CN114921187A - Packaging adhesive film and preparation method and application thereof - Google Patents
Packaging adhesive film and preparation method and application thereof Download PDFInfo
- Publication number
- CN114921187A CN114921187A CN202210743089.5A CN202210743089A CN114921187A CN 114921187 A CN114921187 A CN 114921187A CN 202210743089 A CN202210743089 A CN 202210743089A CN 114921187 A CN114921187 A CN 114921187A
- Authority
- CN
- China
- Prior art keywords
- adhesive film
- packaging adhesive
- film layer
- packaging
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002313 adhesive film Substances 0.000 title claims abstract description 264
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 264
- 238000002360 preparation method Methods 0.000 title claims abstract description 56
- 239000002994 raw material Substances 0.000 claims abstract description 53
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 24
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 10
- 239000011347 resin Substances 0.000 claims abstract description 10
- NOKSMMGULAYSTD-UHFFFAOYSA-N [SiH4].N=C=O Chemical group [SiH4].N=C=O NOKSMMGULAYSTD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000011159 matrix material Substances 0.000 claims abstract description 8
- 239000010410 layer Substances 0.000 claims description 181
- 238000004132 cross linking Methods 0.000 claims description 57
- 239000000203 mixture Substances 0.000 claims description 36
- 230000005855 radiation Effects 0.000 claims description 24
- 238000002156 mixing Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 17
- 229920000642 polymer Polymers 0.000 claims description 17
- 239000005057 Hexamethylene diisocyanate Substances 0.000 claims description 15
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 claims description 15
- 239000004611 light stabiliser Substances 0.000 claims description 15
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 11
- -1 tert-amyl peroxy (2-ethylhexyl) carbonate Chemical compound 0.000 claims description 10
- DRPJWBIHQOHLND-UHFFFAOYSA-N 4-[dimethoxy(methyl)silyl]oxybutyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)OCCCCOC(=O)C(C)=C DRPJWBIHQOHLND-UHFFFAOYSA-N 0.000 claims description 9
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 claims description 9
- 239000002356 single layer Substances 0.000 claims description 8
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 7
- 239000003963 antioxidant agent Substances 0.000 claims description 6
- GTELLNMUWNJXMQ-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO GTELLNMUWNJXMQ-UHFFFAOYSA-N 0.000 claims description 5
- FMGBDYLOANULLW-UHFFFAOYSA-N 3-isocyanatopropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCN=C=O FMGBDYLOANULLW-UHFFFAOYSA-N 0.000 claims description 4
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 claims description 3
- 230000003078 antioxidant effect Effects 0.000 claims description 3
- 238000005266 casting Methods 0.000 claims description 3
- 239000003112 inhibitor Substances 0.000 claims description 3
- 238000006116 polymerization reaction Methods 0.000 claims description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 2
- QWOVEJBDMKHZQK-UHFFFAOYSA-N 1,3,5-tris(3-trimethoxysilylpropyl)-1,3,5-triazinane-2,4,6-trione Chemical compound CO[Si](OC)(OC)CCCN1C(=O)N(CCC[Si](OC)(OC)OC)C(=O)N(CCC[Si](OC)(OC)OC)C1=O QWOVEJBDMKHZQK-UHFFFAOYSA-N 0.000 claims description 2
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 claims description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 claims description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 claims description 2
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 claims description 2
- UMHKOAYRTRADAT-UHFFFAOYSA-N [hydroxy(octoxy)phosphoryl] octyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OP(O)(=O)OCCCCCCCC UMHKOAYRTRADAT-UHFFFAOYSA-N 0.000 claims description 2
- 238000010894 electron beam technology Methods 0.000 claims description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 claims description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000012752 auxiliary agent Substances 0.000 claims 1
- DKTKWMAFBNGURD-UHFFFAOYSA-N tert-butyl 2-ethylhexyl carbonate Chemical compound CCCCC(CC)COC(=O)OC(C)(C)C DKTKWMAFBNGURD-UHFFFAOYSA-N 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 14
- 238000003466 welding Methods 0.000 description 28
- 230000000052 comparative effect Effects 0.000 description 20
- 239000005038 ethylene vinyl acetate Substances 0.000 description 15
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 15
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 14
- 238000010030 laminating Methods 0.000 description 10
- 238000003475 lamination Methods 0.000 description 10
- 239000006096 absorbing agent Substances 0.000 description 8
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 8
- 239000012964 benzotriazole Substances 0.000 description 8
- FIYMNUNPPYABMU-UHFFFAOYSA-N 2-benzyl-5-chloro-1h-indole Chemical compound C=1C2=CC(Cl)=CC=C2NC=1CC1=CC=CC=C1 FIYMNUNPPYABMU-UHFFFAOYSA-N 0.000 description 6
- 239000002250 absorbent Substances 0.000 description 6
- 230000002745 absorbent Effects 0.000 description 6
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 5
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 4
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- HTCRKQHJUYBQTK-UHFFFAOYSA-N 2-ethylhexyl 2-methylbutan-2-yloxy carbonate Chemical compound CCCCC(CC)COC(=O)OOC(C)(C)CC HTCRKQHJUYBQTK-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229920006280 packaging film Polymers 0.000 description 2
- 239000012785 packaging film Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229940097156 peroxyl Drugs 0.000 description 2
- 239000002530 phenolic antioxidant Substances 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 2
- MPJPKEMZYOAIRN-UHFFFAOYSA-N 1,3,5-tris(2-methylprop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound CC(=C)CN1C(=O)N(CC(C)=C)C(=O)N(CC(C)=C)C1=O MPJPKEMZYOAIRN-UHFFFAOYSA-N 0.000 description 1
- JZODKRWQWUWGCD-UHFFFAOYSA-N 2,5-di-tert-butylbenzene-1,4-diol Chemical compound CC(C)(C)C1=CC(O)=C(C(C)(C)C)C=C1O JZODKRWQWUWGCD-UHFFFAOYSA-N 0.000 description 1
- 229940044119 2-tert-butylhydroquinone Drugs 0.000 description 1
- STEYNUVPFMIUOY-UHFFFAOYSA-N 4-Hydroxy-1-(2-hydroxyethyl)-2,2,6,6-tetramethylpiperidine Chemical compound CC1(C)CC(O)CC(C)(C)N1CCO STEYNUVPFMIUOY-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008360 acrylonitriles Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 235000012438 extruded product Nutrition 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- AZQGFVRDZTUHBU-UHFFFAOYSA-N isocyanic acid;triethoxy(propyl)silane Chemical compound N=C=O.CCC[Si](OCC)(OCC)OCC AZQGFVRDZTUHBU-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
