JP3193268U - Square solder discharge nozzle - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent formation of bridges and horns in lead portions of electronic components in a soldering region even in local soldering using lead-free solder without taking measures by a program. Provided is a square solder discharge nozzle for an apparatus. Among the four edge portions 3 and 4 of a nozzle opening 2, the edge portion 3 on the front side with respect to the direction in which the substrate passes through the nozzle opening 2 in the relative movement between the nozzle 1 and the substrate is higher than the surroundings. It has a lower solder drop step portion 5. Further, of the outer peripheral surfaces 8 and 9 around the nozzle 1, the substrate is the nozzle opening 2 as compared with the outer peripheral surface 8 on the front side in the direction in which the substrate passes through the nozzle opening 2 with the edge 3 on the front side as a boundary. The outer peripheral surface 9 on the rear side in the direction of passing through has a surface property that is inferior in terms of wettability. [Selection diagram] Fig. 1

Description

  The present invention relates to a nozzle provided in a local soldering device, and more specifically to a square solder discharge nozzle used in a local soldering device using lead-free solder.

Conventionally, in order to mount electronic components at high density on both sides of a substrate due to the demand for miniaturization of the substrate, a soldering region between the substrate and the electronic component (for example, a through hole of the substrate and an electron penetrating the through hole) A local flow soldering apparatus is used for soldering only the region where the component leads are to be soldered.
Conventionally, for example, a local flow soldering apparatus equipped with a cylindrical nozzle is used, a necessary soldering area is determined in advance, and the nozzle is determined according to a program relating to nozzle position, nozzle or substrate moving speed, nozzle-to-substrate distance, and the like. Alternatively, a method of scanning the substrate, discharging molten solder from a nozzle in a soldering area of the substrate, and bringing the molten solder into contact with an adjacent substrate has been employed.
In recent years, in order to increase the production efficiency with the spread of the apparatus, a rectangular nozzle capable of soldering a soldering region such as a connector at a time is used instead of the cylindrical nozzle.

  On the other hand, from the viewpoint of environmental problems, a soldering apparatus that can use lead-free solder instead of conventional lead-containing solder is naturally required.

In the conventional rectangular nozzle, the molten solder flows down to the four sides of the nozzle opening, so that a so-called bridge or horn is formed in the lead part of the electronic component in the soldering region, and there is a problem that a soldering defect is likely to occur. Therefore, it is conceivable to change the structure of the nozzle opening so that the molten solder flows down from only one of the edges in the square nozzle.
In particular, lead-free solder used in recent years is prone to dross formation, viscosity reduction, and solidification compared to conventional lead-containing solder, and bridges are formed between leads of electronic components in the soldering area. , Soldering defects such as horn formation on the leads are likely to occur. In addition, the square nozzle has a larger area of molten solder that comes into contact with the atmosphere than the cylindrical nozzle, so when lead-free solder is used, it is more likely to be oxidized, and the temperature is lowered and the viscosity is more likely to increase. There is a problem.
Therefore, in conventional soldering board production sites, measures such as changing the nozzle pull-down speed or stopping the jet were taken, but this measure requires a more complicated program to be created. Therefore, there was a need for a method that did not require the preparation of such a program.

  In view of the above problems, the object of the present invention is to form bridges and horns in the lead part of the electronic component in the soldering region even if local soldering using lead-free solder is used, without taking measures by a program. It is an object of the present invention to provide a square solder discharge nozzle for a local soldering apparatus that can effectively prevent this and achieve reliable soldering.

