WO2019019986A1

WO2019019986A1 - Encapsulating composition and encapsulating film comprising same and electronic component assembly

Info

Publication number: WO2019019986A1
Application number: PCT/CN2018/096742
Authority: WO
Inventors: 徐涛; 傅智盛; 吴安洋
Original assignee: 杭州星庐科技有限公司
Priority date: 2017-07-25
Filing date: 2018-07-24
Publication date: 2019-01-31

Abstract

Disclosed in the present invention are an encapsulating composition, an encapsulating film comprising the same, and an electronic component assembly; the encapsulating composition comprises a polymer matrix, a tackifier, and a free radical initiator; according to 100 parts by weight of the polymer matrix, the polymer matrix comprises 5-100 parts by weight of a highly branched polyethylene (P1), 0-95 parts by weight of a copolymer of ethylene and an α-olefin, and 0-70 parts by weight of a copolymer of ethylene and a polar monomer; the highly branched polyethylene (P1) is an ethylene homopolymer having a branched structure, the degree of branching thereof not being less than 40 branches/1000 carbons, while the density of the copolymer of ethylene and α-olefin is not higher than 0.91 g/cm3. The encapsulating composition provided by the present invention has good volume resistivity, aging resistance, and processability, while being low cost.

Description

Packaging composition and encapsulating film and electronic component assembly therewith

Technical field

The invention relates to a packaging composition, and relates to the application of the packaging composition as an encapsulating material in an encapsulating film, and the application of the encapsulating film in a product and a preparation method thereof, and to an electronic device assembly, Such as solar modules.

Background technique

Solar energy is an inexhaustible source of energy. It is safe, reliable, noise-free, pollution-free, renewable, and has a wide coverage. It is the most important new energy source at present. The main application form is to replace it with solar cells. Electrical energy. With the continuous development of solar cells, how to improve the life of solar cells and reduce the cost of solar cells by improving packaging materials and packaging processes has become one of the key issues. The solar cell module includes a solar cell sheet, a glass cover sheet, an encapsulant film, and a back sheet material. The encapsulating film is required to have a good light transmittance to ensure the luminous flux incident on the solar cell module, and also requires a high bonding strength between the film and the glass cover plate and the back sheet film to ensure the structure of the solar cell module. Stability to prevent the infiltration of harmful substances.

Due to the presence of solar radiation, solar modules may reach temperatures of 65 ° C (or higher) internally during use, so the packaging materials used must have excellent mechanical and creep resistance properties. Ethylene-vinyl acetate copolymer (EVA) is the most widely used encapsulating material on the market. For example, EVA described in the patent JP19870174967, after crosslinking, has good light transmittance (90% or more) in addition to the above properties. It can meet the general requirements of solar cell module packaging. However, under long-term solar radiation, EVA will decompose, releasing acetic acid to corrode the cell; after aging, it exhibits significant yellowing and severe potential-induced attenuation (PID), resulting in a decrease in the output power of the solar cell module. In order to make the encapsulating film have better aging resistance, it has become an industry trend to use a polyolefin chain whose molecular chain tends to be saturated, such as ethylene-octene copolymer (POE), as a polymer matrix for encapsulating film. EVA packaging film has significant advantages in aging resistance, electrical properties and moisture barrier properties, but it is inferior to traditional EVA in terms of transparency, cohesiveness, flowability and processing properties of the material itself. The same problem exists in double-glass solar modules, packaging materials, or double-glazed packaging materials for architectural decoration. The raw material cost and crosslinking time of the crosslinked POE packaging film are generally higher than that of the EVA packaging film, resulting in an increase in production cost. These performance and cost issues have somewhat limited polyolefins (especially polyolefin elastomers) as encapsulation films in solar cell modules such as single glass solar modules, double glass solar modules, thin film solar modules or The architectural decoration is used in double-glazed solar cells or as other forms of packaging materials.

Summary of the invention

The object of the present invention is to provide a packaging composition which can be used for making an encapsulating film and an encapsulating material, which is excellent in the technical defects of the encapsulating film and the like packaging material in the solar cell module of the prior art. Weather resistance, UV aging resistance, excellent high and low temperature resistance, electrical insulation properties and moisture barrier, good light transmission, adhesion and processing efficiency, while also having low raw material costs, It meets the long-term stable use requirements of various forms of solar cell modules, packaging materials, and double glazing. If the packaging material is required to have high reflectivity, it may not have good light transmittance.

In order to achieve the above object, the technical solution of the present invention provides a package composition comprising a polymer matrix, a tackifier and a radical initiator, the polymer matrix comprising highly branched polyethylene, the highly branched Polyethylene is a kind of ethylene homopolymer having a branching degree of not less than 40 branches/1000 carbons, wherein the method for synthesizing the highly branched polyethylene uses a late transition metal catalyst to catalyze ethylene homopolymerization by coordination polymerization. It is obtained that the preferred transition metal catalyst may be one of (α-diimine) nickel/palladium catalysts.

More specifically, the encapsulating composition comprises a polymer matrix, a tackifier and a radical initiator, wherein the polymer matrix comprises: 5 to 100 parts by weight of highly branched polyethylene, based on 100 parts by weight of the unit polymer matrix. (P1), 0 to 95 parts by weight of a copolymer of ethylene and an α-olefin, the highly branched polyethylene (P1) being an ethylene homopolymer having a branched structure, and having a branching degree of not less than 40 branches /1000 carbon.

The density of the above ethylene and α-olefin copolymer is preferably not higher than 0.91 g/cm ³ .

Another technical solution is that the encapsulating composition comprises a polymer matrix, a tackifier and a radical initiator, wherein the polymer matrix comprises: 5 to 100 parts by weight or 10 to 100 parts by weight based on 100 parts by weight of the unit polymer matrix. Highly branched polyethylene (P1), the highly branched polyethylene (P1) is a branched ethylene homopolymer, and its branching degree is not less than 40 branches / 1000 carbons; 0 ~ 95 Parts by weight or 0 to 90 parts by weight of a polyolefin (P2) different from highly branched polyethylene, which comprises crystalline polyethylene, propylene homopolymer, ethylene different from highly branched polyethylene a copolymer of an α-olefin, at least one of a binary or ternary copolymer of a monoolefin and a diene; 0 to 70 parts by weight of a copolymer of an olefin and a polar monomer, the olefin being ethylene or other One or more of the α-olefins.

In order to more clearly distinguish between highly branched polyethylene and polyolefins other than highly branched polyethylene, the above highly branched polyethylene code P1 may be imparted in some expressions to impart a polyolefin different from the above highly branched polyethylene. Codenamed P2.

Another technical solution is that the present invention provides an encapsulating material comprising the encapsulating composition of the above technical solution and having the form of a sheet or a film.

The above encapsulating material may be present in a crosslinked or partially crosslinked or uncrosslinked form.

Another technical solution is that the present invention provides an electronic device assembly comprising: at least one electronic device and an encapsulating material in intimate contact with at least one surface of the electronic device, the encapsulating material comprising a polymer matrix, a polymer The matrix comprises a highly branched polyethylene characterized by an ethylene homopolymer having a branched structure having a degree of branching of not less than 40 branches/1000 carbons, wherein The method for synthesizing highly branched polyethylene is obtained by catalyzing ethylene homopolymerization by coordination polymerization using a late transition metal catalyst. The preferred transition metal catalyst may be one of (α-diimine) nickel/palladium catalysts.

Another technical solution is that the present invention provides an electronic device assembly comprising: at least one electronic device and an encapsulating material in intimate contact with at least one surface of the electronic device, the encapsulating composition comprising a polymer matrix, An adhesive and a radical initiator, wherein the polymer matrix comprises: 5 to 100 parts by weight of highly branched polyethylene (P1), and 0 to 95 parts by weight of ethylene and an α-olefin copolymer, based on 100 parts by weight of the unit polymer matrix The highly branched polyethylene (P1) is an ethylene homopolymer having a branched structure, and has a degree of branching of not less than 40 branches/1000 carbons, and the density of the ethylene and the α-olefin copolymer Not higher than 0.91 g/cm ³ .

Another technical solution is that the present invention provides an electronic device assembly comprising: at least one electronic device and an encapsulating material in intimate contact with at least one surface of the electronic device, the encapsulating material comprising a polymer matrix, a polymer The matrix comprises: 5 to 100 parts by weight of highly branched polyethylene (P1), the highly branched polyethylene (P1) is an ethylene homopolymer having a branched structure, and its branching degree is not less than 40 branches/ 1000 carbon; 0 to 95 parts by weight or 0 to 90 parts by weight of a polyolefin (P2) different from highly branched polyethylene, the polyolefin (P2) comprising a crystalline polyethylene different from highly branched polyethylene a propylene homopolymer, a copolymer of ethylene and an α-olefin, a binary or a ternary copolymer of a monoolefin and a diene; and a copolymer of 0 to 70 parts by weight of an olefin and a polar monomer, The olefin is one or more of ethylene or other alpha-olefin.

The terms "intimate contact" and the like mean that the encapsulating material is in contact with at least one surface of the device or other article in a manner similar to the contact of the coating with the substrate, for example, there is little gap or void between the encapsulating material and the surface of the device ( If present, and the material exhibits good or excellent adhesion to the surface of the device. After the encapsulating material is extruded or otherwise applied to at least one surface of the electronic device, the material is typically formed and/or cured into a film, which may be either transparent or opaque, and It can be either flexible or rigid.

The assembly may also include one or more other items, such as one or more cover glass sheets, and in these embodiments, the encapsulating material is typically positioned between the electronic device and the cover glass in a sandwich configuration. If the encapsulating material is applied as a film to the surface of the cover glass opposite the electronic device, the surface of the film in contact with the surface of the cover glass may be smooth or uneven, for example, embossed or textured. Chemical.

The highly branched polyethylene of the present invention can be obtained by catalyzing ethylene homopolymerization by coordination polymerization using a late transition metal catalyst, and the preferred transition metal catalyst can be one of (α-diimine) nickel/palladium catalysts. In the polymerization process, the degree of branching, molecular weight, and melting point can be adjusted by adjusting the structure of the catalyst and the polymerization conditions. Specifically, in the case of a certain catalytic system, when the polymerization temperature is high and the polymerization pressure is low, the prepared product has a higher degree of branching, a lower molecular weight and a melting point, and when the polymerization temperature is lower, the polymerization is performed. When the pressure is high, the prepared product has a lower degree of branching, a higher molecular weight and a melting point. The molecular weights described in the specification are measured by PL-GPC220 in units of g/mol.

