WO2022135256A1 - Module de caméra et dispositif électronique - Google Patents

Module de caméra et dispositif électronique Download PDF

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Publication number
WO2022135256A1
WO2022135256A1 PCT/CN2021/138679 CN2021138679W WO2022135256A1 WO 2022135256 A1 WO2022135256 A1 WO 2022135256A1 CN 2021138679 W CN2021138679 W CN 2021138679W WO 2022135256 A1 WO2022135256 A1 WO 2022135256A1
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WO
WIPO (PCT)
Prior art keywords
bracket
camera module
circuit board
image sensor
substrate
Prior art date
Application number
PCT/CN2021/138679
Other languages
English (en)
Chinese (zh)
Inventor
李美生
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2022135256A1 publication Critical patent/WO2022135256A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the present application relates to the field of imaging technologies, and in particular, to a camera module and an electronic device.
  • the camera module is one of the indispensable core components of electronic equipment such as mobile phones and computers.
  • the external force on the lens base will be transmitted to the filter through the bracket, and the filter is easily broken under the action of the external force, which reduces the reliability of the camera module.
  • the present application provides a camera module and an electronic device, which can avoid the problem that the filter is broken due to external force, and improve the reliability of the camera module.
  • the present application provides a camera module, comprising a circuit board, an image sensor, a first bracket, a filter, a second bracket and a lens base, the image sensor is mounted on the circuit board, and the first bracket is mounted on the circuit board On the top side of the circuit board, the first bracket is provided with a light-through hole corresponding to the image sensor, the filter is installed on the first bracket and covers the light-through hole of the first bracket, and the second bracket is installed on the top side of the circuit board and surrounds the The first bracket is arranged, the inner edge of the second bracket is located on the top side of the outer edge of the first bracket, and the lens base is mounted on the top side of the second bracket.
  • the camera module shown in this application adopts a separate first bracket and a second bracket to support the filter and the lens base, respectively.
  • external force such as when the side of the lens base is squeezed
  • the The two brackets cannot directly transmit these forces to the filter, which can effectively reduce the influence of the filter by external forces, that is, the filter will not be compressed or deformed under the action of external force, which reduces the effect of external force on the filter.
  • the risk of failure improves the reliability of the camera module.
  • the first bracket and the second bracket can reuse the size of the camera module in the length space, which is beneficial to reduce the length of the camera module and realize the camera module.
  • the camera module includes an adhesive layer, and the adhesive layer is adhered between the outer edge of the first bracket and the inner edge of the second bracket. That is, the first bracket and the second bracket are fixed to each other through the adhesive layer, and the first bracket can also assist in supporting the lens base, which is beneficial to improve the stability of the second bracket supporting the lens base, thereby helping to improve the stability of the camera module. Structural stability ensures the reliability of the camera module.
  • the second bracket is provided with a light-transmitting hole corresponding to the filter, and the first bracket, the filter and the second bracket are enclosed to form a gap.
  • the camera module includes a dust-catching glue part, and the dust-catching glue part is filled in the gap.
  • the dust-catching glue can act like a "sponge".
  • the buffering function slows down the force transmitted from the second bracket to the first bracket, thereby slowing down the force transmitted to the optical filter, and reducing the risk of the optical filter breaking and failing under the action of external force.
  • the dust-catching glue part can be completely filled in the gap to completely seal the gap, prevent impurities such as external dust or moisture from entering the inside of the second bracket through the gap, prevent the image sensor from being polluted, and improve the imaging quality of the camera module.
  • the camera module includes a waterproof and breathable membrane, and the waterproof and breathable membrane covers the opening of the gap.
  • the waterproof and breathable membrane can not only prevent moisture from entering the inside of the second bracket through the gap and prevent the image sensor from being contaminated by moisture, but also there is a difference in air pressure between the top side and the bottom side of the filter.
  • the air on the top side and the bottom side can be exchanged through the waterproof breathable membrane and the gap, which can prevent the filter from being broken due to the air pressure difference, and improve the production yield or use reliability of the camera module.
  • the first bracket is provided with a fixing portion, and the fixing portion is fixed on the top surface of the first bracket to increase the strength of the first bracket.
  • the second bracket is provided with a fixing slot, the opening of the fixing slot is located on the bottom surface of the second bracket, and the fixing part is installed in the fixing slot.
  • the first bracket is provided with a notch communicating with the light-passing hole, and the opening of the notch is located on the bottom surface of the first bracket.
  • the camera module includes a wire, the wire is electrically connected between the image sensor and the circuit board, and the highest point of the wire is located in the gap, so that the wire and the first bracket reuse the height space of the camera module, which is beneficial to reduce the height size of the camera module , to realize the miniaturized design of the camera module.
  • the circuit board is provided with a first installation slot, the opening of the first installation slot is located on the top surface of the circuit board, and the image sensor is installed in the first installation slot, so that the image sensor and the circuit board are multiplexed with the camera module.
  • the height space is beneficial to reduce the height size of the camera module and realize the miniaturization design of the camera module.
  • the circuit board includes a substrate and a board body fixed on the top surface of the substrate, the substrate is made of a metal material, the first mounting groove exposes the substrate, and the image sensor is fixed to the substrate, so that the working The generated heat is transferred to the substrate.
  • the heat of the image sensor can be quickly transferred to the external environment, so as to achieve rapid heat dissipation of the image sensor, avoid the image sensor from malfunctioning due to excessive temperature, and ensure the camera mode Use reliability of the group.
  • the camera module includes a first thermally conductive adhesive layer, and the first thermally conductive adhesive layer is connected between the image sensor and the substrate, so as to transmit the heat generated by the image sensor to the substrate in time and effectively, so as to improve the image quality.
  • the cooling efficiency of the sensor is not limited to a first thermally conductive adhesive layer, and the first thermally conductive adhesive layer is connected between the image sensor and the substrate, so as to transmit the heat generated by the image sensor to the substrate in time and effectively, so as to improve the image quality. The cooling efficiency of the sensor.
  • the circuit board is provided with a second mounting slot around the first mounting slot, the opening of the second mounting slot is located on the top surface of the board body, the second mounting slot exposes the substrate, and the first bracket is made of metal material.
  • the feet of the first bracket are installed in the second installation groove and fixed to the substrate, so that the first bracket can receive the heat from the substrate through the feet, which is equivalent to increasing the heat dissipation channel of the image sensor, which is beneficial to improve the image The cooling efficiency of the sensor.
  • the camera module includes a second thermally conductive adhesive, and the second thermally conductive adhesive is connected between the first support and the substrate, so as to transfer the heat of the substrate to the first support in a timely and effective manner, and improve the heat dissipation of the image sensor. efficiency.
  • the circuit board is provided with an avoidance space around the first installation slot, the opening of the avoidance space is located on the top surface of the board body, and exposes the substrate, the second bracket is made of metal material, and the bracket of the second bracket is It is installed in the avoidance space and fixed to the substrate, so that the second bracket can receive the heat from the substrate through the support feet, which is equivalent to increasing the heat dissipation channel of the image sensor, which is beneficial to improve the heat dissipation efficiency of the image sensor.
  • the camera module includes a third thermally conductive adhesive, and the third thermally conductive adhesive is connected between the second bracket and the substrate, so as to transfer the heat of the substrate to the second bracket in a timely and effective manner, and improve the heat dissipation of the image sensor. efficiency.
  • the camera module further includes a lens, and the lens is mounted on the inner side of the lens base to condense light from outside the camera module, and project the condensed external light from the filter to the image sensor.
  • the present application provides an electronic device, comprising an image processor of any of the above camera modules, the image processor is connected to the camera module in communication, and the image processor is used to obtain image data from the camera module and process the image data. .
  • the camera module adopts a separate first bracket and a second bracket to support the filter and the lens base respectively.
  • an external force such as when the side of the lens base is squeezed
  • the The two brackets cannot directly transmit these forces to the filter, which can effectively reduce the influence of the filter by external forces, that is, the filter will not be compressed or deformed under the action of external force, which reduces the effect of external force on the filter.
  • the risk of failure improves the reliability of the camera module, thereby improving the reliability of the electronic equipment.
  • FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • Fig. 2 is the structural representation of the camera module in the electronic equipment shown in Fig. 1;
  • FIG. 3 is a schematic diagram of a partially exploded structure of the camera module shown in FIG. 2 under an embodiment
  • FIG. 4 is a schematic diagram of the assembly structure of the circuit board and the image sensor in the camera module shown in FIG. 3;
  • Fig. 5 is the sectional structure schematic diagram that the structure shown in Fig. 4 is cut along I-I place;
  • Fig. 6 is the structural representation of the first bracket in the camera module shown in Fig. 3;
  • FIG. 7 is a schematic structural diagram of the first bracket shown in FIG. 6 at another angle
  • FIG. 8 is a schematic view of the assembly structure of the first bracket and the filter in the camera module shown in FIG. 3;
  • FIG. 9 is a schematic cross-sectional structure diagram of the structure shown in FIG. 8 taken along II-II;
  • Fig. 10 is the structural representation of the second bracket in the camera module shown in Fig. 3;
  • Figure 11 is a schematic structural diagram of the second bracket shown in Figure 10 at another angle
  • FIG. 12 is a schematic diagram of the assembly structure of the first support, the filter and the second support in the camera module shown in FIG. 3;
  • Figure 13 is a schematic cross-sectional structural diagram of the structure shown in Figure 12 taken along III-III;
  • FIG. 14 is a schematic cross-sectional view of the camera module shown in FIG. 2 cut along IV-IV;
  • FIG. 15 is a schematic cross-sectional structural diagram of the camera module shown in FIG. 2 cut along V-V;
  • 16 is a cross-sectional structural schematic diagram of a camera module section cut along IV-IV in the second electronic device provided by the embodiment of the present application;
  • 17 is a schematic cross-sectional structural diagram of a camera module cut along V-V in the second electronic device provided by the embodiment of the present application;
  • FIG. 18 is a schematic cross-sectional structure diagram of a camera module section cut along IV-IV in the third electronic device provided by the embodiment of the present application;
  • FIG. 19 is a schematic cross-sectional structural diagram of a camera module cut along V-V in the third electronic device provided by the embodiment of the present application;
  • 20 is a schematic diagram of the assembly structure of the circuit board and the image sensor of the camera module in the fourth electronic device provided by the embodiment of the present application;
  • 21 is a schematic structural diagram of a first bracket of a camera module in a fourth electronic device provided by an embodiment of the present application.
  • FIG. 22 is a schematic cross-sectional structure diagram of a camera module section cut along IV-IV in the fourth electronic device provided by the embodiment of the present application;
  • FIG. 23 is a partial cross-sectional structural schematic diagram of a camera module cut along V-V in the fourth electronic device provided by the embodiment of the present application;
  • Fig. 24 is the assembly structure schematic diagram of the circuit board and the image sensor of the camera module in the fifth electronic equipment provided by the embodiment of the present application;
  • 25 is a schematic structural diagram of a first bracket of a camera module in a fifth electronic device provided by an embodiment of the present application.
  • Figure 26 is a schematic structural diagram of the first bracket shown in Figure 25 at another angle;
  • FIG. 27 is a schematic structural diagram of a second bracket of a camera module in a fifth electronic device provided by an embodiment of the present application.
  • FIG. 28 is a schematic cross-sectional structural diagram of a camera module section cut along IV-IV in the fifth electronic device provided by the embodiment of the present application;
  • FIG. 29 is a schematic cross-sectional structural diagram of a camera module section cut along V-V in the fifth electronic device provided by the embodiment of the present application;
  • FIG. 30 is a schematic diagram of the assembly structure of the circuit board and the image sensor of the camera module in the sixth electronic device provided by the embodiment of the present application;
  • 31 is a schematic structural diagram of a second bracket of a camera module in a sixth electronic device provided by an embodiment of the present application.
  • FIG. 32 is a schematic cross-sectional structure diagram of a camera module section taken along IV-IV in the sixth electronic device provided by the embodiment of the present application;
  • FIG. 33 is a schematic cross-sectional structural diagram of a camera module in the fifth electronic device provided by the embodiment of the present application cut along V-V.
  • FIG. 1 is a schematic structural diagram of an electronic device 100 provided by an embodiment of the present application.
  • the electronic device 100 may be an electronic product with a camera function, such as a mobile phone, a tablet computer, a notebook computer, a car machine, a point of sales terminal (point of sales terminal, POS machine for short), or a wearable device.
  • the wearable device may be a smart bracelet, a smart watch, augmented reality (AR) glasses, virtual reality (virtual reality, VR) glasses, and the like.
  • AR augmented reality
  • VR virtual reality
  • the width direction of the electronic device 100 is defined as the X-axis direction
  • the length direction of the electronic device 100 is defined as the Y-axis direction
  • the thickness direction of the electronic device 100 is defined as the Z-axis direction
  • the X-axis direction is defined as the Y-axis direction
  • the Z-axis direction is defined as the Z-axis direction
  • the X-axis direction is defined as the Y-axis direction
  • the directions are perpendicular to each other.
  • the electronic device 100 includes a casing 10 , a display module 20 , a camera module 30 and an image processor 40 .
  • the casing 10 includes a frame 11 and a back cover 12 , and the back cover 12 is fixed to one side of the frame 11 .
  • the frame 11 and the back cover 12 may be fixed to each other by assembling, or may be integrally formed structural components. It should be understood that, in other embodiments, the electronic device 100 may also be a foldable mobile phone.
  • the display module 20 is mounted on the casing 10 and is enclosed with the casing 10 to form the interior of the electronic device 100 . Specifically, the display module 20 is fixed on the side of the frame 11 away from the back cover 12 . That is, the display module 20 and the back cover 12 are respectively fixed on opposite sides of the frame 11 .
  • the display module 20 is provided with a light-transmitting area 201 , and light from outside the electronic device 100 can enter the interior of the electronic device 100 through the light-transmitting area 201 .
  • the camera module 30 and the image processor 40 are installed inside the casing 10 .
  • the inside of the casing 10 is the inside of the electronic device 100 .
  • the camera module 30 can collect light outside the electronic device 100 through the light-transmitting area 201 and form corresponding image data.
  • the image processor 40 is electrically connected to the camera module 30 , and the image processor 40 is used for acquiring image data from the camera module 30 and processing the image data.
  • the image data processed by the image processor 40 can be displayed on the display module 20 , can also be stored in the memory of the electronic device 100 , or can also be stored in the cloud through the electronic device 100 .
  • the camera module 30 is located on the side of the electronic device 100 close to the display module 20 , and is used as a front camera module of the electronic device 100 . It should be noted that, in other embodiments, the camera module 30 can also be located on the side of the electronic device 100 away from the display module 20, and used as a rear camera module of the electronic device 100. At this time, the rear cover 12 is provided with a camera hole, and the camera module 30 collects the light outside the electronic device 100 through the camera hole of the rear cover 12 . In other words, the camera module 30 can be used as both a front camera module of the electronic device 100 and a rear camera module of the electronic device 100 . Alternatively, the electronic device 100 may include multiple (two or more) camera modules 30, at least one camera module 30 is used as a front camera module of the electronic device 100, and at least one camera module 30 is used as an electronic device 100 rear camera module.
  • FIG. 2 is a schematic structural diagram of the camera module 30 in the electronic device 100 shown in FIG. 1
  • FIG. 3 is a partially exploded structural schematic diagram of the camera module 30 shown in FIG. 2 under an embodiment.
  • the width direction of the camera module 30 is the X axis direction
  • the length direction of the camera module 30 is the Y direction
  • the height direction of the camera module 30 is the Z axis direction.
  • the camera module 30 includes a circuit board 31 , an image sensor 32 , a first holder 33 , a filter 34 , a second holder 35 , a lens base 36 and a lens 37 .
  • the circuit board 31 is electrically connected to the image processor 40 , so that the camera module 30 is electrically connected to the image processor 40 .
  • the circuit board 31 includes a top surface 311 and a bottom surface 312 disposed opposite to each other. Both the top surface 311 and the bottom surface 312 of the circuit board 31 are parallel to the X-Y plane (may also be substantially parallel to the X-Y plane, that is, a slight deviation is allowed).
  • both the top surface 311 and the bottom surface 312 of the circuit board 31 are perpendicular to the Z-axis direction (may also be substantially perpendicular to the Z-axis direction, that is, a slight deviation is allowed).
  • the circuit board 31 is provided with a first installation groove 313 , and the opening of the first installation groove 313 is located on the top surface 311 of the circuit board 31 .
  • the opening of the first mounting groove 313 is located in the middle area of the top surface 311 , and the first mounting groove 313 is recessed from the top surface 311 to the bottom surface 312 of the circuit board 31 .
  • orientation terms such as “top” and “bottom” involved in the embodiments of the present application are described with reference to the orientation of FIG. 3 , and do not indicate or imply that the device or element referred to must have a specific orientation, construction and operation in a particular orientation, and therefore should not be construed as a limitation on the present application.
  • FIG. 4 is a schematic diagram of the assembly structure of the circuit board 31 and the image sensor 32 in the camera module 30 shown in FIG. 3 .
  • the top surface 311 of the circuit board 31 is provided with a gold finger 314 , and the gold finger 314 is electrically connected to the circuit board 31 .
  • There are a plurality of gold fingers 314 and the plurality of gold fingers 314 are all arranged near the opening of the first installation groove 313 .
  • Part of the gold fingers 314 are spaced apart from each other along the Y-axis direction to form a first gold finger group, and some of the first gold fingers 314 are spaced apart from each other along the Y-axis direction to form a second gold finger group.
  • the first golden finger group and the second golden finger group are respectively arranged on opposite sides of the opening of the first installation groove 313 along the X-axis direction with an interval from each other.
