WO2022092201A1 - Ruban adhésif - Google Patents

Ruban adhésif Download PDF

Info

Publication number
WO2022092201A1
WO2022092201A1 PCT/JP2021/039822 JP2021039822W WO2022092201A1 WO 2022092201 A1 WO2022092201 A1 WO 2022092201A1 JP 2021039822 W JP2021039822 W JP 2021039822W WO 2022092201 A1 WO2022092201 A1 WO 2022092201A1
Authority
WO
WIPO (PCT)
Prior art keywords
weight
adhesive tape
base material
meth
monomer
Prior art date
Application number
PCT/JP2021/039822
Other languages
English (en)
Japanese (ja)
Inventor
泰志 石堂
誠 福山
明史 堀尾
妃那 安田
奈未 中島
Original Assignee
積水化学工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 積水化学工業株式会社 filed Critical 積水化学工業株式会社
Priority to CN202180058188.3A priority Critical patent/CN116096829A/zh
Priority to JP2022507716A priority patent/JPWO2022092201A1/ja
Priority to KR1020237000292A priority patent/KR20230092862A/ko
Publication of WO2022092201A1 publication Critical patent/WO2022092201A1/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/26—Porous or cellular plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Definitions

  • the present invention relates to an adhesive tape.
  • Adhesive tapes are used for assembly in mobile electronic devices such as mobile phones and personal digital assistants (PDAs) (for example, Patent Documents 1 and 2). Adhesive tapes are also used for fixing in-vehicle electronic device parts such as in-vehicle panels to the vehicle body.
  • PDAs personal digital assistants
  • Adhesive tapes used for fixing portable electronic device parts, in-vehicle electronic device parts, and the like are required to have high adhesive strength and impact resistance that does not peel off even when impacted.
  • portable electronic devices, in-vehicle electronic devices, etc. tend to have more complicated shapes due to higher functionality. be.
  • the adhesive tape is required to have excellent flexibility to follow the shape of the adherend.
  • an adhesive tape having excellent flexibility and impact resistance for example, an adhesive tape using a foam base material obtained by foaming a polyolefin resin or the like is known.
  • electronic devices have been increasingly used for a long time at higher temperatures than before due to harsher usage conditions, application to the car electronics field, etc., and adhesive tapes using conventional foam base materials have been used. Then, there is a problem that it is easy to peel off when a load is applied to the shearing direction or the like at high temperature.
  • An object of the present invention is to provide an adhesive tape having excellent heat-retaining properties, which is difficult to peel off when a load is applied under high temperature.
  • the present invention is an adhesive tape having a substrate and an adhesive layer laminated on at least one surface of the substrate, and is obtained by measuring at 25 ° C. by the Han Echo method using pulse NMR. This is an adhesive tape having a relaxation time ( TL25 ) of the L component of 0.9 ms or less. Further, the present invention is an adhesive tape having a substrate and an adhesive layer laminated on at least one surface of the substrate, which is measured by the Han Echo method at 85 ° C. using pulse NMR. It is an adhesive tape having a relaxation time ( TL85 ) of the obtained L component of 3.3 ms or less.
  • the present invention will be described in detail below.
  • the present inventors analyzed an adhesive tape having a substrate and an adhesive layer laminated on at least one surface of the substrate by using pulse NMR for measuring 1H nuclei.
  • pulse NMR the obtained 1H nucleus spin - spin relaxation free induction decay curve is waveform-separated into multiple components, and the "relaxation time" of each component is obtained to evaluate the molecular motility of that component. can do.
  • the present inventors adjust the relaxation time ( TL25 ) of the L component obtained by measuring at 25 ° C. by the Han Echo method using pulse NMR to a specific value or less, whereby a load is applied at a high temperature. It has been found that an adhesive tape having excellent heat-retaining properties, which is difficult to peel off at the time, can be obtained.
  • the present inventors can also adjust the relaxation time ( TL85 ) of the L component obtained by the Han Echo method at 85 ° C. using pulsed NMR to a specific value or less to load the product under high temperature.
  • TL85 the relaxation time of the L component obtained by the Han Echo method at 85 ° C. using pulsed NMR
  • the pressure-sensitive adhesive tape of the present invention has a base material and a pressure-sensitive adhesive layer laminated on at least one surface of the base material.
  • the upper limit of the relaxation time ( TL25 ) of the L component obtained by measuring at 25 ° C. by the Han Echo method using pulse NMR is 0.9 ms.
  • the upper limit of the relaxation time ( TL85 ) of the L component obtained by measuring at 85 ° C. by the Han Echo method using pulse NMR is 3.3 milliseconds.
  • the "L component obtained by measuring with the Han Echo method at 25 ° C. using pulse NMR” is 1 H obtained by measuring with the Han Echo method at 25 ° C. using pulsed NMR. It means the component with the longest relaxation time when the free induction decay curve of nuclear spin-spin relaxation is waveform-separated into three components in the order of shortest relaxation time. Waveform separation into three components (S component, M component and L component, respectively in the order of shorter relaxation time) is performed by analyzing the free induction decay curve by the method of least squares.
  • the "relaxation time” is the time from the excited state to the ground state of the electron spin after the magnetic field is applied, and the longer the “relaxation time” is, the higher the molecular motility is. That is, the S component is a hard component having a relatively low molecular motility, having the shortest relaxation time and immediately decaying the magnetization strength.
  • the M component is a component having an intermediate relaxation time and molecular motility between the S component and the L component.
  • the L component is a soft component having a relatively high molecular motility, which has the longest relaxation time and takes a long time to decay the magnetization strength.
  • the adhesive tape of the present invention has a relatively high molecular mobility of the L component at 25 ° C. By being suppressed, it becomes difficult to peel off when a load is applied under high temperature.
  • the preferred upper limit of the relaxation time ( TL25 ) of the L component at 25 ° C. is 0.8 ms, the more preferred upper limit is 0.6 ms, and the more preferred upper limit is 0.4 ms.
  • the relaxation time of the L component ( TL25 ) at 25 ° C. was determined by using a pulse NMR device (for example, the minispec mq20, manufactured by BRUKER, etc.) and analysis software (for example, TD-NMRA, manufactured by BRUKER, etc.).
  • Adhesive tape can be used as a measurement sample and measured by the Han Echo method at 25 ° C.
  • the L component obtained by measuring with the Han Echo method at 85 ° C. using pulse NMR was obtained by measuring with the Han Echo method at 85 ° C. using pulse NMR. 1 It means the L component when the free induction decay curve of spin-spin relaxation of H nucleus is waveform-separated into two components, S component and L component, in the order of shortest relaxation time. The waveform separation into two components is performed by analyzing the free induction decay curve by the method of least squares.
  • the adhesive tape of the present invention has a relatively high molecular mobility of the L component at 85 ° C. By being suppressed, it becomes difficult to peel off when a load is applied under high temperature.
  • the more preferable upper limit of the relaxation time ( TL85 ) of the L component at 85 ° C. is 3 ms, and the more preferable upper limit is 2.5 ms.
  • the lower limit of the relaxation time ( TL85 ) of the L component at 85 ° C. is not particularly limited, but from the viewpoint of ensuring the flexibility of the adhesive tape, the preferable lower limit is 0.5 ms, and the more preferable lower limit is 1 ms. be.
  • the method for adjusting the relaxation time of the L component at 25 ° C. ( TL25 ) and the relaxation time of the L component at 85 ° C. ( TL85 ) within the above ranges is not particularly limited, and for example, the substrate can be used.
  • a method using a copolymer having a structure derived from a vinyl aromatic monomer and a structure derived from a (meth) acrylic monomer, which will be described later, and the like can be mentioned.
  • a method of adjusting the weight average molecular weight (Mw) of such a copolymer, a method of adjusting the content of foamed particles in the above-mentioned substrate, and the like can be mentioned.
