WO2022082515A1 - 微孔雾化片以及超声雾化装置 - Google Patents

微孔雾化片以及超声雾化装置 Download PDF

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Publication number
WO2022082515A1
WO2022082515A1 PCT/CN2020/122538 CN2020122538W WO2022082515A1 WO 2022082515 A1 WO2022082515 A1 WO 2022082515A1 CN 2020122538 W CN2020122538 W CN 2020122538W WO 2022082515 A1 WO2022082515 A1 WO 2022082515A1
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WIPO (PCT)
Prior art keywords
conductive layer
piezoelectric ceramic
ceramic sheet
sheet
atomizing
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Application number
PCT/CN2020/122538
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English (en)
French (fr)
Inventor
张谢恩
程时毅
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深圳麦克韦尔科技有限公司
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Priority to PCT/CN2020/122538 priority Critical patent/WO2022082515A1/zh
Publication of WO2022082515A1 publication Critical patent/WO2022082515A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
    • B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
    • B05B17/0638—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers spray being produced by discharging the liquid or other fluent material through a plate comprising a plurality of orifices
    • B05B17/0646—Vibrating plates, i.e. plates being directly subjected to the vibrations, e.g. having a piezoelectric transducer attached thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations

Definitions

  • the present application relates to the technical field of atomization, in particular to a microporous atomizing sheet and an ultrasonic atomizing device.
  • the microporous atomizer includes piezoelectric ceramics and metal microporous diaphragms. Its main function is to use the high-frequency vibration of piezoelectric ceramics to drive the metal microporous diaphragm to resonate. The metal micropores continuously and repeatedly deform with the vibration to squeeze the solution. The output is broken into fine mist droplets to form atomized vapor. It has a wide range of applications in various fields such as household humidification, aromatherapy and beauty, surface spraying, air purification and medical equipment.
  • one electrode is generally formed on the piezoelectric ceramic, another electrode is formed on the metal diaphragm, and two leads are welded to the two electrodes respectively, and the two leads are connected through the two leads.
  • a voltage is applied to cause the piezoelectric ceramic to vibrate.
  • the lead wire is directly welded to the electrode, which makes the connection between the lead wire and the electrode easy to break.
  • the lead wire needs to be manually welded to the electrode first, which is not easy to assemble, and the atomizer chip cannot be It can be removed directly, so that the user cannot replace it by himself.
  • the present application provides a microporous atomizing sheet and an ultrasonic atomizing device, so that the atomizing sheet is easy to assemble and disassemble for self-replacement.
  • the first technical solution provided by the present application is to provide a microporous atomizing sheet, including: a piezoelectric ceramic sheet; The first side of the ceramic sheet; the second conductive layer is stacked with the piezoelectric ceramic sheet and is located on the second side of the piezoelectric ceramic sheet away from the first conductive layer; the first conductive layer extends along the sidewall of the piezoelectric ceramic sheet to the pressure the second side of the electric ceramic sheet, so that the part of the first conductive layer on the second side is used to abut the first spring pin, and the second conductive layer is used to abut the second spring pin on the second side; wherein, the first A conductive layer or the second conductive layer has atomization holes.
  • the first conductive layer includes a main body part and an extension part; the extension part is connected to the main body part and extends to the second side along the side wall of the piezoelectric ceramic sheet, and the extension part is used for abutting the first elastic pin.
  • the extension part and the main body part are integrally formed, the extension part includes a wrapping part and an abutting part, the wrapping part is connected to the main body part and wraps a part of the side wall of the piezoelectric ceramic sheet, and the abutting part is connected to the wrapping part and is arranged on the second side, The abutting portion is used for abutting the first spring needle.
  • the second conductive layer has an opening at a position corresponding to the abutting portion, and the abutting portion is attached to a part of the surface of the piezoelectric ceramic sheet exposed through the opening, and is insulated from the second conductive layer.
  • the first conductive layer has an atomization hole, and the atomization hole is located at the position of the main body portion corresponding to the central through hole of the piezoelectric ceramic sheet.
  • the second conductive layer has atomization holes.
  • the first conductive layer is formed by coating or deposition.
  • the thickness of the first conductive layer is 0.05 mm to 0.1 mm; the surface of the contact portion away from the piezoelectric ceramic sheet is further provided with a metal sheet, and the metal sheet is used for abutting the first elastic pin.
  • the extension part is an independent element from the main body part, the extension part includes a fitting part, a wrapping part and an abutting part;
  • the contact portion is arranged on the second side, and the contact portion is insulated from the second conductive layer.
  • the second conductive layer has atomization holes, the main body of the first conductive layer is formed by coating or deposition; the second conductive layer has an opening at the position corresponding to the abutting part, and the abutting part is connected to the piezoelectric ceramic sheet Part of the surface exposed through the opening is attached.
  • the second conductive layer has atomizing holes, the main body of the first conductive layer is formed by coating or deposition; the extension part is a flexible circuit board, two ends of the flexible circuit board are bent to the same side, and one end is used as a sticker
  • the joint part is electrically connected to the main body part, and the other end is fixed on the surface of the second conductive layer away from the piezoelectric ceramic sheet as an abutting part.
  • the thickness of the first conductive layer is 0.1 mm to 0.5 mm.
  • the microporous atomizing sheet further comprises: a first adhesive layer, located between the first conductive layer and the piezoelectric ceramic sheet, to bond the first conductive layer and the piezoelectric ceramic sheet; a second adhesive layer, located in the second between the conductive layer and the piezoelectric ceramic sheet to bond the second conductive layer and the piezoelectric ceramic sheet.
  • the edge position of the first conductive layer or the second conductive layer is provided with a positioning portion.
  • the second technical solution provided by the present application is to provide an ultrasonic atomization device, the ultrasonic atomization device includes a microporous atomization sheet and a power supply assembly; the power supply assembly includes: a power supply, and a power supply connected to the power supply.
