WO2022097874A1 - Nozzle body device for reducing selective solder ball - Google Patents

Nozzle body device for reducing selective solder ball Download PDF

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Publication number
WO2022097874A1
WO2022097874A1 PCT/KR2021/008311 KR2021008311W WO2022097874A1 WO 2022097874 A1 WO2022097874 A1 WO 2022097874A1 KR 2021008311 W KR2021008311 W KR 2021008311W WO 2022097874 A1 WO2022097874 A1 WO 2022097874A1
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Prior art keywords
nozzle body
solder
nozzle
hole
solder ball
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PCT/KR2021/008311
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French (fr)
Korean (ko)
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백철호
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주식회사 티앤아이텍
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Publication of WO2022097874A1 publication Critical patent/WO2022097874A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Definitions

  • the present invention relates to a selective solder ball reduction nozzle body apparatus, and more particularly, to a selective solder ball reduction nozzle body apparatus capable of remarkably reducing soldering defects of a substrate by reducing the formation of solder balls generated during soldering of mounted parts of a board will be.
  • soldering In the printed circuit board, which is an essential component of electronic and electrical products, various parts and entire circuits are connected by soldering through solder ports in order to be able to exhibit their respective functions.
  • a plurality of heaters for melting the solder are installed inside the solder pot, and a nozzle for ejecting the molten solder to the top of the pot is installed on one side of the solder pot, and on the other side of the nozzle
  • An impeller is installed on the top to allow the solder to be ejected.
  • solder When soldering a printed circuit board, solder is put into the pot and power is applied to the heater, so that the solder is melted by the heat of the heater and becomes a liquid state.
  • the lead-water melting tank is formed with an open upper part, and a plurality of heaters are coupled to melt the solder bar input to the inside and convert it into lead-water
  • the lead-water A lead water storage tank that is coupled to the lead water smelting tank through a connection bracket to be disposed in the lead water storage tank, the lead water storage tank is formed so that the lead water is introduced and stored by pressure
  • An impeller connected via a transmission means and pumped by the drive motor to introduce the lead water in the lead water molten tank into the lead water storage tank, and the lead water storage tank to be exposed to the upper part of the lead water smelting tank and coupled to the impeller
  • the lead water in the lead water storage tank is discharged at a constant pressure toward the printed circuit board disposed on the upper part of the lead water smelting tank by the pressure of the lead water acting as the lead water storage tank in the lead water tank and the pumping force of the impeller.
  • a soldering apparatus including a provided nozzle is disclosed.
  • the nitrogen supply line 10 for forming a nitrogen atmosphere is provided in the nitrogen supply line 10 in a state installed on one side of the solder melting bath 20 .
  • Nitrogen gas is provided to one side of the solder melting bath 20 through the injection nozzle.
  • the injection nozzle body 110 through which the center is penetrated and the solder solution is pumped is seated on the holder 140 seated in the solder solution bath 130,
  • a nozzle cap 120 having an injection hole for the solder solution to flow out is provided on the top of the injection nozzle body 110 .
  • the injection nozzle body 110 and the nozzle cap 120 are seated in a cylindrical insertion groove 112 for seating the nozzle cap 120 on the upper portion of the injection nozzle body 110 .
  • the molten solder solution (SS) flows out through the nozzle body 110 and the nozzle cap 120 seated on the cradle 140 seated in the solder solution tank 130 in which the molten solder solution (SS) is accommodated, and the soldering solution is performed.
  • the solder solution S should flow down by gravity on the outer surfaces of the nozzle cap 120 and the nozzle body 110 and then rejoin the molten solder solution SS.
  • the solder liquid (S) discharged from the injection port of the nozzle cap 120 rides on the outer surface of the nozzle cap 120 and the nozzle body 110 and flows down due to gravity.
  • a nozzle body 10 for guiding downward while preventing transmission;
  • a selective solder ball reduction nozzle body device is provided, which is seated on the upper portion of the nozzle body 10 and is in communication with the central axis of the nozzle body 10 and includes a nozzle cap 20 for discharging the solder liquid (S).
  • soldering defects can be reduced by preventing the occurrence of solder balls according to the temperature change of the solder liquid on the spray nozzle in the soldering apparatus.
  • 1A is a schematic perspective view of a conventional solder ball device.
  • 1B is a schematic cross-sectional view illustrating a state in which a solder ball is generated in a nozzle body of a conventional solder ball device.
  • FIG. 2 is a perspective view of a selective solder ball reduction nozzle body device according to a preferred embodiment of the present invention.
  • FIG. 3 is a cross-sectional view taken along arrow AA of FIG. 2 .
