WO2022067980A1 - 一种均温板 - Google Patents

一种均温板 Download PDF

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Publication number
WO2022067980A1
WO2022067980A1 PCT/CN2020/128042 CN2020128042W WO2022067980A1 WO 2022067980 A1 WO2022067980 A1 WO 2022067980A1 CN 2020128042 W CN2020128042 W CN 2020128042W WO 2022067980 A1 WO2022067980 A1 WO 2022067980A1
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WO
WIPO (PCT)
Prior art keywords
cover plate
lower cover
upper cover
plate
vacuum chamber
Prior art date
Application number
PCT/CN2020/128042
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English (en)
French (fr)
Inventor
徐莎莎
李富根
陈晓杰
方文兵
Original Assignee
瑞声声学科技(深圳)有限公司
瑞声科技（南京）有限公司
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Publication date
Application filed by 瑞声声学科技(深圳)有限公司, 瑞声科技（南京）有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Publication of WO2022067980A1 publication Critical patent/WO2022067980A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the utility model relates to the technical field of heat conduction, in particular to a temperature equalizing plate.
  • the vapor chamber is also known as the vacuum chamber vapor chamber. Its technical principle is similar to that of the heat pipe, but there are differences in the conduction mode.
  • the heat pipe is one-dimensional linear heat conduction, while the heat in the vapor chamber is in a two-dimensional surface. upward conduction, so the heat conduction efficiency is higher.
  • the temperature equalizing plate is generally composed of an upper cover plate and a lower cover plate that are covered together, and a vacuum chamber is formed between the two cover plates. Therefore, in the process of making the vapor chamber, the space between the two cover plates needs to be vacuumized. With the thinning development of the vapor chamber, the thickness of the upper and lower cover plates is usually thinner, which leads to the vacuuming process. The upper and lower cover plates are prone to dents.
  • a support body is usually arranged in the temperature chamber to provide the necessary support strength during the vacuumization operation.
  • a plurality of supports are generally placed evenly in the temperature chamber, and then reused. It is fixed by screwing or welding. This manufacturing method is complicated and time-consuming, which is not conducive to improving production efficiency.
  • the main technical problem solved by the utility model is to provide a temperature equalizing plate, which can simplify the manufacturing process, reduce the manufacturing time, and is beneficial to improve the production efficiency.
  • the embodiment of the utility model provides a temperature equalizing plate, which includes an upper cover plate and a lower cover plate;
  • the upper cover plate and the lower cover plate are connected to form a vacuum chamber together, and the temperature equalizing plate also includes a capillary structure and a cooling medium accommodated in the vacuum chamber;
  • a concave portion away from the lower cover plate, the lower cover plate is stamped and formed with a plurality of raised portions protruding toward the upper cover plate, the lower cover plate covers the concave portion and is connected with the upper cover plate.
  • the plate is enclosed to form the vacuum chamber, the protruding portion is accommodated in the vacuum chamber, and the capillary structure is accommodated in the concave portion and located between the protruding portion and the bottom surface of the concave portion.
  • the longest outer diameter of each of the protrusions is 1.2-6 mm.
  • the upper cover plate further includes a connecting portion extending outward from the periphery of the recessed portion, and the connecting portion is in sealing connection with the periphery of the lower cover plate.
  • connection portion and the peripheral edge of the lower cover plate are sealedly connected by welding or sealant.
  • the lower cover plate includes an inner surface close to a side of the upper cover plate and an outer surface opposite to the inner surface, and the protruding portion is formed concavely from the outer surface to the inner surface ;
  • the depth of the recessed portion is h1
  • the recessed depth of the outer surface to the inner surface is h2
  • the thickness of the capillary structure is t, and the following conditions are satisfied: 0 ⁇ h2+t-h1 ⁇ 20 ⁇ m.
  • the capillary structure is one or more combinations of copper wire mesh, powder sintering, etching, and electrodeposition.
  • the lower cover plate includes an inner surface close to one side of the upper cover plate and an outer surface opposite to the inner surface, and a copper layer is plated on the inner surface.