- C09J123/0815—Copolymers of ethene with aliphatic 1-olefins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/33—Applications of adhesives in processes or use of adhesives in the form of films or foils for batteries or fuel cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a packaging adhesive film and a preparation method and application thereof. The packaging adhesive film comprises a first packaging adhesive film layer; the preparation raw materials of the first packaging adhesive film layer comprise the following components in parts by weight: 100 parts of matrix resin, 0.4-1 part of main cross-linking agent, 0.4-1 part of auxiliary cross-linking agent, 0.1-0.4 part of first silane coupling agent, 0.1-0.4 part of second silane coupling agent and 0.2-0.6 part of tackifier; the second silane coupling agent is an isocyanate silane coupling agent. The packaging adhesive film provided by the invention has better mechanical property and better packaging effect, and is suitable for being used as a packaging adhesive film of a heterojunction battery.
Description
Technical Field
The invention belongs to the technical field of photovoltaic modules, and particularly relates to a packaging adhesive film, and a preparation method and application thereof.
Background
The solar photovoltaic cell is easily influenced by natural factors such as heat, light, oxygen, moisture and the like in the use process, so that the photoelectric conversion efficiency is reduced and even loses efficacy. The packaging adhesive film is used as an important component in a photovoltaic module and mainly used for protecting a solar cell and enabling the cell to be tightly attached to materials such as glass and a back plate to form a whole. The packaging material plays roles of bonding protection and the like in the assembly, more and more battery pieces are used in the photovoltaic assembly, the performances of various battery pieces are different, and the requirements on packaging adhesive films are different; for example, the P-type battery piece needs a glue film with high PID resistance; the heterojunction cell with the circular welding strip needs an adhesive film with a non-slip surface, and the CIGS cell is heat-resistant and needs low-temperature lamination. With the increasing requirements on packaging films, packaging films with different properties have attracted people's attention.
CN110066609A discloses a heat dissipation packaging adhesive film for solar cell and a preparation method thereof. The locking preparation method comprises the following steps: uniformly mixing the adhesive film matrix, the inorganic filler, the crosslinking agent, the ultraviolet absorbent and the light stabilizer, then extruding and granulating by using a double-screw extruder, then extruding the prepared granules by using a single-screw extruder, and extruding and molding the extruded product by using a grinding head to obtain the adhesive film; the mass ratio of the adhesive film matrix to the inorganic filler to the crosslinking agent to the ultraviolet absorbent to the light stabilizer is 800-1200: 5-100: 0.1-5: 0.01-2: 0.01-5; the adhesive film matrix is electrically insulating resin, and the inorganic filler is any one or more of graphene, carbon nano tubes, carbon fibers, boron nitride, titanium dioxide and barium sulfate. The packaging adhesive film provided by the technical scheme has good thermal conductivity and high reflectivity.
CN213520008U discloses an encapsulating adhesive film for black photovoltaic module and a black photovoltaic module. The packaging adhesive film comprises a black packaging adhesive film layer and a white packaging adhesive film layer which are sequentially arranged on the back surface of the battery piece from inside to outside, the black packaging adhesive film layer is used for reflecting light penetrating through the gap of the battery piece, the white packaging adhesive film layer is used for reflecting light penetrating through the black packaging adhesive film layer, and the thickness of the black packaging adhesive film layer is smaller than or equal to that of the white packaging adhesive film layer. This technical scheme has improved the reflectivity through setting up black encapsulation glued membrane layer and white encapsulation glued membrane layer, and then has promoted black photovoltaic module's generating efficiency.
In recent years, with the rapid development of the photovoltaic industry, the domestic and foreign markets also put forward higher and higher requirements on the conversion efficiency and the product performance of the solar cell and the photovoltaic module, which also promotes manufacturers in the industry to actively research novel cell and module structures and related processes. Heterojunction (HJT) cells have the advantages of low light attenuation, low temperature coefficient, etc., and can reduce energy consumption and thermal damage of silicon substrates, which has become an important direction for the development of future high-efficiency cells.
The heterojunction cell mainly forms a heterojunction by depositing intrinsic alpha-Si and H layers on the surfaces of two sides of a silicon substrate and then respectively depositing a p-type alpha-Si and n-type alpha-Si H layers; and preparing corresponding transparent conductive layers on the surfaces of the amorphous silicon film layers on the two sides of the silicon substrate, and then adopting low-temperature silver paste to perform screen printing and curing to form a surface metal electrode. Due to the particularity of the structure of the heterojunction battery, the battery pieces need to be connected, low-temperature welding is used as a new welding method, and the advantages of low welding temperature, conductive paste saving and the like are widely concerned. In the low-temperature welding technology, a welding strip needs to be spot-welded on a battery piece in advance, after a packaging adhesive film is laid, a component enters a laminating machine for laminating, a low-temperature coating on the surface of the welding strip after laminating is melted, so that the welding strip is completely bonded with the battery piece, however, the welding point has a height, the packaging adhesive film is partially melted in the laminating process, and the melted packaging adhesive film flows into the welding point, so that the welding failure between the welding strip and the battery piece can be caused.