  • the first elastic pin and the second elastic pin; the microporous atomizing sheet of any one of the above-mentioned microporous atomizing sheet, and the first conductive layer of the microporous atomizing sheet abuts the first elastic pin on the second side, and the first The two conductive layers abut against the second spring pin on the second side.
  • the first conductive layer extends along the sidewall of the piezoelectric ceramic sheet to the second side of the piezoelectric ceramic sheet, so that the first conductive layer is used on the second side.
  • the second conductive layer is used for abutting against the first spring pin, and the second conductive layer is used for abutting against the second spring pin on the second side, so that the atomizing sheet is easy to assemble and easy to disassemble for self-replacement.
  • FIG. 1 is a schematic structural diagram of an embodiment of a microporous atomizing sheet of the application
  • FIG. 2 is a schematic structural diagram of the first embodiment of the microporous atomizing sheet shown in FIG. 1;
  • FIG. 3 is a schematic structural diagram of the second embodiment of the microporous atomizing sheet shown in FIG. 1;
  • FIG. 4 is a schematic structural diagram of a third embodiment of the microporous atomizing sheet shown in FIG. 1;
  • FIG. 5 is a schematic structural diagram of the fourth embodiment of the microporous atomizing sheet shown in FIG. 1;
  • FIG. 6 is a schematic structural diagram of the fifth embodiment of the microporous atomizing sheet shown in FIG. 1;
  • FIG. 7 is a schematic structural diagram of an embodiment of the ultrasonic atomization device of the present application.
  • first”, “second” and “third” in this application are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as “first”, “second”, “third” may expressly or implicitly include at least one of that feature.
  • "a plurality of” means at least two, such as two, three, etc., unless otherwise expressly and specifically defined. All directional indications (such as up, down, left, right, front, rear%) in the embodiments of the present application are only used to explain the relative positional relationship between components under a certain posture (as shown in the accompanying drawings).
  • FIG. 1 is a schematic structural diagram of the microporous atomizing sheet of the present application.
  • the microporous atomizing sheet 100 includes the piezoelectric ceramic sheet 10.
  • the microporous atomizing sheet 100 is atomized, it is necessary to use electrodes to apply voltage to the two surfaces of the piezoelectric ceramic sheet 10 to make it vibrate, thereby causing the Nebulized substrate nebulization.
  • FIG. 2 is a schematic structural diagram of the first embodiment of the microporous atomizing sheet shown in FIG. 1 .
  • the microporous atomizing sheet 100 includes a piezoelectric ceramic sheet 10 , a first conductive layer 12 and a second conductive layer 11 .
  • the first conductive layer 12 is stacked on the piezoelectric ceramic sheet 10 and is located on the first side of the piezoelectric ceramic sheet 10 .
  • the second conductive layer 11 is stacked on the piezoelectric ceramic sheet 10 and is located on the second side of the piezoelectric ceramic sheet 10 away from the first conductive layer 12 .
  • the first conductive layer 12 or the second conductive layer 11 has atomization holes.
  • This embodiment is described by taking the second conductive layer 11 having an atomization hole as an example.
  • conductive electrodes need to be provided for the first conductive layer 12 and the second conductive layer 11 on both sides of the piezoelectric ceramic sheet 10 .
  • the first conductive layer 12 extends along the sidewall of the piezoelectric ceramic sheet 10 to the second side of the piezoelectric ceramic sheet 10 (ie, the side where the second conductive layer 11 is located), so that the first conductive layer 12 is located on the side of the piezoelectric ceramic sheet 10 .
  • the part on the second side of the piezoelectric ceramic sheet 10 is used to abut the first elastic pin, and the second conductive layer 11 is directly used to abut the second elastic pin on the second side of the piezoelectric ceramic sheet 10 .
  • Both the pin and the second elastic pin are disposed on the second side of the piezoelectric ceramic sheet 10 and are electrically connected to the power supply, so that the power supply applies a voltage to the first conductive layer 12 and the second conductive layer 11 through the first elastic pin and the second elastic pin .
  • the piezoelectric ceramic sheet 10 is circular, as shown in FIG. 2 , in another embodiment, the piezoelectric ceramic sheet 10 may also be square, trapezoidal, etc. It should be noted that, Regardless of the shape of the piezoelectric ceramic sheet 10 , the center thereof has an annular through hole position where the atomization hole is exposed. In this application, the piezoelectric ceramic sheet 10 is taken as an example to be circular for description.
  • the first conductive layer 12 includes a main body portion 121 and an extension portion 122 .
  • the extension portion 122 is connected to the main body portion 121 and extends along the side wall of the piezoelectric ceramic sheet 10 to the second side of the piezoelectric ceramic sheet 10 , and the extension portion 122 is used for abutting against the first elastic pin. Further, the extension portion 122 includes a wrapping portion 123 and an abutting portion 124 . The wrapping portion 123 is connected to the main body portion 121 and wraps a part of the side wall of the piezoelectric ceramic sheet 10 . The abutting portion 124 is connected to the wrapping portion 123 and is disposed on the piezoelectric ceramic sheet 10 . On the second side of the ceramic sheet 10, the abutting portion 124 is used for abutting the first spring pin.
  • the second conductive layer 11 is used as the carrier of the atomization hole, so the main body 121 of the first conductive layer 12 is annular.
  • the projections of the main body portion 121 of the first conductive layer 12 and the piezoelectric ceramic sheet 10 in the vertical direction are completely coincident. That is, the main body portion 121 of the first conductive layer 12 and the piezoelectric ceramic sheet 10 have the same shape and size, and are completely overlapped. It can be understood that the size of the main body portion 121 of the first conductive layer 12 may also be slightly smaller or larger than the size of the piezoelectric ceramic sheet 10.
