WO2022160893A1 - 存储区域共享方法及电子设备 - Google Patents
存储区域共享方法及电子设备 Download PDFInfo
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- WO2022160893A1 WO2022160893A1 PCT/CN2021/132269 CN2021132269W WO2022160893A1 WO 2022160893 A1 WO2022160893 A1 WO 2022160893A1 CN 2021132269 W CN2021132269 W CN 2021132269W WO 2022160893 A1 WO2022160893 A1 WO 2022160893A1
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- 238000012795 verification Methods 0.000 claims description 9
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- 230000006870 function Effects 0.000 description 21
- 238000010586 diagram Methods 0.000 description 14
- 238000004891 communication Methods 0.000 description 12
- 238000004590 computer program Methods 0.000 description 4
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- 238000012545 processing Methods 0.000 description 4
- 238000011068 loading method Methods 0.000 description 3
- 230000003190 augmentative effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F15/00—Digital computers in general; Data processing equipment in general
- G06F15/16—Combinations of two or more digital computers each having at least an arithmetic unit, a program unit and a register, e.g. for a simultaneous processing of several programs
- G06F15/163—Interprocessor communication
- G06F15/167—Interprocessor communication using a common memory, e.g. mailbox
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- the present application relates to the field of chip technology, and in particular, to a storage area sharing method and an electronic device.
- each chip has independent storage space.
- each chip can only allocate its own storage space to store data, so each chip must include enough storage space to implement corresponding functions.
- Embodiments of the present application provide a storage area sharing method and an electronic device, which can realize two chips to share a storage area, thereby saving the overall material of the chip and reducing the cost.
- an embodiment of the present application provides a storage area sharing method, which is applied to an electronic device, where the electronic device includes a first chip and a second chip electrically connected to the first chip, and the storage area sharing method includes :
- the second chip is controlled to access the storage area through the USB protocol, so that the second chip schedules the storage area.
- an embodiment of the present application further provides an electronic device, the electronic device includes a first chip and a second chip electrically connected to the first chip, and the electronic device is used for:
- the second chip is controlled to access the storage area through the USB protocol, so that the second chip schedules the storage area.
- an embodiment of the present application also provides an electronic device, including:
- a first chip configured to determine a storage area on the first chip
- a second chip is electrically connected to the first chip, and the second chip is configured to access the storage area through a USB protocol, so that the second chip schedules the storage area.
- FIG. 1 is a schematic diagram of a first structure of an electronic device provided by an embodiment of the present application.
- FIG. 2 is a schematic diagram of a second structure of an electronic device provided by an embodiment of the present application.
- FIG. 3 is a schematic diagram of a third structure of an electronic device provided by an embodiment of the present application.
- FIG. 4 is a first schematic flowchart of a storage area sharing method provided by an embodiment of the present application.
- FIG. 5 is a schematic diagram of an application scenario of the storage area sharing method provided by an embodiment of the present application.
- FIG. 6 is a schematic flowchart of a second method for sharing a storage area provided by an embodiment of the present application.
- FIG. 7 is a third schematic flowchart of a storage area sharing method provided by an embodiment of the present application.
- FIG. 8 is a schematic diagram of a first startup flow of the first chip and the second chip of the electronic device provided by the embodiment of the present application.
- FIG. 9 is a schematic diagram of a second startup flow of the first chip and the second chip of the electronic device provided by the embodiment of the present application.
- FIG. 10 is a schematic diagram of interaction between a first chip and a second chip of an electronic device according to an embodiment of the present application.
- An embodiment of the present application provides an electronic device, and the electronic device may be a CPE (Customer Premise Equipment), a smart phone, a tablet computer, a game device, an AR (Augmented Reality, augmented reality) device, a notebook computer, and a desktop computing device. equipment, etc.
- CPE Customer Premise Equipment
- the electronic device may be a CPE (Customer Premise Equipment), a smart phone, a tablet computer, a game device, an AR (Augmented Reality, augmented reality) device, a notebook computer, and a desktop computing device. equipment, etc.
- FIG. 1 is a first structural schematic diagram of an electronic device 10 provided by an embodiment of the present application.
- the electronic device 10 includes a first chip 11 and a second chip 12 .
- the first chip 11 and the second chip 12 are electrically connected, for example, by a printed circuit.
- Both the first chip 11 and the second chip 12 can be integrated with a processor and a memory, so both the first chip 11 and the second chip 12 can store data and perform data processing.
- the specifications, configurations, and processing speeds of the first chip 11 and the second chip 12 may be different, so that the first chip 11 and the second chip 12 may perform different functions.
- FIG. 2 is a schematic diagram of a second structure of the electronic device 10 according to an embodiment of the present application.
- the first chip 11 includes a flash memory (Flash Memory) 111, a memory (Memory) 112, a bus (Peripheral Component Interconnect Express, PCIE, high-speed serial computer expansion bus standard) port 113, and a USB (Universal Serial Bus, Universal Serial Bus) port 114 and a General Purpose Input Output (GPIO) port 115 .
- flash memory Flash Memory
- memory Memory
- bus Peripheral Component Interconnect Express
- PCIE high-speed serial computer expansion bus standard
- USB Universal Serial Bus
- GPIO General Purpose Input Output
- the flash memory 111, the memory 112, the bus port 113, the USB port 114, and the general-purpose input output port 115 may be electrically connected through a bus.
- the flash memory 111 is used for accessing and scheduling by the second chip 12 .
- the size of the storage space of the flash memory 111 can be set as required.
- Memory 112 may be used to store data and programs.
- the bus port 113 , the USB port 114 , and the general-purpose input and output port 115 can all be used to communicate with the second chip 12 .
- the first chip 11 may further include functional modules such as a processor and a modulation and demodulation module.
- the processor of the first chip 11 may be used for running programs, performing data processing, etc., and for monitoring and scheduling the first chip 11 .
- the modulation and demodulation module can be used to modulate and demodulate the communication signal.
- the second chip 20 includes a memory 121 , a bus port 122 , a USB port 123 , a general-purpose input and output port 124 and a communication port 125 .
