JP2019160855A - Component mounting method, component mounting structure manufacturing method, and component mounting structure - Google Patents

Abstract

To provide a component mounting method, a component mounting structure manufacturing method, and a component mounting structure capable of mounting an insertion part on a substrate with high reliability.SOLUTION: In a component mounting method in which a pin terminal IT of an insertion part IB is inserted into a through hole 3 provided in a board 2 and the insertion part IB is mounted on the board 2, the through hole 3 is provided with a tapered portion 3V having a shape whose inner diameter decreases toward the back side 2B side from an opening 3K on the front surface 2A side of the board 2. After the through hole 3 has been filled with solder SD from the front surface 2A side of the board 2 facing upward, the pin terminal IT of the insertion part IB is inserted into the through hole 3 from the front surface 2A side of the board 2, and the tip ITs of the pin terminal IT is protruded to the back surface 2B side of the board 2, and the insertion component IB is mounted on the board 2.SELECTED DRAWING: Figure 12

Description

  The present invention relates to a component mounting method, a component mounting structure manufacturing method, and a component mounting structure in which a pin terminal of an insertion component is inserted into a through hole of a substrate and the insertion component is mounted on a substrate.

  2. Description of the Related Art Conventionally, a component mounting structure manufactured by inserting a pin terminal included in an insertion component into a through hole of a substrate is known. In order to manufacture this component mounting structure, first, solder is filled in a through hole provided in a substrate, and then a pin terminal of an insertion component is inserted into the through hole, and then the solder is melted and solidified. The pin terminal and the through hole are electrically connected to each other when the molten solder spreads out.

Japanese Patent Laying-Open No. 2006-25220

  However, in the manufacturing method of the component mounting structure described above, when the pin terminal is inserted into the through hole, the solder filled in the through hole is pushed to the back side of the substrate by the pin terminal and separated vertically. In combination with the shrinkage of the solder in the subsequent reflow process, the solder wetting and spreading is insufficient, and the reliability of electrical connection between the pin terminal and the through hole may be reduced. In addition, when the solder is separated into upper and lower parts, voids that may cause deterioration of the solder may occur, and when the voids are taken into the solder in the through holes, the electrical connection between the pin terminals and the through holes is also caused. Connection reliability may be reduced.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a component mounting method, a component mounting structure manufacturing method, and a component mounting structure in which an insertion component can be mounted on a substrate with high reliability.

  The component mounting method of the present invention is a component mounting method in which a pin terminal of an insertion component is inserted into a through hole provided in a substrate and the insertion component is mounted on the substrate, and the through hole is on the surface side of the substrate. A solder filling step of filling the through-hole with solder from the front surface side of the substrate facing upward, and a through-hole having a tapered portion with a shape whose inner diameter decreases from the opening toward the back surface side; The pin terminal is inserted into the through-hole of the board filled with solder from the front surface side of the board, and the tip part of the pin terminal protrudes to the back side of the board to insert the insertion part into the board And an insertion component mounting step for mounting the component.

  A method for manufacturing a component mounting structure according to the present invention is a method for manufacturing a component mounting structure in which a pin terminal of an insertion component is inserted into a through hole provided in a substrate, and the component mounting structure is manufactured. Has a tapered portion with a shape whose inner diameter decreases from the opening on the front surface side to the back surface side, and fills the through hole with solder from the front surface side of the substrate facing upward A step of inserting the insertion component into the through hole of the substrate in which the through hole is filled with solder from the front surface side of the substrate, and projecting the tip of the pin terminal to the back surface side of the substrate. An insertion component mounting step of mounting the insertion component on the substrate; and a reflow step of solidifying after melting the solder in the through hole in which the pin terminal is inserted.

  In the component mounting structure of the present invention, a pin terminal of an insertion component is inserted from a surface side of the substrate into a through hole provided in the substrate, and the pin terminal is electrically connected to the through hole by solder filled in the through hole. The through-hole has a tapered portion having a shape whose inner diameter decreases from the opening on the front surface side to the back surface side of the substrate.

  According to the present invention, the insertion component can be mounted on the substrate with high reliability.

