WO2022036681A1 - Led发光源装置及其制造方法 - Google Patents

Led发光源装置及其制造方法 Download PDF

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Publication number
WO2022036681A1
WO2022036681A1 PCT/CN2020/110483 CN2020110483W WO2022036681A1 WO 2022036681 A1 WO2022036681 A1 WO 2022036681A1 CN 2020110483 W CN2020110483 W CN 2020110483W WO 2022036681 A1 WO2022036681 A1 WO 2022036681A1
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WO
WIPO (PCT)
Prior art keywords
substrate
bonding surface
mold
pin
conductive wire
Prior art date
Application number
PCT/CN2020/110483
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English (en)
French (fr)
Inventor
柯银湖
Original Assignee
柯银湖
江苏易盛光光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 柯银湖, 江苏易盛光光电科技有限公司 filed Critical 柯银湖
Priority to EP20780549.0A priority Critical patent/EP3978797A4/en
Priority to PCT/CN2020/110483 priority patent/WO2022036681A1/zh
Priority to US17/041,409 priority patent/US20230106003A1/en
Publication of WO2022036681A1 publication Critical patent/WO2022036681A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Definitions

  • the present invention relates to LED light-emitting products, and more specifically relates to an LED light-emitting source device and a manufacturing method thereof.
  • the current traditional LED packaging is mainly packaged by PCB Layout.
  • the size and shape of the substrate are fixed during the molding of the mold. Not only does each shape of the substrate need to develop a set of molds, which greatly increases the manufacturing cost , and the shape of the wiring cannot be changed, and there are problems such as high manufacturing cost, poor universality of fixed size and shape, and so on.
  • the current LED light sources are assembled using patch components to achieve various patterns and fonts.
  • patch components are all single-sided emitting light, so the luminous effect is not ideal.
  • the conventional LED package has problems such as high manufacturing cost, poor versatility of fixed size and shape, and unsatisfactory luminous effect.
  • the present invention provides an LED light source device, comprising: a first substrate, which is light-transmitting and has a first bonding surface; and at least two pins, each of which has an inner connection portion and an outer connection portion. part, the inner connection part of each pin is connected to the first bonding surface of the first substrate, and the outer part of each pin is exposed outside the first bonding surface; at least one control chip, fixed set on the first bonding surface of the first substrate; at least one LED chip is fixed on the first bonding surface of the first substrate; at least one conductive wire is fixed on the first bonding surface of the first substrate
  • the joint surface is connected with the internal connection parts of the control chip, the LED chip and the pins, so as to conduct the electrical properties of the control chip, the LED chip and the pins;
  • a second substrate, which is light-transmitting has a second A bonding surface, the second bonding surface is bonded and connected to the first bonding surface of the first substrate, so as to cover the inner connection portion of the conductive wire, the control chip
  • it further includes at least one conductive sheet, the conductive sheet is fixed on the first bonding surface of the first substrate and connected with the conductive wire.
  • the present invention can achieve the effect of emitting light all around, and under the same energy (electricity) consumption, the present invention can It is more than twice the brightness of the original technology, which greatly improves the utilization rate of energy and meets people's needs for high-brightness LED light sources.
  • the present invention further provides a manufacturing method of an LED light-emitting source device, which includes the following steps: step A, preparing a pin material: the pin material has at least two pins; step B, preparing a first substrate: the connection The foot material is placed on a first mold, the first mold has at least one first mold cavity, and glue is injected into the first mold. After the glue is cooled and solidified, a first substrate that is transparent is obtained.
  • step C fixing the chip and Wire bonding: fix at least one control chip, at least one LED chip and at least one conductive wire on the first bonding surface of the first substrate, so that the conductive wire is internally connected to the control chip, LED chip and pins
  • the parts are connected to each other so as to be electrically connected to each other
  • Step D attaching the second substrate: placing the first substrate together with the pin material on a second mold, the second mold having at least one second cavity, The first bonding surface of the first substrate faces the second mold cavity, and glue is injected into the second mold.
  • a light-transmitting second substrate is obtained.
  • the second bonding surface is bonded and connected to the first bonding surface of the first substrate, and the inner connection portion of the pin, the control chip, the LED chip and the conductive wire are wrapped on the first bonding surface of the first substrate Between the surface and the second bonding surface of the second substrate; Step E, cutting the desired shape: cutting out the desired shape of the first substrate and the second substrate, so that the first substrate and the second substrate outside the predetermined shape are The parts of the substrate and the pin material are cut off to obtain a finished product of the LED light source device. Thereby, the manufacturing cost is reduced, the versatility is better, the mass production is facilitated, and the luminous effect is remarkable.
