WO2022157863A1 - Dispositif de traitement thermique, procédé de traitement thermique et dispositif chirurgical - Google Patents

Dispositif de traitement thermique, procédé de traitement thermique et dispositif chirurgical Download PDF

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Publication number
WO2022157863A1
WO2022157863A1 PCT/JP2021/001874 JP2021001874W WO2022157863A1 WO 2022157863 A1 WO2022157863 A1 WO 2022157863A1 JP 2021001874 W JP2021001874 W JP 2021001874W WO 2022157863 A1 WO2022157863 A1 WO 2022157863A1
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WO
WIPO (PCT)
Prior art keywords
pipe
heat
thermal processing
processed
gas
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Application number
PCT/JP2021/001874
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English (en)
Japanese (ja)
Inventor
剛 松本
Original Assignee
オリンパス株式会社
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Filing date
Publication date
Application filed by オリンパス株式会社 filed Critical オリンパス株式会社
Priority to PCT/JP2021/001874 priority Critical patent/WO2022157863A1/fr
Publication of WO2022157863A1 publication Critical patent/WO2022157863A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups

Definitions

  • the present invention relates to a thermal processing device, a thermal processing method, and a surgical device.
  • thermal processing apparatus that thermally processes a portion of a pipe to be processed, which is to be processed (see, for example, Patent Document 1).
  • Thermal processing in the thermal processing apparatus described in Patent Document 1 is laser processing.
  • the present invention has been made in view of the above, and is a thermal processing apparatus, thermal processing method, and surgical apparatus capable of suppressing adhesion of dust generated by thermal processing to a pipe to be processed. intended to provide
  • a thermal processing apparatus includes: and a dust collection mechanism for sucking dust scattered by thermal processing, and a gas introduction mechanism for introducing gas into the pipe from the end of the pipe.
  • a thermal processing method comprises a step of thermally processing a portion of a pipe to be processed which is to be thermally processed, and operating a dust collection mechanism for sucking dust scattered by the thermal processing of the thermally processed portion. and introducing gas into the pipe from the end of the pipe.
  • a surgical device comprises a pipe heat-processed by the heat-processing method described above.
  • the thermal processing device According to the thermal processing device, the thermal processing method, and the surgical device according to the present invention, it is possible to suppress dust generated by thermal processing from adhering to the pipe to be processed.
  • FIG. 1 is a diagram for explaining an object to be processed according to the embodiment.
  • FIG. 2 is a diagram for explaining an object to be processed according to the embodiment.
  • FIG. 3 is a diagram showing a schematic configuration of the thermal processing apparatus according to the embodiment.
  • FIG. 4 is a diagram showing a schematic configuration of a laser unit.
  • FIG. 5 is a flow chart showing the thermal processing method.
  • FIG. 6 is a diagram for explaining step S8.
  • FIG. 7 is a diagram showing Modification 1 of the embodiment.
  • FIG. 8 is a diagram showing Modification 2 of the embodiment.
  • FIG. 1 is a diagram showing a schematic configuration of a treatment system 1 using a treatment instrument 2 on which a pipe 10 to be processed is mounted.
  • FIG. 2 is a diagram showing the pipe 10. As shown in FIG.
  • one side along the central axis Ax of the pipe 10 is described as front end side Ar1, and the other side is described as base end side Ar2.
  • the treatment system 1 treats a target site (hereinafter referred to as a target site) in a living tissue by applying ultrasonic energy and high-frequency energy to the target site.
  • the treatment that can be performed by the treatment system according to the present embodiment includes a treatment of coagulating (sealing) the target site, a treatment of incising the target site, a treatment of simultaneously performing coagulation and incision, and the like.
  • the treatment system 1 includes a treatment instrument 2 and a control device 3, as shown in FIG.
  • the treatment instrument 2 is an ultrasonic treatment instrument that treats a target site by applying ultrasonic energy and high-frequency energy to the target site, and corresponds to a surgical device according to the present invention.
  • This treatment instrument 2 includes a handpiece 4 and an ultrasonic transducer 5, as shown in FIG.
  • the handpiece 4 includes a holding case 6, a movable handle 7, a switch 8, a rotating knob 9, a pipe 10, a jaw 11, and a vibration transmitting member 12, as shown in FIG.
  • the holding case 6 configures the appearance of the treatment instrument 2 and supports the treatment instrument 2 as a whole.
  • the holding case 6 has a substantially cylindrical holding case main body 61 coaxial with the central axis Ax, and extends downward from the holding case main body 61 in FIG. and a fixed handle 62 that is gripped by the operator of the device.
  • the movable handle 7 receives an opening/closing operation by an operator such as an operator.
  • the opening/closing operation is an operation for opening/closing the jaw 11 with respect to the end portion 121 ( FIG. 1 ) of the tip side Ar1 of the vibration transmitting member 12 .
  • FIG. 1 the end portion 121 ( FIG. 1 ) of the tip side Ar1 of the vibration transmitting member 12 .
  • the switch 8 is provided in a state exposed to the outside from the side surface of the distal end side Ar1 of the fixed handle 62 .
  • the switch 8 receives a treatment operation by an operator such as an operator.
  • the treatment operation is an operation of applying ultrasonic energy or high-frequency energy to the target site.
