WO2022100295A1 - 电子设备、摄像装置及其滤光片 - Google Patents

电子设备、摄像装置及其滤光片 Download PDF

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Publication number
WO2022100295A1
WO2022100295A1 PCT/CN2021/120241 CN2021120241W WO2022100295A1 WO 2022100295 A1 WO2022100295 A1 WO 2022100295A1 CN 2021120241 W CN2021120241 W CN 2021120241W WO 2022100295 A1 WO2022100295 A1 WO 2022100295A1
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WO
WIPO (PCT)
Prior art keywords
lens
infrared
image sensor
camera
light
Prior art date
Application number
PCT/CN2021/120241
Other languages
English (en)
French (fr)
Inventor
谭耀成
张海裕
韦怡
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2022100295A1 publication Critical patent/WO2022100295A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/208—Filters for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11—Anti-reflection coatings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/22—Absorbing filters
    • G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets

Definitions

  • the present application relates to the technical field of electronic equipment, and in particular, to electronic equipment, imaging devices and filters thereof.
  • the application provides an optical filter, comprising:
  • an infrared filter component having a first surface and a second surface disposed opposite to each other;
  • a second anti-reflection film is formed on the second surface.
  • the present application provides an imaging device including the above-mentioned filter.
  • the present application provides an electronic device, including the above-mentioned camera device.
  • FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment
  • FIG. 2 is a schematic diagram of another viewing angle of the electronic device according to an embodiment
  • FIG. 3 is a partial cross-sectional structural schematic diagram of an electronic device provided by an embodiment
  • FIG. 4 is a schematic structural diagram of a camera device of an electronic device according to an embodiment
  • FIG. 5 is a schematic diagram of a filter structure of an imaging device according to an embodiment
  • FIG. 6 is a schematic structural diagram of an infrared filter component of an optical filter according to an embodiment
  • FIG. 7 is a schematic structural diagram of an infrared filter component of an optical filter according to another embodiment
  • FIG. 8 is a schematic structural diagram of a lens, an optical filter, and an image sensor in a camera device according to another embodiment
  • FIG. 9 is a schematic structural diagram of a lens, an optical filter, and an image sensor in a camera device according to another embodiment
  • FIG. 10 is a schematic structural diagram of a lens, an optical filter, and an image sensor in a camera device according to another embodiment
  • FIG. 11 is a spectral transmittance curve diagram of a filter of an imaging device according to an embodiment
  • FIG. 13 is a spectral transmittance curve diagram of an infrared cut filter film superimposed on a filter in an imaging device according to an embodiment
  • 15 is a spectral reflectance curve diagram of a filter of an imaging device according to an embodiment
  • FIG. 16 is a schematic structural diagram of an electronic device according to an embodiment.
  • electronic device refers to a device capable of receiving and/or transmitting communication signals, including but not limited to, connected via any one or several of the following connections:
  • connection via wired line such as via Public Switched Telephone Networks (PSTN), Digital Subscriber Line (DSL), digital cable, direct cable connection;
  • PSTN Public Switched Telephone Networks
  • DSL Digital Subscriber Line
  • DSL Digital Subscriber Line
  • a wireless interface such as a cellular network, a wireless local area network (Wireless Local Area Network, WLAN), a digital TV network such as a DVB-H network, a satellite network, and an AM-FM broadcast transmitter.
  • An electronic device arranged to communicate via a wireless interface may be referred to as a "mobile terminal".
  • mobile terminals include, but are not limited to, the following electronic devices:
  • Satellite telephone or cellular telephone (1) Satellite telephone or cellular telephone
  • PCS terminals that can combine cellular radio telephones with data processing, facsimile, and data communication capabilities;
  • an embodiment of the present application provides an electronic device 100, which may be a mobile phone, a tablet computer, a notebook computer, a smart bracelet, a smart watch, a smart helmet, and smart glasses.
  • an electronic device 100 may be a mobile phone, a tablet computer, a notebook computer, a smart bracelet, a smart watch, a smart helmet, and smart glasses.
  • the following description is given by taking the electronic device 100 as a mobile phone as an example.
  • the electronic device 100 includes a casing 10 and a display screen 20 .
  • An accommodation space is formed between the casing 10 and the display screen 20 .
  • the accommodation space is used to accommodate the internal parts of the electronic device 100 .
  • the casing 10 can play a role in the internal parts of the electronic device 100 . protective effect.
  • the casing 10 may be a back cover of the electronic device 100 and cover components such as a battery and a motherboard of the electronic device 100 .
  • the casing 10 includes a middle frame 11 and a rear casing 12 , and the display screen 20 and the rear casing 12 are respectively connected to opposite sides of the middle frame 11 .
  • the rear casing 12 is a casing of the electronic device 100 that faces away from the side where the display screen 20 is located.
  • the middle frame 11 may be integrally formed with the rear shell 12 , or may be provided separately from the rear shell 12 .
  • the middle frame 11 and the rear case 12 are connected by thermosetting glue, which facilitates the disassembly between the middle frame 11 and the rear case 12 and makes the maintenance of the electronic device 100 easier.
  • the connection method between the middle frame 11 and the rear shell 12 is not limited here.
  • the display screen 20 includes a display panel 21 and a glass panel 22.
  • the display panel 21 is disposed on the side of the glass panel 22 facing the rear case 12, and then the glass panel 22 can not only meet the needs of the display panel 21 for transparent display, but also The glass panel 22 can be used to protect the display panel 21 to prevent the display elements of the display panel 21 from being scratched and affecting the display effect.
  • the middle frame 11 is a glass middle frame 11, and the glass middle frame 11 and the glass panel 22 are integrally formed by injection molding. This molding process is relatively mature, and the glass middle frame 11 and the glass panel 22 are connected by injection molding. In one, it can be easily realized that there is no matching gap between the two, so when the electronic device 100 is used, the side of the electronic device 100 with the display screen 20 facing the user, because the middle frame 11 and the display screen 20 are integrated into one Matching the gap, that is, there is no trace of matching, showing a better overall effect of the full screen.
  • the rear shell 12 adopts a glass rear shell or a ceramic rear shell, so that the appearance and texture of the electronic device 100 are more harmonious and user experience is improved.
  • the middle frame 11 and the rear shell 12 are bonded together by an adhesive layer.
  • the adhesive layer may be formed by bonding OCA optical adhesive (Optically Clear Adhesive) between the middle frame 11 and the rear shell 12 and curing.
