WO2022127594A1 - Module optique - Google Patents

Module optique Download PDF

Info

Publication number
WO2022127594A1
WO2022127594A1 PCT/CN2021/134679 CN2021134679W WO2022127594A1 WO 2022127594 A1 WO2022127594 A1 WO 2022127594A1 CN 2021134679 W CN2021134679 W CN 2021134679W WO 2022127594 A1 WO2022127594 A1 WO 2022127594A1
Authority
WO
WIPO (PCT)
Prior art keywords
board
layer
board layer
capacitor
buried
Prior art date
Application number
PCT/CN2021/134679
Other languages
English (en)
Chinese (zh)
Inventor
邵宇辰
王欣南
张加傲
于琳
Original Assignee
青岛海信宽带多媒体技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 青岛海信宽带多媒体技术有限公司 filed Critical 青岛海信宽带多媒体技术有限公司
Publication of WO2022127594A1 publication Critical patent/WO2022127594A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Definitions

  • the present application relates to the technical field of optical communication, and in particular, to an optical module.
  • the optical module includes an upper casing, a lower casing, a circuit board, and an optical transceiver.
  • the upper casing is covered with the lower casing to form a wrapping cavity with two openings, and the circuit board and the optical transceiver are arranged inside the cavity.
  • Electromagnetic Compatibility As a performance indicator of optical modules, devices or systems, has two meanings: one is that the module does not generate electromagnetic interference to other devices in the same environment when it is working; the other is On the one hand, it means that the module does not affect the normal operation due to electromagnetic interference in the electromagnetic environment where it is located. Reducing the electromagnetic radiation of the optical module itself is beneficial to improve the electromagnetic compatibility performance of the optical module.
  • an embodiment of the present disclosure discloses an optical module, including: a circuit board, including a plurality of board layers; the plurality of board layers from top to bottom include: a first board layer disposed on the surface layer, and a first board layer disposed on the surface layer, respectively The second board layer and the third board layer of the inner layer; the second board layer and the third board layer are reference grounds; the first board layer is provided with high-speed differential signal lines, and the high-speed differential signal lines are between It includes a capacitor pad; a capacitor is welded with the capacitor pad; a plurality of buried holes are arranged in the projection area of the capacitor on the circuit board, and connect the second board layer and the third board layer.
  • an embodiment of the present disclosure discloses an optical module, comprising: a circuit board including a plurality of board layers;
  • the plurality of board layers from top to bottom include: a first board layer arranged on the surface layer, and a second board layer and a third board layer respectively arranged on the inner layer; the second board layer and the third board
  • the layer is a reference ground, and a signal layer is not included between the second board layer and the third board layer; the first board layer is provided with high-speed differential signal lines, and capacitor pads are included between the high-speed differential signal lines;
  • the capacitor is welded with the capacitor pad; a plurality of buried holes are arranged in the projection area of the capacitor on the circuit board and communicate with the second board layer and the third board layer.
  • FIG. 1 is a connection diagram of an optical communication system according to some embodiments
  • FIG. 2 is a structural diagram of an optical network terminal according to some embodiments.
  • FIG. 3 is a schematic structural diagram of an optical module according to some embodiments.
  • FIG. 4 is a schematic diagram of an exploded structure of an optical module according to some embodiments.
  • FIG. 5 is a schematic diagram of a circuit board structure in the related art
  • FIG. 6 is a schematic top-view structure diagram of a circuit board shown in FIG. 5;
  • FIG. 7 is a schematic diagram of a circuit board structure according to some embodiments.
  • FIG. 8 is a top view of the circuit board shown in FIG. 7;
  • FIG. 9 is a schematic structural diagram of the dotted line part in FIG. 7;
  • FIG. 10 is a schematic diagram of the electric field radiation intensity on the surface of the AC coupling capacitor in the circuit board shown in FIG. 5;
  • FIG. 11 is a schematic diagram of the electric field radiation intensity on the surface of the AC coupling capacitor in a circuit board according to some embodiments.
  • FIG. 12 is a schematic diagram of the magnetic field radiation intensity on the surface of the AC coupling capacitor in the circuit board shown in FIG. 5;
  • FIG. 13 is a schematic diagram of the magnetic field radiation intensity on the surface of the AC coupling capacitor in a circuit board according to some embodiments.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implying the number of indicated technical features.
  • a feature defined as “first” or “second” may expressly or implicitly include one or more of that feature.
  • plural means two or more.
  • the expressions “coupled” and “connected” and their derivatives may be used.
  • the term “connected” may be used in describing some embodiments to indicate that two or more components are in direct physical or electrical contact with each other.
  • the term “coupled” may be used in describing some embodiments to indicate that two or more components are in direct physical or electrical contact.
  • the terms “coupled” or “communicatively coupled” may also mean that two or more components are not in direct contact with each other, yet still co-operate or interact with each other.
  • the embodiments disclosed herein are not necessarily limited by the content herein.
  • At least one of A, B, and C has the same meaning as “at least one of A, B, or C”, and both include the following combinations of A, B, and C: A only, B only, C only, A and B , A and C, B and C, and A, B, and C.
