WO2022252755A1 - Ribbon carrier film, preparation method therefor, and application thereof - Google Patents
Ribbon carrier film, preparation method therefor, and application thereof Download PDFInfo
- Publication number
- WO2022252755A1 WO2022252755A1 PCT/CN2022/081620 CN2022081620W WO2022252755A1 WO 2022252755 A1 WO2022252755 A1 WO 2022252755A1 CN 2022081620 W CN2022081620 W CN 2022081620W WO 2022252755 A1 WO2022252755 A1 WO 2022252755A1
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- WO
- WIPO (PCT)
- Prior art keywords
- layer
- carrier film
- ribbon
- total mass
- raw materials
- Prior art date
Links
- 238000002360 preparation method Methods 0.000 title abstract description 21
- 229920005989 resin Polymers 0.000 claims abstract description 62
- 239000011347 resin Substances 0.000 claims abstract description 62
- 238000004132 cross linking Methods 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 17
- 239000011159 matrix material Substances 0.000 claims abstract description 16
- 229920006124 polyolefin elastomer Polymers 0.000 claims abstract description 14
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 claims abstract description 7
- 239000005038 ethylene vinyl acetate Substances 0.000 claims abstract description 5
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 179
- 239000002994 raw material Substances 0.000 claims description 111
- 239000012790 adhesive layer Substances 0.000 claims description 54
- 230000007704 transition Effects 0.000 claims description 51
- 238000003466 welding Methods 0.000 claims description 39
- 239000007822 coupling agent Substances 0.000 claims description 35
- 239000006057 Non-nutritive feed additive Substances 0.000 claims description 28
- 239000003431 cross linking reagent Substances 0.000 claims description 27
- 239000000654 additive Substances 0.000 claims description 26
- 230000000996 additive effect Effects 0.000 claims description 24
- 229910000679 solder Inorganic materials 0.000 claims description 23
- 239000003999 initiator Substances 0.000 claims description 21
- 239000002131 composite material Substances 0.000 claims description 18
- 238000003475 lamination Methods 0.000 claims description 18
- 239000011521 glass Substances 0.000 claims description 15
- 239000002313 adhesive film Substances 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 14
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 13
- 238000009472 formulation Methods 0.000 claims description 12
- 230000003712 anti-aging effect Effects 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 10
- GTELLNMUWNJXMQ-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical group OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO GTELLNMUWNJXMQ-UHFFFAOYSA-N 0.000 claims description 8
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 8
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 8
- 239000003208 petroleum Substances 0.000 claims description 8
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 8
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 claims description 7
- 239000003963 antioxidant agent Substances 0.000 claims description 7
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical group C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N ethyl benzoate Chemical compound CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 claims description 6
- 239000004611 light stabiliser Substances 0.000 claims description 6
- 238000010894 electron beam technology Methods 0.000 claims description 5
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 claims description 4
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 4
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 4
- 239000006096 absorbing agent Substances 0.000 claims description 4
- 150000004645 aluminates Chemical class 0.000 claims description 4
- 239000012948 isocyanate Substances 0.000 claims description 4
- 150000002513 isocyanates Chemical class 0.000 claims description 4
- 239000000314 lubricant Substances 0.000 claims description 4
- 229920001568 phenolic resin Polymers 0.000 claims description 4
- 239000005011 phenolic resin Substances 0.000 claims description 4
- 150000003505 terpenes Chemical class 0.000 claims description 4
- 235000007586 terpenes Nutrition 0.000 claims description 4
- 238000005266 casting Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 2
- 229920000098 polyolefin Polymers 0.000 claims description 2
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 claims 2
- AIRWCJMIIAQWSO-UHFFFAOYSA-N hydroxymethyl prop-2-enoate propane Chemical compound CCC.C(C=C)(=O)OCO.C(C=C)(=O)OCO.C(C=C)(=O)OCO AIRWCJMIIAQWSO-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 14
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- 230000032798 delamination Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 230000007774 longterm Effects 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 87
- 239000012962 antiaging additive Substances 0.000 description 18
- 229920000139 polyethylene terephthalate Polymers 0.000 description 8
- 229940096522 trimethylolpropane triacrylate Drugs 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 6
- 239000012752 auxiliary agent Substances 0.000 description 5
- 239000005022 packaging material Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000010248 power generation Methods 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
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- 238000012545 processing Methods 0.000 description 2
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- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- -1 1,1,3,3-tetramethylbutyl Chemical group 0.000 description 1
- YGFLYIFQVUCTCU-UHFFFAOYSA-N 2-ethylhexoxy 2-methylbutan-2-yl carbonate Chemical compound CCCCC(CC)COOC(=O)OC(C)(C)CC YGFLYIFQVUCTCU-UHFFFAOYSA-N 0.000 description 1
- STEYNUVPFMIUOY-UHFFFAOYSA-N 4-Hydroxy-1-(2-hydroxyethyl)-2,2,6,6-tetramethylpiperidine Chemical compound CC1(C)CC(O)CC(C)(C)N1CCO STEYNUVPFMIUOY-UHFFFAOYSA-N 0.000 description 1
- DRPJWBIHQOHLND-UHFFFAOYSA-N 4-[dimethoxy(methyl)silyl]oxybutyl 2-methylprop-2-enoate Chemical group CO[Si](C)(OC)OCCCCOC(=O)C(C)=C DRPJWBIHQOHLND-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical group C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920006280 packaging film Polymers 0.000 description 1
- 239000012785 packaging film Substances 0.000 description 1
- FZUGPQWGEGAKET-UHFFFAOYSA-N parbenate Chemical compound CCOC(=O)C1=CC=C(N(C)C)C=C1 FZUGPQWGEGAKET-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical group 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- LTOKKZDSYQQAHL-UHFFFAOYSA-N trimethoxy-[4-(oxiran-2-yl)butyl]silane Chemical compound CO[Si](OC)(OC)CCCCC1CO1 LTOKKZDSYQQAHL-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/33—Applications of adhesives in processes or use of adhesives in the form of films or foils for batteries or fuel cells
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/046—Presence of homo or copolymers of ethene in the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the embodiment of the present application relates to a solder tape carrier film, its preparation method and its application.
- busbar-free components have been proposed, which can save the amount of silver and reduce the shielding of the grid lines on the cells, and improve the power generation efficiency, such as the electrode interconnection structure of Taizhou Longji Solar CN201720080886.4 IBC battery, CN201710054876.8 an N-type Double-sided battery interconnection process; Shenzhen Laplace Energy Technology Co., Ltd. CN201720292907.9 Busbar-free solar cell module.
- the general support layer is a crystalline polymer with a higher melting point, so as to ensure that the product will not bond with the equipment during the bonding process of the product and the battery sheet, and at the same time prevent lamination.
- the bonding layer is a material with a lower melting point to ensure adhesion;
- the support layer material of this scheme is different from the packaging material, the performance is quite different, and the bonding with the packaging material is poor.
- the welding ribbon may be pulled, causing the welding ribbon to detach from the electrode and affecting the power generation efficiency; at the same time, the crystalline support layer
- the light transmittance is relatively low, and the haze is relatively large, which also has a certain impact on the power generation efficiency.
- the present application provides a solder ribbon carrier film that is not easy to delaminate, has good temperature resistance, high transmittance and low haze.
- the embodiment of the present application provides a carrier film for solder tape, which includes a pre-crosslinked layer and an adhesive layer, the pre-crosslinked layer is the same as the matrix resin of the adhesive layer, and the matrix resin is ethylene- One or more of vinyl acetate copolymer (EVA), polyolefin elastomer (POE), ethylene acrylic acid copolymer (EAA), or ethyl methacrylate (EMA), the pre-crosslinked layer
- EVA vinyl acetate copolymer
- POE polyolefin elastomer
- EAA ethylene acrylic acid copolymer
- EMA ethyl methacrylate
- the crosslinking degree of the adhesive layer is 50%-90%.
- the pre-crosslinking refers to the degree of crosslinking of each layer in the finished ribbon carrier film.
- the cross-linking degree refers to the cross-linking degree of the bonding layer in the finished photovoltaic module obtained by using the finished ribbon carrier film to prepare a photovoltaic module.
- the degree of pre-crosslinking of the adhesive layer is zero, that is, in the finished product of the ribbon carrier film, the adhesive layer is not crosslinked.
- the pre-crosslinking degree of the pre-crosslinked layer is 30%-60%, more preferably 40%-50%.
- the degree of crosslinking of the adhesive layer is 65%-90%, more preferably 75%-90%.
- the added amount of the matrix resin in the pre-crosslinked layer is 60%-98% of the total mass of the raw materials of the pre-crosslinked layer, more preferably 70%-98%, more preferably 80% ⁇ 95%.
- the raw materials of the pre-crosslinked layer also include a cross-linking agent added in an amount of 1% to 8% of the total mass of the raw material formulation of the pre-crosslinked layer, more preferably 2% to 6%, more preferably 3% to 5%.
- a cross-linking agent added in an amount of 1% to 8% of the total mass of the raw material formulation of the pre-crosslinked layer, more preferably 2% to 6%, more preferably 3% to 5%.
- the raw material of the pre-crosslinked layer also includes an ultraviolet photoinitiator added in an amount of 0.1 to 5% of the total mass of the raw material formulation of the pre-crosslinked layer, more preferably 1% to 5%, more preferably 1% to 3%.
- the addition amount of the matrix resin in the bonding layer is 50-98% of the total mass of the raw materials of the bonding layer, more preferably 60%-98%, more preferably 70%-95% %.
- the raw material of the adhesive layer also includes a crosslinking agent added in an amount of 1-8% of the total mass of the raw material of the adhesive layer, more preferably 1%-6%, more preferably 2%-4% %.
- the raw material of the bonding layer also includes a thermal initiator in an amount of 0.1% to 5% of the total mass of the raw material of the bonding layer, more preferably 1% to 5%, more preferably 1% to 3%.
- the adhesive layer Under normal processing temperature (usually 80 °C ⁇ 130 °C) and high temperature lamination within a short period of time (within 1 minute), the adhesive layer will not be cross-linked, and the lamination temperature is usually above 130 °C, the layer The pressing time is more than 5 minutes, which can cause the cross-linking reaction of the adhesive layer.
- the raw material of the adhesive layer further includes an ultraviolet photoinitiator, and based on the total mass of the raw material of the adhesive layer as 100%, the added amount of the ultraviolet light additive is ⁇ 0.1%.
- a small amount of ultraviolet photoinitiator may be included in the raw materials of the adhesive layer, as long as the pre-crosslinking degree of the adhesive layer is guaranteed to be ⁇ 1%.
- the raw material of the pre-crosslinked layer also includes an anti-aging agent added in an amount of 0.1% to 3% of the total mass of the raw material formulation of the pre-crosslinked layer, still more preferably 0.5% to 3%, and more preferably Preferably it is 0.8% to 2%.
- the raw material of the bonding layer also includes a coupling agent added in an amount of 0.1% to 2% of the total mass of the raw material of the bonding layer, still more preferably 0.1% to 1%, more preferably 0.3% % to 0.8%.
- the raw material of the bonding layer also includes an anti-aging agent added in an amount of 0.1% to 3% of the total mass of the raw material of the bonding layer, still more preferably 0.1% to 1%, more preferably 0.3% % to 0.8%.
- the raw material of the pre-crosslinked layer also includes a tackifying resin added in an amount of 0.1% to 20% of the total mass of the raw material formulation of the pre-crosslinked layer, more preferably 5% to 15%, More preferably, it is 8% to 12%.
- the raw materials of the pre-crosslinked layer also include a coupling agent added in an amount of 0.005% to 2% of the total mass of the raw material formulation of the pre-crosslinked layer, still more preferably 0.01% to 1%, More preferably, it is 0.1%-0.5%.
- the raw material of the pre-crosslinked layer also includes a processing aid added in an amount of 0.001% to 1% of the total mass of the raw material formulation of the precrosslinked layer, still more preferably 0.05% to 1%, More preferably, it is 0.1% to 1%.
- the raw material of the pre-crosslinked layer also includes an anti-PID additive in an amount of 0.005% to 5% of the total mass of the raw material formulation of the precrosslinked layer, and further preferably 0.1% to 5%. , more preferably 0.1% to 1.5%.
- the raw material of the adhesive layer also includes a tackifying resin added in an amount of 0.1% to 30% of the total mass of the raw material of the adhesive layer, still more preferably 10% to 30%, more preferably 15% to 25%.
- the raw material of the adhesive layer also includes a processing aid added in an amount of 0.001% to 1% of the total mass of the raw material of the adhesive layer, still more preferably 0.1% to 1%, more preferably 0.3% to 0.8%.
- the raw material of the bonding layer also includes an anti-PID additive in an amount of 0.005% to 5% of the total mass of the raw material of the bonding layer, further preferably 0.1% to 5%, more preferably 1% to 5%.
- the crosslinking agent is triallyl isocyanurate (TAIC), trimethallyl isocyanate (TMAIC), trimethylolpropane triacrylate (TMPTA), trimethylolpropane One or more of trimethacrylate (TMPTMA) or pentaerythritol triacrylate (PETA).
- TAIC triallyl isocyanurate
- TMAIC trimethallyl isocyanate
- TMPTA trimethylolpropane triacrylate
- TMPTMA trimethacrylate
- PETA pentaerythritol triacrylate
- the ultraviolet photoinitiator is one or more of trimethylolpropane triacrylate, 2-trimethylolpropane tetraacrylate, 4-(dimethylamino) ethyl benzoate .
- the thermal initiator is a peroxide initiator.
- the thermal initiator is ethoxylated trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, dicumyl peroxide One or more of (DCP), 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane.
- the tackifying resin is one or more of rosin, hydrogenated rosin, petroleum resin, hydrogenated petroleum resin, phenolic resin, or terpene resin.
- the coupling agent is one or more of a silane coupling agent, a titanate coupling agent, or an aluminate coupling agent.
- the coupling agent is selected from 3-methacryloxypropylmethyltrimethoxysilane, 3-glycidylpropyltrimethoxysilane, vinyltrimethoxysilane, 3 - one of aminopropyltriethoxysilane, vinyltrimethoxysilane, isopropyl triisostearyl titanate, isopropyl tris (dioctyl pyrophosphate acyloxy) titanate or Various.
