WO2022149834A1 - 컨버터 - Google Patents
컨버터 Download PDFInfo
- Publication number
- WO2022149834A1 WO2022149834A1 PCT/KR2022/000107 KR2022000107W WO2022149834A1 WO 2022149834 A1 WO2022149834 A1 WO 2022149834A1 KR 2022000107 W KR2022000107 W KR 2022000107W WO 2022149834 A1 WO2022149834 A1 WO 2022149834A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- disposed
- electronic component
- straight part
- circuit board
- printed circuit
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 37
- 239000003507 refrigerant Substances 0.000 claims description 37
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20936—Liquid coolant with phase change
Definitions
- This embodiment relates to a converter.
- engine electric devices starter, ignition device, charging device
- lighting devices are common. .
- a hybrid electric vehicle regardless of soft or hard type, is equipped with a DC-DC converter (Low Voltage DC-DC Converter) for supplying an electric load (12V).
- the DC-DC converter which acts as a generator (alternator) of a general gasoline vehicle, supplies a voltage of 12V for the electric load by reducing the high voltage of the main battery (usually a high-voltage battery of 144V or more).
- a DC-DC converter refers to an electronic circuit device that converts DC power of a certain voltage to DC power of another voltage, and is used in various fields such as TV sets and automotive electronics.
- the converter may be contoured by the housing.
- One or more electronic components for driving are disposed inside the housing.
- the electronic component there is a printed circuit board on which a plurality of devices are mounted. Elements disposed on the printed circuit board generate heat by driving. The generated heat causes an overload of each electronic component, which may cause a failure in the setting function and cause a malfunction. Accordingly, a structure or means for heat dissipation of components in the converter is required.
- the present invention has been proposed to improve the above problems, and an object of the present invention is to provide a converter capable of improving heat dissipation efficiency by improving the structure.
- the converter according to the present embodiment includes a housing including an internal space; a printed circuit board disposed in the inner space; a first electronic component disposed on an upper surface of the printed circuit board; a second electronic component disposed on a lower surface of the printed circuit board; and a heat dissipation space disposed in the housing, wherein the first electronic component is disposed to overlap the heat dissipation space in a first direction, and the second electronic component includes the heat dissipation space and a second direction perpendicular to the first direction. are arranged to overlap.
- the first direction may be a vertical direction
- the second direction may be a direction parallel to the printed circuit board.
- a first heat-conducting layer may be disposed between the upper surface of the heat dissipation space and the lower surface of the printed circuit board.
- a groove may be disposed on the bottom surface of the inner space to be more recessed than other regions, and to accommodate the second electronic component.
- a second heat-conducting layer may be disposed between the inner surface of the groove and the outer surface of the second electronic component.
- the second heat-conducting layer may include a side portion disposed between a side surface of the second electronic component and an inner surface of the groove, and a lower surface portion disposed between a lower surface of the second electronic component and a bottom surface of the groove.
- It is disposed in the heat dissipation space and may include a refrigerant pipe through which a refrigerant flows.
- the refrigerant pipe includes a first straight part having a refrigerant inlet at one end, a refrigerant outlet at one end and a second straight part parallel to the first straight part, and the first straight part and the second straight part and a connection part perpendicular to the first straight part and the second straight part.
- the second electronic component may be provided in plurality, some of which are arranged along a first row parallel to the first straight part, and some of the second electronic components are arranged along a second row parallel to the second straight part.
- a converter includes a printed circuit board; a first electronic component disposed on an upper surface of the printed circuit board; a second electronic component disposed on a lower surface of the printed circuit board; and a refrigerant pipe disposed to be spaced apart from a lower surface of the printed circuit board, wherein the refrigerant pipe has a first straight part, a second straight part parallel to the first straight part, and the first straight part and the first straight part and a connection part connecting two straight parts, wherein the first electronic component is disposed to overlap the first straight part, the second straight part, and the connection part in a direction perpendicular to the printed circuit board, and the second electronic component is disposed between the first straight part and the second straight part.
- the first electronic component and the second electronic component disposed on both sides of the printed circuit board form an optimal heat dissipation structure with the refrigerant tube, there is an advantage in that heat dissipation efficiency can be improved.
- FIG. 1 is a perspective view showing an external appearance of a converter according to an embodiment of the present invention
- FIG. 2 is a plan view showing a lower surface of a converter according to an embodiment of the present invention.
- FIG 3 is a plan view showing a top surface of a converter according to an embodiment of the present invention.
