WO2022105828A1 - 天线及电子设备 - Google Patents

天线及电子设备 Download PDF

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Publication number
WO2022105828A1
WO2022105828A1 PCT/CN2021/131438 CN2021131438W WO2022105828A1 WO 2022105828 A1 WO2022105828 A1 WO 2022105828A1 CN 2021131438 W CN2021131438 W CN 2021131438W WO 2022105828 A1 WO2022105828 A1 WO 2022105828A1
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Prior art keywords
dielectric layer
microstrip line
feeding
antenna
frame
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PCT/CN2021/131438
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English (en)
French (fr)
Inventor
王义金
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维沃移动通信有限公司
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Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2022105828A1 publication Critical patent/WO2022105828A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H01Q1/244—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas extendable from a housing along a given path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors

Definitions

  • the present application relates to the field of communication technologies, and in particular, to an antenna and an electronic device.
  • the millimeter-wave antenna design scheme mainly adopts the technology and process of the antenna-in-package (AIP), which combines the millimeter-wave array antenna, the radio frequency integrated circuit (RFIC) and the power management integrated circuit (Power Management Integrated Circuit).
  • AIP antenna-in-package
  • RFIC radio frequency integrated circuit
  • PMIC power management integrated circuit
  • Embodiments of the present application provide an antenna and an electronic device to solve the problem that the existing millimeter-wave antenna design solution will occupy the radiation space of other antennas, resulting in degradation of antenna performance.
  • an embodiment of the present application provides an antenna, including a metal frame, a feeding carrier board, and a floor;
  • the metal frame includes a first frame, the first frame is provided with at least one first through hole, the feeder board is located inside the first frame, and the feeder board includes a first dielectric layer, A second dielectric layer and at least one first feeding structure, the first dielectric layer is located between the first frame and the second dielectric layer, and the first feeding structure is provided on the second dielectric layer Between the first dielectric layer and the first dielectric layer, the number of the first feeding structures is the same as the number of the first through holes, and the at least one first feeding structure and the at least one first through hole are one-to-one corresponding settings.
  • an embodiment of the present application further provides an electronic device, including the antenna described in the first aspect.
  • the first frame of the metal frame is provided with at least one first through hole
  • the feeder board is located inside the first frame
  • the feeder board is connected with a feed structure, such as a millimeter wave
  • the feeding structure means that the millimeter-wave antenna and the metal frame of the electronic device are designed together, and the metal frame is used as the radiator to obtain better antenna performance.
  • the design of the present application reduces the occupation of the internal space of the electronic device, and also reduces the area of the opening on the metal frame, which is more conducive to the development of the electronic device to be lighter and thinner.
  • 1 is a structural diagram of an electronic device to which the antenna provided by an embodiment of the present application is applied;
  • Fig. 2 is the partial structure diagram of the first frame in Fig. 1;
  • FIG. 3 is an exploded view of an antenna provided by an embodiment of the present application.
  • FIG. 4 is an exploded view of a feeding carrier board in an antenna provided by an embodiment of the present application.
  • FIG. 5 is a structural diagram of a first feeding structure and a first through hole in an antenna provided by an embodiment of the present application;
  • FIG. 6 is an exploded view of a feeding carrier board in another antenna provided by an embodiment of the present application.
  • FIG. 7 is a partial structural diagram of the third dielectric layer and the fourth dielectric layer in FIG. 6 .
  • An embodiment of the present application provides an antenna.
  • the antenna includes a metal frame 10 , a feed board 20 and a floor 30
  • the metal frame 10 may be a frame of an electronic device casing.
  • the metal frame 10 includes a first frame 11 , at least one first through hole 12 is formed on the first frame 11
  • the feeder board 20 is located inside the first frame 11
  • the feeder board 20 includes a first dielectric layer 21 , a second The dielectric layer 22 and at least one first feeding structure 41
  • the first dielectric layer 21 is located between the first frame 11 and the second dielectric layer 22, and the first feeding structure 41 is provided on the second dielectric layer 22 and the first dielectric layer 21, the number of the first feeding structures 41 is consistent with the number of the first through holes 12, and at least one first feeding structure 41 and at least one first through hole 12 are provided in a one-to-one correspondence.