- the anti-aging agent includes one or more of antioxidants, light stabilizers, or ultraviolet absorbers.
- the antioxidant is one or more of phenolic antioxidants, phosphite antioxidants and hindered amine antioxidants.
- the light stabilizer is selected from bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate (light stabilizer 770), polysuccinic acid ( 4-Hydroxy-2,2,6,6-tetramethyl-1-piperidineethanol) ester, poly- ⁇ [6-[(1,1,3,3-tetramethylbutyl)-imino] -1,3,5-triazine-2,4-diyl][2-(2,2,6,6-tetramethylpiperidinyl)-nitro]-hexylene-[4-(2 , 2,6,6-tetramethylpiperidinyl)-amino] in one or more.
- the processing aid is an antiblocking agent and/or a lubricant.
- the anti-PID additive is a metal ion scavenger.
- the thickness of the pre-crosslinked layer is 20-200 ⁇ m, more preferably 20-100 ⁇ m, still more preferably 20-80 ⁇ m, still more preferably 20-50 ⁇ m.
- the adhesive layer has a thickness of 20-200 ⁇ m, more preferably 20-100 ⁇ m, still more preferably 20-80 ⁇ m, and still more preferably 20-50 ⁇ m.
- a release film is provided on the outside of the pre-crosslinked layer.
- the release film is a conventional release film, such as PE, PP, PET, etc., and the release film can be colored or colorless.
- the tape carrier film further includes one or more transition layers disposed between the pre-crosslinked layer and the adhesive layer, and the matrix resin includes ethylene-vinyl acetate copolymer, polyolefin One or more of elastomer, ethylene acrylic acid copolymer, or ethyl methacrylate, the transition layer is cross-linked or non-cross-linked, when the transition layer is cross-linked, the The pre-crosslinking degree of the transition layer is ⁇ 1%, and after the ribbon carrier film is prepared into a photovoltaic module, the crosslinking degree of the transition layer is 1-90%.
- the pre-crosslinking degree of the transition layer also refers to the crosslinking degree of the transition layer in the finished product of the ribbon carrier film obtained.
- the raw material of the transition layer includes a matrix resin added in an amount of 50% to 98% of the total mass of the raw material of the transition layer, more preferably 80% to 98%, more preferably 85% to 95% .
- the raw material of the transition layer includes a crosslinking agent added in an amount of 1% to 8% of the total mass of the raw material of the transition layer, more preferably 1% to 8%, more preferably 2% to 5%. %.
- the raw material of the transition layer includes a thermal initiator added in an amount of 0.1% to 5% of the total mass of the raw material of the transition layer, more preferably 0.1% to 5%, more preferably 0.5% to 3% .
- the raw material of the transition layer also includes an ultraviolet photoinitiator, based on the total mass of the raw material of the transition layer as 100%, the addition amount of the ultraviolet light additive is ⁇ 0.1%, and the addition amount of the transition layer is ⁇ 0.1%.
- the raw material may also include a small amount of ultraviolet photoinitiator, as long as the pre-crosslinking degree of the transition layer is guaranteed to be ⁇ 1%.
- the ultraviolet photoinitiator is one or more of trimethylolpropane triacrylate, 2-trimethylolpropane tetraacrylate, and ethyl 4-(dimethylamino)benzoate.
- the raw material of the transition layer also includes a tackifying resin added in an amount of 0.1% to 30% of the total mass of the raw material of the transition layer, still more preferably 10% to 30%, more preferably 15% ⁇ 25%.
- the raw material of the transition layer includes a coupling agent added in an amount of 0.1% to 2% of the total mass of the raw material of the transition layer, more preferably 0.1% to 1%, more preferably 0.5% to 1% %.
- the raw material of the transition layer includes an anti-aging agent added in an amount of 0.1% to 3% of the total mass of the raw material of the transition layer, more preferably 0.1% to 3%, more preferably 0.1% to 2% %.
- the raw material of the transition layer also includes a processing aid added in an amount of 0.001% to 1% of the total mass of the raw material of the transition layer, more preferably 0.1% to 1%, more preferably 0.1% ⁇ 0.6%.
- the raw material of the transition layer also includes an anti-PID additive in an amount of 0.005% to 5% of the total mass of the raw material of the transition layer, more preferably 0.1% to 5%, more preferably 0.1% % ⁇ 3%.
- the matrix resin of the transition layer is one or more of ethylene-vinyl acetate copolymer, polyolefin elastomer, ethylene acrylic acid copolymer, or ethyl methacrylate.
- the basic composition of the transition layer and the adhesive layer is similar, and the matrix resin is the same or different.
- the thermal initiator is ethoxylated trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, dicumyl peroxide, One or more of 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane.
- the crosslinking agent is triallyl isocyanurate (TAIC), trimethallyl isocyanate (TMAIC), trimethylol propane triacrylate (TMPTA), trimethylolpropane trimethyl
- TAIC triallyl isocyanurate
- TMAIC trimethallyl isocyanate
- TMPTA trimethylol propane triacrylate
- PETA pentaerythritol triacrylate
- TMPTMA pentaerythritol triacrylate
- the tackifying resin is one or more of rosin, hydrogenated rosin, petroleum resin, hydrogenated petroleum resin, phenolic resin, or terpene resin.
- the coupling agent is one or more of a silane coupling agent, a titanate coupling agent, or an aluminate coupling agent.
- the anti-aging agent is one or more of antioxidants, light stabilizers, or ultraviolet absorbers.
- the processing aid is an antiblocking agent and/or a lubricant.
- the embodiment of the present application also provides a preparation method of the above-mentioned welding tape carrier film.
- the raw materials of each layer are mixed and granulated respectively, and then multi-layer co-extrusion casting is performed to form a film, and the film is irradiated by UV or electron beam pre-crosslinked layer.
- the electron beam irradiation dose is 10-25 kGy.
- the embodiment of the present application is also a solder ribbon composite, including the solder ribbon carrier film, and a solder ribbon adhered to the solder ribbon carrier film.
- At least 30% or more of the volume of the solder ribbon is exposed to the ribbon carrier film, so that the solder ribbon can be in good contact with the battery sheet while ensuring the bonding performance of the solder ribbon and the carrier film.
- 30% to 70% of the volume of the welding ribbon exposes the welding ribbon carrier film, more preferably 40% to 60% of the volume of the welding ribbon exposes the welding ribbon carrier film .
- the embodiment of the present application also provides a preparation method of the solder ribbon complex, specifically: controlling the temperature at 80°C to 170°C, and adhering the solder ribbon to the solder ribbon by pressing On the carrier film, the pressing time is controlled to be 0.1s-1s, and the two adjacent carrier films are respectively located on both sides of the welding strip and distributed at intervals.
- the controlled temperature is 80°C-150°C, more preferably 80°C-130°C.
- the embodiment of the present application also provides a battery sheet composite, including a battery sheet, a welding ribbon in contact with the battery sheet, and a carrier for fixing the welding ribbon on the battery sheet film, the carrier film is the carrier film of the solder tape.
- the two sides of the cell sheet are respectively provided with the solder strip and the carrier film.
- the cell is one of crystalline silicon cells, amorphous silicon cells, chemical solar cells, multi-component compound thin film solar cells, and the like.
- the embodiment of the present application also provides a method for preparing a cell composite, which specifically includes:
- the ribbon composite unit is composed of the ribbon and two carrier films
- the temperature is controlled at 100° C. to 300° C., and the ribbon composite unit is pressed on the surface of the battery sheet, and the pressing time is controlled to be 0.2s to 3s.
- the controlled temperature is 100°C-200°C, more preferably 100°C-150°C, more preferably 100°C-130°C.
- the embodiment of the present application also provides an application of the ribbon carrier film, or the ribbon composite, or the cell assembly in a photovoltaic module.
- the embodiment of the present application also provides a method for preparing a photovoltaic module, specifically:
- the lamination conditions are: lamination temperature 120°C-180°C, vacuum time 3-8min, lamination time 8-20min; the lamination temperature is further preferably 130°C-180°C, more preferably 135°C ⁇ 150°C.
- the release film is removed before lamination.
- the embodiment of the present application has the following advantages compared with related technologies:
- the compatibility between adjacent two layers is good, and they can be melted into one after lamination, without the risk of delamination failure; the failure caused by temperature changes during use is avoided.
- each layer is made of amorphous material, which has good compatibility with the packaging material, high transmittance of the overall material, low haze, and the same material as the packaging film, so the thickness of the packaging material can be reduced as appropriate to further reduce the component cost; at the same time Both the pre-crosslinked layer and the adhesive layer are cross-linked, which avoids the risk of failure due to the hot spot effect during the use of the module; the chemical reaction between the adhesive layer and the battery sheet will occur during the lamination process, which increases the carrier film and the battery. The adhesion between the cells further enhances the long-term reliability of the product.
- the parts of the raw materials in the following examples and comparative examples are all parts by mass.
- the raw materials in the following examples and comparative examples are obtained commercially or by self-made.
- Tackifying resin Arakawa Chemical PR12603;
- UV photoinitiator BASF 1173
- Cross-linking agent Sartomer SR454NS
- Coupling agent Anhui Sibao GX171;
- Anti-aging additive Cytec B877;
- the anti-PID auxiliary agent is self-made according to the method of related technology.
- Release film layer PET material, thickness 25 ⁇ m
- the raw material formula of the pre-crosslinking layer is: 92.5 parts of POE resin, 1 part of ultraviolet photoinitiator, 4 parts of crosslinking agent, 0.2 part of coupling agent, 1 part of anti-aging additive, 0.8 part of processing aid, and 0.5 part of anti-PID additive .
- the raw material formula of the bonding layer is: 93 parts of POE resin, 1 part of thermal initiator, 3.5 parts of crosslinking agent, 0.5 part of coupling agent, 0.5 part of anti-aging additive, 0.5 part of processing aid, and 1 part of anti-PID additive.
- the raw materials of each layer are mixed uniformly in a high-speed mixer, and then granulated by a twin-screw extruder to complete, and then multi-layer co-extrusion casting is performed to form a film, and the film is cast and laminated with a release film at the same time.
- Pre-crosslinking by electron beam irradiation is carried out after completion.
- the processing temperature is 80-100°C, and the electron beam irradiation dose is 16kGy.
- Step 1 Control the temperature at 80-130°C, adhere the welding ribbon to the carrier film by pressing, control the pressing time to 0.1-1s, and the two adjacent carrier films are respectively located on both sides of the welding ribbon and spaced apart distributed;
- Step 2 cutting the welding ribbon adhered to the carrier film to form a welding ribbon composite unit, the welding ribbon composite unit is composed of a welding ribbon and two carrier films;
- Step 3 Control the temperature at 100-130°C, and press the ribbon composite unit on the surface of the battery sheet to form a battery sheet composite.
- the pressing time is controlled to be 0.2-3s, and the two sides of the battery sheet are respectively pressed with ribbons. complex unit;
- Step 4 Laminate the back sheet, the lower layer of adhesive film, the cell complex, the upper layer of adhesive film, and the glass in sequence, and place them in a laminator to obtain a single-glass solar module.
- the lower layer of glass, the lower layer of adhesive film, the cell complex, the upper layer of adhesive film, and the upper layer of glass are sequentially laminated, and placed in a laminator for lamination to obtain a double-glass solar module.
- the lamination temperature is 145°C
- the vacuum time is 3-8 minutes
- the lamination time is 15 minutes.
- Release film layer PET material, thickness 25 ⁇ m
- the raw material formula of the pre-crosslinking layer is: 92.5 parts of EVA resin, 1.5 parts of ultraviolet photoinitiator, 3.5 parts of crosslinking agent, 0.2 part of coupling agent, 1 part of anti-aging additive, 0.3 part of processing aid, and 1 part of anti-PID additive .
- the raw material formula of the adhesive layer is: 91.2 parts of EVA resin, 1.5 parts of thermal initiator, 3 parts of crosslinking agent, 0.5 part of coupling agent, 0.5 part of anti-aging additive, 0.3 part of processing aid, and 3 parts of anti-PID additive.
- the preparation method of the ribbon carrier film is the same as in Example 1.
- the release film is 1 25 ⁇ m
- the pre-crosslinked layer is 2 40 ⁇ m
- the adhesive layer is 3 40 ⁇ m.
- the preparation of the photovoltaic module is the same as in Example 1.
- Release film layer PET material, thickness 25 ⁇ m
- the raw material formula of the pre-crosslinked layer is: 81 parts of POE resin, 10 parts of tackifying resin, 2 parts of ultraviolet photoinitiator, 4.5 parts of crosslinking agent, 0.2 part of coupling agent, 1 part of anti-aging additive, 0.8 part of processing aid, 0.5 part of anti-PID auxiliary agent.
- the raw material formula of the bonding layer is: 71.5 parts of POE resin, 20 parts of tackifying resin, 2 parts of thermal initiator, 4 parts of crosslinking agent, 0.5 part of coupling agent, 0.5 part of anti-aging additive, 0.5 part of processing aid, anti-PID 1 part of auxiliary agent.
- the preparation method of the ribbon carrier film is the same as in Example 1.
- the release film is 1 25 ⁇ m
- the pre-crosslinked layer is 2 40 ⁇ m
- the adhesive layer is 3 40 ⁇ m.
- the preparation method of the photovoltaic module is the same as that in Example 1.
- Release film layer PET material, thickness 25 ⁇ m.
- the raw material formula of the pre-crosslinking layer is: 92.5 parts of EVA resin, 1.5 parts of ultraviolet photoinitiator, 3.5 parts of crosslinking agent, 0.2 part of coupling agent, 1 part of anti-aging additive, 0.3 part of processing aid, and 1 part of anti-PID additive .
- the raw material formula of the transition layer is: 93.5 parts of POE resin, 1 part of thermal initiator, 3.5 parts of crosslinking agent, 0.5 part of anti-aging additive, 0.5 part of processing aid, and 1 part of anti-PID additive.