  • the positions of the gold fingers 314 are not limited to the ones protruding from the top surface 311 of the circuit board 31 as shown in FIG. 4 . In some other reasonable cases, the gold fingers 314 can also be embedded in the circuit board 31 . At this time, the top surface (not shown) of the gold finger 314 may be flush with the top surface 311 of the circuit board 31 , or the top surface of the gold finger 314 may be recessed relative to the top surface 311 of the circuit board 31 , which is not specified in this application. limited.
  • FIG. 5 is a schematic cross-sectional structure diagram of the structure shown in FIG. 4 cut along the line I-I.
  • the section along "I-I" refers to sectioning along the plane where the I-I line is located, and the same understanding can be made for the description of the accompanying drawings hereinafter.
  • the circuit board 31 includes a board body 31a and a substrate 31b.
  • the top surface (not shown) of the substrate 31b is fixed to the bottom surface (not shown) of the connecting plate body 31a.
  • the top surface (not shown) of the board body 31 a is the top surface 311 of the circuit board 31 above, and the bottom surface (not shown) of the substrate 31 b is the bottom surface 312 of the circuit board 31 .
  • the substrate 31b is used for the substrate body 31a, so that the circuit board 31 has sufficient structural strength to better support other devices and structures.
  • the substrate 31b can be made of metal material.
  • the substrate 31b can be made of metal materials such as stainless steel, copper, or steel, so as to ensure that the substrate 31 has high thermal conductivity, so that the heat of the circuit board 31 and the devices fixed to the circuit board 31 can be quickly dissipated. out to improve the reliability of the camera module 30 .
  • the substrate 31 can also be made of ceramic material.
  • the circuit board 31 may further include an adhesive layer 31c.
  • the adhesive layer 31c is located between the substrate 31b and the plate body 31a, and the adhesive layer 31c is bonded between the top surface of the substrate 31b and the bottom surface of the plate body 31a, that is, the substrate 31b and the plate body 31a are bonded by bonding. way fixed to each other.
  • the adhesive layer 31c may be a conductive adhesive or a non-conductive adhesive.
  • the substrate 31b can also be fixed to the board body 31a by welding.
  • the circuit board 31 may further include a solder layer, and the solder layer is located between the substrate 31b and the board body 31a, and is used for fixedly connecting the substrate 31b and the board body 31a.
  • the circuit board 31 may be a rigid-flex circuit board.
  • the board body 31a includes a first hard board part 311a, a soft board part 312a and a second hard board part 313a arranged in sequence.
  • the board surface area of the first hard board part 311a is larger than the board surface area of the second hard board part 313a.
  • the first hard board part 311a and the second hard board part 313a are rigid board parts, the soft board part 312a is a flexible board part, and the flexible board part is easier to bend than the rigid board part.
  • the first hard board portion 311a is fixed to the substrate 31b, and the top surface of the first hard board portion 311a is the top surface 311 of the circuit board 31 described above.
  • the circuit board 31 may further include a substrate (not shown) fixed to the second hard board portion 313a.
  • the board body 31a is a flexible board member, the board body 31a includes a first part, a second part and a third part arranged in sequence, and the area of the first part is larger than that of the third part.
  • the first part is fixed on the substrate 31b, and the top surface of the first part is the top surface 311 of the circuit board 31 mentioned above.
  • the circuit board 31 may also include a substrate secured to the second portion.
  • the board body 31a has through holes (not shown), the adhesive layer 31c (or solder layer) has through holes (not shown), and the through holes of the adhesive layer 31c communicate with the through holes of the board body 31a.
  • the first mounting groove 313 (as shown in FIG. 5 ) includes a through hole of the board body 31a and a through hole of the adhesive layer 31c, and exposes the substrate 31b. At this time, the region where the top surface of the substrate 31b faces the through hole of the board body 31a forms the groove bottom wall of the first mounting groove 313 .
  • two spaces are "connected", which means that the two spaces are connected and communicated.
  • the processing difficulty of the first installation groove 313 is relatively small, which is beneficial to improve the processing accuracy.
  • the plate body 31a may also have grooves, and the grooves of the plate body 31 communicate with the through holes of the adhesive layer 31c.
  • the first mounting groove 313 includes a through hole of the board body 31a, a through hole of the adhesive layer 31c, and a groove of the substrate 31b. At this time, the bottom wall of the groove of the plate body 31 a is the bottom wall of the first installation groove 313 .
  • the image sensor 32 is mounted on the circuit board 31 and is electrically connected to the circuit board 31 .
  • the image sensor 32 is installed in the first installation groove 313 . That is, the image sensor 32 can be fixed to the circuit board 31 from the top side of the circuit board 31 .
  • the image sensor 32 is mounted on the bottom wall of the first mounting groove 313 .
  • the image sensor 32 may be a chip.
  • the image sensor 32 is fixed to the substrate 31b.
  • the camera module 30 may include a first thermally conductive adhesive layer 50 connected between the image sensor 32 and the substrate 31b. That is, the image sensor 32 can be fixed to the substrate 31b through the first thermally conductive adhesive layer 50, so that the heat generated during operation is transferred to the substrate 31b through the first thermally conductive adhesive layer 50, and the heat dissipation is realized through the substrate 31b.
  • the camera module 30 may include an adhesive layer, and the adhesive layer is adhered between the image sensor 32 and the substrate 31b, that is, the image sensor 32 may be fixed to the substrate 31b by means of adhesive.
  • the camera module 30 may include a solder layer, and the solder layer is connected between the image sensor 32 and the substrate 31b, that is, the image sensor 32 may also be fixed to the substrate 31b by soldering.
  • the height of the image sensor 32 is smaller than the groove depth of the first mounting groove 313 of the circuit board 31 .
  • the height of the image sensor 32 refers to the size of the image sensor 32 in the height direction of the camera module 30 (ie, the Z-axis direction in the figure).
  • the image sensor 32 is completely embedded in the circuit board 31 , and the image sensor 32 and the circuit board 31 can reuse the height space of the camera module 30 , which is beneficial to reduce the height of the camera module 30 .
  • the height of the image sensor 32 can also be equal to the groove depth of the first installation groove 313 of the circuit board 31 , or the height of the image sensor 32 can also be greater than the groove depth of the first installation groove 313 of the circuit board 31 . .
  • the image sensor 32 includes a top surface 321 facing the same as the top surface 311 of the circuit board 31 .
  • the top surface 321 of the image sensor 32 includes a photosensitive area 322 and a non-photosensitive area 323 surrounding the photosensitive area 322 .
  • the photosensitive area 322 is located in the middle area of the top surface 321 of the image sensor 32 , and is used for receiving light entering the interior of the camera module 30 .
  • the non-photosensitive area 323 is located at the edge area of the top surface 321 of the image sensor 32, and is used to realize the electrical connection between the image sensor 32 and the circuit board 31.
  • the top surface 321 of the image sensor 32 is provided with pads 324 , and the pads 324 are electrically connected to the image sensor 32 .
  • the pads 324 are disposed on the non-photosensitive area 323 of the top surface 321 to avoid affecting the photosensitive area 322 to receive light for imaging.
  • Some of the pads 324 are spaced apart from each other along the Y-axis direction to form a first pad group, and some of the pads 324 are spaced apart from each other along the Y-axis direction to form a second pad group.
  • the non-photosensitive regions 323 of the top surface 321 are arranged at intervals in the X-axis direction.
  • the positions of the pads 324 are not limited to protruding from the top surface 321 of the image sensor 32 as shown in FIG. 4 .
  • the pads 324 may also be embedded in the image sensor 32 .
  • the top surface (not shown) of the pad 324 may be flush with the top surface 321 of the image sensor 32, or the top surface of the pad 324 may be recessed relative to the top surface 321 of the image sensor 32, which is not specifically described in this application. limited.
  • the number of pads 324 matches the number of gold fingers 314 . Specifically, the number of pads 324 is the same as the number of gold fingers 314 . In some other embodiments, the number of the pads 324 may also be more or less than the number of the first gold fingers 314 .
  • the camera module 30 further includes a wire 38 , and the wire 38 is connected between the circuit board 31 and the image sensor 32 to electrically connect the circuit board 31 and the image sensor 32 .
  • the image sensor 32 is connected to the board body 31 a of the circuit board 31 through wires 388 to electrically connect the circuit board 31 .
  • the number of wires 38 is the same as the number of gold fingers 314 and pads 324 , and each wire 38 is connected between one gold finger 314 and one pad 324 .
  • the wires 38 can be formed by a wire bonding (WB) process.
  • the wire bonding process may also be called a pressure welding process, a bonding process, a bonding process or a wire bonding process.
  • the wires 38 may be made of gold, copper, aluminum, or other materials.
  • FIG. 6 is a schematic structural diagram of the first bracket 33 in the camera module 30 shown in FIG. 3
  • FIG. 7 is a structural schematic diagram of the first bracket 33 shown in FIG. 6 from another angle.
  • the first bracket 33 includes a top surface 331 and a bottom surface 332 disposed opposite to each other, and a peripheral surface 333 connected between the top surface 331 and the bottom surface 332 .
