WO2022052209A1 - 一种芯片封装体及其制备方法 - Google Patents

一种芯片封装体及其制备方法 Download PDF

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Publication number
WO2022052209A1
WO2022052209A1 PCT/CN2020/121391 CN2020121391W WO2022052209A1 WO 2022052209 A1 WO2022052209 A1 WO 2022052209A1 CN 2020121391 W CN2020121391 W CN 2020121391W WO 2022052209 A1 WO2022052209 A1 WO 2022052209A1
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WIPO (PCT)
Prior art keywords
chip
package
face
plate
packaging
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PCT/CN2020/121391
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English (en)
French (fr)
Inventor
黄晓波
赵凡奎
Original Assignee
安徽龙芯微科技有限公司
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Publication of WO2022052209A1 publication Critical patent/WO2022052209A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/001—Drying-air generating units, e.g. movable, independent of drying enclosure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Definitions

  • the invention relates to the technical field of chip packaging technology, in particular to a chip packaging body and a preparation method thereof.
  • the chip package refers to the casing for mounting the semiconductor integrated circuit chip, which plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrical and thermal performance, and is also a bridge to communicate the internal world of the chip and the external circuit - the contacts on the chip are connected by wires To the pins of the package shell, these pins are connected with other devices through the wires on the printed board; the package plays an important role in the CPU and other LSI integrated circuits; the chip package in the prior art, leads The lack of protective structure between the pins makes it easy to generate static electricity between the pins, resulting in electrostatic interference that will affect the normal use of the chip; at the same time, the chip package has a poor drying effect during the packaging process, which makes the drying effect of silica gel relatively Therefore, it is necessary to design a chip package and a preparation method thereof.
  • the purpose of the present invention is to provide a chip package and a preparation method thereof.
  • the chip package has small size and good protection effect; when in use, it has good signal transmission effect and sensitive signal induction; at the same time, in the process of packaging,
  • the package body has a good drying and drying effect, so that the sealing performance of the chip can be improved, and the sealing effect is good.
  • the present invention provides the following technical solutions:
  • a chip package body comprising a package substrate, a package shell, an insulating plate, a chip assembly, a pin wiring board, an antistatic sleeve, a package cover plate, a package pin and a package substrate, wherein the top end face of the package substrate is provided with a package A substrate, the top end face of the packaging substrate is provided with an encapsulation shell, an insulating plate is installed on the inner bottom of the encapsulation shell, a pin wiring board is installed on the bottom end face of the insulating board, and the outer part of the pin wiring board is installed Encapsulation pins are inserted and installed all around, an anti-static sleeve is sleeved and installed at one end of the encapsulated pins, and one end of the anti-static sleeve is fixedly connected with the package shell, and a chip assembly is arranged above the top of the insulating plate, so An encapsulation cover plate is fixedly installed on the top end face of the encapsulation shell;
  • the chip assembly includes a heat-resistant glass constraining base, a chip body, a chip fixing plate, a silicon vibrating membrane, a medium pipe, a dielectric layer, a metal film, a bonding wire and a varistor, and the heat-resistant glass constraining base is mounted on an insulating Above the top of the board, a chip body is installed in the center of the top end face of the heat-resistant glass constraining base, a silicon vibration membrane is attached to the outside of the chip body, and a chip is attached to both sides of the bottom end face of the silicon vibration membrane.
  • a fixing plate, and the bottom of the chip fixing plate is fixedly connected with the heat-resistant glass restraint base, the top end face of the chip body is fitted with a dielectric layer, and the end faces on both sides of the dielectric layer are plugged and installed with varistors , and the bottom of the varistor is connected to the chip body through the dielectric layer and the silicon vibrating film, the tops of both sides of the end face of the dielectric layer are fitted with a metal film, and the top end face of the metal film is connected and installed with a key
  • the bonding wire is connected, and the other end of the bonding wire is connected to the pin wiring board through the insulating plate.
  • a preparation method of a chip package comprising the following steps:
  • Step S1 After cleaning the inside of the package shell, fix the pin wiring board inside the package shell, and pass the package pins through the anti-static sleeve to the pin wiring board inside the package shell to weld and fix, and the anti-static One end of the electrostatic sleeve is fixedly installed with the package shell, so that the package pins are fixed;
  • Step S2 welding and fixing the bottom end of the bonding wire of the chip assembly to the top of the pin wiring board, and filling and installing the insulating plate on the top of the pin wiring board, so that the bonding wire of the chip assembly penetrates the insulating board;
  • Step S3 after cleaning the chip body and installing it on the top of the heat-resistant glass constraining base, the heat-resistant glass constraining base and the insulating plate are bonded and fixed;
  • Step S4 Preliminarily encapsulate the chip assembly, connect the varistor to the chip body, and then mount the silicon vibrating membrane on the surface of the chip body. After the sleeve is completed, evenly coat the dielectric layer on the outside of the chip body. The surface of the silicon vibrating membrane makes the varistor pass through the dielectric layer and the silicon vibrating membrane to connect with the outside world, so that the chip body is preliminarily packaged;
  • Step S5 bonding and installing the metal film on the surface of the dielectric layer where the varistor is inserted and installed, so that the top of the varistor is connected to the metal film, and then the other ends of the bonding wires of the chip assembly are respectively connected to the metal film The top of the welding is fixed;
  • Step S6 After the wiring is completed, the package cover plate is fixedly installed inside the package shell, and the silica gel is injected into the outside of the chip body through the package substrate through the medium pipe on the bottom end face of the package substrate, and the entire chip package body is thermally cycled. After the drying device dries the molding, the packaging is completed.