  • OCA optical adhesive has the characteristics of colorless and transparent, high light transmittance, high adhesion, high weather resistance, water resistance, high temperature resistance, UV resistance, etc., and has a controlled thickness, which can provide uniform spacing, and will not be produced after long-term use Problems with yellowing, peeling and deterioration.
  • Optical adhesive is one of the important raw materials of touch screen, and it is a double-sided adhesive tape without matrix material.
  • the electronic device 100 includes a camera device 30, and the camera device 30 is communicatively connected to a circuit board (not shown).
  • the user can use the camera device 30 to perform operations such as close-range shooting, long-range shooting, or video recording.
  • the camera device 30 can be used to perform the function of the front camera, that is, the user can perform operations such as self-portrait, video call, etc. through the camera device 30 .
  • the camera device 30 includes a filter 310 , a lens 320 and an image sensor 330 .
  • the lens 320 and the image sensor 330 are located on both sides of the filter 310 , so that the filter 310 can detect the light emitted by the lens 320 .
  • the light is filtered, so that the light required for imaging enters the image sensor 330, and the light not required for imaging is filtered or absorbed.
  • the filter 310 includes an infrared filter component 311 , a first anti-reflection film 312 and a second anti-reflection film 313 .
  • the infrared filter component 311 has a first surface 311a and a second surface 311b disposed opposite to each other, the first antireflection film 312 is formed on the first surface 311a, and the second antireflection film 313 is formed on the first surface 311a. the second surface 311b.
  • the overall reflectivity of the optical filter 310 is greatly reduced, so that the optical filter 310 can be exposed to visible light. Even in the case of a large angle of incidence, the reflectivity does not change much, so no glare or ghosting will occur, so that the camera device 30 using the filter 310 can maintain the imaging effect and improve the backlight photographing effect.
  • the infrared filter component 311 in the filter 310 can filter the infrared light, thereby reducing the infrared light entering the image sensor 330 to generate a virtual image.
  • the infrared filter component 311 includes a light-transmitting substrate 3111 and a pigment layer 3112, and the pigment layer 3112 coats at least one surface of the light-transmitting substrate 3111, wherein the The pigment layer 3112 includes at least one of a near-infrared absorber and an ultraviolet absorber, the near-infrared absorber is used to absorb light in the near-infrared wavelength range, and the ultraviolet absorber is used to absorb light in the ultraviolet wavelength range.
  • the infrared filter component 311 utilizes the pigment layer 3112 coated on the transparent substrate 3111 to absorb near-infrared light or ultraviolet light, so as to improve the filtering effect.
  • the material of the transparent substrate 3111 may be white glass.
  • the light-transmitting substrate 3111 can also be blue glass or a resin material with near-infrared absorption, so that the light-transmitting substrate 3111 can also absorb infrared light to enhance the cut-off filtering effect of infrared light, so that The imaging effect of visible light incident on the image sensor 330 is improved.
  • Near-infrared absorbers are required to have strong absorption of near-infrared light at 660 nm to 930 nm, and weak or no absorption of visible light.
  • the near-infrared absorber can be one or more of phthalocyanine, azo, metal complex, diimmonium or cyanine organic dyes.
  • the UV absorber can be an inorganic material such as cerium oxide, titanium oxide, and the like.
  • the pigment layer 3112 is a near-infrared absorbing pigment added with an ultraviolet absorbing component, so that it can cooperate with the infrared cut filter film disposed in the camera device 30 to filter out ultraviolet light to improve the imaging effect.
  • the lens 320 has a light incident side 320c, and the light incident side 320c is the side where the light enters the lens 320 .
  • the image sensor 330 is disposed on the side of the lens 320 facing away from the light incident side 320c. Types of the image sensor 330 may include a CCD (Charge Coupled) element, a CMOS (Complementary Metal Oxide Conductor) device, a photodiode, and the like. Divided from color, the image sensor 330 may be a color image sensor, a monochrome image sensor, a grayscale sensor, and the like.
  • the light passing through the camera lens 30a is subjected to optical processing such as focusing or filtering by the lens 320 and then enters the image sensor 330 .
  • the lens 320 includes a plurality of mirrors 321, wherein, at least one side of the mirror 321 closest to the light incident side 320c is coated with an infrared cut filter 321a, so that the infrared cut filter 321a is used for infrared rays. Filtering is performed to prevent infrared light from entering the image sensor 330 to form a virtual image, which affects the shooting effect.
  • the infrared cut filter film 321a can be plated on the side of the lens 321 closest to the light incident side 320c away from the image sensor 330, so that the infrared cut filter film 321a is as far as possible from the image sensor 330 to avoid the infrared cut filter film 321a.
  • the light film 321a reflects light into the image sensor 330 to generate flare and ghost images.
  • both sides of the lens 321 closest to the light incident side 320c are provided with infrared cut-off filter films 321a to enhance the filtering effect of infrared light and prevent infrared light from interfering with visible light in Imaging effect of the image sensor 330 .
  • some lenses 321 are convex lenses, and other lenses 321 are concave lenses.
  • the number and type of the lenses 321 in the lens 320 This is not limited.
  • the camera device 30 includes a camera lens 30 a .
  • the camera lens 30 a may be connected to the rear case 12 through a decorative ring 30 b , or the camera lens 30 a may be integrated as a part of the rear case 12 It is formed on the rear case 12 .
  • the camera lens 30a can also be arranged at other positions of the casing 10, as long as it can adapt to the light transmission, so that the light passing through the camera lens 30a can be incident on the image sensor 330 through the lens 320 for imaging, That is, the camera lens 30a is disposed on the light incident side 320c of the lens 320 .
  • the side surface of the camera lens 30a facing the lens 320 is coated with an infrared cut-off filter film 340, so that the light incident on the camera lens 30a is filtered by the infrared cut-off filter film 340. Since the infrared cut-off filter film 340 can filter out infrared rays light, so as to prevent infrared light from entering the image sensor 330 to generate a virtual image, so as to ensure the imaging effect.
  • the camera lens 30a is further provided with an anti-reflection layer 350 to improve the overall light transmittance of the camera lens 30a.
  • the anti-reflection layer 350 may be disposed between the camera lens 30a and the infrared cut filter film 340, or may be disposed on the side of the infrared cut filter film 340 facing away from the camera lens 30a.
  • the lens 320 is installed on the light incident path of the image sensor 330 through the lens holder 320a, that is, when the light optically processed by the lens 320 enters the image sensor 330, the imaging requirements can be met.