  • a and/or B includes the following three combinations: A only, B only, and a combination of A and B.
  • optical communication technology light is used to carry the information to be transmitted, and the optical signal carrying the information is transmitted to information processing equipment such as computers through information transmission equipment such as optical fibers or optical waveguides to complete the transmission of information. Due to the passive transmission characteristics of optical signals when transmitted through optical fibers or optical waveguides, low-cost and low-loss information transmission can be achieved.
  • the signals transmitted by information transmission equipment such as optical fibers or optical waveguides are optical signals, while the signals that can be recognized and processed by information processing equipment such as computers are electrical signals. To establish an information connection between them, it is necessary to realize the mutual conversion of electrical signals and optical signals.
  • the optical module realizes the mutual conversion function of the above-mentioned optical signal and electrical signal in the technical field of optical fiber communication.
  • the optical module includes an optical port and an electrical port.
  • the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides through the optical port, and realizes electrical connection with an optical network terminal (for example, an optical cat) through the electrical port. It is mainly used to realize power supply, I2C signal transmission, data signal transmission and grounding; optical network terminals transmit electrical signals to information processing equipment such as computers through network cables or wireless fidelity technology (Wi-Fi).
  • Wi-Fi wireless fidelity technology
  • FIG. 1 is a connection diagram of an optical communication system according to some embodiments.
  • the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101 and a network cable 103;
  • the optical fiber 101 is connected to the remote server 1000 , and the other end is connected to the optical network terminal 100 through the optical module 200 .
  • the optical fiber itself can support long-distance signal transmission, such as signal transmission of several kilometers (6 kilometers to 8 kilometers). On this basis, if repeaters are used, ultra-long distance transmission can theoretically be achieved. Therefore, in a common optical communication system, the distance between the remote server 1000 and the optical network terminal 100 can usually reach several kilometers, tens of kilometers or hundreds of kilometers.
  • the local information processing device 2000 may be any one or more of the following devices: a router, a switch, a computer, a mobile phone, a tablet computer, a television, and the like.
  • the physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing device 2000 and the optical network terminal 100 .
  • the connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.
  • the optical module 200 includes an optical port and an electrical port.
  • the optical port is configured to be connected to the optical fiber 101, so that the optical module 200 and the optical fiber 101 can establish a two-way optical signal connection; electrical signal connection.
  • the optical module 200 realizes the mutual conversion of optical signals and electrical signals, so as to establish a connection between the optical fiber 101 and the optical network terminal 100 .
  • the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input into the optical network terminal 100
  • the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input into the optical fiber 101 .
  • the optical network terminal 100 includes a substantially rectangular housing, and an optical module interface 102 and a network cable interface 104 disposed on the housing.
  • the optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 can establish a bidirectional electrical signal connection;
  • the network cable interface 104 is configured to access the network cable 103, so that the optical network terminal 100 and the network cable 103 are connected.
  • a connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100 .
  • the optical network terminal 100 transmits the electrical signal from the optical module 200 to the network cable 103, and transmits the signal from the network cable 103 to the optical module 200.
  • the optical network terminal 100 as the host computer of the optical module 200, can monitor the optical module 200. work.
  • the host computer of the optical module 200 may also include an optical line terminal (Optical Line Terminal, OLT) and the like.
  • OLT Optical Line Terminal
  • a bidirectional signal transmission channel is established between the remote server 1000 and the local information processing device 2000 through the optical fiber 101 , the optical module 200 , the optical network terminal 100 and the network cable 103 .
  • FIG. 2 is a structural diagram of an optical network terminal according to some embodiments.
  • the optical network terminal 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105 , and an electrical connector disposed inside the cage 106 .
  • the electrical connector is configured to be connected to the electrical port of the optical module 200 ; the heat sink 107 has protrusions such as fins that increase the heat dissipation area.
  • the optical module 200 is inserted into the cage 106 of the optical network terminal 100 , and the optical module 200 is fixed by the cage 106 .
  • the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106 , so that the optical module 200 and the optical network terminal 100 establish a bidirectional electrical signal connection.
  • the optical port of the optical module 200 is connected to the optical fiber 101 , so that the optical module 200 and the optical fiber 101 establish a bidirectional electrical signal connection.
  • FIG. 3 is a schematic structural diagram of an optical module according to some embodiments