- the memory 121, the bus port 122, the USB port 123, the general-purpose input output port 124, and the communication port 125 may also be electrically connected through the bus.
- the memory 121 can be used to store data and programs.
- the bus port 122 , the USB port 123 , and the general-purpose input and output port 124 can all be used to communicate with the first chip 11 .
- the bus port 122 can be communicatively connected with the bus port 113 to realize the communication between the second chip 12 and the first chip 11 through the bus port;
- the USB port 123 can be communicatively connected with the USB port 114 to realize the communication between the second chip 12 and the first chip 11
- the chip 11 communicates through the USB port;
- the general-purpose input and output port 124 can be communicatively connected with the general-purpose input and output port 115, so as to realize the communication between the second chip 12 and the first chip 11 through the general-purpose input and output port.
- the communication port 125 may enable communication between the electronic device 10 and other electronic devices.
- the communication port 125 may include an Ethernet port and a Wi-Fi port, and correspondingly, Ethernet communication and Wi-Fi communication may be implemented.
- the second chip 12 may also include a processor.
- the processor of the second chip 12 can also be used for running programs, performing data processing, etc., and for monitoring and scheduling the second chip 12 .
- the second chip 12 can access and schedule the storage area of the first chip 11 , so that the storage area of the first chip 11 can be shared. Therefore, the storage space of the memory 112 of the first chip 11 can be set larger, and the storage space of the memory 121 of the second chip 12 can be set smaller.
- the storage space of the memory 112 of the first chip 11 may be set to 512MB
- the storage space of the memory 121 of the second chip 12 may be set to 4MB.
- FIG. 3 is a schematic diagram of a third structure of an electronic device 10 provided by an embodiment of the present application.
- the bus port 113 of the first chip 11 may be configured as a bus client mode, that is, the bus client port 113 .
- the bus port 122 of the second chip 12 may be configured in a bus master side mode, that is, the bus master port 122 .
- the bus client port 113 may be understood as the first bus port, and the bus master port 122 may be understood as the second bus port.
- the bus master port 122 is communicatively connected to the bus client port 113 so that the second chip 12 and the first chip 11 can communicate through the bus.
- the USB port 114 of the first chip 11 includes port A1 and port A2.
- Port A1 can be configured as a DEBUG (debugged) port.
- Port A2 can be configured in USB client mode.
- the USB port 123 of the second chip 12 includes a port C1 and a port C2.
- Port C1 can be configured in USB host mode.
- Port C2 can be configured as a DEBUG port or an external port.
- the port A2 may be understood as the first USB port
- the port C1 may be understood as the second USB port.
- the port C1 is communicatively connected to the port A2, so that the second chip 12 can access the storage area on the first chip 11 for the second chip 12 to access and schedule through the port C1.
- the general-purpose input and output ports 115 of the first chip 11 include port B1, port B2, and port B3.
- the port B1 can be understood as the first general input and output port.
- the port B1 is communicatively connected to the second chip 12 , for example, to a processor of the second chip 12 , so that the first chip 11 can send an instruction to the second chip 12 , such as an interrupt instruction.
- Port B2 can be configured as a USB switching control port for sending USB function switching control commands.
- Port B3 can be configured as a signal light control port for sending signal light control commands.
- the general-purpose input and output ports 124 of the second chip 12 include a port D1, a port D2, and a port D3.
- the port D1 can be configured as a power control port for sending power control commands.
- Port D2 can be configured as a signal light control port for sending signal light control commands.
- Port D3 can be understood as the second general-purpose input and output port.
- the port D3 is communicatively connected to the first chip 11 , for example, to the processor of the first chip 11 , so that the second chip 12 can send an instruction to the first chip 11 , such as an interrupt instruction.
- Embodiments of the present application further provide a method for sharing a storage area.
- the method for sharing a storage area can be performed by the electronic device 10 .
- the electronic device 10 includes a first chip 11 and a second chip 12 electrically connected to the first chip 11 .
- the specific structures and functions of the electronic device 10 , the first chip 11 , and the second chip 12 may refer to the above description.
- FIG. 4 is a schematic flowchart of a first method for sharing a storage area provided by an embodiment of the present application.
- the storage area sharing method includes:
- the first chip has a storage space.
- the electronic device may control the first chip to determine the storage area on the first chip, for example, to plan the storage area on the first chip.
- the capacity of this storage area can be set according to actual needs.
- the storage area may be, for example, Flash Memory.
- the first chip may be configured to determine a storage area on the first chip.
- the storage space can be planned at the same time when the first chip is started to determine the storage area.
- the second chip needs to share the storage space of the first chip, it is also possible to control the determination of the storage area on the first chip.
- the storage area can be simulated as a USB storage area, that is, it is controlled that the storage area can be accessed through the USB protocol.
- the electronic device can control the second chip to access the storage area through the USB protocol, so that the second chip schedules the storage area.
- the second chip 12 can access the data stored in the storage area, and can also store the data generated by the operation into the storage area.
- the second chip may be configured to access the storage area through a USB protocol, so that the second chip schedules the storage area.
- the mass storage function in the USB storage function of the first chip core may be enabled first. Then, configure the first chip to be a USB client mode, that is, a USB device mode. Then, a bearer file of the virtual USB is configured, and the bearer file can enable the file of the first chip to be shared with the second chip for access through the mass storage function. Finally, set the first chip to support USB storage mode. So far, the USB virtualization of the storage area of the first chip is completed.
- the u-boot of the second chip can be modified so that the second chip supports loading the USB controller, and supports the corresponding file system and loading method.
- the memory file system function (ramfs function) of the second chip kernel is enabled, and the kernel file and the dtb file are packaged. So far, the second chip can access the storage area of the first chip through the USB protocol.
- FIG. 5 is a schematic diagram of an application scenario of the storage area sharing method provided by the embodiment of the present application.
- the electronic device controls to determine the storage area 111 on the first chip 11 , and controls the second chip 12 to access the storage area 111 through the USB protocol, so as to realize the sharing of the storage area 111 by the second chip 12 .