  • the lens holder 320 a not only provides an installation space for the lens 320 , but at the same time, the space surrounded by the lens holder 320 a can meet the storage requirements of the image sensor 330 .
  • the lens holder 320 a covers the image sensor 330 , and after the lens 320 is installed on the lens holder 320 a , the optical axis 320 b of the lens 320 and the image sensor 330 are sensitive to light.
  • the intersection point of the areas is approximately located in the middle of the photosensitive area of the image sensor 330, so that the light optically processed by the lens 320 can evenly illuminate the photosensitive area of the image sensor 330 to meet imaging needs.
  • the lens 320 is disposed inside the camera lens 30a, and the inside of the camera lens 30a refers to the side of the camera lens 30a facing the inside of the electronic device 100 when the camera device is installed in the electronic device 100.
  • the camera lens 30a The side exposed to the electronic device 100 is the outer side of the camera lens 30a.
  • the camera device 30 can also be provided with infrared filtering structural components in other places.
  • the side of the image sensor 330 facing the lens 320 is coated with an infrared cutoff filter film 330a, and the infrared cutoff The filter film 330a at least covers the photosensitive area of the image sensor 330 , so that the infrared cut filter film 330a on the image sensor 330 can also be used to filter infrared light well to ensure the imaging effect of the image sensor 330 .
  • the center wavelength of the infrared cut filter film used in the imaging device 30 is greater than or equal to 790 nm, and this structure arrangement can prevent infrared light from entering the image sensor 330 to form a virtual image.
  • the light-transmitting substrate 3111 as blue glass as an example, one side of the blue glass is coated with a pigment layer 3112 that absorbs near-infrared light, and after forming the infrared filter component 311, A first anti-reflection film 312 and a second anti-reflection film 313 are provided on both sides of the infrared filter component 311 .
  • Figure 11 shows the spectral transmittance curves of the filters.
  • the comprehensive spectrum of the imaging device 30 shows that the transmittance T% achieves the effect of infrared cut-off filtering. Specifically, for the light in the sensitive wavelength range of the human eye from 430nm to 640nm, in the imaging device 30 shown in FIG.
  • the maximum transmittance T% can reach 93.6%, thus achieving high transmittance of visible light.
  • the average transmittance T% for light in the wavelength range of 700 nm to 1100 nm is 0.19% or less, and the maximum transmittance T% is 1.5% or less, so efficient cutoff of infrared light is achieved.
  • the incident angle ⁇ (refer to Fig. 4) of 0° and 40° is used to enter the camera lens 30a, the center wavelength shifts are 1.5nm and 3.5nm respectively, so that the angle consistency is relatively good and the normal imaging effect is guaranteed. , there will be no problem of chromatic aberration in the middle and edges.
  • the incident angle ⁇ refers to the included angle between the incident light ray and the normal line of the outer surface of the camera lens 30 a , and also the included angle between the incident light ray and the optical axis 320 b of the lens 320 .
  • the infrared cut-off filter film 340 used in the imaging device 30 has an average transmittance of visible light in the wavelength range of 400 nm to 700 nm when the incident angle ⁇ is in the range of 0 to 40°.
  • the central wavelength of the infrared cut-off filter is above 790. Observed under different angles of incidence, the color effect reflected by the infrared cut-off filter film 340 is basically the same, so as to avoid Shooting shadows appear.
  • FIG. 14 shows a graph of the spectral reflectance of the infrared cut filter film used by the imaging device 30 . It can be seen from Figure 14 that in the incident angle range of 0 to 40°, the average reflectance of visible light for the wavelength range of 400 nm to 700 nm is below 2%, and the highest reflectivity is below 6%; this shows that even in the When the light is incident at a large angle, a lower reflectivity can also be achieved, so that the effect of reducing flare or ghosting can be achieved.
  • the average reflectance in the visible light wavelength range from 420 nm to 680 nm is less than or equal to 0.25%, and the highest reflectance is 0.5%. Even when the incident angle ⁇ is 40°, the average reflectance is 0.8% or less, and the highest reflectance is 1.2%. A lower reflectivity is achieved, which has the effect of reducing flare or ghosting.
  • FIG. 16 is a schematic structural diagram of an electronic device 100 according to an embodiment of the present application.
  • the electronic device 100 may include a radio frequency (RF, Radio Frequency) circuit 501, a memory 502 including one or more computer-readable storage media, an input unit 503, a display unit 504, a sensor 505, an audio circuit 506, a wireless fidelity ( WiFi, Wireless Fidelity) module 507, a processor 508 including one or more processing cores, a power supply 509 and other components.
  • RF Radio Frequency
  • a memory 502 including one or more computer-readable storage media
  • WiFi Wireless Fidelity
  • the radio frequency circuit 501 can be used to send and receive information, or to receive and send signals during a call. In particular, after receiving the downlink information of the base station, it is handed over to one or more processors 508 for processing; in addition, it sends the uplink data to the base station. .
  • the radio frequency circuit 501 includes, but is not limited to, an antenna, at least one amplifier, a tuner, one or more oscillators, a Subscriber Identity Module (SIM, Subscriber Identity Module) card, a transceiver, a coupler, a low noise amplifier (LNA, Low Noise Amplifier), duplexer, etc.
  • the radio frequency circuit 501 can also communicate with the network and other devices through wireless communication.
  • the wireless communication can use any communication standard or protocol, including but not limited to Global System for Mobile Communication (GSM, Global System of Mobile communication), General Packet Radio Service (GPRS, General Packet Radio Service), Code Division Multiple Access (CDMA, Code Division Multiple Access), Wideband Code Division Multiple Access (WCDMA, Wideband Code Division Multiple Access), Long Term Evolution (LTE, Long Term Evolution), email, Short Messaging Service (SMS, Short Messaging Service), etc.
  • GSM Global System for Mobile Communication
  • GPRS General Packet Radio Service
  • GPRS General Packet Radio Service
  • CDMA Code Division Multiple Access
  • WCDMA Wideband Code Division Multiple Access
  • LTE Long Term Evolution
  • SMS Short Messaging Service
  • Memory 502 may be used to store applications and data.
  • the application program stored in the memory 502 contains executable code.
  • Applications can be composed of various functional modules.
  • the processor 508 executes various functional applications and data processing by executing application programs stored in the memory 502 .
  • the memory 502 may mainly include a stored program area and a stored data area, wherein the stored program area may store an operating system, an application program (such as a sound playback function, an image playback function, etc.) required for at least one function, and the like;
  • the use of the electronic device 100 creates data (such as audio data, phone book, etc.) and the like.