  • step S1 silver paste is coated between the pin wiring board and the bottom inner wall of the package casing.
  • step S3 the steps of installing the chip body are as follows:
  • the thermal cycle drying device includes a drying box, a thermal cycle component, a thermal insulation top plate, a material rack, a storage board, a box door, a smoke exhaust component and a reinforced base.
  • a reinforced base is fixedly installed around the bottom end face of the box by welding, the top end face of the drying box is fixedly installed with a thermal insulation top plate, and a smoke exhaust component is fixedly installed on one side of the outer wall of the drying box, and the smoke exhaust component is connected with the drying box.
  • the interior of the drying box is connected, the inner top of the drying box is installed with a thermal cycle assembly, the inside of the drying box is provided with a material rack, and the interior of the material rack is installed with a number of storage boards.
  • the outer side of the box is fixedly installed with a box door through a hinge;
  • the thermal cycle assembly includes an electric control box, an electric heater, a blower motor, a centrifugal shaft, a centrifugal fan blade, an electric heating plate and a ventilation plate, and the electric control box is fixedly installed on the inner top of the drying box.
  • a ventilation plate is installed on the bottom end face of the box, and the bottom of the ventilation plate is communicated with the interior of the drying box, an electric heater is fixedly installed on one side of the inner side of the electric control box, and one end of the electric heater is connected and installed with an electric heating plate , and the electric heating plate is located on one side of the inner wall of the electric control box, the other side inside the electric control box is fixedly installed with a centrifugal fan blade, the center of the end face of the centrifugal fan blade is fixedly installed with a centrifugal shaft, and the blower motor passes through
  • the bolts are fixedly installed on one side of the top end face of the thermal insulation top plate, and one end of the top of the centrifugal shaft passes through the electric control box, and the thermal insulation top plate is fixedly connected with the motor shaft of the blower motor.
  • the guide blocks are fixedly installed on both sides of the bottom end face of the material rack, the inner bottom end face of the drying box is provided with two guide grooves, and the guide blocks are inserted into Installed inside the guide groove.
  • the smoke exhaust assembly includes a heat conduction cover, a smoke exhaust pipe and a flue gas purifier
  • the heat conduction cover is fixedly installed on one side of the outer wall of the drying box, and one end of the heat conduction cover is connected to the drying box
  • the other end of the heat-conducting cover is connected and installed with a smoke exhaust pipe, and one end of the top of the smoke exhaust pipe is connected and installed with a smoke purifier.
  • an anti-static sleeve is installed on the outside of the package pins, and the pin wiring board is installed and fixed on the bottom of the insulating plate, so that the top of the insulating plate has a good insulating effect, thereby Effectively reduce the situation of electrostatic interference; inside the package shell, the bonding wire is connected to the chip body through the dielectric layer, varistor and metal film, which can facilitate signal transmission, effectively improve the overall quality of signal transmission, and avoid static electricity. interference.
  • the entire chip package can be dried and dried by the thermal cycle drying device. Inside the thermal cycle drying device, the entire chip package can be dried. It has a good drying effect on the chip package. Through heat recycling, it can not only reduce the energy consumption, but also improve the drying effect of the chip package; at the same time, after the drying is completed, it can effectively reduce the amount of smoke generated. Pollution.
  • FIG. 1 is a schematic diagram of the overall structure of the chip package of the present invention.
  • Fig. 3 is the overall structure schematic diagram of the thermal cycle drying device of the present invention.
  • a chip package includes a package substrate 1, a package shell 2, an insulating plate 3, a chip assembly 4, a lead wiring board 5, an antistatic sleeve 6, a package cover plate 7, package pins 8 and a package substrate 9.
  • the top end face of the substrate 9 is provided with a package substrate 1
  • the top end face of the package substrate 1 is provided with an encapsulation shell 2
  • an insulating plate 3 is mounted on the inner bottom of the encapsulation shell 2
  • a pin wiring board 5 is mounted on the bottom end face of the insulating plate 3.
  • the outer periphery of the pin wiring board 5 is plugged and installed with package pins 8
  • one end of the package pins 8 is sleeved and installed with an anti-static sleeve 6, and one end of the anti-static sleeve 6 is fixedly connected with the package shell 2
  • the insulating plate A chip assembly 4 is arranged above the top of 3
  • the chip assembly 4 includes a heat-resistant glass constraining base 41, a chip body 42, a chip fixing plate 43, a silicon vibration film 44, a medium pipe 45, a dielectric layer 46, a metal film 47, a bonding
  • the heat-resistant glass constraining base 41 is installed above the top of the insulating plate 3
  • the chip body 42 is installed in the center of the top end face of the heat-resistant glass constraining base 41
  • the silicon vibration film is attached to the outside of the chip body 42 44.
  • Both sides of the bottom end face of the silicon vibrating membrane 44 are fitted with a chip fixing plate 43, and the bottom of the chip fixing plate 43 is fixedly connected with the heat-resistant glass constraining base 41, and the top end face of the chip body 42 is fitted with a dielectric.
  • Layer 46, the end faces on both sides of the dielectric layer 46 are plugged and installed with varistors 49, and the bottom of the varistor 49 is connected to the chip body 42 through the dielectric layer 46 and the silicon vibrating film 44.
