WO2022097874A1 - Dispositif de corps de buse permettant de réduire une bille de soudure sélective - Google Patents

Dispositif de corps de buse permettant de réduire une bille de soudure sélective Download PDF

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Publication number
WO2022097874A1
WO2022097874A1 PCT/KR2021/008311 KR2021008311W WO2022097874A1 WO 2022097874 A1 WO2022097874 A1 WO 2022097874A1 KR 2021008311 W KR2021008311 W KR 2021008311W WO 2022097874 A1 WO2022097874 A1 WO 2022097874A1
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WO
WIPO (PCT)
Prior art keywords
nozzle body
solder
nozzle
hole
solder ball
Prior art date
Application number
PCT/KR2021/008311
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English (en)
Korean (ko)
Inventor
백철호
Original Assignee
주식회사 티앤아이텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 티앤아이텍 filed Critical 주식회사 티앤아이텍
Publication of WO2022097874A1 publication Critical patent/WO2022097874A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Definitions

  • the present invention relates to a selective solder ball reduction nozzle body apparatus, and more particularly, to a selective solder ball reduction nozzle body apparatus capable of remarkably reducing soldering defects of a substrate by reducing the formation of solder balls generated during soldering of mounted parts of a board will be.
  • soldering In the printed circuit board, which is an essential component of electronic and electrical products, various parts and entire circuits are connected by soldering through solder ports in order to be able to exhibit their respective functions.
  • a plurality of heaters for melting the solder are installed inside the solder pot, and a nozzle for ejecting the molten solder to the top of the pot is installed on one side of the solder pot, and on the other side of the nozzle
  • An impeller is installed on the top to allow the solder to be ejected.
  • solder When soldering a printed circuit board, solder is put into the pot and power is applied to the heater, so that the solder is melted by the heat of the heater and becomes a liquid state.
  • the lead-water melting tank is formed with an open upper part, and a plurality of heaters are coupled to melt the solder bar input to the inside and convert it into lead-water
  • the lead-water A lead water storage tank that is coupled to the lead water smelting tank through a connection bracket to be disposed in the lead water storage tank, the lead water storage tank is formed so that the lead water is introduced and stored by pressure
  • An impeller connected via a transmission means and pumped by the drive motor to introduce the lead water in the lead water molten tank into the lead water storage tank, and the lead water storage tank to be exposed to the upper part of the lead water smelting tank and coupled to the impeller
  • the lead water in the lead water storage tank is discharged at a constant pressure toward the printed circuit board disposed on the upper part of the lead water smelting tank by the pressure of the lead water acting as the lead water storage tank in the lead water tank and the pumping force of the impeller.
  • a soldering apparatus including a provided nozzle is disclosed.
  • the nitrogen supply line 10 for forming a nitrogen atmosphere is provided in the nitrogen supply line 10 in a state installed on one side of the solder melting bath 20 .
  • Nitrogen gas is provided to one side of the solder melting bath 20 through the injection nozzle.
  • the injection nozzle body 110 through which the center is penetrated and the solder solution is pumped is seated on the holder 140 seated in the solder solution bath 130,
  • a nozzle cap 120 having an injection hole for the solder solution to flow out is provided on the top of the injection nozzle body 110 .
  • the injection nozzle body 110 and the nozzle cap 120 are seated in a cylindrical insertion groove 112 for seating the nozzle cap 120 on the upper portion of the injection nozzle body 110 .
  • the molten solder solution (SS) flows out through the nozzle body 110 and the nozzle cap 120 seated on the cradle 140 seated in the solder solution tank 130 in which the molten solder solution (SS) is accommodated, and the soldering solution is performed.
  • the solder solution S should flow down by gravity on the outer surfaces of the nozzle cap 120 and the nozzle body 110 and then rejoin the molten solder solution SS.
  • the solder liquid (S) discharged from the injection port of the nozzle cap 120 rides on the outer surface of the nozzle cap 120 and the nozzle body 110 and flows down due to gravity.
  • a nozzle body 10 for guiding downward while preventing transmission;
  • a selective solder ball reduction nozzle body device is provided, which is seated on the upper portion of the nozzle body 10 and is in communication with the central axis of the nozzle body 10 and includes a nozzle cap 20 for discharging the solder liquid (S).
  • soldering defects can be reduced by preventing the occurrence of solder balls according to the temperature change of the solder liquid on the spray nozzle in the soldering apparatus.
  • 1A is a schematic perspective view of a conventional solder ball device.
