WO2022158479A1 - 樹脂カス除去装置 - Google Patents
樹脂カス除去装置 Download PDFInfo
- Publication number
- WO2022158479A1 WO2022158479A1 PCT/JP2022/001742 JP2022001742W WO2022158479A1 WO 2022158479 A1 WO2022158479 A1 WO 2022158479A1 JP 2022001742 W JP2022001742 W JP 2022001742W WO 2022158479 A1 WO2022158479 A1 WO 2022158479A1
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- WIPO (PCT)
- Prior art keywords
- resin residue
- resin
- residue removing
- head
- support arm
- Prior art date
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- 239000011347 resin Substances 0.000 title claims abstract description 408
- 229920005989 resin Polymers 0.000 title claims abstract description 408
- 238000000465 moulding Methods 0.000 claims abstract description 54
- 238000004140 cleaning Methods 0.000 claims description 56
- 238000001816 cooling Methods 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 9
- 238000007790 scraping Methods 0.000 claims description 5
- 230000033001 locomotion Effects 0.000 abstract description 7
- 238000000926 separation method Methods 0.000 abstract 1
- 238000012986 modification Methods 0.000 description 13
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- 230000010365 information processing Effects 0.000 description 6
- 230000006870 function Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910001369 Brass Inorganic materials 0.000 description 3
- 238000000071 blow moulding Methods 0.000 description 3
- 239000010951 brass Substances 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000004886 head movement Effects 0.000 description 3
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- 239000002699 waste material Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical class N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
- B29C49/42—Component parts, details or accessories; Auxiliary operations
- B29C49/42403—Purging or cleaning the blow-moulding apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/16—Cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
- B29C49/02—Combined blow-moulding and manufacture of the preform or the parison
- B29C49/04—Extrusion blow-moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
- B29C49/42—Component parts, details or accessories; Auxiliary operations
Definitions
- the present invention relates to a resin residue removing device for removing resin residue adhering to a die of a molding device.
- Patent Literature 1 discloses a method of obtaining a hollow molded product by extruding a cylindrical parison from a slit formed in a die of a molding apparatus, allowing it to hang down, and blow-molding it in a mold.
- Patent Document 2 discloses a method of manufacturing a resin panel by extruding a resin sheet from a pair of T-dies of a molding device, allowing it to hang down, and clamping it with a mold together with a core material.
- the resin remains in the vicinity of the slit and adheres to the molding device as resin residue, which may adversely affect molding.
- the present invention has been made in view of such circumstances, and provides a resin residue removing device capable of appropriately removing resin residue adhering to the lower surface of a die of a molding device.
- a resin residue removing device for removing resin residue adhering to the lower surface of a die of a molding apparatus, comprising moving means and a resin residue removing head, wherein the moving means is the resin residue removing head. is moved between a lateral position away from directly below the die and a directly below position, and at the directly below position, between a spaced position away from the lower surface and a close position close to the lower surface and the resin residue removing head is configured to be able to remove the resin residue adhering to the lower surface by moving along the lower surface.
- the moving means is configured to move the resin residue removing head between the side position and the directly below position, and between the separated position and the adjacent position, the resin adhering to the lower surface of the die can be removed by the die. can be removed without damaging the
- the moving means includes a support arm that supports the resin scum removing head on its distal end side, and has at least one of the following configurations (1) and (2).
- (1) A configuration in which the support arm moves in the horizontal direction to move the resin residue removal head between the side position and the directly below position.
- (2) A configuration in which the support arm swings like a seesaw to move the resin residue removal head between the spaced position and the close position.
- the moving means includes guide means, a slide member, and linear drive means, the support arm is supported by the slide member, and the slide member is moved by the guide means by being driven by the linear drive means.
- the resin residue removing head moves between the directly below position and the side position.
- the guide means extends toward the die at the lateral position, and the support arm is advanced and retracted by driving the linear drive means to slide the slide member along the guide means. Then, the resin residue removing head moves between the directly below position and the side position.
- the slide member includes a support shaft that pivotally supports the support arm, and a pressing portion that presses the support arm, and the support arm is positioned opposite to the resin residue removal head with the support shaft interposed therebetween.
- the pressing portion presses the pressed portion downward from above, thereby The support arm swings like a seesaw about the support shaft.
- the pressing portion is a roller installed on a support frame that supports the guide means, and the pressed portion is a cam whose upper surface slopes upward toward the rear end side of the support arm.
- the roller comes into contact with the upper surface and presses the cam downward from above.
- the molding device extrudes a cylindrical parison, and an annular slit is formed in the lower surface of the die so that the cylindrical parison can be extruded
- the resin residue removing head comprises a resin residue removing member and a removal driving means, the resin residue removing member has a facing surface facing the lower surface, and driven by the removal driving means, the resin residue removing member moves toward the facing surface. rotates to move along the slit.
- the resin residue removing member is a columnar member that is rotatably supported.
- the resin residue removing member is a removing blade having a blade-shaped portion in the rotating direction.
- the molding device is for extruding a sheet-shaped resin sheet, and a linear slit is formed in the lower surface of the die to allow the resin sheet to be extruded, and the guide means It is arranged along the longitudinal direction of the slit, and when the slide member is slid along the guide means by being driven by the linear drive means, the support arm slides, and the resin residue removal head moves to the side. position and the directly below position, and further along the slit.
- the slide member includes a support shaft that supports the support arm
- the moving means includes a swing drive means for swinging the support arm in a seesaw shape around the support shaft.
- control means for controlling the moving means is provided, and the control means moves the resin residue removal head to the side at the directly below position by the linear drive means while the resin residue removal head is at the separated position. position, the support arm is then oscillated by the oscillating drive means to move the resin residue removal head to the close position, and then the resin residue removal head moves to the close position. , the resin residue removing head is moved toward the side position along the slit by the linear driving means.
- cleaning means is provided for cleaning the resin residue adhering to the resin residue removal head.
- the cleaning means includes cooling means for cooling the resin residue removing head.
- the cleaning means is a tongue that scrapes off resin residue adhering to the resin residue removal head when the resin residue removal head moves to the lateral position.
- the cleaning means includes a cleaning member that moves along the resin residue removing head to scrape off the resin residue adhering to the resin residue removing head, and an air ejection means that ejects air toward the cleaning member.
- a cleaning member that moves along the resin residue removing head to scrape off the resin residue adhering to the resin residue removing head
- an air ejection means that ejects air toward the cleaning member.
- FIG. 1 is a schematic diagram showing the positional relationship between a resin residue removing device 1 according to a first embodiment of the present invention and a molding apparatus 100 that uses this to remove resin residue.
- 2 is an enlarged side view of the resin residue removing device 1 of FIG. 1.
- FIG. 3A is a front view of the resin residue removing head 4 of the resin residue removing apparatus 1 of FIG. 1
- FIG. 3B is an enlarged view of the L portion of FIG. 3A.
- 4A and 4B are explanatory diagrams showing the rotational driving operation of the resin residue removing head 4 of FIG.
- FIG. 5A is a schematic diagram showing a state in which the resin residue removing head 4 of the resin residue removing apparatus 1 of FIG.
- FIG. 7 is an enlarged view showing the cleaning means 5 (tongue 51) attached to the support frame 2.
- FIG. 8A and 8B are explanatory diagrams schematically showing the operation of the resin scum removing device 1 according to Modification 1-1 of the first embodiment of the present invention.
- 9A and 9B are explanatory diagrams schematically showing the operation of the resin scum removing device 1 according to Modification 1-2 of the first embodiment of the present invention.
- FIG. 6 is a side view showing the positional relationship between a resin residue removing device 1 according to a second embodiment of the present invention and a molding apparatus 100 that uses the device to remove resin residue.
- FIG. 11 is a plan view showing the positional relationship between the resin residue removing device 1 of FIG. 10 and the molding device 100; 11 is a perspective view of the resin scum removing device 1 of FIG. 10.
- FIG. FIG. 11 is a side view of the resin residue removing device 1 of FIG. 10; 11 is a perspective view showing a resin residue removing head 4 of the resin residue removing apparatus 1 of FIG. 10.
- FIG. FIG. 14 is a cross-sectional view taken along line AA of FIG.
- FIG. 13; 16A is a side view showing the arrangement of the cleaning means 5 of the resin residue removing apparatus 1 of FIG. 10, and FIG. 16B is a plan view showing the arrangement of the cleaning means 5.
- FIG. 17A to 17D are explanatory diagrams showing how the resin residue removing head 4 of the resin residue removing apparatus 1 of FIG. 10 moves along the die 101 of the molding apparatus 100.
- FIG. 18A is a schematic diagram showing a state in which the resin residue removing head 4 of the resin residue removing apparatus 1 of FIG. 10 is at the lateral position X1 and the separated position Z1, and FIG. It is a schematic diagram which shows a state in X2 and close position Z2.
- FIG. 18A is a schematic diagram showing a state in which the resin residue removing head 4 of the resin residue removing apparatus 1 of FIG. 10 is at the lateral position X1 and the separated position Z1, and FIG. It is a schematic diagram which shows a state in X2 and close position Z2.
