JPH11295046A - Machining tool, optical measuring apparatus using the same and machining equipment provided therewith - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable optical measurement of a work surface during working. SOLUTION: Segment grindstones 14 fixed to a tool base 12 of a machining tool 10 come into contact with a work 100 and work it. Six segment grindstones 14 are circularly arranged at intervals, an annular tool ring part is constituted, and tool trench parts 15 are formed between adjacent grindstones 14. Light through holes 44 are arranged in the tool trench parts 15. A compressed gas jetting hole 50 is formed in the central part of the tool base 12. At the time of working, coolant as working fluid is supplied from a coolant feeding port 42 in the central part of the grindstone 14, When compressed air is spouted from the jetting hole 50 and blows through the tool trench parts 15 between the grindstones 14, the coolant in the vicinity of outlets of light through holes 44 is blown off. Since a measuring light for optical measurement can pass the light through holes 44, optical measurement during working is enabled.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing tool mounted on a processing apparatus, and more particularly, to a method for performing optical measurement on a surface of a work (workpiece) held by the processing apparatus during processing. Related to processing tools. The present invention also relates to an optical measurement device and a processing device using such a processing tool.

[0002]

2. Description of the Related Art Conventionally, mirror finishing and grinding for processing a surface of a work to a mirror surface state are well known, and have been applied to the manufacture of various products. Particularly in grinding, very high processing accuracy is required, and precise measurement is performed to check the processing accuracy. It is well known to use optical metrology techniques for this type of precision measurement. For example, in optical interference measurement, optical interference fringe detection is performed. The surface properties (undulation, roughness, shape, etc.) are measured using an image of interference fringes representing the surface shape of the work. As this type of measuring device, a Fizeau interferometer, a Michelson interferometer, and the like are known.

[0003]

In a normal grinding process,
During processing, a large amount of processing liquid (such as water) is continuously supplied to the work. When a large amount of machining liquid is present, it is difficult to perform optical measurement on the work surface. Also, during processing, there is a processing tool near the work, and this processing tool hinders optical measurement. Therefore, conventionally, precise measurement by optical measurement cannot be performed during processing.

Therefore, conventionally, a certain amount of processing is performed in a state where the work is set in a processing apparatus (machine tool). Next, the workpiece is removed from the processing device and cleaned. Then, the work is set on the measuring instrument, and optical measurement is performed. After the measurement is completed, the work is removed from the measuring instrument, set again in the processing device, and processed. In this manner, the processing step and the measurement step are alternately repeated, and the processing is completed when a desired processing accuracy is finally obtained.

However, in the above-described processing method, it is necessary to remove the work from the processing apparatus, set the work on the measuring instrument, perform the reverse operation, and repeat this operation. These operations take a lot of trouble, and this has been a factor that increases processing time and processing cost. Furthermore, since the processing and the measurement are performed by different devices, it is not easy to accurately judge the quality of the processing conditions and the processing accuracy. In addition, when the work is held on the processing apparatus by a clamp or the like, the work may be distorted due to too strong a clamping force, and this distortion causes a processing defect. Conventionally, it has been difficult to detect clamp distortion in a work set state, and it has been difficult to prevent a machining defect beforehand, since providing a dedicated measuring device for detecting clamp distortion may increase the cost.

[0006] In the above, the problem of the prior art has been described with reference to grinding, but the same applies to other processes. Although the optical interference measurement has been exemplified, the same applies to other optical measurements.

[0007] The present invention has been made in view of the above problems. An object of the present invention is to enable optical measurement of a work surface during processing by improving a processing tool mounted on a processing apparatus. Another object of the present invention is to provide a suitable optical measuring device and a processing device using such a processing tool.

[0008]

Means for Solving the Problems (1) In order to achieve the above object, the present invention is used by being attached to a processing device, and a work held by the processing device is supplied with a processing liquid. A machining tool for machining the workpiece in contact with the workpiece, machining the workpiece by contacting the workpiece, a tool base for holding the tool, and mounting the tool on the machining device; A light path for irradiating the work surface with the measurement light for performing light measurement of the work surface is provided through the tool base portion, and provided inside the tool base portion, and compressed gas is provided. A compressed gas passage for guiding and ejecting the compressed gas into the gap between the tool base and the work, and by removing a machining fluid near an outlet of the optical passage by a gas flow ejected through the compressed gas passage, In process Characterized in that it allows the measurement.

According to the present invention, the compressed gas is jetted into the gap between the tool base and the work through the gas passage, and flows through the gap at a high speed. This gas flow removes the working fluid between the tool base and the workpiece, and at this time, the working fluid at the outlet of the optical path is also removed by the high-speed gas flow in a certain direction. Since the processing liquid at the outlet portion is excluded, the measurement light passing through the light path can irradiate the work surface. Therefore, optical measurement of the work surface during processing becomes possible.

