CN113563812A - Solder strip carrier film, preparation method and application thereof - Google Patents
Solder strip carrier film, preparation method and application thereof Download PDFInfo
- Publication number
- CN113563812A CN113563812A CN202110620404.0A CN202110620404A CN113563812A CN 113563812 A CN113563812 A CN 113563812A CN 202110620404 A CN202110620404 A CN 202110620404A CN 113563812 A CN113563812 A CN 113563812A
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- Prior art keywords
- layer
- carrier film
- raw materials
- crosslinking
- total mass
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 80
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 238000004132 cross linking Methods 0.000 claims abstract description 81
- 229920005989 resin Polymers 0.000 claims abstract description 62
- 239000011347 resin Substances 0.000 claims abstract description 62
- 238000003466 welding Methods 0.000 claims abstract description 34
- 238000010030 laminating Methods 0.000 claims abstract description 23
- 239000005038 ethylene vinyl acetate Substances 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 17
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims abstract description 17
- 239000011159 matrix material Substances 0.000 claims abstract description 16
- 229920006124 polyolefin elastomer Polymers 0.000 claims abstract description 16
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 223
- 239000002994 raw material Substances 0.000 claims description 110
- 230000007704 transition Effects 0.000 claims description 52
- 239000003999 initiator Substances 0.000 claims description 41
- 239000007822 coupling agent Substances 0.000 claims description 35
- 239000002131 composite material Substances 0.000 claims description 27
- 239000003431 cross linking reagent Substances 0.000 claims description 27
- 230000003712 anti-aging effect Effects 0.000 claims description 24
- 239000006057 Non-nutritive feed additive Substances 0.000 claims description 20
- 239000002313 adhesive film Substances 0.000 claims description 17
- 239000011521 glass Substances 0.000 claims description 16
- 238000003825 pressing Methods 0.000 claims description 15
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 13
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 8
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 8
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 239000003963 antioxidant agent Substances 0.000 claims description 8
- 230000003078 antioxidant effect Effects 0.000 claims description 8
- 239000003208 petroleum Substances 0.000 claims description 8
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 8
- 239000000654 additive Substances 0.000 claims description 7
- 230000000996 additive effect Effects 0.000 claims description 7
- 238000003475 lamination Methods 0.000 claims description 7
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 claims description 6
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 claims description 6
- 238000010894 electron beam technology Methods 0.000 claims description 6
- 239000004611 light stabiliser Substances 0.000 claims description 6
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 5
- 238000005266 casting Methods 0.000 claims description 5
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 claims description 4
- GTELLNMUWNJXMQ-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO GTELLNMUWNJXMQ-UHFFFAOYSA-N 0.000 claims description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 4
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 4
- 150000004645 aluminates Chemical class 0.000 claims description 4
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N benzoic acid ethyl ester Natural products CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 claims description 4
- 239000012948 isocyanate Substances 0.000 claims description 4
- 150000002513 isocyanates Chemical class 0.000 claims description 4
- 239000000314 lubricant Substances 0.000 claims description 4
- 229920001568 phenolic resin Polymers 0.000 claims description 4
- 239000005011 phenolic resin Substances 0.000 claims description 4
- 150000003505 terpenes Chemical class 0.000 claims description 4
- 235000007586 terpenes Nutrition 0.000 claims description 4
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- USWPWIPUYQMVDO-UHFFFAOYSA-N methanol propane prop-2-enoic acid Chemical compound CO.CO.CO.CCC.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C USWPWIPUYQMVDO-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 17
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- 239000010408 film Substances 0.000 description 87
- 239000012752 auxiliary agent Substances 0.000 description 26
- 210000004027 cell Anatomy 0.000 description 12
- 238000012545 processing Methods 0.000 description 10
- 229920000139 polyethylene terephthalate Polymers 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 6
- 239000005022 packaging material Substances 0.000 description 4
- -1 1,1,3, 3-tetramethylbutyl Chemical group 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000010248 power generation Methods 0.000 description 3
- MPJPKEMZYOAIRN-UHFFFAOYSA-N 1,3,5-tris(2-methylprop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound CC(=C)CN1C(=O)N(CC(C)=C)C(=O)N(CC(C)=C)C1=O MPJPKEMZYOAIRN-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000005340 laminated glass Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- JDLQSLMTBGPZLW-UHFFFAOYSA-N 1-(1-hydroxyethyl)-2,2,6,6-tetramethylpiperidin-4-ol Chemical compound CC(O)N1C(C)(C)CC(O)CC1(C)C JDLQSLMTBGPZLW-UHFFFAOYSA-N 0.000 description 1
- DRPJWBIHQOHLND-UHFFFAOYSA-N 4-[dimethoxy(methyl)silyl]oxybutyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)OCCCCOC(=O)C(C)=C DRPJWBIHQOHLND-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 1
- 210000003850 cellular structure Anatomy 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
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- 229910021645 metal ion Inorganic materials 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 150000002978 peroxides Chemical group 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/33—Applications of adhesives in processes or use of adhesives in the form of films or foils for batteries or fuel cells
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/046—Presence of homo or copolymers of ethene in the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to a solder strip carrier film, a preparation method and application thereof, wherein the solder strip carrier film comprises a pre-crosslinking layer and a bonding layer, the pre-crosslinking layer is the same as matrix resin of the bonding layer, the matrix resin is one or more of ethylene-vinyl acetate copolymer, polyolefin elastomer, ethylene acrylic acid copolymer or ethyl methacrylate, the pre-crosslinking degree of the pre-crosslinking layer is 30-80%, the pre-crosslinking degree of the bonding layer is less than or equal to 1%, and the crosslinking degree of the bonding layer is 50-90% after the solder strip carrier film is prepared into a photovoltaic module. The welding strip carrier film can be fused into a whole after being laminated, the risk of delamination failure is avoided, the failure risk caused by hot spot effect in the use process of the assembly can be avoided, the transmittance of the whole material is high, the haze is low, the bonding layer and the battery piece are subjected to chemical reaction in the laminating process, the bonding force between the carrier film and the battery piece is increased, and the long-term reliability of the product is further improved.
