WO2022083314A1 - Téléphone mobile intelligent basé sur une architecture x64 - Google Patents

Téléphone mobile intelligent basé sur une architecture x64 Download PDF

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Publication number
WO2022083314A1
WO2022083314A1 PCT/CN2021/116356 CN2021116356W WO2022083314A1 WO 2022083314 A1 WO2022083314 A1 WO 2022083314A1 CN 2021116356 W CN2021116356 W CN 2021116356W WO 2022083314 A1 WO2022083314 A1 WO 2022083314A1
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WO
WIPO (PCT)
Prior art keywords
chipset
mobile phone
cpu
smart mobile
chip
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Application number
PCT/CN2021/116356
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English (en)
Chinese (zh)
Inventor
景泉淞
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景泉淞
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Application filed by 景泉淞 filed Critical 景泉淞
Publication of WO2022083314A1 publication Critical patent/WO2022083314A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/72—Mobile telephones; Cordless telephones, i.e. devices for establishing wireless links to base stations without route selection
    • H04M1/724—User interfaces specially adapted for cordless or mobile telephones
    • H04M1/72403—User interfaces specially adapted for cordless or mobile telephones with means for local support of applications that increase the functionality
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/72—Mobile telephones; Cordless telephones, i.e. devices for establishing wireless links to base stations without route selection
    • H04M1/724—User interfaces specially adapted for cordless or mobile telephones
    • H04M1/72403—User interfaces specially adapted for cordless or mobile telephones with means for local support of applications that increase the functionality
    • H04M1/72427—User interfaces specially adapted for cordless or mobile telephones with means for local support of applications that increase the functionality for supporting games or graphical animations

