WO2022130660A1 - 冷却装置 - Google Patents
冷却装置 Download PDFInfo
- Publication number
- WO2022130660A1 WO2022130660A1 PCT/JP2021/022339 JP2021022339W WO2022130660A1 WO 2022130660 A1 WO2022130660 A1 WO 2022130660A1 JP 2021022339 W JP2021022339 W JP 2021022339W WO 2022130660 A1 WO2022130660 A1 WO 2022130660A1
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- WO
- WIPO (PCT)
- Prior art keywords
- cooling device
- flow path
- surface portion
- protrusion
- cooling
- Prior art date
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- 238000001816 cooling Methods 0.000 title claims abstract description 147
- 239000012809 cooling fluid Substances 0.000 claims abstract description 74
- 238000010438 heat treatment Methods 0.000 claims description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 230000005855 radiation Effects 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 4
- 239000012530 fluid Substances 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 description 46
- 230000000052 comparative effect Effects 0.000 description 18
- 230000007423 decrease Effects 0.000 description 7
- 230000007704 transition Effects 0.000 description 5
- 239000002826 coolant Substances 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 239000000110 cooling liquid Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
Definitions
- the present invention relates to a cooling device for cooling a heating element such as a semiconductor element.
- a cooling device for cooling a semiconductor element such as an insulated gate bipolar transistor (IGBT) is disclosed in, for example, Patent Document 1.
- a plurality of vertical fins are provided on the horizontal plate member, and a flow path between fins extending in the horizontal direction (direction in which the cooling liquid flows) is formed between the fins.
- a substantially rectangular parallelepiped flow path is formed as an aggregate of a plurality of inter-fin flow paths, and a cooling liquid is passed through the flow path to cool the semiconductor element which is a heating element.
- the surface area of the rectangular parallelepiped flow path (the size of the surface that comes into contact with the heating element) and the size of the fins greatly affect the cooling capacity of the cooling device.
- Patent Document 1 since the flow path extends in the horizontal direction and the height of the fins which are the side walls of the flow path does not change from the inlet to the outlet of the flow path, the coolant is horizontally applied to the flow path. It can be easily flowed in and out. However, when the coolant flows in and out of the flow path in the vertical direction, the fins at the inlet and outlet of the flow path are removed, and the coolant flowing in the vertical direction is gradually changed in the horizontal direction. It is necessary to secure a space (transition section) for flowing. However, if such a space is provided, a part of the flow path (inlet / exit) is deleted, so that the surface area of the flow path becomes small and the cooling capacity of the cooling device decreases.
- An object of the present invention is to provide a structure capable of smoothly inflowing and outflowing a cooling fluid from a direction perpendicular to the bottom surface of a flow path and suppressing a decrease in the cooling capacity of the cooling device.
- the cooling device is a cooling device for cooling one or more heating elements provided along the direction in which the cooling fluid flows by the cooling fluid, and the cooling device is formed on the one or more heating elements. It has a first surface portion that is thermally connected and a second surface portion that faces the first surface portion, and a flow path through which the cooling fluid flows is formed between the first surface portion and the second surface portion.
- the cooling device has a side wall that connects the first surface portion and the second surface portion and extends along the direction in which the cooling fluid flows, and the height of the side wall is the height of the side wall at the outlet of the flow path.
- At least a part of the second surface portion is missing in the portion of the side wall whose height is reduced from the second surface portion side toward the first surface portion side, and the side wall is formed on the first surface portion.
- the contacting portion overlaps at least the entire heating element closest to the outlet of the flow path.
- the structure in which at least a part of the second surface portion is missing is a structure in which the upper part of the flow path is cut off. Since the upper part of the flow path is cut out, when the cooling fluid exits the flow path, it tends to flow out vertically from the bottom surface of the flow path. Further, since the lower part of the flow path is not cut out, the bottom surface portion of the flow path can cover the entire downstream heating element in a plan view at the flow path outlet. By covering the entire downstream heating element at the outlet of the flow path, the cooling capacity for the most downstream heating element is not reduced.
- the height of the side wall may be reduced from the second surface side to the first surface side at the entrance of the flow path.
- the cooling device may further have a first projection provided on the side wall to direct the flow of the cooling fluid to the first surface portion.
- the cooling device may further have a second projection provided on the side wall downstream of the first projection to direct the flow of the cooling fluid to the low flow rate region created by the first projection.
- the positions of forming the first protrusion and the second protrusion may correspond to the respective positions of the one or more heating elements.
- the first protrusion is inclined at a first predetermined angle with respect to the direction in which the cooling fluid flows in the flow path
- the second protrusion is at an angle different from the first predetermined angle and is the length of the flow path. It may be tilted with respect to the direction. Alternatively, the first protrusion and the second protrusion may be inclined by about 30 degrees with respect to the longitudinal direction of the flow path.
- the height of the side wall portion whose height has been reduced may be 1 ⁇ 2 or less of the height of the portion whose height has not been reduced. The height of the side wall portion whose height has been reduced does not have to be constant.
- the first protrusion and the second protrusion may come into contact with the side wall facing the side wall.
- the first protrusion and the second protrusion may be formed by punching.
