WO2022054765A1 - 重合体組成物、ワニス、及びポリイミドフィルム - Google Patents
重合体組成物、ワニス、及びポリイミドフィルム Download PDFInfo
- Publication number
- WO2022054765A1 WO2022054765A1 PCT/JP2021/032709 JP2021032709W WO2022054765A1 WO 2022054765 A1 WO2022054765 A1 WO 2022054765A1 JP 2021032709 W JP2021032709 W JP 2021032709W WO 2022054765 A1 WO2022054765 A1 WO 2022054765A1
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- WIPO (PCT)
- Prior art keywords
- group
- formula
- polymer
- compound
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- FMACFWAQBPYRFO-UHFFFAOYSA-N O=C(c1c2cc(C3(c(cccc4)c4-c4c3cccc4)c(cc3)cc(C(O4)=O)c3C4=O)cc1)OC2=O Chemical compound O=C(c1c2cc(C3(c(cccc4)c4-c4c3cccc4)c(cc3)cc(C(O4)=O)c3C4=O)cc1)OC2=O FMACFWAQBPYRFO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Definitions
- It may be a polyamic acid composition containing a polyamic acid containing a repeating unit represented by the following general formula (2) and a compound (Y) represented by the following general formula (3).
- X 2 is a tetravalent group having an alicyclic structure or an aromatic ring
- R 1 and R 2 are independently hydrogen, an alkyl group having 1 to 6 carbon atoms, or 3 carbon atoms, respectively. 9 to 9 alkylsilyl groups.
- X 2 is obtained by removing two dicarboxylic acid anhydride portions (four carboxy group portions) from the tetracarboxylic acid dianhydride which is a raw material of the constituent unit A derived from the tetracarboxylic acid dianhydride described later. Is preferable.
- R 1 and R 2 are independently hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, and are preferably hydrogen.
- the repeating unit represented by the formula (2) is preferably 10 mol% with respect to all the repeating units of the polymer (X). More preferably, it is 30 mol% or more, further preferably 50 mol% or more, further preferably 70 mol% or more, still more preferably 90 mol% or more, and 100 mol% or less. Is. Further, when both the repeating unit represented by the general formula (1) and the repeating unit represented by the general formula (2) are included, the repeating unit represented by the general formula (1) and the repeating unit represented by the general formula (1) are included.
- the molar ratio [(1) / (2)] of the repeating unit represented by 2) is preferably 10/90 to 70/30, more preferably 20/80 to 60/40, and even more preferably 25/75 to. It is 55/45.
- Examples of the alicyclic tetracarboxylic acid dianhydride giving a structural unit derived from the alicyclic tetracarboxylic acid dianhydride include 1,2,4,5-cyclohexanetetracarboxylic acid dianhydride, 1,2,3.
- the compound represented by the formula (a3) is 9,9'-bis (3,4-dicarboxyphenyl) fluorene dianhydride (BPAF).
- the compound is preferably represented by the following formula (b2), and the structural unit B preferably contains a structural unit (B2) derived from the compound represented by the formula (b2).
- the compound represented by the formula (b2) is 4-aminophenyl-4-aminobenzoate (4-BAAB).
- the polymer (X) may be produced by any method, but the following method is preferable. As described above, the polymer (X) has a repeating unit represented by the general formula (1) (that is, an imide moiety) and a repeating unit represented by the general formula (2) (that is, an amide acid moiety). ), But these can be adjusted by changing the manufacturing method.
- a polymer (X) (polyimide) consisting of a repeating unit substantially represented by the formula (1) can be obtained.
- the method for producing the polymer (X) (polyimide) substantially composed of the repeating unit represented by the formula (1) is described in the above step 1 as "a tetracarboxylic acid component constituting the polyimide and a diamine component”. It is read as "the process of obtaining polyimide by reacting with”.
- the polymer (X) (polyamic acid) composed of the repeating unit substantially represented by the formula (2).
- the method for producing the polymer (X) (polyamic acid), which is substantially composed of the repeating unit represented by the formula (2) describes the step 2 as "a tetracarboxylic acid component constituting the polyamic acid and a diamine.” It should be read as "the process of reacting the components to obtain polyamic acid”.
- Examples thereof include a method of carrying out an imidization reaction by raising the temperature to (3) a method of charging a tetracarboxylic acid component, a diamine component and a reaction solvent into a reactor and immediately raising the temperature to carry out the imidization reaction.