  • FIG. 4 is a schematic diagram of an exploded structure of an optical module according to some embodiments.
  • the optical module 200 includes a casing, a circuit board 300 disposed in the casing, and an optical transceiver;
  • the casing includes an upper casing 201 and a lower casing 202.
  • the upper casing 201 is covered on the lower casing 202 to form the above casing with two openings 204 and 205; the outer contour of the casing generally presents a square body.
  • the lower casing 202 includes a bottom plate and two lower side plates located on both sides of the bottom plate and perpendicular to the bottom plate;
  • the upper casing 201 includes a cover plate, and two sides of the cover plate are perpendicular to the cover plate.
  • the two upper side plates are combined with the two side plates by the two side walls to realize that the upper casing 201 is covered on the lower casing 202 .
  • the direction of the connection between the two openings 204 and 205 may be consistent with the length direction of the optical module 200 , or may be inconsistent with the length direction of the optical module 200 .
  • the opening 204 is located at the end of the optical module 200 (the right end in FIG. 3 ), and the opening 205 is also located at the end of the optical module 200 (the left end in FIG. 3 ).
  • the opening 204 is located at the end of the optical module 200
  • the opening 205 is located at the side of the optical module 200 .
  • the opening 204 is an electrical port, and the golden fingers of the circuit board 300 protrude from the electrical port 204 and are inserted into the host computer (such as the optical network terminal 100 );
  • the optical fiber 101 is connected to the optical transceiver device inside the optical module 200 .
  • the combination of the upper case 201 and the lower case 202 is used to facilitate the installation of the circuit board 300, optical transceivers and other devices into the case, and the upper case 201 and the lower case 202 can form encapsulation protection for these devices.
  • the upper case 201 and the lower case 202 can form encapsulation protection for these devices.
  • the upper casing 201 and the lower casing 202 are generally made of metal material, which is beneficial to achieve electromagnetic shielding and heat dissipation.
  • the optical module 200 further includes an unlocking component 203 located on the outer wall of the housing thereof, and the unlocking component 203 is configured to realize a fixed connection between the optical module 200 and the upper computer, or release the connection between the optical module 200 and the upper computer fixed connection.
  • the unlocking components 203 are located on the outer walls of the two lower side panels of the lower casing 202, and include engaging components matching with the cage of the upper computer (eg, the cage 106 of the optical network terminal 100).
  • the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the engaging part of the unlocking part 203; when the unlocking part 203 is pulled, the engaging part of the unlocking part 203 moves accordingly, thereby changing the The connection relationship between the engaging member and the host computer is used to release the engaging relationship between the optical module 200 and the host computer, so that the optical module 200 can be pulled out from the cage of the host computer.
  • the circuit board 300 includes circuit traces, electronic components and chips, and the electronic components and chips are connected together according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission, and grounding.
  • the electronic components may include, for example, capacitors, resistors, triodes, and metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET).
  • the chip may include, for example, a Microcontroller Unit (MCU), a limiting amplifier (limiting amplifier), a clock and data recovery chip (Clock and Data Recovery, CDR), a power management chip, and a digital signal processing (Digital Signal Processing, DSP) chip .
  • MCU Microcontroller Unit
  • limiting amplifier limiting amplifier
  • CDR clock and data recovery chip
  • DSP digital signal processing
  • the circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function. For example, the rigid circuit board can carry chips smoothly; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage. .
  • the circuit board 300 further includes a gold finger formed on the end surface thereof, and the gold finger is composed of a plurality of pins which are independent of each other.
  • the circuit board 300 is inserted into the cage 106 , and is electrically connected to the electrical connector in the cage 106 by gold fingers.
  • the golden fingers can be arranged only on one side surface of the circuit board 300 (eg, the upper surface shown in FIG. 4 ), or can be arranged on the upper and lower surfaces of the circuit board 300 , so as to meet the needs of a large number of pins.
  • the golden finger is configured to establish an electrical connection with the upper computer to realize power supply, grounding, I2C signal transmission, data signal transmission, and the like.
  • flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.
  • the optical transceiver device includes two parts, an optical transmitting device 400 and an optical receiving device, which are respectively used for transmitting and receiving optical signals.
  • the light emitting device generally includes a light emitter, a lens and a light detector, and the lens and the light detector are located on different sides of the light emitter.
  • the front and back sides of the light emitter emit light beams respectively, and the lens is used to converge the front of the light emitter.
  • the emitted light beam makes the light beam emitted by the light transmitter a convergent light so as to be easily coupled to an external optical fiber; the light detector is used to receive the light beam emitted from the reverse side of the light transmitter to detect the optical power of the light transmitter.