- the one or more heating elements may be provided on the first surface portion via a plate-shaped member, and the plate-shaped member may be a copper plate.
- the plate-shaped member may be replaced with a vapor chamber having a copper housing.
- the one or more heating elements may be provided on the first surface portion via a heat pipe. At least one of the one or more heating elements may be an insulated gate bipolar transistor.
- the first surface portion, the side wall portion, and the second surface portion may be formed of one U-shaped metal plate. Further, the flow path may be formed by connecting a plurality of U-shaped metal plates in a direction parallel to the first surface portion and perpendicular to the direction in which the cooling fluid flows.
- the U-shaped metal plate may be a fin member. Further, the flow path may be formed by a plurality of the fin members.
- the metal plate may be a copper plate.
- the side wall may be a plurality of heat radiation fins provided vertically from the first surface portion to the second surface portion.
- the present invention it is possible to suppress a decrease in the cooling capacity of the cooling device while allowing the cooling fluid to smoothly flow in and out from the direction perpendicular to the plate-shaped member of the flow path.
- FIG. 1A It is a perspective view of a cooling device and a semiconductor element cooled by a cooling device. It is a perspective view of a cooling device. It is a figure which shows one fin among the plurality of fins constituting a flow path. It is a side view of the fin shown in FIG. 2B.
- A) is a bottom view showing a state in which three semiconductor elements are attached to a flow path (cooling device) via a board member
- (b) is a side view. It is sectional drawing which shows the flow of the cooling fluid in the vicinity of the outlet of a flow path.
- FIG. 3 is a schematic cross-sectional view of the cooling device of the second embodiment. It is an enlarged sectional view which shows the 4th comparative example.
- FIG. 1A is an external view of a cooling system 22 including a cooling device 20 according to the first embodiment of the present invention.
- 1B is a perspective view of the cooling system 22 of FIG. 1A.
- FIG. 1C is a perspective view of a cooling device 20, a board member 28 on which the cooling device 20 is placed, and three semiconductor elements 51, 52, 53 located under the board member 28 and cooled by the cooling device 20. Is. FIG. 1C does not show the cooling fluid introduction pipe 24, the first connection portion 25, the cover member 26, the second connection portion 31, and the outflow pipe 30, which will be described later.
- the semiconductor elements 51, 52, and 53 are assumed to be insulated gate bipolar transistors (IGBTs).
- the cooling system 22 includes an introduction pipe (inlet side pipe) 24 for introducing a cooling fluid (arrow A) into the cooling device 20, a cover member 26 for covering the cooling device 20, and a board member 28 on which the cover member 26 is placed. It has an outflow pipe (outlet side pipe) 30 through which a cooling fluid (arrow B) flowing out from the cooling device 20 flows.
- the cooling device 20 is located on the board member 28 and inside the cover member 26.
- the cooling fluid is, for example, water or oil.
- the board member 28 is, for example, a copper plate.
- a board member 28 (copper plate) is provided between the semiconductor elements 51 to 53 and the cooling device 20, but since copper has a high thermal conductivity, the cooling capacity of the cooling device 20 can be maintained.
- the longitudinal direction of the board member 28 shown in FIG. 1A is referred to as the X direction
- the height direction of the board member 28 is referred to as the Z direction
- the direction perpendicular to the X direction and the Z direction is referred to as the Y direction. ..
- the plane defined by the X direction and the Y direction is referred to as a horizontal plane in this embodiment.
- the Z direction may be referred to as a vertical direction.
- the + Z direction is referred to as upward, and the -Z direction is referred to as downward.
- a first connection portion 25 for connecting the introduction pipe 24 to one end of the cover member 26 (the left end in FIG. 1A) is provided.
- the downstream end of the first connection portion 25 is connected to the flow path inlet 34a of the cooling device 20.
- a second connecting portion 31 for connecting the outflow pipe 30 to the other end of the cover member 26 (the right end in FIG. 1A) is provided.
- the upstream end of the second connection portion 31 is connected to the flow path outlet 34b of the cooling device 20.
- the cooling fluid flowing in through the introduction pipe 24 as shown by the arrow A flows in a substantially horizontal direction up to the first connection portion 25.
- the cooling fluid that has reached the first connection portion 25 changes its traveling direction from the horizontal direction to the vertical direction by the first connection portion 25, and flows downward.
- the cooling fluid enters the cover member 26 from the first connection portion 25, the cooling fluid flows horizontally in the flow path 34 of the cooling device 20. That is, the cooling fluid flows in the X direction in parallel with the board member 28.
- the cooling fluid that has reached the flow path outlet 34b of the cooling device 20 changes its traveling direction from the horizontal direction to the vertical direction by the second connecting portion 31, and flows upward. Then, the cooling fluid flows from the second connection portion 31 to the outflow pipe 30, and is discharged from the cooling system 22 as shown by the arrow B.
- the board member 28 is a rectangular plate-shaped member.
- the longitudinal direction of the board member 28 coincides with the X direction. Since the three semiconductor elements 51, 52, and 53 are provided on the lower surface of the board member 28, they are drawn by broken lines in FIG. 1C.