  • the top surface 331 of the first bracket 33 is the surface of the first bracket 33 facing away from the circuit board 31 (as shown in FIG. 3 ), and the bottom surface 332 of the first bracket 33 is the surface of the first bracket 33 facing the circuit board 31 .
  • the first bracket 33 is provided with a light-passing hole 334 and two notches 335 .
  • the two notches 335 are spaced apart from each other along the Y-axis direction on opposite sides of the light-passing hole 334 , and both communicate with the light-passing hole 334 .
  • the first bracket 33 may also be provided with one or more than three notches 335, which are not specifically limited in this application.
  • the opening of the light-passing hole 334 is located on the top surface 331 of the first bracket 33 .
  • the opening of the light-passing hole 334 is located in the middle area of the top surface 331 .
  • the light through hole 334 is recessed from the top surface 331 of the first bracket 33 toward the bottom surface 332 , and penetrates through the bottom surface 332 of the first bracket 33 . That is, the light-transmitting hole 334 penetrates the first bracket 33 along the thickness direction of the first bracket 33 (the Z-axis direction in the figure).
  • the light-passing hole 334 is a closed hole (that is, the light-passing hole 334 has a complete hole wall along the circumferential direction).
  • the hole wall 3341 of the light through hole 334 includes a first part 3342 , a second part 3343 and a third part 3344 which are connected in sequence.
  • the first portion 3342 is a portion of the hole wall of the light-passing hole 334 close to the bottom surface 332 of the first bracket 33 .
  • the first part 3342 is inclined relative to the bottom surface 332 of the first bracket 33 , and the included angle ⁇ between the first part 3342 and the bottom surface 332 of the first bracket 33 is between 90° and 180°. That is, the first portion 3342 is a chamfered surface.
  • the third portion 3344 is a portion of the hole wall of the light-passing hole 334 close to the top surface 331 of the first bracket 33 .
  • the third portion 3344 may be relatively vertical or relatively inclined to the top surface 331 of the first bracket 33 .
  • the opening of the notch 335 is located on the bottom surface 332 of the first bracket 33 .
  • the opening of the notch 335 is located at the edge region of the bottom surface 332 .
  • the notch 335 is recessed from the bottom surface 332 of the first bracket 33 toward the top surface 331 , and penetrates through the hole wall of the light-passing hole 334 .
  • the notch 335 also penetrates the peripheral surface 333 of the first bracket 33 .
  • the depth h of the notch 335 is equal to or greater than 0.18 mm.
  • the notch 335 may not penetrate through the peripheral surface 333 of the first bracket 33 . It should be understood that the notch 335 is a non-closed hole, i.e. the notch 335 does not have a complete hole wall along the circumference.
  • the first bracket 33 includes a bearing body 33a and two mounting bodies 33b, and the two mounting bodies 33b are fixed on the bottom surface of the bearing body 33a (not marked in the figure).
  • the top surface (not shown) of the bearing body 33a forms the top surface 331 of the first bracket 33 above
  • the bottom surfaces (not shown) of the two mounting bodies 33b form the bottom surface 332 of the first bracket 33 above.
  • the bearing body 33 a and the two mounting bodies 33 b may be integrally formed to ensure the structural stability of the first bracket 33 .
  • the bearing body 33a is provided with a through hole 331a, and the opening of the through hole 331a is located on the top surface of the bearing body 33a.
  • the through hole 331a extends from the top surface of the bearing body 33a in the direction of the bottom surface, and penetrates through the bottom surface of the bearing body 33a. That is, the through hole 331a penetrates the bearing body 33a along the thickness direction of the bearing body 33a.
  • Both of the two mounting bodies 33b are fixed to the edge region of the bottom surface of the bearing body 33a.
  • the two mounting bodies 33b are respectively arranged on both sides of the through hole 331a at intervals along the Y-axis direction.
  • the space between the two mounting bodies 33b forms a light-passing area 331b and two avoidance areas 332b connected to both sides of the light-passing area 331b.
  • the light passing area 331b communicates with the through hole 331a, and forms the light passing hole 334 of the first bracket 33 above with the through hole 331a.
  • the two avoidance areas 332b are arranged at intervals along the X-axis direction, and the two avoidance areas 332b respectively form the two notches 335 of the first bracket 33 above.
  • FIG. 8 is a schematic view of the assembly structure of the first bracket 33 and the filter 34 of the camera module 30 shown in FIG. 3
  • FIG. 9 is a section along II-II of the structure shown in FIG. 8 Schematic diagram of the cross-sectional structure.
  • the filter 34 is mounted on the first bracket 33 and covers the light-transmitting hole 334 .
  • the filter 34 is mounted on the top surface 331 of the first bracket 33 and covers the opening of the light-passing hole 334 .
  • the filter 34 may be fixed to the top surface 331 of the first bracket 33 by means of adhesive bonding.
  • the camera module 30 may include an adhesive layer 60 , and the adhesive layer 60 is adhered between the filter 34 and the first bracket 33 .
  • the filter 34 may be blue glass (BG).
  • the filter 34 covering the light-passing hole 334 means that the filter 34 covers the narrowest position of the light-passing hole 334 , and external light can only enter the interior of the first bracket 33 through the filter 34 .
  • the hole wall of the light-passing hole 334 may partially protrude to form a support portion (not shown). At least part of the filter 34 is accommodated in the light-passing hole 334 and mounted on the top surface of the supporting portion.
  • the filter 34 is in the shape of a sheet.
  • the optical filter 34 includes a top surface 341 and a bottom surface 342 arranged opposite to each other, and the top surface 341 and the bottom surface 342 of the optical filter 34 have the same area.
  • the thickness of the optical filter 34 is between 150 ⁇ m and 250 ⁇ m.
  • the length and width of the optical filter 34 is 7 mm*7 mm or more.
  • the camera module 30 can have a larger imaging area, which helps the camera module 30 to obtain a clearer and better photographing effect.
  • the first bracket 33 may be made of non-metallic materials such as high-strength plastic.
  • the thickness H of the bearing body 33a is equal to or greater than 0.2 mm to ensure that the first bracket 33 has high strength.
  • the first bracket 33 is not easily deformed by the impact of external force, so as to ensure the reliability of the first bracket 33 supporting the filter 34 .
  • the first bracket 33 may be made of metal material.
  • the thickness H of the bearing body 33a may be less than or equal to 0.15mm. It should be noted that, due to the high strength of the metal material, the thickness of the bearing body 33a made of the metal material can be reduced by at least 50 mm compared to the first bracket 33 made of the non-metallic material, that is, the first bracket The overall thickness of the camera module 33 can be reduced by at least 50 mm, which is beneficial to reduce the height of the camera module 30 and realize the miniaturized design of the camera module 30 .
  • FIG. 10 is a schematic structural diagram of the second bracket 35 in the camera module 30 shown in FIG. 3
  • FIG. 11 is a structural schematic diagram of the second bracket 35 shown in FIG. 10 from another angle.
  • the second bracket 35 includes a top surface 351 and a bottom surface 352 disposed opposite to each other.
  • the top surface 351 of the second bracket 35 is the surface of the second bracket 35 facing away from the circuit board 31 (as shown in FIG. 3 ), and the bottom surface 352 of the second bracket 35 is the surface of the second bracket 35 facing the circuit board 31 .
  • the second bracket 35 is provided with a receiving groove 353 and a light-transmitting hole 354 .
  • the opening of the receiving groove 353 is located on the bottom surface 352 of the second bracket 35.
  • the receiving groove 353 is recessed from the bottom surface 352 of the second bracket 35 toward the top surface 351 .
  • the opening of the light-transmitting hole 354 is located on the top surface 353 of the second bracket 35 .
  • the opening of the light-transmitting hole 354 is located in the middle area of the top surface 353 .
  • the light-transmitting hole 354 is recessed from the top surface 351 of the second bracket 35 toward the bottom surface 352 , and penetrates through the bottom wall of the receiving groove 353 .
  • the light-transmitting hole 354 is a closed hole (that is, the light-transmitting hole 354 has a complete hole wall along the circumferential direction). At this time, the hole wall of the light-transmitting hole 354 may be relatively vertical or relatively inclined to the top surface 351 of the second bracket 35 .
  • FIG. 12 is a schematic diagram of the assembly structure of the first bracket 33 , the filter 34 and the second bracket 35 in the camera module 30 shown in FIG. 3
  • FIG. 13 is the structure shown in FIG. 12 along the III- Schematic diagram of the cross-sectional structure cut at III.
  • the first bracket 33 and the second bracket 35 are fixedly connected to each other. Specifically, the first bracket 33 is installed in the receiving groove 353 of the second bracket 35 . Wherein, the first bracket 33 is installed on the bottom wall (not shown) of the receiving slot 353 of the second bracket 35 . In this embodiment, the outer edge of the first bracket 33 is located at the bottom side of the inner edge of the second bracket 35 , that is, the inner edge of the second bracket 35 is located at the top side of the outer edge of the first bracket 33 . At this time, along the Z-axis direction, the first bracket 33 and the second bracket 35 partially overlap, and the first bracket 33 and the second bracket 35 can reuse the length space of the camera module 30 , which is beneficial to reduce the length of the camera module 30 .