The highly branched polyethylene used in the present invention has a degree of branching of not less than 40 branches/1000 carbons, further preferably 45 to 130 branches/1000 carbons, still more preferably 60 to 116 branches/ 1000 carbons; weight average molecular weight ranging from 50,000 to 500,000, further preferably from 200,000 to 450,000; melting point not higher than 125 ° C, preferably from -44 ° C to 101 ° C, further preferably not higher than 90 ° C, further It is preferably -30 ° C to 80 ° C. The amount of the highly branched polyethylene is preferably from 20 to 100 parts by weight, and still more preferably from 40 to 100 parts by weight per 100 parts by weight of the unit polymer matrix.

The highly branched polyethylene used in the present invention may also preferably have a degree of branching of 60 to 85 branches/1000 carbons, or 62 to 83 branches/1000 carbons, or 67 to 75 branches/1000 Carbon; the weight average molecular weight may preferably be from 100,000 to 200,000, or from 102,000 to 213,000, or from 114,000 to 175,000; the molecular weight distribution is preferably from 1.3 to 3.5; the melting point is preferably not higher than 90 ° C, and may preferably be 40 to 80 ° C, or 55 to 65 ° C, or 70 to 80 ° C; the melt index measured at 190 ° C and a load of 2.16 kg may be 0.1 to 50 g/10 min, and may preferably be 5 to 25 g/10 min, further Preferably, it is 10 to 20 g/10 min, or 5 to 10 g/10 min, or 10 to 15 g/10 min, or 15 to 20 g/10 min; and the amount of the highly branched polyethylene is preferably 70 to 100 parts by weight per unit of the polymer matrix. 100 parts by weight.

The α-olefin in the copolymer of ethylene and α-olefin of the present invention has 3 to 30 carbon atoms selected from the group consisting of propylene, 1-butene, 1-pentene, 3-methyl-butene, and 1 -hexene, 4-methyl-1-pentene, 3-methyl-1-pentene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene Alkene, 1-octadecene, 1-eicosene, 1-icosadiene, 1-tetracosene, 1-dihexene, 1-terocene, and 1-triene. The α-olefin is preferably 1-butene, 1-hexene, 1-octene or 1-decene, and more preferably 1-octene. The copolymer of ethylene and an α-olefin may be a binary or multi-component copolymer, and a typical terpolymer may be an illustrative terpolymer including an ethylene/propylene/1-octene copolymer, ethylene/propylene/ 1-butene copolymer, ethylene/1-butene/1-octene copolymer, and the like. The amount of the ethylene and the α-olefin copolymer used is preferably from 0 to 70 parts by weight, more preferably from 10 to 50 parts by weight, still more preferably from 20 to 40 parts by weight per 100 parts by weight of the unit polymer matrix. The copolymer may be random or block. The copolymer of the above ethylene and the α-olefin is preferably an ethylene-1-octene copolymer or an ethylene-1-butene copolymer, further preferably an ethylene-1-octene copolymer, which is simply referred to as a polyolefin elastomer in practical use. (POE).

The weight percentage of the α-olefin in the ethylene and α-olefin copolymer is generally from 20% to 50%, preferably from 30% to 45%. When the weight percentage of octene in the ethylene-1-octene copolymer is 30% to 45%, the theoretically corresponding tertiary carbon atom ratio is 37.5 to 56.3 tertiary carbon atoms/1000 carbons, or corresponding branches. The degree of conversion is 37.5 to 56.3 branches/1000 carbons. In order to improve the ability and rate of grafting reaction and/or crosslinking reaction of the encapsulating composition without significantly affecting the aging resistance, the branched polyethylene used in the present invention has a branching degree of not less than 40 branches. /1000 carbons, further preferably not less than 60 branches / 1000 carbons.

When the α-olefin in the above copolymer of ethylene and α-olefin is propylene, the weight percentage of propylene in the copolymer is preferably more than 30%, further preferably more than 50%, further preferably more than 70%. In the practice of the present invention, the copolymer comprising ethylene and propylene may further comprise one or more diene comonomers for the preparation of these copolymers, especially suitable diene of the EPDM type including 4 to 20 Conjugated or non-conjugated, linear or branched, monocyclic or polycyclic diene of one carbon atom. Preferred dienes include 1,4-pentadiene, 1,4-hexadiene, 5-ethylidene-2-norbornene, dicyclopentadiene, cyclohexadiene, and 5-butylidene-2- Norbornene. A particularly preferred diene is 5-ethylidene-2-norbornene.

The ethylene homopolymer different from the highly branched polyethylene according to the present invention is a crystalline polyethylene having a low degree of branching and a high melting point, wherein the crystalline polyethylene preferably has a melting point of 80 ° C to 140 ° C, further Preferably, the melting point is from 90 ° C to 130 ° C. The crystalline polyethylene can be obtained by polymerization of a Ziegler-Natta catalyst or a metallocene catalyst. The propylene homopolymer is an isotactic polypropylene. Since polyethylene and polypropylene have crystallinity and can function as physical crosslinking points at high temperatures, the polyolefin film has sufficient thermomechanical properties in a thermoplastic state to meet processing and application requirements. The total amount of the crystalline polyethylene and polypropylene used is preferably from 0 to 30 parts by weight, more preferably from 10 to 20 parts by weight, per 100 parts by weight of the unit polymer matrix. The degree of branching of the above crystalline polyethylene different from highly branched polyethylene is generally less than 40 branches/1000 carbons, preferably less than 30 branches/1000 carbons.

The high number of branches and the complex branch distribution unique to highly branched polyethylene can better destroy the regularity of ethylene molecular chain and reduce crystallization compared to the regular branch distribution of α-olefin introduced into the copolymer of ethylene and α-olefin. The light transmittance is improved, so that the partial or total replacement of the other polyolefins with the highly branched polyethylene can improve the light transmittance and fluidity of the entire composition. On the other hand, the highly branched polyethylene has a relatively low cohesive force. In combination with some of the other polyolefins in the highly branched polyethylene, the cohesive force of the composition as a whole can be improved, and the tendency of cold flow during processing and molding can be reduced. When used in combination with the above different polyolefins, it is expected to enhance the impact resistance of the final product.

The olefin used in the preparation of the copolymer of the olefin and the polar monomer of the present invention includes at least one of an olefin monomer such as ethylene, propylene, 1-butene, 1-hexene or 1-octene. It is preferably ethylene.

The polar group-containing monomers used in the preparation of the copolymer of ethylene and polar monomers of the present invention include, but are not limited to, vinyl acetate, acrylic acid, methacrylic acid, methyl acrylate, ethyl acrylate, At least one of maleic anhydride and vinyltrimethoxysilane is preferably at least a copolymer of ethylene and vinyl acetate, a copolymer of ethylene and maleic anhydride, and a copolymer of ethylene and vinyltrimethoxysilane. One. It should be understood that the copolymer of ethylene and a polar monomer includes not only a copolymer obtained by directly polymerizing ethylene with a polar group-containing monomer but also a derivative of ethylene and a polar group-containing monomer during polymerization. When a copolymer such as ethylene is copolymerized with vinyl acetate, a vinyl alcohol copolymer and polyvinyl butyral derived in a polymerization reaction should also be included in the meaning of a copolymer of ethylene and a polar monomer. In the present invention, the copolymer of ethylene and a polar monomer is preferably a copolymer of ethylene and vinyl acetate (EVA), and the amount of EVA per 100 parts by weight of the unit polymer matrix is preferably 0 to 70 parts by weight, more preferably The range of the melting point of EVA is preferably from 14 to 45 g/10 min, more preferably from 13 to 30 g/10 min, still more preferably from 5 to 10 g/10 min, or from 10 to 15 g/10 min, or from 15 to 20 g/, in an amount of from 0 to 30 parts by weight. 10min.

When the amount of EVA is low, the main purpose is to improve the light transmittance of the composition by adding a small amount of EVA, and provide a certain adhesiveness, effectively reducing the amount of tackifier and free radical initiator, due to the low cost of EVA. For POE, it is also possible to reduce the production cost of the film. When the amount of EVA is high, the main purpose is to improve the weathering, aging resistance and yellowing resistance of EVA by introducing saturated polyolefin into EVA, and to improve volume resistivity and water vapor barrier property, and to improve electrical insulation. Highly branched polyethylene, because of its faster cross-linking rate relative to POE, can be more easily cross-linked with EVA to achieve the aforementioned benefits.

Ethylene homopolymers, copolymers of ethylene and α-olefins or other saturated polyolefins themselves are saturated aliphatic chain structures, do not contain polar groups, and have poor cohesiveness, so the encapsulating composition does not contain olefins and polarities. In the case where the monomer copolymer or the copolymer of the olefin and the polar monomer does not provide sufficient adhesion, it is necessary to enhance the adhesion by adding a tackifier.

In the present invention, the tackifier is used in an amount of from 0 to 10 parts, more preferably from 0.01 to 10 parts, further preferably from 0.1 part, or from 0.2 part, or from 0.5 part, based on 100 parts by weight of the polymer base. Or 1 part; the upper limit is further preferably 5 parts, or 4 parts, or 3 parts, or 2 parts; specifically, it may preferably be 0.1 to 5 parts, or 0.2 to 4 parts, or 0.5 to 2 parts.

The tackifier described in the present invention refers to a polar monomer which can introduce a polar functional group to a polymer molecular chain by a reaction route such as grafting to improve the adhesive property of the polymer film, and contains at least one ethylenic unsaturation. And a polar group, the polar group of the polar monomer may be at least selected from the group consisting of a carbonyl group, a carboxylate group, a carboxylic anhydride group, a siloxane group, a titanyl group, and an epoxide group. One.

The tackifier of the present invention preferably contains a siloxane-based silane coupling agent, wherein the silane coupling agent used has a functional group such as at least one of a vinyl group, an acryl group, an amino group, a chlorine group, and a phenoxy group. Specifically, the tackifier used may be selected from the group consisting of vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris(methoxyethoxy)silane, vinyltriacetoxysilane, γ- At least one of (meth)acryloxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane or γ-ketoacryloxypropyltrimethoxysilane.

In the present invention, the silane coupling agent may be used in an amount of 0.1 to 5 parts by weight based on 100 parts by weight of the polymer matrix, wherein, in order, preferably 0.5 to 5 parts by weight, 1 to 5 parts by weight, and 1 to 4 parts by weight Parts or 1 to 3 parts by weight. When the amount of the silane coupling agent is less than 0.1 parts by weight, the adhesive properties of the prepared encapsulating composition may be deteriorated. On the other hand, when the content of the silane coupling agent exceeds 5 parts by weight, more radical initiator should be used in consideration of the reaction efficiency, so that it is difficult to control the physical properties of the encapsulating composition, and the physical properties of the encapsulating composition. May be degraded.