  • the thickness of the lower cover plate is 0.03-0.12 mm.
  • the upper cover plate is a copper cover plate or a copper alloy cover plate
  • the lower cover plate is a stainless steel cover plate or a titanium alloy cover plate.
  • the raised portions are arranged in an array.
  • the temperature equalizing plate of the utility model comprises an upper cover plate and a lower cover plate, the upper cover plate and the lower cover plate together form a vacuum chamber, wherein the upper cover plate is punched and formed with a concave portion that is recessed away from the lower cover plate, The lower cover plate covers the concave portion and is enclosed with the upper cover plate to form a vacuum chamber.
  • the lower cover plate is stamped and formed with a plurality of raised portions protruding toward the upper cover plate, and the plurality of raised portions are accommodated in the vacuum chamber. , so the plurality of raised parts can be used as a support structure between the upper cover plate and the lower cover plate, which is beneficial to enhance the strength of the temperature equalizing plate.
  • the manufacturing process can be greatly simplified, the installation time of the protruding portion can be saved, and the production efficiency can be improved.
  • Fig. 1 is the top view of the temperature chamber provided by the embodiment of the present invention.
  • Fig. 2 is the exploded schematic diagram of the temperature chamber provided by the embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of the vapor chamber shown in FIG. 1 along the AB direction;
  • FIG. 4 is an enlarged schematic view of the lower cover plate shown in FIG. 2 at the dotted circle C;
  • FIG. 5 is a schematic structural diagram of a raised portion provided by an embodiment of the present invention.
  • Fig. 6 is another structural schematic diagram of the raised portion provided by the embodiment of the present invention.
  • Fig. 7 is another structural schematic diagram of the raised portion provided by the embodiment of the present invention.
  • FIG. 8 is an enlarged schematic view of the vapor chamber shown in FIG. 3 at the dotted circle D.
  • FIG. 8 is an enlarged schematic view of the vapor chamber shown in FIG. 3 at the dotted circle D.
  • the temperature equalizing plate of the utility model can be applied to various electronic equipments to dissipate heat from the heating devices in the electronic equipment, for example, it can be applied to speakers, and can also be used to dissipate heat from CPU chips such as mobile phones.
  • the temperature chamber includes an upper cover 10 and a lower cover 20 , and the upper cover 10 and the lower cover 20 are connected to jointly enclose a vacuum chamber Room 30.
  • the upper cover 10 is used for connecting with the heating device.
  • the vapor chamber also includes a capillary structure 40 housed in the vacuum chamber 30 and a cooling medium.
  • the cooling medium can be cooling liquid, for example, and the cooling liquid can fill the vacuum chamber 30 to improve the heat dissipation effect of the vapor chamber.
  • the capillary structure 40 may be one or more combinations of copper wire mesh, powder sintering, etching and electrodeposition.
  • the upper cover 10 is stamped with a concave portion 11 that is recessed away from the lower cover 20
  • the lower cover 20 is stamped with a plurality of raised portions 21 that protrude toward the upper cover 10
  • the lower cover 20 covers the concave portion 11 and is enclosed with the upper cover 10 to form a vacuum chamber 30 , and a plurality of protrusions 21 are accommodated in the vacuum chamber 30 .
  • the protruding portion 21 protrudes close to the upper cover plate 10 , the protruding portion 21 can serve as a support structure between the upper cover plate 10 and the lower cover plate 20 , which can improve the strength of the uniform temperature plate, and can effectively The probability of depression of the upper cover plate 10 and the lower cover plate 20 during vacuum operation is reduced; and the protrusions 21 are formed on the lower cover plate 20 by stamping, which greatly simplifies the manufacturing process compared with the existing method. In addition, the installation time of the protruding portion can be saved, which is beneficial to improve the production efficiency.
  • the capillary structure 40 is accommodated in the concave portion 11 and located between the convex portion 21 and the bottom surface of the concave portion 11 . Further, in order to better support the raised portion 21 between the upper cover plate 10 and the lower cover plate 20 , the capillary structure 40 may be in contact with the bottom surfaces of the raised portion 21 and the recessed portion 11 at the same time.
