WO2022053051A1 - Ionic resin encapsulation adhesive film and preparation method, laminated structure, and photovoltaic module - Google Patents

Abstract

The present application relates to an ionic resin encapsulation adhesive film and a preparation method, a laminated structure, and a photovoltaic module. The ionic resin encapsulation adhesive film comprises an ionized functional layer, and the ionized functional layer comprises an ionic resin; the ionic resin comprises 50-99% of an ethylene-vinyl acetate copolymer or elastomer, 0.01-40% of an unsaturated metal carboxylate salt, and 0.01-5% of an initiator, based on the total mass content of 100 parts. The unsaturated metal carboxylate salt and the ethylene-vinyl acetate copolymer or elastomer in the adhesive film of the present application have good compatibility, and during use of the adhesive film, the initiator initiates a free radical reaction, so as to form a network structure in the ethylene-vinyl acetate copolymer or elastomer, thereby producing high volume resistivity, improving the anti-PID performance of modules, and maintaining the good light transmittance of the adhesive film.

Description

Ionic resin encapsulation film and preparation method, laminated structure, photovoltaic module

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the priority of Chinese patent application No. 202010955685.0, which was filed on September 11, 2020 and entitled "Multilayer Ionic Resin Encapsulation Film and Module Structure for Photovoltaic Modules", which was filed on September 11, 2020 The priority of the Chinese patent application 202010956377.X entitled "Ionic Resin Encapsulating Film and Laminated Structure", and the title of "Preparation Method of Ionic Resin Encapsulating Adhesive Film" filed on September 11, 2020 The priority of Chinese patent application 202010956133.1, the entire contents of which are incorporated herein by reference.

technical field

The present application relates to the technical field of adhesive films, in particular to an ionic resin encapsulation adhesive film, a preparation method thereof, a laminated structure, and a photovoltaic module.

Background technique

Photovoltaic ethylene-vinyl acetate copolymer (EVA) film is a thermosetting adhesive film, which is placed in the middle of photovoltaic modules or laminated glass. Due to the advantages of photovoltaic EVA in adhesion, durability, optical properties, etc., it is more and more widely used in current components and various optical products. Although photovoltaic EVA accounts for a small part of the overall cost of the module, it is closely related to the reliability of the module and requires high technical requirements. Therefore, considering the cost control, process route, etc., optimizing the formulation of photovoltaic EVA to make it have anti-potential induced decay (PID) performance has become one of the most realistic and feasible methods. The various failure problems of the current modules are more or less related to the photovoltaic EVA film. Regarding the photovoltaic film formulation, domestic and foreign research and improvement are also being continued. However, the formation mechanism of PID has not been clarified so far. For crystalline silicon components, it is speculated that it is due to the migration of sodium ions, low-potential electron conduction, and external active metal ions penetrate SIN to change the parallel resistance, and the fill factor FF will be significantly reduced. At present, PIDFree is used as one of the selling points by many module factories and battery factories, and many PV module users also begin to accept only PIDFree modules. The industry is also actively trying various technologies, such as CN201310089748.9 by adding metal ion scavengers to reduce the mobility of metal ions to improve the anti-PID characteristics of photovoltaic modules, but due to the high melting point of such metal ion scavengers, it cannot be uniform Dispersed in the matrix resin, it can only exist in the form of particles with large particle size, which affects the light transmittance and haze.

Therefore, there is an urgent need for a film that can improve the anti-PID performance while ensuring high light transmittance and low haze, and can not cause damage to the battery.

SUMMARY OF THE INVENTION

The purpose of the present application is to provide an ionic resin encapsulation film and its preparation method, laminate structure, photovoltaic module, the ionic resin encapsulation film can improve the anti-PID performance while ensuring high light transmittance, and It has excellent adhesion to glass, which ensures the safety of its use in laminated glass.

In the first aspect, the embodiment of the present application proposes an ionic resin encapsulation adhesive film, which includes at least two layers of adhesive films, one of which is an adhesive film layer on the side close to the power generation surface of the battery, and the other layer is an ionization functional layer. The functional layer contains ionic resin, wherein the ionic resin contains 50-99% of matrix resin, 0.01-40% of unsaturated carboxylate metal salt, and 0.01-5% of initiator, based on the total mass content of 100 parts; the adhesive film The transmittance is ≥85%, and the haze is ≤5%.

In the ionic resin encapsulation film, the matrix resin is an ethylene-vinyl acetate copolymer or an elastomer.

The ionic resin encapsulation adhesive film provided in the embodiments of the present application includes at least one ionization functional layer, which contains a sufficient amount of unsaturated carboxylic acid metal salt, so as to ensure that the adhesive film has improved anti-PID performance. Moreover, in the ionic resin encapsulation film of the present application, the unsaturated carboxylic acid metal salt can be sufficiently and uniformly dispersed in the ethylene-vinyl acetate copolymer matrix resin of the ionization functional layer, so that the multilayer encapsulation film can obtain High light transmittance and low haze. The ionized functional layer of the ion-type resin encapsulation adhesive film of the present application also contains a certain amount of initiator. Therefore, when the adhesive film is used for lamination, a free radical reaction can be initiated by an initiator, thereby forming a network structure in the ethylene-vinyl acetate copolymer, which can generate high volume resistivity and improve the anti-PID performance of the module. In addition, the network structure of ethylene-vinyl acetate copolymer can also limit the migration and diffusion of unsaturated carboxylate metal salts, preventing the unsaturated carboxylate metal salts from agglomerating to form particles with larger particle sizes, thereby deteriorating the light transmittance and fogging of the adhesive film. Spend.

In the ionic resin encapsulation film provided in this application, if the particle size of the unsaturated carboxylic acid metal salt is too large and the distribution is uneven, the film will have low light transmittance and high haze, and only the particle size will be small to a certain extent. , in order to achieve high transmittance and low haze. In addition, the unsaturated carboxylic acid metal salt in the adhesive film of the present application has good compatibility with ethylene-vinyl acetate copolymer or elastomer. The network structure formed in the vinyl acetate copolymer or elastomer can produce high volume resistivity and improve the anti-PID performance of the component.

According to one aspect of the embodiments of the present application, the cationic metal of the unsaturated carboxylic acid metal salt may include, but is not limited to, one or more of magnesium, zinc, copper, lithium, sodium, and potassium.

