WO2022052842A1 - Module optique - Google Patents

Module optique Download PDF

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Publication number
WO2022052842A1
WO2022052842A1 PCT/CN2021/115887 CN2021115887W WO2022052842A1 WO 2022052842 A1 WO2022052842 A1 WO 2022052842A1 CN 2021115887 W CN2021115887 W CN 2021115887W WO 2022052842 A1 WO2022052842 A1 WO 2022052842A1
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WO
WIPO (PCT)
Prior art keywords
pin
laser
metal
optical
pins
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Application number
PCT/CN2021/115887
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English (en)
Chinese (zh)
Inventor
杨世海
张晓磊
庞广宁
陈金磊
Original Assignee
青岛海信宽带多媒体技术有限公司
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Publication of WO2022052842A1 publication Critical patent/WO2022052842A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements

Definitions

  • the present disclosure relates to the technical field of optical communication, and in particular, to an optical module.
  • the optical module is a tool for realizing the mutual conversion of photoelectric signals, and it is one of the key components in optical communication equipment. And with the rapid development of 5G networks, optical modules in the core position of optical communication have developed by leaps and bounds.
  • An embodiment of the present disclosure provides an optical module, including: a metal casing; an optical fiber adapter, which is electrically connected to the metal casing; a round and square tube body, which is electrically connected to the optical fiber adapter and provided with a nozzle; an optical emission sub-module, including a metal pipe
  • the metal socket is electrically connected to the square tube body; the metal socket is provided with a grounding pin and a grounding pin through hole, wherein: the grounding pin penetrates from the bottom surface of the metal socket to the metal through the grounding pin through hole On the top surface of the socket, a gap is arranged between the grounding pin and the through hole of the grounding pin, and an insulating medium is arranged in the gap; a laser is arranged on the metal socket, and the grounding end of the laser is connected with the grounding pin.
  • Fig. 1 is a schematic diagram of the connection relationship of optical communication terminals
  • FIG. 2 is a schematic structural diagram of an optical network terminal
  • FIG. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure.
  • FIG. 4 is a schematic diagram of an exploded structure of an optical module according to an embodiment of the present disclosure.
  • FIG. 5 is a schematic diagram of an internal structure of an optical module according to an embodiment of the present disclosure.
  • FIG. 6 is a schematic structural diagram of a light emission sub-module according to an embodiment of the present disclosure.
  • FIG. 7 is a schematic structural diagram of a heat sink provided by an embodiment of the present disclosure.
  • FIG. 8 is a schematic structural diagram of a heat sink provided by an embodiment of the present disclosure from another perspective;
  • FIG. 9 is a schematic layout diagram of each pin according to an embodiment of the present disclosure.
  • One of the core links of optical fiber communication is the mutual conversion of optical and electrical signals.
  • Optical fiber communication uses information-carrying optical signals to transmit in information transmission equipment such as optical fibers/optical waveguides.
  • the passive transmission characteristics of light in optical fibers/optical waveguides can realize low-cost, low-loss information transmission; while computers and other information processing equipment Electrical signals are used.
  • the optical module realizes the mutual conversion function of the above-mentioned optical and electrical signals in the technical field of optical fiber communication, and the mutual conversion of the optical signal and the electrical signal is the core function of the optical module.
  • the optical module realizes the electrical connection with the external host computer through the gold finger on its internal circuit board.
  • the main electrical connections include power supply, I2C signal, data information and grounding, etc.
  • the electrical connection realized by the gold finger has become the optical module.
  • the mainstream connection method of the industry based on this, the definition of pins on the gold finger has formed a variety of industry protocols/norms.
  • FIG. 1 is a schematic diagram of a connection relationship of an optical communication terminal.
  • the connection of the optical communication terminal mainly includes the interconnection between the optical network terminal 100 , the optical module 200 , the optical fiber 101 and the network cable 103 .
  • One end of the optical fiber 101 is connected to the remote server, and one end of the network cable 103 is connected to the local information processing device.
  • the connection between the local information processing device and the remote server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by The optical network terminal 100 with the optical module 200 is completed.
  • the optical port of the optical module 200 is externally connected to the optical fiber 101, and a two-way optical signal connection is established with the optical fiber 101;
  • the electrical port of the optical module 200 is externally connected to the optical network terminal 100, and a two-way electrical signal connection is established with the optical network terminal 100;
  • the optical module internally realizes the mutual conversion of optical signals and electrical signals, so as to establish an information connection between the optical fiber and the optical network terminal.
