WO2022105451A1 - 传感器组件和阀装置 - Google Patents

传感器组件和阀装置 Download PDF

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Publication number
WO2022105451A1
WO2022105451A1 PCT/CN2021/121529 CN2021121529W WO2022105451A1 WO 2022105451 A1 WO2022105451 A1 WO 2022105451A1 CN 2021121529 W CN2021121529 W CN 2021121529W WO 2022105451 A1 WO2022105451 A1 WO 2022105451A1
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WO
WIPO (PCT)
Prior art keywords
wall
sensor assembly
base
housing
circuit board
Prior art date
Application number
PCT/CN2021/121529
Other languages
English (en)
French (fr)
Inventor
万霞
黄隆重
黄宁杰
Original Assignee
杭州三花研究院有限公司
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Filing date
Publication date
Application filed by 杭州三花研究院有限公司 filed Critical 杭州三花研究院有限公司
Publication of WO2022105451A1 publication Critical patent/WO2022105451A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K37/00—Special means in or on valves or other cut-off apparatus for indicating or recording operation thereof, or for enabling an alarm to be given
    • F16K37/0025—Electrical or magnetic means
    • F16K37/005—Electrical or magnetic means for measuring fluid parameters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G01K1/10—Protective devices, e.g. casings for preventing chemical attack
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00—Thermometers specially adapted for specific purposes
    • G01K13/006—Thermometers specially adapted for specific purposes for cryogenic purposes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00—Thermometers specially adapted for specific purposes
    • G01K13/02—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007—Fluidic connecting means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0092—Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/142—Multiple part housings
    • G01L19/143—Two part housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L2019/0053—Pressure sensors associated with other sensors, e.g. for measuring acceleration, temperature

Definitions

  • the present application relates to the field of sensor technology, and in particular, to a sensor assembly and a valve device.
  • a sensor assembly in the related art includes a base, an electronic circuit, and a temperature sensor element.
  • the sensor assembly isolates the temperature sensor and wires from the fluid through a closed, liquid-tight channel. Wires extend within the elongated tubular element and connect laterally through holes in the base to the circuit board.
  • the temperature sensor element is positioned relatively lower, so that the temperature sensor element can be closer to the fluid, while the electronic circuit needs to be isolated from the fluid, and the electronic circuit is arranged relatively upward.
  • the base and the tubular element are assembled and fixed, and the two are sealed and matched so that the wire of the temperature sensor located relatively lower extends upward and is connected to the electronic circuit located relatively upward, between the temperature sensing head of the temperature sensor element and the electronic circuit.
  • the distance is relatively long.
  • the related art has higher requirements on the tightness between the tubular element and the base, but it is difficult for the related art to achieve relatively good tightness requirements.
  • the present application provides a sensor assembly with good sealing effect, and a valve device including the sensor assembly.
  • a first aspect of the present application provides a sensor assembly, which includes:
  • the outer shell is provided with an inner cavity and a channel;
  • the base is at least partially accommodated in the inner cavity, the base includes a first wall portion, the first wall portion has a first surface and a second surface, the first surface and the first surface The two surfaces are located on different sides in the thickness direction of the first wall;
  • circuit board unit located on the side where the first surface is located
  • a temperature sensing element includes a temperature sensing part and a conductive part, the channel and the temperature sensing part are both located on the side where the second surface is located, and the conductive part is electrically connected to the temperature sensing part and the temperature sensing part.
  • the circuit board unit
  • the base further includes an accommodating part and an insulating part, and at least part of the conductive part and at least part of the insulating part are accommodated in the accommodating part; the base has a peripheral wall forming the accommodating part, The insulating portion is located between the peripheral wall and the conductive portion; at least part of the conductive portion and the peripheral wall accommodated in the accommodating portion are sealed and connected to the insulating portion, respectively.
  • a second aspect of the present application further provides a valve device, which includes the above-mentioned sensor assembly, the valve device further includes a valve body portion, the sensor assembly is fixedly mounted on the valve body portion, and the valve body portion Including a flow channel, the temperature sensing element is used to directly or indirectly detect the temperature of the fluid in the flow channel.
  • the circuit board unit and the temperature sensing portion are respectively located on different sides of the first wall portion of the base in the thickness direction; at least part of the conductive portion accommodated in the accommodating portion and the peripheral wall of the base are respectively sealed and connected to the insulating portion; Therefore, it is not easy for the fluid to pass between the conductive part and the peripheral wall of the base, which is beneficial to make the circuit board unit not easily contact with the fluid, so that the sensor assembly as a whole has better sealing performance.
  • FIG. 1 is a schematic three-dimensional structure diagram of a sensor assembly of the present application
  • FIG. 2 is a schematic diagram of an exploded structure of the sensor assembly of the present application.
  • Fig. 4 is a kind of sectional structure schematic diagram of the base of the application.
  • Fig. 6 is the exploded schematic diagram of the structure shown in Fig. 5;
  • FIG. 7 is a schematic cross-sectional structure diagram of the sensor assembly of the present application.
  • FIG. 9 is an enlarged schematic view of a part of the structure of FIG. 8;
  • FIG. 11 is an exploded schematic view of the second housing, pressure sensing element, sealing gasket and base of the application;
  • valve device 13 is a schematic structural diagram of the valve device of the application.
  • Figure 14 is a cross-sectional view from an angle of Figure 13;
  • Figure 15 is a cross-sectional view of another angle of Figure 13;
  • Fig. 16 is a schematic exploded view of a part of the structure of the valve device.
  • words such as “first”, “second” and similar words used in the description and claims of the present application do not indicate any order, quantity or importance, but are only used to distinguish the naming of features .
  • “a” or “an” and the like do not denote a quantitative limitation, but rather denote the presence of at least one.
  • words such as “front”, “rear”, “left”, “right”, “upper”, “lower” and other similar words appearing in this application are only for the convenience of description, and are not limited to a specific position or a type of spatial orientation.
  • a sensor assembly 100 provided by the present application can be integrated with various valve parts, such as being installed on a valve body to form a valve device, or combined with an electronic expansion valve, a thermal expansion valve , a solenoid valve, etc. are integrated into a valve device, and the sensor assembly 100 can be used to detect the temperature parameter of the refrigerant, and in some embodiments, can also detect the pressure parameter of the refrigerant. Of course, it can also be used to detect pressure parameters and temperature parameters of other fluids.
  • the sensor assembly 100 in the embodiment of the present application includes a housing 1 , a circuit board unit 2 , a base 3 and a temperature sensing element 4 .
  • the sensor assembly 100 is provided with an inner cavity 110 and a channel 112.
  • the channel 112 is provided in the housing 1, and the housing 1 can form an inner cavity 110 with a certain accommodation capacity. It is beneficial to make the temperature sensing element 4 more likely to come into contact with the fluid.
  • the sensor assembly 100 may also include structures such as a pressure sensing element 5 , a sealing gasket 6 , a protective cover 7 , etc., which will be described in detail in the following embodiments. .
  • the base 3 of the sensor assembly 100 is at least partially accommodated in the inner cavity 110 .
  • the base 3 includes a first wall portion 31 , and the first wall portion 31 has a first surface 311 and a second surface 312 .
  • the first surface 311 and the second surface 312 are located on different sides in the thickness direction of the first wall portion 31 .
  • the temperature sensing element 4 includes a temperature sensing part 40 and a conductive part 41 , the temperature sensing part 40 can be in direct contact with the fluid or indirectly in contact with the fluid, and the temperature sensing part 40 can sense the temperature signal of its surrounding environment.
  • the circuit board unit 2 is located on the side where the first surface 311 is located, and both the channel 112 and the temperature sensing portion 40 are located on the side where the second surface 312 is located.
  • the temperature sensing part 40 is at least partially located in the channel 112 , for example, the temperature sensing part 40 is all located in the channel 112 , or a part of the temperature sensing part 40 is located in the channel 112 , and the other part is located in a part of the housing 1 close to the inner cavity 110 .