- FIG. 4 is an explanatory view showing a state where a protruding portion 102a is present on the rear edge of the lower surface 102 of the die 101; 20A and 20B are side views showing how the cleaning means 5 of the resin residue removing apparatus 1 of FIG. 10 removes the resin residue R attached to the resin residue removing head 4.
- FIG. 21A and 21B are plan views showing how the cleaning means 5 of the resin residue removing apparatus 1 of FIG. 10 removes the resin residue R attached to the resin residue removing head 4.
- FIG. FIG. 10 is a side view showing the positional relationship between a resin residue removing device 1 according to a modified example 2-1 of the second embodiment of the present invention and a molding apparatus 100 that uses this device to remove resin residue.
- FIG. 10 is an explanatory view schematically showing the operation of the resin scum removing device 1 according to Modified Example 2-2 of the second embodiment of the present invention
- 24A is a plan view showing the support arm 34 and the resin residue removing head 4 of the resin residue removing apparatus 1 according to Modification 1-3 of the first embodiment of the present invention
- FIG. 4 is a side view showing a removal blade 142 attached to a rotating plate 41 of the removal head 4 via an attachment member 41b.
- a resin residue removing apparatus 1 includes a support frame 2, moving means 3, and a resin residue removing head 4.
- FIG. 1 the resin residue removing apparatus 1 removes resin residue adhering to the lower surface 102 of the die 101 of the molding apparatus 100 with the resin residue removing head 4 .
- the molding apparatus 100 using the resin residue removing apparatus 1 of the present embodiment extrudes a cylindrical molten resin 103 (cylindrical parison) from an annular slit (not shown) formed in the die 101. It hangs down.
- a hollow molded product is obtained by blow-molding the suspended molten resin 103 in a pair of molds 104 .
- the resin residue is basically generated by remaining on the die 101 side after the cylindrical molten resin 103 is separated into the die 101 side and the die 104 side during mold clamping.
- each configuration of the resin scum removing apparatus 1 will be described in detail.
- the direction in which the resin residue removal head 4 slides is defined as the front-rear direction, and the direction in which the resin residue removal head 4 advances toward the molding apparatus 100 is defined as the front direction (see FIG. 1).
- a direction perpendicular to the front-back direction and the up-down direction is defined as the left-right direction (see FIGS. 3A and 4A).
- the front-rear direction coincides with the closing/opening direction of the mold 104, as shown in FIG.
- the support frame 2 includes a U-shaped frame 21 having a substantially U-shaped side view, and a pair of side frames 22 provided on both sides of the U-shaped frame 21 in the width direction.
- the U-shaped frame 21 includes an upper frame 21a, a rear frame 21b, and a lower frame 21c. As shown in FIG. 2, the lower frame 21c is longer than the upper frame 21a.
- the side frame 22 is attached to the upper frame 21a and the lower frame 21c at a position near the front end of the upper frame 21a. As shown in FIGS. 6A and 6B, two rollers 23 are provided inside each side frame 22 as a pressing portion for pressing the support arm 34 . The number of rollers 23 is not limited to two each. Also, the pair of side frames 22 support the cleaning means 5 extending forward from above the U-shaped frame 21 .
- the cleaning means 5 has, at its tip, a tongue 51 for scraping off the resin residue adhering to the columnar member 42 of the resin residue removing head 4 .
- support frame 2 itself is suspended and supported together with the molding apparatus 100, for example.
- the moving means 3 moves the resin residue removing head 4 to a position away from directly below the die 101 where it does not interfere with the molding operation, to and from a removable position.
- the moving means 3 includes a rail member 31 as a guide means, a slide member 32, a rodless cylinder 33 as a linear drive means, and a support arm 34, as shown in FIG. A moving means 3 having these configurations is supported by the support frame 2 .
- a pair of left and right rail members 31 are arranged in parallel on the upper surface of the lower frame 21c of the support frame 2 over the front-rear direction.
- Each rail member 31 slidably supports the slide member 32 via a guide block 36 .
- each rail member 31 extends toward the die 101 at the side position X1 (see FIG. 1) of the die 101 .
- each rail member 31 extends along the normal direction of an annular slit (not shown) formed in the die 101 .
- the slide member 32 has a substantially U-shape when viewed from the side, and is arranged along the inner side of the U-shaped frame 21 of the support frame 2 .
- the slide member 32 includes an upper plate portion 32a, a rear plate portion 32b, and a lower plate portion 32c.
- a support shaft 35 for supporting the support arm 34 is arranged at a front position on the upper surface of the lower plate portion 32c.
- a guide block 36 is attached.
- a swing restricting portion 37 that restricts swinging of the support arm 34 is provided on the lower surface of the upper plate portion 32a and at a rear position.
- the rodless cylinder 33 includes a slide block 33a and a guide rail 33b as a guide member.
- the slide block 33 a is fixed to the top of the upper plate portion 32 a of the slide member 32 .
- the guide rail 33b is provided under the upper plate of the support frame 2 along the sliding direction.
- the slide member 32 is configured to slide along the rail member 31 by moving the slide block 33a along the guide rail 33b.
- the rodless cylinder 33 may be of a magnet type or an air type. Further, in the present embodiment, a rodless cylinder is used as the direct-acting drive means in order to reduce the installation area, but an electric cylinder, an air cylinder, or the like may be used as long as the slide member 32 can be reciprocated. .
- the support arm 34 is an elongated plate-like member having a substantially rectangular cross section.
- the support arm 34 supports the resin residue removal head 4 at a front end portion 34a that is the end portion on the molding apparatus 100 side.
- the support arm 34 is rotatably supported by a support shaft 35 that extends in the left-right direction and is provided on the slide member 32 so that the support arm 34 can swing about the support shaft 35 like a seesaw.
- rollers 23 provided on side frames 22 press the left and right side surfaces of the support arm 34 at positions rearward of the position where the support shaft 35 supports the support arm 34 .
- a cam 38 is provided as a pressed portion.
- the cam 38 has an inclined surface 38a whose upper surface is inclined upward toward the rear end side of the support arm 34.
- FIGS. 6A and 6B the cam 38 has an inclined surface 38a whose upper surface is inclined upward toward the rear end side of the support arm 34.
- the resin residue removing head 4 includes a rotary plate 41, a pair of columnar members 42 as resin residue removing members, and removal driving means 43. As shown in FIG.
- the resin residue removal head 4 of this embodiment can remove resin residue adhering to the lower surface 102 of the die 101 by means of the pair of columnar members 42 by rotating the rotating plate 41 at the position X2 directly below the die 101 of the molding apparatus 100. configured to
- the rotating plate 41 is an elongated plate-like member with a substantially rectangular cross-sectional shape.
- the rotary plate 41 is arranged at the front end portion 34 a of the support arm 34 and supported by the support arm 34 via the rotary shaft 44 .
- the pair of columnar members 42 are rotatably (rotatably) supported by shafts 41 a extending upward from both ends of the rotating plate 41 .
- Each columnar member 42 has a columnar shape and is arranged such that its axis is oriented in the vertical direction. As a result, the circular upper surface of the columnar member 42 becomes a facing surface 42a that faces the lower surface 102 of the die 101 (see FIG. 3B).
- a soft metal for example, brass.
- the upper edge of the columnar member 42 is an enlarged diameter portion 42b that is enlarged in an inversely tapered shape.
- the distance between the centers of the pair of columnar members 42 is substantially the same as the diameter of the annular slit formed in the die 101 (in other words, the diameter of the cylindrical molten resin 103 suspended from the molding apparatus 100). It is said that
- the removal drive means 43 are configured to rotate the rotary plate 41 at the front end 34 a of the support arm 34 .
- the removal driving means 43 includes a rotating shaft 44, a front pulley 45, a rear pulley 46, a chain 47, and a rodless cylinder 48, as shown in FIGS. 3A, 4A, and 4B.
- the rotating shaft 44 has a rotating plate 41 fixed to its upper end side, and is configured so that the rotating shaft 44 and the rotating plate 41 rotate integrally.
- a front end side pulley 45 is fitted to the lower end side of the rotating shaft 44 so as not to be relatively rotatable.
- the front end pulley 45 is arranged below the front end portion 34a of the support arm 34 and is covered with a front end cover 34b (see also FIG. 2).
- a gear for accelerating or decelerating may be provided between the front end side pulley 45 and the rotating shaft 44 .
- the rear end side pulley 46 is arranged below the rear end portion 34 d of the support arm 34 and supported by the support arm 34 via the rotating shaft 49 .
- the rear end pulley 46 is covered with a rear end cover 34c (see FIG. 2).
- a single chain 47 is wound around the front end side pulley 45 and the rear end side pulley 46 . Both ends of the chain 47 are connected to the slide blocks 48b of the rodless cylinders 48 to form an annular structure.
- the rodless cylinder 48 includes a support plate 48a (see also FIG. 2), slide blocks 48b, and guide rails 48c.
- the support plate 48 a is arranged so that its longitudinal direction extends along the front-rear direction, and is attached to the support arm 34 .
- the support plate 48a supports the guide rails 48c.
- the slide block 48b is supported by the guide rails 48c and is movable along the guide rails 48c.