  • the upper cover 10 and/or the lower cover 20 may be formed by a continuous stamping forming process or a roll forming process to improve the forming efficiency.
  • the upper cover 10 and the lower cover 20 After stamping and forming, it can be connected to the coil material to realize automatic integrated assembly, which can save labor costs. After the materials for making the upper cover plate 10 and the lower cover plate 20 are plastically formed, the materials are hardened, so that the strength and reliability of the vapor chamber can be enhanced.
  • the longest outer diameter of each protruding portion 20 is 1.2-6 mm (millimeters).
  • the plurality of protrusions 21 may be arranged in an array or irregularly, and the shape of the protrusions 21 is not limited, and may be a regular shape or an irregular shape.
  • the longest outer diameter of the raised portion 21 can be understood as the longest distance between two points where the raised portion 21 is located in the vertical projection of the lower cover plate 20 .
  • the longest outer diameter of the raised portion 21 is denoted by d.
  • the raised portion 21 may be a cylinder, that is, the cross-sectional shape is a circle. In this case, the longest raised portion 21 has a
  • the outer diameter d is also the diameter of the cylinder, and its value ranges from 1.2 to 6 mm, for example, it may be 1.5 mm or 4 mm.
  • the raised portion 21 can also be a cone, the bottom area of the cone is larger than the top area, and the top of the cone faces the upper cover plate 10 .
  • the longest outer diameter d is the diameter of the bottom of the cone; or, as shown in FIG. 6 , the raised portion 21 can also be a regular hexagon, that is, the cross-sectional shape is a regular hexagon, and the longest outer diameter of the raised portion 21 is at this time.
  • d is the longest diagonal of a regular hexagon; or, as shown in FIG. 7 , the raised portion 21 can also be a quadrilateral, that is, the cross-sectional shape is a quadrilateral, and the longest outer diameter of the raised portion 21 is a quadrilateral at this time. the longest diagonal.
  • the shape of the protruding portion 21 of the present application is not limited to the shapes exemplified above, and may also be an ellipsoid or other shapes, which will not be exemplified one by one.
  • the protruding portion 21 is an ellipsoid, that is, the cross-sectional shape is an ellipse
  • the longest outer diameter of the protruding portion 21 is the long axis of the ellipsoid.
  • the shapes of all the protrusions 21 may be the same, or may be a combination of various shapes.
  • some protrusions 21 may be cylinders, and some protrusions may be cylindrical.
  • the portion 21 is an ellipsoid, and the other portion of the convex portion 21 is a quadrilateral.
  • the upper cover plate 10 further includes a connecting portion 12 extending from the periphery of the recessed portion 11 to the outside, and the connecting portion 12 is sealingly connected to the peripheral edge of the lower cover plate 20 .
  • the connection portion 12 and the peripheral edge of the lower cover plate 20 may be fixed by welding to achieve a sealed connection, for example, a welding process such as brazing or resistance welding may be used.
  • the connection portion 12 and the peripheral edge of the lower cover plate 20 can also be sealed in other ways, for example, a sealant can be used to bond to achieve the sealed connection.
  • the connecting portion 12 of the upper cover plate 10 is used to connect with the periphery of the lower cover plate 20, the connecting portion 12 and the peripheral edge of the lower cover plate 20 can be made thinner, which is beneficial to reduce weight and save materials.
  • the lower cover 20 includes an inner surface 22 on the side close to the upper cover 10 and an outer surface 23 opposite to the inner surface 22 , wherein the raised portion 21 extends from the outer surface 23 to the inner surface 22 Depression is formed. Therefore, the raised portion 21 of the present application is an internal hollow structure, which can greatly reduce the weight of the vapor chamber compared with the support body with a solid internal structure, which is more conducive to the thin and light design of the vapor chamber.
