WO2022162893A1

WO2022162893A1 - Machine tool, optical systems, and measuring device

Info

Publication number: WO2022162893A1
Application number: PCT/JP2021/003343
Authority: WO
Inventors: 仁増井; 稔椎葉; 俊介中; 純恵奥山; 昌丈杉田; 優介谷澤; 康夫鈴木; 正範荒井; 喬之森田; 禎晃小濱
Original assignee: 株式会社ニコン
Priority date: 2021-01-29
Filing date: 2021-01-29
Publication date: 2022-08-04

Abstract

This machine tool comprises: a machining device provided with a main shaft to and from which a tool is attachable and detachable; and a measuring device capable of measuring the shape of an object by irradiating the object with first light and detecting second light from the object which was irradiated with the first light. The measuring device comprises: a first optical system, which is attached to a part that is different from the main shaft of the machining device and through which the first light and the second light pass; and a second optical system, which is detachably attached to the main shaft and which projects the first light from the first optical system towards the object as well as projecting the second light from the object towards the first optical system.

Description

Machine tools, optical systems and measuring equipment

The present invention, for example, relates to the technical field of machine tools that can process objects using tools, and optical systems and measurement devices used in machine tools.

Patent Document 1 describes a machine tool equipped with a measuring device. In such a machine tool, it is a technical problem to properly arrange the measuring device.

U.S. Patent Publication No. 2008/0297472

According to a first aspect, a processing apparatus includes a spindle to which a processing tool is detachable, and a first light is irradiated onto an object, and a second light from the object irradiated with the first light is detected. and a measuring device capable of measuring the shape of the object by using a first optical system, wherein the measuring device is attached to a portion of the processing device different from the main axis and through which the first light and the second light pass. a system, which is detachably attached to the main shaft, emits the first light from the first optical system toward the object, and emits the second light from the object toward the first optical system; A machine tool is provided comprising a second optical system for

According to the second aspect, the processing apparatus includes a spindle to which a processing tool can be attached and detached, and the object is irradiated with the first light and the second light from the object irradiated with the first light is detected. and a measuring device capable of measuring the object by means of a laser beam, wherein the measuring device includes a first optical system attached to a portion different from the main shaft of the processing device, and a second optical system detachably attached to the main shaft. and wherein the first optical system emits the first light toward the second optical system and receives the second light from the second optical system.

According to a third aspect, a processing device comprising a main shaft to which a processing tool is attachable and detachable, and a first optical system attached to a portion of the processing device different from the main shaft and used for measuring an object, The first optical system emits a first light toward a second optical system detachably attached to the main axis, and emits a first light from the object irradiated with the first light via the second optical system. A machine tool is provided that receives two lights.

According to a fourth aspect, there is provided an optical system for use in a machine tool having a processing device having a main shaft to which a processing tool is attachable and detachable, wherein the optical system is detachably attached to the main shaft and connected to the main shaft of the processing device. receives a first light emitted from a measurement optical system attached to a different portion, emits the received first light toward an object, and receives and receives a second light from the object An optical system is provided that emits the second light toward the measurement optical system, and the measurement optical system measures the object using the second light from the optical system.

According to the fifth aspect, the tool for processing can be attached to a machine tool having a processing device having a detachable main shaft, irradiates the object with the first light, and the object irradiated with the first light A measuring device capable of measuring the object by detecting a second light from the first optical system attached to a portion different from the main shaft of the processing device, and a second optical system detachably attached to the main shaft 2 optical systems, wherein the first optical system emits the first light toward the second optical system and receives the second light from the second optical system. .

The operation and other benefits of the present invention will be made clear from the following description of the embodiment.

FIG. 1 is a perspective view showing the appearance of the machine tool of the first embodiment. FIG. 2 is a system configuration diagram showing the system configuration of the machine tool of the first embodiment. FIG. 3 is a cross-sectional view showing the structure of the processing head of the first embodiment. FIG. 4 is a cross-sectional view showing the structure of the processing head of the first embodiment. FIG. 5 is a cross-sectional view showing a processing head to which the measuring device (particularly, the measuring head) of the first embodiment is attached. FIG. 6 is a cross-sectional view showing the structure of the measuring device (in particular, the measuring head) of the first embodiment. FIG. 7 is a cross-sectional view showing the structure of the optical system of the first embodiment. Each of FIGS. 8(a) to 8(c) is a plan view showing the shape of the scan area irradiated with the measurement light on the surface of the object to be measured. FIG. 9 is a cross-sectional view showing how the optical paths of the measurement light and the return light are changed by changing the rotation angle of the main shaft. FIG. 10 is a cross-sectional view showing a stage on which a coordinate reference member is formed. 11(a) and 11(b) are cross-sectional views showing the coordinate reference member. FIG. 12 is a perspective view showing an example of the structure of an optical system that can be used when the measuring device measures the coordinate reference member. FIG. 13 is a flow chart showing the flow of work measuring operation. FIG. 14 shows measurement light ML regarded as a virtual tool. FIG. 15 is a flow chart showing the flow of the running error calibration operation. FIG. 16 is a cross-sectional view showing an example of the running error correcting member. FIG. 17 is a graph showing the position of the reference plane of the running error correcting member in the Z-axis direction calculated from the measurement result of the running error correcting member. FIG. 18 is a flow chart showing the flow of the running error calibrating operation performed by using the workpiece machined by the machining head as the running error calibrating member. FIG. 19 is a cross-sectional view schematically showing the measurement light ML with which the workpiece W is irradiated. FIG. 20 shows the workpiece W machined under conditions with no running error and the position of the machined surface of the workpiece W measured under conditions without running error. FIG. 21 shows the position of the machined surface of the work machined under conditions with running error and the position of the machined surface of the work measured under conditions with running error. FIG. 22 is a cross-sectional view showing the structure of the measuring device (in particular, the measuring head) of the second embodiment. FIG. 23 is a cross-sectional view showing the measuring head attached to the machining head so that the measuring axis of the measuring device and the rotation axis of the spindle are parallel. FIG. 24 is a cross-sectional view showing the measuring head attached to the machining head so that the measuring axis of the measuring device and the rotation axis of the spindle are not parallel. FIG. 25 is a sectional view showing a measuring head attached to a machining head so that the measuring axis of the measuring device and the rotation axis of the spindle are not parallel. FIG. 26 is a flow chart showing the flow of the shaft misalignment error calibration operation. FIG. 27 is a graph showing the position of the machined surface of the work in the Z-axis direction calculated from the measurement result of the work. FIG. 28 is a cross-sectional view showing the structure of the measuring device (in particular, the measuring head) of the second embodiment. FIG. 29 is a cross-sectional view showing the structure of the measuring device (in particular, the measuring head) of the third embodiment. FIG. 30(a) is a cross-sectional view showing a machining head for machining a work, and FIG. 30(b) is a cross-sectional view showing a measuring device (in particular, a measuring head) for measuring the work. FIG. 31 is a cross-sectional view showing the structure of the measuring device of the fourth embodiment. FIG. 32 is a cross-sectional view showing the structure of the measuring device of the fifth embodiment. FIG. 33 is a cross-sectional view showing the structure of the measuring device of the sixth embodiment. FIG. 34 is a cross-sectional view showing the structure of the measuring device (in particular, the measuring head) of the seventh embodiment. Each of FIGS. 35(a) and 35(b) is a cross-sectional view showing an example of a measuring head that can be attached to the spindle. Each of FIGS. 36(a) and 36(b) is a cross-sectional view showing an example of a measuring head that can be attached to the spindle. 37(a) and 37(b) are cross-sectional views showing an example of a measuring head that can be attached to a spindle. FIG. 38 is a cross-sectional view showing a measuring head that measures a surface of a measurement object facing a narrow space formed in the measurement object. Each of FIGS. 39(a) and 39(b) is a cross-sectional view showing an example of a measuring head that can be attached to the spindle. Each of FIGS. 40(a) and 40(b) is a cross-sectional view showing an example of a measuring head that can be attached to the spindle. 41(a) and 41(b) are cross-sectional views showing an example of a measuring head that can be attached to the spindle. Each of FIGS. 42(a) and 42(b) is a cross-sectional view showing an example of a measuring head that can be attached to the spindle. Each of FIGS. 43(a) and 43(b) is a cross-sectional view showing an example of a measuring head that can be attached to the spindle. 44(a) and 44(b) are cross-sectional views showing an example of a measuring head that can be attached to the spindle. Each of FIGS. 45(a) and 45(b) is a cross-sectional view showing an example of a measuring head that can be attached to the spindle. FIG. 46 is a perspective view showing a work. FIG. 47 is a plan view showing an example of a work composed of members made of different materials. FIG. 48 is a plan view showing the scanning area moving on the surface of the object to be measured. FIG. 49 is a plan view showing a scan area divided into an upstream scan area and a downstream scan area. FIG. 50 is a cross-sectional view showing the stage 41 on which the reference member is formed. FIG. 51 schematically shows a measurement model and a target model each including a model portion corresponding to a reference member. FIG. 52 is a cross-sectional view that schematically shows a machine tool that includes a temperature sensor and a temperature effect reduction device. FIG. 53 is a cross-sectional view that schematically shows a machine tool that includes a vibration sensor and a vibration effect reduction device. is a cross-sectional view showing a stage 41 on which is formed.

Hereinafter, embodiments of machine tools, optical systems, and measuring devices will be described with reference to the drawings. Embodiments of a machine tool, an optical system, and a measuring device will be described below using a machine tool 1 capable of processing a work W, which is an example of an object.

In the following description, the positional relationship of various components constituting the machine tool 1 will be described using an XYZ orthogonal coordinate system defined by mutually orthogonal X-, Y-, and Z-axes. In the following description, for convenience of explanation, each of the X-axis direction and the Y-axis direction is the horizontal direction (that is, a predetermined direction in the horizontal plane), and the Z-axis direction is the vertical direction (that is, the direction perpendicular to the horizontal plane). The description will proceed using an example in which the vertical direction is substantially vertical). Further, the directions of rotation (in other words, tilt directions) about the X-, Y-, and Z-axes may be referred to as the .theta.X direction, the .theta.Y direction, and the .theta.Z direction, respectively.

(1) Machine tool 1a of the first embodiment
First, the machine tool 1 of the first embodiment will be described. In addition, below, the machine tool 1 of 1st Embodiment is called "machine tool 1a."

(1-1) Overall Structure of Machine Tool 1 First, the structure of the machine tool 1a of the first embodiment will be described with reference to FIGS. 1 and 2. FIG. FIG. 1 is a perspective view showing the appearance of a machine tool 1a according to the first embodiment. FIG. 2 is a system configuration diagram showing an example of the system configuration of the machine tool 1a of the first embodiment.

As shown in FIGS. 1 and 2, the machine tool 1a includes a machining head 2, a head drive system 3, a stage device 4, a measuring device 5, a tool changer 6, and a control device 7. . In order to make the drawing easier to see, illustration of the tool changer 6 and the control device 7 is omitted in FIG.

The processing head 2 is a processing device for processing the workpiece W. The machining head 2 has a spindle 21 and a head housing 22 . The processing head 2 will be described below with reference to FIGS. 3 and 4 in addition to FIGS. 3 and 4 are cross-sectional views showing the structure of the processing head 2. FIG.

As shown in FIGS. 1 and 3 to 4, the main shaft 21 is a member rotatable around the rotation axis RX. In this case, the main shaft 21 may be, for example, a member extending along the rotation axis RX (that is, a member having a longitudinal shape). Incidentally, in the example shown in FIG. 1, the rotation axis RX of the main shaft 21 is parallel to the Z-axis. However, the main shaft 21 may rotate around a rotation axis RX that intersects the Z-axis (for example, orthogonal to the Z-axis or inclined with respect to the Z-axis).

A tool 23 for machining the workpiece W (that is, a machining tool) can be attached to the spindle 21, as shown in FIG. Specifically, as shown in FIGS. 3 and 4, the spindle 21 has a mounting portion 211 for mounting the tool 23 thereon. The tool 23 is attached to the spindle 21 via the attachment portion 211 . The tool 23 attached to the attachment portion 211 is removable from the attachment portion 211 . That is, the tool 23 is detachably attached to the spindle 21 .

It should be noted that the state "the first object is attached to the second object" in the embodiment means "the first object is directly attached to the second object (that is, the first object and the second object are The first object is attached to the second object so that the objects are in contact with each other) and the first object is indirectly attached to the second object (that is, the first object and the first object are attached to the second object). the first object is attached to the second object without the two objects coming into contact with each other)”. The condition ``the first object is indirectly attached to the second object'' is defined as ``the first object is attached to the second object through a third object that is different from the first and second objects. It may include the state "attached".

In the example shown in FIGS. 3 and 4, the spindle 21 has a hole 212 (for example, a tapered hole) in which the tool 23 is fitted (or inserted) at the tip of the spindle 21 (specifically, the tip on the workpiece W side). It has a mounting portion 211 formed with a hole). In this case, the tool 23 is attached to the spindle 21 by fitting (or inserting) the shank 231 of the tool 23 having a shape complementary to the hole 212 into the hole 212 of the attachment portion 211 . The attachment portion 211 may hold the tool 23 attached to the attachment portion 211 . In this case, the mounting portion 211 may include at least one of a mechanical chuck, an electrostatic chuck, a vacuum chuck, and the like to hold the tool 23 .

When the spindle 21 rotates while the tool 23 is attached to the spindle 21, the tool 23 also rotates around the rotation axis RX. As a result, the rotating tool 23 comes into contact with the work W, so that the work W is machined. Thus, the machine tool 1a (particularly, the machining head 2) can machine the workpiece W using the tool 23. FIG.

The head housing 22 is a housing that accommodates the spindle 21 . The head housing 22 may accommodate the main shaft 21 in a housing space formed inside the head housing 22 . The main shaft 21 housed in the head housing 22 may be supported by the head housing 22 via bearing members (for example, bearings) not shown.

　In FIGS. 1 and 2 again, the head drive system 3 moves the processing head 2. As shown in FIG. The head drive system 3 may move the processing head 2 along at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction, for example. For example, the head drive system 3 moves the processing head 2 along at least one of the θX direction, θY direction and θZ direction in addition to or instead of at least one of the X-axis direction, Y-axis direction and Z-axis direction. can be moved. That is, the head drive system 3 moves the machining head 2 along at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction. , the rotation axis along the Y-axis direction and the rotation axis along the Z-axis direction. Note that the operation of moving the processing head 2 along at least one of the θX direction, the θY direction, and the θZ direction may be considered equivalent to the operation of changing the attitude of the processing head 2 .

In the example shown in FIG. 1, the head drive system 3 moves the processing head 2 along each of the X-axis direction and the Z-axis direction. In this case, the head drive system 3 is attached to (or , formed) and extending along the X-axis direction, an X-slider member 33 attached to the X-guide member 32 and movable along the X-guide member 32, and for moving the X-slider member 33 , a Z guide member 35 attached (or formed) to the X slider member 33 and extending along the Z axis direction, and a Z guide member 35 attached to the Z guide member 35 and extending along the Z axis direction. and a servo motor 36 that generates a driving force for moving the Z slider member (not shown in FIG. 1). The processing head 2 (in particular, the head housing 22) may be attached to the Z slider member. As a result, the processing head 2 moves in the X-axis direction along with the movement of the X-slider member 33, and moves in the Z-axis direction along with the movement of the Z-slider member.

When the head drive system 3 moves the processing head 2, the relative positional relationship between the processing head 2 and a stage 41 (furthermore, the work W placed on the stage 41) changes. Therefore, the head drive system 3 may function as a position changing device capable of changing the relative positional relationship between the processing head 2 and the stage 41 and the work W, respectively.

The stage device 4 includes a bed 40 , a stage 41 and a stage drive system 42 . The stage 41 and stage drive system 42 are supported by the bed 40 .

A workpiece W is placed on the stage 41 . The stage 41 can support the work W placed on the stage 41 . The stage 41 may be capable of holding the work W placed on the stage 41 . In this case, the stage 41 may have at least one of a mechanical chuck, an electrostatic chuck, a vacuum chuck, and the like to hold the work W.

The stage 41 is arranged at a position where it can face the machining head 2 (especially the spindle 21). In the example shown in FIG. 1, the stage 41 is arranged below the machining head 2 (in particular, the spindle 21). However, the stage 41 may be arranged at a position different from the position below the machining head 2 (in particular, the spindle 21).

The stage drive system 42 moves the stage 41 . The stage drive system 42 may move the stage 41 along at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction, for example. For example, the stage drive system 42 moves the stage 41 along at least one of the θX direction, θY direction and θZ direction in addition to or instead of at least one of the X-axis direction, Y-axis direction and Z-axis direction. You can move it. That is, the stage drive system 42 moves the stage 41 along at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction. The stage 41 may be rotated around at least one of the rotation axis along the Y-axis direction and the rotation axis along the Z-axis direction. Note that the operation of moving the stage 41 along at least one of the θX direction, the θY direction, and the θZ direction may be considered equivalent to the operation of changing the attitude of the stage 41 .

In the example shown in FIG. 1, the stage drive system 42 moves the stage 41 along each of the Y-axis direction, the θX direction, and the θZ direction. In this case, the stage drive system 42 includes, for example, a Y guide member 421 attached (or formed) to the bed 40 and extending along the Y-axis direction, and a Y guide member 421 attached to the Y guide member 421 and extending along the Y guide member 421. a trunnion (Y slider member) 422 that is movable by means of a trunnion 422; a servomotor 423 that generates a driving force for moving the trunnion 422; a cradle 424 rotatable about (which may be referred to as an axis) and a servomotor (not shown) that provides a driving force to rotate the cradle 424 . The stage 41 is mounted on the cradle 424 so as to be rotatable around a rotation axis (which may be referred to as a C axis) along the Z axis with respect to the cradle 424 using a driving force generated by a servomotor (not shown). 424 may be attached. As a result, the stage 41 moves in the Y-axis direction along with the movement of the trunnion 422, rotates around the X-axis along with the rotation of the cradle 424, and rotates around the Z-axis.

When the stage drive system 42 moves the stage 41, the relative positional relationship between the processing head 2 and the stage 41 (furthermore, the workpiece W placed on the stage 41) changes. Therefore, the stage drive system 42 may function as a position changing device capable of changing the relative positional relationship between the processing head 2 and the stage 41 and the work W, respectively.

The measurement device 5 can measure the measurement object. For example, the measurement device 5 may be capable of measuring the properties of the measurement object. The characteristics of the object to be measured include, for example, the position of the object to be measured, the shape of the object to be measured, the distance between the measuring device 5 and the object to be measured, the reflectance of the object to be measured, the transmittance of the object to be measured, and the object to be measured. At least one of the temperature of the object and the surface roughness of the object to be measured may be included. In the following description, an example in which the measuring device 5 measures the shape of the object to be measured will be used. The shape of the measurement object may include the shape of the surface of the measurement object. The shape of the surface of the object to be measured may include the shape of at least part of the surface of the object to be measured.

The object to be measured may include, for example, the work W to be processed by the processing head 2. The object to be measured may include any object placed on the stage 41, for example. Any object placed on the stage 41 may include the work W, for example. Any object placed on the stage 41 may include a reference member. The reference member may include, for example, at least one of a coordinate reference member 411, a running error correction member 91, and a reference member 413, which will be described later. The measurement object may include the stage 41, for example.

The measuring device 5 may be capable of measuring the object to be measured without contact. The measurement device 5 may be capable of optically measuring the measurement object. The measuring device 5 may be capable of electrically measuring the object to be measured. The measurement device 5 may be capable of magnetically measuring the measurement object. The measuring device 5 may be capable of thermally measuring the object to be measured. The measurement device 5 may be capable of measuring the measurement object using a probe that physically contacts the measurement object.

In the following description, an example in which the measurement device 5 can optically measure the measurement object will be used. Specifically, the measurement device 5 irradiates the measurement light ML (see FIG. 6 and the like, which will be described later) to the measurement target, and the light from the measurement target irradiated with the measurement light ML (hereinafter referred to as “return light RL", see FIG. 6) to measure the object to be measured.

In the first embodiment, the measurement device 5 includes, for example, a measurement light source 51, a measurement head 52, a measurement head 53, and an output interface 54 in order to optically measure the measurement object. The structure and operation of the measuring device 5 will be described in detail later, but the outline thereof will be briefly described here. The measurement light source 51 can generate measurement light ML. The measuring head 52 is attached to the machining head 2 . The measuring head 52 is attached to a portion of the machining head 2 different from the main shaft 21 . In other words, the measuring head 52 is not attached to the spindle 21 . A measuring head 53 is also attached to the machining head 2 . However, the measuring head 53 is different from the measuring head 52 which is not attached to the spindle 21 of the machining head 2 in that it is attached to the spindle 21 of the machining head 2 . Although FIG. 1 does not show the measuring head 53 attached to the main shaft 21 for the sake of simplification of the drawing, the measuring head 53 attached to the main shaft 21 does not show the structure of the measuring device 5 and the It is illustrated in FIG. 5 and the like for detailed description of the operation later. The measuring device 5 irradiates the measuring object with the measuring light ML via the measuring heads 52 and 53 . Furthermore, the measurement device 5 detects the return light RL from the measurement object irradiated with the measurement light ML via the measurement heads 52 and 53 . The output interface 54 can output the measurement result of the measurement device 5 (that is, the detection result of the return light RL from the object to be measured) to the control device 7 .

The tool changer 6 is a device that can change the tool 23 attached to the spindle 21 . For example, the tool changer 6 may take out one tool 23 to be attached to the main shaft 21 from a tool magazine (not shown) containing a plurality of tools 23 and attach the taken out one tool 23 to the main shaft 21 . That is, the tool changer 6 may function as a mounting device capable of mounting the tool 23 on the spindle 21 . The tool changer 6 may remove the tool 23 attached to the spindle 21 from the spindle 21 and store the removed tool 23 in a tool magazine (not shown). That is, the tool changer 6 may function as a removal device capable of removing the tool 23 from the spindle 21 . An automatic tool changer (ATC) used in a machining center or the like may be used as the tool changer 6 .

In the first embodiment, as described above, the spindle 21 can be attached with the measuring head 53 included in the measuring device 5 in addition to the tool 23 . Therefore, the tool changer 6 may function as a mounting device capable of mounting the measuring head 53 on the spindle 21 . That is, the tool changer 6 includes a tool magazine (not shown) in which the measuring head 53 is accommodated in addition to the tool 23 (or a tool magazine (not shown) in which the measuring head 53 is accommodated, which is different from the tool magazine in which the tool 23 is accommodated. Alternatively, the measuring head 53 may be taken out from the head magazine) and attached to the spindle 21 . Moreover, the tool changer 6 may function as a removal device capable of removing the measuring head 53 from the spindle 21 . That is, the tool changer 6 may remove the measuring head 53 attached to the spindle 21 from the spindle 21 and store the removed measuring head 53 in a tool magazine (not shown) or a head magazine (not shown).

The control device 7 controls the operation of the machine tool 1a. For example, the control device 7 may control the operation of the machining head 2 provided in the machine tool 1a (for example, rotation of the spindle 21). For example, the control device 7 may control the operation of the head drive system 3 provided in the machine tool 1a (for example, movement of the machining head 2). For example, the control device 7 may control the operation of the stage drive system 42 provided in the machine tool 1a (for example, movement of the stage 41). For example, the control device 7 may control the operation of the tool changer 6 included in the machine tool 1a (that is, the change of the tool 23 attached to the spindle 21 and the measuring head 53).

The control device 7 may acquire the measurement result of the measuring device 5 from the output interface 54 of the measuring device 5 and control the operation of the machine tool 1a based on the acquired measurement result. For example, the control device 7 generates measurement data of the object to be measured (for example, data related to the shape of the object to be measured) based on the measurement result of the measuring device 5, and controls the machine tool 1a based on the generated measurement data. You can control the action.

The control device 7 may include, for example, an arithmetic device and a storage device. The computing device may include, for example, at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). A storage device may include, for example, memory. The control device 7 functions as a device that controls the operation of the machine tool 1a as the arithmetic device executes a computer program. This computer program is a computer program for causing the arithmetic device to perform (that is, to execute) an operation to be performed by the control device 7, which will be described later. That is, this computer program is a computer program for causing the control device 7 to function so as to cause the machine tool 1a to perform the operations described later. The computer program executed by the arithmetic device may be recorded in a storage device (that is, a recording medium) included in the control device 7, or may be stored in any storage device built in the control device 7 or external to the control device 7. It may be recorded on a medium (for example, hard disk or semiconductor memory). Alternatively, the computing device may download the computer program to be executed from a device external to the control device 7 via the network interface.

The control device 7 does not have to be provided inside the machine tool 1a. For example, the control device 7 may be provided as a server or the like outside the machine tool 1a. In this case, the controller 7 and the machine tool 1a may be connected via a wired and/or wireless network (or data bus and/or communication line). As a wired network, a network using a serial bus interface represented by at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485 and USB may be used. A network using a parallel bus interface may be used as the wired network. As a wired network, a network using an Ethernet (registered trademark)-compliant interface represented by at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T may be used. A network using radio waves may be used as the wireless network. An example of a network using radio waves is a network conforming to IEEE802.1x (for example, at least one of wireless LAN and Bluetooth (registered trademark)). A network using infrared rays may be used as the wireless network. A network using optical communication may be used as the wireless network. In this case, the controller 7 and the machine tool 1a may be configured to be able to transmit and receive various information via a network. Also, the control device 7 may be capable of transmitting information such as commands and control parameters to the machine tool 1a via a network. The machine tool 1a may include a receiving device that receives information such as commands and control parameters from the control device 7 via the network. The machine tool 1a may be equipped with a transmission device (that is, an output device that outputs information to the control device 7) that transmits information such as commands and control parameters to the control device 7 via the network. good. Alternatively, a first control device that performs part of the processing performed by the control device 7 is provided inside the machine tool 1a, while a second control device that performs another part of the processing performed by the control device 7 is provided inside the machine tool 1a. The control device may be provided outside the machine tool 1a.

Recording media for recording computer programs executed by the control device 7 include CD-ROMs, CD-Rs, CD-RWs, flexible disks, MOs, DVD-ROMs, DVD-RAMs, DVD-Rs, DVD+Rs, and DVDs. - At least one of optical discs such as RW, DVD+RW and Blu-ray (registered trademark), magnetic media such as magnetic tapes, magneto-optical discs, semiconductor memories such as USB memories, and other arbitrary media that can store programs may be The recording medium may include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is implemented in at least one form of software, firmware, etc., in an executable state). Furthermore, each process and function included in the computer program may be realized by a logical processing block realized in the control device 7 by the control device 7 (that is, computer) executing the computer program, It may be implemented by hardware such as a predetermined gate array (FPGA, ASIC) provided in the control device 7, or a mixture of logical processing blocks and partial hardware modules that implement some elements of hardware. It can be implemented in the form of

(1-2) Structure of Measuring Device 5 Next, the structure of the measuring device 5 will be described in more detail with reference to FIG. FIG. 5 is a cross-sectional view showing the processing head 2 to which the measuring device 5 (in particular, measuring heads 52 and 53) is attached.

As shown in FIG. 5, the measuring head 52 is attached to the processing head 2. Specifically, the measurement head 52 includes a head housing 521 and the head housing 521 is attached to the processing head 2 . In the example shown in FIG. 5 , the head housing 521 is attached to the head housing 22 of the processing head 2 . The head housing 521 may be attached to the machining head 2 at a position separated from the rotation axis RX of the main shaft 21 along the direction intersecting the rotation axis RX. In the example shown in FIG. 5 , the head housing 521 is attached to the side surface of the head housing 22 . However, the mounting position of the head housing 521 (that is, the mounting position of the measurement head 52) is not limited to the position shown in FIG.

A measuring head 53 is also attached to the processing head 2 . Specifically, the measurement head 53 includes a head housing 531 and the head housing 531 is attached to the processing head 2 . In particular, the head housing 531 is attached to the spindle 21 of the machining head 2 . Specifically, the head housing 531 is attached to the attachment portion 211 provided on the main shaft 21 . In the example shown in FIG. 5, since the main shaft 21 is provided with the mounting portion 211 in which the hole 212 is formed, the shank 530 corresponding to the projecting portion of the head housing 531 having a shape complementary to the hole 212 is the mounting portion. The head housing 531 is attached to the main shaft 21 by being fitted (or inserted) into the hole 212 of 211 . The mounting portion 211 may hold the head housing 531 . In this case, the mounting portion 211 may include at least one of a mechanical chuck, an electrostatic chuck, a vacuum chuck, and the like to hold the head housing 531 .

