WO2022083262A1 - 柔性显示面板及移动终端 - Google Patents

柔性显示面板及移动终端 Download PDF

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Publication number
WO2022083262A1
WO2022083262A1 PCT/CN2021/113878 CN2021113878W WO2022083262A1 WO 2022083262 A1 WO2022083262 A1 WO 2022083262A1 CN 2021113878 W CN2021113878 W CN 2021113878W WO 2022083262 A1 WO2022083262 A1 WO 2022083262A1
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WIPO (PCT)
Prior art keywords
display panel
flexible
circuit board
flexible circuit
binding area
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PCT/CN2021/113878
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English (en)
French (fr)
Inventor
秦进
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深圳市万普拉斯科技有限公司
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Publication of WO2022083262A1 publication Critical patent/WO2022083262A1/zh

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements

Definitions

  • the present application relates to the technical field of display packaging, and in particular, to a flexible display panel and a mobile terminal.
  • common high screen-to-body ratio display panels generally use a binding structure on the lower border, and use COP (Chip On Plastic) packaging technology to bend the area where the binding structure is set on the lower border to the back of the display panel, so that the The width of the lower border of the display panel is reduced, thereby increasing the screen ratio of the display panel.
  • COP Chip On Plastic
  • the binding structure of the current display panel is relatively large in size. Even if it is turned over to the back of the display panel, it occupies a large area on the back of the display panel. Therefore, the display panel adopts COP packaging and is used in terminal devices such as mobile phones. Although the screen ratio can be increased to a certain extent, the overall space utilization rate of the device is low, which also leads to less available space for other components such as batteries disposed on the back of the display panel.
  • the purpose of the present application is to provide a flexible display panel and a mobile terminal, which can reduce the size of the binding area of the flexible display panel and improve the overall space utilization rate of the mobile terminal when the flexible display panel is packaged by the COP packaging technology.
  • a flexible display panel including: a display panel and a flexible circuit board, the display panel includes a display area divided on a flexible substrate and a binding area for drawing out a fan-out line of the display area, and the flexible
  • the circuit board is electrically connected with the leads of the binding area, and the binding area is located in the orthographic projection of the flexible circuit board on the flexible substrate.
  • connection end of the flexible circuit board is connected with the lead in the binding area.
  • connection end of the flexible circuit board and the lead are connected by anisotropic conductive glue.
  • connection end of the flexible circuit board is welded with the lead.
  • the binding area is located at the edge of the flexible substrate.
  • a driving chip is provided in the binding area of the flexible substrate, the leads of the driving chip are connected to the fan-out lines, and the driving chip is electrically connected to the flexible circuit board.
  • the flexible circuit board includes functional devices and connectors that are electrically connected to each other, and the functional devices are electrically connected to the leads of the binding area.
  • a stacking gap is provided between the binding area and the flexible circuit board.
  • the functional device is located on a side of the flexible circuit board away from the flexible substrate.
  • the functional device includes a touch control chip.
  • the mobile terminal includes the flexible display panel according to any one of the above, and the binding area of the flexible substrate of the flexible display panel is bent toward the back of the flexible display panel.
  • a flexible display panel provided by an embodiment of the present application includes a display panel and a flexible circuit board.
  • the display panel includes a display area divided on the flexible substrate and a binding area for drawing out the fan-out lines of the display area, the flexible circuit board is electrically connected to the leads of the binding area, and the binding area is located at the end of the flexible circuit board on the flexible substrate. in the orthographic projection. That is, the flexible circuit board and the binding area are arranged in a stack, thereby reducing the total projected area of the binding structure including the binding area and the flexible circuit board on the flexible substrate, so as to improve the stacking efficiency of the flexible display panel and improve the The overall space utilization rate of the mobile terminal when the flexible display panel is packaged by COP packaging technology. This enables the mobile terminal to have more space for arranging components such as batteries, which facilitates increasing the battery capacity or adding other available functions of the mobile terminal.
  • FIG. 1 is a schematic structural diagram of a first viewing angle of a flexible display panel provided by an embodiment of the present application
  • FIG. 2 is one of the schematic structural diagrams of the second viewing angle of the flexible display panel provided by the embodiment of the present application.
