CN112226169A - Solder strip carrier film, preparation method thereof, solder strip composite body and battery piece composite body - Google Patents

Solder strip carrier film, preparation method thereof, solder strip composite body and battery piece composite body Download PDF

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Publication number
CN112226169A
CN112226169A CN202011021675.6A CN202011021675A CN112226169A CN 112226169 A CN112226169 A CN 112226169A CN 202011021675 A CN202011021675 A CN 202011021675A CN 112226169 A CN112226169 A CN 112226169A
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Prior art keywords
carrier film
resin
solder
strip
battery piece
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CN112226169B (en
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韩晓航
王磊
郑亚
陈洪野
吴小平
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Suzhou Cybrid Application Technology Co ltd
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Suzhou Cybrid Application Technology Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/06—Polyethene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2323/04—Homopolymers or copolymers of ethene
    • C08J2323/06—Polyethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2423/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2423/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2423/10—Homopolymers or copolymers of propene
    • C08J2423/12—Polypropene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C08K5/134—Phenols containing ester groups
    • C08K5/1345—Carboxylic esters of phenolcarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C08K5/3435—Piperidines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/33—Applications of adhesives in processes or use of adhesives in the form of films or foils for batteries or fuel cells
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2433/00—Presence of (meth)acrylic polymer
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    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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Abstract

The invention relates to a solder strip carrier film, which comprises an adhesive layer formed by a pressure-sensitive adhesive or a heat-sensitive adhesive, wherein the matrix resin of the pressure-sensitive adhesive or the heat-sensitive adhesive comprises one or more of epoxy resin, polyisocyanate, phenolic resin, urea-formaldehyde resin, acrylic ester, unsaturated polyester, organic silicon resin, organic fluorine resin, polyolefin with the number average molecular weight less than 10000 and a copolymer thereof. According to the invention, through optimization of main body resin of each layer of the carrier film, the carrier film can be well bonded with the welding strip and the battery piece, and the carrier film is not easy to be pressed through. Meanwhile, the carrier film can be bonded with the welding strip at normal temperature and room temperature, the process is more convenient to bond at high temperature than at high temperature, the production cost is saved, the safety of the production process is improved, and the bonding degree is not weaker than that of the carrier film bonded at high temperature.

Description

Solder strip carrier film, preparation method thereof, solder strip composite body and battery piece composite body
Technical Field
The invention particularly relates to a solder strip carrier film, a preparation method thereof, a solder strip composite body and a battery piece composite body.
Background
The current development trend of the photovoltaic industry component is to change from a 3-main grid to a 4-main grid and a 5-main grid, and recently to the current multi-main grid. In recent years, a main grid-free component is provided, so that the using amount of silver can be saved, the shielding of grid lines on a battery piece is reduced, and the power generation efficiency is improved, for example, an electrode interconnection structure of a Thai Longji leaf CN201720080886.4 IBC battery, and a CN 201710054876.8N-type double-sided battery interconnection process are provided; shenzhen Laplacian energy technology Limited CN201720292907.9 does not have a main grid solar cell module.
At present, the lead of the battery piece without the main grid component is fixed on the battery piece in two ways:
1 is a metallized solar cell piece by electroplating process, such as Suzhou solar well new energy Co., Ltd, CN201820959124.6 a no main grid double-sided electroplating;
2. the lead is carried by an adhesive film and is fixed on a battery piece during lamination, such as CN201510933299.0 (Huanghe hydroelectric photovoltaic industry Co., Ltd.) which is a preparation method of a main grid-free solder strip for a solar battery.
In addition, the adhesive film in the prior art generally needs to be pressed with the solder strip and the battery piece at a higher temperature (> 100 ℃) for a longer time, so that the adhesive film in the prior art has the problems of higher energy consumption and lower production efficiency during use.
Disclosure of Invention
The invention aims to provide a welding strip carrier film capable of being rapidly bonded with a welding strip and a battery piece at a lower temperature, a preparation method thereof, a welding strip composite body and a battery piece composite body.