  • a method of adjusting the composition of the pressure-sensitive adhesive layer a method of adjusting the weight average molecular weight (Mw) of the resin constituting the pressure-sensitive adhesive layer, and the like can be mentioned. More specifically, as a method for shortening the relaxation time, a method for introducing a structure derived from a vinyl aromatic monomer in the base material or the pressure-sensitive adhesive layer, and the content of hard blocks described later in the block copolymer. Examples thereof include a method of increasing the number of crosslinks, a method of introducing a crosslinked structure, and a method of increasing the degree of crosslinking thereof.
  • a method of increasing the entanglement between molecules that is, increasing the number of monomers having a short side chain or decreasing the number of monomers having a long side chain
  • reducing the motility of the molecular chain examples include a method (for example, introducing an alicyclic structure), a method of increasing polar interaction (for example, introducing an acid or a hydroxyl group, or increasing the amount thereof), and the like.
  • a method of selecting a raw material monomer so that the glass transition temperature (Tg) becomes higher in the base material or the pressure-sensitive adhesive layer, a method of increasing the molecular weight, a method of adding a filler, and the like can be mentioned.
  • the base material is not particularly limited, but preferably contains a copolymer having a structure derived from a vinyl aromatic monomer and a structure derived from a (meth) acrylic monomer.
  • the relaxation time of the L component at 25 ° C. ( TL25 ) and the relaxation time of the L component at 85 ° C. ( TL85 ) are within the above ranges. It becomes easy to adjust to, and it becomes more difficult for the adhesive tape to peel off when a load is applied under high temperature.
  • vinyl aromatic monomer examples include styrene, alpha-methylstyrene, paramethylstyrene, chlorostyrene and the like. These vinyl aromatic monomers may be used alone or in combination of two or more. Of these, styrene is preferable because the adhesive tape is more difficult to peel off when a load is applied under high temperature.
  • the structure derived from the vinyl aromatic monomer refers to the structure represented by the following general formulas (1) and (2).
  • R 1 represents a substituent having an aromatic ring.
  • substituent R1 having an aromatic ring include a phenyl group, a methylphenyl group, a chlorophenyl group and the like.
  • the content of the structure derived from the vinyl aromatic monomer in the copolymer having the structure derived from the vinyl aromatic monomer and the structure derived from the (meth) acrylic monomer is not particularly limited, but is 1% by weight or more. It is preferably 30% by weight or less.
  • the adhesive tape is less likely to be peeled off when a load is applied at a high temperature.
  • a more preferable lower limit of the content of the structure derived from the vinyl aromatic monomer is 1.5% by weight, a further preferable lower limit is 2% by weight, a further preferable lower limit is 2.5% by weight, and a particularly preferable lower limit is 3% by weight.
  • a particularly preferable lower limit is 4% by weight, a more preferable upper limit is 25% by weight, a further preferable upper limit is 20% by weight, and a particularly preferable upper limit is 15% by weight.
  • the copolymer having a structure derived from the vinyl aromatic monomer and a structure derived from the (meth) acrylic monomer further has a structure derived from the monomer having a crosslinkable functional group.
  • a copolymer having a structure derived from the vinyl aromatic monomer and a structure derived from the (meth) acrylic monomer has a crosslinkable functional group, the cohesive force of the copolymer is enhanced by the crosslinking. It becomes easy to adjust the relaxation time of the L component at ° C. ( TL25 ) and the relaxation time of the L component at 85 ° C. ( TL85 ) within the above ranges. This makes it more difficult for the adhesive tape to peel off when a load is applied under high temperature.
  • the crosslinkable functional group may or may not be crosslinked, but is more preferably crosslinked. However, even if the structure remains uncrosslinked, the cohesive force in the hard block or soft block (particularly the hard block) described later is improved by the interaction between the functional groups, and a load is applied at high temperature. At that time, the adhesive tape becomes more difficult to peel off.
  • the structure derived from the monomer having a crosslinkable functional group refers to the structure represented by the following general formulas (3) and (4).
  • R 2 represents a substituent containing at least one functional group.
  • the functional group include a carboxyl group, a hydroxyl group, an epoxy group, a double bond, a triple bond, an amino group, an amide group, a nitrile group and the like.
  • the substituent R2 containing at least one functional group may contain an alkyl group, an ether group, a carbonyl group, an ester group, a carbonate group, an amide group, a urethane group and the like as its constituent elements.
  • the monomer having a crosslinkable functional group is not particularly limited, and for example, a carboxyl group-containing monomer, a hydroxyl group-containing monomer, an epoxy group-containing monomer, a double bond-containing monomer, a triple bond-containing monomer, an amino group-containing monomer, and an amide group-containing monomer. , A nitrile group-containing monomer and the like.
  • These crosslinkable functional groups may be used alone or in combination of two or more.
  • a carboxyl group-containing monomer a hydroxyl group-containing monomer, an epoxy group-containing monomer, a double bond-containing monomer, a triple bond-containing monomer, and an amide group.
  • At least one selected from the group consisting of contained monomers is preferable.
  • the carboxyl group-containing monomer include (meth) acrylic acid-based monomers such as (meth) acrylic acid.
  • the hydroxyl group-containing monomer include 4-hydroxybutyl (meth) acrylate and 2-hydroxyethyl (meth) acrylate.
  • the epoxy group-containing monomer include glycidyl (meth) acrylate and the like.
  • Examples of the double bond-containing monomer include allyl (meth) acrylate and hexanediol di (meth) acrylate.
  • Examples of the triple bond-containing monomer include propargyl (meth) acrylate and the like.
  • Examples of the amide group-containing monomer include (meth) acrylamide and the like. Of these, a carboxyl group-containing monomer and a hydroxyl group-containing monomer are preferable because the adhesive tape is more difficult to peel off when a load is applied at a high temperature.
  • a (meth) acrylic acid-based monomer containing a carboxyl group and a (meth) acrylic acid-based monomer containing a hydroxyl group are more preferable, and (meth) acrylic acid, 4-hydroxybutyl (meth) acrylate, and 2-hydroxyethyl (meth) are preferable. Acrylic is more preferred.
  • the content of the structure derived from the crosslinkable functional group in the copolymer having the structure derived from the vinyl aromatic monomer and the structure derived from the (meth) acrylic monomer is not particularly limited, but is 0. It is preferably 1% by weight or more and 30% by weight or less.
  • the adhesive tape is less likely to be peeled off when a load is applied at a high temperature.
  • a more preferable lower limit of the content of the structure derived from the monomer having a crosslinkable functional group is 0.5% by weight, a further preferable lower limit is 1% by weight, a more preferable upper limit is 25% by weight, and a further preferable upper limit is 20% by weight. be.
  • the (meth) acrylic monomer may be a single monomer or may use a plurality of monomers.
  • the structure derived from the (meth) acrylic monomer refers to the structure represented by the following general formulas (5) and (6).
  • R 3 represents a side chain.
  • the side chain R 3 includes a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a 2-ethylhexyl group, a nonyl group, a decyl group, a dodecyl group and a lauryl group. Examples thereof include an isostearyl group.
  • Examples of the (meth) acrylic monomer include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, and heptyl (meth). Meta) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, dodecyl (meth) acrylate, lauryl (meth) acrylate, isostearyl (meth) acrylate And so on.
  • (meth) acrylic monomers may be used alone or in combination of two or more.
  • methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, and 2-ethylhexyl (meth) acrylate Is preferable, and methyl acrylate, ethyl acrylate, butyl acrylate, and 2-ethylhexyl acrylate are more preferable.
  • the (meth) acrylic monomer it is preferable to use a (meth) acrylic monomer having 2 or less side chain carbon atoms.
  • the (meth) acrylic monomer having 2 or less side chains has been used, the entanglement between the obtained copolymer chains is increased, the cohesive force is improved, and the relaxation time of the L component at 25 ° C. is increased.
  • TL25 ) and the relaxation time of the L component ( TL85 ) at 85 ° C. can be easily adjusted to the above range, and the adhesive tape becomes more difficult to peel off when a load is applied under high temperature.
