WO2022170756A1 - 发热体、雾化组件及电子雾化装置 - Google Patents

发热体、雾化组件及电子雾化装置 Download PDF

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Publication number
WO2022170756A1
WO2022170756A1 PCT/CN2021/116045 CN2021116045W WO2022170756A1 WO 2022170756 A1 WO2022170756 A1 WO 2022170756A1 CN 2021116045 W CN2021116045 W CN 2021116045W WO 2022170756 A1 WO2022170756 A1 WO 2022170756A1
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Prior art keywords
atomizing
heating element
liquid
heating
atomization
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PCT/CN2021/116045
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English (en)
French (fr)
Inventor
吕铭
段银祥
朱明达
汪成涛
龚博学
Original Assignee
深圳麦克韦尔科技有限公司
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Application filed by 深圳麦克韦尔科技有限公司 filed Critical 深圳麦克韦尔科技有限公司
Priority to PCT/CN2021/116045 priority Critical patent/WO2022170756A1/zh
Priority to CN202190000439.8U priority patent/CN220777419U/zh
Publication of WO2022170756A1 publication Critical patent/WO2022170756A1/zh

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    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F47/00—Smokers' requisites not otherwise provided for

Definitions

  • the present application relates to the technical field of atomizers, and in particular, to a heating element, an atomization component and an electronic atomization device.
  • the electronic atomization device is composed of a heating element, a battery and a control circuit.
  • the heating element is the core component of the electronic atomization device, and its characteristics determine the atomization effect and use experience of the electronic atomization device.
  • the cotton core heating element is mostly a structure in which a spring-like metal heating wire is wound around a cotton rope or fiber rope; the liquid aerosol to be atomized is absorbed by the two ends of the cotton rope, and then transferred to the central metal heating wire for heating and atomization.
  • Most of the ceramic heating elements form a heating film on the surface of the porous ceramic body, and the porous ceramic body plays the role of conducting liquid and storing liquid.
  • a thin heating body is provided to improve the liquid supply capacity, such as sheet-shaped microporous array glass. Heat-generating body, but this thin heat-generating body is easy to break.
  • the present application provides a heating element, an atomizing assembly and an electronic atomizing device to solve the technical problem that the thin heating element is easily broken in the prior art.
  • the first technical solution provided by the present application is to provide a heating element, including a sheet-like base, an electrode and a heating element;
  • the sheet-shaped base is a dense base, and the dense base includes an atomizing surface and a liquid suction surface opposite to the atomizing surface;
  • the dense matrix is provided with a micro-hole array area and a blank area adjacent to the micro-hole array area;
  • the micro-hole array area has a plurality of first micro-holes, The first micro-hole is a through hole passing through the atomizing surface and the liquid-absorbing surface;
  • the electrode is arranged in the blank area of the atomizing surface;
  • the heating element is arranged on the dense substrate and is connected with the The electrodes are electrically connected for heating the atomized aerosol to generate a substrate; wherein, the blank area of the liquid absorbing surface is used to cooperate with a sealing member, and the blank area of the liquid absorbing surface is at least partially covered by the sealing member cover.
  • the sheet-like substrate is in the shape of a flat plate; the blank area is arranged around the microwell array area.
  • the blank area includes two first sub-blank areas and two second sub-blank areas, and the two first sub-blank areas are respectively located opposite to the microwell array area along the first direction
  • the two second sub-blank areas are respectively located on opposite sides of the microwell array area along a second direction, and the second direction is perpendicular to the first direction
  • the first sub-blank areas are The width of the area is larger than the width of the second sub-blank area
  • the electrode is arranged in the first sub-blank area.
  • the width of the first sub-blank area is 2.1mm-2.6mm; the width of the second sub-blank area is greater than or equal to 0.5mm.
  • the dense substrate is in the shape of a rectangular plate, and the plurality of first micro-holes in the micro-hole array area are arranged in a rectangular array; the widths of the two first sub-blank areas are the same, and the two The width of the two blank areas is the same.
  • the material of the dense matrix is glass, and the glass is borosilicate glass, quartz glass or photosensitive lithium aluminosilicate glass.
  • the thickness of the dense matrix is 0.1 mm-1 mm; the diameter of the first micropores is 1 ⁇ m-100 ⁇ m.
  • the ratio of the thickness of the dense matrix to the pore size of the first micropores is 20:1-3:1.
  • the ratio of the hole center distance between the adjacent first micro holes to the pore diameter of the first micro holes is 3:1-1.5:1.
  • the heating element is a heating film, which is arranged in the micropore array area on the atomization surface; the heating film has a plurality of second micropores that correspond to and communicate with each other with the plurality of first micropores. hole.
  • the material of the heating film is silver or silver alloy or copper or copper alloy or aluminum or aluminum alloy or gold or gold alloy, and the thickness of the heating film is in the range of 200nm-5um.
  • the second technical solution provided by the present application is to provide an atomization assembly, which includes a liquid storage chamber, a heating body and a sealing member; the liquid storage chamber is used for storing an aerosol generating substrate; the The heating element is the heating element described in any one of the above; the first micropore is communicated with the liquid storage cavity; the sealing member is arranged on the liquid absorbing surface and covers at least part of the liquid absorbing surface. White area.
  • the sealing member completely covers the blank area of the liquid suction surface; the sealing member is provided with a liquid inlet, so that the micropore array area of the liquid suction surface is completely exposed.
  • the atomizing assembly further includes an atomizing seat, and the sealing member is clamped between the blank area of the heating body and the atomizing seat.
  • the atomizing seat includes an atomizing top seat and an atomizing base, and the atomizing top seat and the atomizing base respectively clamp the heat generating surface from both sides of the liquid suction surface and the atomizing surface.
  • the sealing member is clamped between the blank area of the heating body and the atomizing top seat.
  • the sealing member is provided with a liquid inlet to expose the micropore array area;
  • the atomizing top seat has a lower liquid channel; the lower liquid channel connects the liquid inlet with the liquid storage The cavity is communicated; the heating body cooperates with the atomization base to form an atomization cavity.
  • the material of the atomizing seat is plastic; the material of the sealing member is silica gel or fluororubber.
  • the atomization assembly further includes a thimble; one end of the thimble is in contact with the electrode of the heating body, and the other end of the thimble is used for electrical connection with the power supply assembly; the sealing member at least covers the liquid suction The face corresponds to the area of the thimble.
  • the third technical solution provided by the present application is to provide an electronic atomization device, which includes an atomization assembly and a power supply assembly, and the atomization assembly is the atomization assembly described in any one of the above,
  • the power supply assembly controls the atomization assembly to work.
  • the heating element of the present application includes a sheet-like substrate, a heating element and an electrode;
  • the sheet-like substrate is a dense substrate, and the dense substrate includes an atomizing surface and a liquid absorbing surface opposite to the atomizing surface ;
  • the dense matrix is provided with a micro-hole array area and a blank area adjacent to the micro-hole array area;
  • the micro-hole array area has a plurality of first micro-holes, and the first micro-holes are through holes penetrating the atomizing surface and the liquid-absorbing surface;
  • the heating element is set on the dense substrate and is electrically connected to the electrode;
  • the heating element is used to heat the atomized aerosol to generate the substrate;
  • the blank area of the liquid absorbing surface is used to cooperate with the seal and absorb liquid
  • the blank area of the face is at least partially covered by the seal.
  • the number of the first micro-holes on the sheet-like base is reduced as much as possible, thereby improving the strength of the heating element; and the blank area of the liquid-absorbing surface of the sheet-like base is matched with the seal, which further prevents heat generation by the seal.
  • the lamellar matrix in the body is fractured.
  • Fig. 1 is the structural representation of the electronic atomization device provided by the application
  • FIG. 2 is a schematic cross-sectional structural diagram of the atomizing assembly provided by the present application along a first direction;
  • FIG. 3 is a schematic cross-sectional structural diagram of the atomizing assembly provided by the present application along the second direction;
  • Fig. 4 is the structural representation of the heating element provided by the present application.
  • Fig. 5 is the structural representation of the dense matrix in the heating element provided by Fig. 4;
  • Fig. 6 is the structural representation of the heating element provided by Fig. 4 viewed from the side of the atomizing surface;
  • Fig. 7 is the structural representation of the heating element provided by Fig. 4 viewed from the liquid-absorbing surface side;
  • Fig. 8 is the partial structure schematic diagram of the atomization assembly provided by Fig. 2;
  • Figure 9a is a schematic structural view of Figure 8 in another direction
  • Fig. 9b is a partial structural diagram of another embodiment of the atomizing assembly provided by the present application.
  • FIG. 10 is a schematic partial structure diagram of another embodiment of the atomizing assembly provided by the present application.
  • FIG. 11 is a schematic partial structure diagram of another embodiment of the atomization assembly provided by the present application.
  • Fig. 12 is the partial structure schematic diagram that Fig. 3 provides;
  • Fig. 13 is a schematic structural diagram of another embodiment of the raised portion in Fig. 12 mating with the liquid inlet of the seal;
  • FIG. 14 is a graph showing the relationship between the thickness of the dense substrate of the heating element provided by the present application/the diameter of the first micropore and the amount of atomization.
  • first”, “second” and “third” in this application are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as “first”, “second”, “third” may expressly or implicitly include at least one of that feature.
  • "a plurality of” means at least two, such as two, three, etc., unless otherwise expressly and specifically defined. All directional indications (such as up, down, left, right, front, rear%) in the embodiments of the present application are only used to explain the relative positional relationship between components under a certain posture (as shown in the accompanying drawings).
  • FIG. 1 is a schematic structural diagram of an electronic atomization device provided by the present application.
  • Electronic atomization devices can be used for atomization of liquid substrates.
  • the electronic atomization device includes an atomization assembly 1 and a power supply assembly 2 that are connected to each other.
  • the atomization assembly 1 is used to store the liquid aerosol generation substrate and atomize the aerosol generation substrate to form an aerosol that can be inhaled by the user.
  • the assembly 1 can be used in different fields, for example, medical treatment, electronic aerosolization, and the like.
  • the power supply assembly 2 includes a battery (not shown in the figure), an airflow sensor (not shown in the figure), a controller (not shown in the figure), etc.; the battery is used to supply power to the atomizing assembly 1, so that the atomizing assembly 1 can heat the atomized aerosol The matrix is generated to form an aerosol; the air flow sensor is used to detect the air flow change in the electronic atomization device, and the controller controls whether the atomization assembly 1 works according to the air flow change detected by the air flow sensor.
  • the atomizing assembly 1 and the power supply assembly 2 may be integrally provided, or may be detachably connected, and are designed according to specific needs.
  • FIG. 2 is a schematic cross-sectional structural diagram of the atomizing assembly provided in the present application along a first direction.
  • the atomizing assembly 1 includes a casing 10 , an atomizing seat 11 and a heating body 12 .
  • the housing 10 has a liquid storage chamber 13 and an air outlet channel 14 .
  • the liquid storage chamber 13 is used for storing the liquid aerosol generating substrate, and the liquid storage chamber 13 is arranged around the air outlet channel 14 .
  • the end of the housing 10 also has a suction port 15 which communicates with the air outlet channel 14 .
  • the housing 10 has an accommodating cavity 16 on the side of the liquid storage cavity 13 away from the suction port 15 , and the atomizing seat 11 is arranged in the accommodating cavity 16 .
  • the atomizing seat 11 includes an atomizing top seat 111 and an atomizing base 112; optionally, the material of the atomizing seat 11 is plastic.
  • the atomizing top seat 111 and the atomizing base 112 cooperate to form a accommodating cavity 113 ; that is, the atomizing seat 11 has a accommodating cavity 113 .
  • the atomizing top seat 111 is provided with a receiving groove 1111 , and the receiving groove 1111 cooperates with the atomizing base 112 to form a receiving cavity 113 .
  • the heating element 12 is arranged in the accommodating cavity 113 , and is arranged in the accommodating cavity 16 together with the atomizing seat 11 .
  • Two lower liquid channels 114 are provided on the atomizing top seat 111 .
  • two lower liquid channels 114 are provided on the top wall of the atomizing top seat 111 , and the two lower liquid channels 114 are arranged on both sides of the air outlet channel 14 .
  • One end of the lower liquid channel 114 is communicated with the liquid storage chamber 13, and the other end is communicated with the storage chamber 113, that is, the lower liquid channel 114 communicates the liquid storage chamber 13 with the storage chamber 113, so that the aerosol in the liquid storage chamber 13 generates a matrix
  • the lower liquid channel 114 enters the heating element 12 . That is to say, the heating body 12 is in fluid communication with the liquid storage chamber 13, and the heating body 12 is used for absorbing and heating the atomized aerosol to generate the substrate.
  • the liquid storage chamber 13 may not be formed by the housing 10, but an independent component, such as a liquid storage bottle.
  • the liquid supply to the heating body 12 can be realized in the inner space of the body 10 .
  • the surface of the heating body 12 away from the liquid storage cavity 13 is the atomization surface, and the atomization cavity 115 is formed between the atomization surface of the heating body 12 and the inner wall surface of the receiving cavity 113 .
  • the atomization cavity 115 and the air outlet channel 14 Connected.
  • An air inlet 116 is provided on the atomizing base 112 to communicate the outside with the atomizing cavity 115 .
  • the outside air enters the atomizing chamber 115 through the air inlet 116 , carries the aerosol atomized by the heating element 12 into the air outlet channel 14 , and finally reaches the suction port 15 to be sucked by the user.
  • the atomizing assembly 1 further includes a conducting member 17 , and the conducting member 17 is fixed on the atomizing base 112 .
  • One end of the conducting member 17 is electrically connected to the heating element 12 , and the other end is electrically connected to the power supply assembly 2 , so that the heating element 12 can work.
  • the atomizing assembly 1 also includes a seal 18 and a sealing cap 19 .
  • the sealing member 18 is disposed between the heating body 12 and the atomizing top seat 111, and is used for sealing between the heating body 12 and the lower liquid channel 114 to prevent liquid leakage. That is, the sealing member 18 is used to seal the periphery of the heating element 12 .
  • the sealing top cover 19 is arranged on the surface of the atomizing top seat 111 close to the liquid storage chamber 13, and is used to realize the sealing between the liquid storage chamber 13, the atomizing top seat 111 and the air outlet channel 14 to prevent liquid leakage.