  • the tops of both sides of the end face are fitted with a metal film 47, the top end face of the metal film 47 is connected and installed with a bonding wire 48, and the other end of the bonding wire 48 is connected to the pin wiring board 5 through the insulating plate 3, and the chip body is connected.
  • Silica gel is filled between 42 and the heat-resistant glass constraining base 41; the center of the end face of the heat-resistant glass constraining base 41 is provided with a medium pipe 45, and the bottom of the medium pipe 45 penetrates through the insulating plate 3, the packaging substrate 1 and the packaging substrate 9.
  • the sealing effect of the package is improved; the package cover plate 7 is fixedly installed on the top end face of the package shell 2 .
  • the package shell 2 can be supported by the package substrate 9 and the package substrate 1 , the top of the insulating plate 3 can be sealed by the package cover plate 7 , and the silica gel transported through the medium pipe 45 can improve the sealing effect inside the package shell 2 , by connecting the package pins 8 on one side of the anti-static sleeve 6 with the outside world, the interference between the package pins 8 can be avoided through the anti-static sleeve 6, inside the package shell 2; 5.
  • the chip body 42 is connected to the pin wiring board 5 through the bonding wires 48 of the chip assembly 4.
  • the dielectric layer 46, the varistor 49 and the metal film 47 can The bonding wire 48 is used for signal transmission, so as to facilitate the normal operation of the chip body 42, the chip body 42 is connected to the heat-resistant glass constraining base 41 through the chip fixing plate 43, and the silicon vibration film 44 on the outside of the chip body 42 can improve the signal transmission rate. transfer effect;
  • a preparation method of a chip package comprising the following steps:
  • Step S1 After cleaning the inside of the package shell 2, the pin wiring board 5 is fixedly installed inside the package shell 2, and the package pins 8 are passed through the anti-static sleeve 6 and the pin wiring board inside the package shell 2. 5. Solder and fix, and fix one end of the anti-static sleeve 6 with the package shell 2, so that the package pin 8 is fixed;
  • Step S2 Welding and fixing the bottom end of the bonding wire 48 of the chip assembly 4 to the top of the pin wiring board 5, and filling and installing the insulating plate 3 on the top of the pin wiring board 5, so that the bonding wire 48 of the chip assembly 4 through the insulating plate 3;
  • Step S3 after cleaning the chip body 42 and installing it on the top of the heat-resistant glass constraining base 41, the heat-resistant glass constraining base 41 and the insulating plate 3 are bonded and fixed;
  • the installation steps of the chip body 42 are as follows:
  • Step S4 Preliminarily encapsulate the chip assembly 4, connect the varistor 49 to the chip body 42, and then mount the silicon vibrating membrane 44 on the surface of the chip body 42 by socket. After the socket is completed, the dielectric layer 46 is uniform The surface of the silicon vibration film 44 outside the chip body 42 is painted, so that the varistor 49 is connected to the outside through the dielectric layer 46 and the silicon vibration film 44, so that the chip body 42 is preliminarily packaged;
  • Step S5 Bonding and installing the metal film 47 on the surface of the dielectric layer 46 where the varistor 49 is inserted and installed, so that the top of the varistor 49 is connected to the metal film 47, and then the bonding wires 48 of the chip assembly 4 are respectively connected The other ends of , respectively, are welded and fixed with the top of the metal film 47;
  • Step S6 After the wiring is completed, after the package cover plate 7 is fixedly installed inside the package shell 2, the silica gel is injected into the outside of the chip body 42 through the package substrate 1 through the medium pipe 45 on the bottom end face of the package substrate 9, and the entire After the chip package body is dried and formed by the thermal cycle drying device, the package is completed;
  • the thermal cycle drying device includes a drying box 01, a thermal cycle assembly 02, a thermal insulation top plate 03, a material rack 04, a storage board 05, a box door 07, a smoke exhaust assembly 08 and a reinforcement base 010.
  • the bottom end face of the drying box 01 The reinforced base 010 is fixedly installed on all sides by welding, the top end face of the drying box 01 is fixedly installed with a thermal insulation top plate 03, and one side of the outer wall of the drying box 01 is fixedly installed with a smoke exhaust assembly 08, and the smoke exhaust assembly 08 is connected to the drying box.
  • the interior of 01 is connected, and the smoke exhaust assembly 08 includes a heat conduction cover 081, a smoke exhaust pipe 082 and a flue gas purifier 083.
  • the heat conduction cover 081 is fixedly installed on one side of the outer wall of the drying box 01.
  • the other end of the heat-conducting cover 081 is connected and installed with a smoke exhaust pipe 082, and the top end of the smoke exhaust pipe 082 is connected and installed with a flue gas purifier 083, which can absorb and clean the flue gas evaporated by the material;
  • a thermal cycle assembly 02 is installed on the top of the inner side, and the thermal cycle assembly 02 includes an electric control box 021, an electric heater 022, a blower motor 023, a centrifugal shaft 024, a centrifugal fan blade 025, an electric heating plate 026 and a ventilation plate 027.
