WO2023030457A1 - Module optique - Google Patents

Module optique Download PDF

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Publication number
WO2023030457A1
WO2023030457A1 PCT/CN2022/116576 CN2022116576W WO2023030457A1 WO 2023030457 A1 WO2023030457 A1 WO 2023030457A1 CN 2022116576 W CN2022116576 W CN 2022116576W WO 2023030457 A1 WO2023030457 A1 WO 2023030457A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
sub
pad
frequency signal
signal line
Prior art date
Application number
PCT/CN2022/116576
Other languages
English (en)
Chinese (zh)
Inventor
曲一帆
张加傲
Original Assignee
青岛海信宽带多媒体技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202122127910.4U external-priority patent/CN215378933U/zh
Priority claimed from CN202122128022.4U external-priority patent/CN215416011U/zh
Application filed by 青岛海信宽带多媒体技术有限公司 filed Critical 青岛海信宽带多媒体技术有限公司
Priority to CN202280049975.6A priority Critical patent/CN117751311A/zh
Publication of WO2023030457A1 publication Critical patent/WO2023030457A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements

Definitions

  • the present disclosure relates to the technical field of optical communication, in particular to an optical module.
  • optical communication technology With the development of cloud computing, mobile Internet, video conferencing and other new business and application models, optical communication technology is becoming more and more important.
  • the optical module is a tool to realize the conversion between optical signals and electrical signals, and is one of the key components in optical communication equipment.
  • the transmission rate of the optical module continues to increase.
  • the optical module includes a casing, a digital signal processing chip, a circuit board and an optical transceiver chip assembly.
  • the circuit board is arranged in the casing.
  • the circuit board includes a first circuit board, a second circuit board, at least one groove, high frequency signal lines and via holes.
  • the digital signal processing chip is arranged on the first circuit board.
  • the second circuit board is stacked with the first circuit board.
  • the at least one groove is disposed on at least one of the first circuit board or the second circuit board, the at least one groove is configured to expose a portion of the second circuit board to form a connection area.
  • the high-frequency signal line is arranged on the second circuit board, and one end of the high-frequency signal line is located in the connection area.
  • the via hole runs through the first circuit board, and the other end of the high frequency signal line is electrically connected to the digital signal processing chip through the via hole.
  • the optical transceiver chip assembly is arranged on the second circuit board and located in the connection area, and the optical transceiver chip assembly is electrically connected to the one end of the high-frequency signal line.
  • the optical transceiver chip assembly is configured to receive an optical signal from outside the optical module or send out an optical signal.
  • Fig. 1 is a connection diagram of an optical communication system according to some embodiments
  • Fig. 2 is a structural diagram of an optical network terminal according to some embodiments.
  • Fig. 3 is a structural diagram of an optical module according to some embodiments.
  • Figure 4 is an exploded view of an optical module according to some embodiments.
  • FIG. 5 is a structural diagram of a circuit board, a digital signal processing chip and a light receiving device in an optical module according to some embodiments;
  • Fig. 6 is a partially enlarged view of circle A in Fig. 5;
  • Fig. 7 is a structural diagram of a digital signal processing chip according to some embodiments.
  • FIG. 8 is a top view of a circuit board, a digital signal processing chip, and a light receiving device in an optical module according to some embodiments;
  • FIG. 9 is a structural diagram of a circuit board in an optical module according to some embodiments.
  • FIG. 10 is a structural diagram of another circuit board in an optical module according to some embodiments.
  • FIG. 11 is a structural diagram of a circuit board, a digital signal processing chip, and a transimpedance amplifier in an optical module according to some embodiments;
  • FIG. 12 is a structural diagram of a first circuit board among circuit boards according to some embodiments.
  • Fig. 13 is a partially enlarged view of frame B in Fig. 12;
  • FIG. 14 is a structural diagram of a first sub-circuit board in a circuit board according to some embodiments.
  • Fig. 15 is a partially enlarged view of frame C in Fig. 14;
  • Fig. 16 is a structural diagram of another circuit board in an optical module according to some embodiments.
  • Fig. 17 is another structural diagram of a circuit board, a digital signal processing chip and a transimpedance amplifier in an optical module according to some embodiments;
  • FIG. 18 is a structural diagram of a third sub-circuit board in a circuit board according to some embodiments.
  • Fig. 19 is a partially enlarged view of frame D in Fig. 18;
  • Fig. 20 is a structural diagram of another circuit board in an optical module according to some embodiments.
  • Fig. 21 is another structural diagram of a circuit board, a digital signal processing chip and a transimpedance amplifier in an optical module according to some embodiments;
  • Fig. 22 is a structural diagram of another circuit board in an optical module according to some embodiments.
  • Fig. 23 is another structural diagram of a circuit board, a digital signal processing chip and a transimpedance amplifier in an optical module according to some embodiments;
  • Fig. 24 is a structural diagram of another circuit board in an optical module according to some embodiments.
  • Fig. 25 is another structural diagram of a circuit board, a digital signal processing chip and a transimpedance amplifier in an optical module according to some embodiments;
  • FIG. 26 is a schematic diagram of a return path of a high-frequency signal line in a circuit board according to some embodiments.
  • first and second are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as “first” and “second” may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality” means two or more.
  • connection may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other.
  • the term “connected” may also refer to two or more elements that are not in direct contact with each other, but yet still co-operate or interact with each other.
  • the embodiments disclosed herein are not necessarily limited by the context herein.
  • At least one of A, B and C has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, A and B A combination of A and C, a combination of B and C, and a combination of A, B and C.
  • a and/or B includes the following three combinations: A only, B only, and a combination of A and B.
  • parallel As used herein, “parallel”, “perpendicular”, and “equal” include the stated situation and the situation similar to the stated situation, the range of the similar situation is within the acceptable deviation range, wherein the The acceptable deviation ranges are as determined by one of ordinary skill in the art taking into account the measurement in question and errors associated with measurement of the particular quantity (ie, limitations of the measurement system).
  • optical communication technology In optical communication technology, light is used to carry information to be transmitted, and the optical signal carrying information is transmitted to information processing equipment such as a computer through optical fiber or optical waveguide and other information transmission equipment to complete the information transmission. Because optical signals have passive transmission characteristics when they are transmitted through optical fibers or optical waveguides, low-cost, low-loss information transmission can be achieved.