According to one aspect of the embodiments of the present application, the carboxylic acid group of the unsaturated carboxylic acid metal salt may be a carboxylic acid containing an ethylenic bond and/or an alkyne bond, including but not limited to a methacrylic acid group, an acrylic acid group, a crotonic acid group group, one or more of itaconic acid group, cinnamic acid group, butyndioic acid group and maleic acid group.

According to one aspect of the embodiments of the present application, at least a part of the unsaturated carboxylate metal salt is bonded with the base resin by a secondary bond force.

According to one aspect of the embodiments of the present application, the initiator is an initiator that can generate free radicals by photo-initiation or thermal initiation.

According to an aspect of the embodiments of the present application, the volume resistivity of the ionic resin encapsulation adhesive film is ≥1.0*10 ¹⁴ Ω·cm.

According to an aspect of the embodiments of the present application, the ionic resin encapsulant film may further include at least one ethylene-vinyl acetate layer.

According to an aspect of the embodiments of the present application, the elastomers include rubber elastomers and polyolefin elastomers, and the rubber elastomers include but are not limited to natural rubber (NR), ethylene propylene diene monomer (EPDM), hydrogenated styrene butyl One or more of diene block copolymer (SEBS), styrene-butadiene-styrene block copolymer (SBS), styrene-isoprene-styrene block copolymer (SIS) kind.

According to one aspect of the embodiments of the present application, the ionic resin encapsulation film is used as an encapsulation film of a solar cell.

According to one aspect of the embodiments of the present application, the ionic resin encapsulation film is used as the intermediate film of the laminated glass.

In a second aspect, the present application also relates to a laminate structure comprising at least one outer layer, and at least one ionic resin encapsulant film.

According to one aspect of the embodiments of the present application, the laminated structure is in the form of a photovoltaic module, safety glass or insulating glass.

In a third aspect, the present application also relates to a photovoltaic module, comprising at least one outer layer, a battery sheet, and the ionic resin encapsulating film as described in the first aspect of the present application.

According to one aspect of the embodiments of the present application, the outer layer is photovoltaic glass and/or a backsheet.

In the fourth aspect, the present application also relates to a preparation method of an ionic resin encapsulation film, the preparation method is to add metal oxides or hydroxides, unsaturated carboxylic acids, initiators, other Additives and matrix resin, cast or calendered into film.

In the preparation method of the ionic resin encapsulation film provided in the present application, the metal oxide or hydroxide reacts with the unsaturated carboxylic acid in-situ in the matrix resin to generate the unsaturated carboxylic acid metal salt. The particle size of the unsaturated carboxylic acid metal salt is very small, and it is uniformly distributed in the matrix resin. The adhesive film prepared by this method has low light transmittance and high haze. In addition, the metal salt of unsaturated carboxylate generated in situ by this method has good compatibility with ethylene-vinyl acetate copolymer or elastomer. - A network structure is formed in vinyl acetate copolymer or elastomer, which can produce high volume resistivity and improve the anti-PID performance of components. In addition, the network structure of the ethylene-vinyl acetate copolymer or elastomer can also limit the migration and diffusion of unsaturated carboxylic acid metal salts, preventing unsaturated carboxylic acid metal salts from agglomerating to form particles with larger particle sizes, thereby deteriorating the light transmission of the adhesive film. rate and haze.

According to an aspect of the embodiments of the present application, in the preparation method of the ionic resin encapsulation adhesive film, the content of the matrix resin is 50-99%, the content of the metal oxide or hydroxide is 0.01-40%, and the content of the unsaturated carboxylic acid is 0.01-40%. The content is 0.01-40%, the content of the initiator is 0.01-5%, and the content of other auxiliary agents is 0.01-5%, based on 100 parts of the total mass content.

According to one aspect of the embodiments of the present application, the matrix resin is an ethylene-vinyl acetate copolymer or an elastomer; the elastomer includes a rubber elastomer and a polyolefin elastomer, and the rubber elastomer includes but is not limited to natural rubber (NR), EPDM, hydrogenated styrene butadiene block copolymer (SEBS), styrene-butadiene-styrene block copolymer (SBS), styrene-isoprene One or more of olefin-styrene block copolymers (SIS).

According to one aspect of the embodiments of the present application, the metal oxides or hydroxides include, but are not limited to, one or more of oxides or hydroxides of magnesium, zinc, copper, lithium, sodium, and potassium.

According to one aspect of the embodiments of the present application, the unsaturated carboxylic acid is a carboxylic acid containing ethylenic and acetylenic bonds, including but not limited to methacrylic acid, acrylic acid, crotonic acid, itaconic acid, cinnamic acid, butynedi One or more of acid and maleic acid, etc.

According to an aspect of the embodiments of the present application, the initiator is an initiator that can generate free radicals by photo-initiation or thermal initiation.

According to an aspect of the embodiments of the present application, the other auxiliary agents are one or more of auxiliary crosslinking agents, antioxidants, and silane coupling agents.

detailed description

Features and exemplary embodiments of various aspects of the present application are described in detail below. Numerous specific details are disclosed in the following detailed description to provide a thorough understanding of the present application. However, it will be apparent to those skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating examples of the present application. This application is in no way limited to any specific configurations and algorithms set forth below, but covers any modifications, substitutions and improvements of elements, components and algorithms without departing from the spirit of this application. In the following description, well-known structures and techniques are not shown in order to avoid unnecessarily obscuring the present application.

For a better understanding of the present application, the ionic resin encapsulation adhesive film provided in the embodiments of the present application and its preparation method, laminated structure, and photovoltaic module will be described in detail below.

The embodiments of the present application provide an ionic resin encapsulation adhesive film, which includes at least one ionized functional layer, the ionized functional layer includes an ionic resin, and the ionic resin includes 50-99% of a matrix resin, unsaturated Carboxylic acid metal salt 0.01-40%, initiator 0.01-5%, based on the total mass content of 100 parts; the matrix resin includes ethylene-vinyl acetate copolymer or elastomer; the light transmittance of the adhesive film ≥ 85%, haze≤5%.

The ionic resin encapsulating adhesive film of the present application can be used in photovoltaic modules. Since in the ionic resin encapsulating adhesive film of the present application, the ionizing functional layer contains a predetermined amount of unsaturated metal carboxylate, when the component is laminated and used, a free radical reaction can be initiated by an initiator, thereby forming a network in the matrix resin The structure traps metal ions and thus can provide improved anti-PID performance for photovoltaic modules. In addition, the ionic resin encapsulating film of the present application maintains excellent optical properties, that is, light transmittance≥85% and haze≤5%.