  • the inner diameter of the main body portion 121 of the first conductive layer 12 is larger than that of the piezoelectric ceramic sheet 10, and the outer or the inner diameter of the main body 121 of the first conductive layer 12 is smaller than or equal to the inner diameter of the piezoelectric ceramic sheet 10 , and the outer diameter is smaller than the outer diameter of the piezoelectric ceramic sheet 10 .
  • the shapes of the wrapping portion 123 and the abutting portion 124 are not limited, and can be designed as required.
  • the extension portion 122 of the first conductive layer 12 is integrally formed with the main body portion 121 , for example, it can be a self-supporting metal layer, such as a metal layer formed by a sheet metal process, and the metal can be copper, aluminum Alloy, stainless steel and other conductive materials.
  • the so-called self-supporting property means that the metal layer can exist independently from the support body, or can be disassembled from the support body to distinguish it from the metal layer formed by the coating process.
  • the extension portion 122 and the main body portion 121 of the first conductive layer 12 are copper foils.
  • the thickness of the first conductive layer 12 is 0.1-0.5 mm.
  • the thicknesses of the extension portion 122 and the main body portion 121 are both 0.1 to 0.5 mm.
  • the second conductive layer 11 has an opening 111 at a position corresponding to the abutting portion 124 , and the abutting portion 124 is in contact with a part of the surface of the piezoelectric ceramic sheet 10 exposed through the opening 111 , and is in contact with the second conductive layer 11 . insulation.
  • the extension portion 122 is used to lead the electrode on the upper surface of the piezoelectric ceramic sheet 10 (ie, the main body portion 121 of the first conductive layer 12 ) to one side of the second conductive layer 11 , so as to facilitate Install with power supply.
  • the outline of the opening 111 can be any shape, such as a rectangle, an arc, a trapezoid, and the like.
  • the opening 111 may be an arc-shaped notch or a through hole at the edge of the second conductive layer 11 .
  • the opening 111 is an arc-shaped notch located at the edge of the second conductive layer 11 , which corresponds to the shape of the abutting portion 124 and has a size larger than that of the abutting portion 124 , which can reduce the area of the opening 111 when the spring pin is abutted, and further Unevenness when the first conductive layer 12 vibrates is reduced.
  • the abutting portion 124 and the second conductive layer 11 may be directly insulated by other means.
  • an insulating layer may be provided between the abutting portion 124 and the second conductive layer 11 .
  • the thickness of the second conductive layer 11 is the same as the thickness of the first conductive layer 12, which is 0.1-0.5 mm, and the material of the second conductive layer 11 and the material of the first conductive layer 12 are also the same, for example, Conductive materials such as copper, aluminum alloy, stainless steel, etc.
  • the second conductive layer 11 is staggered from the first elastic pin and the second elastic pin.
  • a positioning portion 113 is provided at the edge of the second elastic pin to ensure that the first elastic pin abuts against the abutment portion 124 of the first conductive layer 12 , and the second elastic pin abuts against the second conductive layer 11 .
  • the positioning portion 113 is a protrusion or a groove.
  • the microporous atomizing sheet 100 further includes: a first adhesive layer 13 and a second adhesive layer 14 , and the first adhesive layer 13 is located between the first conductive layer 12 and the piezoelectric ceramic sheet 10 , so as to The first conductive layer 12 is bonded to the piezoelectric ceramic sheet 10 .
  • the second adhesive layer 14 is located between the second conductive layer 11 and the piezoelectric ceramic sheet 10 to bond the second conductive layer 11 and the piezoelectric ceramic sheet 10. It can be understood that the first adhesive layer 13 and the second adhesive layer 14 are both annular. As shown in FIG. 2 , the positions of the second adhesive layer 14 corresponding to the openings 111 also have corresponding openings. The first adhesive layer 13 and the second adhesive layer 14 are both conductive adhesives.
  • the second conductive layer 11 has an atomizing hole 112 .
  • the second conductive layer 11 is in the shape of a disk and covers the central through hole of the piezoelectric ceramic sheet 10 , and the atomizing hole 112 is located in the second conductive layer 11 .
  • the layer 11 corresponds to the part of the central through hole of the piezoelectric ceramic sheet 10 , as specifically shown in FIG. 2 , that is, the piezoelectric ceramic sheet 10 exposes the atomizing hole 112 .
  • the atomizing hole 112 may be one of conical, rectangular, circular, or any combination thereof. In a specific embodiment, the atomizing hole 112 is tapered.
  • FIG. 3 is a schematic structural diagram of the second embodiment of the microporous atomizing sheet shown in FIG. 1 .
  • the second conductive layer 11 has a protrusion 114 corresponding to the central through hole of the piezoelectric ceramic sheet 10 , and the atomization holes 112 are distributed on the protrusion 114 .
  • the protrusion 114 is one of spherical shape, trapezoidal shape or any combination. It should be noted that the convex direction of the protrusions 114 is preferably the flow direction of the atomized substrate.
  • FIG. 4 is a schematic structural diagram of the third embodiment of the microporous atomizing sheet shown in FIG. 1 .
  • the main body portion 121 and the extension portion 122 of the first conductive layer 12 are integrally formed.
  • the difference lies in that, in this embodiment, the first conductive layer 12 is directly formed on the surface of the piezoelectric ceramic sheet 10 by means of deposition or coating.
  • the first conductive layer 12 is a metal layer formed on the surface of the piezoelectric ceramic sheet 10 by processes such as silver spraying, screen printing, electroplating, thermal deposition, chemical vapor deposition, and sputtering.
  • the material of the first conductive layer 12 is conductive silver paste.
  • the thickness of the first conductive layer 12 is 0.05-0.1 mm. Since the main body portion 121 and the extension portion 122 of the first conductive layer 12 are integrally formed, the thicknesses of the main body portion 121 , the wrapping portion 123 and the abutting portion 124 are all 0.05 to 0.1 mm, therefore, the thickness of the contact portion 124 is thin.