- the raw material formula of the adhesive layer is: 91.2 parts of EVA resin, 1.5 parts of thermal initiator, 3 parts of crosslinking agent, 0.5 part of coupling agent, 0.5 part of anti-aging additive, 0.3 part of processing aid, and 3 parts of anti-PID additive.
- the preparation method of the ribbon carrier film is the same as in Example 1.
- the release film is 1 25 ⁇ m
- the pre-crosslinked layer is 2 25 ⁇ m
- the transition layer is 4 30 ⁇ m
- the adhesive layer is 3 25 ⁇ m.
- the preparation method of the photovoltaic module is the same as that in Example 1.
- Release film layer PET material, thickness 25 ⁇ m.
- the raw material formula of the pre-crosslinked layer is: 81 parts of POE resin, 10 parts of tackifying resin, 2 parts of ultraviolet photoinitiator, 4.5 parts of crosslinking agent, 0.2 part of coupling agent, 1 part of anti-aging additive, 0.8 part of processing aid, 0.5 part of anti-PID auxiliary agent.
- the raw material formula of the transition layer is: 93.5 parts of POE resin, 1 part of thermal initiator, 3.5 parts of crosslinking agent, 0.5 part of anti-aging additive, 0.5 part of processing aid, and 1 part of anti-PID additive.
- the raw material formula of the bonding layer is: 71.5 parts of POE resin, 20 parts of tackifying resin, 2 parts of thermal initiator, 4 parts of crosslinking agent, 0.5 part of coupling agent, 0.5 part of anti-aging additive, 0.5 part of processing aid, anti-PID 1 part of auxiliary agent.
- the preparation method of the ribbon carrier film is the same as in Example 1.
- a four-layer structure of the welding tape carrier film is formed, the release film is 1 25 ⁇ m, the pre-crosslinked layer is 2 40 ⁇ m, the transition layer is 4 30 ⁇ m, and the adhesive layer is 3 40 ⁇ m.
- the preparation method of the photovoltaic module is the same as that in Example 1.
- Support layer pure PET film, thickness 40 ⁇ m. (without pre-crosslinked layer)
- the raw material formula of the bonding layer is: 91.2 parts of EVA resin, 1.5 parts of thermal initiator, 3 parts of crosslinking agent, 0.5 part of coupling agent, 0.5 part of anti-aging additive, 0.3 part of processing aid, 3 parts of anti-PID additive, thickness 40 ⁇ m.
- the preparation method of the photovoltaic module is the same as that in Example 1.
- Release film layer PET material, thickness 25 ⁇ m.
- the raw material formula of the pre-crosslinking layer is: 92.5 parts of EVA resin, 1.5 parts of ultraviolet photoinitiator, 3.5 parts of crosslinking agent, 0.2 part of coupling agent, 1 part of anti-aging additive, 0.3 part of processing aid, and 1 part of anti-PID additive .
- the raw material formula of the bonding layer is: 94.2 parts of EVA resin, 1.5 parts of thermal initiator, 0.5 part of coupling agent, 0.5 part of anti-aging additive, 0.3 part of processing aid, and 3 parts of anti-PID additive.
- the preparation method of the ribbon carrier film is the same as in Example 1.
- the release film is 1 25 ⁇ m
- the pre-crosslinked layer is 2 40 ⁇ m
- the adhesive layer is 3 40 ⁇ m.
- the preparation method of the cell assembly is the same as in Example 1.
- Release film layer PET material, thickness 25 ⁇ m.
- the raw material formula of the pre-crosslinked layer is: 96.8 parts of EVA resin, 0.2 part of ultraviolet photoinitiator, 0.5 part of crosslinking agent, 0.2 part of coupling agent, 1 part of anti-aging additive, 0.3 part of processing aid, and 1 part of anti-PID additive .
- the raw material formula of the adhesive layer is: 91.2 parts of EVA resin, 1.5 parts of thermal initiator, 3 parts of crosslinking agent, 0.5 part of coupling agent, 0.5 part of anti-aging additive, 0.3 part of processing aid, and 3 parts of anti-PID additive.
- the preparation method of the ribbon carrier film is the same as in Example 1.
- the release film is 1 25 ⁇ m
- the pre-crosslinked layer is 2 40 ⁇ m
- the adhesive layer is 3 40 ⁇ m.
- the preparation method of the cell assembly is the same as in Example 1.
- Pre-crosslinking degree/crosslinking degree solvent method (xylene reflux at 145°C, 5h);
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Abstract
Disclosed are a ribbon carrier film, a preparation method therefor, and an application thereof, the ribbon carrier film comprising a pre-crosslinked layer and a bonding layer, the matrix resin of the pre-crosslinked layer and the bonding layer being the same, the matrix resin being one or more of ethylene-vinyl acetate copolymer, polyolefin elastomer, ethylene acrylic acid copolymer, or ethyl methacrylate, the pre-crosslinking degree of the pre-crosslinked layer being 30-80%, the pre-crosslinking degree of the bonding layer being ≤1% and, after the ribbon carrier film is prepared into a photovoltaic module, the cross-linking degree of the bonding layer being 50-90%. The ribbon carrier film of the present application can be fused into one after being laminated, has no risk of delamination failure, and can avoid the risk of failure caused by the hot spot effect during use of the component; the overall material transmittance is high and haze is low, and the bonding layer reacts chemically during the process of being laminated with a battery plate, thereby increasing the bonding force between the carrier film and the battery plate, and further improving the long-term reliability of the product.
Description
本申请实施例涉及一种焊带载体膜、其制备方法及其应用。The embodiment of the present application relates to a solder tape carrier film, its preparation method and its application.
目前光伏行业组件的发展趋势是从3主栅变成4主栅、5主栅,近而发展成现在的多主栅。近几年有提出无主栅组件,可以节约银的用量以及减少栅线对电池片遮挡,提高发电效率,如泰州隆基乐叶CN201720080886.4 IBC电池的电极互联结构,CN201710054876.8一种N型双面电池互联工艺;深圳市拉普拉斯能源技术有限公司CN201720292907.9无主栅太阳能电池片组件。At present, the development trend of photovoltaic industry components is from 3 busbars to 4 busbars, 5 busbars, and recently developed into the current multi-busbar. In recent years, busbar-free components have been proposed, which can save the amount of silver and reduce the shielding of the grid lines on the cells, and improve the power generation efficiency, such as the electrode interconnection structure of Taizhou Longji Solar CN201720080886.4 IBC battery, CN201710054876.8 an N-type Double-sided battery interconnection process; Shenzhen Laplace Energy Technology Co., Ltd. CN201720292907.9 Busbar-free solar cell module.
目前无主栅组件的电池片的导线有两种方式固定于电池片上:1是通过电镀工艺,如苏州太阳井新能源有限公司,CN201820959124.6一种无主栅双面电镀金属化太阳能电池片;2.通过一个粘接膜将导线载住,在层压时固定在电池片上,如黄河水电光伏产业技术有限公司CN201510933299.0一种用于太阳能电池的无主栅焊带的制备方法。At present, there are two ways to fix the wires of the battery sheet without busbar components on the battery sheet: 1. By electroplating process, such as Suzhou Sunwell New Energy Co., Ltd., CN201820959124.6 A double-sided electroplating metallized solar cell sheet without busbar ; 2. Carry the wire through an adhesive film and fix it on the battery sheet during lamination, such as Huanghe Hydropower Photovoltaic Industry Technology Co., Ltd. CN201510933299.0 A preparation method for a busbar-free ribbon for solar cells.
现阶段常规多层结构的粘结膜产品,一般支撑层选取的是熔点较高的结晶性聚合物,以保证在产品与电池片粘合过程中不会与设备出现粘结,同时防止层压过程中焊带位置出现偏移;粘结层为熔点较低的材料以保证粘结性;该种方案支撑层材料与封装材料种类不同,性能差别较大,与封装材料粘结性较差,同时上下两层材料模量相差较大,热膨胀系数有一定差别,在产品使用过程中可能由于使用环境变化进而对焊带产生拉扯,造成焊带与电极脱离,影响发电效率;同时结晶性支撑层的光透过率相对较低,雾度相对较大,对发电效率也有一定影响。At this stage, for conventional multi-layer adhesive film products, the general support layer is a crystalline polymer with a higher melting point, so as to ensure that the product will not bond with the equipment during the bonding process of the product and the battery sheet, and at the same time prevent lamination. During the process, the position of the solder strip is shifted; the bonding layer is a material with a lower melting point to ensure adhesion; the support layer material of this scheme is different from the packaging material, the performance is quite different, and the bonding with the packaging material is poor. At the same time, there is a large difference in modulus between the upper and lower layers of materials, and there is a certain difference in thermal expansion coefficient. During the use of the product, due to changes in the use environment, the welding ribbon may be pulled, causing the welding ribbon to detach from the electrode and affecting the power generation efficiency; at the same time, the crystalline support layer The light transmittance is relatively low, and the haze is relatively large, which also has a certain impact on the power generation efficiency.
发明内容Contents of the invention
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。The following is an overview of the topics described in detail in this article. This summary is not intended to limit the scope of the claims.
本申请提供一种不易分层、耐温性好且透过率大、雾度低的焊带载体膜。The present application provides a solder ribbon carrier film that is not easy to delaminate, has good temperature resistance, high transmittance and low haze.
本申请实施例采用的技术方案是:The technical scheme that the embodiment of the present application adopts is:
一方面,本申请实施例提供一种焊带载体膜,其包括预交联层和粘结层, 所述预交联层与所述粘结层的基体树脂相同,所述基体树脂为乙烯-醋酸乙烯共聚物(EVA)、聚烯烃弹性体(POE)、乙烯丙烯酸共聚物(EAA)、或乙基甲基丙烯酸酯(EMA)中的一种或多种,所述预交联层的预交联度为30%~80%,所述粘结层的预交联度≤1%;On the one hand, the embodiment of the present application provides a carrier film for solder tape, which includes a pre-crosslinked layer and an adhesive layer, the pre-crosslinked layer is the same as the matrix resin of the adhesive layer, and the matrix resin is ethylene- One or more of vinyl acetate copolymer (EVA), polyolefin elastomer (POE), ethylene acrylic acid copolymer (EAA), or ethyl methacrylate (EMA), the pre-crosslinked layer The degree of cross-linking is 30% to 80%, and the pre-cross-linking degree of the adhesive layer is ≤1%;
并且,所述焊带载体膜在制备成光伏组件后,所述粘结层的交联度为50%~90%。Moreover, after the ribbon carrier film is prepared into a photovoltaic module, the crosslinking degree of the adhesive layer is 50%-90%.
本申请中,所述预交联是指获得的焊带载体膜成品中的各层的交联度。In the present application, the pre-crosslinking refers to the degree of crosslinking of each layer in the finished ribbon carrier film.
本申请中,所述的交联度是指使用所述焊带载体膜成品制备光伏组件,获得的光伏组件的成品中粘结层的交联度。In the present application, the cross-linking degree refers to the cross-linking degree of the bonding layer in the finished photovoltaic module obtained by using the finished ribbon carrier film to prepare a photovoltaic module.
优选地,所述粘结层的预交联度为零,即在所述焊带载体膜成品中,所述粘结层未发生交联。Preferably, the degree of pre-crosslinking of the adhesive layer is zero, that is, in the finished product of the ribbon carrier film, the adhesive layer is not crosslinked.
进一步优选地,所述预交联层的预交联度为30%~60%,更优选为40%~50%。Further preferably, the pre-crosslinking degree of the pre-crosslinked layer is 30%-60%, more preferably 40%-50%.
进一步优选地,所述粘结层的交联度为65%~90%,更优选为75%~90%。Further preferably, the degree of crosslinking of the adhesive layer is 65%-90%, more preferably 75%-90%.
优选地,所述预交联层中的所述基体树脂的添加量为所述预交联层的原料总质量的60%~98%,进一步优选为70%~98%,更优选为80%~95%。Preferably, the added amount of the matrix resin in the pre-crosslinked layer is 60%-98% of the total mass of the raw materials of the pre-crosslinked layer, more preferably 70%-98%, more preferably 80% ~95%.
优选地,所述预交联层的原料还包括添加量为所述预交联层的原料配方总质量的1%~8%的交联剂,进一步优选为2%~6%,更优选为3%~5%。Preferably, the raw materials of the pre-crosslinked layer also include a cross-linking agent added in an amount of 1% to 8% of the total mass of the raw material formulation of the pre-crosslinked layer, more preferably 2% to 6%, more preferably 3% to 5%.
优选地,所述预交联层的原料还包括添加量为所述预交联层的原料配方总质量的0.1~5%的紫外光引发剂,进一步优选为1%~5%,更优选为1%~3%。Preferably, the raw material of the pre-crosslinked layer also includes an ultraviolet photoinitiator added in an amount of 0.1 to 5% of the total mass of the raw material formulation of the pre-crosslinked layer, more preferably 1% to 5%, more preferably 1% to 3%.
优选地,所述粘结层中的所述基体树脂的添加量为所述粘结层的原料总质量的50~98%的,进一步优选为60%~98%,更优选为70%~95%。Preferably, the addition amount of the matrix resin in the bonding layer is 50-98% of the total mass of the raw materials of the bonding layer, more preferably 60%-98%, more preferably 70%-95% %.
优选地,所述粘结层的原料还包括添加量为所述粘结层的原料总质量的1~8%的交联剂,进一步优选为1%~6%,更优选为2%~4%。Preferably, the raw material of the adhesive layer also includes a crosslinking agent added in an amount of 1-8% of the total mass of the raw material of the adhesive layer, more preferably 1%-6%, more preferably 2%-4% %.
优选地,所述粘结层的原料还包括添加量为所述粘结层的原料总质量的0.1%~5%的热引发剂,进一步优选为1%~5%,更优选为1%~3%。Preferably, the raw material of the bonding layer also includes a thermal initiator in an amount of 0.1% to 5% of the total mass of the raw material of the bonding layer, more preferably 1% to 5%, more preferably 1% to 3%.
