WO2022083315A1 - 触控显示面板及其制备方法、显示装置 - Google Patents

触控显示面板及其制备方法、显示装置 Download PDF

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Publication number
WO2022083315A1
WO2022083315A1 PCT/CN2021/116369 CN2021116369W WO2022083315A1 WO 2022083315 A1 WO2022083315 A1 WO 2022083315A1 CN 2021116369 W CN2021116369 W CN 2021116369W WO 2022083315 A1 WO2022083315 A1 WO 2022083315A1
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WIPO (PCT)
Prior art keywords
layer
display panel
edge
touch display
base substrate
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PCT/CN2021/116369
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English (en)
French (fr)
Inventor
张元其
文平
张顺
曾扬
王威
王裕
张毅
罗昶
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US18/025,448 priority Critical patent/US20230325016A1/en
Publication of WO2022083315A1 publication Critical patent/WO2022083315A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to a touch display panel, a preparation method thereof, and a display device.
  • the touch film layer is prone to film peeling (peeling), which leads to the scrapping of the entire substrate mother board, which reduces the production yield and Increased product cost.
  • the purpose of the present disclosure is to provide a touch display panel and a manufacturing method thereof, so as to improve the yield of the touch display panel.
  • a touch display panel comprising:
  • a display device layer arranged on one side of the base substrate
  • the touch function layer is arranged on the side of the display device layer away from the base substrate; wherein, the touch function layer includes an inorganic dielectric layer and an organic protective layer that are sequentially stacked on the display device layer;
  • the orthographic projection of at least part of the edge of the inorganic dielectric layer on the base substrate is located within the orthographic projection of the organic protective layer on the base substrate.
  • the touch function layer further includes a first electrode layer and a second electrode layer;
  • the inorganic dielectric layer includes a dielectric buffer layer and a dielectric insulating layer;
  • the dielectric buffer layer, the first electrode layer, the dielectric insulating layer, the second electrode layer and the organic protective layer are sequentially stacked and disposed on the side of the display device layer away from the base substrate.
  • the orthographic projection of the inorganic dielectric layer on the base substrate is located within the orthographic projection of the organic protective layer on the base substrate.
  • any point on the edge of the orthographic projection of the inorganic dielectric layer on the base substrate is the same as the orthographic projection of the organic protective layer on the base substrate.
  • the minimum value of the distance between any points on the edge is not less than 80 microns.
  • an edge of the organic protective layer is close to an edge of the touch display panel, and there is a gap between the organic protective layer and the edge of the touch display panel.
  • the display device layer includes an organic material layer; the peripheral region of the touch display panel includes a first region;
  • the edge of the organic material layer is within the edge of the inorganic dielectric layer.
  • the display device layer further includes an inorganic insulating layer, and the organic material layer is located on a side of the inorganic insulating layer away from the base substrate;
  • the edge of the organic material layer is within the edge of the inorganic insulating layer, the portion of the inorganic insulating layer beyond the organic material layer and the portion of the inorganic dielectric layer beyond the organic material layer Some direct connections.
  • the crack barrier area in the first region, between the edge of the inorganic dielectric layer and the edge of the touch display panel, there is an extension along the edge extending direction of the touch display panel.
  • the inorganic insulating layer covers the crack blocking region, and a groove extending along the edge extending direction of the touch display panel is provided in the crack blocking region; the organic protective layer Cover the crack stop region.
  • the peripheral area of the touch display panel further includes a second area
  • the edge of the touch display panel is arc-shaped, and the organic material layer extends to the edge of the touch display panel.
  • the peripheral area of the touch display panel further includes a bendable area
  • the organic material layer covers the bendable area, and the inorganic dielectric layer and the organic protective layer are hollowed out in the bendable area; wherein, the organic protective layer is close to the edge of the bendable area , located between the edge of the inorganic dielectric layer close to the bendable region and the bendable region.
  • the touch display panel is provided with a through hole, and the orthographic projection of the organic protective layer on the base substrate surrounds the through hole on the base substrate outside the orthographic projection on.
  • a touch display panel including:
  • the display device layer includes an organic material layer
  • the touch function layer is disposed on the side of the display device layer away from the base substrate; the touch function layer includes an inorganic dielectric layer;
  • the edge of the organic material layer is within the edge of the inorganic dielectric layer.
  • a display device including the above touch display panel.
  • a preparation method of a touch display panel comprising:
  • a touch function layer is formed on the side of the display device layer away from the base substrate, and the touch function layer includes an inorganic dielectric layer and an organic protective layer sequentially stacked on the display device layer; the inorganic dielectric layer
  • the orthographic projection of at least part of the edge of the layer on the base substrate is located within the orthographic projection of the organic protective layer on the base substrate.
  • forming the touch function layer on the side of the display device layer away from the base substrate includes:
  • the inorganic dielectric layer and the organic protective layer are formed on the side of the display device layer away from the base substrate, so that the orthographic projection of the inorganic dielectric layer on the base substrate is located on the organic protective layer within the orthographic projection on the base substrate.
  • the peripheral area of the touch display panel includes a first area
  • Forming a display device layer on one side of the base substrate includes:
  • Forming the touch function layer on the side of the display device layer away from the base substrate includes:
  • the inorganic dielectric layer is formed in the first region such that the edge of the organic material layer is within the edge of the inorganic dielectric layer.
  • forming a display device layer on one side of the base substrate further includes:
  • the organic material layer is located on a side of the inorganic insulating layer away from the base substrate; and in the first region, the edge of the organic material layer is located at the within the edge of the inorganic insulating layer;
  • Forming the touch function layer on the side of the display device layer away from the base substrate further includes:
  • the portion of the inorganic insulating layer beyond the organic material layer is directly connected to the portion of the inorganic dielectric layer beyond the organic material layer.
  • the touch display panel in the first region, has cracks that are close to an edge of the touch display panel and extend along an extension direction of the edge of the touch display panel barrier area;
  • Forming the display device layer on one side of the base substrate further includes:
  • the inorganic insulating layer in the first region, covers the crack blocking region, and in the crack blocking region, there are provided extending along the edge extending direction of the touch display panel. the groove;
  • Forming the touch function layer on the side of the display device layer away from the base substrate further includes:
  • the organic protective layer is formed, in the first region, the organic protective layer is made to cover the crack blocking region.
  • the peripheral area of the touch display panel further includes a second area, and the edge of the touch display panel in the second area is arc-shaped;
  • Substrates provided include:
  • the substrate motherboard includes a plurality of substrate substrates of the touch display panel and a dicing channel region surrounding each of the substrate substrates;
  • Forming a display device layer on one side of the base substrate includes:
  • An organic material layer of each of the touch display panels is formed on the substrate motherboard, and the organic material layer also extends and covers a portion of the cut channel region close to the second region;
  • Forming the touch function layer on the side of the display device layer away from the base substrate includes:
  • the edge of the inorganic dielectric layer does not reach the edge of the touch display panel.
  • the peripheral area of the touch display panel further includes a bendable area
  • Forming a display device layer on one side of the base substrate includes:
  • the organic material layer When forming the organic material layer of the display device layer, the organic material layer covers the bendable region;
  • Forming the touch function layer on the side of the display device layer away from the base substrate includes:
  • the touch function layer so that the inorganic dielectric layer and the organic protective layer are hollowed out in the bendable area; wherein, the organic protective layer is close to the edge of the bendable area and located in the inorganic
  • the dielectric layer is adjacent to the edge of the bendable region and between the bendable region.
  • the touch display panel and the manufacturing method thereof provided by the present disclosure can avoid or reduce the intrusion of water vapor into the junction of the inorganic dielectric layer and the display device layer during the preparation of the touch function layer, thereby avoiding the yield caused by peeling of the touch function layer. decrease, thereby improving the fabrication yield of the touch display panel.
  • FIG. 1 is a photo of peeling off a touch function layer of a touch display panel in the related art.
  • FIG. 2 is a schematic flowchart of a manufacturing method of a touch display panel according to an embodiment of the present disclosure.
  • FIG. 3 is a schematic structural diagram of a touch display panel in a display area according to an embodiment of the present disclosure.
  • FIG. 4 is a schematic diagram of forming a dielectric buffer layer according to an embodiment of the present disclosure.
  • FIG. 5 is a schematic diagram of forming a first electrode layer according to an embodiment of the present disclosure.
  • FIG. 6 is a schematic diagram of forming a dielectric insulating layer according to an embodiment of the present disclosure.
  • FIG. 7 is a schematic diagram of forming a second electrode layer according to an embodiment of the present disclosure.
  • FIG. 8 is a schematic top-view structural diagram of a touch display panel according to an embodiment of the present disclosure.
  • FIG. 9 is a schematic top-view structural diagram of a substrate mother board according to an embodiment of the present disclosure.
  • FIG. 10 is a schematic top-view structural diagram of the substrate mother board before the touch display panel is not cut according to an embodiment of the present disclosure.
  • FIG. 11 is a schematic cross-sectional view of the FF' position in FIG. 10 in an embodiment of the present disclosure.
  • FIG. 12 is a schematic cross-sectional view of the FF' position in FIG. 10 in an embodiment of the present disclosure.
  • FIG. 13 is a schematic cross-sectional view of the position of EE' in FIG. 10 in an embodiment of the present disclosure.
  • FIG. 14 is a schematic cross-sectional view of the position of EE' in FIG. 10 in an embodiment of the present disclosure.
  • FIG. 15 is a schematic view of the sectional structure at the QQ' position in FIG. 8 .
  • FIG. 16 is a schematic top-view structural diagram of the substrate mother board before the touch display panel is not cut according to an embodiment of the present disclosure, and the touch display panel may have through holes.
  • FIG. 17 is a schematic cross-sectional view of the PP' position in FIG. 16 , in which only the relative positions of the supporting substrate, the base substrate, the inorganic insulating layer, the organic material layer, the inorganic dielectric layer and the organic protective layer are shown. relation.
  • FIG. 18 is a schematic flowchart of a manufacturing method of a touch display panel according to an embodiment of the present disclosure.
  • 100 base substrate; 200, display device layer; 201, organic material layer; 202, inorganic insulating layer; 211, buffer material layer; 212, semiconductor layer; 213, gate insulating layer; 214, gate electrode layer; 215, Interlayer dielectric layer; 216, source-drain metal layer; 217, planarization layer; 221, pixel electrode layer; 222, pixel definition layer; 223, support pillar layer; 224, organic light-emitting functional layer; 225, common electrode layer; 231 232, organic packaging layer; 233, second inorganic packaging layer; 300, touch function layer; 301, inorganic dielectric layer; 311, dielectric buffer layer; 312, first electrode layer; 313, dielectric insulating layer; 314, second electrode layer; 315, organic protective layer; 400, substrate mother board; 401, cutting channel region; 402, supporting substrate; A, display region; B, peripheral region; 501, first region 5011, crack blocking area; 5012, trench; 5013, crack dam; 502, second area; 503, third area;
  • Example embodiments will now be described more fully with reference to the accompanying drawings.
  • Example embodiments can be embodied in various forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art.
  • the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of the embodiments of the present disclosure.
  • the touch function layer is prone to film layer peeling.
  • the touch function layer is peeled off at the M position.
  • the entire production chamber will be polluted, leading to the scrapping of the entire substrate mother board (eg, a full-face glass substrate), which greatly reduces the production capacity and increases the production cost.
  • the inventor has conducted in-depth research on this problem, combined with a large number of process analysis and verification, and found that the bonding force between the inorganic dielectric layer in the touch function layer and the organic material layer in the display panel is poor; in the FMLOC process, the display panel has poor adhesion. After the organic material layer absorbs moisture, the bonding force with the inorganic dielectric layer in the touch functional layer will be further reduced, thereby causing the touch functional layer to peel off.
  • the present disclosure provides a preparation method of a touch display panel. As shown in FIG. 2 , the preparation method of the touch display panel includes:
  • Step S110 referring to FIG. 3, providing a base substrate 100;
  • Step S120 referring to FIG. 3, forming a display device layer 200 on one side of the base substrate 100;
  • a touch function layer 300 is formed on the side of the display device layer 200 away from the base substrate 100 .
  • the touch function layer 300 includes an inorganic dielectric layer 301 and an organic protective layer sequentially stacked on the display device layer 200 315. 11 to 15 and FIG. 17 , the orthographic projection of at least part of the edge of the inorganic dielectric layer 301 on the base substrate 100 is located within the orthographic projection of the organic protective layer 315 on the base substrate 100 .
  • the organic protective layer 315 when forming the touch function layer 300 , at least part of the edge of the inorganic dielectric layer 301 can be covered by the organic protective layer 315 . That is, the junction between the inorganic dielectric layer 301 and the display device layer 200 is at least partially covered with the organic protective layer 315 , and the organic protective layer 315 can block external water vapor and reduce the intrusion of external water vapor between the inorganic dielectric layer 301 and the display device layer 200 . Therefore, the risk of peeling of the inorganic dielectric layer 301 from the display device layer 200 can be reduced.
  • the organic protective layer 315 can effectively balance the stress of the inorganic dielectric layer 301 to prevent the inorganic dielectric layer 301 from peeling off under the action of stress, and further reduce the risk of peeling off of the touch functional layer 300 .
  • the manufacturing method of the touch display panel has high production yield, which can improve the production capacity of the touch display panel and reduce the cost of the touch display panel.
  • the prepared touch display panel may include a substrate substrate 100, a display device layer 200 and a touch function layer 300 stacked in sequence; wherein, the touch function layer 300 includes sequentially stacked layers.
  • a base substrate 100 may be provided.
  • the base substrate 100 may be the base substrate 100 of an inorganic material or the base substrate 100 of an organic material.
  • the material of the base substrate 100 may be glass materials such as soda-lime glass, quartz glass, sapphire glass, etc., or may be stainless steel, aluminum, nickel, etc. metallic material.