  • a metal sheet 15 is further provided on the surface of the abutting portion 124 away from the piezoelectric ceramic sheet 10 , and the metal sheet 15 is used to abut the first spring. Needle. Specifically, the metal sheet 15 can be welded or fixed on the surface of the abutting portion 124 away from the piezoelectric ceramic sheet 10 by welding or adhesive.
  • the first conductive layer 12 is directly deposited or coated on the piezoelectric ceramic sheet 10 , there is no need to set an adhesive layer between the first conductive layer 12 and the piezoelectric ceramic sheet 10 , but A third adhesive layer 16 is provided only between the second conductive layer 11 and the piezoelectric ceramic sheet 10 to bond the second conductive layer 11 and the piezoelectric ceramic sheet 10 .
  • the structure of the third adhesive layer 16 is the same as that of the second adhesive layer 14 shown in FIG. 3 , and details are not repeated here.
  • FIG. 5 is a schematic structural diagram of the fourth embodiment of the microporous atomizing sheet of the present application.
  • the main body portion 121 and the extension portion 122 of the first conductive layer 12 are independent components.
  • the extension portion 122 includes a bonding portion 125 , a wrapping portion 123 and an abutting portion 124 .
  • the bonding portion 125 is electrically connected to a surface of the main body portion 121 away from the piezoelectric ceramic sheet 10
  • the wrapping portion 123 wraps the piezoelectric ceramic sheet 10 .
  • the abutting portion 124 is disposed on the second side of the electrical ceramic sheet 10 .
  • the contact portion 124 is insulated from the second conductive layer 11 .
  • the shape of the abutting portion 124 corresponds to the shape of the opening 111
  • the abutting portion 124 is attached to the surface of the piezoelectric ceramic sheet 10 exposed through the opening 111
  • the abutting portion 124 is connected to the second conductive layer 11 .
  • the extension portion 122 is a flexible circuit board, and both ends of the flexible circuit board are bent to the same side, the middle portion is the wrapping portion 123 , and one end is used as the fitting portion 125 to be electrically connected to the main body portion 121 , and the other end is electrically connected to the main body portion 121 .
  • the contact portion 124 is fixed to the surface of the second conductive layer 11 away from the piezoelectric ceramic sheet 10 .
  • the flexible circuit board is a circuit board with a conductive circuit layer and an insulating medium layer on one side.
  • the bonding portion 125 may be welded to the surface of the main body portion 121 by welding, and the abutting portion 124 may be bonded to the surface of the second conductive layer 11 away from the piezoelectric ceramic sheet 10 by glue.
  • the first conductive layer 12 may also be a self-supporting metal sheet, which is bonded to the first side of the piezoelectric ceramic sheet through an adhesive layer, which is not limited herein.
  • FIG. 6 is a schematic structural diagram of the fifth embodiment of the microporous atomizing sheet shown in FIG. 1 .
  • the conductive layer 11 is used as the first conductive layer 11
  • the conductive layer 12 is used as the second conductive layer 12 .
  • the difference lies in that: the first conductive layer 11 has an atomization hole 112 and includes a main body part 121 and an extension part 122 .
  • the main body portion 121 of the first conductive layer 11 is circular, and the atomization hole 112 is located at the position of the main body portion 121 corresponding to the central through hole of the piezoelectric ceramic sheet 10 .
  • the extension portion 122 is correspondingly located on the first conductive layer 11 .
  • the structure of the extension portion 122 is the same as that in FIG. 2 to FIG. 5 , which is not repeated here.
  • the contact portion 124 of the second conductive layer 12 corresponding to the extension portion 122 has an opening 111 to insulate the contact portion 124 of the first conductive layer 11 from the second conductive layer 12 .
  • the first conductive layer and the second conductive layer are arranged on both sides of the piezoelectric ceramic, and the first conductive layer extends to one side of the second conductive layer, A spring pin abutting against the first conductive layer and the second conductive layer is arranged on one side of the second conductive layer, so as to achieve the purpose of easy assembly and replacement of the atomizing sheet, and avoid the problem of easy breakage of the lead wire.
  • FIG. 7 is a schematic structural diagram of an embodiment of the ultrasonic atomizing device of the present application.
  • the ultrasonic atomizing device includes a microporous atomizing sheet 100 and a power supply assembly, and the power supply assembly includes a power supply and a first elastic pin 71 and a second elastic pin 72 electrically connected to the power supply.
  • the microporous atomizing sheet 100 is the microporous atomizing sheet 100 shown in any of the above embodiments in FIG. 2 to FIG.
  • the first conductive layer and the second conductive layer are arranged on both sides of the piezoelectric ceramic, and the first conductive layer extends to one side of the second conductive layer, so as to On the side of the second conductive layer, the first conductive layer and the second conductive layer are abutted against the first and second spring pins in the power supply, so as to achieve the purpose of easy assembly and replacement of the atomizing sheet, and avoid using Leads are easily broken.
  • the specific structure of the power supply of the ultrasonic atomizing device in this embodiment is the same as the structure of the power supply in the prior art, which is not repeated here.

