WO2022065295A1 - フィルムコンデンサ - Google Patents

フィルムコンデンサ Download PDF

Info

Publication number
WO2022065295A1
WO2022065295A1 PCT/JP2021/034556 JP2021034556W WO2022065295A1 WO 2022065295 A1 WO2022065295 A1 WO 2022065295A1 JP 2021034556 W JP2021034556 W JP 2021034556W WO 2022065295 A1 WO2022065295 A1 WO 2022065295A1
Authority
WO
WIPO (PCT)
Prior art keywords
film
dielectric resin
resin film
absorption peak
peak intensity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/034556
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
千一 小笹
智道 市川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Shizuki Electric Co Inc
Original Assignee
Murata Manufacturing Co Ltd
Shizuki Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd, Shizuki Electric Co Inc filed Critical Murata Manufacturing Co Ltd
Priority to JP2022551989A priority Critical patent/JP7463539B2/ja
Priority to CN202180064611.0A priority patent/CN116195008B/zh
Priority to DE112021004211.4T priority patent/DE112021004211T5/de
Publication of WO2022065295A1 publication Critical patent/WO2022065295A1/ja
Priority to US18/188,813 priority patent/US12224125B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/302—Polyurethanes or polythiourethanes; Polyurea or polythiourea
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/58—Epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
    • C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
    • C08G18/7671—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/14—Organic dielectrics
    • H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/14—Organic dielectrics