(2) In the machining tool device according to one aspect of the present invention, the tool base portion has a work facing surface facing the work at a predetermined distance, and an outlet of the compressed gas passage is provided at the work outlet. The tool portion is provided on the facing surface,
A tool ring that is provided so as to surround the ejection port, protrudes from the work facing surface toward the work, and comes into contact with the work surface, and exposes the work surface to at least a part of the tool ring. A tool groove for allowing gas ejected from the ejection port to escape to the outside of the tool ring; an exit of the optical path provided in the tool groove; and a gas ejected through the compressed gas passage. Removes the machining fluid at the outlet of the optical path when passing through the tool groove.

[0011] As described above, in this embodiment, the compressed gas injection port is surrounded by the tool ring. The compressed gas is blown into a space surrounded by the work facing surface of the tool base, the work surface, and the tool ring. The jetted gas flows through the tool groove provided in the tool ring as a high-speed gas flow in a certain direction, and escapes outside the tool ring. By this high-speed gas flow, the working fluid near the exit of the optical path provided in the tool groove is blown off and removed. Since the machining fluid is excluded, the measurement light passing through the optical path can irradiate the work surface exposed at the tool groove.

As described above, according to the present invention, the tool ring portion,
With the simple configuration in which the gas outlet and the light passage outlet are arranged as described above, the processing liquid at the outlet of the light passage can be reliably removed, thereby enabling light measurement during processing.

In the present invention, the shape of the tool ring is, for example, circular (donut type). However, the shape of the tool ring portion of the present invention may be any shape as long as it can surround the ejection port, and is not limited to the circular shape as described above, and may be another shape, for example, a hollow polygon. .

(3) Preferably, the tool ring portion includes a plurality of segment grindstones attached to the workpiece facing surface of the tool base and disposed around an outlet of the compressed gas passage. Is formed by arranging adjacent segment grindstones with a gap therebetween, and the exit of the light path is provided between the adjacent segment grindstones on the work facing surface.

In this embodiment, a portion between adjacent segment grinding wheels corresponds to a tool groove. A gas escape route is formed by the adjacent grindstone, the work facing surface and the work surface. The jetted gas flows toward the surrounding segment whetstone,
Flow into the escape route above. At this time, the processing liquid near the light path outlet provided between the grinding wheels is blown off. According to this aspect, by arranging the plurality of whetstones apart from each other in an annular shape, the tool ring portion is formed, and at the same time, the tool groove portion is formed. Therefore, the working tool of the present invention can be easily manufactured.

(4) Preferably, the working tool of the present invention is:
A machining fluid supply path is provided so as to pass through the inside of the tool base and the tool ring, and guides a machining fluid to a contact surface between the tool ring and the work. According to this aspect, the machining fluid is supplied to the contact surface between the tool and the work directly from inside the tool. The machining liquid that has run out of the contact surface is blown off by the gas flow described above. Therefore, it is possible to reliably remove the machining fluid at the measurement site while supplying a sufficient machining fluid to the site where the workpiece is being machined.

(5) One aspect of the present invention is an optical measurement device for performing optical measurement of a work being processed by using the above-described processing tool, and the optical measurement device includes a processing device to which the processing tool is mounted. And light guide means for causing measurement light to enter the optical path along the direction of the optical path. Therefore, the measurement light emitted by the optical measurement device passes through the optical path and irradiates the work surface. By this light irradiation, light measurement of the work surface is performed.

(6) One embodiment of the present invention is a processing apparatus for processing a workpiece using the above-mentioned processing tool. Work holding means for holding the work, a tool mounting portion for mounting the working tool, a working fluid supply means for supplying a working fluid to the work, and a compressed gas supplied to the compressed gas passage provided in the working tool. A supply unit for supplying compressed gas; and an optical measurement unit configured to irradiate the work with measurement light through the optical path to perform optical measurement on the surface of the work.

According to this aspect, the present invention is realized in the form of a processing apparatus including the above-described processing tool. The work is processed using the processing tool mounted on the tool mounting portion. The working fluid is supplied to the workpiece by a working fluid supply unit. Then, the compressed gas is supplied to the processing tool by the compressed gas supply means, whereby the processing liquid is removed as described above, and as a result, optical measurement during processing becomes possible.

Preferably, the processing apparatus of the present invention includes processing control means for automatically adjusting processing conditions of processing using the processing tool by feedback of a measurement result by the optical measurement means. According to this aspect, the measurement result is reflected in the processing conditions, defective processing can be prevented beforehand, and processing accuracy can be improved.