  • the material of the base substrate 100 may be polymethyl methacrylate (PMMA), polyvinyl alcohol (PVA), polyvinyl phenol (Polyvinyl phenol, PVP), Polyethersulfone (PES), Polyimide, Polyamide, Polyacetal, Polycarbonate (PC), Polyethylene terephthalate (PET), Polyethylene naphthalate (PEN) or a combination thereof.
  • the base substrate 100 may also be a flexible base substrate 100 , for example, the material of the base substrate 100 may be polyimide (PI).
  • the base substrate 100 may also be a composite of multiple layers of materials.
  • the base substrate 100 may include a bottom film layer (Bottom Film), a pressure-sensitive adhesive layer, A first polyimide layer and a second polyimide layer.
  • a removable support substrate 402 may also be provided on the side of the base substrate 100 away from the display device layer 200 . After the preparation of the touch display panel is completed, the support substrate 402 can be removed.
  • the base substrate 100 may be a flexible base substrate 100, such as a polyimide base substrate 100; in step S110, the flexible base substrate 100 may be disposed on a glass supporting substrate 402 on the substrate; after the preparation of the touch display panel is completed, the glass substrate can be removed.
  • a substrate mother board 400 may be provided, and the substrate mother board 400 may include a plurality of touch display panel substrate substrates 100 and The cut channel region 401 between the base substrates 100 .
  • Each touch display panel can be prepared on the substrate mother board 400, and each touch display panel can be obtained by cutting after the preparation is completed; after the cutting, the cutting channel region 401 is removed.
  • the display device layer 200 may be formed on one side of the base substrate 100 .
  • the display device layer 200 may be formed on the side of the base substrate 100 away from the support substrate 402 .
  • the display device layer 200 may be provided with light-emitting elements distributed in an array, and the light-emitting elements may be OLED (Organic Electroluminescent Diode), PLED (Macromolecular Organic Electroluminescent Diode), LED (Light Emitting Diode), Micro LED (Micro Light Emitting Diode) Diodes), MiNi LEDs (Mini Light Emitting Diodes), or other active light-emitting components.
  • the display device layer 200 may also be provided with a driving circuit for driving each light-emitting element to emit light independently, and the driving circuit may be an active driving circuit or a passive driving circuit.
  • the display device layer 200 is further explained and illustrated by taking the touch display panel as an OLED touch display panel as an example.
  • the display device layer 200 may include a driving circuit layer, an organic light-emitting layer and a thin film encapsulation layer sequentially stacked on one side of the base substrate 100 .
  • the organic light-emitting layer is provided with OLEDs distributed in an array
  • the driving circuit layer is provided with driving circuits for driving the corresponding OLEDs
  • the thin film encapsulation layer is used to protect the OLEDs.
  • the touch display panel is a touch OLED display panel.
  • the driving circuit layer may be formed with a plurality of pixel driving circuits, and each pixel driving circuit is used for driving the corresponding OLED.
  • any pixel driving circuit may include a thin film transistor and a storage capacitor.
  • the thin film transistor can be a top gate thin film transistor, a bottom gate thin film transistor or a double gate thin film transistor; the material of the active layer of the thin film transistor can be amorphous silicon semiconductor material, low temperature polysilicon semiconductor material, metal oxide semiconductor material, organic semiconductor material or other types of semiconductor materials; the thin film transistor may be an N-type thin film transistor or a P-type thin film transistor; the present disclosure does not limit the specific type of the thin film transistor.
  • the driving circuit layer may include a semiconductor layer 212, a gate insulating layer 213, a gate layer 214, an interlayer dielectric layer 215, a source-drain metal layer 216, a planarization layer 217, etc., which are stacked between the base substrate 100 and the organic light-emitting layer.
  • each thin film transistor and storage capacitor can be formed by a semiconductor layer 212 , a gate insulating layer 213 , a gate layer 214 , an interlayer dielectric layer 215 , a source-drain metal layer 216 and other film layers. The positional relationship of each film layer can be determined according to the film layer structure of the thin film transistor.
  • the driving circuit layer may include a semiconductor layer 212, a gate insulating layer 213, a gate layer 214, an interlayer dielectric layer 215, a source-drain metal layer 216 and
  • the thin film transistor thus formed is a top-gate thin film transistor.
  • the driving circuit layer may include a gate layer 214 , a gate insulating layer 213 , a semiconductor layer 212 , an interlayer dielectric layer 215 and a source-drain metal layer, which are stacked in sequence. 216, the thus formed thin film transistor is a bottom gate type thin film transistor.
  • the driving circuit layer may also adopt a double gate layer structure, that is, the gate layer 214 may include a first gate layer and a second gate layer, and the gate insulating layer 213 may include a semiconductor layer for isolating the semiconductor layer 212 and the first gate layer. a first gate insulating layer, and a second gate insulating layer for isolating the first gate layer and the second gate layer.
  • the driving circuit layer may include a semiconductor layer 212 , a first gate insulating layer, a first gate layer, and a second gate layer, which are sequentially stacked on one side of the base substrate 100 .
  • the driving circuit layer may further include a passivation layer, and the passivation layer may be provided on the surface of the source/drain metal layer 216 away from the base substrate 100 to protect the source/drain metal layer 216 .
  • the driving circuit layer may further include a buffer material layer 211 disposed on the surface of the base substrate 100 , and the semiconductor layer 212 , the gate layer 214 and the like are all located on the side of the buffer material layer 211 away from the base substrate 100 .
  • the material of the buffer material layer 211 may be inorganic insulating materials such as silicon oxide and silicon nitride.
  • the driving circuit layer may further include a shielding layer, and the shielding layer may be located in the buffer material layer 211 to provide electromagnetic shielding effect or shading effect for at least part of the driving circuit layer, or may serve as an alignment mark.
  • the organic light-emitting layer is disposed on the side of the driving circuit layer away from the base substrate 100 , and may include a pixel electrode layer 221 , a pixel definition layer 222 , a support column layer 223 , an organic light-emitting functional layer 224 and a common electrode layer 225 that are stacked in sequence.
  • the pixel electrode layer 221 has a plurality of pixel electrodes in the display area of the touch display panel; the pixel definition layer 222 has a plurality of through pixel openings in the display area corresponding to the plurality of pixel electrodes, and any pixel opening is exposed at least a partial area of the corresponding pixel electrode.
  • the support column layer 223 includes a plurality of support columns in the display area A, and the support columns are located on the surface of the pixel definition layer 222 away from the base substrate 100 so as to support a fine metal mask (FMM) during the evaporation process.
  • the organic light-emitting functional layer 224 covers at least the pixel electrodes exposed by the pixel defining layer 222 .
  • the organic light-emitting functional layer 224 may include an organic electroluminescent material layer, and may include one of a hole injection layer, a hole transport layer, an electron blocking layer, a hole blocking layer, an electron transport layer and an electron injection layer or more.
  • Each film layer of the organic light-emitting functional layer 224 may be prepared by an evaporation process, and a fine metal mask or an open mask may be used to define the pattern of each film layer during evaporation.
  • the common electrode layer 225 may cover the organic light emitting functional layer 224 in the display area A. In this way, the pixel electrode, the common electrode layer 225 and the organic light emitting functional layer 224 between the pixel electrode and the common electrode layer 225 form an organic light emitting diode.
  • the thin film encapsulation layer may include an inorganic encapsulation layer and an organic encapsulation layer 232 which are alternately stacked.
  • the inorganic encapsulation layer can effectively block the moisture and oxygen in the outside world, so as to prevent the water and oxygen from invading the organic light-emitting functional layer 224 and causing the material to degrade.
  • the edge of the inorganic encapsulation layer may be located in the peripheral area, especially on the side of the baffle away from the display area, so as to achieve a better water-oxygen isolation effect by means of the baffle.
  • the organic encapsulation layer 232 is located between two adjacent inorganic encapsulation layers in order to achieve planarization and reduce stress between the inorganic encapsulation layers.
  • the edge of the organic encapsulation layer 232 is located between the display area A and the dam.
  • the thin film encapsulation layer includes a first inorganic encapsulation layer 231 , an organic encapsulation layer 232 and a second inorganic encapsulation layer 233 that are sequentially stacked on the side of the organic light-emitting layer away from the base substrate 100 .
  • the touch function layer 300 may be formed on the side of the display device layer 200 away from the base substrate 100 .
  • the touch function layer 300 may also include an inorganic dielectric layer 301 and an organic protective layer 315 .
  • the touch electrode layer includes a first electrode layer 312 and a second electrode layer 314 .
  • the inorganic dielectric layer 301 includes a dielectric buffer layer 311 and a dielectric insulating layer 313 .
  • the dielectric buffer layer 311 , the first electrode layer 312 , the dielectric insulating layer 313 , the second electrode layer 314 and the organic protective layer 315 are sequentially stacked on the side of the display device layer 200 away from the base substrate 100 .
  • the touch function layer 300 includes a dielectric buffer layer 311 , a first electrode layer 312 , a dielectric insulating layer 313 , a second electrode layer 314 and an organic protective layer 315 which are sequentially stacked on the side of the display device layer 200 away from the base substrate 100 . .
  • the material of the dielectric buffer layer 311 may be silicon nitride.
  • the material of the dielectric insulating layer 313 may be silicon nitride.
  • the material of the organic protective layer 315 may be polyimide.
  • the display device layer 200 includes a thin film encapsulation layer; the second inorganic encapsulation layer 233 of the thin film encapsulation layer can be multiplexed as the dielectric buffer layer 311 of the touch functional layer 300 .
  • the material of the first electrode layer 312 may be selected from metals, alloys, conductive metal oxides, conductive organic materials, or other conductive materials.
  • the first electrode layer 312 may include one layer of conductive material, or may include multiple layers of stacked conductive material. Exemplarily, in one embodiment of the present disclosure, the first electrode layer 312 may include a titanium metal layer, an aluminum metal layer, and a titanium metal layer sequentially stacked. In another embodiment of the present disclosure, the first electrode layer 312 may include an indium tin oxide layer, a silver metal layer, and an indium tin oxide layer sequentially stacked.
  • the material of the second electrode layer 314 may be selected from metals, alloys, conductive metal oxides, conductive organic materials, or other conductive materials.
  • the second electrode layer 314 may include one layer of conductive material, or may include multiple layers of stacked conductive material. Exemplarily, in one embodiment of the present disclosure, the second electrode layer 314 may include a titanium metal layer, an aluminum metal layer, and a titanium metal layer sequentially stacked. In another embodiment of the present disclosure, the second electrode layer 314 may include an indium tin oxide layer, a silver metal layer, and an indium tin oxide layer sequentially stacked.
  • At least one of the first electrode layer 312 and the second electrode layer 314 is used to form a touch electrode, so as to generate a touch signal in response to a touch action.
  • the first electrode layer 312 is formed with a plurality of first touch electrodes, and the first touch electrodes extend along the first direction;
  • the second electrode layer 314 is formed with a plurality of first touch electrodes
  • the second touch electrodes extend along the second direction, wherein the first direction and the second direction are perpendicular to each other.
  • one of the first direction and the second direction is the row direction of the touch display panel, the other is the column direction of the touch display panel, the row direction is the extending direction of the data leads in the driving circuit layer, and the row direction is The extension direction of the scan wires in the drive circuit layer.
  • the first electrode layer 312 includes a plurality of bridge leads distributed in an array;
  • the second electrode layer 314 includes a plurality of first electrodes arranged along the first direction and a plurality of The second electrodes arranged along the second direction are perpendicular to the first direction and the second direction.
  • the first electrode includes a plurality of first sub-electrodes arranged in the second direction and connected in sequence, and the second electrode includes a plurality of second sub-electrodes arranged in the first direction and connected in sequence by bridge wires.
  • the first electrode layer 312 is formed with a plurality of touch leads; the second electrode layer 314 is formed with touch electrodes distributed in an array, each touch electrode and each touch The control leads are electrically connected in one-to-one correspondence.
  • the touch function layer may be formed according to the methods shown in steps S310 to S350.
  • Step S310 referring to FIG. 4 , a dielectric buffer layer 311 is formed on the side of the second inorganic encapsulation layer 233 away from the base substrate 100 .
  • Step S320 referring to FIG. 5 , a first electrode layer 312 is formed on the side of the dielectric buffer layer 311 away from the base substrate 100 .
  • a dielectric insulating layer 313 is formed on the side of the first electrode layer 312 away from the base substrate 100.
  • the dielectric insulating layer 313 is provided with via holes exposing a partial area of the first electrode layer 312.
  • Step S340 referring to FIG. 7 , a second electrode layer 314 is formed on the side of the dielectric insulating layer 313 away from the base substrate 100 , and the second electrode layer 314 is electrically connected to the first electrode layer 312 through via holes.
  • Step S350 referring to FIG. 3 , an organic protective layer 315 is formed on the side of the second electrode layer 314 away from the base substrate 100 .
  • the inorganic dielectric layer 301 and the organic protective layer 315 may be formed on the side of the display device layer 200 away from the base substrate 100 , so that the inorganic dielectric layer 301 is on the base substrate 100 .
  • the orthographic projection is located within the orthographic projection of the organic protective layer 315 on the base substrate 100 .
  • the orthographic projection of the inorganic dielectric layer 301 on the base substrate 100 is located within the orthographic projection of the organic protective layer 315 on the base substrate 100; that is, the inorganic dielectric layer 301 is completely covered by organic
  • the protective layer 315 is covered, and the junction of the inorganic dielectric layer 301 and the display device layer 200 is completely covered by the organic protective layer 315, which can prevent water vapor from invading the junction of the inorganic dielectric layer 301 and the display device layer 200, thereby avoiding the preparation of the touch display panel.