  • FIG. 4 is a cross-sectional view illustrating a solder ball suppression process in a soldering process in a selective solder ball reduction nozzle body device according to a preferred embodiment of the present invention.
  • a nozzle body 10 for guiding downward while preventing transmission;
  • a selective solder ball reduction nozzle body device is provided, which is seated on the upper portion of the nozzle body 10 and is in communication with the central axis of the nozzle body 10 and includes a nozzle cap 20 for discharging the solder liquid (S).
  • the nozzle body 10 includes a central through-hole 12 through the central axis from the upper surface to the lower surface, and a plurality of through-holes from the upper surface to the lower side of the nozzle body 10 with respect to the outer direction of the center through-hole 12 . It is preferable to include an outer through hole 14 .
  • the nozzle body 10 extends from the outer peripheral surface of the nozzle body 10 to the outside of the outer through-hole 14 exposed at the top of the nozzle body 10 to prevent the outflow of the solder liquid (S) to the outside. It is preferable to further provide the prevention piece 16.
  • the outer through-hole 14 of the nozzle body 10 extends to the position of the surface in which the solder solution SS accommodated in the solder solution tank B is submerged.
  • the nozzle body 10 further includes a guide part 18 for guiding the solder liquid S' flowing down the outer through hole 14 of the nozzle body 10 to the outside of the furnace body 110 . It is preferable to do
  • the selective solder ball reduction nozzle body device according to the preferred embodiment of the present invention, it is seated on the cradle (F) mounted on the solder solution bath (B) and solders from the central axis to the upper part.
  • the nozzle body 10 and the nozzle body 10 for inducing the liquid (S) and guiding the residual solder liquid (S) discharged for the soldering operation downward while preventing the temperature drop of the solder liquid (S) from the upper surface ) is seated on the upper part and communicates with the central axis of the nozzle body 10, and consists of a nozzle cap 20 for discharging the solder liquid (S).
  • the nozzle body 10 has a central through-hole 12 through the central axis from the upper surface to the lower surface, and a plurality of outer through-holes through-hole from the upper surface of the nozzle body 10 to the lower side with respect to the outer direction of the center through-hole 12 . (14), and an outflow prevention piece ( 16) is provided.
  • the central through hole 12 of the nozzle body 10 communicates with the central axis of the nozzle cap 20 .
  • the outer through-hole 14 of the nozzle body 10 extends downward along the long axis of the nozzle body 10 from the upper space of the outer portion in which the nozzle cap 20 is seated on the upper surface of the nozzle body 10 and is through-hole. At this time, the outer through-hole 14 of the nozzle body 10 is formed radially symmetrically with respect to the central through-hole 12 of the nozzle body 10 .
  • the outer through-hole 14 of the nozzle body 10 may extend to the lower surface of the nozzle body 10, but according to a preferred embodiment of the present invention, the solder solution (SS) accommodated in the solder solution tank (B). It extends to the position of this locking face.
  • a guide part 18 is further provided to guide the solder liquid S' flowing down the outer through hole 14 of the nozzle body 10 to the outside of the furnace body 110 .
  • the outer through-hole 14 of the nozzle body 10 is discharged from the nozzle cap 20 and flows back into the solder solution tank (B) in the process Since the outer through hole 14 is immersed in the solder solution SS accommodated at a high temperature in the solder solution bath B in a state formed through the nozzle body 10 through the lower surface of the nozzle body 10, It can always have a state of being maintained at a high temperature. As such, the outer through-hole 14 of the nozzle body 10 maintained at a high temperature is solidified while maintaining a high temperature with respect to the solder liquid (S) discharged from the nozzle cap 20. It can be smoothly recycled to the solder solution bath (B).
  • the leakage preventing piece 16 of the nozzle body 10 is extended from the outer peripheral surface of the nozzle body 10 to the outside of the outer through-hole 14 exposed at the top of the nozzle body 10, the solder liquid (S) Prevent external leakage.
  • the nozzle cap 20 is seated on the upper portion of the nozzle body 10 and has a communication hole 22 communicating with the central axis of the nozzle body 10 .
  • soldering defects can be reduced by preventing the occurrence of solder balls according to the temperature change of the solder liquid on the spray nozzle in the soldering apparatus.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

According to the present invention, provided is a nozzle body device for reducing selective solder ball comprising: a nozzle body (10) which is seated on a holder (F) that is placed in a solder solution tank (B) and guides a solder solution (S) to the upper portion in the central shaft, and guides the solder solution (S) that flows down during a soldering work to the lower portion while preventing heat of the solder solution (S) from transferring to outside; and a nozzle cap (20) which is seated on the upper portion of the nozzle body (10) to be in communication with the central shaft of the nozzle body (10) and discharges the solder solution (S).

