WO2022037320A1 - Module de photographie périscopique - Google Patents

Module de photographie périscopique Download PDF

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Publication number
WO2022037320A1
WO2022037320A1 PCT/CN2021/106020 CN2021106020W WO2022037320A1 WO 2022037320 A1 WO2022037320 A1 WO 2022037320A1 CN 2021106020 W CN2021106020 W CN 2021106020W WO 2022037320 A1 WO2022037320 A1 WO 2022037320A1
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WIPO (PCT)
Prior art keywords
lens
wafer
level
level lens
camera module
Prior art date
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PCT/CN2021/106020
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English (en)
Chinese (zh)
Inventor
梅哲文
戎琦
王启
常树杭
郑程倡
孙鑫翔
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from CN202010847105.6A external-priority patent/CN114076998B/zh
Priority claimed from CN202010847292.8A external-priority patent/CN114076999B/zh
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Priority to CN202180059627.2A priority Critical patent/CN116209934A/zh
Publication of WO2022037320A1 publication Critical patent/WO2022037320A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses

Definitions

  • the present invention relates to the field of optical technology, and in particular, the present invention relates to a periscope camera module.
  • the telephoto lens usually has a long total optical length. According to the conventional camera module assembly method, it is difficult to fit the telephoto lens into a thin terminal device. At present, by setting a prism on the market, the optical system of the telephoto camera module is folded to become a periscope module, so that it can be placed into the mobile phone horizontally, which solves the problem of the long optical total length of the telephoto lens causing the telephoto camera module. Group height problem.
  • the parameters and specifications of the periscope camera module continue to increase, and the size of the lens is also becoming larger, which makes the height of the periscope camera module inevitably increase, and the internal space of the mobile phone becomes more and more. It is difficult to meet the module height improvement brought by the performance improvement of the periscope camera module.
  • the periscope camera module has the advantages of high resolution, large aperture, and large light input while achieving telephoto shooting.
  • the thickness of electronic devices limits the height of the periscope camera module
  • the diameter of the lens of the periscope module is limited, and the smaller diameter of the lens naturally limits the improvement of the aperture and the amount of incoming light.
  • a D-cut shaped lens has appeared.
  • the D-cut shape is a cut circle shape, for example, the top and bottom of a complete circle can be cut off to form a cut circle shape with straight top and bottom.
  • the wafer-level lens manufacturing process has emerged in recent years.
  • the lens can be fabricated on a glass substrate, and multiple lenses can be directly stacked together to form a wafer-level lens.
  • Wafer-level lenses eliminate the barrel of conventional lenses, thereby helping to reduce the radial size of the lens (radial, ie, the direction perpendicular to the optical axis).
  • the wafer-level lens manufacturing process is a new type of manufacturing process. Compared with the traditional lens manufacturing process in which the lens is formed separately and then assembled by the lens barrel, its process maturity still has certain shortcomings.
  • the assembly process in which multiple wafer-level lens arrays are assembled into a lens array may introduce relatively large tolerances. Therefore, traditional lenses are still widely used in the current market (eg, in the smartphone market). Especially in the field of products with high resolution, major camera module manufacturers still use traditional lenses with lenses assembled through lens barrels.
  • the periscope module faces relatively strict height restrictions. How to increase the amount of light entering the lens and increase the aperture under the premise of ensuring high resolution is a technical problem that people are eager to solve.
  • the purpose of the present invention is to overcome the deficiencies of the prior art, and to provide a periscope module solution that can increase the amount of light entering the lens and/or increase the aperture under the premise of low height and high resolution.
  • the present invention provides a periscope camera module, which includes: an optical path turning element, which is used to turn incident light from a first optical axis to a second optical axis; a wafer-level lens, which It is arranged at the exit end of the optical path turning element, and the wafer-level lens is obtained by cutting a lens wafer, wherein the lens wafer is a combination obtained by assembling a plurality of lens wafers together.
  • the lens wafer includes a lens array composed of a plurality of lens units, and at least one surface of each lens unit has a light-transmitting curved surface; and a photosensitive component, which is used for receiving the light signal passing through the wafer-level lens and outputting imaging data.
  • the top surface and/or the bottom surface of the wafer-level lens is tangent to the circular outer contour of the light-transmitting curved surface of at least one lens in the wafer-level lens, wherein the second optical axis is horizontal posture, the top surface and the bottom surface of the wafer-level lens are respectively located above and below the second optical axis.
  • the outer contour of the light-transmitting curved surface of at least one lens in the wafer-level lens is in the shape of a cut circle, and the cut circle is obtained by cutting the lens unit of the lens wafer, wherein the The top and/or bottom surfaces of the wafer-level lens are cut surfaces, wherein the second optical axis is in a horizontal attitude, and the top and bottom surfaces of the wafer-level lens are located above and below the second optical axis, respectively.
  • the aspect ratio of the wafer-level lens is 1.1-3.
  • the aspect ratio of the wafer-level lens is 1.2-2.
  • the wafer-level lens includes a plurality of wafer-level lenses and spacers located between adjacent wafer-level lenses, at least one surface of the wafer-level lens has the light-transmitting curved surface, and the A spacer surrounds the light-transmitting curved surface.
  • the spacer is made of magnetic material or contains magnetic material.
  • the spacer includes an injection-molded molding part and a magnet embedded in the molding part.
  • the periscope camera module further includes a lens driving mechanism, and the carrier of the lens driving mechanism is located on the front and rear sides of the wafer-level lens; wherein, the optical axis direction of the wafer-level lens is defined as Y axis, the height direction of the periscope camera module is defined as the Z axis, the Z axis is perpendicular to the Y axis, the X axis is the coordinate axis perpendicular to the Y axis and the Z axis, the crystal
  • the front and rear sides of the circular-level lens correspond to the positive direction side and the negative direction side of the X-axis, respectively.
  • the front side and the rear side of the wafer-level lens are both flat, and the carrier of the lens driving mechanism is supported on the front side and the rear side of the wafer-level lens.
  • both the front side and the rear side of the wafer-level lens are arc surfaces, and the carrier of the lens driving mechanism is supported on the front side and the rear side of the wafer-level lens.
  • the carrier of the lens driving mechanism has a buckling portion, and the buckling portion is buckled on the left end face and the right end face of the wafer-level lens, and the left end face and the right end face are respectively located at one end of the negative direction of the Y-axis. and two end faces at one end in the positive direction.
  • there is a calibration gap between the optical path turning element and the wafer-level lens, and/or between the wafer-level lens and the photosensitive assembly, and the optical path turning element and the wafer-level lens between, and/or the relative position between the wafer-level lens and the photosensitive component is determined by active calibration; wherein, the active calibration is based on the imaging result of the actual output of the photosensitive component.
  • the relative positions between the optical path turning element and the wafer-level lens, and/or between the wafer-level lens and the photosensitive component are adjusted.
  • the optical path turning element is a prism
  • the optical axis direction of the wafer-level lens is defined as the Y axis
  • the height direction of the periscope camera module is defined as the Z axis
  • the Z axis is perpendicular to the Y axis
  • the X-axis is a coordinate axis perpendicular to the Y-axis and the Z-axis; wherein, the size of the wafer-level lens is smaller than the prism in the Z direction, and larger than the size in the X direction Describe the prism.
  • At least one surface of the wafer-level lens has a light-transmitting curved surface
  • the light-transmitting curved surface includes an imaging area located in a central area and a non-imaging area located in an edge area
  • the light-transmitting curved surface of the wafer-level lens The outer contour is in the shape of a cutting circle, and the cutting circle is obtained by cutting the light-transmitting curved surface with a circular outer contour of the lens unit of the lens wafer, and the cutting line passes through the non-imaging area but avoids the Open the imaging area.
  • the light-transmitting curved surface includes an imaging area located in a central area and a non-imaging area located in an edge area, and the outer contour of the light-transmitting curved surface of the wafer-level lens is in the shape of a cut circle, and the cut circle passes through the A light-transmitting curved surface with a circular outer contour of the lens unit of the lens wafer is obtained by cutting, and the cutting line passes through the non-imaging area and the imaging area.
  • the wafer-level lens further includes a light-shielding member, the light-shielding member is located on the object-side surface of the first wafer-level lens on the object side in the wafer-level lens, and the light-shielding member surrounds the object side Around the light-transmitting curved surface of the first wafer-level lens.
  • the wafer-level lens further includes a support member, the support member is located on the image-side surface of the first wafer-level lens on the image side of the wafer-level lens, and the support member surrounds the image side Around the light-transmitting curved surface of the first wafer-level lens.
  • the peripheral side of the wafer-level lens has a light shielding layer.
  • the wafer-level lens includes a substrate, one or two of the lens units formed on the surface of one side or both sides of the substrate, each of the lens units includes a lens portion and a flat portion, and the lens portion has the Translucent surface.
  • the lens wafer includes a substrate, and the lens unit is directly molded on the substrate through an insert injection molding process.
  • the lens wafer includes a substrate, and the lens unit is attached to the surface of the substrate.
  • the lens wafer includes a substrate, and the lens unit is press-molded on the substrate.
  • the substrate has a through hole, and the lens part of the lens unit is fabricated at the position of the through hole.
  • the present application can reduce the size of the periscope module by cutting the lens, especially the module height direction (Z-axis direction) and width direction (X-axis direction).
  • the present application can avoid the problem of inconsistent surface accuracy in two perpendicular directions (such as the longitude direction and the latitude direction) caused by the D-cut lens forming process, thereby ensuring imaging quality. Inconsistent surface accuracy will bring problems such as astigmatism, and it is difficult to compensate for the subsequent module assembly process.
  • This application can ensure that the relative illumination of the wafer-level lens meets the standard, thereby ensuring the imaging quality of the module.
  • the application can reduce the height of the module while ensuring high resolution, and at the same time ensure that the module has the advantages of high light input and large aperture.
  • FIG. 1 shows a schematic longitudinal cross-sectional view of a periscope camera module according to an embodiment of the present application
  • Fig. 2 shows the three-dimensional schematic diagram of the appearance of the periscope camera module shown in Fig. 1;
  • Figure 3a shows a molding cavity for lens wafer injection molding in a wafer-level lens manufacturing process
  • Figure 3b shows the molding cavity after injection of liquid lens material
  • Figure 4a shows a top view of a lens wafer after molding in one embodiment of the present application
  • FIG. 4b shows a schematic cross-sectional view of a lens wafer after molding in an embodiment of the present application
  • FIG. 5 shows a schematic cross-sectional view of a lens wafer composed of a plurality of lens wafers in an embodiment of the present application
  • FIG. 6 shows a schematic cross-sectional view of cutting the lens wafer in an embodiment of the present application
  • FIG. 7 shows a schematic top view of cutting the lens wafer in an embodiment of the present application.
  • FIG. 8a shows a schematic cross-sectional view of a wafer-level lens in an embodiment of the present application
  • FIG. 8b shows a schematic perspective view of a wafer-level lens in an embodiment of the present application
  • Fig. 9a shows a schematic diagram of cutting a wafer-level lens so that its light-transmitting curved surface is close to a D-cut shape in an embodiment of the present application
  • Fig. 9b shows a schematic diagram of cutting a wafer-level lens to make its light-transmitting curved surface form a D-cut shape in an embodiment of the present application
  • FIG. 10a shows a schematic top view of a lens-level wafer close to a D-cut shape obtained after cutting according to an embodiment of the present application
  • FIG. 10b shows a schematic top view of a lens-level wafer with a D-cut shape obtained after cutting in an embodiment of the present application
  • Figure 11a shows a front view of a prism and a wafer-level lens in an embodiment of the present application
  • FIG. 11b shows a top view of a prism and a wafer-level lens in an embodiment of the present application
  • FIG. 12 is a schematic diagram illustrating that adjacent wafer-level lenses are directly fixed to each other in an embodiment of the present application.