  • memory 502 may include high-speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid state storage device. Accordingly, the memory 502 may also include a memory controller to provide access to the memory 502 by the processor 508 and the input unit 503 .
  • the input unit 503 can be used to receive input numbers, character information or user characteristic information (such as fingerprints), and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control.
  • the input unit 503 may include a touch-sensitive surface as well as other input devices.
  • a touch-sensitive surface also known as a touch display or trackpad, collects the user's touch operations on or near it (such as the user's finger, stylus, etc., any suitable operation near the surface), and drive the corresponding connection device according to the preset program.
  • the touch-sensitive surface may include two parts, a touch detection device and a touch controller.
  • the touch detection device detects the user's touch orientation, detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into contact coordinates, and then sends it to the touch controller.
  • the processor 508 can receive the command sent by the processor 508 and execute it.
  • the display unit 504 may be used to display information input by or provided to the user and various graphical user interfaces of the electronic device 100, which may be composed of graphics, text, icons, video, and any combination thereof.
  • the display unit 504 may include the above-described display panel 21 .
  • the display panel 21 may be configured in the form of a liquid crystal display (LCD, Liquid Crystal Display), an organic light emitting diode (OLED, Organic Light-Emitting Diode), or the like.
  • the touch-sensitive surface may cover the display panel 21, and when the touch-sensitive surface detects a touch operation on or near it, it is transmitted to the processor 508 to determine the type of the touch event, and then the processor 508 determines the type of the touch event according to the type of the touch event. Corresponding visual outputs are provided on the display panel 21 .
  • the touch-sensitive surface and the display panel 21 are implemented as two separate components to realize the input and input functions, in some embodiments, the touch-sensitive surface and the display panel 21 may be integrated to realize the input and output functions Features. It can be understood that the display screen 20 may include an input unit 503 and a display unit 504 .
  • the electronic device 100 may also include at least one sensor 505, such as a light sensor, a motion sensor, and other sensors.
  • the light sensor may include an ambient light sensor and a proximity sensor, wherein the ambient light sensor may adjust the brightness of the display panel 21 according to the brightness of the ambient light, and the proximity sensor may close the display panel 21 when the electronic device 100 is moved to the ear and/or backlight.
  • the gravitational acceleration sensor can detect the magnitude of acceleration in all directions (usually three axes), and can detect the magnitude and direction of gravity when stationary, and can be used for applications that recognize the attitude of mobile phones (such as horizontal and vertical screen switching, related games, magnetometer attitude calibration), vibration recognition related functions (such as pedometer, tapping), etc.; as for other sensors such as gyroscope, barometer, hygrometer, thermometer, infrared sensor, etc. that can be configured in the electronic device 100, here No longer.
  • the audio circuit 506 may provide an audio interface between the user and the electronic device 100 through speakers and microphones.
  • the audio circuit 506 can convert the received audio data into an electrical signal, transmit it to the speaker, and the speaker converts it into a sound signal for output; on the other hand, the microphone converts the collected sound signal into an electrical signal, which is converted into an electrical signal after being received by the audio circuit 506.
  • the audio data is processed by the output processor 508, the audio data is sent to, for example, another electronic device 100 via the radio frequency circuit 501, or the audio data is output to the memory 502 for further processing.
  • Audio circuitry 506 may also include a headphone jack to provide peripheral headphone communication with electronic device 100 .
  • Wireless Fidelity is a short-range wireless transmission technology, and the electronic device 100 can help users to send and receive emails, browse web pages, access streaming media, etc. through the Wi-Fi module 507, which provides users with wireless broadband Internet access.
  • FIG. 16 shows the Wi-Fi module 507, it can be understood that it does not belong to the necessary structure of the electronic device 100, and can be completely omitted as required within the scope of not changing the essence of the invention.
  • the processor 508 is the control center of the electronic device 100, uses various interfaces and lines to connect various parts of the entire electronic device 100, and executes by running or executing the application program stored in the memory 502 and calling the data stored in the memory 502. Various functions of the electronic device 100 and processing data, so as to monitor the electronic device 100 as a whole.
  • the processor 508 may include one or more processing cores; preferably, the processor 508 may integrate an application processor and a modem processor, wherein the application processor mainly processes the operating system, user interface, and application programs, etc. , the modem processor mainly deals with wireless communication. It can be understood that, the above-mentioned modulation and demodulation processor may not be integrated into the processor 508 .
  • the electronic device 100 also includes a power supply 509 for powering the various components.
  • the power supply 509 can be logically connected to the processor 508 through a power management system, so that functions such as charging, discharging, and power consumption management are implemented through the power management system.
  • the power source 509 may also include one or more DC or AC power sources, recharging systems, power failure detection circuits, power converters or inverters, power status indicators, and any other components.
  • the electronic device 100 may also include a Bluetooth module, etc., which will not be described herein again.
  • the above modules can be implemented as independent entities, or can be arbitrarily combined to be implemented as the same or several entities.
  • the specific implementation of the above modules can refer to the previous method embodiments, which will not be repeated here.