  • the pin material is made of any one of copper silver-plated or iron silver-plated material, the pin material further has a material frame, and the two pins are made from the material The inside of the frame protrudes.
  • the glue can be any one of epoxy resin, silica gel, ceramic, and aluminum oxide.
  • the epoxy resin can be bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, tetrabromobisphenol epoxy resin, rubber modified epoxy resin, cyclic epoxy resin, etc. Any of epoxy resins, aliphatic epoxy resins, or any combination thereof.
  • step C at least one conductive sheet is fixed on the first bonding surface of the first substrate, and the conductive wire is connected with the conductive sheet.
  • the glue contains fluorescent powder.
  • the glue contains a light diffusing agent.
  • the present invention cuts the outer shape after the first substrate and the second substrate are formed, so that it is not necessary to prepare molds of various shapes, and the cost of mold opening can be reduced to reduce the manufacturing cost , and make mass production more efficient and production lines more flexible and adaptable.
  • the present invention provides another manufacturing method of an LED light source device, which includes the following steps: Step A, preparing a pin material: the pin material has at least two pins, and each pin has an internal connection part and An external part; Step B, wiring: electrically connect at least one conductive wire with each internal connection part of the two pins, and arrange a number of solder pads at predetermined positions of the conductive wire; Step C, prepare a first substrate : Place the leg material on a first mold, the first mold has at least one first mold cavity, inject glue into the first mold cavity, and after the glue is cooled and solidified, a transparent first mold is obtained.
  • step D fixing the chip: at least one control chip and at least one LED chip is fixed on the bonding pad of the conductive wire, so that the control chip and the LED chip are located on the first bonding surface of the first substrate, and are electrically connected with the conductive wire and the pins;
  • step E bonding the first Two substrates: the first substrate and the lead sheet are placed on a second mold, the second mold has at least one second mold cavity, and the first bonding surface of the first substrate faces the second mold The second mold cavity is filled with glue, and after the glue is cooled and solidified, a light-transmitting second substrate is obtained.
  • a second bonding surface of the second substrate is bonded to the first bonding surface of the first substrate.
  • Surface bonding connection so that the internal connection part of the pin, the control chip, the LED chip and the conductive wire are all wrapped between the first bonding surface of the first substrate and the second bonding surface of the second substrate.
  • the present invention also provides a manufacturing method of an LED light source device, which includes the following steps: Step A. Prepare a pin material: the pin material has at least two pins, and each pin has an inner connection portion and an outer connection portion. Step B, wiring and fixing the chip: electrically connecting at least one conductive wire with each internal connection portion of the two pins, and laying a number of pads at predetermined positions of the conductive wire to connect at least one control chip and at least one LED chip is fixed on the bonding pad of the conductive wire, so that the control chip, the LED chip and the conductive wire and the pins are electrically connected; step C, prepare a first substrate: place the pin material on the On a first mold, the first mold has at least one first mold cavity, and glue is injected into the first mold cavity.
  • a light-transmitting first substrate is obtained.
  • the inner connecting portion of the lead sheet and the conductive wire are connected to a first bonding surface of the first substrate;
  • Step D attaching the second substrate: placing the first substrate together with the lead sheet on a second mold
  • the second mold has at least one second mold cavity, and the first bonding surface of the first substrate faces the second mold cavity, and glue is injected into the second mold cavity.
  • a light-transmitting second substrate is obtained, a second bonding surface of the second substrate is bonded and connected to the first bonding surface of the first substrate, and the internal connection portion of the pin, the control chip, and the LED chip are connected.
  • step E cutting the desired shape: cutting the first substrate and the second substrate A desired shape is obtained, and the first substrate, the second substrate and the pin material outside the predetermined shape are cut off to obtain a finished product of the LED light source device.
  • 1 to 7 are schematic diagrams of the manufacturing process of the manufacturing method of the LED light source device provided by the present invention.
  • FIG. 8 is a perspective view of a preferred embodiment of the LED light source device provided by the present invention.
  • FIG. 9 is a cross-sectional view of the embodiment shown in FIG. 8 .
  • FIG. 10 is a schematic diagram of another embodiment of the LED light source device provided by the present invention.