  • the electric control box 021 is fixedly installed on the inner top of the drying box 01, the bottom end face of the electric control box 021 is installed with a ventilation plate 027, and the bottom of the ventilation plate 027 is communicated with the interior of the drying box 01, and the inner side of the electric control box 021 is fixedly installed
  • There is an electric heater 022 one end of the electric heater 022 is connected and installed with an electric heating plate 026, and the electric heating plate 026 is located on one side of the inner wall of the electric control box 021, and the other side inside the electric control box 021 is fixedly installed with a centrifugal fan blade 025,
  • a centrifugal shaft 024 is fixedly installed in the center of the end face of the centrifugal fan blade 025,
  • the blower motor 023 is fixedly installed on the top end face side of the thermal insulation top plate 03 by bolts, and the top end of the centrifugal shaft 024 passes through the electric control box 021, the thermal insulation top plate 03 and the The motor shaft of the blower motor 023 is
  • the drying box 01 can be supported by the reinforcing base 010. After opening the box door 07, the material rack 04 is pulled, so that the guide block 06 at the bottom of the material rack 04 slides inside the guide groove 09, and the material rack 04 is removed from the drying box 01. Pull out the inside of the drying box, place the chip package that needs to be dried on the shelf 05 of the material rack 04, push the material rack 04, push the material rack 04 into the interior of the drying box 01, close the box door 07, and heat cycle
  • the component 02 works, the electric heater 022 inside the electric control box 021 works, so that the electric heating plate 026 can heat the inside of the drying box 01, and the heat can heat and dry the chip package body on the storage board 05, so that the chip package can be packaged.
  • the body can be dried quickly.
  • the blower motor 023 works, the centrifugal shaft 024 is rotated through the motor shaft, and the centrifugal fan blade 025 is rotated, so that the heat on the side of the material rack 04 can be circulated through the ventilation plate 027 to the
  • the other side of the material rack 04 allows the heat to be recycled inside the drying box 01 to improve the utilization rate of energy; after the drying is completed, the flue gas in the drying box 01 is cleaned by the exhaust gas
