WO2022126453A1 - 线路板及其制备方法 - Google Patents

线路板及其制备方法 Download PDF

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Publication number
WO2022126453A1
WO2022126453A1 PCT/CN2020/136965 CN2020136965W WO2022126453A1 WO 2022126453 A1 WO2022126453 A1 WO 2022126453A1 CN 2020136965 W CN2020136965 W CN 2020136965W WO 2022126453 A1 WO2022126453 A1 WO 2022126453A1
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WO
WIPO (PCT)
Prior art keywords
heat
conductor
conducting
bosses
circuit board
Prior art date
Application number
PCT/CN2020/136965
Other languages
English (en)
French (fr)
Inventor
唐昌胜
Original Assignee
深南电路股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深南电路股份有限公司 filed Critical 深南电路股份有限公司
Priority to PCT/CN2020/136965 priority Critical patent/WO2022126453A1/zh
Priority to EP20965471.4A priority patent/EP4124182A4/en
Publication of WO2022126453A1 publication Critical patent/WO2022126453A1/zh
Priority to US17/965,781 priority patent/US20230035374A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09481—Via in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Definitions

  • the present application relates to the technical field of circuit boards, and in particular, to a circuit board and a preparation method thereof.
  • the circuit board is an important electronic component and one of the important components of the electronics industry. Almost every electronic device, ranging from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits. Devices, in order to realize the electrical interconnection between them, all use circuit boards, so the role of circuit boards in the field of circuit technology is becoming more and more important.
  • the main technical problem to be solved by the present application is to provide a circuit board and a preparation method thereof, which can improve the heat dissipation performance of the circuit board.
  • a technical solution adopted in the present application is to provide a circuit board, comprising: a base layer; a transmission line layer, including a plurality of conductor bosses, wherein, there is a a gap to expose at least part of the base layer; an insulating heat-conducting layer including a plurality of heat-conducting parts, wherein a gap between two adjacent conductor bosses is filled with a corresponding heat-conducting part, and the heat-conducting part is The height of the portion is greater than the height of the conductor boss to form the connection groove.
  • the circuit board is used to package chips, and the connection grooves are used to place solder, so that the solder joints of the chips are connected to the corresponding conductors through the solder placed in the connection grooves A boss, and the non-soldering point position of the chip is attached to the insulating and heat-conducting layer.
  • the conductor boss penetrates through the base layer.
  • each of the conductor bosses includes a first portion, a second portion and a connecting portion, wherein the first portion extends from a first side of the base layer and the second portion extends from a second opposite side of the base layer extending, the connection part connects the first part and the second part, and penetrates the base layer; wherein, a first gap is formed between the first parts of two adjacent conductor bosses, and the adjacent A second gap is formed between the second portions of the two conductor bosses.
  • each of the heat-conducting parts includes a first sub-heat-conducting part and a second sub-heat-conducting part, wherein the first sub-heat-conducting part fills the first gap, and the second heat-conducting part fills the second gap , and the height of the first sub-heat-conducting portion is greater than the height of the first portion, so as to form the connecting groove.
  • the insulating and heat-conducting layer further includes a heat-conducting connecting portion connecting the second sub-heat-conducting portions of the plurality of heat-conducting portions.
  • Another technical solution adopted in the present application is to provide an electronic device including the circuit board described in any one of the above.
  • the electronic device further includes a chip, the solder joint position of the chip is connected to the corresponding conductor boss through the solder placed in the connection groove, and the non-solder joint position of the chip is attached to the Insulating and thermally conductive layer.
  • another technical solution adopted in the present application is to provide a method for preparing a circuit board, the method comprising: providing a base layer; forming a transmission line layer, the transmission line layer including a plurality of conductor bosses , wherein, there is a gap between two adjacent conductor bosses to expose at least part of the base layer; an insulating and thermally conductive layer covering the base layer and the conductor boss is provided; The conductor bosses are processed to expose the conductor bosses, and the height of the insulating and heat-conducting layer filled in the gap between two adjacent conductor bosses is greater than the height of the conductor bosses, thereby forming Connection groove.
  • the step of processing the insulating and heat-conducting layer and the conductor boss includes: grinding the insulating and heat-conducting layer until the conductor boss is exposed; processing the conductor boss to reduce the The height of the conductor boss.