Description
Technical Field
The invention particularly relates to a solder strip carrier film, a preparation method and application thereof.
Background
The current development trend of the photovoltaic industry component is to change from a 3-main grid to a 4-main grid and a 5-main grid, and recently to the current multi-main grid. In recent years, a main grid-free component is proposed, which can save the consumption of silver, reduce the shielding of grid lines on battery pieces and improve the power generation efficiency, such as an electrode interconnection structure of a Thai Longji leaf CN201720080886.4IBC battery and a CN 201710054876.8N-type double-sided battery interconnection process; shenzhen Laplacian energy technology Limited CN201720292907.9 does not have main grid solar cell component.
At present, the lead of the battery piece without the main grid component is fixed on the battery piece in two ways: 1 is a metallized solar cell piece by electroplating process, such as Suzhou solar well new energy Co., Ltd, CN201820959124.6 a no main grid double-sided electroplating; 2. the lead is carried by an adhesive film and is fixed on a battery piece during lamination, such as CN201510933299.0 (Huanghe hydroelectric photovoltaic industry Co., Ltd.) which is a preparation method of a main grid-free solder strip for a solar battery.
In the conventional bonding film product with a multilayer structure at the present stage, a crystalline polymer with a higher melting point is generally selected as a supporting layer, so that the bonding with equipment is avoided in the bonding process of the product and a battery piece, and the deviation of the position of a welding strip in the laminating process is prevented; the bonding layer is made of a material with a lower melting point so as to ensure the bonding property; the supporting layer material and the packaging material in the scheme are different in type, have larger performance difference and poorer adhesion with the packaging material, and the modulus difference between the upper layer material and the lower layer material is larger, and the thermal expansion coefficient has certain difference, so that the welding strip is possibly pulled due to the change of the use environment in the use process of a product, the welding strip is separated from an electrode, and the power generation efficiency is influenced; meanwhile, the light transmittance of the crystalline supporting layer is relatively low, the haze is relatively large, and the power generation efficiency is also influenced to a certain extent.
Disclosure of Invention
The invention aims to provide a solder strip carrier film which is not easy to delaminate, good in temperature resistance, high in transmittance and low in haze.
In order to achieve the purpose, the invention adopts the technical scheme that:
the invention provides a welding strip carrier film, which comprises a pre-crosslinking layer and a bonding layer, wherein the pre-crosslinking layer is the same as the matrix resin of the bonding layer, the matrix resin is one or more of ethylene-vinyl acetate copolymer (EVA), polyolefin elastomer (POE), ethylene acrylic acid copolymer (EAA) or Ethyl Methacrylate (EMA), the pre-crosslinking degree of the pre-crosslinking layer is 30-80%, and the pre-crosslinking degree of the bonding layer is less than or equal to 1%;
and after the solder strip carrier film is prepared into a photovoltaic module, the crosslinking degree of the bonding layer is 50-90%.
In the invention, the pre-crosslinking refers to the crosslinking degree of each layer in the obtained welding strip carrier film finished product.
In the invention, the crosslinking degree refers to the crosslinking degree of the bonding layer in the finished product of the photovoltaic module obtained by preparing the photovoltaic module by using the solder strip carrier film finished product.
Preferably, the degree of pre-crosslinking of the tie layer is zero, i.e. the tie layer is not crosslinked in the finished solder carrier film.
Further preferably, the degree of pre-crosslinking of the pre-crosslinked layer is 30% to 60%, more preferably 40% to 50%.
More preferably, the degree of crosslinking of the adhesive layer is 65% to 90%, more preferably 75% to 90%.
Preferably, the addition amount of the matrix resin in the pre-crosslinked layer is 60% to 98%, more preferably 70% to 98%, and still more preferably 80% to 95% of the total mass of the raw materials of the pre-crosslinked layer.
Preferably, the raw material of the pre-crosslinking layer further comprises a crosslinking agent with the addition amount of 1-8% of the total mass of the raw material formula of the pre-crosslinking layer, more preferably 2-6%, and even more preferably 3-5%.
Preferably, the raw material of the pre-crosslinking layer further comprises an ultraviolet initiator with the addition amount of 0.1-5% of the total mass of the raw material formula of the pre-crosslinking layer, more preferably 1-5%, and even more preferably 1-3%.
Preferably, the addition amount of the matrix resin in the bonding layer is 50-98% of the total mass of the raw materials of the bonding layer, more preferably 60-98%, and even more preferably 70-95%.
Preferably, the raw materials of the bonding layer further comprise a cross-linking agent with the addition amount of 1-8% of the total mass of the raw materials of the bonding layer, more preferably 1-6%, and even more preferably 2-4%.
Preferably, the raw material of the bonding layer further comprises a thermal initiator with an addition amount of 0.1-5% of the total mass of the raw material of the bonding layer, more preferably 1-5%, and even more preferably 1-3%.
The bonding layer is not crosslinked by high-temperature pressing at normal processing temperature (usually 80-130 ℃) within short time (within 1 min), and the bonding layer is crosslinked by high-temperature pressing at the laminating temperature of usually more than 130 ℃ for more than 5 min.
In some embodiments, the raw materials of the bonding layer further comprise an ultraviolet light initiator, and the addition amount of the ultraviolet light additive is less than or equal to 0.1 percent based on 100 percent of the total mass of the raw materials of the bonding layer. The raw materials of the bonding layer can comprise a small amount of ultraviolet initiator, so long as the pre-crosslinking degree of the bonding layer is ensured to be less than or equal to 1%.
More preferably, the raw material of the pre-crosslinked layer further comprises an anti-aging agent with an addition amount of 0.1-3% of the total mass of the raw material formula of the pre-crosslinked layer, still more preferably 0.5-3%, and more preferably 0.8-2%.