- Step 2 in the production method of the present invention is a step of reacting the imide oligomer obtained in step 1 with the tetracarboxylic acid component and the diamine component constituting the amic acid moiety to obtain an imide-amide acid copolymer. ..
- the compound giving the structural unit (B2) is preferable.
- a polymer (X) polyamic acid
- the diamine component with respect to the tetracarboxylic acid component is set to 0. It is preferably 9.9 to 1.1 mol.
- Examples of the compound that gives the structural unit (A1) as the tetracarboxylic acid component used as a raw material in the present production method include, but are not limited to, the compound represented by the formula (a1), as long as the same structural unit is given. It may be the derivative. Examples of the derivative include a tetracarboxylic acid corresponding to the compound represented by the formula (a1) and an alkyl ester of the tetracarboxylic acid. As the compound that gives the structural unit (A1), the compound represented by the formula (a1) is preferable.
- aprotonic solvent examples include N, N-dimethylformamide, N, N-dimethylacetamide, N-methyl-2-pyrrolidone, N-methylcaprolactum, 1,3-dimethylimidazolidinone, tetramethylurea and the like.
- Amide-based solvent lactone-based solvent such as ⁇ -butyrolactone and ⁇ -valerolactone, phosphorus-containing amide-based solvent such as hexamethylphosphoric amide and hexamethylphosphintriamide, and sulfur-containing solvent such as dimethylsulfone, dimethylsulfoxide, and sulfolane.
- Examples thereof include a system solvent, a ketone solvent such as acetone, methyl ethyl ketone, cyclohexanone and methylcyclohexanone, and an ester solvent such as acetic acid (2-methoxy-1-methylethyl).
- a system solvent such as acetone, methyl ethyl ketone, cyclohexanone and methylcyclohexanone
- an ester solvent such as acetic acid (2-methoxy-1-methylethyl).
- the compound (Y) contained in the polymer composition of the present invention is represented by the following general formula (3).
- R 3 is at least one selected from the group consisting of an alkyl group having 1 to 30 carbon atoms, a phenyl group, an alkoxy group, an acryloyl group, a methacryloyl group, an acryloyloxyethyl group, and a methacryloyloxyethyl group.
- n is 0 to 2.
- the content of the compound (Y) is preferably 10 ppm or more and 10,000 ppm or less, more preferably 100 ppm or more and 5,000 ppm or less, and further preferably 500 ppm or more and 2,000 ppm or less with respect to the polymer (X). Is.
- the amount of the compound (Y) is in this range, a film having a low yellowness can be obtained while having heat resistance, and the transparency of the film can be further improved.
- "ppm" indicates parts per million by mass.
- the 1% weight loss temperature is the temperature at which the polyimide film is heated to 40 to 550 ° C. at a heating rate of 10 ° C./min and the weight is reduced by 1% as compared with the weight at 300 ° C. ..
- the above-mentioned physical property values in the present invention can be specifically measured by the method described in Examples.
- film thickness was measured using a micrometer manufactured by Mitutoyo Co., Ltd.
- the film thicknesses of Examples 5 and 6 were measured using a film thickness measuring device Filmtrics F20 (manufactured by Filmometrics Co., Ltd.).