  • the rotary knob 9 has a substantially cylindrical shape coaxial with the central axis Ax, and is provided on the distal end side Ar1 of the holding case body 61 as shown in FIG.
  • the rotary knob 9 receives a rotary operation by an operator such as an operator. By this rotating operation, the rotating knob 9 rotates about the central axis Ax with respect to the holding case main body 61 . Further, the rotation of the rotary knob 9 causes the pipe 10, the jaws 11, and the vibration transmission member 12 to rotate about the central axis Ax.
  • the pipe 10 is a cylindrical pipe, and is an object to be thermally processed by the thermal processing apparatus 200 according to the present embodiment.
  • a first fixing hole 101 (FIG. 2) to which a pin (not shown) that rotatably supports the jaw 11 is fixed is formed at the end of the tip side Ar1 of the pipe 10 .
  • a notch 102 (FIG. 2) extending from the tip toward the proximal side Ar2 is formed at the end of the pipe 10 on the distal side Ar1.
  • a second fixing hole 103 (FIG. 2) for fixing the end to the rotary knob 9 is formed at the end of the proximal side Ar2 of the pipe 10 .
  • the first and second fixing holes 101 and 103 and the cutout portion 102 described above are formed by thermal processing using the thermal processing device 200 .
  • At least a portion of the jaw 11 is made of a conductive material.
  • the jaw 11 opens and closes with respect to the end portion 121 of the distal end side Ar1 of the vibration transmitting member 12 in accordance with the grasping operation of the movable handle 7 by an operator such as an operator. Grasp the target part with .
  • the vibration transmitting member 12 is made of a conductive material and has an elongated shape extending linearly along the central axis Ax. Also, as shown in FIG. 1, the vibration transmitting member 12 is inserted into the pipe 10 with the end portion 121 on the tip side Ar1 protruding to the outside.
  • the end portion of the base end side Ar2 of the vibration transmitting member 12 is mechanically connected to the ultrasonic transducer 5, although the specific illustration is omitted. That is, the vibration transmitting member 12 transmits the ultrasonic vibration generated by the ultrasonic transducer 5 from the end portion on the proximal side Ar2 to the end portion 121 on the distal side Ar1.
  • the ultrasonic vibration is longitudinal vibration that vibrates in the direction along the central axis Ax.
  • the ultrasonic transducer 5 includes a TD (transducer) case 51 and an ultrasonic transducer 52, as shown in FIG.
  • the TD case 51 supports the ultrasonic transducer 52 and is detachably connected to the holding case main body 61 .
  • the ultrasonic transducer 52 generates ultrasonic vibrations under the control of the control device 3 .
  • the ultrasonic transducer 52 is composed of a BLT (bolted Langevin transducer).
  • the control device 3 centrally controls the operation of the treatment instrument 2 via the electric cable C (FIG. 1). Specifically, the control device 3 detects a treatment operation to the switch 8 by an operator such as an operator through the electric cable C. As shown in FIG. Then, when the control device 3 detects the treatment operation, the target portion gripped between the jaw 11 and the end portion 121 of the distal end side Ar1 of the vibration transmitting member 12 is detected via the electric cable C. apply ultrasonic energy or high-frequency energy to the That is, the control device 3 treats the target site.
  • the control device 3 supplies driving power to the ultrasonic transducer 52 via the electric cable C.
  • the ultrasonic transducer 52 generates longitudinal vibration (ultrasonic vibration) that vibrates in the direction along the central axis Ax.
  • the end portion 121 of the vibration transmitting member 12 on the tip side Ar1 vibrates with a desired amplitude due to the longitudinal vibration.
  • ultrasonic vibration is applied from the end portion 121 to the target portion gripped between the jaw 11 and the end portion 121 .
  • ultrasonic energy is applied from the end 121 to the target site.
  • the control device 3 when applying high-frequency energy to a target part, supplies high-frequency power between the jaw 11 and the vibration transmitting member 12 via the electric cable C. As a result, a high-frequency current flows through the target portion held between the jaw 11 and the end portion 121 of the vibration transmitting member 12 on the tip side Ar1. In other words, high-frequency energy is applied to the target site.
  • FIG. 3 is a diagram showing a schematic configuration of a thermal processing apparatus 200 according to this embodiment.
  • the thermal processing device 200 forms the first and second fixing holes 101 and 103 and the notch 102 by thermally processing the pipe 10'.
  • the pipe 10 is thus manufactured.
  • the pipe 10' corresponds to the state of the pipe 10 before the first and second fixing holes 101 and 103 and the notch 102 are formed.
  • the thermal processing according to the present embodiment is laser processing.
  • the thermal processing is not limited to laser processing, and other thermal processing such as plasma processing may be used.
  • the thermal processing apparatus 200 includes a laser unit 210, a clamp section 220, a relative movement mechanism 230, a dust collection mechanism 240, and a gas introduction mechanism 250, as shown in FIG.
  • FIG. 4 is a diagram showing a schematic configuration of the laser unit 210.
  • the laser unit 210 is a portion that performs thermal processing by irradiating the portion 104 to be thermally processed of the pipe 10' with the laser beam LA, and corresponds to the thermal processing portion according to the present invention.
  • the heat-processed portions 104 according to this embodiment are both end portions of the pipe 10'.