  • the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input into the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input into the optical fiber .
  • the optical network terminal has an optical module interface 102, which is used to access the optical module 200 and establish a two-way electrical signal connection with the optical module 200; Signal connection; the connection between the optical module 200 and the network cable 103 is established through the optical network terminal 100 .
  • the optical network terminal transmits the signal from the optical module to the network cable, and transmits the signal from the network cable to the optical module, and the optical network terminal serves as the upper computer of the optical module to monitor the operation of the optical module.
  • the remote server has established a two-way signal transmission channel with the local information processing equipment through optical fibers, optical modules, optical network terminals and network cables.
  • Common information processing equipment includes routers, switches, electronic computers, etc.; the optical network terminal is the host computer of the optical module, providing data signals to the optical module and receiving data signals from the optical module.
  • FIG. 2 is a schematic structural diagram of an optical network terminal.
  • the optical network terminal in the optical communication terminal of the foregoing embodiment will be described below with reference to FIG. 2; as shown in FIG. 2, the optical network terminal 100 includes a circuit board 105, and a cage 106 is provided on the surface of the circuit board 105;
  • the electrical connector is used to connect to the electrical port of the optical module such as gold finger;
  • the cage 106 is provided with a radiator 107 , and the radiator 107 has raised parts such as fins to increase the heat dissipation area.
  • the optical module 200 is inserted into the optical network terminal 100 , the electrical port of the optical module is inserted into the electrical connector inside the cage 106 , and the optical port of the optical module is connected to the optical fiber 101 .
  • the cage 106 is located on the circuit board, and the electrical connectors on the circuit board are wrapped in the cage, so that the interior of the cage is provided with electrical connectors; the optical module is inserted into the cage, the optical module is fixed by the cage, and the heat generated by the optical module is conducted to the cage. 106 and then diffuse through a heat sink 107 on the cage.
  • FIG. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure
  • FIG. 4 is a schematic structural diagram of an exploded structure of the optical module.
  • the optical module in the optical communication terminal of the foregoing embodiment will be described below with reference to FIG. 3 and FIG. 4 ; as shown in FIG. 3 and FIG.
  • the upper casing 201 is covered with the lower casing 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity generally presents a square body.
  • the lower case 202 includes a main board and two side plates located on both sides of the main board and perpendicular to the main board; the upper case includes a cover plate, and the cover plate covers the two side plates of the upper case. the side plate to form a wrapping cavity; the upper shell can also include two side walls located on both sides of the cover plate and perpendicular to the cover plate, and the two side walls are combined with the two side plates to realize the upper shell 201 is closed on the lower case 202 .
  • One of the two openings is an electrical port 204, and the gold fingers of the circuit board protrude from the electrical port 204 and are inserted into a host computer such as an optical network terminal; the other opening is an optical port 205, which is used for external optical fiber access to connect
  • the optical transceiver assembly 400 inside the optical module; the circuit board 300, the optical transceiver assembly 400 and other optoelectronic devices are located in the package cavity.
  • the combination of the upper casing and the lower casing is adopted to facilitate the installation of the circuit board 300, the optical transceiver assembly 400 and other devices into the casing, and the upper casing and the lower casing form the outermost encapsulation protection casing of the module;
  • the upper casing and the lower casing are generally made of metal materials to achieve electromagnetic shielding and heat dissipation.
  • the casing of the optical module is not made into an integral part, so that when assembling circuit boards and other devices, positioning parts, heat dissipation and electromagnetic shielding parts It cannot be installed and is not conducive to production automation.
  • the unlocking part 203 is located on the outer wall of the enclosing cavity/lower casing 202, and is used to realize the fixed connection between the optical module and the upper computer, or to release the fixed connection between the optical module and the upper computer.
  • the unlocking part 203 has an engaging part matched with the cage of the upper computer; pulling the end of the unlocking part can make the unlocking part move relatively on the surface of the outer wall; the optical module is inserted into the cage of the upper computer, and the optical module is fixed by the engaging part of the unlocking part In the cage of the host computer; by pulling the unlocking part, the engaging part of the unlocking part moves along with it, thereby changing the connection relationship between the engaging part and the host computer, so as to release the engaging relationship between the optical module and the host computer, so that the optical The module is pulled out from the cage of the upper computer.
  • the circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, MOS tubes) and chips (such as MCU, laser driver chip, amplitude limiting amplifier chip, clock data recovery CDR, power management chip, data processing chip) DSP), etc.