Definitions

  • the utility model relates to a wireless communication technology, in particular to an intelligent mobile phone with an X64 architecture.
  • the architecture of the smart mobile phone basically adopts the ARM architecture, whether it is the chip architecture of Qualcomm, MediaTek and Hisilicon or the A-series processors of Apple, all of them adopt the ARM architecture.
  • ARM adopts the mode of licensing chip design solutions to other companies, and has formed more than 100 partners around the world.
  • ARM adopts the RISC pipeline instruction set, which is fundamentally at a disadvantage in completing comprehensive work. In applications with relatively fixed tasks, its advantages can be brought into full play.
  • the reason why the current smart mobile phone mainly adopts the processor of ARM architecture is mainly due to the low power consumption and high efficiency of ARM.
  • ARM architecture connects the CPU and data storage devices through a dedicated data interface, so the performance expansion of ARM storage, memory, etc. is difficult to carry out.
  • ARM-structured systems generally cannot be extended, and their performance is greatly limited.
  • the technical problem to be solved by the present invention is that the performance of the existing intelligent mobile phone based on the ARM architecture is greatly limited, and the purpose is to provide an intelligent mobile phone of the X64 architecture to solve the above problems.
  • An intelligent mobile phone with X64 architecture comprising a PCB board, a CPU, a first chipset, a second chipset and a remote wireless module arranged inside the intelligent mobile phone; the CPU, the first chipset, the second chipset and the The remote wireless modules are all arranged on the PCB board; the remote wireless module adopts a communication module based on a SIM card or e-SIM; the remote wireless module is connected to the CPU, the first chipset and/or the second chipset; The CPU is connected to the first chipset, and the second chipset is connected to the CPU and/or the first chipset; the CPU, the first chipset, the second chipset and the remote wireless module can be any two or optional The three are integrated into one chip; the CPU, the first chipset, the second chipset and the long-range wireless module can also be integrated into one chip.
  • the inventor provides an intelligent mobile phone based on the X64 architecture.
  • the space utilization problem of the intelligent mobile phone is solved through the solution of the PCB board.
  • the CPU, the first chipset, the second chipset and the remote When the wireless module is arranged on the PCB board, since the thickness of the chip set is very small, the size of the PCB board can be greatly reduced when these chips and modules are placed on two sides of the double-sided PCB.
  • notebooks often use 9-15-inch screens because of their office use, which allows the notebook circuit board to use a single-layer circuit board with a larger area.
  • Chipsets of related chips such as INTEL series comet lake architecture processors and icelake architecture processors, use 10nm process, and for example, AMD series Ryzen 2, Ryzen 3 and Ryzen 4 processors use 7nm process.
  • Core displays such as Xe and Vega enable it to run at a power consumption of 7 to 15W, and its performance far exceeds the existing ARM architecture processors. With the promotion of the 5nm process, the power consumption of these processors will be further reduced.
  • the size of the entire smart mobile phone can be compressed to the physical size of 200mm ⁇ 90mm ⁇ 12mm or even smaller, which fully meets the portable requirements of mobile phones.
  • the utility model can smoothly run the mainstream desktop-level operating systems such as deepin, winning kylin, Ubuntu, AndroidX86, Win10, red flag linux, etc.
  • the CPU, the first chipset, the second chipset and the remote wireless module can be optionally two or three integrated into one chip, that is to say, selecting these four Two or three of them are integrated to improve the integration degree of the present invention, and further the integration degree of the present invention can be further improved by adopting the way of fully integrating the above four chips.
  • the utility model has strong performance, strong compatibility and scalability, and can use LTE, 2G, 3G, 4G, 5G and other communication technologies for voice or video calls; A new solution has also been developed for portable office.
  • the communication module based on the SIM card or e-SIM adopts a 2G communication module, a 3G communication module, a 4G communication module and/or a 5G communication module.
  • a 4G or 5G communication module based on SIM card or e-SIM is also integrated on the PCB board, which is also different from the LTE wireless communication adopted by some existing tablet computers. It is suitable for low-traffic applications such as video calls, but it is not enough for high-traffic applications such as high-definition video calls, so the present invention adopts a 4G or 5G SIM card communication scheme.
  • the SIM card communication solution of 4G or 5G can also be backward compatible with the communication protocols of 2G and 3G.
  • the communication protocols such as 6G that will appear in the future are also applicable to the present utility model, and various existing wireless communication methods are also applicable. in this utility model.
  • the first chipset adopts a north bridge chipset or an MCH chipset; the second chipset adopts a south bridge chipset or an ICH chipset.
  • the ROM is connected to the first chipset, and the ROM is arranged on the PCB;
  • the GPU is connected to the CPU, the first chipset or the second chipset; the GPU can be integrated with the CPU, the first chipset or the second chipset into a single chip;
  • the display screen is connected to the GPU through a driver chip.
  • a GPU can be integrated, which is called a core graphics card.
  • the GPU can be connected in a direct connection mode or a bus mode.
  • the core graphics card can complete the display operation related functions.
  • the display screen adopts LED, LCD, OLED, Mini LED or Mirco LED.
  • LED and LCD display screens can be used for different needs, and at the same time, the OLED folding screen can be adopted for reference to the technology of related enterprises.