  • the light emitted by the optical transmitter enters the optical fiber after being condensed by the lens, and the light detector detects the luminous power of the optical transmitter to ensure the constancy of the emitted optical power of the optical transmitter.
  • FIG. 5 is a schematic structural diagram of a circuit board in the related art.
  • the circuit board is formed by stacking a plurality of board layers.
  • the circuit board 300 includes: ply 301, second ply 302, third ply 303, fourth ply 304, fifth ply 305, sixth ply 306, seventh ply 307 and eighth ply 308, every two phases
  • a dielectric layer is filled between the adjacent plate layers, and the dielectric layer is an insulating material.
  • the different layers of the circuit board are set as the signal layer or the reference ground according to the needs.
  • the signal layer is used for the transmission of the signal line, and the reference ground is the complete ground layer.
  • the AC coupling capacitor 309 is disposed on the upper surface of the first plate layer 301 .
  • Each plate layer is a metal layer, usually a copper plate, and the signal layer is formed by etching lines on the basis of the copper plate layer to form signal lines, that is, a metal layer provided with signal lines.
  • the reference ground is an overall copper plate, and no signal line is provided.
  • the first board layer 301 is a high-speed differential signal line layer.
  • the second board layer 302 , the third board layer 303 , and the seventh board layer 307 are reference grounds, and the other board layers are signal layers.
  • the first board layer 301 is provided with a high-speed differential signal circuit, including: an AC coupling capacitor pad 3011 and a signal line, and the AC coupling capacitor pad 3011 and the AC coupling capacitor 309 are welded.
  • a first ground hole 3013 is provided between the first board layer 301 and the third board layer 303 to realize the grounding of each electronic device on the first board layer 301 .
  • a second ground hole 3014 is provided between the third board layer 303 and the sixth board layer 306 to realize the grounding of the electronic devices on the fourth board layer 304 , the fifth board layer 305 and the sixth board layer 306 .
  • a third ground hole 3015 is provided between the sixth board layer 306 and the eighth board layer 308 to realize the grounding of the electronic devices on the seventh board layer 307 and the eighth board layer 308 .
  • FIG. 6 is a schematic top-view structural diagram of a circuit board shown in FIG. 5 .
  • a layer of insulating layer is generally laid on the upper surface of the first board layer 301 and the lower surface of the eighth board layer to protect the circuit, and only the pad position is exposed.
  • the light-colored part in the figure represents the etched line of the first board layer 301 , which is a fault, and is used to realize differentiated transmission of signals.
  • the four areas formed by the central cross are the differential signal circuit areas: the first circuit area 3016, the second circuit area 3017, the third circuit area 3018 and the fourth circuit area 3019, wherein the first circuit area 3016 and the second circuit area 3017 is located on one side of the AC coupling capacitor pad 3011 , and the third circuit area 3018 and the fourth circuit area 3019 are located on the other side of the AC coupling capacitor pad 3011 .
  • the first circuit area 3016 is connected to the first differential line 30121
  • the second circuit area 3017 is connected to the second differential line 30122
  • the third circuit area 3018 is connected to the third differential line 30123
  • the fourth circuit area 3019 is connected to the fourth differential line 30124 connect.
  • the AC coupling capacitor 309 connects two adjacent regions to achieve electrical connection, and then connects with other electronic devices through differential lines. That is, one end of the AC coupling capacitor 309 is connected to the first circuit area 3016 and the other end is connected to the third circuit area 3018; or one end of the AC coupling capacitor 309 is connected to the second circuit area 3017 and the other end is connected to the fourth circuit area 3019.
  • FIG. 7 is a schematic diagram of a circuit board structure according to some embodiments.
  • FIG. 8 is a top view of the circuit board shown in FIG. 7 .
  • a buried via 3031 is added between the second board layer 302 and the third board layer 303 under the AC coupling capacitor 309 on the circuit board.
  • buried vias 3031 are arranged between the second board layer 302 and the third board layer 303 under the AC coupling capacitor 309 , and the signal return between the AC coupling capacitor 309 and the third board layer 303 can directly pass through Buried via 3031 below the capacitor.
  • the signal return paths of the circuit board AC coupling capacitor 309 and the third board layer 303 are relatively shortened, thereby reducing the signal loop area and thereby reducing the amount of electromagnetic radiation. Compared with the circuit board in the related art, the circuit of the AC coupling capacitor 309 remains unchanged, and the overall intensity of the electromagnetic field formed around the AC coupling capacitor 309 remains unchanged.
  • the buried hole 3031 is used to connect the adjacent reference ground below the AC coupling capacitor 309, and does not connect to any signal layer, so as to prevent the signal of the AC coupling capacitor 309 from flowing back through the signal layer and causing interference to the signal layer itself. Therefore, one end of the buried via 3031 is connected to the second board layer 302 , and the other end is connected to the third board layer 303 . Because the second board layer 302 and the third board layer 303 are reference grounds and are a complete copper plate structure, the buried via 3031 is arranged between the second board layer 302 and the third board layer 303 to realize the second board layer 302 and the third board layer 303. Connectivity of the three ply layers 303 .