  • Fig. 13 shows the exploded schematic diagram of the optical path turning assembly in one embodiment of the present application
  • FIG. 14a shows a schematic cross-sectional view of a wafer-level lens in which a part of the spacer is formed of a magnetic material according to an embodiment of the present application
  • Fig. 14b shows a schematic cross-sectional view of the wafer-level lens shown in Fig. 14a after being installed in a periscope module;
  • Fig. 15a shows a perspective view of the shape and arrangement of the carrier of the lens driving mechanism in an embodiment of the present application
  • Fig. 15b shows a schematic side view of the shape and arrangement of the carrier of the lens driving mechanism of Fig. 15a;
  • Fig. 16a shows a perspective view of the shape and arrangement of a carrier having a buckling portion of a lens driving mechanism in another embodiment of the present application
  • Fig. 16b shows a schematic side view of the shape and arrangement of the carrier of the lens driving mechanism of Fig. 16a;
  • Fig. 17a shows a schematic diagram of placing a substrate with through holes in a molding cavity according to an embodiment of the present application
  • Fig. 17b shows a schematic diagram after injecting a liquid molding material into the molding cavity of Fig. 17a according to an embodiment of the present application
  • Figure 18a shows an example of a lens wafer with a through-hole substrate in one embodiment of the present application
  • Figure 18b shows an example of a lens wafer based on the lens wafer shown in Figure 18a;
  • FIG. 19 shows a schematic cross-sectional view of a lens wafer with through holes in a cutting substrate according to an embodiment of the present application
  • FIG. 20 shows a schematic cross-sectional view of a wafer-level lens with through holes in an embodiment of the present application
  • Figure 21a shows a schematic diagram of forming a lens wafer by bonding lens units on a substrate in an embodiment of the present application
  • Fig. 21b shows an example of a lens wafer with a lens unit fixed on both sides of a substrate in one embodiment of the present application
  • Figure 21c shows an example of a lens wafer in one embodiment of the present application
  • FIG. 22 shows an example of dicing a lens wafer in one embodiment of the present application
  • FIG. 23 shows an example of a diced lens-level wafer in one embodiment of the present application.
  • Figure 24a shows a substrate and mold based on a pressing process in one embodiment of the present application
  • Fig. 24b shows a schematic diagram of compression molding a lens wafer in an embodiment of the present application
  • Figure 25a shows a formed lens wafer in one embodiment of the present application
  • Figure 25b shows a lens wafer in one embodiment of the present application
  • FIG. 26 shows a schematic diagram of cutting a lens wafer in an embodiment of the present application
  • FIG. 27 shows a wafer-level lens obtained after cutting in an embodiment of the present application
  • FIG. 28 shows a schematic longitudinal cross-sectional view of a periscope camera module in which some lenses adopt wafer-level lenses according to an embodiment of the present application
  • 29 shows a schematic cross-sectional view of a lens wafer composed of a plurality of lens wafers in an embodiment of the present application
  • FIG. 30 shows a schematic cross-sectional view of cutting the lens wafer according to an embodiment of the present application
  • 31a shows a schematic cross-sectional view of a wafer-level lens in an embodiment of the present application
  • Figure 31b shows a schematic perspective view of a wafer-level lens in an embodiment of the present application
  • 32a shows a schematic cross-sectional view of an imaging lens composed of a wafer-level lens and a non-wafer-level lens in an embodiment of the present application
  • Fig. 32b shows a schematic perspective view of the imaging lens corresponding to Fig. 32a in an embodiment in which some lenses adopt wafer-level lenses in the present application;
  • Fig. 32c shows a view from an image-side viewing angle of the imaging lens corresponding to Fig. 32a in an embodiment in which some lenses adopt wafer-level lenses in the present application;
  • Figure 33a shows a periscope module with a drive mechanism in an embodiment of the present application
  • Figure 33b shows a view from an image-side perspective of an imaging lens with a driving mechanism in an embodiment of the present application
  • 33c shows a schematic cross-sectional view of an imaging lens in another embodiment of the present application.
  • FIG. 34 is a schematic diagram illustrating that adjacent wafer-level mirrors are directly fixed to each other in an embodiment of the present application.
  • Figure 35a shows a schematic cross-sectional view of an imaging lens in which a part of the spacer is formed of a magnetic material according to an embodiment of the present application
  • Figure 35b shows a schematic cross-sectional view of the imaging lens shown in Figure 35a after being installed in a periscope module;
  • FIG. 36 is a perspective view showing the shape and arrangement of the carrier of the lens driving mechanism in an embodiment of the present application.
  • Figure 37a shows a periscope camera module with a separate design of wafer-level lens and non-wafer-level lens according to an embodiment of the present application
  • FIG. 37b shows an optical zoom periscope camera module with a separate design of a wafer-level lens and a non-wafer-level lens in another embodiment of the present application
  • Figure 38 shows an example of a lens wafer based on the lens wafer shown in Figure 18a in one embodiment of the present application
  • FIG. 39 shows a schematic cross-sectional view of a lens wafer with through holes in a cutting substrate according to an embodiment of the present application
  • FIG. 40 shows a schematic cross-sectional view of a wafer-level lens with through holes in an embodiment of the present application
  • Figure 41 shows an example of a lens wafer in one embodiment of the present application
  • Figure 42 shows an example of dicing a lens wafer in one embodiment of the present application
  • Figure 43 shows an example of a diced lens-level wafer in one embodiment of the present application.
  • Figure 44 shows a lens wafer in one embodiment of the present application
  • FIG. 45 shows a schematic diagram of cutting a lens wafer in an embodiment of the present application.
  • FIG. 46 shows a wafer-level lens obtained after dicing in an embodiment of the present application.
  • FIG. 1 shows a schematic longitudinal cross-sectional view of a periscope camera module according to an embodiment of the present application.
  • FIG. 2 is a schematic perspective view of the appearance of the periscope camera module shown in FIG. 1 .
  • the periscope camera module includes: a housing 10 , an optical path turning component 20 , a wafer-level lens 30 and a photosensitive component 40 installed inside the housing 10 .
  • the optical path turning assembly 20 includes a light turning element 21, and the light turning element 21 can be a mirror or a prism, and the mirror or prism can reflect the light incident on the camera module, thereby changing the direction of the optical axis (for example, Turn the first optical axis 11 to the second optical axis 12).
  • the incident end of the light redirecting element 21 may have a corresponding incident window 21a for incident light to enter (refer to FIG. 2).
  • the wafer-level lens 30 is manufactured by a wafer-level process. Unlike the conventional lens assembly method, it does not require a lens barrel to carry a plurality of lenses, which can effectively reduce the radial dimension of the lens (that is, the radial direction is perpendicular to the lens).
  • the photosensitive assembly 40 includes a circuit board 41 and a photosensitive chip 42 mounted on the circuit board 41 .
  • the photosensitive component 40 may further include a filter 43 disposed between the wafer-level lens 30 and the photosensitive chip 42 .
  • the periscope camera module is sometimes abbreviated as a periscope module in this document, which will not be described in detail below.
  • the D-cut idea is combined with the wafer-level lens, so that it has the advantages of high resolution, large aperture, and large light input under the circumstance that the height of the periscope camera module is limited.
  • the D-cut shape is a cut circle shape, for example, the top and bottom of a complete circle can be cut off to form a cut circle shape with straight top and bottom.
  • the use of such a circular-cut lens can increase the diameter of the lens without increasing the height of the module, thereby increasing the amount of light entering the optical system and increasing the aperture.
  • this D-cut shape introduces a large manufacturing error in the actual manufacturing process.
  • each lens is made separately through the injection molding process, and then each lens is sequentially loaded into the lens barrel to complete the assembly of the lens group.
  • the injection mold needs to be made into a corresponding D-cut shape, that is, a D-cut-shaped molding cavity is formed in the injection mold. After the injection molding material is injected, it can be cooled and formed in the molding cavity, and a lens having a D-cut shape can be obtained after the mold is opened.
  • the conventional injection-molded D-cut lens has the following defects: since the injection-molded material will shrink to a certain extent during molding, the amount of injection-molded material in all directions of the lens is inconsistent under the D-cut shape.
  • the second radial direction is perpendicular to the D-cut shape of the cut, then in parallel to the D-cut shape
  • the amount of injection molding material will be more than the amount in the second radial direction, so when the injection molding material is molded, the shrinkage amounts in the two mutually perpendicular radial directions are inconsistent. This will result in different processing accuracy of the lens in these two mutually perpendicular directions, resulting in different surface accuracy.
  • the size of the lenses is often small, and traditional injection-molded lenses are difficult to cut. Specifically, due to the small size of the lens, its clamping is more difficult. If the clamping force is too small, the stability may be poor, affecting the cutting accuracy of the lens, thereby increasing the manufacturing error; if the clamping force is too large, the lens will be affected due to the excessive force, thereby increasing the manufacturing error.
  • the D-cut lens is usually obtained by direct injection molding in a molding cavity having a D-cut shape.
  • the direct injection molding solution is abandoned, and the D-cut idea is combined with the wafer-level lens. , so that it has the advantages of high resolution, large aperture, and large amount of light in the situation where the height of the periscope camera module is limited.
  • the wafer-level lens manufacturing method includes: providing a molding die.
  • Figure 3a shows a molding cavity for lens wafer injection molding in a wafer-level lens manufacturing process.
  • the forming mold includes an upper mold 31 and a lower mold 32 .
  • the upper and lower molds 31 and 32 clamp a substrate 33 and form a molding cavity 34.
  • Liquid lens material eg resin
  • Figure 3b shows the molding cavity after injection of liquid lens material.
  • FIG. 4a shows a top view of a lens wafer after molding in an embodiment of the present application
  • FIG. 4b shows a schematic cross-sectional view of the lens wafer after molding in an embodiment of the present application.
  • the substrate 33 of the lens wafer 39 is generally circular (but it should be noted that the substrate may also be of other shapes, such as rectangular).
  • the material of the substrate 33 is preferably a material suitable for transmitting visible light, such as a glass material.
  • the lens wafer 39 includes resin layers 36 (including a first resin layer 36 a and a second resin layer 36 b ) on both sides of the substrate 33 .
  • the first resin layer 36a (or the second resin layer 36b) may include a plurality of lens portions 37a and a flat portion 37b connecting the plurality of lens portions.
  • the lens portions 37a and the flat portion 37b are continuously molded and fixed on the substrate 33 .
  • lens part 37a refers to the part of the lens unit with a light-transmitting curved surface (such as a convex surface or a concave surface), and the outer contour of the light-transmitting curved surface is generally circular, as shown in FIG. A light surface with a circular outline.
  • FIG. 5 shows a schematic cross-sectional view of a lens wafer composed of a plurality of lens wafers in an embodiment of the present application.
  • a lens wafer 50 is obtained by stacking a plurality of lens wafers 39 , light-shielding member layers 51 , spacer layers 52 , and supporting member layers 53 in sequence, and fixing them to each other by an adhesive.
  • the optical axes of the lens units of the adjacent lens wafers 39 overlap (manufacturing tolerances are not considered here).
  • the lens wafer can be divided by at least one of sawing, laser cutting, laser grinding, water jet cutting, milling, micromachining, micro-slicing, punching cutting, etc.