  • the circuit board in the present application is provided with a corresponding heat-conducting portion in the gap between two adjacent conductor bosses, and the height of the heat-conducting portion is greater than the height of the conductor bosses, so as to form a connection groove , so that when the circuit board installs the components through the solder in the connection groove, even if the installed components cause some conductor bosses to be blocked, the heat generated by the shielded conductor bosses can be transmitted to other unshielded through the heat conduction part.
  • the conductor boss to achieve the purpose of heat dissipation.
  • the distance between the components and the heat conduction part is relatively close, and the heat generated by the components can also be transferred to the heat conduction part at this time, so as to achieve the purpose of dissipating heat for the components.
  • FIG. 1 is a schematic cross-sectional structure diagram of an embodiment of a circuit board of the present application.
  • FIG. 2 is a schematic cross-sectional structure diagram of the circuit board of FIG. 1 with components installed;
  • FIG. 3 is a schematic cross-sectional structure diagram of an embodiment of the electronic device of the present application.
  • FIG. 4 is a schematic flowchart of an embodiment of a method for preparing a circuit board of the present application
  • FIG. 5 is a production process diagram corresponding to FIG. 4 .
  • FIG. 1 is a schematic cross-sectional structure diagram of an embodiment of the circuit board of the present application.
  • the circuit board 1000 includes a base layer 1100 , a transmission line layer 1200 and an insulating and thermally conductive layer 1300 .
  • the base layer 1100 plays a supporting role in the entire circuit board 1000 , wherein the base layer 1100 may be a single-layer structure or a multi-layer structure formed by stacking multiple layers of materials, which is not limited herein.
  • the transmission line layer 1200 is prepared by using a conductive material and is patterned for transmitting electrical signals, and includes a plurality of conductor bosses 1210, and the plurality of conductor bosses 1210 form a line pattern, wherein, between two adjacent conductor bosses 1210 There are gaps 1220 to expose at least a portion of the base layer 1100 .
  • the transmission line layer 1200 may be prepared by using any conductive material such as copper, aluminum, iron, and alloy.
  • the insulating and heat-conducting layer 1300 is made of insulating and heat-conducting materials for transferring heat. Specifically, the insulating and heat-conducting layer 1300 includes a plurality of heat-conducting portions 1310, wherein the gaps 1220 between two adjacent conductor bosses 1210 are filled with a corresponding The height of the heat conducting portion 1310 is greater than that of the conductor bosses 1210 , so that a connecting groove 1001 is formed between two adjacent conductor bosses 1210 .
  • solder 2001 (the solder 2001 includes at least one of tin, gold, and copper) is placed in the connecting groove 1001 , so that the components 2000 pass through the solder 2001 Electrically connected to the conductor boss 1210 .
  • the gap 1220 between the two adjacent conductor bosses 1210 is filled with a corresponding heat conduction part 1310, so that when the component 2000 is mounted on the circuit board 1000 and part of the conductor bosses 1210 is blocked, the shielded conductor bosses 1210 The generated heat can be transferred to other unshielded conductor bosses 1210 through the heat conducting portion 1310, so as to be dissipated to achieve the purpose of heat dissipation.
  • the distance between the component 2000 and the heat-conducting portion 1310 is relatively short, and the heat generated by the component 2000 can also be transferred to the heat-conducting portion 1310 at this time.
  • the material of the insulating and thermally conductive layer 1300 may be thermally conductive composite plastics, thermally conductive adhesives, thermally conductive coatings, thermally conductive epoxy resins, various thermally conductive rubbers, elastomers (such as thermal interface elastomers), or composite insulating materials Thermally conductive polymer material, wherein, the composite insulating thermally conductive polymer material is composed of insulating and thermally conductive inorganic particles such as boron nitride, silicon nitride, silicon carbide, etc. and different polymer matrices.
  • the material of the insulating and heat-conducting layer 1300 may also be other materials, as long as the materials used are insulating and have good thermal conductivity.
  • the circuit board 1000 is used to package the chip 2100.
  • the position of the solder joint of the chip 2100 is connected by the solder 2001 placed in the groove 1001.
  • the corresponding conductor bosses 1210 are connected, and the non-soldering positions of the chip 2100 are attached to the insulating and thermally conductive layer 1300 .
  • the chip 2100 may be either a bare chip or a packaged chip. At this time, the heat generated by the chip 2100 can be directly dissipated through the insulating and heat-conducting layer 1300 to further improve the heat dissipation performance.
  • solder joints of the chip 2100 are connected to the conductor bosses 1210 through the solder 2001 , so as to realize electrical signal transmission between the chip 2100 and the conductor bosses 1210 .