  • the terms “inner edge” and “outer edge” involved in the description here are described based on the position of the optical filter 34 , and the position close to the optical filter 34 is referred to as the “inner edge”. ”, taking the position away from the filter 34 as the “outer edge”, it does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the application .
  • first bracket 33 and the second bracket 35 have a first overlapping portion (not shown) and a second overlapping portion (not shown) that overlap along the Z-axis direction, and the first overlapping portion and the second overlapping portion are along the Y axis.
  • the shafts are arranged on both sides of the filter 34 at a distance from each other.
  • the length of the first overlapping portion is W1
  • the length of the second overlapping portion is W2.
  • W1+W2 is equal to or greater than 200 ⁇ m to ensure the assembly stability between the first bracket 33 and the second bracket 35 .
  • the camera module 30 may include an adhesive layer 70 connected between the outer edge of the first bracket 33 and the inner edge of the second bracket 35 . That is, the first bracket 33 is mounted on the bottom wall of the receiving groove 353 of the second bracket 35 through the adhesive layer 70 .
  • the thickness D of the adhesive layer 70 is between 30 ⁇ m and 80 ⁇ m.
  • the adhesive layer 70 is a discontinuous (ie, discontinuous) annular glue portion.
  • the adhesive layer 70 includes a plurality of sub-adhesion layers 71 , and the plurality of sub-adhesion layers 71 are spaced apart from each other and arranged around the periphery of the filter 34 .
  • the first bracket 33 , the second bracket 35 and the plurality of sub-adhesive layers 71 may enclose a plurality of air escape holes (not shown).
  • the filter 34 corresponds to the light transmission hole 354 of the second bracket 35 .
  • some of the optical filters 34 are located in the receiving grooves 353 of the second bracket 35
  • some of the optical filters 34 are located in the light-transmitting holes 354 of the second bracket 35 .
  • the optical filter 34 and the second bracket 35 can reuse the height space of the camera module 30 , which is beneficial to reduce the height of the camera module 30 .
  • the peripheral surface (not marked) of the filter 34 is spaced apart from the hole wall of the light-transmitting hole 354 .
  • the first bracket 33 , the filter 34 and the second bracket 35 are enclosed to form a gap 301 , and the slot width L of the gap 301 is equal to or greater than 100 ⁇ m.
  • the deviation distance between the geometric center of the optical filter 34 and the geometric center of the second bracket 35 is less than or equal to 40 ⁇ m, so as to ensure the assembly accuracy between the two and the shooting quality of the camera module 30 .
  • the filter 34 corresponding to the light-transmitting hole 354 of the second bracket 35 means that part or all of the orthographic projection of the filter 34 on the second bracket 35 is located in the light-transmitting hole 354 to ensure that the filter
  • the light sheet 34 can receive the light entering the second bracket 35 from the light transmission hole 354 .
  • the filter 34 may also be located only in the receiving groove 353 of the second bracket 35 , or the filter 34 may only be located in the light transmission hole 354 of the second bracket 35 , or at least partially filter light
  • the sheet 34 may protrude from the top surface 351 of the second bracket 35 .
  • FIG. 14 is a schematic cross-sectional structure diagram of the camera module 30 shown in FIG. 2 cut along the IV-IV position
  • FIG. 15 is a cross-sectional structure of the camera module 30 shown in FIG. 2 cut along the V-V position Schematic.
  • the first bracket 33 is mounted on the top side of the circuit board 31 and covers the top of the image sensor 32 . Specifically, the first bracket 33 is mounted on the top surface 311 of the circuit board 31 . Wherein, the first bracket 33 is fixed to the middle area of the top surface 311 . Exemplarily, the first bracket 33 may be fixed to the top surface 311 of the circuit board 31 by means of bonding.
  • the camera module 30 may include an adhesive layer 80 , and the adhesive layer 80 is adhered between the bottom surface 332 of the first bracket 33 and the top surface 311 of the circuit board 31 .
  • first brackets 33 are mounted on the top side of the circuit board 31 means that at least most of the first brackets 33 are located on the top side of the circuit board 31 .
  • the first bracket 33 is fixed with the top surface 311 of the circuit board 31 .
  • the first bracket 33 can also be embedded in the circuit board 31 .
  • the light-transmitting hole 334 corresponds to the image sensor 32 .
  • the light-transmitting hole 334 corresponding to the image sensor 32 means that part or all of the projection of the light-transmitting hole 334 on the circuit board 31 overlaps with the image sensor 32 to ensure that the image sensor 32 can receive the light from the light-transmitting hole 334 Light entering the inside of the first bracket 33 .
  • the first portion 3342 of the hole wall (not shown) of the light-passing hole 334 is a chamfered surface, it can effectively prevent the first bracket 33 from colliding with the image sensor 32 during the installation process, thereby improving the production yield of the camera module 30 .
  • the wires 38 are accommodated in the notches 335 of the first bracket 33 . Specifically, the portion of the wire 38 facing the circuit board 31 is accommodated in the notch 335 . The highest point of the wire 38 is accommodated in the notch 335 . At this time, the wires 38 and the first bracket 33 can reuse the height space of the camera module 30 , which is beneficial to reduce the height of the camera module 30 . Since the height dimension h of the notch 335 is equal to or greater than 0.18 mm, the problem that the first bracket 33 encounters the wire 38 during the installation process can prevent the wire 38 from collapsing. It should be noted that the highest point of the wire 38 is the position where the wire 38 is farthest from the top surface 311 of the circuit board 31 .
  • the second bracket 35 is mounted on the top side of the circuit board 31 and is disposed around the first bracket 33 . Specifically, the second bracket 35 is mounted on the top surface 311 of the circuit board 31 and is covered on the top of the first bracket 33 . The second bracket 35 is fixed to the edge region of the top surface 311 . Exemplarily, the second bracket 35 may be fixed to the top surface 311 of the circuit board 31 by means of adhesive bonding.
  • the camera module 30 may include an adhesive layer 90 , and the adhesive layer 90 is adhered between the bottom surface 351 of the second bracket 35 and the top surface 311 of the circuit board 31 .
  • the fact that the second brackets 35 are installed on the top side of the circuit board 31 means that at least most of the second brackets 35 are located on the top side of the circuit board 31 .
  • the second bracket 35 is fixed with the top surface 311 of the circuit board 31 .
  • the second bracket 35 can also be fixed with the peripheral surface (not shown) of the circuit board 31 , or the second bracket 35 can be fixed with the top surface 311 and the peripheral surface of the circuit board 31 .
  • the filter 34 corresponds to the image sensor 32 .
  • the external light can enter the filter 34 from the light-transmitting hole 354 of the second bracket 35 , and after being filtered by the filter 34 , pass through the light-transmitting hole 354 of the first bracket 33 and be received by the image sensor 32 , and the image sensor 32 is sensitive to the light. Imaging for transformation.
  • the camera module 30 further includes a dust-catching glue part 39 , and the dust-catching glue part 39 is filled in the gap 301 .
  • the dust-catching glue portion 39 completely fills the gap 301 . That is, the dust-catching glue portion 39 has a continuous annular shape, and completely covers the peripheral surface of the optical filter 34 .
  • the dust collecting glue part 39 is bonded between the filter 34 and the second bracket 35 .
  • the dust-catching glue part 39 is bonded between the peripheral surface of the optical filter 34 and the hole wall of the light-transmitting hole 354 of the second bracket 35 to completely seal the gap 301 and prevent impurities such as external dust or moisture from passing through the gap.
  • the dust-catching glue portion 39 can also be adhered to the top surface 331 of the first bracket 33 .
  • the dust-catching glue part 39 can also be partially filled in the gap 301 . That is, the dust-catching glue portion 39 has an intermittent annular shape, and partially covers the peripheral surface of the optical filter 34 . At this time, the portion of the unfilled gap 301 may communicate with the escape hole.
  • the air on the top side and the bottom side can be exchanged through the gap 301 and the air escape hole, The filter 34 is prevented from being broken due to air pressure difference, and the production yield or use reliability of the camera module 30 is improved.
  • the filter 34 is first fixed on the top surface of the first bracket 33 by the adhesive layer 60 , and then the first bracket 33 and the second bracket 33 are fixed by the adhesive layer 70 .
  • the brackets 35 are fixed to each other, and then the first bracket 33 and the second bracket 35 are respectively fixed to the top surface 311 of the circuit board 31 by the adhesive layer 80 and the adhesive layer 90, and finally the peripheral surface of the filter 34 and the second bracket 35 are respectively fixed.
  • Dust-catching glue is dotted between the walls of the light-transmitting holes 354 of the bracket 35 to form the dust-catching glue portion 39 .
  • the top side and the bottom side of the optical filter 34 are always between the top side and the bottom side.