- FIG. 4 is an exploded perspective view of a converter according to an embodiment of the present invention.
- FIG. 5 is a plan view illustrating a top surface of a converter in which a cover and a printed circuit board are excluded according to an embodiment of the present invention
- Figure 6 is a plan view showing the top surface of the converter according to the embodiment of the present invention is excluded.
- FIG. 7 is a plan view showing a lower surface of a printed circuit board according to an embodiment of the present invention.
- FIG. 8 is a cross-sectional view of a heat dissipation structure in a converter according to an embodiment of the present invention.
- FIG. 9 is a cross-sectional view taken along line A-A' of FIG. 3;
- the terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention.
- the singular form may also include the plural form unless otherwise specified in the phrase, and when it is described as "At least one (or one or more) of A and (and) B, C", it is combined as A, B, C It may contain one or more of all possible combinations.
- a component is described as 'connected', 'coupled' or 'connected' to another component, the component is not only directly connected, coupled or connected to the other component, but also the component It may also include cases where it is 'connected', 'coupled' or 'connected' due to another element between the and another element.
- upper (above) or lower (lower) is not only when the two components are in direct contact with each other, but also also also includes cases in which one or more other components are formed or disposed between two components.
- up (up) or down (down) it may include the meaning of not only the upward direction but also the downward direction based on one component.
- FIG. 1 is a perspective view showing the exterior of a converter according to an embodiment of the present invention
- FIG. 2 is a plan view showing a lower surface of the converter according to an embodiment of the present invention
- FIG. 3 is a view of the converter according to an embodiment of the present invention. It is a plan view showing a top surface
- FIG. 4 is an exploded perspective view of a converter according to an embodiment of the present invention
- FIG. 5 is a plan view showing a top surface of the converter except for a cover and a printed circuit board according to an embodiment of the present invention
- 6 is a plan view showing a top surface of the converter from which a cover is excluded according to an embodiment of the present invention
- FIG. 7 is a plan view showing a lower surface of a printed circuit board according to an embodiment of the present invention
- FIG. It is a cross-sectional view of the heat dissipation structure in the converter according to the embodiment
- FIG. 9 is a cross-sectional view taken along line A-A' of FIG. 3 .
- the converter 10 may have an outer shape formed by the housing 100 .
- An inner space 101 may be formed in the housing 100 to place components for driving the converter 10 .
- a cover 190 is coupled to the upper surface of the housing 100 and may cover the upper surface of the inner space 101 .
- Screw holes are formed in the housing 100 and the cover 190 to allow screws to pass therethrough, respectively, and the housing 100 and the cover 190 may be screw-coupled to each other.
- a sealing member for sealing the inner space 101 may be disposed between the housing 100 and the cover 190 .
- a connector module 200 may be disposed on a side surface of the housing 100 .
- the connector module 200 is disposed on a side surface of the housing 100 and may be exposed to the outside. At least a portion of the connector module 200 may be disposed in the housing 100 and may be electrically connected to a printed circuit board 120 to be described later.
- the connector module 200 electrically connects the converter 10 and a battery (not shown), and the converter 10 and a load, and power provided from the battery may be converted in the converter 10 .
- the converted power may be applied to the load.
- the high voltage power applied from the battery may be converted in the converter 10
- the low voltage power may be applied to the load. Accordingly, a configuration for applying power to the converter 10 through the connector module 200 or a configuration for applying power from the converter 10 may be connected.
- the connector module 200 includes an integral configuration disposed on the outer surface of the housing 10 in order to electrically and physically connect the external terminals related to the driving of the converter 10 .
- the connector module 200 may include a bracket, a pin 210 accommodated in the bracket, and a bus bar 220 electrically connecting the pin 210 and the printed circuit board 120 .
- the converter 10 may include a refrigerant pipe 300 .
- the refrigerant pipe 300 may be coupled to the housing 100 .
- a heat dissipation space 110 may be formed in the housing 100 to accommodate the refrigerant pipe 300 .
- At least a part of the refrigerant pipe 300 may be disposed in the heat dissipation space 110 , and the other part may protrude to the outside of the heat dissipation space 110 to be exposed to the outside.
- an arrangement area of the heat dissipation space 110 may protrude downward than other areas.
- an arrangement area of the heat dissipation space 110 may be partitioned from other areas.
- the heat dissipation space 110 in the housing 100 may have a partition wall shape surrounding the refrigerant pipe 300 .