In order to achieve the purpose, the invention adopts the technical scheme that:
the invention provides a solder strip carrier film, which comprises an adhesive layer formed by a pressure-sensitive adhesive or a heat-sensitive adhesive, wherein the matrix resin of the pressure-sensitive adhesive or the heat-sensitive adhesive comprises one or more of epoxy resin, polyisocyanate, phenolic resin, urea resin, acrylate, unsaturated polyester, organic silicon resin, organic fluorine resin, polyolefin with the number average molecular weight less than 10000 and copolymers thereof.
Preferably, the matrix resin is acrylate and/or polyolefin with the number average molecular weight less than 10000 and copolymer thereof.
In the present invention, the organic fluorine resin includes but is not limited to one or more of PVF, PVDF, PTFE.
In the present invention, the polyolefin and its copolymer include but are not limited to one or more of polyethylene wax, polypropylene wax, polyethylene vinyl acetate with a melt index > 100.
Preferably, the number average molecular weight of the polyolefin and the copolymer thereof is less than 6000.
Preferably, the solder strip carrier film may further include a support layer.
Further preferably, the raw material formula of the supporting layer comprises 95-100% of matrix resin and 0-5% of auxiliary agent by weight percentage.
Still further preferably, the content of the auxiliary agent in the support layer is greater than 0.
Preferably, the auxiliary agent comprises one or more of an initiator, a cross-linking agent, a coupling agent, a light stabilizer, an antioxidant, an ultraviolet absorber, a mouth-opening agent, a nucleating agent, an anti-reflection agent and an anti-PID auxiliary agent.
Further preferably, the solder strip carrier film may further include one or more intermediate layers disposed between the adhesive layer and the support layer.
More preferably, the raw material formula of the intermediate layer can be similar to that of the support layer, and can also be formed by curing glue.
More preferably, the raw material formula of the intermediate layer comprises 95-99.9% of matrix resin and 0.1-5% of auxiliary agent by weight of the total mass of the intermediate layer.
Preferably, the outer side surface of the solder strip carrier film can be provided with a release film.
In the present invention, the release film is a conventional release film, such as PE, PP, PET, etc., and the release film may be colored or colorless.
Preferably, the thickness of the solder strip carrier film is 20-500 μm.
More preferably, the thickness of the adhesive layer is 10 μm to 400 μm, and the thickness of the support layer is 10 μm to 400 μm.
Preferably, the light transmittance of the solder strip carrier film is more than or equal to 80% under the wavelength of 380-1100, and preferably more than or equal to 90%.
Preferably, the raw material formula of the adhesive layer comprises 50-95% of the matrix resin, 0-50% of tackifying resin and 0-5% of auxiliary agent by mass of the adhesive layer; the tackifying resin is one or more of rosin, hydrogenated rosin, petroleum resin, hydrogenated petroleum resin, phenolic resin and terpene resin.
Further preferably, the auxiliary agent comprises one or more of an initiator, a cross-linking agent, a silane coupling agent, a diluent, a plasticizer, a filler, an anti-reflection agent, a light stabilizer, an antioxidant, an ultraviolet absorber, a hydrolysis resistance auxiliary agent and a PID (proportion integration differentiation) resistance auxiliary agent.
In the invention, the initiator is one or more selected from trimethylolpropane triacrylate, 2-trimethylolpropane tetraacrylate, ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, 4- (dimethylamino) ethyl benzoate, dicumyl peroxide (DCP), and 2, 5-dimethyl-2, 5-di (tert-butylperoxy) hexane.
In the invention, the cross-linking agent is one or more selected from cross-linking agents of tert-butyl peroxy-2-ethylhexyl carbonate, tert-butyl peroxy-isopropyl carbonate, dibenzoyl peroxide, dicumyl peroxide, 2, 5-dimethyl-2, 5-bis (tert-butylperoxy) hexane, cyclohexanone peroxide, tert-butyl hydroperoxide, tert-butyl peroxybenzoate, tert-butyl peroxyacetate, di- (4-tert-butylcyclohexyl) peroxydicarbonate, tert-butyl peroxy-3, 5, 5-trimethyl hexanoate and triallyl isocyanate (TAIC).
In the invention, the coupling agent is one or more selected from 3-methacryloxypropylmethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, vinyltrimethoxysilane, 3-aminopropyltriethoxysilane, vinyltrimethoxysilane, triisostearoyl isopropyl titanate, isopropyl trioctyl (dioctyl pyrophosphato) titanate and the like.