- the cooling device 20 has a substantially rectangular parallelepiped shape, and a flow path 34 for flowing a cooling fluid in the X direction is formed inside the cooling device 20. In the present embodiment, the height of the outlet 34b side (right side in the figure) of the flow path 34 is small.
- FIG. 2A is a perspective view of the cooling device 20, and FIG. 2B is a diagram showing one of a plurality of fins 36 constituting the flow path 34.
- 2A and 2B are perspective views seen from the ⁇ Y direction.
- FIG. 2C is a side view of the fin 36 as viewed from the Y direction, and shows the back side of the fin 36 in FIG. 2B.
- the fin 36 has a U-shaped cross section when viewed in the X direction.
- the portion corresponding to the upper side of the U-shape is referred to as the upper surface portion 36a of the fin 36
- the portion corresponding to the bottom side is referred to as the lower surface portion 36c of the fin 36
- the portion corresponding to the vertical side connecting the upper surface portion and the lower surface portion is referred to as the fin 36. It is referred to as a side surface portion 36b of the above.
- the fin 36 is made of a U-shaped metal plate.
- the metal plate (fin 36) is, for example, a copper plate. Since copper has a high thermal conductivity, it is suitable as a material for forming the cooling device 20.
- the lower surface portion 36c of the fin 36 may be referred to as a first surface portion
- the upper surface portion 36a may be referred to as a second surface portion
- the side surface portion 36b may be referred to as a side wall portion.
- the second surface portion (upper surface portion 36a) is a surface portion facing the first surface portion (lower surface portion 36c). Then, a flow path 34 through which the cooling fluid flows is formed between the first surface portion (lower surface portion 36c) and the second surface portion (upper surface portion 36a).
- the side wall 36b is a side wall that connects the first surface portion and the second surface portion and extends along the direction in which the cooling fluid flows.
- a plurality of protrusions 38a and 38b are provided on the side surface portion 36b of the fin 36.
- a pair of protrusions 38 is formed by the two protrusions 38a and 38b, and a plurality of pairs of protrusions 38 are provided on the side surface portion 36b of the fin 36.
- the plurality of pairs of protrusions 38 are arranged in the X direction at predetermined intervals.
- the protrusion 38a may be referred to as a first protrusion
- the protrusion 38b may be referred to as a second protrusion.
- the first protrusion 38a and the second protrusion 38b project toward the front from the paper surface (project in the Y direction).
- the first protrusion 38a and the second protrusion 38b are formed by punching.
- FIG. 2C the first protrusion 38a and the second protrusion 38b are not visible, but the diamond-shaped hole 40 formed by the punching process is shown. Details of the first protrusion 38a and the second protrusion 38b will be described later.
- the upper surface portion 36a of the fin 36 is provided with a plurality of claw portions 42 and engagement holes 43.
- the cooling device 20 (flow path 34) is configured by connecting a plurality of U-shaped fins 36 (FIG. 2B) in the ⁇ Y direction. That is, the cooling device 20 is formed by connecting the plurality of fins 36 in a direction parallel to the upper surface portion 36a and perpendicular to the X direction (direction in which the cooling fluid flows).
- the claw portion 42 of one fin 36 engages with the engaging hole 43 of the adjacent fin 36.
- An inter-fin flow path 34c extending in the X direction is formed between the adjacent fins 36 and the fin 36, and the flow path 34 is formed by the plurality of inter-fin flow paths 34c.
- the first protrusion 38a and the second protrusion 38b project from the side wall 36b of one fin 36 and come into contact with the side wall 36b of the other fin 36 between the adjacent fins 36 and 36. That is, the width (dimension in the Y direction) of the inter-fin flow path 34c is equal to the protrusion amount of the first protrusion 38a and the second protrusion 38b.
- FIG. 3A is a bottom view showing a state in which the three semiconductor elements 51, 52, and 53 are attached (thermally connected) to the cooling device 20 via the board member 28, and is shown in FIG. 3 (a).
- b) is a side view.
- the semiconductor elements 51, 52, and 53 are provided on the lower surface 28b of the board member 28 at predetermined intervals along the direction in which the cooling fluid flows (X direction).
- a cooling device 20 is provided on the upper surface 28a of the board member 28. If the lower surface portion 36c of the fin 36 is referred to as a first surface portion, the first surface portion 36c of the fin 36 is thermally connected to one or more heating elements (semiconductor elements 51 to 53) via the board member 28. It can be said that it is a surface part that has been removed.
- the entire semiconductor elements 52 and 53 are located below the cooling device 20. That is, the entire upper surface of the semiconductor element 52 is in contact with the cooling device 20 (via the board member 28), and the entire upper surface of the semiconductor element 53 is also in contact with the cooling device 20 (via the board member 28). With this configuration, the portion where the side wall portion 36b of the fin 36 is in contact with the lower surface portion 36c overlaps at least the entire semiconductor element 53 closest to the outlet 34b of the flow path 34.
- the cooling fluid flows in the flow path 34 in the X direction, the heat of the semiconductor elements 51, 52, and 53, which are heating elements, is transferred to the cooling fluid, so that the temperature of the cooling fluid goes from the upstream to the downstream of the flow path 34. Ascend according to. Therefore, in order to allow the semiconductor element 53, which is the most downstream heating element, to be sufficiently cooled by the cooling device 20, the entire semiconductor element 53 is positioned below the cooling device 20.