The head housing 531 (that is, the measurement head 53) attached to the attachment portion 211 is removable from the attachment portion 211. That is, the head housing 531 (that is, the measurement head 53) is detachably attached to the spindle 21. As shown in FIG. For example, if the measuring head 53 is attached to the spindle 21 , the tool 23 is removed from the spindle 21 . On the other hand, when the tool 23 is attached to the spindle 21 , the measuring head 53 is removed from the spindle 21 . As described above, attachment and detachment of the head housing 531 and attachment and detachment of the tool 23 are performed by the tool changer 6 . However, the operator of the machine tool 1 a may manually perform at least one of attaching and detaching the measuring head 53 to and from the spindle 21 and attaching and detaching the tool 23 to and from the spindle 21 .

On the other hand, the head housing 521 (that is, the measurement head 52) attached to the processing head 2 does not have to be removable from the processing head 2. That is, the measurement head 52 does not have to be detachably attached to the processing head 2 . The measuring head 52 may remain attached to the machining head 2 even during the machining period in which the machining head 2 processes the workpiece W using the tool 23 . However, the measurement head 52 may be detachably attached to the processing head 2 .

The measuring head 52 may be attached at a fixed position with respect to the processing head 2 . That is, the measuring head 52 may be attached to the processing head 2 so that the positional relationship between the processing head 2 and the measuring head 52 is fixed (that is, does not change). The head housing 521 (that is, the measurement head 52) may be fixed and attached directly to the head housing 22 (that is, the processing head 2). The head housing 521 may be indirectly fixedly attached to the head housing 22 . For example, the head housing 521 may be fixed to the other of the support members, one of which is directly fixed to the head housing 22 . The head housing 521 (that is, the measurement head 52) is attached at a fixed position with respect to the processing head 2, whether directly or indirectly fixed to the head housing 22. It can be said. When the measuring head 52 is attached to the processing head 2, unless the measuring device 5 has a drive system for moving the measuring head 52 independently of the processing head 2, the processing head is normally 2 and the measuring head 52 are fixed.

However, the measuring head 52 does not have to be attached at a position where the positional relationship with the processing head 2 is fixed. The positional relationship between the processing head 2 and the measuring head 52 may be variable. The measuring device 5 may have a drive system for moving the measuring head 52 independently of the processing head 2 . For example, this drive system may be configured to relatively move the processing head 2 and the measurement head 52 along the rotation axis RX. For example, the measuring head 52 may interfere with the machining of the workpiece W during the machining period in which the machining head 2 is machining the workpiece W with the tool 23 . Specifically, for example, if the measuring head 52 contacts the work W (or another object) before the tool 23 contacts the work W, the tool 23 cannot contact the work W, resulting in , the measuring head 52 interferes with the machining of the workpiece W. Therefore, the positional relationship between the machining head 2 and the measuring head 52 during at least part of the measurement period during which the measuring device 5 measures the object to be measured, and the machining head during at least part of the machining period during which the machining head 2 processes the workpiece W 2 and the measuring head 52 may be different. For example, during at least part of the machining period, the positional relationship between the machining head 2 and the measuring head 52 is set to the first relationship in which the measuring head 52 does not interfere with the machining of the workpiece W, and at least part of the measuring period. , the positional relationship between the processing head 2 and the measurement head 52 is a second relationship different from the first relationship (for example, a second relationship in which the measurement device 5 can measure the measurement object using the measurement head 52). 2 relationship).

When the measuring heads 52 and 53 are attached to the processing head 2, each of the measuring heads 52 and 53 also moves as the processing head 2 moves. That is, each of the measuring heads 52 and 53 moves like the processing head 2 . Therefore, the head drive system 3 that moves the processing head 2 may be regarded as functioning as a head drive system that moves the measurement heads 52 and 53, respectively. Furthermore, when the measurement head 53 is attached to the main shaft 21, the measurement head 53 may also rotate around the rotation axis RX as the main shaft 21 rotates.

The measurement head 52 further includes an optical system 522. The optical system 522 is housed in a housing space inside the head housing 521 . Therefore, the optical system 522 is attached to the processing head 2 via the head housing 521 . When the optical system 522 is accommodated in the head housing 521 in this manner, unwanted substances (eg, cutting waste, cutting fluid, etc.) generated by machining the workpiece W are prevented from adhering to the optical system 522 .

The measurement head 53 further includes an optical system 532. The optical system 532 is housed in a housing space inside the head housing 531 . Therefore, the optical system 532 is attached to the processing head 2 via the head housing 531 . In particular, the optical system 532 is detachably attached to the spindle 21 of the machining head 2 via the head housing 531 . When the optical system 532 is accommodated in the head housing 531 in this manner, unnecessary substances (eg, cutting waste, cutting fluid, etc.) generated by machining the workpiece W are prevented from adhering to the optical system 532 .

The

optical systems

522 and 532 are used to irradiate the measurement object with the measurement light ML from the measurement light source 51 . Further,

optical systems

522 and 532 are used to detect return light RL from the measurement object. The structure of the optical systems 522 and 523 will be further described below with reference to FIG. FIG. 6 is a cross-sectional view showing the structures of the

optical systems

522 and 532 together with the optical paths of the measurement light ML and the return light RL.

As shown in FIG. 6, the measurement light ML generated by the measurement light source 51 enters the optical system 522 from the measurement light source 51 via an optical transmission member (not shown) such as an optical fiber. That is, the optical system 522 receives (receives) the measurement light ML from the measurement light source 51 . The measurement light ML that has entered the optical system 522 passes through the optical system 522 . The measurement light ML that has passed through the optical system 522 is emitted from the optical system 522 toward the optical system 532 . That is, the optical system 522 passes the measurement light ML that has entered the optical system 522 and emits the measurement light ML toward the optical system 532 . The measurement light source 51 may be provided outside the measurement head 52, and the measurement light ML from the measurement light source 51 may enter the optical system 522 via an optical transmission member (not shown). Also, the measurement light source 51 may be provided inside the measurement head 52 .

Since the optical system 522 is accommodated in the head housing 521, the head housing 521 is formed with an opening 5211 through which the measurement light ML emitted from the optical system 522 toward the optical system 532 can pass. good. However, if unnecessary substances generated by processing the workpiece W enter the accommodation space inside the head housing 521 through the opening 5211 , the unnecessary substances may adhere to the optical system 522 . Therefore, the head housing 521 may include a lid member 5212 capable of at least partially covering (that is, closing) the opening 5211 . The opening 5211 is at least part of the period during which the measurement light ML is emitted from the optical system 522 (that is, the measurement period during which the measurement device 5 measures the object to be measured, and the measurement head 53 is attached to the spindle 21). The part may not be closed by the lid member 5212 . The opening 5211 may be closed by the lid member 5212 during at least a part of the machining period when the machine tool 1 machines the workpiece W (that is, the period during which the tool 23 is attached to the spindle 21). Note that the lid member 5212 may be a light transmitting member having transparency to the measurement light ML and the return light RL. For example, the lid member 5212 may be a glass member or another member. If the lid member 5212 is a light-transmitting member that transmits the measurement light ML and the return light RL, the opening 5211 may be closed with the lid member 5212 at all times. The lid member 5212 includes a light-transmitting member as a first lid member that always closes the opening 5211 and an opening 5211 (first lid member) that prevents unnecessary substances from adhering to the first lid member (light-transmitting member). member) that can be opened and closed.

The measurement light ML emitted from the optical system 522 toward the optical system 532 enters the optical system 532 . That is, the optical system 532 receives (receives) the measurement light ML emitted from the optical system 522 . The measurement light ML that has entered the optical system 532 passes through the optical system 532 . The measurement light ML that has passed through the optical system 532 is emitted from the optical system 532 toward the object to be measured. That is, the optical system 532 allows the measurement light ML that has entered the optical system 532 to pass therethrough, and emits the measurement light ML toward the object to be measured.

Since the optical system 532 is accommodated in the head housing 531, the head housing 531 has an aperture 5311 through which the measurement light ML that enters the optical system 532 from the optical system 522 can pass, and an opening 5311 that passes through the optical system 532 to the measurement object. An aperture 5312 may be formed through which the measurement light ML that is emitted toward the aperture 5312 can pass. As described above, the measuring head 53 is not attached to the spindle 21 during the machining period when the machine tool 1 is machining the workpiece W because the tool 23 is attached to the spindle 21 . Therefore, there is a low possibility that unnecessary substances (for example, cutting waste, cutting fluid, etc.) generated by machining the workpiece W enter the internal space of the head housing 531 through at least one of the

openings

5311 and 5312 . Therefore, the head housing 531 may not include a lid member capable of at least partially covering the opening 5311 and a lid member capable of at least partially covering the opening 5312 . However, the head housing 531 may include at least one of a lid member capable of at least partially covering the opening 5311 and a lid member capable of at least partially covering the opening 5312 . Note that the head housing 531 may have a lid member that covers at least part of the opening 5311 . The lid member may be a light transmitting member that is transparent to the measurement light ML and the return light RL. For example, the lid member may be a glass member or another member. When the lid member is a light-transmitting member, the opening 5311 may always be covered with the lid member. The lid member consists of a light-transmitting member as a first lid member that always closes the opening 5311 and an opening 5311 (first lid member) that prevents unnecessary substances from adhering to the first lid member. A second lid member that can be opened and closed may be included.

When the measurement light ML irradiates the measurement target (workpiece W in the example shown in FIG. 6), the measurement target emits light caused by the irradiation of the measurement light ML. The light generated due to the irradiation of the measurement light ML may include reflected light of the measurement light ML with which the object to be measured is irradiated. The light generated due to the irradiation of the measurement light ML may include scattered light of the measurement light ML irradiated to the measurement object. The light generated as a result of the irradiation of the measurement light ML may include transmitted light of the measurement light ML with which the object to be measured is irradiated. The light generated due to the irradiation of the measurement light ML may include the diffracted light of the measurement light ML with which the object to be measured is irradiated.

At least part of the light generated due to the irradiation of the measurement light ML enters the optical system 532 via the aperture 5312 as the return light RL from the measurement object. That is, the optical system 532 receives (receives) the return light RL from the object to be measured. The return light RL that has entered the optical system 532 passes through the optical system 532 and is emitted from the optical system 532 toward the optical system 522 through an aperture 5311 . In other words, the optical system 532 allows the return light RL incident on the optical system 532 to pass therethrough and emits the return light RL toward the optical system 522 .

The return light RL emitted from the optical system 532 toward the optical system 522 enters the optical system 522 through the aperture 5211 . That is, the optical system 522 receives (receives) the return light RL emitted from the optical system 532 . The return light RL that has entered the optical system 522 passes through the optical system 522 . The return light RL that has passed through the optical system 522 is emitted from the optical system 522 toward the detection element 5232 (see FIG. 7 described later). That is, the optical system 522 allows the return light RL incident on the optical system 522 to pass therethrough, and emits the return light RL toward the detection element 5232 .

The optical system 522 includes an optical system 5221 , a galvanomirror 5222 and a mirror 5223 to emit the measurement light ML to the optical system 532 and receive the return light RL from the optical system 532 . The optical system 522 includes a mirror 5321 and an fθ lens 5322 in order to emit the measurement light ML toward the measurement object, receive the return light RL from the measurement object, and emit the return light RL toward the optical system 532 . and The measurement device 5 may include a relay optical system that optically conjugates the galvanomirror 5222 and the entrance pupil of the fθ lens 5322 . The relay optical system may have multiple optical members. Some of the multiple optical members may be included in the optical system 522 . Other parts of the plurality of optical members may be included in the optical system 532 . For example, some of the plurality of optical members may be arranged in the optical path of the return light RL from the mirror 5321 to the mirror 5223 and provided inside the measurement head 52 (may be included in the optical system 522). ). Another part of the plurality of optical members may be arranged on the optical path of the return light RL from the mirror 5321 to the mirror 5223 and provided inside the measurement head 53 (may be included in the optical system 532). ).
Further, the optical system 5221 includes a beam splitter 52211, a beam splitter 52212, a beam splitter 52213, and a mirror 52214, as shown in FIG. 7, which is a cross-sectional view showing the structure of the optical system 5221. The

optical systems

522 and 532 will be described in more detail below with reference to FIG. 7 in addition to FIG.

As shown in FIG. 7, the measurement light ML from the measurement light source 51 is incident on the beam splitter 52211. In the first embodiment, two measurement light beams ML respectively generated by the two measurement light sources 51 (specifically, the measurement light sources 51 # 1 and 51 # 2 ) enter the beam splitter 52211 . Therefore, the measurement device 5 includes a measurement light source 51#1 and a measurement light source 51#2. The two measurement light sources 51 may each emit two measurement light beams ML that are phase-synchronized with each other and have coherence. However, the measurement device 5 may have a single measurement light source 51 .

The two measurement light sources 51 have different oscillation frequencies. Therefore, the two measurement light beams ML emitted by the two measurement light sources 51 are two measurement light beams ML having different frequencies. When the measurement light source 51 generates pulsed light as the measurement light ML, the two measurement light beams ML emitted by the two measurement light sources 51 have a pulse frequency (for example, the number of pulsed light beams per unit time, and a pulse The two measurement lights ML differ in the reciprocal of the light emission period). As an example, the measurement light source 51#1 may emit measurement light ML with a pulse frequency of 25 GHz, and the measurement light source 51#2 may emit measurement light ML with a pulse frequency of 25 GHz+α (eg, +100 kHz). . In the following description, the measurement light ML generated by the measurement light source 51#1 is referred to as "measurement light ML#1", and the measurement light ML generated by the measurement light source 51#2 is referred to as "measurement light ML#2". called. However, the two measurement light sources 51 may have the same oscillation frequency.

The measurement light source 51 includes an optical comb light source. The optical comb light source is a light source capable of generating light containing frequency components arranged at equal intervals on the frequency axis (hereinafter referred to as "optical frequency comb") as pulsed light. In this case, the measurement light source 51 emits, as the measurement light ML, pulsed light containing frequency components arranged at equal intervals on the frequency axis. However, the measurement light source 51 may include a light source different from the optical comb light source.

The two measurement beams ML#1 and ML#2 that have entered the beam splitter 52211 are emitted toward the beam splitter 52212. That is, the beam splitter 52211 emits the measurement light beams ML2#1 and ML#2, which are incident on the beam splitter 52211 from different directions, in the same direction (that is, the direction in which the beam splitter 52212 is arranged).

The beam splitter 52212 emits the measurement light ML#1-1, which is part of the measurement light ML#1 incident on the beam splitter 52212, toward the detection element 5231 provided in the measurement device 5. The detection element 5231 may be housed in the head housing 521 . The detection element 5231 may be included in the optical system 5221 . The beam splitter 52212 emits, toward the beam splitter 52213, measurement light ML#1-2, which is another part of the measurement light ML#1 incident on the beam splitter 52212. FIG. The beam splitter 52212 emits the measurement light ML#2-1, which is part of the measurement light ML2#2 incident on the beam splitter 52212, toward the detection element 5231. FIG. The beam splitter 52212 emits, toward the beam splitter 52213, the measurement light ML#2-2, which is another part of the measurement light ML#2 incident on the beam splitter 52212.

The measurement light beams ML#1-1 and ML#2-1 emitted from the beam splitter 52212 enter the detection element 5231. The detection element 5231 detects the measurement light ML#1-1 and the measurement light ML#2-1. In particular, the detection element 5231 detects interference light generated by interference between the measurement light ML#1-1 and the measurement light ML#2-1. Therefore, the beam splitter 52212 that emits the measurement light beams ML#1-1 and ML#2-1 toward the detection element 5231 functions as an interference optical system that interferes the measurement light beams ML#1-1 and ML#2-1. You can assume it works. Specifically, the detection element 5231 detects the interference light by receiving the interference light. Therefore, the detection element 5231 may include a light receiving element (for example, a photoelectric conversion element) capable of receiving light. The detection result of the detection element 5231 is output to the control device 7 via the output interface 54 as part of the measurement result of the measurement device 5 .

Since the optical system 5221 is used for detecting the measurement light beams ML#1-1 and ML#2-1, the optical system 5221 may be called a detection side optical system. Also, the detection-side optical system and the detection element 5231 may constitute one optical system (which may be referred to as a measurement optical system).

The measurement light beams ML#1-2 and ML#2-2 emitted from the beam splitter 52212 enter the beam splitter 52213. The beam splitter 52213 directs at least a part of the measurement light ML#1-2 incident on the beam splitter 52213 to the mirror 52214 and emits it. The beam splitter 52213 directs at least part of the measurement light ML#2-2 incident on the beam splitter 52213 toward the galvanomirror 5222 .

The measurement light ML#1-2 emitted from the beam splitter 52213 is incident on the mirror 52214. The measurement light beams ML#1-2 that have entered the mirror 52214 are reflected by the reflecting surface of the mirror 52214 (the reflecting surface may also be referred to as a reference surface). Specifically, the mirror 52214 reflects the measurement light ML#1-2 incident on the mirror 52214 toward the beam splitter 52213 . That is, the mirror 52214 emits the measurement light ML#1-2 incident on the mirror 52214 toward the beam splitter 52213 as the measurement light ML#1-3 which is the reflected light. In this case, the measurement beams ML#1-3 may be referred to as reference beams. The measurement light beams ML#1-3 emitted from the mirror 52214 enter the beam splitter 52213. As shown in FIG. The beam splitter 52213 emits the measurement light beams ML#1-3 incident on the beam splitter 52213 toward the beam splitter 52212. FIG. The measurement light beams ML#1-3 emitted from the beam splitter 52213 enter the beam splitter 52212. As shown in FIG. The beam splitter 52212 emits the measurement light beams ML#1-3 incident on the beam splitter 52212 toward the detection element 5232 provided in the measurement device 5. FIG. The detection element 5232 may be housed in the head housing 521 . The detection element 5232 may be included in the optical system 5221 .

On the other hand, the measurement light ML#2-2 emitted from the beam splitter 52213 toward the galvanomirror 5222 enters the galvanomirror 5222. Galvanometer mirror 5222 adjusts measurement light ML#2-2 emitted from galvanometer mirror 5222 so that the irradiation position of measurement light ML (measurement light ML#2-2 in this case) on the object to be measured changes. change direction. Therefore, the galvanomirror 5222 may be called a traveling direction changing member. The galvanomirror 5222 may include an X scanning mirror 52221 and a Y scanning mirror 52222 . Each of the X scanning mirror 52221 and the Y scanning mirror 52222 is a variable tilt angle mirror whose angle relative to the optical path of the measurement light ML#2-2 incident on the galvanomirror 5222 can be changed. The X scanning mirror 52221 changes the traveling direction of the measurement light ML#2-2 so that the irradiation position of the measurement light ML#2-2 on the measurement object changes along the X-axis direction. The Y scanning mirror 52222 changes the traveling direction of the measurement light ML#2-2 so that the irradiation position of the measurement light ML#2-2 on the measurement object changes along the Y-axis direction.

Since the galvanomirror 5222 can change the irradiation position of the measurement light ML#2-2 on the object to be measured in this way, the measurement apparatus 5 can irradiate the measurement light ML#2-2 on a plurality of parts of the object to be measured. 2 can be irradiated in order. As a result, the measuring device 5 can measure a plurality of parts of the object to be measured at relatively high speed. That is, the measuring device 5 can perform multi-point measurement of the object to be measured.

The galvanomirror 5222 changes the traveling direction of the measurement light ML#2-2 so that the scan area SA that can be irradiated with the measurement light ML#2-2 on the surface of the measurement object has a desired shape. The traveling direction of the measurement light ML#2-2 may be changed so that For example, each of FIGS. 8A to 8C shows an example of the shape of the scan area SA. For example, as shown in FIG. 8A, the galvanomirror 5222 may change the traveling direction of the measurement light ML#2-2 so that the scan area SA has a rectangular shape. For example, as shown in FIG. 8B, the galvanomirror 5222 may change the traveling direction of the measurement light ML#2-2 so that the scan area SA has a slit shape. For example, as shown in FIG. 8C, the galvanomirror 5222 may change the traveling direction of the measurement light ML#2-2 so that the shape of the scan area SA becomes an annular shape.

The measurement light ML#2-2 emitted from the galvanomirror 5222 is incident on the mirror 5223 as shown in FIG. The mirror 5223 reflects the measurement light ML# 2 - 2 incident on the mirror 5223 toward the optical system 532 . That is, the mirror 5223 is an optical member capable of deflecting the measurement light ML#2-2 so that the measurement light ML#2-2 entering the mirror 5223 enters the optical system 532. FIG. For this reason, mirror 5223 may be referred to as a deflection member. The reflecting surface on which the mirror 5223 reflects the measurement light ML#2-2 is typically flat, but may include curved surfaces.

As described above, the measuring head 52 including the mirror 5223 is attached to the processing head 2 at a position separated from the rotation axis RX of the main shaft 21 along the direction intersecting the rotation axis RX. Therefore, the measurement light ML#2-2 emitted from the optical system 522 toward the optical system 532 is also positioned away from the rotation axis RX of the main shaft 21 along the direction intersecting the rotation axis RX (that is, the rotation (position different from axis RX). On the other hand, a measurement head 53 having an optical system 532 on which the measurement light ML#2-2 emitted from the mirror 5223 is incident is attached to the main shaft 21. FIG. Therefore, the mirror 5223 directs the measurement light ML#2-2 so that the measurement light ML#2-2 emitted from a position different from the rotation axis RX enters the optical system 532 attached to the main shaft 21. can be deflected. Specifically, the mirror 5223 adjusts the travel direction of the measurement light ML#2-2 emitted from the optical system 522 (that is, the travel direction of the measurement light ML#2-2 between the optical system 522 and the optical system 532). ) intersects the rotation axis RX or has a twisted relationship. In this case, the optical axis of the optical system 522 on the optical system 532 side (that is, a virtual ray representative of the light flux of the measurement light ML#2-2 emitted from the optical system 522 to the optical system 532) is the rotation axis. It may intersect RX or may be in a twisted relationship with the rotation axis RX. Similarly, the optical axis of the optical system 532 on the optical system 522 side (that is, a virtual ray representing the light beam of the measurement light ML#2-2 entering the optical system 532 from the optical system 522) is the rotation axis RX , or may be in a twisted relationship with the rotation axis RX.

The measurement light ML#2-2 reflected by the mirror 5223 enters the mirror 5321 of the optical system 532 via the aperture 5311. The mirror 5321 reflects the measurement light ML# 2 - 2 incident on the mirror 5321 toward the fθ lens 5322 . That is, the mirror 5321 is an optical member capable of deflecting the measurement light ML#2-2 so that the measurement light ML#2-2 entering the mirror 5321 enters the fθ lens 5322. FIG. For this reason, mirror 5321 may be referred to as a deflection member. The reflecting surface on which the mirror 5321 reflects the measurement light ML#2-2 is typically flat, but may include curved surfaces.

The traveling direction of the measurement light ML#2-2 incident on the mirror 5321 intersects with the rotation axis RX or has a twisted relationship. In this case, the mirror 5321 reflects the measurement light ML#2-2 so that the traveling direction of the measurement light ML#2-2 reflected by the mirror 5321 is coaxial with the rotation axis RX. The state in which "the traveling direction of the measurement light ML#2-2 is coaxial with the rotation axis RX" means the state in which the optical path of the principal ray of the measurement light ML#2-2 is positioned on the rotation axis RX. You may have However, the mirror 5321 may reflect the measurement light ML#2-2 so that the traveling direction of the measurement light ML#2-2 reflected by the mirror 5321 is parallel to the rotation axis RX. In the state where "the traveling direction of the measurement light ML#2-2 is parallel to the rotation axis RX", the optical path of the principal ray of the measurement light ML#2-2 is not positioned on the rotation axis RX, but the optical path is rotated. It may also mean the state of being "parallel to the axis RX". Alternatively, the mirror 5321 may reflect the measurement light ML#2-2 so that the traveling direction of the measurement light ML#2-2 reflected by the mirror 5321 intersects the rotation axis RX.

The measurement light ML#2-2 reflected by the mirror 5321 enters the fθ lens 5322. The fθ lens 5322 irradiates the measurement object with the measurement light ML#2-2 through the aperture 5312. FIG. The fθ lens 5322 may focus the measurement light ML#2-2 on the measurement object. For this reason, the fθ lens 5322 may be referred to as a condensing optical member.

The optical axis of the fθ lens 5322 is coaxial with the rotation axis RX of the main shaft 21 . In other words, the direction of the optical axis of the fθ lens 5322 is the direction extending along the rotation axis RX. In this case, the fθ lens 5322 emits the measurement light ML#2-2 so that the traveling direction of the measurement light ML#2-2 emitted from the fθ lens 5322 extends along the rotation axis RX. Since the measurement light ML#22 emitted from the fθ lens 5322 is emitted from the optical system 532, the optical axis of the fθ lens 5322 is the optical axis of the optical system 532 on the measurement object side (that is, the optical system 532 may be regarded as a virtual ray representative of the luminous flux of the measurement light ML#2-2 emitted toward the object to be measured. However, the optical axis of the fθ lens 5322 does not have to be coaxial with the rotation axis RX. For example, the optical axis of the fθ lens 5322 may be parallel to the rotation axis RX. The optical axis of the fθ lens 5322 may intersect the rotation axis RX. The optical axis of the fθ lens 5322 may be in a twisted relationship with respect to the rotation axis RX.

In the following description, the optical axis of the terminal optical element included in the measuring device 5 will be referred to as the measurement axis MX of the measuring device 5. The terminal optical element included in the measurement apparatus 5 is the optical element closest to the measurement target among the one or more optical members having power included in the measurement apparatus 5 . The optical element closest to the object to be measured is an optical element that does not have an optical member having power between it and the object to be measured on the optical paths of the measurement light ML and the return light RL. In the first embodiment, the measurement axis MX is the optical axis of the fθ lens 5322 and the optical axis of the optical system 532 on the measurement object side.

When the measurement light ML is irradiated onto the measurement target (workpiece W in the example shown in FIG. 6), the measurement target emits a return light RL generated by the irradiation of the measurement light ML onto the measurement target. be done. The return light RL enters the optical system 532 (specifically, the fθ lens 5322) via the aperture 5312. As shown in FIG. Here, the optical path of the return light RL may overlap the optical path of the measurement light ML#2-2 between the optical system 532 (in particular, the fθ lens 5322 having the final optical element) and the object to be measured. For example, the fθ lens 5322 may irradiate the measurement target with the measurement light ML#2-2 so that the measurement light ML#2-2 is vertically incident on the measurement target. The machine tool 1a controls at least one of the head drive system 3 and the stage drive system 42 so that the measurement light ML#2-2 is perpendicularly incident on the object to be measured. and the measurement object may be adjusted. When the measurement light ML#2-2 is perpendicularly incident on the measurement object, typically between the optical system 532 and the measurement object, the optical path of the return light RL is the same as the optical path of the measurement light ML#2-2. Overlap. In other words, the optical path of the return light RL and the optical path of the measurement light ML#2-2 are coaxial between the optical system 532 and the object to be measured. However, the fθ lens 5322 may irradiate the object to be measured with the measurement light ML#2-2 so that the measurement light ML#2-2 obliquely enters the object to be measured. The machine tool 1a controls at least one of the head drive system 3 and the stage drive system 42 so that the measurement light ML#2-2 is obliquely incident on the measurement object, thereby adjusting the position of the fθ lens 5322 and the measurement object. Relationships can be adjusted. Even in this case, the optical path of the return light RL may overlap the optical path of the measurement light ML#2-2 between the optical system 532 and the object to be measured. For example, when the return light RL includes the scattered light of the measurement light ML#2-2 at the measurement object, even if the measurement light ML#2-2 is obliquely incident on the measurement object, the optical system Between 532 and the object to be measured, there may be scattered light that overlaps the optical path of the measurement light ML#2-2. When the return light RL includes ±N (where N is an integer equal to or greater than 2) order diffracted light of the measurement light ML#2-2, the measurement light ML#2-2 is obliquely incident on the object to be measured. Even so, the optical path of the return light RL may overlap the optical path of the measurement light ML#2-2 between the optical system 532 and the object to be measured. When the optical path of the return light RL overlaps with the measurement light ML#2-2 in this manner, the measurement device 5 is placed at a position that is optically conjugate with the surface of the measurement object (the condensing surface of the fθ lens 5322). , may be provided with a field stop (typically a pinhole). At this time, after the measurement light ML#2-2 is applied to the measurement target position of the measurement target, the multiple reflected light reflected at another position of the measurement target can be shielded by the field stop, and the measurement error can be reduced. can be reduced. Here, instead of the field stop, the end of the optical fiber that transmits the measurement light ML#2-2 and the return light RL may be set at a position that is optically conjugate with the surface of the object to be measured. Between the optical system 532 and the object to be measured, the optical path of the return light RL does not necessarily overlap with the optical path of the measurement light ML#2-2.