  • the bluetooth communication module also includes a bluetooth communication module and a WIFI module connected to the second chipset; the bluetooth communication module is wirelessly connected to a bluetooth peripheral; the bluetooth peripheral includes a bluetooth keyboard and a bluetooth mouse.
  • USB module BIOS chip, audio processing chip, RAM and EC
  • the USB module, BIOS chip, audio processing chip, RAM and EC are all arranged on the PCB
  • the USB module, BIOS BIOS
  • the chip, the audio processing chip, the RAM and the EC are all connected to the second chip set; the audio processing chip is connected with a sound playing device arranged in the smart mobile phone.
  • the module arrangement of a general desktop computer can be adopted, and a USB module, a BIOS chip, an audio processing chip and a RAM can be added to improve the applicability.
  • e-interface or Thunderbolt 4 to further improve scalability and interface communication speed;
  • the EC module as an important module for power control in the present invention, also needs to be connected to the second chipset, and controls the power of each device to increase battery life.
  • it also includes a heat sink and a heat dissipation transmission device; a heat dissipation fin is provided in the CPU, the first chipset, the second chipset and/or the remote wireless module; the hot end of the heat dissipation transmission device is arranged on the heat dissipation device.
  • the heat sink and the heat dissipation transmission device are both arranged inside the smart mobile phone.
  • the cooling transmission device adopts a heat pipe, and a cooling fan is arranged on the cold end of the heat pipe; the cooling fan is arranged on the smart mobile phone.
  • heat dissipation When the utility model is applied, two schemes are provided for heat dissipation, one is active heat dissipation and the other is passive heat dissipation, wherein the active heat dissipation is designed for chips with higher power consumption, and the fan is used to actively dissipate heat from the cold end of the heat pipe; passive heat dissipation; Heat dissipation is designed for chips with lower power consumption.
  • the heat dissipation transmission device can use a vapor chamber, and the cold end is passively dissipated.
  • the modules used are all existing modules, and the present invention only organically combines them to achieve new technical effects, and does not involve software improvements.
  • An intelligent mobile phone with an X64 architecture of the present utility model has powerful performance and extremely strong compatibility and scalability
  • An intelligent mobile phone with an X64 architecture of the present invention can use communication technologies such as LTE, 2G, 3G, 4G, and 5G for voice or video calls;
  • the utility model is an intelligent mobile phone with an X64 architecture, which runs most of the current mainstream 3A games smoothly at a medium picture quality of 30FPS, and also provides a new solution for portable office work.
  • Fig. 1 is the structural representation of the utility model
  • FIG. 2 is a schematic diagram of an embodiment of the present utility model
  • FIG. 3 is a schematic diagram of an embodiment of the present utility model
  • FIG. 5 is a schematic diagram of an embodiment of the present utility model
  • FIG. 6 is a schematic diagram of an embodiment of the present utility model
  • FIG. 7 is a schematic diagram of an embodiment of the present invention.
  • An intelligent mobile phone with X64 architecture comprising a PCB board, a CPU, a first chipset, a second chipset and a remote wireless module arranged inside the intelligent mobile phone; the CPU, the first chipset, the second chipset and the The remote wireless modules are all arranged on the PCB board; the remote wireless module adopts a communication module based on a SIM card or e-SIM; the remote wireless module is connected to the CPU, the first chipset and/or the second chipset; The CPU is connected to the first chipset, and the second chipset is connected to the CPU and/or the first chipset; the CPU, the first chipset, the second chipset and the remote wireless module can be any two or optional The three are integrated into one chip; the CPU, the first chipset, the second chipset and the long-range wireless module can also be integrated into one chip.
  • the inventor provides a smart mobile phone based on the X64 architecture.
  • the space utilization problem of the smart mobile phone is solved through the solution of the PCB board.
  • the CPU, the first chipset, the second chipset and the remote When the wireless module is arranged on the PCB board, since the thickness of the chip set is very small, the size of the PCB board can be greatly reduced when these chips and modules are placed on two sides of the double-sided PCB.
  • notebooks often use 9-15-inch screens because of their office use, which allows the notebook circuit board to use a single-layer circuit board with a larger area.
  • Chipsets of related chips such as INTEL series comet lake architecture processors and icelake architecture processors, use 14nm or 10nm process, and for example, AMD series Zen3 processors use 7nm process technology, and they are equipped with Iris Xe and Vega and other core display enablers. It can run at a power consumption of 7 to 15W, and its performance far exceeds the existing ARM architecture processors. With the promotion of the 5nm process, the power consumption of these processors will be further reduced.
  • the size of the entire smart mobile phone can be compressed to the physical size of 200mm ⁇ 90mm ⁇ 12mm or even smaller, which fully meets the portable requirements of mobile phones.
  • the utility model can smoothly run mainstream desktop-level operating systems such as deepin, winning kylin, Ubuntu, AndroidX86, Win10, red flag linux, etc., with powerful performance, strong compatibility and scalability, and can use LTE, 2G, 3G, 4G, 5G and other communication technologies are used for voice or video calls; at the same time, most mainstream 3A games are run smoothly at medium picture quality of 30FPS, which also improves a new solution for portable office.
  • this embodiment provides an implementation manner in which the first chipset, the CPU, and the second chipset are connected in sequence.
  • the communication module based on the SIM card or e-SIM adopts a 2G communication module, a 3G communication module, a 4G communication module and/or a 5G communication module.