Description

셀렉티브 솔더볼 저감 노즐바디장치Selective Solder Ball Reduction Nozzle Body Device
본 발명은 셀렉티브 솔더볼 저감 노즐바디장치에 관한 것으로서, 보다 상세하게는 기판의 실장부품에 대하여 솔더링시 발생되는 솔더볼의 형성을 저감함으로써 기판의 솔더링 불량을 현저히 줄일 수 있는 셀렉티브 솔더볼 저감 노즐바디장치에 관한 것이다.The present invention relates to a selective solder ball reduction nozzle body apparatus, and more particularly, to a selective solder ball reduction nozzle body apparatus capable of remarkably reducing soldering defects of a substrate by reducing the formation of solder balls generated during soldering of mounted parts of a board will be.
전자 전기 제품의 필수 구성 요소인 인쇄회로기판에는 각각의 제기능을 발휘할 수 있도록 하기 위하여 각종 부품과 전체 회로를 솔더포트에 의해 납땜으로 연결하고 있다. 이와 관련된 솔더링 장치는 솔더포트의 내부에 솔더를 용융시키는 히터가 다수개 설치되고 있고, 솔더포트의 일측으로는 용융된 솔더를 포트의 상부로 분출시키는 노즐이 설치되어 있으며, 다른 일측으로는 노즐의 상부에 솔더가 분출되도록 하는 임펠러가 설치되어 있다.In the printed circuit board, which is an essential component of electronic and electrical products, various parts and entire circuits are connected by soldering through solder ports in order to be able to exhibit their respective functions. In the related soldering apparatus, a plurality of heaters for melting the solder are installed inside the solder pot, and a nozzle for ejecting the molten solder to the top of the pot is installed on one side of the solder pot, and on the other side of the nozzle An impeller is installed on the top to allow the solder to be ejected.
인쇄회로기판을 솔더링하고자 할 경우에는 솔더를 포트 내에 넣고 히터에 전원을 인가하여 솔더가 히터의 열에 의해 용융되어 액체상태로 된다.When soldering a printed circuit board, solder is put into the pot and power is applied to the heater, so that the solder is melted by the heat of the heater and becomes a liquid state.
이러한 상태에서 임펠러를 구동시키면 용융된 솔더는 노즐을 통하여 상부로 분출되므로 분출되는 솔더측으로 인쇄회로기판을 이동시켜 솔더링하게 된다. 이러한 종래의 솔더포트는 노즐을 통하여 솔더를 분출시 압력이 불규칙하게 유지됨에 따라 인쇄회로기판에 원활한 솔더링을 할 수 없었고 이로 인하여 인쇄회로기판에 대한 솔더링시 효율성이 떨어지고 제품 불량이 빈번하게 발생하게 되는 문제점이 있다. 이러한 문제점을 해결하기 위하여 특허 공개공보 제10-2017-70848호에 의하면, 상부가 개방 형성되되 내부로 투입되는 솔더바를 용융시켜 납물로 변환시킬 수 있도록 다수의 히터가 결합되는 납물 용융조, 상기 납물 속에 배치되도록 상기 납물 용융조에 연결 브라켓을 매개로 결합되고, 상기 납물이 압력에 의해 내부로 유입되어 저장되도록 형성되는 납물 저장탱크, 상기 납물 저장탱크 내에 배치되어 상기 납물 융용조에 결합되는 구동모터와 동력전달수단을 매개로 연결되고 상기 구동모터에 의해 펌핑 작동되어 상기 납물 용융조의 납물을 상기 납물 저장탱크 내로 유입하도록 마련되는 임펠러, 및 상기 납물 용융조의 상부로 노출되도록 납물 저장탱크에 결합되고 상기 임펠러의 작동시 상기 납물 용융조에서 상기 납물 저장탱크로 작용하는 납물의 압력과 상기 임펠러의 펌핑력에 의해 상기 납물 저장탱크 내의 납물을 상기 납물 용융조의 상부에 배치되는 인쇄회로기판을 향해 일정한 압력으로 토출하도록 마련되는 노즐을 포함하는 솔더링 장치가 개시되어 있다.When the impeller is driven in this state, the molten solder is ejected upward through the nozzle, so that the printed circuit board is moved to the ejected solder side to perform soldering. Such a conventional solder pot could not perform smooth soldering on the printed circuit board as the pressure was maintained irregularly when the solder was ejected through the nozzle. There is a problem. In order to solve this problem, according to Patent Laid-Open Publication No. 10-2017-70848, the lead-water melting tank is formed with an open upper part, and a plurality of heaters are coupled to melt the solder bar input to the inside and convert it into lead-water, the lead-water A lead water storage tank that is coupled to the lead water smelting tank through a connection bracket to be disposed in the lead water storage tank, the lead water storage tank is formed so that the lead water is introduced and stored by pressure An impeller connected via a transmission means and pumped by the drive motor to introduce the lead water in the lead water molten tank into the lead water storage tank, and the lead water storage tank to be exposed to the upper part of the lead water smelting tank and coupled to the impeller During operation, the lead water in the lead water storage tank is discharged at a constant pressure toward the printed circuit board disposed on the upper part of the lead water smelting tank by the pressure of the lead water acting as the lead water storage tank in the lead water tank and the pumping force of the impeller. A soldering apparatus including a provided nozzle is disclosed.