  • the material of the sealing member 18 and the sealing top cover 19 is silicone or fluororubber.
  • FIG. 3 is a schematic cross-sectional structural diagram of the atomizing assembly provided in the present application along the second direction.
  • FIG. 4 is a schematic structural diagram of a heating body provided by the present application
  • FIG. 5 is a structural schematic diagram of a dense matrix in the heating body provided in FIG. 4 .
  • the heating body 12 includes a sheet-like base body 125 and a heating element 126 .
  • the heating element 126 is disposed on the sheet-like base 125 .
  • the sheet-like substrate 125 may be a sheet-like dense substrate with a thickness of less than or equal to 1 mm, for example, the sheet-like dense substrate is a sheet-like glass sheet; the sheet-like substrate 125 may also be a sheet-like porous ceramic substrate with a thickness of less than or equal to 2 mm.
  • the two sides of the sheet-like base body 125 with a bending strength of less than 100 MPa directly collide with hard objects and are easily broken, and the use of the protection structure described later in the present invention can reduce or avoid the occurrence of breakage of the sheet-like base body 125 .
  • the heating element 126 can be a heating sheet, a heating film, a heating net, etc., and can be arranged on the surface of the sheet-like base 125 or embedded in the sheet-like base 125, and can be specifically designed according to needs.
  • the sheet-like base body 125 can generate heat by itself, and a ceramic heating body that generates heat by itself, in this case, the heating element is a combination of electrodes and the sheet-like base body 125 .
  • the sheet shape defined by the sheet-like base body 125 is relative to the block-like body, and the ratio of the length to the thickness of the sheet-like base body 125 is larger than the ratio of the length to the thickness of the block-like body.
  • the sheet-like base 125 is in the shape of a flat plate.
  • the sheet-like base 125 may also be arc-shaped, cylindrical, etc., such as a cylindrical shape, and other structures in the atomizing assembly 1 are arranged in cooperation with the specific structure of the sheet-like base 125 .
  • the following description will be given by taking the sheet-like base body 125 as a flat plate as an example.
  • the sheet-like base body 125 includes a liquid absorbing surface and an atomizing surface opposite to each other.
  • the heating element 126 is provided on the atomizing surface.
  • the sheet-like substrate 125 in the heating element 12 is a sheet-like dense substrate 121 with a thickness of 1 mm or less, and the heating element 126 in the heating element 12 is the heating film 122 in detail.
  • the dense base 121 includes a first surface 1211 and a second surface 1212 opposite to the first surface 1211 ; the dense base 121 is provided with a plurality of first micro-holes 1213 , and the first micro-holes 1213 penetrate through the first surface 1211 and through holes of the second surface 1212.
  • the heating film 122 is formed on the first surface 1211; the resistance of the heating film 122 at normal temperature is 0.5 ohm-2 ohm, wherein the normal temperature is 25°C. It can be understood that the dense base body 121 serves as a structural support, and the heating film 122 is electrically connected to the power supply assembly 2 .
  • the resistance range of the heating film 122 of the heating element 12 at room temperature is 0.5 ohm- 2 ohms.
  • the surface on which the heating film 122 is arranged on the dense substrate 121 is an atomization surface, that is, the first surface 1211 of the dense substrate 121 is an atomization surface, and the second surface 1212 of the dense substrate 121 is a liquid absorbing surface; 1213 is used to guide the aerosol-generating substrate from the liquid-absorbing surface to the atomizing surface, and the first micropores 1213 have capillary action.
  • the size of the porosity of the heating body 12 can be precisely controlled, and the consistency of the product is improved. That is to say, in mass production, the porosity of the dense matrix 121 in the heating element 12 is basically the same, and the thickness of the heating film 122 formed on the dense matrix 121 is uniform, so that the atomization effect of the electronic atomizers from the same batch is consistent.
  • the aerosol-generating matrix in the liquid storage chamber 13 reaches the dense matrix 121 of the heating element 12 through the lower liquid channel 114 , and the aerosol-generating matrix is guided from the second surface 1212 by the capillary force of the first micropores 1213 on the dense matrix 121 To the first surface 1211 , the aerosol-generating substrate is atomized by the heating film 122 ; that is, the first micropores 1213 communicate with the liquid storage chamber 13 through the lower liquid channel 114 .
  • the material of the dense matrix 121 may be glass or dense ceramic; when the dense matrix 121 is glass, it may be one of ordinary glass, quartz glass, borosilicate glass, and photosensitive lithium aluminosilicate glass.
  • the material of the dense matrix 121 is glass.
  • the extending direction of the first microholes 1213 may be perpendicular to the thickness direction of the dense substrate 121, or may form an included angle with the thickness direction of the dense substrate 121, and the included angle ranges from 80 degrees to 90 degrees.
  • the longitudinal section of the first micro-hole 1213 may be rectangular, trapezoidal, dumbbell-shaped with large ends and small in the middle, or the like.
  • the longitudinal cross-sectional shape and extension direction of the first microholes 1213 can be designed as required. Since the first micropores 1213 are arranged in a regular geometric shape, the volume of the first micropores 1213 in the heating body 12 can be calculated, and thus the porosity of the entire heating body 12 can also be calculated, so that the heating of similar products can be calculated. The uniformity of the porosity of the body 12 can be well ensured.
  • the dense base 121 can be arranged in a regular shape, such as a rectangular plate shape, a circular plate shape, and the like.
  • the plurality of first micropores 1213 disposed on the dense substrate 121 are arranged in an array; that is, the plurality of first micropores 1213 disposed on the dense substrate 121 are regularly arranged, The hole center distances between adjacent first micro holes 1213 in the first micro holes 1213 are the same.
  • the plurality of first micro-holes 1213 are arranged in a rectangular array; or the plurality of first micro-holes 1213 are arranged in a circular array; or the plurality of first micro-holes 1213 are arranged in a hexagonal array.
  • the pore diameters of the plurality of first micropores 1213 may be the same or different, and can be designed as required.
  • Both the first surface 1211 and the second surface 1212 of the dense matrix 121 include smooth surfaces, and the first surface 1211 is flat. That is to say, the first surface 1211 of the dense substrate 121 is a smooth surface and is flat, and the heating film 122 is formed on the first surface 1211. membrane.
  • the first surface 1211 and the second surface 1212 of the dense base 121 are both smooth surfaces, both of which are plane, and the first surface 1211 and the second surface 1212 of the dense base 121 are arranged in parallel; the first micropores 1213 Through the first surface 1211 and the second surface 1212, the axis of the first microhole 1213 is perpendicular to the first surface 1211 and the second surface 1212, and the cross section of the first microhole 1213 is circular; at this time, the thickness of the dense matrix 121 is the same as The lengths of the first microholes 1213 are equal.
  • the second surface 1212 is parallel to the first surface 1211 , and the first microholes 1213 penetrate from the first surface 1211 to the second surface 1212 , so that the production process of the dense substrate 121 is simple and the cost is reduced.
  • the thickness of the dense matrix 121 is the distance between the first surface 1211 and the second surface 1212 .
  • the first micro-holes 1213 may be straight through holes with uniform pore diameters, or may be straight through holes with non-uniform pore diameters, as long as the variation range of the pore diameters is within 50%.
  • the first micro-holes 1213 opened on the glass by laser induction and etching usually have large apertures at both ends and small apertures in the middle. Therefore, it is only necessary to ensure that the diameter of the middle portion of the first microhole 1213 is not less than half of the diameter of the ports at both ends.
  • the first surface 1211 of the dense base 121 is a smooth surface and is flat, so as to facilitate deposition of a metal material into a film with a small thickness.
  • the second surface 1212 of the dense substrate 121 is a smooth surface, and the second surface 1212 can be non-planar, for example, a sloped surface, an arc surface, a sawtooth surface, etc.
  • the second surface 1212 can be designed according to specific needs, and only the first The hole 1213 may penetrate through the first surface 1211 and the second surface 1212 .
  • the heating element 12 with microporous sheet structure provided by the present application has shorter liquid supply channels, faster liquid supply speed, but greater liquid leakage risk. . Therefore, the inventors of the present application studied the influence of the ratio of the thickness of the dense matrix 121 to the pore diameter of the first micropores 1213 on the liquid conduction of the heating element 12, and found that increasing the thickness of the dense matrix 121 and reducing the pore diameter of the first micropores 1213 The risk of liquid leakage can be reduced but the liquid supply rate can also be reduced. Reducing the thickness of the dense matrix 121 and increasing the pore size of the first micropores 1213 can increase the liquid supply rate but increase the liquid leakage risk, which are contradictory.
  • the present application designs the thickness of the dense matrix 121, the diameter of the first micropores 1213, and the ratio of the thickness of the dense matrix 121 to the diameter of the first micropores 1213, so that the heating body 12 can operate at a power of 6 watts to 8.5 watts and a voltage of 6 watts to 8.5 watts.
  • the thickness of the dense substrate 121 is the distance between the first surface 1211 and the second surface 1212 .
  • the inventors of the present application studied the ratio of the hole center distance of the adjacent first micro holes 1213 to the diameter of the first micro holes 1213, and found that if the hole center distance of the adjacent first micro holes 1213 and the hole diameter of the first micro holes 1213 are equal to each other If the ratio is too large, the strength of the dense matrix 121 is high and it is easy to process, but the porosity is too small, which may easily lead to insufficient liquid supply; It is small, the porosity is large, and the liquid supply is sufficient, but the strength of the dense matrix 121 is small and it is not easy to process.
  • the ratio of the pore size improves the strength of the dense matrix 121 as much as possible on the premise of satisfying the liquid supply capacity.
  • the thickness of the dense base 121, the diameter of the first micropores 1213, the dense The ratio of the thickness of the base body 121 to the diameter of the first micro-holes 1213 , and the ratio of the hole center distance between two adjacent first micro-holes 1213 to the diameter of the first micro-holes 1213 will be introduced.
  • the thickness of the dense matrix 121 is 0.1 mm to 1 mm.
  • the thickness of the dense matrix 121 is greater than 1 mm, the liquid supply demand cannot be met, resulting in a decrease in the amount of aerosol, and the resulting heat loss is high, and the cost of setting the first micropores 1213 is high; when the thickness of the dense matrix 121 is less than 0.1 mm, it cannot be Ensuring the strength of the dense matrix 121 is not conducive to improving the performance of the electronic atomization device.
  • the thickness of the dense matrix 121 is 0.2 mm to 0.5 mm.
  • the diameter of the first micropores 1213 on the dense substrate 121 is 1 micrometer to 100 micrometers.
  • the pore size of the first micropores 1213 is less than 1 micron, the liquid supply demand cannot be met, resulting in a decrease in the amount of aerosol; when the pore size of the first micropores 1213 is greater than 100 microns, the aerosol-generating matrix easily flows out from the first micropores 1213 to the The first surface 1211 causes liquid leakage, resulting in a decrease in atomization efficiency.
  • the diameter of the first micropores 1213 is 20 micrometers to 50 micrometers. It can be understood that the thickness of the dense matrix 121 and the diameter of the first micropores 1213 are selected according to actual needs.
  • the ratio of the thickness of the dense matrix 121 to the diameter of the first micropores 1213 is 20:1-3:1; preferably, the ratio of the thickness of the dense matrix 121 to the diameter of the first micropores 1213 is 15:1-5:1 (see FIG. 14 , It is found through experiments that when the ratio of the thickness of the dense matrix 121 to the pore size of the first micropores 1213 is 15:1-5:1, it has a better atomization effect).
  • the aerosol-generating matrix supplied by the capillary force of the first micropores 1213 is difficult to meet the atomization demand of the heating element 12, not only It is easy to cause dry burning, and the amount of aerosol generated by a single atomization decreases; when the ratio of the thickness of the dense matrix 121 to the pore size of the first micropores 1213 is less than 3:1, the aerosol generation matrix is easily generated from the first micropores 1213. If the aerosol flows out to the first surface 1211 , the aerosol-generating substrate is wasted, resulting in a decrease in atomization efficiency and a decrease in the total aerosol amount.
  • the ratio of the hole center distance between two adjacent first microholes 1213 to the diameter of the first microholes 1213 is 3:1-1.5:1, so that the first microholes 1213 on the dense matrix 121 meet the liquid supply requirements.
  • the strength of the dense matrix 121 is improved as much as possible; preferably, the ratio of the hole center distance between two adjacent first micro holes 1213 to the pore diameter of the first micro holes 1213 is 3:1-2:1; More preferably, the ratio of the hole center distance between two adjacent first micro holes 1213 to the diameter of the first micro holes 1213 is 3:1-2.5:1.
  • the ratio of the thickness of the dense matrix 121 to the diameter of the first micro-holes 1213 is 15:1-5:1, and the hole center distance between two adjacent first micro-holes 1213 is the same as that of the first micro-holes 1213.
  • the ratio of the pore diameter of a micropore 1213 is 3:1-2.5:1.
  • the thickness of the dense matrix 121, the diameter of the first micropores 1213, the ratio of the thickness of the dense matrix 121 to the diameter of the first micropores 1213, the distance between the centers of the adjacent first micropores 1213 and the The ratio of the apertures of a micropore 1213 can be combined and designed according to needs.
  • the dense matrix 121 in the heating body 12 is a dense material, it can play the role of structural support. Compared with the spring-shaped metal heating wire of the existing cotton core heating element and the metal thick film wire of the porous ceramic heating element, there is no requirement for the strength and thickness of the heating film 122 in the heating element 12, and the heating film 122 can be made of low resistance. rate of metallic materials.
  • the heating film 122 formed on the first surface 1211 of the dense substrate 121 is a thin film, and the thickness of the heating film 122 ranges from 200 nanometers to 5 microns, that is, the thickness of the heating film 122 is relatively thin;
  • the thickness of the heating film 122 is in the range of 200 nanometers to 1 micrometer; more preferably, the thickness of the heating film 122 is in the range of 200 nanometers to 500 nanometers.
  • the heating film 122 is a thin film
  • the heating film 122 has a plurality of second micropores 1221 which correspond to the plurality of first micropores 1213 one-to-one and communicate with each other.