As described above, according to the present invention,
By jetting the compressed gas between the work surface and the tool base of the processing tool, it is possible to perform good light measurement through the optical path even during processing. Therefore, there is no need to remove the work from the processing apparatus and set the work on the measuring device during the processing, and it is possible to reduce the processing time and the processing cost. Further, since the measurement can be performed during the processing, the quality of the processing conditions and the processing accuracy can be easily determined. Then, the measurement result can be returned to the processing conditions to prevent processing defects and improve processing accuracy. According to this processing apparatus, it is also possible to detect a clamp distortion caused by an excessive clamping force of a work, and also in this respect, it is possible to prevent a processing defect from occurring.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention (hereinafter, referred to as embodiments) will be described below with reference to the drawings. FIG. 1 shows a grinding apparatus of the present embodiment, and the processing tool of the present invention is mounted on the grinding apparatus.

An XY table 4 is mounted on the device base 2. The XY table 4 is provided so as to be movable in the horizontal direction by an actuator mechanism (not shown) (in the present embodiment, the X axis and the Y axis are set in the horizontal direction so as to be orthogonal to each other, and the Z axis is in the vertical direction. Is set to.) The work 100 is clamped to the XY table 4 by a clamp device (not shown).

The apparatus base 2 has an XY table 4
The Z-axis head 6 is fixed above the. Z axis head 6
Supports the Z-axis spindle 8. Z axis head 6
Has a built-in motor and actuator mechanism, and rotates the Z-axis spindle 8 and moves it in the Z-axis direction.
At the time of machining, the Z-axis spindle 8 is driven downward while rotating.

At the tip of the Z-axis spindle 8,
0 is attached. The processing tool 10 includes a tool base 12
And a plurality of segment grinding wheels 14. The segment whetstone is attached to the tool base 12, and the tool base 1
2 is mounted on a Z-axis spindle 8. At the time of processing, the Z-axis spindle 8 descends while rotating, and the segment grindstone 14 comes into contact with the workpiece 100, whereby processing is performed.

A coolant supply device 16 is attached to the device base 2. Coolant supply device 1
Coolant is stored in the tank of No. 6. The coolant is a kind of machining fluid, lubricates and cools a machining surface, and also removes chips generated during machining. A coolant supply pipe (not shown) for guiding coolant from the coolant supply device 16 to the processing tool 10 is provided in the processing device. The coolant is supplied to the workpiece 100 through the coolant supply pipe and the processing tool 10.

An optical interference measuring device (hereinafter referred to as a measuring device) 18 is attached to the device base 2. The measuring device 18 may be a known device such as a Fizeau type. The measuring device 18 emits a parallel light beam (optical axis 22) downward. This parallel light beam is reflected by the two mirrors 20 and
, And as described later, the light beam reaches the workpiece 100 through an optical path provided in the processing tool 10. The rays are
The light is reflected on the surface of the work 100, further reflected on the mirror 20, and returns to the measuring device 18. The measuring device 18 generates an image of interference fringes using the reflected light. The image of the interference fringes is photographed by a camera built in the measuring device 18. Using the image of the interference fringes, the surface properties such as undulation, roughness, and shape are detected.

A compressed air generator 24 is attached to the device base 2. The compressed air generated by the compressed air generator 24 is supplied to an air supply pipe (not shown) in the apparatus.
Through the machining tool 10 and further through the machining tool 10
And is spouted into the gap between the workpiece 100.

Next, the configuration of the working tool 10 will be described with reference to FIG. FIG. 2A is a bottom view of the working tool 10, and FIG. 2B is a cross-sectional view of FIG. 2A taken along a line XX. The tool base 12 has a disk shape. The tool base 12 has a shank 32 provided so as to protrude from the center of an upper surface (a shank surface) 30 thereof. The shank 32 is sandwiched between the Z-axis spindles 8, whereby the machining tool 10 is held on the Z-axis spindle 8.

The lower surface of the tool base 12 is horizontal and parallel to the upper surface of the workpiece 100. This base lower surface is referred to as a work facing surface 34. Work 10 from work facing surface 34
Six segment grinding wheels 14 are provided so as to protrude downward toward zero. Each segment whetstone 14
Is a columnar member having a fan-shaped cross section, and the tool base 1
2 is fixed with two bolts 36 (see FIG. 3).
As shown in FIG. 2, the six segment grinding wheels 14
Are arranged in a circle along the outer circumference of the tool base 12,
The adjacent segment whetstones 14 are arranged with a gap. In other words, six segment whetstones 14 are obtained by cutting the donut-shaped whetstone at six locations.