  • the signals transmitted by information transmission equipment such as optical fibers or optical waveguides are optical signals, while the signals that can be recognized and processed by information processing equipment such as computers are electrical signals. To establish an information connection between devices, it is necessary to realize the mutual conversion between electrical signals and optical signals.
  • Common information processing equipment includes routers, switches, and electronic computers.
  • the optical module realizes the mutual conversion function of the above-mentioned optical signal and electrical signal in the technical field of optical fiber communication.
  • the optical module includes an optical port and an electrical port.
  • the optical module realizes optical communication with information transmission equipment such as optical fiber or optical waveguide through the optical port, and realizes the electrical connection with the optical network terminal (such as an optical modem) through the electrical port.
  • I2C Inter-Integrated Circuit
  • Wi-Fi wireless fidelity technology
  • Fig. 1 is a connection diagram of an optical communication system according to some embodiments.
  • the optical communication system mainly includes a remote server 1000 , a local information processing device 2000 , an optical network terminal 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .
  • optical fiber 101 One end of the optical fiber 101 is connected to the remote server 1000 , and the other end is connected to the optical network terminal 100 through the optical module 200 .
  • Optical fiber itself can support long-distance signal transmission, such as signal transmission of several kilometers (6 kilometers to 8 kilometers). On this basis, if repeaters are used, theoretically unlimited distance transmission can be achieved. Therefore, in a common optical communication system, the distance between the remote server 1000 and the optical network terminal 100 can usually reach thousands of kilometers, tens of kilometers or hundreds of kilometers.
  • the local information processing device 2000 may be any one or more of the following devices: routers, switches, computers, mobile phones, tablet computers, televisions, and so on.
  • the physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing device 2000 and the optical network terminal 100 .
  • the connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103 ; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100 .
  • the optical network terminal 100 includes a substantially rectangular parallelepiped housing (housing), and an optical module interface 102 and a network cable interface 104 disposed on the housing.
  • the optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 establish a bidirectional electrical signal connection;
  • the network cable interface 104 is configured to access the network cable 103, so that the optical network terminal 100 and the network cable 103 A two-way electrical signal connection is established.
  • a connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100 .
  • the optical network terminal 100 transmits the electrical signal from the optical module 200 to the network cable 103, and transmits the electrical signal from the network cable 103 to the optical module 200. Therefore, the optical network terminal 100, as the host computer of the optical module 200, can monitor the optical module 200 jobs.
  • the host computer of the optical module 200 may also include an optical line terminal (Optical Line Terminal, OLT) and the like.
  • the optical module 200 includes an optical port and an electrical port.
  • the optical port is configured to access the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101; electrical signal connection.
  • the optical module 200 implements mutual conversion between optical signals and electrical signals, so that a connection is established between the optical fiber 101 and the optical network terminal 100 .
  • the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100
  • the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101 . Since the optical module 200 is a tool for realizing mutual conversion of photoelectric signals and does not have the function of processing data, the information does not change during the above photoelectric conversion process.
  • the remote server 1000 establishes a two-way signal transmission channel with the local information processing device 2000 through the optical fiber 101 , the optical module 200 , the optical network terminal 100 and the network cable 103 .
  • FIG. 2 is a structural diagram of an optical network terminal according to some embodiments.
  • the optical network terminal 100 also includes a circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the circuit board 105, a radiator 107 disposed on the cage 106, and an electrical circuit board disposed in the cage 106.
  • the electrical connector is configured to be connected to the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as a fin that increases the heat dissipation area.
  • the optical module 200 is inserted into the cage 106 of the optical network terminal 100, and the optical module 200 is fixed by the cage 106.
  • the heat generated by the optical module 200 is conducted to the cage 106, and then diffused through the radiator 107.
  • the electrical port of the optical module 200 is connected to the electrical connector in the cage 106 , so that the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100 .
  • the optical port of the optical module 200 is connected to the optical fiber 101 , so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101 .
  • Fig. 3 is a structural diagram of an optical module according to some embodiments
  • Fig. 4 is an exploded view of an optical module according to some embodiments.
  • the optical module 200 includes a housing (shell), a circuit board 300 disposed in the housing, a light emitting device 400 and a light receiving device 500 .
  • the casing includes an upper casing 201 and a lower casing 202, and the upper casing 201 is covered on the lower casing 202 to form the above casing with two openings.
  • the outer contour of the casing generally presents a square shape.
  • the lower case 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper case 201 includes a cover plate 2011, and the cover plate 2011 covers the lower case 202 on the two lower side panels 2022 to form the above-mentioned housing.
  • the lower case 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021;
  • the two upper side plates 2012 perpendicular to the cover plate 2011 are combined with the two lower side plates 2022 so as to cover the upper case 201 on the lower case 202 .
  • the direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200 , or may not be consistent with the length direction of the optical module 200 .
  • the opening 204 is located at the end of the optical module 200 (the right end in FIG. 3 ), and the opening 205 is also located at the end of the optical module 200 (the left end in FIG. 3 ).
  • the opening 204 is located at the end of the optical module 200
  • the opening 205 is located at the side of the optical module 200 .
  • the opening 204 is an electrical port, and the golden finger 309 of the circuit board 300 extends from the electrical port 204, and is inserted into the host computer (for example, the optical network terminal 100); the opening 205 is an optical port, configured to be connected to an external optical fiber 101, so that The optical fiber 101 connects the light emitting device 400 and the light receiving device 500 in the optical module 200 .
  • the combination of the upper housing 201 and the lower housing 202 is used to facilitate the installation of the circuit board 300, the light emitting device 400, the light receiving device 500 and other devices into the housing, and the upper housing 201 and the lower housing 202 support these device form package protection.
  • the upper housing 201 and the lower housing 202 support these device form package protection.
  • when assembling components such as the circuit board 300 , the light emitting device 400 and the light receiving device 500 it facilitates the deployment of positioning components, heat dissipation components, and electromagnetic shielding components of these components, which is conducive to automatic production.
  • the upper shell 201 and the lower shell 202 are generally made of metal materials, which is beneficial to realize electromagnetic shielding and heat dissipation.
