WO2022118642A1 - ヒューズ及び車載機器 - Google Patents
ヒューズ及び車載機器 Download PDFInfo
- Publication number
- WO2022118642A1 WO2022118642A1 PCT/JP2021/041897 JP2021041897W WO2022118642A1 WO 2022118642 A1 WO2022118642 A1 WO 2022118642A1 JP 2021041897 W JP2021041897 W JP 2021041897W WO 2022118642 A1 WO2022118642 A1 WO 2022118642A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- terminals
- plate portion
- fuse
- housing
- plate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 71
- 238000007747 plating Methods 0.000 claims description 57
- 239000002184 metal Substances 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 23
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 16
- 238000005476 soldering Methods 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 description 37
- 238000000034 method Methods 0.000 description 19
- 230000000694 effects Effects 0.000 description 9
- 230000002093 peripheral effect Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 230000007774 longterm Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/143—Electrical contacts; Fastening fusible members to such contacts
- H01H85/147—Parallel-side contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/20—Bases for supporting the fuse; Separate parts thereof
- H01H85/2045—Mounting means or insulating parts of the base, e.g. covers, casings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/165—Casings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/165—Casings
- H01H85/17—Casings characterised by the casing material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/20—Bases for supporting the fuse; Separate parts thereof
- H01H85/205—Electric connections to contacts on the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/0411—Miniature fuses
- H01H2085/0412—Miniature fuses specially adapted for being mounted on a printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/20—Bases for supporting the fuse; Separate parts thereof
- H01H85/205—Electric connections to contacts on the base
- H01H2085/2055—Connections to bus bars in an installation with screw in type fuses or knife blade fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/20—Bases for supporting the fuse; Separate parts thereof
- H01H2085/2075—Junction box, having holders integrated with several other holders in a particular wiring layout
- H01H2085/208—Junction box, having holders integrated with several other holders in a particular wiring layout specially adapted for vehicles
Definitions
- the present disclosure relates to fuses and in-vehicle devices.
- This application claims priority based on Japanese Application No. 2020-202068 filed on December 4, 2020, and incorporates all the contents described in the Japanese application.
- Patent Document 1 discloses a fuse in order to prevent an overcurrent from flowing through an electric device.
- the fuse is provided in, for example, an in-vehicle device.
- the fuse described in Patent Document 1 is a so-called blade type fuse.
- the two terminals form a long plate.
- the two terminals are connected to the fusing portion.
- Part of the two terminals and the fusing part are covered by a housing.
- the current flows in the order of one terminal, the fusing part and the other terminal. By fusing the fusing portion, the flow of overcurrent is prevented.
- Patent Document 1 a fuse holder into which a blade-type fuse is inserted is mounted on a circuit board. If the blown part of the fuse is blown, remove the fuse from the fuse holder and insert a new fuse into the fuse holder.
- the fuse according to one aspect of the present disclosure is a fuse included in an in-vehicle device, and includes a plurality of long plate-shaped terminals arranged in a row and a blown portion connected to two terminals in the plurality of terminals. , A part of the plurality of terminals and a housing covering the fusing portion, a current flows through the fusing portion, and the fusing portion is fused when the temperature of the fusing portion exceeds a predetermined temperature.
- the housing has a heat resistance of 300 degrees or higher, and each terminal has a metal body, tin terminal plating covering the surface of the metal body, and a long plate shape partially covered by the housing.
- first plate portion has a first plate portion and a second plate portion connected to the first plate portion, and for each of the plurality of terminals, one end of the first plate portion is from a common surface of the housing.
- the second plate portion protrudes from a part of the tip surface of the first plate portion protruding from the housing, and the cross-sectional area of the second plate portion is larger than the cross-sectional area of the first plate portion. Is also small.
- the vehicle-mounted device includes a fuse and a circuit board to which the fuse is attached, and the fuse is formed by a plurality of long plate-shaped terminals arranged in a row and among the plurality of terminals. It has a fusing portion connected to two terminals, a part of the plurality of terminals and a housing that covers the fusing portion and has heat resistance, and a current flows through the fusing portion, and the fusing portion is formed.
- the housing has a heat resistance of 300 degrees or more
- each terminal is a metal body and a tin terminal covering the surface of the metal body.
- the circuit board has an insulating substrate, a plurality of through holes penetrating the insulating substrate, and a plurality of substrate plating covering the insulating substrate.
- Each of the plurality of terminals is inserted into a plurality of through holes, and is connected to the plurality of substrate platings by soldering.
- FIG. It is a front view of the fuse in Embodiment 1.
- FIG. It is a side view of a fuse. It is sectional drawing of a terminal. It is sectional drawing of a fuse. It is explanatory drawing of the state of the terminal and the fusing part seen from the upper side of FIG. It is explanatory drawing which shows the state which the fuse is attached to the circuit board. It is another explanatory drawing which shows the state which a fuse is attached to a circuit board. It is sectional drawing of a circuit board. It is explanatory drawing of the effect obtained when the distance between two through holes is short.
- FIG. It is sectional drawing of a fuse. It is explanatory drawing which shows the state which the fuse is attached to the circuit board. It is explanatory drawing of the effect obtained when the distance between two through holes arranged on both sides is short.
- Patent Document 1 an in-vehicle device is realized by inserting a blade-type fuse into a fuse holder.
- the configuration of this in-vehicle device has a problem that the size is large because the fuse holder is mounted on the circuit board.
- a large number of devices are arranged in a limited area, so that the size of the in-vehicle devices is preferably small.
- soldering As a method of realizing a small in-vehicle device, there is a method of directly attaching a blade type fuse to the board with solder. Usually, many parts different from fuses are attached to a circuit board by soldering. There is a reflow method as a method of attaching parts by soldering. In the reflow method, paste-like solder is applied on the substrate plating that covers the circuit board, and the electrodes of the components are placed on the solder. In this state, hot air is blown or infrared rays are irradiated. As a result, the solder melts, and the electrodes of the component and the substrate plating are connected by the solder.
- the blade type fuses are also attached to the circuit board by the reflow method in order to realize the process of attaching all the parts to the circuit board at low cost.
- the blade type fuse is manufactured on the assumption that it is inserted into the fuse holder. Therefore, the blade type fuse is not currently a component suitable for reflow mounting.
- the fuse configuration is suitable for reflow mounting on a circuit board.
- the fuse according to one aspect of the present disclosure is a fuse included in an in-vehicle device, and is connected to a plurality of long plate-shaped terminals arranged in a row and two terminals in the plurality of terminals.
- a fusing portion, a part of the plurality of terminals, and a housing covering the fusing portion are provided, and a current flows through the fusing portion, and the fusing portion is used when the temperature of the fusing portion exceeds a predetermined temperature.