  • the heating film 122 is also formed on the inner surface of the first microhole 1213; preferably, the heating film 122 is also formed on the entire inner surface of the first microhole 1213 (the structure is shown in FIG. 4).
  • a heating film 122 is disposed on the inner surface of the first micro-holes 1213, so that the aerosol-generating substrate can be atomized in the first micro-holes 1213, which is beneficial to improve the atomization effect.
  • the heating rate is fast.
  • the resistance of the heating film 122 at room temperature is 0.5 ohm-2 ohm
  • the present application uses a metal material with low conductivity to form a thinner metal film and minimize the influence on the pore size of the first micropores 1213 .
  • the resistivity of the heating film 122 is not greater than 0.06*10 ⁇ 6 ⁇ m.
  • the low-conductivity metal material of the heating film 122 is silver or silver alloy or copper or copper alloy or aluminum or aluminum alloy or gold or gold alloy; optionally, the material of the heating film 122 can be aluminum or aluminum alloy or gold or gold alloy. When heated by electricity, the heating film 122 can heat up rapidly, and directly heat the aerosol-generating matrix in the first micropores 1213 to achieve efficient atomization.
  • the inventors of the present application have found that the liquid aerosol generation matrix contains various flavors and fragrances and additives, and contains elements such as sulfur, phosphorus, and chlorine.
  • the heating film 122 is electrically heated, silver and copper are prone to corrosion failure.
  • Gold has very strong chemical inertness, and a dense oxide film will be formed on the surface of aluminum. These two materials are very stable in the liquid aerosol generating matrix, and are preferably used as the material of the heating film 122 .
  • the heating film 122 can be formed on the dense substrate 121 by means of physical vapor deposition (eg, magnetron sputtering, vacuum evaporation, ion plating) or chemical vapor deposition (ion-assisted chemical deposition, laser-assisted chemical deposition, metal organic compound deposition) of the first surface 1211. It can be understood that the heating film 122 is formed so as not to cover the first micro-holes 1213 , that is, the first micro-holes 1213 penetrate the heating film 122 . When the heating film 122 is formed on the first surface 1211 of the dense substrate 121 by physical vapor deposition or chemical vapor deposition, the heating film 122 is also formed on the inner surface of the first micropores 1213 .
  • physical vapor deposition eg, magnetron sputtering, vacuum evaporation, ion plating
  • chemical vapor deposition ion-assisted chemical deposition, laser-assisted chemical deposition, metal organic compound deposition
  • the metal atoms are perpendicular to the first surface 1211 and parallel to the inner surface of the first microhole 1213 during magnetron sputtering, and the metal atoms are It is easier to deposit on the first surface 1211; assuming that the thickness of the heating film 122 formed by the metal atoms deposited on the first surface 1211 is 1 micrometer, the thickness of the metal atoms deposited on the inner surface of the first micropore 1213 is much less than 1 micrometer, Even less than 0.5 microns; the thinner the thickness of the heating film 122 deposited on the first surface 1211, the thinner the thickness of the heating film 122 formed on the inner surface of the first micropores 1213, and the smaller the influence on the pore size of the first micropores 1213.
  • the deposition of the heating film 122 in the first micro-holes 1213 has a negligible effect on the pore size of the first micro-holes 1213 .
  • FIG. 6 is a schematic structural diagram of the heating element provided in FIG. 4 viewed from the side of the atomizing surface
  • FIG. 7 is a schematic structural diagram of the heating element provided in FIG. 4 viewed from the liquid-absorbing surface side.
  • the heating body 12 also includes two electrodes 123 ; that is, the heating body 12 includes a dense matrix 121 , a heating film 122 and two electrodes 123 .
  • the dense substrate 121 includes an atomizing surface and a liquid absorbing surface opposite to the atomizing surface.
  • the heating film 122 and the electrode 123 are arranged on the atomizing surface and are electrically connected to each other; that is, the heating element 126 and the electrode 123 are arranged on the atomizing surface and are electrically connected to each other.
  • the dense substrate 121 is provided with a plurality of first microholes 1213 , that is, a plurality of first microholes 1213 may be arranged in an array on the entire surface of the dense substrate 121 , or may be arranged in an array only on a part of the surface of the dense substrate 121 .
  • a plurality of first micro-holes 1213 are arranged in an arrangement manner.
  • the heating film 122 is a thin film, and the heating film 122 has a plurality of second micropores 1221 that correspond to the plurality of first micropores 1213 one-to-one and communicate with each other.
  • first micropores 1213 provided on the dense base 121, the lower the strength of the dense base 121, which is not conducive to the application of the heating body 12 to products. Therefore, preferably, a plurality of first micro-holes 1213 are arranged in an array only on a part of the surface of the dense substrate 121, which will be described in detail as follows.
  • the dense substrate 121 is provided with a microwell array area 1218 and a blank area 1219 adjacent to the microwell array area 1218 .
  • the micropore array region 1218 has a plurality of first micropores 1213, the first micropores 1213 are through holes penetrating the atomizing surface and the liquid suction surface, and the first micropores 1213 are used to guide the aerosol-generating substrate from the liquid absorption surface to the fogging surface.
  • the electrode 123 is disposed in the blank area 1219 of the atomizing surface.
  • the heating film 122 is disposed on the dense substrate 121 and is electrically connected to the electrode 123 for heating the atomized aerosol to generate the substrate; specifically, the heating film 122 (ie, the heating element 126 ) is disposed in the microporous array region 1218 of the atomization surface.
  • the blank area 1219 on the liquid absorbing surface is used to cooperate with the sealing member 18 , and the blank area 1219 on the liquid absorbing surface is at least partially covered by the sealing member 18 . That is, the sealing member 18 is disposed on the liquid-absorbing surface of the dense substrate 121 and covers at least part of the blank area 1219 of the liquid-absorbing surface.
  • the first microholes 1213 are not arranged on the blank area 1219, which reduces the number of holes on the dense substrate 121.
  • the number of micropores 1213 increases the strength of the dense matrix 121 in the heating element 12 and reduces the production cost of disposing the first micropores 1213 on the dense matrix 121 .
  • the blank area 1219 of the liquid absorbing surface of the dense substrate 121 cooperates with the sealing member 18, and the sealing member 18 prevents the dense substrate 121 in the heating element 12 from breaking while achieving sealing.
  • the blank area 1219 is arranged around the microwell array area 1218.
  • the microporous array area 1218 in the dense matrix 121 serves as an atomization area, covering the heating film 122 and the surrounding area of the heating film 122 , that is, basically covering the area reaching the temperature of the atomized aerosol generation matrix, making full use of thermal efficiency.
  • the heating body 12 is divided into different functional areas (the micro-hole array area 12218 and the blank area 1219 have different functions), and the structure is optimized according to different functions, which not only meets the high thermal efficiency, but also meets the strength requirements and sealing requirements.
  • the blank area 1219 includes two first sub-blank areas 1219a and two second sub-blank areas 1219b, and the two first sub-blank areas 1219a are respectively located opposite the microwell array area 1218 along the first direction.
  • the two second sub-blank areas 1219b are respectively located on opposite sides of the microwell array area 1218 along the second direction, and the second direction is perpendicular to the first direction.
  • the width of the first sub-blank area 1219a is greater than the width of the second sub-blank area 1219b.
  • the width of the first sub-blank area is 2.1mm-2.6mm; the width of the second sub-blank area 1219b is greater than or equal to 0.5mm.
  • the size of the area around the micropore array area 1218 of the dense matrix 121 in this application is larger than the diameter of the first micropore 1213, so it can be called a blank area; that is, the blank area 1219 in this application can be The area where the first microholes 1213 are formed without the first microholes 1213 is not formed in the area around the microhole array area 1218 where the first microholes 1213 cannot be formed. In one embodiment, the distance between the first micro-hole 1213 closest to the edge of the dense base 121 and the edge of the dense base 121 is greater than the diameter of the first micro-hole 1213 . There is a blank area 1219.
  • the dense substrate 121 is in the shape of a rectangular plate, and the plurality of first microholes 1213 in the microhole array area 1218 are arranged in a rectangular array; the widths of the two first sub-blank areas 1219a are the same, and the two The widths of the two sub-blank regions 1219b are the same. It can be understood that the shape of the dense matrix 121 can be designed as required, the arrangement of the plurality of first micro-holes 1213 in the micro-hole array area 1218 can be designed as required, and the setting method and size of the blank area 1219 can be designed according to Design is required, which is not limited in this application.
  • the electrode 123 is disposed in the first sub-blank area 1219a to ensure the continuity and stability of the electrode 123, and the electrode 123 and the conducting member 17 disposed on the atomized surface of the dense substrate 121 have sufficient The large contact area ensures the stability of the electrical connection between the conducting member 17 and the electrode 123 of the heating body 12 . It can be understood that the width of the first sub-blank area 1219a is set to 2.1mm-2.6mm, so that the electrode 123 can be easily disposed in the first sub-blank area 1219a.
  • the first sub-blank area 1219a can be used as a main clamping area for subsequent installation, for example, the first sub-blank area 1219a is clamped by the abutting part of the ejector pin and the atomizing seat 11. Therefore, the first sub-blank area is left blank.
  • the width of the area 1219a is set to 2.1mm-2.6mm, which can not only ensure that the first sub-blank area 1219a can withstand sufficient clamping stress, but also prevent the width of the atomizer 1 from being too large due to the length of the heating element 12 being too large.
  • the electrode 123 is at least partially arranged in the first sub-blank area 1219a (that is, the electrode 123 is partly arranged in the blank area and partly in the micro-hole array area 1218 ), which can realize electrical connection with the conducting member 17; preferably , the electrodes 123 are all arranged in the first sub-blank area 1219a, which reduces the assembly precision requirement between the electrodes 123 and the conducting member 17.
  • the sealing member 18 is an annular structure (see FIG. 8 and FIG. 9a ), and the sealing member 18 has a certain width.
  • the width of the second sub-blank area 1219b is set to be greater than or equal to 0.5 mm in order to realize the blank area 1219 It can cooperate with the sealing member 18 , thereby realizing that the blank area 1219 of the liquid absorbing surface is at least partially covered by the sealing member 18 .
  • FIG. 8 is a schematic diagram of a partial structure of the atomizing assembly provided in FIG. 2
  • FIG. 9a is a schematic diagram of the structure of FIG. 8 in another direction.
  • the atomizing top seat 111 has a receiving groove 1111 , the heating element 12 is disposed in the receiving groove 1111 , and the sealing member 18 is at least partially disposed between the bottom wall of the receiving groove 1111 and the liquid absorbing surface of the heating element 12 .
  • the lower liquid channel 114 on the atomizing top seat 111 is communicated with the receiving groove 1111 , so that the aerosol generating substrate enters the heating body 12 .
  • the heating element 12 and the sealing member 18 are arranged in the receiving groove 1111 .
  • the bottom wall of the accommodating groove 1111 forms a resisting portion (not shown). That is, the atomizing top seat 111 has a resisting portion, that is, the atomizing seat 11 has a resisting portion.
  • the atomizing top seat 111 and the atomizing base 112 clamp the heating element 12 from both sides of the liquid absorbing surface and the atomizing surface respectively, and the sealing member 18 is clamped between the blank area of the heating element 12 and the atomizing top seat 111 That is, the sealing member 18 is clamped between the blank area of the heating element and the atomizing seat 11 .
  • the atomizing assembly 1 further includes a support member 120 , and the support member 120 is disposed on the side of the heating body 12 away from the liquid storage chamber 13 .
  • the support member 120 is fixed on the atomization base 112 .
  • the support member 120 cooperates with the abutting portion to clamp the heating body 12 ; specifically, the supporting member 120 and the abutting portion respectively clamp the sheet-shaped base body from the opposite sides of the sheet-shaped base body 125 of the heating body 12 along the thickness direction thereof. 125.
  • the two electrodes 123 of the heating element 12 are disposed on the surface of the sheet-like base body 125 close to the support member 120 .
  • the sealing member 18 is at least partially located between the heating body 12 and the abutting portion; specifically, the sealing member 18 is at least partially located between the heating body 12 and the bottom wall of the receiving groove 1111 . That is to say, the sealing member 18 is entirely located on the surface of the heating body 12 close to the abutting portion; or, the sealing member 18 is partially located on the surface of the heating body 12 adjacent to the abutting portion, and part of the sealing member 18 is located on the side of the heating body 12; or, the sealing member 18 is partially located It is located on the surface of the heating body 12 close to the abutting part, partly on the side of the heating body 12 , and partly on the surface of the heating body 12 away from the abutting part, which is specifically designed according to needs.
  • the arrangement between the support member 120 , the sealing member 18 and the atomizing seat 11 has a protective effect on the sheet-shaped heating element 12 , which is called the protection structure of the heating element 12 .
  • the receiving groove 1111 on the atomizing top seat 111 it is not necessary to set the receiving groove 1111 on the atomizing top seat 111 , so that the bottom wall of the receiving groove 1111 can be used as a resisting part, and the resisting part can be formed by other structures of the atomizing seat 11 . , so that the abutting portion and the support member 120 can cooperate to clamp the heating element 12 .
  • the end face of the cavity wall of the liquid storage cavity 13 close to the heating body 12 is in contact with the sealing member 18, and the end face of the cavity wall of the liquid storage cavity 13 close to the heating body 12 cooperates with the support member 120 to clamp the heating body 12; That is to say, the end face of the cavity wall of the liquid storage cavity 13 close to the heating body 12 serves as a resisting part (as shown in FIG. 9b , which is a partial structural diagram of another embodiment of the atomizing assembly provided by the present application).
  • the setting method of the abutting portion is designed according to needs, which is not limited in the present application.
  • the end of the heating body 12 can be overlapped on the atomizing top seat 111 and/or the atomizing base 112 .
  • the support member 120 is arranged at least partially in the middle position of the heating body 12 (the middle position does not refer to the center of the heating body 12, but refers to other positions of the heating body 12 except for the edge), rather than the edge of the heating body 12, to further fix Heater 12 . This is because the strength of the sheet-shaped heating element 12 is relatively small, and if the edge of the heating element 12 is clamped, there will be too many suspended parts in the middle of the heating element 12, and the risk of rupture is high.
  • the support member 120 is at least partially disposed at the position corresponding to the electrode 123 of the heating body 12 ; wherein, the electrode 123 of the heating body 12 is located in the middle position of the heating body 12 .