  • 1B is a schematic cross-sectional view illustrating a state in which a solder ball is generated in a nozzle body of a conventional solder ball device.
  • FIG. 2 is a perspective view of a selective solder ball reduction nozzle body device according to a preferred embodiment of the present invention.
  • FIG. 3 is a cross-sectional view taken along arrow AA of FIG. 2 .
  • FIG. 4 is a cross-sectional view illustrating a solder ball suppression process in a soldering process in a selective solder ball reduction nozzle body device according to a preferred embodiment of the present invention.
  • a nozzle body 10 for guiding downward while preventing transmission;
  • a selective solder ball reduction nozzle body device is provided, which is seated on the upper portion of the nozzle body 10 and is in communication with the central axis of the nozzle body 10 and includes a nozzle cap 20 for discharging the solder liquid (S).
  • the nozzle body 10 includes a central through-hole 12 through the central axis from the upper surface to the lower surface, and a plurality of through-holes from the upper surface to the lower side of the nozzle body 10 with respect to the outer direction of the center through-hole 12 . It is preferable to include an outer through hole 14 .
  • the nozzle body 10 extends from the outer peripheral surface of the nozzle body 10 to the outside of the outer through-hole 14 exposed at the top of the nozzle body 10 to prevent the outflow of the solder liquid (S) to the outside. It is preferable to further provide the prevention piece 16.
  • the outer through-hole 14 of the nozzle body 10 extends to the position of the surface in which the solder solution SS accommodated in the solder solution tank B is submerged.
  • the nozzle body 10 further includes a guide part 18 for guiding the solder liquid S' flowing down the outer through hole 14 of the nozzle body 10 to the outside of the furnace body 110 . It is preferable to do
  • the selective solder ball reduction nozzle body device according to the preferred embodiment of the present invention, it is seated on the cradle (F) mounted on the solder solution bath (B) and solders from the central axis to the upper part.
  • the nozzle body 10 and the nozzle body 10 for inducing the liquid (S) and guiding the residual solder liquid (S) discharged for the soldering operation downward while preventing the temperature drop of the solder liquid (S) from the upper surface ) is seated on the upper part and communicates with the central axis of the nozzle body 10, and consists of a nozzle cap 20 for discharging the solder liquid (S).
  • the nozzle body 10 has a central through-hole 12 through the central axis from the upper surface to the lower surface, and a plurality of outer through-holes through-hole from the upper surface of the nozzle body 10 to the lower side with respect to the outer direction of the center through-hole 12 . (14), and an outflow prevention piece ( 16) is provided.
  • the central through hole 12 of the nozzle body 10 communicates with the central axis of the nozzle cap 20 .
  • the outer through-hole 14 of the nozzle body 10 extends downward along the long axis of the nozzle body 10 from the upper space of the outer portion in which the nozzle cap 20 is seated on the upper surface of the nozzle body 10 and is through-hole. At this time, the outer through-hole 14 of the nozzle body 10 is formed radially symmetrically with respect to the central through-hole 12 of the nozzle body 10 .
  • the outer through-hole 14 of the nozzle body 10 may extend to the lower surface of the nozzle body 10, but according to a preferred embodiment of the present invention, the solder solution (SS) accommodated in the solder solution tank (B). It extends to the position of this locking face.
  • a guide part 18 is further provided to guide the solder liquid S' flowing down the outer through hole 14 of the nozzle body 10 to the outside of the furnace body 110 .
  • the outer through-hole 14 of the nozzle body 10 is discharged from the nozzle cap 20 and flows back into the solder solution tank (B) in the process Since the outer through hole 14 is immersed in the solder solution SS accommodated at a high temperature in the solder solution bath B in a state formed through the nozzle body 10 through the lower surface of the nozzle body 10, It can always have a state of being maintained at a high temperature. As such, the outer through-hole 14 of the nozzle body 10 maintained at a high temperature is solidified while maintaining a high temperature with respect to the solder liquid (S) discharged from the nozzle cap 20. It can be smoothly recycled to the solder solution bath (B).
  • the leakage preventing piece 16 of the nozzle body 10 is extended from the outer peripheral surface of the nozzle body 10 to the outside of the outer through-hole 14 exposed at the top of the nozzle body 10, the solder liquid (S) Prevent external leakage.
  • the nozzle cap 20 is seated on the upper portion of the nozzle body 10 and has a communication hole 22 communicating with the central axis of the nozzle body 10 .
  • soldering defects can be reduced by preventing the occurrence of solder balls according to the temperature change of the solder liquid on the spray nozzle in the soldering apparatus.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