  • FIG. 6 shows a schematic cross-sectional view of cutting the lens wafer in an embodiment of the present application.
  • FIG. 7 shows a schematic top view of cutting the lens wafer according to an embodiment of the present application.
  • the broken line is the cutting line.
  • a plurality of independent wafer-level lenses 30 can be obtained.
  • a light-shielding layer can also be provided on the peripheral side of the wafer-level lens 30 (the peripheral side is the outer side of the wafer-level lens 30, and the outer side can also be referred to as the outer peripheral surface or the peripheral side) to shield stray light. .
  • FIG. 8a shows a schematic cross-sectional view of a wafer-level lens in an embodiment of the present application.
  • FIG. 8b shows a schematic perspective view of a wafer-level lens in an embodiment of the present application.
  • the wafer-level lens 30 has an approximate cuboid structure
  • the wafer-level lens 30 includes at least two wafer-level mirrors 39a
  • the wafer-level mirrors 39a include a substrate 33 and a
  • the lens unit 39b on one or both sides of the substrate 33, the lens unit 39a may be composed of a lens portion 37a located in the middle and a flat portion 37b located around the lens portion 37a, the lens portion 37a is suitable for a convex shape Or concave, and its surface is convex or concave;
  • at least one spacer 52a is provided between the at least two wafer-level mirrors 39a, and the spacer 52a fixes the adjacent wafer-level mirrors 39a by an adhesive, And adjust the distance between adjacent wafer-level lenses
  • the shading member 51a on the object side of the lens and the supporting member 53a on the image side of the lens are bonded and fixed by the adhesive.
  • the shading member 51a and the supporting member 53a have the function of protecting the wafer-level lens.
  • the support member 53a is preferably made of an opaque material to reduce the influence of stray light, wherein the light shielding member 51a has an inner side wall, and the diameter of the inner side wall gradually decreases from the object side to the image side.
  • the sidewall of the wafer-level lens 30 may also be provided with a light shielding layer made of opaque materials such as ink, so as to further reduce the influence of stray light.
  • the diameter of the lens portion of the object-side lens unit of the first lens on the object side is larger than that of the other lenses.
  • the area of the lens part of the first lens object side lens unit on the substrate is the largest one among all lenses, thereby receiving more light, increasing the amount of light entering the lens, and improving the imaging clarity of the periscope module.
  • the size of the wafer-level lens in the height direction (Z direction) of the periscope module can be further reduced.
  • the lens part in the Z direction of the wafer-level lens is cut, and even part of the lens part is cut, so that the wafer-level lens has two relatively narrow sides in the Z direction, thereby reducing the periscope the height of the model module.
  • the lens is directly injection-molded in the mold, and it is difficult to further cut it later. Therefore, when the lens is formed by the traditional method, the dimensions of the lens in the two perpendicular directions are usually close.
  • the resin used as the lens manufacturing material will affect the surface of the lens due to the difference in curing shrinkage.
  • the surface shape of the lens in the two perpendicular directions will be different, which will have a greater impact on the imaging quality of the lens.
  • the lens part on the wafer-level lens is completely formed on the substrate first, and then is cut. Therefore, the dimension of the wafer-level lens in the Z direction shorter than the X direction does not Affects the surface shape accuracy of the lens portion of the wafer-level lens.
  • the size of the wafer-level lens in the X direction (which can be understood as the width direction of the module) is L X
  • the size in the Z direction (which can be understood as the height direction of the module) is L Z
  • the ratio of L X to L Z ranges from 1.1 to 3.
  • the ratio is within 1.2 to 2. Therefore, while ensuring the resolution of the periscope module and reducing its height, the relative illuminance of the wafer-level lens is reduced within an allowable range.
  • the relative illuminance refers to the illuminance ratio between the center point of the viewing angle and the full viewing angle on the imaging plane of the photosensitive chip.
  • the relative illumination is too low, the center of the image is brighter and the surrounding area is darker, that is, a vignetting phenomenon occurs, commonly known as vignetting.
  • the inventors of the present application have found that, in smartphones or similar electronic devices, when the aspect ratio of the lens of the periscope module is large, the wafer-level lens has an advantage in resolution compared with the lens based on traditional technology. A discovery is non-obvious.
  • the resolution power may not necessarily have an advantage over the traditional lens manufacturing process.
  • wafer-level lenses are actually assembled from multiple lens wafers and then diced.
  • a lens wafer is actually an array of multiple lens units fabricated on the same substrate.
  • assembly tolerances may be introduced, resulting in incomplete optical axes of lens units on adjacent lens wafers.
  • Overlap for example, the optical axes of the two lens units located on the upper and lower wafers may have an offset or a non-zero included angle), resulting in a decrease in resolution.
  • the inventors of the present application found that when the thickness of a smartphone or similar electronic equipment is relatively thin, and the requirements for the light input, aperture, and image of the camera module are relatively high, it is sometimes necessary to design a periscope module. Lenses with larger aspect ratios, and at this point, the introduction of wafer-level lenses will have an advantage in terms of resolution compared to individually molded D-cut lenses.
  • the reason is as mentioned above, when the aspect ratio of the D-cut lens (that is, the ratio of the dimension in the X-direction to the dimension in the Z-direction) is large to a certain extent, the shrinkage during the molding process will cause the surface accuracy to be inconsistent in different directions. This problem It will cause astigmatism in the entire optical system, thereby reducing the resolution.
  • the problem of inconsistent surface accuracy in different directions is difficult to correct or compensate for in the subsequent assembly process of the module.
  • the wafer-level lens can have an advantage in resolution compared to the lens based on the traditional process.
  • the aspect ratio of the lens is above 1.1, on the premise of ensuring that the module has a small height, and ensuring the advantages of large light input and large aperture, the wafer-level lens is used compared to the traditional
  • the injection molding process to make D-cut lenses is more conducive to ensuring that the resolution meets the design requirements.
  • the aspect ratio of the lens is above 1.2, compared with the D-cut lens made by the traditional injection molding process, the solution using the wafer-level lens will have more obvious advantages in terms of resolution.
  • the wafer-level lens can be cut so that its light-transmitting curved surface forms a D-cut shape, or is close to a D-cut shape.
  • Translucent surfaces are the convex or concave surfaces used for imaging in wafer-level lenses.
  • Each wafer-level lens includes a plurality of wafer-level mirrors arranged along an optical axis, each wafer-level mirror having at least one convex or concave surface for imaging. Under the top view angle (ie, the viewing angle parallel to the optical axis direction), in the original lens wafer, the outer contours of these convex or concave surfaces are usually circular, and they are the main optical components constituting the lens unit.
  • FIG. 9a shows a schematic diagram of cutting a wafer-level lens so that its light-transmitting curved surface is close to a D-cut shape in an embodiment of the present application.
  • the shape close to the D-cut means that the outer side surface of the wafer-level lens is roughly the cut surface of the circular outer contour of the light-transmitting curved surface with the largest diameter.
  • the dashed line in FIG. 9 a shows the cutting line, wherein the cutting line is tangent to the circular outer contour of the light-transmitting curved surface 59 .
  • FIG. 9b shows a schematic diagram of cutting a wafer-level lens so that its light-transmitting curved surface forms a D-cut shape in an embodiment of the present application.
  • the light-transmitting curved surface may have an optical zone (or called an optically effective zone) and a non-optical zone (ie, an optically invalid zone) around the optical zone.
  • the aperture of the imaging channel can sometimes be adjusted through a diaphragm, so that the edge regions of the light-transmitting curved surface do not participate in imaging, that is, these edge regions can constitute an optically invalid area, while the central area within the aperture of the imaging channel constitutes an optically effective area.
  • the optically effective area may also be referred to as an imaging area
  • the optically ineffective area may also be referred to as a non-imaging area.
  • the desired D-cut shape can be obtained by cutting the light-transmitting curved surface of the lens unit of the lens wafer with a circular outer contour, and in one solution, the cutting line can pass through the non-imaging area but avoid the imaging area. This solution requires relatively low cutting accuracy, which helps to reduce costs and improve yield.
  • a part of the imaging area is further excised, so that the optical area of the lens also has a D-cut shape. That is, the cut line passes through both the non-imaged area and the imaged area.
  • This design will help to further reduce the height of the wafer-level lens (that is, the Z-axis dimension), thereby reducing the height of the periscope module, but the requirements for cutting accuracy are relatively high.
  • the cutting of the D-cut shape can be completed in the step of cutting the lens wafer, that is, the light-transmitting curved surface with the D-cut shape in the above embodiment can be directly obtained by cutting the lens wafer, instead of The lens wafer needs to be cut into individual wafer-level lenses first, and then the single wafer-level lens needs to be cut to form a lens with a D-cut shape.
  • FIG. 10a shows a schematic top view of a lens-level wafer close to a D-cut shape obtained after cutting according to an embodiment of the present application.
  • FIG. 10b shows a schematic top view of a lens-level wafer in a D-cut shape obtained after dicing according to an embodiment of the present application.
  • a wafer-level lens or lens wafer
  • only part of the lens can be cut (for example, only one or several light-transmitting curved surfaces with the largest diameter) can be cut to form a D-cut shape or It is close to the shape of D-cut, and other light-transmitting curved surfaces with smaller diameters may not be cut.
  • the D-cut shape is obtained by cutting a light-transmitting curved surface with a circular outer contour, but the present application is not limited to this.
  • the D-cut shape may also be obtained by cutting a flat portion of the lens unit.
  • the outer contour of the flat portion of the lens unit can be made into a circle, and at this time, the D-cut shape can be obtained by cutting the flat portion of the lens unit (ie, the cutting line avoids the light-transmitting curved surface).
  • the outer contour of the flat portion of the lens unit is made into a square shape. At this time, the flat portion of the lens unit can also be cut and the cutting line avoids the light-transmitting curved surface.
  • FIG. 11a shows a front view of a prism and a wafer-level lens in an embodiment of the present application.
  • FIG. 11b shows a top view of a prism and a wafer-level lens in an embodiment of the present application.
  • the size of the wafer-level lens 29 in the Z direction is smaller than its size in the X direction.
  • the size of the wafer-level lens 30 is smaller than the prism 29 in the Z direction, and larger than the prism 29 in the X direction.
  • the substrate of at least one wafer-level lens of the wafer-level lens has an infrared cut-off function, so that the wafer-level lens has an infrared cut-off function, so that the photosensitive component can no longer be required.
  • the infrared cut-off function of the substrate can be realized by, for example, that the substrate material itself has the function of absorbing infrared rays or the surface of the substrate is coated with an infrared cut-off film.
  • FIG. 12 shows a schematic diagram of adjacent wafer-level mirrors being directly fixed to each other in an embodiment of the present application.
  • the structural areas 39c of the two wafer-level lenses can be supported and fixed together, and the structural areas 39c can be formed of resin or other lens imaging materials located in the non-imaging area), thereby forming a complete wafer-level lens 30 .
  • the periscope module further includes a lens driving mechanism, and the lens driving mechanism includes a driving casing (which may be a part of the casing 10 ),
  • the carrier 61, at least one coil-magnet pair 62, through the lens driving mechanism can drive the wafer-level lens 30 as a telephoto lens along its optical axis (refer to the second optical axis 12) or perpendicular to its optical axis (refer to the second optical axis 12).
  • the optical axis 12) moves in the direction to realize the focusing or optical anti-shake function of the periscope module.
  • the lens driving mechanism further includes at least one elastic element for connecting the carrier and the driving housing, so that the carrier is suspended in the driving housing, so that the lens
  • the drive mechanism can drive the carrier to move relative to the drive housing.