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Abstract

一种微孔雾化片（100）以及超声雾化装置，包括：压电陶瓷片（10）；第一导电层（12），与压电陶瓷片（10）层叠设置，且位于压电陶瓷片（10）的第一侧；第二导电层（11），与压电陶瓷片（10）层叠设置并位于压电陶瓷片（10）远离第一导电层（12）的第二侧；第一导电层（12）沿压电陶瓷片（10）的侧壁延伸至压电陶瓷片（10）的第二侧，以使得第一导电层（12）在第二侧的部分用于抵接第一弹针（71），而第二导电层（11）在第二侧用于抵接第二弹针（72）；其中，第一导电层（12）或第二导电层（11）上具有雾化孔。以此实现雾化片（100）容易组装，并且容易拆除以便于自行更换的目的。

Description

微孔雾化片以及超声雾化装置 【技术领域】
本申请涉及雾化技术领域，特别是涉及一种微孔雾化片、超声雾化装置。
【背景技术】
微孔雾化片包括压电陶瓷和金属微孔膜片，其主要功能是利用压电陶瓷的高频振动带动金属微孔膜片谐振，金属微孔伴随振动发生持续反复的形变，将溶液挤出打碎为微细雾滴形成雾化汽。其在家用加湿、香薰美容、表面喷涂、空气净化和医疗器械等多种领域有着广泛的应用。现有的微孔雾化片在进行电连接时，一般是在压电陶瓷上形成一个电极，在金属膜片上形成另一个电极，在两个电极上分别焊接两条引线，通过两条引线施加电压以使压电陶瓷产生振动。焊接引线的微孔雾化片中，引线是直接焊接在电极上，使得引线和电极连接处容易发生断裂，并且在批量生产时需要人工先将引线焊接在电极上，不易组装，雾化片无法直接拆除，从而使得用户无法自行更换。
【发明内容】
本申请提供一种微孔雾化片以及超声雾化装置，使得雾化片容易组装，并且容易拆除以便于自行更换。
为解决上述技术问题，本申请提供的第一个技术方案为：提供一种微孔雾化片，包括：压电陶瓷片；第一导电层，与压电陶瓷片层叠设置，且位于压电陶瓷片的第一侧；第二导电层，与压电陶瓷片层叠设置并位于压电陶瓷片远离第一导电层的第二侧；第一导电层沿压电陶瓷片的侧壁延伸至压电陶瓷片的第二侧，以使得第一导电层在第二侧的部分用于抵接第一弹针，而第二导电层在第二侧用于抵接第二弹针；其中，第一导电层或第二导电层上具有雾化孔。
其中，第一导电层包括主体部以及延伸部；延伸部连接主体部，并 沿压电陶瓷片的侧壁延伸至第二侧，延伸部用于抵接第一弹针。
其中，延伸部与主体部一体成型，延伸部包括包裹部及抵接部，包裹部连接主体部，并包裹压电陶瓷片的部分侧壁，抵接部连接包裹部且设置于第二侧，抵接部用于抵接第一弹针。
其中，第二导电层对应抵接部的位置处具有开口，抵接部与压电陶瓷片通过开口暴露的部分表面贴合，且与第二导电层绝缘。
其中，第一导电层上具有雾化孔，雾化孔位于主体部对应压电陶瓷片的中心通孔位置处。
其中，第二导电层上具有雾化孔。
其中，第一导电层通过涂覆或沉积的方式形成。
其中，第一导电层的厚度为0.05毫米～0.1毫米；抵接部远离压电陶瓷片的表面进一步设置有金属片，金属片用于抵接第一弹针。
其中，延伸部为与主体部独立的元件，延伸部包括贴合部、包裹部及抵接部，贴合部电连接在主体部的表面，包裹部包裹压电陶瓷片的部分侧壁，抵接部设置于第二侧，且抵接部与第二导电层绝缘。
其中，第二导电层上具有雾化孔，第一导电层的主体部通过涂覆或沉积的方式形成；第二导电层对应抵接部的位置处具有开口，抵接部与压电陶瓷片通过开口暴露的部分表面贴合。
其中，第二导电层上具有雾化孔，第一导电层的主体部通过涂覆或沉积的方式形成；延伸部为柔性电路板，柔性电路板两端向同一侧弯折，且一端作为贴合部与主体部电连接，另一端作为抵接部固定在第二导电层远离压电陶瓷片的表面。
其中，第一导电层的厚度为0.1毫米～0.5毫米。
其中，微孔雾化片还包括：第一粘性层，位于第一导电层与压电陶瓷片之间，以将第一导电层与压电陶瓷片粘合；第二粘性层，位于第二导电层与压电陶瓷片之间，以将第二导电层与压电陶瓷片粘合。
其中，第一导电层或第二导电层的边缘位置设置有定位部。
为解决上述技术问题，本申请提供的第二个技术方案为：提供一种超声雾化装置，超声雾化装置包括微孔雾化片和电源组件；电源组件包 括：电源，以及与电源连接的第一弹针及第二弹针；微孔雾化片上述任意一项的微孔雾化片，且微孔雾化片的第一导电层在第二侧抵接第一弹针，而第二导电层在第二侧抵接第二弹针。
本申请的有益效果，区别于现有技术，本申请通过使得第一导电层沿压电陶瓷片的侧壁延伸至压电陶瓷片的第二侧，以使得第一导电层在第二侧用于抵接第一弹针，而第二导电层在第二侧用于抵接第二弹针，使得雾化片容易组装，并且容易拆除以便于自行更换。
【附图说明】
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。其中：
图1为本申请微孔雾化片的一实施例的结构示意图；
图2为图1所示的微孔雾化片的第一实施例的结构示意图；
图3为图1所示的微孔雾化片的第二实施例的结构示意图；
图4为图1所示的微孔雾化片的第三实施例的结构示意图；
图5为图1所示的微孔雾化片的第四实施例的结构示意图；
图6为图1所示的微孔雾化片的第五实施例的结构示意图；
图7为本申请超声雾化装置的一实施例的结构示意图。
【具体实施方式】
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请中的术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征 的数量。由此，限定有“第一”、“第二”、“第三”的特征可以明示或者隐含地包括至少一个该特征。本申请的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。本申请实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。本申请实施例中的术语“包括”和“具有”以及它们任何变形，意图在于覆盖不排他的包含。例如包含了一系列步骤或单元的过程、方法、系统、产品或设备没有限定于已列出的步骤或单元，而是可选地还包括没有列出的步骤或单元，或可选地还包括对于这些过程、方法、产品或设备固有的其它步骤或组件。