As a result of devised ideas to solve the above problems, the inventors have found the following present invention.
That is, the present invention relates to a square solder discharge nozzle having a square nozzle port used in a local soldering apparatus, and the substrate moves in the relative movement between the nozzle and the substrate among the four edges of the nozzle port. The edge on the front side with respect to the direction of passing through the nozzle opening has a solder drop step portion whose height is lower than that of the periphery, and the edge on the front side of the outer peripheral surface around the nozzle is As a boundary, the outer peripheral surface on the rear side in the direction in which the substrate passes through the nozzle port has surface characteristics that are inferior in terms of wettability as compared with the outer peripheral surface in the direction in which the substrate passes through the nozzle port. The present invention relates to a rectangular solder discharge nozzle.
In a preferred aspect of the present invention, among the outer peripheral surfaces around the nozzle, nickel boron plating is applied to the outer peripheral surface on the front side with respect to the direction in which the substrate passes through the nozzle port, and the rear side in the direction in which the substrate passes through the nozzle port. The present invention relates to a square solder discharge nozzle in which a chrome plating is applied to the outer peripheral surface of the plate.
A particularly preferable aspect of the present invention is that nickel boron plating is applied to the edge on the front side with respect to the direction in which the substrate passes through the nozzle opening, and chromium plating is applied to the other three edges. The present invention relates to an applied rectangular solder discharge nozzle.
The second aspect of the present invention is a square solder discharge nozzle having a square nozzle port used in a local soldering apparatus, and the relative relationship between the nozzle and the substrate among the four edges of the nozzle port. The edge on the front side with respect to the direction in which the substrate passes through the nozzle opening in a typical movement has a solder drop step portion whose height is lower than the surroundings, and among the four outer peripheral surfaces of the nozzle, the substrate The present invention relates to a rectangular solder discharge nozzle, characterized in that the other three outer peripheral surfaces have surface properties that are inferior in terms of wettability as compared with the outer peripheral surface on the front side in the direction through which the nozzle passes.
In a preferred embodiment of the present invention, nickel boron plating is applied to the outer peripheral surface on the front side with respect to the direction in which the substrate passes through the nozzle opening, and chromium plating is applied to the other three outer peripheral surfaces. The present invention relates to a rectangular solder discharge nozzle.
In a particularly preferred embodiment of the present invention, nickel boron plating is applied to the edge on the front side with respect to the direction in which the substrate passes through the nozzle opening, and chromium plating is applied to the other three edges. A square solder discharge nozzle.
Further, according to a third aspect of the present invention, in a square solder discharge nozzle having a square nozzle port used in a local soldering apparatus, the relative relationship between the nozzle and the substrate among the four edges of the nozzle port. The edge on the front side with respect to the direction in which the substrate passes through the nozzle opening in such a movement has at least a portion having a height lower than the height of the other three edges, and the outer peripheral surface around the nozzle Among these, the outer peripheral surface on the rear side with respect to the direction in which the substrate passes through the nozzle port is related to the wettability as compared with the outer peripheral surface on the front side in the direction in which the substrate passes through the nozzle port, with the edge on the front side as a boundary. The present invention relates to a square solder discharge nozzle characterized by having inferior surface characteristics.
In a preferred aspect of the present invention, among the outer peripheral surfaces around the nozzle, nickel boron plating is applied to the outer peripheral surface on the front side with respect to the direction in which the substrate passes through the nozzle port, and the rear side in the direction in which the substrate passes through the nozzle port. The present invention relates to a square solder discharge nozzle in which a chrome plating is applied to the outer peripheral surface of the plate.
According to a fourth aspect of the present invention, in a square solder discharge nozzle having a square nozzle used in a local soldering apparatus, relative movement between the nozzle and the substrate among the four edges of the nozzle. The edge on the front side with respect to the direction in which the substrate passes through the nozzle opening has at least a portion having a height lower than the height of the other three edges, and the outer peripheral surfaces of the four sides of the nozzle Among them, the present invention relates to a rectangular solder discharge nozzle characterized in that the other three outer peripheral surfaces have surface properties that are inferior in terms of wettability as compared with the outer peripheral surface on the front side in the direction in which the substrate passes through the nozzle opening.
In a preferred embodiment of the present invention, nickel boron plating is applied to the edge on the front side with respect to the direction in which the substrate passes through the nozzle opening, and chromium plating is applied to the other three edges. The present invention relates to an applied rectangular solder discharge nozzle.
Moreover, this invention relates to the local soldering apparatus provided with the square solder discharge nozzle of any one of the said aspects.