  • the prior art there are two solutions for heat dissipation after chip packaging, one is to increase the layout area of the circuit board and reduce the wiring density of the circuit board, the other is to place heat dissipation components, such as graphene sheets for heat dissipation, or Use copper pipes for heat dissipation, etc.
  • the first solution is not conducive to high-density wiring of circuit boards, and is not conducive to the development of miniaturization of circuit boards
  • the second solution increases the types of devices, increases the difficulty of assembly, and is also not conducive to the development of miniaturization of circuit boards.
  • the heat generated by the chip 2100 is directly transferred to the insulating and heat-conducting layer 1300 , and there is no need to increase the layout area of the circuit board 1000 or additional heat dissipation elements, which can solve the problems existing in the prior art.
  • the insulating and heat-conducting layer 1300 can dissipate heat for the transmission line layer 1200 as well as the chip 2100, which can further improve the heat dissipation performance.
  • the conductor bosses 1210 penetrate through the base layer 1100 .
  • the conductor bosses 1210 are arranged to penetrate through the base layer 1100 , so that the heat on the conductor bosses 1210 can be transferred in the height direction of the circuit board 1000 , and the heat dissipation speed can be accelerated.
  • the conductor bosses 1210 may also be provided only on one side of the base layer 1100 , which is not limited herein.
  • each conductor boss 1210 includes a first portion 1211 , a second portion 1212 and a connecting portion 1213 , wherein the first portion 1211 extends from a first side of the base layer 1100 and the second portion 1212 extends from a second opposite side of the base layer 1100 .
  • first part 1211 and the second part 1212 are respectively arranged on opposite sides of the base layer 1100, and the connecting part 1213 connects the first part 1211 and the second part 1212, and penetrates through the base layer 1100, while the adjacent two
  • a first gap 1221 is formed between the first portions 1211 of the two conductor bosses 1210
  • a second gap 1222 is formed between the second portions 1212 of two adjacent conductor bosses 1210 .
  • the first part 1211 , the second part 1212 and the connecting part 1213 are arranged so that the circuit board 1000 is a double-sided circuit board, that is, both sides of the circuit board 1000 arranged opposite to each other can be used to transmit electrical signals.
  • the conductor boss 1210 may only include the first part 1211 or the second part 1212, and the circuit board 1000 is a single-sided circuit board in this case.
  • the conductor boss 1210 may further include the first part 1211 , one of the second parts 1212 , and a connection part 1213 .
  • each thermal conduction part 1310 includes a first sub thermal conduction part 1311 and a second thermal conduction sub part 1312 , wherein the first thermal conduction sub part 1311 fills the first gap 1221 , and the second thermal conduction part 1312 fills the second gap 1222 , and the height of the first sub-heat-conducting portion 1311 is greater than the height of the first portion 1211 to form the connecting groove 1001 .
  • filling the first sub-heat-conducting portion 1311 in the first gap 1221 and filling the second sub-heat-conducting portion 1312 in the second gap 1222 can improve the double-sided heat dissipation performance of the circuit board 1000 .
  • the second gap 1222 may not be filled with the second sub thermally conductive portion 1312, and the second gap 1222 may not be filled with any substance.
  • the insulating and heat-conducting layer 1300 further includes a heat-conducting connecting portion 1313 connecting the second sub-heat-conducting portions 1312 of the plurality of heat-conducting portions 1310 .
  • the configuration of the thermally conductive connection portion 1313 makes the transmission line layer 1200 on the side of the circuit board 1000 completely covered by the insulating and thermally conductive layer 1300 , so that other material layers can be continuously covered on the circuit board 1000 .
  • the height of the second sub-heat-conducting portion 1312 can also be greater than the height of the second portion 1212 to form the connecting groove 1001 , and the components 2000 can be mounted on the opposite sides of the circuit board 1000 .
  • FIG. 3 is a schematic cross-sectional structure diagram of an embodiment of the electronic device of the present application.
  • the electronic device 3000 includes a circuit board 3100 and a chip 3200 .
  • the structure of the circuit board 3100 is the same as the structure of the circuit board 1000 in any of the above-mentioned embodiments. For details, please refer to the above-mentioned embodiments, which will not be repeated here.
  • solder joint positions of the chip 3200 are connected to the corresponding conductor bosses 3120 through the solder 3300 placed in the connection grooves 3110 of the circuit board 3100 , and the non-solder joint positions of the chip 3200 are attached to the insulating and thermally conductive layer 3130 .