  • the temperature sensing portion 40 is located on the side of the housing 1 away from the inner cavity 110, so that at least a portion of the temperature sensing portion 40 can be exposed to the channel 112, so that the temperature sensing portion 40 can be closer to the fluid, which can increase the temperature of the fluid. Induction accuracy.
  • the base 3 further includes an accommodating portion 32 and an insulating portion 33 .
  • the accommodating portion 32 may be a through-hole structure passing through the base 3 along the height direction of the base 3 , so that it has a certain accommodating space.
  • the base 3 has a peripheral wall 321 forming an accommodating portion 32 , and at least part of the conductive portion 41 and at least part of the insulating portion 33 are accommodated in the accommodating portion 32 .
  • the insulating portion 33 is located between the peripheral wall 321 of the base 3 that forms the accommodating portion 32 and the conductive portion 41.
  • the insulating portion 33 can isolate the conductive portion 41 and the base 3 in the accommodating portion 32 to form the peripheral wall 321 of the accommodating portion 32, and is accommodated in the accommodating portion.
  • At least part of the conductive portion 41 and the peripheral wall 321 of the 32 are sealed with the insulating portion 33 , respectively.
  • the insulating portion 33 and the base 3 are non-integrated structures before assembly, and the insulating portion 33 and the base 3 are independent components. After assembly, the insulating portion 33 and the peripheral wall 321 of the base 3 A sealed connection is formed between them.
  • the sensor assembly can be used to detect the temperature and/or pressure of the refrigerant in the automobile air conditioning system. Due to the high pressure of automobile air conditioners, the pressure of the refrigerant generally reaches 500Ps i. Therefore, it is more important to ensure the airtightness of the internal space of the sensor assembly under high pressure. Special attention should be paid to ensure that the circuit components avoid contact with fluids as much as possible. .
  • the insulating portion 33 and the base 3 may be made of different materials.
  • at least part of the conductive portion 41 , the insulating portion 33 and the base 3 accommodated in the accommodating portion 32 are sintered and fixed into an integrated structure.
  • the conductive portion 41 of the temperature sensing element 4, the base 3 and the insulating portion 33 are sintered and fixed at the accommodating portion 32, so that it is difficult for the fluid to contact the circuit board unit 2 upward through the base 3.
  • the sensor of the present application The assembly 100 is well sealed.
  • the material blank of the insulating portion 33 can be filled between the peripheral wall 321 of the base 3 forming the accommodating portion 32 and the conductive portion 41, and the aforementioned blank is transformed into a dense body through a sintering process.
  • the solid particles of the body are bonded to each other, the grains grow, the voids (pores) and grain boundaries gradually decrease, the total volume shrinks, but the density increases, and finally becomes a dense sintered body.
  • the structure formed by the preliminary assembled base, the conductive part and the corresponding material embryo of the insulating part can be heated to above the melting point of the material of the insulating part, and kept at this temperature for a certain period of time, so that the polymer molecules are formed by The crystalline form is gradually transformed into an amorphous form, so that the dispersed structural particles are bonded into a continuous whole through mutual fusion and diffusion.
  • the base 3 , the insulating portion 33 and the conductive portion 41 finally form an integrated structure.
  • the integrated structure is beneficial to protect the components on the side of the first surface 311 of the base 3 from directly contacting the fluid, so as to be more resistant to corrosion, and the sintering process is beneficial to increase the connection strength between the base 3 , the conductive portion 41 and the insulating portion 33 And the connection stability is beneficial to increase the accuracy of the temperature sensing element 4 to detect the temperature signal.
  • both the base 3 and the conductive portion 41 are made of metal. Metals can usually withstand the high temperatures of the sintering process.
  • the base 3 is made of aluminum, aluminum alloy or stainless steel, and the material of the conductive portion 41 can be made of aluminum, iron, steel or copper or other alloy materials.
  • the material of the insulating portion 33 is glass or ceramics.
  • the insulating portion 33 can be used as an adhesive material, and at least part of the conductive portion 41 accommodated in the accommodating portion 32 is bonded and fixed to the base 3 through the insulating portion 33 . and the peripheral wall 321 are sealed with the insulating portion 33 respectively.
  • the insulating part 33 can be a high-strength epoxy-based two-component structural adhesive or a single-component sealing structural adhesive. Select a suitable colloid as the insulating part 33, so that the conductive part 41 and the base 3 form a bonding and sealing relationship through the insulating part 33, and the fluid is not easy to flow from the side of the second surface 312 of the base 3 to the first surface 311. side. It is beneficial to achieve a relatively good sealing effect.
  • the insulating portion 33 and the base 3 may also be made of the same material, and at least part of the conductive portion 41 , the insulating portion 33 and the base 3 accommodated in the accommodating portion 32 are sintered and fixed as an integral structure. After being processed by the sintering process, the insulating portion 33 and the base 3 are tightly connected and connected into one body.
  • the temperature sensing portion 40 of the temperature sensing element 4 is exposed to the fluid environment to sense the temperature of the fluid, so that the temperature sensing portion 40 can be in direct contact with the fluid.
  • the temperature sensing part 40 can be a packaged thermistor, and its exterior is a resin-based composite material, which has a certain corrosion resistance. Therefore, the temperature sensing part 61 can be in direct contact with the fluid to shorten the temperature detection time. The response time improves the sensitivity of temperature signal detection.
  • the temperature sensing portion 61 of the temperature sensing element 6 may also cooperate with other components to form an insert or be surrounded by other structures to indirectly sense the temperature of the fluid.
  • the conductive part 41 includes a metal connector 43 and a pin 42 extending integrally from the temperature sensing part 40
  • the metal connector 43 includes a first part 431 , a second part 432 and a third part 433, the third part 433 is connected between the first part 431 and the second part 432, the third part 433 is accommodated in the accommodating part 32, that is to say, the third part 433 forms the accommodating part 32 through the insulating part 33 and the base 3.
  • the peripheral wall is sintered and fixed as an integral structure.
  • At least part of the first part 431 and at least part of the second part 432 are exposed to the base 3 , and at least part of the first part 431 is electrically connected to the circuit board unit 2 , for example, by soldering, laser welding or A welding method in resistance welding is welded and fixed, and at least a part of the second part 432 is electrically connected to the pins 42, for example, the two can be welded and fixed by one of soldering, laser welding or resistance welding.
  • the second part 432 and the pins 42 are both coated with anti-corrosion coatings, so that the second part 432 and the pins 42 exposed outside the base 5 are not easily corroded by fluid, which is beneficial to improve the product quality. Accuracy of lifetime and temperature signal detection.
  • the sensor assembly 100 further includes a pressure sensing element 5 .
  • the pressure sensing element 5 is located on the side where the first surface 311 is located.
  • the pressure sensing element 5 is located between the first wall portion 31 and the circuit board unit 2 .
  • the base 3 further includes a second wall portion 34.
  • the second wall portion 34 extends from the outer periphery of the first wall portion 31 in a direction away from the first surface 311.
  • the second wall portion 34 and the first wall portion 31 may be set perpendicular to each other.
  • the second wall portion 34 is provided around the peripheral side of the pressure sensing element 5 .
  • the first wall portion 31 and the second wall portion 34 enclose an accommodation space capable of accommodating the pressure sensing element 5 , so as to facilitate the assembly of the pressure sensing element 5 .
  • the first wall portion 31 is provided with a first hole 313 .
  • the first channel 313 extends from the first surface 311 to the second surface 312 .
  • At least a partial area of the surface of the pressure sensing element 5 facing the first wall 31 forms a pressure sensing area 51 for contact with the fluid.
  • the fluid can directly contact the pressure sensing area 51 , so that the pressure sensing element 5 can sense the pressure signal of the fluid through the pressure sensing area 51 .
  • the first hole 313 is at least partially opposite to the pressure sensing area 51 , so that the fluid directly and quickly acts on the pressure sensing area 51 under the diversion of the first hole 313 , and the pressure sensing element 5 is electrically connected to the circuit board unit 2 . In this way, the pressure signal sensed by the pressure sensing element 5 can be transmitted to the circuit board unit 2 for processing.