The square solder discharge nozzle of the present invention has a lower height portion such as a solder drop portion formed on the edge portion on the tip side of the nozzle, and the wetting property of the outer peripheral surface of the nozzle with the edge portion as a boundary. It is different. As a result, the nozzle of the present invention can cause the molten solder discharged from the nozzle port to flow preferentially from one edge (the front side) of the nozzle port. Therefore, in the local soldering by the local soldering apparatus having the square solder discharge nozzle of the present invention, the soldering part that causes a short circuit in the terminal or the lead part of the electrical component in the soldering region, or excess molten solder Can be prevented from remaining. That is, it is possible to prevent soldering defects such as bridges and horns being formed on the terminals or lead portions.
In addition, by using the square solder discharge nozzle of the present invention, since the molten solder flows preferentially from only one edge, the molten solder may adhere to electronic components mounted outside the soldering area. Can be prevented.
In addition, the rectangular solder discharge nozzle of the present invention can keep the height of the molten solder discharged from the nozzle port almost constant without undulation, and can prevent insufficient dipping of the molten solder on the substrate. An effect is also obtained.

FIG. 1A is a perspective view of a rectangular solder discharge nozzle according to the first embodiment, and the inside of a circle in the drawing shows an enlarged nozzle edge. FIG. 1B is a side view of the rectangular solder discharge nozzle according to the first embodiment, and FIG. 1C is a cross-sectional view taken along line A-A ′ of FIG. FIG. 2 is a schematic cross-sectional view of the local flow soldering process using the square solder discharge nozzle of Example 1 as seen from the side of the nozzle.

  The square solder discharge nozzle of the present invention is a solder discharge nozzle having a square nozzle opening mainly used in a local soldering apparatus. The local soldering device is a device that performs local soldering by bringing the molten solder discharged from the nozzle port into contact with the lead part of the electronic component on the substrate in the soldering area to be soldered on the substrate surface. It is. This type of apparatus includes a type in which the substrate is horizontally scanned with respect to the fixed solder discharge nozzle, a type in which the solder discharge nozzle is horizontally scanned with respect to the fixed substrate, and both the substrate and the solder discharge nozzle. There is a type that scans. The substrate or the solder discharge nozzle is scanned according to predetermined program control. Therefore, the local soldering apparatus to which the nozzle of the present invention is attached includes a general soldering apparatus, for example, a molten solder bath, a nozzle, and a mechanism for pumping molten solder to the nozzle, as well as a molten solder at the upper end of the nozzle. And a control mechanism for performing integrated control with respect to the operation of piling up, the operation of discharging molten solder from the upper end of the nozzle, and the scanning of the substrate or nozzle.

The square solder discharge nozzle according to the present invention has an edge on the front side in a direction in which the substrate passes through the nozzle port in a relative movement between the nozzle and the substrate, and a normal longitudinal portion. The edge in the direction has a portion with a height lower than the height of the other three sides (for convenience, this is also referred to as a solder-off portion).
This solder removal part typically has a stepped shape. In addition, this step-shaped solder drop portion is referred to as a solder drop step portion in this specification.

  That is, in the soldering apparatus equipped with the square solder discharge nozzle of the present invention, the board arrives at the edge opposite to the edge having the solder-removed portion among the four edges of the square nozzle opening, By moving the substrate above the solder discharge nozzle by relative movement of the substrate and the nozzle so that the substrate passes above the nozzle opening and moves away from the edge having the solder-off site. This is a device for soldering by bringing the molten solder accumulated in the nozzle opening into contact with the substrate surface.