  • electronic components such as capacitors, resistors, triodes, MOS tubes
  • chips such as MCU, laser driver chip, amplitude limiting amplifier chip, clock data recovery CDR, power management chip, data processing chip) DSP, etc.
  • the circuit board 300 connects the electrical components in the optical module together according to the circuit design through circuit wiring, so as to realize electrical functions such as power supply, electrical signal transmission, and grounding.
  • the circuit board is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function. For example, the rigid circuit board can carry the chip smoothly; when the optical transceiver components are located on the circuit board, the rigid circuit board can also provide Stable bearing; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage.
  • metal pins/gold fingers are formed on the end surface of one side of the rigid circuit board for connecting with the electrical connector. Connector connections; these are inconvenient to implement with flexible circuit boards.
  • Flexible circuit boards are also used in some optical modules as a supplement to rigid circuit boards; flexible circuit boards are generally used in conjunction with rigid circuit boards.
  • flexible circuit boards can be used to connect the rigid circuit boards and optical transceiver components.
  • the optical transceiver assembly 400 includes two parts, an optical transmitting sub-module and an optical receiving sub-module, which are respectively used for transmitting and receiving optical signals.
  • the emission sub-module generally includes a light emitter, a lens and a light detector, and the lens and the light detector are located on different sides of the light emitter. The front and back sides of the light emitter emit light beams respectively.
  • the lens is used to converge the front of the light emitter.
  • the emitted light beam makes the light beam emitted by the light transmitter a convergent light so as to be easily coupled to an external optical fiber; the light detector is used to receive the light beam emitted from the reverse side of the light transmitter to detect the optical power of the light transmitter.
  • the light emitted by the optical transmitter enters the optical fiber after being condensed by the lens, and the light detector detects the luminous power of the optical transmitter to ensure the constancy of the emitted optical power of the optical transmitter.
  • the optical transceiver assembly 400 will be described in detail below.
  • FIG. 5 is a schematic diagram of the internal structure of an optical module provided by an embodiment of the present disclosure; as shown in FIG. 5 , the optical transceiver assembly 400 in the foregoing embodiment includes an optical transmitting sub-module 500 and an optical receiving sub-module 700, and the optical module further includes a circular The square tube body 600 and the optical fiber adapter 800.
  • the optical fiber adapter 800 is connected to the optical fiber, that is, the optical fiber adapter 800 is embedded on the round square tube body 600 for connecting the optical fiber.
  • the round tube body 600 is provided with a third nozzle 603 into which the optical fiber adapter 800 is inserted.
  • the sub-module 700 establishes an optical connection with the optical fiber adapter 800 respectively, and the light emitted and received by the optical transceiver assembly is transmitted through the same optical fiber in the optical fiber adapter, that is, the same optical fiber in the optical fiber adapter is the transmission of light in and out of the optical transceiver assembly.
  • the square tube body 600 is used to carry the light emitting sub-module 500 and the light receiving sub-module 700.
  • the round tube body 600 is made of metal material, which is beneficial to realize electromagnetic shielding and heat dissipation.
  • the round tube body 600 is provided with a first nozzle 601 and a second nozzle 602 , and the first nozzle 601 and the second nozzle 602 are respectively disposed on the adjacent side walls of the round tube body 600 .
  • the first orifice 601 is provided on the side wall of the circular square pipe body 600 in the length direction
  • the second nozzle 602 is provided on the side wall of the circular square pipe body 600 in the width direction.
  • the light-emitting sub-module 500 is embedded in the first nozzle 601, and through the first nozzle 601, the light-emitting sub-module 500 thermally contacts the round tube body 600;
  • the light-receiving sub-module 700 is embedded in the second nozzle 602, and passes through the second pipe The port 602 , the light receiving sub-module 700 thermally contacts the round tube body 600 .
  • the light-emitting sub-module 500 and the light-receiving sub-module 700 are directly press-fitted into the circular tube body 600, and the circular-square tube body 600 is in direct contact with the light-emitting sub-module 500 and the light-receiving sub-module 700, respectively or contact through a thermally conductive medium.
  • the round and square tube body can be used for the heat dissipation of the light emitting sub-module 500 and the light receiving sub-module 700 , so as to ensure the heat dissipation effect of the light emitting sub-module 500 and the light receiving sub-module 700 .
  • FIG. 6 is a schematic structural diagram of an optical emitting sub-module according to an embodiment of the present disclosure; the following describes the optical emitting sub-module in the optical transceiver assembly 400 in the foregoing embodiment with reference to FIG. 6 .