  • the problem of peeling off of the touch function layer 300 occurs during the process.
  • any point on the edge of the orthographic projection of the inorganic dielectric layer 301 on the base substrate 100 and the edge of the orthographic projection of the organic protective layer 315 on the base substrate 100 can be made.
  • the minimum value of the distance between any point on it is not less than 80 microns.
  • the edge of the organic protective layer 315 can be made to extend beyond the edge of the inorganic dielectric layer 301 by at least 80 ⁇ m.
  • any point on the edge of the orthographic projection of the inorganic dielectric layer 301 on the base substrate 100 and the edge of the orthographic projection of the organic protective layer 315 on the base substrate 100 is not less than 80 microns.
  • the water vapor needs to pass through the junction of the organic protective layer 315 and the display device layer 200 before reaching the inorganic dielectric layer 301, and the length of the junction is at least 80 microns, which makes the The path of water vapor intrusion is elongated to at least 80 microns, so that the water vapor can hardly reach the inorganic dielectric layer 301 , thereby preventing the inorganic dielectric layer 301 from peeling off.
  • an edge of the organic protective layer 315 is close to the edge of the touch display panel, and there is a gap between the edge of the touch display panel and the edge of the touch display panel.
  • the organic protective layer 315 may not extend to the edge of the touch display panel. In this way, it is helpful for cutting or opening through holes of the touch display panel.
  • the touch display panel may include a display area A and a peripheral area B surrounding the display area A.
  • a dicing channel region 401 is also surrounded.
  • the touch display panel may also be provided with through holes and a through hole encapsulation area 5041 surrounding the through holes; in the preparation process, there is a through hole area on the base substrate for forming the through holes 504.
  • the inorganic insulating layer 202 may include a buffer material layer 211, a gate insulating layer 213, an interlayer dielectric layer 215, a passivation layer and other film layers; preferably, referring to FIG. 3, the inorganic insulating layer 202 may include the buffer material layer 211 and Interlayer dielectric layer 215 .
  • part of the organic material or all of the organic material film layers of the display device layer 200 may constitute the organic material layer 201 .
  • the organic material layer 201 may include film layers such as the planarization layer 217 , the pixel electrode layer 221 and the support pillar layer 223 ; preferably, referring to FIG. 3 , the organic material layer 201 may be the planarization layer 217 .
  • the inorganic insulating layer 202 may be thinned in the cutting channel region 401 to reduce the stress during cutting of the substrate mother board 400 and reduce the number and length of cracks. Furthermore, the portion of the inorganic insulating layer 202 in the peripheral region B close to the cutting channel region 401 can also be thinned, so as to further reduce the stress when the substrate mother board 400 is cut, and reduce the number and length of cracks.
  • the inorganic insulating layer 202 may further be provided with a groove 5012 extending along the extending direction of the edge of the touch display panel.
  • the trench 5012 enables the inorganic insulating layer 202 to be formed with a crack dam 5013 extending along the edge extending direction of the touch display panel. In this way, the crack dam 5013 and the groove 5012 can prevent the crack at the edge of the touch display panel from continuing to extend toward the display area A, thereby improving the yield and life of the touch display panel.
  • the number of crack barriers 5013 may be multiple, and the plurality of crack barriers 5013 all extend along the edge extending direction of the touch display panel, and are sequentially arranged along the direction from the display area to the edge of the touch display panel.
  • the number of crack dams 5013 is 2-6.
  • the crack dam 5013 disposed in the peripheral area B may surround the display area A.
  • the distance between the edges of the touch display panel is 100-200 microns.
  • the peripheral area B includes at least a first area 501 .
  • the edge of the organic material layer 201 is within the edge of the inorganic dielectric layer 301 .
  • the organic material layer 201 cannot reach the edge of the touch base substrate 100; in the orthographic projection.
  • step S120 the organic material layer 201 of the display device layer 200 may be formed.
  • step S130 when forming the touch function layer 300 , an inorganic dielectric layer 301 may be formed; and in the first region 501 , the edge of the organic material layer 201 is within the edge of the inorganic dielectric layer 301 .
  • the edge of the organic material layer 201 is covered by the inorganic dielectric layer 301, which makes the junction of the organic material layer 201 and the inorganic dielectric layer 301 located in the protection of the inorganic dielectric layer 301, and it is difficult for water vapor to penetrate into the two.
  • the water vapor intrusion is avoided, which reduces the bonding strength of the two, and the peeling of the inorganic dielectric layer 301 from the organic material layer 201 and thus the peeling of the touch function layer 300 is avoided.
  • the inorganic insulating layer 202 of the display device layer 200 may also be formed, and the organic material layer 201 is located on the side of the inorganic insulating layer 202 away from the base substrate 100; and in the first region 501, the organic material layer is The edge of 201 is within the edge of the inorganic insulating layer 202 .
  • step S130 when forming the inorganic dielectric layer 301 , in the first region 501 , the portion of the inorganic insulating layer 202 beyond the organic material layer 201 is directly connected to the portion of the inorganic dielectric layer 301 beyond the organic material layer 201 .
  • the organic material layer 201 is completely encapsulated between the inorganic dielectric layer 301 and the inorganic insulating layer 202 , thereby making it difficult for water vapor to invade the organic material layer 201 and cause the touch function layer 300 to peel off.
  • the inorganic dielectric layer 301 and the inorganic insulating layer 202 are both inorganic materials, which not only have greater compactness and stronger water blocking ability, but also have higher adhesion between the two, which makes the water vapor in the It is more difficult for some edge regions of the touch display panel to invade the organic material layer 201 .
  • the touch display panel has a crack blocking region 5011 which is close to the edge of the touch display panel and extends along the extending direction of the edge of the touch display panel.
  • the inorganic insulating layer 202 covers the crack blocking region 5011 and a groove extending along the edge extending direction of the touch display panel is provided in the crack blocking region 5011 Slot 5012.
  • the organic protective layer 315 is made to cover the crack blocking region 5011.
  • the first region 501 there is a crack blocking region 5011 extending along the extension direction of the edge of the touch display panel between the edge of the inorganic dielectric layer 301 and the edge of the touch display panel; in the first region 501, The inorganic insulating layer 202 covers the crack blocking region 5011 , and a trench 5012 extending along the edge extension direction of the touch display panel is disposed in the crack blocking region 5011 ; the organic protective layer 315 covers the crack blocking region 5011 .
  • the inorganic insulating layer 202 is formed with a crack barrier 5013 in the crack blocking region 5011, and the trench 5012 is filled with organic materials, so the crack barrier 5013 and the trench 5012 block cracks together Extends to the display area A side.
  • a substrate mother board 400 may be provided, and the substrate mother board 400 includes a plurality of base substrates 100 of the touch display panel and a dicing channel region 401 surrounding each of the base substrates 100 .
  • the organic material layer 201 of each touch display panel may be formed on the mother substrate 400 , and the organic material layer 201 not only exposes the cutting channel region 401 adjacent to the first region 501 , but also exposes the first region 501 Does not extend to the edge of the touch display panel. In this way, in the first region 501, there is a region where the inorganic insulating layer 202 is exposed between the organic material layer 201 and the edge of the touch display panel.
  • step S130 the edge of the inorganic dielectric layer 301 in the first region 501 is outside the edge of the organic material layer 201 , so that the inorganic dielectric layer 301 extends beyond the organic material layer 201 and is directly connected to the inorganic insulating layer 202 .
  • the edge of the organic material layer 201 is covered by the inorganic material, which further avoids the problem of water vapor intruding into the contact between the organic material layer 201 and the inorganic dielectric layer 301 in the first region 501 , and prevents the inorganic dielectric layer 301 from detaching.
  • the inorganic insulating layer 202 can be made to cover the first region 501 and extend and cover the cutting channel region 401 adjacent to the first region 501 .
  • the peripheral area B of the touch display panel may include a second area 502 , and the edge of the touch display panel in the second area 502 is arc-shaped.
  • 13 is a cross-sectional view taken along EE' of FIG. 10 in one embodiment of the present disclosure.
  • 14 is a cross-sectional view taken along EE' in FIG. 10 in another embodiment of the present disclosure.
  • a substrate mother board 400 may be provided.
  • the substrate mother board 400 includes a plurality of touch display panel base substrates 100 and cutting grooves surrounding each of the base substrates 100 Road District 401.
  • the organic material layer 201 of each touch display panel may be formed on the mother substrate 400, and the organic material layer 201 also extends and covers the portion of the cut channel region 401 close to the second region 502.
  • step S130 when forming the inorganic dielectric layer 301, in the second region 502, the edge of the inorganic dielectric layer 301 does not reach the edge of the touch display panel.
  • step S130 in the second region 502, there is an escape space between the edge of the inorganic dielectric layer 301 and the edge of the touch display panel, and the formed organic protective layer 315 can extend beyond the edge of the inorganic dielectric layer 301 and enter The avoidance space is further connected to the organic material layer 201 in the avoidance space.
  • the organic material layer 201 can balance the stress during cutting and reduce cracks in the second region 502 and the cutting channel region 401 adjacent to the second region 502
  • the generation of the cracks can also reduce the expansion of cracks, thereby improving the yield of the touch display panel.
  • the edge track of the touch display panel in the second area 502 is an arc shape.
  • an independent touch display panel can be obtained by removing the cut channel region 401 by cutting.
  • the organic material layer 201 extends to the edge of the touch display panel.
  • the portion of the organic protective layer 315 beyond the inorganic dielectric layer 301 can be directly connected to the organic material layer 201 , so that the edge of the inorganic dielectric layer 301 is covered by the organic material, which further inhibits the entry of water vapor into the inorganic dielectric layer 301 and the organic material. Connections between material layers 201 .
  • both the organic material layer 201 and the organic protective layer 315 are made of organic materials, such as polyimide materials, they can be firmly bonded, further reducing the risk of peeling of the touch functional layer 300 .
  • the inorganic insulating layer 202 may extend and cover the second region 502 , and along the touch display panel at a position close to the edge of the touch display panel
  • the groove 5012 extends in the direction of the edge extension; the groove 5012 makes the inorganic insulating layer 202 form a crack dam 5013 near the edge of the touch display panel, and the crack dam 5013 extends along the edge of the touch display panel extending in the direction, the trench 5012 is filled with the organic material of the organic material layer 201 .
  • the crack dam 5013 and the groove 5012 can block the extension of the crack to the display area A, thereby improving the yield of the touch display panel.
  • the peripheral area B of the touch display panel further includes a third area 503 ; the touch display panel has a bendable area 602 in the third area 503 .
  • step S120 when the organic material layer 201 of the display device layer is formed, the organic material layer 201 is made to cover the bendable region 602 .
  • step S130 when forming the touch functional layer 300 , the inorganic dielectric layer 201 and the organic protective layer 315 are hollowed out in the bendable region 602 ; wherein, the organic protective layer 315 is close to the edge of the bendable region 602 and located in the inorganic dielectric The layer 301 is close to the edge of the bendable area 602 and between the bendable area 602 .
  • the organic material layer 201 covers the bendable area 602, and the inorganic dielectric layer 201 and the organic protective layer 315 are hollowed out in the bendable area 602; wherein, the organic protective layer 315 is close to the bendable area
  • the edge of 602 is located between the edge of the inorganic dielectric layer 301 close to the bendable region 602 and the bendable region 602 .
  • the organic protective layer 315 and the organic material layer 201 can be directly connected, so that the edge of the inorganic dielectric layer 301 close to the bendable region 602 is covered by the organic material closed and protected. Not only that, the organic material layer 201 and the organic protective layer 315 can be firmly bonded, which further reduces the risk of peeling off of the touch function layer 300 .
  • the third area 503 may be a part of the peripheral area B for arranging source drivers, which may include different structures in different types of touch display panels.
  • the base substrate 100 of the touch display panel may be a flexible base substrate 100 .
  • the third area 503 may be provided with a fan-out area 601 that is far away from the display area A, a chip bonding area 603 connecting the lead area 605 and the circuit board.
  • Binding area 604 Fan-out leads may be provided in the fan-out area 601, and die pads may be provided in the die-bonding area 603, and some of the die pads are electrically connected to the data lines and touch lines of the display area A through the fan-out leads; Used to bind the driver chip.
  • the circuit board bonding area 604 is provided with a circuit board pad, and the connection lead area 605 is provided with a connection lead, and the circuit board binding pad can be electrically connected to part of the chip pad through the connection lead.
  • the circuit board bonding pad is used to bind the driving circuit board, so as to interact with electronic devices other than the touch display panel through the driving circuit board, for example, receiving the display signal input by the external electronic device and outputting the touch signal to the external electronic device Wait.
  • the driving circuit board may be a flexible circuit board.
  • the bending area 602 may be located in the fan-out area 601, or may pass through the fan-out area 601 along the extending direction of the scan lines of the touch display panel. In the bending region 602, the touch display panel can be bent toward the back of the touch display panel (the side away from the touch function layer 300), thereby reducing the frame of the touch display panel and increasing the screen ratio.
  • the edge of the inorganic dielectric layer 301 is located between the edge of the organic material layer 201 and the edge of the organic protective layer 315 .
  • the water vapor needs to continuously pass through the organic protective layer 315 and the inorganic dielectric layer 301 to reach the junction of the inorganic dielectric layer 301 and the organic material layer 201, which makes the path of water vapor intrusion prolonged and cannot be Intrusion into the organic material layer 201 , thereby avoiding peeling of the inorganic dielectric layer 301 .
  • the touch display panel may further include a test area 606 in the third area 503, and the test area 606 is provided with a test unit to perform acceptance testing (AT, Acceptance Testing) in the process stage, and facilitate boxing in the module stage. Testing (CT, Cell Testing).
  • the test area 606 may be disposed between the chip bonding area 603 and the bending area 602 .