  • the sealing member 18 covers at least a region of the heating body 12 corresponding to the supporting member 120 .
  • the sealing member 18 is provided with a liquid inlet 181 to expose at least part of the heating element 12, that is, to expose at least part of the plurality of first micropores 1213, so as to be in fluid communication with the liquid storage chamber 13;
  • the suction surface is exposed at least partially from the liquid inlet 181 of the seal 18 to absorb the aerosol-generating substrate.
  • the liquid inlet 181 exposes at least the first micropores 1213 corresponding to the atomization area; when the dense substrate 121 is provided with a micropore array area 1218 and a blank area 1219, the liquid inlet 181 exposes at least the first microwell 1213 in the microwell array area 1218 corresponding to the atomization area, preferably, the liquid inlet 181 completely exposes the entire microwell array area 1218 on the liquid suction surface.
  • the liquid inlet 181 on the sealing member 18 connects the lower liquid channel 114 on the atomizing top seat 111 with the first micropore 1213 on the dense base 121; the lower liquid channel 114 communicates the liquid inlet 181 with the liquid storage cavity 13,
  • the aerosol-generating matrix in the liquid storage chamber 13 enters the heating body 12 through the lower liquid channel 114 and the liquid inlet 181 . That is to say, the liquid suction surface of the heating element 12 is in fluid communication with the liquid storage chamber 13 through the liquid inlet 181 of the sealing member 18 .
  • the heating element 12 cooperates with the atomizing base 112 to form an atomizing cavity 115 .
  • the atomizing surface of the heating element 12 cooperates with the atomizing base 112 to form an atomizing cavity 115 .
  • the liquid inlet 181 on the sealing member 18 makes the heating element 12 and the liquid storage chamber 13 in direct fluid communication;
  • the aerosol-generating substrate can enter the heating element 12 only through the liquid inlet 181 .
  • the heating body 12 is fixed by the cooperation of the support 120 and the atomizing seat 11 ; Since the material of the dense substrate 121 in the heating element 12 is glass or dense ceramics, the clamping force for fixing the heating element 12 is too large, and the heating element 12 is easily broken, which is not conducive to the application of the heating element 12 to products.
  • the sealing member 18 is made to cover at least the area of the heating body 12 corresponding to the supporting member 120 .
  • the sealing member 18 acts as a buffer member while achieving sealing, which can counteract the excessive pressure of the supporting member 120 , thereby preventing the heating body 12 from breaking. .
  • a plurality of first micropores 1213 are arranged in an array on the entire surface of the dense matrix 121 in the heating body 12;
  • the holes 1213 correspond to the second micro holes 1221 .
  • the sealing member 18 can buffer the force exerted by the supporting member 120 on the heating body 12 by covering at least the area of the heating body 12 corresponding to the supporting member 120 with the sealing member 18 . can be applied to the product.
  • the dense matrix 121 in the heating body 12 is provided with a plurality of first micropores 1213 in an array arrangement. That is, the dense matrix 121 is provided with a micro-hole array area 1218 and a blank area 1219 arranged around the micro-hole array area 1218; a plurality of first micro-holes 1213 are arranged in the micro-hole array area 1218, and the blank area 1219 is not provided The first micropore 1213 .
  • the electrode 123 is at least partially arranged in the blank area 1219 of the atomization surface, the heating film 122 is arranged in the micropore array area 1218 of the atomization surface, and the sealing member 18 is arranged in the blank area 1219 of the liquid suction surface.
  • the support member 120 is arranged on the side of the heating body 12 away from the sealing member 18, that is, the support member 120 is arranged on the atomizing surface; The influence of 120 on atomization efficiency and taste, the support 120 is arranged in the blank area of the atomization surface, and the corresponding seal 18 is arranged in the blank area 1219 of the liquid suction surface, and covers at least the area corresponding to the support 120 .
  • the sealing member 18 completely covers the blank area 1219 of the liquid suction surface, so as to simplify the production process of the sealing member 18 and facilitate assembly; at this time, the liquid inlet 181 on the sealing member 18 makes the micropores on the liquid suction surface Array region 1218 is fully exposed.
  • the sealing member 18 can also be arranged in the blank area 1219 and the microporous array area 1218 at the same time (the heating element 12 can still atomize the aerosol to generate the matrix), which can prevent the heating element 12 from breaking That's it.
  • the electrode 123 can be partially arranged in the blank area 1219 and partially arranged in the micro-hole array area 1218; the electrode 123 can also be completely arranged in the blank area 1219, which can realize the electrode 123 and the heating film 122, the electrode 123 and the conducting member 17.
  • the stable electrical connection is sufficient, and the specific arrangement of the electrodes 123 can be designed as required.
  • the surface of the sealing member 18 away from the liquid storage chamber 13 has two positioning portions 182 ; the two positioning portions 182 are arranged opposite and spaced apart; The two positioning parts 182 limit the heating element 12 to prevent the heating element 12 from shaking.
  • the surface of the sealing member 18 away from the liquid storage chamber 13 includes a first side edge, a second side edge opposite to the first side edge, and a third side edge connecting the first side edge and the second side edge , the fourth side;
  • the positioning portion 182 is a long strip, one is arranged on the first side, and the other is arranged on the second side; the distance between the first end of the positioning portion 182 and the third side is greater than or equal to zero, The distance between the second end of the positioning portion 182 and the fourth side is greater than or equal to zero, the distance between the first end and the third side of the positioning portion 182 and the distance between the second end and the fourth side of the positioning portion 182 the same distance.
  • the specific arrangement of the positioning portion 182 can be designed as required, and only needs to be able to limit the position of the heating body 12 .
  • the conducting member 17 is a thimble, one end of the thimble is in contact with the electrode of the heating body 12 , and the other end of the thimble is used for electrical connection with the power supply assembly 2 .
  • the support member 120 includes two conductive support members, and the two conductive support members are respectively abutted with the two electrodes 123 .
  • the two conductive supports are two thimbles and are rigidly fixed on the atomizing seat 11 . That is, the ejector pin serves as the support 120 at the same time.
  • the sealing member 18 covers at least the area of the liquid-absorbing surface of the heating element 12 corresponding to the thimble.
  • the atomizing top seat 111 has a receiving groove 1111, the heating element 12 is arranged in the receiving groove 1111, the sealing member 18 is arranged between the bottom wall of the receiving groove 1111 and the liquid absorbing surface of the heating element 12, the ejector pin and the atomizing top
  • the seat 111 cooperates to clamp the heating body 12 to realize the fixing of the heating body 12 .
  • FIG. 10 is a schematic partial structure diagram of another embodiment of the atomizing assembly provided by the present application.
  • the structure of the atomizing assembly 1 provided in FIG. 10 is basically the same as the structure of the atomizing assembly 1 provided in FIG. 2 , the difference is that the arrangement of the conducting member 17 and the supporting member 120 is different.
  • the conducting member 17 is an elastic sheet or a pin, and is fixed on the atomizing base 112 .
  • the atomization base 112 is in contact with the atomization surface of the heating body 12 , and the atomization base 112 serves as the support 120 at the same time.
  • the atomization base 112 abuts against the blank area 1219 of the atomization surface of the heating element 12 to facilitate atomization efficiency and taste.
  • the atomization base 112 includes a body and a support column disposed on the body, and the support column is in contact with the atomization surface of the heating body 12 (as shown in FIG. 10 ); or, the atomization base 112 includes a body and a support column disposed on the body.
  • the hollow boss is in contact with the atomizing surface of the heating body 12; the specific structure of the atomizing base 112 can be designed as required, and the heating body 12 can be clamped and fixed in cooperation with the atomizing top seat 111.
  • FIG. 11 is a schematic partial structure diagram of another embodiment of the atomizing assembly provided by the present application.
  • the structure of the atomizing assembly 1 provided in FIG. 11 is basically the same as the structure of the atomizing assembly 1 provided in FIG. 2 , the difference is that the arrangement of the conducting member 17 and the supporting member 120 is different.
  • the conducting member 17 is an elastic sheet or an elastic pin, and is fixed on the atomizing base 112 .
  • the support member 120 is an annular structure independent from the atomizing seat 11 , and a surface of the support member 120 is in contact with the atomizing surface of the heating body 12 .
  • the support member 120 is in contact with the blank area 1219 of the atomization surface of the heating body 12 to facilitate atomization efficiency and taste.
  • the support member 120 is disposed in the accommodating groove 1111 of the atomizing top seat 111 by clamping, or is supported and disposed in the accommodating groove 1111 of the atomizing top seat 111 by the atomizing base 112 .
  • FIG. 12 is a schematic diagram of a partial structure provided in FIG. 3 .
  • the material of the atomizing seat 11 is plastic
  • the material of the sealing member 18 is silica gel or fluororubber.
  • the external air easily enters the liquid storage chamber 13 through the plurality of first micro-holes 1213 on the heating element 12, that is, air bubbles will pass through the first micro-holes from the atomizing surface of the heating element 12. 1213 backflow, and the air bubbles are easy to adhere to the silicone parts to form large air bubbles, that is, the backflow air bubbles are easy to adhere to the side of the liquid inlet 181 of the seal 18 (around the liquid suction surface of the heating element 12) to form large air bubbles, affecting Substitute, resulting in poor drainage.
  • the side surface of the liquid inlet 181 may have a lyophilic structure.
  • the lyophilic structure can improve the hydrophilicity and/or lipophilicity of the side of the liquid inlet 181, so that the side of the liquid inlet 181 has a smaller contact angle and stronger wettability with the aerosol-generating substrate.
  • the lyophilic structure is a microstructure formed by modifying the side surface of the liquid inlet 181 .
  • the lyophilic structure is an isolation layer covering at least part of the side surface of the liquid inlet 181 to reduce the influence of backflow bubbles on the lower liquid; wherein, the material of the isolation layer is more wettable than the material of the sealing member 18 .
  • the contact angle of the material of the strong, or barrier layer, with the aerosol-generating matrix is smaller than the contact angle of the material of the seal 18 with the aerosol-generating matrix.
  • the isolation layer is a coating or a patch disposed on the side of the liquid inlet 181 .
  • the material of the isolation layer is one of polysiloxane and vinyl acetate, and the hydrophilic and/or lipophilic properties of these materials are better than those of silica gel and fluororubber.
  • the bottom wall of the receiving groove 1111 of the atomizing top seat 111 has a convex portion 117 , that is, the convex portion 117 is disposed on the surface of the abutting portion close to the sealing member 18 .
  • the raised portion 117 covers at least part of the side surface of the liquid inlet 181 .
  • the surface of the raised portion 117 has a coating, and the material of the coating is one of polysiloxane and vinyl acetate, so as to reduce the influence of backflow bubbles on the lower liquid;
  • the material is one of plastic, glass and silicon.
  • the hydrophilicity of these materials is better than the hydrophilicity and/or lipophilicity of silica gel and fluororubber, so as to reduce the influence of backflow bubbles on the lower liquid; or, convex
  • the material of the raised portion 117 is one of plastic, glass and silicon, and the surface of the raised portion 117 has a coating, and the material of the coating is one of polysiloxane and vinyl acetate, so as to reduce backflow bubbles effect on the fluid.
  • the protruding portion 117 and the atomizing top seat 111 are integrally formed, glued or snap-fitted, and are specifically designed as required.
  • the isolation layer is the raised portion 117 of the atomizing seat 11
  • the material of the raised portion 117 is one of plastic, glass and silicon
  • the raised portion 117 covers at least part of the side surface of the liquid inlet 181, thereby reducing the
  • the contact area between the backflow air bubbles and the liquid inlet 181 of the sealing member 18 further minimizes the influence of the backflow air bubbles on the lower liquid.
  • the size of the liquid inlet 181 of the sealing member 18 in the extending direction thereof is not uniform.
  • the liquid inlet 181 includes a first liquid inlet section and a second liquid inlet section that communicate with each other; the first liquid inlet section is located on the side of the second liquid inlet section away from the heating element 12, and the size of the first liquid inlet section is Larger than the size of the second liquid inlet section, the side surface of the liquid inlet 181 forms a stepped structure. That is, a cutout is provided on the surface of the sealing member 18 away from the heating element 12 and around the liquid inlet 181 to form a stepped structure on the side surface of the liquid inlet 181 . Referring to FIG.
  • the end of the raised portion 117 is in contact with the connecting surface of the first liquid inlet section and the second liquid inlet section, that is, the end of the raised portion 117 is in contact with the bottom surface of the stepped structure; and the raised portion 117 completely covers the side of the first liquid inlet section.
  • the surface of the raised portion 117 away from the lower fluid channel 114 has a perimeter bone 1172 .
  • the surrounding bone 1172 covers at least part of the side surface of the second liquid inlet section, which further reduces the contact area between the air bubbles and the liquid inlet 181, and minimizes the influence of the air bubbles on the lower liquid.
  • FIG. 13 is a schematic structural diagram of another embodiment of the protrusion in FIG. 12 that cooperates with the liquid inlet of the seal.
  • the size of the liquid inlet 181 of the sealing member 18 is uniform in its extending direction.
  • the side surface of the liquid inlet 181 is parallel to the axis of the atomizing assembly 1 .
  • the raised portion 117 covers part of the side surface of the liquid inlet 181 , and there is a gap between the end surface of the raised portion 117 close to the heating element 12 and the heating element 12 . It can be understood that the more sides of the liquid inlet 181 covered by the raised portion 117 , it is also beneficial to reduce the influence of backflow bubbles on the lower liquid, as long as the raised portion 117 does not directly press the heating element 12 .
  • the sealing member 18 can be arranged between the side surface of the heating body 12 and the cavity wall of the receiving cavity 113, so that the suction surface is completely exposed.
  • the sealing member 18 can be achieved.
  • the port of the lower liquid channel 114 is in contact with the liquid suction surface of the heating element 12; that is, the liquid suction surface of the heating element 12 is in direct fluid communication with the lower liquid channel 114 without passing through any components.
  • the material of the atomizing seat 11 has stronger wettability than the material of the sealing member 18, or the contact angle between the material of the atomizing seat 11 and the aerosol-generating substrate is smaller than the contact angle of the material of the sealing member 18 and the aerosol-generating substrate.