  • the purifier 083 works, the flue gas inside the drying box 01 can be absorbed by the smoke exhaust pipe 082 and the heat conduction cover 081, so as to prevent the flue gas from diffusing to the outside, and the box door 07 can be opened, so that the material rack 04 can be removed from the drying box 01. Pull out the inside of the rack, and take out the chip package on the storage board 05, so as to complete the drying; the thermal insulation top plate 03 can make the drying box 01 have a good thermal insulation effect.

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  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • General Engineering & Computer Science (AREA)
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  • Drying Of Solid Materials (AREA)

Abstract

一种芯片封装体及其制备方法，芯片封装体，包括封装衬底（1）、封装外壳（2）、绝缘板（3）、芯片组件（4）、引脚接线板（5）、防静电套（6）、封装盖板（7）、封装引脚（8）和封装基板（9），所述封装基板（9）的顶部端面设置有封装衬底（1），所述封装衬底（1）的顶部端面设置有封装外壳（2），所述封装外壳（2）的内侧底部安装有绝缘板（3），所述绝缘板（3）的底部端面安装有引脚接线板（5），所述引脚接线板（5）的外部四周均插接安装有封装引脚（8），所述封装引脚（8）的一端套接安装有防静电套（6）；所述芯片封装体，体积小巧，防护效果好；在使用时，具有良好的信号传递效果，信号感应灵敏；同时，在封装的过程中，使得封装体具有良好的干燥烘干效果，从而能够提高芯片的密封性，密封效果好。

Description

一种芯片封装体及其制备方法 技术领域
本发明涉及芯片封装工艺技术领域，具体为一种芯片封装体及其制备方法。
背景技术
芯片封装体是指安装半导体集成电路芯片用的外壳，起着安放、固定、密封、保护芯片和增强电热性能的作用，而且还是沟通芯片内部世界与外部电路的桥梁—芯片上的接点用导线连接到封装外壳的引脚上，这些引脚又通过印制板上的导线与其他器件建立连接；封装对CPU和其他LSI集成电路都起着重要的作用；现有技术中的芯片封装体，引脚之间缺乏防护结构，使得引脚之间容易产生静电，从而导致静电干扰会影响芯片的正常使用；同时，芯片封装体在封装的过程中，干燥效果较差，从而使得硅胶的干燥效果较差，进而影响芯片封装体的封装效果，因此，设计一种芯片封装体及其制备方法是很有必要的。
发明内容
本发明的目的在于提供一种芯片封装体及其制备方法，芯片封装体，体积小巧，防护效果好；在使用时，具有良好的信号传递效果，信号感应灵敏；同时，在封装的过程中，使得封装体具有良好的干燥烘干效果，从而能够提高芯片的密封性，密封效果好。
为实现上述目的，本发明提供如下技术方案：
一种芯片封装体，包括封装衬底、封装外壳、绝缘板、芯片组件、引脚接线板、防静电套、封装盖板、封装引脚和封装基板,所述封装基板的顶部端面设置有封装衬底,所述封装衬底的顶部端面设置有封装外壳,所述封装外壳的内侧底部安装有绝缘板,所述绝缘板的底部端面安装有引脚接线板,所述引脚接线板的外部四周均插接安装有封装引脚,所述封装引脚的一端套接安装 有防静电套,且防静电套的一端与封装外壳固定连接,所述绝缘板的顶部上方设置有芯片组件,所述封装外壳的顶部端面固定安装有封装盖板；
所述芯片组件包括耐热玻璃约束底座、芯片本体、芯片固定板、硅振动膜、介质管道、介电层、金属膜、键合引线和压敏电阻,所述耐热玻璃约束底座安装在绝缘板的顶部上方,所述耐热玻璃约束底座的顶部端面中央安装有芯片本体,所述芯片本体的外部贴合有硅振动膜,所述硅振动膜的底部端面两侧均贴合安装有芯片固定板,且芯片固定板的底部与耐热玻璃约束底座固定连接,所述芯片本体的顶部端面贴合安装有介电层,所述介电层的两侧端面均插接安装有压敏电阻,且压敏电阻的底部穿过介电层、硅振动膜与芯片本体连接,所述介电层的端面两侧顶部均贴合安装有金属膜,所述金属膜的顶部端面连接安装有键合引线,且键合引线的另一端穿过绝缘板与引脚接线板连接。
一种芯片封装体的制备方法，包括如下步骤：
步骤S1：将封装外壳的内部进行清洁后，将引脚接线板固定安装在封装外壳的内部，并将封装引脚穿过防静电套与封装外壳内部的引脚接线板焊接固定，并将防静电套的一端与封装外壳固定安装,使得封装引脚固定完成；
步骤S2：将芯片组件的键合引线的底部一端与引脚接线板的顶部焊接固定,将绝缘板填充安装在引脚接线板的顶部，使得芯片组件的键合引线贯穿绝缘板；
步骤S3：将芯片本体清洁后安装在耐热玻璃约束底座的顶部后，将耐热玻璃约束底座与绝缘板粘结固定；
步骤S4：将芯片组件进行初步封装处理，将压敏电阻与芯片本体连接，再将硅振动膜套接安装在芯片本体的表面，套接完成后，将介电层均匀涂刷在芯片本体外侧硅振动膜的表面，使得压敏电阻穿过介电层、硅振动膜与外界连接，从而芯片本体进行初步封装；
步骤S5：在介电层表面插接安装有压敏电阻的位置粘结安装金属膜，使 得压敏电阻的顶部与金属膜连接，再分别将芯片组件的键合引线的另一端分别与金属膜的顶部焊接固定；
步骤S6：接线完成后，将封装盖板固定安装在封装外壳的内部后，通过封装基板底部端面的介质管道穿过封装衬底将硅胶注入到芯片本体的外侧，将整个芯片封装体通过热循环烘干装置干燥成型后，从而完成封装。