  • the first frame 11 is provided with a first through hole 12 , for example, the first through hole 12 is a cross-shaped through hole, or the first through hole 12 may also be of other shapes.
  • the inner side of the first frame 11 is provided with a feeding carrier board 20, and the feeding carrier board 20 is provided with a first feeding structure 41 corresponding to the first through holes 12 one-to-one. It is understood that the first feeding structure 41 can access signal.
  • the first through hole 12 is filled with a non-conductive material, and the first through hole 12 is disposed corresponding to the first feeding structure 41 , which can avoid interference to signals on the first feeding structure 41 .
  • the first feeding structure 41 on the feeding carrier board 20 and the first through hole 12 on the first frame 11 constitute the first antenna, and the first feeding structure 41 can be connected to millimeter wave signals, and the first antenna is a millimeter-wave antenna.
  • a groove is formed on the first frame 11 , the first through hole 12 is provided at the bottom of the groove, and the feeding carrier board 20 is accommodated in the groove.
  • the structure of the metal frame 10 is better utilized, and the feeding board 20 is accommodated in the metal frame, so that no additional space is occupied inside the electronic device, which is more conducive to the installation design of other devices in the electronic device.
  • the feed carrier board 20 can be closely attached to the groove bottom of the groove, for example, it can be bonded to the groove bottom by means of glue, so as to ensure the stability of the feed carrier board 20 .
  • the number of the first through holes 12 is at least one.
  • the number of the first through holes 12 is four
  • the number of the first feeding structures 41 provided on the feeding carrier board 20 is also four
  • one first feeding The structure 41 corresponds to one first through hole 12
  • each of the first feeding structures 41 can be connected to a millimeter wave signal
  • the four first through holes 12 and the four first feeding structures 41 form a millimeter wave antenna array.
  • the four first feed structures 41 are arranged at intervals, for example, a partition wall may be provided between any two adjacent first feed structures 41 to improve the isolation between adjacent millimeter-wave antennas.
  • the millimeter-wave antenna is designed together with the metal frame 10 of the electronic device, and the metal frame 10 is used as a radiator to obtain better antenna performance, and compared with the integrated package of the millimeter-wave antenna in the The module is then placed inside the electronic device.
  • the design of the present application reduces the occupation of the internal space of the electronic device, and further reduces the area of the opening on the metal frame 10, which is more conducive to the development of the electronic device to be lighter and thinner.
  • the first frame 11 and the feeding carrier board 20 constitute a first antenna
  • the metal frame 10 constitutes a second antenna
  • both the first antenna and the second antenna are connected to the floor 30 .
  • the second antenna may be a cellular antenna, or a no-cellular antenna. To better distinguish it from a millimeter-wave antenna, in the following description of the embodiments of the present application, the second antenna is referred to as a non-millimeter-wave antenna.
  • the metal frame 10 may further include a second frame, and the second frame is the part of the metal frame 10 other than the first frame 11 .
  • the metal frame 10 constitutes a second antenna, and the second antenna may be constituted by at least one of the first frame 11 or the second frame.
  • the second antenna is formed by the first frame 11.
  • the first antenna and the second antenna also share a section of the metal frame 10, so that the millimeter-wave antenna array and the non-millimeter-wave antenna are designed in the same section In the metal frame 10, extra antenna space is avoided, which is more conducive to the development of light and thin electronic devices.
  • the second antenna is formed by the second frame.
  • the first antenna and the second antenna are separately set up, which can reduce the related interference between the first antenna and the second antenna, which is more conducive to electronic The stability of the device antenna system.
  • the metal frame 10 is composed of the first frame 11 and the second frame, and the second antenna includes the first frame 11 and the second frame, then the entire metal frame 10 constitutes the second antenna, which is equivalent to the first antenna The metal frame 10 is shared with the second antenna.
  • the feeding carrier 20 includes a first dielectric layer 21 and a second dielectric layer 22 , the first dielectric layer 21 is located between the first frame 11 and the second dielectric layer 22 , and the first feeding The structure 41 is sandwiched between the first dielectric layer 21 and the second dielectric layer 22, and the first dielectric layer 21 is also disposed between the first feeding structure 41 and the first through hole 12, so that the first feeding structure 41 and the first There is coupling between a through hole 12 .
  • the first dielectric layer 21 and the second dielectric layer 22 may be made of non-conductive materials.