Definitions

  • the present invention relates to a film capacitor.
  • a film capacitor having a structure in which a flexible resin film is used as a dielectric and first and second counter electrodes facing each other are arranged with the resin film interposed therebetween.
  • the film capacitor usually has a substantially cylindrical shape formed by winding a resin film as a dielectric as described above, and a first surface thereof is placed on the first and second end faces of the cylinder facing each other, respectively. And a second external terminal electrode is formed.
  • the first counter electrode described above is electrically connected to the first external terminal electrode, and the second counter electrode is electrically connected to the second external terminal electrode.
  • Patent Document 1 includes a dielectric resin film and a first counter electrode and a second counter electrode facing each other with the dielectric resin film interposed therebetween.
  • a film capacitor, the dielectric resin film is a film for a capacitor made of a crosslinked product of a first organic material and a second organic material, and the second organic material is a polyisocyanate having a plurality of isocyanate groups.
  • the first organic material is disclosed as a film capacitor having a plurality of hydroxyl groups and having a branched structure.
  • Patent Document 1 describes that a phenoxy resin such as a high molecular weight bisphenol A type epoxy resin and a polyol such as a polyether polyol and a polyester polyol are used as the first organic material. Further, it is described that a polyisocyanate such as diphenylmethane diisocyanate (MDI) or tolylene diisocyanate (TDI) is used as the second organic material.
  • a phenoxy resin such as a high molecular weight bisphenol A type epoxy resin and a polyol such as a polyether polyol and a polyester polyol are used as the first organic material.
  • a polyisocyanate such as diphenylmethane diisocyanate (MDI) or tolylene diisocyanate (TDI) is used as the second organic material.
  • MDI diphenylmethane diisocyanate
  • TDI tolylene diisocyanate
  • Patent Document 1 describes that it is preferable that the weight ratio of the first organic material (phenoxy resin or polyol) is higher than the weight ratio of the second organic material (polyisocyanate). Further, Patent Document 1 describes that it is preferable that the residue of the hydroxyl group is larger than the residue of the isocyanate group.
  • Patent Document 1 describes that the counter electrode of the film capacitor is formed from, for example, an aluminum film vapor-deposited on the surface of a dielectric resin film. Then, a capacitor element is obtained by stacking and winding a first dielectric resin film and a second dielectric resin film on which counter electrodes are formed, and by spraying zinc on both ends thereof, for example, an external terminal electrode. Is described as being formed.
  • Film capacitors are also used for smoothing inverters in electric vehicles. With the increase in energy density of film capacitors used in such applications, long-term voltage is often applied in a higher temperature usage environment than before.
  • the vapor deposition electrode such as an aluminum film is gradually oxidized and the equivalent series resistance (ESR) of the film capacitor is increased.
  • ESR equivalent series resistance
  • the vapor-deposited electrode on the positive electrode (positive electrode) side easily reacts electrochemically with the hydroxide ion derived from the surrounding moisture, so that the vapor-deposited electrode tends to oxidize more strongly. Further, if the vapor-filmed electrode is oxidized, the function as the electrode is lost, and there is a problem that the capacitance is lowered.
  • the dielectric resin film is made of a urethane-based material in which a hydroxyl group and an isocyanate group are polymerized.
  • the urethane-based material has high hygroscopicity, so that the dielectric resin film easily absorbs moisture in the environment.
  • the vapor-deposited electrodes arranged on the dielectric resin film are easily oxidized by the moisture. Therefore, the fact that the dielectric resin film is made of a urethane-based material is also one of the factors that the problem of the progress of oxidation of the vapor-deposited electrode becomes apparent.
  • the present invention has been made to solve the above problems, and an object of the present invention is to provide a film capacitor in which the metal layer as an electrode is not easily oxidized even when a voltage is applied for a long time in a high temperature usage environment. And.
  • the film capacitor of the present invention comprises a dielectric resin film made of a thermosetting urethane resin and a metal layer provided on at least one surface of the dielectric resin film, and the dielectric resin film is at least isocyanate.
  • Wave number 2200 cm -1 or more and 2350 cm -1 or less detected with respect to the absorption peak intensity of the carbonyl group detected in the range of 1650 cm -1 or more and 1800 cm -1 or less, including groups and carbonyl groups.
  • the ratio of the absorption peak intensity of the isocyanate group (the absorption peak intensity of the isocyanate group / the absorption peak intensity of the carbonyl group) is 0.08 or more and 1.15 or less.
  • the present invention it is possible to provide a film capacitor in which the metal layer as an electrode is not easily oxidized even when a voltage is applied for a long time in a high temperature usage environment.
  • FIG. 1 is a perspective view schematically showing an example of the film capacitor of the present invention.
  • FIG. 2 is a sectional view taken along line II-II of the film capacitor shown in FIG.
  • FIG. 3 is a perspective view schematically showing an example of a wound body of a metallized film constituting the film capacitors shown in FIGS. 1 and 2.
  • the film capacitor of the present invention will be described.
  • the present invention is not limited to the following configuration, and can be appropriately modified and applied without changing the gist of the present invention.