- the storage area on the first chip can be scheduled by the second chip, so that the storage area of the first chip can be shared. Therefore, the storage space on the second chip can be saved, for example, no storage space may be provided on the second chip, or only a small storage space needs to be provided. Therefore, the overall material of the chip can be saved, and the cost can be reduced.
- an electronic device may include three second chips.
- the number of storage areas determined on the first chip is greater than or equal to the number of the second chips, for example, the number of storage areas determined on the first chip may be six.
- the electronic device controls the second chip to access the storage area through the USB protocol, so that when the second chip schedules the storage area, it can control each second chip to access at least one storage area through the USB protocol, so that each second chip schedules the first storage area.
- each second chip may be configured to access at least one storage area on the first chip through the USB protocol, so that each second chip schedules at least one of the storage areas.
- the number of second chips may be three
- the number of storage areas determined on the first chip may be six
- the electronic device may control each second chip to access two storage areas on the first chip through the USB protocol.
- FIG. 6 is a schematic flowchart of a second method for sharing a storage area provided by an embodiment of the present application. Wherein, before controlling the second chip to access the storage area through the USB protocol, it further includes:
- the second chip needs the support of firmware when running. Therefore, before controlling the second chip to access the storage area of the first chip through the USB protocol, the electronic device can also obtain the firmware of the second chip, for example, obtain the firmware of the second chip through the first chip, and store the firmware in the first chip. The preset memory area of the chip. Subsequently, the electronic device controls the second chip to load the component from the preset storage area to activate the second chip.
- the address of the preset storage area can be agreed upon according to a protocol, and both the first chip and the second chip comply with the protocol. Therefore, the second chip can access the preset storage area according to the protocol, so as to load the firmware from the preset storage area and start up.
- the firmware of the second chip may be stored in other parts of the electronic device, for example, in an external memory, or in other storage locations of the first chip.
- the first chip may obtain the firmware of the second chip from an external memory, or obtain the firmware of the second chip from other storage locations of the first chip.
- the firmware of the second chip may also be stored in the memory space of the second chip. At this time, when the second chip is started, it can directly load the firmware from its own storage space.
- the second chip does not need to load firmware again to start before accessing the storage area of the first chip through the USB protocol.
- the method before acquiring the firmware of the second chip and storing the firmware in a preset storage area of the first chip, the method further includes: determining the storage area on the first chip as a preset storage area. That is, the storage area planned on the first chip for scheduling by the second chip can be directly used as the preset storage area for storing the firmware of the second chip.
- FIG. 7 is a third schematic flowchart of a storage area sharing method provided by an embodiment of the present application.
- controlling the second chip to load the firmware from the preset storage area includes:
- control the second chip to load the firmware from the preset storage area to start the second chip
- the integrity check of the firmware can also be performed to detect whether the firmware is damaged.
- the firmware can be checked for integrity through MD5 (Message Digest Algorithm).
- the electronic device controls the second chip to load the firmware from the preset storage area to start the second chip.
- the first chip can send a notification to the second chip, for example, the second chip can be notified through a GPIO (General Purpose Input Output, general input and output) signal. Once the second chip is notified, it can load the firmware and start.
- GPIO General Purpose Input Output, general input and output
- the electronic device controls to update the firmware, for example, controls the first chip to update the firmware.
- the electronic device controls the second chip to load the updated firmware to start the second chip.
- the first chip can send a notification to the second chip, for example, the second chip can be notified through a GPIO signal. Once the second chip is notified, it can load the updated firmware and boot.
- a notification can also be sent to the first chip, for example, the first chip can be notified through a GPIO signal.
- the second chip is controlled to access the storage area of the first chip through the USB protocol, so that after the second chip schedules the storage area, the first chip may also be controlled to run the first keep-alive program.
- the first keep-alive program may perform data interaction with the second chip to obtain the state of the second chip.
- the first keep-alive procedure can be used to monitor whether the state of the second chip is abnormal. For example, when it is detected that the state of the second chip is abnormal, the first chip can send an interrupt instruction to the second chip through the general-purpose input and output port, thereby controlling the second chip to restart.
- the second chip can also be controlled to run the second keep-alive program.
- the second keep-alive program may perform data interaction with the first chip, so as to obtain the state of the first chip.
- the second keep-alive procedure can be used to monitor whether the state of the first chip is abnormal. For example, when it is detected that the state of the first chip is abnormal, the second chip can send an interrupt instruction to the first chip through the general-purpose input and output port, thereby controlling the restart of the first chip.
- FIG. 8 is a schematic diagram of a first startup flow of the first chip and the second chip of the electronic device provided by the embodiment of the present application.
- the first chip is powered on and started, and then the first chip configures the USB storage function, such as enabling the mass storage function in the USB storage function of the first chip core, configuring the first chip as a USB device mode, and configuring the bearer file of the virtual USB .
- the USB storage function such as enabling the mass storage function in the USB storage function of the first chip core, configuring the first chip as a USB device mode, and configuring the bearer file of the virtual USB .
- the power of the second chip can be pulled up, even if the second chip is powered on.
- the first chip enables a keep-alive function, for example, runs a first keep-alive program.
- the firmware is loaded from the first chip through the USB function to start until the second chip is started.
- the second chip enables the keep-alive function, for example, runs a second keep-alive program. So far, the first chip and the second chip are all started up.
- FIG. 9 is a schematic diagram of a second startup flow of the first chip and the second chip of the electronic device provided by the embodiments of the present application.
- the first chip and the second chip are powered on at the same time, that is, the first chip is powered on and the second chip is powered on at the same time. Subsequently, the first chip is configured with a USB storage function, and after the configuration is completed, a keep-alive function is enabled, for example, a first keep-alive program is executed. After the second chip is powered on, it cyclically waits for the configuration of the USB storage function of the first chip to be completed. After the configuration of the USB storage function of the first chip is completed, the second chip loads firmware from the first chip through the USB function to start up, until the start of the second chip is completed. Subsequently, the second chip enables the keep-alive function, for example, runs a second keep-alive program. So far, the first chip and the second chip are all started up.