The shape of the solder drop part can maintain the state where the surface of the molten solder discharged from the nozzle opening is raised from the end of the nozzle opening, and the excessive molten solder droops from only one edge having the solder drop part. There is no particular limitation as long as it can flow, and one or more rectangular recesses, semicircular recesses, cutouts, and the like can be provided. For example, by providing a rectangular recess-shaped solder drop part at both ends of the long edge, that is, a part near the short edge, molten solder that is likely to overflow from the short edge is also removed from the solder drop part. Can effectively spill.

  Further, the board passes through the nozzle port as compared to the outer peripheral surface on the front side with respect to the direction in which the board passes through the nozzle port, with the edge portion having the solder-off portion of the outer peripheral surface of the nozzle according to the present invention as a boundary. The outer peripheral surface on the rear side with respect to the direction has surface properties that are inferior with respect to wettability.

For example, the outer peripheral surface on the front side with respect to the direction in which the substrate passes through the nozzle port, including the edge portion having the solder-removed portion, is different from the outer peripheral surface on the rear side with respect to the direction in which the substrate passes through the nozzle port. It may be made of a member having high solder wettability, or a difference in wettability may be caused by applying a coating or surface treatment having high wettability.
For example, in a square solder discharge nozzle made of iron, stainless steel, etc., solder and wettability are applied to the edge portion having a solder drop-off portion and the outer peripheral surface on the front side with respect to the direction in which the substrate passes through the nozzle opening from the edge portion. Apply high metal plating, such as nickel boron plating, and apply metal plating with low wettability to solder, such as chromium plating, on the other three edges and the outer peripheral surface on the rear side in the direction in which the substrate passes through the nozzle opening. it can.

  Since molten solder, especially lead-free molten solder, has high viscosity and surface tension, the molten solder discharged to the nozzle port has a lower wettability on the outer peripheral surface (that is, other edges other than the edge having the solder drop site and The outer peripheral surface with higher wettability than the outer peripheral surface on the rear side with respect to the direction in which the substrate passes through the nozzle port (that is, the outer peripheral surface on the front side with respect to the direction in which the substrate passes through the nozzle port). It is easy to drip through the wet. In particular, the square solder discharge nozzle of the present invention has a difference in wettability at the edge having the solder removal site, that is, the solder removal site and the outer peripheral surface having higher wettability are connected to each other. As a result, the molten solder discharged from the nozzle port flows toward the portion where the solder is removed, gets wet on the outer peripheral surface having good wettability, and flows more predominately. Thereby, it is possible to effectively prevent the molten solder from dripping from the other three edge portions.

  In addition, when solder is applied to the substrate, generally, the molten solder that has come into contact with the substrate tends to be pulled by the substrate toward the front side in the direction in which the substrate passes through the nozzle opening. Therefore, in the present invention, the excessive molten solder in the soldering area quickly travels along the outer peripheral surface having good wettability via the solder dropping portion located on the front side in the direction in which the substrate passes through the nozzle opening. Therefore, no excess soldering portion remains in the lead portion in the soldering region. That is, no bridge or horn is formed on the lead portion, and soldering failure can be prevented.

In particular, it is preferable that the other three edge portions of the nozzle port have surface characteristics that are inferior due to wettability as compared with the edge portion having the solder-removed portion. As a result, the molten solder discharged to the nozzle port is more likely to sag from the edge part having the solder drop part, particularly from the solder drop part, and the molten solder can be prevented from dripping from the other three edge parts. .
The nozzle mouth edge can be provided with a difference in wettability in the same manner as the outer peripheral surface around the nozzle. For example, nickel boron plating is applied to the edge having a solder removal part such as a solder drop step part, etc. It is preferable to apply chrome plating to the three side edges.