在正常加工温度下(通常为80℃~130℃)以及较短时间内(1min以内)的高温压合,并不会使粘接层发生交联,而层压温度通常在130℃以上,层压时间在5min以上,可引起粘结层发生交联反应。Under normal processing temperature (usually 80 ℃ ~ 130 ℃) and high temperature lamination within a short period of time (within 1 minute), the adhesive layer will not be cross-linked, and the lamination temperature is usually above 130 ℃, the layer The pressing time is more than 5 minutes, which can cause the cross-linking reaction of the adhesive layer.
在一些实施方式中,所述粘结层的原料还包括紫外光引发剂,以所述粘结层的原料总质量为100%计,所述紫外光添加剂的添加量≤0.1%。所述粘结层的原 料中可以包括少量的紫外光引发剂,只要能够保证所述粘结层的预交联度≤1%即可。In some embodiments, the raw material of the adhesive layer further includes an ultraviolet photoinitiator, and based on the total mass of the raw material of the adhesive layer as 100%, the added amount of the ultraviolet light additive is ≤0.1%. A small amount of ultraviolet photoinitiator may be included in the raw materials of the adhesive layer, as long as the pre-crosslinking degree of the adhesive layer is guaranteed to be ≤ 1%.
进一步优选地,所述预交联层的原料还包括添加量为所述预交联层的原料配方总质量的0.1%~3%的抗老化剂,再进一步优选为0.5%~3%,更优选为0.8%~2%。Further preferably, the raw material of the pre-crosslinked layer also includes an anti-aging agent added in an amount of 0.1% to 3% of the total mass of the raw material formulation of the pre-crosslinked layer, still more preferably 0.5% to 3%, and more preferably Preferably it is 0.8% to 2%.
进一步优选地,所述粘结层的原料还包括添加量为所述粘结层的原料总质量的0.1%~2%的偶联剂,再进一步优选为0.1%~1%,更优选为0.3%~0.8%。Further preferably, the raw material of the bonding layer also includes a coupling agent added in an amount of 0.1% to 2% of the total mass of the raw material of the bonding layer, still more preferably 0.1% to 1%, more preferably 0.3% % to 0.8%.
进一步优选地,所述粘结层的原料还包括添加量为所述粘结层的原料总质量的0.1%~3%的抗老化剂,再进一步优选为0.1%~1%,更优选为0.3%~0.8%。Further preferably, the raw material of the bonding layer also includes an anti-aging agent added in an amount of 0.1% to 3% of the total mass of the raw material of the bonding layer, still more preferably 0.1% to 1%, more preferably 0.3% % to 0.8%.
更一步优选地,所述预交联层的原料还包括添加量为所述预交联层的原料配方总质量的0.1%~20%的增粘树脂,再进一步优选为5%~15%,更优选为8%~12%。More preferably, the raw material of the pre-crosslinked layer also includes a tackifying resin added in an amount of 0.1% to 20% of the total mass of the raw material formulation of the pre-crosslinked layer, more preferably 5% to 15%, More preferably, it is 8% to 12%.
更一步优选地,所述预交联层的原料还包括添加量为所述预交联层的原料配方总质量的0.005%~2%的偶联剂,再进一步优选为0.01%~1%,更优选为0.1%~0.5%。More preferably, the raw materials of the pre-crosslinked layer also include a coupling agent added in an amount of 0.005% to 2% of the total mass of the raw material formulation of the pre-crosslinked layer, still more preferably 0.01% to 1%, More preferably, it is 0.1%-0.5%.
更一步优选地,所述预交联层的原料还包括添加量为所述预交联层的原料配方总质量的0.001%~1%的加工助剂,再进一步优选为0.05%~1%,更优选为0.1%~1%。More preferably, the raw material of the pre-crosslinked layer also includes a processing aid added in an amount of 0.001% to 1% of the total mass of the raw material formulation of the precrosslinked layer, still more preferably 0.05% to 1%, More preferably, it is 0.1% to 1%.
更一步优选地,所述预交联层的原料还包括添加量为所述预交联层的原料配方总质量的0.005%~5%的抗PID助剂,再进一步优选为0.1%~5%,更优选为0.1%~1.5%。More preferably, the raw material of the pre-crosslinked layer also includes an anti-PID additive in an amount of 0.005% to 5% of the total mass of the raw material formulation of the precrosslinked layer, and further preferably 0.1% to 5%. , more preferably 0.1% to 1.5%.
更一步优选地,所述粘结层的原料还包括添加量为所述粘结层的原料总质量的0.1%~30%的增粘树脂,再进一步优选为10%~30%,更优选为15%~25%。More preferably, the raw material of the adhesive layer also includes a tackifying resin added in an amount of 0.1% to 30% of the total mass of the raw material of the adhesive layer, still more preferably 10% to 30%, more preferably 15% to 25%.
更一步优选地,所述粘结层的原料还包括添加量为所述粘结层的原料总质量的0.001%~1%的加工助剂,再进一步优选为0.1%~1%,更优选为0.3%~0.8%。More preferably, the raw material of the adhesive layer also includes a processing aid added in an amount of 0.001% to 1% of the total mass of the raw material of the adhesive layer, still more preferably 0.1% to 1%, more preferably 0.3% to 0.8%.
更一步优选地,所述粘结层的原料还包括添加量为所述粘结层的原料总质量的0.005%~5%的抗PID助剂,再进一步优选为0.1%~5%,更优选为1%~5%。More preferably, the raw material of the bonding layer also includes an anti-PID additive in an amount of 0.005% to 5% of the total mass of the raw material of the bonding layer, further preferably 0.1% to 5%, more preferably 1% to 5%.
进一步优选地,所述交联剂为三烯丙基异氰脲酸酯(TAIC)、三甲代烯丙基异氰酸酯(TMAIC)、三羟甲基丙烷三丙烯酸酯(TMPTA)、三羟甲基丙烷三甲基丙烯酸酯(TMPTMA)、或季戊四醇三丙烯酸酯(PETA)中的一种或多种。Further preferably, the crosslinking agent is triallyl isocyanurate (TAIC), trimethallyl isocyanate (TMAIC), trimethylolpropane triacrylate (TMPTA), trimethylolpropane One or more of trimethacrylate (TMPTMA) or pentaerythritol triacrylate (PETA).
进一步优选地,所述的紫外光引发剂为三羟甲基丙烷三丙烯酸酯、2-三羟甲 基丙烷四丙烯酸酯、4-(二甲氨基)苯甲酸乙酯中的一种或多种。Further preferably, the ultraviolet photoinitiator is one or more of trimethylolpropane triacrylate, 2-trimethylolpropane tetraacrylate, 4-(dimethylamino) ethyl benzoate .
进一步优选地,所述的热引发剂为过氧化物引发剂。Further preferably, the thermal initiator is a peroxide initiator.
更进一步优选地,所述热引发剂为乙氧化三羟甲基丙烷三丙烯酸酯、乙氧化三羟甲基丙烷三丙烯酸酯、丙氧化三羟甲基丙烷三丙烯酸酯、过氧化二异丙苯(DCP)、2,5-二甲基-2,5-二(叔丁基过氧基)己烷中的一种或几种。More preferably, the thermal initiator is ethoxylated trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, dicumyl peroxide One or more of (DCP), 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane.
进一步优选地,所述增粘树脂为松香、氢化松香、石油树脂、氢化石油树脂、酚醛树脂、或萜烯树脂中的一种或多种。Further preferably, the tackifying resin is one or more of rosin, hydrogenated rosin, petroleum resin, hydrogenated petroleum resin, phenolic resin, or terpene resin.
进一步优选地,所述偶联剂为硅烷偶联剂、钛酸酯偶联剂、或铝酸酯偶联剂中的一种或多种。Further preferably, the coupling agent is one or more of a silane coupling agent, a titanate coupling agent, or an aluminate coupling agent.
更进一步优选地,所述的偶联剂为选自3-甲基丙烯酰氧基丙基甲基三甲氧基硅烷、3-缩水甘油丙基三甲氧基硅烷、乙烯基三甲氧基硅烷、3-氨丙基三乙氧基硅烷、乙烯基三甲氧基硅烷、三异硬脂酰基钛酸异丙酯、异丙基三(二辛基焦磷酸酰氧基)钛酸酯中的一种或多种。More preferably, the coupling agent is selected from 3-methacryloxypropylmethyltrimethoxysilane, 3-glycidylpropyltrimethoxysilane, vinyltrimethoxysilane, 3 - one of aminopropyltriethoxysilane, vinyltrimethoxysilane, isopropyl triisostearyl titanate, isopropyl tris (dioctyl pyrophosphate acyloxy) titanate or Various.
进一步优选地,所述抗老化剂包括抗氧剂、光稳定剂、或紫外吸收剂中的一种或多种。Further preferably, the anti-aging agent includes one or more of antioxidants, light stabilizers, or ultraviolet absorbers.
更进一步优选地,所述的抗氧剂为酚系抗氧剂、亚磷酸酯系抗氧剂和受阻胺类抗氧剂中的一种或多种。Even more preferably, the antioxidant is one or more of phenolic antioxidants, phosphite antioxidants and hindered amine antioxidants.
更进一步优选地,所述的光稳定剂为选自双(2,2,6,6-四甲基-4-哌啶基)癸二酸酯(光稳定剂770)、聚丁二酸(4-羟基-2,2,6,6-四甲基-1-哌啶乙醇)酯、聚-{[6-[(1,1,3,3-四甲基丁基)-亚氨基]-1,3,5-三嗪-2,4-二基][2-(2,2,6,6-四甲基哌啶基)-氮基]-亚已基-[4-(2,2,6,6-四甲基哌啶基)-氨基]中的一种或多种。More preferably, the light stabilizer is selected from bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate (light stabilizer 770), polysuccinic acid ( 4-Hydroxy-2,2,6,6-tetramethyl-1-piperidineethanol) ester, poly-{[6-[(1,1,3,3-tetramethylbutyl)-imino] -1,3,5-triazine-2,4-diyl][2-(2,2,6,6-tetramethylpiperidinyl)-nitro]-hexylene-[4-(2 , 2,6,6-tetramethylpiperidinyl)-amino] in one or more.
进一步优选地,所述加工助剂为开口剂和/或润滑剂。Further preferably, the processing aid is an antiblocking agent and/or a lubricant.
更进一步优选地,抗PID助剂为金属离子捕捉剂。Even more preferably, the anti-PID additive is a metal ion scavenger.
优选地,所述预交联层的厚度为20~200μm,进一步优选为20~100μm,更进一步优选为20~80μm,再进一步优选为20~50μm。Preferably, the thickness of the pre-crosslinked layer is 20-200 μm, more preferably 20-100 μm, still more preferably 20-80 μm, still more preferably 20-50 μm.
优选地,所述粘结层的厚度为20~200μm,进一步优选为20~100μm,更进一步优选为20~80μm,再进一步优选为20~50μm。Preferably, the adhesive layer has a thickness of 20-200 μm, more preferably 20-100 μm, still more preferably 20-80 μm, and still more preferably 20-50 μm.
优选地,所述预交联层的外侧还设置离型膜。Preferably, a release film is provided on the outside of the pre-crosslinked layer.
进一步优选地,所述离型膜为常规离型膜,例如PE、PP、PET等,所述离型膜有色或者无色均可。Further preferably, the release film is a conventional release film, such as PE, PP, PET, etc., and the release film can be colored or colorless.
优选地,所述焊带载体膜还括设置在所述预交联层和所述粘结层之间的一层或多层过渡层,所述基体树脂包括乙烯-醋酸乙烯共聚物、聚烯烃弹性体、乙烯丙烯酸共聚物、或乙基甲基丙烯酸酯中的一种或多种,所述过渡层为交联型或非交联型,当所述过渡层为交联型时,所述过渡层的预交联度≤1%,并且,所述焊带载体膜在制备成光伏组件后,所述过渡层的交联度为1~90%。Preferably, the tape carrier film further includes one or more transition layers disposed between the pre-crosslinked layer and the adhesive layer, and the matrix resin includes ethylene-vinyl acetate copolymer, polyolefin One or more of elastomer, ethylene acrylic acid copolymer, or ethyl methacrylate, the transition layer is cross-linked or non-cross-linked, when the transition layer is cross-linked, the The pre-crosslinking degree of the transition layer is ≤1%, and after the ribbon carrier film is prepared into a photovoltaic module, the crosslinking degree of the transition layer is 1-90%.
本申请中,所述过渡层的预交联度同样是指获得的所述焊带载体膜成品中的过渡层的交联度。In the present application, the pre-crosslinking degree of the transition layer also refers to the crosslinking degree of the transition layer in the finished product of the ribbon carrier film obtained.
进一步优选地,所述过渡层的原料包括添加量为所述过渡层的原料总质量的50%~98%的基体树脂,更进一步优选为80%~98%,更优选为85%~95%。Further preferably, the raw material of the transition layer includes a matrix resin added in an amount of 50% to 98% of the total mass of the raw material of the transition layer, more preferably 80% to 98%, more preferably 85% to 95% .
进一步优选地,所述过渡层的原料包括添加量为所述过渡层的原料总质量的1%~8%的交联剂,更进一步优选为1%~8%,更优选为2%~5%。Further preferably, the raw material of the transition layer includes a crosslinking agent added in an amount of 1% to 8% of the total mass of the raw material of the transition layer, more preferably 1% to 8%, more preferably 2% to 5%. %.
进一步优选地,所述过渡层的原料包括添加量为所述过渡层的原料总质量的0.1~5%的热引发剂,更进一步优选为0.1%~5%,更优选为0.5%~3%。Further preferably, the raw material of the transition layer includes a thermal initiator added in an amount of 0.1% to 5% of the total mass of the raw material of the transition layer, more preferably 0.1% to 5%, more preferably 0.5% to 3% .
在一些实施方式中,所述过渡层的原料还包括紫外光引发剂,以所述过渡层的原料总质量为100%计,所述紫外光添加剂的添加量≤0.1%,所述过渡层的原料中同样可以包括少量的紫外光引发剂,只要保证所述过渡层的预交联度≤1%即可。In some embodiments, the raw material of the transition layer also includes an ultraviolet photoinitiator, based on the total mass of the raw material of the transition layer as 100%, the addition amount of the ultraviolet light additive is ≤0.1%, and the addition amount of the transition layer is ≤0.1%. The raw material may also include a small amount of ultraviolet photoinitiator, as long as the pre-crosslinking degree of the transition layer is guaranteed to be ≤1%.