- One end of the chain 47 is connected to one end of the slide block 48b, and the other end of the chain 47 is connected to the other end of the slide block 48b.
- the guide rail 48c is arranged along the longitudinal direction of the support plate 48a, that is, along the front-rear direction.
- rodless cylinder 48 may be of a magnet type or an air type. Also, an electric cylinder, an air cylinder, or the like may be used as long as the chain 47 can be moved.
- control means each operation of the resin scum removing device 1 is controlled by control means (not shown).
- the control means can be configured by, for example, an information processing device having a CPU, a memory (eg, flash memory), an input section, and an output section. Further, the processing by each component of the control means configured by the information processing device is performed by the CPU reading and executing the program stored in the memory.
- a personal computer, a PLC (Programmable Logic Controller), or a microcomputer is used as the information processing device.
- some functions of the control means may be configured to be executed on a cloud connected by any communication means.
- the moving means 3 moves the resin residue removing head 4 to a lateral position X1 away from directly below the die 101 and directly below the die 101, as shown in FIGS. 1 and 5A. It is moved between a certain directly below position X2. Further, as shown in FIGS. 5A and 5B, the moving means 3 moves the resin residue removing head 4 from the directly below position X2 to a separated position Z1 away from the bottom surface 102 of the die 101 and a close position close to the bottom surface 102. Move between Z2.
- the "directly below position X2" indicates a position inside the cylinder formed by extending the side surface of the die 101 downward. Further, the fact that the resin residue removing head 4 is located directly below the position X2 means that the rotating shaft 44 of the resin residue removing head 4 is positioned within the cylinder. The operation of moving the removing head by the moving means 3 will be specifically described below.
- the resin residue removing head 4 is retracted to the lateral position X1 as shown in FIG. wait in position.
- the rear end 34d of the support arm 34 of the moving means 3 is brought into contact with the swing restricting portion 37 (see FIG. 2) to swing and move. Specifically, rotation about the support shaft 35 in the upward direction of the rear end portion 34d is restricted.
- the support arm 34 is slightly inclined so that the front end 34a faces downward.
- the rodless cylinder 33 of the moving means 3 is driven in order to move the resin residue removal head 4 to remove the resin residue.
- the slide block 33a of the rodless cylinder 33 is slid forward along the guide rail 33b.
- the slide member 32 slides forward along the rail member 31, and the support arm 34 supported by the slide member 32 moves forward.
- the resin residue removing head 4 supported by the front end portion 34a thereof moves from the side position X1 toward the directly below position X2.
- FIG. 5A shows how the resin residue removal head 4 has moved to the directly below position X2.
- the center of the resin residue removal head 4 that is, the rotary shaft 44 has not yet reached the center of the die 101 .
- the resin residue removing head 4 remains inclined so that the front end portion 34a faces downward.
- the support arm 34 advances and the cam 38 provided on the support arm 34 moves the side frame 22 as shown in FIGS. 6A and 6B. It approaches the roller 23 and then the roller 23 comes into contact with the inclined surface 38a. After that, when the support arm 34 advances further, the roller 23 presses the cam 38 from above downward, and a downward force is applied to the cam 38 .
- a downward force is applied to the cam 38, the support arm 34 swings around the support shaft 35 in a seesaw manner, and the front end portion 34a of the support arm 34 moves upward. This makes the support arm 34 horizontal.
- the rodless cylinder 33, the roller 23, and the cam 38 can be said to be swing drive means for swinging the support arm 34 around the support shaft 35 in a seesaw manner.
- the resin residue removing head 4 moves from the spaced position Z1 to the close position Z2 inside the directly below position X2, as shown in FIGS. 5A and 5B.
- the center (rotating shaft 44) of the resin residue removing head 4 reaches directly below the center of the die 101 when the resin residue removing head 4 moves to the close position Z2.
- the opposing surface 42a of the columnar member 42 faces the lower surface 102 of the die 101 in parallel.
- the resin residue removing apparatus 1 of the present embodiment performs the following resin residue removing operation.
- the die 101 and the columnar member 42 of the resin residue removing head 4 do not move. It is preferable to leave a slight gap (for example, about 2 mm) between them. This prevents the rotating columnar member 42 from interfering with the die 101 .
- the moving means 3 slides the slide block 33a of the rodless cylinder 33 rearward along the guide rail 33b to slide the slide member 32 rearward, and the support arm 34 retreat.
- the resin residue removing head 4 moves from the close position Z2 to the separated position Z1, and then moves from the directly below position X2 to the lateral position X1, contrary to the above.
- the moving means 3 of the present embodiment moves the resin residue removing head 4 between the side position X1 and the directly below position X2 by moving the support arm 34 back and forth with respect to the support frame 2 (moving in the horizontal direction). It is configured to move between Further, the moving means 3 is configured such that the support arm 34 swings like a seesaw to move the resin residue removing head 4 between the separated position Z1 and the adjacent position Z2.
- the operation of removing resin scum is an operation of moving the pair of columnar members 42 along the lower surface 102 of the die 101 . More specifically, the resin residue removing operation is an operation of rotating (revolving) the facing surface 42 a (see FIG. 3B) of each columnar member 42 along the annular slit of the die 101 .
- the resin residue removal operation is performed with the resin residue removal head 4 located at the directly below position X2 and the close position Z2 shown in FIG. 5B.
- the resin residue removal head 4 of this embodiment drives the removal driving means 43 in order to rotate the pair of columnar members 42 .
- the slide block 48b of the rodless cylinder 48 is moved forward and backward along the guide rail 48c.
- the chain 47 moves as the slide block 48b slides, and the front end side pulley 45 rotates.
- the rotating shaft 44 fitted thereto so as not to rotate relative thereto also rotates, and the rotating plate 41 fixed to the upper end side also rotates.
- the rotating plate 41 rotates, the pair of columnar members 42 supported at both ends of the rotating plate 41 via the shafts 41a also rotate.
- the center of the resin residue removal head 4 coincides with the center of the die 101 when the resin residue removal head 4 is in the directly below position X2 and the close position Z2 shown in FIG. , in other words, it is positioned directly below the center of the annular slit.
- the distance between the centers of the pair of columnar members 42 is substantially the same as the diameter of the slit.
- the columnar member 42 rotates (revolves) around the rotating shaft 44
- the columnar member 42 itself can also rotate (rotate) around the shaft 41a. By rotating the columnar member 42 itself, it is possible to prevent the columnar member 42 from being caught by the resin residue.
- the columnar member 42 has an enlarged diameter portion 42b whose upper edge is tapered in an inversely tapered manner, so that resin residue adhering to the die 101 can be effectively torn off. .
- the rodless cylinder 33 is driven to move the support arm 34 forward and backward, thereby moving the resin residue removing head in the horizontal direction. 4 between the lateral position X1 and the directly below position X2, and by swinging the support arm 34, the resin residue removing head 4 can be moved between the separated position Z1 and the adjacent position Z2. ing.
- the resin residue removing device 1 of the present embodiment is capable of performing two motions, that is, the forward/backward motion and the rocking motion of the support arm 34 only by driving one rodless cylinder 33 .
- the support arm 34 swings at the directly below position X2, so that it is possible to prevent the resin residue removing head 4 from interfering with the die 101 during the forward and backward movement.
- the moving means 3 moves the resin residue removing head 4 between the lateral position X1 and the directly below position X2 by moving the support arm 34 back and forth in the horizontal direction.
- the configuration for moving the resin residue removing head 4 between the lateral position X1 and the directly below position X2 is not limited to this.
- the support arm 34 can be rotationally driven by any rotational driving means (not shown) about a rotational axis 39 extending vertically outward of the die 101 in plan view. It is also possible to adopt a configuration in which the resin residue removing head 4 is moved between the lateral position X1 and the directly below position X2.
- An electric motor can be used as the rotation driving means.
- the moving means 3 is configured to swing the support arm 34 around the support shaft 35 to move the resin residue removing head 4 between the separated position Z1 and the adjacent position Z2.
- the configuration for moving the resin residue removing head 4 between the separated position Z1 and the adjacent position Z2 is not limited to this.
- the support arm 34 is moved up and down by the extension/contraction driving means 6, thereby moving the resin residue removal head 4 between the separated position Z1 and the close position Z2.
- the extension/contraction driving means 6 for example, an electric cylinder can be used.
- the resin residue removing head 4 is configured with a pair of columnar members 42 as resin residue removing members for removing resin residue.
- the resin residue removal head 4 serves as a resin residue removal member, instead of the pair of columnar members 42, the rotational direction of the resin residue removal head 4 (rotating plate 41) (FIGS. 24A and 24B). 24B) with a pair of removal blades 142 having blades 142b.
- a pair of removing blades 142 are fixed to both ends of the rotating plate 41 via mounting members 41b.
- the material of the removal blade 142 it is preferable to use a soft metal like the columnar member 42, for example, brass.
- the removal blade 142 is preferably attached to the mounting member 41b in such a manner that the height thereof, that is, the distance between the facing surface 142a of the removal blade 142 and the lower surface 102 of the die 101 can be adjusted.