  • the gas flow can be realized, that is, the gas between the top side and the bottom side of the optical filter 34 can be exchanged, that is, there is no air pressure difference between the top side and the bottom side of the optical filter 34, and the optical filter 34 will not be affected by the top side and the bottom side of the optical filter 34.
  • the dust-catching glue can seal the air escape hole, isolate the gas flow between the top side and the bottom side of the optical filter 34 , and realize the effective sealing of the image sensor 32 .
  • the design of the camera module 30 shown in this embodiment not only cancels the air escape hole in the existing bracket, but also cancels the process of sealing the air escape hole.
  • the camera module 30 shown in this embodiment can directly use the adhesive layer 70 to form an air escape hole between the first bracket 33 and the second support 35, and integrate the air escape hole sealing and dust-catching glue processes into one, which not only saves money
  • the cost of the camera module 30 also simplifies the process of the camera module 30 , which helps to improve the production efficiency of the camera module 30 .
  • the lens base 36 is mounted on the top side of the second bracket 35 . Specifically, the lens base 36 is fixed on the top surface 351 of the second bracket 35 . The lens base 36 is fixed to the edge area of the top surface 351 . Exemplarily, the lens base 36 may be fixed to the second bracket 35 by means of bonding.
  • the camera module 30 may include an adhesive layer 91 , and the adhesive layer 91 is adhered between the lens base 36 and the second bracket 35 .
  • the lens base 36 may be fixed to the second bracket 35 by welding.
  • the camera module 30 may include a solder layer, and the solder layer is fixedly connected between the lens base 36 and the second bracket 35 .
  • the first bracket 33 can also assist in supporting the lens base 36 installed on the second bracket 35 , which helps to improve the structural stability of the camera module 30 . to ensure the reliability of the use of the camera module 30.
  • the lens base 36 includes a top surface 361 facing away from the second bracket 35 and a bottom surface 362 disposed opposite to the top surface 361 .
  • the lens base 36 includes a mounting slot 363 , and the opening of the mounting slot 363 is located in the middle area of the top surface 361 .
  • the mounting groove 363 extends from the top surface 361 of the lens base 36 toward the bottom surface 362 , and penetrates through the bottom surface 362 of the lens base 36 . That is, the mounting groove 363 penetrates the lens base 36 from the height direction of the lens base 36 .
  • the installation groove 363 corresponds to the light-transmitting hole 354 of the second bracket 35 . That is, the mounting groove 363 corresponds to the optical filter 34 .
  • the light outside the camera module 30 can enter the filter 34 from the installation slot 363 and the light-transmitting hole 354 of the second bracket 35 , and is filtered by the filter 34 before being received by the image sensor 32 .
  • the lens 37 is attached to the inner side of the lens base 36 .
  • the lens 37 is installed in the installation groove 363 of the lens base 36 for condensing the light outside the camera module 30 . That is, the lens 37 can condense the external light, and project the condensed external light from the filter 34 to the image sensor 32 .
  • the lens 37 may be fixed to the lens base 36 by means of bonding.
  • the camera module 30 may include an adhesive layer 92 , and the adhesive layer 92 is adhered between the lens 37 and the lens base 36 .
  • the lens 37 may include a lens barrel and a lens group fixed inside the lens barrel. At this time, the number of lenses in the lens group may be multiple, such as 5, or 6, or 7, or 8, and so on.
  • the lens base 36 is a motor.
  • the motor can be an auto-focus motor, and the auto-focus motor can drive the lens group to move in a direction parallel to the optical axis of the lens 37 .
  • the motor may be an optical anti-shake motor, which can drive the lens group to move on a plane perpendicular to the optical axis of the lens 37 , or drive the lens group to flip to tilt relative to the optical axis of the lens 37 .
  • the motors may be autofocus and optical image stabilization motors.
  • the motor may be a voice coil motor (VCM), or a memory alloy motor or the like. This application does not strictly limit the specific function and type of the motor.
  • the lens base 36 can also be a bracket structure. At this time, the camera module 30 is a fixed-focus module.
  • the camera module 30 shown in this embodiment adopts a separate first bracket 33 and a second bracket 35 to support the filter 34 and the lens base 36 respectively.
  • an external force such as the lens base 36
  • the second bracket 35 cannot directly transmit these forces to the filter 34, which can effectively reduce the influence of the filter 34 by external forces, that is, the filter 34 does not Under the action of external force, it will be compressed or deformed by bending, which reduces the risk of failure of the optical filter 34 due to the action of external force.
  • the second bracket 35 and the filter 34 are connected by the dust-catching glue part 39. Since the elastic modulus of the dust-catching glue part 39 is very low, it can also play a buffering role similar to the "sponge body" and slow down the second bracket 35.
  • the force transmitted by the bracket 35 to the first bracket 33 further reduces the force transmitted to the optical filter 34 and reduces the risk of rupture and failure of the optical filter 34 under the action of external force.
  • FIG. 16 is a schematic cross-sectional structure diagram of the camera module 30 cut along IV-IV in the second electronic device provided by the embodiment of the present application
  • FIG. 17 is the second electronic device provided by the embodiment of the present application.
  • the camera module 30 includes a circuit board 31 , an image sensor 32 , a first bracket 33 , a filter 34 , a second bracket 35 , a lens base 36 and a lens 37 .
  • the image sensor 32 is mounted on the circuit board 31 .
  • the first bracket 33 is mounted on the top side of the circuit board 31 , and the first bracket 33 is provided with a light through hole 334 corresponding to the image sensor 32 .
  • the filter 34 is mounted on the first bracket 33 and covers the light-transmitting hole 334 .
  • the second bracket 35 is mounted on the top side of the circuit board 31 and disposed around the first bracket 33 .
  • the inner edge of the second bracket 35 is located on the top side of the outer edge of the first bracket 33 .
  • the lens base 35 is mounted on the top side of the second bracket 35 , and the lens 37 is mounted on the inner side of the lens base 35 .
  • the electronic device shown in this embodiment has substantially the same structure as the above-mentioned first electronic device 100 , and the difference from the above-mentioned first electronic device 100 is that the camera module 30 does not include the dust-catching glue part 39 (as shown in FIG. 14 ) Show). At this time, the gap 301 of the camera module 30 communicates with the air escape hole (not shown).
  • the air escape hole not shown.
  • the optical filter 34 is broken due to the difference in air pressure, which improves the production yield or use reliability of the camera module 30 .
  • FIG. 18 is a schematic cross-sectional structure diagram of the camera module 30 cut along IV-IV in the third electronic device provided by the embodiment of the present application
  • FIG. 19 is the third type of electronic device provided by the embodiment of the present application.
  • the camera module 30 includes a circuit board 31 , an image sensor 32 , a first bracket 33 , a filter 34 , a second bracket 35 , a lens base 36 and a lens 37 .
  • the image sensor 32 is mounted on the circuit board 31 .
  • the first bracket 33 is mounted on the top side of the circuit board 31 , and the first bracket 33 is provided with a light through hole 334 corresponding to the image sensor 32 .
  • the filter 34 is mounted on the first bracket 33 and covers the light-transmitting hole 334 .
  • the second bracket 35 is mounted on the top side of the circuit board 31 and disposed around the first bracket 33 .
  • the inner edge of the second bracket 35 is located on the top side of the outer edge of the first bracket 33 .
  • the lens base 35 is mounted on the top side of the second bracket 35 , and the lens 37 is mounted on the inner side of the lens base 35 .
  • the electronic device shown in this embodiment has substantially the same structure as the above-mentioned second electronic device 100 , and the difference from the above-mentioned second electronic device 100 is that the top surface 351 of the second bracket 35 and the top surface of the filter 34 341 is flush.
  • the camera module 30 further includes a waterproof and breathable membrane 310 .
  • the waterproof and breathable membrane 310 is installed on the top surface 351 of the second bracket 35 and the top surface 341 of the filter 34 and covers the opening of the gap 301 .
  • the waterproof and breathable membrane 310 can not only prevent moisture from entering the second bracket 35 through the gap 301 and the air escape hole (not shown), and prevent the image sensor 32 from being polluted by moisture, but also can prevent the image sensor 32 from being polluted by moisture.
  • the air on the top side and the bottom side can be exchanged through the waterproof and breathable membrane 310, the gap 301 and the air escape hole, so as to avoid the occurrence of the light filter 34 due to the difference in air pressure. Fragmentation, improve the production yield or use reliability of the camera module 30 .
  • FIG. 20 is a schematic diagram of the assembly structure of the circuit board 31 and the image sensor 32 of the camera module in the fourth electronic device provided by the embodiment of the present application.
  • the camera module 30 further includes an insulating glue part 320 , and the insulating glue part 320 is in contact with the top surface 311 of the circuit board 31 .
  • the insulating glue part 320 is arranged on opposite sides of the image sensor 32 at intervals along the X-axis direction.
  • the insulating adhesive portion 320 may be formed by firstly being cured by a dispensing process, and then being cured by means of natural curing, ultraviolet curing, or thermal curing.