The tackifier of the present invention may also be a titanate coupling agent, which may be added in a conventional amount.

The tackifier of the present invention may also be a composite tackifier composed of a silane coupling agent and a titanate coupling agent, which may be added in a conventional amount, preferably 0.2 to 2 parts by weight, and a silane in the composite tackifier. The coupling agent is preferably used in a specific gravity of more than 70%.

The tackifier of the present invention may also be selected from organic compounds containing at least one ethylenic unsaturation (e.g., a double bond) and a carbonyl group. Suitable and common polar monomers are carboxylic acids, anhydrides, esters and their metallic and non-metallic salts. An organic compound containing ethylenic unsaturation conjugated to a carbonyl group, preferably selected from the group consisting of maleic acid, fumaric acid, acrylic acid, methacrylic acid, itaconic acid, crotonic acid, alpha-methyl crotonic acid, and cinnamon At least one of an acid and their anhydrides, esters and salt derivatives. Among them, maleic anhydride is a preferred one. The tackifying organic compound may be used in an amount of 0.01 to 10 parts, preferably 0.05 to 5 parts, more preferably 0.1 to 2 parts, based on 100 parts by weight of the polymer base.

All of the above tackifiers are typically grafted onto the polymer matrix by any conventional means, or by ionizing radiation, in the presence of a free radical initiator such as a peroxide and an azo compound. The polymer matrix modified by grafting is preferably a highly branched polyethylene (P1).

A specific conventional grafting method may be: adding the polymer to a two-roll mill and mixing at a suitable temperature such as 60 ° C, and then bringing the unsaturated organic compound together with a radical initiator such as benzoyl peroxide. Add, and the components are mixed at 30 ° C until the grafting is completed. Another type of grafting process is similar, except that the reaction temperature is higher, for example from 210 ° C to 300 ° C, without the use of a free radical initiator, or with a reduced concentration.

In another embodiment of the invention, the polymer matrix further comprises a graft polymer to provide adhesion between the cover sheet and the electronic device, the graft polymer being a polyolefin polymer grafted with an unsaturated organic compound The unsaturated organic compound may be selected from the above-mentioned tackifiers, specifically a polar monomer comprising at least one ethylenic unsaturation and one polar group, the polar group comprising a carbonyl group, a carboxylate At least one of a group, a carboxylic anhydride group, a siloxane group, a titanyl group, and an epoxide group.

The grafted polymer is typically selected from saturated polyolefins, more typically from the previously described highly branched polyethylene (P1) and polyolefin (P2) other than highly branched polyethylene, preferably P1. At least a portion of P1 and/or P2 is grafted with the graft material by a conventional grafting reaction, and the unsaturated organic compound used is preferably a vinyl silane coupling agent or maleic anhydride.

On the saturated polyolefin molecular chain, the tertiary carbon atom is relatively easy to generate a radical under the action of a radical initiator, and then grafted with a tackifier (for example, a silane coupling agent) to obtain a modified polyolefin. Therefore, increasing the content of tertiary carbon atoms in the molecular chain of the polyolefin helps to improve the grafting efficiency with the silane coupling agent, which contributes to the improvement of the viscosity-increasing effect or reduces the silane coupling while satisfying the same adhesive performance requirements. The amount of the coupling agent and the radical initiator reduces the influence on the electrical insulation properties of the film and reduces the cost. In the existing packaging film production technology, ethylene and α-olefin copolymers are most commonly used as ethylene-octene copolymers, but each long-chain branch corresponds to only one tertiary carbon atom, and the tertiary carbon atoms are located in the main chain. The proportion of tertiary carbon atoms in the total number of carbon atoms of the polymer is generally not more than 5%, and highly branched polyethylenes generally have more tertiary carbon atoms due to the unique branched structure, and the tertiary carbon atoms occupy the carbon atoms of the polymer. The proportion of the total is generally not less than 5%, and some of the tertiary carbon atoms may be located on the branch, which somewhat reduces the influence of the β-branched chain on the overall performance of the polymer, so the partial or total replacement of the highly branched polyethylene is partially or completely replaced. The ethylene-octene copolymers of the prior art, under the same modification conditions, can impart better grafting efficiency and adhesion properties to the whole. Preferably, some or all of the highly branched polyethylene in the polymer matrix is grafted with all the silane coupling agent and the necessary free radical initiator, which can have higher grafting efficiency and grafting conditions. It can be varied, but the melting temperature is usually between 160 and 260 ° C, preferably between 190 and 230 ° C, depending on the residence time and the half-life of the initiator, and the highly branched polyethylene can have good fluidity by itself. It is more evenly dispersed throughout the blending process with the rest of the components.

When the polymer matrix directly comprises a polyolefin modified by grafting of a polar monomer, since the polymer matrix has a certain adhesiveness, the adhesive composition may be formulated without a tackifier or olefin-free. a copolymer of a polar monomer, but equivalent to a tackifier that has been added to the encapsulating composition in advance, so in this case a copolymer containing no copolymer of an olefin and a polar monomer and no tackifier Still within the scope of the technical solution of the present invention.

In the present invention, it is preferred to process the encapsulating composition into a cross-linked film, and then cross-linking curing of the saturated polyolefin generally requires the participation of a radical initiator, which can improve the thermal creep resistance of the polymer matrix and The durability of the components in terms of heat resistance, impact resistance and solvent resistance.

The radical initiator in the present invention may be selected from at least one of a peroxide, an azo initiator, and a photoinitiator. Preferred are heat activated compounds such as peroxides, and azo initiators.

The thermally activated radical initiator described in the present invention may be specifically selected from the group consisting of a dialkyl peroxide, a diperoxy ketal, an azo initiator, and the like, and more specifically may be selected from di-tert-butyl peroxide. Dicumyl peroxide, tert-butyl cumyl peroxide, 1,1-di-tert-butyl peroxide-3,3,5-trimethylcyclohexane, 2,5-dimethyl-2 ,5-di(tert-butylperoxy)hexane, 2,5-dimethyl-2,5-di-tert-butylperoxy-3-hexyne, 1,4-di-tert-butylperoxy Isopropylbenzene, tert-butyl peroxybenzoate, tert-butylperoxy-2-ethylhexyl carbonate, benzoyl peroxide, tert-butyl peroxy neodecanoate, tert-butyl peroxyacetate, At least one of t-butyl isooctanoate, methyl ethyl ketone peroxide, and azobisisobutyronitrile is oxidized. Among the radical initiators, those which are excellent in thermal stability and are less likely to produce by-products which affect the aging properties of the polymer, such as t-butylperoxy-2-ethylhexyl carbonate.

The polymer matrix in the encapsulating composition of the present invention may also be crosslinked and cured by methods such as radiation crosslinking, photocrosslinking, moisture crosslinking, and silane coupling. When radiation crosslinking is employed, the radiation source may be selected from at least one of infrared radiation, electron beam, beta ray, gamma ray, x-ray, and neutron ray, and an appropriate amount of a conventional radiation sensitizer may be added. When photocrosslinking is used, the light source may be selected from sunlight or ultraviolet light. The photoinitiator includes organic carbonyl compounds such as benzophenone, benzofluorenone, benzoin and its alkyl ether, 2,2-diethoxy Acetophenone, 2,2-dimethoxy-2-phenylacetophenone, p-phenoxydichloroacetophenone, 2-hydroxycyclohexyl phenyl ketone, 2-hydroxyisopropyl phenyl ketone And 1-phenylpropanedione-2-(ethoxycarboxy)anthracene. These initiators are used in a known conventional manner and in conventional amounts. When moisture crosslinking is employed, it is generally preferred to use one or more hydrolysis/complexation catalysts. These catalysts include Lewis acids such as dibutyltin dilaurate, dioctyltin dilaurate, stannous octoate, and acid sulfonates such as sulfonic acid.

In the present invention, the radical initiator may be used in an amount of preferably 0.05 to 10 parts by weight, more preferably 0.05 to 5 parts by weight per 100 parts by weight of the polymer base. When the crosslinked type film is produced, it may contain 0.1 to 10 parts by weight of a radical initiator, preferably 0.1 to 5 parts by weight, 0.2 to 4 parts by weight, 1 to 4.5 parts by weight or 1 to 4 parts by weight. When the amount of the radical initiator is less than 0.1 part by weight, the efficiency of the process is too low, and the degree of crosslinking of the prepared encapsulating composition is insufficient to impart sufficient crosslinking degree and creep strength to the encapsulating film. On the other hand, when the amount of the radical initiator exceeds 10 parts by weight, an increase in the production of a large amount of active radicals may cause a large amount of side reactions, for example, due to the presence of a branched structure, a β-fragmentation reaction occurs in the molecular main chain, resulting in a package combination. The physical properties of the object are reduced.

In the production process for producing a cross-linked type encapsulating film, the embodiment of the present invention is such that the content of the highly branched polyethylene is preferably 30 to 100 parts by weight, and more preferably 70 to 100 parts by weight of the unit polymer matrix. The encapsulating composition is used in an amount of from 0.1 to 10 parts by weight based on 100 parts by weight based on 100 parts by weight of the polymer matrix.

In the present invention, the partial or total replacement of the ethylene-α-olefin copolymer with the highly branched polyethylene is expected to shorten the crosslinking curing time and improve the production efficiency. This is because in the saturated polyolefin molecular chain, the tertiary carbon atom is most likely to form free radicals, and then a cross-linking reaction occurs between the tertiary carbon radicals to achieve a curing effect. The tertiary carbon atoms of the commonly used ethylene-α-olefin copolymers such as ethylene-octene copolymers in the prior art are all located in the main chain, and the movement is not free and the steric hindrance is large during the crosslinking process, and the highly branched polycondensation The proportion of tertiary carbon atoms in ethylene is generally higher than that of commonly used ethylene-α-olefin copolymers, and because some of the tertiary carbon atoms are distributed on the branches, the steric hindrance is small, and the space movement is relatively free, which is favorable for rapid crosslinking curing. .