- the housing has a heat resistance of 300 degrees or higher
- each terminal has a metal body, tin terminal plating covering the surface of the metal body, and a length partially covered by the housing.
- the second plate portion protrudes from one surface, and the second plate portion protrudes from a part of the tip surface of the first plate portion protruding from the housing, and the cross-sectional area of the second plate portion is that of the first plate portion. It is smaller than the cross-sectional area.
- a heat resistance of 300 degrees or higher means that X is 300 or higher. If no deformation or melting occurs in the housing, the shape of the housing is maintained. Since the housing has a heat resistance of 300 degrees or higher, the housing is not melted or deformed by blowing hot air or irradiating with infrared rays. As a result, the configuration is suitable for reflow mounting on a circuit board.
- the surface of the metal body is covered with tin terminal plating.
- the solder usually contains a tin component. Therefore, with respect to the terminal having the tin terminal plating, the solder is easy to get used to, so-called wettability. Therefore, the solder strongly adheres to the terminal.
- the second plate portion protrudes from the tip surface of the first plate portion protruding from the housing, and a stepped structure is realized.
- the insulating substrate is provided with a through hole, and the inner surface of the through hole and the insulating substrate around the through hole are covered with the substrate plating.
- a through hole having an area slightly larger than the cross-sectional area of the second plate portion is provided.
- the terminal is inserted into the through hole with the paste-like solder applied on the substrate plating. Since the stepped structure is realized as described above, the housing does not come into contact with the paste-like solder when the terminal is inserted into the through hole. Therefore, when the solder is melted by the reflow method, it is unlikely that ball-shaped solder is formed.
- the cross-sectional area of the second plate portion is smaller than the cross-sectional area of the first plate-shaped portion, and the second plate portion is thin. Therefore, a through hole having a small area can be used as the through hole for inserting the second plate portion. In this case, the gap between the second plate portion and the through hole is small. Therefore, for example, even when hot air is blown to the housing, the second plate portion, that is, the fuse does not tilt significantly, and the housing stands substantially perpendicular to the plate surface of the circuit board. As a result, when mounting by the reflow method, it is not necessary to fix the housing in a state of standing substantially vertically, and it is possible to realize inexpensive mounting.
- the two second plate portions are located inside the arrangement direction. ..
- the distance between the two second plate portions is short for the two terminals arranged on both sides in the arrangement direction. Therefore, in the configuration in which the second plate portion is inserted into the through hole of the circuit board, the distance between the two through holes into which the two terminals arranged on both sides are inserted is short.
- the inner surface of the through hole and the insulating substrate around the through hole are covered with the substrate plating, and the terminals are connected to the substrate plating by soldering.
- a circuit board on which components are mounted a circuit board having a wiring pattern formed inside the insulating board may be used. Wiring patterns are often not provided between two adjacent through holes on the surface and inside of the insulating substrate. When the distance between the through holes into which the two terminals are inserted is short, the permission area in which the wiring pattern can be formed is wide on the surface and inside of the insulating substrate, so that the degree of freedom in designing the wiring pattern is high.
- the tip surfaces of the plurality of first plate portions protruding from the housing are located on the same plane.
- the plurality of terminals are inserted into the plurality of through holes provided in the circuit board.
- the area of the through hole is slightly larger than the cross-sectional area of the second plate portion
- each of the plurality of first plate portions is around the through hole. It hits the circuit board.
- the tip surfaces of the plurality of first plate portions are located on the same plane. Therefore, the fuse is supported by the circuit board in a stable state.
- the vehicle-mounted device includes a fuse and a circuit board to which the fuse is attached, and the fuse includes a plurality of long plate-shaped terminals arranged in a row and the plurality of terminals. It has a fusing portion connected to two terminals in the terminal, a part of the plurality of terminals and a housing that covers the fusing portion and has heat resistance, and a current flows through the fusing portion to cause the fusing.
- the part is blown when the temperature of the fusing part becomes a predetermined temperature or higher, the housing has a heat resistance of 300 degrees or more, and each terminal is a metal body and tin covering the surface of the metal body.
- Each of the plurality of terminals has a terminal plating made of metal, a long plate-shaped first plate portion partially covered by the housing, and a second plate portion connected to the first plate portion.
- the one end of the first plate portion protrudes from a common surface of the housing, and the second plate portion protrudes from a part of the tip surface of the first plate portion protruding from the housing.
- the cross-sectional area of the second plate portion is smaller than the cross-sectional area of the first plate portion
- the circuit board includes an insulating substrate, a plurality of through holes penetrating the insulating substrate, and a plurality of covering the insulating substrate.
- Each of the plurality of terminals is inserted into a plurality of through holes, and is connected to the plurality of substrate platings by soldering.
- each of the plurality of terminals of the fuse is inserted into a plurality of through holes provided in the insulating substrate. After that, each of the plurality of terminals is connected to the plurality of substrate platings by soldering. As a result, the device is realized.
- FIG. 1 is a front view of the fuse 1 in the first embodiment.
- FIG. 2 is a side view of the fuse 1.
- the fuse 1 includes a resin housing 10. As shown in FIGS. 1 and 2, in the fuse 1, two terminals 11 project from a common surface of the housing 10. Each terminal 11 has conductivity.
- FIG. 3 is a cross-sectional view of the terminal 11.
- Each terminal 11 has a long plate-shaped metal body 30.
- the plate surfaces on both sides of the metal body 30 are covered with tin (Sn) terminal plating 31.
- the board surface is the wide surface of the board.
- a metal body 30 is exposed on the side surface of each terminal 11.
- the metal body 30 and the terminal plating 31 have conductivity.
- the metal body 30 is manufactured by using, for example, a zinc alloy. In drawings other than FIG. 3, the description of the metal body 30 and the terminal plating 31 is omitted.
- the terminal plating 31 may cover a surface of the metal body 30, for example, a side surface different from the plate surface.
- FIG. 4 is a cross-sectional view of the fuse 1.
- the housing 10 has a box shape with one open surface. A part of each of the two terminals 11 is covered by the housing 10. As described above, the two terminals 11 project from one common surface of the housing 10. Here, one common surface is an open surface, which is located on the lower side of FIGS. 1, 2, and 4.
- the two terminals 11 are arranged in a row. The two terminals 11 are connected to a rod-shaped fusing portion 12.
- the fusing portion 12 has conductivity.
- the fusing portion 12 is also covered by the housing 10.
- Examples of the electric circuit including the fuse 1 include a circuit in which the fuse 1 is connected to a battery and a load. Specifically, one terminal 11 of the fuse 1 is connected to the positive electrode of the battery. The other terminal 11 of the fuse 1 is connected to one end of the load via a switch. The negative electrode of the battery and the other end of the load are grounded. The load is an electrical device mounted on the vehicle. In this electric circuit, when the switch is on, the current flows in the order of one terminal 11, the fusing portion 12, and the other terminal 11.