In the prior art encapsulation film, in order to improve the anti-PID performance, the particulate metal ion scavenger is often directly mixed into the matrix resin raw material for film formation. Due to the high melting point of such metal ion scavengers, they cannot be uniformly dispersed in the matrix resin, and can only exist in the form of particles with large particle sizes, which adversely affects the light transmittance and haze of the produced film. Therefore, prior to the present application, if the prior art encapsulation film contains a sufficient content of metal ion scavenger, it is necessary to sacrifice optical properties as the expense, and it is impossible to obtain a light transmittance ≥ 85% and a haze ≤ 5%.

The applicant found that if the unsaturated carboxylate metal salt is added to the encapsulation film in an in-situ manner, the generated unsaturated carboxylate metal salt can be uniformly dispersed in the matrix resin of the film, so that the film can maintain Excellent optical properties.

As an embodiment of adding the unsaturated carboxylic acid metal salt in the form of in-situ generation, the corresponding unsaturated carboxylic acid and the unsaturated carboxylic acid metal salt that can react with the unsaturated carboxylic acid to form the unsaturated carboxylic acid metal salt can be added to the matrix resin raw material for film formation. Metal ion basic compounds, such as metal hydroxides, metal oxides. The unsaturated carboxylic acid and the metal ion-containing basic compound react under the conditions of melt blending with the matrix resin to form the unsaturated carboxylic acid metal salt. The in-situ generated metal salt of unsaturated carboxylate can be uniformly dispersed in the matrix resin.

In some embodiments of the present application, the average particle size of the unsaturated carboxylic acid metal salt may be ≤900 nm, or ≤120 nm, or ≤110 nm, ≤50 nm, ≤20 nm, or ≤10 nm, or even ≤1 nm.

In some embodiments, the content of the unsaturated carboxylic acid metal salt in the encapsulating film may be, based on 100 parts by mass of the ionized functional layer base resin, ≤35%, ≤30%, ≤25%, ≤20%, ≤15%, or ≤10%. In some embodiments, the content of the unsaturated carboxylic acid metal salt in the encapsulating film may be, based on 100 parts by mass of the ionized functional layer base resin, ≥0.05%, ≥0.1%, ≥0.5%, ≥1%, or ≥5%. According to the present application, the unsaturated carboxylate metal salt can be very uniformly dispersed in the matrix resin of the ionized functional layer, so even if the content of the unsaturated carboxylate metal salt is low, the anti-PID performance of the photovoltaic module can be effectively improved. In addition, according to the present application, the unsaturated carboxylate metal salt is added in an in-situ manner, so even if the content of the unsaturated carboxylate metal salt is high, the encapsulant film can maintain satisfactory optical properties.

In some embodiments, the cationic metal of the unsaturated metal carboxylate is selected from one or more of magnesium, zinc, copper, lithium, sodium, potassium. Optionally, the cationic metal of the unsaturated carboxylic acid metal salt is selected from one or more of magnesium, zinc, and copper.

In some embodiments, the carboxylic acid group of the metal unsaturated carboxylate is a carboxylic acid group containing an ethylenic and/or acetylenic bond. Optionally, the carboxylic acid group is selected from the group consisting of a methacrylic acid group, an acrylic acid group, a crotonic acid group, an itaconic acid group, a cinnamic acid group, a butynedioic acid group and a maleic acid group. one or more.

In some embodiments, the metal salt of an unsaturated carboxylate is magnesium acrylate, zinc methacrylate.

In the ionic resin encapsulating adhesive film according to the present application, the ionizing functional layer further contains an initiator. In some embodiments, the initiator is selected from initiators that can photo- or thermally generate free radicals. Examples of the initiator include organic peroxides, alkylphenone-based initiators, azo compounds, and the like.

When the encapsulation film is used for the encapsulation of photovoltaic modules, the initiator can generate free radicals to initiate a free radical reaction, so that the ethylene-vinyl acetate copolymer matrix resin forms a network structure, which can generate high volume resistivity and improve the resistance of the module. PID performance.

In some embodiments, the volume resistivity of the encapsulant film according to the present application is ≥1.0*10 ¹⁴ Ω·cm. Optionally, the volume resistivity of the encapsulating film according to the present application is ≥1.0*10 ¹⁵ Ω·cm, or even ≥ 1.0*10 ¹⁶ Ω·cm.

In addition, such a network structure can also limit the migration and diffusion of unsaturated carboxylate metal salts, and prevent unsaturated carboxylate metal salts from agglomerating to form larger particles during the use of the encapsulating film, thereby deteriorating the light transmittance and haze. Therefore, the encapsulating adhesive film of the present application has improved durability when used in photovoltaic modules, and can maintain good optical performance even after a long period of use.

In some embodiments, at least a portion of the unsaturated carboxylate metal salt is subvalently bonded to the matrix resin. Such secondary bonding can be generated by the reaction of the unsaturated groups of the unsaturated carboxylic acid groups with the matrix resin initiated by the initiator. When at least a part of the unsaturated carboxylate metal salt is combined with the base resin by a secondary bond force, the compatibility of the unsaturated carboxylate metal salt with the base resin is improved, so that the unsaturated carboxylate metal salt can be more uniform dispersed in the matrix resin.

In some embodiments, the peel strength of the encapsulating film of the present application and glass is ≥170N/cm, ≥175N/cm, or ≥176N/cm, or even ≥180N/cm.

In some embodiments, the ionic resin encapsulant film may further include at least one layer of ethylene-vinyl acetate. When the encapsulating film is used for photovoltaic modules, the ethylene-vinyl acetate layer is arranged close to the power generation surface of the cell. In this way, the ethylene-vinyl acetate layer can be used as a barrier layer between the ionized functional layer and the battery sheet, to block the reaction product during the lamination and use of the segregated functional layer, thereby protecting the battery sheet.

Embodiments of the present application further provide a laminated structure comprising at least one outer layer and any one of the above-mentioned ionic resin encapsulating adhesive films.

The laminated structure is in the form of photovoltaic modules, safety glass or insulating glass.

The embodiments of the present application further provide a photovoltaic module, comprising at least one outer layer, a battery sheet, and any one of the above-mentioned ionic resin encapsulation adhesive films according to the present application.

In some embodiments, the outer layers of the photovoltaic assembly are photovoltaic glass and/or a backsheet.

The photovoltaic modules according to the present application can obtain improved anti-PID performance. In some embodiments, after 192 hours of aging under the conditions of a temperature of 85° C., a humidity of 85%, and a pressure of 1500V, the photovoltaic module of the present application has a power attenuation of ≤5%, or ≤3%, or even ≤2.5%.