  • the touch display panel is provided with through holes.
  • step S130 when the organic protective layer 315 is formed, the orthographic projection of the organic protective layer 315 on the base substrate 100 surrounds the orthographic projection of the through hole on the plane of the base substrate. In this way, in the formed touch display panel, the orthographic projection of the organic protective layer 315 on the base substrate surrounds the orthographic projection of the through hole on the plane of the base substrate. In other words, the organic protective layer 315 may not extend to the edge of the via hole.
  • the touch display panel is provided with through holes and a through hole encapsulation area 5041 surrounding the through holes; in the preparation process, the base substrate has a through hole area 504 for forming through holes.
  • the organic material layer 201 of the display device layer 200 may be formed such that the organic material layer 201 covers the via encapsulation area 5041 and the via area 504 .
  • the inorganic dielectric layer 301 may be formed in the via hole encapsulation region 5041 so that the edges of the inorganic dielectric layer 301 and the organic protective layer 315 do not reach the edge of the via hole region 504 .
  • the organic material layer 201 can balance the stress during opening and reduce the generation of cracks, and can also reduce the expansion of cracks, thereby improving the yield of the touch display panel.
  • the organic material layer 201 extends to the edge of the via hole, and there is a gap between the organic protective layer 315 and the edge of the via hole.
  • the part of the organic protective layer 315 beyond the inorganic dielectric layer 301 can be directly connected with the organic material layer 201, so that the edge of the inorganic dielectric layer 301 is covered by the organic material, which further inhibits the entry of water vapor into the inorganic dielectric layer 301 and the organic material. Connections between material layers 201 . Not only that, since both the organic material layer 201 and the organic protective layer 315 are made of organic materials, such as polyimide materials, they can be firmly bonded, further reducing the risk of peeling of the touch functional layer 300 .
  • the inorganic insulating layer 202 may be formed with a trench 5012 , the trench 5012 allows the inorganic insulating layer 202 to be formed with a crack dam 5013 to block Propagation of cracks at the edges of vias.
  • a metal material layer (not shown in FIG. 17 ) may also be formed on the upper surface of the crack dam 5013 , and the metal material layer may be provided in the same layer as the source/drain metal layer or the gate layer.
  • the crack barrier 5013 can also make the organic light-emitting layer (not shown in FIG. shown) is cut off, thereby blocking the water and oxygen intrusion channel of water and oxygen invading the display area through the through-hole encapsulation area 5041 .
  • the touch display panel includes:
  • the display device layer 200 is disposed on one side of the base substrate 100;
  • the touch function layer 300 is disposed on the side of the display device layer 200 away from the base substrate 100 ; wherein, the touch function layer 300 includes an inorganic dielectric layer 301 and an organic protective layer 315 stacked on the display device layer 200 in sequence. 11 to 15 and FIG. 17 , the orthographic projection of at least part of the edge of the inorganic dielectric layer 301 on the base substrate 100 is located within the orthographic projection of the organic protective layer 315 on the base substrate 100 .
  • the touch display panel provided by the present disclosure can be prepared according to the above-mentioned preparation method of the touch display panel, and thus has the same or similar technical effects, and will not be repeated in the present disclosure.
  • the touch function layer 300 further includes a first electrode layer 312 and a second electrode layer 314;
  • the inorganic dielectric layer 301 includes a dielectric buffer layer 311 and a dielectric insulating layer 313;
  • An electrode layer 312 , a dielectric insulating layer 313 , a second electrode layer 314 and an organic protective layer 315 are sequentially stacked and disposed on the side of the display device layer 200 away from the base substrate 100 .
  • the orthographic projection of the inorganic dielectric layer 301 on the base substrate 100 is located within the orthographic projection of the organic protective layer 315 on the base substrate 100 .
  • any point on the edge of the orthographic projection of the inorganic dielectric layer 301 on the base substrate 100 and any point on the edge of the orthographic projection of the organic protective layer 315 on the base substrate 100 The minimum value of the distance between them is not less than 80 microns.
  • the organic protective layer 315 is close to the edge of the touch display panel, and has a gap with the edge of the touch display panel.
  • the display device layer 200 includes an organic material layer 201; the peripheral region B of the touch display panel includes a first region 501;
  • the edge of the organic material layer 201 is within the edge of the inorganic dielectric layer 301 .
  • the display device layer 200 further includes an inorganic insulating layer 202, and the organic material layer 201 is located on a side of the inorganic insulating layer 202 away from the base substrate 100;
  • the edge of the organic material layer 201 is within the edge of the inorganic insulating layer 202 , and the portion of the inorganic insulating layer 202 beyond the organic material layer 201 is directly connected to the portion of the inorganic dielectric layer 301 beyond the organic material layer 201 .
  • the touch display panel in the first region 501 , has a crack blocking region 5011 that is close to the edge of the touch display panel and extends along the extending direction of the edge of the touch display panel.
  • the inorganic insulating layer 202 covers the crack blocking region 5011 and a groove 5012 extending along the edge extending direction of the touch display panel is disposed in the crack blocking region 5011 .
  • the organic protective layer 315 covers the crack blocking region 5011 .
  • the peripheral area B of the touch display panel further includes a second area 502;
  • the edge of the touch display panel is arc-shaped, and the organic material layer 201 extends to the edge of the touch display panel.
  • the peripheral area B of the touch display panel further includes a bendable area 602 .
  • the organic material layer 201 covers the bendable region 602 , and the inorganic dielectric layer 201 and the organic protective layer 315 are hollowed out in the bendable region 602 ; wherein, the organic protective layer 315 is close to the edge of the bendable region 602 and is located close to the inorganic dielectric layer 301 Between the edge of the bendable area 602 and the bendable area 602 .
  • the touch display panel is provided with through holes; the orthographic projection of the organic protective layer 315 on the base substrate surrounds the orthographic projection of the through holes on the plane of the base substrate.