  • a combination of two or more of the individual preferred configurations of the invention described below is also the invention.
  • the film capacitor of the present invention includes a dielectric resin film and a metal layer provided on at least one surface of the dielectric resin film.
  • the film capacitor of the present invention is, for example, a columnar column having an elongated cross section, and external terminal electrodes formed by, for example, metal spraying (metallikon) are provided at both ends in the central axis direction.
  • metal spraying metal spraying
  • a first dielectric resin film provided with a first metal layer and a second dielectric resin film provided with a second metal layer are laminated.
  • a winding type film capacitor, which is wound in a wound state will be described as an example.
  • the film capacitor of the present invention is a laminated type in which a first dielectric resin film provided with a first metal layer and a second dielectric resin film provided with a second metal layer are laminated. It may be a film capacitor or the like. Further, in the film capacitor of the present invention, a first dielectric resin film having a first metal layer and a second metal layer provided on the front surface and a back surface, respectively, and a second dielectric having no metal layer provided. It may be a film capacitor in which a resin film is wound or laminated.
  • FIG. 1 is a perspective view schematically showing an example of the film capacitor of the present invention.
  • FIG. 2 is a sectional view taken along line II-II of the film capacitor shown in FIG.
  • the film capacitor 10 shown in FIGS. 1 and 2 is a winding type film capacitor, and is a metallized film wound in a state where the first metallized film 11 and the second metallized film 12 are laminated. 40, and a first external terminal electrode 41 and a second external terminal electrode 42 connected to both ends of the metallized film winding body 40 are provided.
  • the first metallized film 11 is a first metal layer (counter electrode) provided on one surface of a first dielectric resin film 13 and a first dielectric resin film 13.
  • the second metallized film 12 is a second metal layer (counter electrode) provided on one surface of the second dielectric resin film 14 and the second dielectric resin film 14. It is equipped with 16.
  • the first metal layer 15 and the second metal layer 16 face each other with the first dielectric resin film 13 or the second dielectric resin film 14 interposed therebetween. Further, the first metal layer 15 is electrically connected to the first external terminal electrode 41, and the second metal layer 16 is electrically connected to the second external terminal electrode 42.
  • the first dielectric resin film 13 and the second dielectric resin film 14 may have different configurations, but it is desirable that they have the same configuration.
  • the preferable configurations of the first dielectric resin film 13 and the second dielectric resin film 14 will be described later.
  • the first metal layer 15 is formed so as to reach one side edge on one surface of the first dielectric resin film 13 but not to the other side edge.
  • a band-shaped first insulating portion 13a is formed on the other side edge.
  • the second metal layer 16 is formed so as not to reach one side edge on one surface of the second dielectric resin film 14, but to reach the other side edge.
  • a band-shaped second insulating portion 14a is formed on one side edge.
  • the first metal layer 15 and the second metal layer 16 are composed of, for example, an aluminum layer.
  • FIG. 3 is a perspective view schematically showing an example of a wound body of a metallized film constituting the film capacitors shown in FIGS. 1 and 2.
  • the width of the first dielectric resin film 13 and the width of the second dielectric resin film 14 are such that the end portions on the side reaching the side edges of the dielectric resin film 14 are exposed from the laminated film.
  • the layers are stacked so as to be shifted in the direction (left-right direction in FIG. 2).
  • the wound body 40 of the metallized film is formed, and the first metal layer 15 and the second metal are formed.
  • the layers 16 are kept exposed at the ends and are in a stacked state.
  • the second dielectric resin film 14 is located outside the first dielectric resin film 13, and the first dielectric resin film 13 and the second dielectric resin film 14 are formed.
  • Each of the first metal layer 15 and the second metal layer 16 is wound so as to face inward.
  • the first external terminal electrode 41 and the second external terminal electrode 42 are formed by spraying, for example, zinc or the like onto each end surface of the wound body 40 of the metallized film obtained as described above. ..
  • the first external terminal electrode 41 comes into contact with the exposed end of the first metal layer 15 and is thereby electrically connected to the first metal layer 15.
  • the second external terminal electrode 42 comes into contact with the exposed end of the second metal layer 16 and is thereby electrically connected to the second metal layer 16.
  • the wound body of the metallized film is pressed into a flat shape such as an ellipse or an oval, and has a more compact shape than when the cross-sectional shape is a perfect circle. ..
  • the film capacitor of the present invention may include a cylindrical winding shaft.
  • the winding shaft is arranged on the central axis of the metallized film in the wound state, and serves as a winding shaft when winding the metallized film.
  • metal layer In the film capacitor of the present invention, examples of the metal contained in the metal layer include aluminum (Al), titanium (Ti), zinc (Zn), magnesium (Mg), tin (Sn), nickel (Ni) and the like. Be done.
  • the metal layer is formed, for example, by depositing the above metal on a dielectric resin film.
  • the thickness of the metal layer is not particularly limited, but is, for example, 5 nm or more and 40 nm or less.
  • the thickness of the metal layer is specified by observing a cross section of the dielectric resin film provided with the metal layer cut in the thickness direction using an electron microscope such as a field emission scanning electron microscope (FE-SEM). can do.
