WO2022041320A1 - 一种多层lcp电路板 - Google Patents

一种多层lcp电路板 Download PDF

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Publication number
WO2022041320A1
WO2022041320A1 PCT/CN2020/114191 CN2020114191W WO2022041320A1 WO 2022041320 A1 WO2022041320 A1 WO 2022041320A1 CN 2020114191 W CN2020114191 W CN 2020114191W WO 2022041320 A1 WO2022041320 A1 WO 2022041320A1
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WIPO (PCT)
Prior art keywords
lcp
layer
clad laminate
copper clad
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2020/114191
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English (en)
French (fr)
Inventor
计美阳
陈勇利
韩佳明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AAC Technologies Holdings Shenzhen Co Ltd
AAC Module Technologies Changzhou Co Ltd
Original Assignee
AAC Acoustic Technologies Shenzhen Co Ltd
AAC Module Technologies Changzhou Co Ltd
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Filing date
Publication date
Application filed by AAC Acoustic Technologies Shenzhen Co Ltd, AAC Module Technologies Changzhou Co Ltd filed Critical AAC Acoustic Technologies Shenzhen Co Ltd
Publication of WO2022041320A1 publication Critical patent/WO2022041320A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components

Definitions

  • the present application relates to the technical field of circuit board fabrication, in particular to a multi-layer LCP circuit board.
  • Liquid Crystal Polymer resin microwave dielectric substrate material has high heat resistance, low water absorption, low dielectric loss, and high dimensional stability, and is an ideal material for 5G high-frequency signal transmission.
  • the inner layer circuit is produced through the processes of exposure, development and etching, and the copper foil in the inner layer waste area is designed as grid copper or etching.
  • the product is laminated by setting the appropriate parameters such as temperature, pressure and time through the press machine.
  • the purpose of the present application is to provide a multi-layer LCP circuit board, which can effectively reduce air bubbles, release pressing stress, reduce product expansion and shrinkage deformation, and improve product yield.
  • a multi-layer LCP circuit board including: a first LCP copper clad laminate, at least one second LCP copper clad laminate, and a third LCP copper clad laminate, which are laminated without glue and laminated in sequence, wherein the first LCP copper clad laminate is Two LCP copper clad laminates include a second LCP layer and a second copper foil layer laminated with the second LCP layer, the second copper foil layer includes a product forming area and a waste area surrounding the product forming area, The waste area is etched with a plurality of honeycomb structures, and the etched edges of the honeycomb structures penetrate each other.
  • the side length of the honeycomb structure is 1-1.6 mm, and the distance between two adjacent honeycomb structures is 0.1-0.5 mm.
  • the side length of the honeycomb structure is 1.4 mm, and the distance between two adjacent honeycomb structures is 0.3 mm.
  • the etched edge communicates with the product forming area and the outer space of the imposition.
  • the first LCP copper clad laminate includes a first LCP layer laminated with the second copper foil layer and a first copper foil layer disposed on the upper surface of the first LCP layer.
  • the third LCP copper clad laminate includes a third LCP layer laminated with the second LCP layer and a third copper foil layer disposed on the lower surface of the third LCP layer.
  • the honeycomb structure is etched in the waste area through the LCP copper clad laminate of the inner layer, and the etched edges of the honeycomb structure penetrate each other, which can effectively discharge the air bubbles generated when the product is pressed, and at the same time, the honeycomb structure is conducive to releasing the pressing Stress, reduce product expansion and shrinkage deformation, thereby improving product yield.
  • FIG. 1 is a schematic structural diagram of a multilayer LCP circuit board according to an embodiment of the application.
  • FIG. 2 is a schematic structural diagram of a second LCP copper clad laminate according to an embodiment of the application
  • Fig. 3 is a partial enlarged view of area A in Fig. 2;
  • FIG. 4 is a schematic structural diagram of a first LCP copper clad laminate according to an embodiment of the application.
  • FIG. 5 is a schematic structural diagram of a third LCP copper clad laminate according to an embodiment of the present application.
  • FIG. 1 is a schematic structural diagram of a multi-layer LCP circuit board according to an embodiment of the present application. Please refer to FIG. 1 .
  • the multi-layer LCP circuit board 100 includes a first LCP copper clad laminate 10 and at least one second LCP copper clad laminate 10 , which are stacked in sequence and are not glued together.
  • the LCP copper clad laminate 20 and the third LCP copper clad laminate 30 are stacked in sequence and are not glued together.
  • the multiple second LCP copper clad laminates 20 have the same structure and are stacked in sequence.
  • the second LCP copper clad laminate 20 includes a second LCP layer 21 and a second LCP layer 21 .
  • the second copper foil layer 22 is provided.
  • the second copper foil layer 22 includes a product forming area 221 and a waste area 222 surrounding the product forming area 221 .
  • the waste area 222 is etched with a plurality of honeycomb structures 200 .
  • the etched edges communicate with each other, and the etched edges communicate with the product forming area 221 and the outer space of the imposition.
  • the side length of the honeycomb structure 200 is 1-1.6mm, the distance between two adjacent honeycomb structures 200 is 0.1-0.5mm, preferably, the side length of the honeycomb structure 200 is 1.4mm, and the distance between the two adjacent honeycomb structures 200 The spacing between them is 0.3mm.
  • the design of the honeycomb structure 200 in this embodiment is beneficial to release the pressing stress, reduce the expansion and shrinkage deformation of the product, thereby improving the yield of the product, and the etched edges of the honeycomb structure 200 penetrate each other, and The etched edge is connected with the product forming area and the external space of the imposition, which can effectively discharge the air bubbles generated when the product is pressed, and prevent the product bonding force caused by the air bubbles.
  • the first LCP copper clad laminate 10 includes a first LCP layer 11 laminated with the second copper foil layer 22 and a first copper foil layer 12 disposed on the upper surface of the first LCP layer 11 .
  • the third LCP copper clad laminate 30 includes a third LCP layer 31 laminated with the second LCP layer and a third copper foil layer 32 disposed on the lower surface of the third LCP layer 31 .
  • copper foil layers are provided on the upper surface of the first LCP copper clad laminate 10 and the lower surface of the third LCP copper clad laminate 30, and both surfaces of the inner copper foil layer are laminated with the LCP layer, which is To improve the bonding force after pressing, reduce air bubbles and deformation, and etch the honeycomb structure 200 on the waste area of the inner copper foil layer, which effectively improves the product yield.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