- the fusing part 12 When an electric current flows through the fusing part 12, the fusing part 12 generates heat. The larger the current value of the current flowing through the fusing portion 12, the larger the calorific value of the fusing portion 12.
- the calorific value per unit time of the fusing portion 12 exceeds the heat radiation amount per unit time, the temperature of the fusing portion 12 rises.
- the temperature of the fusing portion 12 continues to rise.
- the temperature of the fusing portion 12 exceeds a predetermined temperature, for example, 420 degrees, the fusing portion 12 is fused. As a result, the flow of electric current through the fusing portion 12 is stopped. As a result, overcurrent is prevented from flowing in the load.
- FIG. 5 is an explanatory diagram of a state of the two terminals 11 and the fusing portion 12 as viewed from the upper side of FIG.
- each terminal 11 has a long plate shape.
- the plate surfaces of the two terminals 11 are aligned, and FIG. 4 shows the plate surfaces of the two terminals 11.
- one end protrudes from a common surface (open surface) of the housing 10 toward the lower side of FIG. It is preferable that the plate surfaces of the two terminals 11 are located on the same plane.
- the fuse 1 is a blade type fuse.
- the cross-sectional area of the terminals of a blade-type fuse is larger than the cross-sectional area of the terminals of a chip-type fuse. Therefore, the blade type fuse can be used as a fuse in a circuit through which a large current flows when the state is normal.
- the end of the long plate-shaped second plate portion 21 is connected to the end of the long plate-shaped first plate portion 20.
- a part of the first plate portion 20 is covered by the housing 10.
- the first end portion of the first plate portion 20 projects toward the lower side of FIG. 4 from the common surface of the housing 10 described above.
- the common surface of the housing 10 and the tip surface of the first end portion of the first plate portion 20 are parallel. Further, for the two terminals 11, the tip surfaces of the first end portions of the two first plate portions 20 are located on the same plane.
- the parallelism of the common one surface and the tip surface does not mean only perfect parallelism, but may be substantially parallel. Therefore, the state in which the common one surface and the tip surface are parallel includes the state in which the angle formed by the common one surface and the tip surface is a value within the design error range. Further, the fact that the two tip surfaces are located on the same plane means that there is substantially no step between the two tip surfaces. Therefore, when the step between the two tip surfaces is within the design error range, the two tip surfaces are located on the same plane.
- the second plate portion 21 projects from a part of the tip surface of the first end portion of the first plate portion 20 along the length direction of the first plate portion 20.
- the cross-sectional area of the second plate portion 21 is smaller than the cross-sectional area of the first plate portion 20, and the second plate portion 21 is thinner than the first plate portion 20.
- the thicknesses of the first plate portion 20 and the second plate portion 21 are the same, and the plate surfaces of the first plate portion 20 and the second plate portion 21 are continuous.
- the length directions of the first plate portion 20 and the second plate portion 21 are the same, and are the vertical directions of FIGS. 1, 2, and 4.
- the cross-sectional area of the first plate portion 20 and the second plate portion 21 is obtained by cutting along the width direction of the first plate portion 20 and the second plate portion 21, that is, along the left-right direction of FIGS. 1, 2 and 4. The area of the cross section to be formed.
- the matching of the thicknesses of the first plate portion 20 and the second plate portion 21 does not mean only a perfect matching, but may be a substantial matching. Therefore, the state in which the thicknesses of the first plate portion 20 and the second plate portion 21 are the same includes a state in which the difference between the two thicknesses is within an error range. Further, the match in the two length directions does not mean only a perfect match, but may be a substantial match. Therefore, the state in which the two length directions coincide with each other includes the state in which the angle formed by the two length directions is within the error range.
- the two second plate portions 21 are located inside the arrangement direction of the two terminals 11.
- the arrangement direction is the left-right direction in FIG. Therefore, in FIG. 4, for the terminal 11 on the left side, the second plate portion 21 protrudes from the right edge portion on the tip surface of the first end portion of the first plate portion 20.
- the second plate portion 21 projects from the left edge portion on the tip surface of the first end portion of the first plate portion 20.
- the tip portion of the second plate portion 21 has a pyramidal trapezoidal shape, and the portion of the second plate portion 21 near the housing 10 has a large cross-sectional area and is far from the housing 10. The cross-sectional area of is small.
- the rod-shaped fusing portion 12 is arranged between the first plate portions 20 of the two terminals 11.
- One end of the fusing portion 12 is connected to the side surface of the first plate portion 20 of the one terminal 11.
- the other end of the fusing portion 12 is connected to the side surface of the first plate portion 20 of the other terminal 11.
- the two sides to which the fusing portion 12 is connected face each other.
- the fusing portion 12 is bent and has a V shape as a whole. In the example of FIG. 4, the fusing portion 12 is bent upward in FIG.
- the shape of the fusing portion 12 is not limited to the V shape, and may be, for example, an S shape.
- the housing 10 is provided with two openings 40 on one side of the housing 10 located on the opposite side of the above-mentioned common side, that is, on the upper side of FIG.
- Each of the second ends of the first plate portion 20 of the two terminals 11 faces the two openings 40.
- the user of the fuse 1 measures the resistance value between the two terminals 11 using, for example, a tester. The user can confirm whether or not the fusing portion 12 is fusing based on the measured resistance value.
- FIG. 6 is an explanatory diagram showing a state in which the fuse 1 is attached to the circuit board 5.
- FIG. 7 is another explanatory view showing a state in which the fuse 1 is attached to the circuit board 5.
- the circuit board 5 is a so-called printed circuit board.
- the fuse 1 is attached to the circuit board 5 by the solder H. 6 and 7 show a state after the fuse 1 is attached to the circuit board 5 by the solder H. 6 and 7 show a cross section of the circuit board 5.
- the circuit board 5 has an insulating substrate 50.
- the insulating substrate 50 is provided with two through holes 50a penetrating from the front side plate surface to the back side plate surface.
- the number of through holes 50a is equal to or greater than the number of terminals 11 of the fuse 1.
- the opening of the through hole 50a has a circular shape (see FIG. 9).
- the upper plate surface is the front side plate surface, and the lower plate surface is the back side plate surface.
- a plurality of wiring patterns 52 having conductivity are arranged on the front side plate surface of the insulating substrate 50.
- a plurality of wiring patterns 52 are also arranged on the back plate surface of the insulating substrate 50.
- the inner surface of each through hole 50a is covered with the substrate plating 51.
- the substrate plating 51 has conductivity.
- the peripheral edge portion of the through hole 50a on each of the front side plate surface and the back side plate surface is covered with the wiring pattern 52.
- each substrate plating 51 covers the peripheral edge portion of the through hole 50a on each of the front side plate surface and the back side plate surface via the wiring pattern 52.