作为本发明进一步的方案：所述步骤S1中，引脚接线板与封装外壳的底部内壁之间涂覆有银浆。
作为本发明进一步的方案：所述步骤S3中，芯片本体的安装步骤如下：
a、用去离子水和甲醇对芯片本体和耐热玻璃约束底座表面进行反复清洗；
b、清洗完成后,用氮气吹干,将芯片本体通过芯片固定板与耐热玻璃约束底座直接接触黏合。
作为本发明进一步的方案：所述步骤S6中，热循环烘干装置包括烘干箱、热循环组件、保温顶板、物料架、置物板、箱门、排烟组件和加固底座,所述烘干箱的底部端面四周均通过焊接固定安装有加固底座,所述烘干箱的顶部端面固定安装有保温顶板,所述烘干箱的外壁一侧固定安装有排烟组件,且排烟组件与烘干箱的内部连通,所述烘干箱的内侧顶部安装有热循环组件,所述烘干箱的内部设置有物料架,所述物料架的内部安装有若干个置物板,所述烘干箱的外部一侧通过合页固定安装有箱门；
所述热循环组件包括电控箱、电加热器、鼓风电机、离心轴、离心扇叶、电热板和通风板,所述电控箱固定安装在烘干箱的内侧顶部,所述电控箱的底部端面安装有通风板，且通风板的底部与烘干箱的内部连通，所述电控箱的内部一侧固定安装有电加热器,所述电加热器的一端连接安装有电热板,且电热板位于电控箱的内壁一侧,所述电控箱的内部另一侧固定安装有离心扇叶,所述离心扇叶的端面中央固定安装有离心轴,所述鼓风电机通过螺栓固定 安装在保温顶板的顶部端面一侧,且离心轴的顶部一端穿过电控箱、保温顶板与鼓风电机的电机轴固定连接。
作为本发明进一步的方案：所述物料架的底部端面两侧均固定安装有所述导向块,所述烘干箱的内侧底部端面开设有两个所述导向槽,且所述导向块插接安装在所述导向槽的内部。
作为本发明进一步的方案：所述排烟组件包括导热罩、排烟管和烟气净化器，所述导热罩固定安装在烘干箱的外壁一侧,所述导热罩的一端与烘干箱的内部连接,且导热罩的另一端连接安装有排烟管,且排烟管的顶部一端连接安装有烟气净化器。
与现有技术相比，本发明的有益效果是：
1.本发明的芯片封装体，通过在封装引脚的外侧套接安装防静电套，以及将引脚接线板安装固定在绝缘板的底部，从而使得绝缘板的顶部具有良好的绝缘效果，从而有效降低静电干扰的情况；在封装外壳的内部，通过介电层、压敏电阻和金属膜使得键合引线与芯片本体连接，从而能够便于进行信号传输，有效提高信号传输的整体质量，避免静电干扰。
2.本发明在封装的过程中，通过将芯片本体封装在封装外壳的内部后，再通过热循环烘干装置能够对整个芯片封装体进行干燥烘干，在热循环烘干装置的内部，能够对芯片封装体具有良好的烘干效果，通过热量循环利用，不仅能够降低能量的消耗，而且，能够提高芯片封装体的烘干效果；同时，在烘干完成后，能够有效降低烟气产生的污染。
附图说明
图1是本发明芯片封装体的整体结构示意图；
图2是本发明芯片封装体的整体剖视图；
图3是本发明的热循环烘干装置的整体结构示意图；
图4是本发明的热循环烘干装置的整体剖视图；
图中：1、封装衬底；2、封装外壳；3、绝缘板；4、芯片组件；5、引脚接线板；6、防静电套；7、封装盖板；8、封装引脚；9、封装基板；41、耐热玻璃约束底座；42、芯片本体；43、芯片固定板；44、硅振动膜；45、介质管道；46、介电层；47、金属膜；48、键合引线；49、压敏电阻；01、烘干箱；02、热循环组件；03、保温顶板；04、物料架；05、置物板；06、导向块；07、箱门；08、排烟组件；09、导向槽；010、加固底座；021、电控箱；022、电加热器；023、鼓风电机；024、离心轴；025、离心扇叶；026、电热板；027、通风板；081、导热罩；082、排烟管；083、烟气净化器。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参阅图1-4，本发明提供一种技术方案：
一种芯片封装体，包括封装衬底1、封装外壳2、绝缘板3、芯片组件4、引脚接线板5、防静电套6、封装盖板7、封装引脚8和封装基板9,封装基板9的顶部端面设置有封装衬底1,封装衬底1的顶部端面设置有封装外壳2,封装外壳2的内侧底部安装有绝缘板3,绝缘板3的底部端面安装有引脚接线板5,引脚接线板5的外部四周均插接安装有封装引脚8,封装引脚8的一端套接安装有防静电套6,且防静电套6的一端与封装外壳2固定连接,绝缘板3的顶部上方设置有芯片组件4,芯片组件4包括耐热玻璃约束底座41、芯片本体42、芯片固定板43、硅振动膜44、介质管道45、介电层46、金属膜47、键合引线48和压敏电阻49,耐热玻璃约束底座41安装在绝缘板3的顶部上方,耐热玻璃约束底座41的顶部端面中央安装有芯片本体42,芯片本体42的外部贴合有硅振动膜44,硅振动膜44的底部端面两侧均贴合安装有芯片固定板 43,且芯片固定板43的底部与耐热玻璃约束底座41固定连接,芯片本体42的顶部端面贴合安装有介电层46,介电层46的两侧端面均插接安装有压敏电阻49,且压敏电阻49的底部穿过介电层46、硅振动膜44与芯片本体42连接,介电层46的端面两侧顶部均贴合安装有金属膜47,金属膜47的顶部端面连接安装有键合引线48,且键合引线48的另一端穿过绝缘板3与引脚接线板5连接，芯片本体42与耐热玻璃约束底座41之间填充有硅胶；耐热玻璃约束底座41的端面中央开设有介质管道45,且介质管道45的底部贯穿绝缘板3、封装衬底1与封装基板9连通，提高封装的密封效果；封装外壳2的顶部端面固定安装有封装盖板7。
工作原理：通过封装基板9和封装衬底1能够对封装外壳2进行支撑，通过封装盖板7能够使得绝缘板3的顶部密封，通过介质管道45输送的硅胶能够提高封装外壳2内部的密封效果，通过将防静电套6一侧的封装引脚8与外界连接，通过防静电套6能够避免封装引脚8之间产生干扰，在封装外壳2的内部；通过绝缘板3使得引脚接线板5在绝缘板3的底部工作时避免产生静电干扰，通过芯片组件4的键合引线48将芯片本体42与引脚接线板5连接，通过介电层46、压敏电阻49和金属膜47能够使得键合引线48进行信号传输，从而能够便于芯片本体42正常工作，通过芯片固定板43将芯片本体42与耐热玻璃约束底座41连接，通过芯片本体42外侧的硅振动膜44能够提高信号的传递效果；