  • FIG. 3 is the second structural schematic diagram of the second viewing angle of the flexible display panel provided by the embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of a flexible display panel provided by an embodiment of the present application.
  • Icons 110 - driver chip; 120 - flexible circuit board; 121 - functional device; 122 - connector; 130 - flexible substrate; 140 - binding area.
  • the flexible display panels are usually packaged by COP packaging technology.
  • the area where the binding structure is arranged on the lower frame is bent to the back of the display panel, thereby reducing the width of the lower frame of the display panel, thereby increasing the screen ratio of the display panel.
  • the embodiments of the present application provide a flexible display panel, which can reduce the size of the total projected area of the binding structure including the binding area and the flexible circuit board in the flexible display panel on the flexible substrate, and improve the use of mobile terminals.
  • the space utilization of the whole machine when the COP packaging technology encapsulates the flexible display panel. .
  • FIG. 1 is a schematic structural diagram of a first viewing angle of a flexible display panel provided by an embodiment of the present application
  • FIG. 2 is one of structural schematic diagrams of a second viewing angle of a flexible display panel provided by an embodiment of the present application, as shown in FIGS.
  • the flexible display panel of the embodiment of the present application includes a display panel and a flexible circuit board 120, the display panel includes a display area divided on the flexible substrate 130 and a binding area 140 for drawing out fan-out lines of the display area, and the flexible circuit board 120 and
  • the leads of the binding area 140 are electrically connected to drive and control the screen display in the display area of the flexible display panel, the leads of the binding area 140 are connected to the fan-out lines of the display area, and the binding area 140 is located on the flexible circuit board 120 on the flexible substrate 130 in the orthographic projection.
  • the display areas are not fully shown or labeled in FIG. 1 and FIG. 2, and those skilled in the art should It is known that the display area is in the basic position area and function of the flexible display panel, and the structure and principle of the display area will not be repeated in this application.
  • a stacking gap may be set between the binding area 140 and the flexible circuit board 120 , and the stacking gap can affect the binding area 140 and the flexible circuit board 120 .
  • 120 provides a certain independent space, or use this space to complete the fixed structure.
  • the binding area 140 is provided with the driver chip 110, considering the problem of heat dissipation in the working state of the chip, a corresponding heat dissipation film layer and the like may also be provided in the gap, which is not limited here.
  • a flexible display panel provided by an embodiment of the present application includes a display panel and a flexible circuit board 120 .
  • the display panel includes a display area divided on the flexible substrate 130 and a binding area 140 for drawing out fan-out lines of the display area, the flexible circuit board 120 is electrically connected with the leads of the binding area 140, and the binding area 140 is located on the flexible circuit board 120 is in the orthographic projection on the flexible substrate 130 .
  • the flexible circuit board 120 and the binding area 140 are arranged in a stacked manner, thereby reducing the total projected area of the binding structure including the binding area 140 and the flexible circuit board 120 on the flexible substrate 130, so as to improve the flexible display panel
  • the stacking efficiency is improved, and the overall space utilization rate of the mobile terminal when the flexible display panel is packaged by the COP packaging technology is improved.
  • This enables the mobile terminal to have more space for arranging components such as batteries, which facilitates increasing the battery capacity or adding other available functions of the mobile terminal.
  • the binding area 140 of the flexible display panel is provided with a driver chip 110 , the driver chip 110 is arranged on the flexible substrate 130 of the flexible display panel, and the leads of the driver chip 110 are connected to the fan of the flexible display panel.
  • the outgoing line is connected to drive and control the picture display in the display area of the flexible display panel, and the driving chip 110 is also electrically connected to the flexible circuit board 120 .
  • the driving chip 110 is located in the binding area 140 of the flexible display panel, so as to avoid the adverse effect of the driving chip 110 on the normal display of the flexible display panel.
  • the driving chip 110 is connected to the gate line signal lines, data line signal lines, signal line leads, etc. of the flexible display panel through fan-out lines, so that the flexible display panel is driven by the driving chip 110 to display corresponding images.
  • the flexible circuit board 120 is connected with the driving chip 110 , and the driving chip 110 can be easily electrically connected with the driving circuit (main board, etc.) through the flexible circuit board 120 , so as to transmit the control signal (driving signal) output by the driving circuit to the driving chip 110 to Drive flexible display panels. Therefore, the flexible circuit board 120 in the binding structure of the flexible display panel is used to connect with the driving circuit in practical applications.