In order to obtain better processing performance and performance, the encapsulating composition of the present invention comprises a radical activator, an ultraviolet absorber, a light stabilizer, an antioxidant, and further comprises glass fiber, plasticizer, nucleation. At least one of an agent, a chain extender, a flame retardant, an inorganic filler, a scorch retarder, a thermally conductive filler, a metal ion scavenger, a colorant, a whitening agent, and an antireflective modifier. The amount of the radical activator is 0 to 10 parts by weight, preferably 0.05 to 2 parts by weight, based on 100 parts by weight of the polymer base; the amount of the scorch inhibitor is 0 to 2 parts by weight; and the amount of the ultraviolet absorber is 0 to 2 parts by weight. The fraction is preferably 0.05 to 1 part by weight, 0.1 to 0.8 part by weight, and the antioxidant is used in an amount of 0 to 5 parts by weight, preferably 0.1 to 1 part by weight, and 0.2 to 0.5 part by weight, respectively; and the amount of the light stabilizer is 0 to ～ 5 parts by weight is preferably 0.05 to 2 parts by weight and 0.1 to 1 part by weight in this order.

The radical activator of the invention can prolong the life of the macromolecular radical generated by the hydrogen abstraction of the initiator, and has an auxiliary effect on the grafting reaction and the cross-linking curing. In terms of the crosslinking process, the radical activator can Known as a co-crosslinking agent, the radical activator may be selected from the group consisting of triallyl cyanurate, triallyl isocyanurate, ethylene glycol dimethacrylate, triethyl methacrylate Diester, triallyl trimellitate, trimethylolpropane trimethacrylate, N, N'-m-phenylene bismaleimide, N, N'-bis-decylene acetone, low At least one of molecular weight 1,2-polybutadiene. Among them, triallyl cyanurate, triallyl isocyanurate, ethylene glycol dimethacrylate, triethylene glycol dimethacrylate, trimethylolpropane trimethacrylate can also be used. As a radiation sensitizer.

One difficulty with using thermally activated free radical initiators to promote cross-linking of thermoplastic materials is that they may cause premature crosslinking, ie coking, prior to compounding and/or the actual stage of curing of the compound is desired throughout the processing. The gel particles produced by coking can adversely affect the uniformity of the final product. In addition, excessive coking also reduces the plastic properties of the material, making it inefficient for processing, and it is likely that the entire batch will be lost. Therefore, the present invention can also add a scorch retarder to suppress coking. A commonly used coking inhibitor for compositions containing free radical (especially peroxide) initiators is 4-hydroxy-2,2,6,6-tetramethylpiperidine-1-oxyl radical Also known as 4-hydroxy-TEMPO. 4-Hydroxy-TEMPO is added to inhibit coking by "freezing" the free radical crosslinking of the crosslinkable polymer at the melt processing temperature. The scorch inhibitor is used in an amount of from 0 to 2 parts by weight, preferably from 0.01 to 1.5 parts by weight, based on 100 parts by weight of the unit polymer base, more preferably from 10% to 50% by weight of the radical initiator.

In order to prolong the service life of the module, the ultraviolet absorber of the present invention is selected from the group consisting of benzophenones or benzotriazoles; the light stabilizer is selected from hindered amines or piperidine compounds, preferably benzotriazole ultraviolet absorption. The agent is used in combination with a hindered amine light stabilizer.

The ultraviolet absorber of the present invention is selected from the group consisting of benzophenone compounds such as 2-hydroxy-4-methoxybenzophenone, 2,2-dihydroxy-4-methoxybenzophenone, 2-hydroxyl -4-n-octyloxybenzophenone; benzotriazole compound, such as 2-(2'-hydroxy-3',5'-di-tert-butylphenyl)-benzotriazole, 2-(2 '-Hydroxy-5'-methylphenyl)-benzotriazole; salicylate compounds such as phenyl salicylate, p-octylphenyl salicylate. The light stabilizer of the present invention is selected from the group consisting of bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate, bis(1-octyloxy-2,2,6,6 -tetramethyl-4-piperidinyl) sebacate, 4-(meth)acryloyloxy-2,2,6,6-tetramethylpiperidine polymerized with an α-olefin monomer Graft copolymer, n-hexadecyl 3,5-di-tert-butyl-4-hydroxybenzoate, tris(1,2,2,6,6-pentamethylpiperidine) phosphite, succinic acid and At least one of polymers of 4-hydroxy-2,2,6,6-tetramethyl-1-piperidinol.

The antioxidant according to the present invention may be selected from at least one of a hindered phenol or a phosphite antioxidant, and preferably a hindered phenol antioxidant and a phosphite antioxidant. Specifically, it may be selected from 2,2'-methylenebis(4-methyl-6-tert-butylphenol), 2,2'-methylenebis(4-ethyl-6-tert-butylphenol), Pentaerythritol tetrakis(3,5-di-tert-butyl-4-hydroxy)phenylpropionate, bis(2,4-dicumylphenyl)pentaerythritol diphosphite, distearyl pentaerythritol diphosphite, three (nonylphenyl) phosphite, tris(2,4-di-tert-butylphenyl)phosphite, tris(1,2,2,6,6-pentamethylpiperidine)phosphite, 3 At least one of 5-di-tert-butyl-4-hydroxy-benzoic hexadecyl ester.

The types and amounts of the glass fibers or glass bubbles of the present invention are well known to those skilled in the art, and can effectively control the heat shrinkage deformation of the film.

The invention may also add a plasticizer to improve processing rheology, improve production efficiency and film formation uniformity; the plasticizer is selected from paraffin mineral oil, naphthenic oil and aromatic mineral oil; preferably paraffin mineral oil, in addition The plasticizer can also improve the wettability of the composition to the adherend, and further improve the bonding performance. As the plasticizer, at least one selected from the group consisting of phthalic acid esters, sebacic acid esters, adipates, and tricresyl phosphates may also be selected.

The invention may also add a nucleating agent to make the composition nucleate out of phase during the crystallization process, reduce the grain size and increase the light transmittance, and the nucleating agent is selected from the group consisting of dibenzylidene sorbitol and its derivatives: Benzylidene sorbitol, 1,3:2,4-di-p-methylbenzylidene sorbitol, 1,3:2,4-di(p-ethyl)benzyl sorbitol and di-(3,4-dimethyl At least one of benzylidene) sorbitol is preferably 1,3:2,4-di-p-methylbenzylidene sorbitol.

The flame retardant may be added to the present invention, and the flame retardant may be selected from one or more of nano aluminum hydroxide, nano magnesium hydroxide, nano silicon dioxide, nano zinc oxide and nano titanium dioxide, and may be further selected. One or more selected from the group consisting of nano-aluminum hydroxide, nano-magnesium hydroxide, nano-silica, nano-zinc oxide and nano-titanium dioxide, which may be selected from phosphate ester flame retardants, such as bisphenol One or more of A bis(diphenyl phosphate), triphenyl phosphate, and resorcinol bis (diphenyl phosphate) may also be selected from microencapsulated intumescent flame retardants, such as microencapsulation. Melamine polyphosphate borate. The different classes of flame retardants described above can also be formulated for use in accordance with prior art in the art.

The encapsulating film of the present invention is also used for adding an inorganic filler such as one or more of silica, titania, alumina, calcium carbonate, montmorillonite, and carbon nanotubes.

The invention can also add an auxiliary agent for the light-converting function to absorb the ultraviolet light of a specific wavelength band in the sunlight and emit visible light of a specific wavelength band, thereby reducing the aging effect of the ultraviolet light on the photovoltaic module and improving the spectral conversion efficiency of the component, and the above-mentioned light-transforming function The auxiliary agent may be selected from organic compounds having a large conjugated group in the molecular structure such as distyrylbisbenzoxazole and 2,5-bis(5-tert-butyl-2-benzoxazolyl). One or more of thiophene and 4,4-bis(5-methyl-2-benzoxazolyl)stilbene, and may also be selected from a mixed rare earth complex of a β-diketone and a pyridine derivative. , which may also be selected from one or more of polymerizable fluorescent monomers, which may be selected from the group consisting of bismuth, cerium, lanthanum, cerium, lanthanum, cerium, lanthanum, cerium, lanthanum acrylate. Any one or more of a methacrylate or an organic metal chelate of the two.

The invention can also add an anti-reflection modifier, participate in the crosslinking reaction through the anti-reflecting agent, further destroy the crystal structure of the polyolefin, and improve the light transmittance. The anti-reflection modifier may be selected from the group consisting of ethylene-methyl methacrylate copolymer, difunctional aliphatic urethane acrylate prepolymer, difunctional epoxy acrylate prepolymer, and difunctional polypolymer. Ester acrylate prepolymer, trifunctional polyether acrylate prepolymer, trifunctional aliphatic urethane acrylate prepolymer, tetrafunctional polyester acrylate prepolymer, tetrafunctional epoxy One or more of an acrylate prepolymer, a tetrafunctional polyether acrylate prepolymer, a hexafunctional aliphatic urethane acrylate prepolymer, and a hexafunctional epoxy acrylate prepolymer mixture. The anti-reflection modifier is preferably used in an amount of 0.1 to 1.5 parts by weight, more preferably 0.5 to 1 part by weight, per 100 parts by weight of the polymer base.

The present invention may also add one or more of a chain extender, a colorant, a whitening agent, a binding additive (e.g., polyisobutylene), etc., to achieve or improve the corresponding properties known in the art. These and other potential additives are used in the same manner and in the amounts generally known in the art.

In an embodiment of the present invention, the present invention provides an encapsulating material comprising the above-mentioned encapsulating composition, which has the form of a sheet or a film, and specifically may be an encapsulating film, and the specific processing methods include, but are not limited to, a T-die. Extrusion or calendering.

In a specific embodiment, the electronic device assembly provided by the present invention is a solar cell module. Specifically, it may comprise: (a) at least one electronic device, typically a plurality of such devices arranged in a line or planar pattern, (b) at least one cover glass, typically a cover glass on both surfaces of the device, And (c) at least one encapsulating material. The encapsulating material is typically placed between the cover glass and the electronic device, and the encapsulating material exhibits good adhesion to the device and cover sheet. If the device is required to be exposed to specific forms of electromagnetic radiation, such as sunlight, infrared, ultraviolet light, etc., then the polymeric material exhibits good, generally excellent, transparency properties to the radiation. The polymeric material may contain opaque fillers and/or pigments if the operation of the electronic device does not require transparency or if a single side requires a better reflective effect.

The invention provides a solar cell module having at least one encapsulating film in the structure, and at least one layer of the encapsulating film used comprises the above encapsulating composition. The term "solar" as used in the present invention may be equivalent to "photovoltaic". For example, a solar cell module can also be understood as a photovoltaic cell component.