  • the light emitting sub-module 500 includes a metal tube base 501 through which the light emitting sub-module 500 is connected to the round tube body 600 .
  • the metal tube 501 is embedded in the first orifice 601 of the square tube body 600 .
  • the light emission sub-module 500 is packaged with coaxial TO, the light transmitter is a laser 502, and the light emission sub-module 500 further includes a light detector 503, a lens 504 and a heat sink 505.
  • the laser 502 and the light detector 503 are combined.
  • a lens 504 and other optoelectronic devices are placed on the surface of the metal socket 501 .
  • the laser 502 includes a laser chip and a laser ceramic heat sink, the laser chip is welded on the laser ceramic heat sink using gold-tin solder, and the laser ceramic heat sink is pasted on the side platform of the heat sink 505 using silver glue, which is used for emitting a signal beam.
  • DML Directly Modulated Laser
  • EML Electro-absorption Modulated Laser
  • EML is the electro-absorption modulator EAM
  • the integrated device of DFB laser is better than DML and consumes more power. Compared with DML, EML adds refrigerators, heat sinks, thermistors, etc.
  • the lens 504 is arranged above the laser 502, and the central axis of the lens 504 coincides with the central axis of the laser 502, and is used for converging the signal beam emitted by the laser 502, such as directly converging the signal beam emitted by the laser 502.
  • the beam is coupled into an external fiber.
  • the position of the lens 504 can be determined by the optical parameters of the lens such as the focal length and the position of the laser 502 .
  • the distance between the lens 504 and the light-emitting surface of the laser 502 can be the focal length of the lens 504 , and the lens can be determined according to the focal length of the lens 504 and the position of the laser 502 . 504, thereby securing the lens 504 over the laser 502.
  • the heat sink 505 is disposed on the top surface of the metal socket 501 .
  • the heat sink 505 can be directly fixed on the top surface of the metal socket 501 or indirectly fixed on the top surface of the metal socket 501 through other devices.
  • the heat sink 505 can be made of alloys, such as copper alloys, nickel alloys, etc., mainly for heat dissipation and bearing functions, such as for carrying the laser 502, the photodetector 503, the lens 504, etc. and assisting the laser 502, the photodetector 503, and the lens 504 heat dissipation.
  • 7 is a schematic structural diagram of a heat sink provided by an embodiment of the present disclosure, and FIG.
  • the heat sink 505 includes a first surface 505-1, a second surface 505-2, and a third surface 505-3.
  • the first surface 505-1 and the second surface 505-2 are located on the front surface of the heat sink 505, and the first surface 505-1 and the second surface 505-2 are opposite and intersect, and the third surface 505- 3 is located on the back of the heat sink 505, with the first surface 505-1 and the third surface 505-3 facing away.
  • the first surface 505-1 is perpendicular to the top surface of the metal socket 501
  • the second surface 505-2 is perpendicular to the metal socket 501
  • the top surface is nearly parallel.
  • the first surface 505-1, the second surface 505-2 and the third surface 505-3 of the heat sink 505 are the main bearing surfaces of the heat sink 505, and the first surface 505-1 and the second surface 505-2 of the heat sink 505 And the third surface 505-3 is used to carry the laser 502, the photodetector 503, the lens 504 and other devices.
  • the laser 502 is disposed on the first surface 505-1 of the heat sink 505, so that the laser beam generated by the laser 502 is along a vertical direction to the top surface of the metal stem 501 and away from the second surface 503- 2; thus, the lens 504 is also disposed on the first surface 505-1 of the heat sink 505.
  • the photodetector 503 is fixed to the surface of the heat sink 505 .
  • the light detector 503 is disposed at the backlight end of the laser 502, and is used to realize the backlight collection and feedback of the laser beam generated by the laser 502.
  • the light detector 503 is fixed to the second surface 505 - 2 of the heat sink 505 .
  • the photodetector 503 and the lens 504 are respectively located on different sides of the laser 502 .
  • both opposite sides of the laser 502 can emit light beams, and the front side of the laser 502 emits light beams whose main optical axis is perpendicular to the metal stem 501, and the light beams are converged through the lens 504; , the optical power of the light beam emitted from the back side of the laser 502 is detected by the light detector 503 , thereby detecting the size of the optical power of the light beam emitted from the front side of the laser 502 .
  • the laser 502 can be dynamically adjusted.