The return light RL that has entered the fθ lens 5322 enters the mirror 5321 via the fθ lens 5322 . The mirror 5321 reflects the measurement light ML2#2-3 incident on the mirror 5321 toward the optical system 522 (specifically, the mirror 5223). Between the optical system 532 and the optical system 522, the optical path of the return light RL may or may not overlap the optical path of the measurement light ML#2-2. In other words, between the optical system 532 and the optical system 522, the optical path of the return light RL and the optical path of the measurement light ML#2-2 may or may not be coaxial.

The return light RL that has entered the mirror 5223 enters the optical system 5221 via the galvanomirror 5222 . The return light RL that has entered the optical system 5221 enters the detection element 5232 via the

beam splitters

52213 and 52212, as shown in FIG.

As described above, the measurement light beams ML#1-3 enter the detection element 5232 in addition to the return light beam RL. In other words, the return light RL that travels toward the detection element 5232 via the measurement target and the measurement light ML#1-3 that travels toward the detection element 5232 without via the measurement target enter the detection element 5232 . The detection element 5232 detects the measurement light ML#1-3 and the return light RL. In particular, the detection element 5232 detects interference light generated by interference between the measurement light ML#1-3 and the return light RL. Therefore, the beam splitter 52212 that emits the measurement light beams ML#1-3 and the return light beam RL toward the detection element 5232 functions as an interference optical system that causes the measurement light beams ML#1-3 and the return light beam RL to interfere with each other. may be regarded as Specifically, the detection element 5232 detects the interference light by receiving the interference light. Therefore, the detection element 5232 may include a light receiving element capable of receiving light. The detection result of the detection element 5232 is output to the control device 7 via the output interface 54 as part of the measurement result of the measuring device 5 .

Since the optical system 5221 is used for detecting the measurement light beams ML#1-3 and the return light beam RL, the optical system 5221 may be called a detection side optical system. Also, since the galvanomirror 5222 is used for detecting the return light RL, the galvanomirror 5222 may be referred to as a detection-side optical system. Also, since the mirror 5223 is used for detecting the return light RL, the mirror 5223 may be referred to as a detection-side optical system. Further, since the optical system 522 is arranged closer to the detection side of the return light RL than the optical system 532, at least a part of the optical system 5221, the galvanomirror 5222, and the mirror 5223 included in the optical system 522 is the detection side optical system. may be called Further, the detection-side optical system (at least part of the optical system 5221, the galvanomirror 5222, and the mirror 5223) and the detection element 5232 may constitute one optical system (which may be referred to as a measurement optical system). good.

The control device 7 acquires the detection result of the detection element 5231 and the detection result of the detection element 5232 via the output interface 54 . A device including the output interface 54, the detection element 5231, and the detection element 5232 (that is, a device that detects the return light RL and outputs the detection result of the return light RL to the control device 7) is called a detection device. may Based on the detection result of the detection element 5231 and the detection result of the detection element 5232 (that is, the measurement result of the measurement device 5), the control device 7 generates measurement data of the measurement object (for example, data related to the shape of the measurement object). Generate.

Specifically, since the pulse frequency of the measurement light ML#1 and the pulse frequency of the measurement light ML#2 are different, the pulse frequency of the measurement light ML#1-1 and the pulse frequency of the measurement light ML#2-1 are different. different. Therefore, the interference light between the measurement light ML#1-1 and the measurement light ML#2-1 is the pulsed light that forms the measurement light ML#1-1 and the pulsed light that forms the measurement light ML2#2-1. At the same time, it becomes interference light in which pulsed light appears in synchronization with the timing of incidence on the detection element 5231 . Similarly, the pulse frequency of the measurement light ML#1-3 and the pulse frequency of the return light RL are different. Therefore, the interference light between the measurement light ML#1-3 and the return light RL is generated at the timing when the pulse light forming the measurement light ML#1-3 and the pulse light forming the return light RL simultaneously enter the detection element 5232. It becomes an interference light in which pulsed light appears in synchronization with . Here, the position (position on the time axis) of the pulsed light that generates the interference light detected by the detection element 5232 is the positional relationship between the measurement head 52 and the measurement object (that is, substantially, the processing head 2 and the measurement positional relationship with the object). This is because the interference light detected by the detection element 5232 is composed of the return light RL directed to the detection element 5232 via the measurement target and the measurement light ML#1-3 directed to the detection element 5232 without via the measurement target. This is because it is interference light. On the other hand, the position (position on the time axis) of the pulsed light that generates the interference light detected by the detection element 5231 is the positional relationship between the measurement head 52 and the measurement object (that is, substantially, the processing head 2 and the measurement positional relationship with the object). Therefore, the time difference between the pulsed light generating the interference light detected by the detection element 5232 and the pulsed light generating the interference light detected by the detection element 5231 depends on the positional relationship between the measurement head 52 and the object to be measured (typically, It can be said that it indirectly indicates the distance between the processing head 2 and the object to be measured. Therefore, the control device 7 generates measurement data of the object to be measured based on the time difference between the pulsed light generating the interference light detected by the detection element 5232 and the pulsed light generating the interference light detected by the detection element 5231. can be done. For example, the control device 7 determines the measurement light ML#2- 2 can generate measurement data indicating the position of the irradiated portion.

When the measurement light ML#2-2 is irradiated onto multiple parts of the measurement object, the control device 7 can generate measurement data indicating the positions of the multiple parts of the measurement object. As a result, the control device 7 can generate measurement data indicating the shape of the object to be measured based on the measurement data indicating the positions of a plurality of parts. For example, the control device 7 calculates, as the shape of the object to be measured, a three-dimensional shape composed of virtual planes (or curved surfaces) connecting a plurality of parts whose positions are specified. Metrology data indicative of the shape can be generated.

In this way, the measuring device 5 irradiates the measurement target with the measurement light ML and detects the return light RL from the measurement target irradiated with the measurement light ML, thereby measuring the measurement target. can be done. In particular, in the example described above, the measurement device 5 can measure the measurement object by detecting interference light between the return light RL and the measurement light ML#1-3, which is the reference light. Therefore, the measuring device 5 may be regarded as an interferometric measuring device. However, the measuring device 5 does not have to be an interferometric measuring device as long as it can measure the object to be measured. For example, the measuring device 5 may be a triangulation measuring device. The measurement device 5 may be a stereo measurement device. The measurement device 5 may be a phase shift type measurement device. The measuring device 5 may be a confocal measuring device.

As described above, when the measurement head 53 is attached to the main shaft 21, the measurement head 53 may be rotatable around the rotation axis RX as the main shaft 21 rotates. However, depending on the rotation angle of the main shaft 21, the measurement device 5 may not be able to irradiate the measurement target with the measurement light ML and/or may not be able to detect the return light RL. For example, as shown in the diagram on the right side of FIG. 9, the measurement light ML emitted from the measurement head 52 enters the optical system 532 (in particular, the mirror 5321) of the measurement head 53 through the opening 5311 of the measurement head 53. do. However, as shown in the left diagram of FIG. 9, depending on the rotation angle of the main shaft 21 (that is, the rotation angle of the measurement head 53), the opening 5311 may be positioned on the optical path of the measurement light ML emitted from the measurement head 52. may disappear. In this case, the measurement light ML emitted from the measurement head 52 cannot enter the mirror 5321 because it is blocked by the head housing 531 . Alternatively, as the measurement head 53 rotates, the mirror 5321 accommodated in the head housing 531 also rotates around the rotation axis RX, so the orientation of the reflecting surface of the mirror 5321 changes. As a result, even if the measurement light ML emitted from the measurement head 52 enters the mirror 5321 through the opening 5311, the mirror 5321 may direct the measurement light ML toward the fθ lens 5322 depending on the orientation of the reflecting surface of the mirror 5321. May not be able to reflect.

Therefore, the control device 7 controls the main shaft 21 to which the measurement head 53 is attached so that the measurement device 5 can irradiate the measurement target with the measurement light ML and detect the return light RL. Rotation (that is, rotation of the measurement head 53) may be controlled. For example, as shown on the right side of FIG. rotation) may be controlled. For example, as shown on the right side of FIG. ) may be controlled. For example, as shown in the right side of FIG. 9, the control device 7 rotates the main shaft 21 (in this case, head housing body 531) may be controlled. For example, as shown on the right side of FIG. rotation) may be controlled. For example, as shown on the right side of FIG. 9, the control device 7 controls the rotation of the main shaft 21 (in this case, the rotation of the mirror 5321) so that the measurement light ML reflected by the mirror 5321 is incident on the fθ lens 5322. may At this time, the machining head 2 may be provided with a rotational position detection device for detecting the rotational position of the spindle 21 . This rotational position detection device may be, for example, a rotary encoder.

When the measurement device 5 can irradiate the measurement object with the measurement light ML and detect the return light RL, the return light RL enters the detection element 5232 . On the other hand, when the measurement device 5 cannot irradiate the measurement target with the measurement light ML and/or cannot detect the return light RL, the return light RL is incident on the detection element 5232. or only part of the return light RL enters the detection element 5232 . Therefore, the intensity of the return light RL detected by the detection element 5232 is used to determine whether the measurement device 5 can irradiate the measurement target with the measurement light ML and detect the return light RL. can be used as an index value for Therefore, the control device 7 detects the intensity of the return light RL detected by the detection element 5232 (that is, the intensity of the return light RL detected by the detection element 5232, for example, the intensity of the interference light between the return light RL and the measurement light ML). ) is greater than or equal to a predetermined first intensity threshold, the rotation of the spindle 21 to which the measuring head 53 is attached may be controlled. As an example, the stronger the detected intensity of the return light RL, the more appropriate the optical paths of the measurement light ML and the return light RL are estimated. Therefore, the control device 7 may control the rotation of the main shaft 21 to which the measurement head 53 is attached so that the intensity of the return light RL detected by the detection element 5232 is maximized.

In addition, by utilizing the fact that the measurement head 53 can rotate with the rotation of the main shaft 21, the measurement device 5 rotates the main shaft 21 to change the irradiation position of the measurement light ML on the object to be measured. You may let For example, as described above, the operation of the galvanomirror 5222 may make the optical path of the principal ray of the measurement light ML parallel to the rotation axis RX even though the optical path is not positioned on the rotation axis RX. When the main shaft 21 rotates around the rotation axis RX in this state, the irradiation position of the measurement light ML on the object to be measured also rotates around the rotation axis RX. Therefore, by rotating the main shaft 21, the measurement apparatus 5 can change the irradiation position of the measurement light ML so that the irradiation position of the measurement light ML on the object to be measured rotates around the rotation axis RX. good. At this time, the measurement device 5 may change the irradiation position of the measurement light ML in conjunction with the galvanomirror 5222 . The measurement device 5 may change the irradiation position of the measurement light ML separately from the galvanomirror 5222 .

Also, in the above description, the measuring device 5 includes the measuring head 53 . However, the measuring device 5 does not have to include the measuring head 53 . In this case, the measuring head 53 is a measuring device different from the measuring device 5, and is detachably attachable to the processing head 2 together with the measuring device 5 (specifically, the measuring head 52). may be

(1-3) Operation using the measuring device 5 Next, the operation using the measuring device 5 will be described.

(1-3-1) Coordinate Matching Operation The machine tool 1a may use the coordinate matching operation using the measuring device 5. FIG. A coordinate matching operation is a calibration operation for associating the measurement coordinate system and the stage coordinate system with each other. The measurement coordinate system is a three-dimensional coordinate system used to specify the position of the measurement object measured by the measurement device 5 (for example, the position of the measurement object with reference to the measurement device 5). The stage coordinate system is a three-dimensional coordinate system used to specify a position on stage 41 (for example, a position with stage 41 as a reference). Alternatively, the stage coordinate system may be a three-dimensional coordinate system used to specify the position of stage 41 . When the stage 41 can be moved by the stage drive system 42, the stage drive system 42 may move the stage 41 based on information regarding the position of the stage 41 specified within the stage coordinate system.

When the measurement coordinate system and the stage coordinate system are associated with each other, the coordinates of a position in either one of the stage coordinate system and the measurement coordinate system are converted to the coordinates of a position in the other of the stage coordinate system and the measurement coordinate system. can be converted to Thus, the coordinate matching operation includes information (e.g., a transformation matrix) used to transform coordinates in the stage coordinate system to coordinates in the measurement coordinate system, and transforming coordinates in the measurement coordinate system to coordinates in the stage coordinate system. may be considered equivalent to an operation for obtaining information (eg, a transformation matrix) used to perform the transformation.

The measuring device 5 may measure the coordinate reference member 411 under the control of the control device 7 in order to perform the coordinate matching operation. The coordinate reference member 411 is a member whose position relative to the stage 41 is known to the control device 7 . In other words, the coordinate reference member 411 is a member for which information regarding the relative positional relationship with the stage 41 is known to the control device 7 .

For example, the coordinate reference member 411 may be formed at a predetermined position on the surface of the stage 41 as shown in FIG. In this case, the information about the position where the coordinate reference member 411 is formed on the stage 41 is information known to the control device 7 as information about the position of the coordinate reference member 411 with respect to the stage 41 . However, the coordinate reference member 411 may be formed on a surface (for example, a side surface) different from the surface of the stage 41 . The coordinate reference member 411 may be formed on a member different from the stage 41 and mounted on the stage 41 . At this time, the workpiece W may be held by a member different from the stage 41 and placed on the stage 41 . Further, the coordinate reference member 411 may be installed on the surface of the stage 41 in a state where the positional relationship between the stage 41 and the coordinate reference member 411 is fixed.

An example of the coordinate reference member 411 is shown in FIGS. 11(a) and 11(b). As shown in FIG. 11( a ), a coordinate reference member 411 # 1 including a sphere (that is, a spherical member) may be used as the coordinate reference member 411 . As shown in FIG. 11B, a coordinate reference member 411#2 including a member having a convex polyhedron (a cube in the example shown in FIG. 11B) may be used as the coordinate reference member 411. . However, the coordinate reference member 411 may be a member having a shape different from the shape shown in FIGS. 11(a) and 11(b). For example, the coordinate reference member 411 may include a member on which a predetermined mark (for example, grid mark) measurable by the measuring device 5 is formed. Alternatively, a predetermined mark (for example, a grid mark) measurable by the measuring device 5 may be formed on the stage 41 . In this case, a portion of the stage 41 on which a predetermined mark is formed may be used as the coordinate reference member 411 .

The control device 7 can generate measurement data indicating the position of the coordinate reference member 411 in the measurement coordinate system based on the measurement result of the coordinate reference member 411 by the measurement device 5 . On the other hand, information about the position of the coordinate reference member 411 with respect to the stage 41 is known information to the control device 7, and the position of the stage 41 in the stage coordinate system is measured by a position measuring device (not shown) included in the stage device 4. Since it is possible, the control device 7 can calculate the position of the coordinate reference member 411 in the stage coordinate system. As a result, the control device 7 can specify that the position of the coordinate reference member 411 in the measurement coordinate system indicated by the measurement data and the position of the coordinate reference member 411 in the stage coordinate system are positions to be associated with each other. . That is, the control device 7 can specify that a specific position within the measurement coordinate system and a specific position within the stage coordinate system are positions that should be associated with each other. As a result, based on the identification result that a specific position in the measurement coordinate system and a specific position in the stage coordinate system are positions to be associated with each other, the control device 7 controls the measurement coordinate system and the stage. can be associated with a coordinate system.

As described above, each of the measurement coordinate system and the stage coordinate system is a three-dimensional coordinate system. In this case, a plurality of (for example, at least three) coordinate reference members 411 may be formed on the stage 41 in order to associate the measurement coordinate system and the stage coordinate system, which are three-dimensional coordinate systems, with each other. . For example, at least two coordinate reference members 411 having different positions in the X-axis direction may be formed on the stage 41 . In this case, the control device 7 performs a coordinate matching operation based on the measurement results of at least two coordinate reference members 411, so that the X coordinate of a certain position in either one of the stage coordinate system and the measurement coordinate system is Either the stage coordinate system or the measurement coordinate system can be transformed into the X coordinate of a certain position. For example, at least two coordinate reference members 411 whose positions in the Y-axis direction are different may be formed on the stage 41 . In this case, the control device 7 performs a coordinate matching operation based on the measurement results of at least two coordinate reference members 411, so that the Y coordinate of a certain position in either one of the stage coordinate system and the measurement coordinate system is Either the stage coordinate system or the measurement coordinate system can be transformed into the Y coordinate of a certain position. For example, at least two coordinate reference members 411 having different positions in the Z-axis direction may be formed on the stage 41 . In this case, the control device 7 performs a coordinate matching operation based on the measurement results of at least two coordinate reference members 411, so that the Z coordinate of a certain position in either one of the stage coordinate system and the measurement coordinate system is Either one of the stage coordinate system and the measurement coordinate system can be transformed into the Z coordinate of a certain position.

Alternatively, each time the measuring device 5 measures the coordinate reference member 411, the stage 41 is moved so as to change the position of the coordinate reference member 411 within the stage coordinate system, and then the coordinates moved as the stage 41 is moved. The measuring device 5 may measure the reference member 411 again. In other words, the measurement device 5 may measure the coordinate reference member 411 that moves between a plurality of locations (for example, at least three locations) within the stage coordinate system. In this case, the multiple coordinate reference members 411 may not be formed on the stage 41 . A single coordinate reference member 411 may be formed on the stage 41 . For example, the measuring device 5 measures the coordinate reference member 411, and then the stage 41 includes a directional component along the X-axis direction so as to change the position of the coordinate reference member 411 in the X-axis direction within the stage coordinate system. The measuring device 5 may measure the coordinate reference member 411 that moves along the movement direction and then moves along with the movement of the stage 41 . In this case, the control device 7 performs a coordinate matching operation based on the measurement result of the coordinate reference member 411 to match the X coordinate of a certain position in either the stage coordinate system or the measurement coordinate system to the stage coordinate system. and the other of the measurement coordinate system can be transformed into the X coordinate of a certain position. For example, the measuring device 5 measures the coordinate reference member 411, and then the stage 41 includes a directional component along the Y-axis direction so as to change the position of the coordinate reference member 411 in the Y-axis direction within the stage coordinate system. The measuring device 5 may measure the coordinate reference member 411 that moves along the movement direction and then moves along with the movement of the stage 41 . In this case, the control device 7 performs a coordinate matching operation based on the measurement result of the coordinate reference member 411 to match the Y coordinate of a certain position in either one of the stage coordinate system and the measurement coordinate system to the stage coordinate system. and the Y coordinate of a certain position in the other of the measurement coordinate systems. For example, the measuring device 5 measures the coordinate reference member 411, and then the stage 41 includes a directional component along the Z-axis direction so as to change the position of the coordinate reference member 411 in the Z-axis direction within the stage coordinate system. The measuring device 5 may measure the coordinate reference member 411 that moves along the movement direction and then moves along with the movement of the stage 41 . In this case, the control device 7 performs a coordinate matching operation based on the measurement result of the coordinate reference member 411, so that the Z coordinate of a certain position in either one of the stage coordinate system and the measurement coordinate system is changed to the stage coordinate system. and the Z coordinate of a certain position in the other of the measurement coordinate systems.

Alternatively, when the coordinate reference member 411 includes a member having a three-dimensional shape (for example, the sphere shown in FIG. 11A or the cube shown in FIG. Multiple sites (eg, at least three sites) may be measured. In this case, the plurality of coordinate reference members 411 may not be formed on the stage 41 , and the stage 41 may not move each time the measuring device 5 measures the coordinate reference members 411 . For example, the measuring device 5 measures a first portion of the coordinate reference member 411, and then measures a second portion of the coordinate reference member 411 whose position in the X-axis direction in at least the stage coordinate system is different from that of the first portion. may be measured. In this case, the control device 7 performs a coordinate matching operation based on the measurement result of the coordinate reference member 411 to match the X coordinate of a certain position in either the stage coordinate system or the measurement coordinate system to the stage coordinate system. and the other of the measurement coordinate system can be transformed into the X coordinate of a certain position. For example, the measuring device 5 measures a first portion of the coordinate reference member 411, and then measures a third portion of the coordinate reference member 411 whose position in at least the Y-axis direction in the stage coordinate system is different from that of the first portion. may be measured. In this case, the control device 7 performs a coordinate matching operation based on the measurement result of the coordinate reference member 411 to match the Y coordinate of a certain position in either one of the stage coordinate system and the measurement coordinate system to the stage coordinate system. and the Y coordinate of a certain position in the other of the measurement coordinate systems. For example, the measuring device 5 measures a first portion of the coordinate reference member 411, and then measures a fourth portion of the coordinate reference member 411 whose position in the Z-axis direction in at least the stage coordinate system is different from that of the first portion. may be measured. In this case, the control device 7 performs a coordinate matching operation based on the measurement result of the coordinate reference member 411, so that the Z coordinate of a certain position in either one of the stage coordinate system and the measurement coordinate system is changed to the stage coordinate system. and the Z coordinate of a certain position in the other of the measurement coordinate systems.

When the measuring device 5 measures a plurality of parts of the coordinate reference member 411 , after the measuring device 5 measures one part of the coordinate reference member 411 , the measuring device 5 measures another part of the coordinate reference member 411 . The relative positional relationship between the measuring device 5 and the coordinate reference member 411 may be changed so as to be able to. A relative positional relationship between the measurement device 5 and the coordinate reference member 411 may be changed by the stage drive system 42 . In this case, typically, the stage drive system 42 may change the attitude of the stage 41 with respect to the measuring device 5 (for example, at least one of the measuring heads 52 and 53). A relative positional relationship between the measurement device 5 and the coordinate reference member 411 may be changed by the head drive system 3 . In this case, typically, the head drive system 3 changes the attitude of the measuring device 5 (for example, at least one of the measuring heads 52 and 53) with respect to the stage 41 by changing the attitude of the processing head 2 with respect to the stage 41. You may

Alternatively, after measuring one portion of the coordinate reference member 411 by the measuring device 5, the measuring device 5 may be moved to the coordinate reference member 411 without changing the relative positional relationship between the measuring device 5 and the coordinate reference member 411. Other sites may be measured. In this case, as shown in FIG. 12, the measuring device 5 may measure a plurality of parts of the coordinate reference member 411 via an optical system 412 capable of changing the traveling direction of the measurement light ML. For example, FIG. 12 shows an example in which a coordinate reference member 411#2 including a cube is measured by the measuring device 5. As shown in FIG. In this case, since the traveling direction of the measurement light ML emitted from the measurement head 53 is parallel to the Z-axis, the measurement device 5 faces upward (that is, faces the +Z side) without passing through the optical system 412. and the first surface 4111 of the coordinate reference member 411#2 facing the measurement head 53 can be irradiated with the measurement light ML. On the other hand, when the traveling direction of the measurement light ML emitted from the measurement head 53 is parallel to the Z axis, the measurement device 5 moves the second surface 4112 (see FIG. 12, the surface facing the -X side) and the third surface 4113 facing the side of the coordinate reference member 411#2 (the surface facing the -Y side in the example shown in FIG. 12). ML cannot be irradiated. Therefore, in the example shown in FIG. 12, the optical system 412 includes a mirror member 4121 that reflects the measurement light ML so as to change the traveling direction of the measurement light ML from the direction parallel to the Z axis to the direction parallel to the X axis. , and a mirror member 4122 that reflects the measurement light ML so as to change the traveling direction of the measurement light ML from the direction parallel to the Z axis to the direction parallel to the Y axis. In this case, the second surface 4112 of the coordinate reference member 411#2 is irradiated with the measurement light ML reflected by the mirror member 4121, and the measurement light ML reflected by the mirror member 4122 is projected onto the third surface of the coordinate reference member 411#2. 4113 is irradiated. As a result, the measuring device 5 measures the first surface 4111 to the third surface 4113 of the coordinate reference member 411#2 without changing the relative positional relationship between the measuring device 5 and the coordinate reference member 411. can do. More specifically, the measuring device 5 irradiates the first surface 4111 with the measurement light ML emitted from the galvanomirror 5222 in the first emission direction, and emits the measurement light ML from the galvanomirror 5222 in the second emission direction. The second surface 4112 is irradiated with the measurement light ML emitted through the mirror member 4121, and the measurement light ML emitted from the galvanomirror 5222 in the third emission direction is emitted through the mirror member 4122 to the second surface 4112. Three surfaces 4113 can be irradiated. In this way, the optical system 412 changes the travel direction of the measurement light ML from a travel direction that allows the measurement light ML to irradiate one portion of the coordinate reference member 411, and directs the measurement light ML to another portion of the coordinate reference member 411. A traveling direction changing member (

mirror members

4121 and 4122 in the example shown in FIG. 12) that can be changed to a traveling direction that can be irradiated may be provided, provided, however, that the optical system 412 changes the traveling direction of the measurement light ML. is the optical path length (i.e., optical distance, hereinafter the same) of the measurement light ML irradiated to one portion of the coordinate reference member 411, and the optical path of the measurement light ML irradiated to the other portion of the coordinate reference member 411. There is a possibility that it will be different from the length. Considering the measurement principle of the measuring apparatus 5 described above, the optical path length of the measurement light ML irradiated to one portion of the coordinate reference member 411 and the optical path length of the measurement light ML irradiated to another portion of the coordinate reference member 411 are It is difficult to say that the situation in which the Therefore, in addition to the traveling direction changing member described above, the optical system 412 has an optical path length of the measurement light ML irradiated to one portion of the coordinate reference member 411 and a measurement light irradiated to another portion of the coordinate reference member 411. The optical path length of the measurement light ML irradiated to one portion of the coordinate reference member 411 and the optical path length of the measurement light ML irradiated to the other portion of the coordinate reference member 411 are equal to each other. At least one of the optical path length adjusting members may be included. For example, as shown in FIG. 12, the optical system 412 has the optical path length of the measurement light ML that irradiates the first surface 4111 of the coordinate reference member 411#2 and the length of the measurement light ML that irradiates the second surface 4112 of the coordinate reference member 411#2. The measurement light ML applied to the first surface 4111 is made equal to the optical path length of the measurement light ML applied to the third surface 4113 of the coordinate reference member 411#2. , the optical path length of the measurement light ML irradiated to the second surface 4112 of the coordinate reference member 411#2, and the measurement light ML irradiated to the third surface 4113 of the coordinate reference member 411#2. may be included as an optical path length adjusting member.

(1-3-2) Work Measuring Operation The machine tool 1a may use the measuring device 5 to perform a work measuring operation. The work measuring operation is an operation for measuring the work W (for example, measuring the shape of the work W).

The machine tool 1a may perform a workpiece measurement operation before the machining head 2 starts machining the workpiece W with the tool 23. In this case, the machine tool 1a uses the tool changer 6 to remove the measuring head 53 from the spindle 21 while the stage 41 is holding the workpiece W after completing the workpiece measuring operation, and attaches the tool 23 to the spindle 21. may be attached. After that, the machine tool 1a may process the work W held on the stage 41 based on the result of the work measuring operation.

The machine tool 1a may perform the workpiece measurement operation after the machining head 2 finishes machining the workpiece W. In this case, the machine tool 1a may machine the workpiece W using the tool 23 attached to the spindle 21 before the workpiece measurement operation is performed. The machine tool 1a may machine the workpiece W using a tool other than the tool 23 attached to the spindle 21 before the workpiece measurement operation is performed. Thereafter, after the machining of the workpiece W is completed, the machine tool 1a uses the tool changer 6 to remove the tool 23 from the spindle 21 while the stage 41 is holding the workpiece W, and attach the measuring head 53 to the spindle 21. may be attached. Alternatively, if the work W is machined using a tool different from the tool 23 attached to the main spindle 21 , there is a possibility that the tool 23 is not attached to the main spindle 21 . When the tool 23 is not attached to the main spindle 21, after the machining of the work W is completed, the machine tool 1a is moved from the main spindle 21 using the tool changer 6 while the stage 41 holds the work W. The measuring head 53 may be attached to the spindle 21 without removing the tool 23 . After that, the machine tool 1 a may perform a work measuring operation on the work W held on the stage 41 .