- the height of the side wall 36b of the fin 36 is reduced from the upper surface portion 36a toward the lower surface portion 36c side at the outlet 34b of the flow path 34. More specifically, the height H1 of the fin 36 is reduced to less than half (height H2) at the outlet 34b of the flow path 34. That is, the height H2 of the portion of the side wall 36b whose height is reduced is 1 ⁇ 2 or less of the height H1 of the portion whose height is not reduced.
- the reason why the height of the fin 36 is reduced from H1 to H2 will be described with reference to FIG.
- the portion where the height of the fin 36 is reduced is referred to as a low back portion 36d. In the present embodiment, it is assumed that the height H2 of the low back portion 36d is constant. In the low back portion 36d, the upper surface portion 36a of the fin 36 is removed except for a part (36e).
- FIG. 4 is a cross-sectional view of the vicinity of the outlet 34b of the flow path 34.
- the second connecting portion 31 and the cover member 26 are also shown.
- the height of the fin 36 is half or less at the outlet 34b of the flow path 34.
- most of the upper surface portion 36a of the fin 36 is removed. Therefore, the cooling fluid (arrow C) flowing horizontally in the flow path 34 in the X direction smoothly flows from the low back portion 36d toward the second connection portion 31 at the outlet 34b of the flow path 34, as shown by the arrow D. Turn around.
- the cooling fluid enters the second connection portion 31 it flows in the Z direction as shown by the arrow E.
- changes in the flow of the cooling fluid due to the protrusions 38a and 38b are ignored. The change in the flow of the cooling fluid due to the protrusions 38a and 38b will be described later with reference to FIG.
- the height of the side wall 36b is smaller from the upper surface portion 36a side to the lower surface portion 36c side at the outlet 34b of the flow path 34. It can be said that this structure is a structure in which the upper part of the flow path 34 (the upper part of the cooling device 20) is cut out. Since the upper part of the flow path 34 is cut out, when the cooling fluid exits the flow path 34, it easily flows out from the bottom surface portion (bottom surface portion 36c) of the flow path in the vertical direction. That is, in the structure of FIG. 4, the low back portion 36d forms a transition section for the cooling fluid to gradually change the traveling direction from the horizontal direction to the vertical direction.
- the bottom surface portion of the cooling device 20 at the flow path outlet 34b can cover the entire semiconductor element 53 in a plan view. Since the temperature of the cooling fluid rises as it flows downstream, it becomes a problem to reduce the cooling capacity to the most downstream heating element (semiconductor element 53) at the outlet of the flow path. In the present embodiment, the cooling device 20 covers the entire semiconductor element 53 so as not to reduce the cooling capacity of the semiconductor element 53.
- FIG. 5 is a cross-sectional view of the vicinity of the flow path outlet 34b in the cooling device 100 of the first comparative example.
- the height of the fin 36 remains H1, and the fin 36 does not have a low back.
- the length of the fin 36 in the X direction is the same as that in FIG.
- the low back portion 36d is not formed on the fin 36, there is no transition section for the cooling fluid to gradually change its direction from the horizontal direction to the vertical direction. Therefore, the flow of the cooling fluid is throttled at the flow path outlet 34b, and the cooling fluid cannot smoothly flow from the flow path 34 to the second connection portion 31.
- FIG. 6 is a cross-sectional view of the vicinity of the flow path outlet 34b in the cooling device 200 of the second comparative example.
- the length of the fin 36 in the X direction is shortened in order to provide a transition section for the cooling fluid to gradually change its direction from the horizontal direction to the vertical direction.
- the height of the fin 36 remains H1, and the fin 36 does not have a low back portion, which is the same as in the first comparative example.
- the cooling fluid can gradually change its direction from the horizontal direction to the vertical direction.
- the transition section for gradually changing the traveling direction of the cooling fluid is provided, the bottom surface of the cooling device 200 is cut off, and the cooling device 200 cannot cover the entire semiconductor element 53.
- the cooling capacity for the semiconductor element 53 is reduced.
- FIG. 7 is a bottom view of the second comparative example. As shown in FIG. 7, the cooling device 200 does not cover the entire semiconductor element 53.
- the flow of the cooling fluid at the flow path outlet 34b is smooth without reducing the cooling capacity to the semiconductor element 53. Can be.
- the protrusion 38 of the cooling device 20 of the present embodiment will be described with reference to FIG. Further, when explaining the operation of the protrusion 38, the flow of the cooling fluid in the configuration (third comparative example) in which the protrusion 38 is not provided will be described with reference to FIG. As described above, the first protrusion 38a and the second protrusion 38b are provided on the side wall 36b of the fin 36.
- the first protrusion 38a is a protrusion that directs the flow of the cooling fluid toward the bottom surface portion 36c of the fin 36.
- the cooling fluid flowing in the flow path 34 flows along the flow path 34 as shown by the arrow F until it reaches the first protrusion 38a.