In the invention, the light stabilizer is one or more selected from bis (2,2,6, 6-tetramethyl-4-piperidyl) sebacate (light stabilizer 770), polysuccinic acid (4-hydroxy-2, 2,6, 6-tetramethyl-1-piperidylethanol) ester, and poly- { [6- [ (1,1,3, 3-tetramethylbutyl) -imino ] -1,3, 5-triazine-2, 4-diyl ] [2- (2,2,6, 6-tetramethylpiperidyl) -nitrogen ] -hexylene- [4- (2,2,6, 6-tetramethylpiperidyl) -amino ].
In the invention, the antioxidant is one or more of phenolic antioxidant, phosphite antioxidant and hindered amine antioxidant.
In the invention, the anti-PID auxiliary agent is a metal ion trapping agent.
The second aspect of the present invention also provides a method for preparing the solder strip carrier film, wherein the solder strip carrier film is formed by coating, for example, a formulated resin is not used or diluted with a solvent and then coated to form a film, or the formulated resin is pre-polymerized and then coated to form a film by UV or electron beam irradiation.
The third aspect of the invention also provides a solder strip composite body, which comprises the solder strip carrier film and a solder strip adhered on the solder strip carrier film.
Preferably, at least 30% of the volume of the solder strip is exposed out of the carrier film of the solder strip, so that the solder strip can be well contacted with the battery piece, and the bonding performance of the solder strip and the carrier film is ensured.
More preferably, 30% to 70% of the volume of the solder ribbon is exposed from the solder ribbon carrier film, and even more preferably 40% to 60% of the volume of the solder ribbon is exposed from the solder ribbon carrier film.
The invention also provides a battery piece composite body, which comprises a battery piece, a welding strip contacted with the battery piece and a carrier film used for fixing the welding strip on the battery piece, wherein the carrier film is the carrier film of the welding strip; preferably, the welding strips and the carrier film are respectively arranged on two surfaces of the battery piece.
Preferably, the cell is one of a crystalline silicon cell, an amorphous silicon cell, a chemical solar cell, a multi-compound thin film solar cell and the like.
The fifth aspect of the present invention further provides a method for preparing a battery sheet complex, comprising the following steps:
(1) controlling the temperature to be 50 ℃ or below, preferably at normal temperature, adhering the welding strip on the carrier film through pressing, and controlling the pressing time to be 0.01-1 s, or performing continuous rolling pressing; two adjacent carrier films are respectively positioned on two sides of the welding strip and are distributed at intervals;
(2) cutting the welding strip adhered with the carrier film to form a welding strip composite unit, wherein the welding strip composite unit consists of the welding strip and the two carrier films;
(3) controlling the temperature to be 50 ℃ or below, preferably pressing the welding strip composite unit on the surface of the battery piece at normal temperature, and controlling the pressing time to be 0.01-1 s; or pressing by continuous rolling; preferably, the solder strip composite units are respectively pressed on two sides of the battery piece.
Preferably, when a release film is disposed on the carrier film, the release film is removed before step (1).
The sixth aspect of the invention provides a use of the solder strip carrier film, the solder strip composite body or the cell composite body in a photovoltaic module.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
according to the invention, through optimization of main body resin of each layer of the carrier film, the carrier film can be well bonded with the welding strip and the battery piece, and the carrier film is not easy to be pressed through. Meanwhile, the carrier film can be bonded with the welding strip at normal temperature and room temperature, the process is more convenient to bond at high temperature than at high temperature, the production cost is saved, the safety of the production process is improved, and the bonding degree is not weaker than that of the carrier film bonded at high temperature.
Drawings
FIG. 1 is a schematic structural view of a solder ribbon composite formed by a carrier film of a single layer structure;
FIG. 2 is a schematic diagram of a solder ribbon composite formed from a two-layer carrier film;
FIG. 3 is a schematic structural view of a solder ribbon composite formed by a carrier film of a three-layer structure;
FIG. 4 is a schematic structural view of a cell sheet composite;
wherein, 1, an adhesive layer; 2. a support layer; 3. an intermediate layer; 4. welding a strip; 5. a battery piece.