종래 솔더링 장치의 노즐에 의하면, 도 1a에 도시된 바와 같이, 질소 분위기 형성을 위한 질소 공급라인(10)이 솔더 용융조(20)의 일측에 설치된 상태에서 상기 질소 공급라인(10)에 구비된 분사 노즐을 통하여 솔더 용융조(20)의 일측으로 질소 가스가 제공되고 있다. According to the nozzle of the conventional soldering apparatus, as shown in FIG. 1A , the nitrogen supply line 10 for forming a nitrogen atmosphere is provided in the nitrogen supply line 10 in a state installed on one side of the solder melting bath 20 . Nitrogen gas is provided to one side of the solder melting bath 20 through the injection nozzle.
도 1b에 도시된 바와 같이, 종래 솔더링 장치의 노즐에 의하면, 중심이 통공되어 솔더용액이 펌핑되는 분사 노즐몸체(110)가 솔더용액조(130)에 안착된 거치대(140)상에 안착되며, 분사 노즐몸체(110)의 상부에 솔더용액이 흘러나오기 위한 분사구를 가진 노즐캡(120)이 구비되어 있다. 분사 노즐몸체(110)와 노즐캡(120)은 분사 노즐몸체(110)의 상부에 노즐캡(120)이 안착되기 위한 원주형태의 삽입홈(112)에 안착된다. 용융된 솔더용액(SS)이 수용된 솔더용액조(130)에 안착된 거치대(140) 상에 안착된 노즐몸체(110)와 노즐캡(120)의 분사구를 통하여 솔더액(S)이 흘러나와 솔더링 공정시, 솔더액(S)이 노즐캡(120)과 노즐몸체(110)의 외측면을 타고 중력에 의하여 흘러내린 후 용융된 솔더용액(SS)에 다시 합류가 되어야 한다. 그러나, 종래 솔더링 장치의 노즐에 있어서, 노즐캡(120)의 분사구로부터 토출된 솔더액(S)은 노즐캡(120)과 노즐몸체(110)의 외측면을 타고 중력에 의하여 흘러내리는 과정에서 온도가 저하되면서 연속적이거나 균일하게 흘러내리지 못하고 불연속적으로 흘러내림으로써 낙하현상이 발생되며 그로 인하여 솔더용액조(130)의 솔더용액(SS)에 대하여 낙하 현상에 따른 솔더볼(SB)이 반사적으로 현성되어 상부로 튀어나오는 현상이 발생되고 있다. 이와 같은 솔더볼(SB)이 형성됨으로써 기판에 대한 솔더링 작업 공정에서 기판의 불량을 발생시키는 문제점이 있다.As shown in FIG. 1B, according to the nozzle of the conventional soldering apparatus, the injection nozzle body 110 through which the center is penetrated and the solder solution is pumped is seated on the holder 140 seated in the solder solution bath 130, A nozzle cap 120 having an injection hole for the solder solution to flow out is provided on the top of the injection nozzle body 110 . The injection nozzle body 110 and the nozzle cap 120 are seated in a cylindrical insertion groove 112 for seating the nozzle cap 120 on the upper portion of the injection nozzle body 110 . The molten solder solution (SS) flows out through the nozzle body 110 and the nozzle cap 120 seated on the cradle 140 seated in the solder solution tank 130 in which the molten solder solution (SS) is accommodated, and the soldering solution is performed. During the process, the solder solution S should flow down by gravity on the outer surfaces of the nozzle cap 120 and the nozzle body 110 and then rejoin the molten solder solution SS. However, in the nozzle of the conventional soldering apparatus, the solder liquid (S) discharged from the injection port of the nozzle cap 120 rides on the outer surface of the nozzle cap 120 and the nozzle body 110 and flows down due to gravity. As the temperature decreases, it does not flow continuously or uniformly, but a drop phenomenon occurs because it flows discontinuously. The phenomenon of protruding upwards is occurring. Since such a solder ball SB is formed, there is a problem in that a defect of the substrate occurs in a soldering operation process for the substrate.