  • the first through hole 12 includes a first slit 121 and a second slit 122 , and the length direction of the first slit 121 is perpendicular to the length direction of the second slit 122 .
  • the first feeding structure 41 includes a first microstrip line 411, a second microstrip line 412 and a third microstrip line 413.
  • Two ends of the first microstrip line 411 are respectively connected to the second microstrip line 412 and the third microstrip line Line 413, the free end of the second microstrip line 412 is set corresponding to the first end of the first slot 121, the free end of the third microstrip line 413 is set corresponding to the second end of the first slot 121, the first microstrip line
  • the length direction of the 411 is parallel to the length direction of the first slot 121
  • the first microstrip line 411 includes a first signal feeding end 414 , which is disposed corresponding to one end of the second slot 122 .
  • the first slit 121 and the second slit 122 form a cross-shaped first through hole 12 .
  • the second microstrip line 412, the first microstrip line 411 and the third microstrip line 413 are sequentially connected to form a "U"-shaped microstrip line feeding structure.
  • the second microstrip line 412 and the third microstrip line 413 are both perpendicular to the length direction of the first microstrip line 411 in the length direction, and the free end of the second microstrip line 412 and the free end of the third microstrip line 413
  • the ends of the first microstrip line 411 are respectively arranged corresponding to both ends of the first slot 121
  • the first signal feeding end 414 is arranged in the middle of the first microstrip line 411
  • the first signal feeding end 414 is arranged corresponding to one end of the second slot 122 .
  • This setting enables the first feeding structure 41 to generate a bandwidth covering the frequency bands of n257, n260 and n258 when the millimeter wave signal excitation is introduced through the first signal feeding terminal 414, and can obtain better gain and better The performance of the millimeter wave antenna is ensured.
  • the number of the first feed structures 41 is at least two, and the feed carrier board 20 is further provided with at least one partition wall 25 , and one of the partition walls 25 is located between two adjacent first feed structures between 41.
  • the number of the first feeding structures 41 is four, the number of the partition walls 25 is three, and a partition wall 25 is provided between two adjacent first feed structures 41 , and the partition wall 25
  • the setting can improve the isolation wave between adjacent millimeter-wave antennas and avoid signal interference from adjacent millimeter-wave antennas.
  • the isolation wall 25 may be formed of a conductive medium material.
  • the feeding carrier 20 may be provided with a plurality of slits, and each slit is filled with a conductive medium to form the isolation wall 25 .
  • the feeding carrier board 20 further includes a reference ground layer of the first feeding structure 41 , and the reference ground layer can be connected to the first frame 11 to serve as a reflector of the millimeter-wave antenna, so that the millimeter-wave antenna can obtain relatively high performance. It has good gain and can easily feed the millimeter wave antenna, reduces the loss of the feeding path, and can shield the influence of the internal components of the electronic equipment on the performance of the antenna.
  • the embodiments of the present application further provide another antenna, which is different from the antennas described in FIG. 1 to FIG. 5 in that the structure of the second antenna is different. 6 and 7, on the basis of the structure of the feed carrier 20 shown in FIG. 4, the feed carrier 20 further includes a third dielectric layer 23 and a fourth dielectric layer 24, and the third dielectric layer 23 is located on the Between the first dielectric layer 21 and the fourth dielectric layer 24 , the fourth dielectric layer 24 is located between the third dielectric layer 23 and the second dielectric layer 22 .
  • the side of the third dielectric layer 23 facing the first dielectric layer 21 is provided with at least one second feeding structure 42 at intervals, and a metal layer 26 is provided between the fourth dielectric layer 24 and the third dielectric layer 23 .
  • the metal layer 26 is formed with at least one second through hole 27, and the number of the second feed structures 42 is consistent with the number of the second through holes 27, and the at least one second feed structure 42 is arranged in a one-to-one correspondence with the at least one second through hole 27 .
  • the second through hole 27 is formed by hollowing out the metal layer 26 disposed on the third dielectric layer 23
  • the fourth dielectric layer 24 is provided with a second feeding structure 42 corresponding to the second through hole 27
  • the second feeding structure 42 corresponds to a second through hole 27
  • the second feeding structure 42 may also be connected to a millimeter wave signal.