As described above, the tool ring portion of the present invention protruding from the work facing surface 34 is constituted by these six segment grindstones 14. The portion between the adjacent segment grindstones 14 corresponds to the tool groove 15 of the present invention, and the work surface is exposed in this portion.

As shown in FIG. 2B, a coolant supply passage 38 is provided inside the machining tool 10. The inlet 39 of the coolant supply passage 38 is on the upper surface of the shank 32. The supply path 38 passes through the inside of the shank 32 and reaches the tool base 12. The supply path 38 branches into six branch supply paths 40 in the tool base 12 and travels in the horizontal direction. The six branched branch supply paths 40 are bent downward and enter different segment grinding wheels 14 respectively. The segment grindstone 14 is also provided with a part of the branch line supply path 40, and the branch line supply path 40 vertically penetrates the segment grindstone 14. The outlet of the branch line supply path 40, that is, the coolant supply port 42, is arranged at the center of each segment grindstone 14, as shown in FIG.

As described above, the inlet 39 of the coolant supply passage 38 is on the upper surface of the shank 32. When the shank 32 is mounted on the Z-axis spindle 8, this inlet 39
Is connected to a coolant supply pipe in the Z-axis spindle 8. As described above, the coolant supply pipe is connected to the coolant supply device 16 through the Z-axis spindle 8 and the Z-axis head 6.

As shown in FIG. 2A, an optical path hole 44 is provided between adjacent segment grinding wheels 14. The light passage hole 44 is a circular through hole that penetrates the tool base 12. One light passage hole 44 is provided in each of the six grinding stone gaps. The six light passage holes 44 are provided at an equal distance from the rotation center of the tool base 12.

As described above with reference to FIG. 1, the measuring light emitted from the optical interference measuring device 18 is guided to the tool base 12 by the mirror 20. At this time, the measuring light travels directly below at a position away from the center of rotation of the base by the same distance as the light passage hole 44 and reaches the tool base 12. Such an optical axis is realized by an appropriate arrangement of the mirror 20.

By providing the light passage hole 44 as described above, the measuring light penetrates the tool base 12 and the work 1
00 can be irradiated. Note that, as a modification, the light passage hole 38 may be a through hole of any shape other than a circle, for example, a slit. Also, the light passage hole 38
In addition, a member such as glass that can transmit light may be embedded therein. In short, any path through which the measuring light can pass through the tool base 12 is included in the light path of the present invention.

Further, as shown in FIG.
A compressed air passage 46 is provided at the center of 2. The compressed air passage 46 is located on the center of rotation of the tool base 12 and penetrates the tool base 12 and the shank 32 vertically. The inlet 48 of the air passage 46 is on the upper surface of the shank 32, and the outlet (compressed air supply port) 50 is
There are four. When the shank 32 is mounted on the Z-axis spindle 8, the inlet 48 on the top of the shank leads to an air supply pipe in the Z-axis spindle 8. As described above, the air supply pipe is connected to the compressed air generator 24 through the Z-axis spindle 8 and the Z-axis head 6.

Here, the operation when performing light measurement (in-process measurement) during machining using the machining tool 10 having the above configuration will be described. During processing, the processing tool 10 is pressed against the workpiece 100 while rotating. Thus, the lower surfaces of the six segment grinding wheels 14 are in contact with the surface of the workpiece 100. The coolant supplied from the coolant supply device 16 passes through the coolant supply passage 38 and the branch supply passage 40 in the tool, and is supplied to the contact surface between the grindstone and the work from the coolant supply port 42 of the segment grindstone 14. The coolant spreads from this contact surface in all directions and flows on the work surface.

When performing optical measurement, the compressed air generator 24
Generates compressed air and sends it out to the air supply pipe. This compressed air passes through a compressed air passage 46 in the tool and is ejected from a compressed air supply port 50 in the work facing surface 34. The compressed air is jetted into a space formed by the tool base 12, the workpiece 100, and the group of annular grindstones, and flows toward the surrounding grindstone group. As described above, the segment whetstone 14
Is in contact with the work surface. Therefore, the blown air is applied to the tool groove portion 1 in the portion between the adjacent segment grinding wheels 14.
Go through 5

With such an air flow, the coolant on the work surface is blown off and removed. At this time, the chips on the work surface are also blown away. That is, in the present invention, the working fluid removing means also functions as a means for removing chips. In particular, in the portion between the grindstones, the flow velocity is increased due to the narrow flow path, and the coolant is reliably blown off. Note that the compressed air generator 24 of the present embodiment only needs to generate air having a pressure high enough to blow off the coolant on the work surface as described above. At this time, the compressed air pressure may be a pressure that does not completely blow off the coolant but slightly remains in the roughness portion of the work surface immediately after the grinding, so that interference fringes can be generated. Also,
The shape of the outlet 50 may be such that the coolant can be slightly left on the rough portion of the work surface so that interference fringes can be generated. Further, the compressed air generator 24 may be provided separately from the processing apparatus 1, and the compressed air may be supplied to the processing apparatus 1 through a pipe or the like.