  • FIG. 11 is a block diagram of the manufacturing flow of the first embodiment of the manufacturing method of the LED light source device provided by the present invention.
  • FIG. 12 is a schematic diagram of another embodiment of the LED light source device provided by the present invention.
  • FIG. 13 is a block diagram of the manufacturing flow of the second embodiment of the manufacturing method of the LED light source device provided by the present invention.
  • FIG. 14 is a block diagram of a manufacturing flow of a third embodiment of the manufacturing method of the LED light source device provided by the present invention.
  • 15 is a partial structural diagram of another embodiment of the LED light source device provided by the present invention.
  • FIG. 16 is a schematic diagram of the assembly of partial parts of another embodiment of the LED light source device provided by the present invention.
  • FIG. 1 to FIG. 11 illustrate a method for manufacturing an LED light source device 100 according to a first preferred embodiment of the present invention.
  • the steps include the following steps.
  • Step A. Preparing the lead sheet 10 Please refer to FIG. 1 and FIG. 11 , take at least one lead sheet 10 , and the lead sheet 10 can be manufactured by yourself or purchased from a supplier.
  • the pin material 10 is made of silver-plated copper or silver-plated iron.
  • the pin material 10 has a frame 11 and at least two pins 12 protruding from the inner side of the frame 11 .
  • Step B Preparation of the first substrate 20 : Please refer to FIGS. 2 , 3 , 4 and 11 , take a first mold 30 , the first mold 30 has at least one first mold cavity 31 , and place the pin material 10 On the first mold 30, let one end of the two pins 12 correspond to the first mold cavity 31 (as shown in FIG. 2), and then inject glue 91 into the first mold cavity 31 (as shown in FIG. 3 ).
  • the glue injection temperature is 100 ⁇ 160°C, and the time is 3 ⁇ 15 minutes.
  • the glue 91 can be epoxy resin (such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin) , tetrabromobisphenol epoxy resin, rubber modified epoxy resin, cyclic epoxy resin, aliphatic epoxy resin, or one of its blends and any combination thereof), silica gel, ceramics, aluminum oxide and other materials.
  • epoxy resin such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin
  • tetrabromobisphenol epoxy resin such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin
  • tetrabromobisphenol epoxy resin such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin
  • rubber modified epoxy resin such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin
  • cyclic epoxy resin such as cyclic epoxy resin, aliphatic epoxy resin, or one of its blends and any combination thereof
  • silica gel such as bis
  • the first bonding surface 21 of the 20 is connected, that is, the part where the pin 12 is connected with the first substrate 20 is an internal connection part 121 , and the part that extends outside the first substrate 20 and is not connected to the first substrate 20 It is an external portion 122 (as shown in FIG. 4 ).
  • Step C. Fix the chip and wire bonding please refer to FIGS. 5 , 6 and 11 , move the lead sheet 10 together with the first substrate 20 from the first mold 30 to a worktable, and control at least one The chip 41 and at least one LED chip 42 are fixed on the first bonding surface 21 of the first substrate 20 (as shown in FIG. 5 ), and the conductive wires 43 are arranged on the first surface of the first substrate 20 by wire bonding technology.
  • the control chip 41 , the LED chip 42 and the internal connection portion 121 of the pin 12 are connected by the conductive wire 43 (as shown in FIG. 6 ), so that the control chip 41 , the LED chip 42 and The pins 12 are electrically connected to each other through the conductive wires 43 .
  • Step D attaching the second substrate 60 : referring to FIG. 7 and FIG. 11 , take a second mold 50 , the second mold 50 has at least one second cavity 51 , the first substrate 20 together with the lead sheet 10 is placed on the second mold 50, with the first bonding surface 21 of the first substrate 20 facing the second mold cavity 51, and then injecting glue 91 into the second mold cavity 51 (as shown in FIG. 7 ).
  • the glue injection temperature is also 100-160° C.
  • the time is 3-15 minutes
  • the material of the glue 91 is the same as that of the first substrate 20 .
  • the glue 91 is cooled and solidified in the second mold cavity 51 , the second substrate 60 that is transparent is obtained, and the second bonding surface 61 of the second substrate 60 and the first bonding surface 21 of the first substrate 20 are obtained.
  • Lamination connection so that the internal connection portion 121 of the pin 12 , the control chip 41 , the LED chip 42 and the conductive wire 43 are all covered on the first bonding surface 21 of the first substrate 20 and the second substrate 60 61 between the second bonding surfaces.