  • the sealing member 18 is arranged around the side surface of the heating body 12 and is only arranged between the side surface of the heating body 12 and the cavity wall of the accommodating cavity 113; in another embodiment, the sealing member 18 is only arranged on the heating body. Between the side surface of 12 and the cavity wall of the accommodating cavity 113, and the atomization surface of the heating element 12, the sealing member 18 completely exposes the heating film 122.
  • the surface of the heating element 12 close to the liquid storage chamber 13 is not covered with the sealing member 18, and there is no possibility of the backflow bubbles adhering to the sealing member 18 during the atomization process; at the same time, the port of the lower liquid channel 114 is connected to the heating element.
  • the suction surface of 12 is in contact, and the absence of reflux bubbles will affect the smoothness of the liquid.
  • the liquid supply efficiency of the heating element 12 was evaluated by the heating element 12 wet burning test.
  • the DC power supply is used to supply power, and the electrodes 123 of the heating body 12 are respectively connected through the thimble 20 of the power supply assembly 2 (the thimble 20 is electrically connected to the battery) to control the energization power and energization time, and use an infrared thermal imager or a thermocouple to measure the heating film 122. temperature.
  • the heating film 122 When the heating film 122 is energized, the temperature rises instantaneously, so that the aerosol-forming matrix in the first micropores 1213 is vaporized.
  • the aerosol-generating matrix in the liquid storage chamber 13 is continuously replenished to the heating film 122 .
  • the flow of the aerosol-generating matrix in the first micropores 1213 with capillary action can be calculated according to the Washburn equation, where S is the pore area of the first micropores 1213, ⁇ is the density of the aerosol-generating matrix, and z is the aerosol-generating matrix passing through. distance, ⁇ is the surface tension, ⁇ is the viscosity of the aerosol-generating matrix, r is the radius of the first micropore 1213 , and ⁇ is the contact angle of the aerosol-generating matrix to the dense matrix 121 material.
  • the amount of nebulization of the aerosol-generating substrate is as follows:
  • the heating element 12 was installed and tested to evaluate the relationship between the thickness of the dense matrix 121/the aperture of the first micropore 1213 and the amount of atomization.
  • the aerosol-generating matrix easily flows out from the first micropores 1213 to the surface of the heating film 122 , resulting in a decrease in atomization efficiency and a decrease in the amount of atomization.

Abstract

一种发热体（12）、雾化组件（1）及电子雾化装置，发热体（12）包括片状基体（125）、发热元件（126）和电极（123）；片状基体（125）为致密基体（121），致密基体（121）包括雾化面以及与雾化面相对的吸液面；致密基体（121）设有微孔阵列区（1218）和邻近微孔阵列区（1218）的留白区（1219）；微孔阵列区（1218）具有多个第一微孔（1213），第一微孔（1213）为贯穿雾化面和吸液面的通孔；电极（123）设置于雾化面的留白区（1219）；发热元件（126）设置于致密基体（121）且与电极（123）电连接；发热元件（126）用于加热雾化气溶胶生成基质；吸液面的留白区用于与密封件（18）配合，吸液面的留白区（1219）至少部分被密封件（18）覆盖。尽可能减少片状基体（125）上第一微孔（1213）的数量，以提高发热体（12）的强度；并且片状基体（125）的吸液面的留白区（1219）与密封件（18）配合，通过密封件（18）进一步防止发热体（12）中的片状基体（125）断裂。

Description

发热体、雾化组件及电子雾化装置 技术领域
本申请涉及雾化器技术领域，具体是涉及一种发热体、雾化组件及电子雾化装置。
背景技术
电子雾化装置由发热体、电池和控制电路等部分组成，发热体作为电子雾化装置的核心元件，其特性决定了电子雾化装置的雾化效果和使用体验。
现有的发热体主要是棉芯发热体和陶瓷发热体。棉芯发热体大多为弹簧状的金属发热丝缠绕棉绳或纤维绳的结构；待雾化的液态气溶胶生成基质被棉绳两端吸取，然后传输至中心金属发热丝处加热雾化。陶瓷发热体大多为在多孔陶瓷体表面形成发热膜，多孔陶瓷体起到导液、储液的作用。
随着技术的进步，用户对电子雾化装置的雾化效果的要求越来越高，为了满足用户的需求，提供一种薄的发热体以提高供液能力，例如片状的微孔阵列玻璃发热体，但这种薄的发热体易断裂。
发明内容
有鉴于此，本申请提供一种发热体、雾化组件及电子雾化装置，以解决现有技术中薄的发热体易断裂的技术问题。
为了解决上述技术问题，本申请提供的第一个技术方案为：提供一种发热体，包括片状基体、电极和发热元件；所述片状基体为致密基体，所述致密基体包括雾化面以及与所述雾化面相对的吸液面；所述致密基体设有微孔阵列区和邻近所述微孔阵列区的留白区；所述微孔阵列区具有多个第一微孔，所述第一微孔为贯穿所述雾化面和所述吸液面的通孔；所述电极设置于所述雾化面的留白区；所述发热元件设置于所述致密基体且与所述电极电连接，用于加热雾化气溶胶生成基质；其中，所述吸液面的留白区用于与密封件配合，所述吸液面的留白区至少部分被所述密封件覆盖。
其中，所述片状基体为平板状；所述留白区围绕所述微孔阵列区一周设置。
其中，所述留白区包括两个第一子留白区和两个第二子留白区，两个所述第一子留白区分别位于所述微孔阵列区沿第一方向的相对两侧，两个所述第二子留白区分别位于所述微孔阵列区沿第二方向的相对两侧，所述第二方向垂直于所述第一方向；所述第一子留白区的宽度大于所述第二子留白区的宽度；所述电极设置于所述第一子留白区。
其中，所述第一子留白区的宽度为2.1mm-2.6mm；所述第二子留白区的宽度大于等于0.5mm。
其中，所述致密基体为矩形平板状，所述微孔阵列区中的多个第一微孔呈矩形阵列排布；两个所述第一子留白区的宽度相同，两个所述第二子留白区的宽度相同。
其中，所述致密基体的材料为玻璃，所述玻璃为硼硅玻璃、石英玻璃或光敏铝硅酸锂玻璃。
其中，所述致密基体的厚度为0.1mm-1mm；所述第一微孔的孔径为1μm-100μm。
其中，所述致密基体的厚度与所述第一微孔的孔径的比例为20:1-3:1。
其中，相邻所述第一微孔之间的孔中心距与所述第一微孔的孔径的比例为3:1-1.5:1。
其中，所述发热元件为发热膜，设置于所述雾化面上的微孔阵列区；所述发热膜具有与多个所述第一微孔一一对应且相互连通的多个第二微孔。
其中，所述发热膜的材料为银或银合金或铜或铜合金或铝或铝合金或金或金合金，所述发热膜厚度范围为200nm-5um。
为了解决上述技术问题，本申请提供的第二个技术方案为：提供一种雾化组件，包括储液腔、发热体和密封件；所述储液腔用于存储气溶胶生成基质；所述发热体为上述任意一项所述的发热体；所述第一微孔与所述储液腔连通；所述密封件设置于所述吸液面，且覆盖至少部分所述吸液面的留白区。
其中，所述密封件完全覆盖所述吸液面的留白区；所述密封件上设置有进液口，以使所述吸液面的微孔阵列区完全暴露。
其中，所述雾化组件还包括雾化座，所述密封件夹持于所述发热体的留白区与所述雾化座之间。
其中，所述雾化座包括雾化顶座和雾化底座，所述雾化顶座和所述雾化底座分别从所述吸液面和所述雾化面的两侧夹持所述发热体，所述密封件夹持于所述发热体的留白区与所述雾化顶座之间。
其中，所述密封件上设置有进液口，以使所述微孔阵列区暴露；所述雾化顶座具有下液通道；所述下液通道将所述进液口与所述储液腔连通；所述发热体与所述雾化底座配合形成雾化腔。
其中，所述雾化座的材料为塑胶；所述密封件的材料为硅胶或氟橡胶。
其中，所述雾化组件还包括顶针；所述顶针的一端与所述发热体的电极抵接，所述顶针的另一端用于与电源组件电连接；所述密封件至少覆盖所述吸液面对应所述顶针的区域。
为了解决上述技术问题，本申请提供的第三个技术方案为：提供一种电子雾化装置，包括雾化组件和电源组件，所述雾化组件为上述任意一项所述的雾化组件，所述电源组件控制所述雾化组件工作。
本申请的有益效果：区别于现有技术，本申请的发热体包括片状基体、发热元件和电极；片状基体为致密基体，致密基体包括雾化面以及与雾化面相对的吸液面；致密基体设有微孔阵列区和邻近微孔阵列区的留白区；微孔阵列区具有多个第一微孔，第一微孔为贯穿雾化面和吸液面的通孔；电极设置于雾化面的留白区；发热元件设置于致密基体且与电极电连接；发热元件用于加热雾化气溶胶生成基质；吸液面的留白区用于与密封件配合，吸液面的留白区至少部分被密封件覆盖。通过上述设置，尽可能的减少片状基体上第一微孔的数量，以此提高发热体的强度；并且片状基体的吸液面的留白区与密封件配合，通过密封件进一步防止发热体中的片状基体断裂。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图。
图1是本申请提供的电子雾化装置的结构示意图；
图2是本申请提供的雾化组件沿第一方向的剖视结构示意图；
图3是本申请提供的雾化组件沿第二方向的剖视结构示意图；
图4是本申请提供的发热体的结构示意图；
图5是图4提供的发热体中致密基体的结构示意图；
图6是图4提供的发热体的从雾化面一侧观看的结构示意图；
图7是图4提供的发热体的从吸液面一侧观看的结构示意图；
图8是图2提供的雾化组件的局部结构示意图；
图9a是图8的另一方向的结构示意图；
图9b是本申请提供的雾化组件另一实施方式的局部结构简图
图10是本申请提供的雾化组件另一实施方式的局部结构示意图；
图11是本申请提供的雾化组件又一实施方式的局部结构示意图；
图12是图3提供的局部结构示意图；
图13是图12中凸起部另一实施方式与密封件的进液口配合的结构示意图；
图14是本申请提供的发热体的致密基体厚度/第一微孔孔径与雾化量之间的关系图。
具体实施方式
下面结合附图和实施例，对本申请作进一步的详细描述。特别指出的是，以下实施例仅用于说明本申请，但不对本申请的范围进行限定。同样的，以下实施例仅为本申请的部分实 施例而非全部实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本申请保护的范围。
本申请中的术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”、“第三”的特征可以明示或者隐含地包括至少一个该特征。本申请的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。本申请实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。本申请实施例中的术语“包括”和“具有”以及它们任何变形，意图在于覆盖不排他的包含。例如包含了一系列步骤或单元的过程、方法、系统、产品或设备没有限定于已列出的步骤或单元，而是可选地还包括没有列出的步骤或单元，或可选地还包括对于这些过程、方法、产品或设备固有的其它步骤或组件。