- FIG. 10 is a schematic diagram of interaction between a first chip and a second chip of an electronic device provided by an embodiment of the present application.
- the firmware is prepared, and the firmware is the start-up firmware of the second chip.
- the first chip sends a notification to the second chip through GIPO to notify the second chip that the firmware preparation is completed.
- the firmware is loaded through the USB channel, and then the firmware is started. It can be understood that during the process of loading firmware on the second chip, USB scanning can be performed, the first chip reads the firmware image from the flash memory, and then the second chip obtains the image read by the first chip through the USB channel and loads the image file.
- a startup completion notification may be sent to the first chip, for example, a notification is sent to the first chip through a GPIO. It can be understood that, after the first chip receives the start-up completion notification sent by the second chip, it can close the communication channel through which the second chip obtains firmware to save resources.
- the present application is not limited by the execution order of the described steps, and certain steps may also be performed in other sequences or simultaneously under the condition of no conflict.
- the storage area sharing method includes: determining a storage area on a first chip; and controlling the second chip to access the storage area through a USB protocol, so that the second chip schedules the storage area.
- the storage area on the first chip can be scheduled through the second chip to realize the sharing of the storage area of the first chip, so the storage space on the second chip can be saved, and the overall material of the chip can be saved ,cut costs.
- An embodiment of the present application further provides a storage medium, where a computer program is stored in the storage medium, and when the computer program runs on a computer, the computer executes the storage area sharing method described in any of the foregoing embodiments.
- the storage medium may include, but is not limited to, a read only memory (ROM, Read Only Memory), a random access memory (RAM, Random Access Memory), a magnetic disk or an optical disk, and the like.
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Abstract
一种存储区域共享方法及电子设备,所述存储区域共享方法应用于电子设备,所述电子设备包括第一芯片以及与所述第一芯片电连接的第二芯片,所述存储区域共享方法包括:在所述第一芯片上确定存储区域;控制所述第二芯片通过USB协议访问所述存储区域,以使所述第二芯片调度所述存储区域。
Description
本申请要求于2021年1月29日提交中国专利局、申请号为202110129774.4、发明名称为“存储区域共享方法、存储介质及电子设备”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
本申请涉及芯片技术领域,特别涉及一种存储区域共享方法及电子设备。
当前,诸如CPE(Customer Premise Equipment,客户终端设备)等电子设备中,通常会设置多个芯片,例如设置双芯片。每个芯片都具有独立的存储空间。在多个芯片的运行过程中,每个芯片都只能调配自身的存储空间来存储数据,从而每个芯片都必须包括足够的存储空间来实现相应的功能。
发明内容
本申请实施例提供一种存储区域共享方法及电子设备,可以实现两个芯片共享存储区域,从而节省芯片的整体物料,降低成本。
第一方面,本申请实施例提供一种存储区域共享方法,应用于电子设备,所述电子设备包括第一芯片以及与所述第一芯片电连接的第二芯片,所述存储区域共享方法包括:
在所述第一芯片上确定存储区域;
控制所述第二芯片通过USB协议访问所述存储区域,以使所述第二芯片调度所述存储区域。
第二方面,本申请实施例还提供一种电子设备,所述电子设备包括第一芯片以及与所述第一芯片电连接的第二芯片,所述电子设备用于:
在所述第一芯片上确定存储区域;
控制所述第二芯片通过USB协议访问所述存储区域,以使所述第二芯片调度所述存储区域。
第三方面,本申请实施例还提供一种电子设备,包括:
第一芯片,被配置为在所述第一芯片上确定存储区域;
第二芯片,与所述第一芯片电连接,所述第二芯片被配置为通过USB协议访问所述存储区域,以使所述第二芯片调度所述存储区域。
为了更清楚地说明本申请实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍。显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的电子设备的第一种结构示意图。
图2为本申请实施例提供的电子设备的第二种结构示意图。
图3为本申请实施例提供的电子设备的第三种结构示意图。
图4为本申请实施例提供的存储区域共享方法的第一种流程示意图。
图5为本申请实施例提供的存储区域共享方法的应用场景示意图。
图6为本申请实施例提供的存储区域共享方法的第二种流程示意图。
图7为本申请实施例提供的存储区域共享方法的第三种流程示意图。
图8为本申请实施例提供的电子设备的第一芯片和第二芯片的第一种启动流程示意图。
图9为本申请实施例提供的电子设备的第一芯片和第二芯片的第二种启动流程示意图。
图10为本申请实施例提供的电子设备的第一芯片和第二芯片的交互示意图。
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域技术人员在没有付出创造性劳动前提下所获得的所有其他实施例,都属于本申请的保护范围。
本申请实施例提供一种电子设备,该电子设备可以为CPE(Customer Premise Equipment,客户终端设备)、智能手机、平板电脑、游戏设备、AR (Augmented Reality,增强现实)设备、笔记本电脑、桌面计算设备等。
参考图1,图1为本申请实施例提供的电子设备10的第一种结构示意图。
电子设备10包括第一芯片11和第二芯片12。第一芯片11与第二芯片12电连接,例如可以通过印刷线路电连接。第一芯片11、第二芯片12都可以集成有处理器和存储器,因此第一芯片11、第二芯片12都可以存储数据以及进行数据处理。
可以理解的,实际应用中,第一芯片11与第二芯片12的规格、配置、处理速度等方面可以是不同的,以使得第一芯片11、第二芯片12可以执行不同的功能。
参考图2,图2为本申请实施例提供的电子设备10的第二种结构示意图。
第一芯片11包括闪存(Flash Memory)111、存储器(Memory)112、总线(Peripheral Component Interconnect Express,PCIE,高速串行计算机扩展总线标准)端口113、USB(Universal Serial Bus,通用串行总线)端口114以及通用输入输出(General Purpose Input Output,GPIO)端口115。闪存111、存储器112、总线端口113、USB端口114以及通用输入输出端口115可以通过总线电连接。
其中,闪存111用于供第二芯片12访问和调度。闪存111的存储空间大小可以根据需要进行设置。存储器112可以用于存储数据和程序。总线端口113、USB端口114、通用输入输出端口115都可以用于与第二芯片12进行通信。
此外,可以理解的,第一芯片11还可以包括处理器、调制解调模块等功能模块。第一芯片11的处理器可以用于运行程序、进行数据处理等,以及用于对第一芯片11进行监控和调度。调制解调模块可以用于对通信信号进行调制、解调。
第二芯片20包括存储器121、总线端口122、USB端口123、通用输入输出端口124以及通信端口125。存储器121、总线端口122、USB端口123、通用输入输出端口124以及通信端口125也可以通过总线电连接。
其中,存储器121可以用于存储数据和程序。总线端口122、USB端口123、通用输入输出端口124都可以用于与第一芯片11进行通信。例如,总线端口122可以与总线端口113通信连接,以实现第二芯片12与第一芯片11通过总线端口 进行通信;USB端口123可以与USB端口114通信连接,以实现第二芯片12与第一芯片11通过USB端口进行通信;通用输入输出端口124可以与通用输入输出端口115通信连接,以实现第二芯片12与第一芯片11通过通用输入输出端口进行通信。通信端口125可以实现电子设备10与其他电子设备之间的通信。例如,通信端口125可以包括以太网端口和无线保真端口,相应的可以实现以太网通信和无线保真通信。
此外,可以理解的,第二芯片12也可以包括处理器。第二芯片12的处理器也可以用于运行程序、进行数据处理等,以及用于对第二芯片12进行监控和调度。
需要说明的是,本申请中,第二芯片12可以访问和调度第一芯片11的存储区域,因此可以实现对第一芯片11的存储区域的共享。因此,第一芯片11的存储器112的存储空间可以设置的较大,而第二芯片12的存储器121的存储空间可以设置的较小。例如,在一些实施例中,第一芯片11的存储器112的存储空间可以设置为512MB,第二芯片12的存储器121的存储空间可以设置为4MB。
参考图3,图3为本申请实施例提供的电子设备10的第三种结构示意图。
其中,第一芯片11的总线端口113可以被配置为总线客户端模式,也即总线客户端口113。第二芯片12的总线端口122可以被配置为总线主机端模式,也即总线主机端口122。总线客户端口113可以理解为第一总线端口,总线主机端口122可以理解为第二总线端口。总线主机端口122与总线客户端口113通信连接,以使得第二芯片12与第一芯片11可以通过总线进行通信。
在一些实施例中,第一芯片11的USB端口114包括端口A1和端口A2。端口A1可以被配置为DEBUG(消除故障)端口。端口A2可以被配置为USB客户端模式。
第二芯片12的USB端口123包括端口C1和端口C2。端口C1可以被配置为USB主机端模式。端口C2可以被配置为DEBUG端口或者外接端口。
其中,端口A2可以理解为第一USB端口,端口C1可以理解为第二USB端口。端口C1与端口A2通信连接,以使得第二芯片12可以通过端口C1访问第一芯片11上供第二芯片12访问和调度的存储区域。
在一些实施例中,第一芯片11的通用输入输出端口115包括端口B1、端口 B2以及端口B3。其中,端口B1可以理解为第一通用输入输出端口。端口B1与第二芯片12通信连接,例如与第二芯片12的处理器通信连接,以使得第一芯片11可以向第二芯片12发送指令,例如发送中断指令。端口B2可以被配置为USB切换控制端口,用于发送USB功能切换控制指令。端口B3可以被配置为信号灯控制端口,用于发送信号灯控制指令。