  • Examples of the (meth) acrylic monomer having 2 or less side chain carbon atoms include methyl (meth) acrylate and ethyl (meth) acrylate, and methyl acrylate and ethyl acrylate are particularly preferable.
  • the content of the structure derived from the (meth) acrylic monomer in the copolymer having the structure derived from the vinyl aromatic monomer and the structure derived from the (meth) acrylic monomer is not particularly limited, and the content of the structure derived from the (meth) acrylic monomer is not particularly limited. The effect may be exhibited, but it is preferably 30% by weight or more and 99% by weight or less.
  • the content of the structure derived from the (meth) acrylic monomer is more preferably 40% by weight or more and 98% by weight or less, and further preferably 50% by weight or more and 97% by weight or less.
  • the content of the (meth) acrylic monomer having 2 or less side chain carbon atoms is particularly limited.
  • the preferred lower limit is 5% by weight and the preferred upper limit is 90% by weight.
  • the content of the (meth) acrylic monomer having 2 or less side chain carbon atoms is 5% by weight or more, the effect of improving the cohesive force is likely to be exhibited. If the content of the (meth) acrylic monomer having 2 or less side chain carbon atoms is 90% by weight or less, the cohesive force becomes too high, the flexibility becomes low, and the flexibility as an adhesive tape is lost. Can be prevented.
  • a more preferable lower limit of the content of the (meth) acrylic monomer having 2 or less side chain carbon atoms is 10% by weight, a further preferable lower limit is 20% by weight, a further preferable lower limit is 25% by weight, and a particularly preferable lower limit is 30% by weight.
  • the more preferable upper limit is 85% by weight, the further preferable upper limit is 80% by weight, the still more preferable upper limit is 75% by weight, and the particularly preferable upper limit is 70% by weight.
  • the copolymer having a structure derived from the vinyl aromatic monomer and a structure derived from the (meth) acrylic monomer is not particularly limited as long as it has each structure as described above, and is a random copolymer. It may be a block copolymer or a block copolymer. From the viewpoint of further enhancing the flexibility of the base material, a random copolymer is preferable, and from the viewpoint of further enhancing the balance between the heat resistance retention property and the flexibility of the base material, a block copolymer is preferable.
  • the block copolymer is a copolymer containing a rigid structure (hereinafter, also referred to as "hard block”) and a flexible structure (hereinafter, also referred to as "soft block”).
  • the block copolymer may have a non-uniform phase-separated structure in which two blocks are difficult to be compatible with each other and islands formed by agglomeration of the hard blocks are scattered in the sea of the soft blocks. Since the islands serve as pseudo-crosslinking points, rubber elasticity can be imparted to the block copolymer, so that the adhesive tape is less likely to be peeled off when a load is applied at a high temperature.
  • the adhesive tape becomes more difficult to peel off when a load is applied at a high temperature.
  • the copolymer having the structure derived from the vinyl aromatic monomer and the structure derived from the (meth) acrylic monomer is a random copolymer, the adhesive tape is subjected to a load at a high temperature. It is an adhesive tape with excellent heat retention that is hard to peel off. It is considered that this is because the same interaction as the above-mentioned phase-separated structure works at a very small scale such as the nano level and the molecular level.
  • the block copolymer contains a structure derived from the vinyl aromatic monomer in the hard block and a structure derived from the (meth) acrylic monomer in the soft block.
  • the hard block is not particularly limited as long as it has a rigid structure, and in addition to the structure derived from the vinyl aromatic monomer, for example, a compound having a cyclic structure, a compound having a short side chain substituent, or the like can be used. It may have a structure derived from the above (meth) acrylic monomer as long as the effect of the present invention is not lost.
  • the soft block may have a structure derived from a monomer other than the (meth) acrylic monomer as long as the effect of the present invention is not lost.
  • the block copolymer may have any structure such as a diblock structure or a triblock structure, but the adhesive tape is more difficult to peel off when a load is applied at a high temperature, so that the hard block It is preferable to have a triblock structure having the soft block between the two.
  • the block copolymer may be a graft copolymer in which the hard block and the soft block are separated into a main chain and a side chain. Examples of the graft copolymer include a styrene macromer- (meth) acrylic monomer copolymer and the like.
  • the content of the hard block in the block copolymer is not particularly limited, but is preferably 1% by weight or more and 40% by weight or less.
  • the adhesive tape is less likely to be peeled off when a load is applied at a high temperature.
  • the more preferable lower limit of the content of the hard block is 2% by weight, the more preferable lower limit is 2.5% by weight, and the particularly preferable lower limit is 3% by weight.
  • a more preferable upper limit of the content of the hard block is 35% by weight, a further preferable upper limit is 30% by weight, a further preferable upper limit is 25% by weight, a further preferable upper limit is 20% by weight, and a particularly preferable upper limit is 15% by weight.
  • the weight average molecular weight (Mw) of the copolymer having a structure derived from the vinyl aromatic monomer and a structure derived from the (meth) acrylic monomer is not particularly limited, but is preferably 50,000 or more and 800,000 or less. ..
  • the more preferable lower limit of the weight average molecular weight is 75,000, and the more preferable upper limit is 600,000.
  • the weight average molecular weight can be determined, for example, by a GPC (Gel Permeation Chromatography) method in terms of standard polystyrene.
  • the raw material monomers of the hard block and the soft block are used in the presence of a polymerization initiator.
  • the hard block and the soft block may be obtained by radical reaction, respectively, and then the two may be reacted or copolymerized. Further, after obtaining the hard block, the raw material monomer of the soft block may be continuously added and copolymerized.
  • a solution mixed with the raw material monomers may be subjected to a radical reaction in the presence of a polymerization initiator.
  • the method for causing the radical reaction that is, the polymerization method
  • a conventionally known method is used, and examples thereof include solution polymerization (boiling point polymerization or constant temperature polymerization), emulsion polymerization, suspension polymerization, bulk polymerization and the like.
  • the substrate may contain additives such as antistatic agents, mold release agents, antioxidants, weathering agents, and crystal nucleating agents, and resin modifiers such as polyolefins, polyesters, polyamides, and elastomers. ..
  • the above substrate was at least in a region of 10 ° C. or lower and a region of 50 ° C. or higher when DSC measurement (differential scanning calorimetry) was performed under the conditions of a temperature rise rate of 10 ° C./min and a temperature range of -80 to 200 ° C. It is preferable to have one peak.
  • the substrate has at least one peak in the region of 10 ° C. or lower and the region of 50 ° C. or higher when DSC measurement is performed, the substrate is a block copolymer having two blocks as described above. It can be said that it contains. From the viewpoint of achieving both heat retention and flexibility, it is preferable that the base material contains the block copolymer in this way.
  • the peak in the region of 10 ° C. or lower when the DSC measurement is performed may be referred to as the peak derived from the soft block, and the peak in the region of 50 ° C. or higher may be referred to as the peak derived from the hard block.
  • the peak region can be adjusted by the type of the raw material monomer of the hard block and the soft block.
  • the DSC measurement of the base material can be performed on 100 mg of the base material using a differential scanning calorimeter (for example, 220C manufactured by Seiko Instruments Inc.).
  • the base material may have a single-layer structure or a multi-layer structure.
  • the base material is preferably a foam base material. Since the base material is the foam base material, the relaxation time of the L component at 25 ° C. ( TL25 ) and the relaxation time of the L component at 85 ° C. ( TL85 ) are adjusted within the above ranges. This makes it easier to remove the adhesive tape when a load is applied at high temperature.