The invention provides a solar cell module with a double-layer encapsulation film, comprising a supporting back plate, a solar power generating body (electronic device), a light receiving substrate and an encapsulating film, wherein the encapsulating film is supported on the back plate and There is a layer between the solar power generating bodies and between the light receiving substrate and the solar power generating body, wherein at least one of the sealing films comprises the above package composition. The solar power generation main body is a crystalline silicon solar cell sheet or a thin film solar cell sheet.

In the present invention, the above-mentioned support backing plate is used to protect the back side of the solar cell module from the external environment, and it requires weather resistance. In the present invention, the support back sheet includes a glass plate, a metal plate such as a foil (or aluminum), a fluororesin sheet, a cyclic polyolefin resin sheet, a polycarbonate resin sheet, a polyacrylic resin sheet, a polymethacryl resin sheet, At least one of a polyamide resin sheet, a polyester resin sheet, or a composite sheet in which a weather resistant film and a barrier film are laminated.

In the present invention, the light-receiving substrate formed on the solar power generation main body can realize the function of protecting the internal solar power generation main body from weather, external impact or fire, and ensuring long-term exposure of the solar cell module outdoors. reliability. The light-receiving substrate of the present invention is not particularly limited as long as it has excellent light transmittance, electrical insulation, and mechanical or physicochemical strength, and for example, a glass plate, a fluororesin sheet, a cyclic polyolefin resin sheet, or the like can be used. At least one of a polycarbonate resin sheet, a polyacryl resin sheet, a polymethacryl resin sheet, a polyamide resin sheet, a polyester resin sheet, and the like. In the embodiment of the invention, a glass plate having excellent heat resistance can be preferably used.

In the present invention, an encapsulant film disposed inside the solar cell module, particularly between the support substrate and the light-receiving substrate, which may include the above-described encapsulating composition according to the present application, and having Excellent adhesion to the support substrate and the light-receiving substrate, as well as excellent transparency, thermal stability, ultraviolet stability, and the like, thereby prolonging the life of the solar cell module.

The invention provides a solar cell module with a single-layer encapsulation film, which comprises a supporting backing plate, a solar power generating body, a light receiving substrate and an encapsulating film, wherein the encapsulating film is between the supporting backing plate and the solar power generating body Or between the light-receiving substrate and the solar power generating body, which comprises the above-described encapsulating composition.

The single-layer film-packaged solar cell module may be a thin film type solar cell module, and the solar power generating body may be usually formed on a light-receiving substrate composed of a ferroelectric material by a chemical vapor deposition method.

In the case of using the encapsulant film according to the present invention, after laminating the light-receiving substrate, the solar power generating body, the supporting substrate, and the encapsulating film according to the desired component structure can be subjected to hot pressing by vacuum suction. The apparatus prepares the above solar cell module.

The present invention provides a double glazing using an encapsulating material comprising the above encapsulating composition.

The present invention provides an encapsulating material comprising the above encapsulating composition.

The above encapsulating material has a structural form of a sheet or a film.

A method of preparing an encapsulant film comprising the above encapsulating composition, the method comprising the steps of:

Step 1. The polymer matrix, the tackifier and the free radical initiator are uniformly mixed with the remaining components and then blended and extruded into the extruder in one time. The remaining components refer to the polymer matrix in the encapsulating composition. a component other than a tackifier or a free radical initiator;

Step 2. The extrudate is cast into a film;

Step 3. Cooling and pulling for shaping;

Step 4, the final winding is available.

Step a, a part or all of the polymer matrix, all tackifiers, 3% to 20% by weight of the tackifier, the free radical initiator is first blended by an extruder, grafted, and extruded to obtain a graft modified Polymer matrix material A;

Step b, the polymer matrix A and the remaining components are uniformly mixed and then put into an extruder for blending and extruding, and the remaining components refer to components other than the polymer matrix A in the encapsulating composition;

Step c, the extrudate is cast into a film;

Step d, cooling, and pulling for shaping;

Step e, the final winding is obtained.

In another embodiment, the polymeric material of the electronic device assembly of the present invention in intimate contact with at least one surface of the electronic device is a coextruded material wherein at least one outer skin layer does not contain peroxide. If the extrusion material comprises three layers, the surface layer in contact with the component contains no peroxide and the core layer contains peroxide. The outer skin has good adhesion to one or both of the glass and the electronic device.

In another embodiment, the electronic device in the electronic device assembly of the present invention is encapsulated in an encapsulating material, ie, completely within or encased in the encapsulating material. In another variation of these embodiments, the cap layer is treated with a silane coupling agent, such as gamma-aminopropyltriethoxysilane. In yet another variation of these embodiments, the encapsulating material further comprises a graft polymer to increase its adhesion to one or both of the electronic device and the cover layer. The graft polymer is typically prepared in situ simply by grafting the highly branched polyethylene with an unsaturated organic compound containing a carbonyl group, such as maleic anhydride.

The beneficial effects of the invention are:

(1) Compared with the prior art olefin copolymer (POE) encapsulant film, the encapsulant film prepared by using the encapsulating composition of the present invention can have better processing properties (for example, processing efficiency) and lower. the cost of;

(2) Compared with the prior art EVA packaging film, the encapsulant film prepared by using the encapsulating composition of the invention has better weather resistance, aging resistance, yellowing resistance, and excellent electrical insulation. Water vapor barrier capability extends the life of solar cells.

Detailed ways:

The following examples are given to further illustrate the present invention, but are not intended to limit the scope of the present invention, and some non-essential improvements and adjustments made by those skilled in the art based on the present invention remain within the scope of the present invention. .

One of the embodiments of the present invention provides an encapsulating composition comprising a polymer matrix, a tackifier and a radical initiator, the polymer matrix comprising 5 to 100 weights per 100 parts by weight of the unit polymer matrix Highly branched polyethylene (P1), 0-95 parts by weight of ethylene and α-olefin copolymer, highly branched polyethylene (P1) is a branched ethylene homopolymer, and its branching degree is not lower than 40 branches/1000 carbons, the density of the ethylene and α-olefin copolymer is not higher than 0.91 g/cm ³ .

A second embodiment of the present invention provides a package composition comprising a polymer matrix, a radical initiator and a tackifier, wherein the highly branched polyethylene contained in 100 parts by weight of the polymer matrix is 5 to 100. Parts by weight (P1), comprising from 0 to 30 parts by weight based on the total weight of the crystalline polyethylene and polypropylene, and comprising from 0 to 95 parts by weight based on the weight of the ethylene and the α-olefin copolymer, comprising ethylene and a polar monomer. The weight of the copolymer is from 0 to 70 parts by weight. The amount of the radical initiator is 0.1 to 5 parts by weight, and the amount of the tackifier is 0.1 to 5 parts by weight based on 100 parts by weight of the polymer matrix.

A third embodiment of the present invention provides an encapsulating composition comprising a polymer matrix, a tackifier and a free radical initiator, the polymer matrix being a highly branched polyethylene.

The synthesis method of the highly branched polyethylene used is obtained by catalyzing the homopolymerization of ethylene by coordination polymerization using a late transition metal catalyst, and the preferred transition metal catalyst may be one of (α-diimine) nickel/palladium catalysts, from the cost. It is contemplated that the (α-diimine) nickel catalyst, the structure of the (α-diimine) nickel catalyst used, the synthesis method, and the method for preparing the branched polyethylene therefrom are disclosed prior art, and may be employed but not limited thereto. The following documents: CN102827312A, CN101812145A, CN101531725A, CN104926962A, US6103658, US6660677. The cocatalyst may be selected from one or more of diethylaluminum chloride, ethylaluminum dichloride, sesquiethylaluminum chloride, methylaluminoxane, and modified methylaluminoxane.

The highly branched polyethylene used can be adjusted to adjust the basic parameters such as the degree of branching, molecular weight and melting point by adjusting the structure of the catalyst and the polymerization conditions. The highly branched polyethylene used in the invention has a branching degree of not less than 40 branches/1000 carbons, further may be 45-130 branches/1000 carbons, and further may be 60-116 branches/1000 The carbon may further be 62 to 83 branches/1000 carbons; the weight average molecular weight may range from 50,000 to 500,000, further may be from 200,000 to 450,000, or from 100,000 to 200,000, or from 102,000 to 21.3. 10,000, or 114,000 ~ 175,000; melting point is not higher than 125 ° C, further may be -44 ° C ~ 101 ° C, further may be not higher than 90 ° C, further may be -30 ° C ~ 80 ° C, further may be 40 ° C The melt index measured at 190 ° C and a load of 2.16 kg may be 0.1 to 50 g/10 min, preferably 5 to 25 g/10 min, further preferably 5 to 25 g/10 min, at -80 ° C, or 55 to 65 ° C, or 70 to 80 ° C. For 10 to 20 g/10 min, or 5 to 10 g/10 min, or 10 to 15 g/10 min, or 15 to 20 g/10 min, the amount of highly branched polyethylene is preferably 70 to 100 per 100 parts by weight of the unit polymer matrix. Parts by weight.

The ethylene and α-olefin copolymer used is an ethylene-octene copolymer (POE).

The copolymer of ethylene and polar monomer used is an ethylene-vinyl acetate copolymer (EVA).

The free radical initiator used is a peroxide crosslinker such as t-butylperoxy-2-ethylhexyl carbonate.

The tackifier used is a silane coupling agent such as vinyltrimethoxysilane, vinyltriethoxysilane or vinyltris(methoxyethoxy)silane.

In a preferred embodiment, an auxiliary component can be added to the encapsulating composition to achieve or improve various properties in a targeted manner.

Auxiliary components, such as free radical activators, ultraviolet absorbers, light stabilizers, antioxidants, glass fibers, plasticizers, nucleating agents, chain extenders, flame retardants, inorganic fillers, scorch inhibitors, thermally conductive fillers, A metal ion scavenger, a colorant, a whitening agent, a leveling modifier, a binding additive, etc., and the auxiliary component is used in a conventional amount.

A method for preparing an encapsulating film comprising the above encapsulating composition, comprising the steps of:

(1) A part or all of the polymer matrix, all tackifiers, and 3% to 20% by weight of the tackifier are firstly subjected to graft modification by grafting, grafting and extruding through an extruder. Polymer matrix A. The extruder temperature is controlled at 50 to 210 °C.

(2), the polymer matrix A and the remaining components are uniformly mixed and then put into an extruder for blending and extruding, and the extrudate is cast into a film, shaped by cooling and drawing, and finally obtained by a winding process. The extruder temperature is controlled at 80 to 210 °C.

In order to more clearly describe the embodiments of the present invention, the materials involved in the embodiments of the present invention are defined below.

