WO2022042414A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2022042414A1
WO2022042414A1 PCT/CN2021/113499 CN2021113499W WO2022042414A1 WO 2022042414 A1 WO2022042414 A1 WO 2022042414A1 CN 2021113499 W CN2021113499 W CN 2021113499W WO 2022042414 A1 WO2022042414 A1 WO 2022042414A1
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WO
WIPO (PCT)
Prior art keywords
antenna
frame
electronic device
metal layer
hole
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Application number
PCT/CN2021/113499
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English (en)
French (fr)
Inventor
邾志民
简宪静
王义金
Original Assignee
维沃移动通信有限公司
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Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2022042414A1 publication Critical patent/WO2022042414A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use

Definitions

  • the present application relates to the field of communication technologies, and in particular, to an electronic device.
  • a millimeter-wave radar antenna is installed on an electronic device such as a mobile phone
  • non-metallic materials such as the screen of the mobile phone and other electronic devices
  • the narrowing of the bandwidth and the distortion of the radiation pattern will affect the performance of the millimeter-wave radar antenna, such as the recognition distance and accuracy.
  • the millimeter wave antenna of the existing electronic device has the problem of poor performance.
  • the embodiments of the present application provide an electronic device, which can solve the problem of poor performance of a millimeter-wave antenna of an existing electronic device.
  • the embodiment of the present application provides an electronic device, including: a metal frame and a first antenna, wherein,
  • a frame of the metal frame body is provided with a first through hole, and a first filling medium is arranged in the first through hole;
  • the first antenna is located inside the frame, and includes a first metal layer, a substrate and a second metal layer that are stacked in sequence, and the first metal layer is arranged facing the frame, and the first metal layer is arranged There is a second through hole, and the orthographic projection of the first through hole on the first metal layer at least partially coincides with the second through hole.
  • a first through hole is formed on the frame, and a first filling medium is arranged in the first through hole, so as to maintain the structural integrity of the frame; an antenna, and because the first antenna can not only generate higher-frequency resonance in the required frequency band, but also can excite the current on the first through hole of the frame, so as to generate lower-frequency resonance in the required frequency band, thereby achieving
  • the two resonances are made close to each other to achieve the bandwidth characteristic and the purpose of improving the radiation performance of the first antenna.
  • FIG. 1 is one of the schematic structural diagrams of an electronic device provided by an embodiment of the present application.
  • FIG. 2 is a second schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • FIG. 3 is an impedance matching diagram of a millimeter-wave radar antenna provided by an embodiment of the present application.
  • FIG. 4 is an efficiency diagram of a millimeter-wave radar antenna provided by an embodiment of the present application.
  • FIG. 5 is a maximum gain diagram of the millimeter-wave radar antenna provided by the embodiment of the present application.
  • an embodiment of the present application provides an electronic device, including a metal frame body 10 and a first antenna 20 , wherein:
  • a frame 11 of the metal frame body 10 is provided with a first through hole 111, and a first filling medium (not shown) is arranged in the first through hole 111;
  • the first antenna 20 is located inside the frame 11, and includes a first metal layer 21, a substrate 22 and a second metal layer 23 that are stacked in sequence, and the first metal layer 21 is disposed facing the frame 11, and the first metal layer 21 is disposed with
  • the orthographic projection of the first through hole 111 on the first metal layer 21 at least partially overlaps with the second through hole 211 .
  • a first through hole 111 is opened on the frame 11 , and a first filling medium is arranged in the first through hole 111 to maintain the structural integrity of the frame;
  • the first antenna 20 ie the slot antenna
  • the first antenna 20 can also excite the current on the first through hole 111 of the frame 11, thereby A lower frequency resonance in the required frequency band is generated, thereby achieving the purpose of making the two resonances close to each other to achieve bandwidth characteristics and improving the radiation performance of the first antenna 20 .
  • the first antenna 20 may be a Substrate Integrated Waveguide (SIW) slot antenna.
  • SIW is a new microwave transmission form that utilizes metal through holes to realize the field propagation mode of the waveguide on a dielectric substrate.
  • the first metal layer 21 and the second metal layer 23 can be electrically connected through metallized vias 24, so that the first metal layer 21 and the second metal layer 23 form an SIW cavity, and the A second through hole 211 is arranged on a metal layer 21 for radiation, so that the first antenna 20 can not only generate a higher frequency resonance in the required frequency band, but also can excite the current on the first through hole 111 of the frame 11 to A lower frequency resonance in the required frequency band is generated, thereby achieving the purpose of making the two resonances close to each other to achieve bandwidth characteristics and improving the radiation performance of the first antenna 20 .