Schematic configuration diagram of a component mounting line for manufacturing a component mounting structure by a component mounting body manufacturing method according to an embodiment of the present invention (A) (b) Sectional drawing of the board | substrate of the component mounting structure manufactured by the component mounting body manufacturing method in one embodiment of this invention The partial cross section figure of the component mounting structure manufactured by the component mounting body manufacturing method in one embodiment of this invention The block diagram of the screen printing apparatus with which the component mounting line in one embodiment of this invention is provided The block diagram of the surface mounting component mounting apparatus with which the component mounting line in one embodiment of this invention is provided The block diagram of the insertion component mounting apparatus with which the component mounting line in one embodiment of this invention is provided Sectional drawing which shows the mask with which the screen printing apparatus in one embodiment of this invention is provided with the board | substrate of a component mounting structure (A) (b) The figure explaining the procedure which fills the through-hole of a board | substrate with the component mounting line in one embodiment of this invention (A) (b) The figure explaining the procedure which fills the through-hole of a board | substrate with the component mounting line in one embodiment of this invention (A) (b) The figure explaining the procedure which fills the through-hole of a board | substrate with the component mounting line in one embodiment of this invention (A) (b) The figure explaining the procedure which mounts components in a board | substrate by the component mounting line in one embodiment of this invention. (A) (b) The figure explaining the procedure which mounts components in a board | substrate by the component mounting line in one embodiment of this invention. (A) (b) The figure explaining the procedure which mounts components in a board | substrate by the component mounting line in one embodiment of this invention. (A) (b) (c) The figure explaining operation | movement of the insertion component mounting apparatus with which the component mounting line in one embodiment of this invention is provided. (A) (b) (c) Sectional drawing of the board | substrate which shows the modification of the shape of the through hole of the component mounting structure manufactured by the component mounting body manufacturing method in one embodiment of this invention

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a component mounting line 1 to which a method for manufacturing a component mounting structure according to an embodiment of the present invention is applied. The component mounting line 1 performs component mounting on the substrate 2 shown in FIG. 2A to produce a component mounting structure 2J shown in FIG. In the present embodiment, for convenience of explanation, the left-right direction (feeding direction of the substrate 2) viewed from the operator OP is the X-axis direction, and the front-rear direction viewed from the operator OP is the Y-axis direction. Also, the vertical direction is the Z-axis direction.

  2A, the substrate 2 is provided with a plurality of through holes 3 and a plurality of lands 4 as electrodes. Each through hole 3 has a surface-side exposed portion 3a exposed on the front surface 2A side of the substrate 2 and a back-side exposed portion 3b exposed on the back surface 2B side. The land 4 is provided on the surface 2 </ b> A of the substrate 2.

  As shown in FIG. 2B (enlarged view of the region R in FIG. 2A), the through hole 3 provided in the substrate 2 has an inner diameter from the opening 3K on the front surface 2A side of the substrate 2 toward the back surface 2B side. Is provided with a tapered portion 3V having a shape in which the inner diameter is reduced (here, the inner surface is conical). The through hole 3 having the tapered portion 3V can be formed by using a drill having a conical blade surface. Here, the vertical region of the tapered portion 3V extends over the entire area in the thickness direction (Z-axis direction) of the substrate 2, but as shown in a modification example described later, the vertical region of the tapered portion 3V. May not necessarily extend over the entire area of the substrate 2 in the thickness direction.

  In FIG. 3, an insertion component IB and a surface mounting component HB are mounted on the substrate 2. The insertion part IB has a pin terminal IT extending downward. The surface mount component HB has a flat terminal HT on the lower surface. The insertion component IB is mounted on the substrate 2 by inserting the pin terminal IT into the through hole 3 from the surface 2A side of the substrate 2. The surface mount component HB is mounted by bonding the flat terminal HT to the land 4 provided on the surface 2A of the substrate 2.

  The minimum inner diameter D1 (FIG. 2B) of the tapered portion 3V of the through hole 3 is substantially the same as the outer diameter G (FIG. 3) of the pin terminal IT. Here, “substantially the same” means that the pin terminal IT inserted in the through hole 3 has the same size as the sliding contact (or almost sliding contact) with the portion having the minimum inner diameter D1 of the tapered portion 3V. Say something.