进一步优选地,所述紫外光引发剂为三羟甲基丙烷三丙烯酸酯、2-三羟甲基丙烷四丙烯酸酯、4-(二甲氨基)苯甲酸乙酯中的一种或多种。Further preferably, the ultraviolet photoinitiator is one or more of trimethylolpropane triacrylate, 2-trimethylolpropane tetraacrylate, and ethyl 4-(dimethylamino)benzoate.
再进一步优选地,所述过渡层的原料还包括添加量为所述过渡层的原料总质量的0.1%~30%的增粘树脂,再进一步优选为10%~30%,更优选为15%~25%。Still further preferably, the raw material of the transition layer also includes a tackifying resin added in an amount of 0.1% to 30% of the total mass of the raw material of the transition layer, still more preferably 10% to 30%, more preferably 15% ~25%.
再进一步优选地,所述过渡层的原料包括添加量为所述过渡层的原料总质量的0.1~2%的偶联剂,更进一步优选为0.1%~1%,更优选为0.5%~1%。Still further preferably, the raw material of the transition layer includes a coupling agent added in an amount of 0.1% to 2% of the total mass of the raw material of the transition layer, more preferably 0.1% to 1%, more preferably 0.5% to 1% %.
再进一步优选地,所述过渡层的原料包括添加量为所述过渡层的原料总质量的0.1~3%的抗老化剂,更进一步优选为0.1%~3%,更优选为0.1%~2%。Still further preferably, the raw material of the transition layer includes an anti-aging agent added in an amount of 0.1% to 3% of the total mass of the raw material of the transition layer, more preferably 0.1% to 3%, more preferably 0.1% to 2% %.
再进一步优选地,所述过渡层的原料还包括添加量为所述过渡层的原料总质量的0.001%~1%的加工助剂,更进一步优选为0.1%~1%,更优选为0.1%~0.6%。Still further preferably, the raw material of the transition layer also includes a processing aid added in an amount of 0.001% to 1% of the total mass of the raw material of the transition layer, more preferably 0.1% to 1%, more preferably 0.1% ~0.6%.
再进一步优选地,所述过渡层的原料还包括添加量为所述过渡层的原料总质量的0.005%~5%的抗PID助剂,更进一步优选为0.1%~5%,更优选为0.1%~3%。Still further preferably, the raw material of the transition layer also includes an anti-PID additive in an amount of 0.005% to 5% of the total mass of the raw material of the transition layer, more preferably 0.1% to 5%, more preferably 0.1% %~3%.
所述过渡层的基体树脂为乙烯-醋酸乙烯共聚物、聚烯烃弹性体、乙烯丙烯 酸共聚物、或乙基甲基丙烯酸酯中的一种或多种。本申请中,过渡层与粘结层基本组成类似,基体树脂相同或不同。The matrix resin of the transition layer is one or more of ethylene-vinyl acetate copolymer, polyolefin elastomer, ethylene acrylic acid copolymer, or ethyl methacrylate. In this application, the basic composition of the transition layer and the adhesive layer is similar, and the matrix resin is the same or different.
进一步优选地,所述热引发剂为乙氧化三羟甲基丙烷三丙烯酸酯、乙氧化三羟甲基丙烷三丙烯酸酯、丙氧化三羟甲基丙烷三丙烯酸酯、过氧化二异丙苯、2,5-二甲基-2,5-二(叔丁基过氧基)己烷中的一种或几种。Further preferably, the thermal initiator is ethoxylated trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, dicumyl peroxide, One or more of 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane.
进一步优选地,所述交联剂为三烯丙基异氰脲酸酯(TAIC)、三甲代烯丙基异氰酸酯(TMAIC)、三丙烯酸丙烷三甲醇酯(TMPTA)、三羟甲基丙烷三甲基丙烯酸酯(TMPTMA)、或季戊四醇三丙烯酸酯(PETA)中的一种或多种。Further preferably, the crosslinking agent is triallyl isocyanurate (TAIC), trimethallyl isocyanate (TMAIC), trimethylol propane triacrylate (TMPTA), trimethylolpropane trimethyl One or more of pentaerythritol triacrylate (PETA) or pentaerythritol triacrylate (TMPTMA).
进一步优选地,所述增粘树脂为松香、氢化松香、石油树脂、氢化石油树脂、酚醛树脂、或萜烯树脂中的一种或多种。Further preferably, the tackifying resin is one or more of rosin, hydrogenated rosin, petroleum resin, hydrogenated petroleum resin, phenolic resin, or terpene resin.
进一步优选地,所述偶联剂为硅烷偶联剂、钛酸酯偶联剂、或铝酸酯偶联剂中的一种或多种。Further preferably, the coupling agent is one or more of a silane coupling agent, a titanate coupling agent, or an aluminate coupling agent.
进一步优选地,所述抗老化剂为抗氧剂、光稳定剂、或紫外吸收剂中的一种或多种。Further preferably, the anti-aging agent is one or more of antioxidants, light stabilizers, or ultraviolet absorbers.
进一步优选地,所述加工助剂为开口剂和/或润滑剂。Further preferably, the processing aid is an antiblocking agent and/or a lubricant.
第二方面,本申请实施例还提供一种所述的焊带载体膜的制备方法,将各层原料分别混合、造粒,然后经多层共挤流延成膜,通过UV或电子束照射预交联层。In the second aspect, the embodiment of the present application also provides a preparation method of the above-mentioned welding tape carrier film. The raw materials of each layer are mixed and granulated respectively, and then multi-layer co-extrusion casting is performed to form a film, and the film is irradiated by UV or electron beam pre-crosslinked layer.
优选地,所述电子束辐照剂量为10~25kGy。Preferably, the electron beam irradiation dose is 10-25 kGy.
第三方面,本申请实施例还一种焊带复合体,包括所述的焊带载体膜,以及粘附在所述的焊带载体膜上的焊带。In a third aspect, the embodiment of the present application is also a solder ribbon composite, including the solder ribbon carrier film, and a solder ribbon adhered to the solder ribbon carrier film.
优选地,所述的焊带的至少30%及以上的体积露出所述的焊带载体膜,使焊带能够很好的与电池片接触的同时保证焊带与载体膜的粘结性能。Preferably, at least 30% or more of the volume of the solder ribbon is exposed to the ribbon carrier film, so that the solder ribbon can be in good contact with the battery sheet while ensuring the bonding performance of the solder ribbon and the carrier film.
进一步优选地,所述的焊带的30%~70%的体积露出所述的焊带载体膜,更优选为所述的焊带的40%~60%的体积露出所述的焊带载体膜。Further preferably, 30% to 70% of the volume of the welding ribbon exposes the welding ribbon carrier film, more preferably 40% to 60% of the volume of the welding ribbon exposes the welding ribbon carrier film .
第四方面,本申请实施例还提供一种所述焊带复合体的制备方法,具体为:控制温度在80℃~170℃下,通过压合将所述的焊带粘附在所述的载体膜上,控制压合时间为0.1s~1s,且相邻两个所述的载体膜分别位于所述的焊带的两侧且间隔分布。In the fourth aspect, the embodiment of the present application also provides a preparation method of the solder ribbon complex, specifically: controlling the temperature at 80°C to 170°C, and adhering the solder ribbon to the solder ribbon by pressing On the carrier film, the pressing time is controlled to be 0.1s-1s, and the two adjacent carrier films are respectively located on both sides of the welding strip and distributed at intervals.
优选地,控制温度为80℃~150℃,进一步优选地为80℃~130℃。Preferably, the controlled temperature is 80°C-150°C, more preferably 80°C-130°C.
第五方面,本申请实施例还提供一种电池片复合体,包括电池片、与所述的电池片接触的焊带、以及用于将所述的焊带固定在所述的电池片上的载体膜,所述的载体膜为所述的焊带载体膜。In the fifth aspect, the embodiment of the present application also provides a battery sheet composite, including a battery sheet, a welding ribbon in contact with the battery sheet, and a carrier for fixing the welding ribbon on the battery sheet film, the carrier film is the carrier film of the solder tape.
优选地,所述的电池片的两面分别设置有所述的焊带以及所述的载体膜。Preferably, the two sides of the cell sheet are respectively provided with the solder strip and the carrier film.
进一步优选地,所述的电池片为晶硅电池、非晶硅电池、化学太阳能电池、多元化合物薄膜太阳能电池等中的一种。Further preferably, the cell is one of crystalline silicon cells, amorphous silicon cells, chemical solar cells, multi-component compound thin film solar cells, and the like.
第六方面,本申请实施例还提供一种电池片复合体的制备方法,具体包括:In the sixth aspect, the embodiment of the present application also provides a method for preparing a cell composite, which specifically includes:
对粘附有所述载体膜的焊带进行裁切以形成焊带复合体单元,所述的焊带复合体单元由所述的焊带以及两个所述的载体膜组成,cutting the ribbon attached to the carrier film to form a ribbon complex unit, the ribbon composite unit is composed of the ribbon and two carrier films,
控制温度在100℃~300℃下,将所述的焊带复合体单元压合在电池片的表面,控制压合时间为0.2s~3s。The temperature is controlled at 100° C. to 300° C., and the ribbon composite unit is pressed on the surface of the battery sheet, and the pressing time is controlled to be 0.2s to 3s.
优选地,控制温度为100℃~200℃,进一步优选地为100℃~150℃,更优选为100℃~130℃。Preferably, the controlled temperature is 100°C-200°C, more preferably 100°C-150°C, more preferably 100°C-130°C.
第七方面,本申请实施例还提供一种所述的焊带载体膜,或所述的焊带复合体、或所述的电池片组件在光伏组件中的应用。In a seventh aspect, the embodiment of the present application also provides an application of the ribbon carrier film, or the ribbon composite, or the cell assembly in a photovoltaic module.
第八方面,本申请实施例还提供一种光伏组件的制备方法,具体为:In the eighth aspect, the embodiment of the present application also provides a method for preparing a photovoltaic module, specifically:
将背板,下层胶膜,所述电池片复合体,上层胶膜,玻璃依次层叠,置于层压机中层压得到单玻太阳能组件,Laminate the back sheet, the lower layer of adhesive film, the cell complex, the upper layer of adhesive film, and the glass in sequence, and place them in a laminator to obtain a single-glass solar module.
或将下层玻璃,下层胶膜,所述电池片复合体,上层胶膜,上层玻璃依次层叠,置于层压机中层压得到双玻太阳能组件,Or stack the lower glass, the lower adhesive film, the cell complex, the upper adhesive film, and the upper glass in sequence, and place them in a laminator to obtain a double-glass solar module.
所述层压的条件为:层压温度120℃~180℃,抽真空时间3~8min,层压时间8~20min;所述层压温度进一步优选为130℃~180℃,更优选为135℃~150℃。The lamination conditions are: lamination temperature 120°C-180°C, vacuum time 3-8min, lamination time 8-20min; the lamination temperature is further preferably 130°C-180°C, more preferably 135°C ~150°C.
优选地,当所述的载体膜上设置有离型膜时,所述的离型膜在层压之前去除。Preferably, when a release film is provided on the carrier film, the release film is removed before lamination.
由于上述技术方案运用,本申请实施例与相关技术相比具有下列优点:Due to the application of the above-mentioned technical solutions, the embodiment of the present application has the following advantages compared with related technologies:
本申请实施例通过对载体膜各层原料配方的优化,相邻两层间相容性好,层压后可熔为一体,无分层失效风险;避免了使用过程中因温度变化造成的失效风险;各层均为无定型材料,与封装材料相容性好,整体材料透过率大,雾度低,且与封装胶膜材质相同,可酌情减少封装材厚度,进一步降低组件成本; 同时预交联层和粘结层均为交联结构,避免了组件使用过程中由于热斑效应产生的失效风险;粘结层与电池片在层压过程中会发生化学反应,增加了载体膜与电池片之间的粘结力,进一步提升产品的长期可靠性。In the embodiment of the present application, by optimizing the raw material formula of each layer of the carrier film, the compatibility between adjacent two layers is good, and they can be melted into one after lamination, without the risk of delamination failure; the failure caused by temperature changes during use is avoided. Risk; each layer is made of amorphous material, which has good compatibility with the packaging material, high transmittance of the overall material, low haze, and the same material as the packaging film, so the thickness of the packaging material can be reduced as appropriate to further reduce the component cost; at the same time Both the pre-crosslinked layer and the adhesive layer are cross-linked, which avoids the risk of failure due to the hot spot effect during the use of the module; the chemical reaction between the adhesive layer and the battery sheet will occur during the lamination process, which increases the carrier film and the battery. The adhesion between the cells further enhances the long-term reliability of the product.
在阅读并理解了附图和详细描述后,可以明白其他方面。Other aspects will be apparent to others upon reading and understanding the drawings and detailed description.
附图用来提供对本文技术方案的进一步理解,并且构成说明书的一部分,与本申请的实施例一起用于解释本文的技术方案,并不构成对本文技术方案的限制。The accompanying drawings are used to provide a further understanding of the technical solutions herein, and constitute a part of the description, and are used together with the embodiments of the application to explain the technical solutions herein, and do not constitute limitations to the technical solutions herein.
附图1为本申请实施例的焊带载体膜的一种结构示意图;Accompanying drawing 1 is a kind of structural representation of the carrier film of the welding tape of the embodiment of the present application;
附图2为本申请实施例的焊带载体膜的第二种结构示意图;Accompanying drawing 2 is the second structure schematic diagram of the carrier film of the welding tape of the embodiment of the present application;
附图3为本申请实施例的焊带载体膜的第三种结构示意图;Accompanying drawing 3 is the third structure schematic diagram of the carrier film of the welding tape of the embodiment of the present application;
其中,1、离型膜;2、预交联层;3、粘结层;4、过渡层。Among them, 1. Release film; 2. Pre-crosslinked layer; 3. Adhesive layer; 4. Transition layer.