- the mounting member 41b has a mounting surface 41b1 inclined with respect to the rotation direction
- the removing blade 142 has a mounting surface 142c inclined corresponding to the mounting surface 41b1. Configure to be prepared. Then, while the mounting surface 41b1 and the mounting surface 142c are in contact with each other, the bolt 41c is inserted into a long hole (not shown) formed in the removing blade 142, and the bolt 41c is screwed into the mounting member 41b.
- the removal blade 142 is fixed. With such a configuration, the height of the removing blade 142 can be adjusted by sliding along the mounting surface 41b1 and fixed. In addition, it is more preferable to finely adjust the angle of the removing blade 142 by adjusting the mounting angle of the removing blade 142 with respect to the rotating plate 41 .
- the removing blade 142 is attached to the rectangular rotary plate 41 at an angle so that the blade-like portion 142b faces inward.
- the removal blade 142 is attached such that a straight line formed by the tip of the blade-like portion 142 b extends toward the rotation axis of the rotation plate 41 in plan view.
- the direction of the tip of the blade-like portion 142b coincides with the moving direction of the blade-like portion 142b that rotates with the rotation of the rotary plate 41, effectively scraping off the resin residue adhering to the lower surface 102 of the die 101. It is possible.
- the edge portion 142b has an acute angle at the tip facing the direction of rotation when viewed from the side.
- the blade-like portion 142b can scrape off the resin residue adhering to the lower surface 102 of the die 101 by rotating the rotating plate 41 in a state in which the opposing surface 142a of the removal blade 142 is pressed against the lower surface 102 of the die 101. It is possible. A slight gap may be left between the facing surface 142a of the removing blade 142 and the lower surface 102 of the die 101, as in the first embodiment.
- the rollers 23 provided on the side frames 22 press the cams 38 of the support arms 34 from above downward, so that the rodless cylinders 33 slide the slide members 32 to support the slide members 32 .
- the configuration was such that the arm 34 swings.
- the support arm 34 is oscillatingly driven by a power means other than the rodless cylinder 33 .
- the resin residue removal head 4 is configured with a pair of columnar members 42, but the number and shape of the columnar members 42 are not limited to this. For example, it is possible to make the cross-sectional shape of the columnar member 42 rectangular.
- the rotating plate 41 of the resin residue removing head 4 is rotated by driving the rodless cylinder 48 to move the chain 47 .
- the rotating plate 41 it is also possible to configure the rotating plate 41 to be rotated by other driving means such as an electric motor.
- the molding apparatus 100 in which the resin residue removing apparatus 1 is used has an annular slit, and the cylindrical molten resin 103 (parison) is extruded and suspended.
- the present invention in a molding apparatus that supplies a sheet of molten resin.
- a resin residue removing apparatus 1 includes a support frame 2, a moving means 3, a resin residue removing head 7, and a cleaning means 5. (see FIGS. 16A and 16B) and control means 10 .
- the resin residue removing apparatus 1 removes the resin residue R adhering to the lower surface 102 of the die 101 (T die) of the molding apparatus 100 with the resin residue removing head 7 .
- a molding apparatus 100 using the resin residue removing apparatus 1 of the present embodiment extrudes a sheet-like molten resin 103 (resin sheet), unlike that of the first embodiment.
- a linear slit 105 (see FIG. 11) through which the molten resin 103 can be extruded is formed in the lower surface 102 of the (T die).
- a pair of molding apparatuses 100 are arranged such that a pair of molten resins 103 hang down in parallel.
- a pair of molten resins 103 suspended from each molding device 100 is shaped and clamped by a pair of molds 104 to be molded into a resin molding.
- resin residue is particularly likely to occur when the molten resin 103 to which a filler (particularly, glass) is added is used.
- the resin residue removing device 1 is provided in each of the pair of molding devices 100 .
- the resin residue is basically generated by remaining on the die 101 side after the sheet-like molten resin 103 is separated into the die 101 side and the die 104 side during mold clamping.
- each configuration of the resin scum removing apparatus 1 of this embodiment will be described in detail. Since a pair of resin residue removing devices 1 provided for each molding apparatus 100 have the same configuration, only one of the resin residue removing devices 1 will be described below.
- the longitudinal direction of the slit 105 of the die 101 is defined as the front-rear direction, and the direction perpendicular to the front-rear direction and the vertical direction is defined as the left-right direction (FIGS. 10 and 12). reference).
- the horizontal direction coincides with the closing/opening direction of the mold 104, as shown in FIG.
- a pair of support frames 2 are provided at intervals in the front-rear direction, that is, in the longitudinal direction of the die 101 .
- the support frame 2 supports the guide means 131 of the moving means 3 .
- the support frame 2 itself is suspended and supported together with the molding apparatus 100, for example.
- the moving means 3 moves the resin residue removing head 7 to a position away from directly below the die 101 where it does not interfere with the molding operation (see FIGS. 11 and 17A), and a position where the resin residue adhering to the lower surface 102 of the die 101 can be removed. (see FIGS. 17B and 17C).
- the moving means 3 includes a guide means 131, a slide member 32, a rodless cylinder 33 as a linear drive means, a support arm 34, and a swing drive means. and a first air cylinder 138 as.
- a moving means 3 having these configurations is supported by the support frame 2 .
- the guide means 131 is arranged between the pair of support frames 2 so as to extend in the front-rear direction along the longitudinal direction of the die 101 .
- the guide means 131 slidably supports the slide member 32 via the rodless cylinder 33 .
- the slide member 32 includes a connection plate 32d and a pair of arm support plates 32e.
- the connection plate 32d is supported by a slide block 33a of a rodless cylinder 33, which will be described later, and also supports a pair of arm support plates 32e.
- the connection plate 32d is a plate-like member having a main surface whose normal direction is the horizontal direction, and as shown in FIG. 13, extends downward from a position supported by a slide block 33a described later.
- the connection plate 32d supports the pair of arm support plates 32e on the opposite side (that is, left side) of the slide block 33a, and is located on the same side (that is, right side) as the slide block 33a and below the slide block 33a.
- the one end side mounting portion 138a1 of the first air cylinder 138 is supported by the provided mounting base 32d1.
- the pair of arm support plates 32e are plate-like members each having a main surface whose normal direction is the front-rear direction. 32d. Also, as shown in FIG. 13, the pair of arm support plates 32e extends below the lower ends of the connection plates 32d, and is between the pair of arm support plates 32e at the lower ends of the pair of arm support plates 32e. , a support arm 34 is pivotally supported via a support shaft 35 extending in the front-rear direction.
- the rodless cylinder 33 includes a slide block 33a and a guide member 133b.
- the slide block 33a is supported by the guide member 133b and slides in the front-rear direction along the guide member 133b. Further, the slide block 33a supports the connection plate 32d of the slide member 32.
- the guide member 133b is supported by the guide means 131 and arranged between the pair of support frames 2 so as to extend in the longitudinal direction of the die 101 in the front-rear direction.
- the rodless cylinder 33 is configured to slide the slide member 32 along the guide means 131 by moving the slide block 33a along the guide member 133b.
- rodless cylinder 33 may be of a magnet type or an air type. Further, in the present embodiment, a rodless cylinder is used as the direct-acting drive means in order to reduce the installation area, but an electric cylinder, an air cylinder, or the like may be used as long as the slide member 32 can be reciprocated. .
- the support arm 34 is an elongated plate-like member having a substantially rectangular cross-sectional shape perpendicular to the longitudinal direction, and supports the resin residue removal head 7 .
- the support arm 34 is pivotally supported by a support shaft 35 that extends in the front-rear direction and is provided on the arm support plate 32e, and can swing about the support shaft 35 like a seesaw. More specifically, the support arm 34 includes a straight body portion 34e into which the support shaft 35 is inserted, a tip portion 34f which is the end portion on the molding apparatus 100 side and supports the resin residue removal head 7, and a tip portion 34f. 34f and a base end portion 34g to which the first air cylinder 138 is connected.
- the body portion 34 e is supported by the support shaft 35 and the first air cylinder 138 so as to be lowered toward the lower end of the die 101 . Further, the distal end portion 34f supports the resin residue removing head 7 so that a plate-like base member 70 (described later) thereof is substantially horizontal.
- the first air cylinder 138 as a rocking drive means comprises a cylinder portion 138a and a rod portion 138b.
- the cylinder portion 138a is provided with a one-end mounting portion 138a1, and the other end-side mounting portion 138b1 is provided at the tip of the rod portion 138b.
- the one end side mounting portion 138a1 is rotatably connected to the mounting base 32d1 of the slide member 32 via a rotating shaft 60
- the other end side mounting portion 138b1 is connected to the base end portion 34g of the support arm 34 via a rotating shaft 61.
- both the rotating shaft 60 and the rotating shaft 61 are shafts extending in the front-rear direction.
- the first air cylinder 138 swings the support arm 34 around the support shaft 35 like a seesaw by expanding and contracting the rod portion 138b with respect to the cylinder portion 138a. Specifically, when the rod portion 138b is contracted, the tip portion 34f of the support arm 34 swings downward, and when the rod portion 138b is extended, the tip portion 34f of the support arm 34 is raised.