  • the pressure sensing element 5 can be fixed in the receiving space formed by the base 3 by means of circumferential sealing or bottom sealing.
  • pressure connection pins 50 protrude from the surface of the pressure sensing element 5 facing the circuit board unit 2 , and the pressure connection pins 50 are welded and fixed to the circuit board unit 2 through a spot welding process.
  • the circuit board unit 2 converts the pressure signal sensed by the pressure sensing element 5 and the temperature signal sensed by the temperature sensing element 4 into a corresponding voltage value by processing the collected temperature signal and pressure signal according to a certain logic algorithm.
  • the circuit board unit 2 may further include a conditioning chip, etc., whose function is to perform processing such as denoising, signal amplification, signal compensation, etc. on the pressure signal or the temperature signal, which is beneficial to improve the quality of the signal.
  • the temperature sensing head 40 of the temperature sensing element 4 can be disposed directly below the pressure sensing element 5, which is beneficial to realize the compact structure and miniaturization of the product.
  • the length direction of the metal connector 43 coincides with the thickness direction of the first wall portion 31 .
  • the first portion 431 is exposed on the top end surface of the second wall portion 34 away from the first wall portion 31 .
  • the second portion 432 is exposed on the second surface 312 of the first wall portion 31 .
  • the size of the metal connector 43 can be miniaturized, which is beneficial for the overall structure of the sensor assembly 100 to be more compact.
  • the sensor assembly 100 also includes a sealing gasket 6 between the surface of the pressure sensing element 5 facing the first wall portion 31 and the first surface 311 of the first wall portion 31 .
  • the sealing gasket 6 is compressed between the pressure sensing element 5 and the base 3 .
  • the area of the surface of the pressure sensing element 5 facing the first wall portion 31 corresponding to the area enclosed by the sealing gasket 6 overlaps at least a part of the area of the pressure sensing area 51 .
  • the base 5 is provided with a first boss 315 and a second boss 316 , and the first boss 315 is closer to the first boss 315 than the second boss 316
  • the central axis of the hole 313, the first boss 315 and the second boss 316 are arranged at a certain distance, and the first boss 315 and the second boss 316 are both annular bosses, and the second boss 316 is located on the outer ring,
  • the first boss 315 is located on the inner ring.
  • a recessed area is formed between the first boss 315 and the second boss 316, and the sealing gasket 6 can be installed in the recessed area, so as to facilitate the positioning of the sealing washer 6 by the structure of the base 5, and the sealing washer 6 will not be affected by the high temperature refrigerant. As for the deformed and shifted position, it is beneficial to improve the sealing effect of the sealing gasket 6 .
  • the housing 1 includes a first shell 10 and a second shell 20 , and the first shell 10 and the second shell 20 together form an inner cavity 110 .
  • the first case 10 has a case bottom wall 101 and a case side wall 102 , and a channel 112 is provided on the case bottom wall 101 .
  • the first case 10 is further provided with a step portion 103 , and the step portion 103 protrudes from the case bottom wall 101 toward the second surface 312 of the first wall portion 31 .
  • the second surface 312 is in contact with the top surface of the step portion 103 so that there is a gap between the case bottom wall 101 and the second surface 312 of the first wall portion 31 .
  • the second part 432 of the metal connector 43 is exposed on the second surface 312 of the base 3 and is accommodated in the gap.
  • the pins 42 and the second part 432 are welded at the gap and are not easily squeezed by other components, so that the High reliability.
  • the inner side of the housing side wall 102 and the outer peripheral side of the second wall portion 34 are circumferentially welded so that the housing side wall 102 and the outer peripheral side of the second wall portion 34 are circumferentially welded.
  • the second wall portion 34 is a sealing fit.
  • the specific welding position can be at the position A in FIG. 9 .
  • the gap between the inner side of the shell side wall 102 and the outer peripheral side of the second wall portion 34 is closely matched during the welding process, so that the shell side wall 102 and the second wall portion 34 are tightly matched during the welding process.
  • the part 34 is welded and fixed, and is conducive to realizing the miniaturization of the overall structure, and the welding method can be laser welding or other welding methods.
  • a sealing ring can also be used for sealing.
  • a sealing ring is provided between the bottom wall 101 of the case and the second surface 312 of the base 3, and the sealing ring is pressed against the bottom wall 101 of the case and the base 3. The sealing function is achieved between the second surfaces 312 of the seat 3 .
  • the base 3 is provided with two arc-shaped walls 35 , the two arc-shaped walls 35 are spaced apart from each other and disposed opposite to each other, and both arc-shaped walls 35 are located on the first wall portion 31 The side where the second surface 312 is located.
  • the axis line of the first hole 313 is located between the two arc-shaped walls 35 , and the axis line of the first hole 313 can be indicated by referring to the dotted line in FIG. 10 .
  • At least part of the pins 42 are located between the two arcuate walls 35 .
  • the sensor assembly 100 also includes a cover barrel 7 having a second hole 71 and a barrel wall 72 surrounding the second hole 71 .
  • the cover barrel 7 is located on the side where the second surface 312 is located.
  • the cylinder wall 72 of the cover cylinder 7 is provided with a number of notches or holes penetrating the cylinder wall 72 .
  • the arc-shaped wall 35 is at least partially located in the second channel 71, and the axial length of the cover cylinder 7 can be greater than the length of the arc-shaped wall 35.
  • One of the inner side of the cylinder wall 72 and the outer peripheral side of the arc-shaped wall 35 is provided with a groove 721, and the other is provided with a groove 721.
  • Lugs 351 are provided.
  • the groove 721 is provided on the inner side of the cylinder wall 72 of the cover cylinder 7
  • the lug 351 is provided on the outer peripheral side of the arc-shaped wall 35 .
  • the lugs 351 are at least partially received in the grooves 721 .
  • the grooves 721 and the lugs 351 can form a snap-fit structure, and the grooves 721 and the lugs 351 cooperate so that the cover cylinder 7 is fixed on the outer peripheral side of the arc-shaped wall 35 .
  • the refrigerant can enter the second hole 71 through the gap or hole in the wall 72 of the cover cylinder 7, and the second hole 71 is communicated with the first hole 313, so that the refrigerant finally
  • the second hole 71 and the first hole 313 can approach the pressure sensing element 5 and finally act on the pressure sensing area 51 of the pressure sensing element 5 .
  • the temperature sensing head 40 of the temperature sensing element 4 is at least partially located in the second hole 71 of the cover cylinder 7, and the cover cylinder 7 can protect and locate the temperature sensing element 4 and reduce the impact force of the fluid on the temperature sensing element 4, So as to play a certain protective role, is conducive to the stability of the entire product.
  • the temperature sensing head 40 of the temperature sensing element 4 extends completely out of the cover barrel 7 to be exposed, so that the temperature sensing element 4 can sense the temperature in a more timely and sufficient manner.
  • the temperature sensing head 40 of the temperature sensing element 4 can also be disposed close to the first wall 31 so that the temperature sensing head 40 is not in the second hole 71 or away from the second wall 31 and protrudes out of the second hole 71 .
  • the fluid will eventually contact the temperature sensing head 40 through structures such as the second hole 71 , which is not limited in this application.
  • the housing 1 of the sensor assembly 100 further includes a second housing 20 between which the circuit board unit 2 is at least partially located and the pressure sensing element 5 .
  • the first case 10 further has a first extension portion 111 , and the first extension portion 111 extends from the case side wall 102 to the axis of the channel 112 , that is, the first extension portion 111 is opposite to the case side wall 102 in the direction of the axis of the channel 112 .
  • the inner side is bent, and the second shell 20 has a main body part 201 and a second extension part 211 , and the second extension part 211 is located on the outer periphery of the main body part 201 .