下面结合具体实施例对本申请作进一步描述,但本申请并不限于以下实施例。实施例中采用的实施条件可以根据具体使用的不同要求做进一步调整,未注明的实施条件为本行业中的常规条件。The present application will be further described below in conjunction with specific examples, but the present application is not limited to the following examples. The implementation conditions adopted in the examples can be further adjusted according to the different requirements of specific use, and the implementation conditions not indicated are the conventional conditions in this industry.
下述实施例和对比例中的原料的份数均为质量份。The parts of the raw materials in the following examples and comparative examples are all parts by mass.
下述实施例和对比例中的原料通过市购或自制获得。The raw materials in the following examples and comparative examples are obtained commercially or by self-made.
POE树脂:陶氏8450;POE resin: Dow 8450;
EVA树脂:韩华282;EVA resin: Hanwha 282;
增粘树脂:荒川化学PR12603;Tackifying resin: Arakawa Chemical PR12603;
紫外光引发剂:BASF 1173;UV photoinitiator: BASF 1173;
交联剂:沙多玛SR454NS;Cross-linking agent: Sartomer SR454NS;
偶联剂:安徽硅宝GX171;Coupling agent: Anhui Sibao GX171;
抗老化助剂:氰特B877;Anti-aging additive: Cytec B877;
加工助剂:3M FX5920;Processing aid: 3M FX5920;
抗PID助剂根据相关技术的方法自制。The anti-PID auxiliary agent is self-made according to the method of related technology.
背板:赛伍Cynagard 205A;Backplane: Cynagard 205A;
上层胶膜:赛伍Cybright T11;Upper film: Cybright T11;
下层胶膜:赛伍Cybright C11。Lower film: Cybright C11.
实施例1Example 1
结构如附图1所示的焊带载体膜:The welding tape carrier film with structure as shown in accompanying drawing 1:
离型膜层:PET材质,厚度25μmRelease film layer: PET material, thickness 25μm
预交联层原料配方为:POE树脂92.5份,紫外光引发剂1份,交联剂4份,偶联剂0.2,抗老化助剂1份,加工助剂0.8份,抗PID助剂0.5份。The raw material formula of the pre-crosslinking layer is: 92.5 parts of POE resin, 1 part of ultraviolet photoinitiator, 4 parts of crosslinking agent, 0.2 part of coupling agent, 1 part of anti-aging additive, 0.8 part of processing aid, and 0.5 part of anti-PID additive .
粘结层原料配方为:POE树脂93份,热引发剂1份,交联剂3.5份,偶联剂0.5,抗老化助剂0.5份,加工助剂0.5份,抗PID助剂1份。The raw material formula of the bonding layer is: 93 parts of POE resin, 1 part of thermal initiator, 3.5 parts of crosslinking agent, 0.5 part of coupling agent, 0.5 part of anti-aging additive, 0.5 part of processing aid, and 1 part of anti-PID additive.
焊带载体膜制备方法:Preparation method of ribbon carrier film:
各层原材料在高速混合机中将各种原料混合均匀后经双螺杆挤出机造粒完成,再进行多层共挤流延成膜,流延成膜同时与离型膜复合。完成后进行电子束辐照预交联。加工温度为80~100℃,电子束辐照剂量为16kGy。形成三层结构的焊带载体膜,离型膜1 25μm,预交联层2 40μm,粘结层3 40μm。The raw materials of each layer are mixed uniformly in a high-speed mixer, and then granulated by a twin-screw extruder to complete, and then multi-layer co-extrusion casting is performed to form a film, and the film is cast and laminated with a release film at the same time. Pre-crosslinking by electron beam irradiation is carried out after completion. The processing temperature is 80-100°C, and the electron beam irradiation dose is 16kGy. Form a three-layer structure of the welding tape carrier film, the release film is 1 25 μm, the pre-crosslinked layer is 2 40 μm, and the adhesive layer is 3 40 μm.
光伏组件的制备:Preparation of photovoltaic modules:
步骤1、控制温度在80~130℃下,通过压合将焊带粘附在载体膜上,控制压合时间为0.1~1s,且相邻两个载体膜分别位于焊带的两侧且间隔分布; Step 1. Control the temperature at 80-130°C, adhere the welding ribbon to the carrier film by pressing, control the pressing time to 0.1-1s, and the two adjacent carrier films are respectively located on both sides of the welding ribbon and spaced apart distributed;
步骤2、对粘附有载体膜的焊带进行裁切以形成焊带复合体单元,焊带复合体单元由焊带以及两个载体膜组成; Step 2, cutting the welding ribbon adhered to the carrier film to form a welding ribbon composite unit, the welding ribbon composite unit is composed of a welding ribbon and two carrier films;
步骤3、控制温度在100~130℃下,将焊带复合体单元压合在电池片的表面形成电池片复合体,控制压合时间为0.2~3s,电池片的两面分别压合有焊带复合体单元; Step 3. Control the temperature at 100-130°C, and press the ribbon composite unit on the surface of the battery sheet to form a battery sheet composite. The pressing time is controlled to be 0.2-3s, and the two sides of the battery sheet are respectively pressed with ribbons. complex unit;
步骤4、将背板,下层胶膜,电池片复合体,上层胶膜,玻璃依次层叠,置于层压机中层压得到单玻太阳能组件, Step 4. Laminate the back sheet, the lower layer of adhesive film, the cell complex, the upper layer of adhesive film, and the glass in sequence, and place them in a laminator to obtain a single-glass solar module.
或将下层玻璃,下层胶膜,所述电池片复合体,上层胶膜,上层玻璃依次层叠,置于层压机中层压得到双玻太阳能组件。Alternatively, the lower layer of glass, the lower layer of adhesive film, the cell complex, the upper layer of adhesive film, and the upper layer of glass are sequentially laminated, and placed in a laminator for lamination to obtain a double-glass solar module.
层压温度为145℃,抽真空时间3~8min,层压时间15min。The lamination temperature is 145°C, the vacuum time is 3-8 minutes, and the lamination time is 15 minutes.
实施例2Example 2
结构如附图1所示的焊带载体膜:The welding tape carrier film with structure as shown in accompanying drawing 1:
离型膜层:PET材质,厚度25μmRelease film layer: PET material, thickness 25μm
预交联层原料配方为:EVA树脂92.5份,紫外光引发剂1.5份,交联剂3.5份,偶联剂0.2,抗老化助剂1份,加工助剂0.3份,抗PID助剂1份。The raw material formula of the pre-crosslinking layer is: 92.5 parts of EVA resin, 1.5 parts of ultraviolet photoinitiator, 3.5 parts of crosslinking agent, 0.2 part of coupling agent, 1 part of anti-aging additive, 0.3 part of processing aid, and 1 part of anti-PID additive .
粘结层原料配方为:EVA树脂91.2份,热引发剂1.5份,交联剂3份,偶联剂0.5,抗老化助剂0.5份,加工助剂0.3份,抗PID助剂3份。The raw material formula of the adhesive layer is: 91.2 parts of EVA resin, 1.5 parts of thermal initiator, 3 parts of crosslinking agent, 0.5 part of coupling agent, 0.5 part of anti-aging additive, 0.3 part of processing aid, and 3 parts of anti-PID additive.
焊带载体膜制备方法同实施例1。The preparation method of the ribbon carrier film is the same as in Example 1.
形成三层结构的焊带载体膜,离型膜1 25μm,预交联层2 40μm,粘结层3 40μm。Form a three-layer structure of the welding tape carrier film, the release film is 1 25 μm, the pre-crosslinked layer is 2 40 μm, and the adhesive layer is 3 40 μm.
光伏组件的制备同实施例1。The preparation of the photovoltaic module is the same as in Example 1.
实施例3Example 3
结构如附图1所示的焊带载体膜:The welding tape carrier film with structure as shown in accompanying drawing 1:
离型膜层:PET材质,厚度25μmRelease film layer: PET material, thickness 25μm
预交联层原料配方为:POE树脂81份,增粘树脂10份,紫外光引发剂2份,交联剂4.5份,偶联剂0.2,抗老化助剂1份,加工助剂0.8份,抗PID助剂0.5份。The raw material formula of the pre-crosslinked layer is: 81 parts of POE resin, 10 parts of tackifying resin, 2 parts of ultraviolet photoinitiator, 4.5 parts of crosslinking agent, 0.2 part of coupling agent, 1 part of anti-aging additive, 0.8 part of processing aid, 0.5 part of anti-PID auxiliary agent.
粘结层原料配方为:POE树脂71.5份,增粘树脂20份,热引发剂2份,交联剂4份,偶联剂0.5,抗老化助剂0.5份,加工助剂0.5份,抗PID助剂1份。The raw material formula of the bonding layer is: 71.5 parts of POE resin, 20 parts of tackifying resin, 2 parts of thermal initiator, 4 parts of crosslinking agent, 0.5 part of coupling agent, 0.5 part of anti-aging additive, 0.5 part of processing aid, anti-PID 1 part of auxiliary agent.
焊带载体膜制备方法同实施例1。The preparation method of the ribbon carrier film is the same as in Example 1.
形成三层结构的焊带载体膜,离型膜1 25μm,预交联层2 40μm,粘结层3 40μm。Form a three-layer structure of the welding tape carrier film, the release film is 1 25 μm, the pre-crosslinked layer is 2 40 μm, and the adhesive layer is 3 40 μm.
光伏组件的制备方法同实施例1。The preparation method of the photovoltaic module is the same as that in Example 1.
实施例4Example 4
结构如附图3所示的焊带载体膜:The ribbon carrier film with structure as shown in accompanying drawing 3:
离型膜层:PET材质,厚度25μm。Release film layer: PET material, thickness 25μm.
预交联层原料配方为:EVA树脂92.5份,紫外光引发剂1.5份,交联剂3.5份,偶联剂0.2,抗老化助剂1份,加工助剂0.3份,抗PID助剂1份。The raw material formula of the pre-crosslinking layer is: 92.5 parts of EVA resin, 1.5 parts of ultraviolet photoinitiator, 3.5 parts of crosslinking agent, 0.2 part of coupling agent, 1 part of anti-aging additive, 0.3 part of processing aid, and 1 part of anti-PID additive .
过渡层原料配方为:POE树脂93.5份,热引发剂1份,交联剂3.5份,抗老化助剂0.5份,加工助剂0.5份,抗PID助剂1份。The raw material formula of the transition layer is: 93.5 parts of POE resin, 1 part of thermal initiator, 3.5 parts of crosslinking agent, 0.5 part of anti-aging additive, 0.5 part of processing aid, and 1 part of anti-PID additive.
粘结层原料配方为:EVA树脂91.2份,热引发剂1.5份,交联剂3份,偶联剂0.5,抗老化助剂0.5份,加工助剂0.3份,抗PID助剂3份。The raw material formula of the adhesive layer is: 91.2 parts of EVA resin, 1.5 parts of thermal initiator, 3 parts of crosslinking agent, 0.5 part of coupling agent, 0.5 part of anti-aging additive, 0.3 part of processing aid, and 3 parts of anti-PID additive.
焊带载体膜制备方法同实施例1。The preparation method of the ribbon carrier film is the same as in Example 1.
形成四层结构的焊带载体膜,离型膜1 25μm,预交联层2 25μm,过渡层4 30μm,粘结层3 25μm。Form a four-layer structure of the welding tape carrier film, the release film is 1 25 μm, the pre-crosslinked layer is 2 25 μm, the transition layer is 4 30 μm, and the adhesive layer is 3 25 μm.
光伏组件的制备方法同实施例1。The preparation method of the photovoltaic module is the same as that in Example 1.
实施例5Example 5
结构如附图3所示的焊带载体膜:The ribbon carrier film with structure as shown in accompanying drawing 3:
离型膜层:PET材质,厚度25μm。Release film layer: PET material, thickness 25μm.
预交联层原料配方为:POE树脂81份,增粘树脂10份,紫外光引发剂2份,交联剂4.5份,偶联剂0.2,抗老化助剂1份,加工助剂0.8份,抗PID助剂0.5份。The raw material formula of the pre-crosslinked layer is: 81 parts of POE resin, 10 parts of tackifying resin, 2 parts of ultraviolet photoinitiator, 4.5 parts of crosslinking agent, 0.2 part of coupling agent, 1 part of anti-aging additive, 0.8 part of processing aid, 0.5 part of anti-PID auxiliary agent.
过渡层原料配方为:POE树脂93.5份,热引发剂1份,交联剂3.5份,抗老化助剂0.5份,加工助剂0.5份,抗PID助剂1份。The raw material formula of the transition layer is: 93.5 parts of POE resin, 1 part of thermal initiator, 3.5 parts of crosslinking agent, 0.5 part of anti-aging additive, 0.5 part of processing aid, and 1 part of anti-PID additive.
粘结层原料配方为:POE树脂71.5份,增粘树脂20份,热引发剂2份,交联剂4份,偶联剂0.5,抗老化助剂0.5份,加工助剂0.5份,抗PID助剂1份。The raw material formula of the bonding layer is: 71.5 parts of POE resin, 20 parts of tackifying resin, 2 parts of thermal initiator, 4 parts of crosslinking agent, 0.5 part of coupling agent, 0.5 part of anti-aging additive, 0.5 part of processing aid, anti-PID 1 part of auxiliary agent.
焊带载体膜制备方法同实施例1。The preparation method of the ribbon carrier film is the same as in Example 1.
形成四层结构的焊带载体膜,离型膜1 25μm,预交联层2 40μm,过渡层4 30μm,粘结层3 40μm。A four-layer structure of the welding tape carrier film is formed, the release film is 1 25 μm, the pre-crosslinked layer is 2 40 μm, the transition layer is 4 30 μm, and the adhesive layer is 3 40 μm.
光伏组件的制备方法同实施例1。The preparation method of the photovoltaic module is the same as that in Example 1.
对比例1Comparative example 1
支撑层:纯PET膜,厚度40μm。(无预交联层)Support layer: pure PET film, thickness 40μm. (without pre-crosslinked layer)
粘结层原料配方为:EVA树脂91.2份,热引发剂1.5份,交联剂3份,偶联剂0.5,抗老化助剂0.5份,加工助剂0.3份,抗PID助剂3份,厚度40μm。The raw material formula of the bonding layer is: 91.2 parts of EVA resin, 1.5 parts of thermal initiator, 3 parts of crosslinking agent, 0.5 part of coupling agent, 0.5 part of anti-aging additive, 0.3 part of processing aid, 3 parts of anti-PID additive, thickness 40 μm.