  • the elastic element may be an elastic sheet, a spring or the like.
  • the lens driving mechanism may also be provided with balls, and the balls are disposed between the carrier and the drive housing, so that the carrier can move relative to the drive housing.
  • the wafer-level lens can be obtained by laser cutting stacked and assembled wafers, and the outer side of the wafer-level lens can be formed into other shapes than rectangles.
  • the outer side of the wafer-level lens can be cylindrical or cut cylindrical, so as to fit the existing driving mechanism without changing the structure of the driving mechanism (for example, without changing the shape of the carrier of the driving mechanism) and structure).
  • the front side and the rear side of the wafer-level lens can both be incomplete arc surfaces, so that the carrier with the arc-shaped inner side of the lens driving mechanism can bear against the wafer.
  • the front and rear sides of the lens refer to the front and rear sides in the viewing angle of FIG. 1 , that is, the two sides in the X-axis direction.
  • the X-axis is the coordinate axis perpendicular to the Y-axis and Z-axis.
  • the optical path turning assembly may include a prism as an optical path turning element and a prism driving mechanism.
  • the prism may be a reflective prism having two mutually perpendicular right-angled faces and an inclined face serving as a reflecting face, and the two right-angled faces may serve as an incident face and an exit face, respectively.
  • FIG. 13 shows an exploded schematic view of an optical path turning assembly in an embodiment of the present application. 13 and FIG. 1 , in this embodiment, the prism driving mechanism includes a bracket 13 , an elastic element 14 , a first driver 15 , a second driver 16 , and a prism housing 17 .
  • the prism 21a ie, the light-reversing element 21, which can be referred to in conjunction with FIG.
  • the elastic element 14 is fixed to the bracket 13, and the elastic element 14 is located between the prism 21a and the bracket 13.
  • the elastic element 14 is further connected and fixed with the prism housing 17 through four elastic arms 14a.
  • the first driver 15 can be a coil-magnet pair, wherein the coil can be fixed to the prism housing 17, and the magnet can be fixed to the bracket 13;
  • the second driver 16 can be a coil-magnet pair , wherein the coil can be fixed on the prism housing 17 , and the magnet can be fixed on the bracket 13 .
  • the prism driving mechanism is adapted to drive the prism 21a to translate in the X-axis direction or drive the prism 21a to rotate around the X-axis direction, so as to change the exit angle of the incident light and play the role of optical anti-shake.
  • a series of deformed wafer-level lenses can also be used to replace the wafer-level lenses mentioned above.
  • the following descriptions are respectively made with reference to a plurality of embodiments.
  • the spacer, the support member, and the light shielding member can all be molded together with the wafer-level lens by means of insert injection molding, thereby simplifying the process.
  • the spacer between at least two of the wafer-level lenses may be formed entirely or partially of magnetic materials.
  • FIG. 14a shows a schematic cross-sectional view of a wafer-level lens in which a part of the spacer is formed of a magnetic material according to an embodiment of the present application.
  • FIG. 14b shows a schematic cross-sectional view of the wafer-level lens shown in FIG. 14a after being installed in a periscope module.
  • a portion of the spacer 52a of the wafer-level lens 30 may be constructed of a magnetic material 62a, making the spacer 52a magnetic (eg, the spacer 52a may include an injection molded part and an insert
  • the spacer 52a may include an injection molded part and an insert
  • the magnet can be placed in the molding cavity, and then the molding part can be made by the injection molding process, so that the magnet can be embedded in the molding cavity).
  • the carrier 61 of the lens driving mechanism of the periscope module may not be provided with a magnet, thereby further reducing the thickness of the carrier 61, and even further eliminating the carrier 61, so as to achieve periscope The purpose of reducing the size of the mold module, especially the size reduction in the X direction.
  • the elastic elements fixed on the carrier 61 and the drive housing 10a in the original design can be fixed on the wafer-level lens 30 and the drive housing 10a, so that the wafer-level lens 30 is suspended on the drive housing 10a middle.
  • Fig. 15a is a perspective view showing the shape and arrangement of the carrier of the lens driving mechanism in an embodiment of the present application.
  • Fig. 15b shows a schematic side view of the shape and arrangement of the carrier of the lens driving mechanism of Fig. 15a. 15a and 15b, the carrier of the lens driving mechanism includes a first carrier 61a and a second carrier 61b, the first and second carriers 61a and 61b are fixed on the wafer by bonding and/or snapping Both sides of the stage lens 30 in the X direction.
  • the magnet 62a or the coil is fixed on the carrier 61 and is arranged opposite to the coil or magnet fixed on the casing, so that the carrier, the coil, the magnet and the driving casing are suitable to form a lens driving mechanism to drive the lens to move.
  • 16a shows a schematic perspective view of the shape and arrangement of the carrier with the snap-fit portion of the lens driving mechanism in another embodiment of the present application
  • FIG. 16b shows the shape and arrangement of the carrier of the lens driving mechanism in FIG. 16a.
  • Schematic side view. 16a and 16b, the snap-fit portion 61c can be used to snap the carrier 61 to two end faces of the wafer-level lens 30 (ie, the left end face and the right end face in Fig. 16a).
  • the lens driving mechanism may further include at least one elastic element for connecting the carrier and the driving housing, so that the carrier is suspended in the driving housing, so that the lens driving mechanism can drive the carrier to move relative to the driving housing .
  • the elastic element may be an elastic sheet, a spring or the like.
  • the wafer-level lens may use a substrate with through holes.
  • FIG. 17a shows a schematic diagram of placing a substrate with through holes in a molding cavity according to an embodiment of the present application.
  • Fig. 17b shows a schematic diagram after injecting a liquid molding material into the molding cavity of Fig. 17a according to an embodiment of the present application.
  • the substrate 33 has at least one through hole 33a, and the at least one through hole 33a is distributed in the lens unit area, so that the substrate 33 can be made of an opaque material. Due to the through holes 33a, the substrate 33 will not affect the light transmittance of the lens unit, and the thickness of the substrate 33 will not affect the thickness of the lens unit.
  • a molding die can be provided, the molding die includes an upper die 31 and a lower die 32, the upper and lower dies 31 and 32 clamp a substrate 33 and form a molding cavity 34, and the upper and lower die
  • the injection port 35 formed by 31 and 32 is injected with liquid lens material (such as resin), so that the interior of the molding cavity 34 is filled with the lens material, and then the lens material is cured to form a resin layer 36 on one or both sides of the substrate 33 to form the lens wafer , the upper mold 31 and the lower mold 32 are separated, and the lens wafer is taken out.
  • the manufacturing process of the above-mentioned lens wafer is an insert molding process (Insert Molding).
  • Figure 18a shows an example of a lens wafer with a through-hole substrate in one embodiment of the present application.
  • the substrate 33 has at least one through hole 33 a , and the at least one through hole 33 a is distributed in the lens unit area of the substrate 33 .
  • a lens unit can be formed in the lens unit area of the substrate 33 through the insert injection molding process, and the lens unit can be embedded in the through hole of the substrate.
  • the lens unit is composed of a lens portion 37a located in the middle (ie, the portion corresponding to the light-transmitting curved surface, the outer contour of which may be circular) and a flat portion 37b located around the lens portion 37a, which is located in the in the through hole 33 a of the substrate 33 .
  • Figure 18b shows an example of a lens wafer based on the lens wafer shown in Figure 18a. Referring to FIG.
  • a plurality of lens wafers 39 can be obtained, and the plurality of lens wafers 39 , the light shielding member layer 51 , the spacer layer 52 , and the support member layer 53 are stacked in sequence, and the adhesive They are fixed to each other to obtain a lens wafer 50 .
  • the optical axes of the lens units of adjacent lens wafers 39 overlap (manufacturing tolerances are not considered here). It should be noted that the present application is not limited to this, and in other embodiments, the lens wafer may not be provided with a light shielding member layer, a supporting member layer, or the like.
  • the lens wafer can be divided by at least one of sawing, laser cutting, laser grinding, water jet cutting, milling, micromachining, micro-slicing, punching and cutting to obtain wafer-level lenses.
  • FIG. 19 shows a schematic cross-sectional view of a lens wafer with through holes cut into a substrate according to an embodiment of the present application.
  • FIG. 20 shows a schematic cross-sectional view of a wafer-level lens with through holes according to an embodiment of the present application.
  • a light shielding layer may also be provided on the peripheral side of the wafer-level lens.
  • the wafer-level lens 30 includes at least two wafer-level lenses 39a, and the wafer-level lens 39a includes a substrate 33 and is disposed on the substrate 33
  • the lens unit on one side or both sides, the central area of the substrate 33 (ie the lens unit area) has a through hole 33a, the lens unit is embedded in the through hole 33a of the substrate 33, the lens of the lens unit
  • the portion 37a is located in the through hole 33a of the substrate 33 .
  • the lens unit is composed of a lens portion 37a located in the middle and a flat portion 37b located around the lens portion 37a, and the shape of the lens portion 37a is suitable for convex or concave; the at least two wafer-level lenses 39a There is at least one spacer 52a therebetween, the spacer 52a fixes the adjacent wafer-level mirrors 39a through adhesive, and adjusts the distance between the adjacent wafer-level mirrors 39a.
  • the light-transmitting material reduces stray light from entering the wafer-level lens 30 from the side;
  • the wafer-level lens 30 further includes a light-shielding member 51a fixed on the object side of the lens through an adhesive and a support member 53a on the image side of the lens,
  • the shading member 51a and the supporting member 53a are preferably made of opaque materials to reduce the influence of stray light, wherein the shading member 51a has an inner wall whose diameter is gradually reduced toward the lens image side.
  • the wafer-level lens may not be formed by insert molding, but may be formed by bonding lens units on a substrate.
  • FIG. 21a shows a schematic diagram of forming a lens wafer by bonding lens units on a substrate in an embodiment of the present application.
  • a substrate 33 a plurality of lens units 37 can be provided, and the lens units 37 are flat on one side and have a convex or concave surface (ie, a light-transmitting curved surface, sometimes also referred to as an imaging curved surface) on the other side.
  • a convex or concave surface ie, a light-transmitting curved surface, sometimes also referred to as an imaging curved surface
  • each lens unit 37 is supported on and attached to the base plate 33, for example, a plurality of lens units 37 can be fixed on one side or both sides of the base plate 33 by adhesive ( FIG. 21b shows an embodiment of the present application of the lens wafers of the lens unit are fixed on both sides of the substrate), thereby forming a lens wafer 39 .
  • the substrate 33 and the lens unit can be made of materials such as glass, resin, etc. that can transmit visible light
  • the adhesive is also preferably an adhesive suitable for passing visible light, such as optical glue.
  • the optical adhesive is colorless and transparent, the light transmittance is above 90%, the bonding strength is good, it can be cured at room temperature or medium temperature, and the curing shrinkage is small.
  • the fixation between the lens unit and the substrate can also be carried out in other ways, for example, the plane side of the lens unit can be fixed to the base plate by means of bonding.
  • a plurality of lens wafers 39, a light shielding member layer 51, a spacer layer 52, and a support layer 53 are sequentially stacked to obtain a lens wafer 50 (refer to FIG. 21c, which shows the lens wafer 50 in an embodiment of the present application. example of a circle).
  • the lens wafer 50 may not include a light shielding member layer or a supporting layer. Further, referring to FIG. 22 (FIG.