在本文中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例，也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是，本文所描述的实施例可以与其它实施例相结合。
请参见图1，为本申请微孔雾化片的结构示意图。其中，微孔雾化片100包括压电陶瓷片10，在微孔雾化片100在进行雾化时，需要利用电极为压电陶瓷片10的两表面施加电压，以使得其震动，进而将雾化基质雾化。
具体的，请参见图2，为图1所示的微孔雾化片的第一实施例的结构示意图。其中，微孔雾化片100包括压电陶瓷片10、第一导电层12、第二导电层11。第一导电层12与压电陶瓷片10层叠设置，且位于压电陶瓷片10的第一侧。第二导电层11与压电陶瓷片10层叠设置并位于压电陶瓷片10远离第一导电层12的第二侧。为了使得雾化基质进行雾化，则第一导电层12或第二导电层11上具有雾化孔。本实施例以第二导电层11上具有雾化孔为例进行说明。具体的，为了为压电陶瓷片10的两表面施加电压，以使得其震动，需要为压电陶瓷片10两侧的第一导电层12以及第二导电层11设置导电电极。本实施例中，第一导电层 12沿压电陶瓷片10的侧壁延伸至压电陶瓷片10的第二侧(即第二导电层11的所在侧)，以使得第一导电层12位于压电陶瓷片10的第二侧的部分用于抵接第一弹针，而第二导电层11则在压电陶瓷片10的第二侧直接用于抵接第二弹针，第一弹针及第二弹针均设置压电陶瓷片10的第二侧于且与电源电连接，进而使得电源通过第一弹针及第二弹针对第一导电层12以及第二导电层11施加电压。
具体的，在一实施例中，压电陶瓷片10为圆环形，如图2所示，在另一实施例中，压电陶瓷片10还可以为方形、梯形等，需要说明的是，无论压电陶瓷片10的形状如何，其中心都具有将雾化孔暴露处的环形通孔位置。本申请以压电陶瓷片10为圆形为例进行说明。第一导电层12包括主体部121以及延伸部122。延伸部122连接主体部121，并沿压电陶瓷片10的侧壁延伸至压电陶瓷片10的第二侧，延伸部122用于抵接第一弹针。进一步地，延伸部122包括包裹部123及抵接部124，包裹部123连接主体部121，并包裹压电陶瓷片10的部分侧壁，抵接部124与包裹部123连接且设置于压电陶瓷片10的第二侧，抵接部124用于抵接第一弹针。本实施例中，第二导电层11作为雾化孔的载体，因此，第一导电层12的主体部121为圆环形。在一实施例中，第一导电层12的主体部121与压电陶瓷片10在垂直方向上的投影完全重合。即，第一导电层12的主体部121与压电陶瓷片10的形状和尺寸均相同，且完全重叠设置。可以理解，第一导电层12的主体部121尺寸也可以略小于或大于压电陶瓷片10的尺寸，例如，第一导电层12的主体部121的内径大于压电陶瓷片10的内径，外径小于或等于压电陶瓷片10的外径；或第一导电层12的主体部121的内径小于或等于压电陶瓷片10的内径，外径小于压电陶瓷片10的外径。包裹部123及抵接部124的形状不限，可以根据需要设计。
在一实施例中，第一导电层12的延伸部122与主体部121一体成型，例如，其可以为具有自支撑性的金属层，例如钣金工艺形成的金属层，金属可以为铜、铝合金、不锈钢等导电材质。所谓自支撑性是指金属层可以脱离支撑体而独立存在，或可以从支撑体上拆卸，以区别与通 过镀膜工艺形成的金属层。具体地，第一导电层12的延伸部122与主体部121为铜箔。为了防止其在施加电压过程中磨损断裂，第一导电层12的厚度为0.1～0.5mm。具体的，延伸部122与主体部121的厚度均为0.1～0.5mm。
在一实施例中，第二导电层11对应抵接部124的位置处具有开口111，抵接部124与压电陶瓷片10通过开口111暴露的部分表面贴合，且与第二导电层11绝缘。具体的，如图2所示，延伸部122用于将压电陶瓷片10的上表面的电极(即第一导电层12的主体部121)引到第二导电层11的一侧，以便于与电源进行安装。具体的，开口111的轮廓可以为任意形状，例如矩形、弧形、梯形等。开口111可以为第二导电层11边缘的弧形缺口或通孔。优选地，开口111为位于第二导电层11边缘的弧形缺口，与抵接部124形状对应且尺寸大于抵接部124的尺寸，其可以在抵接弹针时减少开口111的面积，进而降低第一导电层12振动时的不均衡性。抵接部124与第二导电层11直接也可以通过其他方式绝缘设置，例如，抵接部124与第二导电层11之间设置绝缘层。
在一实施例中，第二导电层11的厚度与第一导电层12的厚度相同，为0.1～0.5mm，且第二导电层11的材料与第一导电层12的材料也相同，例如为铜、铝合金、不锈钢等导电材质。
具体的，本实施例中，由于第一弹针及第二弹针连接位置均位于第二导电层11的一侧，因此，本实施例中，第二导电层11错开第一弹针及第二弹针的边缘位置设置有定位部113，用于保证第一弹针与第一导电层12的抵接部124抵接，而第二弹针与第二导电层11抵接。具体地，在一实施例中，定位部113为凸起或凹槽。