More preferably, the raw material of the bonding layer further comprises a coupling agent with an addition amount of 0.1-2% of the total mass of the raw material of the bonding layer, still more preferably 0.1-1%, and even more preferably 0.3-0.8%.
More preferably, the material of the adhesive layer further includes an age resistor in an amount of 0.1 to 3% by mass, still more preferably 0.1 to 1% by mass, and even more preferably 0.3 to 0.8% by mass, based on the total mass of the material of the adhesive layer.
More preferably, the raw material of the pre-crosslinked layer further comprises a tackifying resin with an addition amount of 0.1-20% of the total mass of the raw material formula of the pre-crosslinked layer, still more preferably 5-15%, and more preferably 8-12%.
More preferably, the raw material of the pre-crosslinked layer further comprises a coupling agent with an addition amount of 0.005-2% of the total mass of the raw material formula of the pre-crosslinked layer, still more preferably 0.01-1%, and more preferably 0.1-0.5%.
More preferably, the raw material of the pre-crosslinked layer further comprises a processing aid with an addition amount of 0.001% -1% of the total mass of the raw material formula of the pre-crosslinked layer, still more preferably 0.05% -1%, and more preferably 0.1% -1%.
More preferably, the raw material of the pre-crosslinked layer further comprises an anti-PID auxiliary agent with the addition amount of 0.005-5% of the total mass of the raw material formula of the pre-crosslinked layer, and still more preferably 0.1-5%, and more preferably 0.1-1.5%.
More preferably, the raw material of the adhesive layer further includes a tackifying resin added in an amount of 0.1% to 30% by mass of the total mass of the raw material of the adhesive layer, still more preferably 10% to 30%, and even more preferably 15% to 25%.
More preferably, the raw material of the bonding layer further comprises a processing aid added in an amount of 0.001% to 1% of the total mass of the raw material of the bonding layer, still more preferably 0.1% to 1%, and even more preferably 0.3% to 0.8%.
More preferably, the raw material of the bonding layer further comprises an anti-PID additive in an amount of 0.005% to 5% by weight, still more preferably 0.1% to 5% by weight, and even more preferably 1% to 5% by weight, based on the total mass of the raw material of the bonding layer.
Further preferably, the crosslinking agent is one or more of triallyl isocyanurate (TAIC), trimethyolyl isocyanate (TMAIC), trimethylolpropane triacrylate (TMPTA), trimethylolpropane trimethacrylate (TMPTMA), or pentaerythritol triacrylate (PETA).
Further preferably, the ultraviolet light initiator is one or more of trimethylolpropane triacrylate, 2-trimethylolpropane tetraacrylate and 4- (dimethylamino) ethyl benzoate.
Further preferably, the thermal initiator is a peroxide initiator.
Still more preferably, the thermal initiator is one or more of ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, dicumyl peroxide (DCP), 2, 5-dimethyl-2, 5-di (t-butylperoxy) hexane.
Further preferably, the tackifying resin is one or more of rosin, hydrogenated rosin, petroleum resin, hydrogenated petroleum resin, phenolic resin, or terpene resin.
Further preferably, the coupling agent is one or more of a silane coupling agent, a titanate coupling agent, or an aluminate coupling agent.
Still more preferably, the coupling agent is one or more selected from the group consisting of 3-methacryloxypropylmethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, vinyltrimethoxysilane, 3-aminopropyltriethoxysilane, vinyltrimethoxysilane, triisostearoylisopropyl titanate, isopropyltris (dioctylpyroxyphosphate) titanate.
Further preferably, the aging inhibitor comprises one or more of an antioxidant, a light stabilizer, or an ultraviolet absorber.
More preferably, the antioxidant is one or more of a phenol antioxidant, a phosphite antioxidant and a hindered amine antioxidant.
Still more preferably, the light stabilizer is one or more selected from bis (2,2,6, 6-tetramethyl-4-piperidyl) sebacate (light stabilizer 770), polysuccinic acid (4-hydroxy-2, 2,6, 6-tetramethyl-1-piperidylethanol) ester, poly- { [6- [ (1,1,3, 3-tetramethylbutyl) -imino ] -1,3, 5-triazine-2, 4-diyl ] [2- (2,2,6, 6-tetramethylpiperidyl) -azo ] -hexylidene- [4- (2,2,6, 6-tetramethylpiperidyl) -amino ].
Further preferably, the processing aid is a mouth-opening agent and/or a lubricant.
Even more preferably, the anti-PID additive is a metal ion scavenger.
Preferably, the thickness of the pre-crosslinking layer is 20 to 200 μm, more preferably 20 to 100 μm, even more preferably 20 to 80 μm, and even more preferably 20 to 50 μm.
Preferably, the thickness of the bonding layer is 20 to 200 μm, more preferably 20 to 100 μm, even more preferably 20 to 80 μm, and even more preferably 20 to 50 μm.
Preferably, a release film is further arranged on the outer side of the pre-crosslinking layer.
Further preferably, the release film is a conventional release film, such as PE, PP, PET, etc., which may be colored or colorless.
Preferably, the solder strip carrier film further comprises one or more transition layers arranged between the pre-crosslinking layer and the bonding layer, the matrix resin comprises one or more of ethylene-vinyl acetate copolymer, polyolefin elastomer, ethylene acrylic acid copolymer or ethyl methacrylate, the transition layer is crosslinking type or non-crosslinking type, when the transition layer is crosslinking type, the pre-crosslinking degree of the transition layer is less than or equal to 1%, and after the solder strip carrier film is prepared into a photovoltaic module, the crosslinking degree of the transition layer is 1-90%.
In the invention, the pre-crosslinking degree of the transition layer also refers to the crosslinking degree of the transition layer in the obtained solder strip carrier film finished product.
More preferably, the raw material of the transition layer comprises a matrix resin with an addition amount of 50-98% of the total mass of the raw material of the transition layer, still more preferably 80-98%, and still more preferably 85-95%.