  • the second extension portion 211 and the second wall portion 34 of the base 3 are jointly sandwiched and positioned between the first extension portion 111 and the top surface of the step portion 103 .
  • the second wall portion 34 of the base 3 is further provided with a plurality of third bosses 317 , and the third bosses 317 are located on the top surface of the second wall portion 34 away from the first wall portion 31 .
  • the corresponding second shell 20 may be provided with a plurality of grooves 221 matched with the third bosses 317 , the grooves 221 may be provided on the second extension portion 211 , and the notch of the grooves 221 is disposed toward the direction of the third boss 317 .
  • the third bosses 317 may be at least partially received in the corresponding grooves 221 .
  • the second extending portion 211 covers the circumferential weld between the inner side of the case side wall 102 and the outer peripheral side of the second wall portion 34 to further enhance the combination of the case side wall 102 and the second wall portion 34 tightness at the place.
  • the first shell 10 can be made of a metal material, and the purpose of using the metal material is to facilitate the processing of the flanging to form the first extension portion 111 and reduce the difficulty of forming.
  • the second shell 20 may be made of plastic material. This facilitates cost reduction and weight reduction of the sensor assembly 100 .
  • the specific assembly and forming process between the second shell 20, the base 3 and the first shell 10 is as follows: the part of the first extension part 111 first maintains the same vertical state as the shell side wall 102 and extends in the longitudinal direction; The second extension portion 211 of the second shell 20 and the second wall portion 34 of the base 3 are at least partially aligned in the longitudinal direction and are assembled into the cylindrical space enclosed by the shell side wall 102 after being butted. The first extension portion 111 of the 100 is pressed inward to form a lateral flange.
  • the second extension portion 211 and the second wall portion 34 of the base 3 are jointly clamped and positioned between the first extension portion 111 and the stepped portion 103 , so that the second case 20 can be stably installed relative to the first case 10 . fall.
  • an embodiment of the present application further provides a valve device 300 , which includes the sensor assembly 100 in the above embodiment, the valve device 300 further includes a valve body portion 8 , and the sensor assembly 100 is fixedly mounted on the valve body portion.
  • the valve body 8 includes a flow channel 81 , and the temperature sensing element 4 is used to directly or indirectly detect the temperature of the fluid in the flow channel 81 .
  • a sealing element 93 is further provided between the housing 1 and the valve body 8 , the valve body 8 is provided with a mounting cavity 94 , and the sensor assembly 100 is at least partially accommodated in the valve body 8 . inside the mounting cavity 94 .
  • the sealing element 93 can be compressed between the wall of the valve body portion 8 forming the mounting cavity 94 and the housing bottom wall 101 of the housing 1 .
  • the casing 1 and the valve body portion 8 are sealed by the sealing element 93 , and the flow channel 81 provided in the valve body portion 8 forms a liquid-tight channel that allows the fluid to flow along the axial direction of the flow channel 81 .
  • the temperature sensing head 40 of the temperature sensing element 4 may partially or fully extend into the flow channel 81 , so that the fluid can directly contact the temperature sensing head 40 , and the temperature sensing head 40 can sense the temperature of the fluid.
  • the area for detecting the fluid pressure formed by the sensor assembly 100 is also a closed chamber that allows the fluid to flow axially along the first channel 313 .