  • a buried via 3031 is provided below the AC coupling capacitor 309 , and the second board layer 302 and the third board layer 303 are connected through the buried via 3031 .
  • the buried via 3031 is disposed in the orthographic projection of the AC coupling capacitor 309 on the circuit board 300 .
  • the buried vias 3031 include a first buried via 30311 , a second buried via 30312 , a third buried via 30313 and a fourth buried via 30314 , which are respectively disposed on both sides of the AC coupling capacitor pad 3011 ,
  • the signal line 3012 includes a first differential line 30121, a second differential line 30122, a third differential line 30123, and a fourth differential line 30124.
  • FIG. 9 is a schematic diagram of the structure of the dotted line in FIG. 7.
  • the buried via 3031 is a structure passing through the second board layer 302 and the third board layer 303, and the surface is coated with a copper layer for connecting the second board layer. 302 and the third ply 303.
  • the buried via 3031 is a hollow structure with a diameter of 4 mils.
  • the first buried via 30311 , the second buried via 30312 , the third buried via 30313 and the fourth buried via 30314 are all disposed outside the AC coupling capacitor pad 3011 and away from adjacent AC coupling capacitor pads 3011 edge 5-10mil.
  • the edge of the AC coupling capacitor pad is the edge of the rectangular box in the center of Figure 8.
  • the spacing of buried vias located on the same side of the AC coupling capacitor pad 3011 should not be smaller than the spacing of the corresponding differential signal lines above it. That is, as shown in the figure, the distance between the first buried via 30311 and the second buried via 30312 is equal to or greater than the line distance between the first differential line 30121 and the second differential line 30122 . The distance between the third buried via 30313 and the fourth buried via 30314 is equal to or greater than the line distance between the third differential line 30123 and the fourth differential line 30124 .
  • the distance between the first buried hole 30311 and the second buried hole 30312 is the distance from the central axis of the first buried hole 30311 to the central axis of the second buried hole 30312 .
  • the distance between the third buried hole 30313 and the fourth buried hole 30314 is the distance from the central axis of the third buried hole 30313 to the central axis of the fourth buried hole 30314 .
  • the line distance between the first differential line 30121 and the second differential line 30122 represents the distance from the center line of the first differential line 30121 to the center line of the second differential line 30122 .
  • the line distance between the third differential line 30123 and the fourth differential line 30124 represents the distance from the center line of the third differential line 30123 to the center line of the fourth differential line 30124 .
  • FIG. 10 is a schematic diagram of the electric field radiation intensity on the surface of the AC coupling capacitor in the circuit board shown in FIG. 5
  • FIG. 11 is a schematic diagram of the electric field radiation intensity on the surface of the AC coupling capacitor in a circuit board according to some embodiments. Comparing Fig. 10 and Fig. 11, it can be seen that the radiated electric field distribution under the two conditions, the maximum radiated electric field intensity is about 5370V/m under the condition of designing the inner layer ground hole, and about 6072V/m without the inner layer ground hole condition, The maximum electric field radiation intensity is weakened by about 702V/m.
  • FIG. 12 is a schematic diagram of the magnetic field radiation intensity on the surface of the AC coupling capacitor in the circuit board shown in FIG. 5
  • FIG. 13 is a schematic diagram of the magnetic field radiation intensity on the surface of the AC coupling capacitor in a circuit board according to some embodiments. Comparing Figure 12 and Figure 13, it can be seen that it is the magnetic field radiation intensity on the surface of the AC coupling capacitor.
  • the maximum radiation intensity is about 62A/m without the isolation ground hole. After the isolation hole is added, the radiation intensity of the magnetic field is weakened to 51A/m, which is about 11A/m.
  • the circuit board provided with the buried hole under the AC coupling capacitor provided by the present disclosure can effectively reduce the electromagnetic field intensity radiated from the surface of the capacitor and the electromagnetic energy radiated from the capacitor, thereby suppressing the electromagnetic interference of the rigid circuit board. , to improve the electromagnetic compatibility characteristics of optical modules.
  • an optical module including: a circuit board and an AC coupling capacitor, and the AC coupling capacitor is welded to the circuit board.
  • the circuit board includes a first board layer, a second board layer and a third board layer that are stacked in sequence, and the first board layer is provided with a high-speed differential signal line with an AC coupling capacitor pad; the second board layer and the third board layer are Complete reference.
  • the AC coupling capacitor is connected to the differential signal line through the AC coupling capacitor pad.
  • a plurality of buried holes are arranged in the orthographic projection of the AC coupling capacitor on the circuit board, and the buried holes are connected to the second board layer and the third board layer.
  • the signal return path of the AC coupling capacitor is from the ground outside the AC coupling capacitor pad.
  • the hole reflow is changed to a buried hole reflow, which shortens the signal return path of the AC coupling capacitor, reduces the signal loop area, and then reduces the amount of electromagnetic radiation from the AC coupling capacitor to the outside of the circuit board, which helps to improve the electromagnetic radiation of the optical module.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