The light passage hole 44 of the tool base 12 is provided between the segment grinding wheels 14. Therefore, by removing the coolant, the coolant near the exit of the light passage hole 44 disappears and the work surface appears, so that the optical measurement can be performed. Actually, the six light passage holes 44 rotate together with the tool base 12. Therefore, the measurable timing is limited when the light path hole 44 crosses the optical axis of the measurement light. At this measurable timing, the measuring light reaches the workpiece 100 through the light path hole 44. Measurement light is work 1
The light is reflected at 00, passes through the light path hole 44 again, and
The light is reflected at 0 and returns to the optical interference measurement device 18. Thereby, an interference fringe image is obtained, and the surface properties of the workpiece 100 can be measured.

Here, in optical measurement, good measurement results cannot be obtained if there is fluctuation of air in the optical path of the measurement light. This is because the fluctuation of the air causes a change in the refractive index of the air and the like, and the interference fringes also fluctuate. In a commercially available ordinary light wave interference measuring instrument, measures are taken to provide a means for shielding the interference light path from the surroundings in order to prevent air sway which hinders measurement. However, in the present embodiment, it is necessary to blow air to remove the coolant and the chips, so that the interference optical path cannot be shielded.
Therefore, it is required to obtain a good measurement result even while blowing air. This problem has been solved as follows.

In this embodiment, compressed air is blown out between the tool base 12 and the work 100. The jetted air blows through the exit portion of the light passage hole 44 at high speed. Therefore, a high-speed airflow in a certain direction crosses the optical path of the measurement light. Since this gas flow flows straight in a certain direction along the work surface, it can be said to be a laminar flow.

Even when the high-speed gas flow in the certain direction flows along the work surface, the optical path is not blocked, and the interference fringes fluctuate. However, under these conditions, a fast-changing fluctuation occurs. That is, the interference fringes have a characteristic that when the optical path passes through a high-speed gas flow in a certain direction, the interference fringes fluctuate in a short cycle.

In the present embodiment, a stable optical interference measurement is performed using this characteristic. That is, in the present embodiment,
A predetermined considerable number of interference fringe images are acquired during a predetermined measurement period.
Then, the plurality of interference fringe images are averaged.
Conceptually, pixel values of pixels at the same coordinates are extracted from a plurality of interference fringe images. Then, the total sum of these pixel values is divided by the number of images. This process is performed for all pixels of the interference fringe image. Thus, an averaged interference fringe image is obtained. This averaged image represents an image of interference fringes at the center of the fluctuation. It is also preferable to perform image processing using an appropriate threshold value on the averaged image to obtain a clearer image. The above-mentioned averaging process is a type of process for combining a plurality of images. However, the final interference fringe image may be obtained by using another appropriate image process different from the averaging process.

Next, FIG. 4 shows the configuration of the processing apparatus 1 in the form of a block diagram. As shown, a controller 52 for controlling the processing apparatus is provided. The controller 52 controls an actuator that moves the XY table 4 to move the XY table 4 together with the work 100. Further, the controller 52 outputs a control signal to the Z-axis head 6, and controls the rotation drive and the feed drive of the Z-axis spindle 8 (drive, stop, drive speed, etc.). Thereby, the processing tool 10 rotates and is pressed against the workpiece 100, and the rotation speed and the pressing amount (pressing pressure) are adjusted. Further, the controller 52 controls the coolant supply device 16 to supply the coolant to the machining tool 1 during machining.
0. Further, the controller 52 controls the compressed air generator 24 to generate compressed air. As described above, the compressed air is guided to the processing tool 10 through the Z-axis device, and is injected from the lower surface of the tool.

Further, the controller 52 controls the optical interference measuring device 18. The measuring device 18 has a built-in camera device, and an image of interference fringes is captured by the controller 5.
Sent to 2. The controller 52 is provided with a measuring unit 54. The measurement unit 54 includes an image processing unit 56 and a determination unit 58
Having. The image processing unit 56 generates digital data of an image of an interference fringe based on the output of the optical interference measurement device 18. The determination unit 58 makes a determination on the surface texture (undulation and shape, particularly height information) based on the image data of the interference fringes.