  • the feeding carrier board 20 includes the first feeding structure 41 and the second feeding structure 42, so that the millimeter-wave antenna formed by the feeding carrier board 20 and the first frame 11 can obtain dual polarization performance.
  • the Multiple Input Multiple Output (MIMO) function is formed, which can improve the data transmission rate, increase the wireless connection capability of the millimeter-wave antenna, reduce the probability of communication disconnection, and improve the communication effect and user experience of electronic devices.
  • MIMO Multiple Input Multiple Output
  • the second through hole 27 includes a third slit 271 and a fourth slit 272 , the orthographic projection of the third slit 271 relative to the first frame 11 coincides with the first slot 121 , and the fourth slot 272 relative to the first frame 11 .
  • the orthographic projection coincides with the second slit 122 .
  • the second feeding structure 42 includes a fourth microstrip line 421, a fifth microstrip line 422 and a sixth microstrip line 423.
  • Two ends of the fourth microstrip line 421 are respectively connected to the fifth microstrip line 422 and the sixth microstrip line Line 423, the free end of the fifth microstrip line 422 is set corresponding to the first end of the fourth slot 272, the free end of the sixth microstrip line 423 is set corresponding to the second end of the fourth slot 272, the fourth microstrip line
  • the length direction of the 421 is parallel to the length direction of the fourth slot 272
  • the fourth microstrip line 421 includes a second signal feeding end 424 , and the second signal feeding end 424 is disposed corresponding to one end of the third slot 271 .
  • the third slit 271 and the fourth slit 272 form a cross-shaped second through hole 27
  • the orthographic projection of the second through hole 27 on the first frame 11 coincides with the first through hole 12 , that is, the first through hole 27 .
  • the size and shape of the second through hole 27 and the first through hole 12 are the same.
  • the second feeding structure 42 is also a “U”-shaped microstrip line feeding structure formed by connecting three microstrip lines.
  • the second signal feeding end 424 on the second feeding structure 42 corresponds to one end of the third slot 271 .
  • the first signal feeding end 414 on the first feeding structure 41 is arranged corresponding to one end of the second slot 122, the second slot 122 is perpendicular to the third slot 271, and the first signal feeding end 414 is connected to the second slot 122.
  • the two signal feeding ends 424 are respectively arranged in two directions perpendicular to each other to avoid signal interference.
  • the number of the second feeding structures 42 is the same as the number of the first feeding structures 41 , and one second feeding structure 42 is provided in a one-to-one correspondence with one first feeding structure 41 . Furthermore, the numbers of the first feeding structures 41 , the first through holes 12 , the second feeding structures 42 and the second through holes 27 are all the same, so as to ensure the dual polarization performance of the millimeter wave antenna and improve the data transmission rate.
  • the isolation wall 25 is made of conductive material
  • the metal layer 26 is also made of conductive material
  • the metal layer 26 is in contact with the isolation wall 25
  • the feeding carrier board 20 is attached to the first frame 11
  • the isolation wall 25 is In contact with the first frame 11
  • the metal layer 26 disposed in the feed board 20 can also be connected to the first frame 11 through the isolation wall 25
  • the metal layer 26 and the first frame 11 can be grounded.
  • the feeding carrier board 20 may be implemented by a printed circuit board (Printed Circuit Board, PCB) process.
  • PCB printed Circuit Board
  • Embodiments of the present application also provide an electronic device, the electronic device includes the antenna described in the above embodiments, has all the technical features of the antenna, and can achieve the same technical effect. Repeat.
  • electronic devices may include: mobile phones, tablet computers, e-book readers, MP3 players, MP4 players, digital cameras, laptop computers, car computers, desktop computers, set-top boxes, smart TVs, wearables equipment, etc.