- the resin residue removing head 7 includes a base member 70 and a plate-like member 71 as a resin residue removing member.
- the resin residue removal head 7 of the present embodiment is attached to the lower surface 102 of the die 101 by the plate-like member 71 by moving the plate-like member 71 along the slit 105 at the position X2 directly below the die 101 of the molding apparatus 100. It is configured to be able to remove resin scum.
- the right side of the base member 70 is supported by the distal end portion 34f of the support arm 34.
- the base member 70 has a substantially rectangular plate shape in plan view.
- the left and front upper surface 70a when the rectangle is roughly divided into four in the plan view of the base member 70 is higher than the left and front upper surface 70a, as shown in the cross-sectional view perpendicular to the left-right direction in FIG. ing.
- the base member 70 supports a plate member 71 on the left and front upper surface 70a.
- the upper surface on the left and rear side serves as a residue receiving portion 70b for receiving resin residue rubbed off by the plate member 71 .
- a vertical surface 70c connecting the left and front upper surface 70a and the left and rear waste receiving portion 70b is curved downward and smoothly connected to the waste receiving portion 70b. Further, the base member 70 supports the second air cylinder 52 of the cleaning means 5 on the upper surface on the right side and front side in plan view.
- the plate-like member 71 is a plate-like member having a main surface whose normal direction is the vertical direction.
- the side where the facing surface 71a of the plate-like member 71 and the rear surface of the plate-like member 71 intersect serves as a removal edge 71b for scraping off the resin residue.
- the material of the plate-like member 71 it is preferable to use a metal softer than that of the base member 70, such as brass.
- the cleaning means 5 is used to remove from the plate-like member 71 the plate-like member 71 of the resin residue removing head 7 scraping off the die 101 and adhering to the plate-like member 71 (see FIGS. 20A and 21A). Used.
- the cleaning means 5 includes a second air cylinder 52 and a cleaning member 53 as forward/backward cleaning means, a first air jetting means 54, and a second air jetting means 55.
- the second air cylinder 52 advances and retreats a piston (not shown) within the cylinder 52a by being supplied with compressed air, and drives a rod 52b (FIGS. 20B and 21B) connected to the piston to advance and retreat.
- the cleaning member 53 can be moved forward and backward by a structure other than the second air cylinder 52 as the forward/backward cleaning means.
- the cleaning member 53 is attached to the tip of the rod 52b. As shown in FIGS. 14 and 15, the cleaning member 53 has a rectangular parallelepiped shape with a substantially rectangular cross-section perpendicular to the left-right direction, and the vertical surface 70c of the base member 70 and the scum receiving portion 70b are smoothly connected. Corresponding to , the side where the rear surface and the lower surface intersect has a curved shape (a shape having an R) in the cross-sectional view.
- the second air cylinder 52 is arranged on the upper right side and rear side of the base member 70 of the resin residue removing head 7 . Further, the second air cylinder 52 is arranged in such a direction that the cleaning member 53 moves laterally along the removal edge 71 b of the plate-like member 71 .
- the first air ejection means 54 includes a pair of front and rear nozzles 54a and an air supply source (not shown).
- the pair of nozzles 54a is arranged above the resin residue removing head 7 and on the right side of the plate member 71 and the cleaning member 53, as shown in FIGS. 14 to 16B.
- the first air jetting means 54 is configured to jet compressed air from the right side to the plate-like member 71 and the cleaning member 53 via the nozzle 54a.
- the second air ejection means 55 includes a pair of left and right nozzles 55a, an air supply source (not shown), and a nozzle support frame 55b.
- the pair of nozzles 55a is supported by a nozzle support frame 55b at a position on the left side of the resin residue removing head 7, as shown in FIGS. 16A and 16B.
- the second air jetting means 55 jets compressed air rearward through a nozzle 55a at a position on the left side of the resin residue removing head 7 .
- Control means 10 controls each operation of the resin residue removing device 1 . Specifically, the control means 10 operates the rodless cylinder 33 and the first air cylinder 138 of the moving means 3, the second air cylinder 52 of the cleaning means 5, the first air jetting means 54, and the second air jetting means 55. to control.
- control means 10 can be configured by, for example, an information processing device including a CPU, a memory (eg, flash memory), an input section, and an output section. Further, the processing by each component of the control means 10 configured by the information processing device is performed by the CPU reading and executing the program stored in the memory.
- a personal computer, a PLC (Programmable Logic Controller), or a microcomputer is used as the information processing device.
- some functions of the control means 10 may be configured to be executed on a cloud connected by any communication means.
- a take-out machine (not shown) for taking out the molded body after mold clamping pinches the molten resin 103 protruding from the upper part of the mold 104.
- the resin scum removing device 1 is operated.
- these operations are preferably performed each time the mold 104 is clamped, but may be performed every predetermined number of times or according to a user's instruction.
- the cleaning operation is performed after the removal head moving operation is completed, following the operation. However, the cleaning operation does not have to be performed every time after the removal head moving operation is completed, and may be performed at predetermined times or in accordance with a user's instruction.
- the control means 10 controls the moving means 3 to move the resin residue removing head 7 to the side away from directly below the die 101 as shown in FIGS. 17A to 17D. It is moved between a lateral position X1 (see FIG. 17A) and a directly below position X2 (see FIGS. 17B to 17D) directly below the die 101.
- FIG. 17A, 17B, and 18A and 18B the control means 10 moves the resin residue removing head 7 away from the lower surface 102 of the die 101 at the directly below position X2 under the control of the moving means 3. 17A, 17B and 18A) and a close position Z2 (see FIGS. 17C, 17D and 18B) close to the lower surface 102.
- FIG. 17A, 17B and 18A controls the moving means 3 to move the resin residue removing head 7 to the side away from directly below the die 101 as shown in FIGS. 17A to 17D. It is moved between a lateral position X1 (see FIG. 17A) and a directly below position X2
- the die 101 and the plate member 71 of the resin residue removing head 7 are in contact with each other.
- the plate-like member 71 By bringing the plate-like member 71 into contact with the die 101 at the close position Z2, it is possible to more reliably scrape off the resin residue adhering to the lower surface 102 of the die 101 . It is also possible to press the plate member 71 of the resin residue removing head 7 against the die 101 .
- the die 101 and the resin residue removing head 7 there is a slight gap between the die 101 and the resin residue removing head 7 (in the first embodiment, the die 101 and the resin residue removing head 4) at the "close position".
- the gap is 0 mm, it is also included.
- the "directly below position X2" indicates a position inside the cylinder formed by downwardly extending the outer edge of the lower surface 102 of the die 101.
- the fact that the resin residue removing head 7 is located directly below the position X2 means that the center of gravity of the plate-like member 71 of the resin residue removing head 7 is positioned within the cylinder.
- the moving operation of the resin residue removing head 7 by the moving means 3 will be specifically described below.
- the resin residue removing device 1 of this embodiment does not perform the resin residue removing operation, as shown in FIG. It is made to stand by at a position that does not interfere with the molding operation by 100 .
- the support arm 34 of the moving means 3 maintains the tip portion 34f lowered by maintaining the rod portion 138b of the first air cylinder 138 in the contracted state. be.
- the resin scum removal head 7 is also in a state in which the tip side thereof is slightly lowered.
- the control means 10 drives the rodless cylinder 33 of the moving means 3 in order to move the resin residue removal head 7 to remove the resin residue. Specifically, the control means 10 slides the slide block 33a of the rodless cylinder 33 forward along the guide rail 33b (see FIGS. 11 and 12). Then, as the slide block 33a slides, the slide member 32 slides forward along the rail member 31, and the support arm 34 supported by the slide member 32 moves forward. As the support arm 34 moves forward, the resin residue removing head 7 supported by the tip 34f moves from the side position X1 to the directly below position X2, as shown in FIGS. 17A and 17B. Furthermore, as shown in FIG. 17B, the control means 10 first moves the resin residue removing head 7 to the position farthest from the lateral position X1 (see FIG. 17A) in the directly below position X2.
- control means 10 moves the rod portion 138b of the first air cylinder 138 to the contracted state from the side position X1 shown in FIG. 17A to the position farthest from the side position X1 in the directly below position X2 shown in FIG. 17B. to maintain.
- the distal end portion 34f of the support arm 34 is maintained in a lowered state, and the resin residue removing head 7 is maintained at the separated position Z1 as shown in FIGS. 17B and 18A. That is, in the present embodiment, the resin residue removing apparatus 1 does not remove the resin residue until the resin residue removing head 7 moves to the farthest position (see FIG. 17B) from the lateral position X1.
- control means 10 extends the rod portion 138b of the first air cylinder 138 while the resin residue removing head 7 is in the position farthest from the lateral position X1 (see FIG. 17B). Then, the support arm 34 swings to raise the tip 34f, and as shown in FIGS. 17C and 18B, the resin residue removing head 7 moves from the spaced position Z1 to the close position Z2 inside the directly below position X2. Then, the control means 10 slides the slide block 33a of the rodless cylinder 33 rearward along the guide rail 33b while maintaining the resin residue removing head 7 at the close position Z2 (see 17C to 17D).