  • FIG. 22 shows an example of cutting a lens wafer in an embodiment of the present application, and the dotted line in the figure represents a cutting line), through sawing, laser cutting, laser grinding, water jet cutting, milling At least one of cutting, micro-machining, micro-slicing, punching and cutting is used to divide the lens wafer to obtain the wafer-level lens 30 .
  • FIG. 23 shows an example of a diced lens-level wafer in one embodiment of the present application. Further, after cutting, a light shielding layer may also be provided on the peripheral side of the wafer-level lens.
  • the wafer-level lens can also be manufactured by pressing the wafer.
  • Figure 24a shows a substrate and mold based on a pressing process in one embodiment of the present application. Specifically, a substrate 33 and a pressing mold can be provided, the pressing mold includes an upper mold 31 and a lower mold 32, and the substrate 33 is made of a light-transmitting material. Then, the upper mold 31 or the lower mold 32 is moved, and one surface or both surfaces of the substrate 33 is pressed into a predetermined shape by a pressing mold to form a lens wafer 39 .
  • FIG. 24b shows a schematic diagram of compression molding of a lens wafer in an embodiment of the present application.
  • FIG. 25a shows the formed lens wafer in an embodiment of the present application
  • the spacer layer 52 and the support layer 53 are stacked in sequence and fixed to each other by an adhesive to obtain a lens wafer 50
  • Figure 25b shows a lens wafer in one embodiment of the present application.
  • the optical axes of the lens units of adjacent lens wafers 39 overlap (regardless of manufacturing tolerances).
  • the wafer-level lens 30 is obtained by dividing the lens wafer by at least one of sawing, laser cutting, laser grinding, water jet cutting, milling, micromachining, micro-slicing, punching and the like.
  • FIG. 26 shows a schematic diagram of dicing a lens wafer in an embodiment of the present application.
  • FIG. 27 shows a wafer-level lens obtained after dicing in an embodiment of the present application.
  • a light shielding layer may also be provided on the peripheral side of the wafer-level lens 30 .
  • the wafer-level lens 30 includes at least two wafer-level lenses 39a, the wafer-level lenses 39a are formed by pressing a substrate by pressing a mold, and the at least two wafer-level lenses 39a are There is at least one spacer 52a between the lenses, the spacer 52a fixes the adjacent wafer-level lenses 39a through adhesive, and adjusts the distance between the adjacent wafer-level lenses 39a, the spacer 52a is preferably used
  • the opaque material reduces stray light from entering the wafer-level lens 30 from the side; the wafer-level lens 30 may further include a shading member 51a fixed on the object side of the lens by adhesive and a support on the image side of the lens
  • the component 53a, the shading component 51a and the support component 53a are preferably made of opaque materials to reduce the influence of stray light.
  • the shading member 51a has an inner wall whose diameter gradually decreases from the object side of the lens to the image side of the lens.
  • the wafer-level lens can also be obtained by cutting the lens wafer first to obtain the wafer-level lens, and then the wafer-level lens, light shielding member, spacer, support member, etc. are stacked and fixed in sequence. , forming a wafer-level lens.
  • the output imaging result adjusts the relative positions between the optical path turning element and the wafer-level lens, and between the wafer-level lens and the photosensitive component.
  • the above-mentioned calibration gap may also be only provided between the optical path turning element and the wafer-level lens, or only between the wafer-level lens and the photosensitive component.
  • the relative positions of the module components located at both ends of the calibration gap are determined by active calibration.
  • Active calibration can be performed in multiple degrees of freedom such as X-axis, Y-axis, Z-axis, and rotation around X-axis, Y-axis, and Z-axis, so
  • the axes (eg central axes) of these module components may have a non-zero angle between them.
  • the module component may be an optical path turning element, a wafer-level lens or a photosensitive component.
  • the manufacturing tolerance of the module components eg, wafer-level lens itself can be compensated through active calibration in the module assembly stage, thereby improving the imaging quality.
  • the periscope camera module includes: a housing 10, an optical path turning component 20 installed inside the housing 10, a wafer-level lens 30, and a non-wafer-level lens 70 and photosensitive assembly 40.
  • the optical path turning assembly 20 includes a light turning element 21, and the light turning element 21 can be a mirror or a prism, and the mirror or prism can reflect the light incident on the camera module, thereby changing the direction of the optical axis (for example, Turn the first optical axis 11 to the second optical axis 12).
  • the incident end of the light redirecting element 21 may have a corresponding incident window 21a for incident light to enter (refer to FIG. 2).
  • the wafer-level lens 30 is manufactured by a wafer-level process. Unlike the conventional lens assembly method, it does not require a lens barrel to carry a plurality of lenses, which can effectively reduce the radial dimension of the lens (that is, the radial direction is perpendicular to the lens). the direction of the second optical axis 12).
  • the non-wafer-level lens 70 is a conventional lens, and a lens barrel carries a plurality of lenses, and the lens barrels are used to form a lens group.
  • the photosensitive assembly 40 includes a circuit board 41 and a photosensitive chip 42 mounted on the circuit board 41 .
  • the photosensitive component 40 may further include a filter 43 disposed between the non-wafer-level lens 70 and the photosensitive chip 42 .
  • the wafer-level lens 30 and the non-wafer-level lens 70 are sequentially arranged along the second optical axis 12 , and the two together constitute the imaging lens of the module. Therefore, the wafer-level lens 30 may be regarded as the first sub-lens of the imaging lens, and the non-wafer-level lens 70 may be regarded as the second sub-lens of the imaging lens.
  • the right end surface (ie, the image-side end surface) of the wafer-level lens 30 and the left end surface (ie, the object-side end surface) of the non-wafer-level lens 70 are bonded to form a complete imaging lens.
  • the end surface of the wafer-level lens 30 and the end surface of the non-wafer-level lens 70 can be mutually supported and fixed by bonding. It should be noted, however, that the wafer-level lens 30 and the non-wafer-level lens 70 may also be connected and fixed by other means such as laser welding.
  • the D-cut idea is combined with the wafer-level lens, so that it has the advantages of high resolution, large aperture, and large light input under the circumstance that the height of the periscope camera module is limited.
  • the D-cut shape is a cut circle shape, for example, the top and bottom of a complete circle can be cut off to form a cut circle shape with straight top and bottom.
  • the use of such a circular-cut lens can increase the diameter of the lens without increasing the height of the module, thereby increasing the amount of light entering the optical system and increasing the aperture.
  • this D-cut shape introduces a large manufacturing error in the actual manufacturing process.
  • each lens is made separately through the injection molding process, and then each lens is sequentially loaded into the lens barrel to complete the assembly of the lens group.
  • the injection mold needs to be made into a corresponding D-cut shape, that is, a D-cut-shaped molding cavity is formed in the injection mold. After the injection molding material is injected, it can be cooled and formed in the molding cavity, and a lens having a D-cut shape can be obtained after the mold is opened.
  • the conventional injection-molded D-cut lens has the following defects: since the injection-molded material will shrink to a certain extent during molding, the amount of injection-molded material in all directions of the lens is inconsistent under the D-cut shape.
  • the second radial direction is perpendicular to the D-cut shape of the cut, then in parallel to the D-cut shape
  • the amount of injection molding material will be more than the amount in the second radial direction, so when the injection molding material is molded, the shrinkage amounts in the two mutually perpendicular radial directions are inconsistent. This will result in different processing accuracy of the lens in these two mutually perpendicular directions, resulting in different surface accuracy.
  • the size of the lenses is often small, and traditional injection-molded lenses are difficult to cut. Specifically, due to the small size of the lens, its clamping is more difficult. If the clamping force is too small, the stability may be poor, affecting the cutting accuracy of the lens, thereby increasing the manufacturing error; if the clamping force is too large, the lens will be affected due to the excessive force, thereby increasing the manufacturing error.
  • the D-cut lens is usually obtained by direct injection molding in a molding cavity having a D-cut shape.
  • the direct injection molding solution is abandoned, and the D-cut idea is combined with the wafer-level lens. , so that it has the advantages of high resolution, large aperture, and large amount of light in the situation where the height of the periscope camera module is limited.
  • lenses with larger diameters can be grouped into a first group, and lenses with smaller diameters can be grouped into a second group, the first group is realized by the wafer-level lens, and the second group Groups are implemented by the non-wafer-level lenses (ie, conventional conventional lenses).
  • This design method can comprehensively utilize the respective advantages of wafer-level lenses and conventional lenses.
  • the radial space occupied by the first group with larger diameter lenses is reduced, thereby reducing the height and width of the module.
  • manufacturing and assembling the second group based on a mature production process helps to reduce the manufacturing and assembly tolerances of the second group.
  • the diameter of the lens is generally related to its optical aperture, and the larger the optical aperture, the larger the diameter of the lens is.
  • the optical aperture of at least one wafer-level mirror of the wafer-level lens is larger than the optical apertures of all lenses in the non-wafer-level lens.
  • the imaging lens is composed of a wafer-level lens and a non-wafer-level lens.
  • the present application is not limited to this.
  • the imaging lens when a lens with a larger optical aperture in the optical design is located at both ends, the imaging lens may include two of the wafer-level lenses and one non-wafer-level lens.
  • the imaging lens when a lens with a larger optical aperture in the optical design is located in the middle, the imaging lens may include one wafer-level lens and two non-wafer-level lenses. In other words, the number of wafer-level lenses or non-wafer-level lenses can be greater than one.
  • the wafer-level lens manufacturing method includes: providing a molding die.
  • Figure 3a shows a molding cavity for lens wafer injection molding in a wafer-level lens manufacturing process.
  • the forming mold includes an upper mold 31 and a lower mold 32 .
  • the upper and lower molds 31 and 32 clamp a substrate 33 and form a molding cavity 34.
  • Liquid lens material eg resin
  • Figure 3b shows the molding cavity after injection of liquid lens material.
  • FIG. 4a shows a top view of a lens wafer after molding in an embodiment of the present application
  • FIG. 4b shows a schematic cross-sectional view of the lens wafer after molding in an embodiment of the present application.
  • the substrate 33 of the lens wafer 39 is generally circular (but it should be noted that the substrate may also be of other shapes, such as rectangular).
  • the material of the substrate 33 is preferably a material suitable for transmitting visible light, such as a glass material.
  • the lens wafer 39 includes resin layers 36 (including a first resin layer 36 a and a second resin layer 36 b ) on both sides of the substrate 33 .
  • the first resin layer 36a (or the second resin layer 36b) may include a plurality of lens portions 37a and a flat portion 37b connecting the plurality of lens portions.
  • the lens portions 37a and the flat portion 37b are continuously molded and fixed on the substrate 33 .
  • lens part 37a refers to the part of the lens unit with a light-transmitting curved surface (such as a convex surface or a concave surface), and the outer contour of the light-transmitting curved surface is usually circular, as shown in FIG. A light surface with a circular outline.
  • FIG. 29 shows a schematic cross-sectional view of a lens wafer composed of a plurality of lens wafers in an embodiment of the present application.
  • a lens wafer 50 is obtained by stacking a plurality of lens wafers 39 , light shielding member layers 51 , spacer layers 52 , and supporting member layers 53 in sequence, and fixing them to each other by an adhesive.
  • the lens wafer 50 the optical axes of the lens units of the adjacent lens wafers 39 overlap (manufacturing tolerances are not considered here).
  • the lens wafer can be divided by at least one of sawing, laser cutting, laser grinding, water jet cutting, milling, micromachining, micro-slicing, punching cutting, etc.
  • Fig. 30 shows a schematic cross-sectional view of cutting the lens wafer in an embodiment of the present application.
  • FIG. 7 shows a schematic top view of cutting the lens wafer according to an embodiment of the present application.