따라서 이러한 문제점을 해결할 수 있는 솔더 장치의 개발이 요구되고 있다.Therefore, the development of a solder device capable of solving these problems is required.
따라서 본 발명의 목적은 솔더링 장치에 있어서 분사 노즐 상에서 솔더액의 온도 변화에 따른 솔더볼의 발생현상을 방지함으로써 솔더링의 불량을 줄일 수 있는 셀렉티브 솔더볼 저감 노즐바디장치를 제공하는 것이다.Accordingly, it is an object of the present invention to provide a selective solder ball reduction nozzle body apparatus capable of reducing soldering defects by preventing the occurrence of solder balls according to a temperature change of a solder liquid on a spray nozzle in a soldering apparatus.
본 발명에 의하면, 솔더용액조(B)에 거치된 거치대(F)에 안착되며 중심축에서 상부로 솔더액(S)을 유도하며, 솔더링 작업시 흘러내리는 솔더액(S)의 열량이 외부로 전달되는 것을 방지하면서 하방으로 유도하기 위한 노즐몸체(10)와; 노즐몸체(10)의 상부에 안착되어 노즐몸체(10)의 중심축과 연통되어 솔더액(S)을 토출하기 위한 노즐캡(20)으로 이루어지는 셀렉티브 솔더볼 저감 노즐바디장치가 제공된다.According to the present invention, it is seated on the cradle (F) mounted on the solder solution tank (B) and induces the solder solution (S) from the central axis to the upper part, and the amount of heat of the solder solution (S) flowing down during the soldering operation is external. a nozzle body 10 for guiding downward while preventing transmission; A selective solder ball reduction nozzle body device is provided, which is seated on the upper portion of the nozzle body 10 and is in communication with the central axis of the nozzle body 10 and includes a nozzle cap 20 for discharging the solder liquid (S).
따라서 본 발명에 의하면, 솔더링 장치에 있어서 분사 노즐 상에서 솔더액의 온도 변화에 따른 솔더볼의 발생현상을 방지함으로써 솔더링의 불량을 줄일 수 있다.Therefore, according to the present invention, soldering defects can be reduced by preventing the occurrence of solder balls according to the temperature change of the solder liquid on the spray nozzle in the soldering apparatus.
도 1a는 종래 솔더볼 장치의 개략적인 사시도이다.1A is a schematic perspective view of a conventional solder ball device.
도 1b는 종래 솔더볼 장치의 노즐 바디에서 솔더볼이 발생되는 상태를 나타낸 개략적인 단면도이다.1B is a schematic cross-sectional view illustrating a state in which a solder ball is generated in a nozzle body of a conventional solder ball device.
도 2는 본 발명의 바람직한 실시예에 따른 셀렉티브 솔더볼 저감 노즐바디장치의 사시도이다.2 is a perspective view of a selective solder ball reduction nozzle body device according to a preferred embodiment of the present invention.
도 3은 도 2의 AA 화살표에 대한 단면도이다.FIG. 3 is a cross-sectional view taken along arrow AA of FIG. 2 .
도 4는 본 발명의 바람직한 실시예에 따른 셀렉티브 솔더볼 저감 노즐바디장치에 있어서 솔더링 공정에서 솔더볼의 억제 과정을 나타낸 단면도이다.4 is a cross-sectional view illustrating a solder ball suppression process in a soldering process in a selective solder ball reduction nozzle body device according to a preferred embodiment of the present invention.
본 발명에 의하면, 솔더용액조(B)에 거치된 거치대(F)에 안착되며 중심축에서 상부로 솔더액(S)을 유도하며, 솔더링 작업시 흘러내리는 솔더액(S)의 열량이 외부로 전달되는 것을 방지하면서 하방으로 유도하기 위한 노즐몸체(10)와; 노즐몸체(10)의 상부에 안착되어 노즐몸체(10)의 중심축과 연통되어 솔더액(S)을 토출하기 위한 노즐캡(20)으로 이루어지는 셀렉티브 솔더볼 저감 노즐바디장치가 제공된다.According to the present invention, it is seated on the cradle (F) mounted on the solder solution tank (B) and induces the solder solution (S) from the central axis to the upper part, and the amount of heat of the solder solution (S) flowing down during the soldering operation is external. a nozzle body 10 for guiding downward while preventing transmission; A selective solder ball reduction nozzle body device is provided, which is seated on the upper portion of the nozzle body 10 and is in communication with the central axis of the nozzle body 10 and includes a nozzle cap 20 for discharging the solder liquid (S).