  • the heat-processed portion 104 on the tip side Ar1 of the pipe 10′ is referred to as a first heat-processed portion 1041
  • the heat-processed portion 104 on the base end side Ar2 of the pipe 10′ is referred to as a second heat-processed portion.
  • This laser unit 210 includes a laser oscillator 211, an optical fiber 212, and a processing head 213, as shown in FIG.
  • the laser oscillator 211 is a part that emits a laser beam LA.
  • the optical fiber 212 is a portion that guides the laser beam LA emitted from the laser oscillator 211 to the processing head 213 .
  • the processing head 213 is a portion that irradiates the laser beam LA to the heat-processed portion 104 of the pipe 10'.
  • This processing head 213 includes a collimator lens 214 , a condenser lens 215 , an assist gas port 216 and a nozzle 217 .
  • a collimator lens 214 converts the laser beam LA into a parallel beam.
  • the condensing lens 215 converges the parallel beam of laser light LA that has passed through the collimator lens 214, and irradiates the heat-processed portion 104 of the pipe 10'.
  • the assist gas port 216 is a portion that introduces gas into the nozzle 217 from the outside. The gas then passes through the nozzle 217, advances coaxially with the condensing lens 215, and is jetted against the heat-processed portion 104 of the pipe 10'.
  • the clamp part 220 supports the pipe 10' rotatably about the central axis Ax (FIG. 3) of the pipe 10'.
  • the relative movement mechanism 230 changes the relative position between the laser unit 210 and the pipe 10 ′ to position the heat-processed portion 104 of the pipe 10 ′ at a position facing the laser unit 210 .
  • the relative movement mechanism 230 holds the clamp part 220 and moves along rails (not shown) provided on the base 260 of the thermal processing apparatus 200 .
  • the pipe 10' supported by the clamp portion 220 moves along the central axis Ax. That is, the first and second heat-processed portions 1041 and 1042 are positioned to face the laser unit 210, respectively.
  • the relative movement mechanism according to the present invention is not limited to the configuration for moving the pipe 10' as described above, but the configuration for moving the laser unit 210, or the configuration for moving both the pipe 10' and the laser unit 210. may be adopted.
  • the dust collection mechanism 240 sucks dust scattered by the thermal processing of the portion 104 to be thermally processed.
  • the dust is so-called spatter or dross.
  • the dust collection mechanism 240 includes a housing 241 and a suction pump 242, as shown in FIG.
  • the housing 241 is placed on the base 260 so as to cover the heat-processed portion 104 .
  • the housing 241 is provided with an opening for introducing the laser beam LA and the assist gas from the laser unit 210 into the housing 241 from outside the housing 241.
  • the suction pump 242 sucks air (including dust) inside the housing 241 .
  • the dust collection mechanism 240 described above can be arranged on each of the end portions of the pipe 10'.
  • the gas introduction mechanism 250 introduces gas into the pipe 10' from the end opposite to the end where the dust collection mechanism 240 is arranged, among both ends of the pipe 10'.
  • the gas introduction mechanism 250 includes a supply pump 251 and a supply nozzle 252, as shown in FIG.
  • the supply pump 251 supplies gas to the supply nozzle 252 .
  • the gas is oxygen, nitrogen, air, or argon.
  • the supply nozzle 252 is installed at the end of the pipe 10' opposite to the end where the dust collection mechanism 240 is arranged, and supplies the gas supplied from the supply pump 251 into the pipe 10'. Introduce.
  • FIG. 5 is a flow chart showing the thermal processing method.
  • FIG. 6 is a diagram for explaining step S8.
  • the operator sets the thermal processing apparatus 200 to the first state (step S1).
  • the first state is the state shown in FIG. That is, the operator operates the relative movement mechanism 230 to position the first heat-processed portion 1041 of the pipe 10 ′ at a position facing the laser unit 210 . Further, the operator places the housing 241 on the base 260 so as to cover the periphery of the first heat-processed portion 1041 . Further, the operator installs the supply nozzle 252 at the end of the pipe 10' on the second heat-processed portion 1042 side.
  • step S1 the operator operates the dust collection mechanism 240 (suction pump 242) (step S2). As a result, the air inside the housing 241 starts to be sucked.
  • step S2 the operator operates the gas introduction mechanism 250 (supply pump 251) (step S3). This initiates the supply of gas into the pipe 10'.
  • step S4 the operator operates the laser unit 210 to start thermal processing of the thermally processed portion 104 of the pipe 10' (step S4). More specifically, when the first heat-processed portion 1041 is heat-processed, the operator operates the relative movement mechanism 230 to move the pipe 10' along the central axis Ax or clamp the pipe 10'. By operating the portion 220 , the pipe 10 ′ is rotated around the central axis Ax, and the first fixing hole 101 and the notch portion 102 are formed in the first heat-processed portion 1041 . When performing thermal processing of the second thermally processed portion 1042, the operator operates the relative movement mechanism 230 to move the pipe 10' along the central axis Ax or move the clamp portion 220. By operating, the pipe 10 ′ is rotated about the central axis Ax, and the second fixing hole 103 is formed in the second heat-processed portion 1042 .
  • step S5 After finishing the thermal processing of the heat-processed portion 104 of the pipe 10' (step S5), the operator terminates the operation of the dust collection mechanism 240 (suction pump 242) and the gas introduction mechanism 250 (supply pump 251). (step S6).
  • step S6 the operator determines whether or not both the first and second heat-processed portions 1041 and 1042 have been heat-processed (step S7).