  • FE-SEM field emission scanning electron microscope
  • the metal layer is provided with a fuse portion.
  • the fuse portion means a portion connecting the electrode portion and the electrode portion in which the metal layer serving as the counter electrode is divided into a plurality of parts.
  • the pattern of the metal layer having the fuse portion is not particularly limited, and for example, the electrode patterns disclosed in JP-A-2004-363431, JP-A-5-251266 and the like can be used.
  • the dielectric resin film is made of a thermosetting urethane resin and contains at least an isocyanate group and a carbonyl group. Then, the wave number with respect to the absorption peak intensity of the carbonyl group detected in the range of 1650 cm -1 or more and 1800 cm -1 or less: the absorption peak of the isocyanate group detected in the range of 2200 cm -1 or more and 2350 cm -1 or less.
  • the intensity ratio (absorption peak intensity of isocyanate group / absorption peak intensity of carbonyl group) is 0.08 or more and 1.15 or less.
  • the ratio of the absorption peak intensity of the isocyanate group to the absorption peak intensity of the carbonyl group is preferably 0.1 or more and 1.0 or less, and more preferably 0.2 or more and 0.8 or less.
  • the dielectric resin film of the film capacitor of the present invention absorbs water, it becomes water. Since the isocyanate group is first reacted and consumed, it is possible to suppress the oxidation of the metal layer by water. According to such a principle, even if a voltage is applied to the film capacitor of the present invention for a long time in a high temperature usage environment, it is possible to suppress oxidation of the metal layer as an electrode.
  • the film capacitor of the present invention has high high temperature durability. Further, as described above, even if a voltage is applied for a long time in a high temperature usage environment, it is possible to suppress oxidation of the metal layer as an electrode, so that the film capacitor of the present invention has a reduced capacitance. It becomes difficult to do.
  • the ratio of the absorption peak intensity of the isocyanate group to the absorption peak intensity of the carbonyl group is less than 0.08, the number of isocyanate groups present is small, so that the equivalent series resistance of the capacitor tends to increase and the capacitance decreases. It will be easier.
  • the ratio of the absorption peak intensity of the isocyanate group to the absorption peak intensity of the carbonyl group exceeds 1.15, the number of isocyanate groups present increases. Therefore, the dielectric resin film is close to the uncured state. Therefore, it becomes difficult to function as a dielectric resin film. As a result, the equivalent series resistance of the capacitor tends to increase, and the capacitance tends to decrease.
  • absorption peak intensity means the value calculated as follows. First, the infrared absorption spectrum of the dielectric resin film is measured by an attenuated total reflection method (ATR) using a Fourier transform infrared spectrophotometer (FT-IR). Next, the absorption band observed in the predetermined wavenumber region is assumed to be due to a predetermined functional group, baselines are drawn on both sides of each peak, and the value from the baseline to the apex intensity is set to the "functional group" of the functional group. Absorption peak intensity ".
  • the content of water contained in the dielectric resin film is preferably 0.4% by weight or less.
  • the content of water contained in the dielectric resin film is 0.4% by weight or less, the water content is sufficiently small, so that the water and isocyanate groups react with each other in the dielectric resin film to form unreacted isocyanate groups. It can be suppressed from decreasing. As a result, it is possible to remarkably suppress the oxidation of the metal layer.
  • the content of water contained in the dielectric resin film is preferably 0.01% by weight or more. If the content of water contained in the dielectric resin film is less than 0.01% by weight, it is predicted that the dielectric resin film becomes brittle.
  • the "content of water contained in the dielectric resin film” is a value measured by a hydride reaction method (ISO 15512: 2019 method E) with a heating temperature of 130 ° C.
  • the thickness of the dielectric resin film is not particularly limited, but if the dielectric resin film is too thin, it tends to become brittle. Therefore, the thickness of the dielectric resin film is preferably 1 ⁇ m or more, and more preferably 3 ⁇ m or more. On the other hand, if the film is too thick, defects such as cracks are likely to occur during film formation. Therefore, the thickness of the dielectric resin film is preferably 10 ⁇ m or less, and more preferably 5 ⁇ m or less.
  • the thickness of the dielectric resin film means the thickness of the dielectric resin film alone, which does not include the thickness of the metal layer. The thickness of the dielectric resin film can be measured using an optical film thickness meter.
  • the dielectric resin film is composed of, for example, a cured product of a first organic material having a hydroxyl group (OH group) and a second organic material having an isocyanate group (NCO group).
  • the dielectric resin film is composed of a cured product obtained by reacting a hydroxyl group of the first organic material with an isocyanate group of the second organic material.
  • the first organic material may be an organic polymer having a hydroxyl group and a benzene ring in the repeating unit.
  • examples of such a compound include a phenoxy resin and the like.
  • the phenoxy resin is preferably, for example, a bisphenol A type phenoxy resin, a bisphenol F type phenoxy resin, or the like.
  • Examples of the second organic material include diphenylmethane diisocyanate (MDI), tolylene diisocyanate (TDI), hexamethylene diisocyanate (HDI) and the like. Among these compounds, MDI or TDI is preferable. In addition, these may contain the modified form of the polyisocyanate, and these may be used together.
  • MDI diphenylmethane diisocyanate
  • TDI tolylene diisocyanate
  • HDI hexamethylene diisocyanate