  It should be noted that by chamfering the intersection between the edge of the nozzle opening and the inner peripheral surface, the molten solder can be easily collected at the end of the nozzle opening by the surface tension of the molten solder. Also, by chamfering the intersection of the edge of the nozzle opening and the outer peripheral surface, when the molten solder is jetted or when the shape of the molten solder collapses (that is, when the molten solder contacts the substrate, Or, when the substrate or nozzle is horizontally scanned while maintaining the contact), it is possible to make it easier for the excess molten solder to flow down.

  Further, the external appearance of the rectangular solder discharge nozzle of the present invention is not particularly limited, but the outer peripheral surface including the edge portion having the solder drop portion may be an inclined surface in which the lower portion is widened with respect to the nozzle port. By using an inclined surface, the speed at which the solder drips on the outer peripheral surface can be adjusted, and the dripping solder attracts excess molten solder remaining in the lead portion and does not leave excessive molten solder in the lead portion. Can be.

  The inside of the rectangular solder discharge nozzle of the present invention may be any material that does not easily react with molten solder, and can be formed of, for example, iron or stainless steel. Moreover, the inside should just be connected from the bottom face attached to a local soldering apparatus to an opening part, for example, it is preferable that the internal peripheral surface is comprised by the curved surface so that solder residue may not remain easily. The flow rate and flow rate of the molten solder sent from the pressure feeding unit of the local soldering apparatus can be adjusted depending on the internal shape.

  Hereinafter, the present invention will be described more specifically with reference to examples. However, the scope of the present invention is not limited to these examples. One form of soldering using the solder nozzle of the present invention will be described with reference to FIGS. The present invention is not limited to the embodiments described below.

Example 1: Square solder discharge nozzle (see FIG. 1)
As shown in FIGS. 1 (a) to 1 (c), the rectangular discharge nozzle 1 is a rectangular cylindrical hollow nozzle having a substantially rectangular nozzle port 2 at its upper end, and at its lower end. Has a connection 10 with a soldering device. Out of the outer peripheral surface of the rectangular discharge nozzle 1, the outer peripheral surface extending downward from the longitudinal edge of the nozzle port is an inclined surface 6 extending from the nozzle port toward the lower end of the nozzle port, and the short side of the nozzle port is short. An outer peripheral surface extending downward from the hand edge is a surface 7 perpendicular to the nozzle opening. The lower part of the outer peripheral surface of the square nozzle 1, that is, the connecting portion 10 is a vertical surface on all sides so that it can be connected to a molten solder pumping mechanism (not shown). In addition, the inclined surface 6 and the vertical surface 7, and the upper part and the lower part of the outer peripheral surface are connected via wall surfaces, respectively.
Moreover, in the nozzle opening 2, the length of a long edge part is 30 mm, the length of a short edge part is 7 mm, and all are 0.5 mm in width. One of the longitudinal edges is provided with a solder drop step 5 having a width of 0.5 mm, a depth of 1 mm, and a length of 4 mm, for example, at both left and right ends.
Nickel boron plating is applied to the outer peripheral surface 8 on the front side with respect to the edge 3 having the solder drop-off step and the direction in which the substrate passes through the nozzle opening from the edge 3, and the other three sides 4 and edge The outer peripheral surface 9 on the rear side with respect to the direction in which the substrate passes through the nozzle opening from 3 is provided with a chromium plating that is inferior to the wettability of solder than the nickel boron plating.
Inside the rectangular solder discharge nozzle, the connecting portion 10, the cylindrical hollow portion 11, the elliptic cylindrical hollow portion 12, and the molten solder pool portion 13 are provided in communication from the lower end.

Local soldering apparatus As the local soldering apparatus for this embodiment, a local soldering apparatus that has been used in the past and having the above-described square solder discharge nozzle attached thereto was used.