Note that the range in which interference fringes can be observed is limited to the area irradiated with the measurement light. Therefore, even if the measurement is performed at one place, only an interference fringe image in an extremely narrow range can be obtained.
Therefore, the controller 52 controls the XY table 4, moves the work 100, and performs the interference measurement at a plurality of places slightly shifted. In the image processing unit 56, the interference fringe images obtained at a plurality of locations thus obtained are synthesized, and thereby, an interference fringe image having an appropriate range is obtained. A well-known technique may be applied to the synthesis method and the interference fringe analysis method. For example, Japanese Patent Application Laid-Open Nos. Hei 9-273908 and Hei 9-187763, "Recent Advances in Optical Interferometry" (Toyhiko Yatakai, Precision Machinery 51/4/198)
5, pages 65 to 72) can be applied to the present embodiment.

The controller 52 is connected to a display 60 and a printer 62 as output devices, and an input device 64 such as a keyboard. The display 60 displays an image generated by the image processing unit 56. The measurement result is printed on the printer 62. The input device 64 is a device for the operator to input the operation, stop, and other instructions of the device. On the display 60,
Screen display necessary for the operation of the operator is also appropriately performed.

Next, the operation of the processing apparatus shown in FIG. 4 will be described.
First, an operator fixes the work 100 to the XY table 4 using a clamp device. Further, various instructions relating to processing are input by the operator using the input device 64. The instruction includes a processing amount (corresponding to the total feed amount of the Z-axis spindle 8) of how much the work 100 is processed. At this point, initial processing conditions (feed speed of the tool, cutting depth, grinding speed, etc.) are input. Here, processing conditions set as defaults may be applied.

The cutting depth of the machining conditions is
This is the amount by which 0 is pressed against the work 100. The depth of cut and feed rate are generally determined from the cutting volume per unit time, but if the depth of cut is large, the undulation of the machined surface will increase due to the occurrence of vibrations during machining and the surface shape will deteriorate. . On the other hand, when the cut amount is small, the processing time becomes longer.

The operator uses the input device 64 to instruct the start of machining. The controller 52 controls the XY table 4 to position the work 100 below the Z-axis spindle 8. Under the control of the controller 52, the Z-axis spindle 8 is fed downward while rotating according to the initial processing conditions. The coolant is supplied by the coolant supply device 16. The coolant is supplied to the contact surface between the segment whetstone 14 and the workpiece 10 through the supply paths 38 and 40 in the processing tool 10.

After the start of processing, manual adjustment or automatic adjustment of processing conditions is performed using the measurement result of the optical interference measurement. The measurement is performed during the processing, that is, in a state where the processing tool 10 is rotated.

[Manual Adjustment] When an appropriate time has elapsed since the start of the processing, the operator uses the input device 64 to instruct the execution of measurement. Alternatively, the measurement is performed when the predetermined time elapses or when the work is processed by a predetermined amount (when the work 100 moves by a predetermined feed amount).
2 may be performed automatically.

The controller 52 includes the compressed air generator 24
To generate compressed air. The compressed air is guided by the air supply path and reaches the machining tool 10 through the Z-axis device. The compressed air is ejected from an air supply port 50 on the lower surface of the tool (the work facing surface 34) through an air passage 46 in the tool. Thus, as described above, the coolant and chips near the exit of the light passage hole 44 are eliminated. In this state, the measurement is performed by the optical interference measurement device 18.

In the image processing section 56 of the controller 52,
Images sequentially sent from the optical interference measuring device 18 are subjected to appropriate image processing and recorded. Using this image, the determination unit 100 determines the swell and the shape, particularly the height. The determination result such as the height is displayed on the display
And is printed on the printer 62.

The operator looks at the measurement results and adjusts the processing conditions using the input device 64 as necessary. For example, an operator pays attention to the undulation in the surface texture and corrects the initial grinding conditions so that the undulation is minimized. Thereby, the flatness of the work 100 can be increased.

When the adjustment of the processing conditions is completed, the controller 52 stops the irradiation of the measuring light to the optical interference measuring device 18 and stops the compressed air generator 24 from generating the compressed air.

Preferably, the above-described measurement and adjustment of the processing conditions are performed a plurality of times at appropriate intervals. In the above description, the compressed air is ejected only during the measurement, but the compressed air may be always ejected. Further, the optical interference measurement may be continuously performed without an interval.

The controller 52 maintains the initial processing conditions unless the processing conditions are changed. If an instruction to change the processing conditions is issued, the instruction is followed. Controller 52
Continues the machining, and ends the machining when the first input machining amount is achieved.