- the substrate plating 51 covers the peripheral edge portion of the through hole 50a from the upper side of the wiring pattern 52 and covers the peripheral edge portion of the through hole 50a from the lower side of the wiring pattern 52.
- the substrate plating 51 contains, for example, a tin component.
- the wiring pattern 52 is made of, for example, copper.
- the substrate plating 51 is in contact with the wiring pattern 52 and is conducting with the wiring pattern 52.
- the inner surface and the peripheral portion of the through hole 50a are covered with the insulating resist 53.
- the area of the through hole 50a is slightly larger than the cross-sectional area of the second plate portion 21 of the terminal 11. Therefore, the second plate portion 21 of the terminal 11 can be inserted into the through hole 50a. Since the width of the first plate portion 20 is sufficiently long, when the second plate portion 21 is inserted into the through hole 50a, the first plate portion 20 of the terminal 11 does not pass through the through hole 50a and the substrate around the through hole 50a. It hits the plating 51. Since the tip surfaces of the first ends of the two first plate portions 20 are located on the same plane, the fuse 1 is supported by the circuit board 5 in a stable state.
- each of the second plate portions 21 of the two terminals 11 is provided with two through holes from the front side of the insulating substrate 50, that is, from the upper side of FIGS. 6 and 7. Insert into 50a.
- the first plate portion 20 of the two terminals 11 is supported by the substrate plating 51 covering the front plate surface.
- a part of the second plate portion 21 is exposed from the back plate surface of the circuit board 5.
- the fuse 1 and the circuit board 5 are passed through the reflow furnace.
- hot air is blown to the fuse 1 and the circuit board 5, or infrared rays are applied to the fuse 1 and the circuit board 5.
- the paste-like solder H is melted, and the solder H connects the terminal 11 and the substrate plating 51.
- a part of the solder H is formed on the first plate portion 20 of the terminal 11 exposed from the housing 10 along the axis of the first plate portion 20. It adheres to the plate surface and the end surface, and also adheres to the substrate plating 51 covering the front plate surface of the insulating substrate 50.
- solder H has conductivity.
- the terminal 11 and the substrate plating 51 are made conductive by the solder H.
- Each of the two terminals 11 of the fuse 1 is connected to the two board plating 51 of the circuit board 5 by soldering H. As a result, the in-vehicle device 6 is realized.
- the fuse 1 is attached to the circuit board 5.
- Each of the two terminals 11 is inserted into the two through holes 50a.
- Each of the two terminals 11 is connected to the two substrate plating 51 by the solder H.
- the in-vehicle device 6 has a plurality of circuit elements including a fuse 1.
- a circuit element different from the fuse 1 is also attached to the circuit board 5.
- the circuit board 5 into which the fuse 1 is inserted passes through the first region and the second region in this order in the reflow furnace.
- the temperature in the first region is a temperature in the range of 170 degrees to 190 degrees.
- the circuit board 5 is located in the first region for 80 to 140 seconds.
- the temperature in the second region is a temperature in the range of 230 degrees to 250 degrees.
- the circuit board 5 is located in the second region for 60 to 90 seconds.
- the fuse 1 When the fuse 1 is attached to the circuit board 5 by the reflow method, hot air is blown to the housing 10 or infrared rays are irradiated to the housing 10. At this time, the temperature of the housing 10 rises.
- the housing 10 of the fuse 1 has heat resistance. Therefore, when the temperature of the housing 10 is X degrees or less, deformation or melting does not occur in the housing 10.
- X is a positive real number. With respect to the housing 10, a heat resistance of 300 degrees or higher means that X is 300 or higher. If no deformation or melting occurs in the housing 10, the shape of the housing 10 is maintained.
- the housing 10 has a heat resistance of 300 degrees or higher.
- the housing 10 when the temperature of the housing 10 is less than 300 degrees, the shape of the housing 10 is maintained without deformation or melting in the housing 10. Therefore, the housing 10 is not melted or deformed by blowing hot air or irradiating with infrared rays.
- the configuration of the fuse 1 is suitable for mounting on the circuit board 5 by the reflow method.
- the housing 10 not only the housing 10 but also the fuse 1 has heat resistance. Therefore, when the temperature of the fuse 1 is Y degree or less, the fusing characteristics of the fuse 1 do not substantially change, and the long-term reliability does not substantially decrease.
- a heat resistance of 300 degrees or higher means that Y is 300 or higher.
- the fuse 1 has a heat resistance of 300 degrees or higher. Therefore, when the temperature of the fuse 1 is less than 300 degrees, the fusing characteristics do not substantially change, and the long-term reliability does not substantially decrease.
- the fusing characteristic shows the relationship between the current flowing through the fuse 1 and the fusing time from the flow of the current to the occurrence of fusing of the fusing portion 12.
- the fusing characteristics indicate the fusing time of various currents.
- Long-term reliability is the life in which the fuse 1 functions normally according to the specifications. It is not preferable that the life of the fuse 1 is shortened by the reflow method.
- Examples of the heat-resistant resin used for manufacturing the housing 10 include nylon resin
- the surface of the metal body 30 is covered with the tin terminal plating 31.
- the solder H usually contains a tin component. Therefore, with respect to the terminal 11 having the tin terminal plating 31, the solder H is easy to get used to, so-called wettability. Therefore, the solder H strongly adheres to the terminal 11.
- the terminal plating 31 is not limited to tin, and may be, for example, an alloy containing a tin component.
- the second plate portion 21 protrudes from the tip surface of the first plate portion 20, and a stepped structure is realized.
- the first plate portion 20 does not pass through the through hole 50a and hits the substrate plating 51 on the insulating substrate 50. Therefore, the housing 10 is separated from the circuit board 5.
- the fillet-shaped solder H is likely to be formed. The formation of the fillet-shaped solder H means that good mounting is achieved.
- the terminal 11 is inserted into the through hole 50a in a state where the paste-like solder H is applied on the substrate plating 51. Since the stepped structure is realized as described above, when the terminal 11 is inserted into the through hole 50a, the housing 10 does not come into contact with the paste-like solder H. Therefore, when the solder H is melted by the reflow method, it is unlikely that the ball-shaped solder H is formed.
- the cross-sectional area of the second plate portion 21 is smaller than the cross-sectional area of the first plate portion 20, and the second plate portion 21 is thin. Therefore, as the through hole 50a, a through hole having a small area can be used. In this case, the gap between the second plate portion 21 and the through hole 50a is small. Therefore, for example, even when hot air is blown to the housing 10, the second plate portion 21, that is, the fuse 1 does not tilt significantly, and the housing 10 is substantially relative to the plate surface of the circuit board 5. Standing vertically. As a result, when mounting is performed by the reflow method, it is not necessary to fix the housing 10 in a state of standing substantially vertically, and it is possible to realize inexpensive mounting.