  • the foam base material may have an open cell structure or a closed cell structure, but is preferably a closed cell structure.
  • the foaming ratio is not particularly limited, but the preferable lower limit is 1.1 cm 3 / g and the preferable upper limit is 5 cm 3 / g.
  • the foaming ratio is in the above range, the balance between the heat resistance retention property and the flexibility of the adhesive tape can be further improved.
  • the more preferable lower limit of the foaming ratio is 1.2 cm 3 / g
  • the more preferable upper limit is 4.5 cm 3 / g
  • the more preferable lower limit is 1.3 cm. 3 / g
  • a more preferred upper limit is 4 cm 3 / g.
  • the expansion ratio of the base material can be calculated from the reciprocal of the density of the base material, and can be measured using an electronic hydrometer (for example, "ED120T” manufactured by Mirage Co., Ltd.) in accordance with JIS K 7222.
  • the average bubble diameter is not particularly limited, but is preferably 80 ⁇ m or less. When the average cell diameter is 80 ⁇ m or less, the balance between the heat resistance retention and the flexibility of the adhesive tape can be further improved.
  • the average bubble diameter is more preferably 60 ⁇ m or less, and further preferably 55 ⁇ m or less.
  • the lower limit of the average bubble diameter is not particularly limited, but is preferably 10 ⁇ m or more, and more preferably 20 ⁇ m or more, from the viewpoint of ensuring the flexibility of the adhesive tape.
  • the average bubble diameter of the base material can be measured by the following method.
  • the base material is cut into 50 mm squares, immersed in liquid nitrogen for 1 minute, and then cut in a plane perpendicular to the thickness direction of the base material using a razor blade. Then, using a digital microscope (for example, "VHX-900" manufactured by KEYENCE Corporation), a magnified photograph of the cut surface was taken at a magnification of 200 times, and the most bubbles existing in the range of thickness ⁇ 2 mm were taken. Measure a long bubble diameter (bubble diameter). This operation is repeated 5 times, and the average bubble diameter is calculated by averaging all the obtained bubble diameters.
  • VHX-900 digital microscope
  • the base material preferably has a gel fraction of 90% by weight or less.
  • the adhesive tape can exhibit more excellent flexibility.
  • the more preferable upper limit of the gel fraction is 85% by weight, and the more preferable upper limit is 80% by weight.
  • the lower limit of the gel fraction is not particularly limited, but from the viewpoint of making it more difficult for the adhesive tape to peel off when a load is applied at a high temperature, for example, it is 10% by weight or more, particularly 20% by weight or more, particularly 35% by weight or more. be.
  • the gel fraction can be adjusted by cross-linking the resin constituting the substrate.
  • the gel fraction of the base material can be measured by the following method.
  • the base material has a cross-linked structure formed between the main chains of the resin constituting the base material by adding a cross-linking agent.
  • a cross-linking agent By forming a crosslinked structure between the main chains of the resin constituting the base material, the stress applied intermittently can be dispersed, and the adhesive tape becomes more difficult to peel off when a load is applied at a high temperature.
  • the cross-linking agent is not particularly limited, and can be appropriately selected depending on the functional group of the resin constituting the base material. Specific examples thereof include isocyanate-based cross-linking agents, aziridine-based cross-linking agents, epoxy-based cross-linking agents, and metal chelate-type cross-linking agents. Among them, an epoxy-based cross-linking agent or an isocyanate-based cross-linking agent is preferable because a resin having an alcoholic hydroxyl group or a carboxyl group that can further improve flexibility can be cross-linked.
  • the isocyanate-based cross-linking agent When the isocyanate-based cross-linking agent is used, the alcoholic hydroxyl group or carboxyl group in the resin constituting the substrate is crosslinked with the isocyanate group of the isocyanate-based cross-linking agent.
  • the epoxy-based cross-linking agent When the epoxy-based cross-linking agent is used, the carboxyl group in the resin constituting the base material and the epoxy group of the epoxy-based cross-linking agent are cross-linked.
  • the amount of the cross-linking agent added is not particularly limited, but is preferably 0.01 parts by weight or more and 10 parts by weight or less, and 0.1 parts by weight or more and 7 parts by weight or less with respect to 100 parts by weight of the resin constituting the base material. Is more preferable.
  • the thickness of the base material is not particularly limited, but the preferred lower limit is 40 ⁇ m and the preferred upper limit is 2900 ⁇ m.
  • the thickness of the base material is not particularly limited, but the preferred lower limit is 40 ⁇ m and the preferred upper limit is 2900 ⁇ m.
  • the more preferable lower limit of the thickness of the base material is 60 ⁇ m
  • the more preferable upper limit is 1900 ⁇ m
  • the further preferable lower limit is 80 ⁇ m
  • the further preferable upper limit is 1400 ⁇ m
  • the particularly preferable lower limit is 100 ⁇ m.
  • a particularly preferable upper limit is 1000 ⁇ m.
  • the method for producing the above-mentioned base material is not particularly limited.
  • examples of the method for producing the foam base material include a method of producing by the action of foaming gas and a method of producing by blending hollow spheres in a raw material matrix.
  • the base material produced by the latter method is called syntactic foam, and is excellent in strength, flexibility and heat resistance. Therefore, the base material is preferably syntactic foam.
  • syntactic foam Since the base material is syntactic foam, it becomes a closed cell type foam having a more uniform size distribution, so that the density of the entire base material becomes more constant, and the strength, flexibility and heat resistance are further improved. do. In addition, syntactic foam exhibits higher heat resistance than other foams because it is less likely to cause irreversible disintegration under high temperature and high pressure.
  • Syntactic foam includes those having a foamed structure made of hollow inorganic particles and those having a foamed structure made of hollow organic particles. From the viewpoint of flexibility, syntactic foam having a foamed structure made of hollow organic particles. Foam is preferred.
  • Examples of the hollow organic particles include Expancel DU series (manufactured by Nippon Philite Co., Ltd.), Advancel EM series (manufactured by Sekisui Chemical Co., Ltd.) and the like. Among them, since it is easy to design the bubble diameter after foaming in a region with higher effect, Expandel 461-DU-20 (average bubble diameter after foaming under optimum conditions 20 ⁇ m), Expandel 461-DU- 40 (average cell diameter after foaming under optimum conditions 40 ⁇ m), Expandel 043-80 (average cell diameter after foaming under optimum conditions 80 ⁇ m), Advansel EML101 (average cell diameter after foaming under optimum conditions 50 ⁇ m) ) Is preferable.
  • the content of the hollow organic particles is not particularly limited, but since the adhesive tape is more difficult to peel off when a load is applied at a high temperature, the preferable lower limit with respect to 100 parts by weight of the resin constituting the base material is 0.1.
  • the preferred upper limit is 10 parts by weight
  • the more preferred lower limit is 0.3 parts by weight
  • the more preferred upper limit is 7 parts by weight.
  • the foaming agent is not particularly limited, and a conventionally known foaming agent such as a pyrolytic foaming agent can be used.
  • the pressure-sensitive adhesive layer may be laminated on only one surface of the base material, or may be laminated on both sides.
  • the pressure-sensitive adhesive layers on both sides may have the same composition and physical properties, or may have different compositions and physical properties.
  • the pressure-sensitive adhesive layer is not particularly limited, and examples thereof include an acrylic pressure-sensitive adhesive layer, a rubber-based pressure-sensitive adhesive layer, a urethane pressure-sensitive adhesive layer, and a silicone-based pressure-sensitive adhesive layer.
  • an acrylic pressure-sensitive adhesive layer containing an acrylic copolymer is preferable because it has excellent heat resistance and can be adhered to a wide variety of adherends.
  • the acrylic copolymer can be obtained by copolymerizing a monomer mixture containing butyl acrylate and / or 2-ethylhexyl acrylate from the viewpoint of improving the initial tack and making it easy to attach at low temperature. preferable. Above all, it is more preferable to obtain it by copolymerizing a monomer mixture containing butyl acrylate and 2-ethylhexyl acrylate.