Detailed Description
The present invention will be further described with reference to specific examples, but the present invention is not limited to the following examples. The implementation conditions adopted in the embodiments can be further adjusted according to different requirements of specific use, and the implementation conditions not mentioned are conventional conditions in the industry. The raw materials in the invention are all available in the market. The parts of the raw materials in the following examples and comparative examples are parts by mass.
Example 1
1. The double-layer structure carrier film comprises an adhesive layer 1 and a support layer 2, wherein,
the formula of the raw materials of the supporting layer 2 is as follows: the matrix resin comprises 30 parts of polypropylene, 70 parts of polyethylene, 7700.5 parts of light stabilizer, 10100.2 parts of antioxidant, 0.2 part of anti-reflection agent and 0.2 part of anti-PID auxiliary agent;
the adhesive layer 1 comprises the following raw materials: 60 parts of matrix resin polyethylene wax, 40 parts of hydrogenated petroleum resin, 7700.5 parts of light stabilizer, 10100.2 parts of antioxidant and 0.2 part of anti-PID auxiliary agent.
The support layer 2 is formed by tape casting, and then the adhesive layer 1 is coated on the support layer 2 to form a film with a double-layer structure and a thickness of 80 μm, wherein the adhesive layer is 120 μm, and the support layer is 260 μm.
2. Preparation of cell sheet composite
(1) Controlling the temperature to be 35 ℃, adhering a plurality of welding strips 4 to the adhesive layer 1 of the cut carrier film in parallel by pressing, and controlling the pressing time to be 0.5s, or continuously rolling and pressing, wherein two adjacent carrier films are respectively adhered to the upper side and the lower side of each welding strip 4 and are distributed in a staggered manner;
(2) cutting the solder strip 4 adhered with the carrier film to form a solder strip composite unit consisting of the solder strip 4 and two carrier films;
(3) and (3) pressing the welding strip composite unit on the surface of the battery piece 5 at the controlled temperature of 45 ℃ for 1s, or pressing by continuous rolling.
In the embodiment, the matrix resin of the adhesive layer 1 is a polyolefin micromolecule prepolymer, the number average molecular weight is between 500 and 5000, and the adhesion effect of the low-softening-point tackifying resin on the welding belt 4 and the battery piece 5 at a lower temperature can be ensured by adding the low-softening-point tackifying resin; the supporting layer 2 can prevent the anti-sticking phenomenon from occurring in the sample rolling process.
Example 2
1. The double-layer structure carrier film comprises an adhesive layer 1 and a support layer 2, wherein,
the formula of the raw materials of the supporting layer 2 is as follows: the matrix resin comprises 100 parts of polyethylene terephthalate (PET), 7700.5 parts of light stabilizer, 10100.2 parts of antioxidant, 0.2 part of hydrolysis-resistant assistant and 0.2 part of PID-resistant assistant;
the adhesive layer 1 comprises the following raw materials: 70 parts of matrix resin acrylate, 30 parts of hydrogenated petroleum resin, 0.6 part of initiator dicumyl peroxide, 2 parts of cross-linking agent TAIC, 7700.5 parts of light stabilizer, 10100.2 parts of antioxidant and 0.2 part of anti-PID auxiliary agent.
The support layer 2 is formed by tape casting, and then the adhesive layer 1 is coated on the support layer 2 to obtain a film with a double-layer structure and a thickness of 80 μm, wherein the adhesive layer is 120 μm, and the support layer is 260 μm.
2. Preparation of cell sheet composite
(1) Controlling the temperature at room temperature, adhering a plurality of welding strips 4 on the adhesive layer 1 of the cut carrier film in parallel by pressing, and controlling the pressing time to be 0.3s, or continuously rolling and pressing, wherein two adjacent carrier films are adhered on the upper side and the lower side of each welding strip 4 respectively and are distributed in a staggered manner;
(2) cutting the solder strip 4 adhered with the carrier film to form a solder strip composite unit consisting of the solder strip 4 and two carrier films;
(3) controlling the temperature to be below 40 ℃, and pressing the welding strip composite unit on the surface of the battery piece 5, wherein the pressing time is controlled to be 0.8 s; or by continuous roll pressing.
The adhesive has certain initial adhesion, can be directly bonded with the solder strip 4 at room temperature, and can be bonded with the battery piece 5 at 40 ℃.