  • the chip 3200 may be either a bare chip or a packaged chip.
  • the insulating heat-conducting layer 3130 transmits the heat generated by the conductor bosses 3120 on the one hand and the heat generated by the chip 3200 on the other hand, so that it can be achieved without additional heat dissipation elements and expansion of the layout area of the circuit board 3100 . Heat dissipation of chip 3200.
  • the chip 3200 may not be mounted on the circuit board 3100, and the circuit board 3100 may not be mounted with the chip 3200 but other components, which is not limited herein.
  • FIG. 4 is a schematic flowchart of an embodiment of the method for preparing a circuit board of the present application, and in conjunction with FIG. 5, the method includes:
  • a base layer 4100 is provided.
  • the base layer 4100 may be either a single-layer structure or a multi-layer structure.
  • the transmission line layer 4200 includes a plurality of conductor bosses 4210 , wherein a gap 4220 is formed between two adjacent conductor bosses 4210 to expose at least part of the base layer 4100 .
  • the conductor bosses 4210 can be arranged only on one side of the base layer 4100, or can be distributed on both sides of the base layer 4100. In this case, as shown in FIG. 5, the conductor bosses 4210 penetrate through the base layer 4100, and the bottom part is made of conductor bumps. Stage 4210 is described through base layer 4100 .
  • S300 providing an insulating and thermally conductive layer 4300 covering the base layer 4100 and the conductor bosses 4210 .
  • the insulating and thermally conductive layer 4300 is covered on the base layer 4100 and the conductor boss 4210 by using a lamination technology.
  • a substrate layer (not shown in the figure) is provided on the side of the insulating and heat-conducting layer 4300 away from the base layer 4100 .
  • the substrate layer may specifically be a release film or copper foil), and after the insulating and heat-conducting layer 4300 is pressed onto the base layer 4100 and the transmission line layer 4200, the substrate layer is removed.
  • the insulating and heat-conducting layer 4300 may also be formed by other processes, such as vapor deposition process, vacuum distillation, inkjet printing, etc., which are not limited herein.
  • S400 Process the insulating and thermally conductive layer 4300 and the conductor bosses 4210 to expose the conductor bosses 4210, and make the height of the insulating and thermally conductive layer 4300 filled with the gap 4220 between two adjacent conductor bosses 4210 greater than that of the conductor bosses 4210 , thereby forming the connecting groove 4001 .
  • step S400 specifically includes: grinding the insulating and thermally conductive layer 4300 until the conductor bosses 4210 are exposed; and processing the conductor bosses 4210 to reduce the height of the conductor bosses 4210 .
  • the conductor boss 4210 may be processed by any method such as chemical etching, UV laser drill ablation, UV laser milling, CO 2 laser drill ablation, or the like.
  • a process such as milling is used to directly align the insulating and heat-conducting layer 4300 and the conductor bosses 4210. Processing is performed to remove the insulating and thermally conductive layer 4300 on the surface of the conductor bosses 4210 and to reduce the height of the conductor bosses 4210 .
  • the circuit board prepared by the preparation method in this embodiment has the same structure as the circuit board in any of the above-mentioned embodiments.