- the flow velocity of the arrow F is high in the center of the flow path and slows down as it approaches the flow path wall. This is because the boundary layer 90 (indicated by dots in FIG. 9) is generated in the flow path wall due to the viscosity of the cooling fluid. It is known that when the boundary layer 90 is formed, the cooling capacity is reduced. Therefore, in the present embodiment, as shown by the arrows G1 and G2 in FIG. 8, the semiconductor element 53 is directed by the first projection 38a to direct the flow of the cooling fluid in the flow path 34 toward the bottom surface portion 36c of the fin 36. The boundary layer on the side of the board member 28 to which the is attached is destroyed (or the generation of the boundary layer is reduced), and the decrease in cooling capacity is suppressed.
- a low flow velocity region 56 may occur downstream of the first projection 38a. Since the cooling capacity decreases in the low flow velocity region, the decrease in the cooling capacity is suppressed by directing the flow of the cooling fluid toward the low flow velocity region 56 (arrows J1 and J2) by the second projection 38b.
- the protrusion 38 (the first protrusion 38a and the second protrusion 38b) is an element that maintains the cooling capacity of the cooling device 20 (suppresses the decrease in the cooling capacity)
- the formation position of the protrusion 38 is as shown in FIG. , Corresponds to the positions of the semiconductor elements 51, 52, 53. Therefore, according to the cooling device 20 of the present embodiment, the heating element (51 to 53) can be sufficiently cooled.
- the cooling device 20 of the present invention is not limited to the configuration described above.
- a heat pipe may be provided between the cooling device 20 and the board member 28.
- the heat pipe can improve the heat dissipation efficiency of the cooling device 20.
- the board member 28 may be replaced with a vapor chamber.
- the housing of the vapor chamber is made of copper, for example.
- the cooling device 20 does not have to be composed of a plurality of U-shaped fins 36.
- the cooling device 20 includes a first plate member, a plurality of heat radiation fins provided vertically from the first plate member to the second plate member, and a second plate member provided so as to cover the plurality of heat radiation fins. And may be composed of.
- the flow path is formed between the first plate member and the second plate member, and the height of the heat radiation fin is reduced from the second plate member side toward the first plate member side at the outlet of the flow path. ..
- the shape of the fins is not U-shaped but I-shaped.
- a plurality of L-shaped fins may be connected to form a flow path (cooling device) by providing a plate member on the fins, and the height of the fins may be reduced at the outlet of the flow path.
- the height H2 of the low back portion 36d does not have to be constant.
- the low back portion 36d may be inclined. In the case of inclination, for example, the height H2 of the low back portion 36d becomes smaller as it approaches the flow path outlet 34b.
- the semiconductor elements 51 to 53 are examples of heating elements, and the cooling device 20 of the present invention can be applied to "objects that generate heat" other than semiconductor elements.
- the three semiconductor elements 51 to 53 are attached to the cooling device 20, the number of semiconductor elements may be one or more.
- the semiconductor elements 51, 52, and 53 are assumed to be insulated gate bipolar transistors, one or two of the three semiconductor elements may not be insulated gate bipolar transistors.
- the insulated gate bipolar transistor may be a field effect transistor or the like.
- all three semiconductor elements 51 to 53 may be field effect transistors or the like.
- the semiconductor element 51 closest to the flow path inlet only a part of the semiconductor element 51 is located under the cooling device 20, but the entire semiconductor element 51 is under the cooling device 20. It may be located in. That is, the portion where the side wall portion 36b of the fin 36 is in contact with the lower surface portion 36c may overlap with the entire semiconductor element 51.
- the length of the fin 36 is extended in the ⁇ X direction, but the height of the fin 36 is set to H2 at the extended portion. That is, at the flow path inlet 34a, the fin may have a low back portion as an extension portion. This configuration will be described later as the second embodiment.
- the cooling fluid flowing vertically (downward) through the first connection portion 25 when the cooling fluid enters the flow path 34 Since the angle can be gradually changed in the horizontal direction, the fluid easily flows into the flow path 34. Further, since the lower portion of the flow path 34 (the lower surface portion 36c of the fin 36) is not cut out, the bottom wall of the cooling device 20 can cover the semiconductor element 51 at the flow path inlet 34a, and the semiconductor element 51 can be covered. It can be cooled sufficiently.
- FIG. 10 is a perspective view of the cooling system 122 including the cooling device 120.
- FIG. 10 is drawn as a perspective view.
- FIG. 11 is a cross-sectional view of the portion of reference numeral 11 in FIG. 10, and shows the details when the vicinity of the flow path outlet of the cooling device 120 is viewed from the ⁇ X direction.
- FIG. 12 is a diagram showing a fourth comparative example, and is an enlarged cross-sectional view of a configuration corresponding to a portion of reference numeral 12 in FIG.
- the same configurations as those of the first embodiment are designated by the same reference numerals as those of the first embodiment.
- the cooling system 122 of the second embodiment is different from the cooling system 22 of the first embodiment in the shapes of the introduction pipe portion 124, the first connection portion 125, the cover member 126, the outflow pipe portion 130, and the second connection portion 131.
- the arrangement of the semiconductor elements 51 to 53 with respect to the board member 28 is the same as that of the first embodiment.
- the main difference between the cooling device 20 of the first embodiment and the cooling device 120 of the second embodiment is that the fin 136b has a low back portion even at the inlet of the flow path.