Example 3
1. The double-layer structure carrier film comprises an adhesive layer 1 and a support layer 2, wherein,
the formula of the raw materials of the supporting layer 2 is as follows: the matrix resin comprises 100 parts of polyethylene terephthalate (PET), 7700.5 parts of light stabilizer, 10100.2 parts of antioxidant, 0.2 part of hydrolysis-resistant assistant and 0.2 part of PID-resistant assistant;
the adhesive layer 1 comprises the following raw materials: 85 parts of matrix resin acrylate, 15 parts of hydrogenated petroleum resin, 0.4 part of initiator dicumyl peroxide, 1 part of cross-linking agent TAIC, 7700.5 parts of light stabilizer, 10100.2 parts of antioxidant and 0.2 part of anti-PID auxiliary agent.
The supporting layer 2 is formed by tape casting, and then the adhesive layer 1 is coated on the supporting layer 2 to obtain a film with a double-layer structure and a thickness of 80 microns, the adhesive layer is 120 microns, the supporting layer is 260 microns, and meanwhile, the release film is compounded on the adhesive layer 1 to prevent the adhesive layer 1 from being reversely adhered to the supporting layer 2 after rolling.
2. Preparation of cell sheet composite
(1) Controlling the temperature at room temperature, adhering a plurality of welding strips 4 on the adhesive layer 1 of the cut carrier film in parallel by pressing, and controlling the pressing time to be 0.3s, or continuously rolling and pressing; and two adjacent carrier films are respectively adhered to the upper side and the lower side of the welding strip 4 and are distributed in a staggered manner;
(2) cutting the solder strip 4 adhered with the carrier film to form a solder strip composite unit consisting of the solder strip 4 and two carrier films;
(3) controlling the temperature to be at room temperature, and pressing the welding strip composite unit on the surface of the battery piece 5, wherein the pressing time is controlled to be 0.8 s; or by continuous roll pressing.
In the formula of the embodiment, the addition amounts of the initiator and the cross-linking agent are small, the initial viscosity of the adhesive layer 1 is large, the adhesive layer can be adhered to the solder strip 4 and the battery piece 5 at room temperature, and a release film is required to be added to prevent the support layer 2 from being adhered to the adhesive layer 1; the release film is peeled off before bonding with the solder ribbon 4.
Example 4
1. The carrier film with a single-layer structure and the adhesive layer 1 comprise the following raw materials: 70 parts of matrix resin acrylate, 30 parts of hydrogenated petroleum resin, 0.8 part of initiator dicumyl peroxide, 4 parts of cross-linking agent TAIC, 7700.5 parts of light stabilizer, 10100.2 parts of antioxidant and 0.2 part of anti-PID auxiliary agent.
In order to ensure the rolling feasibility, a double-sided release film is required to be attached, wherein one side of the release film is peeled off before being bonded with the welding strip 4, the other side of the release film is peeled off after being bonded with the battery piece 5, and the double-layer release films are both PET release films.
The two release films are conventional products sold in the market, the carrier film is coated on one release film to obtain a carrier film with the thickness of 80 mu m, and then the carrier film and the other release film are compounded into a product with a three-layer structure.
2. Preparation of cell sheet composite
(1) Controlling the temperature to be 35 ℃, adhering a plurality of welding strips 4 on the adhesive layer 1 of the cut carrier film in parallel by pressing, and controlling the pressing time to be 0.5s, or continuously rolling and pressing; and two adjacent carrier films are respectively adhered to the upper side and the lower side of the welding strip 4 and are distributed in a staggered manner;
(2) cutting the solder strip 4 adhered with the carrier film to form a solder strip composite unit consisting of the solder strip 4 and two carrier films;
(3) controlling the temperature to be 45 ℃, and pressing the welding strip composite unit on the surface of the battery piece 5 for 1 s; or by continuous roll pressing.
The addition amounts of the initiator and the cross-linking agent in the formula are high, so that a carrier film is ensured to have a certain cross-linking degree after being cured, and is ensured to have certain strength and film-forming property, the original shape can be kept after two layers of release films are stripped, and the purpose of fixing the welding strip 4 on the battery piece 5 in the assembly preparation process is ensured.