  In FIG. 1, the component mounting line 1 includes a solder filling portion M1, a surface mounting component mounting portion M2, an insertion component mounting portion M3, and a reflow portion M4 along the flow of transporting the substrate 2 in the X-axis direction. . The solder filling unit M1 fills the plurality of through holes 3 provided in the substrate 2 with the solder SD by the screen printing apparatus 10 shown in FIG. The surface mounting component mounting unit M2 mounts the surface mounting component HB on the substrate 2 by the surface mounting component mounting apparatus 20 shown in FIG. The insertion component mounting unit M3 mounts the insertion component IB on the board 2 by the insertion component mounting apparatus 30 shown in FIG. The reflow part M4 reflows the solder SD filled in the through hole 3 by the solder filling part M1 and applied to the land 4 by a reflow apparatus (not shown).

  In FIG. 4, the screen printing apparatus 10 includes a mask 11, a substrate transport unit 12, a substrate support unit 13, a squeegee head 14, a squeegee lifting mechanism 15, a squeegee head moving mechanism 16, and a dispenser 17. The mask 11 is composed of a flat member extending in the XY plane. In FIG. 7, the mask 11 includes a plurality of through-hole corresponding openings 11A and a plurality of land-corresponding openings 11B. The through hole corresponding opening 11 </ b> A is an opening corresponding to the through hole 3 provided in the substrate 2, and the land corresponding opening 11 </ b> B is an opening corresponding to the land 4 provided in the substrate 2. The through-hole corresponding opening portion 11A has a shape that is the same as or larger than the shape in plan view of the surface-side exposed portion 3a of the through-hole 3 (FIG. 7).

  In FIG. 4, the substrate transport unit 12 is composed of a pair of conveyors extending in the X-axis direction (perpendicular to the paper surface), and carries the substrate 2 sent from the upstream process side to work below the mask 11. Position to position. The substrate support unit 13 can be moved up and down by a lifting mechanism (not shown), and supports the substrate 2 positioned at the work position by the substrate transport unit 12 by lifting it from below. The substrate support portion 13 is formed in a box shape opened upward, and the inside of the substrate support portion 13 becomes a sealed space in a state where the substrate 2 is supported. A suction unit 13 </ b> K that sucks air in the substrate support unit 13 is connected to the substrate support unit 13.

  In FIG. 4, the squeegee head 14 includes a squeegee 14S. The squeegee lifting mechanism 15 moves the squeegee 14S up and down, and the squeegee head moving mechanism 16 moves the squeegee head 14 in the Y-axis direction. The dispenser 17 supplies the solder SD to the surface 2A of the mask 11.

  In FIG. 5, the surface mounting component mounting apparatus 20 includes a substrate transport unit 21, a substrate lifting unit 22, a stopper 23, a surface mounting component supply unit 24, a surface mounting head 25, and a surface mounting head moving mechanism 26. The substrate transport unit 21 includes a pair of conveyors extending in the X-axis direction (a direction perpendicular to the paper surface), and carries the substrate 2 sent from the upstream process side and positions it at a predetermined position. The substrate elevating unit 22 can be raised and lowered by an elevating mechanism (not shown), and lifts and supports the substrate 2 positioned by the substrate transfer unit 21. The stopper 23 is positioned above the substrate transport unit 21, and both end portions of the substrate 2 lifted by the substrate lifting unit 22 are pressed from below. The surface mount component supply unit 24 supplies the surface mount component HB. The surface mount head 25 includes a nozzle 25a. The surface mounting head 25 moves the nozzle 25a up and down and generates a suction force at the lower end of the nozzle 25a. The surface mounting head moving mechanism 26 moves the surface mounting head 25 in the horizontal plane direction.

  In FIG. 6, the insertion component mounting apparatus 30 includes a substrate transport unit 31, a substrate lifting unit 32, a stopper 33, an insertion component supply unit 34, an insertion head 35, and an insertion head moving mechanism 36. The substrate transport unit 31 is composed of a pair of conveyors extending in the X-axis direction (direction perpendicular to the paper surface), and carries the substrate 2 sent from the upstream process side and positions it at a predetermined position. The stopper 33 is positioned above the substrate transport unit 31, and both end portions of the substrate 2 lifted by the substrate lifting unit 32 are pressed from below. The substrate elevating unit 32 can be moved up and down by an elevating mechanism (not shown), and lifts and supports the substrate 2 positioned by the substrate transport unit 31. The insertion part supply unit 34 supplies the insertion part IB. The insertion head 35 includes a pair of chuck fingers 35a that can be opened and closed in the left-right direction. The insertion head moving mechanism 36 moves the insertion head 35 in the horizontal plane direction and in the vertical direction.