  • the circuit board in the present application is provided with a corresponding heat-conducting portion filled in the gap between two adjacent conductor bosses, and the height of the heat-conducting portion is greater than the height of the conductor boss, so as to form a connection groove, so that when the circuit board is When components are installed by connecting the solder in the groove, even if the installed components block part of the conductor bosses, the heat generated by the shielded conductor bosses can be transferred to other unshielded conductor bosses through the heat conduction part. achieve the purpose of heat dissipation. And when the component is mounted on the circuit board, the distance between the component and the heat conduction part is relatively close, and the heat generated by the component can also be transferred to the heat conduction part at this time.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

本申请公开了一种线路板及其制备方法，该线路板包括：基层；传输线路层，包括多个导体凸台，其中，相邻两个导体凸台之间具有间隙以暴露出至少部分的基层；绝缘导热层，包括多个导热部，其中，相邻两个导体凸台之间的间隙填充有一个对应的导热部，且导热部的高度大于导体凸台的高度，以形成连接凹槽。本申请所提供的线路板能够提高线路板的散热性能。

Description

线路板及其制备方法 【技术领域】
本申请涉及线路板技术领域，特别是涉及一种线路板及其制备方法。
【背景技术】
线路板是重要的电子元件，是电子工业的重要元件之一，几乎每种电子设备，小到电子手表、计算器，大到计算机、通讯电子设备、军用武器系统，只要有集成电路等电子元器件，为实现它们之间的电气互联，都要使用线路板，因此线路板在电路技术领域中扮演的角色越来越重要。
而目前随着高功率、高密度电子设备的发展，线路板的散热问题已日益突出。
【发明内容】
本申请主要解决的技术问题是提供一种线路板及其制备方法，能够提高线路板的散热性能。
为解决上述技术问题，本申请采用的一个技术方案是：提供一种线路板，包括：基层；传输线路层，包括多个导体凸台，其中，相邻两个所述导体凸台之间具有间隙以暴露出至少部分的所述基层；绝缘导热层，包括多个导热部，其中，相邻两个所述导体凸台之间的间隙填充有一个对应的所述导热部，且所述导热部的高度大于所述导体凸台的高度，以形成连接凹槽。
其中，所述线路板用于封装芯片，且所述连接凹槽用于放置焊料，以使所述芯片的焊点位置通过所述连接凹槽中放置的所述焊料而连接对应的所述导体凸台，而所述芯片的非焊点位置贴合所述绝缘导热层。
其中，所述导体凸台贯穿所述基层。
其中，每个所述导体凸台包括第一部分、第二部分和连接部，其中，所述第一部分从所述基层的第一侧延伸，所述第二部分从所述基层相对的第二侧延伸，所述连接部连接所述第一部分和所述第二部分，并贯穿所述基层；其中，相邻两个所述导体凸台的所述第一部分之间形成第一间隙，而相邻两个所述导体凸台的所述第二部分之间形成第二间隙。
其中，每个所述导热部包括第一子导热部和第二子导热部，其中，所述第 一子导热部填充所述第一间隙，所述第二子导热部填充所述第二间隙，且所述第一子导热部的高度大于所述第一部分的高度，以形成所述连接凹槽。
其中，所述绝缘导热层进一步包括导热连接部，连接所述多个导热部的所述第二子导热部。
为解决上述技术问题，本申请采用的另一个技术方案是：提供一种电子设备，包括上述任一项所述的线路板。
其中，所述电子设备还包括芯片，所述芯片的焊点位置通过所述连接凹槽中放置的焊料而连接对应的所述导体凸台，而所述芯片的非焊点位置贴合所述绝缘导热层。