[Automatic Adjustment] In the case of automatic adjustment, the measurement is automatically performed by the controller 52. The measurement timing is the time when a predetermined time has elapsed from the start of processing or the time when processing has been performed by a predetermined amount (the work 100
At the time of moving).

When the measurement timing comes, the controller 5
2 executes the same measurement processing as in the case of the above manual adjustment. In the measuring section 54, the surface texture is obtained from the interference fringe image. Then, processing conditions are automatically adjusted so as to obtain appropriate surface properties.

For example, the judging section 58 obtains height information of the surface texture, and compares the height with an appropriate reference value. If the height is smaller than the reference value, the controller 52
Maintain the current processing conditions. If the height is larger than the reference value, the controller 52 adjusts the processing conditions such as reducing the feed amount to make the height uniform. Further, the undulation is compared with another second reference value, and if the undulation is smaller than the second reference value, it is determined that there is no problem even if the processing time is reduced, and the feed amount or the like may be increased. . A plurality of the above reference values may be provided, and the processing conditions may be adjusted in a plurality of stages.
Further, the processing conditions may be continuously adjusted according to the surface properties.

The determination unit 58 checks whether the processed surface is abnormally distorted. If the force by which the clamping device clamps the work 100 is too strong, or if the force is unbalanced at a plurality of locations, the work 100 may be abnormally distorted. When abnormal distortion is detected, the controller 5
2 stops processing and displays "abnormal distortion" on the display 60 to notify the operator. Note that this process
It is preferable to perform even at the start of processing.

It is preferable that the measurement and the adjustment of the processing conditions are performed a plurality of times at appropriate intervals as in the case of the manual adjustment. Further, the ejection of the compressed air may be continuously performed. Further, the optical interference measurement may be continuously performed without an interval. Then, the surface texture may be constantly monitored, and the processing conditions may be adjusted according to the change in the surface texture.

The controller 52 performs the processing while adjusting the processing conditions as necessary as described above, and ends the processing when the first input processing amount is achieved.
The Z-axis spindle 8 is raised and stopped.

The preferred embodiment of the present invention has been described above. According to the present embodiment, as shown in FIG. 2, a simple configuration of arranging the segment grindstone 14, the light passage hole 44, the compressed air passage 46, and the coolant supply passage 38 makes it possible to maintain the work surface even during machining. Optical interference measurement becomes possible. Therefore, it is not necessary to perform a setup change operation such as removing the work from the processing apparatus and setting the work on the measuring device during the processing, and it is possible to reduce the processing time and the processing cost.

Further, it is possible to easily determine whether the processing conditions are good or not and the processing accuracy during the processing, and based on the determination,
Processing accuracy can be improved, and defective processing can be prevented from occurring.

Further, according to the present embodiment, it is possible to observe the distortion generated by the work clamp. As a result, abnormal distortion caused by the clamp is detected, and in this regard, it is also possible to prevent processing defects.

Further, according to the present embodiment, the result of the optical interference measurement is returned to the processing condition, and the processing condition is automatically adjusted, whereby the processing accuracy can be improved. Conventionally, the adjustment of the processing conditions is performed at the discretion of the operator, and the processing accuracy may vary depending on the skill of the operator. On the other hand, in the present embodiment, high-precision machining can be performed without depending on the skill of the worker. Further, by adjusting the processing conditions, the processing speed can be increased as much as possible, and in this respect, the apparatus of the present embodiment can also contribute to shortening of the processing time.

A modification of this embodiment will be described. In the present embodiment, compressed air is used, but another compressed gas may be used. In the present embodiment, the optical interference measurement is performed. On the other hand, other light measurement may be performed. For example, the work 1 is indicated by a laser type indicator.
The position (height) of the surface of 00 may be measured, and in this case also, the effect of the present invention can be suitably obtained similarly to the above-described embodiment. Further, in the present embodiment, the present invention is applied to grinding, but the present invention is similarly applicable to other types of processing within the scope of the present invention.

In this embodiment, since the optical axis 22 is in the external atmosphere, the interference fringes may fluctuate and the mirror 20 may be contaminated. It may be a structure to cover from. Optical axis 2
The light wave passing through 2 can be guided using an optical fiber and the mirror 20 can be eliminated. In such a case where an optical fiber is used, a lens is provided at the exit of the light wave to provide an area necessary for interference. May be generated.

[Brief description of the drawings]

FIG. 1 is a view showing a processing apparatus according to an embodiment of the present invention.