The workpiece measurement operation will be described below with reference to FIG. FIG. 13 is a flowchart showing the flow of work measuring operation.

As shown in FIG. 13, first, the work W is placed on the stage 41 (S101). For example, when the workpiece measuring operation is performed before the machining head 2 starts machining the workpiece W, the workpiece W to be machined by the machining head 2 may be placed on the stage 41 . For example, when the workpiece measurement operation is performed after the machining head 2 finishes machining the workpiece W, the workpiece W that the machining head 2 has finished machining may be placed on the stage 41 . However, when the workpiece measurement operation is performed after the machining head 2 finishes machining the workpiece W, the workpiece W which the machining head 2 has finished machining is already placed on the stage 41 . Therefore, in this case, the operation of step S101 may not be performed.

In parallel with or before or after the operation of step S101, the tool changer 6 attaches the measuring head 53 to the spindle 21 (step S102). However, if the measuring head 53 has already been attached to the spindle 21, the operation of step S102 may not be performed.

After that, the control device 7 acquires measurement path information (step S103). The measurement path information indicates a movement path (in other words, a movement locus) on the measurement object (workpiece W in this case) of the measurement position by the measuring device 5 . As described above, the measurement device 5 measures the measurement object by irradiating the measurement light ML onto the measurement object. Therefore, the measurement path information may indicate the movement path of the irradiation position of the measurement light ML on the measurement object as the movement path of the measurement position on the measurement object by the measuring device 5 . The measurement path information is a scan area SA (FIGS. 8A to 8C) that can be irradiated with the measurement light ML by the operation of the galvanomirror 5222 as a movement path on the measurement target of the measurement position by the measurement device 5. reference) may indicate the route of movement.

The control device 7 may generate measured path information from a path generation device that generates measured path information. The path generation device may generate measurement path information based on, for example, a three-dimensional model of the measurement object (for example, a CAD (Computer Aided Design) model of the measurement object). The path generation device may generate measurement path information based on, for example, a three-dimensional model of the measurement object and information on the position of the portion of the measurement object to be measured by the measurement device 5 .

The path generation device may generate measurement path information using CAM (Computer Aided Manufacturing). A CAM is usually used to generate machining path information that indicates a movement path on a workpiece of a machining position by a machine tool that performs NC (Numerical Control) machining. Therefore, the path generation device may generate the measurement path information using the CAM by performing a process of regarding the positions measured by the measurement device 5 on the CAM as the machining positions by the machine tool.

When the path generation device generates the measurement path information using the CAM, the path generation device may generate the measurement path information by performing processing on the CAM that regards the measurement light ML as a virtual tool. good. For example, as shown in FIG. 14 showing measurement light ML regarded as a virtual tool, the path generation device irradiates the above-described scan area SA (annular scan area SA in the example shown in FIG. 14). The measurement path information may be generated by performing processing on the CAM that regards an aggregate of the measurement light beams ML as a virtual tool attached to the spindle 21 . Here, since the tool 23 rotates around the rotation axis RX of the main shaft 21, the tool 23 normally has a rotationally symmetrical shape with respect to the rotation axis RX. Therefore, even when the assembly of the measurement light ML is regarded as a virtual tool, if the assembly of the measurement light ML has a rotationally symmetrical shape with respect to the rotation axis RX, the path generation device can perform the measurement It is possible to relatively easily perform a process of regarding an aggregate of light ML as a tool. Therefore, the measurement device 5 may emit the measurement light ML so that the aggregate of the measurement light ML irradiated onto the scan area SA has a rotationally symmetrical shape with respect to the rotation axis RX. For example, the measurement device 5 has a shape in which the cross section (specifically, the cross section intersecting the traveling direction of the measurement light ML) of the aggregate of the measurement light ML irradiated onto the scan area SA is rotationally symmetrical with respect to the rotation axis RX. The measurement light ML may be emitted so as to have The measurement device 5 may emit the measurement light ML so that the scan area SA has a rotationally symmetrical shape with respect to the rotation axis RX.

The path generation device may generate measurement path information so that the measurement light ML emitted from the measurement device 5 is vertically incident on each part of the work W. That is, the path generation device generates the measurement path information so as not to cause a situation in which the measurement light ML is vertically incident on a certain portion of the work W while the measurement light ML is obliquely incident on another portion of the work W. may be generated. The path generation device is the distance between the measuring device 5 and the work W (for example, the distance between the final optical element of the measuring device 5 and the work W. In the first embodiment, the fθ lens 5322 and the work W The measured path information may be generated so that the distance between ) is constant.

Note that the control device 7 may generate the measured path information in addition to or instead of acquiring the measured path information from the path generation device. The control device 7 may generate the measured path information using a method similar to the method used by the path generation device to generate the measured path information.

Referring back to FIG. 13, after that, the control device 7 controls the measurement device 5 (and, if necessary, the head drive system 3 and the stage drive system) to measure the workpiece W based on the measurement path information acquired in step S103. 42) is controlled (step S104). As a result, the measuring device 5 measures the workpiece W by irradiating the measurement object with the measurement light ML so that the irradiation position of the measurement light ML moves along the movement path indicated by the measurement path information on the workpiece W. do.

After that, the control device 7 determines whether or not the measurement result of the workpiece W in step S104 is flawed (step S105). As described above, the control device 7 generates measurement data of the work W (for example, data regarding the shape of the work W) based on the measurement results of the work W. FIG. Therefore, the control device 7 may determine that the measurement result of the work W is incomplete when the measurement data cannot be generated from the measurement result of the work W. Although the control device 7 can generate measurement data from the measurement results of the work W, if the reliability of the measurement data is lower than a predetermined reliability threshold, the control device 7 determines that the measurement results of the work W are defective. may

As an example, the control device 7 may acquire the intensity of the return light RL detected by the detection element 5232 as the measurement result of the work W, as described above. In this case, the control device 7 may determine that the measurement result of the workpiece W is defective when the detected intensity of the returned light RL is smaller than a predetermined second intensity threshold. This is because the detection intensity of the return light RL should be equal to or higher than a certain intensity, but if the detection intensity of the return light RL is weak, the measuring device 5 may not be able to appropriately irradiate the workpiece W with the measurement light ML. It is because there is a nature. This is because, as a result, the control device 7 may not be able to generate reliable measurement data.

As a result of the determination in step S105, when it is determined that the measurement result of the work W is defective (step S105: Yes), the control device 7 changes the measurement conditions for measuring the work W (step S106 ). For example, the control device 7 changes the measurement conditions so that the control device 7 can generate reliable measurement data (for example, the reliability is higher than a predetermined reliability threshold) from the measurement results of the workpiece W. You may For example, when it is determined that the measurement result of the work W is defective because the detected intensity of the returned light RL is smaller than the predetermined second intensity threshold, the control device 7 detects the returned light RL. The measurement conditions may be changed so that the intensity is greater than or equal to the second predetermined intensity threshold.

The measurement conditions for the work W may include conditions for the measurement device 5 that irradiates the work W with the measurement light ML and detects the return light RL from the work W. The conditions regarding the measurement device 5 may include conditions regarding the measurement light ML. The conditions regarding the measurement light ML may include at least one of the intensity of the measurement light ML, the timing of irradiation of the measurement light ML, and the irradiation position of the measurement light ML. For example, the control device 7 may change the intensity of the measurement light ML so that the detected intensity of the return light RL is greater than or equal to a predetermined second intensity threshold. At least one of the measuring device 5 (in particular, the measuring heads 52 and 53) and the stage 41 may move while the measuring device 5 measures the workpiece W. FIG. For this reason, the measurement conditions for the workpiece W may include conditions regarding movement of at least one of the measurement device 5 and the stage 41 . The condition regarding movement may include at least one of movement speed, movement timing, movement amount, and movement direction. Since the measuring device 5 (especially the measuring heads 52 and 53) moves with the movement of the processing head 2, the conditions for the movement of the measuring device 5 (especially the measuring heads 52 and 53) are substantially is equivalent to the condition regarding the movement of the machining head 2.

After the measurement conditions are changed, the measuring device 5 measures the workpiece W again (step S104). Thereafter, similar operations (that is, the operations of steps S104 and S106) are repeated until it is determined that the measurement result of the work W is satisfactory (step S105).

On the other hand, as a result of the determination in step S105, if it is determined that there is no defect in the measurement result of the work W (step S105: No), the control device 7, based on the measurement result of the work W in step S104, Measured data of the workpiece W is generated. For example, the control device 7 may generate measurement data indicating the shape of the work W based on the measurement results of the work W, as described above. Specifically, as described above, the measurement result of the work W includes information regarding the positions of the plurality of parts of the work W. As shown in FIG. In this case, the control device 7 may generate point cloud data including a plurality of points respectively corresponding to positions of a plurality of portions of the work W as measurement data indicating the shape of the work W. FIG. Alternatively, the control device 7 may generate a three-dimensional model representing the shape of the workpiece W based on the point cloud data, and may generate measurement data representing the three-dimensional model.

Various noise components may be superimposed on the measurement results of the workpiece W. For example, there is a possibility that a noise component caused by the temperature of the space in which the machine tool 1a and the work W are arranged is superimposed on the measurement result of the work W. For example, there is a possibility that noise components caused by vibrations occurring in the machine tool 1a and the workpiece W are superimposed on the measurement result of the workpiece W. FIG. Therefore, the control device 7 may remove noise components from the measurement results of the work W, and generate measurement data based on the measurement results from which the noise components have been removed. Alternatively, the control device 7 may generate measurement data from which the influence of noise components is eliminated based on the measurement result of the workpiece W. FIG.

After that, the control device 7 performs desired processing using the measurement data generated in step S107 (step S108).

If the workpiece measurement operation is performed before the machining head 2 starts machining the workpiece W, the desired process performed by the control device 7 in step S108 may include alignment of the tool 23. The alignment process of the tool 23 includes a process of moving the tool 23 so that the tool 23 is positioned at a desired position (for example, a machining start position) of the workpiece W whose shape (and position) can be specified by the measurement data. You can stay.

When the workpiece measuring operation is performed before the machining head 2 starts machining the workpiece W, the desired process performed by the control device 7 in step S108 is to determine the position of the workpiece W placed on the stage 41 (hereinafter referred to as "mounting position"). A calibration process may also be included to configure the "placement position"). The process of calibrating the placement position of the work W includes a process of calculating a placement position error corresponding to the difference between the ideal placement position of the work W and the actual placement position of the work W indicated by the measurement data. You can The process of calibrating the placement position of the work W includes a process of notifying the operator of the machine tool 1a of the calculated placement position error and prompting the operator to place the work W again on the stage 41. You can The processing for calibrating the mounting position of the work W may include processing for automatically changing the mounting position of the work W on the stage 41 based on the calculated mounting position error. The processing for calibrating the mounting position of the work W may include processing for controlling movement of at least one of the processing head 2 and the stage 41 so as to offset the calculated mounting position error. For example, in the process of calibrating the mounting position of the work W, the processing head 2 processes the work W in the same manner as when there is no mounting position error even in a situation where a mounting position error has occurred. may include processing for controlling the movement of at least one of the processing head 2 and the stage 41 so that For example, in the process of calibrating the mounting position of the workpiece W, even under the condition where the mounting position error occurs, the measuring device 5 can detect the workpiece W (or an arbitrary measurement object) may include processing for controlling the movement of at least one of the processing head 2 and the stage 41 so as to be able to measure the object. In this case, the head driving system 3 and the stage driving system 42 substantially move the processing head 2 and the stage 41, respectively, based on the information regarding the measurement result of the workpiece W. As a result, the machine tool 1a can process and measure the workpiece W without being affected by the mounting position error.

When the workpiece measuring operation is performed after the machining head 2 finishes machining the workpiece W, the desired process performed by the control device 7 in step S108 is an evaluation process for evaluating the workpiece W machined by the machining head 2. may contain. In other words, the desired process may include an evaluation process for evaluating the details of the machining of the workpiece W by the machining head 2 . The evaluation process may include a process of calculating a machining error corresponding to the difference between the ideal shape of the work W and the actual shape of the work W indicated by the measurement data. The evaluation process may include a process of notifying the operator of the machine tool 1a of information on the machining error. The evaluation process may include a process of comparing the calculated machining error with a predetermined error threshold to determine the quality of the workpiece W machined by the machining head 2 . The evaluation process may include a process of notifying the operator of the machine tool 1a of the determined quality of the workpiece W. The evaluation process may include a process of causing the machining head 2 to process the workpiece W again so as to reduce or eliminate machining errors.

The machine tool 1a produces various types of workpieces by machining the workpiece W. Therefore, the ideal shape of the workpiece W also changes depending on the type of workpiece to be produced by the machine tool 1a. Therefore, the control device 7 may perform evaluation processing for each type of workpiece to be produced by the machine tool 1a. For example, when the machine tool 1a produces a first type of workpiece (for example, a gear), the controller 7 determines the difference between the ideal shape of the gear as the workpiece and the actual shape of the workpiece W. When the machine tool 1a generates a second type of workpiece (for example, a blade), the ideal shape of the blade as the workpiece and A second evaluation process is performed to calculate a machining error corresponding to a difference from the actual shape of the workpiece W, and when the machine tool 1a generates a third type of workpiece (for example, a mold), A third evaluation process of calculating a machining error corresponding to the difference between the ideal shape of the gear as an object and the actual shape of the workpiece W may be performed.

During at least part of the period during which the workpiece measurement operation is performed, the control device 7 controls the measurement device 5 so that the measurement light ML can be applied to the measurement object and the return light RL can be detected. As described above, the operation of controlling the rotation of the spindle 21 to which the measuring head 53 is attached (that is, the rotation of the measuring head 53) may be performed. In the following description, this operation will be referred to as azimuth calibration operation. For example, the control device 7 may perform an azimuth calibration operation between steps S103 and S104 in FIG. For example, the control device 7 may perform the orientation calibration operation after the measurement path information is acquired and before the workpiece W is actually measured based on the measurement path information. For example, the control device 7 may perform an azimuth calibration operation between steps S102 and S104 in FIG. That is, the control device 7 may perform the orientation calibration operation after the measurement head 53 is attached to the spindle 21 and before the work W is actually measured based on the measurement path information.

Alternatively, the control device 7 may perform the azimuth calibration operation as part of the series of operations from step S104 to step S106 in FIG. For example, in step S104, the control device 7 controls the measurement device 5 to irradiate the workpiece W with the measurement light ML, and in step S105, when the intensity of the return light RL is less than the first intensity threshold, the measurement It may be determined that the result is incomplete, and in step S106, the rotation angle of the measurement head 53 (that is, the orientation of the measurement head 53 around the rotation axis RX) as the measurement condition may be changed.

However, if the measurement device 5 is already in a state in which it is possible to irradiate the measurement target with the measurement light ML and detect the return light RL, the control device 7 performs the azimuth calibration operation. (that is, it is not necessary to rotate the measurement head 53 around the rotation axis RX). For example, when the intensity of the return light RL is less than the first intensity threshold, the control device 7 does not have to rotate the measurement head 53 around the rotation axis RX.

It should be noted that the control device 7 may perform the azimuth calibration operation each time the measuring head 53 is attached to the spindle 21 . Alternatively, the control device 7 does not have to perform the azimuth calibration operation each time the measuring head 53 is attached to the spindle 21 .

(1-3-3) Running Error Correction Operation The machine tool 1a may use the measuring device 5 to perform the running error correction operation. The running error calibrating operation is an operation for calibrating the running error of the machining head 2 . A running error of the machining head 2 is a running error of the machining head 2 in a second direction crossing (typically orthogonal to) the first direction, which occurs when the machining head 2 moves along the first direction. Including unintended variations in position. In particular, the running error of the machining head 2 intersects the first direction (typically may include an unintended variation in the position of the machining head 2 in a second (perpendicular) direction (for example, the direction in which the axis of rotation RX extends). As described above, the machining head 2 is movable along the X-axis direction that intersects with the rotation axis RX. Therefore, the running error of the machining head 2 may include unintended positional variations of the machining head 2 in the Z-axis direction that occur when the machining head 2 moves along the X-axis direction. However, if the machining head 2 is movable along the Y-axis direction that intersects with the rotation axis RX, the running error of the machining head 2 is Z It may also include unintended variations in the position of the machining head 2 in the axial direction. The running error correction operation will be described below with reference to FIG. FIG. 15 is a flow chart showing the flow of the running error calibration operation.

As shown in FIG. 15, first, the running error calibration member 91, which is an object used for calibrating the running error, is placed on the stage 41 (step S201). An example of the running error correction member 91 is shown in FIG. As shown in FIG. 16, the running error calibration member 91 is a member provided with a reference surface 911. As shown in FIG. The reference plane 911 is a plane whose shape information is known to the control device 7 . As shown in FIG. 16, the reference plane 911 is a plane. For example, the reference plane 911 is a plane parallel to the moving direction of the processing head 2 intersecting the rotation axis RX under the condition that the running error correction member 91 is placed on the stage 41 positioned at the reference position. may For example, the reference plane 911 may be a plane parallel to the XY plane under the condition that the running error calibration member 91 is placed on the stage 41 positioned at the reference position. For example, the reference plane 911 intersects (typically, orthogonally) the rotation axis RX of the main shaft 21 under the condition that the running error correction member 91 is placed on the stage 41 positioned at the reference position. It may be flat. However, as long as the information about the shape of the reference surface 911 is known to the control device 7, the reference surface 911 may include a curved surface.

Referring again to FIG. 15, the tool changer 6 then attaches the measuring head 53 to the spindle 21 (step S202). However, if the measuring head 53 is already attached to the spindle 21, the operation of step S202 may not be performed.

After that, the measuring device 5 starts measuring the running error calibration member 91 (step S203). In particular, the measuring device 5 starts measuring the reference surface 911 of the running error calibration member 91 (step S203). While the measuring device 5 is measuring the running error calibration member 91, the head drive system 3 moves the processing head 2 (step S203). That is, the measuring device 5 measures the running error calibration member 91 (in particular, the reference plane 911) while the head drive system 3 is moving the processing head 2. FIG.

In step S203, the head drive system 3 moves the processing head 2 along the direction intersecting the rotation axis RX. In the first embodiment, the head drive system 3 moves the processing head 2 along the X-axis direction that intersects the rotation axis RX. Therefore, the measuring device 5 measures the running error calibration member 91 (in particular, the reference plane 911) while the head drive system 3 is moving the machining head 2 along the X-axis direction. On the other hand, in step S203, the head drive system 3 does not perform control for moving the processing head 2 along the Z-axis direction along the rotation axis RX. That is, the head drive system 3 does not perform control for moving the Z slider member (not shown) to which the processing head 2 is attached along the Z guide member 35 .

After that, the control device 7 calculates the running error based on the measurement result of the running error calibrating member 91 in step S203 (step S204). The operation of calculating the running error will be described below with reference to FIG. FIG. 17 shows, with a dotted line, the position of the reference plane 911 in the Z-axis direction calculated from the measurement results of the running error calibration member 91 obtained under the condition that there is no running error (that is, the running error is zero). ing. Further, in FIG. 17, the position of the reference plane 911 in the Z-axis direction calculated from the measurement results of the running error calibration member 91 obtained under the condition that there is a running error (that is, the running error is not zero) is shown by the solid line. is shown. As shown in FIG. 17, when there is no running error, the position of the reference plane 911 in the Z-axis direction varies depending on the measurement position (that is, the position irradiated with the measurement light ML and the position in the X-axis direction). never. This is because the reference plane 911 is a plane. The position of the reference plane 911 in the Z-axis direction when there is no running error corresponds to the ideal position of the reference plane 911 in the Z-axis direction, and is known information for the control device 7 . On the other hand, as shown in FIG. 17, when there is a running error, the position of the reference plane 911 in the Z-axis direction changes depending on the measurement position, even though the reference plane 911 is flat. This is because the position of the machining head 2 fluctuates in the Z-axis direction due to running errors, so the distance between the measuring device 5 and the workpiece W in the Z-axis direction (for example, the fθ lens 5322 having the terminal optical element and the workpiece W in the Z-axis direction) fluctuates. Therefore, the control device 7 calculates the actual position of the reference plane 911 in the Z-axis direction based on the measurement result of the running error calibration member 91, and the actual position of the reference plane 911 in the Z-axis direction and the control device 7 The running error can be calculated by calculating the difference from the ideal position in the Z-axis direction of the reference plane 911, which is known information for .

The same thing can be said when the reference surface 911 includes a curved surface or the like as described above. Specifically, when there is no running error, the position of the reference plane 911 in the Z-axis direction matches the position corresponding to the shape of the reference plane 911, which is information known to the control device 7, regardless of the measurement position. do. On the other hand, if there is a running error, the position of the reference plane 911 in the Z-axis direction differs from the position corresponding to the shape of the reference plane 911, which is information known to the control device 7, depending on the measurement position. . Therefore, the control device 7 calculates the actual position of the reference plane 911 in the Z-axis direction based on the measurement result of the running error calibration member 91, and the actual position of the reference plane 911 in the Z-axis direction and the reference plane 911 The running error can be calculated by calculating the difference from the ideal position in the Z-axis direction.

After the running error is calculated, the control device 7 may control the movement of at least one of the processing head 2 and the stage 41 so as to offset the calculated running error. For example, the control device 7 controls the processing head 2 and the stage so that the processing head 2 can process the workpiece W in the same manner as when there is no running error even under the condition where the running error occurs. At least one movement of 41 may be controlled. For example, the control device 7 allows the measuring device 5 to measure the workpiece W (or any object to be measured) in the same manner as when no running error occurs even under a condition where a running error occurs. Movement of at least one of the processing head 2 and the stage 41 may be controlled so as to be possible. By performing the running error calibrating operation in this way, the head driving system 3 and the stage driving system 42 substantially operate the processing head 2 and the stage 41 based on the information on the measurement result of the running error calibrating member 91. Each will be moved. As a result, the machine tool 1a can process and measure the workpiece W without being affected by running errors.

The work W machined by the machining head 2 may be used as the running error calibrating member 91 . A running error calibrating operation performed by using the workpiece W machined by the machining head 2 as the running error calibrating member 91 will be described below with reference to FIG. FIG. 18 is a flow chart showing the flow of the running error calibrating operation performed by using the workpiece W machined by the machining head 2 as the running error calibrating member 91 .

As shown in FIG. 18, first, a workpiece W used for calibrating the running error is placed on the stage 41 (step S211). The work W placed on the stage 41 in step S211 may be a work for test machining used for calibrating running errors, or may be a work for forming a work using the machine tool 1a. It may be a work for the main processing to be used. After that, the tool changer 6 attaches the tool 23 to the spindle 21 (step S212). However, if the tool 23 is already attached to the spindle 21, the operation of step S212 may not be performed.

After that, the machining head 2 starts machining the workpiece W (step S213). While the machining head 2 is machining the workpiece W, the head drive system 3 moves the machining head 2 (step S213). That is, the processing head 2 processes the workpiece W during at least part of the period during which the head drive system 3 moves the processing head 2 .

In step S213, the head drive system 3 moves the processing head 2 along the direction intersecting the rotation axis RX of the main shaft 21. In the first embodiment, the head drive system 3 moves the machining head 2 along the X-axis direction intersecting the rotation axis RX of the spindle 21 . Therefore, the processing head 2 processes the workpiece W during at least part of the period during which the head drive system 3 moves the processing head 2 along the X-axis direction. In this case, the machining head 2 brings the upper surface of the workpiece W into contact with the tool 23, thereby performing machining for scraping off the upper surface of the workpiece W by a certain amount. On the other hand, in step S<b>213 , the head drive system 3 does not perform control for moving the processing head 2 along the Z-axis direction along the rotation axis RX of the main shaft 21 . That is, the head drive system 3 does not perform control for moving the Z slider member (not shown) to which the processing head 2 is attached along the Z guide member 35 .

After that, the tool changer 6 removes the tool 23 attached to the spindle 21 and attaches the measuring head 53 to the spindle 21 (step S214). After that, the measuring device 5 starts measuring the workpiece W (step S215). In particular, the measuring device 5 starts measuring the machined surface (for example, the upper surface) of the workpiece W machined by the machining head 2 (step S215).

The operation of step S215 differs from the operation of step S203 of FIG. 15, in which the running error calibration member 91 is the object of measurement, in that the workpiece W processed in step S213 is the object of measurement. Other features of the operation of step S215 may be the same as other features of the operation of step S203. Therefore, in step S215 as well, the head drive system 3 moves the machining head 2 along the X-axis direction intersecting the rotation axis RX of the main shaft 21, as in step S203. Therefore, the measuring device 5 measures the workpiece W (particularly, the surface to be machined) while the head drive system 3 is moving the machining head 2 along the X-axis direction.

However, in step S215, the measuring device 5 uses the galvanomirror 5222 to irradiate the measuring light ML to a plurality of parts of the workpiece W under the condition that the processing head 2 is positioned at a certain position. You may change the advancing direction of ML. For example, as shown in the upper part of FIG. 19, under the condition that the processing head 2 is positioned at the first position, the measurement light ML is applied to a plurality of parts (three parts in the example shown in FIG. 19) of the workpiece W. The traveling direction of the measurement light ML may be changed using the galvanomirror 5222 so that the . In the following description, for convenience of explanation, the measurement light beams ML that irradiate the three parts of the workpiece W are referred to as measurement light beams ML#a, measurement light beams ML#b, and measurement light beams ML#c, respectively. However, the measuring device 5 does not irradiate the workpiece W with the three different measurement beams ML#a, ML#b, and ML#c at the same time. For the sake of convenience, the three measurement light beams ML that irradiate the three regions with different W are simply referred to as the measurement light beam ML#a, the measurement light beam ML#b, and the measurement light beam ML#c. After that, as shown in the lower part of FIG. 19, even in a situation where the machining head 2 is positioned at the second position different from the first position as the machining head 2 moves, the measuring device 5 detects the workpiece. A galvanomirror 5222 may be used to change the traveling direction of the measurement light ML so that the measurement light ML#a, ML#b, and ML#c are sequentially irradiated onto a plurality of sites of W.

After that, the control device 7 calculates the running error based on the measurement result of the workpiece W in step S215 (step S216). The operation of calculating the running error based on the measurement result of the workpiece W will be described below with reference to FIGS. 20 and 21. FIG.

The upper diagram of FIG. 20 shows the workpiece W machined under conditions where there is no running error. In this case, the processing surface of the work W becomes a plane. This is because even if the machining head 2 moves in the X-axis direction, the distance in the Z-axis direction between the machining head 2 and the work W (in particular, the distance in the Z-axis direction between the tool 23 and the work W) is This is because they do not change. As a result, as shown in the lower part of FIG. 20, the position in the Z-axis direction of the machined surface of the work W obtained from the measurement result of the work W does not change depending on the measurement position. More specifically, as shown in the lower part of FIG. 20, the position of the processing surface irradiated with the measurement light ML#a in the Z-axis direction, the position of the processing surface irradiated with the measurement light ML#b in the Z-axis direction , and the position in the Z-axis direction of the processing surface irradiated with the measurement light ML#c do not change depending on the measurement position.

On the other hand, the upper diagram of FIG. 21 shows the workpiece W machined under conditions where there is a running error. In this case, the machined surface of the workpiece W may not be flat. Specifically, there is a possibility that the machined surface of the workpiece W will be a curved surface having undulations corresponding to the running error. This is because, due to running errors, the distance between the machining head 2 and the workpiece W in the Z-axis direction (in particular, the Z This is because the distance in the axial direction) fluctuates. As a result, as shown in the lower diagram of FIG. 21, the position in the Z-axis direction of the machined surface of the work W obtained from the measurement result of the work W changes depending on the measurement position. More specifically, as shown in the lower part of FIG. 21, the position of the processing surface irradiated with the measurement light ML#a in the Z-axis direction, the position of the processing surface irradiated with the measurement light ML#b in the Z-axis direction and at least one of the position in the Z-axis direction of the processing surface irradiated with the measurement light ML#c changes depending on the measurement position. Therefore, based on the measurement result of the workpiece W, the control device 7 can determine the position of the machining surface irradiated with the measurement light ML#a in the Z-axis direction, the position of the machining surface irradiated with the measurement light ML#b in the Z-axis direction. and the position in the Z-axis direction of the machined surface irradiated with the measurement light ML#c, and by comparing the calculated positions, the running error can be calculated.