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Abstract

本申请提供一种天线及电子设备，涉及通信技术领域。其中，所述天线包括金属边框、馈电载板和地板，金属边框包括第一边框，第一边框上开设有至少一个第一通孔，馈电载板位于第一边框内侧，所述馈电载板包括第一介质层、第二介质层及至少一个第一馈电结构，第一介质层位于第一边框与第二介质层之间，第一馈电结构设于第二介质层与第一介质层之间，所述至少一个第一馈电结构与所述至少一个第一通孔一一对应设置。

Description

天线及电子设备
相关申请的交叉引用
本申请主张在2020年11月23日在中国提交的中国专利申请No.202011319630.7的优先权，其全部内容通过引用包含于此。
技术领域
本申请涉及通信技术领域，尤其涉及一种天线及电子设备。
背景技术
随着通信技术的发展，毫米波天线的设计被逐渐引入到一些小的电子设备上，如手机、平板电脑，甚至笔记本电脑等。目前，毫米波的天线设计方案主要是采用封装天线(Antenna in package，AIP)的技术与工艺，将毫米波阵列天线、射频集成电路(Radio Frequency Integrated Circuit，RFIC)以及电源管理集成电路(Power Management Integrated Circuit，PMIC)集成在一个模块内，再将该模块置入电子设备内部，而这样的设计方式会占据其他天线的辐射空间，导致天线性能下降。
发明内容
本申请实施例提供一种天线及电子设备，以解决现有的毫米波天线设计方案会占据其他天线的辐射空间，导致天线性能下降的问题。
为解决上述问题，本申请是这样实现的：
第一方面，本申请实施例提供了一种天线，包括金属边框、馈电载板和地板；
所述金属边框包括第一边框，所述第一边框上开设有至少一个第一通孔，所述馈电载板位于所述第一边框内侧，所述馈电载板包括第一介质层、第二介质层及至少一个第一馈电结构，所述第一介质层位于所述第一边框与所述第二介质层之间，所述第一馈电结构设于所述第二介质层与所述第一介质层之间，所述第一馈电结构的数量与所述第一通孔的数量一致，所述至少一个 第一馈电结构与所述至少一个第一通孔一一对应设置。
第二方面，本申请实施例还提供了一种电子设备，包括如第一方面所述的天线。
本申请实施例提供的方案，金属边框的第一边框上设有至少一个第一通孔，馈电载板位于该第一边框内侧，而馈电载板上连接有馈电结构，如毫米波馈电结构，也就将毫米波天线与电子设备的金属边框设计在了一起，利用金属边框作为辐射体，可获得较好的天线性能，且相比于将毫米波天线集成封装在模块上再置入电子设备内部，本申请这样的设计减小了对电子设备内部空间的占用，也更加缩小了金属边框上开孔的面积，更有利于电子设备向轻薄化发展。
附图说明
图1是适用本申请实施例提供的天线的一种电子设备的结构图；
图2是图1中第一边框的局部结构图；
图3是本申请实施例提供的一种天线的爆炸图；
图4是本申请实施例提供的一种天线中馈电载板的爆炸图；
图5是本申请实施例提供的一种天线中第一馈电结构与第一通孔的结构图；
图6是本申请实施例提供的另一种天线中馈电载板的爆炸图；
图7是图6中第三介质层与第四介质层的局部结构图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获取的所有其他实施例，都属于本申请保护的范围。
本申请实施例提供了一种天线。
请参照图1至图5，所述天线包括金属边框10、馈电载板20和地板30，金属边框10可以是电子设备壳体的边框。金属边框10包括第一边框11，第 一边框11上开设有至少一个第一通孔12，馈电载板20位于第一边框11内侧，馈电载板20包括第一介质层21、第二介质层22及至少一个第一馈电结构41，第一介质层21位于第一边框11与第二介质层22之间，第一馈电结构41设于第二介质层22与第一介质层21之间，第一馈电结构41的数量与第一通孔12的数量一致，至少一个第一馈电结构41与至少一个第一通孔12一一对应设置。