  • the optical module 200 further includes an unlocking part 203 located on the outer wall of its housing, and the unlocking part 203 is configured to realize a fixed connection between the optical module 200 and the host computer, or release the connection between the optical module 200 and the host computer. fixed connection.
  • the unlocking component 203 is located on the outer walls of the two lower side panels 2022 of the lower casing 202 , and has an engaging component that matches the cage 106 of the upper computer.
  • the optical module 200 is inserted into the cage 106, the optical module 200 is fixed in the cage 106 by the engaging part of the unlocking part 203; when the unlocking part 203 is pulled, the engaging part of the unlocking part 203 moves accordingly, thereby changing the locking part
  • the connection relationship with the host computer is to release the engagement relationship between the optical module 200 and the host computer, so that the optical module 200 can be pulled out from the cage 106 .
  • the circuit board 300 includes circuit traces, electronic components and chips, etc.
  • the electronic components and chips are connected together according to the circuit design through the circuit traces, so as to realize functions such as power supply, electrical signal transmission and grounding.
  • the electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET).
  • the chip can include, for example, a Microcontroller Unit (MCU), a laser driver chip, a limiting amplifier (Limiting Amplifier), a clock data recovery chip (Clock and Data Recovery, CDR), a power management chip (Power Management Chip), a digital signal Processing (Digital Signal Processing, DSP) chip.
  • MCU Microcontroller Unit
  • a laser driver chip a laser driver chip
  • a limiting amplifier Liting Amplifier
  • CDR clock and Data Recovery
  • Power Management Chip Power Management Chip
  • DSP digital signal Processing
  • the circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function, such as the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the cage 106 of the host computer in the electrical connector.
  • Gold fingers 309 of the circuit board 300 are formed on the end surface thereof.
  • the gold finger 309 is composed of multiple independent pins.
  • the circuit board 300 is inserted into the cage 106 , and is conductively connected with the electrical connector in the cage 106 by the gold finger 309 .
  • the gold fingers 309 can be set on only one side of the circuit board 300 (such as the upper surface shown in FIG. 4 ), or can be set on the upper and lower sides of the circuit board 300, so as to meet the occasions requiring a large number of pins.
  • the golden finger 309 is configured to establish an electrical connection with the host computer to realize power supply, grounding, I2C signal transmission, data signal transmission and so on.
  • flexible circuit boards can also be used in some optical modules.
  • Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.
  • the optical module 200 further includes a first fiber adapter 600 , a second fiber adapter 700 , a first inner fiber 610 and a second inner fiber 710 .
  • the first fiber adapter 600 is connected to the light emitting device 400 through the first inner fiber 610
  • the second fiber adapter 700 is connected to the light receiving device 500 through the second inner fiber 710 .
  • the optical signal emitted by the light emitting device 400 is transmitted to the external optical fiber 101 through the first internal optical fiber 610 and the first optical fiber adapter 600 .
  • the optical signal received by the second optical fiber adapter 700 from the outside of the optical module 200 is transmitted to the optical receiving device 500 through the second internal optical fiber 710 .
  • the light emitting device 400 includes a laser chip, a first lens and a second lens.
  • the laser chip is configured to emit a laser beam
  • the first lens is configured to collimate the laser beam emitted by the laser chip
  • the second lens is configured to converge the laser beam collimated by the first lens. After the laser beam emitted by the laser chip is collimated by the first lens, the laser beam is converged by the second lens, and transmitted to the first optical fiber adapter 600 through the first internal optical fiber 610 to output an optical signal.
  • the light emitting device 400 may include multiple laser chips.
  • the light emitting device 400 may include a plurality of first lenses and a plurality of second lenses. The plurality of first lenses and the plurality of second lenses correspond to the plurality of laser chips respectively.
  • FIG. 5 is a structural diagram of a circuit board, a digital signal processing chip and a light receiving device in an optical module according to some embodiments.
  • FIG. 6 is a partially enlarged view of circle A in FIG. 5 .
  • the light receiving device 500 includes a light receiving chip 501 and a transimpedance amplifier 502 , and the light receiving chip 501 and the transimpedance amplifier 502 are arranged on the circuit board 300 .
  • the light receiving chip 501 is electrically connected to the transimpedance amplifier 502 .
  • the light receiving chip 501 is electrically connected to the transimpedance amplifier 502 through a gold wire.
  • the light receiving chip 501 is configured to convert an optical signal from outside the optical module 200 into an electrical signal.
  • the transimpedance amplifier 502 is configured to limit and amplify the electrical signal from the light receiving chip 501 .
  • the light receiving chip 501 includes a PIN photodiode or an avalanche photodiode (Avalanche Photon Diode, APD).
  • a PIN photodiode or an avalanche photodiode Avalanche Photon Diode, APD.
  • the transimpedance amplifier 502 includes an amplifier body 5020 and a first pad 5021 .
  • the first pad 5021 is disposed on the surface of the amplifier body 5020 away from the circuit board 300 .
  • the circuit board 300 includes a high-frequency signal line and a second pad 308 .
  • the second pad 308 is disposed close to the transimpedance amplifier 502 , and the second pad 308 is connected to the high frequency signal line.
  • the first pad 5021 is electrically connected to the second pad 308 through a wire bonding process.
  • the first pad 5021 is electrically connected to the second pad 308 through a connection wire 90 (as shown in FIG. 11 ). In this way, the transimpedance amplifier 502 is connected to the high-frequency signal line on the circuit board 300 through the first pad 5021 and the second pad 308 .
  • the first pad 5021 may be disposed at other positions of the amplifier body 5020 , for example, the bottom surface or the side surface of the amplifier body 5020 . This disclosure does not limit this.
  • the optical module 200 includes an optical transceiver chip assembly, and the optical transceiver chip assembly includes the above-mentioned laser chip, an optical receiving chip 501 and a transimpedance amplifier 502 .
  • the optical module 200 further includes a digital signal processing (Digital Signal Process, DSP) chip 800.
  • the digital signal processing chip 800 is disposed on the circuit board 300 , and the digital signal processing chip 800 is electrically connected to the transimpedance amplifier 502 through a high-frequency signal line. In this way, the electrical signal amplified by the transimpedance amplifier 502 can be transmitted to the digital signal processing chip 800 so that the digital signal processing chip 800 can process the electrical signal.