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Abstract

一种电子设备、摄像装置及其滤光片，该滤光片包括红外滤光部件(311)、第一增透膜(312)和第二增透膜(313)，红外滤光部件(311)具有相背设置的第一表面(311a)和第二表面(311b)，第一增透膜(312)形成于第一表面(311a)，第二增透膜(313)形成于第二表面(311b)。

Description

电子设备、摄像装置及其滤光片 技术领域
本申请涉及电子设备技术领域，特别是涉及电子设备、摄像装置及其滤光片。
背景技术
随着智能手机、平板电脑等电子设备的普及，用户越来越多的关注电子设备的使用体验，带有摄像装置电子设备中，通常需要利用摄像装置实现拍摄功能。
然而，在摄像装置中，为了减少红外光进入图像传感器，在镜头与图像传感器之间设置滤光片进行滤光，滤光片的设置虽然能够对红外光起到较好的过滤效果，以避免产生拍摄虚像，但由此也带来眩光或鬼影问题，严重影响逆光拍照效果。
发明内容
基于此，有必要提供一种电子设备、摄像装置及其滤光片。
一方面，本申请提供一种滤光片，包括：
红外滤光部件，具有相背设置的第一表面和第二表面；
第一增透膜，形成于所述第一表面；及
第二增透膜，形成于所述第二表面。
另一方面，本申请提供一种摄像装置，包括上述的滤光片。
又一方面，本申请提供一种电子设备，包括上述的摄像装置。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为一实施例提供的电子设备的结构示意图；
图2为一实施例的电子设备的另一视角的示意图；
图3为一实施例提供的电子设备的局部剖视结构示意图；
图4为一实施例的电子设备的摄像装置的结构示意图；
图5为一实施方式的摄像装置的滤光片结构示意图；
图6为一实施方式的滤光片的红外滤光部件结构示意图；
图7为另一实施方式的滤光片的红外滤光部件结构示意图；
图8为另一实施方式的摄像装置中，镜头、滤光片和图像传感器的结构示意图；
图9为又一实施方式的摄像装置中，镜头、滤光片和图像传感器的结构示意图；
图10为再一实施方式的摄像装置中，镜头、滤光片和图像传感器的结构示意图；
图11为一实施方式的摄像装置的滤光片的光谱透过率曲线图；
图12为一实施方式的摄像装置中，所采用的红外截止滤光膜的光谱透过率曲线图；
图13为一实施方式的摄像装置中，红外截止滤光膜叠加滤光片的光谱透过率曲线图；
图14为一实施方式的摄像装置中，所采用的红外截止滤光膜的光谱反射率曲线图；
图15为一实施方式的摄像装置的滤光片的光谱反射率曲线图；
图16为一实施例的电子设备的结构示意图。
具体实施方式
为了便于理解本申请，下面将参照相关附图对本申请进行更全面的描述。附图中给出了本申请的较佳的实施例。但是，本申请可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本申请的公开内容的理解更加透彻全面。
作为在此使用的“电子设备”指包括但不限于经由以下任意一种或者数种连接方式连接的能够接收和/或发送通信信号的装置：
(1)经由有线线路连接方式，如经由公共交换电话网络(Public Switched Telephone Networks，PSTN)、数字用户线路(Digital Subscriber Line，DSL)、数字电缆、直接电缆连接；
(2)经由无线接口方式，如蜂窝网络、无线局域网(Wireless Local Area Network，WLAN)、诸如DVB-H网络的数字电视网络、卫星网络、AM-FM广播发送器。
被设置成通过无线接口通信的电子设备可以被称为“移动终端”。移动终端的示例包括但不限于以下电子装置：
(1)卫星电话或蜂窝电话；
(2)可以组合蜂窝无线电电话与数据处理、传真以及数据通信能力的个人通信系统(Personal Communications System，PCS)终端；
(3)无线电电话、寻呼机、因特网/内联网接入、Web浏览器、记事簿、日历、配备有全球定位系统(Global Positioning System，GPS)接收器的个人数字助理(Personal Digital Assistant，PDA)；
(4)常规膝上型和/或掌上型接收器；
(5)常规膝上型和/或掌上型无线电电话收发器等。
结合图1和图2所示，本申请一实施例提供一种电子设备100，可以是手机、平板电脑、笔记本电脑、智能手环、智能手表、智能头盔、智能眼镜等。为了便于理解，下面以电子设备100为手机为例进行说明。
电子设备100包括机壳10和显示屏20，机壳10与显示屏20之间形成收容空间，收容空间用于收容电子设备100的内部零件，机壳10可以对电子设备100的内部零件起到保护效果。机壳10可以是电子设备100的后盖，并覆盖电子设备100的电池、主板等零部件。在一些实施方式中，机壳10包括中框11和后壳12，显示屏20与后壳12分别连接于中框11的相对两侧。可以理解地，后壳12为电子设备100的背向显示屏20所在一侧的壳体。中框11可以是与后壳12一体成型，也可以是与后壳12分体设置。
在一些实施方式中，中框11与后壳12之间采取热固胶相连，这样便于中框11与后壳12之间的拆卸，使得电子设备100的维修更为简便。对于中框11与后壳12之间的连接方式，在此不做限定。
结合图3所示，显示屏20包括显示面板21和玻璃面板22，显示面板21设置在玻璃面板22面向后壳12的一面，继而玻璃面板22既能满足显示面板21透光显示的需要，也能够利用玻璃面板22对显示面板21进行保护，避免显示面板21的显示元件被刮伤而影响显示效果。
在一些实施方式中，中框11为玻璃中框11，玻璃中框11与玻璃面板22 注塑一体成型，这种成型工艺较为成熟，而且利用注塑成型的方式将玻璃中框11与玻璃面板22连接于一体，能够很方便的实现两者之间无配合缝隙，从而在使用电子设备100时，电子设备100设置显示屏20的一面正对用户，由于中框11与显示屏20融为一体而无配合缝隙，即没有配合的痕迹，呈现出全面屏的整体效果较好。
后壳12采用玻璃后壳或陶瓷后壳，使得电子设备100的外观质感较为协调，提高用户体验。
在一些实施例中，中框11与后壳12通过粘胶层粘结于一体。该粘胶层可以是OCA光学胶(Optically Clear Adhesive)粘结在中框11与后壳12之间固化而成。OCA光学胶具有无色透明、高透光性、高黏着力、高耐候、耐水性、耐高温、抗紫外线等特点，且具有受控制的厚度，能提供均匀的间距，长时间使用不会产生黄化、剥离及变质的问题。光学胶是重要触摸屏的原材料之一，是一种无基体材料的双面贴合胶带。