여기서, 노즐몸체(10)는 중심축에 상면으로부터 하면까지 통공된 중심 관통공(12)과, 중심 관통공(12)의 외측 방향에 대하여 노즐몸체(10)의 상면으로부터 하측으로 통공된 복수개의 외측 관통공(14)을 포함하는 것이 바람직하다.Here, the nozzle body 10 includes a central through-hole 12 through the central axis from the upper surface to the lower surface, and a plurality of through-holes from the upper surface to the lower side of the nozzle body 10 with respect to the outer direction of the center through-hole 12 . It is preferable to include an outer through hole 14 .
또한, 노즐몸체(10)는 노즐몸체(10)의 상부에 노출된 외측 관통공(14)의 외측에 노즐몸체(10)의 외주면으로부터 연장되어 솔더액(S)의 외부 유출을 방지하기 위한 유출 방지편(16)을 더 구비하는 것이 바람직하다.In addition, the nozzle body 10 extends from the outer peripheral surface of the nozzle body 10 to the outside of the outer through-hole 14 exposed at the top of the nozzle body 10 to prevent the outflow of the solder liquid (S) to the outside. It is preferable to further provide the prevention piece 16.
또한, 노즐몸체(10)의 외측 관통공(14)은 솔더용액조(B) 내에 수용된 솔더용액(SS)이 잠기는 면의 위치까지 연장되는 것이 바람직하다.In addition, it is preferable that the outer through-hole 14 of the nozzle body 10 extends to the position of the surface in which the solder solution SS accommodated in the solder solution tank B is submerged.
또한, 노즐몸체(10)는 노즐몸체(10)의 외측 관통공(14)을 흘러 내려온 솔더액(S')이 노몸체(110)의 외측으로 가이드되도록 하기 위한 가이드부(18)를 더 구비하는 것이 바람직하다.In addition, the nozzle body 10 further includes a guide part 18 for guiding the solder liquid S' flowing down the outer through hole 14 of the nozzle body 10 to the outside of the furnace body 110 . It is preferable to do
도 2 내지 도 4에 도시된 바와 같이, 본 발명의 바람직한 실시예에 따른 셀렉티브 솔더볼 저감 노즐바디장치에 의하면, 솔더용액조(B)에 거치된 거치대(F)에 안착되며 중심축에서 상부로 솔더액(S)을 유도하며 솔더링 작업을 위하여 토출된 잔여 솔더액(S)을 상부면으로부터 솔더액(S)의 온도 강하를 방지하면서 하방으로 유도하기 위한 노즐몸체(10)와, 노즐몸체(10)의 상부에 안착되어 노즐몸체(10)의 중심축과 연통되어 솔더액(S)을 토출하기 위한 노즐캡(20)으로 이루어진다.2 to 4, according to the selective solder ball reduction nozzle body device according to the preferred embodiment of the present invention, it is seated on the cradle (F) mounted on the solder solution bath (B) and solders from the central axis to the upper part. The nozzle body 10 and the nozzle body 10 for inducing the liquid (S) and guiding the residual solder liquid (S) discharged for the soldering operation downward while preventing the temperature drop of the solder liquid (S) from the upper surface ) is seated on the upper part and communicates with the central axis of the nozzle body 10, and consists of a nozzle cap 20 for discharging the solder liquid (S).
노즐몸체(10)는 중심축에 상면으로부터 하면까지 통공된 중심 관통공(12), 중심 관통공(12)의 외측 방향에 대하여 노즐몸체(10)의 상면으로부터 하측으로 통공된 복수개의 외측 관통공(14), 및 노즐몸체(10)의 상부에 노출된 외측 관통공(14)의 외측에 노즐몸체(10)의 외주면으로부터 연장되어 솔더액(S)의 외부 유출을 방지하기 위한 유출 방지편(16)을 구비한다.The nozzle body 10 has a central through-hole 12 through the central axis from the upper surface to the lower surface, and a plurality of outer through-holes through-hole from the upper surface of the nozzle body 10 to the lower side with respect to the outer direction of the center through-hole 12 . (14), and an outflow prevention piece ( 16) is provided.
노즐몸체(10)의 중심 관통공(12)은 노즐캡(20)의 중심축과 연통된다. The central through hole 12 of the nozzle body 10 communicates with the central axis of the nozzle cap 20 .