  • the depth of the concave portion 11 of the upper cover plate 10 is h1
  • the depth of the concave portion 23 from the outer surface 23 to the inner surface 22 is h2
  • the thickness of the capillary structure 40 is t
  • the three satisfy the following conditions: 0 ⁇ (h2+t-h1) ⁇ 20 ⁇ m
  • the upper cover plate 10 is a copper cover plate or a copper alloy cover plate, so by using a copper material with better thermal conductivity, when the upper cover plate 10 is connected to the heating device, it can generate heat. The device cools down faster.
  • the lower cover plate 20 is a stainless steel cover plate or a titanium alloy cover plate, so that the lower cover plate 20 is made of a material with greater strength, which can provide sufficient rigidity for the vapor chamber.
  • a copper layer may be plated on the inner surface 22 of the lower cover plate 20 to further improve the heat dissipation efficiency.
  • the lower cover plate 20 can be connected to the coil in the form of micro-connection points for single-sided copper plating process. Positioning, so as to realize the continuous copper plating process and save the cost of electroplating. After all the processes are completed, the blanking die can be used for blanking or the manipulator can break it off.
  • the thickness of the lower cover plate 20 is 0.03-0.12 mm, such as 0.09 or 0.11 mm. It should be noted that the thickness of the lower cover plate 20 refers to the thickness of the plate of the lower cover plate 20 itself, not the depth h2 of the depression of the outer surface 23 to the inner surface 22, and when the lower cover plate 20 is a plate of irregular thickness , the thickness of the lower cover plate 20 at the thinnest position is 0.03-0.12 mm. Through this design, the lower cover 20 can be made lighter and thinner while ensuring the rigidity of the lower cover 20 .