The embodiment of the present application also provides a method for preparing an ionic resin encapsulation film, the preparation method is to add metal oxides or hydroxides, unsaturated carboxylic acids, initiators, and other auxiliary agents to the film-making equipment And matrix resin, casting or calendering into film.

In the preparation method of the ionic resin encapsulation film, the content of matrix resin is 50-99%, the content of metal oxide or hydroxide is 0.01-40%, the content of unsaturated carboxylic acid is 0.01-40%, the initiator The content is 0.01-5%, and the content of other auxiliary agents is 0.01-5%, based on the total mass content of 100 parts.

In the prior art encapsulation film, in order to improve the anti-PID performance, the particulate metal ion scavenger is often directly mixed into the matrix resin raw material for film formation. Due to the high melting point of such metal ion scavengers, they cannot be uniformly dispersed in the matrix resin, and can only exist in the form of particles with large particle sizes, which adversely affects the light transmittance and haze of the produced film. Therefore, prior to the present application, if the prior art encapsulation film contains a sufficient content of metal ion scavenger, it is necessary to sacrifice optical performance as the expense, and cannot obtain light transmittance ≥ 85% and haze ≤ 5%.

The applicant found that if the unsaturated carboxylate metal salt is added to the encapsulation film in an in-situ manner, the generated unsaturated carboxylate metal salt can be uniformly dispersed in the matrix resin of the film, so that the film can maintain Excellent optical properties.

As an embodiment of adding the unsaturated carboxylic acid metal salt in the form of in-situ generation, the corresponding unsaturated carboxylic acid and the unsaturated carboxylic acid metal salt that can react with the unsaturated carboxylic acid to form the unsaturated carboxylic acid metal salt can be added to the matrix resin raw material for film formation. Metal ion basic compounds, such as metal hydroxides, metal oxides. The unsaturated carboxylic acid and the metal ion-containing basic compound react under the conditions of melt blending with the matrix resin to form the unsaturated carboxylic acid metal salt. The in-situ generated metal salt of unsaturated carboxylate can be uniformly dispersed in the matrix resin.

In some embodiments of the present application, the average particle size of the unsaturated carboxylic acid metal salt may be ≤900 nm, or ≤130 nm, or ≤25 nm, or even ≤2 nm.

In some embodiments, the metal oxide or hydroxide is selected from one or more of the oxides or hydroxides of the metals magnesium, zinc, copper, lithium, sodium, potassium;

In some embodiments, the unsaturated carboxylic acid is selected from one or more of methacrylic acid, acrylic acid, crotonic acid, itaconic acid, cinnamic acid, butynedioic acid, maleic acid, and the like.

In some embodiments, the initiator is selected from initiators that can photo- or thermally generate free radicals. Examples of the initiator include organic peroxides, alkylphenone-based initiators, azo compounds, and the like.

When the encapsulation film is used for the encapsulation of photovoltaic modules, the initiator can generate free radicals to initiate a free radical reaction, so that the matrix resin forms a network structure, which can generate high volume resistivity and improve the anti-PID performance of the module.

In some embodiments, the volume resistivity of the encapsulant film according to the present application is ≥1.0*10 ¹⁴ Ω·cm. Optionally, the volume resistivity of the encapsulating film according to the present application is ≥1.0*10 ¹⁵ Ω·cm, or even ≥ 1.0*10 ¹⁶ Ω·cm.

In addition, such a network structure can also limit the migration and diffusion of unsaturated carboxylate metal salts, and prevent unsaturated carboxylate metal salts from agglomerating to form larger particles during the use of the encapsulating film, thereby deteriorating the light transmittance and haze.

Example

Unless otherwise specified, the materials used in the following specific examples were obtained commercially and used directly.

Example 1

Both outer layer formulations are as follows (outer layer is defined as ethylene-vinyl acetate layer):

Ethylene-vinyl acetate copolymer: 91%;

Initiator: 1.5% 2-hydroxy-2-methyl-1-phenylacetone;

Co-crosslinking agent: 3% 2,4,6-tris(allyloxy)s-triazine;

Silane coupling agent: 3.5% γ-aminopropyltriethoxysilane;

Antioxidant: 1% 2,6-di-tert-butyl-4-methylphenol;

The formula of the ionized functional layer, that is, the interlayer film, is as follows:

In terms of mass content,

Ethylene-vinyl acetate copolymer: 86%;

Unsaturated carboxylic acid: 6% methacrylic acid;

Metal oxide: 0.5% zinc oxide;

Initiator: 0.5% tert-butyl peroxybenzoate;

Co-crosslinking agent: 3% 2,4,6-tris(allyloxy)s-triazine;

Silane coupling agent: 3.5% γ-aminopropyltriethoxysilane;

Antioxidant: 0.5% 2,6-di-tert-butyl-4-methylphenol;

According to the designed experimental formula, the materials are weighed, and after the weighing is completed, they are respectively added to the hoppers of three plastic extruders for extrusion. film. The three-layer adhesive film obtained by co-extrusion is denoted as S1-1.

Example 2

The formula of ethylene-vinyl acetate layer is as follows: (This formula is defined as ordinary ethylene-vinyl acetate film D1-1)

Ethylene-vinyl acetate copolymer: 92%;

Initiator: 1.5% 2-hydroxy-2-methyl-1-phenylacetone;

Co-crosslinking agent: 3% 2,4,6-tris(allyloxy)s-triazine;

Silane coupling agent: 3.5% γ-aminopropyltriethoxysilane;

The formula of the ionized functional layer is as follows:

In terms of mass content,

Ethylene-vinyl acetate copolymer: 50%;

Unsaturated carboxylic acid: 30% acrylic acid;

Metal oxide: 10% magnesium oxide;

Initiator: 3% 2-hydroxy-2-methyl-1-phenylacetone;

Co-crosslinking agent: 2.8% 2,4,6-tri(allyloxy)-s-triazine;

Silane coupling agent: 3% γ-methacryloyloxypropyltrimethoxysilane;

Antioxidant: 1.2% 2,6-di-tert-butyl-4-methylphenol;

According to the designed experimental formula, the materials are weighed. After the weighing is completed, the materials are added to the hoppers of two plastic extruders for extrusion. The temperature of the plastic extruders is 90 °C, and the required double-layer structure hot melt film. The double-layer adhesive film obtained by co-extrusion is denoted as S1-2.