- the two second plate portions 21 are located inside the arrangement direction of the two terminals 11, so that the second plate portions 21 of the two terminals 11 are located inside.
- the distance between them is short. Therefore, the distance between the two through holes 50a into which the two second plate portions 21 are inserted is short.
- the effect obtained when the distance between the two through holes 50a is short will be described.
- FIG. 8 is a cross-sectional view of the circuit board 5.
- the wiring pattern 52 is provided on both or one of the front side plate surface and the back side plate surface of the insulating substrate 50.
- the wiring pattern 52 is provided on both the front side plate surface and the back side plate surface of the insulating substrate 50.
- the wiring pattern 52 is also provided inside the insulating substrate 50.
- two layers are formed inside the insulating substrate 50, and a plurality of wiring patterns 52 are provided in each layer. Two connections in the four wiring patterns 52 provided on the front side plate surface, the two layers and the back side plate surface, respectively, are realized by vias.
- FIG. 9 is an explanatory diagram of the effect obtained when the distance between the two through holes is short.
- the wiring pattern 52 is not provided between the two through holes 50a of the fuse 1. Therefore, as shown in FIG. 9, when the distance between the two through holes 50a is long, the prohibited area where the wiring pattern 52 is prohibited is wide. On the other hand, when the distance between the two through holes 50a is short, the prohibited area of the wiring pattern 52 is narrow by the two areas indicated by the hatching of the horizontal line.
- the distance between the two through holes 50a into which the two terminals 11 of the fuse 1 are inserted is short. Therefore, inside the insulating substrate 50, the prohibited area of the wiring pattern 52 is narrow, and the permitted area where the wiring pattern 52 can be formed is wide. Similarly, on the surface of the insulating substrate 50, the prohibited area of the wiring pattern 52 is narrow, and the permitted area where the wiring pattern 52 can be formed is wide. As a result, the degree of freedom in designing the wiring pattern 52 is high.
- the number of terminals 11 included in the fuse 1 is 2.
- the number of terminals 11 included in the fuse 1 is not limited to 2.
- the difference between the second embodiment and the first embodiment will be described.
- Other configurations other than the configurations described later are common to the first embodiment. Therefore, the same reference reference numerals as those in the first embodiment are assigned to the components common to the first embodiment, and the description of the components will be omitted.
- FIG. 10 is a front view of the fuse 1 in the second embodiment.
- the side surface of the fuse 1 in the second embodiment is the same as the side surface of the fuse 1 shown in FIG.
- three terminals 11 project from a common surface (open surface) of the housing 10. Each terminal 11 has conductivity.
- FIG. 11 is a cross-sectional view of the fuse 1. As shown in FIGS. 2, 10 and 11, a part of each of the three terminals 11 is covered by the housing 10. As shown in FIG. 11, inside the housing 10, the three terminals 11 are arranged in a row. The fuse 1 has two blown portions 12. Two adjacent terminals 11 are connected by a fusing portion 12. The two fusing portions 12 are also covered by the housing 10.
- Examples of the electric circuit including the fuse 1 include a circuit in which the fuse 1 is connected to a battery and two loads. Specifically, the central terminal 11 is connected to the positive electrode of the battery. Each of the two terminals 11 arranged on both sides is connected to one end of the load via a switch. The negative electrode of the battery and the other ends of the two loads are grounded. The two loads are the electrical equipment mounted on the vehicle.
- the switch of the terminal 11 located on the left side of FIG. 11 is on, the current flows in the order of the central terminal 11, the fusing portion 12, and the terminal 11 on the left side.
- the switch of the terminal 11 located on the right side of FIG. 11 is on, the current flows in the order of the central terminal 11, the fusing portion 12, and the right terminal 11.
- the fusing portion 12 when a current flows through the fusing portion 12, the fusing portion 12 generates heat. When the temperature of the fusing portion 12 exceeds a predetermined temperature, for example, 420 degrees, the fusing portion 12 is fused.
- each terminal 11 has a long plate shape.
- the plate surfaces (wide surfaces) of the three terminals 11 are aligned.
- One end of the three terminals 11 projects downward from FIG. 11 from a common surface of the housing 10.
- the end portion of the long plate-shaped second plate portion 21 is connected to the end portion of the long plate-shaped first plate portion 20.
- a part of the first plate portion 20 is covered by the housing 10.
- the first end portion of the first plate portion 20 projects toward the lower side of FIG. 11 from the common surface of the housing 10 described above.
- the common surface of the housing 10 and the tip surface of the first end portion of the first plate portion 20 are parallel. Further, for the three terminals 11, the tip surfaces of the first end portions of the three first plate portions 20 are located on the same plane.
- the plate surfaces of the three terminals 11 are located on the same plane.
- the parallelism of the common one surface and the tip surface does not mean only perfect parallelism, but may be substantially parallel.
- the three tip surfaces do not have to be located on the same plane. The fact that the three tip surfaces are coplanar means that there is virtually no step between the two most distant tip faces of the three tip faces. Therefore, when the step of the two most distant tip surfaces among the three tip surfaces is within the design error range, the three tip surfaces are located on the same plane.
- the second plate portion 21 projects from a part of the tip end surface of the first end portion of the first plate portion 20 along the length direction of the first plate portion 20.
- the cross-sectional area of the second plate portion 21 is smaller than the cross-sectional area of the first plate portion 20, and the second plate portion 21 is thinner than the first plate portion 20.
- the thicknesses of the first plate portion 20 and the second plate portion 21 are the same, and the plate surfaces of the first plate portion 20 and the second plate portion 21 are continuous.
- the length directions of the first plate portion 20 and the second plate portion 21 are the same, and are the vertical directions in FIG. It should be noted that the matching of the thicknesses of the first plate portion 20 and the second plate portion 21 does not mean only a perfect matching, but may be a substantial matching.
- a match in two length directions does not mean only a perfect match, but may be a substantial match.
- the two second plate portions 21 are located inside in the arrangement direction.
- the arrangement direction is the left-right direction in FIG. Therefore, in FIG. 11, for the terminal 11 on the left side, the second plate portion 21 protrudes from the right edge portion on the tip end surface of the first end portion of the first plate portion 20. For the terminal 11 on the right side, the second plate portion 21 projects from the left edge portion on the tip surface of the first end portion of the first plate portion 20. Since the two second plate portions 21 project in this way, the distance between the second plate portions 21 of the two terminals 11 arranged on both sides is short.
- the second plate portion 21 may protrude from the tip surface of the first tip portion of the first plate portion 20. In the example of FIG. 11, the second plate portion 21 projects from the center of the tip surface of the first tip portion of the first plate portion 20.