  The reflow unit M4 is configured by a reflow device (not shown). The reflow apparatus includes a substrate transport path extending in the X-axis direction, and heats and cools the substrate 2 while transporting the substrate 2 sent from the upstream process side.

  Next, a procedure for manufacturing the component mounting structure 2J using the component mounting line 1 (a manufacturing method of the component mounting structure) will be described. In the manufacture of the component mounting structure 2J, first, the substrate 2 having the surface 2A facing upward is put into the substrate transport unit 12 of the screen printing apparatus 10.

  When the substrate transport unit 12 of the screen printing apparatus 10 receives the substrate 2, it positions the substrate 2 at the working position (FIG. 4). When the substrate 2 is positioned at the working position, the substrate support portion 13 is raised to lift and support the substrate 2. The suction unit 13K sucks air in the substrate support unit 13 when the substrate support unit 13 comes into contact with the back surface 2B of the substrate 2. As a result, the inside of the substrate support portion 13 becomes a negative pressure, and the substrate 2 is in close contact with the substrate support portion 13.

  The substrate support unit 13 brings the surface 2A of the substrate 2 lifted and supported into contact with the lower surface of the mask 11 (FIG. 8A → FIG. 8B). As a result, the through hole 3 of the substrate 2 and the through hole corresponding opening 11A of the mask 11 are aligned vertically, and the land 4 of the substrate 2 and the land corresponding opening 11B of the mask 11 are aligned vertically (FIG. 8B). ).

  When the surface 2A of the substrate 2 comes into contact with the lower surface of the mask 11, the dispenser 17 supplies the solder SD onto the mask 11 (FIG. 9A), and the squeegee lifting mechanism 15 lowers the squeegee 14S and masks its lower edge. 11 (FIG. 9B). When the lower edge of the squeegee 14S comes into contact with the mask 11, the squeegee head 14 slides the squeegee 14S on the mask 11 by moving the squeegee head 14 in the Y-axis direction, and performs screen printing with the squeegee 14S (FIG. 9). (B) → FIG. 10 (a)). By this screen printing, each through hole 3 is filled with solder SD through each through hole corresponding opening 11A, and solder SD is applied to each land 4 through each land corresponding opening 11B (solder filling step).

  While the solder filling process is being performed, the suction unit 13K continues to suck air in the substrate support unit 13 and applies a negative pressure to the through hole 3 from the back surface 2B side of the substrate 2. Therefore, in the solder filling step, the solder SD filled in the through hole 3 by the squeegee 14S is pulled toward the back surface 2B side of the substrate 2, and the through hole 3 is reliably filled with the solder SD.

  As described above, the through hole corresponding opening portion 11A of the mask 11 has a shape larger than the shape of the through hole 3 in plan view. Therefore, when the squeegee 14S slides on the mask 11 in the solder filling process, The solder SD is applied to the surface side exposed portion 3 a of the hole 3. For this reason, as shown in FIG. 10 (b), a raised portion S 1 of solder SD having a thickness corresponding to the thickness of the mask 11 is formed in the surface-side exposed portion 3 a.

  When the through hole 3 is filled with the solder SD, the substrate support unit 13 is lowered to separate the plate 2 from the mask, and the substrate 2 is placed on the substrate transfer unit 12 (FIG. 10B). When the substrate 2 is placed on the substrate transport unit 12, the substrate transport unit 12 delivers the substrate 2 to the substrate transport unit 21 of the surface mount component mounting apparatus 20.

  When the board transport unit 21 of the surface mount component mounting apparatus 20 receives the board 2, the board 2 is positioned at a predetermined position (FIG. 5). When the substrate 2 is positioned, the substrate elevating part 22 is raised to support the substrate 2, and both ends of the substrate 2 are pressed against the stopper 23 from below to fix the substrate 2 (FIG. 11A).

  When the substrate 2 is fixed, the surface mounting head moving mechanism 26 moves the surface mounting head 25, and the surface mounting head 25 sucks the surface mounting component HB supplied from the surface mounting component supply unit 24 by the nozzle 25a. When the surface mount head 25 sucks the surface mount component HB by the nozzle 25a, the flat plate terminal HT is aligned with the land 4 of the substrate 2 (FIG. 11A), and the surface mount component HB is lowered to bring the flat plate terminal HT into the land 4 The surface-mounted component HB is mounted on the substrate 2 so as to be in contact with the substrate 2 (FIG. 11B. Surface-mounted component mounting step).