  • MDI or TDI is preferable.
  • these may contain the modified form of the polyisocyanate, and these may be used together.
  • the isocyanate group contained in the dielectric resin film may be an isocyanate group derived from the second organic material.
  • the dielectric resin film can also contain additives for adding other functions.
  • smoothness can be imparted by adding a leveling agent.
  • the additive may be a material that has a functional group that reacts with a hydroxyl group and / or an isocyanate group and forms a part of the crosslinked structure of the cured product. Examples of such a material include a resin having at least one functional group selected from the group consisting of an epoxy group, a silanol group and a carboxyl group.
  • the film capacitor of the present invention it is shown as the product of the capacitance value of the film capacitor and the insulation resistance value measured 1 minute after the voltage is applied at a voltage of 150 V / ⁇ m after being allowed to stand in an atmosphere at a temperature of 125 ° C. for 1 hour.
  • the CR value is preferably 250 ⁇ ⁇ F or more, and more preferably 500 ⁇ ⁇ F or more. It can be said that the high temperature durability is high when the CR value of the capacitor under the above conditions is 250 ⁇ ⁇ F or more. Further, the CR value is preferably 5000 ⁇ ⁇ F or less. Attempting to manufacture a film capacitor having a CR value exceeding 5000 ⁇ ⁇ F is too costly and the production efficiency is lowered.
  • the dielectric resin film of the film capacitor of the present invention is produced by forming a resin solution containing a first organic material having a hydroxyl group and a second organic material having an isocyanate group into a film, and then heat-treating and curing the resin solution. can do. At this time, the amount of unreacted isocyanate groups is adjusted by adjusting the heat treatment conditions such as the reaction temperature and the reaction time, and by adjusting the molar ratio of the hydroxyl group of the first organic material to the isocyanate group of the second organic material. Can be controlled.
  • the ratio of the absorption peak intensity of the isocyanate group (the absorption peak intensity of the isocyanate group / the absorption peak intensity of the carbonyl group) to the absorption peak intensity of the carbonyl group of the obtained dielectric resin film is 0.08 or more and 1.15 or less. Can be.
  • a metallized film is obtained by forming a metal layer on one surface of the produced dielectric resin film.
  • the method for forming the metal layer include a method such as thin film deposition.
  • a metal layer is formed so that a band-shaped insulating portion is formed on one side edge of one surface of the dielectric resin film.
  • two metallized films having a metal layer formed on one surface of the dielectric resin film are prepared.
  • One of the two metallized films is rotated 180 degrees around the stacking direction so that the positions of the insulating parts are staggered, and the films are stacked in a state of being shifted by a predetermined distance in the width direction, and then wound.
  • a laminated body can be obtained.
  • the laminate may be sandwiched from a direction perpendicular to the width direction and pressed into an elliptical cylinder shape.
  • a film capacitor as shown in FIG. 1 can be obtained.
  • thermal spraying can be mentioned.
  • a dielectric resin film As a dielectric resin film, a high-molecular-weight bisphenol A-type phenoxy resin and MDI, which is a bifunctional isocyanate, are mixed so that the number of moles of the hydroxyl group of the former and the number of moles of the isocyanate group of the latter are almost equal, and the base film is formed. After applying thinly, it was dried to obtain a resin film. Aluminum was vapor-deposited to form a metal layer so that a band-shaped insulating portion was formed on one side edge of the dielectric resin film, and then the base material was peeled off and heat-cured.
  • MDI which is a bifunctional isocyanate
  • thermosetting was appropriately adjusted at 100 ° C. to 180 ° C. for 2 hours to 50 hours to form the metal layers according to Production Example 1-1, Production Example 1-2, Production Example 1-3 and Production Example 1-4.
  • a dielectric resin film having a thickness of 3 ⁇ m was produced.
  • the ratio of the absorption peak intensity of the isocyanate group (the absorption peak intensity of the isocyanate group / the absorption peak intensity of the carbonyl group) to the absorption peak intensity of the carbonyl group of each dielectric resin film was measured by the following method. there were.
  • the dielectric resin film was measured by ATR using a Fourier transform infrared spectrophotometer.
  • the wavenumber range was 4000 cm -1 to 500 cm -1 .
  • "FT / IR-4100ST" manufactured by JASCO Corporation was used.
  • the number of integrations was 64, and the resolution was 4 cm -1 .
  • the wave number the absorption peak intensity of the isocyanate group detected in the range of 2200 cm -1 or more and 2350 cm -1 or less with respect to the absorption peak intensity of the carbonyl group detected in the range of 1650 cm -1 or more and 1800 cm -1 or less.
  • the ratio (absorption peak intensity of isocyanate group / absorption peak intensity of carbonyl group) was calculated.
  • the dielectric resin film according to Production Example 1-1 is used.
  • the dielectric resin film according to Production Example 1-2 is used for the film capacitor according to Example 1-1.
  • the dielectric resin film according to Production Example 1-3 is used for the film capacitor according to Example 1-2.
  • the dielectric resin film according to Production Example 1-4 is used.
  • CR value is 100 ⁇ ⁇ F or more and ESR increase rate is 15% or less
  • CR value is less than 100 ⁇ ⁇ F and ESR increase rate is 15% or less
  • CR value is 100 ⁇ ⁇ F or more and ESR increase rate exceeds 15%
  • CR value is less than 100 ⁇ ⁇ F, and ESR increase rate exceeds 15%
  • the ratio of the absorption peak intensity of the isocyanate group to the absorption peak intensity of the carbonyl group is 0.08 or more.