  • DSP Digital Signal Process
  • Fig. 7 is a structural diagram of a digital signal processing chip according to some embodiments.
  • the digital signal processing chip 800 includes a digital signal processing chip body 801, a first receiving pad 802, a second receiving pad 803, a first output pad 804, and a second output pad. Disk 805.
  • the first receiving pad 802, the second receiving pad 803, the first output pad 804 and the second output pad 805 are respectively arranged on the surface (the following surface) of the digital signal processing chip body 801 close to the circuit board 300, so that The digital signal processing chip 800 is electrically connected to the high frequency signal line on the circuit board 300 .
  • the first receiving pad 802 is configured to receive an electrical signal from the transimpedance amplifier 502 .
  • the second receiving pad 803 is configured to receive an electrical signal from the golden finger 309 .
  • the first output pad 804 is configured to provide a driving signal to the laser chip.
  • the second output pad 805 is configured to transmit the electrical signal processed by the digital signal processing chip 800 to the golden finger 309 .
  • connection pads corresponding to the pads of the digital signal processing chip 800 are provided on the circuit board 300 for electrical connection between the digital signal processing chip 800 and the high-frequency signal lines on the circuit board.
  • the bonding pads of the digital signal processing chip 800 may also be arranged on the bottom surface or the side surface of the digital signal processing chip body 801 . This disclosure does not limit this.
  • the first receiving pad 802 and the first output pad 804 are arranged close to the transimpedance amplifier 502 and the laser chip respectively, so as to connect the digital signal processing chip 800 with the transimpedance amplifier 502 and the laser chip electrical connection.
  • the second receiving pad 803 and the second output pad 805 are disposed close to the gold finger 309 on the circuit board 300 , so that the second receiving pad 803 and the second output pad 805 are electrically connected to the gold finger 309 .
  • the electrical signal received by the second receiving pad 803 is processed by the digital signal processing chip 800, it is transmitted to the laser chip through the first output pad 804 and the high-frequency signal line, thereby driving the laser chip to emit a laser beam.
  • the electrical signal received by the first receiving pad 802 is processed by the digital signal processing chip 800 , it is transmitted to the gold finger 309 through the second output pad 805 and the high-frequency signal line, and then transmitted to the host computer through the gold finger 309 .
  • Fig. 8 is a top view of a circuit board, a digital signal processing chip and a light receiving device in an optical module according to some embodiments.
  • the optical module 200 is an optical module with a high transmission rate, such as an 800G (signal transmission rate of 800Gbit/s) optical module.
  • the light receiving device 500 includes a first sub-light receiving device 510 and a second sub-light receiving device 520 .
  • the first sub-light receiving device 510 and the second sub-light receiving device 520 are respectively disposed on two sides of the circuit board 300 along the width direction of the optical module 200 (direction MN as shown in FIG. 4 ).
  • the first sub-light receiving device 510 includes a first sub-light receiving chip and a first sub-transimpedance amplifier
  • the second sub-light receiving device 520 includes a second sub-light receiving chip and a second sub-transimpedance amplifier.
  • the high-frequency signal lines include a first part of high-frequency signal lines and a second part of high-frequency signal lines.
  • the first sub-transimpedance amplifier and the second sub-transimpedance amplifier are electrically connected to the digital signal processing chip 800 through high-frequency signal lines (a first part of high-frequency signal lines and a second part of high-frequency signal lines).
  • the high-frequency signal lines are arranged on the surface of the circuit board 300 (the upper surface of the circuit board 300 as shown in FIG. 4 ) in the form of microstrip lines.
  • the light receiving chip 501 , the transimpedance amplifier 502 and the digital signal processing chip 800 are respectively arranged on the surface of the circuit board 300 . Due to the limited space on the surface of the circuit board 300, the high-frequency signal lines between the transimpedance amplifier 502 and the digital signal processing chip 800 cannot all be arranged on the surface of the circuit board 300 in the form of a microstrip line (Microstrip Line), A part of the high-frequency signal line is arranged inside the circuit board 300 in the form of a stripline (Stripline), and the other part is arranged on the surface of the circuit board 300 to be electrically connected with the transimpedance amplifier 502 and the digital signal processing chip 800, increasing Discontinuous impedance points on the high-frequency signal line affect the stability of high-frequency signal transmission.
  • Microstrip Line microstrip line
  • Stripline stripline
  • the other part is arranged on the surface of the circuit board 300 to be electrically connected with the transimpedance amplifier 502 and the digital signal processing chip 800, increasing Discontinuous
  • the microstrip line refers to a microwave transmission line composed of a single conductor strip disposed on a dielectric substrate.
  • the stripline refers to a transmission line composed of two grounding metal strips and a conductor strip arranged in the middle of the grounding metal strips, and the cross section of the conductor strip is rectangular.
  • the circuit board 300 includes a first circuit board 301 and a second circuit board 302 , and the first circuit board 301 and the second circuit board 302 are stacked.
  • the second circuit board 302 is provided with a high-frequency signal line
  • the transimpedance amplifier 502 is provided on the second circuit board 302 .
  • the transimpedance amplifier 502 is disposed on a side of the second circuit board 302 close to the first circuit board 301 .
  • the transimpedance amplifier 502 is electrically connected to the high-frequency signal line on the second circuit board 302 .
  • the high-frequency signal line on the second circuit board 302 is electrically connected with the transimpedance amplifier 502
  • the high-frequency signal line does not need to be transferred to the first circuit board 301, reducing the high-frequency signal line from the first circuit board 301.
  • the discontinuous impedance point to the second circuit board 302 improves the stability of high-frequency signal transmission.
  • the high-frequency signal lines disposed on the second circuit board 302 are disposed in the form of strip lines.
  • Fig. 9 is a structural diagram of a circuit board in an optical module according to some embodiments.
  • the circuit board 300 includes two grooves 310 .
  • the two grooves 310 are disposed on the surface of the first circuit board 301 away from the lower casing 202 , and respectively extend toward the direction close to the second circuit board 302 , so that a part of the second circuit board 302 is exposed.
  • the first sub-transimpedance amplifier and the second sub-transimpedance amplifier can be respectively arranged on the second circuit board 302 through two grooves 310.