  • other peripheral devices functional devices 121 ) related to the display panel may also be disposed on the flexible circuit board 120 . For example, devices for stabilizing drive current and voltage, etc.
  • connection end of the flexible circuit board 120 is connected to the lead wire in the binding area 140 .
  • connection end of the flexible circuit board 120 is connected to the leads in the binding area 140 , so that the leads of the driving chip 110 can be rewired more conveniently in the binding area 140 , so that when the size B of the driving chip 110 (as shown in FIG. 1 and FIG. 4 ) is small, the rewiring of its leads in the bonding area 140 can be used to improve the convenience of the connection between the flexible circuit board 120 and the driving chip 110 , which is convenient for the application of the high-performance, high-density driving chip 110 in the flexible display panel.
  • connection end of the flexible circuit board 120 and the lead wire of the driving chip 110 can be set by those skilled in the art according to actual needs, which is not limited here.
  • connection end of the flexible circuit board 120 and the lead are connected by anisotropic conductive glue.
  • ACF Adisotropic Conductive Film
  • anisotropic conductive adhesive can also be replaced by other conductive adhesives, such as conductive silver adhesive, which is not limited here.
  • connection ends of the flexible circuit board 120 are soldered to the leads.
  • corresponding pads can be set on the electrodes of the connecting end of the flexible circuit board 120 and on the leads of the driving chip 110, respectively, and then the corresponding pads are welded together by soldering or the like to realize the fixing and fixing of the flexible circuit board. electrical connection between the two. In this way, the structure is relatively stable, and the fixed performance and effect are relatively good.
  • the binding area 140 is located at the edge of the flexible substrate 130 .
  • Disposing the binding area 140 on the edge of the flexible substrate 130 can prevent the edge of the flexible substrate 130 from occupying too much area on the back of the flexible display panel after COP packaging, thereby further increasing the available space on the back of the flexible display panel.
  • the flexible circuit board 120 includes a functional device 121 and a connector 122 (as shown in FIG. 1 ) that are electrically connected to each other, and the functional device 121 and the lead of the binding area 140 (the lead of the driver chip 110 ) ) electrical connection.
  • the flexible display panel can be provided through the functional device 121 .
  • the use of the connector 122 (board-to-board connector 122, etc.) enables the flexible circuit board 120 to be more conveniently connected to a driving circuit such as a main board, thereby improving the detachability of the flexible display panel in the mobile terminal and facilitating assembly. .
  • those skilled in the art can set the functional devices 121 on the flexible circuit board 120 according to the actual functional design, and there can be one or more functional devices 121.
  • multiple functional devices 121 are included, multiple functional devices 121
  • the device 121 is used to implement various other additional functions of the flexible display panel in addition to the display function, and the specific function and quantity of the functional device 121 are not limited here.
  • the functional device 121 includes a touch control chip.
  • a touch chip is arranged in the binding area of the flexible display panel, correspondingly, a touch layer is also integrated in the display area of the flexible display panel.
  • the control chip can make the touch layer in the flexible display panel work by being driven to realize the touch function of the flexible display panel.
  • the commonly used functional device 121 also includes a fingerprint recognition driver.
  • a fingerprint sensing structure is integrated in a specific position of the display area of the flexible display panel, and the fingerprint recognition system is used for fingerprint recognition.
  • the driver can make the fingerprint sensing structure work to recognize the user's fingerprint and realize functions such as screen unlocking of the flexible display panel.
  • the functional device 121 is not limited to the above-mentioned examples, which are not limited in the embodiments of the present application.
  • the functional device 121 is located on the side of the flexible circuit board 120 away from the flexible substrate 130 .
  • the functional device 121 and the driving chip 110 can be prevented from contacting or approaching, so that the heat dissipation of the functional device 121 and the driving chip 110 is more convenient and the effect is better. .
  • the performance and functional stability of the binding structure of the flexible display panel are improved.
  • the functional device 121 may also be located on the flexible circuit board 120 close to the flexible circuit board 120 . one side of the substrate 130 .
  • the flexible display panel may use an OLED (Organic Light-Emitting Diode, organic electroluminescence) device as the light-emitting display device, that is, the flexible display panel is an OLED self-luminous display panel.