The highly branched polyethylene selected in the examples has the following characteristics: a branching degree of 46 to 130 branches/1000 carbons, a weight average molecular weight of 66,000 to 471,000, and a melting point of -44 to 101 °C. Among them, the degree of branching was measured by nuclear magnetic resonance spectroscopy, the molecular weight and molecular weight distribution were measured by PL-GPC220, and the melting point was measured by differential scanning calorimetry.

The details are as follows:

Performance test method:

(1) Crosslinking degree and peeling strength: measured according to GB/T 29848-2013 standard;

(2) Light transmittance: The sample was tested according to the spectrophotometer method of GB/T 2410-2008. The wavelength range of the spectrophotometer is set to be 290 nm to 1100 nm. The average values of the transmittances in the wavelength range of 290 nm to 380 nm and 380 nm to 1100 nm were respectively calculated. At least three samples were tested in each group and the test results were averaged. The light transmittance described in the embodiments of the present invention is a test result for a wavelength range of 380 nm to 1100 nm.

(3) Volume resistivity: first put the sample into the laboratory of 23 °C ± 2 °C, 50% ± 5% RH, at least 48h; then according to the requirements of GB/T 1410-2006, at 1000V ± 2V, The volume resistivity of the sample was tested under the condition of an electrochemical time of 60 min, and three samples were tested, and the results were averaged.

(4) Humidification and heat aging resistance and yellowing index: Firstly, all the samples are placed in a high temperature and high humidity aging test chamber, and the test conditions are set: temperature 85 °C ± 2 °C, relative humidity 85% ± 5%; test time is 1000h, after the end of the test, the sample was taken out, and after 2 to 4 hours of recovery in an open environment of 23 ° C ± 5 ° C and relative humidity of less than 75%, the appearance inspection was carried out, and no appearance defects were required. Finally, the laminate test before and after the test was performed separately. The sample is measured according to ASTM E313, and each sample is measured by not less than 3 points. The yellow index of the sample is taken as the average value of the measured points, and the difference in yellow index change before and after aging is recorded.

(5) Anti-PID performance test: A voltage of -1000 V was applied at 85 ° C and 85 RH% for testing.

Examples 1-8 and Comparative Example 1

Packaging film and its crosslinking speed test:

The packaged composition of the comparative polymer matrix of DOW ENGAGE 8137 and PER-15 was tested under the following formulation. The vulcanization time Tc90 was tested according to the national standard GB/T16584-1996, and the test temperature was 150 °C. The test duration is 30 minutes. The formulation is 100 parts by weight of polymer matrix, 1 part by weight of vinyltrimethoxysilane, 1 part by weight of t-butylperoxy-2-ethylhexyl carbonate, 0.5 part by weight of triallyl isocyanurate, 0.25 Parts by weight of pentaerythritol tetrakis(3,5-di-tert-butyl-4-hydroxy)phenylpropanate, 0.15 parts by weight of bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate And 0.15 parts by weight of 2-hydroxy-4-n-octyloxybenzophenone. The polymer matrix and the liquid component are soaked and mixed, and then the other components are blended and extruded in an extruder, the extrusion temperature is controlled at 90±1 ° C, and the residence time of the mixture in the extruder is 4 min. The extrudate is subjected to a film formation, cooling, slitting, and coiling process to obtain a transparent encapsulating film having a thickness of 0.5 mm. Cut the sample and stack it into about 5 grams of the sample to be tested for testing. The specific gravity of DOW ENGAGE 8137 and PER-15 in the polymer matrix and the corresponding Tc90 are shown in Table 1:

Table 1

By comparison of Examples 1-8 with Comparative Example 1, it can be clearly found that the cross-linking speed of the highly branched polyethylene having a suitable degree of branching is significantly higher than that of the polyolefin copolymer commonly used in the prior art, when the package composition or package is used. When the polymer matrix of the material is partially or completely made of highly branched polyethylene, under the same processing conditions, the crosslinking speed can be effectively increased, thereby shortening the crosslinking curing time required for the assembly during processing, and on the other hand, it can be effectively reduced. Energy consumption and increased productivity, on the other hand can protect electronic devices such as solar cells, reducing their residence time under high temperature and high pressure.

Examples 9 to 16 and Comparative Examples 1 and 2

The formulation components of Examples 9 to 16 and Comparative Examples 2 and 3 are shown in Table 2: (wherein the parts by weight of each component used per 100 parts by weight of the polymer matrix are listed)

Table 2

The encapsulating compositions of Examples 9 to 16 were kneaded by an internal mixer, and then calendered or extruded into a film having a film thickness of 0.5 mm, and flat glass and a TFT back sheet were attached to both surfaces of the film. The resulting laminate was then laminated in a vacuum laminator.

The performance test data of each test sample is shown in Table 3:

table 3

By comparison of Example 8, Example 15 and Comparative Example 2, it can be found that partially or completely replacing the POE in the prior art with highly branched polyethylene can impart better crosslinking degree, light transmittance, and Volume resistivity and adhesion to glass.

By comparison of Examples 9 to 14 and Comparative Example 3, it was found that the encapsulating film using the highly branched polyethylene as the polymer matrix has excellent transparency, and the solar cell using the encapsulating film has good power generation efficiency. Secondly, the encapsulating film with highly branched polyethylene as the polymer matrix has good peeling strength between the glass and the peeling strength between the glass after the heat and humidity aging resistance is much higher than that of the EVA encapsulant in the comparative example. The film and the yellowing index are also much lower than the EVA encapsulating film in the comparative example, indicating that the encapsulating film with the highly branched polyethylene as the polymer matrix in the invention has excellent adhesive properties and moist heat aging resistance, and can be more Good for outdoor environments. The novel encapsulating film provided by the invention adopts highly branched polyethylene whose molecular chain is all saturated hydrocarbon structure, so the high volume resistivity has a significant advantage in terms of electrical insulation relative to the EVA encapsulating film.

By comparison of Example 16 and Comparative Example 3, it can be found that replacing some of the prior art EVA with highly branched polyethylene can significantly improve the moisture aging resistance of the EVA packaging film, reduce the yellowing index and improve the electrical insulation. It has improved the performance defects of the existing EVA packaging film, and although the bonding strength with the glass is reduced, it still meets the industry standard of more than 60N/cm.

Example 17

Single glass solar module:

An encapsulant film having a thickness of 0.5 mm was prepared by a package composition comprising 100 parts by weight of PER-13 (190 ° C, MI of 1.16 kg load of 1 g/10 min), 1 part by weight of vinyltrimethoxysilane, 1 part by weight of t-butylperoxy-2-ethylhexyl carbonate, 0.5 part by weight of triallyl isocyanurate, 0.05 part by weight of 4-hydroxy-TEMPO, 0.25 part by weight of four (3,5-di-tert Pentaerythritol ester of butyl-4-hydroxy)phenylpropanate, 0.15 parts by weight of bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate, and 0.15 parts by weight of 2-hydroxy-4 - n-octyloxybenzophenone. The polymer matrix and the liquid component are soaked and mixed, and then the other components are blended and extruded in an extruder, the extrusion temperature is controlled at 90±1 ° C, and the residence time of the mixture in the extruder is 4 min. The extrudate is subjected to a film formation, cooling, slitting, and coiling process to obtain an encapsulating film having a thickness of 0.5 mm. The solar cell module was prepared by a lamination method at 145 ° C, wherein the encapsulant film was located between the glass cover plate and the solar cell, and also between the TPT back plate and the solar cell. Anti-PID test: After 192 hours of testing, the output power attenuation was 0.82%.

Example 18

Single glass solar module:

An encapsulant film having a thickness of 0.5 mm was prepared by a package composition comprising 90 parts by weight of PER-14 (190 ° C, MI of 2.16 kg load of 5 g/10 min), 10 parts by weight of maleic anhydride-modified ethylene. 1-octene copolymer (graft content of MAH is 1 wt%, MI: 1.5 g/10 min), 1 part by weight of vinyltrimethoxysilane, 1 part by weight of t-butylperoxy-2-ethylhexyl carbonate Ester, 0.5 parts by weight of triallyl isocyanurate, 0.05 parts by weight of 4-hydroxy-TEMPO, 0.25 parts by weight of pentaerythritol tetrakis(3,5-di-tert-butyl-4-hydroxy)phenylpropionate, 0.15 by weight Bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate, and 0.15 parts by weight of 2-hydroxy-4-n-octyloxybenzophenone. The polymer matrix and the liquid component are soaked and mixed, and then the other components are blended and extruded in an extruder, the extrusion temperature is controlled at 90±1 ° C, and the residence time of the mixture in the extruder is 4 min. The extrudate is subjected to a film formation, cooling, slitting, and coiling process to obtain an encapsulating film having a thickness of 0.5 mm. The solar cell module was prepared by a lamination method at 145 ° C, wherein the encapsulant film was located between the glass cover plate and the solar cell, and also between the TPT back plate and the solar cell. Anti-PID test: After 192 hours of testing, the output power attenuation was 0.88%.

Example 19

Single glass solar module:

An encapsulant film having a thickness of 0.5 mm was prepared by a package composition containing 70 parts by weight of PER-15 (190 ° C, MI at a load of 2.16 kg of 13 g/10 min), 30 parts by weight of Dow POE 8137, 1 part by weight. Vinyltrimethoxysilane, 1 part by weight of t-butylperoxy-2-ethylhexyl carbonate, 0.5 part by weight of triallyl isocyanurate, 0.25 parts by weight of tetrakis(3,5-di-tert-butyl Pentaerythritol 4-hydroxy) phenylpropionate, 0.15 parts by weight of bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate, and 0.15 parts by weight of 2-hydroxy-4-positive Octyloxybenzophenone. The polymer matrix and the liquid component are soaked and mixed, and then the other components are blended and extruded in an extruder, the extrusion temperature is controlled at 90±1 ° C, and the residence time of the mixture in the extruder is 4 min. The extrudate is subjected to a film formation, cooling, slitting, and coiling process to obtain an encapsulating film having a thickness of 0.5 mm. The solar cell module was prepared by a lamination method at 145 ° C, wherein the encapsulant film was located between the glass cover plate and the solar cell, and also between the TPT back plate and the solar cell. Anti-PID test: After 192 hours of testing, the output power attenuation was 0.81%.