  When the surface mount component HB is mounted on the substrate 2, the surface mount component mounting apparatus 20 lowers the substrate elevating unit 22 and places the substrate 2 on the substrate transfer unit 21. If the board | substrate 2 is mounted in the board | substrate conveyance part 21, the board | substrate conveyance part 21 will be operated and the board | substrate 2 will be delivered to the board | substrate conveyance part 31 of the insertion component mounting apparatus 30. FIG.

  When the board conveyance unit 31 of the insertion component mounting apparatus 30 receives the board 2 from the surface mounting component mounting apparatus 20, it positions the board 2 at a predetermined position (FIG. 6). When the substrate 2 is positioned, the substrate raising / lowering unit 32 is raised to support the substrate 2 and both ends of the substrate 2 are pressed against the stopper 33 from below to fix the substrate 2 (FIG. 12A).

  When the substrate 2 is fixed, the insertion head moving mechanism 36 moves the insertion head 35. The insertion head 35 opens and closes the pair of chuck fingers 35a in the left-right direction to chuck the insertion component IB supplied by the insertion component supply unit 34. . When the insertion head 35 chucks the insertion part IB with the chuck finger 35a, the pin terminal IT is aligned with the through hole 3 of the substrate 2 (FIG. 12A), the insertion part IB is lowered and inserted into the through hole 3, The insertion component IB is mounted on the substrate 2 such that the tip portion ITs of the pin terminal IT protrudes to the back surface 2B side (below the substrate 2) of the substrate 2 (FIG. 12B, insertion component mounting step).

  As described above, the through hole 3 includes the tapered portion 3V having a shape in which the inner diameter decreases from the opening 3K on the front surface 2A side of the substrate 2 toward the back surface 2B side. For this reason, the solder SD in the through hole 3 is difficult to move downward because the lower end (portion having the minimum inner diameter) of the tapered portion 3V becomes a bottleneck. Therefore, even when the pin terminal IT is inserted into the through hole 3, the solder SD (separated solder) that is pushed by the pin terminal IT and separated from the solder SD in the through hole 3 and escapes to the back surface 2B side of the substrate 2 is separated. This is referred to as S2. The amount in FIG.

  In the present embodiment, as described above, since the minimum inner diameter D1 of the tapered portion 3V of the through hole 3 is substantially the same as the outer diameter G of the pin terminal IT, the pin terminal IT is the minimum inner diameter of the through hole 3. It passes while sliding (or almost sliding) on the portion having D1. For this reason, most of the solder SD adhering to the outer peripheral surface of the pin terminal IT is scraped off at the portion having the minimum inner diameter of the through-hole 3, and also from this, the separated solder S2 that comes out to the back surface 2B side of the substrate 2 is small. Amount.

  As in the present embodiment, the through hole 3 is not provided with the tapered portion 3V, and is inserted from above in the conventional through hole that passes straight through the substrate 2 in the thickness direction with the same inner diameter. In order to attract the pin terminal IT, the inner diameter of the opening on the surface 2A side of the substrate 2 must be formed to be somewhat larger than the outer diameter of the pin terminal IT. Therefore, when the pin terminal IT is inserted into the through hole, a part of the solder SD in the through hole is pushed out to the back surface 2B side of the substrate 2 by the pin terminal IT, and the other part adheres to the outer peripheral surface of the pin terminal IT. To the rear surface 2B side of the substrate 2. The solder SD attached to the outer peripheral surface of the pin terminal IT and coming out to the back surface 2B side of the substrate 2 has a back surface 2B of the substrate 2 when the vertical center axis of the pin terminal IT is eccentric with respect to the vertical center axis of the through hole. When projecting to the side, there is a tendency to bend and proceed to the side of the pin terminal IT. Thus, the separated solder S2 that has bent to the side of the pin terminal IT may come into contact with the separated solder S2 that is pushed out from another adjacent pin terminal IT to cause a short circuit.