  • OLED Organic Light-Emitting Diode, organic electroluminescence
  • the flexible substrate 130 of the OLED self-luminous display panel can be made of polymer materials such as polyimide plastic, polyether ether ketone, etc., which is not limited here.
  • the frame of the flexible substrate 130 protrudes from the display area of the flexible display panel, that is, in the non-display area (the non-display area includes the binding area 140, and may also include other areas such as fan-out area, frame area, dummy area, etc.).
  • the above-mentioned binding structure can be disposed on the frame.
  • the frame portion of the flexible substrate 130 where the above-mentioned binding structure is disposed is bent toward the back of the panel, so that the above-mentioned binding structure (the binding area 140 and the flexible circuit board) is formed. 120) can be located on the back of the flexible display panel, so as to reduce the frame width of the flexible display panel, so as to realize the narrow frame package.
  • the back of the flexible display panel is the side of the panel that does not emit light, that is, the plane on the side away from the display screen of the panel.
  • the above-mentioned binding structure can be used for binding with a driving circuit such as a motherboard.
  • a driving circuit such as a motherboard.
  • the projected area of the binding structure including the binding area 140 and the flexible circuit board 120 on the flexible substrate 130 is reduced.
  • the space utilization rate of the whole machine when the mobile terminal adopts the COP packaging technology to package the flexible display panel is improved. This enables the mobile terminal to have more space to set components such as batteries, so as to increase battery capacity or increase terminal functions.
  • the mobile terminal includes any one of the above flexible display panels, and the binding area 140 of the flexible substrate 130 of the flexible display panel is bent toward the back of the flexible display panel take shape.
  • the mobile terminal also includes other components such as a main board and a battery.