Example 3

Both outer layers are formulated as follows (defined as an ethylene vinyl acetate layer)

Ethylene-vinyl acetate copolymer: 92%;

Initiator: 4% 2-hydroxy-2-methyl-1-phenylacetone;

Co-crosslinking agent: 1.5% 2,4,6-tri(allyloxy)-s-triazine;

Silane coupling agent: 1.5% vinyltrimethoxysilane;

Antioxidant: 1% tetrakis[beta-(3,5-di-tert-butyl-4-hydroxyphenyl)propionic acid]pentaerythritol ester;

The formula of the ionized functional layer, that is, the interlayer film, is as follows:

In terms of mass content,

Ethylene-vinyl acetate copolymer: 85%;

Unsaturated carboxylic acid: 6% acrylic acid;

Metal oxide: 1% zinc oxide;

Initiator: 0.5% azobisisobutyronitrile;

Co-crosslinking agent: 3% 2,4,6-tris(allyloxy)s-triazine;

Silane coupling agent: 3.5% γ-aminopropyltriethoxysilane;

Antioxidant: 1% 2,6-di-tert-butyl-4-methylphenol;

According to the designed experimental formula, the materials are weighed, and after the weighing is completed, they are added to the hoppers of three plastic extruders for extrusion. film. The three-layer adhesive film obtained by co-extrusion is denoted as S1-3.

Example 4

The formula of ethylene-vinyl acetate layer is as follows: (this formula is defined as ordinary ethylene-vinyl acetate film D1-2)

Ethylene-vinyl acetate copolymer: 81%;

Initiator: 1.5% 2-hydroxy-2-methyl-1-phenylacetone;

Co-crosslinking agent: 3% 2,4,6-tris(allyloxy)s-triazine;

Silane coupling agent: 4.5% γ-aminopropyltriethoxysilane;

The formula of the ionized functional layer is as follows:

In terms of mass content,

Ethylene-vinyl acetate copolymer: 50%;

Unsaturated carboxylate metal salt: 20% acrylic acid;

Metal oxide: 20% zinc oxide;

Initiator: 3% 2-hydroxy-2-methyl-1-phenylacetone;

Co-crosslinking agent: 2.8% 2,4,6-tri(allyloxy)-s-triazine;

Silane coupling agent: 3% γ-methacryloyloxypropyltrimethoxysilane;

Antioxidant: 1.2% 2,6-di-tert-butyl-4-methylphenol;

According to the designed experimental formula, the materials are weighed. After the weighing is completed, the materials are added to the hoppers of two plastic extruders for extrusion. The temperature of the plastic extruders is 90 °C, and the required double-layer structure hot melt film. The double-layer adhesive film obtained by co-extrusion is denoted as S1-4.

Example 5

Put the three-layer adhesive film prepared in Example 1 in the order of tempered glass (float glass)-S1-1-battery sheet-S1-1-tempered glass (float glass or backplane), and place the laminator. In the middle lamination, the lamination temperature is 142°C, the lamination time is 18min, and the obtained module structure is denoted as C1-1.

Example 6

Put the adhesive films prepared in Examples 1-2 in the order of tempered glass (float glass)-S1-1-battery sheet-S1-2-tempered glass (float glass or backplane), and place the laminator In the middle lamination, the lamination temperature was 142°C, and the lamination time was 18min, and the obtained module structure was denoted as C1-2.

Example 7

Put the adhesive film prepared in Example 2 in the order of tempered glass (float glass)-S1-2-battery sheet-S1-2-tempered glass (float glass or backplane), and place them in a laminator for lamination. , the lamination temperature is 142°C, the lamination time is 18min, and the obtained component structure is denoted as C1-3.

Example 8

Put the adhesive films prepared in Example 1 in the order of float glass (tempered glass)-S1-1-float glass (tempered glass), place them in a laminator for lamination, and the lamination process is 90-135°C , the lamination time is 70min, and the obtained module structure is denoted as C1-4.

Example 9

Put the adhesive films prepared in Example 2 in the order of float glass (tempered glass)-S1-2-float glass (tempered glass), and place them in a laminator for lamination. The lamination process is 90-135°C. , the lamination time is 70min, and the obtained module structure is denoted as C1-5.

In order to better prove the beneficial effects of the present application, four comparative examples are given here, which are ordinary ethylene-vinyl acetate adhesive film (denoted as D1-1) and ordinary ethylene-vinyl acetate adhesive film (denoted as D1-1). D1-2), ordinary ethylene-vinyl acetate film assembly structure (denoted as D1-3), ordinary ethylene-vinyl acetate film assembly structure (denoted as D1-4).

Example 10

The film formulation is as follows:

In terms of mass content,

Ethylene-vinyl acetate copolymer: 60%;

Unsaturated carboxylic acid: 20% methacrylic acid;

Metal oxide: 14% zinc oxide;

Initiator: 1% tert-butyl peroxybenzoate;

Co-crosslinking agent: 1% 2,4,6-tris(allyloxy)s-triazine;

Silane coupling agent: 3% γ-aminopropyltriethoxysilane;

Antioxidant: 1% 2,6-di-tert-butyl-4-methylphenol;

According to the designed experimental formula, the material is weighed, and after the weighing is completed, it is added to the hopper of the plastic extruder for extrusion. 1.

Example 11

The film formulation is as follows:

In terms of mass content,

Polyolefin elastomer: 50%;

Unsaturated carboxylic acid: 30% acrylic acid;

Metal oxide: 10% magnesium oxide;

Initiator: 3% 2-hydroxy-2-methyl-1-phenylacetone;

Co-crosslinking agent: 2.8% 2,4,6-tri(allyloxy)-s-triazine;

Silane coupling agent: 3% γ-methacryloyloxypropyltrimethoxysilane;

Antioxidant: 1.2% 2,6-di-tert-butyl-4-methylphenol;

According to the designed experimental formula, the material is weighed, and after the weighing is completed, it is added to the hopper of the plastic extruder for extrusion. 2.

Example 12

The film formulation is as follows:

In terms of mass content,

EPDM rubber: 85%;

Unsaturated carboxylic acid: 6% acrylic acid;

Metal oxide: 1% zinc oxide;

Initiator: 0.5% azobisisobutyronitrile;

Co-crosslinking agent: 3.5% 2,4,6-tri(allyloxy)-s-triazine;

Silane coupling agent: 3% γ-aminopropyltriethoxysilane;

Antioxidant: 1% 2,6-di-tert-butyl-4-methylphenol;

According to the designed experimental formula, the material is weighed, and after the weighing is completed, it is added to the hopper of the plastic extruder for extrusion. 3.