  However, in the present embodiment, as described above, there is almost no solder SD that adheres to the outer peripheral surface of the pin terminal IT and escapes to the back surface 2B side of the substrate 2, and almost no solder SD that escapes to the back surface 2B side of the substrate 2 Is pushed straight down by the pin terminal IT. For this reason, the separated solder S2 that has come out to the back surface 2B side of the substrate 2 does not bend and advance to the side of the pin terminal IT, and the above-described short circuit does not occur. In the present embodiment, since the tapered portion 3V has a shape spreading toward the surface 2A side of the substrate 2, the inner diameter D2 of the opening 3K of the through hole 3 on the surface side of the substrate 2 (FIG. 2). (B)) is larger than the outer diameter G of the pin terminal IT, and this serves to attract the pin terminal IT.

  Further, when the tip portion ITs of the pin terminal IT is inserted into the through hole 3 and the solder SD in the through hole 3 is separated vertically, a void that may cause the solder SD to deteriorate may occur. In this embodiment, since the amount of the separated solder S2 that comes out to the back surface 2B side of the substrate 2 is small, the generated void is extremely small and the solder SD is hardly deteriorated. Further, since the amount of the separation solder S2 that comes out to the back surface 2B side of the substrate 2 is small, the separation solder S2 does not hang down along the pin terminal IT, and the reflow on the downstream process side as well as the insertion component mounting apparatus 30 is performed. There is no risk of the device being soiled.

  The insertion component mounting step is executed as described above. In the present embodiment, the reinsertion operation of the pin terminal IT is performed at least once. Here, in the reinsertion operation, after the pin terminal IT is inserted into the through hole 3, the insertion part IB is lifted with respect to the substrate 2 so that the tip portion ITs of the pin terminal IT is pulled into the through hole 3. After one operation (FIG. 12 (b) → FIG. 13 (a)) and after this first operation, the insertion part IB is lowered with respect to the substrate 2, and the tip portion ITs of the pin terminal IT is moved to the back surface 2B side of the substrate 2. The second operation (FIG. 13 (a) → FIG. 13 (b)) is caused to project.

  In the reinsertion operation, the tip portion ITs of the pin terminal IT that protrudes toward the back surface 2B side of the substrate 2 is drawn into the through hole 3 by the first operation. As a result, the separated solder S2 adhering to the tip portion ITs of the pin terminal IT is again integrated with the solder SD in the through hole 3 (FIG. 14 (a) → FIG. 14 (b)). Then, when the pin terminal IT is lowered in the second operation thereafter, the pin terminal IT passes again through the portion that was the separated solder S2 (FIG. 14 (b) → FIG. 14 (c)). A portion of the separated solder S2 is formed with a passage for the pin terminal IT once passed therethrough and hardly adheres to the outer surface of the descending pin terminal IT. For this reason, the amount of solder SD (separated solder S2) that comes out again to the back surface 2B side of the substrate 2 in the second operation of the pin terminal IT is extremely small (FIG. 14C).

  By performing the above re-insertion operation, it is possible to reduce the separated solder S2 that has slipped out to the back surface 2B side of the substrate 2 and return it to the through hole 3. Such re-insertion operation may be performed once, but by performing it twice or more, the amount of solder SD returned to the through hole 3 can be further increased, and the amount of solder SD in the through hole 3 is secured. can do.

  Further, when the pin terminal IT is inserted into the through hole 3, the raised portion S 1 of the solder SD formed in the exposed portion 3 a of the surface side of the through hole 3 is drawn into the through hole 3. Since the solder SD drawn into the through hole 3 supplements the solder SD that has come out to the back surface 2B side of the substrate 2, the effect of maintaining a sufficient amount of the solder SD in the through hole 3 can be obtained.

  When the insertion component mounting apparatus 30 mounts the insertion component IB on the board 2 as described above, the board lifting / lowering section 32 is lowered and the board 2 is placed on the board transport section 31. If the board | substrate 2 is mounted in the board | substrate conveyance part 31, the board | substrate conveyance part 31 will be operated and the board | substrate 2 will be delivered to the board | substrate conveyance path of a reflow apparatus.

  The board transfer path of the reflow apparatus receives the board 2 from the insertion component mounting apparatus 30 and heats the whole board 2 while transferring the board 2 to fill the solder SD and the land filled in the through hole 3 of the board 2. After the solder SD applied to 4 is melted, the entire substrate 2 is cooled to solidify the melted solder SD (reflow process). Thereby, the manufacture of the component mounting structure 2J is completed.

  The reflow process of the solder SD by the reflow apparatus is executed in a state where a sufficient amount of the solder SD is filled in the through hole 3 of the substrate 2. For this reason, even if the solder SD contracts in the reflow process, the solder SD in the through hole 3 is not insufficient, and sufficient wetting occurs to ensure the electrical connection reliability between the pin terminal IT and the through hole 3. Is done.