进一步的，由于本申请的第一导电层12以及第二导电层11具有自支撑性，因此需要将其固定在压电陶瓷片10的第一侧以及第二侧，在一具体实施例中，可以利用焊接的方式进行焊接，或者还可以利用粘性胶将其粘合。因此，如图2所示，微孔雾化片100进一步包括：第一粘性层13以及第二粘性层14，第一粘性层13位于第一导电层12与压电陶瓷片10之间，以将第一导电层12与压电陶瓷片10粘合。第二粘性 层14位于第二导电层11与压电陶瓷片10之间，以将第二导电层11与压电陶瓷片10粘合。可以理解的，第一粘性层13与第二粘性层14均为圆环形。如图2所示，第二粘性层14对应开口111的位置处也具有对应的开口。第一粘性层13与第二粘性层14均为导电粘结剂。
本实施例中，第二导电层11上具有雾化孔112，具体的，第二导电层11为圆片状且将压电陶瓷片10的中心通孔覆盖，雾化孔112位于第二导电层11对应压电陶瓷片10的中心通孔的部分，具体的如图2所示，即压电陶瓷片10将雾化孔112裸露出来。雾化孔112可以为锥形、矩形、圆形中一种或任意组合。在一具体实施例中，雾化孔112为锥形。
在另一实施例中，具体请参见图3，为图1所示的微孔雾化片的第二实施例的结构示意图。第二导电层11对应压电陶瓷片10的中心通孔处具有凸起114，雾化孔112分布于凸起114上。凸起114为圆球面形、梯形中一种或任意组合。需要注意的是，凸起114的凸起方向优选为雾化基质的流动方向。
请参见图4，为图1所示的微孔雾化片的第三实施例的结构示意图。本实施例中，第一导电层12的主体部121与延伸部122一体成型。与上述图3所示的第二实施例相比，区别在于，本实施例中，第一导电层12是利用沉积或涂覆的方式直接形成在压电陶瓷片10的表面。例如，本实施例中，第一导电层12为喷银、丝网印刷、电镀、热沉积、化学气相沉积、溅射等工艺形成在压电陶瓷片10表面的金属层。在一具体实施例中，第一导电层12的材料为导电银浆。
具体的，第一导电层12的厚度为0.05～0.1mm，由于第一导电层12的主体部121与延伸部122一体成型，即主体部121、包裹部123以及抵接部124的厚度均为0.05～0.1mm，因此，抵接部124厚度较薄。为了防止第一导电层12的抵接部124被弹针磨损而出现失效问题，在抵接部124远离压电陶瓷片10的表面进一步设置金属片15，金属片15用于抵接第一弹针。具体的，金属片15可以焊接或粘结剂固定在抵接部124远离压电陶瓷片10的表面，金属片15可以为铜片、铝片等，厚度为0.1～0.5mm。
需要说明的是，由于本实施例中，第一导电层12直接沉积或涂覆在压电陶瓷片10上，因此第一导电层12与压电陶瓷片10之间不需要设置粘性层，而仅在第二导电层11与压电陶瓷片10之间设置第三粘性层16，第三粘性层16以将第二导电层11与压电陶瓷片10粘合。其中，第三粘性层16与图3所示的第二粘性层14结构相同，具体不再赘述。
请参见图5，为本申请微孔雾化片的第四实施例的结构示意图。具体的，与上述图4所示的第二实施例相比，区别在于，本实施例中，第一导电层12的主体部121与延伸部122为独立元件。具体的，延伸部122包括贴合部125、包裹部123及抵接部124，贴合部125电连接在主体部121远离压电陶瓷片10的一表面，包裹部123包裹压电陶瓷片10的部分侧壁，抵接部124设置于电陶瓷片10的第二侧。
抵接部124与第二导电层11绝缘。在一实施例中，抵接部124的形状对应于开口111的形状，抵接部124与压电陶瓷片10通过开口111暴露的部分表面贴合，且抵接部124与第二导电层11之间间隔设置。在一实施例中，延伸部122为柔性电路板，柔性电路板的两端向同一侧弯折，中间部即为包裹部123，且一端作为贴合部125与主体部121电连接，另一端作为抵接部124固定在第二导电层11远离压电陶瓷片10的表面。可以理解的，柔性线路板为单面具有导电线路层和绝缘介质层的线路板。具体的，贴合部125可以通过焊接的方式焊接在主体部121的表面，抵接部124可以通过胶水粘合在第二导电层11远离压电陶瓷片10的表面。
在另一实施例中，第一导电层12还可以为具有自支撑性的金属片，其通过粘结层粘结在压电陶瓷片的第一侧，在此不做限定。
请参见图6，为图1所示的微孔雾化片的第五实施例的结构示意图。具体的，本实施例中，导电层11作为第一导电层11，而导电层12作为第二导电层12。与上述图2所示的第一实施例相比，区别在于：第一导电层11上具有雾化孔112，且包括主体部121和延伸部122。具体地，第一导电层11的主体部121为圆形，雾化孔112位于主体部121对应压电陶瓷片10的中心通孔位置处。延伸部122对应位于第一导电层11 上，具体的，延伸部122的结构与上述图2至图5中的相同，在此不再赘述。
本实施例中，第二导电层12上对应延伸部122的抵接部124上具有开口111以使得第一导电层11的抵接部124与第二导电层12绝缘。
本申请上述实施例所示的微孔雾化片，其通过在压电陶瓷的两侧设置第一导电层以及第二导电层，并使得第一导电层延伸至第二导电层的一侧，以在第二导电层一侧设置抵接第一导电层以及第二导电层的弹针，以实现雾化片容易组装、更换方便的目的，并且避免了使用引线容易断裂的问题。
请参见图7，为本申请超声雾化装置的一实施例的结构示意图。其中，超声雾化装置包括微孔雾化片100和电源组件，电源组件包括电源以及与电源电连接的第一弹针71以及第二弹针72。微孔雾化片100为上述图2至图6任一实施例所示的微孔雾化片100，其中，微孔雾化片100的第一导电层12的抵接部124在第二侧抵接第一弹针71，而第二导电层11在第二侧抵接第二弹针72。
本申请上述实施例所示的超声雾化装置，其通过在压电陶瓷的两侧设置第一导电层以及第二导电层，并使得第一导电层延伸至第二导电层的一侧，以在第二导电层一侧使得第一导电层以及第二导电层的抵接电源中的第一弹针以及第二弹针，以实现雾化片容易组装、更换方便的目的，并且避免了使用引线容易断裂的问题。
本实施例的超声雾化装置的电源的具体结构与现有技术中的电源的结构相同，在此不再赘述。