Example 13

The film formulation is as follows:

In terms of mass content,

Hydrogenated styrene butadiene block copolymer: 50%;

Unsaturated carboxylic acid: 20% acrylic acid;

Metal oxide: 20% zinc oxide;

Initiator: 2.5% 2-hydroxy-2-methyl-1-phenylacetone;

Co-crosslinking agent: 2.8% 2,4,6-tri(allyloxy)-s-triazine;

Silane coupling agent: 3.5% γ-methacryloyloxypropyltrimethoxysilane;

Antioxidant: 1.2% 2,6-di-tert-butyl-4-methylphenol;

According to the designed experimental formula, the material is weighed, and after the weighing is completed, it is added to the hopper of the plastic extruder for extrusion. 4.

Example 14

Put the adhesive film prepared in Example 1 in the order of tempered glass (float glass)-S1-battery sheet-S1-tempered glass (float glass or backplane), place it in a laminator for lamination, and the lamination temperature The temperature was 142° C., the lamination time was 18 min, and the obtained module structure was denoted as C2-1.

Example 15

Put the adhesive films prepared in Examples 1-2 in the order of tempered glass (float glass)-S1-battery sheet-S2-tempered glass (float glass or backplane), and place them in a laminator for lamination. The pressing temperature was 142° C., the lamination time was 18 min, and the resulting module structure was denoted as C2-2.

Example 16

Put the adhesive film prepared in Example 2 in the order of tempered glass (float glass)-S2-battery sheet-S2-tempered glass (float glass or backplane), place it in a laminator for lamination, and the lamination temperature The temperature was 142° C., the lamination time was 18 min, and the resulting module structure was denoted as C2-3.

Example 17

The adhesive films prepared in Example 1 were placed in the order of float glass (tempered glass)-S1-float glass (tempered glass), placed in a laminator for lamination, and the lamination process was 90-135° C. The pressing time was 70 min, and the obtained assembly structure was denoted as C2-4.

Example 18

The adhesive films prepared in Example 2 were placed in the order of float glass (tempered glass)-S2-float glass (tempered glass), placed in a laminator for lamination, and the lamination process was 90-135° C. The pressing time was 70 min, and the obtained assembly structure was denoted as C2-5.

In order to better prove the beneficial effects of the present application, four comparative examples are given here, namely ethylene-vinyl acetate adhesive film (denoted as D2-1), polyolefin elastomer adhesive film (denoted as D2-2), Ethylene-vinyl acetate film assembly structure (denoted as D2-3), polyolefin elastomer film assembly structure (denoted as D2-4).

Example 19

Ethylene-vinyl acetate copolymer: 50%;

Unsaturated carboxylic acid: 40% acrylic acid;

Oxides or hydroxides of metals: 8% magnesium hydroxide;

Initiator: 0.5% 2-hydroxy-2-methyl-1-phenylacetone;

Co-crosslinking agent: 0.5% 2,4,6-tri(allyloxy)-s-triazine;

Silane coupling agent: 0.5% γ-methacryloyloxypropyltrimethoxysilane;

Antioxidant: 0.5% 2,6-di-tert-butyl-4-methylphenol;

According to the designed experimental formula, the material is weighed, and after the weighing is completed, it is added to the hopper of the plastic extruder for extrusion and casting into a film. The temperature of the plastic extruder is 90 ° C, and the extrusion time is 15 minutes. S3-1.

Example 20

Rubber elastomer: 50% EPDM rubber;

Unsaturated carboxylic acid: 6% cinnamic acid;

Oxides or hydroxides of metals: 40% magnesium oxide;

Initiator: 1.5% 2-hydroxy-2-methyl-1-phenylacetone;

Co-crosslinking agent: 2.0% 2,4,6-tri(allyloxy)-s-triazine;

Silane coupling agent: 0.4% γ-methacryloyloxypropyltrimethoxysilane;

Antioxidant: 0.1% 2,6-di-tert-butyl-4-methylphenol;

According to the designed experimental formula, the material is weighed, and after the weighing is completed, it is added to the hopper of the plastic extruder for extrusion and casting into a film. The temperature of the plastic extruder is 70 ° C, and the extrusion time is 15 minutes. The obtained film is recorded as S3-2.

Example 21

Rubber elastomer: 60% hydrogenated styrene butadiene block copolymer;

Unsaturated carboxylic acid: 20% acrylic acid;

Oxides or hydroxides of metals: 10% zinc oxide;

Initiator: 5% 2-hydroxy-2-methyl-1-phenylacetone;

Co-crosslinking agent: 3% 2,4,6-tris(allyloxy)s-triazine;

Silane coupling agent: 1% γ-methacryloyloxypropyltrimethoxysilane;

Antioxidant: 1% 2,6-di-tert-butyl-4-methylphenol;

According to the designed experimental formula, the material is weighed, and after the weighing is completed, it is added to the hopper of the plastic extruder for extrusion and calendering into a film. The temperature of the plastic extruder is 110 ° C, and the extrusion time is 25 minutes. -3.

Example 22

Polyolefin: 99% ethylene-octene copolymer;

Unsaturated carboxylic acid: 0.01% methacrylic acid;

Oxides or hydroxides of metals: 0.01% zinc oxide;

Initiator: 0.01% 2-hydroxy-2-methyl-1-phenylacetone;

Co-crosslinking agent: 0.03% 2,4,6-tri(allyloxy)-s-triazine;

Silane coupling agent: 0.02% γ-methacryloyloxypropyltrimethoxysilane;

Antioxidant: 0.02% 2,6-di-tert-butyl-4-methylphenol;

According to the designed experimental formula, the material is weighed. After the weighing is completed, it is added to the hopper of the plastic extruder for extrusion and calendering. The temperature of the plastic extruder is 140 ° C and the extrusion time is 15 minutes. -4.

Comparative ratio

Ethylene-vinyl acetate copolymer: 92%;

Initiator: 1.5% 2-hydroxy-2-methyl-1-phenylacetone;

Co-crosslinking agent: 3% 2,4,6-tris(allyloxy)s-triazine;

Silane coupling agent: 3.5% γ-aminopropyltriethoxysilane;

According to the designed experimental formula, the material is weighed, and after the weighing is completed, it is added to the hopper of the plastic extruder for extrusion and casting into a film. The temperature of the plastic extruder is 90 ° C, and the extrusion time is 15 minutes. Ordinary ethylene-vinyl acetate film D3-1.