  • the broken line is the cutting line.
  • a plurality of independent wafer-level lenses 30 can be obtained.
  • a light-shielding layer can also be provided on the peripheral side of the wafer-level lens 30 (the peripheral side is the outer side of the wafer-level lens 30, and the outer side can also be referred to as the outer peripheral surface or the peripheral side) to shield stray light. .
  • FIG. 31a shows a schematic cross-sectional view of a wafer-level lens in an embodiment of the present application.
  • FIG. 31b shows a schematic perspective view of a wafer-level lens in an embodiment of the present application.
  • the wafer-level lens 30 has an approximate cuboid structure
  • the wafer-level lens 30 includes at least two wafer-level mirrors 39a
  • the wafer-level mirrors 39a include a substrate 33 and a
  • the lens unit 39b on one or both sides of the substrate 33, the lens unit 39a may be composed of a lens portion 37a located in the middle and a flat portion 37b located around the lens portion 37a, the lens portion 37a is suitable for a convex shape Or concave, and its surface is convex or concave;
  • at least one spacer 52a is provided between the at least two wafer-level mirrors 39a, and the spacer 52a fixes the adjacent wafer-level mirrors 39a by an adhesive, And adjust the distance between adjacent wafer-level lenses
  • the shading member 51a on the object side of the lens and the supporting member 53a on the image side of the lens are bonded and fixed by the adhesive.
  • the shading member 51a and the supporting member 53a have the function of protecting the wafer-level lens.
  • the support member 53a is preferably made of an opaque material to reduce the influence of stray light, wherein the light shielding member 51a has an inner side wall, and the diameter of the inner side wall gradually decreases from the object side to the image side.
  • the sidewall of the wafer-level lens 30 may also be provided with a light shielding layer made of opaque materials such as ink, so as to further reduce the influence of stray light.
  • the diameter of the lens portion of the object-side lens unit of the first lens on the object side is larger than that of the other lenses.
  • the area of the lens part of the first lens object side lens unit on the substrate is the largest one among all lenses, thereby receiving more light, increasing the amount of light entering the lens, and improving the imaging clarity of the periscope module.
  • the size of the wafer-level lens in the height direction (Z direction) of the periscope module can be further reduced.
  • the lens part in the Z direction of the wafer-level lens is cut, and even part of the lens part is cut, so that the wafer-level lens has two relatively narrow sides in the Z direction, thereby reducing the periscope the height of the model module.
  • the lens is directly injection-molded in the mold, and it is difficult to further cut it later. Therefore, when the lens is formed by the traditional method, the dimensions of the lens in the two perpendicular directions are usually close.
  • the resin used as the lens manufacturing material will affect the surface of the lens due to the difference in curing shrinkage.
  • the surface shape of the lens in the two perpendicular directions will be different, which will have a greater impact on the imaging quality of the lens.
  • the lens part on the wafer-level lens is completely formed on the substrate first, and then is cut. Therefore, the dimension of the wafer-level lens in the Z direction shorter than the X direction does not Affects the surface shape accuracy of the lens portion of the wafer-level lens.
  • the size of the wafer-level lens in the X direction (which can be understood as the width direction of the module) is L X
  • the size in the Z direction (which can be understood as the height direction of the module) is L Z
  • the ratio of L X to L Z (that is, the ratio of the width and height of the wafer-level lens, sometimes referred to as the aspect ratio) is in the range of 1.1-3, preferably, the ratio is in the range of 1.2-2. This makes the reduction of the relative illuminance of the wafer-level lens within an allowable range while ensuring the resolution of the periscope module and reducing its height.
  • the relative illuminance refers to the illuminance ratio between the center point of the viewing angle and the full viewing angle on the imaging plane of the photosensitive chip.
  • the relative illumination is too low, the center of the image is brighter and the surrounding area is darker, that is, a vignetting phenomenon occurs, commonly known as vignetting.
  • the inventors of the present application have found that, in smartphones or similar electronic devices, when the aspect ratio of the lens of the periscope module is large, the wafer-level lens has an advantage in resolution compared with the lens based on traditional technology. A discovery is non-obvious.
  • the resolution power may not have an advantage over the traditional lens manufacturing process.
  • wafer-level lenses are actually assembled from multiple lens wafers and then diced.
  • a lens wafer is actually an array of multiple lens units fabricated on the same substrate.
  • assembly tolerances may be introduced, resulting in incomplete optical axes of lens units on adjacent lens wafers.
  • Overlap for example, the optical axes of the two lens units located on the upper and lower wafers may have an offset or a non-zero included angle), resulting in a decrease in resolution.
  • the inventors of the present application found that when the thickness of a smartphone or similar electronic equipment is relatively thin, and the requirements for the light input, aperture, and image of the camera module are relatively high, it is sometimes necessary to design a periscope module. Lenses with larger aspect ratios, and at this point, the introduction of wafer-level lenses will have an advantage in terms of resolution compared to individually molded D-cut lenses.
  • the reason is as mentioned above, when the aspect ratio of the D-cut lens (that is, the ratio of the dimension in the X-direction to the dimension in the Z-direction) is large to a certain extent, the shrinkage during the molding process will cause the surface accuracy to be inconsistent in different directions. This problem It will cause astigmatism in the entire optical system, thereby reducing the resolution.
  • the problem of inconsistent surface accuracy in different directions is difficult to correct or compensate for in the subsequent assembly process of the module.
  • the wafer-level lens can have an advantage in resolution compared to the lens based on the traditional process.
  • the aspect ratio of the lens is above 1.1, on the premise of ensuring that the module has a small height, and ensuring the advantages of large light input and large aperture, the wafer-level lens is used compared to the traditional
  • the injection molding process to make D-cut lenses is more conducive to ensuring that the resolution meets the design requirements.
  • the aspect ratio of the lens is above 1.2, compared with the D-cut lens made by the traditional injection molding process, the solution using the wafer-level lens will have more obvious advantages in terms of resolution.
  • the wafer-level lens can be cut so that its light-transmitting curved surface forms a D-cut shape, or is close to a D-cut shape.
  • the light-transmitting surface is the convex or concave surface used for imaging in a wafer-level lens.
  • Each wafer-level lens includes a plurality of wafer-level mirrors arranged along an optical axis, each wafer-level mirror having at least one convex or concave surface for imaging. Under the top view angle (ie, the viewing angle parallel to the optical axis direction), in the original lens wafer, the outer contours of these convex or concave surfaces are usually circular, and they are the main optical components constituting the lens unit.
  • FIG. 9a shows a schematic diagram of cutting a wafer-level lens so that its light-transmitting curved surface is close to a D-cut shape in an embodiment of the present application.
  • the shape close to the D-cut means that the outer side surface of the wafer-level lens is roughly the cut surface of the circular outer contour of the light-transmitting curved surface with the largest diameter.
  • the dashed line in FIG. 9 a shows the cutting line, wherein the cutting line is tangent to the circular outer contour of the light-transmitting curved surface 59 .
  • FIG. 9b shows a schematic diagram of cutting a wafer-level lens so that its light-transmitting curved surface forms a D-cut shape in an embodiment of the present application.
  • the light-transmitting curved surface may have an optical zone (or called an optically effective zone) and a non-optical zone (ie, an optically invalid zone) around the optical zone.
  • the aperture of the imaging channel can sometimes be adjusted through a diaphragm, so that the edge regions of the light-transmitting curved surface do not participate in imaging, that is, these edge regions can constitute an optically invalid area, while the central area within the aperture of the imaging channel constitutes an optically effective area.
  • the optically effective area may also be referred to as an imaging area
  • the optically ineffective area may also be referred to as a non-imaging area.
  • the desired D-cut shape can be obtained by cutting the light-transmitting curved surface of the lens unit of the lens wafer with a circular outer contour, and in one solution, the cutting line can pass through the non-imaging area but avoid the imaging area. This solution requires relatively low cutting accuracy, which helps to reduce costs and improve yield.
  • a part of the imaging area is further excised, so that the optical area of the lens also has a D-cut shape. That is, the cut line passes through both the non-imaged area and the imaged area.
  • This design will help to further reduce the height of the wafer-level lens (that is, the Z-axis dimension), thereby reducing the height of the periscope module, but the requirements for cutting accuracy are relatively high.
  • the cutting of the D-cut shape can be completed in the step of cutting the lens wafer, that is, the light-transmitting curved surface with the D-cut shape in the above embodiment can be directly obtained by cutting the lens wafer, instead of The lens wafer needs to be cut into individual wafer-level lenses first, and then the single wafer-level lens needs to be cut to form a lens with a D-cut shape.
  • a wafer-level lens or lens wafer
  • only part of the lens can be cut (for example, only one or several light-transmitting curved surfaces with the largest diameter) can be cut to form a D-cut shape or It is close to the shape of D-cut, and other light-transmitting curved surfaces with smaller diameters may not be cut.
  • the D-cut shape is obtained by cutting a light-transmitting curved surface with a circular outer contour, but the present application is not limited to this.
  • the D-cut shape may also be obtained by cutting a flat portion of the lens unit.
  • the outer contour of the flat part of the lens unit can sometimes be made into a circle, and in this case, the D-cut shape can be obtained by cutting the flat part of the lens unit (ie, the cutting line avoids the light-transmitting curved surface).
  • the outer contour of the flat part of the lens unit is made into a square shape, in this case, the flat part of the lens unit can also be cut and the cutting line avoids the light-transmitting curved surface.
  • FIG. 32a shows a schematic cross-sectional view of an imaging lens composed of a wafer-level lens and a non-wafer-level lens in an embodiment of the present application.
  • Fig. 32b shows a schematic perspective view of the imaging lens corresponding to Fig. 32a in an embodiment in which some lenses adopt wafer-level lenses in the present application.
  • Fig. 32c shows a view from an image-side viewing angle of the imaging lens corresponding to Fig. 32a in an embodiment in which some lenses adopt wafer-level lenses in the present application.
  • the outer contour of the wafer-level lens 30 is rectangular
  • the outer contour of the non-wafer-level lens 70 is circular.
  • the dimension (including the length and width) of the wafer-level lens 30 perpendicular to its optical axis is larger than the diameter of the non-wafer-level lens 70 (the diameter is the dimension perpendicular to its optical axis).
  • the light-reflecting element may be a prism (eg, a reflective prism).
  • the wafer-level lens 30 may be further cut in the Z direction to shorten the height, so the dimension of the wafer-level lens 30 in the Z direction is smaller than its dimension in the X direction. Also, in this embodiment, the size of the wafer-level lens 30 is smaller than the prism in the Z direction, and larger than the prism in the X direction.
  • the substrate of at least one wafer-level lens of the wafer-level lens has an infrared cut-off function, so that the wafer-level lens has an infrared cut-off function, so that the photosensitive component can no longer be required.
  • the infrared cut-off function of the substrate can be realized by, for example, that the substrate material itself has the function of absorbing infrared rays or the surface of the substrate is coated with an infrared cut-off film.
  • Fig. 33a shows a periscope module with a driving mechanism in an embodiment of the present application.
  • the periscope module further includes a lens drive mechanism, and the lens drive mechanism includes a drive housing (which may be a part of the housing 10), a carrier 61, at least a A coil-magnet pair 62, through the lens driving mechanism, can drive the wafer-level lens 30 as a telephoto lens along its optical axis (referred to as the second optical axis 12) or perpendicular to its optical axis (referred to as the second optical axis 12).