  • the touch display panel provided by the embodiment of the present disclosure can be manufactured by the above-mentioned method for manufacturing a touch display panel, and the respective structures, principles and effects thereof have been described in the description of the above-mentioned method for manufacturing a touch display panel, or can be prepared according to the above-mentioned method for manufacturing a touch display panel. It can be reasonably deduced from the description of the manufacturing method of the touch display panel, which is not repeated here in the present disclosure.
  • the present disclosure provides another method for manufacturing a touch display panel.
  • the method for manufacturing a touch display panel includes:
  • Step S210 providing a base substrate 100
  • Step S220 forming a display device layer 200 on one side of the base substrate 100; the display device layer 200 includes an organic material layer 201;
  • a touch function layer 300 is formed on the side of the display device layer 200 away from the base substrate 100 , and the touch function layer 300 includes an inorganic dielectric layer 301 .
  • the edge of the organic material layer 201 is within the edge of the inorganic dielectric layer 301 .
  • the edge of the organic material layer 201 when forming the touch function layer 300 , can be within the edge of the inorganic dielectric layer 301 in at least part of the edge region. In this way, in at least part of the edge regions, the junction of the organic material layer 201 and the inorganic dielectric layer 301 is under the protection of the inorganic dielectric layer 301, so that water vapor can be prevented from intruding into the junction of the organic material layer 201 and the inorganic dielectric layer 301 in these edge regions , thereby avoiding peeling of the inorganic dielectric layer 301 .
  • the prepared touch display panel includes the base substrate 100 , the display device layer 200 and the touch function layer 300 which are stacked in sequence.
  • the display device layer 200 includes an organic material layer 201 ;
  • the touch function layer 300 includes an inorganic dielectric layer 301 ; in at least part of the edge area of the touch display panel, the edge of the organic material layer 201 is within the edge of the inorganic dielectric layer 301 .
  • the touch display panel may include a display area A and a peripheral area B surrounding the display area A.
  • the peripheral region B may include a first region 501 and a third region 503 ; in edge regions of the first region 501 and the third region 503 , the edge of the organic material layer 201 is within the edge of the inorganic dielectric layer 301 .
  • the display device layer 200 may further include an inorganic insulating layer 202, and at the edge regions of the first region 501 and the third region 503, the inorganic dielectric layer 301 and the inorganic insulating layer 202 may extend beyond the organic material layer 201 and be directly connected. In this way, in these edge regions, the edges of the organic material layer 201 are covered by the inorganic material, which prevents water vapor from invading the organic material layer 201 and peeling off the inorganic dielectric layer 301 .
  • the present disclosure also provides another touch display panel, including:
  • the display device layer 200 is disposed on one side of the base substrate 100; the display device layer 200 includes an organic material layer 201;
  • the touch function layer 300 is disposed on the side of the display device layer 200 away from the base substrate 100 ; the touch function layer 300 includes an inorganic dielectric layer 301 ; in at least part of the peripheral region B of the touch display panel, the organic material layer 201 The edge of the inorganic dielectric layer 301 is within the edge.
  • the touch display panel provided by the embodiment of the present disclosure can be manufactured by the above-mentioned method for manufacturing a touch display panel, and the respective structures, principles and effects thereof have been described in the description of the above-mentioned method for manufacturing a touch display panel, or can be prepared according to the above-mentioned method for manufacturing a touch display panel. It can be reasonably deduced from the description of the manufacturing method of the touch display panel, which is not repeated here in the present disclosure.
  • Embodiments of the present disclosure further provide a display device, where the display device includes any one of the touch display panels described in the touch display panel implementations of Embodiment 1 and Embodiment 2 above.
  • the display device may be a mobile phone screen, a tablet computer screen or other types of display devices. Since the display device has any of the touch display panels described in the above-mentioned embodiments of the touch display panel, it has the same beneficial effects, and details are not described herein again.

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Abstract

一种触控显示面板及其制备方法、显示装置，属于显示技术领域。该触控显示面板包括依次层叠的衬底基板(100)、显示器件层(200)和触控功能层(300)。触控功能层(300)包括依次层叠设置于显示器件层(200)上的无机电介质层(301)和有机保护层(315)；无机电介质层(301)的至少部分边缘在衬底基板(100)上的正投影，位于有机保护层(315)在衬底基板(100)上的正投影以内。该触控显示面板具有更好的制备良率。

Description

触控显示面板及其制备方法、显示装置
交叉引用
本公开要求于2020年10月20日提交的申请号为202011122519.9、名称为“触控显示面板及其制备方法、显示装置”的中国专利申请的优先权，该中国专利申请的全部内容通过引用全部并入本文。
技术领域
本公开涉及显示技术领域，尤其涉及一种触控显示面板及其制备方法、显示装置。
背景技术
在采用屏上柔性金属膜(FMLOC，Flexible Metal Layer on Cell)制备触控显示面板时，触控膜层容易发生膜层剥离(Peeling)而导致整个衬底母板报废，降低了生产良率并提高了产品成本。
所述背景技术部分公开的上述信息仅用于加强对本公开的背景的理解，因此它可以包括不构成对本领域普通技术人员已知的现有技术的信息。
公开内容
本公开的目的在于提供一种触控显示面板及其制备方法，提高触控显示面板的良率。
为实现上述发明目的，本公开采用如下技术方案：
根据本公开的第一个方面，提供一种触控显示面板，包括：
衬底基板；
显示器件层，设于所述衬底基板的一侧；
触控功能层，设于所述显示器件层远离所述衬底基板的一侧；其中，所述触控功能层包括依次层叠设置于所述显示器件层上的无机电介质层和有机保护层；所述无机电介质层的至少部分边缘在所述衬底基板上的正投影，位于所述有机保护层在所述衬底基板上的正投影以内。
在本公开的一种示例性实施例中，所述触控功能层还包括第一电极层和第二电极层；所述无机电介质层包括电介质缓冲层和电介质绝缘层；
所述电介质缓冲层、所述第一电极层、所述电介质绝缘层、所述第二电极层和所述有机保护层依次层叠设置于所述显示器件层远离所述衬底基板的一侧。
在本公开的一种示例性实施例中，所述无机电介质层在所述衬底基板上的正投影，位于所述有机保护层在所述衬底基板上的正投影以内。
在本公开的一种示例性实施例中，所述无机电介质层在所述衬底基板上的正投影的边缘上的任意一点，与所述有机保护层在所述衬底基板的正投影的边缘上的任意一点之间的距离的最小值不小于80微米。
在本公开的一种示例性实施例中，所述有机保护层靠近所述触控显示面板的边缘一侧的边缘，与所述触控显示面板的边缘之间具有间隙。
在本公开的一种示例性实施例中，所述显示器件层包括有机材料层；所述触控显示面板的外围区包括第一区域；
在所述第一区域，所述有机材料层的边缘在所述无机电介质层的边缘以内。
在本公开的一种示例性实施例中，所述显示器件层还包括无机绝缘层，所述有机材料层位于所述无机绝缘层远离所述衬底基板的一侧；
在所述第一区域，所述有机材料层的边缘在所述无机绝缘层的边缘以内，所述无机绝缘层超出所述有机材料层的部分与所述无机电介质层超出所述有机材料层的部分直接连接。
在本公开的一种示例性实施例中，在所述第一区域，所述无机电介质层的边缘和所述触控显示面板的边缘之间具有沿所述触控显示面板的边缘延伸方向延伸的裂纹阻隔区；
在所述第一区域，所述无机绝缘层覆盖所述裂纹阻隔区，且在所述裂纹阻隔区内设置有沿所述触控显示面板的边缘延伸方向延伸的沟槽；所述有机保护层覆盖所述裂纹阻隔区。
在本公开的一种示例性实施例中，所述触控显示面板的外围区还包括第二区域；
在所述第二区域，所述触控显示面板的边缘为弧形，所述有机材料层 延伸至所述触控显示面板的边缘。
在本公开的一种示例性实施例中，所述触控显示面板的外围区还包括可弯折区；
所述有机材料层覆盖所述可弯折区，且所述无机电介质层和所述有机保护层在所述可弯折区镂空；其中，所述有机保护层靠近所述可弯折区的边缘，位于所述无机电介质层靠近所述可弯折区的边缘与所述可弯折区之间。
在本公开的一种示例性实施例中，所述触控显示面板设置有通孔，所述有机保护层在所述衬底基板上的正投影环绕于所述通孔在所述衬底基板上的正投影以外。
根据本公开的第二个方面，提供一种触控显示面板，包括：
衬底基板；
显示器件层，设于所述衬底基板的一侧；所述显示器件层包括有机材料层；
触控功能层，设于所述显示器件层远离所述衬底基板的一侧；所述触控功能层包括无机电介质层；
在所述触控显示面板的外围区的至少部分区域，所述有机材料层的边缘在所述无机电介质层的边缘以内。
根据本公开的第三个方面，提供一种显示装置，包括上述的触控显示面板。
根据本公开的第四个方面，提供一种触控显示面板的制备方法，包括：
提供衬底基板；
在所述衬底基板的一侧形成显示器件层；
在所述显示器件层远离所述衬底基板的一侧形成触控功能层，所述触控功能层包括依次层叠于所述显示器件层上的无机电介质层和有机保护层；所述无机电介质层的至少部分边缘在所述衬底基板上的正投影，位于所述有机保护层在所述衬底基板上的正投影以内。