  • the substrate 22 can be a circuit board substrate with a dielectric constant of 2.2; in practical applications, the circuit board substrate can be flexibly selected according to requirements.
  • the first antenna 20 in the present application has bandwidth characteristics, and the SIW slot antenna based on Liquid Crystal Polymer (LCP) material can generate higher frequency resonance in the required frequency band, and at the same time it will excite the metal frame
  • LCP Liquid Crystal Polymer
  • the current on the first through hole 111 of 11 can generate a lower frequency resonance in the desired frequency band, and the two resonances can be made close to each other to realize the bandwidth characteristic.
  • the electronic device in this application can be a full-screen electronic device.
  • the full screen and the metal frame body 10 can be guaranteed.
  • better antenna performance is obtained, and no additional space is required to place the first antenna; thus, space coverage with high bandwidth and high gain is achieved on the basis of high screen ratio.
  • the electronic device also includes structures such as a back cover plate (not shown), a display screen (not shown), a glass cover plate (not shown), and the like.
  • the metal frame 10 is located between the back cover plate and the display screen, and can be The metal frame 10 is bonded to the back cover plate and the display screen by an adhesive, such as glue.
  • the back cover can be a casing or a battery cover, and the material can be plastic, glass or ceramics, etc.
  • the glass cover is placed on the display screen to protect the display screen.
  • the first antenna 20 is placed under the screen 30, so that the distortion of the radiation pattern of the antenna caused by the screen 40 can be effectively weakened, which is convenient for face recognition or gestures Better implementation of functions such as recognition.
  • the first antenna 20 may be located directly above the back cover plate, or located directly under the glass cover plate.
  • the metal frame 10 may further include a frame with a radiator (not shown) of the second antenna, and the frame 11 with the first through hole 111 and the frame with the radiator are different frames.
  • the second antenna may be a non-millimeter wave communication antenna, for example, 4G LTE or the like.
  • the first antenna 20 in the present application can be a millimeter-wave antenna, and can be integrated with a cellular antenna and a non-cellular antenna, that is, a millimeter-wave antenna is included in the cellular antenna and the non-cellular antenna, thereby saving the occupied space required by the antenna.
  • the electronic device further includes a grounding structure, and the metal frame body 10 is conductively connected to the grounding structure, so that the metal frame body 10 is grounded.
  • the first antenna chip 40 is further included, and the first antenna chip 40 is electrically connected to the first metal layer 21 through the wiring 50 to realize the radio frequency function of the first antenna 20 .
  • the traces 50 may be LCP traces made of LCP material.
  • the first filling medium can be plastic or silica gel, etc., to ensure the integrity of the appearance of the metal frame body 10; and the color of the exposed surface of the first filling medium can be consistent with the color of the metal frame body 10, so as to enhance the metal frame body 10.
  • the integrity of the housing 10 can be plastic or silica gel, etc.
  • a golden plastic material or a golden silicon crystal can be selected as the first filling medium, so as to maintain the integrity of the appearance of the metal frame body 10 .
  • a second filling medium 60 that can play a buffering role may also be provided, and the second filling medium 60 may be plastic or silica gel or the like.
  • a buffer layer such as a plastic layer or a silica gel layer, can be provided between the frame 11 and the first antenna 20, so that when the frame 11 is impacted, the impact force acting on the first antenna 20 can be reduced by the buffer layer and the external environment can be reduced. The impact force damages the first antenna 20 .
  • the first metal layer 21 is further provided with a groove for impedance matching.
  • the impedance matching effect of the first antenna 20 can be improved, thereby improving the radiation performance of the first antenna 20 .
  • the shape of the groove can be square, arc, etc.
  • a microstrip feeder 213 can also be formed on the first metal layer 21, and is electrically connected to the first antenna chip 40 through the microstrip feeder 213. Specifically, the microstrip feeder 213 is electrically connected to the wiring 50, and is The line 50 is electrically connected to the first antenna chip 40 , so that the first antenna 20 is fed through the microstrip feed line 213 .
  • the feeding form can be flexibly configured according to actual needs, such as coaxial feeding, coplanar waveguide feeding, etc.
  • the groove can be divided into at least two sub-grooves 212 by the microstrip feed line 213 , and the number of the sub-grooves 212 can be set according to the coverage frequency band of the first antenna 20 .