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种均温板，包括上盖板(10)和下盖板(20)；所述上盖板(10)和所述下盖板(20)连接以共同围成真空腔室(30)，所述均温板还包括收容于所述真空腔室(30)内的毛细结构(40)及冷却介质；所述上盖板(10)冲压成型有向远离所述下盖板(20)凹陷的凹陷部(11)，所述下盖板(20)冲压成型有向靠近所述上盖板(10)凸起的若干凸起部(21)，所述下盖板(20)覆盖所述凹陷部(11)并与所述上盖板(10)围合形成所述真空腔室(30)，所述凸起部(21)收容于所述真空腔室(30)内，所述毛细结构(40)收容于所述凹陷部(11)内并位于所述凸起部(21)与所述凹陷部(11)的底面之间；通过上述方式，能够简化制作工艺，减少制作时间，有利于提高生产效率。

Description

一种均温板 技术领域
本实用新型涉及热传导技术领域，特别是涉及一种均温板。
 背景技术
均温板也即真空腔均热板，其技术原理与热管相类似，但在传导方式上有所区别，热管为一维线性热传导，而均温板中的热量则是在一个二维的面上传导，因此热传导效率更高。
均温板一般是由盖合在一起的上盖板和下盖板组成，两盖板之间为真空腔。因此，在制作均温板的过程中，需对两盖板之间的空间进行真空化作业，而随着均温板的薄型化发展，上下盖板的厚度通常较薄，导致在抽真空过程中上下盖板容易产生凹陷。相关技术中，通常会在均温板内设置支撑体以在真空化作业进行时提供必要的支撑强度，然而，现有一般是将多个支撑体均匀摆放于均温板内，然后再利用螺接或焊接等方式固定，此种制作方式工艺复杂，且时间耗费多，不利于提高生产效率。
 技术问题
本实用新型主要解决的技术问题是提供一种均温板，能够简化制作工艺，减少制作时间，有利于提高生产效率。
 技术解决方案
本实用新型实施例提供一种均温板，包括上盖板和下盖板；
所述上盖板和所述下盖板连接以共同围成真空腔室，所述均温板还包括收容于所述真空腔室内的毛细结构及冷却介质；所述上盖板冲压成型有向远离所述下盖板凹陷的凹陷部，所述下盖板冲压成型有向靠近所述上盖板凸起的若干凸起部，所述下盖板覆盖所述凹陷部并与所述上盖板围合形成所述真空腔室，所述凸起部收容于所述真空腔室内，所述毛细结构收容于所述凹陷部内并位于所述凸起部与所述凹陷部的底面之间。
在一些实施例中，每一所述凸起部的最长外径为1.2~6mm。
在一些实施例中，所述上盖板还包括自所述凹陷部的周缘向外侧延伸的连接部，所述连接部与所述下盖板的周缘密封连接。
在一些实施例中，所述连接部与所述下盖板的周缘通过焊接或密封胶实现密封连接。
在一些实施例中，所述下盖板包括靠近所述上盖板一侧的内表面和与所述内表面相对的外表面，所述凸起部自所述外表面向所述内表面凹陷形成；
所述凹陷部的深度为h1、所述外表面向所述内表面凹陷的深度为h2以及所述毛细结构的厚度为t，满足以下条件：0≤h2+t-h1≤20μm。
在一些实施例中，所述毛细结构为铜丝网、粉末烧结、蚀刻和电沉积中的一种或多种组合。
在一些实施例中，所述下盖板包括靠近所述上盖板一侧的内表面和与所述内表面相对的外表面，所述内表面上镀有一铜层。
在一些实施例中，所述下盖板的厚度为0.03~0.12mm。
在一些实施例中，所述上盖板为铜盖板或铜合金盖板，所述下盖板为不锈钢盖板或钛合金盖板。
在一些实施例中，所述凸起部呈阵列排列。
 有益效果
本实用新型的均温板，包括上盖板和下盖板，上盖板和下盖板共同围成一真空腔室，其中，上盖板冲压成型有向远离下盖板凹陷的凹陷部，下盖板覆盖该凹陷部并与上盖板围合形成真空腔室，此外，下盖板冲压成型有向靠近上盖板凸起的若干凸起部，该若干凸起部收容于真空腔室内，因此该若干凸起部可作为上盖板和下盖板之间的支撑结构，有利于增强均温板的强度，并且，本方案中，通过冲压成型的方式在下盖板形成凸起部，可以大大简化制作工艺，且可以节省凸起部的安装时间，有利于提高生产效率。
 附图说明
图1是本实用新型实施例提供的均温板的俯视图；
图2是本实用新型实施例提供的均温板的分解示意图；
图3是图1所示的均温板沿AB方向的剖面图；
图4是图2所示的下盖板在虚线圈C处的放大示意图；
图5是本实用新型实施例提供的凸起部的一结构示意图；
图6是本实用新型实施例提供的凸起部的另一结构示意图；
图7是本实用新型实施例提供的凸起部的又一结构示意图；
图8是图3所示的均温板在虚线圈D处的放大示意图。