本申请实施例中，第一边框11上开设有第一通孔12，例如第一通孔12为十字形通孔，或者第一通孔12也可以是其他形状。第一边框11的内侧设置有馈电载板20，馈电载板20上设有与第一通孔12一一对应的第一馈电结构41，可以理解地，第一馈电结构41能够接入信号。其中，第一通孔12内填充有非导电材质，第一通孔12与第一馈电结构41对应设置，也就能够避免对第一馈电结构41上信号的干扰。这样，馈电载板20上的第一馈电结构41与第一边框11上的第一通孔12构成了第一天线，第一馈电结构41可以是接入毫米波信号，第一天线为毫米波天线。
可选的，如图3所示，第一边框11形成有凹槽，第一通孔12设置于凹槽的槽底，馈电载板20收容于凹槽内。这样，也就更好地利用了金属边框10的结构，将馈电载板20收容在金属边框中，也就无需额外占用电子设备内部的空间，更有利于电子设备内其他器件的安装设计。其中，馈电载板20可以是与凹槽的槽底紧密贴合，例如可以是通过粘胶的方式粘接在槽底，确保了馈电载板20的稳固性。
需要说明的是，第一通孔12的数量为至少一个。可选的，如图2和图3所示，第一通孔12的数量为四个，馈电载板20上设置的第一馈电结构41的数量也为四个，一个第一馈电结构41对应一个第一通孔12，每个第一馈电结构41可以是接入毫米波信号，四个第一通孔12与四个第一馈电结构41形成毫米波天线阵列。其中，四个第一馈电结构41间隔设置，例如任意相邻的两个第一馈电结构41之间可以是设置有隔离墙，以提升相邻毫米波天线之间的隔离度。通过这样的设置，也就将毫米波天线与电子设备的金属边框10设计在了一起，利用金属边框10作为辐射体，可获得较好的天线性能，且相比于将毫米波天线集成封装在模块上再置入电子设备内部，本申请这样的设计 减小了对电子设备内部空间的占用，也更加缩小了金属边框10上开孔的面积，更有利于电子设备向轻薄化发展。
可选地，第一边框11和馈电载板20构成第一天线，金属边框10构成第二天线，第一天线和第二天线均与地板30连接。在一些实施例中，第二天线可以是蜂窝(cellular)天线，或者是非蜂窝(no-cellular)天线。为更好地与毫米波天线区别，本申请实施例的以下描述中，将第二天线称之为非毫米波天线。
本申请实施例中，金属边框10还可以包括第二边框，第二边框为金属边框10的除第一边框11外的部分。金属边框10构成第二天线，第二天线可以是第一边框11或者第二边框中的至少一者构成。例如，第二天线由第一边框11构成，这种情况下，第一天线和第二天线也就共用一段金属边框10，这样也就将毫米波天线阵列与非毫米波天线设计在了同一段金属边框10中，避免占用额外的天线空间，更有利于电子设备向轻薄化发展。
或者，第二天线由第二边框构成，这种情况下，第一天线和第二天线也就是分开各自设置的，这样能够降低第一天线与第二天线之间的相关干扰，更有利于电子设备天线系统的稳定性。又或者，金属边框10由第一边框11和第二边框组成，第二天线包括第一边框11和第二边框，那么也就是整个金属边框10构成第二天线，这样也就相当于第一天线和第二天线共用了金属边框10。
请进一步参照图4和图5，馈电载板20包括第一介质层21和第二介质层22，第一介质层21位于第一边框11与第二介质层22之间，第一馈电结构41夹在第一介质层21与第二介质层22之间，第一馈电结构41与第一通孔12之间还设置有第一介质层21，使得第一馈电结构41与第一通孔12之间存在耦合。可选的，所述第一介质层21和第二介质层22可以是非导电材质构成。
进一步地，第一通孔12包括第一缝隙121和第二缝隙122，第一缝隙121的长度方向与所述第二缝隙122的长度方向相垂直。第一馈电结构41包括第一微带线411、第二微带线412和第三微带线413，第一微带线411的两端分别连接第二微带线412和第三微带线413，第二微带线412的自由端与第一 缝隙121的第一端对应设置，第三微带线413的自由端与第一缝隙121的第二端对应设置，第一微带线411的长度方向与第一缝隙121的长度方向平行，且第一微带线411包括第一信号馈入端414，第一信号馈入端414与第二缝隙122的一端对应设置。