Example 2: Local flow soldering (see FIG. 2)
An electronic component 22 (integrated circuit package) having leads 23 is mounted on the upper surface of the printed circuit board 20 with the through hole 21, and flux is applied to a soldering unnecessary portion on the lower surface of the circuit board 20 and heated to 100 ° C. and dried. It was. The substrate 20 is fixed, and the rectangular solder discharge nozzle 1 is horizontally scanned below the substrate 20 (see the arrow in FIG. 2). For example, in the soldering region having a width of about 20 mm and a length of about 40 mm, the substrate The through hole 21 and the electronic component lead 23 were soldered.
As the molten solder, lead-free solder (Sn—Ag—Cu, melting point 183 ° C.) is used, and 300
The melted lead-free solder was fed to the local soldering apparatus while being kept at 250 ° C. to 300 ° C.
First, an amount of molten solder 25 that is sufficient for soldering and that does not flow from the nozzle port was discharged to the nozzle port 2. Next, the substrate is brought closer to the edge of the nozzle port 2 opposite to the edge 3 having the solder drop step 5, and the molten solder 25 discharged to the nozzle port is brought into contact with the end of the soldering area of the substrate, Then, the square solder discharge nozzle was horizontally scanned so that the molten solder was applied to the entire soldering region (see the arrow in FIG. 2), and the lead 23 of the electronic component was soldered to the through hole 21 of the substrate.

Until the lower surface of the substrate was separated from the molten solder 25 discharged to the upper part of the nozzle, excess molten solder was dripped down from the stepped portion 5 while getting wet on the outer peripheral surface 8. Solder did not sag on the other three edges 4 and the outer peripheral surface 9.
As a result, bridges and horns were not formed on the lead 26 of the electronic component soldered to the through hole 21 of the substrate.

Example 3: An electronic component 22 (integrated circuit package) having leads 23 is mounted on the upper surface of a printed circuit board 20 with a spot soldering through hole 21, and flux application is performed on the lower surface of the circuit board 20 where soldering is unnecessary. The temperature was raised to dryness. The substrate 20 is brought into contact with the molten solder discharged to the nozzle port of the square solder discharge nozzle 1 so that the through hole 21 of the substrate and the lead of the electronic component can be obtained in a soldering region having a width of about 5 mm and a length of about 20 mm. 23 was soldered.
Lead-free solder (Sn—Ag—Cu, melting point 183 ° C.) was used as the molten solder, and the lead-free solder heated to 300 ° C. and melted was fed to a local soldering apparatus.
Then, in the soldering region of the substrate 20, the nozzle 1 was moved up and down to perform spot soldering on the lower surface of the substrate.

When the molten solder 25 discharged to the nozzle opening contacted the lower surface of the substrate, the excess molten solder dripped down from the solder drop step portion 5 along the outer peripheral surface 8. Solder did not sag on the other three edges 4 and the outer peripheral surface 9.
As a result, bridges and horns were not formed on the lead 26 of the electronic component soldered to the through hole 21 of the substrate.

  From the above, the square solder discharge nozzle of the present invention and the local soldering apparatus equipped with the nozzle are solders in which bridges and horns are formed in the lead portions in local flow soldering or spot soldering using lead-free solder. It is possible to perform local soldering of electronic components to the substrate without causing defects.

1. 1. Square solder discharge nozzle 2. Nozzle port 3. Edge with solder drop step 4. the other three edges 5. Solder drop step part Inclined surface 6
7). Vertical plane 7
8). 8. The outer peripheral surface on the front side with respect to the direction in which the substrate passes through the nozzle opening rather than the edge portion having the solder drop step portion. 10. Outer peripheral surface on the rear side with respect to the direction in which the substrate passes through the nozzle opening rather than the edge portion having the solder drop step portion. Connection unit 11. Cylindrical hollow part 12. Elliptical cylindrical hollow 13. Molten solder reservoir 20. Printed circuit board 21. Through hole 22. Electronic component 23. Lead 24. Soldering area 25. Molten solder 26. Electronic component leads soldered to board through-holes

Claims (11)