More preferably, the raw material of the transition layer comprises a crosslinking agent with an addition amount of 1-8% of the total mass of the raw material of the transition layer, still more preferably 1-8%, and even more preferably 2-5%.
More preferably, the raw material of the transition layer comprises a thermal initiator with the addition amount of 0.1-5% of the total mass of the raw materials of the transition layer, more preferably 0.1-5%, and even more preferably 0.5-3%.
In some embodiments, the raw material of the transition layer further comprises an ultraviolet light initiator, the addition amount of the ultraviolet light additive is less than or equal to 0.1% based on 100% of the total mass of the raw material of the transition layer, and a small amount of the ultraviolet light initiator can be also included in the raw material of the transition layer as long as the pre-crosslinking degree of the transition layer is less than or equal to 1%.
Further preferably, the ultraviolet light initiator is one or more of trimethylolpropane triacrylate, 2-trimethylolpropane tetraacrylate and 4- (dimethylamino) ethyl benzoate.
Still more preferably, the raw material of the transition layer further includes a tackifying resin added in an amount of 0.1% to 30% by weight, still more preferably 10% to 30% by weight, and even more preferably 15% to 25% by weight, based on the total mass of the raw material of the transition layer.
Still more preferably, the raw material of the transition layer comprises a coupling agent with an addition amount of 0.1-2% of the total mass of the raw material of the transition layer, still more preferably 0.1-1%, and even more preferably 0.5-1%.
Still more preferably, the raw material of the transition layer includes an age resistor in an amount of 0.1 to 3% by mass, more preferably 0.1 to 3% by mass, and still more preferably 0.1 to 2% by mass, based on the total mass of the raw material of the transition layer.
Still more preferably, the raw material of the transition layer further comprises a processing aid added in an amount of 0.001% to 1% of the total mass of the raw material of the transition layer, more preferably 0.1% to 1%, and even more preferably 0.1% to 0.6%.
Still more preferably, the raw material of the transition layer further comprises an anti-PID additive in an amount of 0.005% to 5%, more preferably 0.1% to 5%, and even more preferably 0.1% to 3% of the total mass of the raw material of the transition layer.
The matrix resin of the transition layer is one or more of ethylene-vinyl acetate copolymer, polyolefin elastomer, ethylene acrylic acid copolymer or ethyl methacrylate. In the present invention, the transition layer and the adhesive layer have a similar basic composition, and the matrix resin is the same or different.
Further preferably, the thermal initiator is one or more of ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, dicumyl peroxide, 2, 5-dimethyl-2, 5-di (t-butylperoxy) hexane.
Further preferably, the crosslinking agent is one or more of triallyl isocyanurate (TAIC), trimethyolprooyl isocyanate (TMAIC), trimethylolpropane triacrylate (TMPTA), trimethylolpropane trimethacrylate (TMPTMA), or pentaerythritol triacrylate (PETA).
Further preferably, the tackifying resin is one or more of rosin, hydrogenated rosin, petroleum resin, hydrogenated petroleum resin, phenolic resin, or terpene resin.
Further preferably, the coupling agent is one or more of a silane coupling agent, a titanate coupling agent, or an aluminate coupling agent.
Further preferably, the aging inhibitor is one or more of an antioxidant, a light stabilizer, or an ultraviolet absorber.
Further preferably, the processing aid is a mouth-opening agent and/or a lubricant.
The second aspect of the invention also provides a preparation method of the solder strip carrier film, which comprises the steps of respectively mixing and granulating raw materials of each layer, then forming a film by multilayer coextrusion casting, and irradiating the pre-crosslinking layer by UV or electron beams.
Preferably, the irradiation dose of the electron beam is 10-25 kGy.
The third aspect of the invention also provides a solder strip composite body, which comprises the solder strip carrier film and a solder strip adhered to the solder strip carrier film.
Preferably, at least 30% of the volume of the solder strip is exposed out of the carrier film of the solder strip, so that the solder strip can be well contacted with the battery piece, and the bonding performance of the solder strip and the carrier film is ensured.
More preferably, 30% to 70% of the volume of the solder ribbon is exposed from the solder ribbon carrier film, and even more preferably 40% to 60% of the volume of the solder ribbon is exposed from the solder ribbon carrier film.
The fourth aspect of the present invention further provides a method for preparing the solder strip composite, which specifically comprises: and controlling the temperature to be 80-170 ℃, adhering the welding strip on the carrier film by pressing, controlling the pressing time to be 0.1-1 s, and respectively positioning two adjacent carrier films at two sides of the welding strip and distributing at intervals.
Preferably, the temperature is controlled to be 80 ℃ to 150 ℃, and more preferably 80 ℃ to 130 ℃.
The fifth aspect of the invention also provides a battery piece composite body, which comprises a battery piece, a welding strip in contact with the battery piece, and a carrier film for fixing the welding strip on the battery piece, wherein the carrier film is the welding strip carrier film.
Preferably, the welding strips and the carrier film are respectively arranged on two surfaces of the battery piece.
More preferably, the cell is one of a crystalline silicon cell, an amorphous silicon cell, a chemical solar cell, a multi-compound thin film solar cell, and the like.
The sixth aspect of the present invention further provides a method for preparing a battery sheet complex, which specifically includes:
cutting the welding strip adhered with the carrier film to form a welding strip composite unit, wherein the welding strip composite unit consists of the welding strip and the two carrier films,
and (3) pressing the welding strip composite unit on the surface of the battery piece at the temperature of 100-300 ℃, wherein the pressing time is controlled to be 0.2-3 s.
Preferably, the temperature is controlled to be 100 ℃ to 200 ℃, more preferably 100 ℃ to 150 ℃, and still more preferably 100 ℃ to 130 ℃.
The seventh aspect of the invention also provides a use of the solder strip carrier film, the solder strip composite body, or the cell sheet assembly in a photovoltaic module.