一种芯片封装体的制备方法，包括如下步骤：
步骤S1：将封装外壳2的内部进行清洁后，将引脚接线板5固定安装在封装外壳2的内部，并将封装引脚8穿过防静电套6与封装外壳2内部的引脚接线板5焊接固定，并将防静电套6的一端与封装外壳2固定安装,使得封装引脚8固定完成；
其中，引脚接线板5与封装外壳2的底部内壁之间涂覆有银浆，提高接 线的灵敏性；
步骤S2：将芯片组件4的键合引线48的底部一端与引脚接线板5的顶部焊接固定,将绝缘板3填充安装在引脚接线板5的顶部，使得芯片组件4的键合引线48贯穿绝缘板3；
步骤S3：将芯片本体42清洁后安装在耐热玻璃约束底座41的顶部后，将耐热玻璃约束底座41与绝缘板3粘结固定；
其中，芯片本体42的安装步骤如下：
a、用去离子水和甲醇对芯片本体42和耐热玻璃约束底座41表面进行反复清洗；
b、清洗完成后,用氮气吹干,将芯片本体42通过芯片固定板43与耐热玻璃约束底座41直接接触黏合；
步骤S4：将芯片组件4进行初步封装处理，将压敏电阻49与芯片本体42连接，再将硅振动膜44套接安装在芯片本体42的表面，套接完成后，将介电层46均匀涂刷在芯片本体42外侧硅振动膜44的表面，使得压敏电阻49穿过介电层46、硅振动膜44与外界连接，从而芯片本体42进行初步封装；
步骤S5：在介电层46表面插接安装有压敏电阻49的位置粘结安装金属膜47，使得压敏电阻49的顶部与金属膜47连接，再分别将芯片组件4的键合引线48的另一端分别与金属膜47的顶部焊接固定；
步骤S6：接线完成后，将封装盖板7固定安装在封装外壳2的内部后，通过封装基板9底部端面的介质管道45穿过封装衬底1将硅胶注入到芯片本体42的外侧，将整个芯片封装体通过热循环烘干装置干燥成型后，从而完成封装；
其中，热循环烘干装置包括烘干箱01、热循环组件02、保温顶板03、物料架04、置物板05、箱门07、排烟组件08和加固底座010,烘干箱01的底部端面四周均通过焊接固定安装有加固底座010,烘干箱01的顶部端面固 定安装有保温顶板03,烘干箱01的外壁一侧固定安装有排烟组件08,且排烟组件08与烘干箱01的内部连通,排烟组件08包括导热罩081、排烟管082和烟气净化器083，导热罩081固定安装在烘干箱01的外壁一侧,导热罩081的一端与烘干箱01的内部连接,且导热罩081的另一端连接安装有排烟管082,且排烟管082的顶部一端连接安装有烟气净化器083，能够将物料蒸发的烟气吸收清洁；烘干箱01的内侧顶部安装有热循环组件02,热循环组件02包括电控箱021、电加热器022、鼓风电机023、离心轴024、离心扇叶025、电热板026和通风板027,电控箱021固定安装在烘干箱01的内侧顶部,电控箱021的底部端面安装有通风板027，且通风板027的底部与烘干箱01的内部连通，电控箱021的内部一侧固定安装有电加热器022,电加热器022的一端连接安装有电热板026,且电热板026位于电控箱021的内壁一侧,电控箱021的内部另一侧固定安装有离心扇叶025,离心扇叶025的端面中央固定安装有离心轴024,鼓风电机023通过螺栓固定安装在保温顶板03的顶部端面一侧,且离心轴024的顶部一端穿过电控箱021、保温顶板03与鼓风电机023的电机轴固定连接；烘干箱01的内部设置有物料架04,物料架04的底部端面两侧均固定安装有导向块06,烘干箱01的内侧底部端面开设有两个导向槽09,且导向块06插接安装在导向槽09的内部，便于物料架04移动；物料架04的内部安装有若干个置物板05,烘干箱01的外部一侧通过合页固定安装有箱门07；
通过加固底座010能够将烘干箱01进行支撑，将箱门07打开后，拉动物料架04，使得物料架04底部的导向块06在导向槽09内部滑动，将物料架04从烘干箱01的内部拉出，将需要干燥烘干的芯片封装体放置在物料架04的置物板05上，推动物料架04，使得物料架04推入烘干箱01的内部后闭合箱门07，热循环组件02工作，电控箱021内部的电加热器022工作，使得电热板026能够对烘干箱01的内部进行加热，热量从而能够对置物板05上 的芯片封装体进行加热干燥，使得芯片封装体能够快速干燥，在干燥的过程中，鼓风电机023工作，通过电机轴使得离心轴024转动，进而使得离心扇叶025转动，从而能够使得物料架04一侧的热量通过通风板027循环到物料架04的另一侧，使得热量在烘干箱01的内部循环利用，提高能量的利用率；烘干完成后，通过排烟组件08将烘干箱01内的烟气进行清洁，烟气净化器083工作，通过排烟管082和导热罩081能够将烘干箱01内部的烟气吸收，从而避免烟气扩散到外界，打开箱门07，从而能够将物料架04从烘干箱01的内部拉出，将置物板05上的芯片封装体取出，从而完成干燥；保温顶板03能够使得烘干箱01具有良好的保温效果。
需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。
尽管已经示出和描述了本发明的实施例，对于本领域的普通技术人员而言，可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型，本发明的范围由所附权利要求及其等同物限定。

Claims (8)

  1. 一种芯片封装体，其特征在于，包括封装衬底(1)、封装外壳(2)、绝缘板(3)、芯片组件(4)、引脚接线板(5)、防静电套(6)、封装盖板(7)、封装引脚(8)和封装基板(9),所述封装基板(9)的顶部端面设置有封装衬底(1),所述封装衬底(1)的顶部端面设置有封装外壳(2),所述封装外壳(2)的内侧底部安装有绝缘板(3),所述绝缘板(3)的底部端面安装有引脚接线板(5),所述引脚接线板(5)的外部四周均插接安装有封装引脚(8),所述封装引脚(8)的一端套接安装有防静电套(6),且防静电套(6)的一端与封装外壳(2)固定连接,所述绝缘板(3)的顶部上方设置有芯片组件(4),所述封装外壳(2)的顶部端面固定安装有封装盖板(7)；