以上仅为本申请的实施方式，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (15)

  1. 一种微孔雾化片，其中，包括：
    压电陶瓷片；
    第一导电层，与所述压电陶瓷片层叠设置，且位于所述压电陶瓷片的第一侧；
    第二导电层，与所述压电陶瓷片层叠设置并位于所述压电陶瓷片远离所述第一导电层的第二侧；
    所述第一导电层沿所述压电陶瓷片的侧壁延伸至所述压电陶瓷片的第二侧，以使得所述第一导电层在所述第二侧的部分用于抵接第一弹针，而所述第二导电层在所述第二侧用于抵接第二弹针；
    其中，所述第一导电层或所述第二导电层上具有雾化孔。
  2. 根据权利要求1所述的微孔雾化片，其中，所述第一导电层包括主体部以及延伸部；
    所述延伸部连接所述主体部，并沿所述压电陶瓷片的侧壁延伸至所述第二侧，所述延伸部用于抵接所述第一弹针。
  3. 根据权利要求2所述的微孔雾化片，其中，所述延伸部与所述主体部一体成型，所述延伸部包括包裹部及抵接部，所述包裹部连接所述主体部，并包裹所述压电陶瓷片的部分侧壁，所述抵接部连接所述包裹部且设置于所述第二侧，所述抵接部用于抵接所述第一弹针。
  4. 根据权利要求3所述的微孔雾化片，其中，所述第二导电层对应所述抵接部的位置处具有开口，所述抵接部与所述压电陶瓷片通过所述开口暴露的部分表面贴合，且与所述第二导电层绝缘。
  5. 根据权利要求4所述的微孔雾化片，其中，所述第一导电层上具有所述雾化孔，所述雾化孔位于所述主体部对应所述压电陶瓷片的中心通孔位置处。
  6. 根据权利要求4所述的微孔雾化片，其中，所述第二导电层上具有所述雾化孔。
  7. 根据权利要求6所述的微孔雾化片，其中，所述第一导电层通过涂覆或沉积的方式形成。
  8. 根据权利要求7所述的微孔雾化片，其中，所述第一导电层的厚度为0.05毫米～0.1毫米；
    所述抵接部远离所述压电陶瓷片的表面进一步设置有金属片，所述金属片用于抵接所述第一弹针。
  9. 根据权利要求2所述的微孔雾化片，其中，所述延伸部为与所述主体部独立的元件，所述延伸部包括贴合部、包裹部及抵接部，所述贴合部电连接在所述主体部的表面，所述包裹部包裹所述压电陶瓷片的部分侧壁，所述抵接部设置于所述第二侧，且所述抵接部与所述第二导电层绝缘。
  10. 根据权利要求9所述的微孔雾化片，其中，所述第二导电层上具有所述雾化孔，所述第一导电层的主体部通过涂覆或沉积的方式形成；所述第二导电层对应所述抵接部的位置处具有开口，所述抵接部与所述压电陶瓷片通过所述开口暴露的部分表面贴合。
  11. 根据权利要求9所述的微孔雾化片，其中，所述第二导电层上具有所述雾化孔，所述第一导电层的主体部通过涂覆或沉积的方式形成；所述延伸部为柔性电路板，所述柔性电路板两端向同一侧弯折，且一端作为贴合部与所述主体部电连接，另一端作为抵接部固定在所述第二导电层远离所述压电陶瓷片的表面。
  12. 根据权利要求1所述的微孔雾化片，其中，所述第一导电层的厚度为0.1毫米～0.5毫米。
  13. 根据权利要求12所述的微孔雾化片，其中，所述微孔雾化片还包括：
    第一粘性层，位于所述第一导电层与所述压电陶瓷片之间，以将所述第一导电层与所述压电陶瓷片粘合；
    第二粘性层，位于所述第二导电层与所述压电陶瓷片之间，以将所述第二导电层与所述压电陶瓷片粘合。
  14. 根据权利要求1所述的微孔雾化片，其中，所述第一导电层或所述第二导电层的边缘位置设置有定位部。
  15. 一种超声雾化装置，其中，所述超声雾化装置包括微孔雾化片和电源组件；
    所述电源组件包括：电源，以及与所述电源连接的第一弹针及第二弹 针；
    所述微孔雾化片为权利要求1-14中任意一项所述的微孔雾化片，且所述微孔雾化片的所述第一导电层在所述第二侧抵接所述第一弹针，而所述第二导电层在所述第二侧抵接所述第二弹针。
PCT/CN2020/122538 2020-10-21 2020-10-21 微孔雾化片以及超声雾化装置 WO2022082515A1 (zh)

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CN102553767A (zh) * 2011-12-13 2012-07-11 南京航空航天大学 压电陶瓷超声雾化片
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CN204214085U (zh) * 2014-08-22 2015-03-18 创天昱科技(深圳)有限公司 一种用于加湿器的雾化模块
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CN208912405U (zh) * 2018-09-17 2019-05-31 深圳来福士雾化医学有限公司 一种耐用且易于组装的超声雾化片
CN111215283A (zh) * 2020-03-19 2020-06-02 湖南嘉业达电子有限公司 一种新型超声雾化片

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US20130119151A1 (en) * 2010-05-13 2013-05-16 Nortev Limited Aerosol generator assembly
CN102553767A (zh) * 2011-12-13 2012-07-11 南京航空航天大学 压电陶瓷超声雾化片
CN203076135U (zh) * 2012-12-26 2013-07-24 广州市番禺奥迪威电子有限公司 一种超声波雾化片
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