在本文中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例，也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是，本文所描述的实施例可以与其它实施例相结合。
请参阅图1，图1是本申请提供的电子雾化装置的结构示意图。
电子雾化装置可用于液态基质的雾化。电子雾化装置包括相互连接的雾化组件1和电源组件2。雾化组件1用于存储液态气溶胶生成基质并雾化气溶胶生成基质以形成可供用户吸食的气溶胶，液态气溶胶生成基质可以是药液、植物草叶类液体等液态基质；雾化组件1具体可用于不同的领域，比如，医疗、电子气溶胶化等。电源组件2包括电池(图未示)、气流传感器(图未示)以及控制器(图未示)等；电池用于为雾化组件1供电，以使得雾化组件1能够加热雾化气溶胶生成基质形成气溶胶；气流传感器用于检测电子雾化装置中气流变化，控制器根据气流传感器检测到的气流变化控制雾化组件1是否工作。雾化组件1与电源组件2可以是一体设置，也可以是可拆卸连接，根据具体需要进行设计。
请参阅图2，图2是本申请提供的雾化组件沿第一方向的剖视结构示意图。
雾化组件1包括壳体10、雾化座11和发热体12。壳体10具有储液腔13、出气通道14，储液腔13用于储存液态的气溶胶生成基质，储液腔13环绕出气通道14设置。壳体10的端部还具有抽吸口15，抽吸口与出气通道14连通。壳体10在储液腔13背离抽吸口15的一侧具有容置腔16，雾化座11设置于容置腔16中。雾化座11包括雾化顶座111和雾化底座112；可选的，雾化座11的材料为塑胶。雾化顶座111和雾化底座112配合形成收容腔113；即，雾化座11具有收容腔113。具体的，雾化顶座111上设置有收容槽1111，收容槽1111与雾化底座112配合形成收容腔113。发热体12设置于收容腔113中，同雾化座11一起设置于容置腔16中。
雾化顶座111上设置有两个下液通道114，具体的，雾化顶座111的顶壁上设置有两个下液通道114，两个下液通道114设置于出气通道14的两侧。下液通道114的一端与储液腔13连通，另一端与收容腔113连通，即，下液通道114使储液腔13与收容腔113连通，以使储液腔13中的气溶胶生成基质通道下液通道114进入发热体12。也就是说，发热体12与储液腔13流体相通，发热体12用于吸收并加热雾化气溶胶生成基质。
在其他实施方式中，储液腔13可以不是由壳体10形成的，而是独立的部件，例如储液瓶，将该独立的储液腔13设置于壳体10之外通过针管并与壳体10的内部空间中即可实现对发热体12供液。
在本实施例中，发热体12远离储液腔13的表面为雾化面，发热体12的雾化面与收容腔113的内壁面之间形成雾化腔115，雾化腔115与出气通道14连通。雾化底座112上设置有进气口116，以使外界与雾化腔115连通。外界气体通过进气口116进入雾化腔115，携带发热体12雾化好的气溶胶进入出气通道14，最终到达抽吸口15，被用户吸食。
雾化组件1还包括导通件17，导通件17固定于雾化底座112。导通件17的一端于发热体12电连接，另一端用于与电源组件2电连接，以使发热体12能够工作。
雾化组件1还包括密封件18和密封顶盖19。密封件18设置于发热体12与雾化顶座111之间，用于对发热体12与下液通道114之间实现密封，防止漏液。即，密封件18用于密封发热体12的周边。密封顶盖19设置于雾化顶座111靠近储液腔13的表面，用于实现对储 液腔13与雾化顶座111、出气通道14之间的密封，防止漏液。可选的，密封件18和密封顶盖19的材料为硅胶或氟橡胶。
请参阅图3，图3是本申请提供的雾化组件沿第二方向的剖视结构示意图。
在雾化顶座111的外侧面与壳体10的内侧面之间存在间隙，从进气口116进入的外界气体进入雾化腔115，携带发热体12雾化好的气溶胶，经过雾化顶座111的外侧面与壳体10的内侧面之间的间隙进入出气通道14。
请参阅图4和图5，图4是本申请提供的发热体的结构示意图，图5是图4提供的发热体中致密基体的结构示意图。
发热体12包括片状基体125和发热元件126。发热元件126设置于片状基体125上。片状基体125可以是厚度小于等于1mm的片状致密基体，例如，片状致密基体为片状玻璃片；片状基体125也可以是厚度小于等于2mm的片状多孔陶瓷基体。折弯强度低于100MPa的片状基体125两侧直接与硬物抵触容易断裂，而采用本发明的后续介绍的保护结构可以减少或避免出现片状基体125的断裂情况。发热元件126可以是发热片、发热膜、发热网等，可以设置在片状基体125的表面，也可以埋设在片状基体125内部，具体根据需要进行设计。在一些实施例中，片状基体125本身可以发热，自身发热的陶瓷发热体，此时发热元件为电极和片状基体125的组合。
其中，片状基体125所定义的片状是相对于块状体来说的，片状基体125的长度与厚度的比值相对于块状体的长度与厚度的比值要大。在本实施方式中，片状基体125为平板状。在其他实施方式中，片状基体125也可以是弧状、筒状等，例如圆筒状，雾化组件1中的其他结构与片状基体125的具体结构配合设置。下面以片状基体125为平板状为例进行介绍。
片状基体125包括相对的吸液面和雾化面，在本实施方式中，发热元件126设在雾化面上。下面对发热体12中的片状基体125为厚度小于等于1mm的片状致密基体121，发热体12中的发热元件126为发热膜122进行详细介绍。
参见图5，致密基体121包括第一表面1211以及与第一表面1211相对的第二表面1212；致密基体121上设置有多个第一微孔1213，第一微孔1213为贯穿第一表面1211和第二表面1212的通孔。参见图4，发热膜122形成于第一表面1211上；发热膜122在常温下的电阻为0.5欧姆-2欧姆，其中，常温为25℃。可以理解的是，致密基体121起结构支撑作用，发热膜122与电源组件2电连接。在电子雾化装置的功率为6瓦-8.5瓦，电池的电压范围为2.5伏-4.4伏时，为了达到电池的工作电阻，发热体12的发热膜122在常温下的电阻范围为0.5欧姆-2欧姆。其中，致密基体121上设置有发热膜122的表面为雾化面，即，致密基体121的第一表面1211为雾化面，致密基体121的第二表面1212为吸液面；第一微孔1213用于将气溶胶生成基质从吸液面导引至雾化面，第一微孔1213具有毛细作用。
本申请通过在致密基体121上设置多个具有毛细作用力的第一微孔1213，使得发热体12的孔隙率的大小可精确控制，提升产品的一致性。也就是说，在批量生产中，发热体12中致密基体121的孔隙率基本一致，形成于致密基体121上的发热膜122的厚度均匀，使得同一批出厂的电子雾化装置雾化效果一致。
储液腔13中的气溶胶生成基质经过下液通道114到达发热体12的致密基体121，利用致密基体121上第一微孔1213的毛细作用力将气溶胶生成基质从第二表面1212导引至第一表面1211，使气溶胶生成基质被发热膜122雾化；也就是说，第一微孔1213通过下液通道114与储液腔13连通。其中，致密基体121的材料可以为玻璃或致密陶瓷；致密基体121为玻璃时，可以普通玻璃、石英玻璃、硼硅玻璃、光敏铝硅酸锂玻璃中的一种。
下面以致密基体121的材料为玻璃进行介绍。
在具体实施方式中，第一微孔1213的延伸方向可以与致密基体121的厚度方向垂直，也可以与致密基体121的厚度方向形成夹角，夹角的范围为80度-90度。第一微孔1213的纵截面可以为矩形、梯形、两端大中间小的哑铃形等。第一微孔1213的纵截面形状及其延伸方向可以根据需要进行设计。由于第一微孔1213被设置呈规则的几何形状，因此第一微孔1213在发热体12的体积能够计算得出，从而也可以计算得出整个发热体12的孔隙率，使得同类产品的发热体12的孔隙率的一致性能够得到良好的保证。
致密基体121可以设置为规则的形状，如矩形板状、圆形板状等。在本实施方式中，设置于致密基体121上的多个第一微孔1213呈阵列排布；即，设置于致密基体121上的多个第一微孔1213之间呈规则排布，多个第一微孔1213中相邻的第一微孔1213之间的孔中心 距相同。可选的，多个第一微孔1213呈矩形阵列排列；或多个第一微孔1213呈圆形阵列排列；或多个第一微孔1213呈六角形阵列排列。其中，多个第一微孔1213的孔径可以相同，也可以不同，根据需要进行设计。
致密基体121的第一表面1211和第二表面1212均包括光滑表面，第一表面1211为平面。也就是说，致密基体121的第一表面1211为光滑表面，且为平面，发热膜122形成于第一表面1211，第一表面1211为光滑表面有利于金属材料在厚度较小的情况下沉积成膜。
在一实施方式中，致密基体121的第一表面1211和第二表面1212均为光滑表面，均为平面，且致密基体121的第一表面1211和第二表面1212平行设置；第一微孔1213贯穿第一表面1211和第二表面1212，第一微孔1213的轴线与第一表面1211和第二表面1212垂直，第一微孔1213的截面为圆形；此时，致密基体121的厚度与第一微孔1213的长度相等。可以理解，第二表面1212与第一表面1211平行，第一微孔1213由第一表面1211贯穿至第二表面1212，使得致密基体121的生产工艺简单，降低成本。致密基体121的厚度为第一表面1211与第二表面1212之间的距离。第一微孔1213可以为孔径均匀的直通孔，也可以为孔径不均匀的直通孔，只要孔径的变化范围在50％之内即可。例如，由于制备工艺所限，通过激光诱导和腐蚀在玻璃上开设的第一微孔1213通常为两端孔径大中间孔径小。因此，只要确保第一微孔1213的中间部分的孔径不小于两端端口的孔径的一半即可。
在另一实施方式中，致密基体121的第一表面1211为光滑表面，且为平面，以利于金属材料在厚度较小的情况下沉积成膜。致密基体121的第二表面1212为光滑表面，且第二表面1212可以为非平面，例如，斜面、弧面、锯齿面等，第二表面1212可以根据具体需要进行设计，只需使第一微孔1213贯穿第一表面1211和第二表面1212即可。
相对现有的棉芯发热体和多孔陶瓷发热体，本申请提供的这种带微孔的薄片式结构的发热体12供液通道更短，供液速度更快，但漏液风险液更大。因此，本申请发明人研究了致密基体121厚度与第一微孔1213的孔径的比例对发热体12导液的影响，结果发现，增大致密基体121厚度、减小第一微孔1213的孔径可以降低漏液风险但也会减小供液速率，减小致密基体121的厚度、增大第一微孔1213的孔径可以增大供液速率但又会提高漏液风险，二者相互矛盾。为此，本申请设计了致密基体121的厚度、第一微孔1213的孔径，以及致密基体121厚度与第一微孔1213孔径的比例，使发热体12在功率为6瓦-8.5瓦、电压为2.5伏-4.4伏工作时，既能实现充足的供液，也能防止漏液。其中，致密基体121的厚度为第一表面1211与第二表面1212之间的距离。
另外，本申请发明人研究了相邻第一微孔1213的孔中心距与第一微孔1213孔径的比值，发现如果相邻第一微孔1213的孔中心距与第一微孔1213孔径的比值过大，致密基体121的强度较大也容易加工，但是孔隙率太小，容易导致供液量不足；如果相邻第一微孔1213的孔中心距与第一微孔1213孔径的比值过小，孔隙率较大，供液量充足，但是致密基体121的强度较小而且不容易加工；为此，本申请还设计了相邻第一微孔1213的孔中心距与第一微孔1213孔径的比值，在满足供液能力的前提下，尽可能提升了致密基体121的强度。
下面以致密基体121的材料为玻璃，且致密基体121的第一表面1211和第二表面1212均为光滑的平面且平行设置时，对致密基体121的厚度、第一微孔1213的孔径、致密基体121厚度与第一微孔1213孔径的比例、相邻两个第一微孔1213之间的孔中心距与第一微孔1213的孔径的比例进行介绍。
致密基体121的厚度为0.1毫米-1毫米。致密基体121的厚度大于1毫米时，无法满足供液需求，导致气溶胶量下降，且造成的热损失多，设置第一微孔1213的成本高；致密基体121的厚度小于0.1毫米时，无法保证致密基体121的强度，不利于提高电子雾化装置的性能。优选，致密基体121的厚度为0.2毫米-0.5毫米。致密基体121上第一微孔1213的孔径为1微米-100微米。第一微孔1213的孔径小于1微米时，无法满足供液需求，导致气溶胶量下降；第一微孔1213的孔径大于100微米时，气溶胶生成基质容易从第一微孔1213内流出至第一表面1211造成漏液，导致雾化效率下降。优选，第一微孔1213的孔径为20微米-50微米。可以理解的是，致密基体121的厚度和第一微孔1213的孔径根据实际需要进行选择。
致密基体121厚度与第一微孔1213孔径的比例为20:1-3:1；优选，致密基体121厚度 与第一微孔1213孔径的比例为15:1-5:1(参见图14，通过实验发现致密基体121厚度与第一微孔1213孔径的比例为15:1-5:1时，具有较好的雾化效果)。当致密基体121的厚度与第一微孔1213的孔径的比例大于20:1时，通过第一微孔1213的毛细作用力供给的气溶胶生成基质难以满足发热体12的雾化需求量，不仅容易导致干烧，且单次雾化产生的气溶胶量下降；当致密基体121的厚度与第一微孔1213的孔径的比例小于3:1时，气溶胶生成基质容易从第一微孔1213内流出至第一表面1211，气溶胶生成基质浪费，导致雾化效率下降，进而使得总气溶胶量降低。
相邻两个第一微孔1213之间的孔中心距与第一微孔1213的孔径的比例为3:1-1.5:1，以使致密基体121上的第一微孔1213在满足供液能力的前提下，尽可能提升致密基体121的强度；优选，相邻两个第一微孔1213之间的孔中心距与第一微孔1213的孔径的比例为3:1-2:1；更优选，相邻两个第一微孔1213之间的孔中心距与第一微孔1213的孔径的比例为3:1-2.5:1。
在一个具体实施例中，优选，致密基体121的厚度与第一微孔1213的孔径的比例为15:1-5:1，相邻两个第一微孔1213之间的孔中心距与第一微孔1213的孔径的比例为3:1-2.5:1。
可以理解的是，本申请提供的致密基体121的厚度、第一微孔1213的孔径、致密基体121厚度与第一微孔1213孔径的比例、相邻第一微孔1213的孔中心距与第一微孔1213孔径的比例可以根据需要进行组合设计。
由于发热体12中的致密基体121为致密材料，能够起到结构支撑的作用。相对于现有的棉芯发热体的弹簧状的金属发热丝和多孔陶瓷发热体的金属厚膜导线，对发热体12中的发热膜122的强度和厚度无要求，发热膜122可以采用低电阻率的金属材料。