第二芯片12的通用输入输出端口124包括端口D1、端口D2以及端口D3。其中,端口D1可以被配置为电源控制端口,用于发送电源控制指令。端口D2可以被配置为信号灯控制端口,用于发送信号灯控制指令。端口D3可以理解为第二通用输入输出端口。端口D3与第一芯片11通信连接,例如与第一芯片11的处理器通信连接,以使得第二芯片12可以向第一芯片11发送指令,例如发送中断指令。
本申请实施例还提供一种存储区域共享方法,该存储区域共享方法可以由上述电子设备10执行,该电子设备10包括第一芯片11以及与该第一芯片11电连接的第二芯片12。其中,电子设备10、第一芯片11、第二芯片12的具体结构和功能可以参考上文的描述。
参考图4,图4为本申请实施例提供的存储区域共享方法的第一种流程示意图。其中,该存储区域共享方法包括:
110,在第一芯片上确定存储区域;
120,控制第二芯片通过USB协议访问该存储区域,以使第二芯片调度该存储区域。
可以理解的,第一芯片具有存储空间。电子设备可以对第一芯片进行控制,以在第一芯片上确定存储区域,例如在第一芯片上规划存储区域。该存储区域的容量可以根据实际需要进行设置。该存储区域例如可以为Flash Memory(闪存)。其中,该第一芯片可以被配置为在该第一芯片上确定存储区域。
实际应用中,可以在第一芯片启动的同时对存储空间进行规划,以确定存储区域。或者,也可以在第一芯片启动后的运行过程中,当第二芯片需要共享第一芯片的存储空间时,再控制在第一芯片上确定存储区域。
在第一芯片上确定存储区域后,该存储区域可以模拟成USB存储区域,也即控制该存储区域可以通过USB协议进行访问。随后,电子设备可以控制第二 芯片通过USB协议访问该存储区域,以使第二芯片调度该存储区域。例如,第二芯片12可以访问该存储区域中存储的数据,也可以将运算产生的数据存储到该存储区域中。其中,该第二芯片可以被配置为通过USB协议访问该存储区域,以使第二芯片调度该存储区域。
需要说明的是,第一芯片的存储区域模拟成USB存储区域时,可以先开启第一芯片内核的USB存储功能中的大容量存储器功能。随后,配置第一芯片为USB客户端模式,也即USB设备模式。然后,配置虚拟USB的承载文件,承载文件可以使第一芯片的文件通过大容量存储器功能共享给第二芯片访问。最后,将第一芯片设置为支持USB存储模式。至此,第一芯片的存储区域USB虚拟化完成。
为了实现第二芯片通过USB协议访问第一芯片的存储区域,可以修改第二芯片的u-boot,以使第二芯片支持加载USB控制器、支持对应的文件系统和加载方式。并且,开启第二芯片内核的内存文件系统功能(ramfs功能),并将kernel文件和dtb文件打包。至此,即可实现第二芯片通过USB协议访问第一芯片的存储区域。
例如,参考图5,图5为本申请实施例提供的存储区域共享方法的应用场景示意图。其中,电子设备控制在第一芯片11上确定存储区域111,并控制第二芯片12通过USB协议访问该存储区域111,以实现第二芯片12对该存储区域111的共享。
从而,可以通过第二芯片调度第一芯片上的存储区域,实现对第一芯片的存储区域进行共享。因此,可以节省第二芯片上的存储空间,例如第二芯片上可以不设置存储空间,或者只需要设置较小的存储空间即可。从而,可以节省芯片的整体物料,降低成本。
在一些实施例中,第一芯片上确定的存储区域为至少两个。从而,可以在第一芯片上规划多个存储区域供第二芯片调度,提高存储区域规划的灵活性。
可以理解的,在一些实施例中,第二芯片可以为至少两个,例如电子设备可以包括3个第二芯片。第一芯片上确定的存储区域的数量大于或等于第二芯片的数量,例如第一芯片上确定的存储区域的数量可以为6个。
电子设备控制第二芯片通过USB协议访问该存储区域,以使第二芯片调度 该存储区域时,可以控制每一个第二芯片通过USB协议访问至少一个存储区域,以使每一个第二芯片调度第一芯片上的至少一个存储区域。因此,每一个第二芯片都可以被配置为通过USB协议访问第一芯片上的至少一个存储区域,以使每一个第二芯片调度至少一个该存储区域。
例如,第二芯片的数量可以为3个,第一芯片上确定的存储区域的数量可以为6个,电子设备可以控制每一个第二芯片通过USB协议访问第一芯片上的2个存储区域。
在一些实施例中,参考图6,图6为本申请实施例提供的存储区域共享方法的第二种流程示意图。其中,控制第二芯片通过USB协议访问该存储区域之前,还包括:
130,获取第二芯片的固件并将该固件存储到第一芯片的预设存储区域;
140,控制第二芯片从该预设存储区域加载该固件,以启动第二芯片。
可以理解的,第二芯片运行时需要固件的支持。因此,电子设备在控制第二芯片通过USB协议访问第一芯片的存储区域之前,还可以获取第二芯片的固件,例如通过第一芯片获取第二芯片的固件,并将该固件存储到第一芯片的预设存储区域。随后,电子设备控制第二芯片从该预设存储区域加载该部件,以启动第二芯片。
其中,该预设存储区域的地址可以根据协议进行约定,第一芯片、第二芯片都遵守该协议。从而,第二芯片可以根据该协议访问该预设存储区域,以从该预设存储区域加载该固件,并进行启动。
可以理解的,在获取第二芯片的固件之前,第二芯片的固件可以存储在电子设备的其他部位,例如存储在外部存储器中,或者存储在第一芯片的其他存储位置。第一芯片可以从外部存储器中获取第二芯片的固件,或者从第一芯片的其他存储位置获取第二芯片的固件。
在一些实施例中,第二芯片的固件也可以存储在第二芯片的存储空间中。此时,第二芯片在启动时,直接从自身的存储空间中加载固件即可。
还可以理解的,若第二芯片在共享第一芯片的存储区域之前已经启动并运行,那么第二芯片在通过USB协议访问第一芯片的存储区域之前,便不需要再次加载固件来启动了。
在一些实施例中,获取第二芯片的固件并将该固件存储到第一芯片的预设存储区域之前,还包括:将第一芯片上的该存储区域确定为预设存储区域。也即,第一芯片上规划的供第二芯片调度的存储区域可以直接作为该预设存储区域,用来存储第二芯片的固件。
在一些实施例中,参考图7,图7为本申请实施例提供的存储区域共享方法的第三种流程示意图。其中,控制第二芯片从该预设存储区域加载该固件,包括:
141,对该固件进行完整性校验;
142,若校验成功,则控制第二芯片从该预设存储区域加载该固件,以启动第二芯片;
143,若校验失败,则对该固件进行更新,并控制第二芯片加载更新后的固件,以启动第二芯片。
可以理解的,获取第二芯片的固件并将该固件存储到第一芯片的预设存储区域后,还可以对该固件进行完整性校验,以检测该固件是否损坏。例如,可以通过MD5(Message Digest Algorithm,消息摘要算法)对该固件进行完整性校验。