  • the film capacitors according to Examples 1-1 and 1-2 having such a configuration had a CR value of 250 ⁇ ⁇ F or more.
  • Example 2-1 and (Example 2-2) and (Comparative Example 2-1) and (Comparative Example 2-2)
  • a dielectric resin film As a dielectric resin film, a high molecular weight bisphenol A type phenoxy resin and a trifunctional trimethylolpropane (TMP) -adduct TDI are used, and the number of moles of the hydroxyl group of the former and the number of moles of the isocyanate group of the latter are almost equal.
  • TMP trifunctional trimethylolpropane
  • Aluminum was vapor-deposited to form a metal layer so that a band-shaped insulating portion was formed on one side edge of the dielectric resin film, and then the base material was peeled off and heat-cured.
  • thermosetting is appropriately adjusted at 100 ° C. to 180 ° C. for 2 hours to 50 hours, and the metal layer having a thickness of 5 ⁇ m according to Production Example 2-1 and Production Example 2-2, Production Example 2-3 and Production Example 2-4.
  • the ratio of the absorption peak intensity of the isocyanate group (the absorption peak intensity of the isocyanate group / the absorption peak intensity of the carbonyl group) to the absorption peak intensity of the carbonyl group of each dielectric resin film was measured by the following method. there were.
  • the absorption peak intensity of each functional group was measured by the same method as in the above-mentioned " ⁇ Measurement of absorption peak intensity of functional group>".
  • the dielectric resin film according to Production Example 2-2 is used for the film capacitor according to Example 2-1.
  • the dielectric resin film according to Production Example 2-3 is used for the film capacitor according to Example 2-2.
  • the dielectric resin film according to Production Example 2-4 is used as the film capacitor according to Comparative Example 2-2.
  • the ratio of the absorption peak intensity of the isocyanate group to the absorption peak intensity of the carbonyl group (absorption peak intensity of isocyanate group / absorption peak of carbonyl group). It was found that when the strength) was 0.08 or more and 1.15 or less, oxidation of the vapor-deposited electrode was suppressed even when a voltage was applied for a long time at a high temperature, and the ESR was unlikely to increase. Further, the film capacitors according to Examples 2-1 and 2-2 having such a configuration had a CR value of 250 ⁇ ⁇ F or more.
  • Four kinds of coating liquids were mixed to prepare 50/50, 40/60 and 30/70, and each coating liquid was thinly applied to the base film and then dried to obtain a resin film.
  • the absorption peak intensities of the isocyanate group and the carbonyl group are measured by the same method as in the above " ⁇ Measurement of absorption peak intensity of functional group>" to obtain the carbonyl group.
  • the ratio of the absorption peak intensity of the isocyanate group to the absorption peak intensity was calculated. The results are shown in Table 3.
  • the dielectric resin film according to Production Example 3-1 is used for the film capacitor according to Comparative Example 3-1.
  • the dielectric resin film according to Production Example 3-2 is used for the film capacitor according to Example 3-1.
  • the dielectric resin film according to Production Example 3-3 is used for the film capacitor according to Example 3-2.
  • the dielectric resin film according to Production Example 3-4 is used as the film capacitor according to Comparative Example 3-2.
  • the film capacitors according to Examples 3-1 and 3-2 having such a configuration had a CR value of 250 ⁇ ⁇ F or more.
  • the first organic material and the second organic material are mixed in advance by adjusting the ratio of the number of moles of the latter isocyanate group to the number of moles of the former hydroxyl group to a certain degree and mixing them. It was found that the content of isocyanate groups contained in the body resin film can be easily adjusted.
  • Example 4-1 to (Example 4-4) As a dielectric resin film, a high-molecular-weight bisphenol A-type phenoxy resin and MDI, which is a bifunctional isocyanate, are mixed so that the number of moles of the hydroxyl group of the former and the number of moles of the isocyanate group of the latter are almost equal, and the base film is formed. After applying thinly, it was dried to obtain a resin film. Aluminum was vapor-deposited to form a metal layer so that a band-shaped insulating portion was formed on one side edge of the dielectric resin film, and then the base material was peeled off and heat-cured. The heat curing is at 150 ° C.
  • the metal layer in which the ratio of the absorption peak intensity of the isocyanate group to the absorption peak intensity of the carbonyl group (absorption peak intensity of the isocyanate group / absorption peak intensity of the carbonyl group) is 0.2.
  • the formed dielectric resin film having a thickness of 5 ⁇ m was produced.
  • the absorption peak intensity of the carbonyl group and the absorption peak intensity of the isocyanate group were measured by the same method as in the above-mentioned " ⁇ Measurement of absorption peak intensity of functional group>".
  • the capacitor element is forcibly humidified in an atmosphere of 85 ° C. and 85%, and the unhumidified capacitor element is heated and dried at 125 ° C. for 1 to 12 hours to reduce the water content in the dielectric resin film.
  • Table 4 Four types of capacitor elements, which are the numerical values shown in Table 4, were manufactured. The water content was measured by the hydride reaction method (ISO 15512: 2019 method E).
  • the film capacitors according to Examples 4-1 to 4-4 were manufactured.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Non-Insulated Conductors (AREA)
PCT/JP2021/034556 2020-09-23 2021-09-21 フィルムコンデンサ Ceased WO2022065295A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2022551989A JP7463539B2 (ja) 2020-09-23 2021-09-21 フィルムコンデンサ
CN202180064611.0A CN116195008B (zh) 2020-09-23 2021-09-21 薄膜电容器
DE112021004211.4T DE112021004211T5 (de) 2020-09-23 2021-09-21 Folienkondensator
US18/188,813 US12224125B2 (en) 2020-09-23 2023-03-23 Film capacitor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020158884 2020-09-23
JP2020-158884 2020-09-23