Est divulgué un module optique, comprenant : une carte de circuit imprimé et un condensateur, le condensateur et la carte de circuit imprimé étant soudés l'un à l'autre, la carte de circuit imprimé comprenant, de haut en bas, une première couche de carte disposée sur une couche de surface ainsi qu'une deuxième couche de carte et une troisième couche de carte respectivement disposées sur des couches internes, des lignes de signal différentiel à grande vitesse étant disposées dans la première couche de carte, un plot de condensateur étant compris entre les lignes de signal différentiel à grande vitesse, la deuxième couche de carte et la troisième couche de carte étant des masses de référence complètes, et le condensateur étant connecté aux lignes de signal différentiel à grande vitesse au moyen du plot de condensateur ; et une pluralité de trous enterrés formés dans une zone de projection du condensateur sur la carte de circuit imprimé, les trous enterrés permettant la communication de la deuxième couche de carte et de la troisième couche de carte. Le retour par l'intermédiaire d'un trajet de retour de signal du condensateur est modifié pour passer à travers les trous enterrés depuis l'origine passant à travers des trous de mise à la masse sur le côté extérieur du plot de condensateur, ce qui permet de raccourcir le trajet de retour de signal du condensateur, réduire la surface d'une boucle de signal, puis réduire la quantité de rayonnement électromagnétique du condensateur vers l'extérieur de la carte de circuit imprimé, et faciliter l'amélioration de la compatibilité électromagnétique du module optique.
PCT/CN2021/134679 2020-12-18 2021-12-01 Module optique WO2022127594A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202011500774.2A CN114650647A (zh) 2020-12-18 2020-12-18 一种光模块
CN202011500774.2 2020-12-18