(1-4) Technical Effects of the Machine Tool 1a of the First Embodiment As described above, the machine tool 1a uses the measuring device 5 having the measuring head 53 detachably attached to the spindle 21 to measure An object (for example, work W) is measured. Attachment and detachment of the measuring head 53 to and from the spindle 21 are automatically performed by the tool changer 6 . Therefore, the load on the operator for attaching and detaching the measuring head 53 to and from the spindle 21 is reduced. Here, since the measuring head 52 attached to the machining head 2 rather than the measuring head 53 detachably attached to the spindle 21 is provided with the galvanomirror 5222 which tends to occupy a large volume, the size of the measuring head 53 is determined by the tool. A size that can be handled by the exchange device 6 is possible.

In addition, the measurement device 5 can sequentially irradiate the measurement light ML onto multiple parts of the measurement object at a relatively high speed by changing the traveling direction of the measurement light ML using the galvanomirror 5222 . Therefore, the measuring device 5 can measure the properties (for example, positions) of a plurality of parts of the object to be measured at relatively high speed. As a result, the control device 7 can generate measurement data indicating the shape of the measurement object at a relatively high speed by integrating the positions of a plurality of parts of the measurement object.

Also, in the first embodiment, the measurement axis MX of the measurement device 5 (specifically, the optical axis of the fθ lens 5322) and the rotation axis RX of the main shaft 21 are coaxial. Therefore, the processing point PP (see FIG. 6), which is the intersection of the rotation axis RX and the work W, overlaps (that is, coincides with) the measurement point MP (see FIG. 6), which is the intersection of the measurement axis MX and the work W. ). For this reason, the machining head 2 uses a tool 23 attached to the spindle 21 to irradiate a portion of the workpiece W that can be irradiated with the measurement light ML by the measuring device 5 (that is, a portion of the workpiece W that can be measured by the measuring device 5). can be processed by Furthermore, the measuring device 5 can irradiate the portion of the work W that can be processed by the tool 23 attached to the spindle 21 with the measurement light ML (that is, can measure). Therefore, in the first embodiment, the machining range that can be processed by the machining head 2 and the measurement range that can be measured by the measuring device 5 match. Therefore, compared with the case where the machining range and the measurement range do not match, restrictions on the operation of the machine tool 1a are reduced. Specifically, for example, if part of the machining range is not included in the measurement range, the measuring device 5 cannot measure the part of the workpiece W machined by the machining head 2 (as a result, the above-described workpiece measuring operation The evaluation processing described above cannot be performed), and the measuring device 5 cannot measure the portion of the work W that the processing head 2 wants to process (as a result, the processing head 2 cannot measure the portion of the work W that is not included in the measurement range). part of it cannot be processed). Further, for example, if part of the measurement range is not included in the processing range, there is a possibility that the processing head 2 cannot process the portion of the workpiece W measured by the measuring device 5 . However, in the first embodiment, such restrictions are eliminated.

(2) Machine tool 1b of the second embodiment
Next, a machine tool 1 according to a second embodiment will be described. In addition, below, the machine tool 1 of 2nd Embodiment is called "the machine tool 1b." A machine tool 1b of the second embodiment differs from the machine tool 1a of the first embodiment in that it is provided with a measuring device 5b instead of the measuring device 5. FIG. Other features of machine tool 1b may be identical to other features of machine tool 1a.

The measuring device 5b of the second embodiment differs from the measuring device 5 of the first embodiment in that it includes a measuring head 52b instead of the measuring head 52. Furthermore, the measuring device 5b differs from the measuring device 5 in that the measuring head 53 attached to the spindle 21 may not be provided. Other features of the measuring device 5b may be the same as other features of the measuring device 5. FIG. Therefore, the measuring device 5b (in particular, the measuring head 52b) of the second embodiment will be described below with reference to FIG. FIG. 22 is a cross-sectional view showing the structure of the measuring device 5b (in particular, the measuring head 52b) of the second embodiment. In addition, in the following description, the same reference numerals are given to the constituent elements that have already been described, and the detailed description thereof will be omitted.

As shown in FIG. 22, the measurement head 52b of the second embodiment differs from the measurement head 52 of the first embodiment in that it includes an optical system 522b instead of the optical system 522. Other features of measuring head 52 b may be the same as other features of measuring head 52 .

The optical system 522b of the second embodiment includes an optical system 5221 and a galvanomirror 5222, like the optical system 522 of the first embodiment. On the other hand, the optical system 522b differs from the optical system 522 in that the mirror 5223 may not be provided. Furthermore, the optical system 522b differs from the optical system 522 in that it includes an fθ lens 5322 . In other words, the optical system 522b may be regarded as functioning as an optical system in which the optical systems 522 and 523 of the first embodiment are substantially integrated. Other features of optical system 522 b may be identical to other features of optical system 522 .

In the second embodiment, the measurement light ML emitted from the galvanomirror 5222 enters the fθ lens 5322 . The fθ lens 5322 irradiates the measurement target (for example, the work W) with the measurement light ML through the opening 5211 . Also, the return light RL from the object to be measured enters the fθ lens 5322 through the aperture 5211 . At this time, also in the second embodiment, similarly to the first embodiment, the distance between the optical system 522b (particularly, the fθ lens 5322 having the terminal optical element) that irradiates the measurement object with the measurement light ML and the measurement object , the optical path of the return light RL may overlap the optical path of the measurement light ML. As a result, the measurement device 5b of the second embodiment can measure the measurement object, like the measurement device 5 of the first embodiment.

In the second embodiment, the fθ lens 5322 is accommodated in the head housing 521 of the measurement head 52b attached to the processing head 2 at a position separated from the rotation axis RX of the main shaft 21 along the direction intersecting the rotation axis RX. . Therefore, in the second embodiment, the optical axis of the fθ lens 5322 is not coaxial with the rotation axis RX. The optical axis of the fθ lens 5322 is positioned away from the rotation axis RX along the direction intersecting the rotation axis RX. As described above, since the optical axis of the terminal optical element of the measuring device 5b is the measuring axis MX of the measuring device 5b, the measuring axis MX is not coaxial with the rotation axis RX in the second embodiment. The measurement axis MX is positioned away from the rotation axis RX along the direction intersecting the rotation axis RX.

In the second embodiment, the optical axis of the fθ lens 5322 (that is, the optical axis of the optical system 522b on the measurement object side, the measurement axis MX) is parallel to the rotation axis RX. However, as described in detail in the third embodiment, the optical axis of the fθ lens 5322 may intersect the rotation axis RX. The optical axis of the fθ lens 5322 may be in a twisted relationship with respect to the rotation axis RX. In other words, the measurement axis MX and the rotation axis RX may be non-coaxial.

The machine tool 1b may use such a measuring device 5b to perform the above-described coordinate matching operation, workpiece measurement operation, and running error calibration operation.

In the second embodiment, since the optical axis of the fθ lens 5322 (that is, the measurement axis MX) is not coaxial with the rotation axis RX of the main shaft 21, the measurement results of the object to be measured by the measurement device 5b include measurement errors. There is a possibility that Hereinafter, for convenience of explanation, the measurement error caused by the non-coaxiality of the measurement axis MX and the rotation axis RX will be referred to as "axis deviation error". Such an axis deviation error occurs when the measurement axis MX and the rotation axis RX, which should be parallel, are not actually parallel. The axis deviation error will be described below with reference to FIGS. 23 and 24. FIG.

FIG. 23 shows a measurement head 52b attached to the processing head 2 so that the measurement axis MX and the rotation axis RX are parallel (both parallel to the Z-axis of the stage coordinate system in the example shown in FIG. 23). ing. In this case, the control device 7 generates measurement data representing the work W based on the measurement result of the work W by the measuring device 5 . For example, in the stage coordinate system, the control device 7 can move a portion of the work W from the measurement device 5b (for example, from the measurement head 52b) along the measurement axis MX (that is, along the Z axis of the stage coordinate system). Measured data indicating that the distance is D1#1 is generated. That is, the control device 7 generates measurement data indicating the relative position of the workpiece W with respect to the measurement device 5b in the stage coordinate system. Furthermore, since the measuring device 5b (in particular, the measuring head 52b) is attached to the processing head 2, the measurement data substantially also indicates the relative position of the workpiece W with respect to the processing head 2 in the stage coordinate system. ing. For example, the measurement data indicates that a portion of the work W is separated from the processing head 2 by a distance D2#1 uniquely calculated according to the distance D1#1 along the rotation axis RX in the stage coordinate system. is shown.

On the other hand, FIG. 24 shows a measuring head 52b attached to the processing head 2 so that the measuring axis MX and the rotation axis RX are not parallel. In the example shown in FIG. 24, the rotation axis RX is parallel to the Z-axis of the stage coordinate system, while the measurement axis MX is tilted with respect to the Z-axis of the stage coordinate system. Also in this case, the control device 7 generates measurement data indicating the work W based on the measurement result of the work W by the measuring device 5 . For example, in the stage coordinate system, the control device 7 outputs measurement data indicating that the part where the workpiece W is located is separated from the measuring device 5b (for example, from the measuring head 52b) by a distance D1#2 along the measurement axis MX. to generate However, since the measurement axis MX is inclined with respect to the Z-axis of the stage coordinate system, the distance D1#2 calculated by the control device 7 is between the portion of the workpiece W in the stage coordinate system and the measurement device 5b. will differ from the actual distance D1#1 along the Z-axis of . Therefore, the control device 7 controls the position of the work W and the measurement device 5b even though the position of the work W and the measurement device 5b are separated by a distance D1#1 along the Z-axis in the stage coordinate system. are separated by a distance D1#2 along the Z axis. As a result, the measurement data indicates a position different from the actual position as the relative position of the workpiece W with respect to the machining head 2 . For example, in the stage coordinate system, the part where the work W is located and the machining head 2 are separated by a distance D2#1 along the Z-axis, but the measurement data shows that the part where the work W is located and the machining head 2 are separated from each other. It indicates that they are separated by a distance D2#2 (≠D2#1) that is uniquely calculated according to the distance D1#2 along the Z axis. As a result, as shown in FIG. 25 showing the apparent position of the work W calculated from the measurement results, the control device 7 generates measurement data indicating that the work W is positioned at a position different from the actual position. It may generate.

Therefore, in the second embodiment, the machine tool 1b may perform a shaft misalignment error calibration operation using the measurement result of the measuring device 5b in order to configure the shaft misalignment error. Below, referring to FIG. 26, the shaft misalignment error calibration operation will be described. FIG. 26 is a flow chart showing the flow of the shaft misalignment error calibration operation.

As shown in FIG. 26, the machine tool 1b first performs the running error calibration operation described with reference to FIG. 15 in order to perform the axis deviation error calibration operation. As a result, the running error of the machining head 2 is calculated. As described above, after the running error is calculated, the control device 7 controls movement of at least one of the machining head 2 and the stage 41 so as to offset the calculated running error. However, the measurement result of the running error calibration member 91 for calculating the running error still includes the axis deviation error. Therefore, the machine tool 1b further performs the operations described below.

Specifically, first, the work W used for calibrating the axial misalignment error is placed on the stage 41 (step S301b). The work W placed on the stage 41 in step S301b may be a work for test machining used to calibrate the axis misalignment error, or may be a work for forming a work using the machine tool 1b. It may be a work for main processing used for. After that, the tool changer 6 attaches the tool 23 to the spindle 21 (step S302b). However, if the tool 23 is already attached to the spindle 21, the operation of step S302b may not be performed.

After that, the machining head 2 starts machining the workpiece W (step S303b). While the machining head 2 is machining the workpiece W, the head drive system 3 moves the machining head 2 (step S303b). That is, the processing head 2 processes the workpiece W during at least part of the period during which the head drive system 3 moves the processing head 2 . The operation of step S303b may be the same as the operation of step S213 in FIG. 18 described above. Therefore, detailed description of step S303b is omitted. However, in step S213, the head driving system 3 moves the processing head 2 so as to cancel out the running error calculated in the running error calibrating operation.

After that, another measuring device different from the measuring device 5 starts measuring the workpiece W (step S304b). Another measuring device different from the measuring device 5 may be a measuring device outside the machine tool 1b. In this case, the workpiece W processed in step S303b may be transported from the stage 41 to another measuring device, and then the other measuring device may start measuring the workpiece W. However, if the machine tool 1 is equipped with another measuring device, the other measuring device may measure the workpiece W placed on the stage 41 .

In step S304b, another measuring device starts measuring the machined surface (for example, the upper surface) of the workpiece W machined by the machining head 2. The operation of step S304b may be the same as the operation of step S215 in FIG. 18 described above. Therefore, detailed description of step S304b is omitted.

After that, the control device 7 calculates the axis deviation error based on the measurement result of the workpiece W by another measuring device in step S304b (step S305b). Hereinafter, the operation of calculating the axis deviation error based on the measurement result of the workpiece W by another measuring device will be described with reference to FIG. 27 .

FIG. 27 shows the position of the machined surface of the work W in the Z-axis direction calculated from the measurement results of the work W obtained under the condition that there is no axial misalignment error (that is, the axis misalignment error is zero). showing. Furthermore, FIG. 27 shows the position in the Z-axis direction of the machined surface of the workpiece W calculated from the measurement results of the workpiece W acquired under the condition where there is an axis deviation error (that is, the axis deviation error is not zero). It is indicated by a solid line. As shown in FIG. 27, when there is no axial deviation error, the position of the machined surface of the workpiece W in the Z-axis direction does not change depending on the measurement position. This is because when the workpiece W is machined in step S303b of FIG. 26, the running error has already been canceled, so if there is no axial deviation error, the machining head 2 must move in the X-axis direction (that is, move along the X-axis). This is because the machined surface of the work W also becomes flat as a result of parallel movement along the surface. On the other hand, as shown in FIG. 27, when there is an axis deviation error, the position of the machined surface of the workpiece W in the Z-axis direction changes depending on the measurement position. This is because, although the running error has already been canceled when the work W is machined in step S303b of FIG. 26, the axis misalignment error is not yet canceled, so the measurement data still contains the axis misalignment error. because there is Therefore, the control device 7 calculates the actual position of the machining surface in the Z-axis direction based on the measurement result of the workpiece W, and calculates the actual position of the machining surface in the Z-axis direction and the ideal position of the machining surface ( That is, by calculating the difference (in the example shown in FIG. 27, the difference between the dotted line and the solid line) from the position of the machined surface when the machined surface is flat, the axis deviation error can be calculated.

After the axis misalignment error is calculated, the control device 7 may control the movement of at least one of the processing head 2 and the stage 41 so as to offset the calculated axis misalignment error. For example, the control device 7 controls the processing head 2 so that the processing head 2 can process the workpiece W in the same manner as when there is no axial misalignment error even under a situation where an axial misalignment error occurs. and a process of controlling the movement of at least one of the stage 41 . For example, the control device 7 causes the measuring device 5 to measure the work W (or any object to be measured) in the same manner as when no axis misalignment error occurs, even under a situation where an axis misalignment error occurs. A process for controlling the movement of at least one of the processing head 2 and the stage 41 may be included. By performing the axis deviation error calibrating operation in this way, the head driving system 3 and the stage driving system 42 can substantially provide information related to the measurement results of the running error calibration member 91 and the measurement results of the processed workpiece W. Based on the information, the processing head 2 and the stage 41 are moved. As a result, the machine tool 1b can process and measure the workpiece W without being affected by the axis deviation error.

As described above, the machine tool 1b uses the measuring device 5b having the measuring head 52b attached to the machining head 2 to measure the object to be measured (for example, the workpiece W). Therefore, it becomes unnecessary to attach and detach some components of the measuring device 5 to and from the spindle 21 .

Further, similarly to the measuring device 5, the measuring device 5b changes the direction of travel of the measuring light ML using the galvanomirror 5222, thereby transmitting the measuring light ML to multiple parts of the object to be measured at a relatively high speed. They can be irradiated sequentially. Therefore, similarly to the measuring device 5, the measuring device 5b can measure the characteristics (for example, positions) of a plurality of parts of the measurement object at relatively high speed. As a result, the control device 7 can generate measurement data indicating the shape of the measurement object at a relatively high speed by integrating the positions of a plurality of parts of the measurement object.

Incidentally, in the second embodiment, the fθ lens 5322 included in the measurement head 52b may be replaceable with another optical member. As an example, as shown in FIG. 28, the fθ lens 5322 may be replaceable with the mirror 5223 described in the first embodiment. In this case, the measurement head 53 described in the first embodiment may be attached to the spindle 21 . As a result, the measuring device 5b in the second embodiment can function as the measuring device 5 in the first embodiment. In other words, when the optical system 522b of the measurement head 52b includes the fθ lens 5322, the measurement head 52b (particularly, the optical system 522b) functions as a device that emits the measurement light ML toward the object to be measured. good too. In other words, when the optical system 522b of the measurement head 52b includes the fθ lens 5322, the measurement head 52b (in particular, the optical system 522b) directs the measurement light ML toward the measurement object without the measurement head 53. It may function as a device that ejects On the other hand, when the optical system 522b of the measurement head 52b includes a mirror 5223 instead of the fθ lens 5322, the measurement head 52b (in particular, the optical system 522b) emits the measurement light ML toward the measurement head 53. It may function as a device for In other words, when the optical system 522b of the measurement head 52b includes the mirror 5223 instead of the fθ lens 5322, the measurement head 52b (especially the optical system 522b) measures the measurement light ML via the measurement head 53. It may function as a device that injects toward an object. In addition to the fθ lens 5322, other optical members included in the measurement head 52b may be replaceable.

Also, as will be described later in the first modified example, the measurement head 53 attached to the spindle 21 may be replaced. In this case, depending on the type of the measurement head 53 attached to the spindle 21, it may be determined whether or not the fθ lens 5322 (or other optical member) included in the measurement head 52b should be replaced. For example, when the first type measurement head 53 is attached to the spindle 21, the fθ lens 5322 may not be replaced (that is, the optical system 532 may include the fθ lens 5322), When the second type of measurement head 53 is attached to the spindle 21, the fθ lens 5322 may be replaced (that is, the optical system 532 may be replaced with another optical member instead of the fθ lens 5322). can also be used).

(3) Machine tool 1c of the third embodiment
Next, a machine tool 1 according to a third embodiment will be described. In addition, below, the machine tool 1 of 3rd Embodiment is called "the machine tool 1c." A machine tool 1c of the third embodiment differs from the machine tool 1b of the second embodiment in that it includes a measuring device 5c instead of the measuring device 5b. Other features of machine tool 1c may be identical to other features of machine tool 1b.

The measuring device 5c of the third embodiment differs from the measuring device 5b of the second embodiment in that it includes a measuring head 52c instead of the measuring head 52b. Other features of the measuring device 5c may be the same as other features of the measuring device 5b. Therefore, the measuring device 5c (in particular, the measuring head 52c) of the third embodiment will be described below with reference to FIG. FIG. 29 is a cross-sectional view showing the structure of a measuring device 5c (in particular, a measuring head 52c) according to the third embodiment.

As shown in FIG. 29, the measurement head 52c of the third embodiment has the fθ It differs from the measurement head 52b of the second embodiment in which the optical axis of the lens 5322 (that is, the measurement axis MX) does not have to intersect the rotation axis RX. Other features of measuring head 52c may be the same as other features of measuring head 52b.

A machine tool 1c equipped with such a measuring device 5c can enjoy the effects that the machine tool 1b of the above-described second embodiment can enjoy.

Especially in the third embodiment, similarly to the first embodiment, the processing point PP, which is the intersection of the rotation axis RX and the work W, overlaps the measurement point MP, which is the intersection of the measurement axis MX and the work W. Therefore, in the third embodiment, similarly to the first embodiment, it is possible to enjoy the effect that the restrictions on the operation of the machine tool 1c are reduced. Furthermore, in the third embodiment, the measuring device 5c can measure the processing point PP, which is the intersection of the rotation axis RX and the workpiece W. If the tool 23 attached to the spindle 21 can machine the machining point PP, the measuring device 5c may measure the tool 23 attached to the spindle 21 . For example, the measuring device 5c may measure the position of the tool 23 attached to the spindle 21. FIG. For example, the measuring device 5c may measure the shape of the tool 23 attached to the spindle 21. FIG. However, in the third embodiment, the processing point PP and the measurement point MP do not have to overlap.

Furthermore, in the third embodiment, since the machining point PP and the measurement point MP overlap, the possibility of the axial misalignment error described in the second embodiment occurring is low. Therefore, in the third embodiment, the machine tool 1c does not need to perform the shaft misalignment error calibration operation described in the second embodiment. However, in a situation where the processing point PP and the measurement point MP should originally overlap, the processing point PP and the measurement point MP do not overlap due to at least one of the mounting error of the measuring head 52c and the mounting error of the optical system 522b. If not, the above-described axis misalignment error may occur also in the third embodiment. Therefore, the machine tool 1c may perform the shaft misalignment error correction operation described in the second embodiment.

Incidentally, as shown in FIG. 30A showing the machining head 2 for machining the workpiece W, the machining head 2 is arranged such that the rotation axis RX intersects (typically, orthogonally) the surface of the workpiece W. W may be processed. On the other hand, as shown in FIG. 30(b) showing a measuring device 5c (in particular, a measuring head 52c) that measures the work W, the measuring device 5c has a measurement axis MX that intersects the surface of the work W (typically may be perpendicular to each other). On the other hand, in the third embodiment, the rotation axis RX and the measurement axis MX intersect (that is, they are not parallel). no longer perpendicular to the surface. Similarly, when the measurement axis MX is perpendicular to the surface of the work W, the rotation axis RX is no longer perpendicular to the surface of the work W. For this reason, in the third embodiment, the positional relationship between the machining head 2 and the workpiece W is rotated during at least a part of the machining period during which the machining head 2 machining the workpiece W, as shown in FIG. The head drive system 3 may move the processing head 2 and/or the stage drive system 42 may move the stage 41 so that the axis RX is orthogonal to the surface of the workpiece W in the first relationship. On the other hand, during at least part of the measurement period during which the measuring device 5c measures the workpiece W, the positional relationship between the machining head 2 to which the measuring head 52c is attached and the workpiece W is as shown in FIG. The head drive system 3 may move the processing head 2 so that the measurement axis MX is perpendicular to the surface of the workpiece W (that is, a second relationship different from the first relationship), and/or the stage The drive system 42 may move the stage 41 .

(4) Machine tool 1d of the fourth embodiment
Next, a machine tool 1 according to a fourth embodiment will be described. In addition, below, the machine tool 1 of 4th Embodiment is called "machine tool 1d." A machine tool 1d of the fourth embodiment differs from the machine tool 1a of the first embodiment in that it is provided with a measuring device 5d instead of the measuring device 5. FIG. Other features of machine tool 1d may be identical to other features of machine tool 1a. Therefore, the measurement device 5d of the fourth embodiment will be described below with reference to FIG. FIG. 31 is a cross-sectional view showing the structure of the measuring device 5d of the fourth embodiment.

As shown in FIG. 31, the measuring device 5d of the fourth embodiment differs from the measuring device 5 of the first embodiment in the following points. Other features of measuring device 5d may be the same as other features of measuring device 5, except as described below.

First, as shown in FIG. 31, the measuring device 5d differs from the measuring device 5 in that the measuring head 52 may not be provided. The measuring device 5 d differs from the measuring device 5 in that an optical system 522 d including an optical system 5221 and a galvanomirror 5222 included in the measuring head 52 is accommodated inside the processing head 2 . For example, the optical system 522d may be housed inside the head housing 22 . For example, the optical system 522d may be housed inside the main shaft 21 . Although the optical axis of the optical system 522d is coaxial with the rotation axis RX, it is not necessarily coaxial.

When the optical system 522d is accommodated inside the processing head 2, an optical path space 213d used as the optical paths of the measurement light ML and the return light RL may be formed inside the processing head 2. For example, the spindle 21 may include a coolant (for example, cutting oil, also called cutting fluid) for cooling the tool 23, reducing friction between the tool 23 and the workpiece W, and/or washing away cutting waste and the like. ) is formed to the tool 23 . At least part of this coolant channel may be used as at least part of the optical path space 213d. However, the optical path space 213d may be formed separately from the coolant channel. The axis extending along the optical path space 213d is coaxial with the rotation axis RX, but it is not necessarily coaxial.

Furthermore, as shown in FIG. 31, the measuring device 5d differs from the measuring device 5 in that it has a measuring head 53d instead of the measuring head 53. The measurement head 53d differs from the measurement head 53 in that it has an optical system 532d instead of the optical system 532. FIG. The optical system 532d differs from the optical system 532 in that the mirror 5321 may not be provided. However, when the optical axis of the optical system 532 d and the optical axis of the optical system 522 d are not coaxial, the optical system 532 d may include the mirror 5321 and the optical system 522 d may include the mirror 5223 .

In the measurement apparatus 5d of the fourth embodiment, the measurement light ML emitted from the optical system 522d enters the optical system 532d inside the measurement head 53 via the optical path space 213d. Therefore, the shank 530 of the measurement head 53d may be formed with an optical path space 5301d through which the measurement light ML entering from the optical path space 213d can pass. Further, the head housing 531 of the measurement head 53d may be formed with an opening 5313d through which the measurement light ML entering from the optical path space 5301d formed in the shank 530 can pass. Return light RL from the work W (or any object to be measured) enters the optical system 522d from the measurement head 53d via the opening 5313d, the optical path space 5301d, and the optical path space 213d.

A machine tool 1d equipped with such a measuring device 5d can enjoy the effects that the machine tool 1a of the first embodiment described above can enjoy. In addition, in the fifth embodiment, the

mirrors

5223 and 5321 of the first embodiment (that is, the measurement light ML emitted from the optical system 522 is relayed to the optical system 532 and the return light RL emitted from the optical system 532 is (optical member for relaying to the optical system 522) is not necessarily required, the configuration of the measuring device 5d is further simplified.

(5) Machine tool 1e of the fifth embodiment
Next, a machine tool 1 according to a fifth embodiment will be described. In addition, below, the machine tool 1 of 5th Embodiment is called "machine tool 1e." A machine tool 1e of the fifth embodiment differs from the machine tool 1d of the fourth embodiment in that a measuring device 5e is provided instead of the measuring device 5d. Other features of machine tool 1e may be the same as other features of machine tool 1d. Therefore, the measuring device 5e of the fifth embodiment will be described below with reference to FIG. FIG. 32 is a cross-sectional view showing the structure of the measuring device 5e of the fifth embodiment.

As shown in FIG. 32, the measuring device 5e of the fifth embodiment differs from the measuring device 5d of the fourth embodiment in the following points. Other features of measuring device 5e may be the same as other features of measuring device 5d, except as described below.

First, as shown in FIG. 31, the measuring device 5e is different from the measuring device 5d in that the optical system 522d including the optical system 5221 and the galvanomirror 5222 does not have to be housed inside the processing head 2. different in that respect. In the example shown in FIG. 32 , the optical system 522d is arranged outside the processing head 2 while being accommodated in the head housing 521 . In this case, a measurement head 52e including an optical system 522d and a head housing 521 may be attached to the processing head 2 in the same manner as the measurement head 52 of the first embodiment. However, the optical system 522d may not be housed in the head housing 521. Although the optical axis of the optical system 522d is coaxial with the rotation axis RX, it is not necessarily coaxial.

Also in the fifth embodiment, similarly to the fourth embodiment, the measurement light ML emitted from the optical system 522d enters the measurement head 53d via the optical path space 213d, the optical path space 5301d and the aperture 5313d. Furthermore, the return light RL from the workpiece W (or any object to be measured) enters the optical system 522d from the measurement head 53d via the opening 5313d, the optical path space 5301d and the optical path space 213d.

A machine tool 1e equipped with such a measuring device 5e can enjoy the effects that the machine tool 1d of the above-described fourth embodiment can enjoy.

Note that the measurement device 5e may include a beam expander in order to adjust the beam diameter of the measurement light ML with respect to the size of the XY section of the optical path space 213d (for example, the diameter of the XY section). The beam expander may be included in the optical system 5221, may be arranged between the optical system 5221 and the galvanomirror 5222, or may be arranged in the optical path space 213d. Further, another beam expander is arranged in the optical path space 213d in order to readjust the adjusted beam diameter to the original beam diameter after adjusting the beam diameter with respect to the size of the XY section of the optical path space 213d. may The same applies to the fourth embodiment in which the measurement light ML propagates through the optical path space 213d.