- the refrigerant pipe 300 has a flow path 301 formed therein so that the refrigerant flows, a refrigerant inlet 310 for introducing the refrigerant into the flow path 301 is disposed at one end, and the flow path 301 is disposed at the other end.
- a refrigerant discharge unit 320 through which the refrigerant circulated is disposed.
- the refrigerant pipe 300 may be formed in a metal pipe shape. Heat exchange is performed by the refrigerant circulated along the flow path 301 so that the converter 10 can radiate heat.
- the refrigerant pipe 300 and the housing 100 may be integrally formed by gravity casting.
- the refrigerant pipe 300 includes a first straight part 302 and a second straight part 306 disposed parallel to each other, and a connection part connecting the first straight part 302 and the second straight part 306 .
- the connection part 304 may be disposed perpendicular to the first straight part 302 and the second straight part 304 .
- a connection region between the connection part 304 and the first straight part 302 and a connection region between the connection part 304 and the second straight part 306 may have a bent shape.
- the refrigerant inlet 310 may be disposed at one end of the first straight part 302
- the refrigerant outlet 320 may be disposed at one end of the second straight part 306 .
- the partition wall of the heat dissipation space 110 is formed to surround the first straight part 302 , the second straight part 306 , and the connecting part 304 disposed in the housing 100 , and the first straight part 302 . ) and a connection region of the connection part 304 , and a connection region of the second straight part 306 and the connection part 304 may be exposed to the space within the housing 100 .
- At least one electronic component for driving the converter 10 may be disposed in the inner space 101 .
- the electronic component may include a printed circuit board 120 , a first electronic component 122 , and a second electronic component 130 .
- the printed circuit board 120 is formed in a plate shape and may be disposed in the inner space 101 .
- An upper surface of the printed circuit board 120 may be disposed to face the cover 190 , and a lower surface of the printed circuit board 120 may be disposed to face a bottom surface of the inner space 101 .
- a plurality of electronic components may be disposed on both surfaces of the printed circuit board 120 .
- the first electronic component 122 may be disposed on an upper surface of the printed circuit board 120
- the second electronic component 130 may be disposed on a lower surface of the printed circuit board 120 .
- the first electronic component 122 may be disposed on the upper surface of the printed circuit board 120 .
- the first electronic component 122 may include a FET device.
- the first electronic component 122 is provided in plurality, and may be mounted on the printed circuit board 120 .
- the plurality of first electronic components 122 may be arranged in a plurality of groups by forming one group of four each.
- the four first electronic components 122 in a single group may be respectively disposed in a corner area. Each group may be spaced apart from each other.
- the first electronic component 122 may be disposed to overlap the refrigerant pipe 300 in an up-down direction (a first direction).
- the first electronic component 122 may be disposed to vertically overlap with the first straight part 302 and the second straight part 306 .
- the first electronic component 122 includes six groups, three groups are disposed to overlap the first straight part 302 in the vertical direction, and the remaining three groups include the second straight part It may be disposed to overlap with the 306 in the vertical direction.
- a lower surface of the printed circuit board 120 may be in contact with the outer surface of the heat dissipation space 110 .
- a first heat-conducting layer 129 may be disposed between the lower surface of the printed circuit board 120 and the upper surface of the heat dissipation space 110 . Under the interposition of the first heat-conducting layer 129 , the lower surface of the printed circuit board 120 and the upper surface of the heat dissipation space 110 may contact each other.
- the first heat-conducting layer 129 may be formed of a material having excellent thermal conductivity, and may transmit driving heat of the first electronic component 122 to the heat dissipation space 110 .
- An upper surface of the heat dissipation space 110 on which the first heat-conducting layer 129 is disposed may be a flat surface.
- the second electronic component 130 may be disposed on a lower surface of the printed circuit board 120 .
- the second electronic component 130 may include an inductor for obtaining inductance.
- the second electronic component 130 is provided in plurality and may be mounted on the lower surface of the printed circuit board 120 .
- the second electronic component 130 forms one row of three each, and six of them may be disposed in the inner space 101 .
- the six second electronic components 130 include a 2-1 electronic component 131, a 2-2 electronic component 132 and a 2-3 electronic component 133 forming a first row, and a second It may include the 2-4th electronic component 134, the 2-5th electronic component 135, and the 2-6th electronic component 136 which form a column.
- Each of the second electronic components 130 may be disposed to be spaced apart from each other.