In a square solder discharge nozzle having a square nozzle port used in a local soldering apparatus,
Of the four edge portions of the nozzle port, the edge portion on the front side with respect to the direction in which the substrate passes through the nozzle port in the relative movement of the nozzle and the substrate has a solder drop step portion whose height is lower than the periphery. Have
Further, of the outer peripheral surface around the nozzle, with respect to the direction of the substrate passing through the nozzle port, the substrate passes through the nozzle port, and the rear side of the substrate passes through the nozzle port. A rectangular solder discharge nozzle, characterized in that the outer peripheral surface of the side has surface properties that are inferior in terms of wettability.   Of the outer peripheral surfaces around the nozzle, nickel boron plating is applied to the outer peripheral surface on the front side with respect to the direction in which the substrate passes through the nozzle port, and chrome plating is applied to the outer peripheral surface on the rear side in the direction in which the substrate passes through the nozzle port. The square solder discharge nozzle according to claim 1, wherein   Of the four sides, nickel boron plating is applied to the edge on the front side with respect to the direction in which the substrate passes through the nozzle opening, and chromium plating is applied to the other three edges. Or the square solder discharge nozzle of Claim 2. In a square solder discharge nozzle having a square nozzle port used in a local soldering apparatus,
Of the four edge portions of the nozzle port, the edge portion on the front side with respect to the direction in which the substrate passes through the nozzle port in the relative movement of the nozzle and the substrate has a solder drop step portion whose height is lower than the periphery. Have
Further, of the four outer peripheral surfaces of the nozzle, the other three outer peripheral surfaces have surface characteristics that are inferior in terms of wettability as compared with the outer peripheral surface on the front side in the direction in which the substrate passes through the nozzle opening. A square solder discharge nozzle.   5. Of the four outer peripheral surfaces, nickel boron plating is applied to the outer peripheral surface on the front side with respect to the direction in which the substrate passes through the nozzle opening, and chromium plating is applied to the other three outer peripheral surfaces. The described square solder discharge nozzle.   5. The nickel boron plating is applied to the edge on the front side with respect to the direction in which the substrate passes through the nozzle opening, and the chromium plating is applied to the other three edges. Or the square-shaped solder discharge nozzle of Claim 5. In a square solder discharge nozzle having a square nozzle port used in a local soldering apparatus,
Of the four edges of the nozzle opening, the edge on the front side with respect to the direction in which the substrate passes the nozzle opening in the relative movement between the nozzle and the substrate is lower than the height of the other three edges. Having at least a height portion,
Further, of the outer peripheral surface around the nozzle, with respect to the direction of the substrate passing through the nozzle port, the substrate passes through the nozzle port, and the rear side of the substrate passes through the nozzle port. A rectangular solder discharge nozzle, characterized in that the outer peripheral surface of the side has surface properties that are inferior in terms of wettability.   Of the outer peripheral surfaces around the nozzle, nickel boron plating is applied to the outer peripheral surface on the front side with respect to the direction in which the substrate passes through the nozzle port, and chrome plating is applied to the outer peripheral surface on the rear side in the direction in which the substrate passes through the nozzle port. The square solder discharge nozzle according to claim 7, wherein In a square solder discharge nozzle having a square nozzle used in a local soldering apparatus,
Of the four edges of the nozzle, the edge on the front side with respect to the direction in which the substrate passes through the nozzle opening in the relative movement between the nozzle and the substrate is lower than the height of the other three edges. Having at least a portion of
Further, of the four outer peripheral surfaces of the nozzle, the other three outer peripheral surfaces have surface characteristics that are inferior in terms of wettability as compared with the outer peripheral surface on the front side in the direction in which the substrate passes through the nozzle opening. A square solder discharge nozzle.   The nickel boron plating is applied to the edge on the front side with respect to the direction in which the substrate passes through the nozzle port among the four edges, and the chromium plating is applied to the other three edges. 9. A rectangular solder discharge nozzle according to 9.   The local soldering apparatus provided with the square-shaped solder discharge nozzle as described in any one of Claims 1 thru | or 10.

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