请具体参照图5，第一缝隙121和第二缝隙122构成了十字形的第一通孔12。第二微带线412、第一微带线411及第三微带线413依次连接形成“U”形的微带线馈电结构。其中第二微带线412和第三微带线413在长度方向上均与第一微带线411的长度方向垂直，且第二微带线412的自由端和第三微带线413的自由端分别与第一缝隙121的两端对应设置，而第一微带线411的中部设置有第一信号馈入端414，且该第一信号馈入端414与第二缝隙122的一端对应设置。这样的设置，使得当第一馈电结构41通过第一信号馈电端414引入毫米波信号激励时，能够产生覆盖n257，n260，n258频段的带宽，并能获得较好的增益，更好地确保了毫米波天线的性能。
本申请实施例中，第一馈电结构41的数量为至少两个，馈电载板20还设置有至少一个隔离墙25，一个所述隔离墙25位于相邻的两个第一馈电结构41之间。如图4所示，第一馈电结构41的数量为四个，隔离墙25的数量为三个，相邻的两个第一馈电结构41之间设置有一个隔离墙25，隔离墙25的设置能够提升相邻毫米波天线之间的隔离波，避免相邻毫米波天线信号的干扰。其中，隔离墙25可以是导电介质材质构成。例如，馈电载板20上可以是开设有多个缝隙，每一个缝隙内填充导电介质，以形成隔离墙25。
需要说明的是，馈电载板20还包括第一馈电结构41的参考地层，所述参考地层与第一边框11可导通，以作为毫米波天线的反射器，使得毫米波天线获得较好的增益，并且可方便的对毫米波天线进行馈电，降低馈电路径损耗，能够屏蔽电子设备内部器件对天线性能的影响。
本申请实施例还提供了另一种天线，与上述图1至图5所述天线的不同之处在于第二天线的结构不同。请进一步参照图6和图7，在图4所示馈电载板20结构的基础上，馈电载板20进一步还包括第三介质层23和第四介质层24，第三介质层23位于第一介质层21与第四介质层24之间，第四介质层24位于第三介质层23与第二介质层22之间。其中，第三介质层23的朝 向第一介质层21的一侧间隔设置有至少一个第二馈电结构42，第四介质层24与第三介质层23之间设有金属层26，金属层26形成有至少一个第二通孔27，且第二馈电结构42的数量与第二通孔27的数量一致，至少一个第二馈电结构42与至少一个第二通孔27一一对应设置。
本实现方式中，第二通孔27由设置在第三介质层23上的金属层26挖空形成，而第四介质层24上设置有与第二通孔27对应的第二馈电结构42，且第二馈电结构42对应一个第二通孔27，第二馈电结构42也可以是接入毫米波信号。这样的设置，也就使得馈电载板20包括第一馈电结构41和第二馈电结构42，使得馈电载板20与第一边框11形成的毫米波天线可获得双极化性能，形成多输入多输出(Multiple Input Multiple Output，MIMO)功能，进而能够提升数据的传输速率，增加毫米波天线的无线连接能力，减少通信断线的机率，提升电子设备的通信效果和用户体验。
进一步地，第二通孔27包括第三缝隙271和第四缝隙272，第三缝隙271相对于第一边框11的正投影与第一缝隙121重合，第四缝隙272相对于第一边框11的正投影与第二缝隙122重合。第二馈电结构42包括第四微带线421、第五微带线422和第六微带线423，第四微带线421的两端分别连接第五微带线422和第六微带线423，第五微带线422的自由端与第四缝隙272的第一端对应设置，第六微带线423的自由端与第四缝隙272的第二端对应设置，第四微带线421的长度方向与第四缝隙272的长度方向平行，且第四微带线421包括第二信号馈入端424，第二信号馈入端424与第三缝隙271的一端对应设置。
本实现方式中，第三缝隙271和第四缝隙272构成十字形的第二通孔27，且第二通孔27在第一边框11上的正投影与第一通孔12重合，也即第二通孔27与第一通孔12在尺寸及形状上均一致。第二馈电结构42同样也是三条微带线相连接构成的“U”形微带线馈电结构，第二馈电结构42上的第二信号馈入端424与第三缝隙271的一端对应设置，而第一馈电结构41上的第一信号馈入端414与第二缝隙122的一端对应设置，第二缝隙122与第三缝隙271相垂直，进而第一信号馈入端414与第二信号馈入端424也就分别设置在相垂直的两个方向上，以避免出现信号干扰。
可选的，第二馈电结构42的数量与第一馈电结构41的数量一致，一个第二馈电结构42与一个第一馈电结构41一一对应设置。进而，第一馈电结构41、第一通孔12、第二馈电结构42及第二通孔27的数量均一致，以确保毫米波天线的双极化性能，提升数据的传输速率。