Comparative example 1
1. The double-layer structure carrier film comprises an adhesive layer 1 and a support layer 2, wherein,
the formula of the raw materials of the supporting layer 2 is as follows: the matrix resin comprises 30 parts of polypropylene, 70 parts of polyethylene, 7700.5 parts of light stabilizer, 10100.2 parts of antioxidant, 0.2 part of anti-reflection agent and 0.2 part of anti-PID auxiliary agent;
the adhesive layer 1 comprises the following raw materials: 100 parts of matrix resin PE, 7700.5 parts of light stabilizer, 10100.2 parts of antioxidant and 0.2 part of anti-PID auxiliary agent.
The film with the thickness of 80 mu m and the double-layer structure is obtained by one-step molding through a double-layer co-extrusion process, the adhesive layer is 140 mu m, and the supporting layer is 240 mu m.
2. Preparation of cell sheet composite
In the comparative example, the adhesive layer 1 has a melting point of more than 100 ℃ and is a non-polar material, and cannot be bonded with the solder strip 4 and the battery piece 5 without adding a tackifying resin.
Comparative example 2
1. The double-layer structure carrier film comprises an adhesive layer 1 and a support layer 2, wherein,
the formula of the raw materials of the supporting layer 2 is as follows: the matrix resin comprises 100 parts of polyethylene terephthalate (PET), 7700.5 parts of light stabilizer, 10100.2 parts of antioxidant, 0.2 part of hydrolysis-resistant assistant and 0.2 part of PID-resistant assistant;
the adhesive layer 1 comprises the following raw materials: 70 parts of matrix resin acrylate, 30 parts of hydrogenated petroleum resin, 2 parts of initiator dicumyl peroxide, 4 parts of cross-linking agent TAIC, 7700.5 parts of light stabilizer, 10100.2 parts of antioxidant and 0.2 part of anti-PID auxiliary agent.
The support layer 2 is formed by tape casting, and then the adhesive layer 1 is coated on the support layer 2 to obtain a film with a double-layer structure and a thickness of 80 μm, wherein the adhesive layer is 120 μm, and the support layer is 260 μm.
2. Preparation of cell sheet composite
In the comparative example, the dosage of the initiator and the cross-linking agent is greatly increased, the initial viscosity of the adhesive layer 1 is obviously reduced, and the adhesive layer can not be bonded with the welding strip 4 and the battery piece 5 under the condition that the temperature is lower than 50 ℃.
Comparative example 3
The double-layer structure carrier film comprises an adhesive layer 1 and a support layer 2, wherein,
the formula of the raw materials of the supporting layer 2 is as follows: the matrix resin comprises 100 parts of polyethylene terephthalate (PET), 7700.5 parts of light stabilizer, 10100.2 parts of antioxidant, 0.2 part of hydrolysis-resistant assistant and 0.2 part of PID-resistant assistant;
the adhesive layer 1 comprises the following raw materials: 85 parts of matrix resin acrylate, 15 parts of hydrogenated petroleum resin, 0.4 part of initiator dicumyl peroxide, 1 part of cross-linking agent TAIC, 7700.5 parts of light stabilizer, 10100.2 parts of antioxidant and 0.2 part of anti-PID auxiliary agent.
The support layer 2 is formed by tape casting, and then the adhesive layer 1 is coated on the support layer 2 to obtain a film with a double-layer structure and a thickness of 80 μm, wherein the adhesive layer is 120 μm, and the support layer is 260 μm.
The formula of this comparative example is the same with embodiment 3, but does not add release film, and is great between supporting layer 2 and gluing layer 1 in the rolling process adhesion, unreels in-process gluing layer 1 and is torn the destruction, and the sample can't continuous production uses.
The carrier films obtained in the above examples and comparative examples were tested as follows, and the results are shown in Table 1.
The detection and evaluation methods of the properties are as follows:
shrinkage rate: GB/T13541-92;
transmittance: IEC 60664-1;
TABLE 1
Figure BDA0002700816920000081
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims (16)

1. A solder ribbon carrier film, comprising: the adhesive comprises an adhesive layer formed by a pressure-sensitive adhesive or a heat-sensitive adhesive, wherein the pressure-sensitive adhesive or the matrix resin of the heat-sensitive adhesive comprises one or more of epoxy resin, polyisocyanate, phenolic resin, urea resin, acrylate, unsaturated polyester, organic silicon resin, organic fluororesin, polyolefin with the number average molecular weight less than 10000 and copolymer thereof.