- a groove 102 to which the second electronic component 130 is coupled may be formed in the bottom surface of the inner space 101 .
- the groove 102 may be formed to correspond to the cross-sectional shape of the second electronic component 130 , and a portion of the bottom surface of the inner space 101 may be recessed downward than other regions.
- a portion of the second electronic component 130 may be accommodated in the groove 102 , and another portion may be disposed to protrude outside the groove 102 .
- An upper region of the second electronic component 130 protruding to the outside of the groove 102 may be coupled to the printed circuit board 120 .
- a protrusion 107 protruding downward from other regions may be disposed in a region corresponding to the groove 102 formation region on the lower surface of the housing 100 .
- the protrusion 107 may be disposed to horizontally overlap with the area of the heat dissipation space 110 protruding from the lower surface of the housing 100 .
- the second electronic component 130 may include a core and a coil disposed in the core.
- the core may be disposed in the groove 102 , and the coil may be exposed upwardly of the core to be electrically connected to the printed circuit board 120 .
- At least a portion of the second electronic component 130 is disposed to overlap the refrigerant pipe 300 in a horizontal direction.
- the horizontal direction (second direction) may be understood as a direction perpendicular to the vertical direction and a direction parallel to the printed circuit board 120 .
- the 2-1 th electronic component 131 , the 2-2 th electronic component 132 , and the 2-3 th electronic component 133 may be disposed to overlap the first straight part 302 in a horizontal direction.
- the 2-4th electronic component 134 , the 2-5th electronic component 135 , and the 2-6th electronic component 136 may be disposed to overlap the second straight part 306 in a horizontal direction. Accordingly, the driving heat of the second electronic component 130 may be easily transferred to the refrigerant pipe 300 .
- a second heat conduction layer 150 may be disposed between the inner surface of the groove 102 and the outer surface of the second electronic component 130 .
- the second heat-conducting layer 150 includes a side portion 152 disposed between a side surface of the second electronic component 130 and an inner surface of the groove 102 , and a lower surface of the second electronic component 130 and the groove. It may include a lower surface portion 154 disposed between the bottom surfaces of the 102 .
- a cross-section of the second heat-conducting layer 150 may have a “C” shape by the side portion 152 and the lower surface portion 154 .
- the second heat-conducting layer 150 may be formed of a material having excellent thermal conductivity, and may transmit driving heat of the second electronic component 130 to the refrigerant tube 300 and the heat dissipation space 110 .
- the second heat-conducting layer 150 may have a pad shape.
- the first electronic component and the second electronic component disposed on both sides of the printed circuit board form an optimal heat dissipation structure with the refrigerant tube, there is an advantage in that heat dissipation efficiency can be improved.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Dc-Dc Converters (AREA)
Abstract
Description
Claims (10)
- 내부 공간을 포함하는 하우징;상기 내부 공간 내 배치되는 인쇄회로기판;상기 인쇄회로기판의 상면에 배치되는 제1전자부품;상기 인쇄회로기판의 하면에 배치되는 제2전자부품; 및상기 하우징 내 배치되는 방열 공간을 포함하며,상기 제1전자부품은 상기 방열 공간과 제1방향으로 오버랩되게 배치되고,상기 제2전자부품 상기 방열 공간과 상기 제1방향에 수직한 제2방향으로 오버랩되게 배치되는 컨버터.
- 제 1 항에 있어서,상기 제1방향은 상하 방향이고,상기 제2방향은 상기 인쇄회로기판에 평행한 방향인 컨버터.
- 제 1 항에 있어서,상기 방열 공간의 상면과 상기 인쇄회로기판의 하면 사이에는 제1열전도층이 배치되는 컨버터.
- 제1 항 내지 제3 항 중 어느 한 항에 있어서,상기 내부 공간의 바닥면에는 타 영역보다 함몰 형성되며, 상기 제2전자부품을 수용하는 홈이 배치되는 컨버터.
- 제 4 항에 있어서,상기 홈의 내면과 상기 제2전자부품의 외면 사이에는 제2열전도층이 배치되는 컨버터.
- 제 5 항에 있어서,상기 제2열전도층은,상기 제2전자부품의 측면과 상기 홈의 내면 사이에 배치되는 측면부와, 상기 제2전자부품의 하면과 상기 홈의 바닥면 사이에 배치되는 하면부를 포함하는 컨버터.
- 제 1 항 내지 제 3 항 중 어느 한 항에 있어서,상기 방열 공간 내 배치되며, 내부에 냉매가 유동하는 냉매관을 포함하는 컨버터.