  • the second optical axis 12 optical axis
  • the second optical axis 12 perpendicular to its optical axis
  • the lens driving mechanism further includes at least one elastic element for connecting the carrier and the driving housing, so that the carrier is suspended in the driving housing, so that the lens
  • the drive mechanism can drive the carrier to move relative to the drive housing.
  • the elastic element may be an elastic sheet, a spring or the like.
  • the lens driving mechanism may also be provided with balls, and the balls are disposed between the carrier and the drive housing, so that the carrier can move relative to the drive housing.
  • the wafer-level lens can be obtained by laser cutting stacked and assembled wafers, and the outer side of the wafer-level lens can be formed into other shapes than rectangles, for example, The outer side of the wafer-level lens can be cylindrical or cut to fit the existing driving mechanism without changing the structure of the driving mechanism (for example, without changing the shape and structure of the carrier of the driving mechanism. ).
  • FIG. 33b shows a view from an image-side viewing angle of an imaging lens with a driving mechanism in an embodiment of the present application.
  • the imaging lens includes a non-wafer-level lens 70 and a wafer-level lens 30 .
  • the non-wafer-level lens 70 may be a conventional lens in which a lens group is formed by a lens barrel.
  • the outer side of the non-wafer-level lens 70 may be circular, and the outer side of the wafer-level lens 30 may be rectangular.
  • the wafer-level lens 30 includes at least one lens, and the diameter of the at least one lens is larger than the diameter of any lens in the non-wafer-level lens 70 .
  • the four corner regions of the image-side end surface of the non-wafer-level lens 70 may have a certain space, so that the magnet 62a or the coil can be arranged in the space.
  • the influence of the carrier on the size of the periscope module can be reduced, thereby further reducing the volume of the module.
  • FIG. 33c shows a schematic cross-sectional view of an imaging lens in another embodiment of the present application.
  • the imaging lens includes a non-wafer-level lens 70 and a wafer-level lens 30 .
  • the non-wafer-level lens 70 may be a conventional lens in which a lens group is formed by a lens barrel.
  • the outer side of the non-wafer-level lens 70 may be circular, and the outer side of the wafer-level lens 30 may be rectangular.
  • the wafer-level lens 30 includes at least one lens, and the diameter of the at least one lens is larger than the diameter of any lens in the non-wafer-level lens 70 .
  • the imaging lens further includes a lens holder 71 .
  • the lens holder 71 may surround the wafer-level lens 30 and the non-wafer-level lens 70 .
  • the outer sides of the wafer-level lens 30 and the non-wafer-level lens 70 are respectively bonded with corresponding sections of the inner side of the lens holder 71 (the adhesive 72 can be used for bonding), so that the wafer-level lens can be bonded together.
  • 30 and the non-wafer-level lens 70 are fixed as a whole by the lens holder 71 to form a complete imaging lens.
  • the lens holder 71 in this embodiment does not need to support the assembly of the lens, so compared with the lens barrel in the conventional lens, the thickness thereof can be relatively low, so that the overall radial dimension of the imaging lens can be reduced.
  • the lens holder 71 may not be closed, for example, the lens holder may be only provided on both sides of the imaging lens in the X direction, so as not to increase the imaging lens in the Z direction. size. In this way, the size (ie height) of the periscope module in the Z direction can be further reduced.
  • the lens holder can be regarded as being located on the wafer-level lens 30 and the non-wafer-level lens 70. Circular stage lens 70 outside.
  • the wafer-level lens 30 and the non-wafer-level lens 70 of the imaging lens may be assembled based on an active calibration process to constitute the imaging lens.
  • the active calibration is to adjust the relative positions of the wafer-level lens 30 and the non-wafer-level lens 70 according to the imaging result actually output by the photosensitive component.
  • pre-positioning can be performed first, that is, the wafer-level lens 30 and the non-wafer-level lens 70 are arranged along the optical axis (for example, the second optical axis), so that the wafer-level lens 30 and the non-wafer-level lens 70 share the same Constructing an imageable optical system, the wafer-level lens 30 and the non-wafer-level lens 70 maintain a calibration gap.
  • Active calibration is then performed. In the active calibration stage, the photosensitive component is powered on to obtain the image formed by the imageable optical system, and the image quality of the imageable optical system in the current state is calculated through image algorithms such as SFR and MTF, and the calibration gap is calculated according to the image quality.
  • the relative position between the wafer-level lens 30 and the non-wafer-level lens 70 is actively adjusted in real time in at least one direction of the six-axis direction according to the adjustment amount (that is, the calibration gap is adjusted).
  • the image quality of the lens can reach the target value.
  • the wafer-level lens 30 and the non-wafer-level lens 70 are bonded by adhesive, so that they remain in the relative positions determined by the active calibration.
  • the imaging quality can be characterized by one or more of optical parameters such as resolution peak, field curvature, and astigmatism, and can also be characterized by a weighted comprehensive value of the above optical parameters.
  • the six-axis directions may be: X-axis, Y-axis, Z-axis, and six directions of rotation around X-axis, Y-axis, and Z-axis.
  • the wafer-level lens 30 and the non-wafer-level lens are bonded by an adhesive.
  • the step of 70 may include two sub-steps: an adhesive deployment step and a curing step.
  • the adhesive placement step can be done before the active calibration or after the active calibration (for example, after the active calibration is completed, one of the sub-lenses can be removed, the adhesive can be placed on the other sub-lens, and then according to the record.
  • the position of the sub-lens returns to the position of the previous sub-lens, wherein the sub-lens refers to the wafer-level lens 30 or the non-wafer-level lens 70 that constitutes the imaging lens.
  • the adhesive is suitable for UV thermosetting glue, UV glue or glue such as thermosetting glue.
  • the adhesive curing step is to cure the corresponding type of adhesive by irradiating UV light, heating, etc., so that the wafer-level lens 30 and the non-wafer-level lens 70 are maintained in the relative positions determined by the active calibration.
  • the lens assembled by the active calibration method can be adjusted by the relative position of each lens part to compensate the manufacturing tolerance of each sub-lens itself, so that the imaging quality of the imaging lens can meet the requirements.
  • the optical axis 30 of the wafer-level lens and the optical axis of the non-wafer-level lens 70 can be adjusted. has a non-zero included angle.
  • the included angle is usually not more than 1°.
  • FIG. 34 shows a schematic diagram of adjacent wafer-level mirrors being directly fixed to each other in an embodiment of the present application.
  • the structure regions 39c of the two wafer-level lenses may be supported and fixed together, and the structure regions 39c may be formed of resin or other lens molding materials in the non-imaging area), thereby forming the wafer-level lens 30 .
  • the optical path turning assembly may include a prism as an optical path turning element and a prism driving mechanism.
  • the prism may be a reflecting prism having two mutually perpendicular right-angled faces and an inclined face serving as a reflecting face, and the two right-angled faces may serve as an incident face and an exit face, respectively.
  • Figure 13 shows an exploded schematic view of the optical path turning assembly.
  • the prism driving mechanism includes a bracket 13 , an elastic element 14 , a first driver 15 , a second driver 16 , and a prism housing 17 .
  • the prism 21a ie, the light-reversing element 21 , which can be referred to in conjunction with FIG.
  • the first driver 15 can be a coil-magnet pair, wherein the coil can be fixed to the prism housing 17, and the magnet can be fixed to the bracket 13;
  • the second driver 16 can be a coil-magnet pair , wherein the coil can be fixed on the prism housing 17 , and the magnet can be fixed on the bracket 13 .
  • the prism driving mechanism is adapted to drive the prism 21a to translate in the X-axis direction or drive the prism 21a to rotate around the X-axis direction, so as to change the exit angle of the incident light and play the role of optical anti-shake.
  • a series of deformed wafer-level lenses can also be used to replace the wafer-level lenses mentioned above.
  • the following descriptions are respectively made with reference to a plurality of embodiments.
  • the spacer, the support member, and the light shielding member can all be molded together with the wafer-level lens by means of insert injection molding, thereby simplifying the process.
  • the spacer between at least two of the wafer-level lenses may be formed entirely or partially of magnetic materials.
  • FIG. 35a shows a schematic cross-sectional view of an imaging lens in which a part of the spacer is formed of a magnetic material according to an embodiment of the present application.
  • FIG. 35b shows a schematic cross-sectional view of the imaging lens shown in FIG. 35a after being installed in the periscope module. Referring to FIGS.
  • a portion of the spacer 52a of the wafer-level lens 30 may be formed of a magnetic material 62a, so that the spacer 52a is magnetic.
  • the carrier 61 of the lens driving mechanism of the periscope module may not be provided with a magnet, thereby further reducing the thickness of the carrier 61, and even further eliminating the carrier 61, so as to achieve periscope The purpose of reducing the size of the mold module, especially the size reduction in the X direction.
  • the elastic elements fixed on the carrier 61 and the drive housing 10a in the original design can be fixed on the wafer-level lens 30 and the drive housing 10a, so that the wafer-level lens 30 is suspended on the drive housing 10a middle.
  • FIG. 36 is a schematic perspective view showing the shape and arrangement of the carrier of the lens driving mechanism in an embodiment of the present application.
  • the carrier of the lens driving mechanism includes a first carrier 61a and a second carrier 61b, the first and second carriers 61a and 61b are fixed on the wafer-level lens 30 and the non- Both sides of the wafer-level lens 70 in the X direction.
  • the magnet 62a or the coil is fixed on the carrier 61 and is arranged opposite to the coil or magnet fixed on the casing, so that the carrier, the coil, the magnet and the driving casing are suitable to form a lens driving mechanism to drive the imaging lens to move.
  • the lens driving mechanism may further include at least one elastic element for connecting the carrier and the driving housing, so that the carrier is suspended in the driving housing, so that the lens driving mechanism can drive the carrier to move relative to the driving housing .
  • the elastic element may be an elastic sheet, a spring or the like.
  • FIG. 37a shows a periscope camera module in which the wafer-level lens and the non-wafer-level lens are designed separately according to an embodiment of the present application.
  • the wafer-level lens 30 is separated from the non-wafer-level lens 70 .
  • the wafer-level lens 30 is mounted on the carrier 61 of the lens driving mechanism.
  • the non-wafer-level lens 70 may be fixed.
  • the wafer-level lens 30 can move along the direction of the second optical axis 12 or in a direction perpendicular to the second optical axis 12 to realize focusing (AF) or optical image stabilization (OIS) of the periscope module Function.
  • AF focusing
  • OIS optical image stabilization
  • the non-wafer-level lens 70 may also be used to implement the function of focusing (AF) or optical image stabilization (OIS).
  • the non-wafer-level lens 70 is mounted on the carrier 61 of the lens driving mechanism.
  • the wafer-level lens 70 may be fixed.
  • the non-wafer-level lens 70 can move along the direction of the second optical axis 12 or in a direction perpendicular to the second optical axis 12 to realize focusing (AF) or optical image stabilization (OIS) of the periscope module. )Function.
  • FIG. 37b shows an optical zoom periscope camera module in another embodiment of the present application in which the wafer-level lens and the non-wafer-level lens are designed separately.
  • a fixed mirror group 80 (the fixed mirror group 80 may have one or more fixed lenses) is added at the front end (object side end) of the wafer-level lens, and the wafer
  • the stage lens 30 and the non-wafer-level lens 70 are respectively mounted on the carriers 61c and 61d of the first lens driving mechanism and the second lens driving mechanism.
  • the wafer-level lens 30 can move along the direction of the second optical axis 12 under the driving of the first lens driving mechanism to realize the zoom function, and the non-wafer-level lens 70 can be driven by the second lens driving mechanism.