- the tip portion of the second plate portion 21 has a pyramidal shape as in the first embodiment, and the second plate portion 21 has a large cross-sectional area near the housing 10 and is located far from the housing 10.
- the cross-sectional area is small.
- the cross-sectional area is, as described above, the area of the cross section obtained by cutting along the width direction of the second plate portion 21, that is, the left-right direction of FIGS. 10 and 11.
- the fusing portion 12 is arranged between the first plate portions 20 of two adjacent terminals 11. One end of the fusing portion 12 is connected to the side surface of the first plate portion 20 of the one terminal 11. The other end of the fusing portion 12 is connected to the side surface of the first plate portion 20 of the other terminal 11. The two sides to which the fusing portion 12 is connected face each other.
- the fusing portion 12 is bent and has a V shape as a whole. In the example of FIG. 11, the fusing portion 12 is bent upward in FIG.
- the shape of the fusing portion 12 is not limited to the V shape as in the first embodiment, and may be, for example, an S shape.
- the fuse 1 in the second embodiment is provided with three openings 40 corresponding to the three terminals 11 as in the first embodiment.
- Each of the second ends of the first plate portion 20 of the three terminals 11 faces the three openings 40.
- the user of the fuse 1 measures the resistance value between the two terminals 11 using, for example, a tester. The user can confirm whether or not the fusing is performed for each of the two fusing portions 12 based on the measured resistance value.
- FIG. 12 is an explanatory diagram showing a state in which the fuse 1 is attached to the circuit board 5.
- FIG. 12 corresponds to FIG. FIG. 12 shows a cross section of the circuit board 5.
- the insulating substrate 50 of the circuit board 5 in the second embodiment is provided with three through holes 50a corresponding to the three terminals of the fuse 1.
- the three through holes 50a are arranged in a row. Similar to the first embodiment, the inner surface of each through hole 50a is covered with the substrate plating 51.
- the peripheral edge portion of the through hole 50a on each of the front side plate surface and the back side plate surface of the insulating substrate 50 is covered with the wiring pattern 52.
- each substrate plating 51 covers the peripheral edge portion of the through hole 50a on each of the front side plate surface and the back side plate surface via the substrate plating 51.
- the substrate plating 51 covers the peripheral edge portion of the through hole 50a from the upper side of the wiring pattern 52 and covers the peripheral edge portion of the through hole 50a from the lower side of the wiring pattern 52.
- the second plate portion 21 of the three terminals 11 is inserted into the three through holes 50a.
- each of the three terminals 11 of the fuse 1 is connected to the three board plating 51 of the circuit board 5 by soldering H.
- the in-vehicle device 6 is realized.
- the fuse 1 is attached to the circuit board 5.
- Each of the three terminals 11 is inserted into the three through holes 50a.
- Each of the three terminals 11 is connected to the three substrate plating 51 by the solder H.
- the housing 10 of the fuse 1 has a heat resistance of 300 degrees or higher.
- the fuse 1 also has a heat resistance of 300 degrees or higher.
- the in-vehicle device 6 has a plurality of circuit elements including a fuse 1. A circuit element different from the fuse 1 is also attached to the circuit board 5.
- FIG. 13 is an explanatory diagram of the effect obtained when the distance between the two through holes arranged on both sides is short.
- the wiring pattern 52 is also provided inside the insulating substrate 50. In many cases, the wiring pattern 52 is not provided between two adjacent through holes 50a. Therefore, as shown in FIG. 13, when the distance between the two through holes 50a arranged on both sides is long, the prohibited area in which the wiring pattern 52 is prohibited is wide. On the other hand, when the distance between the two through holes 50a arranged on both sides is short, the prohibited area of the wiring pattern 52 is narrow by the two areas indicated by the hatching of the horizontal line.
- the distance between the two through holes 50a into which the two terminals 11 of the fuse 1 are inserted is short. Therefore, the prohibited area of the wiring pattern 52 is narrow, and the permitted area where the wiring pattern 52 can be formed is wide. Similarly, on the surface of the insulating substrate 50, the prohibited area of the wiring pattern 52 is narrow, and the permitted area where the wiring pattern 52 can be formed is wide. As a result, the degree of freedom in designing the wiring pattern 52 is high.
- the wiring pattern 52 described here is a wiring pattern whose potential is different from that of the substrate plating 51.
- each of the fuse 1 and the vehicle-mounted device 6 in the second embodiment similarly exhibits the effects of the fuse 1 and the vehicle-mounted device 6 in the first embodiment.
- the number of terminals 11 included in the fuse 1 is not limited to 3, and may be 4 or more.
- each of the plurality of fusing portions 12 is connected to a common terminal 11 and one of the remaining terminals 11. Therefore, it is assumed that the number of terminals 11 is represented by N.
- N is an integer of 4 or more.
- the number of fusing portions 12 is (N-1), and (N-1) fusing portions 12 are connected to a common terminal 11.
- the common terminal 11 is, for example, a terminal connected to a battery, and the remaining terminals 11 are terminals connected to a load.
- the configuration of the terminal 11 is not limited to the configuration in which the second plate portion 21 protrudes from the tip surface of the first plate portion 20.
- the terminal 11 may be configured by a sufficiently long first plate portion 20.
- the opening of the through hole 50a has a rectangular shape, and the first plate portion 20 is inserted into the through hole 50a of the circuit board 5.