Publications (1)

Publication Number Publication Date
WO2022127594A1 true WO2022127594A1 (fr) 2022-06-23

Family

ID=81990652

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/134679 WO2022127594A1 (fr) 2020-12-18 2021-12-01 Module optique

Country Status (2)

Country Link
CN (1) CN114650647A (fr)
WO (1) WO2022127594A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115279038A (zh) * 2022-09-26 2022-11-01 深圳国人无线通信有限公司 一种适用于高速信号传输的布线方法和pcb板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101031182A (zh) * 2007-03-23 2007-09-05 华为技术有限公司 印制线路板及其设计方法
CN108242582A (zh) * 2016-12-23 2018-07-03 华为技术有限公司 一种dgs滤波器、印制电路板及滤波装置
CN111182716A (zh) * 2020-03-04 2020-05-19 惠州Tcl移动通信有限公司 一种印刷电路板结构及终端设备
CN111948764A (zh) * 2019-05-17 2020-11-17 青岛海信宽带多媒体技术有限公司 光模块

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101031182A (zh) * 2007-03-23 2007-09-05 华为技术有限公司 印制线路板及其设计方法
CN108242582A (zh) * 2016-12-23 2018-07-03 华为技术有限公司 一种dgs滤波器、印制电路板及滤波装置
CN111948764A (zh) * 2019-05-17 2020-11-17 青岛海信宽带多媒体技术有限公司 光模块
CN111182716A (zh) * 2020-03-04 2020-05-19 惠州Tcl移动通信有限公司 一种印刷电路板结构及终端设备

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115279038A (zh) * 2022-09-26 2022-11-01 深圳国人无线通信有限公司 一种适用于高速信号传输的布线方法和pcb板
CN115279038B (zh) * 2022-09-26 2022-12-27 深圳国人无线通信有限公司 一种适用于高速信号传输的布线方法和pcb板

Also Published As

Publication number Publication date
CN114650647A (zh) 2022-06-21

Similar Documents

Publication Publication Date Title
CN111555811B (zh) 一种光模块
WO2021227643A1 (fr) Module optique
CN113660035B (zh) 一种光模块及校准单位定义方法
CN213659029U (zh) 一种光模块
CN211603626U (zh) 一种光模块
CN114879321B (zh) 一种光模块
WO2022127594A1 (fr) Module optique
WO2022111034A1 (fr) Module optique
WO2022052842A1 (fr) Module optique
CN214278492U (zh) 一种光模块
CN212086203U (zh) 一种光模块
WO2023030457A1 (fr) Module optique
WO2024016905A1 (fr) Module optique et ensemble laser
WO2022193734A1 (fr) Module optique
CN217693343U (zh) 一种光模块
WO2022242309A1 (fr) Module optique
CN217766937U (zh) 一种光模块
US20220337022A1 (en) Light Emission Assembly and an Optical Module
CN217484550U (zh) 一种光模块及激光组件
CN215378933U (zh) 一种光模块
CN215416011U (zh) 一种光模块
WO2022105413A1 (fr) Module optique
WO2022116619A1 (fr) Module optique
CN115220160A (zh) 一种光模块
CN114624826A (zh) 一种光模块

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21905523

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21905523

Country of ref document: EP

Kind code of ref document: A1