2. The solder ribbon carrier film of claim 1, wherein: the solder strip carrier film may further include a support layer.
3. The solder ribbon carrier film of claim 2, wherein: the supporting layer comprises, by mass, 95-100% of matrix resin and 0-5% of an auxiliary agent.
4. The solder ribbon carrier film of claim 2, wherein: the solder ribbon carrier film may also include one or more intermediate layers disposed between the adhesive layer and the support layer.
5. Solder ribbon carrier film according to any one of claims 1 to 4, characterized in that: the outer side surface of the welding strip carrier film can be provided with a release film.
6. Solder ribbon carrier film according to any one of claims 1 to 4, characterized in that: the thickness of the solder strip carrier film is 20-500 μm; the light transmittance of the solder strip carrier film under the wavelength of 380-1100 is more than or equal to 80%, preferably more than or equal to 90%.
7. Solder ribbon carrier film according to any one of claims 1 to 4, characterized in that: the adhesive layer comprises, by mass, 50-95% of the base resin, 0-50% of the tackifying resin and 0-5% of an auxiliary agent; the tackifying resin is one or more of rosin, hydrogenated rosin, petroleum resin, hydrogenated petroleum resin, phenolic resin and terpene resin.
8. The solder ribbon carrier film of claim 7, wherein: the auxiliary agent comprises one or more of initiator, cross-linking agent, coupling agent, diluent, plasticizer, filler, anti-reflection agent, light stabilizer, antioxidant, ultraviolet absorbent, hydrolysis-resistant auxiliary agent and anti-PID auxiliary agent.
9. A method of preparing a solder ribbon carrier film as claimed in any one of claims 1 to 8, characterized by: the coating film may be formed by, for example, coating the resin formulation without or after diluting the resin formulation with a solvent, or by pre-polymerizing the resin formulation and then coating the resin formulation by UV or electron beam irradiation.
10. A solder strip composite, comprising: a solder strip carrier film comprising the solder strip carrier film of any one of claims 1 to 8, and a solder strip adhered to the solder strip carrier film.
11. The solder ribbon composite of claim 10, wherein: at least 30% and more of the volume of the solder strip is exposed out of the solder strip carrier film.
12. A battery sheet composite characterized in that: the welding strip carrier film comprises a battery piece, a welding strip in contact with the battery piece and a carrier film for fixing the welding strip on the battery piece, wherein the carrier film is the welding strip carrier film of any one of claims 1 to 8; preferably, the welding strips and the carrier film are respectively arranged on two surfaces of the battery piece.
13. The battery sheet composite according to claim 12, wherein: the cell slice is one of a crystalline silicon cell, an amorphous silicon cell, a chemical solar cell, a multi-compound thin-film solar cell and the like.
14. A preparation method of a battery piece complex is characterized by comprising the following steps: the method comprises the following steps:
(1) adhering the solder strip on the carrier film according to any one of claims 1 to 8 by pressing at a temperature of 50 ℃ or below, preferably at room temperature, for a pressing time of 0.01 to 1s, or by continuous roll pressing; two adjacent carrier films are respectively positioned on two sides of the welding strip and are distributed at intervals;
(2) cutting the welding strip adhered with the carrier film to form a welding strip composite unit, wherein the welding strip composite unit consists of the welding strip and the two carrier films;
(3) controlling the temperature to be 50 ℃ or below, preferably pressing the welding strip composite unit on the surface of the battery piece at normal temperature, and controlling the pressing time to be 0.01-1 s; or pressing by continuous rolling; preferably, the solder strip composite units are respectively pressed on two sides of the battery piece.
15. The method for producing a battery sheet composite according to claim 14, characterized in that: when a release film is arranged on the carrier film, the release film is removed before the step (1).
16. Use of a solder ribbon carrier film according to any one of claims 1 to 8, or a solder ribbon composite according to claim 10 or 11, or a cell sheet composite according to claim 12 or 13 in a photovoltaic module.
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