  • a 4G or 5G SIM card or e-SIM-based communication module is also integrated on the PCB, which is also different from the LTE wireless communication used by some existing tablet computers.
  • the LTE wireless communication rate is It is suitable for low-traffic applications such as video calls, but it is not enough for high-traffic applications such as high-definition video calls, so the present invention adopts a 4G or 5G SIM card communication scheme.
  • the 4G or 5G SIM card communication solution can also be backward compatible with 2G and 3G communication protocols;
  • the communication module of the SIM communicates with the CPU, the first chipset and/or the second chipset through channels such as PCIE or USB.
  • Huawei's ME909S-821 is used for wireless communication, and the ME909S-821 is connected to the CPU, the first chipset and/or the second chipset through PCIE, USB or M.2.
  • the packaging methods of the CPU, the first chipset, the second chipset, and the communication module based on the SIM card or e-SIM tend to be diverse, so in this embodiment,
  • the integration degree of this embodiment is improved by encapsulating any two or three of the above-mentioned four, and even a technology of encapsulating all of the above-mentioned four can be used to further improve the integration degree of this embodiment.
  • the first chipset adopts a north bridge chipset or an MCH chipset; the second chipset adopts a south bridge chipset or an ICH chipset.
  • this embodiment also includes a display screen, a ROM and a GPU;
  • the ROM is connected to the first chipset, and the ROM is arranged on the PCB;
  • the GPU is connected to the CPU, the first chipset or the second chipset; the GPU can be integrated with the CPU, the first chipset or the second chipset into a single chip;
  • the display screen is connected to the GPU through a driver chip.
  • a GPU can be integrated, which is called a core graphics card.
  • the GPU can be connected in a direct connection mode or a bus mode.
  • the core graphics card can complete the display operation related functions.
  • the display screen adopts LED, LCD, OLED, Mini LED or Mirco LED.
  • LED and LCD display screens can be used for different needs, and at the same time, the OLED folding screen can be used for reference by the technology of related companies.
  • the plurality of remote wireless modules further include a Bluetooth communication module; the Bluetooth communication module is wirelessly connected to a Bluetooth peripheral device; the Bluetooth peripheral device includes a Bluetooth keyboard and a Bluetooth mouse.
  • USB module a BIOS chip, an audio processing chip and a RAM
  • the USB module, the BIOS chip, the audio processing chip, the EC control and the RAM are all arranged on the PCB board
  • the USB module, the BIOS chip, the audio processing chip and the RAM are all connected to the second chipset; the audio processing chip is connected to a sound playing device arranged in the smart mobile phone.
  • a general desktop computer module arrangement can be adopted, and a USB module, a BIOS chip, an audio processing chip and a RAM can be added to improve the applicability.
  • the e-interface further improves scalability and interface communication speed.
  • a heat sink and a heat dissipation transmission device are also included; the CPU, the first chipset, the second chipset and/or multiple remote wireless modules are provided with heat sinks; The hot end of the transmission device is arranged on the heat sink; the heat sink and the heat dissipation transmission device are both arranged inside the smart mobile phone.
  • a cooling fan is also included; the heat dissipation transmission device adopts a heat pipe, and a cooling fan is arranged on the cold end of the heat pipe; the cooling fan is arranged on the smart mobile phone.
  • heat dissipation When the utility model is applied, two schemes are provided for heat dissipation, one is active heat dissipation and the other is passive heat dissipation, wherein the active heat dissipation is designed for chips with higher power consumption, and the fan is used to actively dissipate heat from the cold end of the heat pipe; passive heat dissipation; Heat dissipation is designed for chips with lower power consumption.
  • the heat dissipation transmission device can use a vapor chamber, and the cold end is passively dissipated.
  • the CPU and the first chipset use Intel's tenth-generation Core i7-10710U, which is packaged on the A side of the PCB board through BGA, and the second chipset uses PCH IBEX PEAK chipset, communication module with SIM card slot as shown in Figure 2.
  • heat dissipation is carried out by means of a heat pipe and a fan. Set the display screen above the B side of the PCB board.
  • the CPU and the first chipset use AMD's Ryzen 5700U processor, which is packaged on the A side of the PCB board through BGA, and the second chipset uses an ICH7 chip Group, which is on the B side of the PCB board, and the remote wireless module adopts a communication module with a SIM card slot.
  • the CPU and the first chipset use KX5000, KX6000 or KX7000 processors, and the domestic chips of Zhaoxin Kaixian series are more suitable for the application of the present invention.
  • the technology adopts 16nm, but the integration degree is high.
  • the CPU and the first chipset are directly packaged on the PCB board by means of BGA packaging, and at the same time, the second chipset adopts the ZX-200IO expansion chip.
  • the CPU and the first chipset may integrate expansion interfaces such as PCIe, PCI, and M.2.
  • FIG. 3 is a partial wiring diagram of the CPU and the first chipset
  • FIG. 4 is a partial wiring diagram of the second chipset.
  • buttons and two cameras are arranged on the front, the three buttons are arranged below the front, the screen is arranged above the buttons, and the camera is arranged on the upper part of the screen.
  • the top side button is the volume adjustment button
  • the middle side button is the BIOS switch button
  • the bottom side button is the BIOS switch button.
  • the side button is the power button.
  • a rear camera group and a fingerprint identification module are set on the back of the body for taking pictures and fingerprint identification.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Human Computer Interaction (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Telephone Function (AREA)