  • the number of sub-grooves 212 is two, that is, the microstrip feed line 213 divides the groove into two sub-grooves 212 .
  • the two sub-grooves 212 formed by being separated by the microstrip feeder 213 may be symmetrically arranged with respect to the microstrip feeder 213 to further improve the radiation performance of the first antenna 20 .
  • a plurality of first through holes 111 may be arranged on the frame 11, and a plurality of first antennas 20 may be arranged corresponding to the first through holes 111, and the plurality of first antennas 20 are linearly arranged on the frame 11 to improve the first
  • the performance of the antenna 20 identifies the effect.
  • a plurality of first through holes 111 can also be arranged on the frame 11, and a plurality of first antennas 20 can be arranged corresponding to the plurality of first through holes 111 to form millimeter waves
  • the array antenna can achieve the purpose of improving the antenna radiation performance of the electronic device without requiring additional space for placing the millimeter-wave array antenna.
  • the first antenna 20 is a millimeter-wave radar antenna as an example, and based on the return loss of -6dB, the coverable frequency band of the proposed millimeter-wave radar antenna is 56GHz-65.2Ghz, which can meet the current universal millimeter-wave radar antenna. Bandwidth requirements of wave radar antennas (57GHz to 64GHz).
  • the proposed millimeter-wave radar antenna has an efficiency of more than -3dB and greater than With a maximum gain of 4.5dB, the overall radiation performance of the proposed millimeter-wave radar antenna is good.
  • the radiation pattern of the millimeter-wave radar antenna at 60 GHz basically faces the side of the screen 30, and at the same time, the fluctuation of the radiation pattern is small, which can satisfy better performance.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Details Of Aerials (AREA)

Abstract

本申请提供一种电子设备，包括：金属框体和第一天线，其中，所述金属框体的一边框上设置有第一通孔，且所述第一通孔内设置有第一填充介质；所述第一天线位于所述边框的内侧，并包括依次层叠设置的第一金属层、基板和第二金属层，且所述第一金属层面向所述边框设置，所述第一金属层设置有第二通孔，所述第一通孔在所述第一金属层上的正投影与所述第二通孔至少部分重合。

Description

电子设备
相关申请的交叉引用
本申请主张在2020年8月26日在中国提交的中国专利申请号No.202010869355.X的优先权，其全部内容通过引用包含于此。