 本发明的实施方式
下面将结合本实用新型实施例中的附图，对本实用新型实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本实用新型一部分实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，均属于本实用新型保护的范围。
本实用新型的均温板，可以应用于各种电子设备中以对电子设备中的发热器件进行散热，例如可以应用于扬声器中，还可以用于手机等CPU芯片的散热。
参阅图1至图8，本实用新型的均温板的一些实施例中，均温板包括上盖板10和下盖板20，上盖板10和下盖板20连接以共同围成真空腔室30。上盖板10用于与发热器件连接。
此外，均温板还包括收容于真空腔室30内的毛细结构40和冷却介质，冷却介质例如可以是冷却液，冷却液可以填充满真空腔室30，以提高均温板的散热效果。毛细结构40可以是铜丝网、粉末烧结、蚀刻和电沉积中的一种或多种组合。
其中，如图3所示，上盖板10冲压成型有向远离下盖板20凹陷的凹陷部11，下盖板20冲压成型有向靠近上盖板10凸起的若干凸起部21，并且下盖板20覆盖凹陷部11并与上盖板10围合形成真空腔室30，若干凸起部21收容于真空腔室30内。由此，由于凸起部21为靠近上盖板10凸起，因此，凸起部21可以作为上盖板10和下盖板20之间的支撑结构，可以提高均温板的强度，能够有效降低在真空作业时上盖板10和下盖板20发生凹陷的几率；并且，通过冲压成型的方式在下盖板20上形成凸起部21，与现有方式相比，可以大大简化制作工艺，且可以节省凸起部的安装时间，有利于提高生产效率。
其中，毛细结构40收容于凹陷部11内，并且位于凸起部21和凹陷部11的底面之间。进一步地，为了使得凸起部21更好地支撑在上盖板10和下盖板20之间，毛细结构40可以同时与凸起部21和凹陷部11的底面接触。
在本申请的一些实施例中，上盖板10和/或下盖板20可以采用连续冲压成型工艺或者滚压成型工艺来形成，以提高成型效率，此外，上盖板10和下盖板20冲压成型后可以连接在卷料上，以实现自动化一体装配，可以节约人工成本。用于制作上盖板10和下盖板20的材料在经过塑性成型后，材料发生硬化，从而可以增强均温板的强度和可靠性。
其中，每一凸起部20的最长外径为1.2~6mm（毫米）。多个凸起部21可以是呈阵列排列，也可以是不规则排列，并且凸起部21的形状不做限定，可以是规则形状也可以是不规则形状。凸起部21的最长外径可以理解为凸起部21位于下盖板20的垂直投影中的两点之间的最长距离。凸起部21的最长外径用d表示，在一些实施方式中，如图4所示，凸起部21可以是柱体，即截面形状为圆形，此时凸起部21的最长外径d也即柱体的直径，其取值范围为1.2~6mm，例如可以是1.5mm或者4mm等。
在其他一些实施方式中，如图5所示，凸起部21也可以是圆椎体，圆锥体的底部面积大于顶部面积，圆锥体的顶部面向上盖板10，此时凸起部21的最长外径d也即圆锥体底部的直径；或者，如图6所示，凸起部21也可以正六边体，即截面形状为正六边形，此时凸起部21的最长外径d为正六边形的最长对角线；又或者，如图7所示，凸起部21也可以是四边体，即截面形状为四边形，此时凸起部21的最长外径为四边形的最长对角线。
当然，本申请的凸起部21的形状并不限于上述所例举的形状，还可以是椭圆体或其他形状，对此不做一一例举。当凸起部21是椭圆体，即截面形状为椭圆形，此时凸起部21的最长外径也即椭圆体的长轴。
其中，所有凸起部21的形状可以是一致的，或者，也可以是多种形状的组合，例如，多个凸起部21中，可以一部分凸起部21为柱体，还有一部分凸起部21为椭圆体，其他部分的凸起部21为四边体。
在本申请的一些实施例中，如图2和图3所示，上盖板10还包括自凹陷部11的周缘向外侧延伸的连接部12，连接部12与下盖板20的周缘密封连接。其中，连接部12与下盖板20的周缘可以通过焊接固定以实现密封连接，比如，可以采用钎焊或电阻焊等焊接工艺。当然，连接部12和下盖板20的周缘也可以通过其他方式进行密封连接，例如可以采用密封胶粘接以实现密封连接。此外，由于上盖板10的连接部12是用于和下盖板20的周缘进行连接，因此连接部12以及下盖板20的周缘可以做得更薄，有利于减轻重量和节省材料。