在本公开的一种示例性实施例中，在所述显示器件层远离所述衬底基板的一侧形成触控功能层包括：
在所述显示器件层远离所述衬底基板的一侧形成所述无机电介质层 和所述有机保护层，使得所述无机电介质层在所述衬底基板上的正投影位于所述有机保护层在所述衬底基板上的正投影以内。
在本公开的一种示例性实施例中，所述触控显示面板的外围区包括第一区域；
在所述衬底基板的一侧形成显示器件层包括：
形成所述显示器件层的有机材料层；
在所述显示器件层远离所述衬底基板的一侧形成触控功能层包括：
形成所述无机电介质层，且在所述第一区域，使得所述有机材料层的边缘在所述无机电介质层的边缘以内。
在本公开的一种示例性实施例中，在所述衬底基板的一侧形成显示器件层还包括：
形成所述显示器件层的无机绝缘层，所述有机材料层位于所述无机绝缘层远离所述衬底基板的一侧；且在所述第一区域，使得所述有机材料层的边缘在所述无机绝缘层的边缘以内；
在所述显示器件层远离所述衬底基板的一侧形成触控功能层还包括：
在形成所述无机电介质层时，在所述第一区域，使得所述无机绝缘层超出所述有机材料层的部分与所述无机电介质层超出所述有机材料层的部分直接连接。
在本公开的一种示例性实施例中，在所述第一区域，所述触控显示面板具有靠近所述触控显示面板的边缘且沿所述触控显示面板的边缘延伸方向延伸的裂纹阻隔区；
在所述衬底基板的一侧形成显示器件层还包括：
在形成所述无机绝缘层时，在所述第一区域，使得所述无机绝缘层覆盖所述裂纹阻隔区且在所述裂纹阻隔区内设置有沿所述触控显示面板的边缘延伸方向延伸的沟槽；
在所述显示器件层远离所述衬底基板的一侧形成触控功能层还包括：
在形成所述有机保护层时，在所述第一区域，使得所述有机保护层覆盖所述裂纹阻隔区。
在本公开的一种示例性实施例中，所述触控显示面板的外围区还包括第二区域，且所述触控显示面板在所述第二区域的边缘为弧形；
提供衬底基板包括：
提供衬底母板，所述衬底母板包括多个所述触控显示面板的衬底基板以及围绕各个所述衬底基板的切割沟道区；
在所述衬底基板的一侧形成显示器件层包括：
在所述衬底母板上形成各个所述触控显示面板的有机材料层，且所述有机材料层还延伸并覆盖所述切割沟道区靠近所述第二区域的部分；
在所述显示器件层远离所述衬底基板的一侧形成触控功能层包括：
在形成所述无机电介质层时，在所述第二区域，使得所述无机电介质层的边缘不抵达所述触控显示面板的边缘。
在本公开的一种示例性实施例中，所述触控显示面板的外围区还包括可弯折区；
在所述衬底基板的一侧形成显示器件层包括：
在形成所述显示器件层的有机材料层时，使得所述有机材料层覆盖所述可弯折区；
在所述显示器件层远离所述衬底基板的一侧形成触控功能层包括：
形成所述触控功能层，使得所述无机电介质层和所述有机保护层在所述可弯折区镂空；其中，所述有机保护层靠近所述可弯折区的边缘，位于所述无机电介质层靠近所述可弯折区的边缘与所述可弯折区之间。
本公开提供的触控显示面板及其制备方法，能够在制备触控功能层时避免或者减弱水汽入侵无机电介质层与显示器件层的结合处，进而可以避免触控功能层剥离而导致的良率降低，进而提高触控显示面板的制备良率。
附图说明
通过参照附图详细描述其示例实施方式，本公开的上述和其它特征及优点将变得更加明显。
图1是相关技术中触控显示面板的触控功能层剥离的照片。
图2是本公开一种实施方式的触控显示面板的制备方法的流程示意图。
图3是本公开一种实施方式的触控显示面板在显示区的结构示意图。
图4是本公开一种实施方式的形成电介质缓冲层的示意图。
图5是本公开一种实施方式的形成第一电极层的示意图。
图6是本公开一种实施方式的形成电介质绝缘层的示意图。
图7是本公开一种实施方式的形成第二电极层的示意图。
图8是本公开一种实施方式的触控显示面板的俯视结构示意图。
图9是本公开一种实施方式的衬底母板的俯视结构示意图。
图10是本公开一种实施方式的未切割触控显示面板前的衬底母板的俯视结构示意图。
图11是图10中的FF＇位置在本公开一种实施方式中的剖切结构示意图。
图12是图10中的FF＇位置在本公开一种实施方式中的剖切结构示意图。
图13是图10中的EE＇位置在本公开一种实施方式中的剖切结构示意图。
图14是图10中的EE＇位置在本公开一种实施方式中的剖切结构示意图。
图15是图8中的QQ＇位置的剖切结构示意图。
图16是本公开一种实施方式的未切割触控显示面板前的衬底母板的俯视结构示意图，该触控显示面板可以开设通孔。
图17是图16中的PP＇位置的剖切结构示意图，其中，仅仅示出了支撑基板、衬底基板、无机绝缘层、有机材料层、无机电介质层和有机保护层等膜层的相对位置关系。
图18是本公开一种实施方式的触控显示面板的制备方法的流程示意图。
图中主要元件附图标记说明如下：
100、衬底基板；200、显示器件层；201、有机材料层；202、无机绝缘层；211、缓冲材料层；212、半导体层；213、栅极绝缘层；214、栅极层；215、层间电介质层；216、源漏金属层；217、平坦化层；221、像素电极层；222、像素定义层；223、支撑柱层；224、有机发光功能层；225、公共电极层；231、第一无机封装层；232、有机封装层；233、第二无机封装层；300、触控功能层；301、无机电介质层；311、电介质缓冲层；312、第一电极层；313、电介质绝缘层；314、第二电极层；315、有机保 护层；400、衬底母板；401、切割沟道区；402、支撑基板；A、显示区；B、外围区；501、第一区域；5011、裂纹阻隔区；5012、沟槽；5013、裂纹挡坝；502、第二区域；503、第三区域；504、通孔区域；5041、通孔封装区；601、扇出区；602、弯折区；603、芯片绑定区；604、电路板绑定区；605、连接引线区；606、测试区。
具体实施方式
现在将参考附图更全面地描述示例实施例。然而，示例实施例能够以多种形式实施，且不应被理解为限于在此阐述的范例；相反，提供这些实施例使得本公开将更加全面和完整，并将示例实施例的构思全面地传达给本领域的技术人员。所描述的特征、结构或特性可以以任何合适的方式结合在一个或更多实施例中。在下面的描述中，提供许多具体细节从而给出对本公开的实施例的充分理解。
在图中，为了清晰，可能夸大了区域和层的厚度。在图中相同的附图标记表示相同或类似的结构，因而将省略它们的详细描述。
所描述的特征、结构或特性可以以任何合适的方式结合在一个或更多实施例中。在下面的描述中，提供许多具体细节从而给出对本公开的实施例的充分理解。然而，本领域技术人员将意识到，可以实践本公开的技术方案而没有所述特定细节中的一个或更多，或者可以采用其它的方法、组元、材料等。在其它情况下，不详细示出或描述公知结构、材料或者操作以避免模糊本公开的主要技术创意。
用语“一个”、“一”、“所述”用以表示存在一个或多个要素/组成部分/等；用语“包括”和“具有”用以表示开放式的包括在内的意思并且是指除了列出的要素/组成部分/等之外还可存在另外的要素/组成部分/等。用语“第一”和“第二”等仅作为标记使用，不是对其对象的数量限制。
在相关技术中，在采用FMLOC技术制备触控显示面板时，触控功能层容易发生膜层剥离。参见图1，在M位置触控功能层发生了剥离。触控功能层剥离后会污染整个生产腔室，导致整个衬底母板(例如整面玻璃基板)报废，大大降低了产能并提高了生产成本。发明人对该问题进行了深入研究，并结合大量的工艺分析和验证，发现触控功能层中的无机电介质 层与显示面板中的有机材料层结合力较差；在FMLOC工艺中，显示面板中的有机材料层吸收水分后将进一步降低与触控功能层中的无机电介质层的结合力，进而导致触控功能层剥离。
实施例一
本公开提供一种触控显示面板的制备方法，如图2所示，触控显示面板的制备方法包括：
步骤S110，参见图3，提供衬底基板100；
步骤S120，参见图3，在衬底基板100的一侧形成显示器件层200；
步骤S130，参见图3，在显示器件层200远离衬底基板100的一侧形成触控功能层300，触控功能层300包括依次层叠于显示器件层200上的无机电介质层301和有机保护层315。其中，参见图11～图15、图17，无机电介质层301的至少部分边缘在衬底基板100上的正投影，位于有机保护层315在衬底基板100上的正投影以内。
根据本公开提供的触控显示面板的制备方法，参见图11～图15、图17，在形成触控功能层300时，可以使得无机电介质层301的至少部分边缘被有机保护层315覆盖。即，无机电介质层301和显示器件层200之间的结合处至少部分覆盖有有机保护层315，该有机保护层315可以阻隔外部的水汽，降低外部水汽侵入无机电介质层301和显示器件层200之间的结合处的风险，进而可以降低无机电介质层301从显示器件层200剥离的风险。不仅如此，有机保护层315可以有效地平衡无机电介质层301的应力，避免无机电介质层301在应力作用下剥离，进一步降低触控功能层300剥离的风险。如此，该触控显示面板的制备方法具有高的生产良率，能够提高触控显示面板的产能并降低触控显示面板的成本。
根据本公开提供的触控显示面板的制备方法，所制备的触控显示面板可以包括依次层叠的衬底基板100、显示器件层200和触控功能层300；其中，触控功能层300包括依次层叠于显示器件层200上的无机电介质层301和有机保护层315；无机电介质层301的至少部分边缘在衬底基板100上的正投影，位于有机保护层315在衬底基板100上的正投影以内。
下面，结合附图对本公开提供的触控显示面板的制备方法以及所制备的触控显示面板的步骤、结构、原理和效果做进一步地解释和说明。
在步骤S110中，参见图3，可以提供一衬底基板100。衬底基板100可以为无机材料的衬底基板100，也可以为有机材料的衬底基板100。举例而言，在本公开的一种实施方式中，衬底基板100的材料可以为钠钙玻璃(soda-lime glass)、石英玻璃、蓝宝石玻璃等玻璃材料，或者可以为不锈钢、铝、镍等金属材料。在本公开的另一种实施方式中，衬底基板100的材料可以为聚甲基丙烯酸甲酯(Polymethyl methacrylate，PMMA)、聚乙烯醇(Polyvinyl alcohol，PVA)、聚乙烯基苯酚(Polyvinyl phenol，PVP)、聚醚砜(Polyether sulfone，PES)、聚酰亚胺、聚酰胺、聚缩醛、聚碳酸酯(Poly carbonate，PC)、聚对苯二甲酸乙二酯(Polyethylene terephthalate，PET)、聚萘二甲酸乙二酯(Polyethylene naphthalate，PEN)或其组合。在本公开的另一种实施方式中，衬底基板100也可以为柔性衬底基板100，例如衬底基板100的材料可以为聚酰亚胺(polyimide，PI)。衬底基板100还可以为多层材料的复合，举例而言，在本公开的一种实施方式中，衬底基板100可以包括依次层叠设置的底膜层(Bottom Film)、压敏胶层、第一聚酰亚胺层和第二聚酰亚胺层。
在一些实施方式中，参见图11～图15、图17，在衬底基板100远离显示器件层200的一侧还可以设置有可去除的支撑基板402。在完成触控显示面板的制备后，可以去除该支撑基板402。举例而言，衬底基板100可以为一柔性衬底基板100，例如可以为聚酰亚胺衬底基板100；在步骤S110中，该柔性衬底基板100可以设置于一作为支撑基板402的玻璃基板上；在完成该触控显示面板的制备后，可以去除该玻璃基板。
在本公开的一种实施方式中，在步骤S110中，参见图9，可以提供一衬底母板400，该衬底母板400可以包括多个触控显示面板的衬底基板100以及位于各个衬底基板100之间的切割沟道区401。可以在该衬底母板400上进行各个触控显示面板的制备，并在制备完成后通过切割而获得各个触控显示面板；在切割后，切割沟道区401被去除。
在步骤S120中，参见图3，可以在衬底基板100的一侧形成显示器件层200。当衬底基板100设置于支撑基板402上时，可以在衬底基板100远离支撑基板402的一侧形成显示器件层200。
该显示器件层200可以设置有阵列分布的发光元件，该发光元件可以 为OLED(有机电致发光二极管)、PLED(大分子有机电致发光二极管)、LED(发光二极管)、Micro LED(微型发光二极管)、MiNi LED(迷你发光二极管)或者其他主动发光的发光元件。该显示器件层200还可以设置有驱动各个发光元件独立发光的驱动电路，该驱动电路可以为有源驱动电路，也可以为无源驱动电路。
如下，以触控显示面板为一种OLED触控显示面板为例，对显示器件层200做进一步地解释和说明。
该显示器件层200可以包括依次层叠于衬底基板100一侧的驱动电路层、有机发光层和薄膜封装层。其中，有机发光层设置有阵列分布的OLED，驱动电路层设置有驱动对应的OLED的驱动电路，薄膜封装层用于保护OLED。如此，该触控显示面板为一种触控OLED显示面板。
驱动电路层可以形成有多个像素驱动电路，各个像素驱动电路用于驱动对应的OLED。其中，任意一个像素驱动电路可以包括有薄膜晶体管和存储电容。薄膜晶体管可以为顶栅型薄膜晶体管、底栅型薄膜晶体管或者双栅型薄膜晶体管；薄膜晶体管的有源层的材料可以为非晶硅半导体材料、低温多晶硅半导体材料、金属氧化物半导体材料、有机半导体材料或者其他类型的半导体材料；薄膜晶体管可以为N型薄膜晶体管或者P型薄膜晶体管；本公开对薄膜晶体管的具体类型不做限制。
驱动电路层可以包括层叠于衬底基板100和有机发光层之间的半导体层212、栅极绝缘层213、栅极层214、层间电介质层215、源漏金属层216和平坦化层217等。其中，各个薄膜晶体管和存储电容可以由半导体层212、栅极绝缘层213、栅极层214、层间电介质层215、源漏金属层216等膜层形成。其中，各个膜层的位置关系可以根据薄膜晶体管的膜层结构确定。举例而言，在本公开的一种实施方式中，驱动电路层可以包括依次层叠设置的半导体层212、栅极绝缘层213、栅极层214、层间电介质层215、源漏金属层216和平坦化层217，如此所形成的薄膜晶体管为顶栅型薄膜晶体管。再举例而言，在本公开的另一种实施方式中，驱动电路层可以包括依次层叠设置的栅极层214、栅极绝缘层213、半导体层212、层间电介质层215和源漏金属层216，如此所形成的薄膜晶体管为底栅型薄膜晶体管。驱动电路层还可以采用双栅极层结构，即栅极层214可以包括第一栅极层 和第二栅极层，栅极绝缘层213可以包括用于隔离半导体层212和第一栅极层的第一栅极绝缘层，以及包括用于隔离第一栅极层和第二栅极层的第二栅极绝缘层。举例而言，在本公开的一种实施方式中，驱动电路层可以包括依次层叠设置于衬底基板100一侧的半导体层212、第一栅极绝缘层、第一栅极层、第二栅极绝缘层、第二栅极层、层间电介质层215、源漏金属层216和平坦化层217。
可选地，驱动电路层还可以包括有钝化层，钝化层可以设于源漏金属层216远离衬底基板100的表面，以便保护源漏金属层216。
可选地，驱动电路层还可以包括设于衬底基板100表面的缓冲材料层211，且半导体层212、栅极层214等均位于缓冲材料层211远离衬底基板100的一侧。缓冲材料层211的材料可以为氧化硅、氮化硅等无机绝缘材料。进一步可选地，驱动电路层还可以包括有屏蔽层，屏蔽层可以位于缓冲材料层211内，用于为驱动电路层的至少部分区域提供电磁屏蔽效果或者遮光效果，或者可以作为对准标记。
有机发光层设置于驱动电路层远离衬底基板100的一侧，其可以包括依次层叠设置的像素电极层221、像素定义层222、支撑柱层223、有机发光功能层224和公共电极层225。其中，像素电极层221在触控显示面板的显示区具有多个像素电极；像素定义层222在显示区具有与多个像素电极一一对应设置的多个贯通的像素开口，任意一个像素开口暴露对应的像素电极的至少部分区域。支撑柱层223在显示区A包括多个支撑柱，且支撑柱位于像素定义层222远离衬底基板100的表面，以便在蒸镀制程中支撑精细金属掩模版(Fine Metal Mask，FMM)。有机发光功能层224至少覆盖被像素定义层222所暴露的像素电极。其中，有机发光功能层224可以包括有机电致发光材料层，以及可以包括有空穴注入层、空穴传输层、电子阻挡层、空穴阻挡层、电子传输层和电子注入层中的一种或者多种。可以通过蒸镀工艺制备有机发光功能层224的各个膜层，且在蒸镀时可以采用精细金属掩模版或者开放式掩膜板(Open Mask)定义各个膜层的图案。公共电极层225在显示区A可以覆盖有机发光功能层224。如此，像素电极、公共电极层225和位于像素电极和公共电极层225之间的有机发光功能层224形成有机发光二极管。
薄膜封装层可以包括交替层叠设置的无机封装层和有机封装层232。其中，无机封装层可以有效的阻隔外界的水分和氧气，避免水氧入侵有机发光功能层224而导致材料降解。可选地，无机封装层的边缘可以位于外围区，尤其是位于挡坝远离显示区的一侧，以便借助挡坝实现更好地水氧隔离效果。有机封装层232位于相邻的两层无机封装层之间，以便实现平坦化和减弱无机封装层之间的应力。其中，有机封装层232的边缘，位于显示区A和挡坝之间。示例性地，薄膜封装层包括依次层叠于有机发光层远离衬底基板100一侧的第一无机封装层231、有机封装层232和第二无机封装层233。