  • the light receiving chip 501 and the transimpedance amplifier 502 can be disposed in the groove 310 .
  • the circuit board 300 includes a second pad 308 .
  • the second pad 308 is disposed on the second circuit board 302 and located in the groove 310 .
  • a part of the second pads 308 is connected to the first sub-transimpedance amplifier, and another part of the second pads 308 is connected to the second sub-transimpedance amplifier.
  • the first sub-transimpedance amplifier and the second sub-transimpedance amplifier can be connected to the high-frequency signal line (stripline) on the second circuit board 302 through the second pad 308 .
  • one end of the high-frequency signal line disposed on the second circuit board 302 is electrically connected to the transimpedance amplifier 502 , and the other end is electrically connected to the digital signal processing chip 800 disposed on the first circuit board 301 .
  • one end of the high-frequency signal line provided on the second circuit board 302 is electrically connected to the second pad 308 , and the other end is electrically connected to the digital signal processing chip 800 .
  • the high-frequency electrical signal output by the transimpedance amplifier 502 can be transmitted to the digital signal processing chip 800 through the high-frequency signal line, so that the digital signal processing chip 800 can process the high-frequency signal.
  • Fig. 10 is a structural diagram of another circuit board in an optical module according to some embodiments.
  • the circuit board 300 includes a first via hole 31 .
  • the first via hole 31 runs through the first circuit board 301 , and the first via hole 31 is filled with a conductive medium (such as copper).
  • the digital signal processing chip 800 is electrically connected to the high-frequency signal line provided on the second circuit board 302 through the first via hole 31 .
  • the first receiving pad 802 of the digital signal processing chip 800 is electrically connected to the high-frequency signal line on the second circuit board 302 through the first via hole 31, so that the electrical signal transmitted by the transimpedance amplifier 502 passes through the high-frequency signal line transmitted to the digital signal processing chip 800. In this way, the electrical connection between the digital signal processing chip 800 and the high-frequency signal line on the second circuit board 302 can be facilitated by providing the first via hole 31 .
  • the foregoing mainly takes the optical module 200 including two optical transceiver chip assemblies as an example for description.
  • the optical module 200 may also include one, three or more optical transceiver chip components, which is not limited in the present disclosure.
  • the optical module 200 includes a transimpedance amplifier 502 and the circuit board 300 includes a groove 310 as an example for illustration.
  • Fig. 11 is a structural diagram of a circuit board, a digital signal processing chip and a transimpedance amplifier in an optical module according to some embodiments.
  • the second circuit board 302 includes a first sub-circuit board 3022 .
  • the first circuit board 301 is stacked with the first sub-circuit board 3022 , and the first circuit board 301 is located on a side (such as an upper side) of the first sub-circuit board 3022 away from the lower casing 202 .
  • the groove 310 includes a first groove 3010
  • the circuit board 300 further includes a first region 3011 and a first high-frequency signal line 3014 (as shown in FIG. 14 ).
  • the first groove 3010 is arranged on the surface (such as the upper surface) of the first circuit board 301 away from the first sub-circuit board 3022, and the first groove 3010 is recessed towards the direction close to the first sub-circuit board 3022, so that the first sub-circuit board 3022 A part of the circuit board 3022 is exposed, thereby forming the first region 3011 .
  • the first high-frequency signal line 3014 is disposed on the first sub-circuit board 3022 . One end of the first high-frequency signal line 3014 is located in the first region 3011 and is electrically connected to the transimpedance amplifier 502 , and the other end is electrically connected to the digital signal processing chip 800 .
  • FIG. 12 is a structural diagram of a first circuit board among circuit boards according to some embodiments, and FIG. 13 is a partially enlarged view of block B in FIG. 12 .
  • FIG. 14 is a structural diagram of a first sub-circuit board in a circuit board according to some embodiments, and FIG. 15 is a partial enlarged view of block C in FIG. 14 .
  • the circuit board 300 further includes a third pad 303 .
  • the third pad 303 is disposed on the first circuit board 301 and corresponds to the first receiving pad 802 of the digital signal processing chip 800 .
  • the third pad 303 is connected to the first receiving pad 802 of the digital signal processing chip 800 .
  • the circuit board 300 further includes a fourth pad 304 .
  • the fourth pad 304 is disposed on the first sub-circuit board 3022 , and the fourth pad 304 corresponds to the third pad 303 , so that the third pad 303 is connected to the fourth pad 304 through the first via hole 31 .
  • the orthographic projection of the third pad 303 on the first sub-circuit board 3022 coincides with the orthographic projection of the fourth pad 304 on the first sub-circuit board 3022 .
  • the first via hole 31 is disposed through the first circuit board 301 .
  • the transimpedance amplifier 502 is disposed on the first sub-circuit board 3022 and located in the first region 3011 .
  • a part of the transimpedance amplifier 502 eg, the part of the transimpedance amplifier 502 away from the first sub-circuit board 3022 in FIG. 11 ) is exposed through the first groove 3010 .
  • the part of the transimpedance amplifier 502 away from the first sub-circuit board 3022 may protrude from the upper surface of the first circuit board 301 .
  • the part of the transimpedance amplifier 502 away from the first sub-circuit board 3022 may also be flush with the upper surface of the first circuit board 301 .
  • the part of the transimpedance amplifier 502 away from the first sub-circuit board 3022 is lower than the upper surface of the first circuit board 301 .
  • the second pad 308 connected to the first pad 5021 of the transimpedance amplifier 502 is disposed on the first sub-circuit board 3022 and located in the first region 3011 .
  • One end of the first high-frequency signal line 3014 on the first sub-circuit board 3022 is connected to the second pad 308 , and the other end is connected to the fourth pad 304 .
  • the transimpedance amplifier 502 can pass through the first pad 5021, the second pad 308, the first high-frequency signal line 3014, the fourth pad 304, the first via hole 31 and the third pad 303, and the digital signal in sequence.
  • the processing chip 800 is electrically connected.
  • the first high-frequency signal line 3014 is arranged on the first sub-circuit board 3022 in the form of a strip line.
  • the stripline will not be affected by the electromagnetic interference (Electromagnetic Interference, EMI) of the outside air, and the stripline will not radiate energy, which is conducive to improving the electromagnetic compatibility (Electromagnetic Compatibility, EMC).