- the flow of the cooling fluid in the cooling device 120 is almost the same as that of the first embodiment, but since the fin 136b has a low back portion at the flow path inlet, the cooling fluid entering the flow path inlet from the first connection portion 125 is , The low back portion of the fin 136b can smoothly flow into the flow path.
- the fin 136b is extended in the ⁇ X direction as compared with the first embodiment, and the fin 136b covers the entire semiconductor element 51 in a top view.
- the differences from the cooling device 20 of the first embodiment will be mainly described.
- the cooling device 120 has one bottom surface member 136c, a plurality of side wall portions (fins) 136b extending in the Z direction from the bottom surface member 136c, and a top surface member 136a provided on the plurality of fins 136b.
- the upper side of the upper surface member 136a is shown by a two-dot chain line.
- the cooling device 120 has a low back portion 136d at the flow path outlet 34b, as in the first embodiment.
- An inter-fin flow path 34c is formed between the adjacent fins 136b and 136b.
- the board member 28 will be located below the bottom surface member 136c.
- the second connection portion 131 covers the entire vicinity of the outlet of the cooling device 120.
- the second connection portion 131 has an upper portion 131a and a lower portion 131b.
- the upper portion 131a of the second connecting portion 131 projects above the upper surface member 136a of the cooling device 120.
- the upper portion 131a of the second connecting portion 131 is connected to the outflow pipe portion 130.
- the second connection portion 131 is integrated with the cover member 126. Since the cooling device 120 has a low back portion 136d at the flow path outlet, the height of the fin 136 is H1 from the flow path inlet 34a to the front of the inflow port 34b, and the flow path outlet 34b is the same as in the first embodiment. The height is set to H2.
- the cooling device 120 also has a low back portion 136d at the flow path inlet.
- the upper portion 131a of the second connecting portion 131 projects inward in the flow path width direction as compared with the lower portion 131b and extends to the upper portion of the cooling device 120, so that the cooling fluid extends from the flow path outlet 34b.
- the upper portion 131a of the second connecting portion 131 may be an obstacle to the cooling fluid on both sides in the flow path width direction. That is, as shown in FIG. 12, if the cooling device 120 (or fin 136) does not have the low back portion 136d, the gap between the upper portion 131a of the second connecting portion 131 and the upper surface member 136a of the cooling device 120 is small. It obstructs the flow of cooling fluid.
- the cooling fluid flows between the upper surface member 136a of the cooling device 120 and the upper portion 131a of the second connecting portion 131. Sufficient space is secured.