Therefore, how to provide a package adhesive film for a heterojunction battery that can meet the technical requirements of low-temperature soldering has become a technical problem to be solved.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a packaging adhesive film, a preparation method and application thereof. According to the invention, through the design of the preparation raw materials of the first packaging adhesive film layer, the prepared packaging adhesive film has a good packaging effect on the heterojunction battery.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the present invention provides a packaging adhesive film for a heterojunction battery, the packaging adhesive film comprising a first packaging adhesive film layer;
the preparation raw materials of the first packaging adhesive film layer comprise the following components in parts by weight:
100 parts of matrix resin, 0.4-1 part of main cross-linking agent, 0.4-1 part of auxiliary cross-linking agent, 0.1-0.4 part of first silane coupling agent, 0.1-0.4 part of second silane coupling agent, 0.2-0.6 part of tackifier and 0.1-0.5 part of light stabilizer;
the second silane coupling agent is an isocyanate silane coupling agent.
When the package adhesive film is used for packaging and laminating the heterojunction battery assembly, the packaging adhesive film is partially melted due to the high laminating temperature, and the melted package adhesive film close to one side of the battery piece flows into the welding point, so that the welding failure between the welding strip and the battery piece is caused.
According to the invention, through the design of the preparation raw material of the first packaging adhesive film layer and the matched use of the isocyanate silane coupling agent and the tackifier, the prepared packaging adhesive film has higher peeling force and better packaging effect, and the problem of welding failure between a welding strip and a battery piece caused by the fact that the packaging adhesive film close to one side of the battery piece flows into a welding point in the lamination process can be effectively avoided.
In the present invention, the weight part of the primary crosslinking agent may be 0.4 part, 0.5 part, 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, or the like.
The weight portion of the assistant crosslinking agent can be 0.4 portion, 0.5 portion, 1 portion, 1.5 portions, 2 portions, 2.5 portions, 3 portions, 3.5 portions or 4 portions, etc.
The weight portion of the first silane coupling agent may be 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, or the like.
The weight part of the second silane coupling agent may be 0.1 part, 0.2 part, 0.3 part, 0.4 part, or the like.
The tackifier may be present in an amount of 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, or the like.
The following is a preferred technical solution of the present invention, but not a limitation to the technical solution provided by the present invention, and the object and advantageous effects of the present invention can be better achieved and achieved by the following preferred technical solution.
In a preferred embodiment of the present invention, the matrix resin is selected from EVA (ethylene-vinyl acetate copolymer) and/or POE (polyethylene octene co-elastomer).
Preferably, the primary crosslinking agent is selected from any one of tert-butyl peroxy-2-ethylhexyl carbonate (TBEC), tert-amyl peroxy-2-ethylhexyl carbonate (TAEC), dicumyl peroxide (DCP) and 2, 5-dimethyl-2, 5-di (tert-butylperoxy) hexane or a combination of at least two thereof.
Preferably, the auxiliary crosslinking agent is selected from any one of triallyl isocyanurate (TAIC), trimethyolprooyl isocyanate (TMAIC), trimethylolpropane triacrylate (TMPTA), trimethylolpropane trimethacrylate (TMPTA), pentaerythritol triacrylate (PETA), ethoxylated trimethylolpropane triacrylate (ethoxylated TMPTA), and propoxylated trimethylolpropane triacrylate (propoxylated TMPTA), or a combination of at least two thereof.
In a preferred embodiment of the present invention, the first silane coupling agent is any one or a combination of at least two selected from the group consisting of 3-methacryloxypropylmethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, vinyltrimethoxysilane, 3-aminopropyltriethoxysilane, vinyltrimethoxysilane, triisostearoyltitanate and isopropyltris (dioctylpyrophosphate) titanate.
Preferably, the second silane coupling agent is selected from any one of or a combination of at least two of isocyanatopropyltrimethoxysilane, isocyanatopropyltriethoxysilane, and 1,3, 5-tris (trimethoxysilylpropyl) isocyanurate.
In a preferred embodiment of the present invention, the tackifier is selected from any one of toluene diisocyanate, isophorone diisocyanate polymer, diphenylmethane diisocyanate polymer, hexamethylene diisocyanate, and hexamethylene diisocyanate polymer, or a combination of at least two thereof.
Preferably, the raw materials for preparing the first encapsulating adhesive film layer further include 0.1-0.5 part of a light stabilizer, for example, 0.1 part, 0.2 part, 0.3 part, 0.4 part or 0.5 part.
Preferably, the light stabilizer is selected from any one of bis (2,2,6, 6-tetramethyl-4-piperidyl) sebacate (light stabilizer 770), polysuccinic acid (4-hydroxy-2, 2,6, 6-tetramethyl-1-piperidineethanol) ester, poly- { [6- [ (1,1,3, 3-tetramethylbutyl) -imino ] -1,3, 5-triazine-2, 4-diyl ] [2- (2,2,6, 6-tetramethylpiperidyl) -aza ] -hexylene- [4- (2,2,6, 6-tetramethylpiperidyl) -amino ] } or a combination of at least two stations.
In a preferred embodiment of the present invention, the raw material for preparing the first encapsulating film layer further includes 0.05 to 0.5 parts of a UV absorbing additive, which may be, for example, 0.05 part, 0.1 part, 0.2 part, 0.3 part, 0.4 part, or 0.5 part.