  • step S7: Yes the operator ends this heat-processing method.
  • step S7: No the operator moves the heat-processing device 200 to the second state (step S8).
  • the second state is the state shown in FIG.
  • the operator operates the relative movement mechanism 230 to position the second heat-processed portion 1042 of the pipe 10 ′ at a position facing the laser unit 210 . Also, the operator places the housing 241 on the base 260 so as to cover the second heat-processed portion 1042 . Further, the operator installs the supply nozzle 252 at the end of the pipe 10' on the first heat-processed portion 1041 side. After step S8, the operator sequentially performs step S2 and subsequent steps.
  • the thermal processing apparatus 200 includes the laser unit 210, the dust collection mechanism 240, and the gas introduction mechanism 250 described above. For this reason, dust dispersed in the pipe 10 ′ during the thermal processing of the pipe 10 ′ is pushed out into the housing 241 by the gas introduced into the pipe 10 ′ from the gas introduction mechanism 250 . That is, the dust scattered inside the pipe 10' is sucked and removed by the dust collection mechanism 240 together with the dust scattered outside the pipe 10'. Therefore, according to the thermal processing apparatus 200 according to the present embodiment, dust generated by thermal processing can be prevented from adhering to the pipe 10' to be processed.
  • the thermal processing apparatus 200 further includes the clamp section 220 and the relative movement mechanism 230 described above. Therefore, it is possible to thermally process the heat-processed portion 104 of the pipe 10' into various shapes. Moreover, even if the heat-processed portions 104 are both end portions of the pipe 10', when the heat processing of one end side of the pipe 10' is completed and the other end side of the pipe 10' is heat-processed, the pipe 10' from the clamp portion 220. That is, there is no positional deviation of the pipe 10', and the heat processing can be performed on the both end portions with high accuracy.
  • the dust collecting mechanism 240 can be arranged at each of the end portions of the pipe 10'.
  • the gas introduction mechanism 250 can also be arranged at each end of the pipe 10'. Therefore, even if the heat-processed portions 104 are both end portions of the pipe 10' and heat processing is performed on the both end portions, the dust generated by the heat processing will not adhere to the pipe 10'. can be suppressed.
  • the gas introduced into the pipe 10' by the gas introduction mechanism 250 is any one of oxygen, nitrogen, air, and argon.
  • oxygen when oxygen is used as the gas, the dust can be oxidized by the oxygen. That is, the dust can be chemically stabilized and adherence to the pipe 10' can be suppressed satisfactorily.
  • nitrogen or argon when either nitrogen or argon is used as the gas, the material surface of the pipe 10' which has undergone thermal processing is not oxidized, so machinability can be improved. Therefore, it is possible to obtain the effect of obtaining the pipe 10 with little contamination by dust, and the effect of obtaining the pipe 10 which does not have an oxide film and does not require finishing processing.
  • the surgical device according to the present invention employs a treatment instrument that applies both ultrasonic energy and high-frequency energy to a target site, but the present invention is not limited to this.
  • Other surgical devices may be employed as long as they include pipes that have been thermally processed by the thermal processing methods described in the above embodiments.
  • a treatment instrument that applies at least one of ultrasonic energy, high-frequency energy, and thermal energy to a target site may be employed.
  • applying thermal energy to a target site means transferring heat generated by a heater or the like to the target site.
  • forceps or a rigid endoscope may be employed as the surgical device according to the present invention.
  • the number of laser units 210 is not limited to one, and may be another number, for example, two according to the number of heat-processed portions of the pipe 10'.
  • a configuration may be adopted in which a control device that controls the heat processing apparatus 200 in a centralized manner is provided, and at least part of the flow shown in FIG. 5 is automatically executed by the control device.
  • FIG. 7 is a diagram showing Modification 1 of the embodiment.
  • both end portions of the pipe 10' are used as the heat-processed portion according to the present invention, but the present invention is not limited to this.
  • portions other than the both end portions first and second heat-processed portions 1041 and 1042 shown in Modification 1 of FIG. ).
  • the housing 241 is placed on the base 260 so as to cover the third heat-processed portion 1043 .
  • two gas introduction mechanisms 250 are provided.
  • the supply nozzles 252 of the two gas introduction mechanisms 250 are installed at both ends of the pipe 10'.
  • the suction pump 242 is operated to operate the gas introduced into the pipe 10' from both ends of the pipe 10' and introduced into the housing 241 through the third heat-processed portion 1043 (the third heat-processed portion 1043). (including dust scattered by heat processing to 1043) is sucked.
  • FIG. 8 is a diagram showing Modification 2 of the embodiment.
  • the thermal processing apparatus 200 is equipped with the gas introduction mechanism 250.
  • the gas introduction mechanism 250 is not limited to this, and the thermal processing apparatus 200 is equipped with the gas introduction mechanism 250 as shown in Modification 2 of FIG. It does not matter if it is not installed.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Accommodation For Nursing Or Treatment Tables (AREA)
  • Surgical Instruments (AREA)