  • EMC Electromagnetic Compatibility
  • the stripline first high frequency signal line 3014 can avoid the glue dispensing area of the transimpedance amplifier 502 , preventing the glue from affecting the impedance of the first high frequency signal line 3014 .
  • the circuit board 300 further includes a first ground wire.
  • the first ground line is disposed on a side of the first circuit board 301 close to the first sub-circuit board 3022 to form a reference ground plane.
  • the first ground wire can be used as the return path of the first high-frequency signal wire 3014 on the first sub-circuit board 3022, so that the magnetic flux in the circuit board 300 can be canceled, thereby ensuring the high voltage on the first sub-circuit board 3022. Stability of frequency signal transmission.
  • the return path (such as the first ground line) is parallel to and close to the corresponding signal path (such as the first high-frequency signal line 3014), the direction of the magnetic field of the return path is opposite to that of the signal path. . In this way, the magnetic field of the return path and the magnetic field of the signal path can cancel each other, thereby achieving the effect of magnetic flux cancellation.
  • circuit board 300 including a two-layer circuit board as an example for illustration.
  • circuit board 300 may include a three or more layer circuit board.
  • Fig. 16 is a structural diagram of another circuit board in an optical module according to some embodiments
  • Fig. 17 is another structural diagram of a circuit board, a digital signal processing chip and a transimpedance amplifier in an optical module according to some embodiments.
  • the second circuit board 302 further includes a second sub-circuit board 3023 and a third sub-circuit board 3024 .
  • the first circuit board 301 , the first sub-circuit board 3022 , the second sub-circuit board 3023 and the third sub-circuit board 3024 are stacked in sequence along a direction close to the lower casing 202 (from top to bottom).
  • the circuit board 300 further includes a second high-frequency signal line 3015 (as shown in FIG. 18 ).
  • the second high-frequency signal line 3015 is disposed on the third sub-circuit board 3024 .
  • One end of the second high-frequency signal line 3015 is electrically connected to the transimpedance amplifier 502 , and the other end is electrically connected to the digital signal processing chip 800 .
  • the circuit board 300 further includes a second via hole 32 and a third via hole 33 .
  • the second via hole 32 runs through the first circuit board 301 , the first sub-circuit board 3022 and the second sub-circuit board 3023 in sequence
  • the third via hole 33 runs through the first sub-circuit board 3022 and the second sub-circuit board 3023 in sequence.
  • the second via hole 32 and the third via hole 33 are filled with a conductive medium (such as copper), one end of the second high frequency signal line 3015 is connected to the transimpedance amplifier 502 through the third via hole 33, and the other end is passed through the second via hole 32 is connected with the digital signal processing chip 800.
  • the circuit board 300 further includes a fifth pad 305 , and the fifth pad 305 is disposed on the first sub-circuit board 3022 .
  • the first pad 5021 of the transimpedance amplifier 502 includes a first sub-pad 5022 and a second sub-pad 5023
  • the second pad 308 includes a third sub-pad 3081 and a fourth sub-pad 3082.
  • the third sub-pad 3081 and the fourth sub-pad 3082 are disposed within the first region 3011 .
  • the first sub-pad 5022 is connected to the third sub-pad 3081
  • the second sub-pad 5023 is connected to the fourth sub-pad 3082 .
  • the first high-frequency signal line 3014 includes a first sub-high-frequency signal line 3017 and a second sub-high-frequency signal line 3018 .
  • One end of the first sub-high frequency signal line 3017 is connected to the third sub-pad 3081 , and the other end is connected to the fourth pad 304 .
  • One end of the second sub-high frequency signal line 3018 is connected to the fourth sub-pad 3082 , and the other end is connected to the fifth pad 305 .
  • Fig. 18 is a structural diagram of a third sub-circuit board in a circuit board according to some embodiments
  • Fig. 19 is a partial enlarged view of block D in Fig. 18
  • the circuit board 300 further includes a sixth pad 306 and a seventh pad 307 .
  • the sixth pad 306 and the seventh pad 307 are respectively disposed on the third sub-circuit board 3024 , and the sixth pad 306 is electrically connected to the seventh pad 307 through the second high-frequency signal line 3015 .
  • the sixth pad 306 is set corresponding to the fifth pad 305
  • the seventh pad 307 is set corresponding to the third pad 303 .
  • the orthographic projection of the fifth pad 305 on the third sub-circuit board 3024 coincides with the orthographic projection of the sixth pad 306 on the third sub-circuit board 3024
  • the third pad 303 is on the third sub-circuit board 3024
  • the orthographic projection of is coincident with the orthographic projection of the seventh pad 307 on the third sub-circuit board 3024 .
  • the fifth pad 305 can be electrically connected to the sixth pad 306 through the third via hole 33 .
  • the third pad 303 can be electrically connected to the seventh pad 307 through the second via hole 32, so that the transimpedance amplifier 502 can be electrically connected to the digital signal processing chip 800 through the first high-frequency signal line 3014 and the second high-frequency signal line 3015. connected for the transmission of electrical signals.
  • the distance between the fourth pad 304 and the transimpedance amplifier 502 is different from the distance between the fifth pad 305 and the transimpedance amplifier 502 .
  • the distance between the fourth pad 304 and the transimpedance amplifier 502 is greater than the distance between the fifth pad 305 and the transimpedance amplifier 502, so as to avoid connecting the first sub-high frequency signal line 3017 from affecting the connection of the second sub-high frequency Routing of the signal line 3018.
  • high-frequency signals are jointly transmitted through the high-frequency signal lines on the first sub-circuit board 3022 and the third sub-circuit board 3024, which can avoid setting more first sub-circuit boards 3022 on the first sub-circuit board 3022
  • the high-frequency signal line 3014 avoids crosstalk of high-frequency signals, and facilitates the stability of signal transmission of optical modules with high transmission rates (such as 800G optical modules). Moreover, it can reduce the discontinuous impedance points when the high-frequency signal line passes from the first circuit board 301 to the second circuit board 302, improve the impedance uniformity of the high-frequency signal line, and improve the stability of high-frequency signal transmission.