若校验成功,表示该固件未被损坏。此时,电子设备控制第二芯片从该预设存储区域加载该固件,以启动第二芯片。可以理解的,校验成功后,第一芯片可以给第二芯片发送通知,例如可以通过GPIO(General Purpose Input Output,通用输入输出)信号通知第二芯片。第二芯片收到通知后,即可加载该固件并启动。
若校验失败,表示该固件被损坏。此时,电子设备控制对该固件进行更新,例如控制第一芯片对该固件进行更新。固件更新完成后,电子设备控制第二芯片加载更新后的固件,以启动第二芯片。可以理解的,固件更新完成后,第一芯片可以给第二芯片发送通知,例如可以通过GPIO信号通知第二芯片。第二芯片收到通知后,即可加载更新后的固件并启动。
可以理解的,第二芯片启动完成后,也可以给第一芯片发送通知,例如也可以通过GPIO信号通知第一芯片。
在一些实施例中,控制第二芯片通过USB协议访问第一芯片的存储区域, 以使第二芯片调度该存储区域之后,还可以控制第一芯片运行第一保活程序。第一保活程序可以与第二芯片进行数据交互,从而获取第二芯片的状态。第一保活程序可以用于监测第二芯片的状态是否出现异常。例如,当监测到第二芯片的状态出现异常时,第一芯片可以通过通用输入输出端口向第二芯片发送中断指令,从而控制第二芯片重启。
可以理解的,控制第二芯片通过USB协议访问第一芯片的存储区域,以使第二芯片调度该存储区域之后,还可以控制第二芯片运行第二保活程序。第二保活程序可以与第一芯片进行数据交互,从而获取第一芯片的状态。第二保活程序可以用于监测第一芯片的状态是否出现异常。例如,当监测到第一芯片的状态出现异常时,第二芯片可以通过通用输入输出端口向第一芯片发送中断指令,从而控制第一芯片重启。
参考图8,图8为本申请实施例提供的电子设备的第一芯片和第二芯片的第一种启动流程示意图。
首先,第一芯片上电启动,随后第一芯片配置USB存储功能,例如开启第一芯片内核的USB存储功能中的大容量存储器功能、配置第一芯片为USB设备模式、配置虚拟USB的承载文件、将第一芯片设置为支持USB存储模式。配置完成后,可以拉起第二芯片电源,也即使第二芯片上电。随后,第一芯片开启保活功能,例如运行第一保活程序。第二芯片上电后,通过USB功能从第一芯片加载固件进行启动,直至第二芯片启动完成。随后,第二芯片开启保活功能,例如运行第二保活程序。至此,第一芯片、第二芯片均启动完成。
在一些实施例中,参考图9,图9为本申请实施例提供的电子设备的第一芯片和第二芯片的第二种启动流程示意图。
其中,第一芯片和第二芯片同时上电启动,也即第一芯片上电、第二芯片上电同时进行。随后,第一芯片配置USB存储功能,配置完成后开启保活功能,例如运行第一保活程序。第二芯片上电后,循环等待第一芯片USB存储功能配置完成。第一芯片USB存储功能配置完成后,第二芯片通过USB功能从第一芯片加载固件进行启动,直至第二芯片启动完成。随后,第二芯片开启保活功能,例如运行第二保活程序。至此,第一芯片、第二芯片均启动完成。
参考图10,图10为本申请实施例提供的电子设备的第一芯片和第二芯片的 交互示意图。
其中,第一芯片启动后,准备固件,该固件即为第二芯片的启动固件。固件准备完成后,第一芯片通过GIPO发送通知给第二芯片,以通知第二芯片固件已经准备完成。第二芯片启动后,并在接收到第一芯片通过GPIO发送的通知后,通过USB通道加载固件,随后启动固件。可以理解的,第二芯片加载固件的过程中,可以进行USB扫描,第一芯片从闪存中读取固件镜像,随后第二芯片通过USB通道获取第一芯片读取的镜像并加载镜像文件。第二芯片启动固件完成后,可以向第一芯片发送启动完成通知,例如通过GPIO向第一芯片发送通知。可以理解的,第一芯片收到第二芯片发送的启动完成通知后,可以关闭第二芯片获取固件的通信通道,以节省资源。
在本申请的描述中,需要理解的是,诸如“第一”、“第二”等术语仅用于区分类似的对象,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。
具体实施时,本申请不受所描述的各个步骤的执行顺序的限制,在不产生冲突的情况下,某些步骤还可以采用其它顺序进行或者同时进行。
由上可知,本申请实施例提供的存储区域共享方法,包括:在第一芯片上确定存储区域;控制第二芯片通过USB协议访问该存储区域,以使第二芯片调度该存储区域。该存储区域共享方法中,可以通过第二芯片调度第一芯片上的存储区域,实现对第一芯片的存储区域进行共享,因此可以节省第二芯片上的存储空间,从而可以节省芯片的整体物料,降低成本。
本申请实施例还提供一种存储介质,所述存储介质中存储有计算机程序,当所述计算机程序在计算机上运行时,所述计算机执行上述任一实施例所述的存储区域共享方法。
需要说明的是,本领域普通技术人员可以理解上述实施例的各种方法中的全部或部分步骤是可以通过计算机程序来指令相关的硬件来完成,计算机程序可以存储于计算机可读存储介质中,存储介质可以包括但不限于:只读存储器(ROM,Read Only Memory)、随机存取存储器(RAM,Random Access Memory)、磁盘或光盘等。
以上对本申请实施例所提供的存储区域共享方法及电子设备进行了详细 介绍。本文中应用了具体个例对本申请的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本申请的方法及其核心思想;同时,对于本领域的技术人员,依据本申请的思想,在具体实施方式及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本申请的限制。
Claims (20)
- 一种存储区域共享方法,应用于电子设备,所述电子设备包括第一芯片以及与所述第一芯片电连接的第二芯片,所述存储区域共享方法包括:在所述第一芯片上确定存储区域;控制所述第二芯片通过USB协议访问所述存储区域,以使所述第二芯片调度所述存储区域。
- 根据权利要求1所述的存储区域共享方法,其中,所述控制所述第二芯片通过USB协议访问所述存储区域之前,还包括:获取所述第二芯片的固件并将所述固件存储到所述第一芯片的预设存储区域;控制所述第二芯片从所述预设存储区域加载所述固件,以启动所述第二芯片。
- 根据权利要求2所述的存储区域共享方法,其中,所述控制所述第二芯片从所述预设存储区域加载所述固件,包括:对所述固件进行完整性校验;若校验成功,则控制所述第二芯片从所述预设存储区域加载所述固件;若校验失败,则对所述固件进行更新,并控制所述第二芯片加载更新后的固件。
- 根据权利要求2所述的存储区域共享方法,其中,所述获取所述第二芯片的固件并将所述固件存储到所述第一芯片的预设存储区域之前,还包括:将所述第一芯片上的所述存储区域确定为所述预设存储区域。
- 根据权利要求1所述的存储区域共享方法,其中,所述控制所述第二芯片通过USB协议访问所述存储区域之前,还包括:获取所述第二芯片的固件并将所述固件存储到所述第二芯片的存储空间;控制所述第二芯片从所述存储空间加载所述固件,以启动所述第二芯片。