- the first plate portion 20 is connected to the substrate plating 51 by the solder H.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Fuses (AREA)
Abstract
Description
本出願は、2020年12月4日出願の日本出願第2020-202068号に基づく優先権を主張し、前記日本出願に記載された全ての記載内容を援用するものである。
特許文献1では、ヒューズホルダにブレード型のヒューズを挿入することによって車載機器が実現されている。この車載機器の構成は、ヒューズホルダが回路基板上に取り付けられている構成であるため、サイズが大きいという問題がある。車両内では、限られた領域に多数の機器を配置するため、車載機器のサイズは小さいことが好ましい。
本開示によれば、ヒューズの構成がリフロー方式での回路基板への取り付けに適している。
最初に本開示の実施態様を列挙して説明する。以下に記載する実施形態の少なくとも一部を任意に組み合わせてもよい。
本開示の実施形態に係るヒューズの具体例を、以下に図面を参照しつつ説明する。なお、本発明はこれらの例示に限定されるものではなく、請求の範囲によって示され、請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。
<ヒューズの構成>
図1は実施形態1におけるヒューズ1の正面図である。図2はヒューズ1の側面図である。ヒューズ1は、樹脂製のハウジング10を備える。図1及び図2に示すように、ヒューズ1では、ハウジング10の共通の一面から2つの端子11が突出している。各端子11は導電性を有する。
なお、端子メッキ31は、板面とは異なる金属体30の面、例えば側面を覆ってもよい。
なお、2つの端子11の板面は同一平面上に位置していることが好ましい。
なお、溶断部12の形状は、V字状に限定されず、例えば、S字状であってもよい。
図6は、ヒューズ1が回路基板5に取り付けられた状態を示す説明図である。図7は、ヒューズ1が回路基板5に取り付けられた状態を示す他の説明図である。回路基板5は、所謂、プリント基板である。ヒューズ1は、半田Hによって回路基板5に取り付けられる。図6及び図7は、ヒューズ1が半田Hによって回路基板5に取り付けられた後の状態を示している。図6及び図7には、回路基板5の断面が示されている。図6及び図7に示すように、回路基板5は絶縁基板50を有する。絶縁基板50では、表側板面から裏側板面まで貫通する2つの貫通孔50aが設けられている。貫通孔50aの数は、ヒューズ1の端子11の数以上である。貫通孔50aの開口は円形状をなす(図9参照)。絶縁基板50について、図6及び図7では、上側の板面が表側板面であり、下側の板面が裏側板面である。
ハウジング10の製造に用いられる耐熱性の樹脂として例えばナイロン樹脂が挙げられる。
なお、端子メッキ31は、錫製に限定されず、例えば、錫成分を含む合金製であってもよい。
図8は回路基板5の断面図である。前述したように、回路基板5では、絶縁基板50の表側板面及び裏側板面の両方又は一方に配線パターン52が設けられている。図8の例では、絶縁基板50の表側板面及び裏側板面の両方に配線パターン52が設けられている。図8に示すように、配線パターン52は絶縁基板50の内部にも設けられている。図8の例では、絶縁基板50の内部に2つの層が形成されており、各層に複数の配線パターン52が設けられている。表側板面、2つの層及び裏側板面それぞれに設けられた4つの配線パターン52中の2つの接続はビアによって実現される。
実施形態1では、ヒューズ1が有する端子11の数は2である。しかしながら、ヒューズ1が有する端子11の数は、2に限定されない。
以下では、実施形態2について、実施形態1と異なる点を説明する。後述する構成を除く他の構成については、実施形態1と共通している。このため、実施形態1と共通する構成部には実施形態1と同一の参照符号を付し、その構成部の説明を省略する。
図10は実施形態2におけるヒューズ1の正面図である。実施形態2におけるヒューズ1の側面は、図2に示すヒューズ1の側面と同様である。実施形態2におけるヒューズ1では、ハウジング10の共通の一面(開放面)から3つの端子11が突出している。各端子11は導電性を有する。
また、共通の一面及び先端面の平行は、完全な平行のみを意味せず、実質的な平行であればよい。また、3つの先端面は同一平面上に位置していなくてもよい。3つの先端面が同一平面上に位置することは、3つの先端面の中で最も離れている2つの先端面の段差が実質的にないことを意味する。従って、3つの先端面の中で最も離れている2つの先端面の段差が設計上の誤差範囲内の値である場合、3つの先端面は同一平面上に位置する。
なお、第1板部分20及び第2板部分21の厚みの一致は、完全な一致のみを意味せず、実質的な一致であればよい。2つの長さ方向の一致は、完全な一致のみを意味せず、実質的な一致であればよい。
なお、溶断部12の形状は、実施形態1と同様に、V字状に限定されず、例えば、S字状であってもよい。
図12は、ヒューズ1が回路基板5に取り付けられた状態を示す説明図である。図12は図6に対応する。図12には、回路基板5の断面が示されている。実施形態2における回路基板5の絶縁基板50では、ヒューズ1が有する3つの端子に対応する3つの貫通孔50aが設けられている。3つの貫通孔50aは一列に並んでいる。実施形態1と同様に、各貫通孔50aの内面は基板メッキ51によって覆われている。絶縁基板50の表側板面及び裏側板面それぞれにおける貫通孔50aの周縁部は配線パターン52によって覆われている。各基板メッキ51は、貫通孔50aの内面に加えて、表側板面及び裏側板面それぞれにおける貫通孔50aの周縁部を、基板メッキ51を介して覆っている。図11においては、基板メッキ51は、配線パターン52の上側から貫通孔50aの周縁部を覆うとともに、配線パターン52の下側から貫通孔50aの周縁部を覆っている。
図13は、両側に配置されている2つの貫通孔間の距離が短い場合に得られる効果の説明図である。実施形態1の説明で述べたように、回路基板5では、配線パターン52は絶縁基板50の内部にも設けられている。隣り合う2つの貫通孔50a間に配線パターン52が設けられないことが多い。このため、図13に示すように、両側に配置されている2つの貫通孔50a間の距離が長い場合、配線パターン52を設けることが禁止されている禁止領域は広い。一方で、両側に配置されている2つの貫通孔50a間の距離が短い場合、配線パターン52の禁止領域は、横線のハッチングで示す2つの領域分、狭い。
なお、実施形態2において、ヒューズ1が有する端子11の数は、3に限定されず、4以上であってもよい。この場合、例えば、複数の溶断部12それぞれは、共通の端子11と、残りの端子11中の1つとに接続される。従って、端子11の数がNで表されると仮定する。Nは4以上の整数である。溶断部12の数は(N-1)であり、(N-1)個の溶断部12は共通の端子11に接続される。共通の端子11は、例えば、バッテリに接続される端子であり、残りの端子11は負荷に接続される端子である。
5 回路基板
6 車載機器
10 ハウジング
11 端子
12 溶断部
20 第1板部分
21 第2板部分
30 金属体
31 端子メッキ
40 開口
50 絶縁基板
50a 貫通孔
51 基板メッキ
52 配線パターン
53 レジスト
H 半田
Claims (4)
- 車載機器が備えるヒューズであって、
一列に並べられている長板状の複数の端子と、
前記複数の端子中の2つの端子に接続される溶断部と、
前記複数の端子の一部及び前記溶断部を覆うハウジングと
を備え、
電流は前記溶断部を介して流れ、
前記溶断部は、前記溶断部の温度が所定温度を超えた場合に溶断され、
前記ハウジングは、300度以上の耐熱性を有し、
各端子は、
金属体と、
前記金属体の表面を覆う錫製の端子メッキと、
一部が前記ハウジングによって覆われている長板状の第1板部分と、
前記第1板部分に連結している第2板部分と
を有し、
前記複数の端子それぞれについて、前記第1板部分の一方の端部は前記ハウジングの共
通の一面から突出しており、
前記第2板部分は、前記ハウジングから突出している前記第1板部分の先端面の一部分
から突出しており、
前記第2板部分の断面積は前記第1板部分の断面積よりも小さい
ヒューズ。 - 前記複数の端子の並び方向の両側に配置されている2つの端子について、2つの第2板
部分は、前記並び方向の内側に位置している
請求項1に記載のヒューズ。 - 前記ハウジングから突出している複数の第1板部分の先端面は同一平面上に位置する
請求項1又は請求項2に記載のヒューズ。 - ヒューズと、
前記ヒューズが取り付けられる回路基板と
を備え、
前記ヒューズは、
一列に並べられている長板状の複数の端子と、
前記複数の端子中の2つの端子に接続される溶断部と、
前記複数の端子の一部及び前記溶断部を覆い、耐熱性を有するハウジングと
を有し、
電流は前記溶断部を介して流れ、
前記溶断部は、前記溶断部の温度が所定温度以上となった場合に溶断され、
前記ハウジングは、300度以上の耐熱性を有し、
各端子は、
金属体と、
前記金属体の表面を覆う錫製の端子メッキと、
一部が前記ハウジングによって覆われている長板状の第1板部分と、
前記第1板部分に連結している第2板部分と
を有し、