  • a main board and a battery are arranged on the back of the flexible display panel, and the battery is located between the bent portion of the flexible display panel and the motherboard.
  • the mobile terminal may also be a tablet computer, a display, a smart watch, etc., which is not limited here.
  • the mobile terminal adopts the above-mentioned flexible display panel, which has a smaller binding structure. After it is packaged by COP, it has a higher stacking efficiency of the whole machine, so that the space outside the flexible display panel inside the casing is larger, which can be more convenient. A battery with a larger volume and capacity can also be added more conveniently to add other functional components to achieve various functions.

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  • Theoretical Computer Science (AREA)
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Abstract

一种柔性显示面板及应用柔性显示面板的移动终端，其中柔性显示面板包括显示面板和柔性电路板（120），显示面板包括在柔性基板（130）上划分的显示区域和用于引出显示区域的扇出线的绑定区（140），柔性电路板（120）与绑定区（140）的引线电连接，绑定区（140）位于柔性电路板（120）在柔性基板（130）上的正投影内。柔性显示面板能够减小包括绑定区（140）和柔性电路板（120）在内的绑定结构在柔性基板（130）上的总投影面积，从而提高移动终端采用COP封装技术封装柔性显示面板时的整机空间利用率。

Description

柔性显示面板及移动终端 【技术领域】
本申请涉及显示封装技术领域，具体而言，涉及一种柔性显示面板及移动终端。
【背景技术】
随着电子科技的快速发展，电子产品行业竞争愈发激烈，用户对手机等电子产品的性能和外观的要求也越来越高。为了提高手机等电子产品的美观性，以及为电子产品提供更好的交互体验，提高手机等具有显示面板的终端设备的屏占比(即显示区域占比)，都成为众多厂家追捧的热点。
目前，常见的高屏占比显示面板，一般采用在下边框设置绑定结构，并利用COP(Chip On Plastic)封装技术，将下边框设置绑定结构的区域弯折至显示面板的背面，从而使显示面板的下边框宽度缩减，进而提高显示面板的屏占比。
但是，目前的显示面板的绑定结构，尺寸相对较大，即使翻转至显示面板的背面，其占用显示面板背面的区域面积也较多，因此，显示面板采用COP封装应用于手机等终端设备中时，虽然能够一定程度提高屏占比，但是设备的整机空间利用率较低，这样也导致设置于显示面板背面的电池等其他部件结构的可用空间较小。
【发明内容】
本申请的目的在于提供一种柔性显示面板及移动终端，能够减小柔性显示面板的绑定区的尺寸，提高移动终端采用COP封装技术封装柔性显示面板时的整机空间利用率。
本申请的实施例是这样实现的：
本申请实施例的一方面，提供一种柔性显示面板，包括：显示面板和柔性电路板，显示面板包括在柔性基板上划分的显示区域和用于引出显示区域的扇出线的绑定区，柔性电路板与绑定区的引线电连接，绑定区位于柔性电路板在柔性基板上的正投影内。
可选地，柔性电路板的连接端在绑定区与引线连接。
可选地，柔性电路板的连接端与引线通过异方性导电胶连接。
可选地，柔性电路板的连接端与引线焊接。
可选地，绑定区位于柔性基板的边缘。
可选地，在柔性基板的绑定区设置有驱动芯片，驱动芯片的引线与扇出线连接，驱动芯片与柔性电路板电连接。
可选地，柔性电路板包括相互电连接的功能器件和连接器，功能器件与绑定区的引线电连接。
可选地，绑定区与柔性电路板之间设有堆叠间隙。
可选地，功能器件位于柔性电路板背离柔性基板的一侧。
可选地，功能器件包括触控芯片。
本申请实施例的另一方面，提供一种移动终端，该移动终端包括上述任一项的柔性显示面板，且该柔性显示面板的柔性基板的绑定区朝向柔性显示面板的背面弯折成形。
