WO2022082898A1 - 钻头的使用方法及制备方法 - Google Patents

钻头的使用方法及制备方法 Download PDF

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Publication number
WO2022082898A1
WO2022082898A1 PCT/CN2020/128174 CN2020128174W WO2022082898A1 WO 2022082898 A1 WO2022082898 A1 WO 2022082898A1 CN 2020128174 W CN2020128174 W CN 2020128174W WO 2022082898 A1 WO2022082898 A1 WO 2022082898A1
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WO
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Prior art keywords
drill
drill bit
layer
edge
drilling
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PCT/CN2020/128174
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English (en)
French (fr)
Inventor
郑鑫
陈汉泉
Original Assignee
广东鼎泰高科技术股份有限公司
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Application filed by 广东鼎泰高科技术股份有限公司 filed Critical 广东鼎泰高科技术股份有限公司
Priority to US18/031,338 priority Critical patent/US20230347419A1/en
Publication of WO2022082898A1 publication Critical patent/WO2022082898A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B35/00—Methods for boring or drilling, or for working essentially requiring the use of boring or drilling machines; Use of auxiliary equipment in connection with such methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/16—Perforating by tool or tools of the drill type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B51/00—Tools for drilling machines
    • B23B51/02—Twist drills
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/28—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools
    • B23P15/32—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools twist-drills
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2228/00—Properties of materials of tools or workpieces, materials of tools or workpieces applied in a specific manner
    • B23B2228/10—Coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
    • B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection

Definitions

  • the present application relates to the technical field of machining tools, for example, to a method for using and preparing a drill.
  • the plated through hole (PTH) in the multilayer printed circuit board (PCB) plays the function of interconnecting the inner power layer and the ground layer.
  • PTH plated through hole
  • the PTH hole will It becomes the bottleneck and obstacle of signal integrity. It is like a redundant "tail" (Stubs) in the transmission line, which acts as a notch filter.
  • a redundant "tail" in the transmission line, which acts as a notch filter.
  • the oscillating section whether it is filtering or oscillating, will cause damage to high-speed signal transmission and distort the signal.
  • the widely used method is the back-drilling method.
  • the back-drilling method is highly dependent on the process, and on the other hand, the depth of the back-drilling is difficult to control.
  • the present application provides a method for using a drill bit and a method for preparing the drill bit.
  • the drilling depth can be accurately controlled, and at the same time, there is no dependence on the process, and the processing efficiency and processing accuracy can be improved.
  • An embodiment provides a method of using a drill bit, wherein the drill bit includes a drill shank, a drill edge and a drill tip connected in sequence, the drill tip is capable of conducting electricity and the drill edge is covered with a non-conductive film layer, the use of the drill bit
  • the method includes the following steps:
  • the distance H time difference t ⁇ drill-down speed v.
  • the diameter of the drilled hole of the depth control drill is larger than the diameter of the through hole.
  • the drill bit further includes a transition table, one end of the transition table is connected with the drill shank and the other end is connected with the drill edge.
  • the transition table is of a circular truncated shape.
  • An embodiment provides a method for preparing a drill bit, which is used to prepare the above-mentioned drill bit, and the preparation method for the drill bit includes:
  • the drill bit further includes a transition table, one end of the transition table is connected with the drill shank and the other end is connected with the drill edge; the step S21 includes: processing the raw material bar into a A semi-finished product of the drill shank, the transition table and the drill edge profile.
  • the raw material bar is processed into a semi-finished product having the drill shank, the transition table and the outline of the drill edge by grinding the outer circle and level difference processing with a rough and fine grinding device.
  • the non-conductive film layer is coated on the part of the profile of the drill edge by a PVD method or a CVD method.
  • the drill bit provided by the present application comprises a drill shank, a drill edge and a drill tip which are connected in sequence, the drill tip can conduct electricity, and the drill edge is covered with a non-conductive film layer.