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022547589A JP7838482B2 (ja) | 2020-09-10 | 2021-09-06 | 重合体組成物、ワニス、及びポリイミドフィルム |
| KR1020237007962A KR20230066345A (ko) | 2020-09-10 | 2021-09-06 | 중합체 조성물, 바니시, 및 폴리이미드 필름 |
| CN202180054894.0A CN116057109B (zh) | 2020-09-10 | 2021-09-06 | 聚合物组合物、清漆、和聚酰亚胺薄膜 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-152368 | 2020-09-10 | ||
| JP2020152368 | 2020-09-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2022054765A1 true WO2022054765A1 (ja) | 2022-03-17 |
Family
ID=80632388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2021/032709 Ceased WO2022054765A1 (ja) | 2020-09-10 | 2021-09-06 | 重合体組成物、ワニス、及びポリイミドフィルム |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7838482B2 (https=) |
| KR (1) | KR20230066345A (https=) |
| CN (1) | CN116057109B (https=) |
| TW (1) | TWI896753B (https=) |
| WO (1) | WO2022054765A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022220286A1 (ja) * | 2021-04-16 | 2022-10-20 | 三菱瓦斯化学株式会社 | イミド-アミド酸共重合体及びその製造方法、ワニス、並びにポリイミドフィルム |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018025955A1 (ja) * | 2016-08-03 | 2018-02-08 | 日産化学工業株式会社 | 剥離層形成用組成物 |
| JP2019506478A (ja) * | 2015-12-24 | 2019-03-07 | ドゥーサン コーポレイション | 接着力が向上したポリアミック酸組成物及びこれを含むポリイミドフィルム |
| JP2019112632A (ja) * | 2017-12-22 | 2019-07-11 | ドゥーサン コーポレイション | ポリアミック酸溶液及びこれを用いた透明ポリイミド樹脂フィルム |
| WO2019188305A1 (ja) * | 2018-03-28 | 2019-10-03 | 三菱瓦斯化学株式会社 | ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4660959B2 (ja) * | 2000-04-27 | 2011-03-30 | Jsr株式会社 | ゴム組成物 |
| TW200300772A (en) * | 2001-12-11 | 2003-06-16 | Kaneka Corp | Polyimide precursor, manufacturing method thereof, and resin composition using polyimide precursor |
| CN102976983B (zh) * | 2012-10-25 | 2015-10-21 | 华中科技大学 | 一种砜基含氟二胺化合物和聚酰亚胺薄膜材料及其制法 |
| WO2015046375A1 (ja) * | 2013-09-30 | 2015-04-02 | 株式会社ネオス | 親水撥油性付与剤およびこれを含有する組成物 |
| JP6627510B2 (ja) | 2013-11-27 | 2020-01-08 | 宇部興産株式会社 | ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板 |
| JP6760083B2 (ja) | 2015-01-29 | 2020-09-23 | 宇部興産株式会社 | ポリイミド前駆体組成物およびそれを用いた絶縁被覆層の製造方法 |
| JP6672987B2 (ja) * | 2016-04-21 | 2020-03-25 | 三菱エンジニアリングプラスチックス株式会社 | 熱可塑性樹脂組成物及びその成形品 |
| JP7375318B2 (ja) * | 2018-05-16 | 2023-11-08 | 東レ株式会社 | ポリイミド前駆体樹脂組成物、ポリイミド樹脂組成物およびその膜状物、それを含む積層体、ならびにフレキシブルデバイス |
| WO2020110947A1 (ja) * | 2018-11-28 | 2020-06-04 | 三菱瓦斯化学株式会社 | ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム |
| CN113166413B (zh) * | 2018-12-13 | 2024-02-09 | 三菱瓦斯化学株式会社 | 聚酰亚胺树脂组合物和聚酰亚胺薄膜 |
-
2021
- 2021-09-06 KR KR1020237007962A patent/KR20230066345A/ko active Pending
- 2021-09-06 JP JP2022547589A patent/JP7838482B2/ja active Active
- 2021-09-06 WO PCT/JP2021/032709 patent/WO2022054765A1/ja not_active Ceased
- 2021-09-06 CN CN202180054894.0A patent/CN116057109B/zh active Active
- 2021-09-07 TW TW110133173A patent/TWI896753B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019506478A (ja) * | 2015-12-24 | 2019-03-07 | ドゥーサン コーポレイション | 接着力が向上したポリアミック酸組成物及びこれを含むポリイミドフィルム |
| WO2018025955A1 (ja) * | 2016-08-03 | 2018-02-08 | 日産化学工業株式会社 | 剥離層形成用組成物 |
| JP2019112632A (ja) * | 2017-12-22 | 2019-07-11 | ドゥーサン コーポレイション | ポリアミック酸溶液及びこれを用いた透明ポリイミド樹脂フィルム |
| WO2019188305A1 (ja) * | 2018-03-28 | 2019-10-03 | 三菱瓦斯化学株式会社 | ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022220286A1 (ja) * | 2021-04-16 | 2022-10-20 | 三菱瓦斯化学株式会社 | イミド-アミド酸共重合体及びその製造方法、ワニス、並びにポリイミドフィルム |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI896753B (zh) | 2025-09-11 |
| JP7838482B2 (ja) | 2026-04-01 |
| TW202219122A (zh) | 2022-05-16 |
| JPWO2022054765A1 (https=) | 2022-03-17 |
| CN116057109B (zh) | 2024-05-14 |
| CN116057109A (zh) | 2023-05-02 |
| KR20230066345A (ko) | 2023-05-15 |
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