在高速混合机中将各种原料混合均匀后经双螺杆挤出机造粒完成,再进行流延成膜,流延出的膜直接淋在PET膜上后收卷,其中PET膜面温度25-100℃。In the high-speed mixer, all kinds of raw materials are mixed evenly, and then granulated by the twin-screw extruder, and then cast into a film. The cast film is directly poured on the PET film and then wound up. The temperature of the PET film surface is 25 -100°C.
光伏组件的制备方法同实施例1。The preparation method of the photovoltaic module is the same as that in Example 1.
对比例2(粘结层不交联)Comparative example 2 (adhesive layer is not cross-linked)
结构如附图3所示的焊带载体膜:The ribbon carrier film with structure as shown in accompanying drawing 3:
离型膜层:PET材质,厚度25μm。Release film layer: PET material, thickness 25μm.
预交联层原料配方为:EVA树脂92.5份,紫外光引发剂1.5份,交联剂3.5份,偶联剂0.2,抗老化助剂1份,加工助剂0.3份,抗PID助剂1份。The raw material formula of the pre-crosslinking layer is: 92.5 parts of EVA resin, 1.5 parts of ultraviolet photoinitiator, 3.5 parts of crosslinking agent, 0.2 part of coupling agent, 1 part of anti-aging additive, 0.3 part of processing aid, and 1 part of anti-PID additive .
粘结层原料配方为:EVA树脂94.2份,热引发剂1.5份,偶联剂0.5,抗老化助剂0.5份,加工助剂0.3份,抗PID助剂3份。The raw material formula of the bonding layer is: 94.2 parts of EVA resin, 1.5 parts of thermal initiator, 0.5 part of coupling agent, 0.5 part of anti-aging additive, 0.3 part of processing aid, and 3 parts of anti-PID additive.
焊带载体膜制备方法同实施例1。The preparation method of the ribbon carrier film is the same as in Example 1.
形成三层结构的焊带载体膜,离型膜1 25μm,预交联层2 40μm,粘结层3 40μm。Form a three-layer structure of the welding tape carrier film, the release film is 1 25 μm, the pre-crosslinked layer is 2 40 μm, and the adhesive layer is 3 40 μm.
电池片组件的制备方法同实施例1。The preparation method of the cell assembly is the same as in Example 1.
对比例3(预交联层2的预交联度低)Comparative example 3 (the degree of precrosslinking of precrosslinked layer 2 is low)
结构如附图3所示的焊带载体膜:The ribbon carrier film with structure as shown in accompanying drawing 3:
离型膜层:PET材质,厚度25μm。Release film layer: PET material, thickness 25μm.
预交联层原料配方为:EVA树脂96.8份,紫外光引发剂0.2份,交联剂0.5份,偶联剂0.2,抗老化助剂1份,加工助剂0.3份,抗PID助剂1份。The raw material formula of the pre-crosslinked layer is: 96.8 parts of EVA resin, 0.2 part of ultraviolet photoinitiator, 0.5 part of crosslinking agent, 0.2 part of coupling agent, 1 part of anti-aging additive, 0.3 part of processing aid, and 1 part of anti-PID additive .
粘结层原料配方为:EVA树脂91.2份,热引发剂1.5份,交联剂3份,偶联剂0.5,抗老化助剂0.5份,加工助剂0.3份,抗PID助剂3份。The raw material formula of the adhesive layer is: 91.2 parts of EVA resin, 1.5 parts of thermal initiator, 3 parts of crosslinking agent, 0.5 part of coupling agent, 0.5 part of anti-aging additive, 0.3 part of processing aid, and 3 parts of anti-PID additive.
焊带载体膜制备方法同实施例1。The preparation method of the ribbon carrier film is the same as in Example 1.
形成三层结构的焊带载体膜,离型膜1 25μm,预交联层2 40μm,粘结层3 40μm。Form a three-layer structure of the welding tape carrier film, the release film is 1 25 μm, the pre-crosslinked layer is 2 40 μm, and the adhesive layer is 3 40 μm.
电池片组件的制备方法同实施例1。The preparation method of the cell assembly is the same as in Example 1.
上述实施例和对比例制得的载体膜按照如下方法进行检测,检测结果见表1。The carrier membranes prepared in the above examples and comparative examples were tested according to the following method, and the test results are shown in Table 1.
各性能的检测和评定方法如下:The detection and evaluation methods of each performance are as follows:
预交联度/交联度:溶剂法(二甲苯回流145℃,5h);Pre-crosslinking degree/crosslinking degree: solvent method (xylene reflux at 145°C, 5h);
透过率:GB/T 2410-2008;Transmittance: GB/T 2410-2008;
雾度:GB/T 2410-2008Haze: GB/T 2410-2008
表1Table 1
上述实施例只为说明本申请的技术构思及特点,其目的在于让熟悉此项技术的人士能够了解本申请的内容并据以实施,并不能以此限制本申请的保护范围。凡根据本申请精神实质所作的等效变化或修饰,都应涵盖在本申请的保护范围之内。The above-mentioned embodiments are only to illustrate the technical concept and characteristics of the present application, and the purpose is to enable those familiar with this technology to understand the content of the present application and implement it accordingly, and not to limit the protection scope of the present application. All equivalent changes or modifications made according to the spirit of the present application shall fall within the protection scope of the present application.
Claims (18)
- 一种焊带载体膜,其包括预交联层和粘结层,所述预交联层与所述粘结层的基体树脂相同,所述基体树脂为乙烯-醋酸乙烯共聚物、聚烯烃弹性体、乙烯丙烯酸共聚物、或乙基甲基丙烯酸酯中的一种或多种,A carrier film for welding tape, which includes a pre-crosslinked layer and an adhesive layer, the pre-crosslinked layer is the same as the matrix resin of the adhesive layer, and the matrix resin is ethylene-vinyl acetate copolymer, polyolefin elastic One or more of polymers, ethylene acrylic acid copolymers, or ethyl methacrylates,所述预交联层的预交联度为30%~80%,所述粘结层的预交联度≤1%;The pre-crosslinking degree of the pre-crosslinking layer is 30% to 80%, and the pre-crosslinking degree of the adhesive layer is ≤ 1%;并且,所述焊带载体膜在制备成光伏组件后,所述粘结层的交联度为50%~90%。Moreover, after the ribbon carrier film is prepared into a photovoltaic module, the crosslinking degree of the adhesive layer is 50%-90%.
- 根据权利要求1所述的焊带载体膜,其中:The ribbon carrier film of claim 1, wherein:所述预交联层中的所述基体树脂的添加量为所述预交联层的原料总质量的60%~98%,所述预交联层的原料还包括添加量为所述预交联层的原料配方总质量的1%~8%的交联剂、以及添加量为所述预交联层的原料配方总质量的0.1%~5%的紫外光引发剂;The addition amount of the matrix resin in the pre-crosslinked layer is 60% to 98% of the total mass of the raw materials of the pre-crosslinked layer, and the raw materials of the pre-crosslinked layer also include the addition amount of the pre-crosslinked layer. 1% to 8% of the crosslinking agent of the total mass of the raw material formulation of the interlinked layer, and an ultraviolet photoinitiator added in an amount of 0.1% to 5% of the total mass of the raw material formulation of the pre-crosslinked layer;所述粘结层中的所述基体树脂的添加量为所述粘结层的原料总质量的50%~98%,所述粘结层的原料还包括添加量为所述粘结层的原料总质量的1%~8%的交联剂、以及添加量为所述粘结层的原料总质量的0.1%~5%的热引发剂。The addition amount of the matrix resin in the adhesive layer is 50% to 98% of the total mass of the raw materials of the adhesive layer, and the raw materials of the adhesive layer also include the raw materials added in an amount of the adhesive layer The cross-linking agent is 1%-8% of the total mass, and the thermal initiator is added in an amount of 0.1%-5% of the total mass of the raw materials of the bonding layer.
- 根据权利要求2所述的焊带载体膜,其中:所述粘结层的原料还包括紫外光引发剂,以所述粘结层的原料总质量为100%计,所述紫外光添加剂的添加量≤0.1%。The welding tape carrier film according to claim 2, wherein: the raw material of the adhesive layer also includes an ultraviolet photoinitiator, and the total mass of the raw material of the adhesive layer is 100%, and the addition of the ultraviolet light additive Amount ≤ 0.1%.
- 根据权利要求2所述的焊带载体膜,其中:所述预交联层的原料还包括添加量为所述预交联层的原料配方总质量的0.1%~3%的抗老化剂;The ribbon carrier film according to claim 2, wherein: the raw material of the pre-crosslinked layer further includes an anti-aging agent added in an amount of 0.1% to 3% of the total mass of the raw material formula of the pre-crosslinked layer;所述粘结层的原料还包括添加量为所述粘结层的原料总质量的0.1%~2%的偶联剂、以及添加量为所述粘结层的原料总质量的0.1%~3%的抗老化剂。The raw materials of the adhesive layer also include a coupling agent added in an amount of 0.1% to 2% of the total mass of the raw materials of the adhesive layer, and an added amount of 0.1% to 3% of the total mass of the raw materials of the adhesive layer. % anti-aging agent.
- 根据权利要求4所述的焊带载体膜,其中:所述预交联层的原料还包括添加量为所述预交联层的原料配方总质量的0.1%~20%的增粘树脂、添加量为所述预交联层的原料配方总质量的0.005%~2%的偶联剂、添加量为所述预交联层的原料配方总质量的0.001%~1%的加工助剂、添加量为所述预交联层的原料配方总质量的0.005%~5%的抗PID助剂;The welding tape carrier film according to claim 4, wherein: the raw materials of the pre-crosslinked layer also include a tackifying resin, an additive amount of 0.1% to 20% of the total mass of the raw material formula of the pre-crosslinked layer, A coupling agent whose amount is 0.005% to 2% of the total mass of the raw material formulation of the pre-crosslinked layer, a processing aid added in an amount of 0.001% to 1% of the total mass of the raw material formulation of the pre-crosslinked layer, and an additive An anti-PID additive in an amount of 0.005% to 5% of the total mass of the raw material formulation of the pre-crosslinked layer;所述粘结层的原料还包括添加量为所述粘结层的原料总质量的0.1%~30%的增粘树脂、添加量为所述粘结层的原料总质量的0.001%~1%的加工助剂、添加量为所述粘结层的原料总质量的0.005%~5%的抗PID助剂;The raw materials of the adhesive layer also include a tackifying resin added in an amount of 0.1% to 30% of the total mass of the raw materials of the adhesive layer, and an added amount of 0.001% to 1% of the total mass of the raw materials of the adhesive layer processing aids, anti-PID additives added in an amount of 0.005% to 5% of the total mass of raw materials of the bonding layer;所述交联剂为三烯丙基异氰脲酸酯、三甲代烯丙基异氰酸酯、三羟甲基丙 烷三丙烯酸酯、三羟甲基丙烷三甲基丙烯酸酯、或季戊四醇三丙烯酸酯中的一种或多种;The cross-linking agent is triallyl isocyanurate, trimethallyl isocyanate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, or pentaerythritol triacrylate. one or more;所述紫外光引发剂为三羟甲基丙烷三丙烯酸酯、2-三羟甲基丙烷四丙烯酸酯、4-(二甲氨基)苯甲酸乙酯中的一种或多种;Described ultraviolet photoinitiator is one or more in trimethylolpropane triacrylate, 2-trimethylolpropane tetraacrylate, 4-(dimethylamino) ethyl benzoate;所述热引发剂为乙氧化三羟甲基丙烷三丙烯酸酯、乙氧化三羟甲基丙烷三丙烯酸酯、丙氧化三羟甲基丙烷三丙烯酸酯、过氧化二异丙苯、2,5-二甲基-2,5-二(叔丁基过氧基)己烷中的一种或几种;The thermal initiator is ethoxylated trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, dicumyl peroxide, 2,5- One or more of dimethyl-2,5-bis(tert-butylperoxy)hexane;所述增粘树脂为松香、氢化松香、石油树脂、氢化石油树脂、酚醛树脂、或萜烯树脂中的一种或多种;The tackifying resin is one or more of rosin, hydrogenated rosin, petroleum resin, hydrogenated petroleum resin, phenolic resin, or terpene resin;所述偶联剂为硅烷偶联剂、钛酸酯偶联剂、或铝酸酯偶联剂中的一种或多种;The coupling agent is one or more of a silane coupling agent, a titanate coupling agent, or an aluminate coupling agent;所述抗老化剂为抗氧剂、光稳定剂、或紫外吸收剂中的一种或多种;The anti-aging agent is one or more of antioxidants, light stabilizers, or ultraviolet absorbers;所述加工助剂为开口剂和/或润滑剂。The processing aid is an antiblocking agent and/or a lubricant.
- 根据权利要求1所述的焊带载体膜,其中:所述预交联层和所述粘结层的厚度独立地为20~200μm。The solder tape carrier film according to claim 1, wherein the thicknesses of the pre-crosslinked layer and the adhesive layer are independently 20-200 μm.
- 根据权利要求1所述的焊带载体膜,其中:所述预交联层的外侧还设置离型膜。The welding tape carrier film according to claim 1, wherein: a release film is provided on the outside of the pre-crosslinked layer.
- 根据权利要求1至7中任一项所述的焊带载体膜,其中:所述焊带载体膜还包括设置在所述预交联层和所述粘结层之间的一层或多层过渡层,所述过渡层为交联型或非交联型,The ribbon carrier film according to any one of claims 1 to 7, wherein the ribbon carrier film further comprises one or more layers disposed between the pre-crosslinked layer and the adhesive layer transition layer, the transition layer is cross-linked or non-cross-linked,当所述过渡层为交联型时,所述过渡层的预交联度≤1%,并且,所述焊带载体膜在制备成光伏组件后,所述过渡层的交联度小于等于90%。When the transition layer is cross-linked, the pre-cross-linking degree of the transition layer is ≤ 1%, and after the ribbon carrier film is prepared into a photovoltaic module, the cross-linking degree of the transition layer is less than or equal to 90% %.