La présente invention concerne un dispositif de corps de buse permettant de réduire une bille de soudure sélective comprenant : un corps de buse (10) qui repose sur un support (F) qui est placé dans un réservoir de solution de soudure (B) et guide une solution de soudure (S) jusqu'à la partie supérieure dans l'arbre central, et guide la solution de soudure (S) qui s'écoule vers le bas pendant un travail de soudure jusqu'à la partie inférieure tout en empêchant le transfert de la chaleur de la solution de soudure (S) vers l'extérieur ; et un capuchon de buse (20) qui est logé sur la partie supérieure du corps de buse (10) pour être en communication avec l'arbre central du corps de buse (10) et évacue la solution de soudure (S).
PCT/KR2021/008311 2020-11-04 2021-06-30 Dispositif de corps de buse permettant de réduire une bille de soudure sélective WO2022097874A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020200146370A KR102242583B1 (ko) 2020-11-04 2020-11-04 셀렉티브 솔더볼 저감 노즐바디장치
KR10-2020-0146370 2020-11-04

Publications (1)

Publication Number Publication Date
WO2022097874A1 true WO2022097874A1 (fr) 2022-05-12

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PCT/KR2021/008311 WO2022097874A1 (fr) 2020-11-04 2021-06-30 Dispositif de corps de buse permettant de réduire une bille de soudure sélective

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KR (1) KR102242583B1 (fr)
WO (1) WO2022097874A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102242583B1 (ko) * 2020-11-04 2021-04-19 (주)티앤아이텍 셀렉티브 솔더볼 저감 노즐바디장치
KR102692635B1 (ko) 2022-07-29 2024-08-06 한국원자력연구원 솔더장치의 노즐 바디 결합장치

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011105034A1 (fr) * 2010-02-26 2011-09-01 パナソニック株式会社 Appareil de brasage
JP3193268U (ja) * 2014-07-11 2014-09-25 セイテック株式会社 角型半田吐出ノズル
KR20170070848A (ko) * 2017-05-15 2017-06-22 백철호 솔더링 장치용 솔더포트
JP2019114718A (ja) * 2017-12-25 2019-07-11 千住金属工業株式会社 噴流はんだ槽及び噴流はんだ付け装置
KR20190099778A (ko) * 2018-02-20 2019-08-28 (주)제이앤디테크 셀렉티브 솔더링 장치
KR102242583B1 (ko) * 2020-11-04 2021-04-19 (주)티앤아이텍 셀렉티브 솔더볼 저감 노즐바디장치

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011105034A1 (fr) * 2010-02-26 2011-09-01 パナソニック株式会社 Appareil de brasage
JP3193268U (ja) * 2014-07-11 2014-09-25 セイテック株式会社 角型半田吐出ノズル
KR20170070848A (ko) * 2017-05-15 2017-06-22 백철호 솔더링 장치용 솔더포트
JP2019114718A (ja) * 2017-12-25 2019-07-11 千住金属工業株式会社 噴流はんだ槽及び噴流はんだ付け装置
KR20190099778A (ko) * 2018-02-20 2019-08-28 (주)제이앤디테크 셀렉티브 솔더링 장치
KR102242583B1 (ko) * 2020-11-04 2021-04-19 (주)티앤아이텍 셀렉티브 솔더볼 저감 노즐바디장치

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