结合图2和图3所示，在一些实施例中，电子设备100包括摄像装置30，摄像装置30通信连接于电路板(图未示)，在一些实施方式中，摄像装置30可用于执行后置摄像头的功能，例如用户可以通过摄像装置30进行近景、远景拍摄或者视频录制等操作。在另一些实施方式中，摄像装置30可用于执行前置摄像头的功能，即用户可以通过摄像装置30进行自拍、视频通话等操作。
结合图4所示，摄像装置30包括滤光片310、镜头320和图像传感器330，镜头320和图像传感器330分别位于滤光片310的两侧，以利用滤光片310对镜头320所出射的光线进行过滤，从而使得成像所需要的光线入射图像传感器330，而将成像不需要的光线过滤掉或吸收掉。
结合图5所示，所述滤光片310包括红外滤光部件311、第一增透膜312 和第二增透膜313。所述红外滤光部件311具有相背设置的第一表面311a和第二表面311b，所述第一增透膜312形成于所述第一表面311a，所述第二增透膜313形成于所述第二表面311b。
该实施方式中，由于滤光片310的两侧分别设有第一增透膜312和第二增透膜313，从而极大降低滤光片310的整体反射率，使得滤光片310在可见光波段，即使大角度入射的情况下反射率变化也不大，从而不会产生眩光或鬼影的现象，以便采取该滤光片310的摄像装置30能够在维持成像效果的同时提升逆光拍照效果。且滤光片310内的红外滤光部件311又能够对红外光线起到过滤效果，从而减少红外光线进入图像传感器330而产生虚像。
结合图6和图7所示，所述红外滤光部件311包括透光基材3111和色素层3112，所述色素层3112至少涂覆所述透光基材3111的其中一个表面，其中，所述色素层3112包含近红外吸收剂和紫外吸收剂中的至少一种，近红外吸收剂用来吸收近红外波长范围的光，所述紫外吸收剂用来吸收紫外波长范围的光。该实施方式中，红外滤光部件311利用涂覆在透光基材3111的色素层3112对近红外光线进行吸收或紫外光线进行吸收，以提高滤光效果。
所述透光基材3111的材质可以是白玻璃。在其他实施方式中，透光基材3111也可以是蓝玻璃或者具有近红外吸收的树脂材料，这样透光基材3111也能够对进行红外光进行吸收，增强对红外光截止滤光效果，以提升可见光入射至图像传感器330的成像效果。
近红外吸收剂要求对660nm～930nm的近红外光有强吸收，而对可见光弱吸收或不吸收。近红外吸收剂可以是酞菁类、偶氮类、金属络合物类、二亚铵类或菁类有机染料中的一种或几种。紫外吸收剂可以是无机材料，例如氧化铈、氧化钛等。在一些实施方式中，色素层3112为加有紫外吸收成分的近 红外吸收色素，这样便可以配合设置在摄像装置30内的红外截止滤光膜共同过滤掉紫外光，以提高成像效果。
需要说明的是，镜头320具有入光侧320c，该入光侧320c为光线进入镜头320的一侧。图像传感器330设置于镜头320的背向入光侧320c的一侧。图像传感器330的类型可以包括CCD(电荷耦合)元件、CMOS(互补金属氧化物导体)器件和光敏二极管等。从色彩来划分，图像传感器330可以是彩色图像传感器、单色图像传感器和灰度传感器等。透过摄像头镜片30a的光线经镜头320进行聚焦或滤光等光学处理后入射图像传感器330。
其中，结合图8所示，镜头320包括多个镜片321，其中，最靠近入光侧320c的镜片321的至少一面镀有红外截止滤光膜321a，从而利用红外截止滤光膜321a对红外光线进行过滤，以避免红外光线入射至图像传感器330而形成虚像，影响拍摄效果。红外截止滤光膜321a可以是镀设在最靠近入光侧320c的镜片321的远离图像传感器330的一侧，从而红外截止滤光膜321a距离图像传感器330尽可能的远，以避免红外截止滤光膜321a反射光进入图像传感器330而产生眩光和鬼影。
在结合图9所示，在一些实施方式中，最靠近入光侧320c的镜片321的两侧均设有红外截止滤光膜321a，以增强对红外光线的过滤效果，避免红外光线干扰可见光在图像传感器330的成像效果。
需要说明的是，可以根据镜头320对入射光线进行光学处理的需要，多个镜片321中，一些镜片321为凸透镜，另一些镜片321为凹透镜，对于镜头320内的镜片321的数量和类型，在此不做限定。
在一些实施方式中，结合图4所示，摄像装置30包括摄像头镜片30a，摄像头镜片30a可以是通过装饰圈30b与后壳12相连接，也可以是将摄像头 镜片30a作为后壳12的一部分一体成型于后壳12。
在其他实施方式中，摄像头镜片30a还可以是设置在机壳10的其他位置，只要能够适应光线透过，使得透过摄像头镜片30a的光线能够经过镜头320入射至图像传感器330进行成像即可，即摄像头镜片30a设置于镜头320的入光侧320c。
摄像头镜片30a的朝向镜头320的一侧表面上镀有红外截止滤光膜340，从而利用红外截止滤光膜340对入射摄像头镜片30a的光线进行过滤，由于红外截止滤光膜340能够过滤掉红外光，从而避免红外光进入图像传感器330而产生虚像，以确保成像效果。
摄像头镜片30a上还设有增透层350，以提高摄像头镜片30a的整体透光率。增透层350可以是设置在摄像头镜片30a与红外截止滤光膜340之间，也可以是设置在红外截止滤光膜340的背向摄像头镜片30a的一侧。
在一些实施例中，镜头320通过镜座320a安装于图像传感器330的入光路径上，即经过镜头320进行光学处理的光线入射图像传感器330时，能够满足成像需要。其中，镜座320a不仅提供镜头320的安装空间，同时，镜座320a所围设的空间能够满足图像传感器330的收容需要。
需要说明的是，结合图4所示，摄像装置30处于装配状态下，镜座320a将图像传感器330罩住，镜头320安装至镜座320a后，镜头320的光轴320b与图像传感器330的感光区的交点大致位于图像传感器330的感光区的中部位置，以使得经过镜头320光学处理的光线能够均匀地照射图像传感器330的感光区，以适应成像需要。
需要说明的是，镜头320设置于摄像头镜片30a的内侧，摄像头镜片30a的内侧指的是摄像头装置安装于电子设备100时，摄像头镜片30a朝向电子 设备100内部的一侧，相应地，摄像头镜片30a外露于电子设备100的一侧为摄像头镜片30a的外侧。
需要说明的是，摄像装置30内还可以在其它地方设置红外过滤的结构件，例如，结合图10所示，图像传感器330的朝向镜头320的一侧镀有红外截止滤光膜330a，红外截止滤光膜330a至少覆盖图像传感器330的感光区，这样也可以利用图像传感器330上的红外截止滤光膜330a对红外光起到良好的过滤效果，以确保图像传感器330的成像效果。
需要说明的是，摄像装置30内，所采用红外截止滤光膜的中心波长大于或等于790nm，采取这种结构设置，可以避免红外光入射至图像传感器330而形成虚像。