在步骤S130中，可以在显示器件层200远离衬底基板100的一侧形成触控功能层300。该触控功能层300除了包括有触控电极层以外，还可以包括有无机电介质层301和有机保护层315。
可选地，触控电极层包括第一电极层312和第二电极层314。无机电介质层301包括电介质缓冲层311和电介质绝缘层313。电介质缓冲层311、第一电极层312、电介质绝缘层313、第二电极层314和有机保护层315依次层叠于显示器件层200远离衬底基板100的一侧。如此，触控功能层300包括依次层叠于显示器件层200远离衬底基板100的一侧的电介质缓冲层311、第一电极层312、电介质绝缘层313、第二电极层314和有机保护层315。
可选地，电介质缓冲层311的材料可以为氮化硅。
可选地，电介质绝缘层313的材料可以为氮化硅。
可选地，有机保护层315的材料可以为聚酰亚胺。
在本公开的一种实施方式中，显示器件层200包括薄膜封装层；薄膜封装层的第二无机封装层233可以复用为触控功能层300的电介质缓冲层311。
第一电极层312的材料可以选自金属、合金、导电金属氧化物、导电有机材料或者其他导电材料。第一电极层312可以包括一层导电材料，也可以包括多层层叠的导电材料。示例性地，在本公开的一种实施方式中，第一电极层312可以包括依次层叠的钛金属层、铝金属层和钛金属层。在本公开的另一种实施方式中，第一电极层312可以包括依次层叠的铟锡氧 化物层、银金属层和铟锡氧化物层。
第二电极层314的材料可以选自金属、合金、导电金属氧化物、导电有机材料或者其他导电材料。第二电极层314可以包括一层导电材料，也可以包括多层层叠的导电材料。示例性地，在本公开的一种实施方式中，第二电极层314可以包括依次层叠的钛金属层、铝金属层和钛金属层。在本公开的另一种实施方式中，第二电极层314可以包括依次层叠的铟锡氧化物层、银金属层和铟锡氧化物层。
第一电极层312和第二电极层314中的至少一个用于形成触控电极，以便响应触控动作而生成触控信号。
举例而言，在本公开的一种实施方式中，第一电极层312形成有多个第一触控电极，且第一触控电极沿第一方向延伸；第二电极层314形成有多个第二触控电极，且第二触控电极沿第二方向延伸；其中，第一方向和第二方向相互垂直。优选地，第一方向和第二方向中的一个为触控显示面板的行方向，另一个为触控显示面板的列方向，行方向为驱动电路层中的数据引线的延伸方向，行方向为驱动电路层中的扫描引线的延伸方向。
再举例而言，在本公开的另一种实施方式中，第一电极层312包括阵列分布的多个桥接引线；第二电极层314包括多个沿第一方向排列的第一电极和多个沿第二方向排列的第二电极，第一方向和第二方向垂直。其中，第一电极包括多个沿第二方向排列且依次连接的第一子电极，第二电极包括多个沿第一方向排列且通过桥接引线依次连接的多个第二子电极。
再举例而言，在本公开的另一种实施方式中，第一电极层312形成有多个触控引线；第二电极层314形成有阵列分布的触控电极，各个触控电极和各个触控引线一一对应地电连接。
可选地，可以按照步骤S310～S350所示的方法形成触控功能层。
步骤S310，参见图4，在第二无机封装层233远离衬底基板100的一侧形成电介质缓冲层311。
步骤S320，参见图5，在电介质缓冲层311远离衬底基板100的一侧形成第一电极层312。
步骤S330，参见图6，在第一电极层312远离衬底基板100的一侧形成电介质绝缘层313，电介质绝缘层313设置有暴露第一电极层312的部 分区域的过孔。
步骤S340，参见图7，在电介质绝缘层313远离衬底基板100的一侧形成第二电极层314，第二电极层314通过过孔与第一电极层312电连接。
步骤S350，参见图3，在第二电极层314远离衬底基板100的一侧形成有机保护层315。
可选地，在形成触控功能层300时，可以在显示器件层200远离衬底基板100的一侧形成无机电介质层301和有机保护层315，使得无机电介质层301在衬底基板100上的正投影位于有机保护层315在衬底基板100上的正投影以内。如此，在所形成的触控显示面板中，无机电介质层301在衬底基板100上的正投影位于有机保护层315在衬底基板100上的正投影以内；即，无机电介质层301完全被有机保护层315覆盖，无机电介质层301与显示器件层200的结合处完全被有机保护层315覆盖，可以阻止水汽侵入无机电介质层301与显示器件层200的结合处，进而避免在制备触控显示面板的过程中发生触控功能层300剥离的问题。
可选地，在形成触控功能层300时，可以使得无机电介质层301在衬底基板100上的正投影的边缘上的任意一点，与有机保护层315在衬底基板100的正投影的边缘上的任意一点之间的距离的最小值不小于80微米。换言之，在形成触控功能层300时，可以使得有机保护层315的边缘超出无机电介质层301的边缘至少80微米。由此，在所形成的触控显示面板中，无机电介质层301在衬底基板100上的正投影的边缘上的任意一点，与有机保护层315在衬底基板100的正投影的边缘上的任意一点之间的距离的最小值不小于80微米。
在该触控显示面板及其制备过程中，水汽需要先穿过有机保护层315和显示器件层200的结合处才能够抵达无机电介质层301，而该结合处的长度至少为80微米，这使得水汽入侵的路径被拉长至至少80微米，使得水汽基本不能够抵达无机电介质层301，进而可以避免无机电介质层301剥离。
可选地，参见图11～图15、图17，有机保护层315靠近触控显示面板的边缘一侧的边缘，与触控显示面板的边缘之间具有间隙。换言之，有机保护层315可以不延伸至触控显示面板的边缘。如此，有助于触控显示面 板的切割或者开设通孔。
参见图8，从俯视的角度观察，触控显示面板可以包括有显示区A和围绕显示区A的外围区B。参见图9和图10，在衬底母板400上，外围区B以外还围绕有切割沟道区401。参见图17，在一些实施方式中，触控显示面板还可以设置通孔和围绕通孔的通孔封装区5041；在制备过程中，衬底基板上具有一用于形成通孔的通孔区域504。
在外围区B和通孔封装区5041等区域，显示器件层200的部分无机或者全部无机材料膜层可以组成无机绝缘层202。例如，无机绝缘层202可以包括缓冲材料层211、栅极绝缘层213、层间电介质层215、钝化层等膜层；优选地，参见图3，无机绝缘层202可以包括缓冲材料层211和层间电介质层215。在外围区B和通孔封装区5041等区域，显示器件层200的部分有机或者全部有机材料膜层可以组成有机材料层201。例如，有机材料层201可以包括平坦化层217、像素电极层221和支撑柱层223等膜层；优选地，参见图3，有机材料层201可以为平坦化层217。
在一些实施方式中，无机绝缘层202在切割沟道区401可以被减薄，以便降低衬底母板400切割时的应力，减弱裂纹的数量和长度。更进一步地，无机绝缘层202在外围区B靠近切割沟道区401的部分也可以减薄，以便进一步降低衬底母板400切割时的应力，减弱裂纹的数量和长度。
在一些实施方式中，参见图11～图15，在外围区B靠近触控显示面板的边缘的位置，无机绝缘层202还可以设置有沿触控显示面板的边缘延伸方向延伸的沟槽5012，该沟槽5012使得无机绝缘层202形成有沿触控显示面板的边缘延伸方向延伸的裂纹挡坝5013(crack dam)。如此，该裂纹挡坝5013和沟槽5012可以阻挡触控显示面板的边缘的裂纹继续向显示区A的方向延伸，提高触控显示面板的良率和寿命。
可选地，裂纹挡坝5013地数量可以为多条，多条裂纹挡坝5013均沿触控显示面板的边缘延伸方向延伸，且沿从显示区至触控显示面板的边缘的方向依次排列。示例性地，裂纹挡坝5013的数量为2～6条。
可选地，设置于外围区B的裂纹挡坝5013，可以环绕显示区A。
可选地，最靠近触控显示面板的边缘的裂纹挡坝5013，触控显示面板的边缘之间的间距为100～200微米。
在本公开的一种实施方式中，参见图8和图10，外围区B至少包括第一区域501。参见图11和图12，在该第一区域501内，有机材料层201的边缘在无机电介质层301的边缘以内。换言之，在该第一区域501内，有机材料层201不能抵达触控衬底基板100的边缘；有机材料层201在衬底基板上的正投影，在无机电介质层301在衬底基板100上的正投影内。
如此，在步骤S120中，可以形成显示器件层200的有机材料层201。在步骤S130中，在形成触控功能层300时，可以形成无机电介质层301；且在第一区域501，使得有机材料层201的边缘在无机电介质层301的边缘以内。如此，在该第一区域501，有机材料层201的边缘被无机电介质层301覆盖，这使得有机材料层201和无机电介质层301的结合处位于无机电介质层301的保护中，水汽难以侵入两者的结合处，避免了水汽入侵而导致两者的结合强度降低，避免了无机电介质层301从有机材料层201上剥离并进而导致触控功能层300剥离。
进一步地，在步骤S120中，还可以形成显示器件层200的无机绝缘层202，有机材料层201位于无机绝缘层202远离衬底基板100的一侧；且在第一区域501，使得有机材料层201的边缘在无机绝缘层202的边缘以内。在步骤S130中，在形成无机电介质层301时，在第一区域501，使得无机绝缘层202超出有机材料层201的部分与无机电介质层301超出有机材料层201的部分直接连接。如此，在该第一区域501中，有机材料层201被完全包覆于无机电介质层301和无机绝缘层202之间，进而使得水汽难以入侵有机材料层201而导致触控功能层300剥离。不仅如此，无机电介质层301和无机绝缘层202均为无机材料，不仅具有更大的致密性和更强的阻水能力，而且两者之间具有更高的粘附力，这使得水汽在该触控显示面板的部分边缘区域更难入侵有机材料层201。
进一步地，参见图12，在第一区域501，触控显示面板具有靠近触控显示面板的边缘且沿触控显示面板的边缘延伸方向延伸的裂纹阻隔区5011。在步骤S120中，在形成无机绝缘层202时，在第一区域501，使得无机绝缘层202覆盖裂纹阻隔区5011且在裂纹阻隔区5011内设置有沿触控显示面板的边缘延伸方向延伸的沟槽5012。在步骤S130中，在形成有机保护层315时，在第一区域501，使得有机保护层315覆盖裂纹阻隔区 5011。
如此，参见图12，在第一区域501，无机电介质层301的边缘和触控显示面板的边缘之间具有沿触控显示面板的边缘延伸方向延伸的裂纹阻隔区5011；在第一区域501，无机绝缘层202覆盖裂纹阻隔区5011，且在裂纹阻隔区5011内设置有沿触控显示面板的边缘延伸方向延伸的沟槽5012；有机保护层315覆盖裂纹阻隔区5011。
如此，在该第一区域501中，无机绝缘层202在裂纹阻隔区5011内形成有裂纹挡坝5013，且沟槽5012内填充有有机材料，因此该裂纹挡坝5013和沟槽5012一起阻挡裂纹向显示区A一侧延伸。
可选地，在步骤S110中，可以提供衬底母板400，衬底母板400包括多个触控显示面板的衬底基板100以及围绕各个衬底基板100的切割沟道区401。在步骤S120中，可以在衬底母板400上形成各个触控显示面板的有机材料层201，该有机材料层201不仅暴露邻近第一区域501的切割沟道区401，而且在第一区域501不延伸至触控显示面板的边缘。如此，在第一区域501，有机材料层201与触控显示面板的边缘之间存在一个暴露无机绝缘层202的区域。在步骤S130中，无机电介质层301在第一区域501的边缘在有机材料层201的边缘以外，使得无机电介质层301超出有机材料层201并与无机绝缘层202直接连接。如此，该有机材料层201的边缘被无机材料包覆，在第一区域501进一步避免了水汽侵入有机材料层201和无机电介质层301接触处问题，避免无机电介质层301脱离。进一步地，在步骤S120中，可以使得无机绝缘层202覆盖第一区域501，以及延伸并覆盖邻近第一区域501的切割沟道区401。
在本公开的一些实施方式中，参见图8和图10，触控显示面板的外围区B可以包括第二区域502，且触控显示面板在第二区域502的边缘为弧形。图13为在本公开一种实施方式中沿图10中EE＇进行剖切的剖视图。图14为在本公开另一种实施方式中沿图10中EE＇进行剖切的剖视图。
参见图10、图13和图14，在步骤S110中，可以提供衬底母板400，衬底母板400包括多个触控显示面板的衬底基板100以及围绕各个衬底基板100的切割沟道区401。在步骤S120中，可以在衬底母板400上形成各个触控显示面板的有机材料层201，且有机材料层201还延伸并覆盖切 割沟道区401靠近第二区域502的部分。在步骤S130中，在形成无机电介质层301时，在第二区域502，使得无机电介质层301的边缘不抵达触控显示面板的边缘。
如此，在步骤S130中，在第二区域502，无机电介质层301的边缘与触控显示面板的边缘之间存在一个避让空间，所形成的有机保护层315可以超出无机电介质层301的边缘并进入该避让空间，进而在该避让空间内与有机材料层201连接。
如此，在切割衬底母板400以形成各个触控显示面板时，在第二区域502以及邻近第二区域502的切割沟道区401内，有机材料层201可以平衡切割时的应力并减少裂纹的产生，还能够减弱裂纹的扩大，进而提高触控显示面板的良率。通过切割，可以获得具有弧形顶角的触控显示面板。优选地，触控显示面板在第二区域502的边缘轨迹为一圆弧形。
在该实施方式中，通过切割去除切割沟道区401，可以获得独立的触控显示面板，在第二区域502，有机材料层201延伸至触控显示面板的边缘。在该第二区域502，有机保护层315超出无机电介质层301的部分可以与有机材料层201直接连接，使得无机电介质层301的边缘被有机材料包覆，进一步抑制水汽进入无机电介质层301和有机材料层201之间的连接处。不仅如此，由于有机材料层201和有机保护层315均采用有机材料，例如均采用聚酰亚胺材料，因此两者之间可以实现牢靠地结合，进一步降低触控功能层300剥离的风险。
在本公开的一种实施方式中，参见图14，在该第二区域502，无机绝缘层202可以延伸并覆盖第二区域502，且在靠近触控显示面板的边缘的位置沿触控显示面板的边缘延伸方向延伸的沟槽5012；该沟槽5012使得无机绝缘层202在靠近触控显示面板的边缘的位置形成有裂纹挡坝5013，且该裂纹挡坝5013沿触控显示面板的边缘延伸方向延伸，沟槽5012内被有机材料层201的有机材料填充。如此，在切割衬底母板400以形成触控显示面板时，该裂纹挡坝5013和沟槽5012可以阻挡裂纹向显示区A的延伸，提高触控显示面板的良率。
在本公开的一种实施方式中，参见图8，触控显示面板的外围区B还包括第三区域503；触控显示面板在第三区域503具有可弯折区602。
参见图15，在步骤S120中，在形成显示器件层的有机材料层201时，使得有机材料层201覆盖可弯折区602。在步骤S130中，在形成触控功能层300时，使得无机电介质层201和有机保护层315在可弯折区602镂空；其中，有机保护层315靠近可弯折区602的边缘，位于无机电介质层301靠近可弯折区602的边缘与可弯折区602之间。
如此，在该第三区域503中，有机材料层201覆盖可弯折区602，且无机电介质层201和有机保护层315在可弯折区602镂空；其中，有机保护层315靠近可弯折区602的边缘，位于无机电介质层301靠近可弯折区602的边缘与可弯折区602之间。
如此，在该第三区域503中，在靠近可弯折区602的位置，有机保护层315和有机材料层201可以直接连接，进而使得无机电介质层301靠近可弯折区602的边缘被有机材料封闭和保护。不仅如此，有机材料层201和有机保护层315之间可以实现牢靠地结合，进一步降低触控功能层300剥离的风险。
可选地，第三区域503可以为外围区B的用于设置源极驱动器的部分，其在不同的触控显示面板类型中可以包括不同的结构。
举例而言，在本公开的一种实施方式中，该触控显示面板的衬底基板100可以为柔性衬底基板100。触控显示面板为COP(Chip on Panel)结构的触控显示面板，则该第三区域503可以设置有依次远离显示区A的扇出区601、芯片绑定区603连接引线区605和电路板绑定区604。在扇出区601可以设置有扇出引线，在芯片绑定区603可以设置有芯片焊盘，部分芯片焊盘通过扇出引线与显示区A的数据线和触控线电连接；芯片焊盘用于绑定驱动芯片。在电路板绑定区604设置有电路板焊盘，连接引线区605设置有连接引线，电路板绑定焊盘可以通过连接引线与部分芯片焊盘电连接。该电路板绑定焊盘用于绑定驱动电路板，以便通过驱动电路板与触控显示面板以外的电子设备进行交互，例如接收外部电子设备输入的显示信号并向外部电子设备输出触控信号等。可选地，该驱动电路板可以为柔性电路板。
该弯折区602可以位于扇出区601内，或者沿触控显示面板的扫描线延伸方向穿过该扇出区601。在该弯折区602内，该触控显示面板可以向 触控显示面板的背面(远离触控功能层300的一侧)弯折，进而减小触控显示面板的边框并提高屏占比。
进一步地，在第三区域503的边缘位置，无机电介质层301的边缘位于有机材料层201的边缘和有机保护层315的边缘之间。如此，在第三区域503的边缘位置，水汽需要连续穿过有机保护层315和无机电介质层301才能够到达无机电介质层301和有机材料层201的结合处，这使得水汽入侵的路径延长而不能侵入有机材料层201，进而避免无机电介质层301剥离。