  Even if a void generated by the solder SD separating vertically in the insertion component mounting process is taken into the solder SD in the through hole 3, the through hole 3 has a shape spreading toward the surface 2A side of the substrate 2. This makes it easy for voids to escape into the air. For this reason, the void is unlikely to remain in the solder SD in the through hole 3 and the deterioration of the electrical characteristics of the solder SD due to the void is suppressed. From this aspect as well, the electrical connection between the pin terminal IT and the through hole 3 is suppressed. Connection reliability is ensured.

  As described above, the method for manufacturing the component mounting structure 2J according to the present embodiment fills the through hole 3 with the solder SD on the assumption that the through hole 3 uses the substrate 2 with the tapered portion 3V. The solder filling process, the insertion part mounting process in which the pin terminal IT is inserted into the through hole 3 of the substrate 2 to mount the insertion part IB, and the reflow process in which the solder SD in the through hole 3 is melted and solidified are arranged in this order. It is supposed to be executed in Of these, in the solder filling step and the subsequent insertion component mounting step, the procedure for mounting the insertion component IB on the substrate 2 is a component mounting method for mounting the insertion component IB on the substrate 2.

  In the present embodiment, the through hole 3 is provided with a tapered portion 3V having a shape whose inner diameter decreases from the opening 3K on the front surface 2A side of the substrate 2 toward the back surface 2B side, so that the through hole 3 is filled. The solder SD does not easily flow downward, and a sufficient amount of solder SD can be held in the through hole 3. Further, since the through hole 3 has a shape spreading toward the surface 2A side of the substrate 2, when the pin terminal IT is inserted into the through hole 3, the solder SD is separated vertically and a void is generated inside the solder SD. Even so, the void easily escapes into the air, and the deterioration of the electrical characteristics of the solder SD due to the void is suppressed. For this reason, the electrical connection reliability between the pin terminal IT and the through hole 3 can be improved, and the insertion component IB can be mounted on the substrate 2 with high reliability.

  Although the embodiment of the present invention has been described so far, the present invention is not limited to the above. For example, in the above-described embodiment, the vertical region of the tapered portion 3V of the through hole 3 included in the substrate 2 extends over the entire thickness direction (Z-axis direction) of the substrate 2, The region in the vertical direction of the tapered portion 3V does not necessarily need to cover the entire region in the thickness direction of the substrate 2. For example, as shown in the modification of FIG. 15A, the tapered portion 3V may have a shape in which the inner diameter gradually decreases from the opening on the front surface side to the back surface side. Alternatively, as shown in the modification of FIG. 15 (b), the substrate 2 has a portion having a minimum inner diameter D1 in the middle portion in the thickness direction, and the lower through hole 3 has a cylindrical shape having the same inner diameter. It may be. Alternatively, as shown in FIG. 15C, even if the substrate 2 has a portion with the minimum inner diameter D1 in the middle portion in the thickness direction, the through hole 3 below the portion extends downward. Good. Any of the through holes 3 having these shapes can be formed by using a plurality of drills having different diameters.

  In the above-described embodiment, the solder SD for mounting the surface mount component HB on the surface 2A of the substrate 2 is applied in the solder filling process. However, the surface mount component HB is applied to the substrate 2 in the solder filling process. When the mounting is not performed, it is not necessary to apply the solder SD for mounting the surface mounting component HB in the solder filling process.

  The above-described configurations of the screen printing apparatus 10, the surface mounting component mounting apparatus 20, and the insertion component mounting apparatus 30 are merely examples, and may not have the above-described configurations as long as they can execute the intended processes. The solder filling portion M1 only needs to be able to fill the through hole 3 with the solder SD from the surface 2A side of the substrate 2 facing upward, and does not necessarily have to be based on screen printing. Accordingly, when the surface mounting component HB is not mounted on the substrate 2, the solder SD may be discharged by the dispenser 17 or the like to fill the through hole 3 with the solder SD.

  Provided are a component mounting method, a component mounting structure manufacturing method, and a component mounting structure in which an insertion component can be mounted on a substrate with high reliability.