  • the insulating glue part 320 covers the gold finger 314 , the wire 38 and the pad 324 to assist in fixing the wire 38 , improve the arc stability of the wire 38 , and avoid the wire 38 in the assembly process of the camera module 30 (such as operation, inspection or rework, etc.) During the process), the cycloid occurs due to human touch, or the cycloid is deformed due to overstress under external force during use, resulting in the problem that the multiple wires 38 contact each other and cause a short circuit.
  • the insulating glue portion 320 covers a part of the non-photosensitive area 323 of the image sensor 32 .
  • the insulating glue portion 320 is located outside the photosensitive region 322 of the image sensor 32 , that is, the insulating glue portion 320 does not cover the photosensitive region 322 of the image sensor 32 to prevent the insulating glue portion 320 from affecting the photosensitive region 322 to receive light for imaging.
  • the insulating glue part 320 may cover part of the gold fingers 314 , and/or the insulating glue part 320 may cover part of the wires 38 , and/or the insulating glue part 320 may cover part of the pads 324 .
  • FIG. 21 is a schematic structural diagram of the first bracket 33 of the camera module in the fourth electronic device provided by the embodiment of the present application.
  • the first bracket 33 includes two mounting bodies 33b, and the two mounting bodies 33b are spaced apart from each other along the Y-axis direction.
  • the top surfaces of the two mounting bodies 33 b form the top surface 331 of the first bracket 33
  • the bottom surfaces of the two mounting bodies 33 b form the bottom surface 332 of the first bracket 33 .
  • the interval between the two mounting bodies 33 b forms a light-passing hole 334 and two notches 335 located on both sides of the light-passing hole 334 .
  • the opposite surfaces of the two mounting bodies 33b form the hole walls 3341 of the light-passing holes 334 .
  • the included angle ⁇ between the hole wall 3341 of the light-passing hole 334 and the bottom surface 331 of the first bracket 33 is between 90° and 180°. That is, the hole wall 3341 of the light-passing hole 334 is a chamfered surface.
  • FIG. 22 is a schematic cross-sectional structure diagram of a camera module cut along IV-IV in the fourth electronic device provided by the embodiment of the present application
  • FIG. 23 is the fourth electronic device provided by the embodiment of the present application. Schematic diagram of the cross-sectional structure of the camera module in the electronic device cut along the V-V.
  • the first bracket 33 is mounted on the top side of the circuit board 31 and covers the top of the image sensor 32 .
  • the light-transmitting hole 334 of the first bracket 33 corresponds to the image sensor 32 .
  • part of the wire 38 and part of the insulating glue part 320 are accommodated in the notch 335 of the first bracket 33 (as shown in FIG. 21 ).
  • the portion of the wire 38 and the insulating glue portion 320 facing the circuit board 31 is accommodated in the notch 335 .
  • the wire 38 , the insulating glue part 320 and the first bracket 33 can reuse the height space of the camera module 30 , which is beneficial to reduce the height of the camera module 30 .
  • the second bracket 35 is mounted on the top side of the circuit board 31 and is disposed around the first bracket 33 . Specifically, the second bracket 35 is mounted on the top surface 311 of the circuit board 31 and is covered on the top of the first bracket 33 .
  • the first bracket 33 , the filter 34 and the second bracket 35 are enclosed to form a gap 301 , and the gap 301 communicates with the gap 335 .
  • the dust catching glue part 39 is filled in the gap 301 , and the dust catching glue part 39 is adhered between the filter 34 and the second bracket 35 .
  • the dust-catching glue part 39 is also adhered to the top surface 331 of the first bracket 33 and the dust-catching glue part 39 .
  • the first bracket 33 of the camera module 30 in the electronic device shown in the embodiment of the present application omits the support table 33a (as shown in FIG. 7 ), The height dimension of the first bracket 33 is smaller, which is beneficial to reduce the height of the camera module 30 and realize the miniaturized design of the camera module 30 .
  • FIG. 24 is a schematic diagram of the assembly structure of the circuit board 31 and the image sensor 32 of the camera module in the fifth electronic device provided by the embodiment of the present application.
  • the substrate 31b of the circuit board 31 is made of metal material.
  • the image sensor 32 is located in the first mounting groove 313 of the circuit board 31, and is fixed to the substrate 31b of the circuit board 31. Specifically, the image sensor 32 is fixed to the substrate 31b through the first thermal conductive adhesive layer 50, so that the heat generated during operation can be transferred to the substrate 31b. Since the substrate 31b is made of a metal material with good thermal conductivity, the lining The bottom 31b can achieve effective heat dissipation of the image sensor 32 .
  • the circuit board 31 is further provided with a second mounting groove 315 located around the first mounting groove 313 , and the opening of the second mounting groove 315 is located on the top surface 311 of the circuit board 31 .
  • the opening of the second installation groove 315 is located in the middle area of the top surface 311 and is disposed around the first installation groove 313 .
  • the second mounting groove 315 is recessed from the top surface 311 of the circuit board 31 toward the bottom surface 312 , and exposes the substrate 31 b of the circuit board 31 .
  • the second installation groove 315 includes two sub-installation grooves 315 a, which are spaced apart from each other along the Y-axis direction on both sides of the first installation groove 313 and communicate with the first installation groove 313 .
  • FIG. 25 is a schematic structural diagram of the first bracket 33 of the camera module in the fifth electronic device provided by the embodiment of the present application
  • FIG. 26 is the first bracket 33 shown in FIG. 25 at another angle. Below is the schematic diagram of the structure.
  • the first bracket 33 is provided with a fixing portion 336 and a supporting leg 337 .
  • the fixing portion 336 is fixed on the top surface 331 of the first bracket 33 to increase the overall strength of the first bracket 33 .
  • the fixing portion 336 is located at the edge region of the top surface 331 and at the periphery of the light-transmitting hole 334 .
  • the fixing portion 336 extends from the top surface 331 of the first bracket 33 in a direction away from the bottom surface 332 .
  • the fixing portion 336 includes two sub-fixing portions 366a spaced apart from each other.
  • the two sub-fixing portions 336a are arranged on opposite sides of the light-passing hole 334 along the X-axis direction and correspond to the two notches 335 respectively.
  • the support legs 337 are fixed on the bottom surface 332 of the first bracket 33 . Specifically, the support legs 337 are located at the edge of the bottom surface 332 and at the periphery of the light-passing hole 334 .
  • the support legs 337 extend from the bottom surface 332 of the first bracket 33 in a direction away from the top surface 331 .
  • the supporting leg 337 includes two sub-supporting legs 337a spaced apart from each other, and the two sub-supporting legs 337a are arranged on opposite sides of the light-passing hole 334 along the Y-axis direction. At this time, the two sub-legs 337a are respectively fixed to the two mounting bodies 33b of the first bracket 33 .
  • FIG. 27 is a schematic structural diagram of the second bracket 35 of the camera module in the fifth electronic device provided by the embodiment of the present application.
  • the second bracket 35 is further provided with a fixing slot 355 , and the opening of the fixing slot 355 is located on the bottom surface 352 of the second bracket 35 .
  • the opening of the fixing groove 355 is located at the bottom wall of the receiving groove 354 .
  • the fixing groove 355 is located at the periphery of the light-transmitting hole 354 .
  • the fixing groove 355 is recessed from the bottom wall of the receiving groove 354 toward the top surface 351 of the second bracket 35 , penetrates the hole wall of the light-transmitting hole 354 , and communicates with the light-transmitting hole 354 .
  • the fixing groove 355 includes two sub-fixing grooves 355a spaced apart from each other, and the two sub-fixing grooves 355a are arranged on opposite sides of the light-transmitting hole 354 along the X-axis direction.
  • FIG. 28 is a schematic cross-sectional structure diagram of a camera module cut along IV-IV in the fifth electronic device provided by the embodiment of the present application
  • FIG. 29 is the fifth type of electronic device provided by the embodiment of the present application. Schematic diagram of the cross-sectional structure of the camera module in the electronic device cut along the V-V.
  • the first bracket 33 is made of metal material.
  • the first bracket 33 is mounted on the top side of the circuit board 31 and covers the top of the image sensor 32 .
  • the first bracket 33 is installed in the second installation groove 315 .
  • a part of the first bracket 33 is located in the second installation groove 315 , and the legs 337 of the first bracket 33 are fixed to the substrate 31 b of the circuit board 31 .
  • the two sub-legs 337a (as shown in FIG. 26 ) of the bracket 337 are respectively mounted on the two sub-mounting grooves 315a (as shown in FIG. 27 ) of the second mounting groove 315 , and both are fixed to the substrate 31b.
  • the camera module 30 further includes a second thermally conductive adhesive layer 51, and the second thermally conductive adhesive layer 51 is connected between the first bracket 33 and the substrate 31b. That is, the first bracket 33 can be fixed to the substrate 31 through the second thermally conductive adhesive layer 51 , so as to receive heat from the substrate 31 b through the second thermally conductive adhesive layer 51 , so as to achieve rapid heat dissipation to the substrate 31 b .