  • the sensor assembly 100 in the embodiment of the present application further includes several metal connections embedded in the second shell 20 shrapnel.
  • the metal connecting elastic piece has an outer end exposed to the outside of the second shell 20 and an inner end exposed to the inner side of the second shell 20 .
  • the inner end is connected to the circuit board unit 2
  • the outer end is connected to the external main circuit board 91 .
  • the metal connecting elastic pieces are embedded in the second shell 20 through an injection molding process.
  • the valve device 300 also includes a compression nut 92.
  • the housing 1 also has a convex structure extending integrally with the bottom wall 101 of the case.
  • the nut 92 has an annular shape and is disposed on the outer peripheral side of the housing side wall 102 .
  • the outer periphery of the compression nut 92 is screwed to the valve body portion 8 to fix the sensor device 100 and the valve body portion 8 together.
  • the valve device 300 provided in the embodiment of the present application may further include a fluid control assembly 301 , and the fluid control assembly 301 is fixed to the valve body 8 .
  • the fluid control assembly 301 may be an electronic expansion valve, which is used for refrigerant flow control in an automobile air conditioning system to realize throttling of the refrigerant.
  • the fluid control assembly 301 correspondingly includes a coil assembly and other structures, which will not be repeated in this application.
  • the sensor assembly 100 acts as a temperature and pressure sensor and can be used to detect the pressure and temperature of the refrigerant passing through the fluid control assembly 301 .
  • the fluid control assembly 301 may also be other control valves or thermal management system components, etc., which can implement corresponding control of the refrigerant in the thermal management system components.

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Abstract

本申请提供了一种传感器组件，包括外壳、电路板单元、基座和温度感应元件；传感器组件设有内腔和通道；基座至少部分收容于内腔，基座包括第一壁部，第一壁部具有第一表面和第二表面；电路板单元位于第一表面所在侧，温度感应元件包括感温部和导电部；通道和感温部位于第二表面所在侧；基座还包括容纳部和绝缘部；导电部的至少部分以及绝缘部的至少部分均收容于容纳部；绝缘部位于基座形成容纳部的周壁与导电部之间；收容于容纳部的至少部分导电部和基座形成容纳部的周壁分别与绝缘部密封连接；导电部电性连接感温部与电路板单元。本申请提供的传感器组件密封性较好。

Description

传感器组件和阀装置
本申请要求在2020年11月20日提交的、申请号为202011317063.1、发明创造名称为“传感器组件和阀装置”的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请涉及传感器技术领域，尤其涉及一种传感器组件和阀装置。
背景技术
相关技术中的传感器组件包括基座、电子电路和温度传感器元件。传感器组件通过封闭式的液密通道使温度传感器和导线与流体隔离。导线在细长的管状元件内延伸并从侧方穿过基座的孔连接至电路板。
相关技术中温度传感器元件位置相对靠下，从而温度传感器元件能更接近流体，而电子电路则需要与流体相隔离，电子电路相对靠上设置。相应的，基座与管状元件组装固定且二者密封配合使位置相对靠下的温度传感器的导线向上延伸并连接至位置相对靠上的电子电路，温度传感器元件的感温头和电子电路之间距离相对较长。相关技术对管状元件与基座之间的密封性的要求较高，但是相关技术较难达到相对较好的密封性要求。
发明内容
本申请提供了一种密封效果好的传感器组件，以及包含传感器组件的阀装置。
为实现上述目的，本申请第一方面提供了一种传感器组件，其包括：
外壳，所述外壳设有内腔和通道；
基座，所述基座至少部分收容于所述内腔，所述基座包括第一壁部，所述第一壁部具有第一表面和第二表面，所述第一表面和所述第二表面位于第一壁部厚度方向的不同侧；
电路板单元,所述电路板单元位于所述第一表面所在侧；以及
温度感应元件，所述温度感应元件包括感温部和导电部，所述通道和所述感温部均位于所述第二表面所在侧，所述导电部电性连接所述感温部与所述电路板单元；
其中，所述基座还包括容纳部和绝缘部，所述导电部的至少部分以及所述绝缘部的至少部分均收容于所述容纳部；所述基座具有形成所述容纳部的周壁，所述绝缘部位于所述周壁与所述导电部之间；收容于所述容纳部的至少部分导电部和所述周壁分别与所述绝缘部密封连接。
本申请第二方面还提供了一种阀装置，其包括上述所述的传感器组件，所述阀装置还包括阀体部，所述传感器组件固定安装于所述阀体部，所述阀体部包括流道，所述温度感应元件用于直接或者间接检测所述流道内流体的温度。
本申请提供的传感器组件，电路板单元和感温部分别位于基座的第一壁部厚度方向的不同侧；收容于容纳部的至少部分导电部和基座的周壁分别与绝缘部密封连接；从而导电部和基座的周壁之间不容易使流体通过，相应的有利于使得电路板单元不容易接触流体，使得传感器组件整体具有较好的密封性。
附图说明
图1为本申请的传感器组件的立体结构示意图；
图2为本申请的传感器组件的爆炸结构示意图；
图3为本申请的基座结构示意图；
图4为本申请的基座的一种剖面结构示意图；
图5为本申请的基座与温度感应元件连接结构示意图；
图6为图5所示结构的分解示意图；
图7为本申请的传感器组件的剖面结构示意图；
图8为本申请的传感器组件另一角度的剖面结构示意图；；
图9为图8的部分结构放大示意图；
图10为本申请的基座与罩筒之间的分解示意图；
图11为本申请的第二壳、压力感应元件、密封垫圈和基座的分解示意图；
图12为本申请外壳的结构示意图；
图13为本申请的阀装置的结构示意图；
图14为图13的一种角度的剖视图；
图15为图13的另一种角度的剖视图；
图16为阀装置的部分结构分解示意图。
具体实施方式
下面将结合附图详细地对本申请示例性具体实施方式进行说明。如果存在若干具体实施方式，在不冲突的情况下，这些实施方式中的特征可以相互组合。当描述涉及附图时，除非另有说明，不同附图中相同的数字表示相同或相似的要素。以下示例性具体实施方式中所描述的内容并不代表与本申请相一致的所有实施方式；相反，它们仅是与本申请的权利要求书中所记载的、与本申请的一些方面相一致的装置、产品和/或方法的例子。
在本申请中使用的术语是仅仅出于描述具体实施方式的目的，而非旨在限制本申请的保护范围。在本申请的说明书和权利要求书中所使用的单数形式的“一种”、“所述”或“该”也旨在包括多数形式，除非上下文清楚地表示其他含义。