Comparative ratio

Ethylene-octene copolymer: 81%;

Initiator: 1.5% 2-hydroxy-2-methyl-1-phenylacetone;

Co-crosslinking agent: 3% 2,4,6-tris(allyloxy)s-triazine;

Silane coupling agent: 4.5% γ-aminopropyltriethoxysilane;

According to the designed experimental formula, the material is weighed, and after the weighing is completed, it is added to the hopper of the plastic extruder for extrusion and casting into a film. The temperature of the plastic extruder is 90 ° C, and the extrusion time is 15 minutes. Ordinary polyolefin elastomer film D3-2.

In order to better prove the beneficial effect of the present application, two comparative examples are given here, namely the ordinary ethylene-vinyl acetate adhesive film (denoted as D3-1) and the ordinary polyolefin elastomer adhesive film (denoted as D3) -2).

Performance Testing

The particle size, haze, light transmittance, volume resistivity and peel strength of the unsaturated carboxylic acid metal salts in the adhesive films of Examples 1 to 4 were tested. The haze, light transmittance and anti-PID performance of the laminated structures 1 to 5 were tested.

The particle size, haze, light transmittance, volume resistivity and peel strength of the unsaturated carboxylic acid metal salt in the adhesive films of Examples 10-13 were tested. The haze, light transmittance and anti-PID performance of the laminated structures 1 to 5 were tested.

The particle size, haze, light transmittance, volume resistivity and peel strength of the unsaturated carboxylic acid metal salts in the adhesive films of Examples 19-22 were tested. The haze, light transmittance and anti-PID performance of the laminated structures 1 to 5 were tested.

Performance test plan

1. Particle size of unsaturated carboxylate metal salt

The particle size was measured by the transmission electron microscope sectioning method, a small amount of the sample was uniformly dispersed in the ethanol solution, the sample was dropped on the surface of the copper mesh, and the sample on the copper mesh was dried. After the copper mesh is completely dried, put the copper mesh into the testing instrument, and observe the particle size of the unsaturated carboxylic acid metal salt at different magnifications.

2. Haze

Take one piece of 100mm*100mm film and two pieces of glass, and put them into the laminator in the order of glass/film/glass for lamination. The lamination process is 145°C, and the lamination pressure is 70kPa for 18 minutes. Use a high-precision haze tester to test in accordance with GB/T2410.

3. Light transmittance

Take two pieces of 100mm*100mm film, put the two pieces of film together in a laminator for lamination, the lamination process is 145°C, the lamination pressure is 70kPa, 18 minutes, and after cooling, take 6cm in length and 3cm in width. Use UV spectrophotometer to test, take the average value between 380-1100nm as the final data. Tested according to GB/T 29848 standard.

4. Volume resistivity

Take two 100mm*100mm adhesive films, overlap the adhesive films, and place them in a laminator for lamination. The lamination process is 145°C, the lamination pressure is 70kPa, and the volume resistivity is measured after cooling for 18 minutes. Tested according to GB/T 29848 standard.

5. Peel strength

Take two 200mm*300mm adhesive films, overlap the adhesive films, place them in the order of glass-adhesive film-adhesive film-backplane, and place them in a laminator for lamination. The lamination process is 145°C, and the lamination pressure is 70kPa, 18 minutes, after cooling, cut 5 strips with a width of 15mm, peel off at a speed of 10mm/s at room temperature, and test the peel strength between the film and the glass. Tested according to GB/T 29848 standard.

6. Anti-PID performance

Prepare two pieces of film, two pieces of glass, and one cell (including the welding tape and the busbar), put them in the order of glass-film-cell-film-glass to simulate a small component, and put the small component into the layer Lamination in a press, lamination process at 145° C., lamination pressure at 70 kPa, for 18 minutes. After the small components are cooled, the small components are put into the PID aging box. The test conditions are: temperature 85°C, humidity 85%, pressure 1500V, time 192H. Tested according to GB/T 29848 standard. The test results are shown in Tables 1 to 5.

Table 1 Performance test results of embodiments S1-1 to S1-4 and comparative examples

Table 2 Performance test results of component structures C1-1～C1-5 and the comparative example

	Haze (%)	Transmittance(%)	Anti-PID performance (power decay %)
C1-1	3.8	89.6	2.3
C1-2	4.1	89.1	2.5
C1-3	3.7	90.0	2.7
C1-4	2.6	91.3	/
C1-5	3.0	90.6	/
D1-3	2.5	92.0	16.4

D1-4

6.2

85.4

5.5

Compared with the ethylene-vinyl acetate olefin film, the haze of Examples S1-1 to S1-4 is reduced, and the light transmittance is increased; 1 Compared with ordinary ethylene-vinyl acetate film D1-2, the volume resistivity and peel strength are significantly improved.

Compared with ordinary ethylene-vinyl acetate module structure D1-4, module structures C1-1～C1-5 have lower haze and higher light transmittance; module structures C1-1～C1-5 are different from ordinary ethylene-vinyl acetate module structures The film component structure D1-3 and the ordinary ethylene-vinyl acetate component structure D1-4 have significantly improved anti-PID performance.

Table 3 Performance test results of embodiments S2-1 to S2-4 and comparative examples

Table 4 Performance test results of component structures C2-1～C2-5 and the comparative example

	Haze (%)	Transmittance(%)	Anti-PID performance (power decay %)
C2-1	3.8	89.6	2.3
C2-2	4.1	89.1	2.5
C2-3	3.7	90.0	2.7
C2-4	2.6	91.3	/
C2-5	3.0	90.6	/
D2-3	2.5	92.0	16.4
D2-4	6.2	85.4	5.5

Compared with the ethylene-vinyl acetate olefin film, the haze of Examples S2-1 to S2-4 is reduced, and the light transmittance is increased; 1 Compared with ordinary polyolefin elastomer film D2-2, the volume resistivity and peel strength are significantly improved.

Component structures C2-1 to C2-5 have lower haze and higher light transmittance compared to ordinary polyolefin elastomer component structure D2-4; component structures C2-1 to C2-5 are different from ordinary ethylene-vinyl acetate glue For the membrane module structure D2-3 and the common polyolefin elastomer module structure D2-4, the anti-PID performance is significantly improved.