  • the second thermally conductive adhesive layer 51 includes two sub-thermally conductive adhesive layers (not shown), and each sub-thermally conductive adhesive layer is connected between one of the sub-legs 337a and the substrate 31b.
  • the heat of the image sensor 32 during operation can be transferred to the substrate 31b through the first thermally conductive adhesive layer 50, and part of the heat can be transferred to the external environment through the bottom surface and the peripheral surface of the substrate 31b, Part of the heat can be transferred to the first bracket 33 through the second thermal conductive adhesive layer 51, and transferred to the external environment through the first bracket 33, which is equivalent to increasing the heat dissipation channel of the image sensor 32, improving the heat dissipation efficiency of the image sensor 32, and avoiding the image sensor 32.
  • the problem that the sensor 32 fails due to high temperature improves the reliability of the camera module 30 .
  • the filter 34 is mounted on the first bracket 33 and covers the light-transmitting hole 334 . Specifically, the filter 34 is mounted on the top surface 331 of the first bracket 33 and is located between the two sub-fixing portions 336 a of the fixing portion 336 (as shown in FIG. 25 ). The filter 34 and the two sub-fixing parts 336a of the fixing part 336 are spaced apart from each other.
  • the second bracket 35 and the first bracket 33 are fixed to each other.
  • the fixing portion 336 of the first bracket 33 is installed in the fixing groove 355 of the second bracket 35 .
  • the two sub-fixing portions 336 a of the fixing portion 336 are respectively installed in the two sub-installing grooves of the fixing groove 355 .
  • each sub-fixing portion 336a is spaced apart from the side wall of the sub-mounting slot, and the gap between the two is equal to or greater than 0.1 mm.
  • the first bracket 33 , the filter 34 and the second bracket 35 are enclosed to form a gap 301 , and the dust-catching glue portion 39 is filled in the gap 301 .
  • the flow path of the dust-catching glue is more tortuous in the process of spotting the dust-catching glue, so it is not easy to pass through the air escape hole between the first bracket 33 and the second bracket 35 (Fig. (not shown) into the inside of the second bracket 35 to avoid the problem that the dust-catching glue affects the normal operation of the image sensor 32 .
  • FIG. 30 is a schematic diagram of the assembly structure of the circuit board 31 and the image sensor 32 of the camera module in the sixth electronic device provided by the embodiment of the present application.
  • the circuit board 31 is further provided with an escape space 316 located around the first mounting groove 313 , and the opening of the escape space 316 is located on the top surface 311 of the circuit board 31 .
  • the opening of the avoidance space 316 is located at the edge region of the top surface 311 and is disposed around the first installation groove 313 and the second installation groove 315 .
  • the avoidance space 316 is recessed from the top surface 311 of the circuit board 31 toward the bottom surface 312 , and exposes the substrate 31 b of the circuit board 31 .
  • the avoidance space 316 includes two sub-avoidance spaces 316a spaced apart from each other, and the two sub-avoidance spaces 316a both penetrate through the peripheral surface of the circuit board 31 (not marked in the figure). It should be understood that the avoidance space 316 is not limited to the notch provided on the edge of the circuit board 31 as shown in FIG.
  • FIG. 31 is a schematic structural diagram of the second bracket 35 of the camera module in the sixth electronic device provided by the embodiment of the present application.
  • the second bracket 35 is provided with a supporting leg 356 , and the supporting leg 356 is fixed on the bottom surface 352 of the second supporting frame 35 .
  • the support feet 356 are located at the edge of the bottom surface 352 and at the periphery of the receiving groove 355 .
  • the support legs 356 extend from the bottom surface 352 of the second bracket 35 in a direction away from the top surface 351 .
  • the support leg 356 includes two sub-legs 356a spaced apart from each other.
  • FIG. 32 is a schematic cross-sectional structure diagram of a camera module cut along IV-IV in the fifth electronic device provided by the embodiment of the present application
  • FIG. 33 is the fifth type of electronic device provided by the embodiment of the present application. Schematic diagram of the cross-sectional structure of the camera module in the electronic device cut along the V-V.
  • the second bracket 35 is made of metal material.
  • the second bracket 35 is mounted on the top side of the circuit board 31 .
  • the second bracket 35 is installed in the avoidance space 316 .
  • a part of the second bracket 35 is located in the avoidance space 316 , and the legs 356 of the second bracket 35 are fixedly connected to the substrate 31 b of the circuit board 31 .
  • the two sub-legs 356a (as shown in FIG. 31 ) of the supporting leg 356 are respectively installed in the two sub-avoidance spaces 316a (as shown in FIG. 30 ) of the avoidance space 316 , and both are fixed to the substrate 31b.
  • the camera module 30 further includes a third thermally conductive adhesive layer 52, and the third thermally conductive adhesive layer 52 is connected to the second bracket 33 and the substrate 31b. That is, the second bracket 33 can be fixed to the substrate 31b through the third thermally conductive adhesive layer 52, so as to receive heat from the substrate 31b through the third thermally conductive adhesive layer 52, so as to achieve rapid heat dissipation to the substrate 31b.
  • the third thermally conductive adhesive layer 52 includes two sub-thermally-conductive adhesive layers (not shown), and each sub-thermally conductive adhesive layer is connected between a sub-leg 356a and the substrate 31b.
  • the heat of the image sensor 32 during operation can be transferred to the substrate 31b through the first thermally conductive adhesive layer 50, and part of the heat can be transferred to the external environment through the bottom surface and the peripheral surface of the substrate 31b, Part of the heat can be transferred to the first bracket 33 through the second thermally conductive adhesive layer 51 , and transferred to the external environment through the first bracket 33 , part of the heat can be transferred to the second bracket 35 through the third thermally conductive adhesive layer 52 , and passed through the second bracket 35 .
  • the peripheral surface is transmitted to the external environment.
  • the substrate 31 b , the first support 31 and the second support 35 serve as heat dissipation channels to dissipate heat to the image sensor 32 , which avoids the problem of high temperature failure of the image sensor 32 and improves the reliability of the camera module 30 .

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  • Engineering & Computer Science (AREA)
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  • Signal Processing (AREA)
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Abstract

Des modes de réalisation de la présente demande concernent un module de caméra et un dispositif électronique, destinés à être utilisés pour éviter le problème selon lequel un filtre du module de caméra est cassé en raison d'une force externe, pour améliorer la fiabilité du module de caméra. Le module de caméra comprend une carte de circuit imprimé, un capteur d'image, un premier support, un filtre, un second support, et une base de lentille ; le capteur d'image est monté sur la carte de circuit imprimé ; le premier support est monté sur le côté supérieur de la carte de circuit imprimé ; le premier support est pourvu d'un trou traversant de lumière correspondant au capteur d'image ; le filtre est monté sur le premier support et recouvre le trou traversant de lumière du premier support ; le second support est monté sur le côté supérieur de la carte de circuit imprimé et entoure le premier support ; le bord interne du second support est situé sur le côté supérieur du bord externe du premier support ; et la base de lentille est montée sur le côté supérieur du second support.
PCT/CN2021/138679 2020-12-23 2021-12-16 Module de caméra et dispositif électronique WO2022135256A1 (fr)

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CN203387593U (zh) * 2013-08-08 2014-01-08 南昌欧菲光电技术有限公司 摄像模组及包含该摄像模组的移动设备
CN105573020A (zh) * 2016-02-22 2016-05-11 宁波舜宇光电信息有限公司 具有捕尘结构的摄像模组
CN108270948A (zh) * 2016-12-30 2018-07-10 宁波舜宇光电信息有限公司 摄像模组及其模制电路板组件和制造方法以及带有摄像模组的电子设备
CN210016539U (zh) * 2019-07-30 2020-02-04 宁波舜宇光电信息有限公司 摄像模组、复合基板和感光组件
CN210157258U (zh) * 2019-08-01 2020-03-17 宁波舜宇光电信息有限公司 感光组件和摄像模组

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CN211481357U (zh) * 2020-03-13 2020-09-11 华为技术有限公司 相机模组及电子设备
CN212211129U (zh) * 2020-04-30 2020-12-22 华为技术有限公司 摄像头模组及电子设备

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Publication number Priority date Publication date Assignee Title
US20110096219A1 (en) * 2009-10-28 2011-04-28 Celsia Technologies Taiwan, Inc. Image sensor package and method for manufacturing the same
CN203387593U (zh) * 2013-08-08 2014-01-08 南昌欧菲光电技术有限公司 摄像模组及包含该摄像模组的移动设备
CN105573020A (zh) * 2016-02-22 2016-05-11 宁波舜宇光电信息有限公司 具有捕尘结构的摄像模组
CN108270948A (zh) * 2016-12-30 2018-07-10 宁波舜宇光电信息有限公司 摄像模组及其模制电路板组件和制造方法以及带有摄像模组的电子设备
CN210016539U (zh) * 2019-07-30 2020-02-04 宁波舜宇光电信息有限公司 摄像模组、复合基板和感光组件
CN210157258U (zh) * 2019-08-01 2020-03-17 宁波舜宇光电信息有限公司 感光组件和摄像模组

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