在一实施方式中，形成于致密基体121的第一表面1211上的发热膜122为薄膜，发热膜122的厚度范围为200纳米-5微米，即发热膜122的厚度较薄；优选，发热膜122的厚度范围为200纳米-1微米；更优选，发热膜122的厚度范围为200纳米-500纳米。当发热膜122为薄膜时，发热膜122具有与多个第一微孔1213一一对应且相互连通的多个第二微孔1221。进一步，发热膜122还形成于第一微孔1213的内表面；优选，发热膜122还形成于第一微孔1213的整个内表面(结构如图4所示)。在第一微孔1213的内表面设置有发热膜122，使得气溶胶生成基质在第一微孔1213内就可以被雾化，有利于提高雾化效果。
发热膜122越薄，对第一微孔1213的孔径的影响就越小，进而实现较好的雾化效果；而且发热膜122越薄，发热膜122本身吸热少，电热损耗低，发热体12升温速度快。在发热膜122在常温下的电阻为0.5欧姆-2欧姆的基础上，本申请采用低导电率的金属材料，以形成较薄的金属膜，尽可能降低对第一微孔1213的孔径的影响。可选的，发热膜122的电阻率不大于0.06*10 -6Ω·m。发热膜122的低导电率的金属材料为银或银合金或铜或铜合金或铝或铝合金或金或金合金；可选的，发热膜122的材料可以为铝或铝合金或金或金合金。通电加热时，发热膜122可以快速升温，直接加热第一微孔1213内的气溶胶生成基质，实现高效雾化。
进一步，本申请发明人研究发现，液态气溶胶生成基质中包含各种香精香料和添加剂，含硫、磷、氯等元素，发热膜122通电加热时银和铜易发生腐蚀失效。金具有非常强的化学惰性，铝表面会生成致密氧化薄膜，这两种材料在液态气溶胶生成基质中非常稳定，优选作为发热膜122材料。
发热膜122可以通过物理气相沉积(如，磁控溅射、真空蒸发、离子镀)或化学气相沉积(离子体辅助化学沉积、激光辅助化学沉积、金属有机化合物沉积)的方式形成于致密基体121的第一表面1211。可以理解的是，发热膜122的形成工艺使其不会覆盖第一微孔1213，即，第一微孔1213贯穿发热膜122。通过物理气相沉积或化学气相沉积在致密基体121的第一表面1211形成发热膜122的同时也就在第一微孔1213的内表面形成了发热膜122。在选用磁控溅射的方式在致密基体121的第一表面1211形成发热膜122时，磁控溅射时金属原子与第一表面1211垂直，与第一微孔1213的内表面平行，金属原子更容易沉积在第一表面1211；假设金属原子沉积在第一表面1211形成的发热膜122的厚度为1微米，此时金属原子沉积在第一微孔1213的内表面的厚度远小于1微米，甚至达不到0.5微米；发热膜122沉积在第一表面1211的厚度越薄，形成于第一微孔1213内表面的发热膜122的厚度越薄，对第一微孔1213的孔径影响越小。由于发热膜122的厚度远小于第一微孔1213的孔径，且发热膜122沉积于第一微孔1213内的部分的厚度要小于沉积于致密基体121的第一表面 1211的部分的厚度，因此，发热膜122沉积于第一微孔1213内对第一微孔1213的孔径影响可以忽略。
请参阅图6和图7，图6是图4提供的发热体的从雾化面一侧观看的结构示意图，图7是图4提供的发热体的从吸液面一侧观看的结构示意图。
发热体12还包括两个电极123；即，发热体12包括致密基体121、发热膜122和两个电极123。致密基体121包括雾化面以及与雾化面相对的吸液面。发热膜122和电极123设置于雾化面且相互电连接；即，发热元件126和电极123设置于雾化面且相互电连接。致密基体121上设置有多个第一微孔1213，即，可以在整个致密基体121表面以阵列排布的方式设置多个第一微孔1213，也可以仅在致密基体121的部分表面以阵列排布的方式设置多个第一微孔1213。其中，发热膜122为薄膜，发热膜122具有与多个第一微孔1213一一对应且相互连通的多个第二微孔1221。
本申请发明人研究发现，致密基体121上设置的第一微孔1213的数量越多，致密基体121的强度越低，不利于将发热体12应用于产品。因此，优选的，仅在致密基体121的部分表面以阵列排布的方式设置多个第一微孔1213，详细介绍如下。
致密基体121设有微孔阵列区1218和邻近微孔阵列区1218的留白区1219。微孔阵列区1218具有多个第一微孔1213，第一微孔1213为贯穿雾化面和吸液面的通孔，第一微孔1213用于将气溶胶产生基质从吸液面导流至雾化面。电极123设置于雾化面的留白区1219。发热膜122设置于致密基体121且与电极123电连接，用于加热雾化气溶胶生成基质；具体地，发热膜122(即，发热元件126)设置于雾化面的微孔阵列区1218。其中，吸液面的留白区1219用于与密封件18配合，吸液面的留白区1219至少部分被密封件18覆盖。也就是说，密封件18设置于致密基体121的吸液面，且覆盖至少部分吸液面的留白区1219。
通过在致密基体121上设有微孔阵列区1218和邻近微孔阵列区1218的留白区1219，可以理解，留白区1219上并未设置第一微孔1213，减少了致密基体121上第一微孔1213的数量，以此提高发热体12中致密基体121的强度，降低在致密基体121上设置第一微孔1213的生产成本。并且致密基体121的吸液面的留白区1219与密封件18配合，密封件18在实现密封的同时防止发热体12中的致密基体121断裂。
在一实施方式中，留白区1219围绕微孔阵列区1218一周设置。致密基体121中的微孔阵列区1218作为雾化区，覆盖发热膜122及发热膜122周边区域，也就是基本覆盖达到雾化气溶胶生成基质温度的区域，充分利用了热效率。发热体12分为不同的功能区(微孔阵列区12218和留白区1219具有不同功能)，根据不同的功能最大优化结构，既满足高的热效率，又满足强度要求和密封要求。
具体地，留白区1219包括两个第一子留白区1219a和两个第二子留白区1219b，两个第一子留白区1219a分别位于微孔阵列区1218沿第一方向的相对两侧，两个第二子留白区1219b分别位于微孔阵列区1218沿第二方向的相对两侧，第二方向垂直于第一方向。第一子留白区1219a的宽度大于第二子留白区1219b的宽度。其中，第一子留白区的宽度为2.1mm-2.6mm；第二子留白区1219b的宽度大于等于0.5mm。可以理解，本申请中的致密基体121的微孔阵列区1218周边的区域的尺寸大于第一微孔1213的孔径，才能称之为留白区；即，本申请中的留白区1219是可以形成第一微孔1213而没有形成第一微孔1213的区域，而非微孔阵列区1218周边的无法形成第一微孔1213的区域。在一个实施例中，距离致密基体121的边线最近的第一微孔1213与致密基体121的边线之间的间距大于第一微孔1213的孔径，才认为在微孔阵列区1218的周向上设有留白区1219。
在一实施方式中，致密基体121为矩形平板状，微孔阵列区1218中的多个第一微孔1213呈矩形阵列排布；两个第一子留白区1219a的宽度相同，两个第二子留白区1219b的宽度相同。可以理解，致密基体121的形状可以根据需要进行设计，微孔阵列区1218中的多个第一微孔1213的排布方式可以根据需要进行设计，留白区1219的设置方式及其尺寸可以根据需要进行设计，本申请对上述并不进行限定。
在一实施方式中，电极123设置于第一子留白区1219a，以保证电极123的连续性和稳定性，且使设置于致密基体121雾化面上的电极123与导通件17具有足够大的接触面积， 保证导通件17与发热体12的电极123电连接的稳定性。可以理解，将第一子留白区1219a的宽度设置为2.1mm-2.6mm，便于将电极123设置于第一子留白区1219a。另外，第一子留白区1219a可以用作后续安装的主要夹持区域，例如通过顶针和雾化座11的抵接部夹持第一子留白区1219a，因此，将第一子留白区1219a的宽度设置为2.1mm-2.6mm，既可以保证第一子留白区1219a可以承受足够的夹持应力，又不至于由于发热体12长度过大而导致雾化器1宽度过大。电极123至少部分设置于第一子留白区1219a(即，电极123部分设置于留白区，部分设置于微孔阵列区1218)，能够实现与导通件17的电连接即可；优选的，电极123全部设置于第一子留白区1219a，降低电极123与导通件17之间的装配精度要求。
可以理解，密封件18为环形结构(参见图8和图9a)，密封件18是有一定宽度的，将第二子留白区1219b的宽度设置为大于等于0.5mm是为了实现留白区1219能够与密封件18配合，进而实现吸液面的留白区1219至少部分被密封件18覆盖。
请参阅图8和图9a，图8是图2提供的雾化组件的局部结构示意图，图9a是图8的另一方向的结构示意图。
参见图2，雾化顶座111具有收容槽1111，发热体12设置于收容槽1111内，密封件18至少部分设置于收容槽1111的底壁与发热体12的吸液面之间。雾化顶座111上的下液通道114与收容槽1111连通，以使气溶胶生成基质进入发热体12。发热体12和密封件18设置于收容槽1111内。其中，收容槽1111的底壁形成抵持部(图未示)。即，雾化顶座111具有抵持部，也就是雾化座11具有抵持部。
具体地，雾化顶座111和雾化底座112分别从吸液面和雾化面的两侧夹持发热体12，密封件18夹持于发热体12的留白区与雾化顶座111之间；即，密封件18夹持于发热体的留白区与雾化座11之间。
雾化组件1还包括支撑件120，支撑件120设置于发热体12远离储液腔13的一侧。支撑件120固定于雾化底座112上。支撑件120与抵持部配合以夹持发热体12；具体地，支撑件120与抵持部分别从发热体12的片状基体125沿着其厚度方向的相对的两侧夹持片状基体125。发热体12的两个电极123设置于片状基体125靠近支撑件120的表面。密封件18至少部分位于发热体12与抵持部之间；具体的，密封件18至少部分位于发热体12与收容槽1111的底壁之间。也就是说，密封件18全部位于发热体12靠近抵持部的表面；或，密封件18部分位于发热体12靠近抵持部的表面，部分位于发热体12的侧面；或，密封件18部分位于发热体12靠近抵持部的表面，部分位于发热体12的侧面，部分位于发热体12远离抵持部的表面，具体根据需要进行设计。
支撑件120、密封件18与雾化座11之间的设置方式对片状发热体12起到保护作用，称之为发热体12的保护结构。
在另一实施方式中，也可以不需在雾化顶座111上设置收容槽1111，以使收容槽1111的底壁作抵持部使用，抵持部可以为雾化座11其他结构形成的，能够使抵持部与支撑件120配合夹持发热体12即可。在又一实施方式中，储液腔13腔壁靠近发热体12的端面与密封件18抵接，且储液腔13腔壁靠近发热体12的端面与支撑件120配合夹持发热体12；也就是说，储液腔13腔壁靠近发热体12的端面作为抵持部(如图9b所示，图9b是本申请提供的雾化组件另一实施方式的局部结构简图)。抵持部的设置方式根据需要进行设计，本申请对此并不限定。
发热体12的端部可以搭接于雾化顶座111和/或雾化底座112上。支撑件120至少部分设置于发热体12的中间位置(该中间位置不是指发热体12的正中心，而是指发热体12除了边缘的其他位置)，而不是发热体12的边缘，以进一步固定发热体12。这是由于片状发热体12强度较小，如果夹持发热体12的边缘，发热体12的中间悬空的部分太多，破裂风险较大。在一具体实施方式中，支撑件120至少部分设置于发热体12的电极123对应处；其中，发热体12的电极123位于发热体12的中间位置。
密封件18至少覆盖发热体12对应支撑件120的区域。密封件18上设置有进液口181， 使发热体12至少部分暴露，也就是使多个第一微孔1213中的至少部分暴露，从而与储液腔13流体相通；即，发热体12的吸液面至少部分从密封件18的进液口181露出以吸收气溶胶生成基质。当致密基体121的整个表面都设置有第一微孔1213，进液口181至少使对应于雾化区的第一微孔1213暴露；当致密基体121设有微孔阵列区1218和留白区1219，进液口181至少使微孔阵列区1218中对应于雾化区的第一微孔1213暴露，优选的，进液口181使吸液面的整个微孔阵列区1218完全暴露。
密封件18上的进液口181使雾化顶座111上的下液通道114与致密基体121上的第一微孔1213连通；下液通道114将进液口181与储液腔13连通，储液腔13中的气溶胶生成基质通过下液通道114、进液口181进入发热体12。也就是说，发热体12的吸液面通过密封件18的进液口181与储液腔13流体相通。发热体12与雾化底座112配合形成雾化腔115，具体的，发热体12的雾化面与雾化底座112配合形成雾化腔115。
可以理解，在其他实施方式中，密封件18上的进液口181使发热体12与储液腔13直接流体连通,；也就是说，并不需要设置下液通道114，储液腔13中的气溶胶生成基质仅通过进液口181就可以进入发热体12。
通过支撑件120与雾化座11的配合实现对发热体12的固定；也就是说，支撑件120和雾化座11夹持发热体12，实现对发热体12的固定。由于发热体12中致密基体121的材料为玻璃或致密陶瓷，固定发热体12的夹持力太大，易使发热体12破裂，不利于将该发热体12应用于产品。为了解决该问题，使密封件18至少覆盖发热体12对应支撑件120的区域，密封件18在实现密封的同时作为缓冲件，可以对冲支撑件120过多的压力，以此防止发热体12破裂。
在一实施方式中，发热体12中的致密基体121的整个表面上以阵列排布的方式设置多个第一微孔1213；即，发热膜122和电极123上均具有与多个第一微孔1213对应的第二微孔1221。即使致密基体121的整个表面都设置有第一微孔1213，通过使密封件18至少覆盖发热体12对应支撑件120的区域，密封件18能够缓冲支撑件120施加给发热体12的力，依然能够应用于产品。
在另一实施方式中，发热体12中的致密基体121仅有部分表面以阵列排布的方式设置多个第一微孔1213。即，致密基体121设有微孔阵列区1218和围绕微孔阵列区1218一周设置的留白区1219；微孔阵列区1218中设置有多个第一微孔1213，留白区1219并未设置第一微孔1213。电极123至少部分设置于雾化面的留白区1219，发热膜122设置于雾化面的微孔阵列区1218；密封件18设置于吸液面的留白区1219。可以理解，由于支撑件120设置于发热体12远离密封件18的一侧，即，支撑件120设置于雾化面；发热膜122设置于雾化面的微孔阵列区1218，为了避免支撑件120对雾化效率、口感的影响，支撑件120设置于雾化面的留白区，相应的密封件18设置于吸液面的留白区1219，且至少覆盖对应于支撑件120的区域。优选的，密封件18完全覆盖吸液面的留白区1219，以此简化密封件18的生产工艺，且便于装配；此时，密封件18上的进液口181使吸液面的微孔阵列区1218完全暴露。在不考虑雾化效率和口感的前提下，密封件18也可以同时设置于留白区1219和微孔阵列区1218(发热体12依然可以雾化气溶胶生成基质)，能够防止发热体12破裂即可。其中，电极123可以部分设置于留白区1219，部分设置于微孔阵列区1218；电极123也可以完全设置于留白区1219，能够实现电极123与发热膜122、电极123与导通件17的稳定电连接即可，电极123的具体设置方式可以根据需要进行设计。