结合图8和图11所示，以透光基材3111为蓝玻璃为例，在蓝玻璃的其中一侧涂覆对近红外光线具有吸收的色素层3112，形成红外滤光部件311后，在红外滤光部件311的两侧设置第一增透膜312和第二增透膜313。图11示出了滤光片的光谱透过率曲线。结合图13所示，摄像装置30的综合光谱显示，透过率T％达到了红外截止滤光的效果。具体地，对于人眼敏感波段430nm～640nm的光线来说，图4示出的摄像装置30中，红外截止滤光膜340叠加滤光片310，在435nm～565nm波长范围的可见光的平均透过率达到了90％，最大透过率T％可达93.6％，因此实现了可见光的高透过率。对于700nm～1100nm的波长范围的光线的平均透过率T％在0.19％以下，最大透过率T％在1.5％以下，因此实现了红外光线的高效截止。并且采取0°和40°的入射角γ(参考图4所示)入射摄像头镜片30a时，中心波长偏移量分别为1.5nm和3.5nm，从而角度一致性比较好，保证了正常的成像效果，不会出现中间和边缘存在色差的问题。
需要说明的是，入射角γ指的是入射光线与摄像头镜片30a的外表面的法线的夹角，也是入射光线与镜头320的光轴320b的夹角。结合图4和图12所示，摄像装置30所采用的红外截止滤光膜340，在入射角γ取值为0～40°的范围内，对于400nm～700nm的波长范围的可见光的平均透过率98％以上，最小透过率94％以上，红外截止滤光的中心波长在790以上，在不同角度入射的情况下观察，红外截止滤光膜340所反射的颜色效果基本是一致，从而避免拍摄暗影出现。
结合图14所示，图14示出了摄像装置30所采用的红外截止滤光膜的光谱反射率曲线图。从图14中可以看出，在0～40°的入射角范围内，对于400纳米～700纳米的波长范围的可见光的平均反射率在2％以下，最高反射率6％以下；这表明即使在光线大角度入射的情况下，也能实现较低的反射率，从而可以实现减少眩光或鬼影的效果。
结合图15所示，在入射角γ为0°时，可见光光波段420nm～680nm平均反射率小于或等于0.25％，最高反射率为0.5％。即使在入射角γ为40°时，平均反射率小于或等于0.8％以下，最高反射率为1.2％。实现了较低反射率，起到了减少眩光或鬼影的效果。
参考图16，图16为本申请实施例提供的电子设备100的结构示意图。该电子设备100可以包括射频(RF，Radio Frequency)电路501、包括有一个或一个以上计算机可读存储介质的存储器502、输入单元503、显示单元504、传感器505、音频电路506、无线保真(WiFi，Wireless Fidelity)模块507、包括有一个或者一个以上处理核心的处理器508、以及电源509等部件。本领域技术人员可以理解，图16中示出的电子设备100结构并不构成对电子设备100的限定，可以包括比图示更多或更少的部件，或者组合某些部件，或者不同的部件布置。
射频电路501可用于收发信息，或通话过程中信号的接收和发送，特别地，将基站的下行信息接收后，交由一个或者一个以上处理器508处理；另外，将涉及上行的数据发送给基站。通常，射频电路501包括但不限于天线、至少一个放大器、调谐器、一个或多个振荡器、用户身份模块(SIM，Subscriber Identity Module)卡、收发信机、耦合器、低噪声放大器(LNA，Low Noise Amplifier)、双工器等。此外，射频电路501还可以通过无线通信与网络和其他设备通信。该无线通信可以使用任一通信标准或协议，包括但不限于全球移动通信系统(GSM，Global System of Mobile communication)、通用分组无线服务(GPRS，General Packet Radio Service)、码分多址(CDMA，Code Division Multiple Access)、宽带码分多址(WCDMA，Wideband Code Division Multiple Access)、长期演进(LTE，Long Term Evolution)、电子邮件、短消息服务(SMS，Short Messaging Service)等。
存储器502可用于存储应用程序和数据。存储器502存储的应用程序中包含有可执行代码。应用程序可以组成各种功能模块。处理器508通过运行存储在存储器502的应用程序，从而执行各种功能应用以及数据处理。存储器502可主要包括存储程序区和存储数据区，其中，存储程序区可存储操作系统、至少一个功能所需的应用程序(比如声音播放功能、图像播放功能等)等；存储数据区可存储根据电子设备100的使用所创建的数据(比如音频数据、电话本等)等。此外，存储器502可以包括高速随机存取存储器，还可以包括非易失性存储器，例如至少一个磁盘存储器件、闪存器件、或其他易失性固态存储器件。相应地，存储器502还可以包括存储器控制器，以提供处理器508和输入单元503对存储器502的访问。
输入单元503可用于接收输入的数字、字符信息或用户特征信息(比如 指纹)，以及产生与用户设置以及功能控制有关的键盘、鼠标、操作杆、光学或者轨迹球信号输入。具体地，在一个具体的实施例中，输入单元503可包括触敏表面以及其他输入设备。触敏表面，也称为触摸显示屏或者触控板，可收集用户在其上或附近的触摸操作(比如用户使用手指、触笔等任何适合的物体或附件在触敏表面上或在触敏表面附近的操作)，并根据预先设定的程式驱动相应的连接装置。可选的，触敏表面可包括触摸检测装置和触摸控制器两个部分。其中，触摸检测装置检测用户的触摸方位，并检测触摸操作带来的信号，将信号传送给触摸控制器；触摸控制器从触摸检测装置上接收触摸信息，并将它转换成触点坐标，再送给处理器508，并能接收处理器508发来的命令并加以执行。
显示单元504可用于显示由用户输入的信息或提供给用户的信息以及电子设备100的各种图形用户接口，这些图形用户接口可以由图形、文本、图标、视频和其任意组合来构成。显示单元504可包括上述的显示面板21。可选的，可以采用液晶显示器(LCD，Liquid Crystal Display)、有机发光二极管(OLED，Organic Light-Emitting Diode)等形式来配置显示面板21。
进一步的，触敏表面可覆盖显示面板21，当触敏表面检测到在其上或附近的触摸操作后，传送给处理器508以确定触摸事件的类型，随后处理器508根据触摸事件的类型在显示面板21上提供相应的视觉输出。
虽然在图16中，触敏表面与显示面板21是作为两个独立的部件来实现输入和输入功能，但是在某些实施例中，可以将触敏表面与显示面板21集成而实现输入和输出功能。可以理解的是，显示屏20可以包括输入单元503和显示单元504。