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US18/188,813 Continuation US12224125B2 (en) 2020-09-23 2023-03-23 Film capacitor

Publications (1)

Publication Number Publication Date
WO2022065295A1 true WO2022065295A1 (ja) 2022-03-31

Family

ID=80845447

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/034556 Ceased WO2022065295A1 (ja) 2020-09-23 2021-09-21 フィルムコンデンサ

Country Status (5)

Country Link
US (1) US12224125B2 (https=)
JP (1) JP7463539B2 (https=)
CN (1) CN116195008B (https=)
DE (1) DE112021004211T5 (https=)
WO (1) WO2022065295A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024252778A1 (ja) * 2023-06-06 2024-12-12 株式会社指月電機製作所 フィルムコンデンサ

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112021004211T5 (de) * 2020-09-23 2023-06-01 Murata Manufacturing Co., Ltd. Folienkondensator

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02191624A (ja) * 1989-01-20 1990-07-27 Asahi Chem Ind Co Ltd コンデンサー封止用一液性エポキシ樹脂組成物
WO2017175511A1 (ja) * 2016-04-06 2017-10-12 株式会社村田製作所 フィルムコンデンサ、コンデンサ用フィルム、及び、フィルムコンデンサの製造方法
WO2019097751A1 (ja) * 2017-11-15 2019-05-23 株式会社村田製作所 フィルムコンデンサ、及び、フィルムコンデンサ用フィルム
WO2020166392A1 (ja) * 2019-02-15 2020-08-20 株式会社村田製作所 フィルムコンデンサ、及び、フィルムコンデンサ用の誘電体樹脂フィルム