应当理解，本申请的说明书以及权利要求书中所使用的，例如“第一”、“第二”以及类似的词语，并不表示任何顺序、数量或者重要性，而只是用来区分特征的命名。同样，“一个”或者“一”等类似词语也不表示数量限制，而是表示存在至少一个。除非另行指出，本申请中出现的“前”、“后”、“左”、“右”、“上”、“下”等类似词语只是为了便于说明，而并非限于某一特定位置或者一种空间定向。“包括”或者“包含”等类似词语是一种开放式的表述方式，意指出现在“包括”或者“包含”前面的元件涵盖出现在“包括”或者“包含”后面的元件及其等同物，这并不排除出现在“包括”或者“包含”前面的元件还可以包含其他元件。本申请中如果出现“若干”，其含义是指两个以及两个以上。
请参考图1至图16，本申请提供的一种传感器组件100，其可以与各类阀件相集成，如单独安装在阀体上从而形成一个阀装置，或者与电子膨胀阀、热力膨胀阀、电磁阀等集成为一个阀装置，传感器组件100可以用于检测制冷剂的温度参数，在一些实施方式中还可以检测制冷剂的压力参数。当然也可以用于检测其他流体的压力参数和温度参数。
本申请实施方式中的传感器组件100，包括外壳1、电路板单元2、基座3和温度感应元件4。传感器组件100设有内腔110和通道112，在一些实施方式中，通道112设于外壳1，外壳1可以形成具有一定收容能力的内腔110，通道112轴向方向的两侧具有开口，从而有利于使得温度感应元件4能够更可能的接触到流体。
具体的，如图2所示的传感器组件100的爆炸结构示意图，在传感器组件100中还可以包括压力传感元件5、密封垫圈6、保护罩7等结构，下述实施方式中会逐一详细阐述。
传感器组件100的基座3至少部分收容于内腔110，参考图3、图4所示，基座3包括第一壁部31，第一壁部31具有第一表面311和第二表面312，第一表面311和第二表面312位于第一壁部31厚度方向的不同侧。
温度感应元件4包括感温部40和导电部41，感温部40可以直接与流体接触或者间接与流体接触，感温部40能够感受其周围环境的温度信号。电路板单元2位于所述第一表面311所在侧，通道112和所述感温部40均位于所述第二表面312所在侧。在一些实施方式中，感温部40至少部分位于所述通道112，如感温部40全部位于通道112中，或者感温部40一部分位于通道112，另一部分位于外壳1靠近内腔110的一侧。或者，感温部40的至少部分位于外壳1远离内腔110的一侧，这样，感温部40至少有部分可以露出于通道112，从而感温部40能够更接近流体，可以提高对流体温度感应的准确性。
基座3还包括容纳部32和绝缘部33，在一些实施方式中，容纳部32可以是沿基座3的高度方向贯穿基座3的通孔结构，从而其具有一定的收容空间。基座3具有形成容纳部32的周壁321，导电部41的至少部分以及绝缘部33的至少部分均收容于容纳部32。绝缘部33位于基座3形成容纳部32的周壁321与导电部41之间，绝缘部33在容纳部32中可以隔离导电部41和基座3形成容纳部32的周壁321，收容于容纳部32的至少部分导电部41和周壁321分别与绝缘部33密封连接。在密封连接关系中，绝缘部33和基座3在装配前为非一体成型的结构，绝缘部33和基座3是互相独立的部件，在装配后，绝缘部33和基座3的周壁321之间形成密封连接的关系。
在相关技术中如汽车空调应用场景中，传感器组件可以用来检测汽车空调系统中冷媒的温度和/或压力。而由于汽车空调压力较大，其冷媒的压力一般要达到500Ps i，因此在较大的压力下要保证传感器组件内部空间的密封性则较为重要，特别需要注意保证电路元件尽可能避免接触到流体。
绝缘部33和基座3可以为不同材质。在本申请的一种实施方式中，收容于容纳部32的至少部分导电部41、绝缘部33以及基座3烧结固定为一体结构。本申请将温度感应元件4的导电部41、基座3之间以及绝缘部33在容纳部32处实现烧结固定，从而流体较难通过基座3向上接触到电路板单元2，本申请的传感器组件100密封性较好。在实际应用时，可以将绝缘部33的材料胚体填充于基座3形成容纳部32的周壁321与导电部41之间，通过烧结工艺将上述胚体转变为致密体，经过成型后，胚体的固体颗粒相互键联，晶粒长大，空隙(气孔)和晶界渐趋减少，其总体积收缩，但密度增加，最后成为致密的烧结体。在实际加工过程中，可以将初步组装的基座、导电部和绝缘部对应的材料胚体形成的结构加热至绝缘部的材料熔点以上，并在此温度下保持一定时间，使聚合物分子由结晶形逐渐转变为无定型，从而使分散的结构颗粒通过相互熔融扩散黏结成一个连续的整体。基座3、绝缘部33和导电部41最终形成一体的结构。该一体结构有利于保护基座3第一表面311一侧的元件不直接与流体接触，从而更耐腐蚀，且烧结工艺有利于增加基座3、导电部41和绝缘部33之间的连接强度和连接稳定性，有利于增加温度感应元件4检测温度信号的准确性。
在一些实施方式中，基座3和导电部41的材质均为金属。金属通常可以承受烧结工艺的高温。例如基座3为铝、铝合金或者不锈钢，导电部41的材质可以为铝、铁、钢或铜或者其他合金材质。而绝缘部33的材质为玻璃或者陶瓷。
在本申请提供的其他实施方式中，绝缘部33可以作为粘接材料，收容于所述容纳部32的至少部分导电部41通过绝缘部33与基座3粘接固定，该至少部分导电部41和周壁321分别与绝缘部33密封配合。绝缘部33可以为高强度环氧基双组分结构胶或者单组分密封结构胶。选择合适的胶体作为绝缘部33，使得导电部41与基座3通过绝缘部33形成粘接密封的关系，流体也不容易从基座3的第二表面312一侧流到第一表面311一侧。有利于实现相对较好的密封效果。
当然，绝缘部33和基座3也可以为相同材质，收容于容纳部32的至少部分导电部41、绝缘部33以及基座3烧结固定为一体结构。在经过烧结工艺加工后，绝缘部33和基座3紧密结合连接成为一体。
在一些实施方式中，温度感应元件4的感温部40暴露于流体环境中以感测流体温度，从而感温部40可以与 流体直接接触。在实际中，感温部40可以为封装好的热敏电阻，其外部为树脂类的复合材料，本身具有一定的耐腐蚀性，因此，感温部61可以与流体直接接触从而缩短温度检测的响应时间，提高温度信号检测的灵敏度。在其他一些实施方式中，温度感应元件6的感温部61也可以与其他零部件配合形成嵌件或者被其他结构包围从而间接感测流体温度。
参考图4、图5、图6所示，导电部41包括金属连接件43和自感温部40一体延伸的引脚42，金属连接件43包括第一部分431、第二部分432和第三部分433，第三部分433连接于第一部分431和第二部分432之间，第三部分433收容于容纳部32，也就是说，第三部分433通过绝缘部33与基座3形成容纳部32的周壁烧结固定为一体结构。
第一部分431的至少部分区域和第二部分432的至少部分区域均露出于基座3，第一部分431的至少部分区域与电路板单元2电性连接，例如二者可以通过锡焊、激光焊或电阻焊中的一种焊接方式焊接固定，第二部分432的至少部分区域与引脚42电性连接，例如二者可以通过锡焊、激光焊或电阻焊中的一种焊接方式焊接固定。一些实施方式中，第二部分432及引脚42均涂覆有防腐蚀涂层，从而露出在基座5之外的第二部分432及引脚42不容易被流体腐蚀，有利于提高产品的寿命和温度信号检测的准确性。
为了能够同时测量流体的压力和温度，一些实施方式中，传感器组件100还包括有压力感应元件5，参考图2、图7、图8和图11，压力感应元件5位于第一表面311所在侧，且压力感应元件5位于所述第一壁部31与电路板单元2之间。
具体的，基座3还包括第二壁部34，第二壁部34自第一壁部31的外周边沿向远离第一表面311的方向延伸，第二壁部34和第一壁部31可以相互垂直设置。第二壁部34围绕压力感应元件5的周侧设置。第一壁部31和第二壁部34围设成一个能够收容压力感应元件5的收容空间，从而利于对压力感应元件5进行组装。
第一壁部31设有第一孔道313。第一孔道313自第一表面311延伸至第二表面312。压力感应元件5朝向第一壁部31的表面至少部分区域形成用于与流体接触的压力感测区51。流体可以直接与压力感测区51相接触，从而压力感应元件5可以通过压力感测区51感应流体的压力信号。第一孔道313与压力感测区51至少部分区域相对，这样使得流体在第一孔道313的导流下直接快速的作用在压力感测区51，压力感应元件5与电路板单元2电性连接。这样压力感测元件5感测到的压力信号可以传递给电路板单元2进行处理。压力感应元件5可以通过周向密封或者底面密封的方式固定于基座3形成的收容空间内。
压力感应元件5的朝向电路板单元2的表面伸出若干压力连接引脚50，压力连接引脚50通过点焊工艺与电路板单元2焊接固定。
电路板单元2将压力感应元件5感测到的压力信号和温度感应元件4感测到的温度信号，按一定的逻辑算法方式处理采集到的温度信号和压力信号，转变成相应的电压值。在一些实施方式中，电路板单元2还可以包括调理芯片等，其作用在于对压力信号或者温度信号进行去噪、信号放大、信号补偿等处理，有利于改善信号的质量。
在一些实施方式中，温度感应元件4的感温头40可以设置于压力感应元件5的正下方，有利于实现产品的结构紧凑和小型化。
参考图4所示，在一些实施方式中，金属连接件43的长度方向与所述第一壁部31的厚度方向重合。第一部分431露出于第二壁部34远离第一壁部31的顶端面。第二部分432露出于第一壁部31的第二表面312。这样，金属连接件43的尺寸可以小型化，有利于传感器组件100整体结构更加紧凑。