本申请提供了一种多层LCP电路板，包括：依次叠设并无胶压合的第一LCP覆铜板、至少一个第二LCP覆铜板以及第三LCP覆铜板，第二LCP覆铜板包括第二LCP层和与第二LCP层压合的第二铜箔层，第二铜箔层包括产品成型区和围设于产品成型区的废料区，废料区蚀刻有多个蜂巢结构，蜂巢结构的蚀刻边缘相互贯通。本申请的多层LCP电路板通过内层的LCP覆铜板在废料区蚀刻有蜂巢结构，同时蜂巢结构的蚀刻边缘相互贯通，能够有效排出产品压合时产生的气泡，同时蜂巢结构有利于释放压合应力，减小产品涨缩变形，从而提高产品的良率。

Description

一种多层LCP电路板 技术领域
本申请涉及电路板制作技术领域，具体涉及一种多层LCP电路板。
 背景技术
随着电子技术的飞速发展，电路板设计越来越趋于高精度、高密度化。为了获得更多的布线空间或需要铜箔以进行接地屏蔽时，就需要用到双面板或多层板。液晶聚合物树脂（简称LCP，Liquid Crystal Polymer）类微波介质基板材料具有高耐热性、低吸水率、低介质损耗，以及高的尺寸稳定性，是5G高频信号传输的理想材料。
但目前以LCP为基材的印制电路板在LCP覆铜板无胶压合时，通过曝光、显影和蚀刻等工序制作出内层线路，内层废料区的铜箔设计为网格铜或蚀刻圆，与产品外层叠板后，通过传压机设置合适的温度、压力和时间等参数对产品进行层压。LCP压合时，从高弹态向黏流态转变的温度较高，基材的流动性较大，容易造成产品变形，且容易出现气泡，影响产品品质。
因此，有必要提供一种新的技术方案以解决上述缺陷。
 技术问题
本申请的目的在于提供一种多层LCP电路板，能够有效减小气泡，释放压合应力，减小产品涨缩变形并提高产品良率。
 技术解决方案
本申请的技术方案如下：提供一种多层LCP电路板，包括：依次叠设并无胶压合的第一LCP覆铜板、至少一个第二LCP覆铜板以及第三LCP覆铜板，所述第二LCP覆铜板包括第二LCP层和与所述第二LCP层压合的第二铜箔层，所述第二铜箔层包括产品成型区和围设于所述产品成型区的废料区，所述废料区蚀刻有多个蜂巢结构，所述蜂巢结构的蚀刻边缘相互贯通。
根据本申请的一个实施例，所述蜂巢结构的边长为1-1.6mm，相邻两个所述蜂巢结构之间的间距为0.1-0.5mm。
根据本申请的一个实施例，所述蜂巢结构的边长为1.4mm，相邻两个所述蜂巢结构之间的间距为0.3mm。
根据本申请的一个实施例，所述蚀刻边缘与所述产品成型区、拼版外部空间相互贯通。
根据本申请的一个实施例，所述第一LCP覆铜板包括与所述第二铜箔层压合的第一LCP层以及设于所述第一LCP层上表面的第一铜箔层。
根据本申请的一个实施例，所述第三LCP覆铜板包括与所述第二LCP层压合的第三LCP层以及设于所述第三LCP层下表面的第三铜箔层。
 有益效果
本申请的有益效果在于：通过内层的LCP覆铜板在废料区蚀刻有蜂巢结构，同时蜂巢结构的蚀刻边缘相互贯通，能够有效排出产品压合时产生的气泡，同时蜂巢结构有利于释放压合应力，减小产品涨缩变形，从而提高产品的良率。
 附图说明
图1为本申请实施例的多层LCP电路板的结构示意图；
图2为本申请实施例的第二LCP覆铜板的结构示意图；
图3为图2中A区域的局部放大图；
图4为本申请实施例的第一LCP覆铜板的结构示意图；
图5为本申请实施例的第三LCP覆铜板的结构示意图。
 本发明的实施方式
下面结合附图和实施方式对本申请作进一步说明。
图1是本申请实施例的多层LCP电路板的结构示意图，请参见图1，该多层LCP电路板100包括依次叠设并无胶压合的第一LCP覆铜板10、至少一个第二LCP覆铜板20以及第三LCP覆铜板30。