  • To be able to conduct electricity first collect the feedback time T of each conductive layer of the plate to be processed through the drill tip, then determine the target layer and reference layer of the plate to be processed, and calculate the time difference t between the target layer and the reference layer; then according to the time difference t and The drilling speed v of the drill bit determines the distance H between the target layer and the reference layer; finally, the distance H is used as the drilling depth to carry out depth-controlled drilling from the reference layer on the basis of the through hole. Controlling the depth of drilling by the above method can precisely control the drilling depth, so as to get rid of the dependence on the control of the thickness of the plate and the process flow, and can improve the processing efficiency and processing accuracy.
  • FIG. 1 is a flow chart of the main steps of a method for using a drill bit provided by an embodiment of the present application
  • FIG. 2 is a schematic structural diagram of a drill bit provided in an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a through hole drilled on a plate to be processed provided by an embodiment of the present application;
  • FIG. 4 is a schematic structural diagram of a controlled deep drilling on a plate to be processed provided by an embodiment of the present application
  • Fig. 5 is the main step flow chart of the preparation method of the drill bit provided by the embodiment of the present application.
  • FIG. 6 is a detailed flow chart of the steps of the method for preparing the drill bit provided in the embodiment of the present application.
  • connection should be understood in a broad sense, for example, it may be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between the two elements.
  • connection may be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between the two elements.
  • a first feature "on” or “under” a second feature may include the first and second features in direct contact, or may include the first and second features Not directly but through additional features between them.
  • the first feature being “above”, “over” and “above” the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature.
  • the first feature is “below”, “below” and “below” the second feature includes the first feature is directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.
  • the drill bit 1 includes a drill shank 11, a drill edge 12 and a drill tip 13 which are connected in sequence.
  • the drill tip 13 can conduct electricity and the drill edge 12 is covered with a non-conductive film layer 15.
  • the use method of the drill bit includes the following step:
  • the plate 2 to be processed includes a plurality of conductive layers arranged at intervals.
  • the drill bit 1 is used to drill through holes 21 on the plate 2 to be processed, since the drill tip 13 can conduct electricity and the drill edge 12 is covered with a non-conductive film layer 15, the drill edge 12 It cannot conduct electricity, so when the drill tip 13 contacts the conductive layer of the plate 2 to be processed, the feedback time T of each conductive layer can be collected.
  • the plate 2 to be processed is a PCB board, and in other embodiments, the plate 2 to be processed may also have other structures.
  • S12 Determine the target layer and the reference layer of the plate 2 to be processed, and calculate the time difference t between the target layer and the reference layer.
  • the reference layer may be the surface layer or the inner layer, which can be selected according to the processing conditions. After the reference layer and the target layer are selected, the target layer and the target layer are calculated according to the feedback time T collected by the drill tip 13 in step S11. The time difference t between the reference layers.
  • the distance H in step S13 time difference t ⁇ drill-down speed v.
  • the distance between the target layer and the reference layer can be determined by the time difference t between the target layer and the reference layer and the drilling speed v of the drill bit 1. Since the drilling speed v of the drill bit 1 can be precisely controlled by the machine, it can be guaranteed that the speed obtained by the above method can be guaranteed. The value of distance H is more precise.
  • the diameter of the drilled hole 22 of the controlled depth drilling is larger than the diameter of the through hole 21 .
  • the outer diameter of the drill edge 12 of the drill bit 1 used in the above step S14 should be larger than that of the drill bit 1 used when drilling the through hole 21.
  • the outer diameter of the blade 12 is about 2mm-3mm.
  • the drill bit 1 further includes a transition table 14 , one end of the transition table 14 is connected with the drill shank 11 and the other end is connected with the drill edge 12 .
  • the transition table 14 is in the shape of a circular frustum.
  • the larger end of the transition table 14 is connected to the drill shank 11
  • the smaller end of the outer diameter is connected to the drill edge 12 .
  • the transition table 14 may also have other shapes, or the transition table 14 may not be provided.
  • the non-conductive film layer 15 is a DLC coating.