  • the preferable lower limit of the content of the butyl acrylate in the total monomer mixture is 40% by weight, and the preferable upper limit is 80% by weight.
  • the preferable lower limit of the content of the 2-ethylhexyl acrylate in the total monomer mixture is 10% by weight, the preferable upper limit is 100% by weight, the more preferable lower limit is 30% by weight, the more preferable upper limit is 80% by weight, and the further preferable lower limit is 50% by weight. %, A more preferred upper limit is 60% by weight.
  • the monomer mixture may contain other copolymerizable monomers other than butyl acrylate and 2-ethylhexyl acrylate, if necessary.
  • the other copolymerizable monomer include a (meth) acrylic acid alkyl ester having an alkyl group having 1 to 8 carbon atoms and a (meth) acrylic acid alkyl ester having an alkyl group having 13 to 18 carbon atoms. Examples include functional monomers.
  • Examples of the (meth) acrylic acid alkyl ester having 1 to 8 carbon atoms in the alkyl group include methyl (meth) acrylic acid, ethyl (meth) acrylic acid, n-propyl (meth) acrylic acid, and (meth) acrylic acid.
  • the (meth) acrylic acid alkyl ester having 13 to 18 carbon atoms in the alkyl group include tridecylic methacrylic acid and stearyl (meth) acrylic acid.
  • Examples of the functional monomer include (meth) acrylic acid hydroxyalkyl, glycerin dimethacrylate, (meth) glycidyl acrylate, 2-methacryloyloxyethyl isocyanate, (meth) acrylic acid, itaconic acid, maleic anhydride, and crotonic acid. Maleic acid, fumaric acid and the like can be mentioned.
  • the monomer mixture may be subjected to a radical reaction in the presence of a polymerization initiator.
  • a method of radically reacting the monomer mixture that is, a polymerization method
  • a conventionally known method is used, and examples thereof include solution polymerization (boiling point polymerization or constant temperature polymerization), emulsion polymerization, suspension polymerization, bulk polymerization and the like.
  • the weight average molecular weight (Mw) of the acrylic copolymer is not particularly limited, but the preferred lower limit is 400,000 and the preferred upper limit is 1.5 million.
  • Mw weight average molecular weight
  • the more preferable lower limit of the weight average molecular weight is 500,000, and the more preferable upper limit is 1.4 million.
  • the ratio (Mw / Mn) of the weight average molecular weight (Mw) to the number average molecular weight (Mn) of the acrylic copolymer is preferably 10.0.
  • Mw / Mn is 10.0 or less, the proportion of small molecule components is suppressed, the pressure-sensitive adhesive layer is softened at high temperatures, the bulk strength is lowered, and the adhesive strength is suppressed.
  • the adhesive tape is less likely to come off when a load is applied underneath.
  • the more preferable upper limit of Mw / Mn is 5.0, and the more preferable upper limit is 3.0.
  • the pressure-sensitive adhesive layer may contain a pressure-sensitive adhesive resin.
  • the tackifier resin include rosin ester resin, hydrogenated rosin resin, terpene resin, terpene phenol resin, Kumaron inden resin, alicyclic saturated hydrocarbon resin, C5 petroleum resin, and C9 resin. Examples thereof include petroleum resins and C5-C9 copolymerized petroleum resins. These tackifier resins may be used alone or in combination of two or more.
  • the content of the tackifier resin is not particularly limited, but the preferable lower limit is 10 parts by weight and the preferable upper limit is 60 parts by weight with respect to 100 parts by weight of the resin (for example, acrylic copolymer) which is the main component of the pressure-sensitive adhesive layer. ..
  • the content of the pressure-sensitive adhesive resin is 10 parts by weight or more, the pressure-sensitive adhesive layer can exert a high pressure-sensitive adhesive force, and the pressure-sensitive adhesive tape becomes more difficult to peel off when a load is applied at a high temperature.
  • the content of the pressure-sensitive adhesive resin is 60 parts by weight or less, it is possible to suppress a decrease in adhesive strength or tackiness due to the hardening of the pressure-sensitive adhesive layer.
  • the pressure-sensitive adhesive layer has a cross-linked structure formed between the main chains of the resin (for example, the acrylic copolymer, the pressure-sensitive adhesive resin, etc.) constituting the pressure-sensitive adhesive layer by adding a cross-linking agent.
  • a cross-linking agent for example, the acrylic copolymer, the pressure-sensitive adhesive resin, etc.
  • the above-mentioned cross-linking agent is not particularly limited, and examples thereof include an isocyanate-based cross-linking agent, an aziridine-based cross-linking agent, an epoxy-based cross-linking agent, and a metal chelate-type cross-linking agent. Of these, isocyanate-based cross-linking agents are preferable.
  • the pressure-sensitive adhesive layer By adding an isocyanate-based cross-linking agent to the pressure-sensitive adhesive layer, the isocyanate group of the isocyanate-based cross-linking agent and the alcohol in the resin constituting the pressure-sensitive adhesive layer (for example, the acrylic copolymer, the pressure-sensitive adhesive resin, etc.)
  • the pressure-sensitive adhesive layer is crosslinked by reacting with the sex hydroxylate.
  • the amount of the cross-linking agent added is preferably 0.01 to 10 parts by weight, preferably 0.1 to 7 parts by weight, based on 100 parts by weight of the resin (for example, the acrylic copolymer) which is the main component of the pressure-sensitive adhesive layer. Is more preferable.
  • the pressure-sensitive adhesive layer may contain a silane coupling agent for the purpose of improving the pressure-sensitive adhesive strength.
  • the silane coupling agent is not particularly limited, and examples thereof include epoxysilanes, acrylicsilanes, methacrylsilanes, aminosilanes, and isocyanatesilanes.
  • the pressure-sensitive adhesive layer may contain a coloring material for the purpose of imparting light-shielding properties.
  • the coloring material is not particularly limited, and examples thereof include carbon black, aniline black, and titanium oxide. Of these, carbon black is preferable because it is relatively inexpensive and chemically stable.
  • the pressure-sensitive adhesive layer may contain conventionally known particles and additives such as inorganic particles, conductive particles, antioxidants, foaming agents, organic fillers, and inorganic fillers, if necessary.
  • the preferable lower limit of the gel fraction is 10% by weight, and the preferable upper limit is 80% by weight.
  • the adhesive tape is less likely to be peeled off when a load is applied under high temperature.
  • the more preferable lower limit of the gel fraction is 20% by weight, and the more preferable upper limit is 70% by weight.
  • the gel fraction of the pressure-sensitive adhesive layer can be measured by the same method as the gel fraction of the base material.
  • the preferable lower limit of the storage elastic modulus G'in the dynamic viscoelasticity measurement at 23 ° C. is 105 Pa, and the preferable upper limit is 106 Pa.
  • the storage elastic modulus G'at 23 ° C. is within the above range, the adhesive tape is less likely to be peeled off when a load is applied under high temperature.
  • the more preferable lower limit of the storage elastic modulus G'at 23 ° C. of the pressure-sensitive adhesive layer is 2 ⁇ 10 5 Pa, and the more preferable upper limit is 8 ⁇ 10 5 Pa.
  • the storage elastic modulus G'of the pressure-sensitive adhesive layer at 23 ° C. can be adjusted by the composition of the raw material monomer of the pressure-sensitive adhesive layer.
  • the storage elastic modulus G'at 23 ° C. of the pressure-sensitive adhesive layer was set to 10 ° C./min in a constant-speed temperature rise tension mode using a viscoelasticity spectrometer (for example, DVA-200 manufactured by IT Measurement Control Co., Ltd.). It can be obtained as the storage elastic modulus at 23 ° C. when the dynamic viscoelasticity spectrum at ⁇ 40 to 140 ° C. is measured under the condition of 10 Hz.
  • a viscoelasticity spectrometer for example, DVA-200 manufactured by IT Measurement Control Co., Ltd.
  • the thickness of the pressure-sensitive adhesive layer is not particularly limited, but a preferable lower limit is 0.01 mm, a preferable upper limit is 0.1 mm, a more preferable lower limit is 0.015 mm, and a more preferable upper limit is 0.09 mm.
  • a preferable lower limit is 0.01 mm
  • a preferable upper limit is 0.1 mm
  • a more preferable lower limit is 0.015 mm
  • a more preferable upper limit is 0.09 mm.
  • the adhesive tape of the present invention may further have a resin layer laminated on at least one surface of the base material.
  • the resin layer may be laminated on only one surface of the base material or may be laminated on both sides, but it is preferable that the resin layer is laminated on only one surface of the base material.
  • the resin constituting the resin layer preferably has heat resistance.