Note that FIG. 32 shows a specific example in which at least part of the coolant flow path 214e for supplying coolant is used as part of the optical path space 213d. That is, FIG. 32 shows an optical path space 2131d that is at least part of the coolant channel 214e and an optical path space 2132d that connects the coolant channel 214e and the optical system 522d (that is, upstream of the optical path space 2131d). and an optical path space 2132d located on the side (the side closer to the optical system 522d). In this case, the machine tool 1e may include a coolant supply device 81e, a gas supply device 82e, a valve 83e, and a valve 83e. The coolant supply device 81e supplies coolant to the coolant flow path 214e via a coolant supply pipe 85e connected to the coolant flow path 214e. The gas supply device 82e supplies gas to the optical path space 213d through a gas supply pipe 86e connected to the optical path space 2132d. The gas supplied by the gas supply device 82e may be used to clean the coolant flow path 214e (for example, remove coolant adhering to the coolant flow path 214e). The valve 83e is arranged between a connection point 851e where the coolant supply pipe 85e is connected to the coolant flow path 214e and a connection point 861e where the gas supply pipe 86e is connected to the optical path space 2132d. The valve 84e is arranged upstream of the connection point 861e in the optical path space 2132d.

Both the

valves

83e and 84e may be closed during the machining period in which the machining head 2 is machining the workpiece W. In this case, the coolant supply device 81e can supply coolant to the coolant flow path 214e through the coolant supply pipe 85e. Furthermore, since the valve 83e is closed, the coolant supplied to the coolant channel 214e does not flow into the gas supply device 82e and the optical system 522d through the optical path space 2132d. After that, after the machining head 2 finishes machining the workpiece W, the valve 83e may be opened and the valve 84e may be closed. In this case, the gas supply device 82e can supply gas to the optical path space 213d (in particular, the coolant flow path 214e) through the gas supply pipe 86e. As a result, the coolant channel 214e is cleaned. After that, both

valves

83e and 84e may be opened during the measurement period in which the measurement device 5e measures the workpiece W. As a result, the measurement light ML emitted from the optical system 522d irradiates the work W through the optical path space 213d, and the return light RL from the work W enters the optical system 522d through the optical path space 213d. Since the optical path space 213d (particularly the coolant channel 214e) is cleaned by the gas supplied from the gas supply device 82e before the measuring device 5e measures the workpiece W, the coolant remained in the optical path space 213d (particularly the coolant channel 214e). Prevents measurement errors caused by coolant. Cutting waste and cutting fluid adhering to the workpiece W may be removed by the gas supplied from the gas supply device 82e to the optical path space 213d.

Also in the fourth embodiment, when at least part of the coolant flow path 214e is used as part of the optical path space 213d, the machine tool 1d includes the coolant supply device 81e and the gas A supply device 82e, a valve 83e, and a valve 83e may be provided.

(6) Machine tool 1f of the sixth embodiment
Next, a machine tool 1 according to a sixth embodiment will be described. In addition, below, the machine tool 1 of 6th Embodiment is called "machine tool 1f." The machine tool 1f of the sixth embodiment differs from the machine tool 1e of the fifth embodiment in that it is equipped with a measuring device 5f instead of the measuring device 5e. Other features of machine tool 1f may be the same as other features of machine tool 1e. Therefore, the measuring device 5f of the sixth embodiment will be described below with reference to FIG. FIG. 33 is a cross-sectional view showing the structure of the measuring device 5f of the sixth embodiment.

As shown in FIG. 33, the measuring device 5f of the sixth embodiment differs from the measuring device 5e of the fifth embodiment in the following points. Other features of measuring device 5f may be the same as other features of measuring device 5e, except as described below.

First, as shown in FIG. 33, in the measuring device 5f, the optical path space 2132d on the upstream side of the coolant flow path 214e is different from the optical path space 21321d extending along the rotation axis RX of the main shaft 21 in comparison with the measuring device 5e. , and an optical path space 21322d extending along a direction intersecting the rotation axis RX. In this case, the measurement light ML emitted from the optical system 522d enters the optical path space 21322d, enters the optical path space 21321d via the optical path space 21322d, and enters at least a part of the coolant channel 214e via the optical path space 21321d. It may enter the corresponding optical path space 2131d. Further, the return light RL from the workpiece W enters the optical path space 2131d from the measuring head 53, enters the optical path space 21321d through the optical path space 2131d, enters the optical path space 21322d through the optical path space 21321d, and enters the optical path space 21322d. It may enter the optical system 522d via 21322d.

When the optical path space 2132d includes the optical path space 21321d and the optical path space 21322d, a mirror 215f may be arranged at the connection point 2133d where the optical path space 21321d and the optical path space 21322d are connected. The mirror 215f rotates the traveling direction of the measurement light ML incident on the mirror 215f from the optical path space 21322d from the direction in which the optical path space 21322d extends (that is, the direction intersecting the rotation axis RX) to the direction in which the optical path space 21321d extends (that is, rotates). direction along the axis RX), and reflects the measurement light ML toward the optical path space 21321d. Further, the mirror 215f changes the traveling direction of the return light RL incident on the mirror 215f from the optical path space 21321d from the direction in which the optical path space 21321d extends (that is, the direction along the rotation axis RX) to the direction in which the optical path space 21322d extends (that is, , a direction intersecting the rotation axis RX), the return light RL is reflected toward the optical path space 21322d. As a result, even when the optical path space 2132d includes the optical path space 21321d and the optical path space 21322d, the measurement device 5f irradiates the workpiece W (or any measurement object) with the measurement light ML and returns the light RL can be detected.

A machine tool 1f equipped with such a measuring device 5f can enjoy the effects that the machine tool 1f of the fifth embodiment described above can enjoy. Furthermore, in the sixth embodiment, the optical path space 2132d includes not only the optical path space 21321d extending along the rotation axis RX, but also the optical path space 21322d extending along the direction intersecting the rotation axis RX. Therefore, in the sixth embodiment, compared with the fifth embodiment, the optical system 522d can be arranged even when there is no space for arranging the optical system 522d above the processing head 2. FIG. For example, the optical system 522d can be arranged on the side of the processing head 2. For this reason, the optical system 522d may be arranged in the arrangement mode described in the fifth embodiment, depending on the position with respect to the processing head 2 of the space in which the optical system 522d can be arranged in the periphery of the processing head 2. They may be arranged in the arrangement mode described in the sixth embodiment.

Note that in FIG. 33, a connection point 851e at which a coolant supply pipe 85e to which the coolant supply device 81e supplies coolant and the coolant flow path 214e are connected is located inside the main shaft 21. As shown in FIG. In this case, considering that the main shaft 21 is rotatable, the coolant supply pipe 85e and the coolant flow channel 214e (specifically, the pipe forming the coolant flow channel) are connected by a rotary joint 2161f at a connection point 851e. may be connected via However, the connection point 851e does not have to be positioned inside the spindle 21 .

In addition, in FIG. 33, a connection point 2133d where the optical path space 21322d is connected to the optical path space 21321d is located inside the main shaft 21 . In this case, considering that the main shaft 21 is rotatable, the optical path space 21322d and the optical path space 21321d (specifically, the piping forming the optical path space 21322d and the piping forming the optical path space 21322d) are connected at the connection point 2133d. may be connected via a rotary joint 2162f at . However, the connection point 2133 d does not have to be located inside the spindle 21 .

(7) Machine tool 1g of the seventh embodiment
Next, a machine tool 1 according to a seventh embodiment will be described. In addition, below, the machine tool 1 of 7th Embodiment is called "the machine tool 1g." A machine tool 1g of the seventh embodiment differs from the machine tool 1a of the first embodiment in that it is provided with a measuring device 5g instead of the measuring device 5. FIG. Other features of machine tool 1g may be the same as other features of machine tool 1a.

A measuring device 5g of the seventh embodiment differs from the measuring device 5 of the first embodiment in that a measuring head 53g is provided instead of the measuring head 53. Furthermore, the measuring device 5g differs from the measuring device 5 in that the measuring head 52 attached to the processing head 2 may not be provided. Other features of the measuring device 5g may be the same as other features of the measuring device 5. FIG. Therefore, the measuring device 5g (in particular, the measuring head 53g) of the seventh embodiment will be described below with reference to FIG. FIG. 34 is a cross-sectional view showing the structure of a measuring device 5g (in particular, a measuring head 53g) according to the seventh embodiment.

As shown in FIG. 34, the measurement head 53g of the seventh embodiment differs from the measurement head 53 of the first embodiment in that it includes an optical system 532g instead of the optical system 532. Other features of the measuring head 53 g may be the same as other features of the measuring head 53 .

An optical system 532g of the seventh embodiment includes an fθ lens 5322, like the optical system 532 of the first embodiment. On the other hand, the optical system 532g differs from the optical system 532 in that the mirror 5321 may not be provided. In this case, the opening 5311 (see FIG. 6) through which the measurement light ML emitted from the measurement head 52 can pass may not be formed in the head housing 531 . Furthermore, the optical system 532g differs from the optical system 532 in that it includes an optical system 5221 and a galvanomirror 5222 . In other words, the optical system 532g may be regarded as functioning as an optical system in which the optical systems 522 and 523 of the first embodiment are substantially integrated. Other features of optical system 532 g may be identical to other features of optical system 532 .

A machine tool 1g equipped with such a measuring device 5g can enjoy the effects that the machine tool 1a of the above-described first embodiment can enjoy.

(8) Modifications Subsequently, modifications that can be employed in at least one of the machine tools 1a of the first embodiment to the machine tool 1g of the seventh embodiment will be described.

(8-1) First Modification In the first modification, the measurement head 53 attached to the main shaft 21 may be replaceable by utilizing the fact that the measurement head 53 is detachable from the main shaft 21. . Therefore, the first modification includes the machine tool 1a of the first embodiment in which the measuring head 53 is attached to the spindle 21, and the machine tool 1d of the fourth embodiment in which the measuring head 53d is attached to the spindle 21 to the machine tool 1d of the sixth embodiment. It can be adopted in at least one of the machine tools 1f.

In the description of the modified examples, for convenience of explanation, unless otherwise specified, the "measurement head 53" refers not only to the measurement head 53 of the first embodiment, but also to those of the fourth to sixth embodiments. The measuring head 53d is also meant. Similarly, in the description of the modifications, for convenience of description, unless otherwise specified, the “optical system 532” refers not only to the optical system 532 of the first embodiment, but also to the optical system 532 of the fourth to sixth embodiments. optical system 532d. Similarly, in the description of the modifications, for convenience of explanation, unless otherwise specified, the “measuring device 5” refers not only to the measuring device 5 of the first embodiment, but also to the measuring device 5d of the fourth embodiment. It shall also mean the measuring device 5f of the sixth embodiment.

One measuring head 53 selected from among a plurality of types of measuring heads 53 may be attached to the spindle 21 . For example, the tool changer 6 may attach the first type measuring head 53 to the spindle 21 . For example, the tool changer 6 removes the first type measuring head 53 from the spindle 21 to which the first type measuring head 53 is attached, and then removes a second type measuring head 53 different from the first type measuring head 53 . type of measuring head 53 may be attached to the spindle 21 . Note that the operator of the machine tool 1 may manually perform at least one of attachment and detachment of one measuring head 53 of the plurality of types of measuring heads 53 to and from the spindle 21 . An operator of the machine tool 1 manually performs at least one of attaching and detaching the first type measuring head 53 to and from the spindle 21 and attaching and detaching the second type measuring head 53 to and from the spindle 21. may

A plurality of types of measurement heads 53 may each include a plurality of different types of optical systems 532 . An example of a plurality of types of measurement heads 53 that can be attached to the spindle 21 will be described below with reference to FIGS. 35(a) to 45(b). 35(a) to 45(b) are cross-sectional views showing an example of the measurement head 53. FIG.

As shown in FIGS. 35(a) and 35(b), the plurality of types of measurement heads 53 attachable to the spindle 21 may include at least two measurement heads 53#1. The at least two measurement heads 53#1 may each include at least two optical systems 532#1 in which the fθ lens 5322 has different optical characteristics. In this case, the tool changer 6 may attach the measurement head 53#1 including the fθ lens 5322 with optical characteristics suitable (typically, optimal) for measuring the measurement object to the spindle 21. . As a result, the measurement device 5 can appropriately measure the measurement object.

An example of the optical characteristics of the fθ lens 5322 is at least one of the f-number and focal length. For example, as shown in FIGS. 35(a) and 35(b), the plurality of types of measurement heads 53 that can be attached to the spindle 21 include an fθ lens 5322 having a first f-number f#1. A measuring head 53#11 having a system 532#11 and an optical system 532#12 including an fθ lens 5322 having a second value f#2 different from the first value f#1. #12. Incidentally, FIG. 35(a) shows the measuring head 53#1 that can be used in the first embodiment, and FIG. 35(b) shows the measuring head 53 that can be used in the fourth to sixth embodiments. #1 is shown. In this case, the tool changer 6 determines the distance between the object to be measured and the measuring head 53 (for example, the distance between the fθ lens 5322 and the object to be measured; this distance may be called a working distance). A measurement head 53 # 1 having an fθ lens 5322 having an f value corresponding to θ may be attached to the spindle 21 . As a result, even when the distance between the measurement object and the measurement head 53 changes, the measurement device 5 can appropriately measure the measurement object. In the above description, the f value of the fθ lens 5322 may be replaced with the exit-side numerical aperture of the fθ lens 5322 .

Next, as shown in FIGS. 36(a) and 36(b), the plurality of types of measurement heads 53 attachable to the spindle 21 may include a measurement head 53#2. The measurement head 53#2 does not need to include the fθ lens 5322. If the measurement head 53 # 2 is attached to the spindle 21 , the measurement device 5 does not have to include the galvanomirror 5222 . Conversely, if the measuring device 5 does not have the galvanomirror 5222 , the tool changer 6 may attach the measuring head 53 # 2 that does not have the fθ lens 5322 to the spindle 21 .

Incidentally, FIG. 36(a) shows the measuring head 53#2 that can be used in the first embodiment, and FIG. 36(b) shows the measuring head 53 that can be used in the fourth to sixth embodiments. #2 is shown. As shown in FIG. 36( a ), the measurement head 53 # 2 that can be used in the first embodiment may have an optical system 532 # 2 that has a mirror 5321 . On the other hand, as shown in FIG. 36(b), the measurement head 53#2 that can be used in the fourth to sixth embodiments does not have to include the optical system 532. FIG. In this case, the measuring head 53#2 does not have to be attached to the spindle 21 in the first place. The measuring device 5 may measure the object to be measured while the measuring head 53#2 is not attached to the spindle 21. FIG.

Next, as shown in FIGS. 37(a) and 37(b), the multiple types of measurement heads 53 that can be attached to the spindle 21 may include a measurement head 53#3. The measurement head 53 # 3 may have an optical system 532 # 3 with a mirror 5323 . The mirror 5323 is an optical member capable of emitting (in this case, reflecting) the measurement light ML emitted from the fθ lens 5322 in a direction intersecting the optical axis of the fθ lens 5322 . Furthermore, the mirror 5323 is an optical member capable of emitting (reflecting in this case) the return light RL from the object to be measured in a direction along the optical axis of the fθ lens 5322 . The mirror 5323 shown in FIGS. 37A and 37B directs the measurement light ML emitted from the fθ lens 5322 in a direction orthogonal to the optical axis of the fθ lens 5322. However, the mirror 5323 lens 5322 may be arranged so that the measurement light ML emitted from the f.theta. Further, the angle of the mirror 5323 may be changed so that the direction in which the measurement light ML emitted from the fθ lens 5322 is bent (the direction in which the measurement light ML is emitted from the mirror 5323) can be changed. For example, the angle of the mirror 5323 may be changed by a driving device such as a motor. Although the mirror 5323 shown in FIGS. 37(a) and 37(b) has a planar reflective surface, it may have a reflective surface of another shape (for example, conical or pyramidal). good. Note that the mirror 5323 may be regarded as bending the respective optical paths of the measurement light ML and the return light RL. Therefore, the mirror 5323 may be called an optical path bending member. Incidentally, the measurement head 53#3 may be provided with not only the mirror 5323 but also other existing members capable of bending the optical path as the optical path bending member. Incidentally, FIG. 37(a) shows the measuring head 53#3 that can be used in the first embodiment, and FIG. 37(b) shows the measuring head 53 that can be used in the fourth to sixth embodiments. #3 is shown.

The measurement light ML emitted from the mirror 5323 enters the object to be measured through the opening 5312 formed in the head housing 531 . Also, the return light RL from the object to be measured enters the mirror 5323 through the opening 5312 . However, since the direction of travel of the measurement light ML and the return light RL between the mirror 5323 and the object to be measured is a direction that intersects the optical axis of the fθ lens 5322, the aperture 5312 can be formed by, for example, the head housing 531 may be formed on the side surface of the

An example of a scene where the measurement head 53#3 is used is a scene of measuring a surface of an object to be measured that is parallel or inclined to the optical axis of the fθ lens 5322. In the example shown in FIGS. 37(a) and 37(b), since the optical axis of the fθ lens 5322 is parallel to the Z-axis, the measurement head 53#3 can be positioned parallel to or along the Z-axis, for example. It may be used to measure a surface of a measurement object that is tilted with respect to the object. Therefore, when the measuring device 5 measures a surface of the object to be measured that is parallel to the Z-axis or tilted with respect to the Z-axis, the tool changer 6 may attach the measuring head 53#3 to the spindle 21. .

Another example of the use of the measurement head 53#3 is the measurement of the surface of the measurement object facing the narrow space formed in the measurement object. For example, as shown in FIG. 38, when a concave portion (for example, a vertical hole Wh) corresponding to a narrow space is formed in the work W, the measurement head 53#3 is positioned on the inner surface of the work W facing the vertical hole Wh. It may be used to measure Wis (that is, the inner surface of the recess in the work W). Therefore, when the measuring device 5 measures the surface of the object to be measured facing a narrow space, the tool changing device 6 may attach the measuring head 53 # 3 to the spindle 21 . In this case, the measurement device 5 directs the measurement light ML to the inner surface Wis (that is, the inner surface of the recess) while at least part of the measurement head 53#3 is arranged in the recess (for example, the vertical hole Wh) of the work W. The shape and the like of the work W may be measured by irradiating the workpiece W and receiving (that is, detecting) the return light RL from the inner surface Wis (that is, the inner surface of the concave portion).

When measuring the surface of the measurement object facing a narrow space using the measurement head 53#3, as shown in FIG. The measurement light ML may be irradiated from the measurement head 53 to the measurement target (eg, the inner surface Wis) while a portion of the measurement head 53 is inserted into the narrow space (eg, the vertical hole Wh). In this case, the head housing 531 includes a housing portion 5314 connected to the main shaft 21 and a housing portion 5315 connected to the housing portion 5314 and smaller in size than the housing portion 5314, as shown in FIG. may In this case, the mirror 5323 may be housed in the housing portion 5315 and the opening 5312 may be formed in the housing portion 5315 . Here, the condensing position in the direction of travel of the measurement light ML may be changed according to the change in the diameter (size in the XY direction) of the vertical hole Wh corresponding to the narrow space. Note that the control device 7 rotates the main shaft 21 (that is, the measurement head 53#3) around the rotation axis RX, and as the main shaft 21 rotates, the measurement light ML is sequentially emitted from the measurement head 53#3 to the object to be measured. may be controlled to irradiate the entire narrow space (for example, acquisition of measurement data indicating the shape of the entire narrow space).

Next, as shown in FIGS. 39(a) and 39(b), the plurality of types of measurement heads 53 attachable to the spindle 21 may include a measurement head 53#4. The measurement head 53#4 may include an optical system 532#4 including a parallel plate 5324 instead of the fθ lens 5322. Incidentally, FIG. 39(a) shows the measuring head 53#4 that can be used in the first embodiment, and FIG. 39(b) shows the measuring head 53 that can be used in the fourth to sixth embodiments. #4 is shown.

The parallel plate 5324 is arranged such that its surface (optical surface) is inclined with respect to the traveling direction of the measurement light ML incident on the parallel plate 5324 . As a result, the incident position of the measurement light ML on the parallel plate 5324 and the exit position of the measurement light ML from the parallel plate 5324 are in a direction intersecting the traveling direction of the measurement light ML (for example, intersecting the rotation axis RX of the main shaft 21). direction). Under such circumstances, when the measurement head 53#4 rotates around the rotation axis RX (that is, the parallel plate 5324 rotates) with the rotation of the main shaft 21, the emission position of the measurement light ML from the parallel plate 5324 is , change along the direction intersecting the traveling direction of the measurement light ML. That is, the emission position of the measurement light ML from the measurement head 53#4 changes along the direction intersecting the traveling direction of the measurement light ML. Therefore, the parallel plate 5324 may be regarded as functioning as an emission position changing member that changes the emission position of the measurement light ML from the measurement head 53#4. As a result, the irradiation position of the measurement light ML on the measurement object changes along the surface of the measurement object. Further, since the return light RL from the object to be measured returns to the optical system 522 through the same optical path as the measurement light ML, detailed description thereof will be omitted. Note that the emission position changing member is not limited to the parallel plate 5324 as long as it is a member capable of changing the emission position with respect to the incident position of the measurement light ML. For example, a plate-shaped optical member having a non-parallel light entrance surface and a light exit surface may be used as the light emission changing member, or an optical member having another shape may be used as the light emission changing member. good.

However, in the measurement head 53#4 that can be used in the first embodiment, the measurement light ML emitted from the measurement head 52 enters the measurement head 53#4 through the opening 5311. As described above, the opening 5311 may not be positioned on the optical path of the measurement light ML emitted from the measurement head 52 depending on the rotation angle of the main shaft 21 (that is, the rotation angle of the measurement head 53#4). Therefore, as shown in FIG. 39A, the measurement head 53#4 may be formed with an annular opening 5311 that surrounds the rotation axis RX over 360 degrees. However, if the ring-shaped opening 5311 that surrounds the rotation axis RX over 360 degrees is simply formed, the head housing 531 is physically separated vertically at the boundary of the opening 5311 . Therefore, in the opening 5311, a housing portion of the head housing 531 above the opening 5311 and a housing portion of the head housing 531 below the opening 5311 through which the measurement light ML can pass. A support member 5316 may be arranged to connect the . Note that not only the measurement head 53#4 having the parallel plate 5324, but also any measurement head 53 that can be used in the first embodiment has an annular opening 5311 that surrounds the rotation axis RX over 360 degrees. Alternatively, a support member 5316 may be arranged in the opening 5311 .

Furthermore, the measurement head 53#4 that can be used in the first embodiment includes a mirror 5321 on which the measurement light ML emitted from the measurement head 52 is incident. As described above, depending on the rotation angle of the main shaft 21 (that is, the rotation angle of the mirror 5321), the measurement light ML that has entered the measurement head 53#4 through the opening 5311 may not enter the reflecting surface of the mirror 5321. have a nature. Therefore, as shown in FIG. 39A, instead of the mirror 5321, the measurement head 53#4 is equipped with a cone mirror 5325 whose reflection surface has a cone shape (for example, a cone shape or a pyramid shape). good too. In this case, even if the main axis 21 rotates, the conical mirror 5325 reflects the measurement light ML incident on the conical mirror 5325 toward the parallel plate 5324, and transmits the return light RL incident on the conical mirror 5325 to the optical system 522 can be reflected towards Note that any measurement head 53 that can be used in the first embodiment, not limited to the measurement head 53 #4 having the parallel plate 5324 , may have the cone mirror 5325 instead of the mirror 5321 .

It should be noted that when the measurement head 53#4 including the parallel plate 5324 is attached to the spindle 21, the measurement device 5 does not have to include the galvanomirror 5222. Conversely, if the measuring device 5 does not have the galvanomirror 5222 , the tool changer 6 may attach the measuring head 53 # 4 having the parallel plate 5324 to the spindle 21 .

Also, in the above description, the parallel plate 5324 rotates as the main shaft 21 rotates. However, the measuring device 5 may include a drive system for rotating the parallel plate 5324 regardless of whether the main shaft 21 is rotated.

Next, as shown in FIGS. 40(a) and 40(b), the plurality of types of measurement heads 53 attachable to the spindle 21 may include a measurement head 53#5. The measurement head 53#5 may include an optical system 532#5 including a conical mirror 5326 having a conical reflecting surface on the optical path of the measurement light ML emitted from the fθ lens 5322. Incidentally, FIG. 40(a) shows the measuring head 53#5 that can be used in the first embodiment, and FIG. 40(b) shows the measuring head 53 that can be used in the fourth to sixth embodiments. #5 is shown.

The cone mirror 5326 allows the measurement light ML emitted from the first region of the exit surface of the fθ lens 5322 to enter the reflecting surface of the cone mirror 5326, while the measurement light ML emitted from the second region of the exit surface of the fθ lens 5322 is measured. It is arranged so that the light ML does not enter the reflecting surface of the cone mirror 5326 . In this case, the measurement light ML emitted from the first region of the exit surface of the fθ lens 5322 is reflected by the cone mirror 5326 . As a result, the cone mirror 5326 emits (in this case, reflects) the measurement light ML emitted from the fθ lens 5322 in a direction intersecting the optical axis of the fθ lens 5322 . Therefore, in this case, the conical mirror 5326 can function as the mirror 5323 included in the measurement head 53#3 described with reference to FIGS. 37(a) and 37(c). On the other hand, the measurement light ML emitted from the second region of the exit surface of the fθ lens 5322 is not reflected by the cone mirror 5326 . As a result, the measurement light ML emitted from the fθ lens 5322 is emitted from the measurement head 53 in the emission direction along the optical axis of the fθ lens 5322 . Therefore, the measurement head 53#5 can measure the surface of the object to be measured perpendicular to the optical axis of the fθ lens 5322 (for example, the surface along the XY plane) and the object to be measured parallel or inclined to the optical axis of the fθ lens 5322. (for example, a surface parallel to the Z-axis or inclined with respect to the Z-axis) can be irradiated with the measurement light ML. Further, since the return light RL from the object to be measured returns to the optical system 522 through the same optical path as the measurement light ML, detailed description thereof will be omitted.

Note that the measurement light ML that passes through the cone mirror 5326 and the measurement light ML that does not pass through the cone mirror 5326 are emitted from the measurement head 53#5. For this reason, the head housing 531 has an aperture 5312-1 through which the measurement light ML emitted from the measurement head 53#5 can pass, and an aperture 5312-1 through which the measurement light ML can pass without passing through the cone mirror 5326. An opening 5312-2 through which the measurement light ML passing through the mirror 5326 can pass may be formed. Furthermore, the opening 5312-2 may have an annular shape surrounding the rotation axis RX over 360 degrees, as described with reference to FIG. 39(a). Furthermore, as described with reference to FIG. 39(a), the opening 5312-2 allows the measurement light ML to pass through, and the housing portion of the head housing 531 above the opening 5312-2 and the head. A support member may be arranged to connect the housing portion of the housing 531 below the opening 5312-2.

Next, as shown in FIGS. 41(a) and 41(b), the plurality of types of measurement heads 53 attachable to the spindle 21 may include a measurement head 53#6. The measurement head 53 # 6 may have an optical system 532 # 6 having a mirror 5327 instead of the fθ lens 5322 . FIG. 41(a) shows the measuring head 53#6 that can be used in the first embodiment, and FIG. 41(b) shows the measuring head 53 that can be used in the fourth to sixth embodiments. #6 is shown.

The mirror 5327 reflects the measurement light ML that has entered the mirror 5327 . In particular, the mirror 5327 reflects the measurement light ML so that the measurement light ML that has entered the mirror 5327 returns to the optical system 522 . Such a measurement head 53#6 may be used, for example, to adjust the attitude of the optical system 522 (for example, the orientation of the optical axis). Therefore, when adjusting the attitude of the optical system 522 , the tool changer 6 may attach the measuring head 53 # 6 having the mirror 5327 to the spindle 21 .

Specifically, when the posture of the optical system 522 is an ideal posture, the measurement light ML emitted from the optical system 522 is incident on the mirror 5327, and the measurement light ML reflected by the mirror 5327 is incident on the optical system 522 (and consequently on the detector element 5232). On the other hand, when the posture of the optical system 522 is not ideal, at least part of the measurement light ML emitted from the optical system 522 does not enter the mirror 5327 and/or the mirror 5327 reflects There is a possibility that at least part of the measured light ML that has been measured does not enter the optical system 522 (as a result, does not enter the detection element 5232). Therefore, when the posture of the optical system 522 is not ideal, detection of the measurement light ML by the detection element 5232 is more difficult than when the posture of the optical system 522 is ideal. strength may be reduced. Therefore, the attitude of the optical system 522 can be adjusted based on the intensity of the measurement light ML detected by the detection element 5232 .