  • the above description mainly takes the transimpedance amplifier 502 and the second pad 308 disposed on the same layer of circuit board as an example for description.
  • some embodiments of the present disclosure are not limited thereto.
  • Fig. 20 is a structural diagram of another circuit board in an optical module according to some embodiments
  • Fig. 21 is another structural diagram of a circuit board, a digital signal processing chip and a transimpedance amplifier in an optical module according to some embodiments.
  • the second circuit board 302 includes a first sub-circuit board 3022 and a second sub-circuit board 3023 .
  • the second sub-circuit board 3023 , the first sub-circuit board 3022 and the first circuit board 301 are sequentially stacked along a direction away from the lower casing 202 (from bottom to top).
  • the groove 310 further includes a second groove 3020
  • the circuit board 300 further includes a second region 3012 .
  • the first groove 3010 communicates with the second groove 3020 .
  • the second groove 3020 is arranged on the surface (such as the upper surface) of the first sub-circuit board 3022 close to the first circuit board 301, and is recessed toward the direction close to the second sub-circuit board 3023, so that a part of the second sub-circuit board 3023 exposed to form the second region 3012 .
  • the area of the orthographic projection of the first groove 3010 on the first circuit board 301 is greater than the area of the orthographic projection of the second groove 3020 on the first circuit board 301, so that a part of the first sub-circuit board 3022 is exposed to form a second groove 3020.
  • One area 3011 For example, the size of the first groove 3010 in the length direction of the circuit board 300 (the KL direction shown in FIG. 20 ) is greater than the size of the second groove 3020 in the length direction of the circuit board 300 .
  • the transimpedance amplifier 502 is disposed on the second sub-circuit board 3023 and located in the second area 3012 .
  • the second pad 308 corresponding to the first pad 5021 of the transimpedance amplifier 502 is disposed within the first region 3011 .
  • One end of the first high-frequency signal line 3014 on the first sub-circuit board 3022 is connected to the second pad 308 , and the other end is electrically connected to the digital signal processing chip 800 through the first via hole 31 .
  • the transimpedance amplifier 502 can be electrically connected with the digital signal processing chip 800 to transmit electrical signals.
  • the distance between the first pad 5021 and the second pad 308 on the transimpedance amplifier 502 can be shortened.
  • the length of the connecting wire 90 is
  • the surface (such as the upper surface) of the transimpedance amplifier 502 disposed in the second region 3012 away from the second region 3012 may protrude from the upper surface of the first sub-circuit board 3022, or may be connected to the first sub-circuit board 3022.
  • the upper surface of the sub-circuit board 3022 is even, or the height of the upper surface of the transimpedance amplifier 502 can also be lower than the height of the upper surface of the first sub-circuit board 3022, as long as the first pad 5021 on the transimpedance amplifier 502 can It only needs to be connected to the second pad 308 in the first region 3011 through a wire bonding process.
  • Fig. 22 is a structural diagram of another circuit board in an optical module according to some embodiments
  • Fig. 23 is another structural diagram of a circuit board, a digital signal processing chip and a transimpedance amplifier in an optical module according to some embodiments.
  • the groove 310 further includes a third groove 3030 .
  • the third groove 3030 is disposed on the surface (such as the upper surface) of the second sub-circuit board 3023 close to the first sub-circuit board 3022, and is recessed in a direction away from the second groove 3020.
  • the size of the third groove 3030 is the same as that of the second groove 3020, and the third groove 3030 communicates with the first groove 3010 and the second groove 3020, so that a part of the second sub-circuit board 3023 is exposed, thereby A second region 3012 is formed.
  • the transimpedance amplifier 502 is disposed on the second sub-circuit board 3023 and located in the second area 3012 .
  • the depth of the third groove 3030 the height difference between the upper surface of the transimpedance amplifier 502 and the upper surface of the first sub-circuit board 3022 can be adjusted, so that the upper surface of the transimpedance amplifier 502 and the first sub-circuit board 3022
  • the upper surface of the upper surface of the transimpedance amplifier 502 is flush or substantially flush, so as to reduce the height difference between the first pad 5021 on the transimpedance amplifier 502 and the first sub-circuit board 3022, thereby shortening the first pad 5021 on the transimpedance amplifier 502 and the first sub-circuit board 3022.
  • connection structure between the transimpedance amplifier 502 and the digital signal processing chip 800 has been described above, and will not be repeated here.
  • Fig. 24 is a structural diagram of another circuit board in an optical module according to some embodiments
  • Fig. 25 is another structural diagram of a circuit board, a digital signal processing chip and a transimpedance amplifier in an optical module according to some embodiments.
  • the second circuit board 302 includes a first sub-circuit board 3022 , a second sub-circuit board 3023 and a third sub-circuit board 3024 .
  • the first circuit board 301 , the first sub-circuit board 3022 , the second sub-circuit board 3023 and the third sub-circuit board 3024 are stacked in sequence along a direction close to the lower casing 202 .
  • the circuit board 300 also includes a third area 3013 .
  • the transimpedance amplifier 502 is disposed on the third sub-circuit board 3024 and located in the third area 3013 .
  • the first groove 3010 communicates with the second groove 3020 .
  • the size of the first groove 3010 in the length direction of the circuit board 300 is greater than the size of the second groove 3020 in the length direction of the circuit board 300 , so that a part of the first sub-circuit board 3022 is exposed to form the first region 3011 .
  • the size of the second groove 3020 is the same as that of the third groove 3030, and the third groove 3030 communicates with the second groove 3020 and the first groove 3010, so that a part of the third sub-circuit board 3024 is exposed, thereby forming The third area 3013.
  • the third sub-pad 3081 is disposed in the first region 3011 and corresponds to the first sub-pad 5022 of the transimpedance amplifier 502 .
  • the fourth sub-pad 3082 is disposed in the third region 3013 and corresponds to the second sub-pad 5023 of the transimpedance amplifier 502 .
  • One end of the first high-frequency signal line 3014 on the first sub-circuit board 3022 is connected to the third sub-pad 3081 , and the other end is connected to the digital signal processing chip 800 through the fourth pad 304 and the first via hole 31 .
  • One end of the second high-frequency signal line 3015 on the third sub-circuit board 3024 is connected to the fourth sub-pad 3082 , and the other end is connected to the digital signal processing chip 800 through the seventh pad 307 and the second via hole 32 .