    所述芯片组件(4)包括耐热玻璃约束底座(41)、芯片本体(42)、芯片固定板(43)、硅振动膜(44)、介质管道(45)、介电层(46)、金属膜(47)、键合引线(48)和压敏电阻(49),所述耐热玻璃约束底座(41)安装在绝缘板(3)的顶部上方,所述耐热玻璃约束底座(41)的顶部端面中央安装有芯片本体(42),所述芯片本体(42)的外部贴合有硅振动膜(44),所述硅振动膜(44)的底部端面两侧均贴合安装有芯片固定板(43),且芯片固定板(43)的底部与耐热玻璃约束底座(41)固定连接,所述芯片本体(42)的顶部端面贴合安装有介电层(46),所述介电层(46)的两侧端面均插接安装有压敏电阻(49),且压敏电阻(49)的底部穿过介电层(46)、硅振动膜(44)与芯片本体(42)连接,所述介电层(46)的端面两侧顶部均贴合安装有金属膜(47),所述金属膜(47)的顶部端面连接安装有键合引线(48),且键合引线(48)的另一端穿过绝缘板(3)与引脚接线板(5)连接。
  2. 根据权利要求1的一种芯片封装体，其特征在于：所述芯片本体(42)与耐热玻璃约束底座(41)之间填充有硅胶；所述耐热玻璃约束底座(41) 的端面中央开设有介质管道(45),且介质管道(45)的底部贯穿绝缘板(3)、封装衬底(1)与封装基板(9)连通。
  3. 一种芯片封装体的制备方法，其特征在于，包括如下步骤：
    步骤S1：将封装外壳(2)的内部进行清洁后，将引脚接线板(5)固定安装在封装外壳(2)的内部，并将封装引脚(8)穿过防静电套(6)与封装外壳(2)内部的引脚接线板(5)焊接固定，并将防静电套(6)的一端与封装外壳(2)固定安装,使得封装引脚(8)固定完成；
    步骤S2：将芯片组件(4)的键合引线(48)的底部一端与引脚接线板(5)的顶部焊接固定,将绝缘板(3)填充安装在引脚接线板(5)的顶部，使得芯片组件(4)的键合引线(48)贯穿绝缘板(3)；
    步骤S3：将芯片本体(42)清洁后安装在耐热玻璃约束底座(41)的顶部后，将耐热玻璃约束底座(41)与绝缘板(3)粘结固定；
    步骤S4：将芯片组件(4)进行初步封装处理，将压敏电阻(49)与芯片本体(42)连接，再将硅振动膜(44)套接安装在芯片本体(42)的表面，套接完成后，将介电层(46)均匀涂刷在芯片本体(42)外侧硅振动膜(44)的表面，使得压敏电阻(49)穿过介电层(46)、硅振动膜(44)与外界连接，从而芯片本体(42)进行初步封装；
    步骤S5：在介电层(46)表面插接安装有压敏电阻(49)的位置粘结安装金属膜(47)，使得压敏电阻(49)的顶部与金属膜(47)连接，再分别将芯片组件(4)的键合引线(48)的另一端分别与金属膜(47)的顶部焊接固定；
    步骤S6：接线完成后，将封装盖板(7)固定安装在封装外壳(2)的内部后，通过封装基板(9)底部端面的介质管道(45)穿过封装衬底(1)将硅胶注入到芯片本体(42)的外侧，将整个芯片封装体通过热循环烘干装置干燥成型后，从而完成封装。
  4. 根据权利要求3的一种芯片封装体的制备方法，其特征在于：所述步骤S1中，引脚接线板(5)与封装外壳(2)的底部内壁之间涂覆有银浆。
  5. 根据权利要求3的一种芯片封装体的制备方法，其特征在于：所述步骤S3中，芯片本体(42)的安装步骤如下：
    a、用去离子水和甲醇对芯片本体(42)和耐热玻璃约束底座(41)表面进行反复清洗；
    b、清洗完成后,用氮气吹干,将芯片本体(42)通过芯片固定板(43)与耐热玻璃约束底座(41)直接接触黏合。
  6. 根据权利要求3的一种芯片封装体的制备方法，其特征在于：所述步骤S6中，热循环烘干装置包括烘干箱(01)、热循环组件(02)、保温顶板(03)、物料架(04)、置物板(05)、箱门(07)、排烟组件(08)和加固底座(010),所述烘干箱(01)的底部端面四周均通过焊接固定安装有加固底座(010),所述烘干箱(01)的顶部端面固定安装有保温顶板(03),所述烘干箱(01)的外壁一侧固定安装有排烟组件(08),且排烟组件(08)与烘干箱(01)的内部连通,所述烘干箱(01)的内侧顶部安装有热循环组件(02),所述烘干箱(01)的内部设置有物料架(04),所述物料架(04)的内部安装有若干个置物板(05),所述烘干箱(01)的外部一侧通过合页固定安装有箱门(07)；
    所述热循环组件(02)包括电控箱(021)、电加热器(022)、鼓风电机(023)、离心轴(024)、离心扇叶(025)、电热板(026)和通风板(027),所述电控箱(021)固定安装在烘干箱(01)的内侧顶部,所述电控箱(021)的底部端面安装有通风板(027)，且通风板(027)的底部与烘干箱(01)的内部连通，所述电控箱(021)的内部一侧固定安装有电加热器(022),所述电加热器(022)的一端连接安装有电热板(026),且电热板(026)位于电控箱(021)的内壁一侧,所述电控箱(021)的内部另一侧固定安装有离 心扇叶(025),所述离心扇叶(025)的端面中央固定安装有离心轴(024),所述鼓风电机(023)通过螺栓固定安装在保温顶板(03)的顶部端面一侧,且离心轴(024)的顶部一端穿过电控箱(021)、保温顶板(03)与鼓风电机(023)的电机轴固定连接。
  7. 根据权利要求6的一种芯片封装体的制备方法，其特征在于：所述物料架(04)的底部端面两侧均固定安装有所述导向块(06),所述烘干箱(01)的内侧底部端面开设有两个所述导向槽(09),且所述导向块(06)插接安装在所述导向槽(09)的内部。
  8. 根据权利要求6的一种芯片封装体的制备方法，其特征在于：所述排烟组件(08)包括导热罩(081)、排烟管(082)和烟气净化器(083)，所述导热罩(081)固定安装在烘干箱(01)的外壁一侧,所述导热罩(081)的一端与烘干箱(01)的内部连接,且导热罩(081)的另一端连接安装有排烟管(082),且排烟管(082)的顶部一端连接安装有烟气净化器(083)。
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