Next, as shown in FIGS. 42(a) and 42(b), the plurality of types of measurement heads 53 attachable to the spindle 21 may include a measurement head 53#7. The measurement head 53#7 may include an optical system 532#7 including a half mirror 5328 instead of the fθ lens 5322. Incidentally, FIG. 42(a) shows the measuring head 53#7 that can be used in the first embodiment, and FIG. 42(b) shows the measuring head 53 that can be used in the fourth to sixth embodiments. #7 is shown.

A part of the measurement light ML that has entered the half mirror 5328 passes through the half mirror 5328 . As a result, the measurement light ML that has passed through the half mirror 5328 is irradiated onto the object to be measured. On the other hand, another part of the measurement light ML that has entered the half mirror 5328 is reflected by the half mirror 5328 . The measurement light ML reflected by the half mirror 5328 enters the detection element 5232 via the optical system 522 . The measurement light ML that has entered the detection element 5232 may be used as reference light for interfering with the return light RL. Therefore, when the measurement head 53#7 including the half mirror 5328 is attached to the main shaft 21, the optical system 522 is used for generating the reference light (for example, the measurement light ML#1-3 shown in FIG. 7). The optical members (for example, beam splitter 52213 and mirror 52214 shown in FIG. 7) may not be provided.

Next, as shown in FIGS. 43(a) and 43(b), the plurality of types of measurement heads 53 attachable to the spindle 21 may include a measurement head 53#8. The measurement head 53#8 may include an optical system 532#8 including an objective lens 5329 instead of the fθ lens 5322. The objective lens 5329 is an optical member for condensing the measurement light ML (for example, condensing it on the surface of the measurement object). FIG. 43(a) shows the measuring head 53#8 that can be used in the first embodiment, and FIG. 43(b) shows the measuring head 53 that can be used in the fourth to sixth embodiments. #8 is shown.

Next, as shown in FIGS. 44(a) and 44(b), the multiple types of measurement heads 53 that can be attached to the spindle 21 may include a measurement head 53#9. The measurement head 53 # 9 may include an optical system 532 # 9 including a galvanomirror 5222 . The galvanomirror 5222 is arranged on the optical path of the measurement light ML incident on the fθ lens 5322 . Incidentally, when the measurement head 53#9 is attached to the spindle 21, the optical system 522 does not have to include the galvanomirror 5222. Incidentally, FIG. 44(a) shows the measuring head 53#9 that can be used in the first embodiment, and FIG. 44(b) shows the measuring head 53 that can be used in the fourth to sixth embodiments. #9 is shown.

Next, as shown in FIGS. 45(a) and 45(b), the plurality of types of measurement heads 53 attachable to the spindle 21 may include a measurement head 53#10. The measurement head 53 # 10 may include a measurement head 53 # 10 in which a cleaning member 533 is formed on the outer surface of a head housing 531 . The cleaning member 533 is a member for cleaning the surface of the object to be measured (for example, removing cutting waste and the like). Cleaning member 533 may include, for example, at least one of a blade and a brush. 45(a) shows an example in which the cleaning member 533 is formed on the bottom surface of the head housing 531, and FIG. 45(b) shows an example in which the cleaning member 533 is formed on the side surface of the head housing 531. FIG. showing. However, the formation position of the cleaning member 533 is not limited to this example. 45(a) and 45(b) each show the measurement head 53#10 that can be used in the fourth to sixth embodiments, but the measurement head 53#10 that can be used in the first embodiment A cleaning member 533 may be formed on the outer surface of the head housing 531 of the head 53 . Further, a cleaning member 533 may be formed on the outer surface of at least one of the head housings 531 of the measurement heads 53#1 to 53#9 described above.

When the measurement head 53#10 is attached to the main shaft 21, the measurement head 53#10 also rotates as the main shaft 21 rotates. As a result, the cleaning member 533 removes, scrapes off, or wipes off unnecessary substances such as cutting waste adhering to the surface of the object to be measured. As a result, the surface of the object to be measured is cleaned.

When the measuring head 53 attached to the spindle 21 is replaced, the measuring device 5 may change the position of at least one optical member included in the measuring head 52 in accordance with the replacement of the measuring head 53 . For example, when the measuring device 5 has the first type of measuring head 53 attached to the main shaft 21 , one optical member included in the measuring head 52 is arranged at the first position, and the main shaft 21 has the second optical member. When the type of measurement head 53 is attached, one optical member provided in the measurement head 52 is positioned at a second position different from the first position. You can change it. In this case, the measurement device 5 may change the position of at least one optical member included in the measurement head 52 so that the measurement target can be measured. More specifically, the measurement device 5 includes at least one optical element included in the measurement head 52 so that the measurement target is irradiated with the measurement light ML (for example, the measurement light ML is focused on the measurement target). You may change the position of a member. For example, when the first type of measurement head 53 is attached to the spindle 21 , the measurement device 5 measures the measurement light ML irradiated to the measurement object via the first type of measurement head 53 . When the measurement head 53 of the second type is attached to the spindle 21, the measurement light ML that is focused on the object and is irradiated onto the object to be measured through the measurement head 53 of the second type is measured. The position of at least one optical member included in the measurement head 52 may be changed so that the light is focused on the object. The change of the position of the optical member includes the change of the position of the optical member in the direction along the optical axis of the optical system 522 provided in the measurement head 52, and the change of the position of the optical member in the direction intersecting the optical axis of the optical system 522. , and changing the orientation of the optical member. The change of the posture of the optical member includes the change of the posture of the optical member around the rotation axis along the optical axis of the optical system 522 and the change of the posture of the optical member around the rotation axis along the direction intersecting the optical axis of the optical system 522. at least one of the modifications of

(8-2) Second Modification In the second modification, at least one of the measuring device 5 of the first embodiment to the measuring device 5g of the seventh embodiment, under the control of the control device 7, controls the galvanomirror 5222. The size of the scan area SA that can be irradiated with the measurement light ML may be changed by the operation. In this case, for example, the measurement device 5 may change the size of the scan area SA according to the shape of the measurement object. For example, the measurement device 5 may change the size of the scan area SA according to the size of the measurement object.

As an example, FIG. 46 shows a workpiece W in which grooves GRV with varying widths are formed. In the example shown in FIG. 46, the width of the groove GRV changes from width A to width B narrower than width A along the X-axis direction. When the measuring device 5 measures such a groove GRV (specifically, the measuring device 5 measures the surface of the workpiece W facing the groove GRV), the measuring device 5 measures the width of the groove GRV. may be used to change the size of the scan area SA. For example, the measurement device 5 makes the size of the scan area SA correspond to the width A at the position where the width of the groove GRV is width A, and the size of the scan area SA at the position where the width of the groove GRV is width B. The size of the scan area SA may be changed so that the size of the width B corresponds to the size of the scan area SA.

(8-3) Third Modification In the third modification, at least one of the measuring device 5 of the first embodiment to the measuring device 5g of the seventh embodiment, under the control of the control device 7, scans the scan area SA. In addition to or instead of changing the size, in the scan area SA, an irradiation area SAp that is actually irradiated with the measurement light ML and a non-irradiation area SAn that is not actually irradiated with the measurement light ML are set. good too. A specific example of the operation of setting the irradiation area SAp and the non-irradiation area SAn will be described below with reference to FIGS. 47 and 48. FIG.

First, a first specific example of the operation of setting the irradiation area SAp and the non-irradiation area SAn will be described. FIG. 47 shows an example of a work W composed of members made of different materials. In this case, the surface of the work W shown in FIG. and a second region WA2 corresponding to the surface of a member made of a second material (ceramic in the example shown in FIG. 47). The measurement device 5 may set the irradiation area SAp and the non-irradiation area SAn when measuring the workpiece W using the scan area SA spanning the first area WA1 and the second area WA2. For example, as shown in FIG. 47, the measuring device 5 determines that the ratio of the irradiation area SAp and the non-irradiation area SAn in the first scan area portion SA1 overlapping the first area WA1 of the scan area SA is The irradiation area SAp and the non-irradiation area SAn may be set so as to differ from the ratio of the irradiation area SAp and the non-irradiation area SAn in the second scan area portion SA2 overlapping the second area WA2. In the example shown in FIG. 47, the measuring device 5 sets the non-irradiation area SAn in the first scan area portion SA1, but does not set the non-irradiation area SAn in the second scan area portion SA2 (that is, in the second scan The irradiation area SAp and the non-irradiation area SAn may be set such that the entire area portion SA2 becomes the irradiation area SAp.

The measurement device 5 may set the irradiation area SAp and the non-irradiation area SAn so that measurement data can be generated appropriately. For example, as described above, the measurement device 5 can perform multi-point measurement of the measurement object by changing the traveling direction of the measurement light ML using the galvanomirror 5222 . Here, depending on the material of the members forming the workpiece W, the density of multi-point measurement (for example, the number of times of irradiation of the measurement light ML per unit area, and the number of points forming the point cloud data corresponding to the above-described measurement data) density) may differ. For example, the density of multi-point measurement for appropriately measuring the member of the first material forming the first area WA1 is the same as the density of multi-point measurement for appropriately measuring the member of the second material forming the second area WA2. It may differ from the point measurement density. Therefore, the measurement device 5 may set the irradiation area SAp and the non-irradiation area SAn according to the density of multi-point measurement required for appropriately measuring the measurement object. For example, if the density of multi-point measurement required to properly measure the first area WA1 is lower than the density of multi-point measurement required to properly measure the second area WA2, the first area WA1 The number of times of irradiation of the measurement light ML per unit area within the overlapping first scan area portion SA1 is less than the number of times of irradiation of the measurement light ML per unit area within the second scan area portion SA2 overlapping the second area WA2. No problem will arise. Therefore, in this case, the measurement device 5 determines that the ratio of the size of the non-irradiated area SAn to the size of the irradiated area SAp within the first scan area portion SA1 is equal to the irradiated area SAp within the second scan area portion SA2. The irradiation area SAp and the non-irradiation area SAn may be set so as to be larger than the ratio of the size of the non-irradiation area SAn to the size of .

Next, before describing the second specific example of the operation of setting the irradiation area SAp and the non-irradiation area SAn, the premise of the second specific example will be described. FIG. 48 shows the scanning area SA moving on the surface of the measurement object. When measuring the object to be measured, the measurement device 5 moves the scan area SA along the scan direction (the direction along the Y-axis in the example shown in FIG. 48) on the surface of the object to be measured. A scanning operation for irradiating the measurement light ML on the SA and a step direction (in the example shown in FIG. 48, in the example shown in FIG. and the step operation of moving the scan area SA along the direction of movement of the scan area SA may be alternately performed. In this case, as shown in FIG. 48, the measuring device 5 determines that the scanned area SC#N of the measurement object, in which the scan area SA moves by the Nth (N is an integer equal to or greater than 2) scanning operation, is N− A part of the scanned area SC#N−1 of the measurement object to which the scan area SA moves by the first scan operation and a scanned area SC#N+1 of the measurement object to which the scan area SA moves by the N+1th scan operation The scan area SA may be moved so as to overlap with a part of . In the example shown in FIG. 48, the measuring device 5 determines that the −X side edge of the scanned area SC#N overlaps the +X side edge of the scanned area SC#N−1, and the scanning area SC#N overlaps the -X side end of the scanned area SC#N+1. In this case, the surface of the measurement object includes a non-overlapping area OP1 that overlaps the scan area SA only once, and an overlap area OP2 that overlaps the scan area SA twice.

Under this premise, the measurement device 5 determines that the ratio of the irradiation area SAp and the non-irradiation area SAn in the third scan area portion SA3 overlapping the non-overlapping area OP1 of the scan area SA is The irradiation area SAp and the non-irradiation area SAn may be set so as to differ from the ratio of the irradiation area SAp and the non-irradiation area SAn in the fourth scan area portion SA4 overlapping the overlap area OP2. Specifically, as shown in FIG. 48, the measuring device 5 determines that the ratio of the irradiation area SAp and the non-irradiation area SAn in the fourth scan area portion SA4 is equal to the irradiation area SAp and the non-irradiation area SAp in the third scan area portion SA3. The irradiation area SAp and the non-irradiation area SAn may be set so as to be larger than the ratio with the area SAn. In the example shown in FIG. 48, the measuring device 5 sets half of the fourth scan region portion SA4 to be the non-irradiation region SAn, while the non-irradiation region SAn is not set to the third scan region portion SA3 (that is, the third scan region portion SA3). The irradiation area SAp and the non-irradiation area SAn are set so that the entire area portion SA3 becomes the irradiation area SAp. In this case, the measurement device 5 determines that the number of irradiations of the measurement light ML per unit area within the fourth scan region portion SA4 overlapping the overlapping region OP2 is the unit within the third scanning region portion SA3 overlapping the non-overlapping region OP1. The number of times of irradiation of the measurement light ML per area is approximately half. Even in this case, since the overlapping region OP2 overlaps the scanning region SA twice, the number of irradiations of the measurement light ML per unit area within the overlapping region OP2 is the same as that per unit area within the non-overlapping region OP1. It is almost the same as the number of irradiations of the measurement light ML. Therefore, the measurement of the object to be measured is hardly affected.

When the non-irradiation area SAn is set within the scan area SA in this manner, the galvanomirror 5222 is arranged in the non-irradiation area SAn compared to the case where the non-irradiation area SAn is not set within the scan area SA. It becomes unnecessary to perform the operation for irradiating the measurement light ML to the . That is, the driving amount (further driving time) of the galvanomirror 5222 required to irradiate the scan area SA with the measurement light ML is reduced. Therefore, the time required for measuring the measurement object is also reduced. As a result, the throughput for measuring the measurement object is improved.

(8-4) Fourth Modification In the fourth modification, at least one of the measuring device 5 of the first embodiment to the measuring device 5g of the seventh embodiment, under the control of the control device 7, scans the scan area SA. The irradiation mode of the measurement light ML in the upstream scan area SAup and the irradiation mode of the measurement light ML in the downstream scan area SAdw of the scan area SA may be controlled separately. As shown in FIG. 49, the upstream scan area SAup is positioned forward of the downstream scan area SAdw in the movement direction of the scan area SA. That is, as shown in FIG. 49, the downstream scan area SAdw is located on the rear side in the moving direction of the scan area SA relative to the upstream scan area SAup.

For example, the measurement device 5 measures the measurement light beams in each of the upstream scan area SAup and the downstream scan area SAdw so that the density of multipoint measurement in the upstream scan area SAup is lower than the density of multipoint measurement in the downstream scan area SAdw. The ML irradiation mode may be controlled. Specifically, for example, the measurement apparatus 5 determines that the number of irradiations of the measurement light ML per unit area in the upstream scan area SAup is higher than the number of irradiations of the measurement light ML per unit area in the downstream scan area SAdw. The irradiation mode of the measurement light ML in each of the upstream scan area SAup and the downstream scan area SAdw may be controlled so as to reduce it. In other words, the measuring device 5 irradiates the upstream scan area SAup with the measurement light ML so as to give priority to improving the throughput for measuring the object to be measured rather than improving the measurement accuracy of the object to be measured. The SAdw may be irradiated with the measurement light ML so that improvement of the measurement accuracy of the object to be measured is prioritized over improvement of the throughput for measurement of the object to be measured.

For example, the measurement device 5 sets the exposure time of the measurement light ML in the upstream scan area SAup to be shorter than the exposure time of the measurement light ML in the downstream scan area SAdw. The irradiation mode of the measurement light ML may be controlled. Note that the exposure time of the measurement light ML becomes longer as the moving speed of the measurement light ML on the measurement object by the galvanomirror 5222 becomes lower. That is, the exposure time of the measurement light ML becomes longer as the driving speed of the galvanomirror 5222 becomes lower. The longer the exposure time of the measurement light ML, the longer the time required to measure the object to be measured. Improves measurement accuracy. On the other hand, the shorter the exposure time of the measurement light ML, the shorter the time required to measure the measurement target, although the measurement accuracy of the measurement target may deteriorate. Therefore, in this case, the measurement device 5 directs the measurement light ML so as to prioritize improvement of throughput for measurement of the measurement object over improvement of measurement accuracy of the measurement object with respect to the upstream scan area SAup. It may be considered that the downstream scan area SAdw is irradiated with the measurement light ML so as to give priority to improving the measurement accuracy of the measurement object over improving the throughput for measuring the measurement object.

When the irradiation mode of the measurement light ML in the upstream scan area SAup and the irradiation mode of the measurement light ML in the downstream scan area SAdw can be separately controlled, the measuring device 5 can control the measurement light irradiated to the upstream scan area SAup. The irradiation mode of the measurement light ML in the downstream scan area SAdw may be controlled based on the measurement result using the ML. For example, when the measurement result using the measurement light ML irradiated to the upstream scan area SAup is incomplete (for example, appropriate measurement data cannot be generated), the measurement device 5 measures the downstream scan area SAdw. The measurement light ML may be irradiated so as to give priority to improving the measurement accuracy of the object to be measured over improving the throughput for measuring the object. Specifically, for example, the measurement device 5 adjusts the measurement light ML in the downstream scan area SAdw so that the density of multipoint measurement in the downstream scan area SAdw is higher than the density of multipoint measurement in the upstream scan area SAup. The irradiation mode may be changed. For example, the measurement device 5 adjusts the irradiation mode of the measurement light ML in the downstream scan area SAdw so that the exposure time of the measurement light ML in the downstream scan area SAdw is longer than the exposure time of the measurement light ML in the upstream scan area SAup. You can change it. As a result, it is less likely that the measurement result using the measurement light ML irradiated to the downstream scan area SAdw will be flawed.

(8-5) Fifth Modification As described above, after the machining head 2 finishes machining the workpiece W, the control device 7 can perform an evaluation process for evaluating the details of machining of the workpiece W by the machining head 2. be. In this case, the control device 7 calculates a machining error corresponding to the difference between the ideal shape of the work W and the actual shape of the work W indicated by the measurement data. Specifically, the control device 7 controls a three-dimensional model (for example, the above-described CAD model, hereinafter referred to as a “target model”) representing an ideal shape of the work W, and a model of the work W represented by the measurement data. By comparing a three-dimensional model showing the actual shape (substantially a virtual model composed of a plurality of points included in point cloud data, hereinafter referred to as a "measurement model"), Calculate the machining error. In this case, in order to specify which part of the measurement model corresponds to which part of the target model, it is necessary to specify the reference part of the measurement model and the reference part of the target model corresponding to the reference part of the measurement model. There is For example, the operator of the machine tool 1 must specify the reference portion of the measurement model and specify the reference portion of the target model corresponding to the reference portion of the measurement model. After that, the control device 7 compares the measurement model and the target model with reference to the designated reference portion.

In the fifth modification, at least one of the machine tool 1a of the first embodiment to the machine tool 1g of the seventh embodiment is configured as shown in FIG. Alternatively, a workpiece W having a reference member 413 that can be used as a reference portion of a measurement model formed in advance may be processed. Reference member 413 is a member whose shape is known to control device 7 .

In this case, the measuring device 5 measures the reference member 413 together with the workpiece W in order to perform the evaluation process. As a result, as shown in FIG. 51, the control device 7 generates measurement data (actually, point cloud data) representing a measurement model representing the shapes of the workpiece W and the reference member 413 . Furthermore, in this case, the target model (CAD model) is a three-dimensional model showing not only the workpiece W but also the shape of the reference member 413 . As a result, based on the information about the shape of the reference member 413 known to the control device 7, the control device 7 determines the model portion corresponding to the reference member 413 in the measurement model and the reference member 413 in the target model. It can be recognized that corresponding model parts are parts corresponding to each other. In other words, the operation of designating the reference portion of the measurement model and designating the reference portion of the target model corresponding to the reference portion of the measurement model becomes unnecessary. Therefore, it is possible to shorten the time required for the evaluation process. That is, the throughput of evaluation processing is improved.

Furthermore, since the measurement result of the workpiece W includes the information about the reference member 413, the control device 7 can can be used to perform evaluation processing in real time. Furthermore, in this case, if it is found that the processing details of the work W are not appropriate while the measuring device 5 is measuring the work W, the measuring device 5 may interrupt the measurement of the work W. . As a result, the time required to measure the work W that has already been evaluated is eliminated, leading to an improvement in throughput.

Note that the reference member 413 may be formed on a member different from the stage 41 . For example, reference member 413 may be formed in cradle 424 shown in FIG. For example, the reference member 413 may be formed on the workpiece W. In this case, the processing head 2 may process the workpiece W on which the reference member 413 is formed. However, in this case, the processing head 2 does not have to process the reference member 413 itself.

(8-6) Sixth Modification In the measuring device 5 of the first embodiment to the measuring device 5c of the third embodiment and the measuring device 5e of the fifth embodiment to the measuring device 5f of the sixth embodiment, the measuring head 52 ( (including the measuring heads 52b, 52c and 52e) may be attached to the processing head 2 as described above. In this case, temperature fluctuations of the processing head 2 may affect the measurement accuracy of the measuring device 5 .

Therefore, in the sixth modification, at least one of the machine tool 1a of the first embodiment to the machine tool 1c of the third embodiment and the machine tool 1e of the fifth embodiment to the machine tool 1f of the sixth embodiment is 52, a temperature sensor 871 for measuring the temperature of the processing head 2, and a temperature effect reduction device for reducing the effect of the temperature fluctuation of the processing head 2 on the measurement head 52 based on the detection result of the temperature sensor 871. A device 872 may also be provided.

The temperature effect reduction device 872 may include, for example, a heating device (for example, at least one of a heater and a heat pipe) for heating at least one of the processing head 2 and the measurement head 52. The temperature effect reduction device 872 may include a cooling device (for example, at least one of a Peltier element, a heat sink and a heat pipe) for cooling at least one of the processing head 2 and the measurement head 52 . Note that the temperature sensor 871 may measure the temperature of the measurement head 52 . Moreover, the temperature effect reduction device 872 may include a heat insulating material that reduces heat directed from the processing head 2 to the measurement head 52 .

(8-7) Seventh Modification In the measuring device 5 of the first embodiment to the measuring device 5c of the third embodiment and the measuring device 5e of the fifth embodiment to the measuring device 5f of the sixth embodiment, the measuring head 52 ( (including the measuring heads 52b, 52c and 52e) may be attached to the processing head 2 as described above. In this case, vibration of the processing head 2 may affect the measurement accuracy of the measuring device 5 .

Therefore, in the seventh modification, at least one of the machine tool 1a of the first embodiment to the machine tool 1c of the third embodiment and the machine tool 1e of the fifth embodiment to the machine tool 1f of the sixth embodiment has a machining A vibration sensor 881 for detecting vibration of the head 2 and a vibration effect reduction device 882 for reducing the effect of the vibration of the processing head 2 on the measurement head 52 based on the detection result of the vibration sensor 881 may be provided. good. Note that the vibration sensor 881 may detect vibration of the measurement head 52 .

The vibration sensor 881 detects acceleration of the machining head 2 (for example, acceleration in at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction) as an index value that quantitatively represents the vibration of the machining head 2. A sensor may be included. The vibration sensor 881 can detect the amount of displacement of the machining head 2 (for example, the amount of displacement in at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction) as an index value that quantitatively represents the vibration of the machining head 2. displacement sensor.

The vibration influence reduction device 882 includes, for example, a vibration damping device (for example, at least one of a damper and a spring) capable of damping the vibration by absorbing the vibration of at least one of the processing head 2 and the measurement head 52. good too. The vibration influence reduction device 882 is, for example, a drive device (for example, an actuator) capable of generating a force for canceling the vibration generated in at least one of the processing head 2 and the measurement head 52. As a specific example, a VCM (Voice Coil Motor )).

(8-8) Other Modifications In the above description, the measuring apparatus 5 is an interferometric measuring apparatus that uses the optical comb light source as the measuring light source 51 . However, the measurement apparatus 5 may be an interferometric measurement apparatus that uses a light source different from the optical comb light source as the measurement light source 51 . For example, the measurement device 5 may be an optical coherence tomography (OCT) type measurement device. An example of an OCT-type measuring device is described in Japanese Patent Application Laid-Open No. 2020-101499. For example, the measuring device 5 may be a measuring device with a white confocal displacement gauge. An example of a white confocal displacement meter is described in JP-A-2020-085633. For example, the measurement device 5 may be a phase modulation type measurement device. An example of the phase modulation type measuring device is described in Japanese Patent Application Laid-Open No. 2010-025922. For example, the measurement device 5 may be an intensity modulation type measurement device. An example of the intensity modulation type measuring device is described in Japanese Patent Application Laid-Open No. 2016-510415 and US Patent Application Publication No. 2014/226145.

In the above description, the space inside the head housing 521 of the measurement head 52 may be kept at a positive pressure using a utility force (not shown).

In the above description, the machine tool 1 uses the tool 23 to process the workpiece W. That is, the machine tool 1 is machining the workpiece W. As shown in FIG. However, the machine tool 1 may machine the work W using means different from the tool 23 . For example, the machine tool 1 may process the work W by irradiating the work W with an energy beam. In this case, the machine tool 1 may additionally process the work W by irradiating the work W with an energy beam. The machine tool 1 may remove and process the workpiece W by irradiating the workpiece W with an energy beam. At least one of light, charged particle beams (eg, electron beams or ion beams), and electromagnetic waves may be used as the energy beam. When an energy beam (for example, light) is used to process the work W, the machine tool 1 uses the measuring device 5 for irradiating the work W with the measurement light ML to process the work W. (hereinafter referred to as "processing light") may be irradiated onto the workpiece W. For example, the machine tool 1 may irradiate the workpiece W with the machining light via at least one of the

optical systems

522 and 532 provided in the measuring device 5 . For example, the machine tool 1 may irradiate the workpiece W with the machining light emitted from the optical system 522 via the optical system 532 .