需要说明的是，隔离墙25为导电材质，金属层26也为导电材质，金属层26与隔离墙25相接触，馈电载板20与第一边框11贴合设置，进而隔离墙25也就是与第一边框11相接触的，设置于馈电载板20内的金属层26也就能够通过隔离墙25实现与第一边框11的连接，金属层26与第一边框11可接地设置。
本申请实施例中，馈电载板20可以是通过印刷电路板(Printed Circuit Board，PCB)工艺实现。
本申请实施例还提供了一种电子设备，所述电子设备包括如上实施例中所述的天线，具有所述天线的全部技术特征，并能达到相同的技术效果，为避免重复，此处不再赘述。
可选的，电子设备可以包括：手机、平板电脑、电子书阅读器、MP3播放器、MP4播放器、数码相机、膝上型便携计算机、车载电脑、台式计算机、机顶盒、智能电视机、可穿戴设备等。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (10)

  1. 一种天线，包括金属边框、馈电载板和地板；
    所述金属边框包括第一边框，所述第一边框上开设有至少一个第一通孔，所述馈电载板位于所述第一边框内侧，所述馈电载板包括第一介质层、第二介质层及至少一个第一馈电结构，所述第一介质层位于所述第一边框与所述第二介质层之间，所述第一馈电结构设于所述第二介质层与所述第一介质层之间，所述第一馈电结构的数量与所述第一通孔的数量一致，所述至少一个第一馈电结构与所述至少一个第一通孔一一对应设置。
  2. 根据权利要求1所述的天线，其中，所述第一通孔包括第一缝隙和第二缝隙，所述第一缝隙的长度方向与所述第二缝隙的长度方向相垂直；
    所述第一馈电结构包括第一微带线、第二微带线和第三微带线，所述第一微带线的两端分别连接所述第二微带线和所述第三微带线，所述第二微带线的自由端与所述第一缝隙的第一端对应设置，所述第三微带线的自由端与所述第一缝隙的第二端对应设置，所述第一微带线的长度方向与所述第一缝隙的长度方向平行，且所述第一微带线包括第一信号馈入端，所述第一信号馈入端与所述第二缝隙的一端对应设置。
  3. 根据权利要求2所述的天线，其中，所述第一馈电结构的数量为至少两个，所述馈电载板还设置有至少一个隔离墙，一个所述隔离墙位于相邻的两个所述第一馈电结构之间。
  4. 根据权利要求3所述的天线，其中，所述馈电载板还包括第三介质层和第四介质层，所述第三介质层位于所述第一介质层与所述第四介质层之间，所述第四介质层位于所述第三介质层与所述第二介质层之间；
    其中，所述第三介质层的朝向所述第一介质层的一侧间隔设置有至少一个第二馈电结构，所述第四介质层与所述第三介质层之间设有金属层，所述金属质层形成有至少一个第二通孔，且所述第二馈电结构的数量与所述第二通孔的数量一致，所述至少一个第二馈电结构与所述至少一个第二通孔一一对应设置。
  5. 根据权利要求4所述的天线，其中，所述第二通孔包括第三缝隙和第 四缝隙，所述第三缝隙相对于所述第一边框的正投影与所述第一缝隙重合，所述第四缝隙相对于所述第一边框的正投影与所述第二缝隙重合；
    所述第二馈电结构包括第四微带线、第五微带线和第六微带线，所述第四微带线的两端分别连接所述第五微带线和所述第六微带线，所述第五微带线的自由端与所述第四缝隙的第一端对应设置，所述第六微带线的自由端与所述第四缝隙的第二端对应设置，所述第四微带线的长度方向与所述第四缝隙的长度方向平行，且所述第四微带线包括第二信号馈入端，所述第二信号馈入端与所述第三缝隙的一端对应设置。
  6. 根据权利要求4所述的天线，其中，所述第二馈电结构的数量与所述第一馈电结构的数量一致，一个所述第二馈电结构与一个所述第一馈电结构一一对应设置。
  7. 根据权利要求4所述的天线，其中，所述隔离墙及所述金属层均为导电材质，所述金属层与所述隔离墙相接触。
  8. 根据权利要求1所述的天线，其中，所述第一边框形成有凹槽，所述第一通孔设置于所述凹槽的槽底，所述馈电载板收容于所述凹槽内。
  9. 根据权利要求1所述的天线，其中，所述第一边框和所述馈电载板构成第一天线，所述金属边框构成第二天线，所述第一天线和所述第二天线均与所述地板连接。
  10. 一种电子设备，包括如权利要求1-9中任一项所述的天线。
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