- the resin residue removing head 7 moves along the slit 105 toward the side position X1, and the resin residue adhering to the vicinity of the slit 105 is scraped off by the removal edge 71b of the plate-like member 71.
- FIG. Part of the scraped resin residue adheres to the plate-like member 71, and the resin residue falling from the plate-like member 71 is held in the residue receiving portion 70b.
- the moving means 3 of the present embodiment moves the support arm 34 in the front-rear direction (horizontal direction) with respect to the support frame 2, thereby moving the resin residue removing head 7 to the lateral position X1. It is configured to be moved between the directly below position X2. Further, the moving means 3 is configured to move the resin residue removing head 7 between the distant position Z1 and the close position Z2 by swinging the support arm 34 in a seesaw manner.
- the control means 10 controls the second air cylinder 52, the first air jetting means 54, and the second air jetting means 55 of the cleaning means 5 to control the removal head moving operation. After the end, the resin residue cleaning operation is executed.
- the control means 10 drives the second air cylinder 52 with the resin scum removal head 7 at the lateral position X1.
- the cleaning member 53 attached to the tip of the rod 52b is moved leftward by extending the rod 52b.
- the control means 10 operates the first air jetting means 54 to jet compressed air from the right side to the plate-like member 71 and the cleaning member 53 through the nozzle 54a.
- the control means 10 operates the second air jetting means 55 to jet compressed air rearward through the nozzle 55a at the position on the left side of the resin residue removing head 7 .
- the resin scum R adhering to the plate-shaped member 71 of the resin scum removing head 7 and the resin scum R accumulated in the residue receiving portion 70b are ejected from the cleaning member 53 and the nozzle 54a of the first air ejection means 54. It is peeled off by the compressed air and flung to the left. As a result, the plate member 71 and the dregs receiving portion 70b are cleaned.
- the scum receiving portion 70b and the vertical surface 70c of the base member 70 are smoothly connected, and the side where the rear surface and the lower surface of the cleaning member 53 intersect is curved. With this shape, it is possible to suppress clogging of the resin residue R between the residue receiving portion 70 b and the cleaning member 53 .
- the resin scum R blown away by the cleaning member 53 and the compressed air jetted from the nozzle 54a of the first air jetting means 54 is pushed backward by the compressed air jetted from the nozzle 55a of the second air jetting means 55 (see FIG. 21B).
- flying the resin scum R backward that is, to the side opposite to the die 101 , it is possible to prevent the resin scum R from adhering to the mold 104 or the like arranged below the die 101 .
- the resin residue R thus removed and collected can be pulverized by, for example, a pulverizer and reused.
- the compressed air jetted from the nozzle 54a of the first air jetting means 54 also has the effect of cooling the plate member 71 of the resin residue removing head 7 as cooling means.
- the plate-like member 71 By cooling the plate-like member 71, the viscosity of the adhering resin residue R is reduced, making it possible for the resin residue R to be easily peeled off.
- the rodless cylinder 33 is driven to move the support arm 34 in the front-rear direction (horizontal direction), thereby moving the resin residue removing head. 7 is moved between the lateral position X1 and the directly below position X2, and the first air cylinder 138 is driven to swing the support arm 34, thereby moving the resin residue removing head 7 between the spaced position Z1 and the close position Z2. It is possible to move with Further, by performing the swinging operation after the resin residue removing head 7 is moved to the directly below position X2, when the resin residue removing head 7 is moved from the lateral position X1 to the directly below position X2, the resin residue removing head 7 is moved to the die. 101 can be prevented.
- the resin residue removing apparatus 1 of the present embodiment after the control means 10 moves the resin residue removing head 7 to the farthest position (see FIG. 17B) from the lateral position X1, the resin residue removing head 7 is removed. is moved from the distant position Z1 to the close position Z2.
- the resin residue that gradually seeps out from the slit 105 can be removed immediately before the next molding operation by the molding apparatus 100, and the adhesion of the resin residue to the resin molded product can be preferably suppressed. It is possible.
- the resin residue removing apparatus 1 of the present embodiment is provided with the cleaning means 5 for cleaning the resin residue adhering to the resin residue removing head 7, thereby maintaining the resin residue removing performance and removing the resin residue. It is possible to use the device 1 continuously.
- the molding apparatus 100 in which the resin residue removing apparatus 1 is used is configured such that a pair of molten resins 103 (resin sheets) are arranged so as to hang down in parallel to a pair of molds 104. there were.