本申请实施例的有益效果包括：
本申请实施例提供的一种柔性显示面板，包括显示面板和柔性电路板。显示面板包括在柔性基板上划分的显示区域和用于引出显示区域的扇出线的绑定区，柔性电路板与绑定区的引线电连接，并且绑定区位于柔性电路板在柔性基板上的正投影内。即柔性电路板和绑定区之间呈堆叠设置，从而减少包括绑定区和柔性电路板在内的绑定结构在柔性基板上的总投影面积，以提高该柔性显示面板的堆叠效率，提高移动终端采用COP封装技术封装该柔性显示面板时的整机空间利用率。使移动终端能够有更多的空间设置电池等部件，便于增大电池容量或增加移动终端的其他可用功能。
【附图说明】
为了更清楚地说明本申请实施例的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，应当理解，以下附图仅示出了本申请的某些实施例，因此不应被看作是对范围的限定，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他相关的附图。
图1为本申请实施例提供的柔性显示面板的第一视角的结构示意图；
图2为本申请实施例提供的柔性显示面板的第二视角的结构示意图之一；
图3为本申请实施例提供的柔性显示面板的第二视角的结构示意图之二；
图4为本申请实施例提供的柔性显示面板的结构示意图。
图标：110-驱动芯片；120-柔性电路板；121-功能器件；122-连接器；130-柔性基板；140-绑定区。
【具体实施方式】
为使本申请实施例的目的、技术方案和优点更加清楚，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。通常在此处附图中描述和示出的本申请实施例的组件可以以各种不同的配置来布置和设计。因此，以下对在附图中提供的本申请的实施例的详细描述并非旨在限制要求保护的本申请的范围，而是仅仅表示本申请的选定实施例。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步定义和解释。
在目前常用的高屏占比显示面板中，通常利用COP封装技术对柔性显示面板进行封装。柔性显示面板的封装过程将下边框设置绑定结构的区域弯折至显示面板的背面，从而使显示面板的下边框宽度缩减，进而提高显示面板的屏占比。
但是，目前的显示面板的绑定结构，绑定结构整体尺寸相对较大，弯折至背面后占用显示面板背面的区域面积也较多，因此显示面板采用COP封装应用于手机等终端设备中时，设备的整机空间利用率较低，导致位于显示面板背面的电池等部件的可用空间较小。因此，本申请实施例提供了一种柔性显示面板，能够减小柔性显示面板中包括绑定区和柔性电路板在内的绑定结构在柔性基板上的总投影面积的尺寸，提高移动终端采用COP封装技术封装柔性显示面板时的整机空间利用率。。
图1为本申请实施例提供的柔性显示面板的第一视角的结构示意图，图2为本申请实施例提供的柔性显示面板的第二视角的结构示意图之一，如图1和图2所示，本申请实施例的柔性显示面板包括显示面板和柔性电路板120，显示面板包括在柔性基板130上划分的显示区域和用于引出显示区域的扇出线的绑 定区140，柔性电路板120与绑定区140的引线电连接，以驱动控制柔性显示面板显示区域的画面显示，绑定区140的引线与显示区域的扇出线连接，且绑定区140位于柔性电路板120在柔性基板130上的正投影内。
需要说明的是，为了对于包括绑定区140和柔性电路板120在内的绑定结构的示图清晰，图1和图2中对于显示区域未进行完整显示也未标号，本领域技术人员应当知晓，显示区域在柔性显示面板的基本位置区域以及功能，本申请对于显示区域的结构及原理不再赘述。
需要说明的是，在实际应用中，为了提高绑定区140内引线的散热效果，绑定区140和柔性电路板120之间可以设置堆叠间隙，堆叠间隙能够对绑定区140和柔性电路板120提供一定的独立空间，或者利用该空间完善固定结构。且如若绑定区140设置驱动芯片110，考虑芯片工作状态下的散热等问题，还可以在间隙中设置相应的散热膜层等，此处不做限制。
本申请实施例提供的一种柔性显示面板，如图1所示，包括显示面板和柔性电路板120。显示面板包括在柔性基板130上划分的显示区域和用于引出显示区域的扇出线的绑定区140，柔性电路板120与绑定区140的引线电连接，并且绑定区140位于柔性电路板120在柔性基板130上的正投影内。即柔性电路板120和绑定区140之间呈堆叠设置，从而减少包括绑定区140和柔性电路板120在内的绑定结构在柔性基板130上的总投影面积，以提高该柔性显示面板的堆叠效率，提高移动终端采用COP封装技术封装该柔性显示面板时的整机空间利用率。使移动终端能够有更多的空间设置电池等部件，便于增大电池容量或增加移动终端的其他可用功能。
示例的，如图1和图2所示，柔性显示面板的绑定区140设置驱动芯片110，驱动芯片110设置于柔性显示面板的柔性基板130上，驱动芯片110的引线与柔性显示面板的扇出线连接，以驱动控制柔性显示面板显示区域的画面显示，驱动芯片110还与柔性电路板120电连接。