Table 5 Performance test results of embodiments S3-1 to S3-4 and comparative examples

Compared with the ethylene-vinyl acetate olefin film, the haze of Examples S3-1 to S3-4 is reduced, and the light transmittance is increased; 1 Compared with ordinary polyolefin elastomer film D3-2, the volume resistivity and peel strength are significantly improved.

Those skilled in the art should understand that the above-mentioned embodiments are all illustrative and not restrictive. Different technical features appearing in different embodiments can be combined to achieve beneficial effects. Those skilled in the art should be able to understand and implement other modified embodiments of the disclosed embodiments on the basis of studying the description and the claims. In the claims, the term "comprising" does not exclude other means or steps; an item is intended to include one/one or more/kinds of items when not modified by a quantifier, and may be combined with "one/one or more/kinds of items" "Used interchangeably"; the terms "first", "second" are used to denote names and not to indicate any particular order. The functions of multiple parts appearing in the claims may be performed by a single hardware or software module Implementation. The appearance of certain technical features in different dependent claims does not imply that these technical features cannot be combined to achieve beneficial effect.

Claims (24)

1. An ionic resin encapsulation adhesive film at least includes an ionized functional layer, the ionized functional layer includes an ionic resin, and the ionic resin includes 50-99% of a matrix resin and 0.01-40% of an unsaturated carboxylic acid metal salt , the initiator is 0.01-5%, based on the total mass content of 100 parts; the matrix resin includes ethylene-vinyl acetate copolymer or elastomer;

   The light transmittance of the ionic resin encapsulation film is ≥85%, and the haze is ≤5%.
2. The ionic resin encapsulation film according to claim 1, wherein the cationic metal of the unsaturated carboxylic acid metal salt comprises one or more of magnesium, zinc, copper, lithium, sodium and potassium.
3. The ionic resin encapsulating film according to claim 1, wherein the carboxylic acid group of the unsaturated carboxylic acid metal salt is a carboxylic acid group containing an ethylenic bond and/or an acetylene bond.
4. The ionic resin encapsulation film according to claim 3, wherein the carboxylic acid group is a methacrylic acid group, an acrylic acid group, a crotonic acid group, an itaconic acid group, a cinnamic acid group, One or more of a butynedioic acid group and a maleic acid group.
5. The ionic resin encapsulating adhesive film according to claim 1, wherein at least a part of the unsaturated carboxylic acid metal salt is combined with the base resin by a secondary bond force.
6. The ionic resin encapsulation adhesive film according to claim 1, wherein the initiator is an initiator that can generate free radicals by photo-initiation or thermal initiation.
7. The ionic resin encapsulation adhesive film according to claim 1, wherein the volume resistivity of the ionic resin encapsulation adhesive film is greater than or equal to 1.0*10 ¹⁴ Ω·cm.
8. The ionic resin encapsulating film according to claim 1, further comprising at least one ethylene-vinyl acetate layer.
9. The ionic resin encapsulating film according to claim 1, wherein the elastomer comprises a rubber elastomer and a polyolefin elastomer, and the rubber elastomer comprises natural rubber (NR), ethylene propylene diene rubber (EPDM), hydrogenated One of styrene butadiene block copolymer (SEBS), styrene-butadiene-styrene block copolymer (SBS), styrene-isoprene-styrene block copolymer (SIS) one or more.
10. The ionic resin encapsulation adhesive film according to claim 1, wherein the ionic resin encapsulation adhesive film is used as a solar cell encapsulation adhesive film.
11. The ionic resin encapsulation adhesive film according to claim 1, wherein the ionic resin encapsulation adhesive film is used as an intermediate film of laminated glass.
12. A laminated structure comprising at least one outer layer, and at least one ionic resin encapsulant film according to any one of claims 1 to 11.
13. 13. The laminated structure of claim 12, wherein the laminated structure is in the form of a photovoltaic module, safety glass or insulating glass.
14. A photovoltaic module, comprising at least one outer layer, a battery sheet, and the ionic resin encapsulating adhesive film according to any one of claims 1 to 11.
15. The photovoltaic assembly of claim 14, wherein the outer layer is photovoltaic glass and/or a backsheet.
16. The invention relates to a method for preparing an ionic resin encapsulation adhesive film, which comprises adding metal oxides or hydroxides, unsaturated carboxylic acids, initiators, other auxiliaries and matrix resins into film making equipment, and casting or calendering to form films.
17. The method for preparing an ionic resin encapsulation film according to claim 16, wherein the content of the matrix resin is 50-99%, the content of the metal oxide or hydroxide is 0.01-40%, and the content of the unsaturated carboxylic acid is 0.01% ～40%, the content of the initiator is 0.01～5%, and the content of other auxiliary agents is 0.01～5%, based on the total mass content of 100 parts.
18. The method for preparing an ionic resin encapsulation film according to claim 16, wherein the matrix resin is an ethylene-vinyl acetate copolymer or an elastomer; the elastomer includes a rubber elastomer and a polyolefin elastomer, and the rubber Elastomers include natural rubber (NR), ethylene propylene diene monomer (EPDM), hydrogenated styrene butadiene block copolymer (SEBS), styrene-butadiene-styrene block copolymer (SBS), benzene One or more of ethylene-isoprene-styrene block copolymers (SIS).
19. The method for preparing an ionic resin encapsulating adhesive film according to claim 16, wherein the other auxiliary agent is one or more of an auxiliary crosslinking agent, an antioxidant, and a silane coupling agent.
20. The method for preparing an ionic resin encapsulation film according to claim 16, wherein the metal oxide or hydroxide comprises metal oxides or hydroxides of magnesium, zinc, copper, lithium, sodium, and potassium. one or more of;
21. The method for preparing an ionic resin encapsulating adhesive film according to claim 16, wherein the unsaturated carboxylic acid is a carboxylic acid containing an ethylenic bond and an acetylenic bond.
22. The method for preparing an ionic resin encapsulating film according to claim 21, wherein the unsaturated carboxylic acid comprises methacrylic acid, acrylic acid, crotonic acid, itaconic acid, cinnamic acid, butynedioic acid and maleic acid One or more of acids, etc.
23. The method for preparing an ionic resin encapsulation adhesive film according to claim 16, wherein the initiator is an initiator that can generate free radicals by photo- or thermal-initiation.
24. The method for preparing an ionic resin encapsulation adhesive film according to claim 16, wherein the adhesive film prepared by the method has a light transmittance ≥85%, a haze ≤5%, and a volume resistivity ≥1.0*10 ¹⁴ Ω ·cm.