  • the image plane of the imaging system is always on the photosensitive surface of the photosensitive component 40 or a position close to the photosensitive surface, that is, the non-wafer
  • the stage lens 70 can implement a focusing function to compensate for the image plane movement caused by zooming.
  • the functions of the wafer-level lens 30 and the non-wafer-level lens 70 can be interchanged, that is, the non-wafer-level lens 70 can be used to realize the zoom function, and the wafer-level lens 30 can be used to implement the focus function to compensate for the image plane shift caused by zooming.
  • the fixed lens group 80 may be a wafer-level lens or a non-wafer-level lens. When the optical aperture of the fixed lens group 80 is relatively large, a wafer-level lens is preferably used.
  • the wafer-level lens may use a substrate with through holes. 17a and 17b, the substrate 33 has at least one through hole 33a, and the at least one through hole 33a is distributed in the lens unit area, so that the substrate 33 can be made of an opaque material. Due to the through holes 33a, the substrate 33 will not affect the light transmittance of the lens unit, and the thickness of the substrate 33 will not affect the thickness of the lens unit. The distance is less than the thickness of the substrate.
  • a molding die During production, a molding die can be provided, the molding die includes an upper die 31 and a lower die 32, the upper and lower dies 31 and 32 clamp a substrate 33 and form a molding cavity 34, and the upper and lower die
  • the injection port 35 formed by 31 and 32 is injected with liquid lens material (such as resin), so that the interior of the molding cavity 34 is filled with the lens material, and then the lens material is cured to form a resin layer 36 on one or both sides of the substrate 33 to form the lens wafer , the upper mold 31 and the lower mold 32 are separated, and the lens wafer is taken out.
  • the manufacturing process of the above-mentioned lens wafer is an insert molding process (Insert Molding).
  • the substrate 33 has at least one through hole 33 a , and the at least one through hole 33 a is distributed in the lens unit area of the substrate 33 .
  • a lens unit can be formed in the lens unit area of the substrate 33 through the insert injection molding process, and the lens unit can be embedded in the through hole of the substrate.
  • the lens unit is composed of a lens portion 37a located in the middle (ie, the portion corresponding to the light-transmitting curved surface, the outer contour of which may be circular) and a flat portion 37b located around the lens portion 37a, which is located in the in the through hole 33 a of the substrate 33 . Further, FIG.
  • FIG. 38 shows an example of a lens wafer based on the lens wafer shown in FIG. 18a in one embodiment of the present application.
  • a plurality of lens wafers 39 can be obtained, and the plurality of lens wafers 39 , the light-shielding member layer 51 , the spacer layer 52 , and the support member layer 53 are stacked in sequence, and the adhesive They are fixed to each other to obtain a lens wafer 50 .
  • the optical axes of the lens units of adjacent lens wafers 39 overlap (manufacturing tolerances are not considered here).
  • the lens wafer may not be provided with a light shielding member layer, a supporting member layer, or the like.
  • the lens wafer can be divided by at least one of sawing, laser cutting, laser grinding, water jet cutting, milling, micromachining, micro-slicing, punching and cutting to obtain wafer-level lenses.
  • FIG. 39 shows a schematic cross-sectional view of a lens wafer with through holes cut into a substrate according to an embodiment of the present application.
  • FIG. 40 shows a schematic cross-sectional view of a wafer-level lens with through holes in an embodiment of the present application.
  • a light shielding layer may also be provided on the peripheral side of the wafer-level lens.
  • the wafer-level lens 30 includes at least two wafer-level lenses 39a, and the wafer-level lens 39a includes a substrate 33 and is disposed on the substrate 33
  • the lens unit on one side or both sides, the central area of the substrate 33 (ie the lens unit area) has a through hole 33a, the lens unit is embedded in the through hole 33a of the substrate 33, the lens of the lens unit
  • the portion 37a is located in the through hole 33a of the substrate 33 .
  • the lens unit is composed of a lens portion 37a located in the middle and a flat portion 37b located around the lens portion 37a, and the shape of the lens portion 37a is suitable for convex or concave; the at least two wafer-level lenses 39a There is at least one spacer 52a therebetween, the spacer 52a fixes the adjacent wafer-level mirrors 39a through adhesive, and adjusts the distance between the adjacent wafer-level mirrors 39a.
  • the light-transmitting material reduces stray light from entering the wafer-level lens 30 from the side;
  • the wafer-level lens 30 further includes a light-shielding member 51a fixed on the object side of the lens through an adhesive and a support member 53a on the image side of the lens,
  • the shading member 51a and the supporting member 53a are preferably made of opaque materials to reduce the influence of stray light, wherein the shading member 51a has an inner wall whose diameter is gradually reduced toward the lens image side.
  • the wafer-level lens may not be formed by insert molding, but may be formed by bonding lens units on a substrate.
  • FIG. 21a shows a schematic diagram of forming a lens wafer by bonding lens units on a substrate in an embodiment of the present application.
  • a substrate 33 a plurality of lens units 37 can be provided, and the lens units 37 are flat on one side and have a convex or concave surface (ie, a light-transmitting curved surface, sometimes also referred to as an imaging curved surface) on the other side.
  • a convex or concave surface ie, a light-transmitting curved surface, sometimes also referred to as an imaging curved surface
  • each lens unit 37 is supported on and attached to the base plate 33, for example, a plurality of lens units 37 can be fixed on one side or both sides of the base plate 33 by adhesive ( FIG. 21b shows an embodiment of the present application of the lens wafers of the lens unit are fixed on both sides of the substrate), thereby forming a lens wafer 39 .
  • the substrate 33 and the lens unit can be made of materials such as glass, resin, etc. that can transmit visible light
  • the adhesive is also preferably an adhesive suitable for passing visible light, such as optical glue.
  • the optical adhesive is colorless and transparent, the light transmittance is above 90%, the bonding strength is good, it can be cured at room temperature or medium temperature, and the curing shrinkage is small.
  • the fixation between the lens unit and the substrate can also be carried out in other ways, for example, the plane side of the lens unit can be fixed to the base plate by means of bonding.
  • a plurality of lens wafers 39, a light-shielding member layer 51, a spacer layer 52, and a support layer 53 are sequentially stacked to obtain a lens wafer 50 (refer to FIG. 21c, FIG. example of a circle).
  • the lens wafer 50 may not include a light shielding member layer or a supporting layer. Further, referring to FIG. 42 (FIG.
  • FIG. 42 shows an example of cutting a lens wafer in an embodiment of the present application, and the dotted line in the figure represents a cutting line), through sawing, laser cutting, laser grinding, water jet cutting, milling At least one of cutting, micro-machining, micro-slicing, punching and cutting is used to divide the lens wafer to obtain the wafer-level lens 30 .
  • FIG. 43 shows an example of a diced lens-level wafer in one embodiment of the present application. Further, after cutting, a light shielding layer may also be provided on the peripheral side of the wafer-level lens.
  • the wafer-level lens can also be manufactured by pressing the wafer.
  • Figure 24a shows a substrate and mold based on a pressing process in one embodiment of the present application. Specifically, a substrate 33 and a pressing mold can be provided, the pressing mold includes an upper mold 31 and a lower mold 32, and the substrate 33 is made of a light-transmitting material. Then, the upper mold 31 or the lower mold 32 is moved, and one surface or both surfaces of the substrate 33 is pressed into a predetermined shape by a pressing mold to form a lens wafer 39 .
  • FIG. 24b shows a schematic diagram of compression molding of a lens wafer in an embodiment of the present application.
  • FIG. 25a shows the formed lens wafer in an embodiment of the present application
  • the spacer layer 52 and the support layer 53 are stacked in sequence and fixed to each other by an adhesive to obtain a lens wafer 50 .
  • Figure 44 shows a lens wafer in one embodiment of the present application.
  • the optical axes of the lens units of adjacent lens wafers 39 overlap (regardless of manufacturing tolerances).
  • the wafer-level lens 30 is obtained by dividing the lens wafer by at least one of sawing, laser cutting, laser grinding, water jet cutting, milling, micromachining, micro-slicing, punching and the like.
  • FIG. 45 shows a schematic diagram of dicing a lens wafer in one embodiment of the present application.
  • FIG. 46 shows a wafer-level lens obtained after dicing in an embodiment of the present application.
  • a light shielding layer may also be provided on the peripheral side of the wafer-level lens 30 .
  • the wafer-level lens 30 includes at least two wafer-level lenses 39 , the wafer-level lenses 39 are formed by pressing a substrate by pressing a mold, and the at least two wafer-level lenses 39 are formed by pressing a substrate. There is at least one spacer 52a between the lenses. The spacer 52a fixes the adjacent wafer-level lenses 39 through adhesive and adjusts the distance between the adjacent wafer-level lenses 39.
  • the spacer 52a is preferably used
  • the opaque material reduces stray light from entering the wafer-level lens 30 from the side;
  • the wafer-level lens 30 may further include a shading member 51a fixed on the object side of the lens by adhesive and a support on the image side of the lens
  • the component 53a, the shading component 51a and the support component 53a are preferably made of opaque materials to reduce the influence of stray light.
  • the shading member 51a has an inner wall whose diameter gradually decreases from the object side of the lens to the image side of the lens.
  • the wafer-level lens can also be obtained by cutting the lens wafer first to obtain the wafer-level lens, and then the wafer-level lens, light shielding member, spacer, support member, etc. are stacked and fixed in sequence. , forming a wafer-level lens.
  • a non-wafer-level lens is a concept relative to a wafer-level lens.
  • a non-wafer-level lens refers to a conventional lens with a very mature production process.
  • the lens group is formed to form the lens of the lens group.
  • the inner surface of the lens barrel may have multiple steps, and each lens may be sequentially loaded into the lens barrel according to its diameter from small to large, thereby completing the assembly.

Abstract

L'invention concerne un module de photographie périscopique, qui comprend : un élément de rotation de trajet optique ; une lentille de qualité de tranche, qui est disposée au niveau d'une extrémité de transmission de l'élément de rotation de trajet optique, la lentille de qualité de tranche étant produite par découpe d'une tranche de lentille, la tranche de lentille étant une combinaison produite par empilement de multiples ensembles de tranches de lentille, chacune des tranches de lentille comprenant un réseau de lentilles constitué de multiples unités de lentille, au moins une surface avec laquelle chacune des unités de lentille étant disposée est une surface incurvée transmettant la lumière, et le contour de la surface incurvée transmettant la lumière étant circulaire ; et un composant photosensible, qui est utilisé pour recevoir un signal optique traversant la lentille de qualité de tranche et délivrer en sortie des données d'imagerie. La présente invention évite le problème de précision de forme de surface irrégulière dans deux directions perpendiculaires l'une à l'autre provoquée par un procédé de formation de lentille à coupe D, garantissant ainsi une qualité d'imagerie. La précision de forme de surface irrégulière provoque des problèmes tels que l'astigmatisme et est difficile à compenser au moyen d'un processus d'assemblage de module ultérieur.
PCT/CN2021/106020 2020-08-21 2021-07-13 Module de photographie périscopique WO2022037320A1 (fr)

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CN202010847105.6A CN114076998B (zh) 2020-08-21 2020-08-21 潜望式摄像模组
CN202010847292.8A CN114076999B (zh) 2020-08-21 2020-08-21 潜望式摄像模组
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JP2004029554A (ja) * 2002-06-27 2004-01-29 Olympus Corp 撮像レンズユニットおよび撮像装置
US20170238785A1 (en) * 2008-10-08 2017-08-24 Olympus Corporation Manufacturing method for image pickup unit and image pickup unit
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