The eighth aspect of the present invention further provides a method for manufacturing a photovoltaic module, which specifically comprises:
sequentially laminating a back plate, a lower-layer adhesive film, the battery piece composite body, an upper-layer adhesive film and glass, placing the laminated body, the upper-layer adhesive film and the glass in a laminating machine to obtain the single-glass solar module,
or the lower layer glass, the lower layer adhesive film, the cell sheet composite body, the upper layer adhesive film and the upper layer glass are sequentially laminated and are placed in a laminating machine to be laminated to obtain the double-glass solar component,
the lamination conditions were: the laminating temperature is 120-180 ℃, the vacuumizing time is 3-8 min, and the laminating time is 8-20 min; the lamination temperature is more preferably 130 to 180 ℃, and still more preferably 135 to 150 ℃.
Preferably, when a release film is provided on the carrier film, the release film is removed prior to lamination.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
according to the invention, through optimization of raw material formulas of each layer of the carrier film, the compatibility between two adjacent layers is good, and the carrier film can be fused into a whole after lamination without the risk of layering failure; the failure risk caused by temperature change in the using process is avoided; each layer is made of an amorphous material, has good compatibility with the packaging material, large transmittance of the whole material, low haze and the same material as the packaging adhesive film, can reduce the thickness of the packaging material as appropriate and further reduce the assembly cost; meanwhile, the pre-crosslinking layer and the bonding layer are both in a crosslinking structure, so that the failure risk caused by a hot spot effect in the use process of the assembly is avoided; the bonding layer and the battery piece can generate chemical reaction in the laminating process, so that the bonding force between the carrier film and the battery piece is increased, and the long-term reliability of the product is further improved.
Drawings
FIG. 1 is a schematic diagram of a structure of a solder strip carrier film of the present invention;
FIG. 2 is a second schematic diagram of the solder strip carrier film of the present invention;
FIG. 3 is a third schematic view of the solder strip carrier film of the present invention;
wherein, 1, a release film; 2. a pre-crosslinked layer; 3. a bonding layer; 4. and a transition layer.
Detailed Description
The present invention will be further described with reference to specific examples, but the present invention is not limited to the following examples. The implementation conditions adopted in the embodiments can be further adjusted according to different requirements of specific use, and the implementation conditions not mentioned are conventional conditions in the industry.
The parts of the raw materials in the following examples and comparative examples are parts by mass.
The raw materials in the following examples and comparative examples were obtained by commercial or home-made methods.
POE resin: dow 8450;
EVA resin: hanhua 282;
tackifying resin: desoxydized chemical PR 12603;
ultraviolet initiator: BASF 1173;
thermal initiator: akema
TAEC；
A crosslinking agent: sartomer SR454 NS;
coupling agent: anhui silicon treasure GX 171;
anti-aging auxiliary agent: cyanote B877;
processing aid: 3M FX 5920;
anti-PID aids were made by the prior art methods.
Backing plate: race Cynagard 205A;
an upper adhesive film layer: cybright T11;
a lower adhesive film layer: cybright C11.
Example 1
A solder strip carrier film having the structure shown in figure 1:
and (3) release film layer: PET material with thickness of 25 μm
The formula of the raw materials of the pre-crosslinking layer is as follows: 92.5 parts of POE resin, 1 part of ultraviolet initiator, 4 parts of cross-linking agent, 0.2 part of coupling agent, 1 part of anti-aging auxiliary agent, 0.8 part of processing auxiliary agent and 0.5 part of anti-PID auxiliary agent.
The raw material formula of the bonding layer is as follows: 93 parts of POE resin, 1 part of thermal initiator, 3.5 parts of cross-linking agent, 0.5 part of coupling agent, 0.5 part of anti-aging auxiliary agent, 0.5 part of processing auxiliary agent and 1 part of anti-PID auxiliary agent.
The preparation method of the solder strip carrier film comprises the following steps:
all the raw materials are uniformly mixed in a high-speed mixer and then granulated by a double-screw extruder, and then multilayer coextrusion casting film forming is carried out, wherein the casting film forming is simultaneously compounded with a release film. And performing electron beam irradiation pre-crosslinking after the completion. The processing temperature is 80-100 ℃, and the electron beam irradiation dose is 16 kGy. The carrier film of the solder strip with a three-layer structure is formed, the release film is 125 mu m, the pre-crosslinking layer is 240 mu m, and the bonding layer is 340 mu m.
Preparing a photovoltaic module:
or sequentially laminating the lower layer of glass, the lower layer of adhesive film, the cell sheet composite body, the upper layer of adhesive film and the upper layer of glass, and placing the laminated glass in a laminating machine for laminating to obtain the double-glass solar module.
The laminating temperature is 145 ℃, the vacuumizing time is 3-8 min, and the laminating time is 15 min.
Example 2
A solder strip carrier film having the structure shown in figure 1:
and (3) release film layer: PET material with thickness of 25 μm
The formula of the raw materials of the pre-crosslinking layer is as follows: 92.5 parts of EVA resin, 1.5 parts of ultraviolet initiator, 3.5 parts of cross-linking agent, 0.2 part of coupling agent, 1 part of anti-aging aid, 0.3 part of processing aid and 1 part of anti-PID aid.
The raw material formula of the bonding layer is as follows: 91.2 parts of EVA resin, 1.5 parts of thermal initiator, 3 parts of cross-linking agent, 0.5 part of coupling agent, 0.5 part of anti-aging auxiliary agent, 0.3 part of processing auxiliary agent and 3 parts of anti-PID auxiliary agent.
The preparation method of the solder ribbon carrier film was the same as in example 1.
The carrier film of the solder strip with a three-layer structure is formed, the release film is 125 mu m, the pre-crosslinking layer is 240 mu m, and the bonding layer is 340 mu m.
Photovoltaic modules were prepared as in example 1.