Example 20

Single glass solar module:

An encapsulant film having a thickness of 0.5 mm was prepared by a package composition comprising 100 parts by weight of PER-18 (190 ° C, MI at a load of 2.16 kg of 30 g/10 min), 1 part by weight of vinyltrimethoxysilane, 1 part by weight of t-butylperoxy-2-ethylhexyl carbonate, 0.5 part by weight of triallyl isocyanurate, 0.05 part by weight of 4-hydroxy-TEMPO, 0.25 part by weight of four (3,5-di-tert Pentaerythritol ester of butyl-4-hydroxy)phenylpropanate, 0.15 parts by weight of bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate, and 0.15 parts by weight of 2-hydroxy-4 - n-octyloxybenzophenone. The processing method is as follows: all the polymer matrix, all the silane coupling agent and the peroxide having a weight of 10% of the silane coupling agent are uniformly mixed, and then added to a twin-screw extruder for blending and extrusion. The temperature of the feed end portion of the twin-screw extruder is 50 ° C, the temperature of the reactor portion injected with nitrogen is 210 ° C, and the temperature of the outlet after the reaction is 140 ° C, to obtain a graft modified polymer matrix material A; The graft-modified polymer base material A and the remaining components were uniformly mixed, and then extruded into a film by a twin-screw extruder and a T-die. Nitrogen was injected into the extruder and the extrusion temperature was controlled to 110 °C. The residence time of the mixture in the extruder was 4 min, and the extrudate was subjected to a film formation, cooling, slitting, and coiling process to obtain an encapsulating film having a thickness of 0.5 mm. The solar cell module was prepared by a lamination method at 145 ° C, wherein the encapsulant film was located between the glass cover plate and the solar cell, and also between the TPT back plate and the solar cell. Anti-PID test: After 192 hours of testing, the output power attenuation was 0.83%.

Example 21

Double glass solar cell module, wherein the two layers of the battery component are transparent film:

An encapsulant film having a thickness of 0.5 mm was prepared by a package composition comprising 100 parts by weight of PER-16 (190 ° C, MI at a load of 2.16 kg of 13 g/10 min), 1 part by weight of vinyltrimethoxysilane, 1 part by weight of t-butylperoxy-2-ethylhexyl carbonate, 0.5 part by weight of triallyl isocyanurate, 0.05 part by weight of 4-hydroxy-TEMPO, 0.25 part by weight of four (3,5-di-tert Pentaerythritol ester of butyl-4-hydroxy)phenylpropanate, 0.15 parts by weight of bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate, and 0.15 parts by weight of 2-hydroxy-4 - n-octyloxybenzophenone. The polymer matrix and the liquid component are soaked and mixed, and then the other components are blended and extruded in an extruder, the extrusion temperature is controlled at 90±1 ° C, and the residence time of the mixture in the extruder is 4 min. The extrudate is subjected to a film formation, cooling, slitting, and coiling process to obtain an encapsulating film having a thickness of 0.5 mm. The solar cell module is prepared by a lamination method at 145 ° C, wherein the solar cell is an N-type cell sheet, and the encapsulation film is located between the glass cover plate and the solar cell, and also between the glass cover plate and the solar cell. Anti-PID test: After 192 hours of testing, the output power attenuation was 0.63%.

Example 22

The double-glass solar cell module has a transparent film on the upper layer and a white film on the lower layer:

An upper encapsulant film having a thickness of 0.5 mm was prepared by a package composition comprising 100 parts by weight of PER-16 (190 ° C, MI at a load of 2.16 kg of 13 g/10 min), 1 part by weight of vinyl trimethoxysilane 1 part by weight of t-butylperoxy-2-ethylhexyl carbonate, 0.5 part by weight of triallyl isocyanurate, 0.05 part by weight of 4-hydroxy-TEMPO, 0.25 parts by weight of tetrakis(3,5-di Pentaerythritol tert-butyl-4-hydroxy)phenylpropanate, 0.15 parts by weight of bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate, and 0.15 parts by weight of 2-hydroxy- 4-n-octyloxybenzophenone. The polymer matrix and the liquid component are soaked and mixed, and then the other components are blended and extruded in an extruder, the extrusion temperature is controlled at 90±1 ° C, and the residence time of the mixture in the extruder is 4 min. The extrudate is subjected to a film formation, cooling, slitting, and coiling process to obtain a transparent encapsulating film having a thickness of 0.5 mm.

The lower encapsulant film having a thickness of 0.5 mm was prepared by a package composition containing 100 parts by weight of PER-16 (190 ° C, MI at a load of 2.16 kg of 13 g/10 min), 10 parts by weight of titanium oxide powder, and 1 part by weight. Vinyltrimethoxysilane, 1 part by weight of t-butylperoxy-2-ethylhexyl carbonate, 0.5 parts by weight of triallyl isocyanurate, 0.05 parts by weight of 4-hydroxy-TEMPO, 0.25 parts by weight of four Pentaerythritol (3,5-di-tert-butyl-4-hydroxy)phenylpropanate, 0.15 parts by weight of bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate, and 0.15 Parts by weight of 2-hydroxy-4-n-octyloxybenzophenone. The polymer matrix and the liquid component are soaked and mixed, and then the other components are blended and extruded in an extruder, the extrusion temperature is controlled at 90±1 ° C, and the residence time of the mixture in the extruder is 4 min. The extrudate is subjected to a film formation, cooling, slitting, and coiling process to obtain a transparent encapsulating film having a thickness of 0.5 mm.

The solar cell module is prepared by a lamination method at 145 ° C, wherein the solar cell is an N-type cell sheet, the transparent encapsulation film is located between the upper glass cover plate and the solar cell, and the white film is located in the lower glass cover plate and the solar cell. between. Anti-PID test: After 192 hours of testing, the output power attenuation was 0.68%.

Example 23

Double glass solar N-type double-sided battery assembly, wherein the battery is an N-type double-sided battery, and the two layers of the component are transparent plastic film:

An encapsulant film having a thickness of 0.5 mm was prepared by a package composition comprising 100 parts by weight of PER-16 (190 ° C, MI at a load of 2.16 kg of 13 g/10 min), 1 part by weight of vinyltrimethoxysilane, 1 part by weight of t-butylperoxy-2-ethylhexyl carbonate, 0.5 part by weight of triallyl isocyanurate, 0.05 part by weight of 4-hydroxy-TEMPO, 0.25 part by weight of four (3,5-di-tert Pentaerythritol ester of butyl-4-hydroxy)phenylpropanate, 0.15 parts by weight of bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate, and 0.15 parts by weight of 2-hydroxy-4 - n-octyloxybenzophenone. The polymer matrix and the liquid component are soaked and mixed, and then the other components are blended and extruded in an extruder, the extrusion temperature is controlled at 90±1 ° C, and the residence time of the mixture in the extruder is 4 min. The extrudate is subjected to a film formation, cooling, slitting, and coiling process to obtain an encapsulating film having a thickness of 0.5 mm. The solar cell module is prepared by a lamination method at 145 ° C, wherein the solar cell is an N-type double-sided cell sheet, and the encapsulation film is located between the glass cover plate and the solar cell, and also between the glass cover plate and the solar cell. Anti-PID test: After 192 hours of testing, the output power attenuation was 1.52%.

In general, the encapsulating film comprising the encapsulating composition of the invention has excellent weather resistance, aging resistance, yellowing resistance, electrical insulation and good optical properties and bonding in the case of a high content of highly branched polyethylene. Performance, compared to the existing EVA packaging film and POE packaging film, the advantages are obvious. In the case of low-branched polyethylene content, it is also expected to improve the performance defects of EVA packaging film and POE packaging film, and the production cost of highly branched polyethylene is theoretically significantly lower than POE, and the crosslinking speed Higher than POE, it can reduce the time cost and increase the production efficiency for the PV module supplier. Therefore, from the perspective of performance and cost, the solution of the present invention has obvious advantages over the prior art.

The above embodiments are merely preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention belong to the present invention. The scope of the claim.