进一步地，触控显示面板在第三区域503还可以包括有测试区606，测试区606设置有测试单元以便在工艺阶段进行验收测试(AT，Acceptance Testing)，以及便于在模组阶段进行成盒测试(CT，Cell Testing)。该测试区606可以设置于芯片绑定区603与弯折区602之间。
在本公开的另一种实施方式中，参见图16，触控显示面板设置通孔。在步骤S130中，在形成有机保护层315时，使得有机保护层315在衬底基板100上的正投影环绕于通孔在衬底基板所在平面上的正投影以外。如此，在所形成的触控显示面板中，有机保护层315在衬底基板上的正投影环绕于通孔在衬底基板所在平面上的正投影以外。换言之，有机保护层315可以不延伸至通孔的边缘。
进一步地，参见图16，触控显示面板设置通孔和围绕通孔的通孔封装区5041；在制备过程中，衬底基板上具有一用于形成通孔的通孔区域504。
参见图17，在步骤S120中，可以形成显示器件层200的有机材料层201，使得有机材料层201覆盖通孔封装区5041和通孔区域504。在步骤S130中，可以形成无机电介质层301，在通孔封装区5041，使得无机电介质层301和有机保护层315的边缘不抵达通孔区域504的边缘。如此，在通孔区域504进行开孔以形成通孔时，有机材料层201可以平衡开孔时的应力并减少裂纹的产生，还可以减弱裂纹的扩大，进而提高触控显示面板的良率。在形成通孔后，在通孔封装区5041，有机材料层201延伸至通孔的边缘，有机保护层315与通孔的边缘之间存在间隙。
在通孔封装区5041，有机保护层315超出无机电介质层301的部分可以与有机材料层201直接连接，使得无机电介质层301的边缘被有机材料 包覆，进一步抑制水汽进入无机电介质层301和有机材料层201之间的连接处。不仅如此，由于有机材料层201和有机保护层315均采用有机材料，例如均采用聚酰亚胺材料，因此两者之间可以实现牢靠地结合，进一步降低触控功能层300剥离的风险。
在本公开的一种实施方式中，参见图17，在通孔封装区5041，无机绝缘层202可以形成有沟槽5012，该沟槽5012使得无机绝缘层202形成有裂纹挡坝5013，以阻挡通孔边缘的裂纹的扩散。进一步地，在裂纹挡坝5013上表面上还可以形成有金属材料层(图17中未示出)，该金属材料层可以与源漏金属层或者栅极层同层设置。这一方面使得沟槽5012深度增加，提高防裂纹效果；另一方面，该裂纹挡坝5013还可以使得其上的有机发光层(图17中未示出)和公共电极层(图17中未示出)被隔断，进而阻断水氧通过通孔封装区5041侵入显示区的水氧入侵通道。
本公开还提供一种触控显示面板，参见图3，该触控显示面板包括：
衬底基板100；
显示器件层200，设于衬底基板100的一侧；
触控功能层300，设于显示器件层200远离衬底基板100的一侧；其中，触控功能层300包括依次层叠设置于显示器件层200的无机电介质层301和有机保护层315。参见图11～图15、图17，无机电介质层301的至少部分边缘在衬底基板100上的正投影，位于有机保护层315在衬底基板100上的正投影以内。
本公开提供的触控显示面板可以根据上述的触控显示面板的制备方法而制备，因此具有相同或者类似的技术效果，本公开在此不再赘述。
在本公开的一种实施方式中，触控功能层300还包括第一电极层312和第二电极层314；无机电介质层301包括电介质缓冲层311和电介质绝缘层313；电介质缓冲层311、第一电极层312、电介质绝缘层313、第二电极层314和有机保护层315依次层叠设置于显示器件层200远离衬底基板100的一侧。
在本公开的一种实施方式中，无机电介质层301在衬底基板100上的正投影位于有机保护层315在衬底基板100上的正投影以内。
在本公开的一种实施方式中，无机电介质层301在衬底基板100上的 正投影的边缘上的任意一点，与有机保护层315在衬底基板100的正投影的边缘上的任意一点之间的距离的最小值不小于80微米。
在本公开的一种实施方式中，参见图11～图15、图17，有机保护层315靠近触控显示面板的边缘一侧的边缘，与触控显示面板的边缘之间具有间隙。
在本公开的一种实施方式中，显示器件层200包括有机材料层201；触控显示面板的外围区B包括第一区域501；
在第一区域501，有机材料层201的边缘在无机电介质层301的边缘以内。
在本公开的一种实施方式中，显示器件层200还包括无机绝缘层202，有机材料层201位于无机绝缘层202远离衬底基板100的一侧；
在第一区域501，有机材料层201的边缘在无机绝缘层202的边缘以内，无机绝缘层202超出有机材料层201的部分与无机电介质层301超出有机材料层201的部分直接连接。
在本公开的一种实施方式中，在第一区域501，触控显示面板具有靠近触控显示面板的边缘且沿触控显示面板的边缘延伸方向延伸的裂纹阻隔区5011。在第一区域501，无机绝缘层202覆盖裂纹阻隔区5011且在裂纹阻隔区5011内设置有沿触控显示面板的边缘延伸方向延伸的沟槽5012。有机保护层315覆盖裂纹阻隔区5011。
在本公开的一种实施方式中，触控显示面板的外围区B还包括第二区域502；
在第二区域502，触控显示面板的边缘为弧形，有机材料层201延伸至触控显示面板的边缘。
在本公开的一种实施方式中，触控显示面板的外围区B还包括可弯折区602。有机材料层201覆盖可弯折区602，且无机电介质层201和有机保护层315在可弯折区602镂空；其中，有机保护层315靠近可弯折区602的边缘，位于无机电介质层301靠近可弯折区602的边缘与可弯折区602之间。
在本公开的一种实施方式中，触控显示面板设置有通孔；有机保护层315在衬底基板上的正投影环绕于通孔在衬底基板所在平面上的正投影以 外。
本公开实施例提供的触控显示面板可以通过上述的触控显示面板制备方法进行制备，其各个结构、原理和效果已经记载于上述的触控显示面板的制备方法的描述中，或者可以根据上述的触控显示面板的制备方法的描述而合理地推导出来，本公开在此不再一一赘述。
实施例二
本公开提供另一种触控显示面板的制备方法，参见图18，触控显示面板的制备方法包括：
步骤S210，提供衬底基板100；
步骤S220，在衬底基板100的一侧形成显示器件层200；显示器件层200包括有机材料层201；
步骤S230，在显示器件层200远离衬底基板100的一侧形成触控功能层300，触控功能层300包括无机电介质层301。参见图11，在触控显示面板的外围区B的至少部分区域，使得有机材料层201的边缘在无机电介质层301的边缘以内。
根据本公开提供的触控显示面板的制备方法，在形成触控功能层300时，可以使得在至少部分边缘区域，有机材料层201的边缘在无机电介质层301的边缘以内。如此，在至少部分边缘区域，有机材料层201与无机电介质层301的结合处处于无机电介质层301的保护之下，能够避免水汽在这些边缘区域侵入有机材料层201与无机电介质层301的结合处，进而避免无机电介质层301剥离。
根据本公开提供的触控显示面板的制备方法，所制备的触控显示面板包括依次层叠的衬底基板100、显示器件层200和触控功能层300。显示器件层200包括有机材料层201；触控功能层300包括无机电介质层301；在触控显示面板的至少部分边缘区域，有机材料层201的边缘在无机电介质层301的边缘以内。
示例性地，参见图8，从俯视的角度观察，触控显示面板可以包括有显示区A和围绕显示区A的外围区B。外围区B可以包括有第一区域501和第三区域503；在第一区域501和第三区域503的边缘区域，有机材料层201的边缘在无机电介质层301的边缘以内。
可选地，显示器件层200还可以包括有无机绝缘层202，在第一区域501和第三区域503的边缘区域，无机电介质层301和无机绝缘层202可以超出有机材料层201并直接连接。如此，在这些边缘区域，有机材料层201的边缘被无机材料包覆，避免了水汽侵入有机材料层201而使得无机电介质层301剥离。
本公开还提供另一种触控显示面板，包括：
衬底基板100；
显示器件层200，设于衬底基板100的一侧；显示器件层200包括有机材料层201；
触控功能层300，设于显示器件层200远离衬底基板100的一侧；触控功能层300包括无机电介质层301；在触控显示面板的外围区B的至少部分区域，有机材料层201的边缘在无机电介质层301的边缘以内。
本公开实施例提供的触控显示面板可以通过上述的触控显示面板制备方法进行制备，其各个结构、原理和效果已经记载于上述的触控显示面板的制备方法的描述中，或者可以根据上述的触控显示面板的制备方法的描述而合理地推导出来，本公开在此不再一一赘述。
在该实施例二中，各个步骤和结构的原理、效果和细节在实施例一中进行了详细的描述，或者可以根据实施例一的描述而合理地推导出来，本公开在此不再一一详述。
实施例三
本公开实施方式还提供一种显示装置，该显示装置包括上述实施例一和实施例二的触控显示面板实施方式所描述的任意一种触控显示面板。该显示装置可以为手机屏幕、平板电脑屏幕或者其他类型的显示装置。由于该显示装置具有上述触控显示面板实施方式所描述的任意一种触控显示面板，因此具有相同的有益效果，本公开在此不再赘述。
应可理解的是，本公开不将其应用限制到本说明书提出的部件的详细结构和布置方式。本公开能够具有其他实施方式，并且能够以多种方式实现并且执行。前述变形形式和修改形式落在本公开的范围内。应可理解的是，本说明书公开和限定的本公开延伸到文中和/或附图中提到或明显的两个或两个以上单独特征的所有可替代组合。所有这些不同的组合构成本公 开的多个可替代方面。本说明书的实施方式说明了已知用于实现本公开的最佳方式，并且将使本领域技术人员能够利用本公开。

Claims (20)

  1. 一种触控显示面板，包括：
    衬底基板；
    显示器件层，设于所述衬底基板的一侧；
    触控功能层，设于所述显示器件层远离所述衬底基板的一侧；其中，所述触控功能层包括依次层叠设置于所述显示器件层上的无机电介质层和有机保护层；所述无机电介质层的至少部分边缘在所述衬底基板上的正投影，位于所述有机保护层在所述衬底基板上的正投影以内。
  2. 根据权利要求1所述的触控显示面板，其中，所述触控功能层还包括第一电极层和第二电极层；所述无机电介质层包括电介质缓冲层和电介质绝缘层；
    所述电介质缓冲层、所述第一电极层、所述电介质绝缘层、所述第二电极层和所述有机保护层依次层叠设置于所述显示器件层远离所述衬底基板的一侧。
  3. 根据权利要求1所述的触控显示面板，其中，所述无机电介质层在所述衬底基板上的正投影，位于所述有机保护层在所述衬底基板上的正投影以内。
  4. 根据权利要求1所述的触控显示面板，其中，所述无机电介质层在所述衬底基板上的正投影的边缘上的任意一点，与所述有机保护层在所述衬底基板的正投影的边缘上的任意一点之间的距离的最小值不小于80微米。
  5. 根据权利要求1所述的触控显示面板，其中，所述有机保护层靠近所述触控显示面板的边缘一侧的边缘，与所述触控显示面板的边缘之间具有间隙。
  6. 根据权利要求1～5任意一项所述的触控显示面板，其中，所述显示器件层包括有机材料层；所述触控显示面板的外围区包括第一区域；
    在所述第一区域，所述有机材料层的边缘在所述无机电介质层的边缘以内。
  7. 根据权利要求6所述的触控显示面板，其中，所述显示器件层还包括无机绝缘层，所述有机材料层位于所述无机绝缘层远离所述衬底基板 的一侧；
    在所述第一区域，所述有机材料层的边缘在所述无机绝缘层的边缘以内，所述无机绝缘层超出所述有机材料层的部分与所述无机电介质层超出所述有机材料层的部分直接连接。
  8. 根据权利要求7所述的触控显示面板，其中，在所述第一区域，所述无机电介质层的边缘和所述触控显示面板的边缘之间具有沿所述触控显示面板的边缘延伸方向延伸的裂纹阻隔区；
    在所述第一区域，所述无机绝缘层覆盖所述裂纹阻隔区，且在所述裂纹阻隔区内设置有沿所述触控显示面板的边缘延伸方向延伸的沟槽；所述有机保护层覆盖所述裂纹阻隔区。
  9. 根据权利要求6所述的触控显示面板，其中，所述触控显示面板的外围区还包括第二区域；
    在所述第二区域，所述触控显示面板的边缘为弧形，所述有机材料层延伸至所述触控显示面板的边缘。
  10. 根据权利要求6所述的触控显示面板，其中，所述触控显示面板的外围区还包括可弯折区；
    所述有机材料层覆盖所述可弯折区，且所述无机电介质层和所述有机保护层在所述可弯折区镂空；其中，所述有机保护层靠近所述可弯折区的边缘，位于所述无机电介质层靠近所述可弯折区的边缘与所述可弯折区之间。
  11. 根据权利要求6所述的触控显示面板，其中，所述触控显示面板设置有通孔，所述有机保护层在所述衬底基板上的正投影环绕于所述通孔在所述衬底基板上的正投影以外。
  12. 一种触控显示面板，包括：
    衬底基板；
    显示器件层，设于所述衬底基板的一侧；所述显示器件层包括有机材料层；
    触控功能层，设于所述显示器件层远离所述衬底基板的一侧；所述触控功能层包括无机电介质层；
    在所述触控显示面板的外围区的至少部分区域，所述有机材料层的边 缘在所述无机电介质层的边缘以内。
  13. 一种显示装置，包括上述的触控显示面板。
  14. 一种触控显示面板的制备方法，包括：
    提供衬底基板；
    在所述衬底基板的一侧形成显示器件层；
    在所述显示器件层远离所述衬底基板的一侧形成触控功能层，所述触控功能层包括依次层叠于所述显示器件层上的无机电介质层和有机保护层；所述无机电介质层的至少部分边缘在所述衬底基板上的正投影，位于所述有机保护层在所述衬底基板上的正投影以内。
  15. 根据权利要求14所述的触控显示面板的制备方法，其中，在所述显示器件层远离所述衬底基板的一侧形成触控功能层包括：
    在所述显示器件层远离所述衬底基板的一侧形成所述无机电介质层和所述有机保护层，使得所述无机电介质层在所述衬底基板上的正投影位于所述有机保护层在所述衬底基板上的正投影以内。
  16. 根据权利要求14或15所述的触控显示面板的制备方法，其中，所述触控显示面板的外围区包括第一区域；
    在所述衬底基板的一侧形成显示器件层包括：
    形成所述显示器件层的有机材料层；
    在所述显示器件层远离所述衬底基板的一侧形成触控功能层包括：
    形成所述无机电介质层，且在所述第一区域，使得所述有机材料层的边缘在所述无机电介质层的边缘以内。
  17. 根据权利要求16所述的触控显示面板的制备方法，其中，在所述衬底基板的一侧形成显示器件层还包括：
    形成所述显示器件层的无机绝缘层，所述有机材料层位于所述无机绝缘层远离所述衬底基板的一侧；且在所述第一区域，使得所述有机材料层的边缘在所述无机绝缘层的边缘以内；
    在所述显示器件层远离所述衬底基板的一侧形成触控功能层还包括：
    在形成所述无机电介质层时，在所述第一区域，使得所述无机绝缘层超出所述有机材料层的部分与所述无机电介质层超出所述有机材料层的部分直接连接。
  18. 根据权利要求17所述的触控显示面板的制备方法，其中，在所述第一区域，所述触控显示面板具有靠近所述触控显示面板的边缘且沿所述触控显示面板的边缘延伸方向延伸的裂纹阻隔区；
    在所述衬底基板的一侧形成显示器件层还包括：
    在形成所述无机绝缘层时，在所述第一区域，使得所述无机绝缘层覆盖所述裂纹阻隔区且在所述裂纹阻隔区内设置有沿所述触控显示面板的边缘延伸方向延伸的沟槽；
    在所述显示器件层远离所述衬底基板的一侧形成触控功能层还包括：
    在形成所述有机保护层时，在所述第一区域，使得所述有机保护层覆盖所述裂纹阻隔区。
  19. 根据权利要求16所述的触控显示面板的制备方法，其中，所述触控显示面板的外围区还包括第二区域，且所述触控显示面板在所述第二区域的边缘为弧形；
    提供衬底基板包括：
    提供衬底母板，所述衬底母板包括多个所述触控显示面板的衬底基板以及围绕各个所述衬底基板的切割沟道区；
    在所述衬底基板的一侧形成显示器件层包括：
    在所述衬底母板上形成各个所述触控显示面板的有机材料层，且所述有机材料层还延伸并覆盖所述切割沟道区靠近所述第二区域的部分；
    在所述显示器件层远离所述衬底基板的一侧形成触控功能层包括：
    在形成所述无机电介质层时，在所述第二区域，使得所述无机电介质层的边缘不抵达所述触控显示面板的边缘。
  20. 根据权利要求16所述的触控显示面板的制备方法，其中，所述触控显示面板的外围区还包括可弯折区；
    在所述衬底基板的一侧形成显示器件层包括：
    在形成所述显示器件层的有机材料层时，使得所述有机材料层覆盖所述可弯折区；
    在所述显示器件层远离所述衬底基板的一侧形成触控功能层包括：
    形成所述触控功能层，使得所述无机电介质层和所述有机保护层在所述可弯折区镂空；其中，所述有机保护层靠近所述可弯折区的边缘，位于 所述无机电介质层靠近所述可弯折区的边缘与所述可弯折区之间。
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