  • the resin constituting the heat-resistant resin layer include polyester resins such as polyethylene terephthalate, acrylic resins, silicone resins, phenol resins, polyimides, and polycarbonates. Among them, acrylic resin and polyester resin are preferable, and polyethylene terephthalate is more preferable, because an adhesive tape having excellent flexibility can be obtained.
  • the resin layer may be colored.
  • coloring the resin layer it is possible to impart light-shielding properties to the adhesive tape.
  • the method of coloring the resin layer is not particularly limited, and for example, a method of kneading particles such as carbon black or titanium oxide or fine bubbles into the resin constituting the resin layer, or applying ink to the surface of the resin layer. The method and the like can be mentioned.
  • the resin layer may contain conventionally known particles and additives such as inorganic particles, conductive particles, plasticizers, tackifiers, ultraviolet absorbers, antioxidants, foaming agents, organic fillers, and inorganic fillers, if necessary. May be contained.
  • the thickness of the resin layer is not particularly limited, but the preferred lower limit is 5 ⁇ m and the preferred upper limit is 100 ⁇ m.
  • the thickness of the resin layer is not particularly limited, but the preferred lower limit is 5 ⁇ m and the preferred upper limit is 100 ⁇ m.
  • the more preferable lower limit of the thickness of the resin layer is 10 ⁇ m, and the more preferable upper limit is 70 ⁇ m.
  • the thickness of the entire adhesive tape of the present invention is not particularly limited, but a preferable lower limit is 0.04 mm, a more preferable lower limit is 0.05 mm, a preferable upper limit is 2 mm, and a more preferable upper limit is 1.5 mm.
  • a preferable lower limit is 0.04 mm
  • a more preferable lower limit is 0.05 mm
  • a preferable upper limit is 2 mm
  • a more preferable upper limit is 1.5 mm.
  • the shape of the adhesive tape of the present invention is not particularly limited, and examples thereof include a rectangle, a square, a frame shape, a circle shape, an ellipse shape, and a donut shape.
  • the method for producing the adhesive tape of the present invention is not particularly limited, and examples thereof include the following methods. First, a pressure-sensitive adhesive solution is applied to a release film and dried to form a pressure-sensitive adhesive layer. Next, an unfoamed base material is manufactured, and a resin layer is laminated on the unfoamed base material to form a laminated body. Then, an adhesive layer is attached to both sides of the obtained laminate, and the unfoamed base material is foamed by heating to form a foam base material, and an adhesive tape is manufactured.
  • the use of the adhesive tape of the present invention is not particularly limited, but since it is an adhesive tape having excellent heat retention and heat retention that is difficult to peel off when a load is applied under high temperature, it can be used for portable electronic device parts, in-vehicle electronic device parts, and the like. It is preferably used for assembling or fixing electronic device parts.
  • an adhesive tape having excellent heat retention and holding property, which is difficult to peel off when a load is applied at a high temperature.
  • Example 1 Production of unfoamed base material 0.902 g of 1,6-hexanedithiol, 1.83 g of carbon disulfide, and 11 mL of dimethylformamide were placed in a two-necked flask and stirred at 25 ° C. To this, 2.49 g of triethylamine was added dropwise over 15 minutes, and the mixture was stirred at 25 ° C. for 3 hours. Then, 2.75 g of methyl- ⁇ -bromophenylacetic acid was added dropwise over 15 minutes, and the mixture was stirred at 25 ° C. for 4 hours.
  • the blending amount of the mixture was adjusted so that the content of the hard block in the obtained block copolymer was 3% by weight and the content of the soft block was 97% by weight.
  • a part of the reaction solution is collected, 4000 parts by weight of n-hexane is added thereto, and the mixture is stirred to precipitate the reaction product, and then the unreacted monomers (MA, BA, AAc) and the solvent are filtered to react.
  • the product was dried under reduced pressure at 70 ° C. to obtain a block copolymer.
  • the weight average molecular weight of the obtained block copolymer was measured by the GPC method and found to be 391,000.
  • "2690 Separations Module" manufactured by Water Co., Ltd.
  • the obtained block copolymer was dissolved in ethyl acetate so that the solid content was 35%.
  • 3.3 parts by weight of Expandel 461-DU-40 (461DU40) manufactured by Nippon Philite
  • Tetrad C epoxy-based cross-linking
  • Agent manufactured by Mitsubishi Gas Chemical Company, Ltd. 0.16 parts by weight was added at a solid content ratio and further sufficiently stirred to obtain a substrate solution.
  • the obtained base material solution was applied onto one side of a 23 ⁇ m polyethylene terephthalate (PET) film having corona treatment on both sides as a resin layer, and dried at 90 ° C. for 7 minutes to obtain an unfoamed base material and a resin. A laminate with the layer was obtained.
  • PET polyethylene terephthalate
  • the obtained adhesive solution was applied with a doctor knife so that the thickness of the dry film was 75 ⁇ m, and 110 The coating solution was dried by heating at ° C. for 5 minutes to obtain a pressure-sensitive adhesive layer.
  • Another pressure-sensitive adhesive layer was manufactured by the same operation. Then, the pressure-sensitive adhesive layer was laminated on each surface of the laminate of the unfoamed base material and the resin layer obtained above to obtain a laminate.
  • the unfoamed substrate is allowed to stand in an environment of 40 ° C. for 48 hours, removed from the environment at 40 ° C. after 48 hours, and heated at 130 ° C. for 1 minute to foam the unfoamed substrate to form a foamed substrate (thickness 127 ⁇ m), which is an adhesive tape.
  • the S component is Gaussian type, M component and L in the relaxation curve obtained at 25 ° C according to the product manual.
  • the components used were the exponential type, and all the relaxation curves obtained at 85 ° C. were fitted with the exponential type.
  • the following formulas were used for fitting at 25 ° C and 85 ° C, respectively.
  • w1 to w3 are Weibull coefficients. At 25 ° C, w1 takes a value of 2 and w2 and w3 take a value of 1.
  • A1 is the S component
  • B1 is the M component
  • C1 is the L component ratio
  • T2A is the S component
  • T2B is the M component
  • T2C is the L component.
  • t is time.
  • w1 and 2 take a value of 1.
  • A1 is the component ratio of the S component
  • B1 is the component ratio of the L component
  • T2A is the relaxation time of the S component
  • T2B is the relaxation time of the L component.
  • t is time.
  • Examples 2 to 9, Comparative Examples 1 to 2 An adhesive tape was obtained in the same manner as in Example 1 except that the base material and the resin layer were changed as shown in Table 1.
  • a copolymer was obtained by a one-step synthetic reaction (random copolymerization) using only ABN-E without using a RAFT agent.
  • Comparative Example 2 a 30% toluene solution of Septon 2063 (styrene-ethylene-propylene-styrene block polymer resin, manufactured by Kuraray Co., Ltd.) was used, and Tetrad C (epoxy-based cross-linking agent, manufactured by Mitsubishi Gas Chemical Company, Inc.) was used as a cross-linking agent. was not added.
  • the raw materials in the table are as follows.
  • Foaming agent (foaming particles)
  • Advansel EML101 manufactured by Sekisui Chemical Co., Ltd., the heating and foaming process of the unfoamed substrate was performed at 150 ° C. for 1 minute
  • Evaluation of heat retention (holding power test) 1 and 2 show a diagram schematically showing a holding force test of the adhesive tape.
  • one surface (surface) of the test piece 1 having an adhesive tape size of 25 mm ⁇ 25 mm is attached to the SUS plate 2 and the other side of the test piece 1 is attached.
  • a 2 kg rubber roller was reciprocated once from the front surface (back surface) side at a speed of 300 mm / min.
  • the aluminum plate 3 is attached to the back surface of the test piece 1, pressed from the side of the aluminum plate 3 with a weight of 0.5 kg for 10 seconds to be crimped, and then left in an environment of 23 ° C. and 50% relative humidity for 24 hours.
  • a sample for holding force test was prepared.
  • a 1 kg weight 4 is attached to one end of the aluminum plate 3 so that a load is applied horizontally to the test piece 1 and the aluminum plate 3 at 85 ° C. for the holding force test sample, and the amount of deviation of the weight after 1 hour ( The deviation length) was measured.
  • ⁇ when the amount of deviation was larger than 0 mm and less than 1 mm the amount of deviation was 1 mm or more, or the adhesive tape fell off.
  • the case was set to x.
  • an adhesive tape having excellent heat retention and holding property, which is difficult to peel off when a load is applied at a high temperature.
  • Test piece (adhesive tape) 2 SUS plate 3 Aluminum plate 4 Weight (1 kg)