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4317159A (en) 1979-12-10 1982-02-23 Sprague Electric Company AC Capacitor and impregnant therefor
US4317158A (en) 1980-03-03 1982-02-23 Sprague Electric Company AC Capacitor
US4580189A (en) * 1985-03-12 1986-04-01 Sprague Electric Company Dry metallized film capacitor
CA1266518A (en) * 1985-03-12 1990-03-06 Raynor Linzey Self-healing metallized film capacitor
SE453202B (sv) 1986-05-12 1988-01-18 Sandvik Ab Sinterkropp for skerande bearbetning
JP3155323B2 (ja) 1992-03-04 2001-04-09 三菱伸銅株式会社 フィルムコンデンサの製造方法およびコンデンサ用メタライズドフィルムの製造方法
JP2004363431A (ja) 2003-06-06 2004-12-24 Matsushita Electric Ind Co Ltd 金属化フィルムコンデンサ
EP1888311A4 (en) * 2005-05-12 2011-06-22 Georgia Tech Res Inst COATED METAL OXIDE NANOTEHICLES AND MANUFACTURING METHOD THEREFOR
CN104137203B (zh) * 2012-02-29 2017-04-05 株式会社村田制作所 薄膜电容器用电介质树脂组合物和薄膜电容器
JP2013251427A (ja) * 2012-06-01 2013-12-12 Toray Ind Inc 太陽電池モジュール裏面封止シート用フィルム
JP6701896B2 (ja) * 2016-04-04 2020-05-27 信越化学工業株式会社 シリコーン変性ポリウレタン系繊維及びその製造方法
EP3712914B1 (en) * 2017-11-15 2025-12-03 Murata Manufacturing Co., Ltd. Film capacitor
JPWO2020175229A1 (ja) * 2019-02-28 2021-12-23 信越化学工業株式会社 医療用材料及びその製造方法
DE112021004211T5 (de) * 2020-09-23 2023-06-01 Murata Manufacturing Co., Ltd. Folienkondensator
WO2023105990A1 (ja) * 2021-12-07 2023-06-15 株式会社村田製作所 フィルムコンデンサおよび樹脂フィルム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02191624A (ja) * 1989-01-20 1990-07-27 Asahi Chem Ind Co Ltd コンデンサー封止用一液性エポキシ樹脂組成物
WO2017175511A1 (ja) * 2016-04-06 2017-10-12 株式会社村田製作所 フィルムコンデンサ、コンデンサ用フィルム、及び、フィルムコンデンサの製造方法
WO2019097751A1 (ja) * 2017-11-15 2019-05-23 株式会社村田製作所 フィルムコンデンサ、及び、フィルムコンデンサ用フィルム
WO2020166392A1 (ja) * 2019-02-15 2020-08-20 株式会社村田製作所 フィルムコンデンサ、及び、フィルムコンデンサ用の誘電体樹脂フィルム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024252778A1 (ja) * 2023-06-06 2024-12-12 株式会社指月電機製作所 フィルムコンデンサ

Also Published As

Publication number Publication date
CN116195008B (zh) 2025-09-23
JP7463539B2 (ja) 2024-04-08
JPWO2022065295A1 (https=) 2022-03-31
CN116195008A (zh) 2023-05-30
DE112021004211T5 (de) 2023-06-01
US12224125B2 (en) 2025-02-11
US20230230769A1 (en) 2023-07-20

Similar Documents

Publication Publication Date Title
CN111344824B (zh) 薄膜电容器以及薄膜电容器用薄膜
JP6944161B2 (ja) フィルムコンデンサ及びフィルムコンデンサの製造方法
CN110114848B (zh) 薄膜电容器、薄膜电容器的制造方法、电介质树脂膜以及电介质树脂膜的制造方法
JP7463539B2 (ja) フィルムコンデンサ
CN111149180A (zh) 薄膜电容器、薄膜电容器用薄膜、薄膜电容器用薄膜的制造方法以及薄膜电容器的制造方法
WO2020161984A1 (ja) フィルムコンデンサ
JP7099636B2 (ja) フィルムコンデンサ、及び、フィルムコンデンサ用フィルム
JP7234831B2 (ja) フィルムコンデンサ用フィルム、フィルムコンデンサ用フィルムの製造方法、フィルムコンデンサ、及び、フィルムコンデンサの製造方法
JP7509222B2 (ja) フィルムコンデンサ、フィルム、及び、金属化フィルム
JP7525301B2 (ja) フィルムコンデンサおよびフィルムコンデンサ用フィルム
JP7509224B2 (ja) フィルムコンデンサ、フィルム、及び、金属化フィルム
JP7632690B2 (ja) フィルムコンデンサおよび樹脂フィルム
JP7136369B2 (ja) フィルムコンデンサ、及び、フィルムコンデンサ用フィルム
CN116325042B (zh) 薄膜电容器、薄膜电容器用薄膜以及金属化薄膜
JP7348960B2 (ja) フィルムコンデンサ、及び、フィルムコンデンサ用フィルム
JP7786471B2 (ja) フィルムコンデンサ
WO2024252778A1 (ja) フィルムコンデンサ
JPH0128494B2 (https=)

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21872424

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2022551989

Country of ref document: JP

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 21872424

Country of ref document: EP

Kind code of ref document: A1

WWG Wipo information: grant in national office

Ref document number: 202180064611.0

Country of ref document: CN