노즐몸체(10)의 외측 관통공(14)은 노즐몸체(10)의 상면에 노즐캡(20)이 안착된 외측부의 상부 공간으로부터 노즐몸체(10)의 장축을 따라 하부로 연장되어 통공된다. 이 때, 노즐몸체(10)의 외측 관통공(14)은 노즐몸체(10)의 중심 관통공(12)을 중심으로 방사 대칭형으로 형성된다. 한편, 노즐몸체(10)의 외측 관통공(14)은 노즐몸체(10)의 하면까지 연장될 수도 있으나, 본 발명의 바람직한 실시예에 의하면, 솔더용액조(B) 내에 수용된 솔더용액(SS)이 잠기는 면의 위치까지 연장된다. 이 경우, 노즐몸체(10)의 외측 관통공(14)을 흘러 내려온 솔더액(S')이 노몸체(110)의 외측으로 가이드되도록 하기 위한 가이드부(18)를 더 구비한다.The outer through-hole 14 of the nozzle body 10 extends downward along the long axis of the nozzle body 10 from the upper space of the outer portion in which the nozzle cap 20 is seated on the upper surface of the nozzle body 10 and is through-hole. At this time, the outer through-hole 14 of the nozzle body 10 is formed radially symmetrically with respect to the central through-hole 12 of the nozzle body 10 . On the other hand, the outer through-hole 14 of the nozzle body 10 may extend to the lower surface of the nozzle body 10, but according to a preferred embodiment of the present invention, the solder solution (SS) accommodated in the solder solution tank (B). It extends to the position of this locking face. In this case, a guide part 18 is further provided to guide the solder liquid S' flowing down the outer through hole 14 of the nozzle body 10 to the outside of the furnace body 110 .
본 발명의 바람직한 실시예에 따른 셀렉티브 솔더볼 저감 노즐바디장치에 의하면, 노즐몸체(10)의 외측 관통공(14)은 노즐캡(20)로부터 토출되어 다시 솔더용액조(B)로 흘러들어가는 과정에서 외측 관통공(14)은 노즐몸체(10)를 관통하여 형성되어 있는 상태에서 솔더용액조(B) 내에 고온으로 수용된 솔더용액(SS)에 노즐몸체(10)의 하부면을 매개하여 잠겨 있기 때문에 항상 고온으로 유지상태를 가질 수 있다. 이와 같이 고온으로 유지된 노즐몸체(10)의 외측 관통공(14)은 노즐캡(20)으로부터 토출된 솔더액(S)에 대하여 고온을 유지하면서 응고되거나 액상의 상변화를 주지 않으도록 함으로써 다시 솔더용액조(B)로 원할하게 재순환될 수 있다.According to the selective solder ball reduction nozzle body device according to a preferred embodiment of the present invention, the outer through-hole 14 of the nozzle body 10 is discharged from the nozzle cap 20 and flows back into the solder solution tank (B) in the process Since the outer through hole 14 is immersed in the solder solution SS accommodated at a high temperature in the solder solution bath B in a state formed through the nozzle body 10 through the lower surface of the nozzle body 10, It can always have a state of being maintained at a high temperature. As such, the outer through-hole 14 of the nozzle body 10 maintained at a high temperature is solidified while maintaining a high temperature with respect to the solder liquid (S) discharged from the nozzle cap 20. It can be smoothly recycled to the solder solution bath (B).
한편, 노즐몸체(10)의 유출 방지편(16)은 노즐몸체(10)의 상부에 노출된 외측 관통공(14)의 외측에 노즐몸체(10)의 외주면으로부터 연장되어 솔더액(S)의 외부 유출을 방지하도록 한다.On the other hand, the leakage preventing piece 16 of the nozzle body 10 is extended from the outer peripheral surface of the nozzle body 10 to the outside of the outer through-hole 14 exposed at the top of the nozzle body 10, the solder liquid (S) Prevent external leakage.
노즐캡(20)은 노즐몸체(10)의 상부에 안착되어 노즐몸체(10)의 중심축과 연통되는 연통공(22)을 구비한다.The nozzle cap 20 is seated on the upper portion of the nozzle body 10 and has a communication hole 22 communicating with the central axis of the nozzle body 10 .
따라서 본 발명에 의하면, 솔더링 장치에 있어서 분사 노즐 상에서 솔더액의 온도 변화에 따른 솔더볼의 발생현상을 방지함으로써 솔더링의 불량을 줄일 수 있다.Therefore, according to the present invention, soldering defects can be reduced by preventing the occurrence of solder balls according to the temperature change of the solder liquid on the spray nozzle in the soldering apparatus.

Claims (5)

  1. 솔더용액조(B)에 거치된 거치대(F)에 안착되며 중심축에서 상부로 솔더액(S)을 유도하며, 솔더링 작업시 흘러내리는 솔더액(S)의 열량이 외부로 전달되는 것을 방지하면서 하방으로 유도하기 위한 노즐몸체(10)와; It is seated on the cradle (F) mounted on the solder solution tank (B) and guides the solder solution (S) from the central axis to the top, preventing the heat of the solder solution (S) flowing down during soldering from being transmitted to the outside. a nozzle body 10 for guiding downward;
    노즐몸체(10)의 상부에 안착되어 노즐몸체(10)의 중심축과 연통되어 솔더액(S)을 토출하기 위한 노즐캡(20)으로 이루어지는 것을 특징으로 하는 셀렉티브 솔더볼 저감 노즐바디장치.Selective solder ball reduction nozzle body device, characterized in that it is seated on the upper portion of the nozzle body (10) and communicates with the central axis of the nozzle body (10) and comprises a nozzle cap (20) for discharging the solder liquid (S).