  • the DLC coating has the advantages of high hardness, low friction coefficient, good film density and chemical stability, etc., and can prolong the service life of the drill edge 12 .
  • Whether to coat the non-conductive film layer 15 at the positions of the drill shank 11 and the transition table 14 is not limited here, and can be adaptively selected according to actual use requirements. In other embodiments, the non-conductive film layer 15 may also be other coatings.
  • the present embodiment also provides a method for preparing a drill bit, which is used to prepare the above-mentioned drill bit 1, as shown in Figures 5 and 6, the preparation method for the drill bit includes the following steps:
  • the stock bar is machined into a semi-finished product with the profile of the drill shank 11 , the transition table 14 and the drill edge 12 . That is, the shank 11 and the transition table 14 of the drill bit 1 are processed from the raw bar material, and the outline of the drill edge 12 is processed to form a semi-finished product.
  • the raw material bar is processed into a semi-finished product.
  • other equipment or other processing techniques may also be used, but the technical requirements of the semi-finished product should be guaranteed as required.
  • a helical groove is set on the contour of the drill edge 12 of the semi-finished product.
  • the drilling edge 12 is partially processed, and the waste material in the drilling process can be discharged through the helical groove.
  • the specific shape, size and quantity of the spiral groove there is no restriction here, and it can be adaptively selected according to the actual use requirements.
  • one end of the spiral groove away from the transition table 14 is ground to form the drill tip 13 .
  • the length of the drill tip 13 there is no limitation here, and it can be set adaptively according to actual use requirements.
  • the non-conductive film layer 15 is coated by a PVD method or a CVD method.