由于基座3具有第一孔道313，流体经第一孔道313可以到达第一壁部31的第一表面311一侧，为了保证压力传感元件5和基座3之间的密封性，传感器组件100还包括密封垫圈6，密封垫圈6位于压力感应元件5朝向第一壁部31的表面与第一壁部31的第一表面311之间。密封垫圈6被压紧于压力感应元件5与基座3之间。压力感应元件5朝向第一壁部31的表面对应密封垫圈6围合范围的区域与压力感测区51至少部分区域重叠。
参考图3和图4所示，本申请的一些实施方式中，基座5设有第一凸台315和第二凸台316，第一凸台315相比第二凸台316更靠近第一孔道313的中心轴线，第一凸台315和第二凸台316间隔一定距离设置，且第一凸台 315和第二凸台316均为环状凸台，第二凸台316位于外圈，第一凸台315位于内圈。第一凸台315和第二凸台316之间形成凹陷区域，密封垫圈6可以安装于该凹陷区域，从而利于基座5的结构对密封垫圈6进行定位，密封垫圈6在高温冷媒作用下不至于变形而移动位置，从而有利于提高密封垫圈6的密封效果。
在一些实施方式中，参考图7和图8两个不同视角的剖面示意图，外壳1包括第一壳10和第二壳20，第一壳10和第二壳20共同形成内腔110。
第一壳10具有壳底壁101和壳侧壁102，通道112设置于壳底壁101。第一壳10还设有台阶部103，台阶部103自壳底壁101朝向第一壁部31的第二表面312凸起。第二表面312与台阶部103的顶面相接触，使得壳底壁101与第一壁部31的第二表面312之间具有间隙。金属连接件43的第二部分432露出于基座3的第二表面312并收容于该间隙中，引脚42与第二部分432在该间隙处进行焊接，不容易被其他部件挤压，从而可靠性较高。
在一些实施方式中，如图9所示的传感器组件100的剖面结构部分区域放大示意图，壳侧壁102的内侧与第二壁部34的外周侧之间周向焊接以使得壳侧壁102与第二壁部34密封配合。具体的焊接位置可以在图9中的A位置，壳侧壁102的内侧与第二壁部34的外周侧之间的缝隙在焊接过程中紧密配合，从而实现将壳侧壁102与第二壁部34焊接固定，并且有利于实现整体结构的小型化，焊接方式可以采用激光焊或者其他焊接方式。在其他实施方式中，也可以采用密封圈的方式进行密封，例如在壳底壁101和基座3的第二表面312之间设置密封圈，该密封圈被压紧于壳底壁101和基座3的第二表面312之间从而实现密封功能。
在一些实施方式中，参考图10，基座3设有两个弧形壁35，两个弧形壁35彼此间隔且对向设置，两个弧形壁35均位于所述第一壁部31的第二表面312所在侧。第一孔道313的轴心线位于两个弧形壁35之间，第一孔道313的轴心线可以参考图10中虚线示意。至少部分引脚42位于该两个弧形壁35之间。
传感器组件100还包括罩筒7，罩筒7具有第二孔道71和位于第二孔道71外围的筒壁72。罩筒7位于第二表面312所在侧。罩筒7的筒壁72设有若干缺口或者贯通筒壁72的孔。
弧形壁35至少部分位于第二孔道71，罩筒7的轴向长度可以大于弧形壁35的长度，筒壁72的内侧和弧形壁35的外周侧一个设有凹槽721，另一个设有凸耳351。在图10中，凹槽721设于罩筒7的筒壁72的内侧，凸耳351设于弧形壁35的外周侧。当然也可以反过来。凸耳351至少部分收容于凹槽721内。凹槽721和凸耳351可以形成卡扣结构，凹槽721和凸耳351相配合使得罩筒7固定于所述弧形壁35的外周侧。当传感器组件100应用在空调热泵系统中时，冷媒可以通过罩筒7的筒壁72上开设的缺口或者孔进入到第二孔道71，第二孔道71与第一孔道313相连通，这样冷媒最终可通过第二孔道71和第一孔道313向压力感应元件5处靠近并最终作用于压力感应元件5的压力感测区51。
在一些实施方式中，温度感应元件4的感温头40至少部分位于罩筒7的第二孔道71，罩筒7可以保护和定位温度感应元件4，减少流体对温度感应元件4的冲击力，从而起到一定的防护作用，有利于整个产品的稳定性。在本申请的其他实施方式中，温度感应元件4的感温头40完全伸出罩筒7而暴露设置，从而温度感应元件4对温度的感测更及时更充分。当然温度感应元件4的感温头40也可以靠近第一壁部31设置从而感温头40不在第二孔道71或远离第二壁部31而伸出第二孔道71。流体会经过第二孔道71等结构最终接触到感温头40，本申请对此不作过多限制。
传感器组件100的外壳1还包括第二壳20，电路板单元2至少部分位于第二壳20与所述压力感应元件5之间。
参考图9，第一壳10还具有第一延伸部111，第一延伸部111自壳侧壁102向通道112轴心线方向延伸，即第一延伸部111相对于壳侧壁102而言向内侧弯折，第二壳20具有主体部201和第二延伸部211，第二延伸部211位于主体部201的外周。第二延伸部211和基座3的第二壁部34被共同夹持定位于第一延伸部111与台阶部103的顶面之间。
在一些实施方式中，基座3的第二壁部34还设有若干第三凸台317，第三凸台317位于第二壁部34远离第一壁部31的顶端面。相应的第二壳20可以设有若干与第三凸台317相配合的凹槽221，凹槽221可以设于第二延 伸部211，凹槽221的槽口朝向第三凸台317所在方向设置。第三凸台317可以至少部分收容于对应的凹槽221。这样便于防呆和保证基座3和第二壳20之间的预定位，即便于基座3的第二壁部34与第二壳20的第二延伸部211在纵向上组装对位。若干第三凸台317的形状可以相同或者形状各异。请参照图9所示，第二延伸部211覆盖壳侧壁102的内侧与第二壁部34的外周侧之间的周向焊缝，以进一步提高壳侧壁102与第二壁部34结合处的密封性。
第一壳10可以为金属材质制造，采用金属材料的目的是便于加工翻边形成第一延伸部111，降低成型难度。第二壳20可以是塑料材质。这样有利于降低成本且减轻传感器组件100的重量。
第二壳20、基座3和第一壳10之间的具体组装及成型过程为：第一延伸部111的部分先是与壳侧壁102保持同样的竖直状态在纵向上延伸，在将第二壳20的第二延伸部211和基座3的第二壁部34在纵向上至少部分对齐且对接后装入壳侧壁102围成的筒状空间内，这时候再通过工装把竖直的第一延伸部111向内压成呈横向的翻边。因此，第二延伸部211和基座3的第二壁部34共同夹持定位于第一延伸部111与台阶部103之间，故而第二壳20能够相对于第一壳10安装稳定不掉落。
参考图13所示，本申请的实施方式还提供了一种阀装置300，其包括上述实施方式中的传感器组件100，阀装置300还包括阀体部8，传感器组件100固定安装于阀体部8，阀体部8包括流道81，温度感应元件4用于直接或者间接检测所述流道81内流体的温度。
在图14和图15示意的剖面结构中，外壳1和阀体部8之间还设有一密封元件93，阀体部8设有安装腔94，传感器组件100至少部分收容于阀体部8的安装腔94内。密封元件93可以被压紧于阀体部8形成安装腔94的壁部与外壳1的壳底壁101之间。通过密封元件93将外壳1和阀体部8之间密封住，阀体部8设置的流道81就形成一个允许流体沿流道81的轴向流动的液密通道。温度感应元件4的感温头40可以部分或全部的伸入流道81内，从而流体可以与感温头40直接接触，感温头40可以感测流体温度。通过压力感应元件5和基座3之间的密封垫圈6，传感器组件100形成的检测流体压力的区域也是一个允许流体沿第一孔道313轴向流动且封闭的腔室。
由于电路板单元2被保护在第二壳20以内，为了把温度值和电压值向外界传递出去，本申请实施方式中的传感器组件100还包括嵌设在第二壳20上的若干个金属连接弹片。金属连接弹片具有暴露于第二壳20外侧的外端部以及暴露于第二壳20内侧的内端部。相应的，内端部与电路板单元2连接，外端部与外部的主电路板91连接。金属连接弹片通过注塑包胶工艺嵌设于第二壳20当中。
阀装置300还包括压紧螺母92，如图14至图16所示，外壳1还具有与壳底壁101一体延伸的外凸结构，该外凸结构至少部分与压紧螺母92配合，压紧螺母92呈环形，其设于壳侧壁102的外周侧，压紧螺母92的外周与阀体部8螺纹连接，以将传感器装置100和阀体部8固定在一起。
在本申请实施方式提供的阀装置300还可以包括流体控制组件301，流体控制组件301与阀体部8固定。流体控制组件301可以是电子膨胀阀，用于汽车空调系统中的制冷剂流量控制，实现对制冷剂的节流。流体控制组件301相应的包括线圈组件等结构，对此本申请不再过多赘述。传感器组件100作为温度压力传感器，可以用于检测经过流体控制组件301内的制冷剂的压力和温度。当然，流体控制组件301也可能是其他控制阀或热管理系统部件等，可以实现对热管理系统部件内制冷剂进行相应的控制。
以上实施例仅用于说明本申请而并非限制本申请所描述的技术方案，对本说明书的理解应该以所属技术领域的技术人员为基础，例如对“前”、“后”、“左”、“右”、“上”、“下”等方向性的描述，尽管本说明书参照上述的实施例对本申请已进行了详细的说明，但是，本领域的普通技术人员应当理解，所属技术领域的技术人员仍然可以对本申请进行修改或者等同替换，而一切不脱离本申请的精神和范围的技术方案及其改进，均应涵盖在本申请的权利要求范围内。

Claims (18)

  1. 一种传感器组件(100)，其包括：
    外壳(1)，所述外壳(1)设有内腔(110)和通道(112)；
    基座(3)，所述基座(3)至少部分收容于所述内腔(110)，所述基座(3)包括第一壁部(31)，所述第一壁部(31)具有第一表面(311)和第二表面(312)，所述第一表面(311)和所述第二表面(312)位于第一壁部(31)厚度方向的不同侧；