技术领域
本申请涉及通信技术领域，尤其涉及一种电子设备。
背景技术
目前，毫米波雷达天线设置在手机等电子设备上的时候，由于手机等电子设备的屏幕等非金属材质对毫米波雷达天线的影响较大，常会造成毫米波雷达天线的谐振频率发生偏移、带宽的缩窄以及辐射方向图的畸变，从而影响毫米波雷达天线的识别距离和精度等性能。
可见，现有的电子设备的毫米波天线存在性能差的问题。
发明内容
本申请实施例提供一种电子设备，能够解决现有的电子设备的毫米波天线存在性能差的问题。
为解决上述技术问题，本申请是这样实现的：
本申请实施例提供了一种电子设备，包括：金属框体和第一天线，其中，
所述金属框体的一边框上设置有第一通孔，且所述第一通孔内设置有第一填充介质；
所述第一天线位于所述边框的内侧，并包括依次层叠设置的第一金属层、基板和第二金属层，且所述第一金属层面向所述边框设置，所述第一金属层设置有第二通孔，所述第一通孔在所述第一金属层上的正投影与所述第二通孔至少部分重合。
在本申请实施例中，通过在边框上开设第一通孔，并在第一通孔内设置第一填充介质，以保持边框的结构的整体性；同时在对应第一通孔的位置设 置第一天线，并由于第一天线既能够产生所需频段内的较高频的谐振，也能够激励边框的第一通孔上的电流，从而产生所需频段内的较低频的谐振，进而达到使两个谐振相互靠近实现带宽特性，实现改善第一天线的辐射性能的目的。
附图说明
图1是本申请实施例提供的电子设备的结构示意图之一；
图2是本申请实施例提供的电子设备的结构示意图之二；
图3是本申请实施例提供的毫米波雷达天线的阻抗匹配图；
图4是本申请实施例提供的毫米波雷达天线的效率图；
图5是本申请实施例提供的毫米波雷达天线的最大增益图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
如图1至图5所示，本申请实施例提供一种电子设备，包括金属框体10和第一天线20，其中：
金属框体10的一边框11设置有第一通孔111，且第一通孔111内设置有第一填充介质(未图示)；
第一天线20位于该边框11的内侧，并包括依次层叠设置的第一金属层21、基板22和第二金属层23，且第一金属层21面向边框11设置，第一金属 层21设置有第二通孔211，第一通孔111在第一金属层21上的正投影与第二通孔211至少部分重合。
本实施方式中，在边框11上开设第一通孔111，并在第一通孔111内设置第一填充介质，以保持边框的结构的整体性；同时在对应第一通孔111的位置设置第一天线20(即缝隙天线)，并由于第一天线20能够产生所需频段内的较高频的谐振，同时第一天线20还能够激励边框11的第一通孔111上的电流，从而产生所需频段内的较低频的谐振，进而达到使两个谐振相互靠近实现带宽特性，实现改善第一天线20的辐射性能的目的。
其中，第一天线20可以是基片集成波导(Substrate Integrated Waveguide，SIW)缝隙天线，SIW是一种新的微波传输形式，其利用金属通孔在介质基片上实现波导的场传播模式。
如图2所示，第一金属层21和第二金属层23可以通过金属化过孔24电连接，以使第一金属层21和第二金属层23构成一个SIW腔体，并通过在第一金属层21上设置第二通孔211进行辐射，以使第一天线20既能够产生所需要频段内的较高频的谐振，也能激励边框11的第一通孔111上的电流，以产生所需频段内的较低频的谐振，进而达到使两个谐振相互靠近实现带宽特性，实现改善第一天线20的辐射性能的目的。
基板22可以采用介电常数为2.2的电路板基板；实际应用中，可以根据要求灵活选择电路板基板。
本申请中的第一天线20具有带宽特性，而且基于液晶聚合物(Liquid Crystal Polymer，LCP)材料的SIW缝隙天线能够产生所需频段内的较高频的谐振，同时其会激励起金属框体11的第一通孔111上的电流，从而产生所需频段内的较低频的谐振，并可以使两个谐振相互靠近，以实现带宽特性。
其中，本申请中的电子设备可以使全面屏电子设备，通过在边框11上设置第一通孔111，并对应第一通孔111设置第一天线20，可以在保证全面屏和金属框体10的外观前提下，获得较好的天线性能，而且不需要额外设置空间放置第一天线；从而在高屏占比的基础上，实现带宽高增益的空间覆盖。
其中，电子设备还包括背盖板(未图示)、显示屏(未图示)和玻璃盖板(未图示)等结构，金属框体10位于背盖板和显示屏之间，并可以通过粘接 剂，比如胶水，实现金属框体10与背盖板和显示屏的粘合。背盖板可以是壳体或者电池盖，其制作材料可以是塑胶、玻璃或者陶瓷等；玻璃盖板盖设于显示屏，以对显示屏进行保护。
这样，通过将第一天线20设置在边框11的内侧，可以避免第一天线20置于屏幕30下方，从而能够有效的削弱屏幕40对天线的辐射方向图造成的畸变，便于人脸识别或者手势识别等功能的更好实现。
其中，第一天线20可以位于背盖板的正上方，或者位于玻璃盖板的正下方。
其中，金属框体10上还可以包括设有第二天线的辐射体(未图示)的边框，且设有第一通孔111的边框11与设有辐射体的边框为不同的边框。第二天线可以是非毫米波通信天线，比如，4G LTE等。