- the resin residue removing apparatus 1 according to the present embodiment can also be used for a molding apparatus 100 that is arranged for a set of molds 104 only.
- ⁇ Modification 2-2> only one molding apparatus 100 of the pair of molding apparatuses 100 arranged so that the molten resin 103 hangs down in parallel to the pair of molds 104 is filled with resin residue. It is also possible to use a removal device 1 .
- a surface material 106 for example, carpet material
- a molten resin 103 that hangs down from one molding device 100 (the molding device 100 on the left side of the figure).
- the resin residue is covered with the skin material 106 and does not affect the appearance of the finished resin molded product. Therefore, it is also preferable to arrange the resin residue removing device 1 only in the molding device 100 on the side where the skin material 106 is not arranged.
- the control means 10 moves the resin residue removing head 7 to the farthest position (see FIG. 17B) from the lateral position X1, and then moves the resin residue removing head 7 from the distant position Z1 to the close position.
- the resin residue was removed by moving to Z2.
- the resin residue removing head 7 may be moved to the close position Z2 to remove the resin residue.
- the plate member 71 of the resin residue removing head 7 is cooled by jetting compressed air from the nozzle 54 a of the first air jetting means 54 of the cleaning means 5 .
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Abstract
Description
前記移動手段は、前記支持アームを前記支持軸を中心にシーソー状に揺動させる揺動駆動手段を備えている。
本発明の第1実施形態に係る樹脂カス除去装置1は、図1及び図2に示すように、支持フレーム2と、移動手段3と、樹脂カス除去ヘッド4とを備える。樹脂カス除去装置1は、図1に示すように、樹脂カス除去ヘッド4により成形装置100のダイ101の下面102に付着した樹脂カスを除去するものである。
<支持フレーム2>
支持フレーム2は、図2に示すように、側面視が略コの字形状をなすコの字フレーム21と、当該コの字フレーム21の幅方向両側に設けられる一対の側面フレーム22とを備える。コの字フレーム21は、上フレーム21aと、後フレーム21bと、下フレーム21cとを備え、図2に示すように、上フレーム21aに対して、下フレーム21cのほうが長くなっている。
移動手段3は、図1、図5A及び図5Bに示すように、樹脂カス除去ヘッド4を、成形動作と干渉しないダイ101の直下から外れた位置と、ダイ101の下面102に付着した樹脂カスを除去可能な位置との間で移動させるものである。移動手段3は、具体的には、図2に示すように、ガイド手段としてのレール部材31と、スライド部材32と、直線駆動手段としてのロッドレスシリンダ33と、支持アーム34とを備える。これらの構成を備える移動手段3は、支持フレーム2に支持される。
樹脂カス除去ヘッド4は、図2及び図3A~図4Bに示すように、回転プレート41と、樹脂カス除去部材としての一対の柱状部材42と、除去駆動手段43とを備える。本実施形態の樹脂カス除去ヘッド4は、成形装置100のダイ101の直下位置X2において回転プレート41を回転させることで、一対の柱状部材42によってダイ101の下面102に付着した樹脂カスを除去可能に構成される。
次に、図4A~図6Bを参照して、上記構成の樹脂カス除去装置1の動作、具体的には、樹脂カス除去ヘッド4を移動させる除去ヘッド移動動作と、樹脂カス除去ヘッド4による樹脂カス除去動作について説明する。なお、これらの動作は、成形装置100のダイ101のスリット(図示せず)から溶融状態の溶融樹脂103が押し出された後、スリットからの溶融樹脂103の垂下が途切れているタイミングで行われる。より具体的には、例えば、金型104が型閉じされた後であって、型締め後の成形体を取り出す取り出し機(図示せず)が金型104の上部にはみ出した溶融樹脂103を挟み込んだタイミングで樹脂カス除去装置1を動作させる。また、これらの動作は、金型104を型締めする度に毎回行うことが好ましいが、所定の回数ごとに行うことや、ユーザの指示に従って行う構成としても良い。
本実施形態の樹脂カス除去装置1において、移動手段3は、図1及び図5Aに示すように、樹脂カス除去ヘッド4を、ダイ101の直下から外れた側方位置X1とダイ101の直下である直下位置X2との間で移動させる。また、移動手段3は、図5A及び図5Bに示すように、樹脂カス除去ヘッド4を、上記直下位置X2において、ダイ101の下面102から離間する離間位置Z1と、下面102に近接する近接位置Z2との間で移動させる。
次に、図4A及び図4Bに基づいて、樹脂カス除去ヘッド4による樹脂カス除去動作を説明する。本実施形態において、樹脂カス除去動作は、一対の柱状部材42をダイ101の下面102に沿って移動させる動作である。より具体的には、樹脂カス除去動作は、各柱状部材42の対向面42a(図3B参照)をダイ101の円環状のスリットに沿って回転(公転)させる動作である。
以上のように、本実施形態に係る樹脂カス除去装置1によれば、ロッドレスシリンダ33の駆動により、支持アーム34を進退させて水平方向に移動させることで樹脂カス除去ヘッド4を側方位置X1と直下位置X2の間で移動させるとともに、支持アーム34を揺動させることで樹脂カス除去ヘッド4を離間位置Z1と近接位置Z2との間で移動させることが可能となっている。
本実施形態に係る発明は、以下の態様でも実施可能である。
上述した実施形態において、移動手段3は、支持アーム34を進退させて水平方向に移動させることで樹脂カス除去ヘッド4を側方位置X1と直下位置X2との間で移動させる構成であった。しかしながら、樹脂カス除去ヘッド4を側方位置X1と直下位置X2との間で移動させる構成は、これに限定されない。例えば、図8A及び図8Bに示すように、支持アーム34を、任意の回転駆動手段(図示せず)により平面視におけるダイ101の外方において垂直方向に伸びる回転軸39まわりに回転駆動させることで、樹脂カス除去ヘッド4を側方位置X1と直下位置X2との間で移動させる構成とすることも可能である。回転駆動手段としては、電動モータが挙げられる。
上述した実施形態において、移動手段3は、支持アーム34を支持軸35のまわりに揺動させることで樹脂カス除去ヘッド4を離間位置Z1と近接位置Z2との間で移動させる構成であった。しかしながら、樹脂カス除去ヘッド4を離間位置Z1と近接位置Z2との間で移動させる構成は、これに限定されない。例えば、図9A及び図9Bに示すように、伸縮駆動手段6により支持アーム34を上下方向に昇降させることで、樹脂カス除去ヘッド4を離間位置Z1と近接位置Z2との間で移動させる構成とすることも可能である。伸縮駆動手段6としては、例えば電動シリンダが挙げられる。さらに、支持アーム34を支持軸35のまわりに揺動させる構成と、伸縮駆動手段6により支持アームを昇降させる構成を組み合わせ、高さの異なるダイ101に適用可能とすることも好適である。
上述した実施形態において、樹脂カス除去ヘッド4は、樹脂カスを除去する樹脂カス除去部材としての一対の柱状部材42を備えて構成されていた。しかしながら、図24A及び図24Bに示すように、樹脂カス除去ヘッド4は樹脂カス除去部材として、一対の柱状部材42に代えて、樹脂カス除去ヘッド4(回転プレート41)の回転方向(図24A及び図24Bの矢印の方向)に刃状部142bを有する一対の除去ブレード142を備えて構成されてもよい。一例において、一対の除去ブレード142は、取付部材41bを介して回転プレート41の両端部に固定される。また、除去ブレード142の材質は、柱状部材42と同様、柔らかい金属を用いることが好ましく、例えば、真鍮製とされる。
・上記実施形態においては、側面フレーム22に設けたローラ23が支持アーム34のカム38を上方から下方に向かって押圧することで、ロッドレスシリンダ33によるスライド部材32のスライド動作を利用して支持アーム34が揺動する構成であった。しかしながら、ロッドレスシリンダ33とは別の動力手段により、支持アーム34を揺動駆動する構成とすることも可能である。
・上記実施形態において、樹脂カス除去ヘッド4は一対の柱状部材42を備えて構成されていたが、柱状部材42の数及び形状はこれに限定されるものではない。例えば、柱状部材42の断面形状を矩形とすることも可能である。また、回転プレート41上に柱状部材42を1つだけ設ける構成とすることも可能である。
・上記実施形態において、樹脂カス除去ヘッド4の回転プレート41はロッドレスシリンダ48の駆動によりチェーン47が移動することで回転するものであった。しかしながら、回転プレート41を電動モータ等の他の駆動手段によって回転させる構成とすることも可能である。
・上記実施形態においては、樹脂カス除去装置1が使用される成形装置100は円環状のスリットを有し、円筒状の溶融樹脂103(パリソン)を押し出して垂下させるものであった。しかしながら、本発明を、シート状の溶融樹脂を供給する成形装置に用いることも可能である。
本発明の第2実施形態に係る樹脂カス除去装置1は、図10及び図11に示すように、支持フレーム2と、移動手段3と、樹脂カス除去ヘッド7と、清掃手段5(図16A及び図16B参照)と、制御手段10とを備える。樹脂カス除去装置1は、図10に示すように、樹脂カス除去ヘッド7により成形装置100のダイ101(Tダイ)の下面102に付着した樹脂カスRを除去するものである。
<支持フレーム2>
支持フレーム2は、図11及び図12に示すように、前後方向、すなわちダイ101の長手方向に間隔をあけて一対設けられる。支持フレーム2は、移動手段3のガイド手段131を支持する。なお、支持フレーム2自体は、例えば、成形装置100とともに吊り下げ支持される。
移動手段3は、樹脂カス除去ヘッド7を、成形動作と干渉しないダイ101の直下から外れた位置(図11及び図17A参照)と、ダイ101の下面102に付着した樹脂カスを除去可能な位置(図17B及び図17C参照)との間で移動させるものである。移動手段3は、具体的には、図11及び図12に示すように、ガイド手段131と、スライド部材32と、直線駆動手段としてのロッドレスシリンダ33と、支持アーム34と、揺動駆動手段としての第1エアシリンダ138とを備える。これらの構成を備える移動手段3は、支持フレーム2に支持される。