Claims

A package composition comprising a polymer matrix, a tackifier and a free radical initiator, the polymer matrix comprising from 5 to 100 parts by weight of highly branched polyethylene (P1), based on 100 parts by weight of the unit polymer matrix 0 to 95 parts by weight of a copolymer of ethylene and an α-olefin, the highly branched polyethylene (P1) being an ethylene homopolymer having a branched structure, and having a degree of branching of not less than 40 branches/1000 carbons .
The encapsulating composition according to claim 1, wherein said highly branched polyethylene (P1) is obtained by post-transition metal catalyst catalyzed ethylene homopolymerization, and the degree of branching is not less than 60 branches/1000 Carbon has a weight average molecular weight of 100,000 to 220,000.
The encapsulating composition according to claim 1, wherein the α-olefin in the ethylene and α-olefin copolymer has 3 to 30 carbon atoms and is selected from the group consisting of propylene, 1-butene, and 1-pentene. , 3-methyl-butene, 1-hexene, 4-methyl-1-pentene, 3-methyl-1-pentene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicosene, 1-eidiene, 1-tetracosene, 1-dihexene, 1-28 At least one of the alkene and the 1-triene olefin, the ethylene and the α-olefin copolymer have a density of not more than 0.91 g/cm 3 .
The encapsulating composition according to claim 1, wherein the P1 and the ethylene-α-olefin copolymer have a melting point of not higher than 90 °C.
The encapsulating composition according to claim 1, wherein the encapsulating composition contained in the encapsulating composition is not less than 0.1 part by weight based on 100 parts by weight of the polymer matrix.
The encapsulating composition according to claim 1, wherein said tackifier is a polar monomer comprising at least one ethylenic unsaturation and a polar group, said polar group comprising a carbonyl group, At least one of a carboxylate group, a carboxylic anhydride group, a siloxane group, a titanyl group, and an epoxide group.
The encapsulating composition according to claim 1, wherein the tackifier is a silane coupling agent selected from the group consisting of vinyltrimethoxysilane, vinyltriethoxysilane, and vinyltris(methoxy). Ethoxy)silane, vinyltriacetoxysilane, γ-(meth)acryloxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-ketoacryloyloxy At least one of propyltrimethoxysilane.
The encapsulating composition according to claim 1, wherein the encapsulating composition further comprises not less than 0.1 part by weight based on 100 parts by weight of the unit polymer matrix.
The encapsulating composition according to claim 8, wherein said radical initiator comprises at least one of a peroxide, an azo-based initiator and a photoinitiator, said peroxide being selected from the group consisting of di-tert-butyl Base peroxide, dicumyl peroxide, tert-butyl cumyl peroxide, 1,1-di-tert-butyl peroxide-3,3,5-trimethylcyclohexane, 2,5- Dimethyl-2,5-di(tert-butylperoxy)hexane, 2,5-dimethyl-2,5-di-tert-butylperoxy-3-hexyne, 1,4-double Tert-butylperoxyisopropylbenzene, tert-butyl peroxybenzoate, tert-butylperoxy-2-ethylhexyl carbonate, benzoyl peroxide, tert-butyl peroxy neodecanoate, peracetic acid At least one of tert-butyl ester, t-butyl peroxyoctanoate, and methyl ethyl ketone peroxide.
The encapsulating composition according to claim 1, wherein the encapsulating composition further comprises a radical activator, an ultraviolet absorber, a light stabilizer, an antioxidant, a glass fiber, a plasticizer, a nucleating agent, At least one of a chain extender, a flame retardant, an inorganic filler, a scorch inhibitor, a thermally conductive filler, a metal ion scavenger, a colorant, a whitening agent, a binding additive, and an antireflective modifier.
The encapsulating composition according to claim 1, wherein the encapsulating composition further comprises 0.05 to 10 parts of a radical activator and 0 to 2 parts by weight of an ultraviolet absorber based on 100 parts by weight of the unit polymer matrix. 0 to 5 parts by weight of the antioxidant, 0 to 5 parts by weight of the light stabilizer, and 0 to 2 parts by weight of the scorch inhibitor, wherein the ultraviolet absorber is selected from the group consisting of an benzophenone compound, a benzotriazole compound, and water. At least one of the cation ester compounds, the light stabilizer is at least one selected from the group consisting of hindered amine compounds and piperidine compounds.
The encapsulating composition according to claim 1 wherein said polymer matrix further comprises a polyolefin polymer grafted with an unsaturated organic compound, said unsaturated organic compound comprising at least one ethylenic unsaturation and a polar group of a polar group comprising at least one of a carbonyl group, a carboxylate group, a carboxylic anhydride group, a siloxane group, a titanyl group, and an epoxide group.
The encapsulating composition according to claim 12, wherein the unsaturated organic compound is a vinyl silane coupling agent or maleic anhydride, and the grafted polyolefin polymer is selected from the group consisting of P1 or ethylene and an α-olefin. At least one of the copolymers.
An encapsulating material comprising the encapsulating composition according to any one of claims 1 to 13 in the form of a sheet or film.
An electronic device assembly comprising an electronic device and an encapsulating material in intimate contact with an electronic device surface, characterized in that the encapsulating material comprises the encapsulating composition of any one of claims 1 to 13.
The electronic device assembly of claim 15 wherein said electronic device is a solar cell.
The electronic device assembly of claim 15 wherein said electronic device assembly further comprises at least one cover glass.
An encapsulating composition comprising a polymer matrix, a tackifier and a free radical initiator, wherein the polymer matrix comprises from 5 to 100 parts by weight of highly branched polyally based on 100 parts by weight of the unit polymer matrix Ethylene (P1), 0 to 95 parts by weight of a polyolefin (P2) different from the highly branched polyethylene, and 0 to 70 parts by weight of a copolymer of ethylene and a polar monomer.
The encapsulating composition according to claim 18, wherein the highly branched polyethylene is an ethylene homopolymer having a branched structure, and the degree of branching is not less than 40 branches/1000 carbons, and the weight is The average molecular weight is 50,000 to 500,000, and the melting point is -44 to 101 °C.
The encapsulating composition according to claim 19, wherein said polyolefin (P2) different from highly branched polyethylene comprises crystalline polyethylene, propylene homopolymer, ethylene and α-olefin copolymer, single At least one of a binary or ternary copolymer of an olefin and a diene.
The encapsulating composition according to claim 18, wherein the highly branched polyethylene is obtained by homopolymerization of ethylene by a late transition metal catalyst, wherein the metal element in the late transition metal catalyst is nickel or palladium. One of them.
The encapsulating composition according to claim 18, wherein the crystalline polyethylene has a melting point of from 80 ° C to 140 ° C, which is obtained by polymerization of a Ziegler-Natta catalyst or a metallocene catalyst, at 100 weights. The content of the crystalline polyethylene in the unit polymer base is from 0 to 30 parts by weight.
The encapsulating composition according to claim 18, wherein the copolymer of ethylene and the α-olefin is used in an amount of from 0 to 70 parts by weight based on 100 parts by weight of the unit polymer matrix, and copolymerization of the ethylene and the α-olefin The α-olefin has 3 to 30 carbon atoms, and the α-olefin includes propylene, 1-butene, 1-pentene, 3-methyl-butene, 1-hexene, 4-methyl 1-pentene, 3-methyl-1-pentene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, At least one of 1-eicosene, 1-eidecadiene, 1-tetradecene, 1-dihexadecene, 1-octadecene, and 1-triaconne.
The encapsulating composition according to claim 18, wherein the polar group-containing monomer used in the preparation of the copolymer of ethylene and a polar monomer comprises vinyl acetate, acrylic acid, methacrylic acid. At least one of methyl acrylate, ethyl acrylate, and maleic anhydride.
The encapsulating composition according to claim 18, wherein the encapsulating composition comprises 0.1 to 5 parts by weight of the tackifier based on 100 parts by weight of the polymer matrix.
The encapsulating composition according to claim 25, wherein the tackifier introduces a polar functional group into the polyolefin molecular chain through a graft reaction pathway to improve the binding property of the polyolefin film to the polar monomer. The polar group of the polar monomer is at least one selected from the group consisting of a carboxylate group, a carboxylic anhydride group, a siloxane group, and an epoxide group, and the polar monomer is a siloxane group. A silane coupling agent, wherein the silane coupling agent used has a functional group containing at least one of a vinyl group, an acryl group, an amino group, a chlorine group, and a phenoxy group.
The encapsulating composition according to claim 26, wherein the tackifier is selected from the group consisting of vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris(methoxyethoxy)silane, At least one of vinyl triacetoxysilane or γ-ketoacryloxypropyltrimethoxysilane.
The encapsulating composition according to claim 18, wherein the encapsulating composition comprises 0.05 to 10 parts of a radical initiator based on 100 parts by weight of the polymer matrix.
The encapsulating composition according to claim 28, wherein said radical initiator is a peroxide selected from the group consisting of di-tert-butyl peroxide, dicumyl peroxide, and tert-butyl cumyl Oxide, 1,1-di-tert-butyl peroxide-3,3,5-trimethylcyclohexane, 2,5-dimethyl-2,5-di(tert-butylperoxy) Alkane, 2,5-dimethyl-2,5-di-tert-butylperoxy-3-hexyne, 1,4-di-tert-butylperoxyisopropylbenzene, tert-butyl peroxybenzoate, Tert-butylperoxy-2-ethylhexyl carbonate, benzoyl peroxide, tert-butyl peroxy neodecanoate, tert-butyl peroxyacetate, tert-butyl peroxyisophthalate, methyl ethyl ketone At least one of the oxides.
The encapsulating composition according to claim 18, wherein the encapsulating composition further comprises a radical activator, an ultraviolet absorber, a light stabilizer, an antioxidant, a glass fiber, a plasticizer, a nucleating agent, At least one of a chain extender, a flame retardant, a filler, a scorch retarder, a thermally conductive filler, a metal ion scavenger, a colorant, a whitening agent, and an antireflective modifier.
The encapsulating composition according to claim 30, wherein the encapsulating composition contains 0 to 10 parts of a radical activator and 0 to 2 parts of an ultraviolet absorber, based on 100 parts by weight of the unit polymer matrix. 0 to 5 parts of oxygen agent, 0 to 5 parts of light stabilizer, wherein the radical activator comprises triallyl cyanurate, triallyl isocyanurate, ethylene glycol dimethacrylate Ester, triethylene glycol dimethacrylate, triallyl trimellitate, trimethylolpropane trimethacrylate, N, N'-m-phenylene bismaleimide, N, N' At least one of bis-indenyl acetonone and 1,2-polybutadiene, the ultraviolet absorbing agent comprising at least one of a benzophenone or a benzotriazole, the light stabilizer comprising At least one of a hindered amine or a piperidine compound, the antioxidant comprising at least one of a hindered phenol or a phosphite antioxidant, the antioxidant comprising 2,2'-methylene double (4-methyl-6-tert-butylphenol), 2,2'-methylenebis(4-ethyl-6-tert-butylphenol), tetrakis(3,5-di-tert-butyl-4- Hydroxy) pentaerythritol phenylpropanate, bis(2,4-diyl) Phenyl) pentaerythritol diphosphite, distearyl pentaerythritol diphosphite, tris(nonylphenyl)phosphite, tris(2,4-di-tert-butylphenyl)phosphite, tris(1) At least one of 2,2,6,6-pentamethylpiperidine phosphite, 3,5-di-tert-butyl-4-hydroxy-benzoic hexadecyl ester.
A solar cell module characterized in that at least one layer of the encapsulant film used in the solar cell module comprises the encapsulating composition according to any one of claims 18 to 31.
The solar cell module according to claim 32, comprising a supporting backing plate, a solar power generating body, a light receiving substrate, and an encapsulating film, wherein the supporting backing plate and the solar power generating body, the light receiving substrate An encapsulating film is disposed between the solar power generating body, and the encapsulating film comprises the encapsulating composition, and the solar power generating body is a crystalline silicon solar cell sheet or a thin film solar cell sheet.
A method of processing a solar cell module according to claim 33, wherein, after laminating the light-receiving substrate, the solar power generating body, the supporting substrate and the encapsulating film are processed by a vacuum suctioning hot-pressing device .
A double glazing, characterized in that the encapsulating material used in the double glazing comprises the encapsulating composition according to any one of claims 18 to 31.
An encapsulating material, comprising the encapsulating composition according to any one of claims 18 to 31 in the encapsulating material.
A method of preparing an encapsulant film comprising the encapsulating composition of any one of claims 18 to 31, wherein the method comprises the steps of:

Step 1, the polymer matrix, the tackifier and the free radical initiator are uniformly mixed with the remaining components; and then put into the extruder and blended and extruded in one time;

Step 2. The extrudate is cast into a film;

Step 3. Cooling and pulling for shaping;

Step 4, the final winding is available.
A method of preparing an encapsulant film comprising the encapsulating composition of any one of claims 18 to 31, wherein the method comprises the steps of:

Step a, a part or all of the polymer matrix, all tackifiers, 3% to 20% by weight of the tackifier, the free radical initiator is first blended by an extruder, grafted, and extruded to obtain a graft modified Polymer matrix A,

Step b, the polymer matrix A and the remaining components are uniformly mixed and then put into an extruder for blending and extrusion;

Step c, the extrudate is cast into a film;

Step d, cooling, and pulling for shaping;

Step e, the final winding is obtained.