- 제 7 항에 있어서,상기 냉매관은,일단에 냉매 유입부가 배치되는 제1직선부와, 일단에 냉매 배출부가 배치되며 상기 제1직선부와 평행한 제2직선부와, 상기 제1직선부와 상기 제2직선부를 연결하며 상기 제1직선부와 상기 제2직선부에 수직한 연결부를 포함하는 컨버터.
- 제 8 항에 있어서,상기 제2전자부품은 복수로 구비되어, 일부는 상기 제1직선부와 평행한 제1열을 따라 배치되고, 나머지 일부는 상기 제2직선부와 평행한 제2열을 따라 배치되는 컨버터.
- 인쇄회로기판;상기 인쇄회로기판의 상면에 배치되는 제1전자부품;상기 인쇄회로기판의 하면에 배치되는 제2전자부품; 및상기 인쇄회로기판의 하면과 이격되어 배치되는 냉매관을 포함하고,상기 냉매관은 제1직선부와, 상기 제1직선부와 평행한 제2직선부와, 상기 제1직선부와 상기 제2직선부를 연결하는 연결부를 포함하고,상기 제1전자부품은 상기 제1직선부, 상기 제2직선부 및 상기 연결부와 상기 인쇄회로기판에 수직한 방향으로 오버랩되도록 배치되고,상기 제2전자부품은 상기 제1직선부와 상기 제2직선부 사이에 배치되는 컨버터.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202280008773.7A CN116724486A (zh) | 2021-01-05 | 2022-01-04 | 转换器 |
EP22736811.5A EP4277444A1 (en) | 2021-01-05 | 2022-01-04 | Converter |
JP2023540937A JP2024501776A (ja) | 2021-01-05 | 2022-01-04 | コンバータ |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2021-0001038 | 2021-01-05 | ||
KR1020210001038A KR20220099022A (ko) | 2021-01-05 | 2021-01-05 | 컨버터 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022149834A1 true WO2022149834A1 (ko) | 2022-07-14 |
Family
ID=82358189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2022/000107 WO2022149834A1 (ko) | 2021-01-05 | 2022-01-04 | 컨버터 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP4277444A1 (ko) |
JP (1) | JP2024501776A (ko) |
KR (1) | KR20220099022A (ko) |
CN (1) | CN116724486A (ko) |
WO (1) | WO2022149834A1 (ko) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010104204A (ja) * | 2008-10-27 | 2010-05-06 | Denso Corp | 電力変換装置 |
JP2010172147A (ja) * | 2009-01-26 | 2010-08-05 | Denso Corp | 電力変換装置 |
JP2012210002A (ja) * | 2011-03-29 | 2012-10-25 | Denso Corp | スイッチング電源装置 |
WO2013080317A1 (ja) * | 2011-11-30 | 2013-06-06 | 三菱電機株式会社 | 半導体装置、及び車載用電力変換装置 |
JP2020198347A (ja) * | 2019-05-31 | 2020-12-10 | 株式会社豊田自動織機 | 電力変換装置 |
-
2021
- 2021-01-05 KR KR1020210001038A patent/KR20220099022A/ko unknown
-
2022
- 2022-01-04 JP JP2023540937A patent/JP2024501776A/ja active Pending
- 2022-01-04 CN CN202280008773.7A patent/CN116724486A/zh active Pending
- 2022-01-04 WO PCT/KR2022/000107 patent/WO2022149834A1/ko active Application Filing
- 2022-01-04 EP EP22736811.5A patent/EP4277444A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010104204A (ja) * | 2008-10-27 | 2010-05-06 | Denso Corp | 電力変換装置 |
JP2010172147A (ja) * | 2009-01-26 | 2010-08-05 | Denso Corp | 電力変換装置 |
JP2012210002A (ja) * | 2011-03-29 | 2012-10-25 | Denso Corp | スイッチング電源装置 |
WO2013080317A1 (ja) * | 2011-11-30 | 2013-06-06 | 三菱電機株式会社 | 半導体装置、及び車載用電力変換装置 |
JP2020198347A (ja) * | 2019-05-31 | 2020-12-10 | 株式会社豊田自動織機 | 電力変換装置 |
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CN116724486A (zh) | 2023-09-08 |
KR20220099022A (ko) | 2022-07-12 |
JP2024501776A (ja) | 2024-01-15 |
EP4277444A1 (en) | 2023-11-15 |
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