为解决上述技术问题，本申请采用的另一个技术方案是：提供一种线路板的制备方法，所述方法包括：提供一基层；形成传输线路层，所述传输线路层包括多个导体凸台，其中，相邻两个所述导体凸台之间具有间隙以暴露出至少部分的所述基层；设置覆盖所述基层以及所述导体凸台的绝缘导热层；对所述绝缘导热层和所述导体凸台进行加工，以暴露所述导体凸台，并使相邻两个所述导体凸台之间的间隙填充的所述绝缘导热层的高度大于所述导体凸台的高度，从而形成连接凹槽。
其中，所述对所述绝缘导热层和所述导体凸台进行加工的步骤，包括：研磨所述绝缘导热层直至暴露所述导体凸台；对所述导体凸台进行加工，以降低所述导体凸台的高度。
本申请的有益效果是：本申请中的线路板设置相邻两个导体凸台之间的间隙内填充一个对应的导热部，且导热部的高度大于导体凸台的高度，以形成连接凹槽，从而当线路板通过连接凹槽内的焊料安装元器件时，即使安装的元器件使部分导体凸台被遮挡，被遮挡的导体凸台产生的热量也能够通过导热部传递到其他未被遮挡的导体凸台，达到散热的目的。且当元器件安装在线路板上时，元器件与导热部的距离较近，此时元器件产生的热量也能够传递到导热部上，达到为元器件散热的目的。
【附图说明】
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下， 还可以根据这些附图获得其他的附图。其中：
图1是本申请线路板一实施方式的剖面结构示意图；
图2是图1线路板安装有元器件的剖面结构示意图；
图3是本申请电子设备一实施方式的剖面结构示意图；
图4是本申请线路板的制备方法一实施方式的流程示意图；
图5是图4对应的制备过程图。
【具体实施方式】
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性的劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
参阅图1，图1是本申请线路板一实施方式的剖面结构示意图，该线路板1000包括基层1100、传输线路层1200以及绝缘导热层1300。
基层1100在整个线路板1000中起支撑作用，其中基层1100可以是单层结构，也可以是由多层材料层堆叠而成的多层结构，在此不做限制。
传输线路层1200采用导电材料制备且被图案化，用于传输电信号，其包括多个导体凸台1210，多个导体凸台1210形成线路图形，其中，相邻两个导体凸台1210之间具有间隙1220以暴露出至少部分的基层1100。其中，传输线路层1200可以采用铜、铝、铁、合金等任一种可以导电的材料制备。
绝缘导热层1300采用绝缘且导热的材料制备，用于传输热量，具体地，绝缘导热层1300包括多个导热部1310，其中，相邻两个导体凸台1210之间的间隙1220填充有一个对应的导热部1310，且导热部1310的高度大于导体凸台1210的高度，以使相邻两个导体凸台1210之间形成连接凹槽1001。
具体地，结合图2，当线路板1000需要安装元器件2000时，连接凹槽1001内放置焊料2001(焊料2001包括锡、金、铜中的至少一种)，以使元器件2000通过焊料2001与导体凸台1210电连接。
同时相邻两个导体凸台1210之间的间隙1220填充有一个对应的导热部1310，从而当线路板1000上安装元器件2000而使部分导体凸台1210被遮挡，被遮挡的导体凸台1210产生的热量能够通过导热部1310传递到其他未被遮挡的导体凸台1210，从而散发出去，达到散热的目的。
同时，当元器件2000安装在线路板1000上时，元器件2000与导热部1310的距离较近，此时元器件2000产生的热量也能够传递到导热部1310上。
在本实施方式中，绝缘导热层1300的材料可以是导热复合塑料、导热胶黏剂、导热涂层、导热环氧树脂、各类导热橡胶、弹性体(例如热界面弹性体)或者复合型绝缘导热高分子材料，其中，复合型绝缘导热高分子材料采用绝缘导热无机粒子如氮化硼、氮化硅、碳化硅等和不同聚合物基体复合而成。
在其他实施方式中，绝缘导热层1300的材料还可以为其他，只要其使用的材料绝缘且导热性能良好即可。
继续结合图1和图2，在一应用场景中，线路板1000用于封装芯片2100，当芯片2100安装在线路板1000上时，芯片2100的焊点位置通过连接凹槽1001中放置的焊料2001而连接对应的导体凸台1210，而芯片2100的非焊点位置贴合绝缘导热层1300。
其中，芯片2100既可以是裸芯片，也可以是封装完毕的芯片。此时芯片2100产生的热量能够直接通过绝缘导热层1300散发出去，进一步提高散热性能。
芯片2100的焊点位置通过焊料2001而与导体凸台1210连接，从而实现芯片2100与导体凸台1210之间的电信号传输。
现有技术中，芯片封装后散热的方案有两种，一种是增大线路板的布设面积，降低线路板的布线密度，另一种是放置散热元件，例如放置石墨烯片进行散热，或者利用铜管进行散热等。其中，第一种方案不利于线路板高密度布线，也不利于线路板的小型化发展，而第二种方案增加了器件种类，提高了装配难度，同样也不利于线路板的小型化发展。
而本应用场景中，芯片2100产生的热量直接传递到绝缘导热层1300上，不需要增大线路板1000的布设面积，也不需要额外增加散热元件，能够解决现有技术中存在的问题。