而且，本申请中的第一天线20可以是毫米波天线，并可以与蜂窝天线、非蜂窝天线整合设计，即蜂窝天线、非蜂窝天线中包含毫米波天线，从而节省天线所需的占用空间。
另外，电子设备还包括接地结构，金属框体10与该接地结构导通连接，以使金属框体10接地。
可选的，还包括第一天线芯片40，第一天线芯片40通过走线50与第一金属层21电连接，以实现第一天线20的射频功能。
本实施方式中，走线50可以是LCP材料制成的LCP走线。
其中，第一填充介质可以是塑胶或者硅胶等，以保证金属框体10的外观的整体性；而且，第一填充介质的显露面的颜色可以与金属框体10的颜色保持一致，以提升金属框体10的整体性。
比如，当金属框体10为金色的时候，可以选用金色的塑胶材料或者金色的硅晶作为第一填充介质，以保持金属框体10的外观的整体性。
在边框11和第一天线20之间，还可以设置能够起到缓冲作用的第二填充介质60，第二填充介质60可以是塑胶或者硅胶等。
具体的，可以在边框11和第一天线20之间设置缓冲层，比如塑胶层或者硅胶层，以便当边框11受到冲击时，可以通过缓冲层降低作用于第一天线20的冲击力，降低外界冲击力对第一天线20的破坏。
可选的，第一金属层21上还设置有用于阻抗匹配的凹槽，通过设置凹槽可以改善第一天线20的阻抗匹配效果，进而改善第一天线20的辐射性能。
其中，凹槽的形状可以是方形、弧形等。
进一步的，还可以第一金属层21上形成微带馈线213，并通过微带馈线213与第一天线芯片40电连接，具体的，通过微带馈线213与走线50电连接，并通过走线50与第一天线芯片40电连接，从而实现通过微带馈线213对第一天线20进行馈电。
在实际应用中，可以根据实际需求，灵活配置馈电形式，比如同轴馈电、共面波导馈电等。
其中，可以通过微带馈线213将凹槽分隔成至少两个子凹槽212，且子凹槽212的数量可以根据第一天线20的覆盖频段进行设置。
可选的，子凹槽212的数量为两个，即微带馈线213将凹槽分隔成两个子凹槽212。
而且，被微带馈线213分隔形成的两个子凹槽212可以相对于微带馈线213对称设置，以进一步改善第一天线20的辐射性能。
其中，可以在边框11上设置多个第一通孔111，并对应第一通孔111设置多个第一天线20，且多个第一天线20在边框11上线性摆放，以提升第一天线20的性能识别效果。
需要说明的是，在保证电子设备的外观前提下，还可以在边框11上设置多个第一通孔111，并对应多个第一通孔111设置多个第一天线20，以形成毫米波阵列天线，并可以在不需要额外设置空间放置毫米波阵列天线的情况下，达到改善电子设备的天线辐射性能的目的。
而且，可以在维持电子设备的金属框体10的外观设计的前提下，无需增加电子设备的整机尺寸，就能实现在高屏占比的情况下，实现带宽高增益的空间覆盖。
如图3所示，第一天线20为毫米波雷达天线为例，并以-6dB回波损耗计算，所提出的毫米波雷达天线的可覆盖频段为56GHz～65.2Ghz，可满足目前通用的毫米波雷达天线的带宽需求(57GHz～64GHz)。
基于图4所示的毫米波雷达天线的总效率图和如图5所示的毫米波雷达 天线的最大增益图可知，所提出的毫米波雷达天线在阻抗带宽内具有-3dB以上的效率和大于4.5dB的最大增益，所提出的毫米波雷达天线整体的辐射性能良好。
而且，毫米波雷达天线在60GHz时的辐射方向图基本朝向屏幕30那一面，同时其辐射方向图的起伏较小，能满足更好的性能。
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (10)

  1. 一种电子设备，包括：金属框体和第一天线，其中，
    所述金属框体的一边框上设置有第一通孔，且所述第一通孔内设置有第一填充介质；
    所述第一天线位于所述边框的内侧，并包括依次层叠设置的第一金属层、基板和第二金属层，且所述第一金属层面向所述边框设置，所述第一金属层设置有第二通孔，所述第一通孔在所述第一金属层上的正投影与所述第二通孔至少部分重合。
  2. 根据权利要求1所述的电子设备，还包括第一天线芯片，所述第一天线芯片通过走线与所述第一金属层电连接。
  3. 根据权利要求2所述的电子设备，其中，所述第一金属层上还设置有用于阻抗匹配的凹槽。
  4. 根据权利要求3所述的电子设备，还包括用于电连接所述第一金属层和所述走线的微带馈线，所述微带馈线将所述凹槽分隔成两个子凹槽。
  5. 根据权利要求4所述的电子设备，其中，两个所述子凹槽相对于所述微带馈线对称设置。
  6. 根据权利要求3所述的电子设备，其中，所述凹槽的形状为方形、弧形。
  7. 根据权利要求2至6中任一项所述的电子设备，其中，所述第一金属层和所述边框之间设置有第二填充介质。
  8. 根据权利要求2至6中任一项所述的电子设备，其中，所述走线为液晶聚合物走线。
  9. 根据权利要求2至6中任一项所述的电子设备，其中，所述第一填充介质为塑胶、硅胶中的任一项。
  10. 根据权利要求2至6中任一项所述的电子设备，其中，所述金属框体上还包括设有第二天线的辐射体的边框，且设有所述第一通孔的边框与设有所述辐射体的边框为不同的边框。
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