Abstract

Un dispositif de traitement thermique (200) comprend : une unité de traitement thermique (210) qui traite thermiquement une partie soumise à un traitement thermique (104) d'un tuyau (10') en tant que cible de traitement ; un mécanisme de récupération de poussière (240) qui aspire la poussière diffusée en raison du traitement thermique sur la partie soumise à un traitement thermique ; et un mécanisme d'introduction de gaz (250) qui introduit du gaz à partir d'une partie d'extrémité du tuyau (10') dans le tuyau (10').
PCT/JP2021/001874 2021-01-20 2021-01-20 Dispositif de traitement thermique, procédé de traitement thermique et dispositif chirurgical WO2022157863A1 (fr)

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PCT/JP2021/001874 WO2022157863A1 (fr) 2021-01-20 2021-01-20 Dispositif de traitement thermique, procédé de traitement thermique et dispositif chirurgical

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/001874 WO2022157863A1 (fr) 2021-01-20 2021-01-20 Dispositif de traitement thermique, procédé de traitement thermique et dispositif chirurgical

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WO2022157863A1 true WO2022157863A1 (fr) 2022-07-28

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0270380A (ja) * 1988-09-02 1990-03-09 Ishikawajima Harima Heavy Ind Co Ltd バックシールドを要する金属管の溶接方法及びその装置
JPH06142932A (ja) * 1993-05-20 1994-05-24 Tadahiro Omi ウェルドヘッド及び溶接装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0270380A (ja) * 1988-09-02 1990-03-09 Ishikawajima Harima Heavy Ind Co Ltd バックシールドを要する金属管の溶接方法及びその装置
JPH06142932A (ja) * 1993-05-20 1994-05-24 Tadahiro Omi ウェルドヘッド及び溶接装置

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