其中，驱动芯片110位于柔性显示面板的绑定区140，以避免驱动芯片110对柔性显示面板的正常显示造成不良影响。并且，驱动芯片110通过扇出线与柔性显示面板的栅线信号线、数据线信号线、信号线引线等连接，以利用驱动芯片110对柔性显示面板进行驱动显示相应的画面。
柔性电路板120与驱动芯片110连接，通过柔性电路板120能够方便的将 驱动芯片110与驱动电路(主板等)电连接，从而将驱动电路输出的控制信号(驱动信号)传输至驱动芯片110以驱动柔性显示面板。因此，该柔性显示面板的绑定结构中的柔性电路板120，在实际应用中用于与驱动电路连接。并且，在本申请的其他实施例中，柔性电路板120上还可以设置其他与显示面板相关的外围器件(功能器件121)。例如，用于稳定驱动电流和电压的器件等。
可选地，如图1和图2所示，柔性电路板120的连接端在绑定区140与引线连接。
通过将驱动芯片110的引线延伸至绑定区140，使柔性电路板120的连接端在绑定区140与引线连接，能够使驱动芯片110的引线在绑定区140可以更加方便的进行重布线，从而当驱动芯片110的尺寸B(如图1和图4所示)较小时，能够利用其引线在绑定区140的重布线，提高柔性电路板120与驱动芯片110之间连接的便捷性，便于高性能、高密度驱动芯片110在该柔性显示面板中应用。
在实际应用中，柔性电路板120的连接端与驱动芯片110的引线之间具体的连接方式，本领域技术人员可以根据实际需要进行设置，此处不做限制。
示例地，柔性电路板120的连接端与引线通过异方性导电胶连接。
通过ACF(Anisotropic Conductive Film，异方性导电胶)将驱动芯片110的引线与柔性电路板120的连接段粘接并电性连接，工艺相对简单易于操作，且成本相对较低。并且，能够降低相邻电极之间因电性连接而短路导通的几率。
当然，在实际应用中，异方性导电胶还可以通过其他导电胶代替，例如导电银胶等此处不做限制。
示例地，柔性电路板120的连接端与引线焊接。
通常可以在柔性电路板120的连接端的电极上，以及驱动芯片110的引线上分别设置对应的焊盘，然后通过锡焊等方式将对应的焊盘焊接在一起，实现对柔性线路板的固定和两者之间的电性连接。该方式，结构相对稳定，固定的性能和效果也相对较好。
可选地，如图2所示，绑定区140位于柔性基板130的边缘。
将绑定区140设置于柔性基板130的边缘，能够避免柔性基板130的边缘在COP封装后过多占用柔性显示面板背面区域，从而进一步增加柔性显示面板背面的可用空间。
可选地，如图2所示，柔性电路板120包括相互电连接的功能器件121和连接器122(如图1所示)，功能器件121与绑定区140的引线(驱动芯片110的引线)电连接。
通过功能器件121能够为柔性显示面板提供其他显示相关的功能。并且，利用连接器122(板对板连接器122等)能够使该柔性电路板120可以更加方便的与主板等驱动电路进行连接，提高该柔性显示面板在移动终端中的可拆卸性，便于组装。
在实际应用中，本领域技术人员可以根据实际功能设计对柔性电路板120上的功能器件121进行设置，且功能器件121可以为一个或多个，当包括多个功能器件121时，多个功能器件121用于实现柔性显示面板除显示功能以外的多种其他附加功能，此处对于功能器件121的具体功能和数量均不做限制。
示例地，功能器件121包括触控芯片。
在柔性显示面板的绑定区域设置触控芯片，与之对应的，在柔性显示面板的显示区域还集成有触控层，这样一来，通过设置的与显示区域的触控层信号连接的触控芯片，能够使得柔性显示面板中的触控层受驱工作实现柔性显示面板的触控功能。又例如，在实际应用中，以移动终端为手提电话为例，常用的功能器件121还包括指纹识别驱动，对应的，在柔性显示面板的显示区域的特定位置集成有指纹感应结构，通过指纹识别驱动能够使得指纹感应结构工作以识别使用者指纹，实现柔性显示面板的屏幕解锁等功能，当然，功能器件121不限于上述的举例内容，本申请实施例中对此不做限制。
可选地，功能器件121位于柔性电路板120背离柔性基板130的一侧。
通过将功能器件121设置于柔性电路板120背离柔性基板130的一侧，能够避免功能器件121和驱动芯片110相接触或靠近，从而使功能器件121以及驱动芯片110的散热更加方便，效果更好。从而提高该柔性显示面板的绑定结构的性能，以及功能稳定性。
当然，在实际应用中，如图3所示，图3本申请实施例提供的柔性显示面板的绑定结构的第二视角的结构示意图之二，功能器件121还可以位于柔性电路板120靠近柔性基板130的一侧。
示例地，柔性显示面板可以采用OLED(Organic Light-Emitting Diode，有机电致发光)器件作为发光显示器件，即该柔性显示面板为OLED自发光显示 面板。OLED自发光显示面板的柔性基板130可以采用聚酰亚胺塑料、聚醚醚酮等高分子材料，此处不做限制。