  2. 제1항에 있어서, 노즐몸체(10)는 중심축에 상면으로부터 하면까지 통공된 중심 관통공(12)과, 중심 관통공(12)의 외측 방향에 대하여 노즐몸체(10)의 상면으로부터 하측으로 통공된 복수개의 외측 관통공(14)을 포함하는 것을 특징으로 하는 셀렉티브 솔더볼 저감 노즐바디장치.According to claim 1, wherein the nozzle body 10 is a central through-hole 12 through the central axis from the upper surface to the lower surface, and from the upper surface of the nozzle body 10 to the lower side with respect to the outer direction of the central through-hole 12. Selective solder ball reduction nozzle body device, characterized in that it comprises a plurality of outer through-holes (14).
  3. 제2항에 있어서, 노즐몸체(10)는 노즐몸체(10)의 상부에 노출된 외측 관통공(14)의 외측에 노즐몸체(10)의 외주면으로부터 연장되어 솔더액(S)의 외부 유출을 방지하기 위한 유출 방지편(16)을 더 구비하는 것을 특징으로 하는 셀렉티브 솔더볼 저감 노즐바디장치.According to claim 2, wherein the nozzle body (10) extends from the outer peripheral surface of the nozzle body (10) on the outside of the outer through-hole (14) exposed at the top of the nozzle body (10) to prevent the outflow of the solder solution (S) to the outside Selective solder ball reduction nozzle body device, characterized in that it further comprises a leak prevention piece (16) for preventing.
  4. 제2항 또는 제3항에 있어서, 노즐몸체(10)의 외측 관통공(14)은 솔더용액조(B) 내에 수용된 솔더용액(SS)이 잠기는 면의 위치까지 연장되는 것을 특징으로 하는 셀렉티브 솔더볼 저감 노즐바디장치.[Claim 4] The selective solder ball according to claim 2 or 3, wherein the outer through hole (14) of the nozzle body (10) extends to the position of the surface in which the solder solution (SS) accommodated in the solder solution tank (B) is submerged. Reduced nozzle body device.
  5. 제4항에 있어서, 노즐몸체(10)는 노즐몸체(10)의 외측 관통공(14)을 흘러 내려온 솔더액(S')이 노몸체(110)의 외측으로 가이드되도록 하기 위한 가이드부(18)를 더 구비하는 것을 특징으로 하는 셀렉티브 솔더볼 저감 노즐바디장치.The guide part (18) according to claim 4, wherein the nozzle body (10) guides the solder liquid (S') flowing down through the outer through hole (14) of the nozzle body (10) to the outside of the furnace body (110). ) Selective solder ball reduction nozzle body device, characterized in that it further comprises.
PCT/KR2021/008311 2020-11-04 2021-06-30 Nozzle body device for reducing selective solder ball WO2022097874A1 (en)

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KR20240016773A (en) 2022-07-29 2024-02-06 한국원자력연구원 Combination device of a nozzle body for soldering device

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JP3193268U (en) * 2014-07-11 2014-09-25 セイテック株式会社 Square solder discharge nozzle
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JP2019114718A (en) * 2017-12-25 2019-07-11 千住金属工業株式会社 Jet solder tank and jet soldering device
KR20190099778A (en) * 2018-02-20 2019-08-28 (주)제이앤디테크 Seletive soldering machine
KR102242583B1 (en) * 2020-11-04 2021-04-19 (주)티앤아이텍 Nozzle body device for reducing the sellective solderball

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011105034A1 (en) * 2010-02-26 2011-09-01 パナソニック株式会社 Soldering apparatus
JP3193268U (en) * 2014-07-11 2014-09-25 セイテック株式会社 Square solder discharge nozzle
KR20170070848A (en) * 2017-05-15 2017-06-22 백철호 Solder port for soldering apparatus
JP2019114718A (en) * 2017-12-25 2019-07-11 千住金属工業株式会社 Jet solder tank and jet soldering device
KR20190099778A (en) * 2018-02-20 2019-08-28 (주)제이앤디테크 Seletive soldering machine
KR102242583B1 (en) * 2020-11-04 2021-04-19 (주)티앤아이텍 Nozzle body device for reducing the sellective solderball

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