  • the coating effect of the PVD method or the CVD method is good, and the performance of the non-conductive film layer 15 can be guaranteed.
  • other methods may also be used to coat the non-conductive film layer 15 .
  • the non-conductive film layer 15 of the drill tip 13 should be polished off to ensure the conduction effect.
  • the non-conductive film layer 15 may be coated only on the outside of the drill edge 12 in step S24.
  • the drill bit 1 is prepared by the above-mentioned preparation method, and the above-mentioned method of using the drill bit is used to drill holes on the plate 2 to be processed, so that the drilling depth can be accurately controlled during deep drilling, thereby eliminating the need for the thickness of the plate and the process.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Drilling Tools (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

一种钻头(1)的使用方法及制备方法，其中钻头(1)包括依次连接的钻柄(11)、钻刃(12)和钻尖(13)，钻尖(13)能够导电且钻刃(12)覆盖有非导电膜层(15)。该钻头(1)的使用方法包括：S11、在待加工板材(2)上通过钻头(1)钻通孔(21)，并通过钻尖(13)采集待加工板材(2)的每一个导电层的反馈时间T；S12、确定待加工板材(2)的目标层和参考层，计算目标层和参考层的时间差t；S13、根据时间差t和钻头(1)的下钻速度v确定目标层与参考层之间的距离H；S14、以距离H为下钻深度在通孔(21)的基础上从参考层开始进行控深钻。钻头(1)的制备方法包括：S21、将原料棒材加工成具有钻刃(12)轮廓的半成品；S22、在半成品的钻刃(12)轮廓上开设螺旋槽；S23、将螺旋槽的自由端磨尖加工出钻尖(13)；S24、在钻刃(12)轮廓的部分涂覆非导电膜层(15)；S25、将钻尖(13)部分的非导电膜层(15)打磨掉。

Description

钻头的使用方法及制备方法
本申请要求申请日为2020年10月22日、申请号为202011140390.4的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请涉及机械加工刀具技术领域，例如涉及一种钻头的使用方法及制备方法。
背景技术
多层印制电路板(Printed Circuit Board，PCB)中镀通孔(Plating Through Hole，PTH)起到内层电源层与接地层的相互连通的功能，当系统进入高速讯号传输时，PTH孔将成为信号完整性的瓶颈和障碍，在传输线中犹如一条多余的“尾巴”(Stubs)，扮演着凹痕式滤波器的功能，在信号传输线路中，两处出现这种Stubs时，将形成一段震荡段，不管是滤波或是震荡，对高速讯号传输都会造成伤害，使信号失真。目前被广泛应用的方法是背钻法，但是，背钻法一方面对工序依赖大，另一方面背钻深度不好控制。
发明内容
本申请提供了一种钻头的使用方法及制备方法，在使用钻头控深钻时，能够精确控制下钻深度，同时对于工序没有依赖，能够提高加工效率和加工精度。
一实施例提供一种钻头的使用方法，其中，钻头包括依次连接的钻柄、钻刃和钻尖，所述钻尖能够导电且所述钻刃覆盖有非导电膜层，所述钻头的使用方法包括以下步骤：
S11、在待加工板材上通过所述钻头钻通孔，并通过所述钻尖采集所述待加工板材的每一个导电层的反馈时间T；
S12、确定所述待加工板材的目标层和参考层，计算所述目标层和所述参考层的时间差t；
S13、根据所述时间差t和所述钻头的下钻速度v确定所述目标层与所述参考层之间的距离H；
S14、以所述距离H为下钻深度在所述通孔的基础上从所述参考层开始进行控深钻。