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L'objectif de la présente invention est de fournir un ruban adhésif qui présente une excellente conservation de sa résistance à la chaleur et qui ne se décolle pas facilement lorsqu'il est soumis à des contraintes à température élevée. La présente invention concerne un ruban adhésif qui comprend un substrat et une couche adhésive qui est stratifiée sur au moins une surface du substrat, le temps de relaxation (TL25) du composant L comme mesuré par le procédé d'écho de Hahn à 25 °C par RMN impulsionnelle ne dépassant pas 0,9 milliseconde. La présente invention concerne également un ruban adhésif qui comprend un substrat et une couche adhésive qui est stratifiée sur au moins une surface du substrat, le temps de relaxation (TL85) du composant L comme mesuré par le procédé d'écho de Hahn à 85 °C par RMN impulsionnelle ne dépassant pas 3,3 millisecondes.
PCT/JP2021/039822 2020-10-28 2021-10-28 Ruban adhésif WO2022092201A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202180058188.3A CN116096829A (zh) 2020-10-28 2021-10-28 粘合带
JP2022507716A JPWO2022092201A1 (fr) 2020-10-28 2021-10-28
KR1020237000292A KR20230092862A (ko) 2020-10-28 2021-10-28 점착 테이프

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020180950 2020-10-28
JP2020-180950 2020-10-28