FIG. 2 is a view showing a processing tool mounted on the processing apparatus of FIG. 1;

FIG. 3 is an enlarged view of the segment grinding wheel of FIG. 2;

FIG. 4 is a block diagram illustrating a configuration of the processing apparatus of FIG. 1;

[Explanation of symbols]

1 processing equipment, 2 equipment base, 4 XY table, 6
Z-axis head, 8 Z-axis spindle, 10 processing tools,
Reference Signs List 12 tool base, 14 segment whetstone, 16 coolant supply device, 18 optical interference measurement device, 20 mirror, 22 optical axis, 24 compressed air generator, 32 shank, 34 work facing surface, 38 coolant supply path, 4
2 coolant supply port, 44 light passage hole, 46 compressed air passage, 50 compressed air supply port, 52 controller,
54 measuring unit, 56 image processing unit, 58 judgment unit, 60
Display, 62 printer, 64 input device, 1
00 work.

Claims (8)

[Claims] 1. A processing tool which is used by being mounted on a processing device and processes a work held by the processing device in a state in which a processing liquid is supplied to the work, wherein the processing tool contacts the work and A tool part for processing the workpiece, a tool base part for holding the tool part and mounting it on the processing device, and a measurement part provided through the tool base part for performing optical measurement of the work surface. An optical path for allowing light to pass through the tool base to irradiate the work surface; and a compressed gas path provided inside the tool base and guiding compressed gas to be ejected into a gap between the tool base and the work. A machining tool, comprising: removing a machining fluid near an outlet of the optical passage by a gas flow ejected through the compressed gas passage, thereby enabling optical measurement during machining. 2. The processing tool according to claim 1, wherein the tool base has a work facing surface facing the work at a predetermined distance, and an outlet of the compressed gas passage has a work facing surface. The tool portion is provided so as to surround the ejection port, has a tool ring portion that protrudes from the work facing surface toward the work and comes into contact with the work surface, at least the tool ring portion In part, a tool groove is provided for exposing a work surface and allowing gas ejected from the ejection port to escape to the outside of the tool ring, and an exit of the light path is provided in the tool groove. A processing tool, wherein gas ejected through a compressed gas passage excludes a processing liquid at an outlet portion of the optical passage when passing through the tool groove. 3. The machining tool according to claim 2, wherein the tool ring is attached to the workpiece facing surface of the tool base, and the plurality of segment grinding wheels are arranged so as to surround an outlet of the compressed gas passage. The tool groove portion is formed by arranging adjacent segment grindstones with a gap therebetween, and the exit of the optical path is provided between the adjacent segment grindstones on the work facing surface. A machining tool characterized by the following: 4. The processing tool according to claim 2, wherein the processing tool is provided so as to pass through the inside of the tool base and the tool ring, and is formed on a contact surface between the tool ring and the work. A processing tool having a processing liquid supply path for guiding a liquid. 5. A processing tool that is used by being mounted on a processing device and processes a work held by the processing device while a processing liquid is supplied to the work, wherein the processing tool is mounted on the processing device. A tool base portion having a work facing surface facing the work at a predetermined distance from the work, and projecting from the work facing surface of the tool base portion toward the work so as to come into contact with the work surface to process the work surface. An annular tool ring portion, a compressed gas passage provided inside the tool base portion, for guiding a compressed gas and ejecting the compressed gas into a gap between the work facing surface and the work surface inside the tool ring portion; and the tool ring portion. A tool groove that exposes the work surface and allows gas ejected from the ejection port to escape to the outside of the tool ring, and is provided through the tool base. An optical path for irradiating the work surface with the measurement light for performing optical measurement of the work surface having an opening in the tool groove portion, and irradiating the work surface with the measurement light, and ejects the gas through the compressed gas passage. A machining tool which enables optical measurement during machining by removing a machining fluid near an outlet of the optical path when a gas flow passes through the tool groove. 6. An optical measurement device for performing optical measurement of a work being processed by using the processing tool according to claim 1, wherein the optical measurement device is provided with the processing tool. An optical measurement device provided in a processing device, comprising: a light guiding unit that causes measurement light to enter the optical path along a path direction of the optical path. 7. A processing apparatus for processing a workpiece using the processing tool according to claim 1, wherein the workpiece holding means holds the workpiece, and a tool mounting unit for mounting the processing tool. A machining fluid supply unit for supplying a machining fluid to the work, a compressed gas supply unit for supplying a compressed gas to the compressed gas passage provided in the machining tool, and irradiating the work with measurement light through the optical passage. And a light measuring means for performing light measurement on the surface of the work by performing the processing. 8. The processing apparatus according to claim 7, further comprising a processing control unit that automatically adjusts processing conditions of processing using the processing tool by feedback of a measurement result obtained by the optical measurement unit. Processing equipment.