Example 3
A solder strip carrier film having the structure shown in figure 1:
and (3) release film layer: PET material with thickness of 25 μm
The formula of the raw materials of the pre-crosslinking layer is as follows: 81 parts of POE resin, 10 parts of tackifying resin, 2 parts of ultraviolet initiator, 4.5 parts of cross-linking agent, 0.2 part of coupling agent, 1 part of anti-aging aid, 0.8 part of processing aid and 0.5 part of anti-PID aid.
The raw material formula of the bonding layer is as follows: 71.5 parts of POE resin, 20 parts of tackifying resin, 2 parts of thermal initiator, 4 parts of cross-linking agent, 0.5 part of coupling agent, 0.5 part of anti-aging aid, 0.5 part of processing aid and 1 part of anti-PID aid.
The preparation method of the solder ribbon carrier film was the same as in example 1.
The carrier film of the solder strip with a three-layer structure is formed, the release film is 125 mu m, the pre-crosslinking layer is 240 mu m, and the bonding layer is 340 mu m.
The photovoltaic module was prepared in the same manner as in example 1.
Example 4
A solder strip carrier film having the structure shown in fig. 3:
and (3) release film layer: PET material, thickness 25 μm.
The formula of the raw materials of the pre-crosslinking layer is as follows: 92.5 parts of EVA resin, 1.5 parts of ultraviolet initiator, 3.5 parts of cross-linking agent, 0.2 part of coupling agent, 1 part of anti-aging aid, 0.3 part of processing aid and 1 part of anti-PID aid.
The formula of the transition layer raw materials is as follows: 93.5 parts of POE resin, 1 part of thermal initiator, 3.5 parts of cross-linking agent, 0.5 part of anti-aging aid, 0.5 part of processing aid and 1 part of anti-PID aid.
The raw material formula of the bonding layer is as follows: 91.2 parts of EVA resin, 1.5 parts of thermal initiator, 3 parts of cross-linking agent, 0.5 part of coupling agent, 0.5 part of anti-aging auxiliary agent, 0.3 part of processing auxiliary agent and 3 parts of anti-PID auxiliary agent.
The preparation method of the solder ribbon carrier film was the same as in example 1.
The carrier film of the solder strip with a four-layer structure is formed, the release film is 125 mu m, the pre-crosslinking layer is 225 mu m, the transition layer is 430 mu m, and the bonding layer is 325 mu m.
The photovoltaic module was prepared in the same manner as in example 1.
Example 5
A solder strip carrier film having the structure shown in fig. 3:
and (3) release film layer: PET material, thickness 25 μm.
The formula of the raw materials of the pre-crosslinking layer is as follows: 81 parts of POE resin, 10 parts of tackifying resin, 2 parts of ultraviolet initiator, 4.5 parts of cross-linking agent, 0.2 part of coupling agent, 1 part of anti-aging aid, 0.8 part of processing aid and 0.5 part of anti-PID aid.
The formula of the transition layer raw materials is as follows: 93.5 parts of POE resin, 1 part of thermal initiator, 3.5 parts of cross-linking agent, 0.5 part of anti-aging aid, 0.5 part of processing aid and 1 part of anti-PID aid.
The raw material formula of the bonding layer is as follows: 71.5 parts of POE resin, 20 parts of tackifying resin, 2 parts of thermal initiator, 4 parts of cross-linking agent, 0.5 part of coupling agent, 0.5 part of anti-aging aid, 0.5 part of processing aid and 1 part of anti-PID aid.
The preparation method of the solder ribbon carrier film was the same as in example 1.
The carrier film of the solder strip with a four-layer structure is formed, the release film is 125 mu m, the pre-crosslinking layer is 240 mu m, the transition layer is 430 mu m, and the bonding layer is 340 mu m.
The photovoltaic module was prepared in the same manner as in example 1.
Comparative example 1
A support layer: pure PET film, thickness 40 μm. (without Pre-crosslinked layer)
The raw material formula of the bonding layer is as follows: 91.2 parts of EVA resin, 1.5 parts of thermal initiator, 3 parts of cross-linking agent, 0.5 part of coupling agent, 0.5 part of anti-aging auxiliary agent, 0.3 part of processing auxiliary agent, 3 parts of anti-PID auxiliary agent and 40 mu m in thickness.
Mixing various raw materials uniformly in a high-speed mixer, granulating by a double-screw extruder, casting to form a film, directly spraying the cast film on a PET film, and rolling, wherein the surface temperature of the PET film is 25-100 ℃.
The photovoltaic module was prepared in the same manner as in example 1.
Comparative example 2 (bonding layer not crosslinked)
A solder strip carrier film having the structure shown in fig. 3:
and (3) release film layer: PET material, thickness 25 μm.
The formula of the raw materials of the pre-crosslinking layer is as follows: 92.5 parts of EVA resin, 1.5 parts of ultraviolet initiator, 3.5 parts of cross-linking agent, 0.2 part of coupling agent, 1 part of anti-aging aid, 0.3 part of processing aid and 1 part of anti-PID aid.
The raw material formula of the bonding layer is as follows: 94.2 parts of EVA resin, 1.5 parts of thermal initiator, 0.5 part of coupling agent, 0.5 part of anti-aging auxiliary agent, 0.3 part of processing auxiliary agent and 3 parts of anti-PID auxiliary agent.
The preparation method of the solder ribbon carrier film was the same as in example 1.
The carrier film of the solder strip with a three-layer structure is formed, the release film is 125 mu m, the pre-crosslinking layer is 240 mu m, and the bonding layer is 340 mu m.
The cell assembly was prepared in the same manner as in example 1.
Comparative example 3 (Pre-crosslinking layer 2 having a low degree of Pre-crosslinking)
A solder strip carrier film having the structure shown in fig. 3:
and (3) release film layer: PET material, thickness 25 μm.