Preferably, the UV absorption aid is selected from any one of benzophenone ultraviolet absorbers, benzotriazole ultraviolet absorbers, salicylate ultraviolet absorbers, substituted acrylonitrile ultraviolet absorbers and triazine ultraviolet absorbers or a combination of at least two of the benzophenone ultraviolet absorbers, the benzotriazole ultraviolet absorbers and the triazine ultraviolet absorbers.
Preferably, the preparation raw material of the first packaging adhesive film layer further comprises 0.01-0.1 part of antioxidant, for example, 0.01 part, 0.02 part, 0.04 part, 0.06 part, 0.08 part or 0.1 part, and the like.
Preferably, the antioxidant is selected from any one of or a combination of at least two of phenol antioxidants (BHT), phosphite antioxidants and hindered amine antioxidants.
Preferably, the raw material for preparing the first encapsulating adhesive film layer further comprises 0.01-0.05 part of polymerization inhibitor, for example, 0.01 part, 0.02 part, 0.03 part, 0.04 part or 0.05 part.
Preferably, the polymerization inhibitor is selected from any one of hydroquinone, p-hydroxyanisole (MEHQ), 2, 6-di-tert-butyl-p-cresol, 2, 5-di-tert-butyl-hydroquinone, 2-tert-butyl-hydroquinone, p-benzoquinone and methyl hydroquinone or a combination of at least two of the above.
In a preferred embodiment of the present invention, the thickness of the sealant film is 300 to 800 μm, for example, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm, or 800 μm.
Preferably, the packaging adhesive film comprises a single-layer packaging adhesive film and a multi-layer packaging adhesive film.
Preferably, the single-layer packaging adhesive film consists of a first packaging adhesive film layer.
Preferably, the multilayer packaging adhesive film comprises at least two packaging adhesive film layers.
Preferably, the multilayer packaging adhesive film comprises a first packaging adhesive film layer, and the thickness of the first packaging adhesive film layer is 100-700 μm, for example, 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, or 700 μm.
Preferably, the packaging adhesive film comprises a single-layer structure, a double-layer structure and a three-layer structure;
the packaging adhesive film is of a single-layer structure, and consists of a first packaging adhesive film layer, and the thickness of the packaging adhesive film is the thickness of the first packaging adhesive film layer; if the packaging adhesive film is of a double-layer structure, the packaging adhesive film is composed of a first packaging adhesive film layer and a second packaging adhesive film layer which are attached to each other, and the thicknesses of the first packaging adhesive film layer and the second packaging adhesive film layer are respectively and independently selected from 100-700 mu m; if the packaging adhesive film is of a three-layer structure, the packaging adhesive film is composed of a first packaging adhesive film layer, a third packaging adhesive film layer and a fourth packaging adhesive film layer which are sequentially overlapped, and the thicknesses of the first packaging adhesive film layer, the third packaging adhesive film layer and the fourth packaging adhesive film layer are respectively and independently selected from 100-400 mu m. If the packaging adhesive film has a double-layer structure or a three-layer structure, one side of the first packaging adhesive film layer away from other packaging adhesive film layers (the second packaging adhesive film layer or the fourth packaging adhesive film layer) is attached to the battery piece.
According to the invention, by controlling the thickness of each layer in the double-layer structure and the three-layer structure within a specific range, the prepared packaging adhesive film has better mechanical property and packaging effect, and has better bonding effect with a battery piece. If the thickness of the first packaging adhesive film layer is too small, the prepared packaging adhesive film has poor mechanical property, poor adhesion with a battery piece and low stripping force; if the thickness of other layers is too small, the prepared packaging adhesive film has a poor packaging effect.
It should be noted that, if the packaging adhesive film includes at least two packaging adhesive film layers, the raw materials for preparing other packaging adhesive film layers except the first packaging adhesive film layer are not limited in any way, and the raw material components for preparing the packaging adhesive film in the field are all applicable, or the raw material components similar to the first packaging adhesive film layer of the present invention may be selected.
Meanwhile, the first packaging adhesive film layer has higher pre-crosslinking degree in the subsequent irradiation crosslinking process by designing the preparation raw materials of the first packaging adhesive film layer and further using the main crosslinking agent and the auxiliary crosslinking agent, so that the prepared packaging adhesive film is not easy to flow and fill gaps formed by welding points in the laminating process, the welding strip can be completely adhered to the battery piece, and a better welding effect is achieved. If the packaging adhesive film comprises at least two packaging adhesive film layers, in order to obtain a better packaging effect, the second packaging adhesive film layer, the third packaging adhesive film layer and the fourth packaging adhesive film layer have a smaller pre-crosslinking degree, so that if the preparation raw materials of the second packaging adhesive film layer, the third packaging adhesive film layer and the fourth packaging adhesive film layer adopt the preparation raw materials similar to the first packaging adhesive film layer, the dosage of the auxiliary crosslinking agent can be properly adjusted to be smaller.
In a second aspect, the present invention provides a method for preparing the packaging adhesive film according to the first aspect, wherein the method comprises the following steps:
(1) uniformly mixing the preparation raw materials of the first packaging adhesive film layer to obtain a mixture A;
(2) extruding and casting the mixture A, and performing radiation crosslinking to obtain the packaging adhesive film;
alternatively, the preparation method comprises the following steps:
(A) uniformly mixing the preparation raw materials of the first packaging adhesive film layer to obtain a mixture A;
respectively and uniformly mixing the preparation raw materials of other layers of the packaging adhesive film to obtain a mixture B;
(B) and co-extruding and molding the mixture A and the mixture B, and then performing radiation crosslinking to obtain the packaging adhesive film.