电子设备100还可包括至少一种传感器505，比如光传感器、运动传感 器以及其他传感器。具体地，光传感器可包括环境光传感器及接近传感器，其中，环境光传感器可根据环境光线的明暗来调节显示面板21的亮度，接近传感器可在电子设备100移动到耳边时，关闭显示面板21和/或背光。作为运动传感器的一种，重力加速度传感器可检测各个方向上(一般为三轴)加速度的大小，静止时可检测出重力的大小及方向，可用于识别手机姿态的应用(比如横竖屏切换、相关游戏、磁力计姿态校准)、振动识别相关功能(比如计步器、敲击)等；至于电子设备100还可配置的陀螺仪、气压计、湿度计、温度计、红外线传感器等其他传感器，在此不再赘述。
音频电路506可通过扬声器、传声器提供用户与电子设备100之间的音频接口。音频电路506可将接收到的音频数据转换成电信号，传输到扬声器，由扬声器转换为声音信号输出；另一方面，传声器将收集的声音信号转换为电信号，由音频电路506接收后转换为音频数据，再将音频数据输出处理器508处理后，经射频电路501以发送给比如另一电子设备100，或者将音频数据输出至存储器502以便进一步处理。音频电路506还可能包括耳机座，以提供外设耳机与电子设备100的通信。
无线保真(WiFi)属于短距离无线传输技术，电子设备100通过无线保真模块507可以帮助用户收发电子邮件、浏览网页和访问流式媒体等，它为用户提供了无线的宽带互联网访问。虽然图16示出了无线保真模块507，但是可以理解的是，其并不属于电子设备100的必须构成，完全可以根据需要在不改变发明的本质的范围内而省略。
处理器508是电子设备100的控制中心，利用各种接口和线路连接整个电子设备100的各个部分，通过运行或执行存储在存储器502内的应用程序，以及调用存储在存储器502内的数据，执行电子设备100的各种功能和处理 数据，从而对电子设备100进行整体监控。可选的，处理器508可包括一个或多个处理核心；优选的，处理器508可集成应用处理器和调制解调处理器，其中，应用处理器主要处理操作系统、用户界面和应用程序等，调制解调处理器主要处理无线通信。可以理解的是，上述调制解调处理器也可以不集成到处理器508中。
电子设备100还包括给各个部件供电的电源509。优选的，电源509可以通过电源管理系统与处理器508逻辑相连，从而通过电源管理系统实现管理充电、放电、以及功耗管理等功能。电源509还可以包括一个或一个以上的直流或交流电源、再充电系统、电源故障检测电路、电源转换器或者逆变器、电源状态指示器等任意组件。
尽管图16中未示出，电子设备100还可以包括蓝牙模块等，在此不再赘述。具体实施时，以上各个模块可以作为独立的实体来实现，也可以进行任意组合，作为同一或若干个实体来实现，以上各个模块的具体实施可参见前面的方法实施例，在此不再赘述。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对申请专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干变形和改进，这些都属于本申请的保护范围。因此，本申请专利的保护范围应以所附权利要求为准。

Claims (20)

  1. 一种滤光片，其特征在于，包括：
    红外滤光部件，具有相背设置的第一表面和第二表面；
    第一增透膜，形成于所述第一表面；及
    第二增透膜，形成于所述第二表面。
  2. 根据权利要求1所述的滤光片，其特征在于，所述红外滤光部件包括透光基材和色素层，所述色素层至少涂覆所述透光基材的其中一个表面，其中，所述色素层包含近红外吸收剂和紫外吸收剂中的至少一种。
  3. 根据权利要求2所述的滤光片，其特征在于，所述近红外吸收剂包含吸收近红外波长范围的光的有机化合物，所述紫外吸收剂包括吸收紫外波长范围的光的无机化合物。
  4. 根据权利要求2或3所述的滤光片，其特征在于，所述透光基材的材质为蓝玻璃、白玻璃或具有近红外吸收的树脂材料。
  5. 根据权利要求2或3所述的滤光片，其特征在于，所述近红外吸收剂包括酞菁类、偶氮类、金属络合物类、二亚铵类或菁类有机染料中的一种或几种。
  6. 根据权利要求2或3所述的滤光片，其特征在于，所述紫外吸收剂包括氧化铈或氧化钛。
  7. 一种摄像装置，其特征在于，包括权利要求1-6任一项所述的滤光片。
  8. 根据权利要求7所述的摄像装置，其特征在于，所述摄像装置包括镜头和图像传感器，所述滤光片设置于所述镜头与所述图像传感器之间。
  9. 根据权利要求8所述的摄像装置，其特征在于，所述镜头包括沿其光轴排布的多个镜片，其中，最靠近入光侧的镜片的至少一面镀有红外截止滤 光膜。
  10. 根据权利要求9所述的摄像装置，其特征在于，位于最靠近入光侧的镜片的所述红外截止滤光膜的中心波长大于或等于790nm。
  11. 根据权利要求8-10任一项所述的摄像装置，其特征在于，所述图像传感器的朝向所述镜头的一侧镀有红外截止滤光膜，位于所述图像传感器的所述红外截止滤光膜至少覆盖所述图像传感器的感光区。
  12. 根据权利要求11所述的摄像装置，其特征在于，位于所述图像传感器的所述红外截止滤光膜的中心波长大于或等于790nm。
  13. 根据权利要求8-10任一项所述的摄像装置，其特征在于，包括摄像头镜片，所述摄像头镜片设置于所述镜头的入光侧，所述摄像头镜片的朝向所述镜头的一侧表面上镀有红外截止滤光膜。
  14. 根据权利要求13所述的摄像装置，其特征在于，位于所述摄像头镜片的所述红外截止滤光膜的中心波长大于或等于790nm。
  15. 根据权利要求13所述的摄像装置，其特征在于，所述摄像头镜片上的所述红外截止滤光膜与所述摄像头镜片之间设有增透层；
    或者，所述摄像头镜片上的所述红外截止滤光膜的背向所述摄像头镜片的一侧设有增透层。
  16. 根据权利要求11所述的摄像装置，其特征在于，包括摄像头镜片，所述摄像头镜片设置于所述镜头的入光侧，所述摄像头镜片的朝向所述镜头的一侧表面上镀有红外截止滤光膜。
  17. 根据权利要求16所述的摄像装置，其特征在于，位于所述图像传感器的所述红外截止滤光膜的中心波长大于或等于790nm，和/或，位于所述摄像头镜片的所述红外截止滤光膜的中心波长大于或等于790nm。
  18. 根据权利要求16所述的摄像装置，其特征在于，所述摄像头镜片上的所述红外截止滤光膜与所述摄像头镜片之间设有增透层；
    或者，所述摄像头镜片上的所述红外截止滤光膜的背向所述摄像头镜片的一侧设有增透层。
  19. 根据权利要求8所述的摄像装置，其特征在于，所述图像传感器包括CCD元件、CMOS器件或光敏二极管；
    或者，所述图像传感器为彩色图像传感器、单色图像传感器或灰度传感器。
  20. 一种电子设备，其特征在于，包括权利要求7-19任一项所述的摄像装置。
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