Abstract

Dans la présente invention, un téléphone mobile intelligent basé sur une architecture X64 est divulgué, comprenant : une carte circuit imprimé, une CPU, un premier jeu de puces, un second jeu de puces et une pluralité de modules sans fil à distance disposés à l'intérieur du téléphone mobile intelligent. La CPU, le premier jeu de puces, le second jeu de puces et la pluralité de modules sans fil à distance sont disposés sur deux côtés de la carte de circuit imprimé ; la CPU et le premier jeu de puces sont connectés au second jeu de puces ; la pluralité de modules sans fil à distance sont tous connectés au second jeu de puces ; et la pluralité de modules sans fil à distance comprennent des modules de communication basés sur une carte SIM ou e-SIM. Le téléphone mobile intelligent basé sur une architecture X64 divulgué dans la présente invention a d'excellentes performances et une compatibilité et une extensibilité élevées, peut réaliser des appels vocaux ou vidéo sur la base de technologies de communication telles que LTE, 2G, 3G, 4G, 5G, Wi-Fi et Bluetooth, peut exécuter certains jeux AAA grand public sans problèmes à une qualité d'image moyenne-faible de 30 fps, et fournit une nouvelle solution pour gérer un travail de bureau en déplacement.
PCT/CN2021/116356 2020-10-23 2021-09-03 Téléphone mobile intelligent basé sur une architecture x64 WO2022083314A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202022391754.8 2020-10-23
CN202022391754.8U CN212875888U (zh) 2020-10-23 2020-10-23 一种x64架构的智能移动电话

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WO2022083314A1 true WO2022083314A1 (fr) 2022-04-28

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Publication number Priority date Publication date Assignee Title
CN212875888U (zh) * 2020-10-23 2021-04-02 景泉淞 一种x64架构的智能移动电话

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CN108780709A (zh) * 2016-05-18 2018-11-09 西门子股份公司 用于提供继电器触头的功能安全监测的系统和方法
CN208480149U (zh) * 2018-06-15 2019-02-05 深圳市通泰电子技术开发有限公司 一种应用与x86主板的pcb板结构
CN212875888U (zh) * 2020-10-23 2021-04-02 景泉淞 一种x64架构的智能移动电话

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7793029B1 (en) * 2005-05-17 2010-09-07 Nvidia Corporation Translation device apparatus for configuring printed circuit board connectors
CN201639618U (zh) * 2010-01-08 2010-11-17 青岛海信移动通讯技术股份有限公司 一种超薄音乐手机
CN108780709A (zh) * 2016-05-18 2018-11-09 西门子股份公司 用于提供继电器触头的功能安全监测的系统和方法
CN106331235A (zh) * 2016-09-12 2017-01-11 努比亚技术有限公司 移动终端主板、移动终端主板设置方法及移动终端
CN208480149U (zh) * 2018-06-15 2019-02-05 深圳市通泰电子技术开发有限公司 一种应用与x86主板的pcb板结构
CN212875888U (zh) * 2020-10-23 2021-04-02 景泉淞 一种x64架构的智能移动电话

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