参见图9a，密封件18远离储液腔13的表面具有两个定位部182；两个定位部182相对且间隔设置；发热体12设置于两个定位部182之间。两个定位部182对发热体12进行限位，防止发热体12晃动。在本实施方式中，密封件18远离储液腔13的表面包括第一侧边和与第一侧边相对的第二侧边，以及连接第一侧边和第二侧边的第三侧边、第四侧边；定位部182为长条状，一个设置于第一侧边，另一个设置于第二侧边；定位部182的第一端与第三侧边之间的距离大于等于零，定位部182的第二端与第四侧边之间的距离大于等于零，定位部182的第一端与第三侧边之间的距离和定位部182的第二端与第四侧边之间的距离相同。定位部182的具体设置方式，可以根据需要进行设计，能够实现对发热体12的限位即可。
参见图2、图8和图9a，导通件17为顶针，顶针的一端与发热体12的电极抵接，顶针的另一端用于与电源组件2电连接。
在一实施方式中，支撑件120包括两个导电支撑件，两个导电支撑件分别与两个电极123抵接。两个导电支撑件为两个顶针，且刚性固定在雾化座11上。即，顶针同时用作支撑件120。密封件18至少覆盖发热体12的吸液面对应顶针的区域。具体地，雾化顶座111具有收容槽1111，发热体12设置于收容槽1111内，密封件18设置于收容槽1111的底壁与发热体12的吸液面之间，顶针与雾化顶座111配合夹持发热体12，实现对发热体12的固定。
请参阅图10，图10是本申请提供的雾化组件另一实施方式的局部结构示意图。
图10提供的雾化组件1的结构与图2提供的雾化组件1的结构基本相同，不同之处在于导通件17和支撑件120的设置不同。
在另一实施方式中，导通件17为弹片或弹针，固定在雾化底座112上。雾化底座112与发热体12的雾化面抵接，雾化底座112同时用作支撑件120。可选的，雾化底座112与发热体12雾化面的留白区1219抵接，以利于雾化效率和口感。具体地，雾化底座112包括本体和设置于本体上的支撑柱，支撑柱与发热体12的雾化面抵接(如图10所示)；或，雾化底座112包括本体和设置于本体上的中空凸台，中空凸台与发热体12的雾化面抵接；雾化底座112的具体结构可以根据需要进行设计，能够与雾化顶座111配合夹持固定发热体12即可。
请参阅图11，图11是本申请提供的雾化组件又一实施方式的局部结构示意图。
图11提供的雾化组件1的结构与图2提供的雾化组件1的结构基本相同，不同之处在于导通件17和支撑件120的设置不同。
在又一实施方式中，导通件17为弹片或弹针，固定在雾化底座112上。支撑件120为独立与雾化座11的环形结构，且支撑件120的一表面与发热体12的雾化面抵接。可选的，支撑件120与发热体12雾化面的留白区1219抵接，以利于雾化效率和口感。具体地，支撑件120通过卡接设置于雾化顶座111的收容槽1111内或通过雾化底座112支撑设置于雾化顶座111的收容槽1111内。装配过程中，先将密封件18、发热体12依次设置于雾化顶座111的收容槽1111，然后将支撑件120卡接与收容槽1111或通过雾化底座112设置于收容槽1111；通过支撑件120与雾化顶座111夹持固定发热体12。
请参阅图12，图12是图3提供的局部结构示意图。
通常情况下，雾化座11的材料为塑胶，密封件18的材料为硅胶或氟橡胶。薄的发热体12在雾化过程中，外部气体容易通过发热体12上的多个第一微孔1213进入储液腔13，即会有气泡从发热体12的雾化面通过第一微孔1213回流，而气泡容易粘附在硅胶件上形成大气泡，即回流的气泡易粘附在密封件18的进液口181的侧面(发热体12吸液面的周围)上形成大气泡，影响下液，导致下液不畅。由于气泡相对不容易粘附在雾化座11(塑胶件)上，减少密封件18(硅胶件)的进液口181的厚度即可降低回流气泡对下液的影响。为了解决该问题，可以使进液口181的侧面具有亲液结构。亲液结构可以改善进液口181的侧面的亲水性和/或亲油性，使得进液口181的侧面与气溶胶生成基质具有更小的接触角和更强的润湿性。亲液结构为通过对进液口181的侧面进行改性处理形成的微结构。在一实施方式中，亲液结构为至少包覆在进液口181的部分侧面的隔离层，以降低回流气泡对下液的影响；其中，隔离层的材料比密封件18的材料润湿性强，或隔离层的材料与气溶胶生成基质的接触角小于密封件18的材料与气溶胶生成基质的接触角。
在一实施方式中，隔离层为设置于进液口181的侧面的涂层或贴片。隔离层的材料为聚硅氧烷和乙酸乙烯酯中的一种，这几种材料的亲水性和/或亲油性比硅胶、氟橡胶的亲水性和/或亲油性好。
在一实施方式中，雾化顶座111的收容槽1111的底壁上具有凸起部117，也就是说，凸起部117设置于抵持部靠近密封件18的表面。凸起部117覆盖进液口181的至少部分侧面。可选的，凸起部117的表面具有涂层，涂层的材料为聚硅氧烷和乙酸乙烯酯中的一种，以此降低回流气泡对下液的影响；或，凸起部117的材料为塑胶、玻璃以及硅中的一种，这几种 材料的亲水性比硅胶、氟橡胶的亲水性和/或亲油性好，以此降低回流气泡对下液的影响；或，凸起部117的材料为塑胶、玻璃以及硅中的一种，且凸起部117的表面具有涂层，涂层的材料为聚硅氧烷和乙酸乙烯酯中的一种，以此降低回流气泡对下液的影响。可选的，凸起部117与雾化顶座111一体成型、胶黏固定或卡合固定，具体根据需要进行设计。
当隔离层为雾化座11的凸起部117，凸起部117的材料为塑胶、玻璃以及硅中的一种时，凸起部117覆盖进液口181的至少部分侧面，以此减小回流的气泡与密封件18的进液口181的接触面积，进而最大限度的降低回流气泡对下液的影响。其中，凸起部117靠近发热体12的端面与发热体12之间存在间隙，以防止雾化顶座111的凸起部117直接将力压在发热体12上。参见图8，密封件18的进液口181在其延伸方向上的尺寸并不均一。具体地，进液口181包括相互连通的第一进液段和第二进液段；第一进液段位于第二进液段远离发热体12的一侧，且第一进液段的尺寸大于第二进液段的尺寸，进液口181的侧面形成台阶结构。即，在密封件18远离发热体12的表面，且环绕进液口181设置有切口，以在进液口181的侧面形成台阶结构。参见图12，凸起部117的端部与第一进液段和第二进液段的连接面抵接，即，凸起部117的端部与台阶结构的底面抵接；且凸起部117完全覆盖第一进液段的侧面。
进一步，凸起部117远离下液通道114的表面具有围骨1172。围骨1172覆盖第二进液段的至少部分侧面，进一步减小气泡与进液口181的接触面积，最大限度的降低气泡对下液的影响。其中，围骨1172靠近发热体12的端面与发热体12之间存在间隙，以防止雾凸起部117上的围骨1172直接将力压在发热体12上。
请参阅图13，图13是图12中凸起部另一实施方式与密封件的进液口配合的结构示意图。
在另一实施方式中，密封件18的进液口181在其延伸方向上的尺寸均一。进液口181的侧面与雾化组件1的轴线平行。凸起部117覆盖进液口181的部分侧面，凸起部117靠近发热体12的端面与发热体12之间存在间隙。可以理解，凸起部117覆盖进液口181的侧面越多，也有利于降低回流气泡对下液的影响，只需使凸起部117不直接将力压在发热体12上即可。
为了解决回流气泡易粘附在密封件18(硅胶件)上影响下液的问题，可以将密封件18设置于发热体12的侧面与收容腔113的腔壁之间，使吸液面完全暴露于下液通道114，实现密封即可。可选的，下液通道114的端口与发热体12的吸液面抵接；即，发热体12的吸液面与下液通道114直接流体连通，并不经过任何部件。其中，雾化座11的材料比密封件18的材料润湿性强，或雾化座11的材料与气溶胶生成基质的接触角小于密封件18的材料与气溶胶生成基质的接触角。在一实施方式中，密封件18环绕发热体12的侧面设置且仅设置于发热体12的侧面与收容腔113的腔壁之间；在另一实施方式中，密封件18仅设置于发热体12的侧面与收容腔113的腔壁之间，和发热体12的雾化面上，且密封件18使发热膜122完全暴露。也就是说，在发热体12靠近储液腔13的表面并未覆盖密封件18，雾化过程中回流气泡不存在粘附在密封件18的可能；同时，下液通道114的端口与发热体12的吸液面抵接，回流气泡不存在对下液的顺畅度造成影响。
下面通过实验验证，本申请提供的致密基体121的厚度和第一微孔1213的孔径对供液效率的影响。
通过发热体12湿烧实验评估发热体12的供液效率。采用直流电源供电，通过电源组件2的顶针20(顶针20与电池电连接)分别连接发热体12的电极123，控制通电功率和通电时间，采用红外热成像仪或热电偶对发热膜122进行测温。
当发热膜122通电时，瞬间温度上升，使第一微孔1213内的气溶胶生成基质气化，随着第一微孔1213内气溶胶生成基质的消耗，第一微孔1213的毛细作用使储液腔13内的气溶胶生成基质不断向发热膜122处补充。
气溶胶生成基质在具有毛细作用的第一微孔1213内的流动可以根据Washburn方程推算，S是第一微孔1213的孔面积，ρ是气溶胶生成基质密度，z是气溶胶生成基质经过的距离，γ是表面张力，μ是气溶胶生成基质的粘度，r是第一微孔1213的半径，θ是气溶胶生成基质对致密基体121材料的接触角。气溶胶生成基质的雾化量如下：
Figure PCTCN2021116045-appb-000001
从公式可知，确定气溶胶生成基质和致密基体121的材料后，ρ、γ、μ、θ不变。第一微孔1213的孔径越大，供液越充足，但产品在运输过程中的航空负压和使用过程中的温冲漏液风险也会更大。因此，致密基体121的厚度、孔径、厚径比非常重要，既要保证雾化过程中充足的供液，也要防止气溶胶生成基质漏出。
将发热体12装机测试，评价致密基体121厚度/第一微孔1213孔径与雾化量之间的关系，结果如图14所示(图14是本申请提供的发热体的致密基体厚度/第一微孔孔径与雾化量之间的关系图)。由图14可知，当致密基体121厚度/第一微孔1213孔径过大时，通过毛细作用供给的气溶胶生成基质难以满足雾化需求量，雾化量下降。当致密基体121厚度/第一微孔1213孔径过小时，气溶胶生成基质容易从第一微孔1213内流出至发热膜122面，导致雾化效率下降，雾化量降低。
以上所述仅为本申请的部分实施例，并非因此限制本申请的保护范围，凡是利用本申请说明书及附图内容所作的等效装置或等效流程变换，或直接或间接运用在其它相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (19)

  1. 一种发热体，用于雾化液态气溶胶生成基质，其中，所述发热体包括：
    片状基体，所述片状基体为致密基体，所述致密基体包括雾化面以及与所述雾化面相对的吸液面；所述致密基体设有微孔阵列区和邻近所述微孔阵列区的留白区；所述微孔阵列区具有多个第一微孔，所述第一微孔为贯穿所述雾化面和所述吸液面的通孔；
    电极，设置于所述雾化面的留白区；
    发热元件，设置于所述致密基体且与所述电极电连接，用于加热雾化气溶胶生成基质；
    其中，所述吸液面的留白区用于与密封件配合，所述吸液面的留白区至少部分被所述密封件覆盖。
  2. 根据权利要求1所述的发热体，其中，所述片状基体为平板状；所述留白区围绕所述微孔阵列区一周设置。
  3. 根据权利要求2所述的发热体，其中，所述留白区包括两个第一子留白区和两个第二子留白区，两个所述第一子留白区分别位于所述微孔阵列区沿第一方向的相对两侧，两个所述第二子留白区分别位于所述微孔阵列区沿第二方向的相对两侧，所述第二方向垂直于所述第一方向；所述第一子留白区的宽度大于所述第二子留白区的宽度；所述电极设置于所述第一子留白区。
  4. 根据权利要求3所述的发热体，其中，所述第一子留白区的宽度为2.1mm-2.6mm；所述第二子留白区的宽度大于等于0.5mm。
  5. 根据权利要求3所述的发热体，其中，所述致密基体为矩形平板状，所述微孔阵列区中的多个第一微孔呈矩形阵列排布；两个所述第一子留白区的宽度相同，两个所述第二子留白区的宽度相同。
  6. 根据权利要求1所述的发热体，其中，所述致密基体的材料为玻璃，所述玻璃为硼硅玻璃、石英玻璃或光敏铝硅酸锂玻璃。
  7. 根据权利要求1所述的发热体，其中，所述致密基体的厚度为0.1mm-1mm；所述第一微孔的孔径为1μm-100μm。
  8. 根据权利要求1所述的发热体，其中，所述致密基体的厚度与所述第一微孔的孔径的比例为20:1-3:1。
  9. 根据权利要求1所述的发热体，其中，相邻所述第一微孔之间的孔中心距与所述第一微孔的孔径的比例为3:1-1.5:1。
  10. 根据权利要求1所述的发热体，其中，所述发热元件为发热膜，设置于所述雾化面上的微孔阵列区；所述发热膜具有与多个所述第一微孔一一对应且相互连通的多个第二微孔。
  11. 根据权利要求10所述的发热体，其中，所述发热膜的材料为银或银合金或铜或铜合金或铝或铝合金或金或金合金，所述发热膜厚度范围为200nm-5um。
  12. 一种雾化组件，其中，包括：
    储液腔，用于存储气溶胶生成基质；
    发热体，所述发热体为权利要求1-11任意一项所述的发热体；所述第一微孔与所述储液腔连通；
    密封件，设置于所述吸液面，且覆盖至少部分所述吸液面的留白区。
  13. 根据权利要求12所述的雾化组件，其中，所述密封件完全覆盖所述吸液面的留白区；所述密封件上设置有进液口，以使所述吸液面的微孔阵列区完全暴露。
  14. 根据权利要求12所述的雾化组件，其中，所述雾化组件还包括雾化座，所述密封件夹持于所述发热体的留白区与所述雾化座之间。
  15. 根据权利要求14所述的雾化组件，其中，所述雾化座包括雾化顶座和雾化底座，所述雾化顶座和所述雾化底座分别从所述吸液面和所述雾化面的两侧夹持所述发热体，所述密封件夹持于所述发热体的留白区与所述雾化顶座之间。
  16. 根据权利要求15所述的雾化组件，其中，所述密封件上设置有进液口，以使所述微孔阵列区暴露；所述雾化顶座具有下液通道；所述下液通道将所述进液口与所述储液腔连通；所述发热体与所述雾化底座配合形成雾化腔。
  17. 根据权利要求14所述的雾化组件，其中，所述雾化座的材料为塑胶；所述密封件的材料为硅胶或氟橡胶。
  18. 根据权利要求12所述的雾化组件，其中，所述雾化组件还包括顶针；所述顶针的一端与所述发热体的电极抵接，所述顶针的另一端用于与电源组件电连接；所述密封件至少覆盖所述吸液面对应所述顶针的区域。
  19. 一种电子雾化装置，其中，包括雾化组件和电源组件，所述雾化组件为权利要求12-18任意一项所述的雾化组件，所述电源组件控制所述雾化组件工作。
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