- 根据权利要求1所述的存储区域共享方法,其中,所述存储区域为至少两个。
- 根据权利要求6所述的存储区域共享方法,其中,所述第二芯片为至 少两个,所述存储区域的数量大于或等于所述第二芯片的数量,所述控制所述第二芯片通过USB协议访问所述存储区域,以使所述第二芯片调度所述存储区域,包括:控制每一所述第二芯片通过USB协议访问至少一个所述存储区域,以使每一所述第二芯片调度至少一个所述存储区域。
- 根据权利要求1所述的存储区域共享方法,其中,所述控制所述第二芯片通过USB协议访问所述存储区域,以使所述第二芯片调度所述存储区域之后,还包括:控制所述第一芯片运行第一保活程序,所述第一保活程序用于监测所述第二芯片的状态是否出现异常。
- 根据权利要求1所述的存储区域共享方法,其中,所述控制所述第二芯片通过USB协议访问所述存储区域,以使所述第二芯片调度所述存储区域之后,还包括:控制所述第二芯片运行第二保活程序,所述第二保活程序用于监测所述第一芯片的状态是否出现异常。
- 一种电子设备,所述电子设备包括第一芯片以及与所述第一芯片电连接的第二芯片,所述电子设备用于:在所述第一芯片上确定存储区域;控制所述第二芯片通过USB协议访问所述存储区域,以使所述第二芯片调度所述存储区域。
- 根据权利要求10所述的电子设备,其中,所述控制所述第二芯片通过USB协议访问所述存储区域之前,所述电子设备还用于:获取所述第二芯片的固件并将所述固件存储到所述第一芯片的预设存储区域;控制所述第二芯片从所述预设存储区域加载所述固件,以启动所述第二芯片。
- 根据权利要求11所述的电子设备,其中,所述控制所述第二芯片从所述预设存储区域加载所述固件时,所述电子设备用于:对所述固件进行完整性校验;若校验成功,则控制所述第二芯片从所述预设存储区域加载所述固件;若校验失败,则对所述固件进行更新,并控制所述第二芯片加载更新后的固件。
- 根据权利要求11所述的电子设备,其中,所述获取所述第二芯片的固件并将所述固件存储到所述第一芯片的预设存储区域之前,所述电子设备还用于:将所述第一芯片上的所述存储区域确定为所述预设存储区域。
- 根据权利要求10所述的电子设备,其中,所述控制所述第二芯片通过USB协议访问所述存储区域之前,所述电子设备还用于:获取所述第二芯片的固件并将所述固件存储到所述第二芯片的存储空间;控制所述第二芯片从所述存储空间加载所述固件,以启动所述第二芯片。
- 根据权利要求10所述的电子设备,其中,所述第二芯片为至少两个,所述存储区域的数量大于或等于所述第二芯片的数量,所述控制所述第二芯片通过USB协议访问所述存储区域,以使所述第二芯片调度所述存储区域时,所述电子设备还用于:控制每一所述第二芯片通过USB协议访问至少一个所述存储区域,以使每一所述第二芯片调度至少一个所述存储区域。
- 一种电子设备,包括:第一芯片,被配置为在所述第一芯片上确定存储区域;第二芯片,与所述第一芯片电连接,所述第二芯片被配置为通过USB协议访问所述存储区域,以使所述第二芯片调度所述存储区域。
- 根据权利要求16所述的电子设备,其中:所述第二芯片为至少两个,所述存储区域的数量大于或等于所述第二芯片的数量;每一所述第二芯片均被配置为通过USB协议访问至少一个所述存储区域,以使每一所述第二芯片调度至少一个所述存储区域。
- 根据权利要求16所述的电子设备,其中:所述第一芯片包括第一USB端口,所述第一USB端口被配置为USB客户端模式;所述第二芯片包括第二USB端口,所述第二USB端口被配置为USB主机端模式;其中,所述第二USB端口与所述第一USB端口通信连接,以使所述第二芯片通过所述第二USB端口访问所述存储区域。
- 根据权利要求16所述的电子设备,其中:所述第一芯片包括第一总线端口,所述第一总线端口被配置为总线客户端模式;所述第二芯片包括第二总线端口,所述第二总线端口被配置为总线主机端模式;其中,所述第二总线端口与所述第一总线端口通信连接。
- 根据权利要求16所述的电子设备,其中:所述第一芯片包括第一通用输入输出端口,所述第一通用输入输出端口与所述第二芯片通信连接;所述第二芯片包括第二通用输入输出端口,所述第二通用输入输出端口与所述第一芯片通信连接。
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140041044A1 (en) * | 2012-08-01 | 2014-02-06 | Research In Motion Limited | Controlling access to a shared file |
CN108021518A (zh) * | 2017-11-17 | 2018-05-11 | 华为技术有限公司 | 一种数据交互方法和计算设备 |
CN109101455A (zh) * | 2018-08-01 | 2018-12-28 | 湖南国科微电子股份有限公司 | 共享存储系统与基于共享存储系统的待执行程序读写方法 |
CN111475435A (zh) * | 2020-03-13 | 2020-07-31 | 苏州浪潮智能科技有限公司 | 一种存储介质共享方法、装置及电子设备和存储介质 |
CN112035393A (zh) * | 2020-09-09 | 2020-12-04 | 杭州海康威视数字技术股份有限公司 | 一种节约双片上系统存储资源的方法、双片上系统 |
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140041044A1 (en) * | 2012-08-01 | 2014-02-06 | Research In Motion Limited | Controlling access to a shared file |
CN108021518A (zh) * | 2017-11-17 | 2018-05-11 | 华为技术有限公司 | 一种数据交互方法和计算设备 |
CN109101455A (zh) * | 2018-08-01 | 2018-12-28 | 湖南国科微电子股份有限公司 | 共享存储系统与基于共享存储系统的待执行程序读写方法 |
CN111475435A (zh) * | 2020-03-13 | 2020-07-31 | 苏州浪潮智能科技有限公司 | 一种存储介质共享方法、装置及电子设备和存储介质 |
CN112035393A (zh) * | 2020-09-09 | 2020-12-04 | 杭州海康威视数字技术股份有限公司 | 一种节约双片上系统存储资源的方法、双片上系统 |
CN112948315A (zh) * | 2021-01-29 | 2021-06-11 | Oppo广东移动通信有限公司 | 存储区域共享方法、存储介质及电子设备 |
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