(9) Supplementary notes The following supplementary notes are disclosed with respect to the above-described embodiments.
[Appendix 1]
a processing device having a spindle on which a processing tool is attachable and detachable;
a measuring device capable of measuring the object by irradiating the object with a first light and detecting a second light from the object irradiated with the first light,
The measuring device comprises a first optical system attached to the processing device, and a second optical system detachably attached to the spindle,
A machine tool, wherein the first optical system emits the first light toward the second optical system and receives the second light from the second optical system.
[Appendix 2]
The machine tool according to appendix 1, wherein the measuring device irradiates the object with the first light and detects the second light through the first and second optical systems.
[Appendix 3]
The first optical system passes the first light and the second light,
The second optical system emits the first light from the first optical system toward the object and emits the second light from the object toward the first optical system. The machine tool described in .
[Appendix 4]
The main shaft is rotatable around a rotation axis,
The spindle rotates the tool around the rotation axis,
4. The machine tool according to any one of appendices 1 to 3, wherein the direction of the object-side optical axis of the second optical system is a direction extending along the rotation axis.
[Appendix 5]
The main shaft is rotatable around a rotation axis,
The first light emitted from the first optical system to the second optical system is emitted from a position different from the rotation axis,
The first optical system includes a first deflection member that deflects the first light so that the traveling direction of the first light emitted from the first optical system intersects with the rotation axis or has a twisted relationship. prepared,
The second optical system includes a second deflection member that deflects the first light so that the traveling direction of the first light from the first optical system is coaxial with or parallel to the rotation axis. The machine tool according to any one of 1.
[Appendix 6]
The main shaft is rotatable around a rotation axis,
The second optical system includes a deflection member that deflects the first light emitted from the first optical system,
the deflecting member is rotatable with the rotation of the main shaft;
The measurement device includes a detection element capable of detecting the second light,
6. The machine tool according to any one of appendices 1 to 5, further comprising a control device that controls rotation of the spindle based on a result of detection of the second light by the detection element.
[Appendix 7]
7. The machine tool according to appendix 6, wherein the control device controls the rotation of the main shaft so that the intensity of the second light detected by the detection element is maximized.
[Appendix 8]
8. The machine tool according to any one of appendices 1 to 7, wherein the second optical system includes a condensing optical member condensing the first light from the first optical system onto the object.
[Appendix 9]
9. The machine tool according to appendix 8, wherein the condensing optical member includes an f-theta lens.
[Appendix 10]
10. The first optical system according to any one of appendices 1 to 9, wherein the first optical system includes a traveling direction changing member that changes a traveling direction of the first light so as to change an irradiation position of the first light on the object. machine tools.
[Appendix 11]
11. The machine tool according to appendix 10, wherein the traveling direction changing member includes a galvanomirror.
[Appendix 12]
12. The machine tool according to any one of appendices 1 to 11, wherein the optical path of the first light and the optical path of the second light overlap between the second optical system and the object.
[Appendix 13]
13. The machine tool according to any one of appendices 1 to 12, wherein the measuring device includes a detection element capable of detecting the second light.
[Appendix 14]
The measurement device includes a detection element capable of detecting the second light,
The first optical system includes an interference optical system that interferes the second light and the third light,
14. The machine tool according to any one of appendices 1 to 13, wherein the detection element detects interference light between the second light and the third light.
[Appendix 15]
The second optical system is
a condensing optical member condensing the first light from the first optical system onto the object;
15. The tool according to any one of appendices 1 to 14, comprising: an optical path bending member that emits the first light from the condensing optical member in a direction that intersects the optical axis direction of the condensing optical system. machine.
[Appendix 16]
The second optical system includes an emission position changing member that changes the emission position of the first light so that the irradiation position of the first light on the object changes along the surface of the object. The machine tool according to any one of 1.
[Appendix 17]
17. The machine according to any one of appendices 1 to 16, wherein the second optical system includes a reflecting member that reflects at least part of the first light from the first optical system toward the first optical system. machine.
[Appendix 18]
18. The machine tool according to any one of appendices 1 to 17, further comprising a mounting device capable of mounting each of the tool and the second optical system to the spindle.
[Appendix 19]
The second optical system comprises a second optical system of a first type and a second optical system of a second type different from the first type,
19. The machine tool according to appendix 18, wherein the mounting device mounts one of the tool, the second optical system of the first type, and the second optical system of the second type to the spindle.
[Appendix 20]
20. The machine tool of clause 19, wherein the second optical system of the second type is attached to the spindle after the second optical system of the first type is removed from the spindle.
[Appendix 21]
21. The machine tool according to appendix 19 or 20, wherein the attachment device attaches the second optical system of the second type to the spindle after removing the second optical system of the first type from the spindle.
[Appendix 22]
22. The machine tool according to any one of appendices 1 to 21, wherein the first optical system includes an exchangeable exchangeable optical member.
[Appendix 23]
When the first optical system includes a first optical member as the replacement optical member, the first optical system emits the first light toward the second optical system,
In the case where the first optical system includes a second optical member different from the first optical member as the replacement optical member, the first optical system does not pass through the second optical system. 23. The machine tool of Claim 22, wherein a first light is directed toward the object.
[Appendix 24]
the first optical member includes a reflecting member that reflects the first light toward the second optical system;
24. The machine tool according to appendix 23, wherein the second optical member includes a condensing optical member condensing the first light onto the emission target member.
[Appendix 25]
a processing device having a spindle on which a processing tool is attachable and detachable;
a first optical system attached to a portion different from the main axis of the processing device and used for measuring an object,
The first optical system emits a first light toward a second optical system detachably attached to the main axis, and emits a first light from the object irradiated with the first light via the second optical system. 2 A machine tool that receives light.
[Appendix 26]
26. The machine tool according to appendix 25, wherein the first optical system functions as a part of a measuring device that measures the object by attaching the second optical system to the spindle.
[Appendix 27]
27. The machine tool according to appendix 26, further comprising a detection device that detects the second light from the first optical system and outputs a detection result to an arithmetic device that generates measurement data of the object.
[Appendix 28]
28. The machine tool according to appendix 27, further comprising the arithmetic device that generates measurement data of the object based on the detection result of the detection device.
[Appendix 29]
The first optical system functions as part of a measuring device that measures the object,
29. The machine tool according to any one of appendices 25 to 28, wherein the measuring device irradiates the object with the first light and detects the second light through the first and second optical systems.
[Appendix 30]
The first optical system passes the first light and the second light,
The second optical system emits the first light from the first optical system toward the object and emits the second light from the object toward the first optical system. The machine tool according to any one of 1.
[Appendix 31]
The main shaft is rotatable around a rotation axis,
The spindle rotates the tool around the rotation axis,
31. The machine tool according to any one of appendices 25 to 30, wherein the direction of the object-side optical axis of the second optical system is a direction extending along the rotation axis.
[Appendix 32]
The main shaft is rotatable around a rotation axis,
The first light emitted from the first optical system to the second optical system is emitted from a position different from the rotation axis,
The first optical system includes a first deflection member that deflects the first light so that the traveling direction of the first light emitted from the first optical system intersects with the rotation axis or has a twisted relationship. 32. A machine tool according to any one of clauses 25-31.
[Appendix 33]
32. Described in Appendix 32, wherein the second optical system includes a second deflection member that deflects the first light so that the traveling direction of the first light from the first optical system is coaxial with or parallel to the rotation axis. machine tools.
[Appendix 34]
The first optical system functions as part of a measuring device that measures the object,
the second deflection member is rotatable with the rotation of the main shaft;
The measurement device includes a detection element capable of detecting the second light,
34. The machine tool according to

appendix

32 or 33, further comprising a control device that controls rotation of the spindle based on a result of detection of the second light by the detection element.
[Appendix 35]
35. The machine tool according to appendix 34, wherein the control device controls the rotation of the main shaft so that the intensity of the second light detected by the detection element is maximized.
[Appendix 36]
36. The machine tool according to any one of appendices 25 to 35, wherein the second optical system includes a condensing optical member condensing the first light from the first optical system onto the object.
[Appendix 37]
37. The machine tool of Clause 36, wherein the concentrating optic includes an f-theta lens.
[Appendix 38]
38. The first optical system according to any one of appendices 25 to 37, wherein the first optical system includes a traveling direction changing member that changes a traveling direction of the first light so that an irradiation position of the first light on the object is changed. machine tools.
[Appendix 39]
39. The machine tool according to appendix 38, wherein the traveling direction changing member includes a galvanomirror.
[Appendix 40]
40. The machine tool according to any one of appendices 25 to 39, wherein the optical path of the first light and the optical path of the second light overlap between the second optical system and the object.
[Appendix 41]
The first optical system functions as part of a measuring device that measures the object,
41. The machine tool according to any one of appendices 25 to 40, wherein the measuring device includes a detection element capable of detecting the second light.
[Appendix 42]
The second optical system includes a detection element capable of detecting the second light,
The first optical system includes an interference optical system that interferes the second light and the third light,
42. The machine tool according to any one of appendices 25 to 41, wherein the detection element detects interference light between the second light and the third light.
[Appendix 43]
The second optical system is
a condensing optical member condensing the first light from the first optical system onto the object;
43. The tool according to any one of appendices 25 to 42, comprising: an optical path bending member that emits the first light from the condensing optical member in a direction that intersects the optical axis direction of the condensing optical system. machine.
[Appendix 44]
The second optical system includes an emission position changing member that changes the emission position of the first light so that the irradiation position of the first light on the object changes along the surface of the object. The machine tool according to any one of 1.
[Appendix 45]
45. The machine according to any one of appendices 25 to 44, wherein the second optical system includes a reflecting member that reflects at least part of the first light from the first optical system toward the first optical system. machine.
[Appendix 46]
46. The machine tool according to any one of appendices 25 to 45, further comprising an attachment device capable of attaching each of the tool and the second optical system to the spindle.
[Appendix 47]
The second optical system comprises a second optical system of a first type and a second optical system of a second type different from the first type,
47. The machine tool of clause 46, wherein the mounting device mounts one of the tool, the second optical system of the first type, and the second optical system of the second type to the spindle.
[Appendix 48]
48. The machine tool of clause 47, wherein the second optical system of the second type is attached to the spindle after the second optical system of the first type is removed from the spindle.
[Appendix 49]
49. The machine tool according to appendix 47 or 48, wherein the mounting device mounts the second optical system of the second type on the spindle after removing the second optical system of the first type from the spindle.
[Appendix 50]
50. The machine tool of any one of Appendixes 25-49, wherein the first optical system includes an exchangeable exchangeable optical member.
[Appendix 51]
When the first optical system includes a first optical member as the replacement optical member, the first optical system emits the first light toward the second optical system,
In the case where the first optical system includes a second optical member different from the first optical member as the replacement optical member, the first optical system does not pass through the second optical system. 51. The machine tool of clause 50, wherein a first light is directed toward the object.
[Appendix 52]
the first optical member includes a reflecting member that reflects the first light toward the second optical system;
52. The machine tool according to appendix 51, wherein the second optical member includes a condensing optical member condensing the first light onto the emission target member.
[Appendix 53]
An optical system for use in a machine tool having a machining apparatus having a spindle to which a machining tool is detachable,
Detachably attached to the main shaft,
receiving a first light emitted from a measurement optical system attached to a portion different from the main axis of the processing apparatus, emitting the received first light toward an object, and emitting a second light from the object; receiving light and emitting the received second light toward the measurement optical system;
The second light is light for measuring the object,
Optical system.
[Appendix 54]
54. The machine tool according to appendix 53, wherein the optical system functions as part of a measuring device that measures the object by attaching the optical system to the spindle.
[Appendix 55]
The measurement optical system is
a detection-side optical system attached to the processing apparatus, emitting the first light toward the optical system, receiving the second light from the optical system, and emitting the second light toward a detection element; When,
and the detection element that detects the second light from the detection-side optical system,
55. The optical system according to

appendix

53 or 54, wherein a detection result of the second light by the detection element is output to an arithmetic device that generates measurement data of the object based on the detection result.
[Appendix 56]
the spindle rotates the tool around the axis of rotation of the spindle;
56. The optical system according to any one of appendices 53 to 55, wherein the direction of the optical axis on the object side of the optical system is a direction extending along the rotation axis.
[Appendix 57]
The first light emitted from the measurement optical system to the optical system is emitted from a position different from the rotation axis of the main shaft,
56. Any one of Appendices 53 to 56, wherein the optical system includes a second deflection member that deflects the first light so that the traveling direction of the first light from the measurement optical system is coaxial with or parallel to the rotation axis. The optical system according to item 1.
[Appendix 58]
The measurement optical system includes a first deflection member that deflects the first light so that the traveling direction of the first light emitted from the measurement optical system intersects the rotation axis or has a twisted relationship. 57. The optical system according to 57.
[Appendix 59]
The main shaft is rotatable around a rotation axis,
comprising a deflection member that deflects the first light emitted from the measurement optical system;
the deflecting member is rotatable with the rotation of the main shaft;
The measurement optical system includes a detection element capable of detecting the second light,
59. The optical system according to any one of appendices 53 to 58, wherein rotation of the deflection member is controlled based on a detection result of the second light.
[Appendix 60]
60. The optical system according to appendix 59, wherein the rotation of the deflection member is controlled such that the intensity of the second light detected by the detection element is maximized.
[Appendix 61]
61. The optical system according to any one of appendices 53 to 60, including a condensing optical member that condenses the first light from the measurement optical system onto the object.
[Appendix 62]
62. The optical system according to appendix 61, wherein the condensing optical member includes an f-theta lens.
[Appendix 63]
63. The optical system according to any one of appendices 53 to 62, wherein the optical path of the first light and the optical path of the second light overlap between the optical system and the object.
[Appendix 64]
a condensing optical member condensing the first light from the measurement optical system onto the object;
64. The optical system according to any one of appendices 53 to 63, comprising: an optical path bending member that emits the first light from the condensing optical member in a direction that intersects the optical axis direction of the condensing optical system system.
[Appendix 65]
64. The method according to any one of appendices 53 to 64, including an emission position changing member that changes the emission position of the first light so that the irradiation position of the first light on the object changes along the surface of the object. optics.
[Appendix 66]
66. The optical system according to any one of appendices 53 to 65, including a reflecting member that reflects at least part of the first light from the measurement optical system toward the measurement optical system.
[Appendix 67]
67. The optical system of any one of clauses 53-66, wherein each of the tool and the optical system is attachable to the spindle by a mounting device.
[Appendix 68]
A machining tool is attachable to a machine tool having a machining apparatus having a detachable spindle, irradiates an object with a first light, and detects a second light from the object irradiated with the first light. A measuring device capable of measuring the object by
a first optical system attached to a portion different from the main axis of the processing device;
a second optical system detachably attached to the main shaft,
The first optical system emits the first light toward the second optical system and receives the second light from the second optical system.
[Appendix 69]
69. The measuring device according to appendix 68, wherein the measuring device irradiates the object with the first light and detects the second light via the first and second optical systems.
[Appendix 70]
The first optical system passes the first light and the second light,
The second optical system emits the first light from the first optical system toward the object and emits the second light from the object toward the first optical system. The measuring device according to .
[Appendix 71]
the spindle rotates the tool around the axis of rotation of the spindle;
71. The measuring device according to any one of appendices 68 to 70, wherein the direction of the object-side optical axis of the second optical system is a direction extending along the rotation axis.
[Appendix 72]
The first light emitted from the first optical system to the second optical system is emitted from a position different from the rotation axis of the main shaft,
The first optical system includes a first deflection member that deflects the first light so that the traveling direction of the first light emitted from the first optical system intersects with the rotation axis or has a twisted relationship. prepared,
The second optical system includes a second deflection member that deflects the first light so that the traveling direction of the first light from the first optical system is coaxial or parallel to the rotation axis. The measuring device according to any one of 1.
[Appendix 73]
The main shaft is rotatable around a rotation axis,
The second optical system includes a deflection member that deflects the first light emitted from the first optical system,
the deflecting member is rotatable with the rotation of the main shaft;
Further comprising a detection element capable of detecting the second light,
73. The measuring device according to any one of appendices 68 to 72, wherein rotation of the deflection member is controlled based on a detection result of the second light by the detection element.
[Appendix 74]
74. The measurement apparatus according to appendix 73, wherein the rotation of the deflection member is controlled such that the intensity of the second light detected by the detection element is maximized.
[Appendix 75]
75. The measuring device according to any one of appendices 68 to 74, wherein the second optical system includes a condensing optical member that condenses the first light from the first optical system onto the object.
[Appendix 76]
76. The measurement device according to appendix 75, wherein the condensing optical member includes an f-theta lens.
[Appendix 77]
77. According to any one of appendices 68 to 76, wherein the first optical system includes a traveling direction changing member that changes a traveling direction of the first light so that an irradiation position of the first light on the object is changed. measuring device.
[Appendix 78]
78. The measuring device according to appendix 77, wherein the traveling direction changing member includes a galvanomirror.
[Appendix 79]
79. The measuring device according to any one of appendices 68 to 78, wherein the optical path of the first light and the optical path of the second light overlap between the second optical system and the object.
[Appendix 80]
79. The measurement device according to any one of appendices 68 to 79, further comprising a detection element capable of detecting the second light.
[Appendix 81]
Further comprising a detection element capable of detecting the second light,
The first optical system includes an interference optical system that interferes the second light and the third light,
81. The measuring device according to any one of appendices 68 to 80, wherein the detection element detects interference light between the second light and the third light.
[Appendix 82]
The second optical system is
a condensing optical member condensing the first light from the first optical system onto the object;
82. The measurement according to any one of appendices 68 to 81, including: an optical path bending member that emits the first light from the condensing optical member in a direction that intersects the optical axis direction of the condensing optical system Device.
[Appendix 83]
The second optical system includes an emission position changing member that changes the emission position of the first light so that the irradiation position of the first light on the object changes along the surface of the object. The measuring device according to any one of 1.
[Appendix 84]
84. The measurement according to any one of appendices 68 to 83, wherein the second optical system includes a reflecting member that reflects at least part of the first light from the first optical system toward the first optical system. Device.
[Appendix 85]
85. The measuring device according to any one of appendices 68 to 84, further comprising a mounting device capable of mounting each of the tool and the second optical system on the spindle.
[Appendix 86]
The second optical system comprises a second optical system of a first type and a second optical system of a second type different from the first type,
86. The measuring device according to appendix 85, wherein the mounting device mounts one of the tool, the second optical system of the first type, and the second optical system of the second type to the spindle.
[Appendix 87]
87. The measuring device according to appendix 86, wherein the second optical system of the second type is attached to the main shaft after the second optical system of the first type is removed from the main shaft.
[Appendix 88]
88. The measuring device according to appendix 86 or 87, wherein the attachment device attaches the second optical system of the second type to the main shaft after removing the second optical system of the first type from the main shaft.
[Appendix 89]
89. The measuring device according to any one of appendices 68 to 88, wherein the first optical system includes an exchangeable exchangeable optical member.
[Appendix 90]
When the first optical system includes a first optical member as the replacement optical member, the first optical system emits the first light toward the second optical system,
In the case where the first optical system includes a second optical member different from the first optical member as the replacement optical member, the first optical system does not pass through the second optical system. 90. The measuring device according to appendix 89, wherein a first light is emitted toward the object.
[Appendix 91]
the first optical member includes a reflecting member that reflects the first light toward the second optical system;
91. The measuring device according to appendix 90, wherein the second optical member includes a condensing optical member that condenses the first light onto the emission target member.
[Appendix 92]
a processing device having a spindle on which a processing tool is attachable and detachable;
a measuring device capable of measuring the object by irradiating the object with a first light and detecting a second light from the object irradiated with the first light,
The measuring device is attached to the processing device at a position away from the rotation axis along a direction intersecting the rotation axis of the main shaft,
A machine tool, wherein the optical path of the first light and the optical path of the second light overlap between the measuring device and the object.
[Appendix 93]
the measuring device irradiates the object with a first light and detects the second light from the object through an optical system;
93. The machine tool according to appendix 92, wherein an optical axis of the optical system is parallel to the rotation axis.
[Appendix 94]
the measuring device irradiates the object with a first light and detects the second light from the object through an optical system;
93. The machine tool according to appendix 92, wherein an optical axis of the optical system intersects the rotation axis.
[Appendix 95]
95. The machine tool according to appendix 94, wherein the intersection of the optical axis and the object coincides with the intersection of the rotation axis and the object.
[Appendix 96]
During at least part of a machining period in which the object is machined using the tool, the relative positional relationship between the object and the machining device is a first relationship, and the measuring device measures the object. Further comprising a position changing device capable of changing the relative positional relationship such that the relative positional relationship becomes a second relationship different from the first relationship for at least part of the period Machine tools as described.
[Appendix 97]
further comprising a position changing device capable of changing the relative positional relationship between the object and the processing device along a first direction intersecting the rotation axis;
The measuring device moves the first measure an object,
The position changing device changes the relative positional relationship between the second object as the object and the processing device along the first direction based on the information about the measurement result of the first object. 96. Machine tool according to any one of clauses 96.
[Appendix 98]
In the processing device, the position changing device changes a relative positional relationship between a second object as the object and the processing device along the first direction based on information about the measurement result of the first object. processing the second object during at least part of the period of
The position changing device moves a third object as the object and the processing device along the first direction based on information about the measurement result of the first object and information about the measurement result of the second object. 98. The machine tool according to Clause 97, wherein the relative positions are changed.
[Appendix 99]
The measuring device according to any one of appendices 1 to 52 and 92 to 98, wherein the measuring device is an interferometric measuring device capable of measuring the object by detecting interference light between the second light and the third light. machine tools.
[Appendix 100]
The machine tool according to any one of claims 1 to 52 and 92 to 99, wherein the first light includes pulsed light having frequency components arranged at equal intervals on the frequency axis.
[Appendix 101]
68. The optical system according to any one of appendices 53 to 67, wherein the optical system is used in an interferometric measuring device capable of measuring the object by detecting interference light between the second light and the third light. .
[Appendix 102]
102. The optical system according to any one of Claims 53 to 67 and 101, wherein the first light includes pulsed light having frequency components arranged at equal intervals on the frequency axis.
[Appendix 103]
92. The measuring device according to any one of appendices 68 to 91, wherein the measuring device is an interferometric measuring device capable of measuring the object by detecting interference light between the second light and the third light.
[Appendix 104]
104. The measuring device according to any one of Claims 68 to 91 and 103, wherein the first light includes pulsed light having frequency components arranged at regular intervals on the frequency axis.
[Appendix 105]
a processing device having a spindle on which a processing tool is attachable and detachable;
A first optical system attached to a portion different from the main axis of the processing device,
machining an object with the tool attached to the spindle;
The light from the first optical system is irradiated onto the object after being machined by the tool or the object before being machined by the tool through a second optical system detachably attached to the spindle. Do machine tools.
[Appendix 106]
irradiating the object with the light from the first optical system as the first light through the second optical system, and the second light from the object with the first optical system through the second optical system; 106. The machine tool according to appendix 105, wherein the object irradiated with the first light is measured by receiving the light.
[Appendix 107]
107. The machine tool according to appendix 105 or 106, wherein the light from the first optical system is applied as processing light to the object via the second optical system, and the object irradiated with the processing light is processed.
[Appendix 108]
With at least part of the second optical system attached to the main shaft being placed in the recess of the object, the first light is applied to the inner surface of the recess, and the second light from the inner surface of the recess is received. 108. The machine tool according to any one of appendices 1 to 52 and 105 to 107, wherein the shape measurement of the object is performed by the measuring device.
[Appendix 109]
The main shaft is rotatable around a rotation axis,
The irradiation position of the first light on the object is changed by rotating the main shaft with the second optical system attached to the main shaft. The machine tool described in .
[Appendix 110]
further comprising a stage for holding the object;
performing shape measurement of the object held on the stage by the measuring device using the second optical system attached to the main shaft;
After the shape measurement is completed, removing the second optical system from the main shaft while holding the object from the stage, and attaching the tool to the main shaft;
109. The machine tool according to any one of appendices 1 to 52 and 105 to 109, wherein the tool is used to machine the object held on the stage based on the result of the shape measurement.
[Appendix 111]
Before the shape measurement,
Machining the object held on the stage with the tool or a tool different from the tool attached to the spindle;
111. The machine tool according to appendix 110, wherein after the completion of the machining, the second optical system is attached to the spindle to measure the shape of the machined body.

At least part of the constituent elements of each embodiment described above can be appropriately combined with at least another part of the constituent elements of each embodiment described above. Some of the constituent requirements of each of the above-described embodiments may not be used. Further, to the extent permitted by law, the disclosures of all publications and US patents cited in each of the above embodiments are incorporated herein by reference.

The present invention is not limited to the above-described embodiments, and can be modified as appropriate within the scope not contrary to the gist or idea of the invention that can be read from the scope of claims and the entire specification. Optical systems and metrology devices are also included within the scope of the present invention.

1 machine tool 2 processing head 21 spindle 23 tool 3 head drive system 4 stage device 5 measurement device 51 measurement light source 52 measurement head 521 head housing 522 optical system 5221 optical system 5222 galvanomirror 5223 mirror 53 measurement head 531 head housing 532 optics System 5321 Mirror 5322 fθ lens 6 Tool changer 7 Control device W Work RX Rotation axis MX Measurement axis ML Measurement light RL Return light

Claims

a processing device having a spindle on which a processing tool is attachable and detachable;
a measuring device capable of measuring the shape of the object by irradiating the object with a first light and detecting a second light from the object irradiated with the first light,
The measuring device includes a first optical system attached to a portion of the processing device different from the main axis and through which the first light and the second light pass; a second optical system that emits the first light from the system toward the object and emits the second light from the object toward the first optical system.
The machine tool according to claim 1, wherein the optical path of the first light and the optical path of the second light overlap between the second optical system and the object.
The main shaft is rotatable around a rotation axis,
The first light emitted from the first optical system to the second optical system is emitted from a position different from the rotation axis,
The first optical system includes a first deflection member that deflects the first light so that the traveling direction of the first light emitted from the first optical system intersects with the rotation axis or has a twisted relationship. prepared,
2. The second optical system comprises a second deflection member that deflects the first light so that the traveling direction of the first light from the first optical system is coaxial with or parallel to the rotation axis. 2. The machine tool according to 2.
the second deflection member is rotatable with the rotation of the main shaft;
The measurement device includes a detection element capable of detecting the second light,
The machine tool according to claim 3, further comprising a control device that controls rotation of the spindle based on a detection result of the second light by the detection element.
The machine tool according to claim 4, wherein the control device controls the rotation of the main shaft so that the intensity of the second light detected by the detection element is maximized.
6. The first optical system according to any one of claims 1 to 5, wherein the first optical system includes a traveling direction changing member that changes a traveling direction of the first light so as to change an irradiation position of the first light on the object. Machine tools as described.
The main shaft is rotatable around a rotation axis,
The spindle rotates the tool around the rotation axis,
The machine tool according to any one of claims 1 to 6, wherein the direction of the object-side optical axis of the second optical system is a direction extending along the rotation axis.
The machine tool according to any one of claims 1 to 7, wherein the second optical system includes a condensing optical member condensing the first light from the first optical system onto the object.
The machine tool according to any one of claims 1 to 8, wherein the measuring device includes a detection element capable of detecting the second light.
The first optical system includes an interference optical system that interferes the second light and the third light,
The machine tool according to claim 9, wherein the detection element detects interference light between the second light and the third light.
The second optical system is
a condensing optical member condensing the first light from the first optical system onto the object;
The optical path bending member that emits the first light from the condensing optical member in a direction that intersects the optical axis direction of the condensing optical member. Machine Tools.
The second optical system includes an emission position changing member that changes the emission position of the first light so that the irradiation position of the first light on the object changes along the surface of the object. 12. The machine tool according to any one of 11.
further comprising a mounting device capable of mounting the tool on the spindle;
The machine tool according to any one of claims 1 to 12, wherein the mounting device can mount each of the tool and the second optical system on the spindle.
The second optical system comprises a second optical system of a first type and a second optical system of a second type different from the first type,
14. The machine tool according to claim 13, wherein the mounting device mounts one of the tool, the second optical system of the first type, and the second optical system of the second type to the spindle.
15. The machine tool according to claim 14, wherein the attachment device attaches the second optical system of the second type to the spindle after removing the second optical system of the first type from the spindle.
16. A machine tool according to any one of claims 1 to 15, wherein the first optical system includes an exchangeable exchangeable optical member.
When the first optical system includes a first optical member as the replacement optical member, the first optical system emits the first light toward the second optical system,
In the case where the first optical system includes a second optical member different from the first optical member as the replacement optical member, the first optical system does not pass through the second optical system. 17. The machine tool of claim 16, wherein a first light is directed toward the object.
the first optical member includes a reflecting member that reflects the first light toward the second optical system;
18. The machine tool of claim 17, wherein the second optical member includes a condensing optical member concentrating the first light onto the object.
With at least part of the second optical system attached to the main shaft being placed in the recess of the object, the first light is applied to the inner surface of the recess, and the second light from the inner surface of the recess is received. The machine tool according to any one of claims 1 to 18, wherein the shape measurement of the object is performed by the measuring device.
The main shaft is rotatable around a rotation axis,
The irradiation position of the first light on the object is changed by rotating the main shaft with the second optical system attached to the main shaft, according to any one of claims 1 to 19. Machine Tools.
further comprising a stage for holding the object;
performing shape measurement of the object held on the stage by the measuring device using the second optical system attached to the main shaft;
After the shape measurement is completed, with the stage holding the object, the second optical system is removed from the main shaft and the tool is attached to the main shaft;
The machine tool according to any one of claims 1 to 20, wherein the tool is used to machine the object held on the stage based on the result of the shape measurement.
Before the shape measurement,
Machining the object held on the stage with the tool or a tool different from the tool attached to the spindle;
22. The machine tool according to claim 21, wherein after the machining is completed, the second optical system is attached to the spindle to measure the shape of the machined object.
a processing device having a spindle on which a processing tool is attachable and detachable;
a measuring device capable of measuring the object by irradiating the object with a first light and detecting a second light from the object irradiated with the first light,
The measuring device comprises a first optical system attached to a portion different from the main shaft of the processing device, and a second optical system detachably attached to the main shaft,
A machine tool, wherein the first optical system emits the first light toward the second optical system and receives the second light from the second optical system.
a processing device having a spindle on which a processing tool is attachable and detachable;
a first optical system attached to a portion different from the main axis of the processing device and used for measuring an object,
The first optical system emits a first light toward a second optical system detachably attached to the main axis, and emits a first light from the object irradiated with the first light via the second optical system. 2 A machine tool that receives light.
An optical system for use in a machine tool having a machining apparatus having a spindle to which a machining tool is detachable,
Detachably attached to the main shaft,
receiving a first light emitted from a measurement optical system attached to a portion different from the main axis of the processing apparatus, emitting the received first light toward an object, and emitting a second light from the object; receiving light and emitting the received second light toward the measurement optical system;
The optical system, wherein the second light is light for measuring the object.
A machining tool is attachable to a machine tool having a machining apparatus having a detachable spindle, irradiates an object with a first light, and detects a second light from the object irradiated with the first light. A measuring device capable of measuring the object by
a first optical system attached to a portion different from the main axis of the processing device;
a second optical system detachably attached to the main shaft,
The first optical system emits the first light toward the second optical system and receives the second light from the second optical system.