If the packaging adhesive film is a single-layer packaging adhesive film, the packaging adhesive film is prepared through the steps (1) and (2); if the packaging adhesive film comprises at least two packaging adhesive film layers, the packaging adhesive film is prepared through the steps (A) and (B), and further, if the packaging adhesive film is of a double-layer structure and consists of a first packaging adhesive film layer and a second packaging adhesive film layer which are attached to each other, the step (A) is replaced by the step (A'):
(A') uniformly mixing the preparation raw materials of the first packaging adhesive film layer to obtain a mixture A;
and uniformly mixing the preparation raw materials of the second packaging adhesive film layer to obtain a mixture B.
If the packaging adhesive film has a three-layer structure, the preparation method comprises the following steps:
(A') uniformly mixing the preparation raw materials of the first packaging adhesive film layer to obtain a mixture A;
uniformly mixing the preparation raw materials of the third packaging adhesive film layer to obtain a mixture B1;
and uniformly mixing the preparation raw materials of the fourth packaging adhesive film layer to obtain a mixture B2.
(B') co-extruding the mixture A, the mixture B1 and the mixture B2 for forming, and then performing radiation crosslinking to obtain the packaging adhesive film.
According to the invention, through radiation crosslinking, the first packaging adhesive film layer can have a certain pre-crosslinking degree, so that the melting temperature is higher, the mobility is poorer, and the first packaging adhesive film layer is used as a packaging adhesive film of a heterojunction battery, is not easy to flow and fills gaps formed at welding points in the laminating process, so that a welding strip can be completely adhered to a battery piece, and a better welding effect is obtained.
As a preferred technical scheme of the invention, the radiation crosslinking in the step (2) and the step (B) is electron beam radiation crosslinking.
Preferably, the radiation crosslinking amount is 10 to 60KGY, for example, 10KGY, 15KGY, 20KGY, 25KGY, 30KGY, 35KGY, 40KGY, 45KGY, 50KGY, 55KGY, 60KGY, or the like.
In a preferred embodiment of the present invention, after the radiation crosslinking, the degree of pre-crosslinking of the first encapsulant film layer is 25 to 50%, for example, 25%, 27%, 30%, 33%, 35%, 37%, 40%, 42%, 46%, or 50%.
The packaging adhesive film is of a double-layer structure, and after radiation crosslinking, the pre-crosslinking degree of the second packaging adhesive film layer is 5-20%, for example, 5%, 7%, 10%, 12%, 14%, 16%, 18% or 20%.
The packaging adhesive film is of a three-layer structure, and after radiation crosslinking, the pre-crosslinking degrees of the third packaging adhesive film layer and the fourth packaging adhesive film layer are respectively and independently selected from 5-20%, for example, 5%, 7%, 10%, 12%, 14%, 16%, 18%, 20% or the like.
In a third aspect, the present invention provides a use of the adhesive film for packaging a heterojunction battery as described in the first aspect.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, through the design of the packaging adhesive film structure and the design of the preparation raw material of the first packaging adhesive film layer, the isocyanate silane coupling agent and the tackifier are further matched for use, and the thickness of each layer is controlled within a specific range, so that the packaging adhesive film which has good cohesiveness with a battery piece and good packaging effect is prepared, the stripping force is 40.9-53.4N/cm, no shadow is generated through an EL test after lamination, and the packaging adhesive film provided by the invention can not be filled with a welding point between a welding strip and the battery piece in the lamination process and is suitable for being used as the packaging adhesive film of a heterojunction battery.
Detailed Description
For the purpose of facilitating an understanding of the present invention, the present invention will now be described by way of examples. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
Some of the components in the examples and comparative examples were sourced as follows:
EVA: hanhua, EV 282;
POE resin: dow, PV 8660;
hexamethylene diisocyanate polymer: wanhua chemical, HT-100.
Example 1
The embodiment provides a single-layer packaging adhesive film, which consists of a first packaging adhesive film layer, wherein the first packaging adhesive film layer is prepared from the following raw materials in parts by weight:
100 parts of EVA (ethylene-vinyl acetate), 0.6 part of tert-butyl peroxy-2-ethylhexyl carbonate, 0.4 part of triallyl isocyanurate, 0.6 part of ethoxylated trimethylolpropane triacrylate, 0.2 part of 3-methacryloxypropylmethyltrimethoxysilane, 0.2 part of isocyanatopropyltriethoxysilane, 0.4 part of hexamethylene diisocyanate polymer, 7700.1 parts of light stabilizer and 0.15 part of benzotriazole ultraviolet absorber.
The preparation method of the packaging adhesive film comprises the following steps:
(1) uniformly mixing the preparation raw materials of the first packaging adhesive film layer to obtain a mixture A;
(2) and extruding and casting the mixture A, and performing radiation crosslinking to obtain a packaging adhesive film with the thickness of 600 mu m, wherein the dosage of the radiation crosslinking is 15KGY, and the pre-crosslinking degree of the packaging adhesive film is 28.9%.
Example 2
The embodiment provides a packaging adhesive film with a double-layer structure, which comprises a first packaging adhesive film layer and a second packaging adhesive film layer which are attached to each other;
the preparation raw materials of the first packaging adhesive film layer comprise the following components:
100 parts of EVA (ethylene-vinyl acetate), 0.6 part of tert-butyl peroxy-2-ethylhexyl carbonate, 0.4 part of triallyl isocyanurate, 0.6 part of ethoxylated trimethylolpropane triacrylate, 0.2 part of 3-methacryloxypropylmethyltrimethoxysilane, 0.2 part of isocyanatopropyltriethoxysilane, 0.4 part of hexamethylene diisocyanate polymer, 7700.1 parts of light stabilizer and 0.15 part of benzotriazole ultraviolet absorbent;
the preparation raw materials of the second packaging adhesive film layer comprise the following components:
100 parts of EVA (ethylene vinyl acetate), 0.7 part of tert-butyl 2-ethylhexyl carbonate peroxide, 0.4 part of triallyl isocyanurate, 0.2 part of 3-methacryloxypropyl methyltrimethoxysilane, 0.2 part of isocyanatopropyl triethoxysilane, 0.4 part of hexamethylene diisocyanate polymer, 7700.2 parts of light stabilizer, 0.05 part of phenolic antioxidant (BHT), 0.01 part of p-hydroxyanisole and 0.15 part of benzotriazole ultraviolet absorbent.