在本实用新型的一些实施例中，下盖板20包括靠近上盖板10一侧的内表面22和与内表面22相对的外表面23，其中凸起部21自外表面23向内表面22凹陷形成。因此，本申请的凸起部21，为内部中空结构，与内部为实体结构的支撑体相比，可以大大减轻均温板的重量，更有利于均温板的轻薄设计。
其中，如图8所示，上盖板10的凹陷部11的深度为h1，外表面23向内表面22凹陷的深度为h2，毛细结构40的厚度为t，三者满足以下条件：0≤（h2+t-h1）≤20μm，通过此设计，有利于避免均温板表面整体性凹陷，还可以避免因上盖板10和下盖板20之间的真空腔室30的高度过小而导致上盖板10出现凸起部21的印记的情况。
在本实用新型的一些实施例中，上盖板10为铜盖板或铜合金盖板，从而通过利用导热性能较好的铜材料制成，当上盖板10与发热器件连接时可以使得发热器件降温速度更快。下盖板20为不锈钢盖板或钛合金盖板，从而通过使用强度较大的材料制成下盖板20，可以为均温板提供足够的刚度。
可选地，在下盖板20的内表面22上还可以镀上一铜层，以进一步提高散热效率。在实际制作过程中，在下盖板20冲压成型之后，可以以微连接点的形式将下盖板20连接在卷料上进行单面镀铜工艺，镀铜过程中以冲压过程中产生的定位孔进行定位，从而实现连续镀铜工艺，节约电镀成本，当所有工序完成之后，可以用冲切模具进行落料或机械手掰断即可。
在本实用新型的一些实施例中，下盖板20的厚度为0.03~0.12mm，例如可以是0.09或者0.11等。需要说明的是，下盖板20的厚度是指下盖板20本身板材的厚度，并非是指外表面23向内表面22凹陷的深度h2，并且，当下盖板20为不规则厚度的板材时，下盖板20在最薄位置处的厚度为0.03~0.12mm。通过此设计，可以在确保下盖板20的刚度的同时，使得下盖板20更轻薄化。
以上仅为本实用新型的实施方式，并非因此限制本实用新型的专利范围，凡是利用本实用新型说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本实用新型的专利保护范围内。

Claims (10)

  1. 一种均温板，其特征在于，包括上盖板和下盖板；
    所述上盖板和所述下盖板连接以共同围成真空腔室，所述均温板还包括收容于所述真空腔室内的毛细结构及冷却介质；所述上盖板冲压成型有向远离所述下盖板凹陷的凹陷部，所述下盖板冲压成型有向靠近所述上盖板凸起的若干凸起部，所述下盖板覆盖所述凹陷部并与所述上盖板围合形成所述真空腔室，所述凸起部收容于所述真空腔室内，所述毛细结构收容于所述凹陷部内并位于所述凸起部与所述凹陷部的底面之间。
  2. 根据权利要求1所述的均温板，其特征在于，每一所述凸起部的最长外径为1.2~6mm。
  3. 根据权利要求1所述的均温板，其特征在于，所述上盖板还包括自所述凹陷部的周缘向外侧延伸的连接部，所述连接部与所述下盖板的周缘密封连接。
  4. 根据权利要求3所述的均温板，其特征在于，所述连接部与所述下盖板的周缘通过焊接或密封胶实现密封连接。
  5. 根据权利要求1所述的均温板，其特征在于，所述下盖板包括靠近所述上盖板一侧的内表面和与所述内表面相对的外表面，所述凸起部自所述外表面向所述内表面凹陷形成；
    所述凹陷部的深度为h1、所述外表面向所述内表面凹陷的深度为h2以及所述毛细结构的厚度为t，满足以下条件：0≤h2+t-h1≤20μm。
  6. 根据权利要求1所述的均温板，其特征在于，所述毛细结构为铜丝网、粉末烧结、蚀刻和电沉积中的一种或多种组合。
  7. 根据权利要求1所述的均温板，其特征在于，所述下盖板包括靠近所述上盖板一侧的内表面和与所述内表面相对的外表面，所述内表面上镀有一铜层。
  8. 根据权利要求1所述的均温板，其特征在于，所述下盖板的厚度为0.03~0.12mm。
  9. 根据权利要求1所述的均温板，其特征在于，所述上盖板为铜盖板或铜合金盖板，所述下盖板为不锈钢盖板或钛合金盖板。
  10. 根据权利要求1所述的均温板，其特征在于，所述凸起部呈阵列排列。
PCT/CN2020/128042 2020-09-30 2020-11-11 一种均温板 WO2022067980A1 (zh)

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CN203313574U (zh) * 2013-05-09 2013-11-27 吴哲元 均热装置的内部支撑结构
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