通常柔性基板130的边框伸出于柔性显示面板的显示区域，即位于非显示区域(非显示区域包括绑定区140，还可以包括其他如扇出区、边框区、虚拟区等)。上述绑定结构可以设置于边框上，在进行COP封装时，柔性基板130设置上述绑定结构的边框部分则朝向面板的背面弯折，从而使上述绑定结构(绑定区140及柔性电路板120)能够位于柔性显示面板的背面，以减小柔性显示面板的边框宽度，从而实现窄边框封装。
其中，柔性显示面板的背面为面板不出光的一侧，即背离面板显示画面的一侧的平面。
此外，柔性显示面板在其扇出区(位于显示面板的非显示区域)可以采用上述的绑定结构与主板等驱动电路进行绑定。通过柔性电路板120和驱动芯片110之间堆叠设置，从而减少包括绑定区140和柔性电路板120在内的绑定结构，在柔性基板130上的投影面积。以提高该柔性显示面板的堆叠效率，从而提高移动终端采用COP封装技术封装该柔性显示面板时的整机空间利用率。使移动终端能够有更多的空间设置电池的等部件，以便于增大电池容量或增加终端功能。
本申请实施例的另一方面，提供一种移动终端，该移动终端包括上述任意一项的柔性显示面板，且该柔性显示面板的柔性基板130的绑定区140朝向柔性显示面板的背面弯折成形。
通常，该移动终端还包括主板、电池等其他部件。以手机为例，在主板和电池均设置于柔性显示面板的背面，且电池位于柔性显示面板弯折成形的部分以及主板之间。
当然，在实际应用中，移动终端还可以是平板电脑、显示器、智能手表等，此处不做限制。
移动终端采用上述的柔性显示面板，具有较小的绑定结构，其采用COP封装之后，具有较高的整机堆叠效率，从而使其壳体内部柔性显示面板以外的空间更大，能够更加方便的设置体积和容量更大的电池，也能够更方便的增设其他功能部件，实现多样的功能。
以上所述仅为本申请的优选实施例而已，并不用于限制本申请，对于本领 域的技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (20)

  1. 一种柔性显示面板，其特征在于，包括：
    显示面板，所述显示面板包括在柔性基板上划分的显示区域和用于引出所述显示区域的扇出线的绑定区；和
    柔性电路板，所述柔性电路板与所述绑定区的引线电连接，所述绑定区位于所述柔性电路板在所述柔性基板上的正投影内。
  2. 如权利要求1所述的柔性显示面板，其特征在于，所述柔性电路板的连接端在所述绑定区与所述引线连接。
  3. 如权利要求2所述的柔性显示面板，其特征在于，所述柔性电路板的连接端与所述引线通过异方性导电胶连接。
  4. 如权利要求2所述的柔性显示面板，其特征在于，所述柔性电路板的连接端与所述引线焊接。
  5. 如权利要求2所述的柔性显示面板，其特征在于，所述绑定区位于所述柔性基板的边缘。
  6. 如权利要求1所述的柔性显示面板，其特征在于，在所述柔性基板的绑定区设置有驱动芯片，所述驱动芯片的引线与所述扇出线连接，所述驱动芯片与所述柔性电路板电连接。
  7. 如权利要求1所述的柔性显示面板，其特征在于，所述柔性电路板包括相互电连接的功能器件和连接器，所述功能器件与所述绑定区的引线电连接。
  8. 如权利要求1所述的柔性显示面板，其特征在于，所述绑定区与所述柔性电路板之间设有堆叠间隙。
  9. 如权利要求7所述的柔性显示面板，其特征在于，所述功能器件位于所述柔性电路板背离所述柔性基板的一侧。
  10. 如权利要求7或8所述的柔性显示面板，其特征在于，所述功能器件包括触控芯片。
  11. 一种移动终端，其特征在于，包括柔性显示面板，且所述柔性显示面板的柔性基板的绑定区朝向所述柔性显示面板的背面弯折成形；
    所述柔性显示面板包括：
    显示面板，所述显示面板包括在柔性基板上划分的显示区域和用于引出所 述显示区域的扇出线的绑定区；
    柔性电路板，所述柔性电路板与所述绑定区的引线电连接，所述绑定区位于所述柔性电路板在所述柔性基板上的正投影内。
  12. 如权利要求11所述的移动终端，其特征在于，所述柔性电路板的连接端在所述绑定区与所述引线连接。
  13. 如权利要求12所述的移动终端，其特征在于，所述柔性电路板的连接端与所述引线通过异方性导电胶连接。
  14. 如权利要求12所述的移动终端，其特征在于，所述柔性电路板的连接端与所述引线焊接。
  15. 如权利要求12所述的移动终端，其特征在于，所述绑定区位于所述柔性基板的边缘。
  16. 如权利要求11所述的移动终端，其特征在于，在所述柔性基板的绑定区设置有驱动芯片，所述驱动芯片的引线与所述扇出线连接，所述驱动芯片与所述柔性电路板电连接。
  17. 如权利要求11所述的移动终端，其特征在于，所述柔性电路板包括相互电连接的功能器件和连接器，所述功能器件与所述绑定区的引线电连接。
  18. 如权利要求11所述的移动终端，其特征在于，所述绑定区与所述柔性电路板之间设有堆叠间隙。
  19. 如权利要求17所述的移动终端，其特征在于，所述功能器件位于所述柔性电路板背离所述柔性基板的一侧。
  20. 如权利要求17或18所述的移动终端，其特征在于，所述功能器件包括触控芯片。
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