  • the transimpedance amplifier 502 can be electrically connected to the digital signal processing chip 800 through the high-frequency signal lines on the first sub-circuit board 3022 and the third sub-circuit board 3024 .
  • the transimpedance amplifier 502 can be electrically connected to different circuit boards by disposing the second pads 308 on different circuit boards.
  • the transimpedance amplifier 502 can jointly transmit high-frequency signals through the high-frequency signal lines on the first sub-circuit board 3022 and the third sub-circuit board 3024, which can avoid setting more high-frequency signals on the first sub-circuit board 3022 Line, avoid high-frequency signal crosstalk, and facilitate the stability of signal transmission of optical modules with high transmission rates (such as 800G optical modules).
  • it can reduce the discontinuous impedance points of the high-frequency signal line from the first circuit board 301 to the second circuit board 302, improve the impedance uniformity of the high-frequency signal line, and improve the stability of high-frequency signal transmission.
  • FIG. 26 is a schematic diagram of a return path of a high-frequency signal line in a circuit board according to some embodiments.
  • the circuit board 300 includes a second ground line.
  • the second ground line is arranged on the second sub-circuit board 3023 between the first sub-circuit board 3022 and the third sub-circuit board 3024, so that the high-frequency signal line on the first sub-circuit board 3022 is connected to the first sub-circuit board 3024.
  • the two ground wires form a return path, and the high-frequency signal line on the third sub-circuit board 3024 and the second ground wire form a return path.
  • the first sub-circuit board 3022 and the third sub-circuit board 3024 form multiple return paths through the second sub-circuit board 3023 between them, so as to cancel the magnetic flux and reduce electromagnetic interference.
  • the foregoing mainly takes the transimpedance amplifier 502 disposed on the second circuit board 302 as an example for description.
  • the laser chip in the light emitting device 400 can also be arranged on the second circuit board 302 .
  • the circuit board 300 includes a fourth groove.
  • the fourth groove is disposed on a surface (such as an upper surface) of the first circuit board 301 away from the lower casing 202, and extends towards the direction close to the second circuit board 302, so that a part of the second circuit board 302 is exposed.
  • the laser chip can be disposed on the second circuit board 302 through the fourth groove, and be electrically connected to the high-frequency signal line on the second circuit board 302 .
  • the laser chip includes a laser chip body and an eighth pad.
  • the eighth pad is disposed on the surface of the laser chip body close to the second circuit board 302 (the lower surface). In the case that the laser chip is arranged in the fourth groove, the eighth pad can be located on the second circuit board 302, so that the laser chip can be connected to the second circuit through the eighth pad.
  • the high-frequency signal lines (strip lines) on the board 302 are electrically connected.
  • the high-frequency signal lines disposed on the second circuit board 302 further include a third part of high-frequency signal lines.
  • the third part of high-frequency signal lines is arranged on the second circuit board 302 in the form of strip lines.
  • One end of the third part of the high-frequency signal line is electrically connected to the eighth pad, and the other end is electrically connected to the digital signal processing chip 800 through the first via hole 31, so that the high-frequency signal output by the digital signal processing chip 800 is passed through the eighth pad.
  • the three parts of the high-frequency signal line are transmitted to the laser chip to drive the laser chip to emit a laser beam.
  • the circuit board 300 may also include multiple fourth grooves.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

L'invention concerne un module optique (200), comprenant un boîtier, une puce de traitement de signal numérique (800), une carte de circuit imprimé (300) et un ensemble puce d'émetteur-récepteur optique (500). La carte de circuit imprimé (300) comprend une première carte de circuit imprimé (301), une seconde carte de circuit imprimé (302), au moins une rainure (310), une ligne de signal haute fréquence et un trou d'interconnexion. La puce de traitement de signal numérique (800) est disposée sur la première carte de circuit imprimé (301). La ou les rainures (310) sont agencées sur au moins l'une de la première carte de circuit imprimé (301) ou de la seconde carte de circuit imprimé (302), et sont configurées pour exposer une partie de la seconde carte de circuit imprimé (302) de façon à former une région de connexion. Une extrémité de la ligne de signal haute fréquence est située dans la région de connexion, et l'autre extrémité est électriquement connectée à la puce de traitement de signal numérique (800) au moyen du trou d'interconnexion. L'ensemble puce d'émetteur-récepteur optique (500) est disposée sur la seconde carte de circuit imprimé (302) et est située dans la région de connexion, et l'ensemble puce d'émetteur-récepteur optique (500) est électriquement connecté à une extrémité de la ligne de signal haute fréquence.
PCT/CN2022/116576 2021-09-03 2022-09-01 Module optique WO2023030457A1 (fr)

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CN202122127910.4U CN215378933U (zh) 2021-09-03 2021-09-03 一种光模块
CN202122127910.4 2021-09-03
CN202122128022.4U CN215416011U (zh) 2021-09-03 2021-09-03 一种光模块
CN202122128022.4 2021-09-03

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CN116243439A (zh) * 2023-03-23 2023-06-09 成都光创联科技有限公司 附带有柔性电路板的光器件外壳及其制备方法

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CN113179131A (zh) * 2021-04-22 2021-07-27 青岛海信宽带多媒体技术有限公司 一种光模块
CN215378933U (zh) * 2021-09-03 2021-12-31 青岛海信宽带多媒体技术有限公司 一种光模块
CN215416011U (zh) * 2021-09-03 2022-01-04 青岛海信宽带多媒体技术有限公司 一种光模块

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JP2004012672A (ja) * 2002-06-05 2004-01-15 Hitachi Cable Ltd 光送受信モジュール
CN103533749A (zh) * 2013-10-31 2014-01-22 华为技术有限公司 功率放大器电路板及其制造方法
CN111239935A (zh) * 2020-03-19 2020-06-05 青岛海信宽带多媒体技术有限公司 光模块
CN113179131A (zh) * 2021-04-22 2021-07-27 青岛海信宽带多媒体技术有限公司 一种光模块
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CN116243439B (zh) * 2023-03-23 2024-01-23 成都光创联科技有限公司 附带有柔性电路板的光器件外壳及其制备方法

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