    电路板单元(2),所述电路板单元(2)位于所述第一表面(311)所在侧；以及
    温度感应元件(4)，所述温度感应元件(4)包括感温部(40)和导电部(41)，所述通道(112)和所述感温部(40)均位于所述第二表面(312)所在侧，所述导电部(41)电性连接所述感温部(40)与所述电路板单元(2)；
    其中，所述基座(3)还包括容纳部(32)和绝缘部(33)，所述导电部(41)的至少部分以及所述绝缘部(33)的至少部分均收容于所述容纳部(32)；所述基座(3)具有形成所述容纳部(32)的周壁(321)，所述绝缘部(33)位于所述周壁(321)与所述导电部(41)之间；收容于所述容纳部(32)的至少部分导电部(41)和所述周壁(321)分别与所述绝缘部(33)密封连接。
  2. 根据权利要求1所述的传感器组件(100)，其中：所述绝缘部(33)与所述基座(3)为相同材质或者不同材质；其中，收容于所述容纳部(32)的至少部分导电部(41)、所述绝缘部(33)以及所述基座(3)烧结固定为一体结构；或者，
    所述绝缘部(33)作为粘接材料，收容于所述容纳部(32)的至少部分导电部(41)通过所述绝缘部(33)与所述基座(3)粘接固定。
  3. 根据权利要求1所述的传感器组件(100)，其中，所述感温部(40)至少部分位于所述通道(112)或者所述感温部(40)至少部分露出于所述外壳(1)；
    所述传感器组件(100)还包括压力感应元件(5)；所述压力感应元件(5)位于所述第一表面(311)所在侧，且所述压力感应元件(5)位于所述第一壁部(31)与所述电路板单元(2)之间；
    所述第一壁部(31)设有第一孔道(313)；所述第一孔道(313)为所述通道(112)的至少一部分；所述压力感应元件(5)朝向所述第一壁部(31)的表面至少部分区域形成用于与流体接触的压力感测区(51)；所述第一孔道(313)与所述压力感测区(51)至少部分区域相对；所述压力感应元件(5)与所述电路板单元(2)电性连接。
  4. 根据权利要求3所述的传感器组件(100)，其中，所述导电部(41)包括金属连接件(43)和自所述感温部(40)一体延伸的引脚(42)，所述金属连接件(43)包括第一部分(431)、第二部分(432)和第三部分(433)，所述第三部分(433)连接于第一部分(431)和第二部分(432)之间，所述第三部分(433)收容于所述容纳部(32)，所述第一部分(431)和所述第二部分(432)均露出于所述基座(3)；所述第一部分(431)与所述电路板单元(2)相固定，所述第二部分(432)与所述引脚(42)相固定。
  5. 根据权利要求4所述的传感器组件(100)，其中，所述第一部分(431)的至少部分区域与所述电路板单元(2)通过锡焊、激光焊或电阻焊中的一种焊接固定，所述第二部分(432)的至少部分区域与所述引脚(42)通过锡焊、激光焊或电阻焊中的一种焊接固定，所述第二部分(432)的至少部分表面以及所述引脚(42)的至少部分表面均涂覆有防腐蚀涂层。
  6. 根据权利要求4所述的传感器组件(100)，其中，所述基座(3)包括第二壁部(34)，所述第二壁部(34)自所述第一壁部(31)向远离所述第一表面(311)的方向延伸；所述第二壁部(34)围绕所述压力感应元件(5)的周侧设置；
    所述传感器组件(100)还包括密封垫圈(6)，所述密封垫圈(6)位于所述压力感应元件(5)朝向所述第一壁部(31)的一侧与所述第一壁部(31)的第一表面(311)之间；所述密封垫圈(6)被压紧于所述压力感应元件(5)与所述基座(3)之间。
  7. 根据权利要求6所述的传感器组件(100)，其中，所述基座(5)设有第一凸台(315)和第二凸台(316)，所述第一凸台(315)和所述第二凸台(316)均自所述第一表面(311)凸出；所述第一凸台(315)相比所述第二凸台(316)更靠近所述第一孔道(313)的中心轴线，所述第一凸台(315)和所述第二凸台(316)间隔一定距离从而二者之间形成凹陷区域，所述密封垫圈(6)安装于所述凹陷区域。
  8. 根据权利要求6所述的传感器组件(100)，其中，所述金属连接件(43)的长度方向与所述第一壁部(31)的厚度方向重合；所述第一部分(431)露出于所述第二壁部(34)远离所述第一壁部(31)的顶端面；所述第二部分(432)露出于所述第一壁部(31)的第二表面(312)。
  9. 根据权利要求6所述的传感器组件(100)，其中，所述外壳(1)包括第一壳(10)，所述第一壳(10)具有壳底壁(101)和壳侧壁(102)；
    所述第一壳(10)还设有台阶部(103)，所述台阶部(103)自所述壳底壁(101)朝向所述第一壁部(31)的第二表面(312)凸起；所述第二表面(312)与所述台阶部(103)的顶面相接触，使得所述壳底壁(101)与所述第一壁部(31)的第二表面(312)之间具有间隙；所述第二部分(432)至少部分位于所述间隙；
    所述壳侧壁(102)的内侧与所述第二壁部(34)的外周侧之间周向焊接以使得所述壳侧壁(102)与所述第二壁部(34)密封配合。
  10. 根据权利要求9所述的传感器组件(100)，其中，所述基座(3)设有两个弧形壁(35)，两个所述弧形壁(35)彼此间隔且对向设置，两个所述弧形壁(35)均位于所述第一壁部(31)的第二表面(312)所在侧；所述第一孔道(313)的轴心线所在直线位于所述两个弧形壁(35)之间；部分所述引脚(42)位于该两个弧形壁(35)之间；
    所述传感器组件(100)还包括罩筒(7)，所述罩筒(7)具有第二孔道(71)和位于第二孔道(71)外围的筒壁(72)；所述罩筒(7)位于所述第二表面(312)所在侧；所述罩筒(7)的筒壁(72)设有若干缺口或者若干贯通筒壁(72)的孔；
    所述弧形壁(35)至少部分位于所述第二孔道(71)，所述筒壁(72)的内侧和所述弧形壁的外周侧中的一个设有凹槽(721)，另一个设有凸耳(351)；所述凸耳(351)至少部分收容于所述凹槽(721)；所述凹槽(721)和所述凸耳(351)相配合使得所述罩筒(7)固定于所述弧形壁(35)的外周侧。
  11. 根据权利要求9所述的传感器组件(100)，其中，所述外壳(1)还包括第二壳(20)，所述电路板单元(2)至少部分位于所述第二壳(20)与所述压力感应元件(5)之间；
    所述第一壳(10)还具有第一延伸部(111)，所述第一延伸部(111)自所述壳侧壁(102)向所述通道(112)轴心线方向延伸，所述第二壳(20)具有主体部(201)和第二延伸部(211)，所述第二延伸部(211)位于所述主体部(201)的外周；所述第二延伸部(211)和所述基座(3)的第二壁部(34)被共同夹持定位于所述第一延伸部(111)与所述台阶部(103)的顶面之间。
  12. 根据权利要求11所述的传感器组件(100)，其中，所述第二壁部(34)还设有第三凸台(317)，所述第三凸台(317)位于所述第二壁部(34)远离所述第一壁部(31)的顶端面；所述第二延伸部(211)设有与所述第三凸台(317)相配合的凹槽(221)，所述第三凸台(317)至少部分收容于所述凹槽(221)。
  13. 根据权利要求11所述的传感器组件(100)，其中，所述第二延伸部(211)覆盖所述壳侧壁(102)的 内侧与所述第二壁部(34)的外周侧之间的周向焊缝。
  14. 一种阀装置(300)，其特征在于：包括如权利要求1至13任一项所述的传感器组件(100)，所述阀装置(300)还包括阀体部(8)，所述传感器组件(100)固定安装于所述阀体部(8)，所述阀体部(8)包括流道(81)，所述温度感应元件(4)用于直接或者间接检测所述流道(81)内流体的温度。
  15. 根据权利要求14所述的阀装置(300)，其中，所述外壳(1)和所述阀体部(8)之间还设有一密封元件(93)，所述阀体部(8)设有安装腔(94)，所述传感器组件(100)至少部分收容于所述安装腔(94)内；所述密封元件(93)被压紧于所述阀体部(8)形成所述安装腔(94)的壁部与所述外壳(1)的壳底壁(101)之间。
  16. 根据权利要求15所述的阀装置(300)，其中，所述阀装置(300)还设有主电路板(91)，所述传感器组件(100)还包括嵌设在所述第二壳(20)上的若干个金属连接弹片；所述金属连接弹片具有暴露于所述第二壳(20)外侧的外端部以及暴露于所述第二壳(20)内侧的内端部；所述内端部与所述电路板单元(2)连接，所述外端部与所述主电路板(91)连接。
  17. 根据权利要求15所述的阀装置(300)，其中，所述阀装置(300)还包括压紧螺母(92)，所述外壳(1)还具有与所述壳底壁(101)一体延伸的外凸结构，所述外凸结构至少部分与所述压紧螺母(92)配合，所述压紧螺母(92)呈环形且设于所述外壳(1)的壳侧壁(102)的外周侧；所述压紧螺母(92)的外周与所述阀体部(8)螺纹连接，以将所述传感器装置(100)和所述阀体部(8)固定在一起。
  18. 根据权利要求17所述的阀装置(300)，其中，所述阀装置(300)还包括流体控制组件(301)，所述流体控制组件(301)与所述阀体部(8)固定。
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