2 Substrate 2A Front surface 2B Back surface 2J Component mounting structure 3 Through hole 3K Opening 3V Tapered portion 11 Mask 11A Through hole corresponding opening (opening)
14S Squeegee D1 Minimum inner diameter HB Surface mount parts IB Insert parts IT Pin terminals ITs Tip G Outer diameter SD Solder

Claims (16)

A component mounting method for mounting the insert component on the substrate by inserting a pin terminal of the insert component into a through hole provided in the substrate,
The through hole includes a tapered portion having a shape in which the inner diameter decreases from the opening on the front side of the substrate toward the back side,
A solder filling step of filling the through hole with solder from the surface side of the substrate facing upward;
The pin terminal is inserted into the through hole of the substrate where the through hole is filled with solder from the front surface side of the substrate, and the tip end portion of the pin terminal protrudes to the back surface side of the substrate. A component mounting method including an insertion component mounting step for mounting the insertion component.   The component mounting method according to claim 1, wherein a minimum inner diameter of the tapered portion is substantially the same as an outer diameter of the pin terminal.   In the insertion component mounting step, after inserting the pin terminal into the through hole, the first operation of raising the insertion component relative to the substrate and pulling the tip portion of the pin terminal into the through hole; The re-insertion operation comprising the second operation of lowering the insertion part relative to the substrate and projecting the tip end portion of the pin terminal toward the back side of the substrate after the first operation is performed at least once. The component mounting method according to 1 or 2.   The component mounting method according to claim 1, wherein the solder filling step is performed while applying a negative pressure to the through hole from the back surface side of the substrate.   The component mounting method according to claim 1, wherein the solder filling step is performed by screen printing performed by sliding a squeegee on a mask.   The component mounting method according to claim 5, wherein an opening corresponding to the through hole provided in the mask is larger than the opening on the surface side of the substrate of the through hole.   The solder is applied to lands for mounting surface-mounted components provided on the surface of the substrate by sliding the squeegee on the mask in the solder filling step. Component mounting method. A component mounting structure manufacturing method for manufacturing a component mounting structure by inserting a pin terminal of an insertion component into a through hole provided in a substrate,
The through hole includes a tapered portion having a shape in which the inner diameter decreases from the opening on the front side of the substrate toward the back side,
A solder filling step of filling the through hole with solder from the surface side of the substrate facing upward;
The insertion part is inserted from the front side of the substrate into the through hole of the substrate where the through hole is filled with solder, and the tip of the pin terminal protrudes from the back side of the substrate to the substrate. An insertion component mounting step for mounting the insertion component;
And a reflow process in which the solder in the through hole in which the pin terminal is inserted is melted and then solidified.   The method for manufacturing a component mounting structure according to claim 8, wherein a minimum inner diameter of the tapered portion is substantially the same as an outer diameter of the pin terminal.   In the insertion component mounting step, after inserting the pin terminal into the through hole, the first operation of raising the insertion component relative to the substrate and pulling the tip portion of the pin terminal into the through hole; The re-insertion operation comprising the second operation of lowering the insertion part relative to the substrate and projecting the tip end portion of the pin terminal toward the back side of the substrate after the first operation is performed at least once. The manufacturing method of the component mounting structure of 8 or 9.   The manufacturing method of the component mounting structure according to any one of claims 8 to 10, wherein the solder filling step is performed while applying a negative pressure to the through hole from the back side of the substrate.   The method for manufacturing a component mounting structure according to claim 8, wherein the solder filling step is performed by screen printing performed by sliding a squeegee on a mask.   The method for manufacturing a component mounting structure according to claim 12, wherein an opening corresponding to the through hole provided in the mask is larger than the opening on the surface side of the substrate of the through hole.   In the solder filling step, the squeegee is slid on the mask to apply solder to lands for mounting surface-mounted components provided on the surface of the substrate, and after the solder filling step The method for manufacturing a component mounting structure according to claim 12 or 13, wherein a surface mounting component mounting step of mounting a surface mounting component on the land to which the solder is applied is executed. Component mounting in which a pin terminal of an insertion component is inserted into a through hole provided in the substrate from the surface side of the substrate, and the pin terminal is electrically connected to the through hole by solder filled in the through hole A structure,
The through-hole is a component mounting structure including a tapered portion whose inner diameter decreases from the opening on the front surface side to the back surface side of the substrate.   The component mounting structure according to claim 15, wherein a minimum inner diameter of the tapered portion is substantially the same as an outer diameter of the pin terminal.

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