可选地，所述步骤S13中的所述距离H＝时间差t×下钻速度v。
可选地，所述控深钻的钻孔的直径大于所述通孔的直径。
可选地，所述钻头还包括过渡台，所述过渡台的一端与所述钻柄连接且另一端与所述钻刃连接。
可选地，所述过渡台为圆台型。
一实施例提供一种钻头的制备方法，用于制备上述的钻头，所述钻头的制备方法包括：
S21、将原料棒材加工成具有所述钻刃轮廓的半成品；
S22、在所述半成品的所述钻刃轮廓上开设螺旋槽；
S23、将所述螺旋槽的自由端磨尖加工出所述钻尖；
S24、在所述钻刃轮廓的部分涂覆所述非导电膜层；
S25、将所述钻尖部分的所述非导电膜层打磨掉。
可选地，所述钻头还包括过渡台，所述过渡台的一端与所述钻柄连接且另一端与所述钻刃连接；所述步骤S21包括：将所述原料棒材加工成具有所述钻柄、所述过渡台和所述钻刃轮廓的半成品。
可选地，所述步骤S21中通过粗精磨设备磨外圆、段差加工将所述原料棒材加工成具有所述钻柄、所述过渡台和所述钻刃轮廓的半成品。
可选地，所述步骤S24中通过PVD方法或CVD方法在所述钻刃轮廓的部分涂覆所述非导电膜层。
本申请提供的钻头包括依次连接的钻柄、钻刃和钻尖，且钻尖能够导电，钻刃覆盖有非导电膜层，在使用该钻头在待加工板材上钻通孔时，由于钻尖能够导电，首先通过钻尖采集待加工板材的每一个导电层的反馈时间T，然后确定待加工板材的目标层和参考层，并计算目标层和参考层的时间差t；接下来根据时间差t和钻头的下钻速度v确定目标层与参考层之间的距离H；最后以距离H为下钻深度在通孔的基础上从参考层开始进行控深钻。通过上述方法进行控深钻能够精确控制下钻深度，从而摆脱对板材厚度和工艺流程控制的依赖性，能够提高加工效率和加工精度。
附图说明
图1是本申请实施例提供的钻头的使用方法的主要步骤流程图；
图2是本申请实施例提供的钻头的结构示意图；
图3是本申请实施例提供的待加工板材上钻有通孔的结构示意图；
图4是本申请实施例提供的在待加工板材上控深钻的结构示意图；
图5是本申请实施例提供的钻头的制备方法的主要步骤流程图；
图6是本申请实施例提供的钻头的制备方法的详细步骤流程图。
图中：
1-钻头；11-钻柄；12-钻刃；13-钻尖；14-过渡台；15-非导电膜层；
2-待加工板材；21-通孔；22-钻孔。
具体实施方式
在本申请的描述中，除非另有明确的规定和限定，术语“相连”、“连接”、“固定”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
如图1-图4所示，钻头1包括依次连接的钻柄11、钻刃12和钻尖13，钻尖13能够导电且钻刃12覆盖有非导电膜层15，钻头的使用方法包括以下步骤：
S11、在待加工板材2上通过钻头1钻通孔21，并通过钻尖13采集待加工板材2的每一个导电层的反馈时间T。
待加工板材2包括多个间隔设置的导电层，当使用钻头1在待加工板材2上钻通孔21时，由于钻尖13能够导电且钻刃12覆盖有非导电膜层15，钻刃 12不能够导电，因此当钻尖13接触到待加工板材2的导电层时，能够采集到的每一个导电层的反馈时间T。至于钻尖13采集导电层的反馈时间的具体工作原理，已为相关技术，在此不在进行赘述。本实施例中，待加工板材2为PCB板，在其他实施例中，待加工板材2也可以为其他结构。
S12、确定待加工板材2的目标层和参考层，计算目标层和参考层的时间差t。
本实施例中，参考层可以为表层也可以为内层，可根据加工条件进行选取，当选定参考层和目标层后，根据步骤S11中钻尖13采集到的反馈时间T计算目标层和参考层之间的时间差t。
S13、根据时间差t和钻头1的下钻速度v确定目标层与参考层之间的距离H。
可选地，步骤S13中的距离H＝时间差t×下钻速度v。通过目标层与参考层之间的时间差t以及钻头1的下钻速度v即可确定二者之间的距离，由于钻头1的下钻速度v可由机器精确控制，因此能够保证通过上述方法得到的距离H的数值更加精确。
S14、以距离H为下钻深度在通孔21的基础上从参考层开始进行控深钻。
可选地，控深钻的钻孔22的直径大于通孔21的直径。为保证控深钻的钻孔22的直径大于通孔21的直径，在上述步骤S14中所使用的的钻头1的钻刃12的外径应大于在钻通孔21时使用的钻头1的钻刃12的外径2mm-3mm左右。通过上述方法在通孔21的基础上进行控深钻，能够精确控制下钻深度，从而摆脱对板材厚度和工艺流程控制的依赖性，提高加工效率和加工精度。
可选地，如图2所示，钻头1还包括过渡台14，过渡台14的一端与钻柄11连接且另一端与钻刃12连接。可选地，过渡台14为圆台型。本实施例中，过渡台14的外径较大的一端与钻柄11连接，外径较小的一端与钻刃12连接。在其他实施例中，过渡台14也可以为其它形状，或者也可以不设置过渡台14。