Publications (1)

Publication Number Publication Date
WO2022092201A1 true WO2022092201A1 (fr) 2022-05-05

Family

ID=81383353

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/039822 WO2022092201A1 (fr) 2020-10-28 2021-10-28 Ruban adhésif

Country Status (4)

Country Link
JP (1) JPWO2022092201A1 (fr)
KR (1) KR20230092862A (fr)
CN (1) CN116096829A (fr)
WO (1) WO2022092201A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016037592A (ja) * 2014-08-11 2016-03-22 積水化学工業株式会社 アクリル粘着剤及び電子機器用粘着シート
JP2016183275A (ja) * 2015-03-26 2016-10-20 積水化学工業株式会社 粘着剤組成物及び粘着テープ
JP2020012106A (ja) * 2018-07-04 2020-01-23 積水化学工業株式会社 両面粘着テープ
WO2020218430A1 (fr) * 2019-04-24 2020-10-29 積水化学工業株式会社 Ruban adhésif sensible à la pression

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009242541A (ja) 2008-03-31 2009-10-22 Sekisui Chem Co Ltd 衝撃吸収テープ
JP5249625B2 (ja) 2008-04-15 2013-07-31 積水化学工業株式会社 表示装置前板用粘着シート

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016037592A (ja) * 2014-08-11 2016-03-22 積水化学工業株式会社 アクリル粘着剤及び電子機器用粘着シート
JP2016183275A (ja) * 2015-03-26 2016-10-20 積水化学工業株式会社 粘着剤組成物及び粘着テープ
JP2020012106A (ja) * 2018-07-04 2020-01-23 積水化学工業株式会社 両面粘着テープ
WO2020218430A1 (fr) * 2019-04-24 2020-10-29 積水化学工業株式会社 Ruban adhésif sensible à la pression

Also Published As

Publication number Publication date
CN116096829A (zh) 2023-05-09
JPWO2022092201A1 (fr) 2022-05-05
KR20230092862A (ko) 2023-06-26

Similar Documents

Publication Publication Date Title
JP6966650B2 (ja) 粘着テープ
JP5517015B1 (ja) 粘着テープ
JP5582327B2 (ja) 耐油性両面粘着テープ
JP5048994B2 (ja) 粘着剤組成物および光学機能性フィルム
JP7036715B2 (ja) 両面粘着テープ
KR20140019759A (ko) 양면 점착 시트 및 휴대 전자 기기
JP2019512028A (ja) 感圧接着ストリップ
JP2019523720A (ja) 感圧接着ストリップ
JPWO2005111167A1 (ja) 粘着剤組成物
TWI819096B (zh) 雙面黏著帶
JPWO2011118182A1 (ja) アクリル系粘着テープ
TW201819577A (zh) 光學透明黏著劑組成物、包括該組成物之光學透明黏著性膜、及平板顯示器
JP2010126707A (ja) 光学部材用プロテクトフィルム
WO2022092201A1 (fr) Ruban adhésif
EP3492543A1 (fr) Feuille adhésive sensible à la pression
WO2022219969A1 (fr) Composition adhésive et feuille adhésive
WO2022092149A1 (fr) Ruban adhésif sensible à la pression
WO2022092199A1 (fr) Ruban adhésif
JP2022071863A (ja) 粘着テープ
JP2022071864A (ja) 粘着テープ
JP2022071845A (ja) 粘着テープ
TWI833947B (zh) 黏著帶
JP2022071862A (ja) 粘着テープ
JP7211457B1 (ja) フレキシブル画像表示装置用粘着シート、フレキシブル画像表示装置用積層体及び、フレキシブル画像表示装置。
JP6867164B2 (ja) 着色粘着テープ、及び、携帯電子機器部品固定用着色粘着テープ

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2022507716

Country of ref document: JP

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21886318

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21886318

Country of ref document: EP

Kind code of ref document: A1