The formula of the raw materials of the pre-crosslinking layer is as follows: 96.8 parts of EVA resin, 0.2 part of ultraviolet initiator, 0.5 part of cross-linking agent, 0.2 part of coupling agent, 1 part of anti-aging auxiliary agent, 0.3 part of processing auxiliary agent and 1 part of anti-PID auxiliary agent.
The raw material formula of the bonding layer is as follows: 91.2 parts of EVA resin, 1.5 parts of thermal initiator, 3 parts of cross-linking agent, 0.5 part of coupling agent, 0.5 part of anti-aging auxiliary agent, 0.3 part of processing auxiliary agent and 3 parts of anti-PID auxiliary agent.
The preparation method of the solder ribbon carrier film was the same as in example 1.
The carrier film of the solder strip with a three-layer structure is formed, the release film is 125 mu m, the pre-crosslinking layer is 240 mu m, and the bonding layer is 340 mu m.
The cell assembly was prepared in the same manner as in example 1.
The carrier films obtained in the above examples and comparative examples were tested as follows, and the results are shown in Table 1.
The detection and evaluation methods of the properties are as follows:
degree of pre-crosslinking/degree of crosslinking: solvent method (xylene reflux 145 ℃,5 h);
transmittance: GB/T2410-2008;
haze: GB/T2410-
TABLE 1
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (18)
1. A solder ribbon carrier film, comprising: the adhesive comprises a pre-crosslinking layer and an adhesive layer, wherein the pre-crosslinking layer is the same as the matrix resin of the adhesive layer, the matrix resin is one or more of ethylene-vinyl acetate copolymer, polyolefin elastomer, ethylene acrylic acid copolymer or ethyl methacrylate,
the pre-crosslinking degree of the pre-crosslinking layer is 30-80%, and the pre-crosslinking degree of the bonding layer is less than or equal to 1%;
and after the solder strip carrier film is prepared into a photovoltaic module, the crosslinking degree of the bonding layer is 50-90%.
2. The solder ribbon carrier film of claim 1, wherein:
the addition amount of the matrix resin in the pre-crosslinking layer is 60-98% of the total mass of the raw materials of the pre-crosslinking layer, the raw materials of the pre-crosslinking layer also comprise a crosslinking agent with the addition amount of 1-8% of the total mass of the raw material formula of the pre-crosslinking layer, and an ultraviolet initiator with the addition amount of 0.1-5% of the total mass of the raw material formula of the pre-crosslinking layer;
the addition amount of the matrix resin in the bonding layer is 50-98% of the total mass of the raw materials of the bonding layer, the raw materials of the bonding layer also comprise a cross-linking agent with the addition amount of 1-8% of the total mass of the raw materials of the bonding layer, and a thermal initiator with the addition amount of 0.1-5% of the total mass of the raw materials of the bonding layer.
3. The solder ribbon carrier film of claim 2, wherein: the raw materials of the bonding layer also comprise an ultraviolet light initiator, and the addition amount of the ultraviolet light additive is less than or equal to 0.1 percent based on 100 percent of the total mass of the raw materials of the bonding layer.
4. The solder ribbon carrier film of claim 2, wherein: the raw materials of the pre-crosslinking layer also comprise an anti-aging agent with the addition amount of 0.1-3% of the total mass of the raw material formula of the pre-crosslinking layer;
the raw materials of the bonding layer also comprise a coupling agent with the addition amount of 0.1-2% of the total mass of the raw materials of the bonding layer and an anti-aging agent with the addition amount of 0.1-3% of the total mass of the raw materials of the bonding layer.
5. The solder ribbon carrier film of claim 4, wherein: the raw materials of the pre-crosslinking layer also comprise tackifying resin with the addition amount of 0.1-20% of the total mass of the raw material formula of the pre-crosslinking layer, coupling agent with the addition amount of 0.005-2% of the total mass of the raw material formula of the pre-crosslinking layer, processing aid with the addition amount of 0.001-1% of the total mass of the raw material formula of the pre-crosslinking layer, and anti-PID aid with the addition amount of 0.005-5% of the total mass of the raw material formula of the pre-crosslinking layer;
the raw materials of the bonding layer also comprise tackifying resin with the addition amount of 0.1-30% of the total mass of the raw materials of the bonding layer, processing aid with the addition amount of 0.001-1% of the total mass of the raw materials of the bonding layer, and anti-PID aid with the addition amount of 0.005-5% of the total mass of the raw materials of the bonding layer;
the cross-linking agent is one or more of triallyl isocyanurate, trimethyolyl isocyanate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate or pentaerythritol triacrylate;
the ultraviolet initiator is one or more of trimethylolpropane triacrylate, 2-trimethylolpropane tetraacrylate and 4- (dimethylamino) ethyl benzoate;
the thermal initiator is one or more of ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, dicumyl peroxide and 2, 5-dimethyl-2, 5-di (tert-butylperoxy) hexane;
the tackifying resin is one or more of rosin, hydrogenated rosin, petroleum resin, hydrogenated petroleum resin, phenolic resin or terpene resin;
the coupling agent is one or more of silane coupling agent, titanate coupling agent or aluminate coupling agent;
the anti-aging agent is one or more of an antioxidant, a light stabilizer or an ultraviolet absorber;
the processing aid is an opening agent and/or a lubricant.
6. The solder ribbon carrier film of claim 1, wherein: the thickness of the pre-crosslinking layer and the bonding layer is independently 20-200 mu m.
7. The solder ribbon carrier film of claim 1, wherein: and a release film is arranged on the outer side of the pre-crosslinking layer.
8. Solder ribbon carrier film according to any one of claims 1 to 7, characterized in that: the solder tape carrier film further comprises one or more transition layers disposed between the pre-crosslinked layer and the tie layer, the transition layers being either crosslinked or non-crosslinked,
when the transition layer is in a cross-linking type, the pre-cross-linking degree of the transition layer is less than or equal to 1%, and the cross-linking degree of the transition layer is less than or equal to 90% after the solder strip carrier film is prepared into the photovoltaic module.