本实施例中，非导电膜层15为DLC涂层。DLC涂层具有高硬度、低摩擦系数、良好的膜层致密性以及化学稳定性等优点，能够延长钻刃12的使用寿命。至于在钻柄11和过渡台14的位置是否涂覆非导电膜层15，在此不做限定，可根据实际使用需求适应性选择。在其他实施例中，非导电膜层15也可以为其他涂层。
本实施例还提供了一种钻头的制备方法，用于制备上述的钻头1，如图5和 图6所示，该钻头的制备方法包括以下步骤：
S21、将原料棒材加工成具有钻刃12轮廓的半成品。
可选地，将原料棒材加工成具有钻柄11、过渡台14和钻刃12轮廓的半成品。即，将原料棒材加工出钻头1的钻柄11、过渡台14结构，并加工出钻刃12的轮廓，形成半成品。本实施例中，使用粗精磨设备磨外圆并进行段差加工后，将原料棒材加工成半成品。在其他实施例中，也可以使用其他设备或者其他加工工艺，但应需保证半成品的技术要求。
S22、在半成品的钻刃12轮廓上开设螺旋槽。
在钻刃12的外轮廓上开设螺旋槽后，钻刃12部分加工完毕，通过螺旋槽能够将钻孔过程中的废料排出。至于螺旋槽的具体形状尺寸以及数量在此不做限制，可根据实际使用需求适应性选择。
S23、将螺旋槽的自由端磨尖加工出钻尖13。
接下来打磨螺旋槽远离过渡台14的一端以形成钻尖13，至于钻尖13的长度，在此不作限制，可根据实际使用需求适应性设置。
S24、在钻刃12轮廓的部分涂覆非导电膜层15。
本实施例中，通过PVD方法或CVD方法涂覆非导电膜层15。使用PVD方法或CVD方法的涂覆效果好，能够保证非导电膜层15的使用性能。在其他实施例中，也可以采用其他方法涂覆非导电膜层15。
S25、将钻尖13部分的非导电膜层15打磨掉。
由于需要通过钻尖13采集反馈信号，因此需要保证钻尖13部分能够导电，所以最后应将钻尖13部分的非导电膜层15打磨掉，以保证导电效果。在其他实施例中，也可以在步骤S24中仅对钻刃12的外部涂覆非导电膜层15。
本实施例中，通过上述制备方法制备出钻头1，并采用上述的钻头使用方法在待加工板材2上钻孔，能够在控深钻的时候精确控制下钻深度，从而摆脱对板材厚度和工艺流程控制的依赖性，提高加工效率和加工精度。

Claims (9)

  1. 一种钻头的使用方法，其中，钻头(1)包括依次连接的钻柄(11)、钻刃(12)和钻尖(13)，所述钻尖(13)能够导电且所述钻刃(12)覆盖有非导电膜层(15)，所述钻头的使用方法包括以下步骤：
    S11、在待加工板材(2)上通过所述钻头(1)钻通孔(21)，并通过所述钻尖(13)采集所述待加工板材(2)的每一个导电层的反馈时间T；
    S12、确定所述待加工板材(2)的目标层和参考层，计算所述目标层和所述参考层的时间差t；
    S13、根据所述时间差t和所述钻头(1)的下钻速度v确定所述目标层与所述参考层之间的距离H；
    S14、以所述距离H为下钻深度在所述通孔(21)的基础上从所述参考层开始进行控深钻。
  2. 根据权利要求1所述的钻头的使用方法，其中，所述步骤S13中的所述距离H＝时间差t×下钻速度v。
  3. 根据权利要求1所述的钻头的使用方法，其中，所述控深钻的钻孔(22)的直径大于所述通孔(21)的直径。
  4. 根据权利要求1所述的钻头的使用方法，其中，所述钻头(1)还包括过渡台(14)，所述过渡台(14)的一端与所述钻柄(11)连接且另一端与所述钻刃(12)连接。
  5. 根据权利要求4所述的钻头的使用方法，其中，所述过渡台(14)为圆台型。
  6. 一种钻头的制备方法，用于制备权利要求1-5任一项所述的钻头(1)，所述钻头的制备方法包括：
    S21、将原料棒材加工成具有所述钻刃(12)轮廓的半成品；
    S22、在所述半成品的所述钻刃(12)轮廓上开设螺旋槽；
    S23、将所述螺旋槽的自由端磨尖加工出所述钻尖(13)；
    S24、在所述钻刃(12)轮廓的部分涂覆所述非导电膜层(15)；
    S25、将所述钻尖(13)部分的所述非导电膜层(15)打磨掉。
  7. 根据权利要求6所述的钻头的制备方法，其中，所述钻头(1)还包括过渡台(14)，所述过渡台(14)一端与所述钻柄(11)连接且另一端与所述钻刃(12)连接；
    所述步骤S21包括：将所述原料棒材加工成具有所述钻柄(11)、所述过 渡台(14)和所述钻刃(12)轮廓的半成品。
  8. 根据权利要求7所述的钻头的制备方法，其中，所述步骤S21中通过粗精磨设备磨外圆、段差加工将所述原料棒材加工成具有所述钻柄(11)、所述过渡台(14)和所述钻刃(12)轮廓的半成品。
  9. 根据权利要求6所述的钻头的制备方法，其中，所述步骤S24中通过PVD方法或CVD方法在所述钻刃(12)轮廓的部分涂覆所述非导电膜层(15)。
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