  • the optical detector 503 detects that the optical power becomes larger, the emitted optical power of the laser 502 becomes larger, which can be reduced by controlling the laser drive circuit.
  • the driving power applied to the laser makes the light of the laser 502 smaller; if the optical detector 503 detects that the optical power becomes smaller, the emitted light power of the laser 502 becomes smaller, and the driving current of the laser can be increased by controlling the laser driving circuit to make the laser 502 emit light.
  • the light emission of the laser 502 becomes smaller, thereby ensuring the constant emission power of the laser.
  • the light emitting sub-module 500 further includes a thermistor 506 and a TEC (thermoelectric cooler) 507 .
  • the thermistor 506 is disposed on the heat sink 505 to obtain the temperature of the heat sink 505 to monitor the working temperature of the laser 502 .
  • the TEC 507 is fixed on the top surface of the metal socket 501 , and the TEC 507 supports the heat sink 505 , that is, the heat sink 505 is fixed on the metal socket 501 through the TEC 507 .
  • one heat exchange surface of the TEC507 is directly attached to the metal socket 501, and the other heat exchange surface of the TEC507 is used to directly mount the heat sink 505, which ensures that the laser 502 and the TEC507 can be efficiently connected. heat transfer.
  • the temperature of the heat sink 505 is obtained through the thermistor 506, and the operation of the TEC 507 is controlled according to the temperature of the heat sink 505, thereby controlling the temperature of the laser 502 within the target temperature range.
  • the thermistor 506 is disposed on the third surface 505 - 3 of the heat sink 505 .
  • the light-emitting sub-module and the light-receiving sub-module in the embodiment of the present disclosure should be kept in an electrically isolated state. It is an insulating glue, so the light receiving sub-module 700 is in an electrically isolated state.
  • the metal casing of the optical module is connected with the optical fiber adapter 800 by laser welding, the optical fiber adapter 800 is connected with the circular square tube body 600 by laser welding, and the circular square tube body is welded and connected with the metal socket 501.
  • the metal casing, the optical fiber adapter 800, the circular The square tube body 600 and the metal tube base 501 are integral, and are electrically connected to each other.
  • the lasers, photodetectors and other devices need to be grounded;
  • the photodetector and other devices are connected to the metal socket, and the metal socket is connected to the grounding pin, so as to realize the grounding of the laser, etc.; however, this grounding method needs to connect the laser to the metal socket, because the metal socket is electrically If it is turned on, the laser, etc. and the metal casing are also electrically connected, and the light emitting sub-module at this time is not in an electrically isolated state.
  • the metal socket 501 is provided with a plurality of pins
  • FIG. 9 is a schematic diagram of the layout of each pin according to an embodiment of the present disclosure; as shown in FIG. 9 , the pins pass through the metal socket 501 and protrude on the surface of the metal socket 501 , and the pins are wrapped by glass to achieve insulation between the pins and the metal socket 501 .
  • several pins on the metal socket 501 are evenly distributed around the TEC 507 .
  • the metal socket 501 is provided with a ground pin 508a, a laser pin 508b, a photodetector pin 508c, a thermistor pin 508d and a TEC pin 508e.
  • the ground pin 508a passes through the ground pin
  • the through hole 509a penetrates from the bottom surface of the metal socket 501 to the top surface of the metal socket 501, and there is a gap between the ground pin 508a and the ground pin through hole 509a, and an insulating medium is arranged in the gap
  • the laser pin 508b passes through the laser
  • the pin through hole 509b penetrates from the bottom surface of the metal socket 501 to the top surface of the metal socket 501, and there is a gap between the laser pin 508b and the laser pin through hole 509b, and an insulating medium is arranged in the gap
  • the pin 508c penetrates from the bottom surface of the metal socket 501 to the top surface of the metal
  • An insulating medium is provided inside; the thermistor pin 508d penetrates from the bottom surface of the metal socket 501 to the top surface of the metal socket 501 through the thermistor pin through hole 509d, and the thermistor pin 508d is connected to the thermistor tube. There is a gap between the through holes 509d, and an insulating medium is arranged in the gap; the TEC pin 508e penetrates from the bottom surface of the metal socket 501 to the top surface of the metal socket 501 through the TEC pin through hole 509e, and the TEC pin 508e is connected to the top surface of the metal socket 501.
  • the insulating medium may be glass or ceramics; by filling the insulating medium in the gap, the insulating medium is used to connect each pin with the metal
  • the socket 501 achieves electrical isolation.