- 根据权利要求8所述的焊带载体膜,其中:所述过渡层的原料包括添加量为所述过渡层的原料总质量的50%~98%的基体树脂、添加量为所述过渡层的原料总质量的1~8%的交联剂、添加量为所述过渡层的原料总质量的0.1%~5%的热引发剂。The welding ribbon carrier film according to claim 8, wherein: the raw materials of the transition layer include matrix resin in an amount of 50% to 98% of the total mass of the raw materials of the transition layer, and the addition amount of the transition layer is The cross-linking agent is 1-8% of the total mass of raw materials, and the thermal initiator is added in an amount of 0.1-5% of the total mass of raw materials of the transition layer.
- 根据权利要求9所述的焊带载体膜,其中:所述过渡层的原料还包括紫外光引发剂,以所述过渡层的原料总质量为100%计,所述紫外光添加剂的添加量≤0.1%;The welding tape carrier film according to claim 9, wherein: the raw material of the transition layer also includes an ultraviolet photoinitiator, and the addition amount of the ultraviolet light additive is ≤ 0.1%;所述紫外光引发剂为三羟甲基丙烷三丙烯酸酯、2-三羟甲基丙烷四丙烯酸酯、 4-(二甲氨基)苯甲酸乙酯中的一种或多种。The ultraviolet photoinitiator is one or more of trimethylolpropane triacrylate, 2-trimethylolpropane tetraacrylate, and 4-(dimethylamino) ethyl benzoate.
- 根据权利要求9所述的焊带载体膜,其中:所述过渡层的原料还包括添加量为所述过渡层的原料总质量的0.1%~30%的增粘树脂、添加量为所述过渡层的原料总质量的0.1%~2%的偶联剂、添加量为所述过渡层的原料总质量的0.1%~3%的抗老化剂、添加量为所述过渡层的原料总质量的0.001%~1%的加工助剂、以及添加量为所述过渡层的原料总质量的0.005%~5%的抗PID助剂;The welding ribbon carrier film according to claim 9, wherein: the raw material of the transition layer further includes a tackifying resin whose addition amount is 0.1% to 30% of the total mass of the transition layer raw material, and the addition amount is the transition layer The coupling agent of 0.1%~2% of the total mass of the raw materials of the layer, the anti-aging agent of 0.1%~3% of the total mass of the raw materials of the transition layer, the addition of 0.1%~3% of the total mass of the raw materials of the transition layer 0.001% to 1% of processing aids, and 0.005% to 5% of anti-PID additives added in an amount of 0.005% to 5% of the total mass of raw materials of the transition layer;所述过渡层的基体树脂为乙烯-醋酸乙烯共聚物、聚烯烃弹性体、乙烯丙烯酸共聚物、或乙基甲基丙烯酸酯中的一种或多种;The matrix resin of the transition layer is one or more of ethylene-vinyl acetate copolymer, polyolefin elastomer, ethylene acrylic acid copolymer, or ethyl methacrylate;所述热引发剂为乙氧化三羟甲基丙烷三丙烯酸酯、乙氧化三羟甲基丙烷三丙烯酸酯、丙氧化三羟甲基丙烷三丙烯酸酯、过氧化二异丙苯、2,5-二甲基-2,5-二(叔丁基过氧基)己烷中的一种或几种;The thermal initiator is ethoxylated trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, dicumyl peroxide, 2,5- One or more of dimethyl-2,5-bis(tert-butylperoxy)hexane;所述交联剂为三烯丙基异氰脲酸酯、三甲代烯丙基异氰酸酯、三丙烯酸丙烷三甲醇酯、三羟甲基丙烷三甲基丙烯酸酯、或季戊四醇三丙烯酸酯中的一种或多种;The crosslinking agent is one of triallyl isocyanurate, trimethallyl isocyanate, propane trimethylol triacrylate, trimethylolpropane trimethacrylate, or pentaerythritol triacrylate or more;所述增粘树脂为松香、氢化松香、石油树脂、氢化石油树脂、酚醛树脂、或萜烯树脂中的一种或多种;The tackifying resin is one or more of rosin, hydrogenated rosin, petroleum resin, hydrogenated petroleum resin, phenolic resin, or terpene resin;所述偶联剂为硅烷偶联剂、钛酸酯偶联剂、或铝酸酯偶联剂中的一种或多种;The coupling agent is one or more of a silane coupling agent, a titanate coupling agent, or an aluminate coupling agent;所述抗老化剂为抗氧剂、光稳定剂、或紫外吸收剂中的一种或多种;The anti-aging agent is one or more of antioxidants, light stabilizers, or ultraviolet absorbers;所述加工助剂为开口剂和/或润滑剂。The processing aid is an antiblocking agent and/or a lubricant.
- 一种如权利要求1至11中任一项所述的焊带载体膜的制备方法,其中:将各层原料分别混合、造粒,然后经多层共挤流延成膜,通过UV或电子束照射预交联层,所述电子束辐照剂量为10kGy~25kGy。A method for preparing a ribbon carrier film as claimed in any one of claims 1 to 11, wherein: the raw materials of each layer are mixed and granulated respectively, and then formed into a film through multi-layer co-extrusion casting, and the film is formed by UV or electron The beam irradiates the pre-crosslinked layer, and the electron beam irradiation dose is 10kGy-25kGy.
- 一种焊带复合体,其中:包括权利要求1至11中任一项所述的焊带载体膜,以及粘附在所述的焊带载体膜上的焊带。A solder ribbon composite, comprising: the solder ribbon carrier film according to any one of claims 1 to 11, and a solder ribbon adhered to the solder ribbon carrier film.
- 一种如权利要求13所述的焊带复合体的制备方法,其中:控制温度在80℃~170℃下,通过压合将所述的焊带粘附在如权利要求1至11中任一项所述的载体膜上,控制压合时间为0.1s~1s,且相邻两个所述的载体膜分别位于所述的焊带的两侧且间隔分布。A method for preparing a solder ribbon composite as claimed in claim 13, wherein: the temperature is controlled at 80°C to 170°C, and the solder ribbon is adhered to any one of claims 1 to 11 by pressing. On the carrier film described in Item 1, the pressing time is controlled to be 0.1 s to 1 s, and two adjacent carrier films are respectively located on both sides of the welding strip and distributed at intervals.
- 一种电池片复合体,其中:包括电池片、与所述的电池片接触的焊带、 以及用于将所述的焊带固定在所述的电池片上的载体膜,所述的载体膜为权利要求1至11中任一项所述的焊带载体膜。A battery sheet composite, wherein: comprising a battery sheet, a welding ribbon in contact with the battery sheet, and a carrier film for fixing the welding ribbon on the battery sheet, the carrier film is The ribbon carrier film according to any one of claims 1 to 11.
- 一种如权利要求15所述的焊带复合体的制备方法,其包括:A method for preparing a ribbon composite as claimed in claim 15, comprising:对粘附有所述载体膜的焊带进行裁切以形成焊带复合体单元,所述的焊带复合体单元由所述的焊带以及两个所述的载体膜组成,cutting the ribbon attached to the carrier film to form a ribbon complex unit, the ribbon composite unit is composed of the ribbon and two carrier films,控制温度在100℃~300℃下,将所述的焊带复合体单元压合在电池片的表面,控制压合时间为0.2s~3s。The temperature is controlled at 100° C. to 300° C., and the ribbon composite unit is pressed on the surface of the battery sheet, and the pressing time is controlled to be 0.2s to 3s.
- 一种如权利要求1至11中任一项所述的焊带载体膜,或权利要求13所述的焊带复合体、或权利要求15所述的电池片复合体在光伏组件中的应用。An application of the ribbon carrier film as claimed in any one of claims 1 to 11, or the ribbon composite as claimed in claim 13, or the cell sheet composite as claimed in claim 15 in a photovoltaic module.
- 一种光伏组件的制备方法,其中:所述光伏组件的制备方法具体为:A method for preparing a photovoltaic module, wherein: the method for preparing a photovoltaic module is specifically:将背板,下层胶膜,权利要求15所述电池片复合体,上层胶膜,玻璃依次层叠,置于层压机中层压得到单玻太阳能组件,The back sheet, the lower layer of adhesive film, the battery sheet complex described in claim 15, the upper layer of adhesive film, and the glass are sequentially laminated, placed in a laminator and laminated to obtain a single-glass solar module,或将下层玻璃,下层胶膜,权利要求15所述电池片复合体,上层胶膜,上层玻璃依次层叠,置于层压机中层压得到双玻太阳能组件,Or the lower layer of glass, the lower layer of adhesive film, the battery chip complex described in claim 15, the upper layer of adhesive film, and the upper layer of glass are sequentially laminated, placed in a laminator and laminated to obtain a double-glass solar module,所述层压的条件为:层压温度120℃~180℃,抽真空时间3~8min,层压时间8~20min;The lamination conditions are: lamination temperature 120°C-180°C, vacuum time 3-8min, lamination time 8-20min;当所述的载体膜上设置有离型膜时,所述的离型膜在层压之前去除。When the carrier film is provided with a release film, the release film is removed before lamination.
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CN118516059A (en) * | 2024-07-25 | 2024-08-20 | 浙江长阳科技有限公司 | Preparation method of packaging adhesive film special for heterojunction battery assembly and packaging adhesive film |
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Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103013364A (en) * | 2013-01-08 | 2013-04-03 | 李民 | Multilayer coextruded surface-layer pre-crosslinked adhesive film |
JP2013145801A (en) * | 2012-01-13 | 2013-07-25 | Keiwa Inc | Protection film for solar battery module, and solar battery module using the same |
CN203721748U (en) * | 2014-03-03 | 2014-07-16 | 上海海优威电子技术有限公司 | Solar energy photovoltaic battery assembly structure |
CN105646995A (en) * | 2016-02-04 | 2016-06-08 | 杭州福斯特光伏材料股份有限公司 | Snail track resistant packaging adhesive film and preparation method thereof |
US20160340560A1 (en) * | 2014-02-24 | 2016-11-24 | Shanghai Hiuv New Materials Co., Ltd. | Radiation pre-crosslinked polyolefin film and preparation method, and related encapsulation method and encapsulation assembly |
CN107502209A (en) * | 2017-09-21 | 2017-12-22 | 杭州福斯特应用材料股份有限公司 | The packaging adhesive film for solar cell and preparation method of a kind of three-decker |
CN111689699A (en) * | 2019-03-13 | 2020-09-22 | 上海海优威新材料股份有限公司 | Laminated glass with clear pattern |
CN112225981A (en) * | 2020-09-18 | 2021-01-15 | 苏州赛伍应用技术股份有限公司 | Solder strip carrier film and preparation method and application thereof |
CN112226169A (en) * | 2020-09-25 | 2021-01-15 | 苏州赛伍应用技术股份有限公司 | Solder strip carrier film, preparation method thereof, solder strip composite body and battery piece composite body |
CN112322227A (en) * | 2020-10-21 | 2021-02-05 | 苏州赛伍应用技术股份有限公司 | Packaging adhesive film with selective pre-crosslinked multilayer structure and preparation method and application thereof |
CN113563812A (en) * | 2021-06-03 | 2021-10-29 | 苏州赛伍应用技术股份有限公司 | Solder strip carrier film, preparation method and application thereof |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110713803B (en) * | 2018-07-12 | 2021-10-08 | 杭州福斯特应用材料股份有限公司 | Thermoplastic photovoltaic module packaging adhesive film and preparation method thereof |
CN112226177B (en) * | 2020-09-18 | 2022-08-16 | 苏州赛伍应用技术股份有限公司 | Solder strip carrier film, solder strip composite and battery piece composite |
-
2021
- 2021-06-03 CN CN202110620404.0A patent/CN113563812A/en active Pending
-
2022
- 2022-03-18 WO PCT/CN2022/081620 patent/WO2022252755A1/en active Application Filing
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013145801A (en) * | 2012-01-13 | 2013-07-25 | Keiwa Inc | Protection film for solar battery module, and solar battery module using the same |
CN103013364A (en) * | 2013-01-08 | 2013-04-03 | 李民 | Multilayer coextruded surface-layer pre-crosslinked adhesive film |
US20160340560A1 (en) * | 2014-02-24 | 2016-11-24 | Shanghai Hiuv New Materials Co., Ltd. | Radiation pre-crosslinked polyolefin film and preparation method, and related encapsulation method and encapsulation assembly |
CN203721748U (en) * | 2014-03-03 | 2014-07-16 | 上海海优威电子技术有限公司 | Solar energy photovoltaic battery assembly structure |
CN105646995A (en) * | 2016-02-04 | 2016-06-08 | 杭州福斯特光伏材料股份有限公司 | Snail track resistant packaging adhesive film and preparation method thereof |
CN107502209A (en) * | 2017-09-21 | 2017-12-22 | 杭州福斯特应用材料股份有限公司 | The packaging adhesive film for solar cell and preparation method of a kind of three-decker |
CN111689699A (en) * | 2019-03-13 | 2020-09-22 | 上海海优威新材料股份有限公司 | Laminated glass with clear pattern |
CN112225981A (en) * | 2020-09-18 | 2021-01-15 | 苏州赛伍应用技术股份有限公司 | Solder strip carrier film and preparation method and application thereof |
CN112226169A (en) * | 2020-09-25 | 2021-01-15 | 苏州赛伍应用技术股份有限公司 | Solder strip carrier film, preparation method thereof, solder strip composite body and battery piece composite body |
CN112322227A (en) * | 2020-10-21 | 2021-02-05 | 苏州赛伍应用技术股份有限公司 | Packaging adhesive film with selective pre-crosslinked multilayer structure and preparation method and application thereof |
CN113563812A (en) * | 2021-06-03 | 2021-10-29 | 苏州赛伍应用技术股份有限公司 | Solder strip carrier film, preparation method and application thereof |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN118516059A (en) * | 2024-07-25 | 2024-08-20 | 浙江长阳科技有限公司 | Preparation method of packaging adhesive film special for heterojunction battery assembly and packaging adhesive film |
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