The preparation method of the packaging adhesive film comprises the following steps:
(A') uniformly mixing the preparation raw materials of the first packaging adhesive film layer to obtain a mixture A;
and uniformly mixing the preparation raw materials of the second packaging adhesive film layer to obtain a mixture B.
(B) And performing double-layer co-extrusion molding on the mixture A and the mixture B, and performing radiation crosslinking to obtain the packaging adhesive film, wherein the radiation crosslinking amount is 20KGY, the pre-crosslinking degree of the first packaging adhesive film layer is 43.5%, the thickness is 300 mu m, the pre-crosslinking degree of the second packaging adhesive film layer is 17.2%, and the thickness is 300 mu m.
Example 3
The embodiment provides a packaging adhesive film with a double-layer structure, which comprises a first packaging adhesive film layer and a second packaging adhesive film layer which are attached to each other;
the preparation raw materials of the first packaging adhesive film layer comprise the following components:
100 parts of EVA (ethylene-vinyl acetate), 0.6 part of tert-butyl 2-ethylhexyl carbonate peroxide, 0.4 part of triallyl isocyanurate, 0.6 part of ethoxylated trimethylolpropane triacrylate, 0.2 part of 3-methacryloxypropylmethyltrimethoxysilane, 0.2 part of isocyanatopropyltrimethoxysilane, 0.4 part of hexamethylene diisocyanate polymer, 7700.1 parts of light stabilizer and 0.15 part of benzotriazole ultraviolet absorbent;
the preparation raw materials of the second packaging adhesive film layer comprise the following components:
100 parts of POE resin, 0.85 part of peroxyl (2-ethylhexyl) carbonate tert-amyl ester, 0.6 part of triallyl isocyanurate, 0.2 part of 3-methacryloxypropylmethyltrimethoxysilane, 0.2 part of isocyanatopropyltrimethoxysilane, 0.2 part of hexamethylene diisocyanate polymer, 7700.1 parts of light stabilizer, 0.01 part of p-hydroxyanisole and 0.15 part of UV absorption aid.
The preparation method of the packaging adhesive film comprises the following steps:
(A) uniformly mixing the preparation raw materials of the first packaging adhesive film layer to obtain a mixture A;
and uniformly mixing the preparation raw materials of the second packaging adhesive film layer to obtain a mixture B.
(B) And performing double-layer co-extrusion molding on the mixture A and the mixture B, and performing radiation crosslinking to obtain the packaging adhesive film, wherein the measurement of the radiation crosslinking is 25KGY, the pre-crosslinking degree of the first packaging adhesive film layer is 47.1%, the thickness of the first packaging adhesive film layer is 300 mu m, the pre-crosslinking degree of the second packaging adhesive film layer is 9.7%, and the thickness of the second packaging adhesive film layer is 300 mu m.
Example 4
The embodiment provides a packaging adhesive film with a three-layer structure, which comprises a first packaging adhesive film layer, a third packaging adhesive film layer and a fourth packaging adhesive film layer which are sequentially stacked;
the preparation raw materials of the first packaging adhesive film layer comprise the following components:
100 parts of EVA (ethylene-vinyl acetate), 0.6 part of tert-butyl peroxy-2-ethylhexyl carbonate, 0.4 part of triallyl isocyanurate, 0.6 part of ethoxylated trimethylolpropane triacrylate, 0.2 part of 3-methacryloxypropylmethyltrimethoxysilane, 0.2 part of isocyanatopropyltriethoxysilane, 0.4 part of hexamethylene diisocyanate polymer, 7700.1 parts of light stabilizer and 0.15 part of benzotriazole ultraviolet absorbent;
the preparation raw materials of the third packaging adhesive film layer comprise the following components:
100 parts of POE resin, 0.85 part of peroxyl (2-ethylhexyl) carbonate tert-amyl ester, 0.85 part of triallyl isocyanurate, 0.1 part of first silane coupling agent, 0.1 part of isocyanatopropyl triethoxysilane, 0.2 part of hexamethylene diisocyanate polymer and 7700.1 parts of light stabilizer;
the preparation raw materials of the fourth packaging adhesive film layer comprise the following components:
100 parts of EVA (ethylene-vinyl acetate), 0.7 part of tert-butyl peroxy-2-ethylhexyl carbonate, 0.4 part of triallyl isocyanurate, 0.2 part of 3-methacryloxypropylmethyltrimethoxysilane, 0.2 part of isocyanatopropyltriethoxysilane, 0.4 part of hexamethylene diisocyanate polymer, 7700.2 parts of light stabilizer, 0.05 part of phenolic antioxidant (BHT), 0.01 part of p-hydroxyanisole and 0.15 part of benzotriazole ultraviolet absorber.
The preparation method of the packaging adhesive film comprises the following steps:
(A') uniformly mixing the preparation raw materials of the first packaging adhesive film layer to obtain a mixture A;
uniformly mixing the preparation raw materials of the third packaging adhesive film layer to obtain a mixture B1;
and uniformly mixing the preparation raw materials of the fourth packaging adhesive film layer to obtain a mixture B2.