  • each pin is electrically isolated from the metal socket 501, the negative electrode of the laser 502 is connected to the ground pin 508a by wire connection, the negative electrode of the photodetector 503 is connected to the ground pin 508a by wire connection, and one end of the thermistor 506 is connected to the ground pin 508a.
  • the grounding pin 508a is connected by wire, and the negative electrode of the TEC507 is connected with the grounding pin 508a.
  • the grounding terminals of the laser 502, the photodetector 503 and other devices are directly connected to the grounding pin, so as to avoid the electrical connection between the laser and the metal socket. If connected, the laser, etc. and the metal socket are in an electrically insulated state.
  • the laser pin 508b is connected to the positive electrode of the laser 502 through a gold wire
  • the photodetector pin 508c is connected to the positive electrode of the photodetector 503 through a gold wire
  • the thermistor pin 508d is connected to one end of the thermistor 506 through a gold wire.
  • the TEC pin 508e is connected to the positive electrode of the TEC through a gold wire.
  • the optical module provided by the present disclosure includes a metal casing, an optical fiber adapter, a circular square tube body, and a light emitting sub-module.
  • the optical emitting sub-module includes a metal socket; the metal casing is electrically connected to the optical fiber adapter, and the optical fiber adapter is electrically connected to the circular square tube body.
  • the round and square tube body is electrically connected to the metal tube base;
  • the metal tube base is provided with a laser, and the metal tube base is provided with a grounding pin and a grounding pin through hole, wherein the grounding pin passes through the grounding pin through hole from the metal tube
  • the bottom surface of the socket penetrates to the top surface of the metal socket, and there is a gap between the grounding pin and the grounding pin through hole, and an insulating medium is arranged in the gap; directly connecting the grounding end of the laser to the grounding pin can realize the grounding of the laser .
  • the metal casing, the optical fiber adapter, the round square tube body and the metal tube base of the optical module are integrated, and are in a state of electrical conduction with each other; this grounding method avoids the electrical connection between the laser and the metal tube base.
  • the laser and the metal socket are in an electrically insulated state. Since the metal shell, the optical fiber adapter, the round and square tube body and the metal socket are integrated, the laser and the metal shell are also in an electrically insulated state, thereby realizing the Electrical isolation of the light emitting sub-module from the metal casing of the optical module.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

L'invention concerne un module optique, comprenant un boîtier métallique, un adaptateur de fibre optique, un corps de tube carré rond et un sous-module de transmission optique, le sous-module de transmission optique comprenant une douille de tube métallique ; le boîtier métallique est relié par conduction électrique à l'adaptateur de fibre optique, l'adaptateur de fibre optique est relié au corps de tube carré rond d'une manière de conduction électrique, et le corps de tube carré rond est relié à la douille de tube métallique par conduction électrique ; un dispositif laser est disposé sur la douille de tube métallique, la douille de tube métallique est pourvue d'une broche de mise à la terre et d'un trou traversant de broche de mise à la terre, un espace est ménagé entre la broche de mise à la terre et le trou traversant de broche de mise à la terre, et un milieu isolant est disposé dans l'espace ; et une extrémité de mise à la terre du dispositif laser est directement connectée à la broche de mise à la terre pour réaliser la mise à la terre du dispositif laser. Cette mise à la terre empêche une connexion électrique de se produire entre le dispositif laser et la douille de tube métallique, c'est-à-dire, le dispositif laser et la douille de tube métallique sont dans un état d'isolation électrique, et étant donné que le boîtier métallique, l'adaptateur de fibre optique, le corps de tube carré rond et la douille de tube métallique sont intégrés, le dispositif laser et le boîtier métallique sont également dans un état d'isolation électrique, réalisant ainsi une isolation électrique entre le sous-module de transmission optique et le boîtier métallique de module optique.
PCT/CN2021/115887 2020-09-08 2021-09-01 Module optique WO2022052842A1 (fr)

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CN202021955658.5 2020-09-08
CN202021955658.5U CN213091954U (zh) 2020-09-08 2020-09-08 一种光模块

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CN213091954U (zh) * 2020-09-08 2021-04-30 青岛海信宽带多媒体技术有限公司 一种光模块
CN113721330B (zh) * 2021-08-31 2023-01-24 青岛海信宽带多媒体技术有限公司 一种高速激光器组件及光模块
CN115980944B (zh) * 2023-01-30 2025-01-10 青岛海信宽带多媒体技术有限公司 一种光模块

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