樹脂カス除去ヘッド7は、図14に示すように、ベース部材70と、樹脂カス除去部材としての板状部材71とを備える。本実施形態の樹脂カス除去ヘッド7は、成形装置100のダイ101の直下位置X2において板状部材71をスリット105に沿って移動させることで、板状部材71によってダイ101の下面102に付着した樹脂カスを除去可能に構成される。
清掃手段5は、樹脂カス除去ヘッド7の板状部材71がダイ101から擦り取り、板状部材71に付着した樹脂カスR(図20A及び図21A参照)を板状部材71から除去するために用いられる。清掃手段5は、図16A及び図16Bに示すように、進退清掃手段としての第2エアシリンダ52及び清掃部材53と、第1エア噴出手段54と、第2エア噴出手段55とを備える。第2エアシリンダ52は、圧縮エアが供給されることで図示しないピストンをシリンダ52a内で進退させ、ピストンに連結されたロッド52b(図20B及び図21B)を進退駆動する。なお、進退清掃手段として、第2エアシリンダ52以外の構成により清掃部材53を進退駆動するよう構成することも可能である。
制御手段10は、樹脂カス除去装置1の各動作を制御する。制御手段10は、具体的には、移動手段3のロッドレスシリンダ33及び第1エアシリンダ138、清掃手段5の第2エアシリンダ52、第1エア噴出手段54及び第2エア噴出手段55の動作を制御する。
次に、図17A~図21Bを参照して、本実施形態の樹脂カス除去装置1の動作、具体的には、樹脂カス除去ヘッド7を移動させて樹脂カスを除去する除去ヘッド移動動作と、樹脂カス除去ヘッド7に付着した樹脂カスRを清掃する樹脂カス清掃動作について説明する。これらの動作は、ユーザの指示又は予め設定されたプログラムに応じて、制御手段10によって制御される。なお、本実施形態においては、除去ヘッド移動動作により、ダイ101からの樹脂カス除去も同時に行われる。また、除去ヘッド移動動作は、成形装置100のダイ101のスリット105(図11参照)からシート状の溶融樹脂103が押し出された後、スリット105からの溶融樹脂103の垂下が途切れているタイミングで行われる。より具体的には、例えば、金型104が型閉じされた後であって、型締め後の成形体を取り出す取り出し機(図示せず)が金型104の上部にはみ出した溶融樹脂103を挟み込んだタイミングで樹脂カス除去装置1を動作させる。また、これらの動作は、金型104を型締めする度に毎回行うことが好ましいが、所定の回数ごとに行うことや、ユーザの指示に従って行う構成としても良い。また、清掃動作は、除去ヘッド移動動作の終了後、当該動作に続いて実行される。ただし、清掃動作についても、除去ヘッド移動動作の終了後、毎回行う必要はなく、所定の回数ごとに行うことや、ユーザの指示に従って行う構成としても良い。
本実施形態の樹脂カス除去装置1において、制御手段10は、移動手段3を制御することによって、図17A~図17Dに示すように、樹脂カス除去ヘッド7を、ダイ101の直下から外れた側方位置X1(図17A参照)とダイ101の直下である直下位置X2(図17B~図17D参照)との間で移動させる。また、制御手段10は、移動手段3の制御により、図17A、図17B及び図18A及び図18Bに示すように、樹脂カス除去ヘッド7を、上記直下位置X2において、ダイ101の下面102から離間する離間位置Z1(図17A、図17B及び図18A参照)と、下面102に近接する近接位置Z2(図17C、図17D及び図18B参照)との間で移動させる。
本実施形態の樹脂カス除去装置1において、制御手段10は、清掃手段5の第2エアシリンダ52、第1エア噴出手段54及び第2エア噴出手段55を制御することにより、除去ヘッド移動動作の終了後に樹脂カス清掃動作を実行する。
以上のように、本実施形態に係る樹脂カス除去装置1によれば、ロッドレスシリンダ33の駆動により支持アーム34を前後方向(水平方向)に移動させることで樹脂カス除去ヘッド7を側方位置X1と直下位置X2の間で移動させるとともに、第1エアシリンダ138の駆動により支持アーム34を揺動させることで樹脂カス除去ヘッド7を離間位置Z1と近接位置Z2との間で移動させることが可能となっている。また、樹脂カス除去ヘッド7が直下位置X2に移動してから揺動動作を行うことにより、樹脂カス除去ヘッド7を側方位置X1から直下位置X2に移動させる際に樹脂カス除去ヘッド7がダイ101と干渉することを防止することが可能となっている。
本実施形態に係る発明は、以下の態様でも実施可能である。
上述した実施形態において、樹脂カス除去装置1が使用される成形装置100は、一組の金型104に対して溶融樹脂103(樹脂シート)が平行に一対垂下されるよう一対配置される構成であった。しかしながら、本実施形態に係る樹脂カス除去装置1は、図22に示すように、一組の金型104に対して1つのみ配置される成形装置100に対しても用いることが可能である。
また、上記実施形態のように、一組の金型104に対して溶融樹脂103が平行に一対垂下されるよう一対配置される一対の成形装置100のうち、1つの成形装置100にのみ樹脂カス除去装置1を用いることも可能である。例えば、図23に示すように、一方の成形装置100(図の左側の成形装置100)から垂下される溶融樹脂103と金型104の間に表皮材106(例えば、カーペット材)を配置するような場合、当該溶融樹脂103に樹脂カスが付着しても、樹脂カスが表皮材106に覆われて完成した樹脂成形品の外観に影響がない。したがって、表皮材106を配置しない側の成形装置100にのみ、樹脂カス除去装置1を配置することも好適である。
・上記実施形態では、制御手段10が、樹脂カス除去ヘッド7を側方位置X1から最も離れた位置(図17B参照)に移動させてから、当該樹脂カス除去ヘッド7を離間位置Z1から近接位置Z2に移動させて樹脂カスを除去するようにしていた。しかしながら、樹脂カス除去ヘッド7を側方位置X1(つまり、樹脂カス除去動作を行わないときに退避させる位置)から側方位置X1から最も離れた位置へと移動させる際にも、樹脂カス除去ヘッド7を近接位置Z2に移動させて樹脂カスを除去するようにしても良い。
・上記実施形態では、清掃手段5の第1エア噴出手段54のノズル54aから圧縮エアを噴出することで、樹脂カス除去ヘッド7の板状部材71を冷却していた。しかしながら、板状部材71を水冷する水冷手段を設けることも可能である。
Claims (16)
- 成形装置のダイの下面に付着した樹脂カスを除去する樹脂カス除去装置であって、
移動手段と、樹脂カス除去ヘッドとを備え、
前記移動手段は、前記樹脂カス除去ヘッドを前記ダイの直下から外れた側方位置と前記直下である直下位置との間で移動させるとともに、前記直下位置において、前記下面から離間する離間位置と、前記下面に近接する近接位置との間で移動させるよう構成され、
前記樹脂カス除去ヘッドは、前記下面に沿って移動することにより前記下面に付着した樹脂カスを除去可能に構成される、樹脂カス除去装置。 - 請求項1に記載の樹脂カス除去装置であって、
前記移動手段は、前記樹脂カス除去ヘッドをその先端側で支持する支持アームを備えるとともに、下記(1)、(2)の少なくとも1つの構成を備える、樹脂カス除去装置。
(1)前記支持アームが水平方向に移動することで、前記樹脂カス除去ヘッドを前記側方位置と前記直下位置との間で移動させる構成。
(2)前記支持アームがシーソー状に揺動することで、前記樹脂カス除去ヘッドを前記離間位置と前記近接位置との間で移動させる構成。 - 請求項2に記載の樹脂カス除去装置であって、
前記移動手段は、ガイド手段と、スライド部材と、直線駆動手段とを備え、
前記支持アームは前記スライド部材に支持されており、
前記直線駆動手段の駆動により前記スライド部材が前記ガイド手段に沿ってスライドすることで、前記樹脂カス除去ヘッドが前記直下位置と前記側方位置との間で移動する、樹脂カス除去装置。 - 請求項3に記載の樹脂カス除去装置であって、
前記ガイド手段は、前記側方位置において前記ダイに向かって延びており、
前記直線駆動手段の駆動により前記スライド部材が前記ガイド手段に沿ってスライドすることで前記支持アームが前進及び後退して、前記樹脂カス除去ヘッドが前記直下位置と前記側方位置との間で移動する、樹脂カス除去装置。 - 請求項4に記載の樹脂カス除去装置であって、
前記スライド部材は、前記支持アームを軸支する支持軸と、前記支持アームを押圧する押圧部とを備え、
前記支持アームは、前記支持軸を挟んで前記樹脂カス除去ヘッドとは反対側の位置に被押圧部を備えており、
前記スライド部材のスライドに伴って前記支持アームが前進した際に、前記押圧部が前記被押圧部を上方から下方に向かって押圧することで、前記支持アームが前記支持軸を中心にシーソー状に揺動する、樹脂カス除去装置。 - 請求項5に記載の樹脂カス除去装置であって、
前記押圧部は、前記ガイド手段を支持する支持フレームに設置されたローラであり、
前記被押圧部は、その上面が前記支持アームの後端側に向かうにつれて上がるよう傾斜するカムであって、
前記スライド部材のスライドに伴って前記支持アームが前進すると、前記ローラが前記上面に当接して当該カムを上方から下方に向かって押圧する、樹脂カス除去装置。 - 請求項1~請求項6のいずれかに記載の樹脂カス除去装置であって、
前記成形装置は、円筒状のパリソンを押し出すものであって、前記ダイの下面には、前記円筒状のパリソンを押出可能な円環状のスリットが形成されており、
前記樹脂カス除去ヘッドは、樹脂カス除去部材と、除去駆動手段とを備え、
前記樹脂カス除去部材は、前記下面と対向する対向面を備え、
前記除去駆動手段の駆動により、前記樹脂カス除去部材は、前記対向面が前記スリットに沿って移動するよう回転する、樹脂カス除去装置。 - 請求項7に記載の樹脂カス除去装置であって、
前記樹脂カス除去部材は、自転可能に支持された柱状部材である、樹脂カス除去装置。 - 請求項7に記載の樹脂カス除去装置であって、
前記樹脂カス除去部材は、前記回転方向に刃状部を有する除去ブレードである、樹脂カス除去装置。 - 請求項3に記載の樹脂カス除去装置であって、
前記成形装置は、シート状の樹脂シートを押し出すものであって、前記ダイの下面には、前記樹脂シートを押出可能な直線状のスリットが形成されており、
前記ガイド手段は、前記スリットの長手方向に沿って配置されており、
前記直線駆動手段の駆動により前記スライド部材が前記ガイド手段に沿ってスライドすることで前記支持アームがスライドして、前記樹脂カス除去ヘッドが前記側方位置と前記直下位置との間で移動し、さらに前記スリットに沿って移動する、樹脂カス除去装置。 - 請求項10に記載の樹脂カス除去装置であって、
前記スライド部材は、前記支持アームを軸支する支持軸を備え、
前記移動手段は、前記支持アームを前記支持軸を中心にシーソー状に揺動させる揺動駆動手段を備えている、樹脂カス除去装置。 - 請求項11に記載の樹脂カス除去装置であって、
前記移動手段を制御する制御手段を備え、
前記制御手段は、前記樹脂カス除去ヘッドが前記離間位置にある状態で前記直線駆動手段により前記樹脂カス除去ヘッドを前記直下位置における前記側方位置から最も離れた位置に移動させ、次いで、前記揺動駆動手段により前記支持アームを揺動させて前記樹脂カス除去ヘッドを前記近接位置に移動させ、その後、前記樹脂カス除去ヘッドが前記近接位置にある状態で前記直線駆動手段により前記樹脂カス除去ヘッドを前記スリットに沿って前記側方位置に向かって移動させる、樹脂カス除去装置。 - 請求項1~請求項12のいずれかに記載の樹脂カス除去装置であって、
前記樹脂カス除去ヘッドに付着した樹脂カスを清掃する清掃手段を備える、樹脂カス除去装置。 - 請求項13に記載の樹脂カス除去装置であって、
前記清掃手段は、前記樹脂カス除去ヘッドを冷却する冷却手段を備える、樹脂カス除去装置。 - 請求項13又は請求項14に記載の樹脂カス除去装置であって、
前記清掃手段は、前記樹脂カス除去ヘッドが前記側方位置に移動した際に当該樹脂カス除去ヘッドに付着した樹脂カスを擦り取るベロである、樹脂カス除去装置。 - 請求項13又は請求項14に記載の樹脂カス除去装置であって、
前記清掃手段は、前記樹脂カス除去ヘッドに沿って移動して当該樹脂カス除去ヘッドに付着した樹脂カスを擦り取る清掃部材と、前記清掃部材に向かってエアを噴出するエア噴出手段とを備える、樹脂カス除去装置。
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