(B') co-extruding and molding the mixture A, the mixture B1 and the mixture B2, and then performing radiation crosslinking to obtain the packaging adhesive film, wherein the dosage of the radiation crosslinking is 20KGY, the degree of pre-crosslinking of the first packaging adhesive film layer is 44.5%, the thickness of the first packaging adhesive film layer is 200 micrometers, the degree of pre-crosslinking of the third packaging adhesive film layer is 8.1%, the thickness of the third packaging adhesive film layer is 200 micrometers, the degree of pre-crosslinking of the fourth packaging adhesive film layer is 15.2%, and the thickness of the fourth packaging adhesive film layer is 200 micrometers.
Example 5
The comparative example provides a packaging adhesive film with a double-layer structure, and only differs from the embodiment 2 in that the thickness of the first packaging adhesive film layer is 100 mu m, and the pre-crosslinking degree is 43.3%; the thickness of the second packaging adhesive film layer is 500 mu m, and the pre-crosslinking degree is 13.2%; other conditions were the same as in example 2.
Example 6
The comparative example provides a packaging adhesive film with a double-layer structure, and only differs from the embodiment 2 in that the thickness of the first packaging adhesive film layer is 500 microns, and the pre-crosslinking degree is 45.9%; the thickness of the second packaging adhesive film layer is 100 mu m, and the pre-crosslinking degree is 15.5 percent; other conditions were the same as in example 2.
Comparative example 1
The comparative example provides a packaging adhesive film with a double-layer structure, and only differs from the embodiment 2 in that the thickness of the first packaging adhesive film layer is 50 μm, and the pre-crosslinking degree is 43.3%; the thickness of the second packaging adhesive film layer is 550 mu m, and the pre-crosslinking degree is 13.2%; other conditions were the same as in example 2.
Comparative example 2
The comparative example provides a packaging adhesive film with a double-layer structure, and only differs from the embodiment 3 in that the thickness of the first packaging adhesive film layer is 50 μm, and the pre-crosslinking degree is 46.8%; the thickness of the second packaging adhesive film layer is 550 mu m, and the pre-crosslinking degree is 9.5%; other conditions were the same as in example 3.
Comparative example 3
The comparative example provides a packaging adhesive film with a double-layer structure, and only differs from the embodiment 2 in that the thickness of the first packaging adhesive film layer is 550 mu m, and the pre-crosslinking degree is 44.7%; the thickness of the second packaging adhesive film layer is 50 mu m, and the pre-crosslinking degree is 13.9%; other conditions were the same as in example 2.
Comparative example 4
The comparative example provides a packaging adhesive film with a three-layer structure, and the difference from the example 4 is only that the thickness of the first packaging adhesive film layer is 50 μm, and the pre-crosslinking degree is 43.8%; the thickness of the third packaging adhesive film layer is 500 mu m, and the pre-crosslinking degree is 8.7 percent; the thickness of the fourth packaging adhesive film layer is 50 mu m, and the pre-crosslinking degree is 14.2%; other conditions were the same as in example 4.
Comparative example 5
The comparative example provides a packaging adhesive film with a double-layer structure, and the difference from the example 2 is that no isocyanatopropyltriethoxysilane is added in the raw materials for preparing the first packaging adhesive film layer, the weight part of the hexamethylene diisocyanate polymer is 0.6 part, the pre-crosslinking degree of the first packaging adhesive film layer is 44.4%, and the pre-crosslinking degree of the second packaging adhesive film layer is 16.3%; other conditions were the same as in example 2.
Comparative example 6
The comparative example provides a packaging adhesive film with a double-layer structure, and the difference from the example 2 is that no hexamethylene diisocyanate polymer is added in the preparation raw materials of the first packaging adhesive film layer, the weight part of the isocyanate propyl triethoxysilane is 0.6 part, the pre-crosslinking degree of the first packaging adhesive film layer is 46.8%, and the pre-crosslinking degree of the second packaging adhesive film layer is 16.9%; other conditions were the same as in example 2.
The performance of the packaging adhesive films provided in the above examples and comparative examples was tested, and the test method was as follows:
peeling force: GB/T29848-2018;
EL (electroluminescence) test after lamination: IEC 61215& 61730;
TC200, post EL: IEC 61215& 61730;
assembly lamination conditions: the packaging adhesive films provided by the above examples and comparative examples are used for packaging heterojunction batteries, vacuumizing is carried out at 145 ℃ for 5min, then lamination is carried out for 10min, and appearance of the heterojunction battery assembly obtained after lamination is observed;
used heterojunction battery piece is hua cheng 166 battery piece, efficiency: 24.0H _ SL, level: A0.
TABLE 1
The content in table 1 shows that the packaging adhesive film which has good adhesion with the battery piece and good packaging effect is prepared by designing the structure of the packaging adhesive film and the preparation raw material of the first packaging adhesive film layer and further by using the isocyanate silane coupling agent and the tackifier in a matching manner and controlling the thickness of each layer within a specific range, the peeling force of the packaging adhesive film is 40.9-53.4N/cm, and no shadow is generated after lamination through an EL test. The packaging adhesive film provided by the invention can not fill the welding points between the welding strips and the battery pieces in the laminating process, and is suitable for being used as the packaging adhesive film of the heterojunction battery.
Compared with the examples 2-4, if the thickness of the first packaging adhesive film layer is too small (comparative examples 1-2 and 4), the prepared packaging adhesive film has poor mechanical property, poor adhesion with the battery piece, small stripping force and obvious shadow in an EL test after lamination; compared with example 2, if the thickness of the second packaging adhesive film layer is too small (comparative example 3), bubbles are generated on the bonding surface of the packaging adhesive film and the glass after the prepared packaging adhesive film is used for laminating, and the packaging effect is poor.