也就是说，在该应用场景中，当线路板1000封装芯片2100后，绝缘导热层1300既能够为传输线路层1200散热，也能够为芯片2100散热，能够进一步提高散热性能。
继续参阅图1，导体凸台1210贯穿基层1100。设置导体凸台1210贯穿基层1100，可以使导体凸台1210上的热量在线路板1000的高度方向上进行传递，能够加快散热速度。在其他实施方式中，导体凸台1210也可以只设置在基层1100的一侧，在此不做限制。
继续参阅图1，每个导体凸台1210包括第一部分1211、第二部分1212和连接部1213，其中，第一部分1211从基层1100的第一侧延伸，第二部分1212从基层1100相对的第二侧延伸，也就是说，第一部分1211、第二部分1212分别设置在基层1100相背设置的两侧，同时连接部1213连接第一部分1211和第二部分1212，并贯穿基层1100，同时相邻两个导体凸台1210的第一部分1211之间形成第一间隙1221，而相邻两个导体凸台1210的第二部分1212之间形成第二间隙1222。
具体地，第一部分1211、第二部分1212和连接部1213的设置使得线路板1000为双面线路板，即线路板1000相背设置的两面均可用于传递电信号。
在其他实施方式中，导体凸台1210可以只包括第一部分1211或者第二部分1212，此时线路板1000即为单面线路板。或者，导体凸台1210还可以包括第一部分1211、第二部分1212中的一个以及连接部1213。
继续参阅图1，每个导热部1310包括第一子导热部1311和第二子导热部1312，其中，第一子导热部1311填充第一间隙1221，第二子导热部1312填充第二间隙1222，且第一子导热部1311的高度大于第一部分1211的高度，以形成连接凹槽1001。
具体地，在第一间隙1221内填充第一子导热部1311，在第二间隙1222内填充第二子导热部1312，可以提高线路板1000的双面散热性能。
在其他实施方式中，第二间隙1222也可以不填充第二子导热部1312，且第二间隙1222不填充任何物质。
继续参阅图1，绝缘导热层1300进一步包括导热连接部1313，连接多个导热部1310的第二子导热部1312。
具体地，导热连接部1313的设置使得线路板1000一侧的传输线路层1200完全被绝缘导热层1300覆盖，从而可以在线路板1000上继续覆盖其他材料层。
在其他实施方式中，第二子导热部1312的高度也可以大于第二部分1212的高度，以形成连接凹槽1001，此时线路板1000的相背设置的两面均可以安装元器件2000。
参阅图3，图3是本申请电子设备一实施方式的剖面结构示意图。该电子设备3000包括线路板3100以及芯片3200。
线路板3100的结构与上述任一项实施方式中的线路板1000的结构相同，详见可参见上述实施方式，在此不再赘述。
其中，芯片3200的焊点位置通过线路板3100的连接凹槽3110中放置的焊料3300而连接对应的导体凸台3120，而芯片3200的非焊点位置贴合绝缘导热层3130。
其中，芯片3200既可以是裸芯片，也可以是封装完毕的芯片。
在本实施方式中，绝缘导热层3130一方面传递导体凸台3120产生的热量，另一方面传递芯片3200产生的热量，使得不需要设置额外的散热元件以及扩大线路板3100的布设面积就能够实现芯片3200的散热。
在其他实施方式中，线路板3100上可以不安装芯片3200，以及线路板3100上安装的可以不是芯片3200，而是其他元器件，在此不做限制。
参阅图4，图4是本申请线路板的制备方法一实施方式的流程示意图，同时结合图5，该方法包括：
S100：提供一基层4100。
其中，基层4100既可以是单层结构，也可以是多层结构。
S200：形成传输线路层4200，传输线路层4200包括多个导体凸台4210，其中，相邻两个导体凸台4210之间具有间隙4220以暴露出至少部分的基层4100。
具体地，导体凸台4210可以只设置在基层4100的一侧，也可以分布在基层4100的两侧，此时如图5所示，导体凸台4210贯穿基层4100，其中，下面均以导体凸台4210贯穿基层4100进行说明。
S300：设置覆盖基层4100以及导体凸台4210的绝缘导热层4300。
具体地，在本实施方式中，采用层压技术将绝缘导热层4300覆盖到基层4100以及导体凸台4210之上。
在一应用场景中，为了保证绝缘导热层4300的绝缘性能，避免层压过程中外部杂质混入绝缘导热层4300，在层压之前，绝缘导热层4300远离基层4100一侧设置有衬底层(图未示，衬底层具体可以为离型膜或者铜箔)，而在将绝缘导热层4300压合到基层4100以及传输线路层4200之上后，去除该衬底层。
当然还可以采用其他工艺设置绝缘导热层4300，例如采用气相沉积工艺、真空蒸馏、喷墨打印等，在此不做限制。
S400：对绝缘导热层4300和导体凸台4210进行加工，以暴露导体凸台4210，并使相邻两个导体凸台4210之间的间隙4220填充的绝缘导热层4300的高度大于导体凸台4210的高度，从而形成连接凹槽4001。
在一应用场景中，结合图5，步骤S400具体包括：研磨绝缘导热层4300 直至暴露导体凸台4210；对导体凸台4210进行加工，以降低导体凸台4210的高度。