- the second embodiment is not limited to the above configuration.
- the configurations (1) to (7) described as a modification of the first embodiment may be appropriately adopted.
- Cooling device 34 Flow path 36 ... Fins 36a ... Top surface 36b ... Side surface (side wall) 36c ... Bottom surface 36d ... Low back 38a ... First protrusion 38b ... Second protrusion 51, 52, 53 ... Semiconductor element H1 ... Fin height H2 ... Low back height
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Abstract
Description
本発明の目的は、冷却流体が流路の底面部に垂直な方向からスムーズに流入・流出できるようにしつつ、冷却装置の冷却能力の低下を抑制できる構造を提供することである。
前記冷却装置は、前記側壁に設けられて、前記冷却流体の流れを前記第1面部に向ける第1突起をさらに有してもよい。
前記冷却装置は、第1突起の下流で前記側壁に設けられて、前記冷却流体の流れを前記第1の突起により生成された低流速域に向ける第2突起をさらに有してもよい。
前記第1突起及び前記第2突起を形成する位置は、前記1つ以上の発熱体のそれぞれの位置に対応してよい。
高さが小さくされた前記側壁の部分の高さは、高さが小さくされていない部分の高さの1/2以下であってよい。
高さが小さくされた前記側壁の部分の高さは一定ではなくてもよい。
前記第1突起及び第2突起は、前記側壁と対向する側壁に接触してよい。
前記1つ以上の発熱体は、板状部材を介して前記第1面部に設けられ、前記板状部材は銅板であってよい。前記板状部材は、銅製の筐体を有するベイパーチャンバに置換してもよい。
前記1つ以上の発熱体はヒートパイプを介して前記第1面部に設けられてよい。
前記1つ以上の発熱体のうち少なくとも1つは絶縁ゲートバイポーラトランジスタであってよい。
前記コの字状の金属板はフィン部材であってよい。また、前記流路は複数の前記フィン部材により形成されてよい。前記金属板は銅板であってよい。
前記側壁は、前記第1面部から前記第2面部に向けて垂直に設けられた複数の放熱フィンであってよい。
図1Aは本発明の実施形態1に係る冷却装置20を含む冷却システム22の外観図である。図1Bは図1Aの冷却システム22の透視図である。図1Cは、冷却装置20と、冷却装置20を載置するボード部材28と、ボード部材28の下に位置して、冷却装置20により冷却される3つの半導体素子51、52、53の斜視図である。図1Cには、後述する冷却流体の導入パイプ24、第1接続部25、カバー部材26、第2接続部31、流出パイプ30が示されていない。本実施形態では、半導体素子51、52、53は、絶縁ゲートバイポーラトランジスタ(IGBT)であるとする。
つまり、冷却流体は、ボード部材28に平行に、X方向に流れる。冷却装置20の流路出口34bに到達した冷却流体は、第2接続部31により、その進行方向が水平方向から垂直方向に変わり、上方に流れる。そして、冷却流体は、第2接続部31から流出パイプ30に流れて、矢印Bのように冷却システム22から排出される。
図2Bから分かるように、フィン36はX方向で見た場合、コの字状の断面を有している。コの字の上辺に相当する部分をフィン36の上面部36aと称し、底辺に相当する部分をフィン36の下面部36cと称し、上面部と下面部を繋ぐ縦辺に相当する部分をフィン36の側面部36bと称する。フィン36は、コの字状の金属板により構成されている。金属板(フィン36)は、例えば、銅板である。銅は熱伝導率が高いので、冷却装置20を形成する材料として適している。
また、流路34の下部(下面部36c)は切り欠かれていないので、流路出口34bにおいて、冷却装置20の底面部は、平面視で、半導体素子53の全体を覆うことができる。冷却流体は下流に流れるのに従って温度が高くなるので、流路出口において最下流の発熱体(半導体素子53)への冷却能力の低下が課題になる。本実施形態では、冷却装置20が半導体素子53の全体を覆うことにより、半導体素子53に対する冷却能力を低下させないようにしている。
図5は、第1比較例の冷却装置100における流路出口34b近傍の断面図である。第1比較例では、フィン36の高さはH1のままであり、フィン36は低背部を有していない。第1比較例では、フィン36のX方向の長さは図4と同じである。第1比較例では、フィン36に低背部36dが形成されていないので、冷却流体が水平方向から垂直方向に徐々に方向を変えるための遷移区間が無い。従って、流路出口34bにおいて冷却流体の流れが絞られてしまい、冷却流体は流路34から第2接続部31へスムーズに流れることができない。
第1比較例及び第2比較例と比べて、本実施形態の冷却装置20(図4)では、半導体素子53への冷却能力を低下させること無く、流路出口34bにおける冷却流体の流れをスムーズにすることができる。
上記したように、フィン36の側壁36bに第1突起38aと第2突起38bが設けられている。第1突起38aは、冷却流体の流れをフィン36の底面部36cに向ける突起である。
本発明の冷却装置20は上記において説明した構成に限定されない。例えば、以下のような変更が可能である。(1)冷却装置20とボード部材28の間にヒートパイプを設けてもよい。ヒートパイプにより、冷却装置20の放熱効率を向上することができる。(2)ボード部材28をベイパーチャンバに置換してもよい。ベイパーチャンバの筐体は、例えば、銅製である。ボード部材28の代わりにベイパーチャンバを使用することにより、冷却装置20の放熱効率を向上することができる。
(6)3つの半導体素子51~53が冷却装置20に取り付けられていたが、半導体素子の数は1以上であればよい。
(7)半導体素子51、52、53は絶縁ゲートバイポーラトランジスタであるとしたが、3つのうちの1つまたは2つの半導体素子は絶縁ゲートバイポーラトランジスタでなくてもよい。例えば、絶縁ゲートバイポーラトランジスタを電界効果トランジスタ等にしてもよい。あるいは、3つの半導体素子51~53の全てを電界効果トランジスタ等にしてもよい。
フィン36の側壁部36bの高さが流路34の入口34aにおいても低くなれば、冷却流体が流路34に入る際に、第1接続部25を垂直方向(下方向)に流れる冷却流体は徐々に水平方向に向かって角度を変えることができるので、流路34に流入し易い。また、流路34の下部(フィン36の下面部36c)は切り欠かれていないので、流路入口34aにおいて、冷却装置20の底壁は、半導体素子51を覆うことができ、半導体素子51を十分に冷却することができる。