9. The solder ribbon carrier film of claim 8, wherein: the raw materials of the transition layer comprise matrix resin with the addition amount of 50-98% of the total mass of the raw materials of the transition layer, a cross-linking agent with the addition amount of 1-8% of the total mass of the raw materials of the transition layer, and a thermal initiator with the addition amount of 0.1-5% of the total mass of the raw materials of the transition layer.
10. The solder ribbon carrier film of claim 9, wherein: the raw materials of the transition layer also comprise an ultraviolet light initiator, and the addition amount of the ultraviolet light additive is less than or equal to 0.1 percent based on 100 percent of the total mass of the raw materials of the transition layer;
the ultraviolet initiator is one or more of trimethylolpropane triacrylate, 2-trimethylolpropane tetraacrylate and 4- (dimethylamino) ethyl benzoate.
11. The solder ribbon carrier film of claim 9, wherein: the raw materials of the transition layer also comprise tackifying resin with the addition amount of 0.1-30% of the total mass of the raw materials of the transition layer, coupling agent with the addition amount of 0.1-2% of the total mass of the raw materials of the transition layer, anti-aging agent with the addition amount of 0.1-3% of the total mass of the raw materials of the transition layer, processing aid with the addition amount of 0.001-1% of the total mass of the raw materials of the transition layer, and anti-PID aid with the addition amount of 0.005-5% of the total mass of the raw materials of the transition layer;
the matrix resin of the transition layer is one or more of ethylene-vinyl acetate copolymer, polyolefin elastomer, ethylene acrylic acid copolymer or ethyl methacrylate;
the thermal initiator is one or more of ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, dicumyl peroxide and 2, 5-dimethyl-2, 5-di (tert-butylperoxy) hexane;
the cross-linking agent is one or more of triallyl isocyanurate, trimethyolyl isocyanate, propane trimethanol triacrylate, trimethylolpropane trimethacrylate or pentaerythritol triacrylate;
the tackifying resin is one or more of rosin, hydrogenated rosin, petroleum resin, hydrogenated petroleum resin, phenolic resin or terpene resin;
the coupling agent is one or more of silane coupling agent, titanate coupling agent or aluminate coupling agent;
the anti-aging agent is one or more of an antioxidant, a light stabilizer or an ultraviolet absorber;
the processing aid is an opening agent and/or a lubricant.
12. A kind ofA method of producing a solder ribbon carrier film according to any one of claims 1 to 11, characterized in that: respectively mixing and granulating raw materials of each layer, then forming a film by multilayer coextrusion casting, and irradiating a pre-crosslinking layer by UV or electron beams，The electron beam irradiation dose is 10 kGy-25 kGy.
13. A solder strip composite, comprising: a solder strip carrier film comprising the solder strip carrier film of any one of claims 1 to 11, and a solder strip adhered to the solder strip carrier film.
14. A method of making a solder strip composite as claimed in claim 13 wherein: adhering the solder strip to the carrier film of any one of claims 1 to 11 by pressing at a temperature of 80 ℃ to 170 ℃, wherein the pressing time is controlled to be 0.1s to 1s, and two adjacent carrier films are respectively positioned on two sides of the solder strip and are distributed at intervals.
15. A battery sheet composite characterized in that: the welding strip carrier film comprises a battery piece, a welding strip in contact with the battery piece and a carrier film for fixing the welding strip on the battery piece, wherein the carrier film is the welding strip carrier film in any one of claims 1 to 11.
16. A method of making a solder strip composite as claimed in claim 15 wherein:
cutting the welding strip adhered with the carrier film to form a welding strip composite unit, wherein the welding strip composite unit consists of the welding strip and the two carrier films,
and (3) pressing the welding strip composite unit on the surface of the battery piece at the temperature of 100-300 ℃, wherein the pressing time is controlled to be 0.2-3 s.
17. Use of a solder ribbon carrier film according to any one of claims 1 to 11, or a solder ribbon composite according to claim 13, or a cell sheet composite according to claim 15 in a photovoltaic module.
18. A preparation method of a photovoltaic module is characterized by comprising the following steps: the preparation method of the photovoltaic module comprises the following specific steps:
laminating a back plate, a lower adhesive film, the battery plate composite body of claim 15, an upper adhesive film and glass in sequence, placing the laminated layers in a laminating machine to obtain a single-glass solar module,
or laminating the lower glass layer, the lower adhesive film layer, the cell composite body according to claim 15, the upper adhesive film layer and the upper glass layer in sequence, and placing the laminated layers in a laminating machine for laminating to obtain the double-glass solar module,
the lamination conditions were: the laminating temperature is 120-180 ℃, the vacuumizing time is 3-8 min, and the laminating time is 8-20 min;
when a release film is disposed on the carrier film, the release film is removed prior to lamination.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110620404.0A CN113563812A (en) | 2021-06-03 | 2021-06-03 | Solder strip carrier film, preparation method and application thereof |
| PCT/CN2022/081620 WO2022252755A1 (en) | 2021-06-03 | 2022-03-18 | Ribbon carrier film, preparation method therefor, and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202110620404.0A CN113563812A (en) | 2021-06-03 | 2021-06-03 | Solder strip carrier film, preparation method and application thereof |
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| CN113563812A true CN113563812A (en) | 2021-10-29 |
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| CN202110620404.0A Pending CN113563812A (en) | 2021-06-03 | 2021-06-03 | Solder strip carrier film, preparation method and application thereof |
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| Country | Link |
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| CN (1) | CN113563812A (en) |
| WO (1) | WO2022252755A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022252755A1 (en) * | 2021-06-03 | 2022-12-08 | 苏州赛伍应用技术股份有限公司 | Ribbon carrier film, preparation method therefor, and application thereof |
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| CN112226177A (en) * | 2020-09-18 | 2021-01-15 | 苏州赛伍应用技术股份有限公司 | Welding strip carrier film, welding strip composite body and battery piece composite body |
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