本实施例中，第二LCP覆铜板20设置多个时，多个第二LCP覆铜板20的结构相同且依次叠设。在一实施例中，请参见图1，第二LCP覆铜板20设置一个，请参见图1和图2，第二LCP覆铜板20包括第二LCP层21和与第二LCP层21压合的第二铜箔层22。
进一步地，请参见图2和图3，第二铜箔层22包括产品成型区221和围设于产品成型区221的废料区222，废料区222蚀刻有多个蜂巢结构200，蜂巢结构200的蚀刻边缘相互贯通，并且蚀刻边缘与产品成型区221、拼版外部空间相互贯通。蜂巢结构200的边长为1-1.6mm，相邻两个蜂巢结构200之间的间距为0.1-0.5mm，优选地，蜂巢结构200的边长为1.4mm，相邻两个蜂巢结构200之间的间距为0.3mm。
相对于网格铜和蚀刻圆的设计，本实施例的蜂巢结构200设计有利于释放压合应力，减小产品涨缩变形，从而提高产品的良率，蜂巢结构200的蚀刻边缘相互贯通，并且蚀刻边缘与产品成型区、拼版外部空间相互贯通，能够有效排出产品压合时产生的气泡，防止因气泡而产生的产品结合力问题。
请参见图1和图4，第一LCP覆铜板10包括与第二铜箔层22压合的第一LCP层11以及设于第一LCP层11上表面的第一铜箔层12。
请参见图1和图5，第三LCP覆铜板30包括与第二LCP层压合的第三LCP层31以及设于第三LCP层31下表面的第三铜箔层32。
本实施例的多层LCP电路板在第一LCP覆铜板10的上表面和第三LCP覆铜板30下表面均设置铜箔层，内部铜箔层的两个表面均与LCP层压合，为提升压合后的结合力，减少气泡和形变，对内部铜箔层的废料区作了蚀刻蜂巢结构200的处理，有效提高产品良率。
以上所述的仅是本申请的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本申请创造构思的前提下，还可以做出改进，但这些均属于本申请的保护范围。

Claims (6)

1、一种多层LCP电路板，其特征在于，包括：依次叠设并无胶压合的第一LCP覆铜板、至少一个第二LCP覆铜板以及第三LCP覆铜板，所述第二LCP覆铜板包括第二LCP层和与所述第二LCP层压合的第二铜箔层，所述第二铜箔层包括产品成型区和围设于所述产品成型区的废料区，所述废料区蚀刻有多个蜂巢结构，所述蜂巢结构的蚀刻边缘相互贯通。
2、根据权利要求1所述的多层LCP电路板，其特征在于，所述蜂巢结构的边长为1-1.6mm，相邻两个所述蜂巢结构之间的间距为0.1-0.5mm。
3、根据权利要求2所述的多层LCP电路板，其特征在于，所述蜂巢结构的边长为1.4mm，相邻两个所述蜂巢结构之间的间距为0.3mm。
4、根据权利要求1所述的多层LCP电路板，其特征在于，所述蚀刻边缘与所述产品成型区、拼版外部空间相互贯通。
5、根据权利要求1所述的多层LCP电路板，其特征在于，所述第一LCP覆铜板包括与所述第二铜箔层压合的第一LCP层以及设于所述第一LCP层上表面的第一铜箔层。
6、根据权利要求1所述的多层LCP电路板，其特征在于，所述第三LCP覆铜板包括与所述第二LCP层压合的第三LCP层以及设于所述第三LCP层下表面的第三铜箔层。
PCT/CN2020/114191 2020-08-28 2020-09-09 一种多层lcp电路板 Ceased WO2022041320A1 (zh)

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