次に、本発明の実施形態2に係る冷却装置120を、図10~図12を参照して説明する。図10は、冷却装置120を含む冷却システム122の斜視図である。図10は透視図で描かれている。図11は、図10の符号11の部分の断面図であり、冷却装置120の流路出口近傍を-X方向から見た場合の詳細を示している。図12は、第4比較例を示す図であり、図11の符号12の部分に相当する構成の拡大断面図である。
以下の説明において、実施形態1と同様な構成には、実施形態1と同じ参照符号を付ける。実施形態2の冷却システム122は、実施形態1の冷却システム22と比べると、導入パイプ部124、第1接続部125、カバー部材126、流出パイプ部130および第2接続部131の形状が異なる。ボード部材28に対する半導体素子51~53の配置は実施形態1と同じである。
実施形態1の冷却装置20と実施形態2の冷却装置120の主な相違点は、フィン136bが流路入口においても低背部を有していることである。冷却装置120内における冷却流体の流れは実施形態1とほぼ同じであるが、フィン136bが流路入口に低背部を有しているので、第1接続部125から流路入口に入る冷却流体は、フィン136bの低背部からスムーズに流路に流入することができる。フィン136bは、実施形態1と比較すると、-X方向に延長されており、フィン136bは上面視で半導体素子51の全体を覆っている。以下、実施形態1の冷却装置20との相違点を中心に説明する。
本実施形態では、第2接続部131が冷却装置120の出口付近全体を覆っている。第2接続部131は上部131aと下部131bを有する。第2接続部131の上部131aは、冷却装置120の上面部材136aの上方に張り出している。第2接続部131の上部131aが流出パイプ部130に繋がっている。尚、第2接続部131はカバー部材126と一体である。
冷却装置120は流路出口において低背部136dを有するので、実施形態1と同じように、流路入口34aから流入出口34bの前までは、フィン136の高さはH1であり、流路出口34bにおいて高さがH2にされている。流路入口においても、冷却装置120は低背部136dを有している。
これに対し、本実施形態では、図11に示すように、フィン136が低背部136dを有するので、冷却装置120の上面部材136aと第2接続部131の上部131aとの間に冷却流体が流れる十分なスペースが確保される。
34…流路
36…フィン
36a…上面部
36b…側面部(側壁部)
36c…下面部
36d…低背部
38a…第1突起
38b…第2突起
51、52、53…半導体素子
H1…フィンの高さ
H2…低背部の高さ
Claims (19)
- 冷却流体が流れる方向に沿って設けられた1つ以上の発熱体を、前記冷却流体により冷却する冷却装置であって、
前記1つ以上の発熱体に熱的に接続された第1面部と、
前記第1面部に対向する第2面部と、を有し、
前記第1面部と前記第2面部の間に、前記冷却流体が流れる流路が形成され、
前記冷却装置は、前記第1面部と前記第2面部を繋ぎ、且つ、前記冷却流体が流れる方向に沿って延びる側壁を有し、
前記側壁の高さは、前記流路の出口において、前記第2面部側から前記第1面部側に向かって小さくされ、
高さが小さくされた前記側壁の部分において、前記第2面部の少なくとも一部は欠落しており、
前記側壁が前記第1面部に接する部分は、少なくとも前記流路の出口に最も近い発熱体の全体に重なることを特徴とする冷却装置。 - 前記側壁の高さは、前記流路の入口においても、前記第2面部側から前記第1面部側に向かって小さくされていることを特徴とする請求項1に記載の冷却装置。
- 前記側壁に設けられて、前記冷却流体の流れを前記第1面部に向ける第1突起をさらに有することを特徴とする請求項1または2に記載の冷却装置。
- 前記第1突起の下流で前記側壁に設けられて、前記冷却流体の流れを前記第1の突起により生成された低流速域に向ける第2突起をさらに有することを特徴とする請求項3に記載の冷却装置。
- 前記第1突起及び前記第2突起を形成する位置は、前記1つ以上の発熱体のそれぞれの位置に対応していることを特徴とする請求項4に記載の冷却装置。
- 前記第1突起は、前記流路の前記冷却流体が流れる方向に対して、第1所定角度傾斜しており、前記第2突起は前記第1所定角度とは異なる角度で、前記流路の長手方向に対して傾斜していることを特徴とする請求項4または5に記載の冷却装置。
- 前記第1突起及び前記第2突起は、前記流路の長手方向に対して、約30度傾斜していることを特徴とする請求項4または5に記載の冷却装置。
- 高さが小さくされた前記側壁の部分の高さは、高さが小さくされていない部分の高さの1/2以下であることを特徴とする請求項1~7のいずれか1項に記載の冷却装置。
- 高さが小さくされた前記側壁の部分の高さは一定ではないことを特徴とする請求項1~8のいずれか1項に記載の冷却装置。
- 前記第1突起及び第2突起は、前記側壁と対向する側壁に接触することを特徴とする請求項1~9のいずれか1項に記載の冷却装置。
- 前記第1突起及び第2突起は、打ち抜き加工で形成されたことを特徴とする請求項1~10のいずれか1項に記載の冷却装置。
- 前記1つ以上の発熱体は、板状部材を介して前記第1面部に設けられ、前記板状部材は銅板であることを特徴とする請求項1~11のいずれか1項に記載の冷却装置。
- 前記板状部材は銅製の筐体を有するベイパーチャンバであることを特徴とする請求項12に記載の冷却装置。
- 前記1つ以上の発熱体はヒートパイプを介して前記第1面部に設けられていることを特徴とする請求項1~13のいずれか1項に記載の冷却装置。
- 前記1つ以上の発熱体のうち少なくとも1つは絶縁ゲートバイポーラトランジスタであることを特徴とする請求項1~14のいずれか1項に記載の冷却装置。
- 前記第1面部と前記側壁と前記第2面部は、コの字状の1つの金属板により構成され、前記流路は、複数の前記コの字状の金属板を、前記第1面部と平行かつ前記冷却流体が流れる方向と垂直な方向に連結して形成されることを特徴とする請求項1~15のいずれか1項に記載の冷却装置。
- 前記コの字状の金属板はフィン部材であり、前記流路は複数の前記フィン部材により形成されることを特徴とする請求項16に記載の冷却装置。
- 前記金属板は銅板であることを特徴とする請求項16または17に記載の冷却装置。
- 前記側壁は、前記第1面部から前記第2面部に向けて垂直に設けられた複数の放熱フィンであることを特徴とする請求項1~15のいずれか1項に記載の冷却装置。
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