Compared with example 2, if the raw materials for preparing the first packaging adhesive film do not contain the isocyanate silane coupling agent or the tackifier (comparative examples 5-6), the prepared packaging adhesive film has poor adhesion with the battery piece and small stripping force.
In summary, the packaging adhesive film with good adhesion to the battery cell and good packaging effect is prepared by designing the structure of the packaging adhesive film and the preparation raw materials of the first packaging adhesive film layer, and further by using the isocyanate silane coupling agent and the tackifier in a matching manner and controlling the thickness of each layer within a specific range.
The applicant states that the present invention is illustrated by the detailed process flow of the present invention through the above examples, but the present invention is not limited to the above detailed process flow, that is, it does not mean that the present invention must rely on the above detailed process flow to be implemented. It should be understood by those skilled in the art that any modification of the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
Claims (10)
1. A packaging adhesive film is characterized by comprising a first packaging adhesive film layer;
the preparation raw materials of the first packaging adhesive film layer comprise the following components in parts by weight:
100 parts of matrix resin, 0.4-1 part of main cross-linking agent, 0.4-1 part of auxiliary cross-linking agent, 0.1-0.4 part of first silane coupling agent, 0.1-0.4 part of second silane coupling agent and 0.2-0.6 part of tackifier;
the second silane coupling agent is an isocyanate silane coupling agent.
2. The packaging adhesive film according to claim 1, wherein the matrix resin is selected from EVA and/or POE resins;
preferably, the primary crosslinking agent is selected from any one of tert-butyl 2-ethylhexyl carbonate, tert-amyl peroxy (2-ethylhexyl) carbonate, dicumyl peroxide and 2, 5-dimethyl-2, 5-di (tert-butylperoxy) hexane or a combination of at least two thereof;
preferably, the auxiliary crosslinking agent is selected from any one of triallyl isocyanurate, trimethyallylisocyanate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, ethoxylated trimethylolpropane triacrylate and propoxylated trimethylolpropane triacrylate, or a combination of at least two thereof.
3. The packaging adhesive film according to claim 1 or 2, wherein the first silane coupling agent is selected from any one of 3-methacryloxypropylmethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, vinyltrimethoxysilane, 3-aminopropyltriethoxysilane, vinyltrimethoxysilane, triisostearoylisopropyl titanate, and isopropyltris (dioctylpyrophosphate) titanate, or a combination of at least two thereof;
preferably, the second silane coupling agent is selected from any one of or a combination of at least two of isocyanatopropyltrimethoxysilane, isocyanatopropyltriethoxysilane, and 1,3, 5-tris (trimethoxysilylpropyl) isocyanurate.
4. The packaging adhesive film according to any one of claims 1 to 3, wherein the tackifier is selected from any one or a combination of at least two of toluene diisocyanate, isophorone diisocyanate polymer, diphenylmethane diisocyanate polymer, hexamethylene diisocyanate, and hexamethylene diisocyanate polymer;
preferably, the raw materials for preparing the first packaging adhesive film layer further comprise 0.1-0.5 part of light stabilizer.
5. The packaging adhesive film according to any one of claims 1 to 4, wherein the raw material for preparing the first packaging adhesive film layer further comprises 0.05 to 0.5 parts of UV absorption auxiliary agent;
preferably, the preparation raw material of the first packaging adhesive film layer further comprises 0.01-0.1 part of antioxidant;
preferably, the preparation raw material of the first packaging adhesive film layer further comprises 0.01-0.05 part of polymerization inhibitor.
6. The packaging adhesive film according to any one of claims 1-5, wherein the thickness of the packaging adhesive film is 300-800 μm;
preferably, the packaging adhesive film comprises a single-layer packaging adhesive film and a multi-layer packaging adhesive film;
preferably, the single-layer packaging adhesive film consists of a first packaging adhesive film layer;
preferably, the multi-layer packaging adhesive film comprises at least two packaging adhesive film layers;
preferably, the multi-layer packaging adhesive film comprises a first packaging adhesive film layer, and the thickness of the first packaging adhesive film layer is 100-700 μm.
7. A method for preparing the packaging adhesive film according to any one of claims 1 to 6, comprising the steps of:
(1) uniformly mixing the preparation raw materials of the first packaging adhesive film layer to obtain a mixture A;
(2) extruding and casting the mixture A, and then performing radiation crosslinking to obtain the packaging adhesive film;
alternatively, the preparation method comprises the following steps:
(A) uniformly mixing the preparation raw materials of the first packaging adhesive film layer to obtain a mixture A;
respectively and uniformly mixing the preparation raw materials of other layers of the packaging adhesive film to obtain a mixture B;
(B) and co-extruding and molding the mixture A and the mixture B, and then performing radiation crosslinking to obtain the packaging adhesive film.
8. The method of claim 7, wherein the radiation crosslinking in step (2) and step (B) is electron beam radiation crosslinking;
preferably, the dosage of the radiation crosslinking is 10-60 KGY.
9. The preparation method according to claim 7 or 8, wherein after the radiation crosslinking, the pre-crosslinking degree of the first packaging adhesive film layer is 25-50%.
10. Use of an encapsulating adhesive film according to any one of claims 1 to 6 in a heterojunction battery package.
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| CN116102987A (en) * | 2023-04-13 | 2023-05-12 | 合肥华晟光伏科技有限公司 | Solar cell module packaging adhesive film, preparation method thereof and solar cell module |
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| CN116102987A (en) * | 2023-04-13 | 2023-05-12 | 合肥华晟光伏科技有限公司 | Solar cell module packaging adhesive film, preparation method thereof and solar cell module |
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