前記複数の端子それぞれについて、前記第1板部分の一方の端部は前記ハウジングの共
通の一面から突出しており、
前記第2板部分は、前記ハウジングから突出している前記第1板部分の先端面の一部分
から突出しており、
前記第2板部分の断面積は前記第1板部分の断面積よりも小さく、
前記回路基板は、
絶縁基板と、
前記絶縁基板を貫通する複数の貫通孔と、
前記絶縁基板を覆う複数の基板メッキと
を有し、
前記複数の端子それぞれは、複数の貫通孔に挿入されており、半田によって前記複数の
基板メッキに接続されている
車載機器。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202180080591.6A CN116529845A (zh) | 2020-12-04 | 2021-11-15 | 熔丝及车载设备 |
US18/254,977 US20240021395A1 (en) | 2020-12-04 | 2021-11-15 | Fuse and on-vehicle device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020202068A JP7049634B1 (ja) | 2020-12-04 | 2020-12-04 | ヒューズ及び車載機器 |
JP2020-202068 | 2020-12-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022118642A1 true WO2022118642A1 (ja) | 2022-06-09 |
Family
ID=81259234
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2021/041897 WO2022118642A1 (ja) | 2020-12-04 | 2021-11-15 | ヒューズ及び車載機器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20240021395A1 (ja) |
JP (1) | JP7049634B1 (ja) |
CN (1) | CN116529845A (ja) |
WO (1) | WO2022118642A1 (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6289750U (ja) * | 1985-11-27 | 1987-06-09 | ||
JPH10321107A (ja) * | 1997-05-23 | 1998-12-04 | Uchihashi Estec Co Ltd | 温度ヒュ−ズの実装方法及び合金型温度ヒュ−ズ |
JP2002038295A (ja) * | 2000-07-21 | 2002-02-06 | Sumitomo Bakelite Co Ltd | 回路基板の電気メッキ方法 |
JP2002163974A (ja) * | 2000-11-22 | 2002-06-07 | Taiheiyo Seiko Kk | ブレード形フューズ |
JP2005166410A (ja) * | 2003-12-02 | 2005-06-23 | Soundtech:Kk | ヒューズ |
JP2009170423A (ja) * | 2008-01-14 | 2009-07-30 | Littelfuse Inc | ブレードヒューズ |
JP2011076772A (ja) * | 2009-09-29 | 2011-04-14 | Autonetworks Technologies Ltd | ヒューズホルダ |
-
2020
- 2020-12-04 JP JP2020202068A patent/JP7049634B1/ja active Active
-
2021
- 2021-11-15 CN CN202180080591.6A patent/CN116529845A/zh active Pending
- 2021-11-15 WO PCT/JP2021/041897 patent/WO2022118642A1/ja active Application Filing
- 2021-11-15 US US18/254,977 patent/US20240021395A1/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6289750U (ja) * | 1985-11-27 | 1987-06-09 | ||
JPH10321107A (ja) * | 1997-05-23 | 1998-12-04 | Uchihashi Estec Co Ltd | 温度ヒュ−ズの実装方法及び合金型温度ヒュ−ズ |
JP2002038295A (ja) * | 2000-07-21 | 2002-02-06 | Sumitomo Bakelite Co Ltd | 回路基板の電気メッキ方法 |
JP2002163974A (ja) * | 2000-11-22 | 2002-06-07 | Taiheiyo Seiko Kk | ブレード形フューズ |
JP2005166410A (ja) * | 2003-12-02 | 2005-06-23 | Soundtech:Kk | ヒューズ |
JP2009170423A (ja) * | 2008-01-14 | 2009-07-30 | Littelfuse Inc | ブレードヒューズ |
JP2011076772A (ja) * | 2009-09-29 | 2011-04-14 | Autonetworks Technologies Ltd | ヒューズホルダ |
Also Published As
Publication number | Publication date |
---|---|
CN116529845A (zh) | 2023-08-01 |
JP2022089575A (ja) | 2022-06-16 |
JP7049634B1 (ja) | 2022-04-07 |
US20240021395A1 (en) | 2024-01-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7564337B2 (en) | Thermally decoupling fuse holder and assembly | |
TWI475590B (zh) | 具有表面安裝端蓋及增進之連接性的超小型保險絲 | |
TWI389158B (zh) | Protective components and rechargeable battery devices | |
US8767368B2 (en) | Protective element and method for producing the same | |
JP5942898B2 (ja) | 電子部品及び電子制御装置 | |
US7473487B2 (en) | Temperature fuse, and battery using the same | |
TW201841179A (zh) | 保險絲元件 | |
JP6036408B2 (ja) | 電子部品及び電子制御装置 | |
JP2014165477A (ja) | 電子部品及び電子制御装置 | |
US9203170B2 (en) | Pin header | |
WO2022118642A1 (ja) | ヒューズ及び車載機器 | |
JP7500735B2 (ja) | 限流ヒューズ | |
WO2022176844A1 (ja) | 保護素子 | |
JPS5823138A (ja) | ヒユ−ズ回路板 | |
JP6989038B1 (ja) | 給電制御装置 | |
WO2021187063A1 (ja) | 電気装置 | |
JP6981953B2 (ja) | 基板表面実装ヒューズ | |
JP2002222626A (ja) | 電流ヒューズ、及びこの電流ヒューズを用いた電池 | |
WO2022113804A1 (ja) | 保護素子 | |
WO2024042813A1 (ja) | ヒューズ | |
JP5878028B2 (ja) | ブレードヒューズ | |
KR20170132581A (ko) | 온도 퓨즈 및 온도 퓨즈에 적용되는 인쇄회로기판 | |
JP2021027047A (ja) | 鉛直面取り付けデバイスパススルーヒューズ | |
KR101547427B1 (ko) | 복합보호소자 | |
JP2000173427A (ja) | 保護装置組立構体および保護装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 21900397 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 18254977 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 202180080591.6 Country of ref document: CN |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 21900397 Country of ref document: EP Kind code of ref document: A1 |