具体地，可以采用化学蚀刻、UV激光钻烧蚀、UV激光铣切、CO 2激光钻烧蚀等任一种方式对导体凸台4210进行加工。
在另一应用场景中，在设置覆盖基层4100以及导体凸台4210的绝缘导热层4300之后，在对应导体凸台4210的位置，采用诸如铣切等工艺直接对绝缘导热层4300以及导体凸台4210进行加工，以去除导体凸台4210表面的绝缘导热层4300，并降低导体凸台4210的高度。
采用本实施方式中制备方法制备的线路板与上述任一项实施方式中的线路板结构相同，详细的线路板结构可参见上述实施方式，在此不再赘述。
总而言之，本申请中的线路板设置相邻两个导体凸台之间的间隙内填充一个对应的导热部，且导热部的高度大于导体凸台的高度，以形成连接凹槽，从而当线路板通过连接凹槽内的焊料安装元器件时，即使安装的元器件使部分导体凸台被遮挡，被遮挡的导体凸台产生的热量也能够通过导热部传递到其他未被遮挡的导体凸台，达到散热的目的。且当元器件安装在线路板上时，元器件与导热部的距离较近，此时元器件产生的热量也能够传递到导热部上。
以上所述仅为本申请的实施方式，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (10)

  1. 一种线路板，其中，包括：
    基层；
    传输线路层，包括多个导体凸台，其中，相邻两个所述导体凸台之间具有间隙以暴露出至少部分的所述基层；
    绝缘导热层，包括多个导热部，其中，相邻两个所述导体凸台之间的间隙填充有一个对应的所述导热部，且所述导热部的高度大于所述导体凸台的高度，以形成连接凹槽。
  2. 根据权利要求1所述的线路板，其中，所述线路板用于封装芯片，且所述连接凹槽用于放置焊料，以使所述芯片的焊点位置通过所述连接凹槽中放置的所述焊料而连接对应的所述导体凸台，而所述芯片的非焊点位置贴合所述绝缘导热层。
  3. 根据权利要求1所述的线路板，其中，所述导体凸台贯穿所述基层。
  4. 根据权利要求3所述的线路板，其中，每个所述导体凸台包括第一部分、第二部分和连接部，其中，所述第一部分从所述基层的第一侧延伸，所述第二部分从所述基层相对的第二侧延伸，所述连接部连接所述第一部分和所述第二部分，并贯穿所述基层；
    其中，相邻两个所述导体凸台的所述第一部分之间形成第一间隙，而相邻两个所述导体凸台的所述第二部分之间形成第二间隙。
  5. 根据权利要求4所述的线路板，其中，每个所述导热部包括第一子导热部和第二子导热部，其中，所述第一子导热部填充所述第一间隙，所述第二子导热部填充所述第二间隙，且所述第一子导热部的高度大于所述第一部分的高度，以形成所述连接凹槽。
  6. 根据权利要求5所述的线路板，其中，所述绝缘导热层进一步包括导热连接部，连接所述多个导热部的所述第二子导热部。
  7. 一种电子设备，其中，包括如权利要求1至6任一项所述的线路板。
  8. 根据权利要求7所述的电子设备，其中，所述电子设备还包括芯片，所述芯片的焊点位置通过所述连接凹槽中放置的焊料而连接对应的所述导体凸台，而所述芯片的非焊点位置贴合所述绝缘导热层。
  9. 一种线路板的制备方法，其中，所述制备方法包括：
    提供一基层；
    形成传输线路层，所述传输线路层包括多个导体凸台，其中，相邻两个所述导体凸台之间具有间隙以暴露出至少部分的所述基层；
    设置覆盖所述基层以及所述导体凸台的绝缘导热层；
    对所述绝缘导热层和所述导体凸台进行加工，以暴露所述导体凸台，并使相邻两个所述导体凸台之间的间隙填充的所述绝缘导热层的高度大于所述导体凸台的高度，从而形成连接凹槽。
  10. 根据权利要求9所述的方法，其中，所述对所述绝缘导热层和所述导体凸台进行加工的步骤，包括：
    研磨所述绝缘导热层直至暴露所述导体凸台；
    对所述导体凸台进行加工，以降低所述导体凸台的高度。
PCT/CN2020/136965 2020-12-16 2020-12-16 线路板及其制备方法 WO2022126453A1 (zh)

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CN110996503A (zh) * 2019-12-31 2020-04-10 四会富仕电子科技股份有限公司 一种高散热的金属基板的制作方法
CN211240270U (zh) * 2019-12-26 2020-08-11 四会富仕电子科技股份有限公司 一种双面凸台基板
CN211267243U (zh) * 2019-12-23 2020-08-14 珠海智锐科技有限公司 一种线路板

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US20150257261A1 (en) * 2014-03-07 2015-09-10 Ibiden Co., Ltd. Printed wiring board
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