  • Step E cutting the desired shape: referring to FIG. 8 and FIG. 11 , cut out the desired shape of the first substrate 20 and the second substrate 60 , namely the first substrate 20 , the second substrate 60 , the pins outside the predetermined shape
  • the parts of the material sheet 10 are cut off to obtain the finished product of the LED light source device 100 of the present invention.
  • the structure of the LED light source device 100 of the present invention is obtained, as shown in FIG. 8 and FIG.
  • the first substrate 20 has a first bonding surface 21
  • the second substrate 60 has a second bonding surface 61
  • the two pins 12 respectively have an inner connection portion 121 and an outer connection portion 122 .
  • the inner connection portion 121 is connected to the first bonding surface 21 of the first substrate 20, the external portion 122 is exposed outside the first substrate 20, the control chip 41, the LED chip 42 and the conductive wire 43 are fixed on the first substrate
  • the conductive wire 43 is connected to the control chip 41, the LED chip 42 and the internal connection portion 121 of the pin 12 to be electrically conductive.
  • the second bonding surface of the second substrate 60 is The bonding surface 61 is bonded and connected to the first bonding surface 21 of the first substrate 20 , that is, the conductive wire 43 , the control chip 41 , the LED chip 42 and the inner connecting portion 121 of the pin 12 are covered on the first bonding surface 121 . between the first bonding surface 21 of the substrate 20 and the second bonding surface 61 of the second substrate 60 .
  • the present invention can achieve the effect of emitting light around the circumference. Under the same energy (electricity) consumption, the present invention can achieve two of the original technology. More than twice the brightness, greatly improving the utilization rate of energy and meeting people's needs for high-brightness LED light sources.
  • the outer shape is cut, so that it is not necessary to prepare molds of various shapes, thereby reducing the cost of mold opening, reducing the manufacturing cost, and making mass production more convenient. It is more efficient, and the production line is more flexible and adaptable.
  • step C the step of fixing the chip and bonding the wire
  • a plurality of conductive sheets 44 can be fixed on the first bonding surface 21 of the first substrate, and the conductive wires 43 can be connected to on the conductive sheets 44 (as shown in FIG. 10 ) to avoid the breakage of the conductive wires 43 .
  • step C the control chip 41 , the LED chip 42 (and the conductive sheet 44 ) are fixed first, and then the conductive wires 43 are marked. But in fact, in step C, the control chip 41, the LED chip 42 (and the conductive sheet 44) can also be fixed after the conductive wires 43 are marked, and the same effect can still be achieved.
  • phosphor powder can also be added to the raw materials (glue 91 ) of the first substrate 20 and the second substrate 60 , and the phosphor powder can be YAG phosphor powder, TAG phosphor powder, aluminate (Aluminate) , Silicate (Silicatr), Nitride (Nitride) and Nitride (Oxynitride) any one and any combination thereof.
  • a light diffusing agent can also be added to the raw materials (glue 91 ) of the first substrate 20 and the second substrate 60 , and the light diffusing agent can be nano barium sulfate, calcium carbonate, silicon dioxide, pressure Acrylic type light diffusing agent, styrene type, acrylic resin type light diffusing agent, etc. In order to achieve the softening and fogging effect of light.
  • the first mold 30 and the second mold 50 are different molds to improve the efficiency of the production line.
  • the first mold 30 and the second mold 50 can be the same mold to reduce mold cost.
  • the present invention can cut out different shapes according to the actual needs of different customers, so that the scope of application is wider.
  • each pin 12 of the pin material 10 protrude from the two inner sides of the material frame 11 .
  • each pin 12 can only protrude from the same inner side of the material frame 11 , which can not only reduce the manufacturing cost, but also allow the control chip 41 , the LED chip 42 and the conductive wire 43 There is more space for layout (as shown in Figure 16).
  • FIG. 13 is a manufacturing method of an LED light source device provided by a second preferred embodiment of the present invention, and the steps include the following steps.
  • Step A. Preparation of pin material Please refer to FIG. 13, take at least one pin material, the pin material has a material frame and at least two pins protruding from the inner side of the material frame, the same as the previous embodiment, Each pin has an inner connection part and an outer connection part.
  • Step B Wiring: Referring to FIG. 13 , at least one conductive wire is electrically connected to each internal connection portion of the two pins, and a solder pad is arranged at a predetermined position of the conductive wire.
  • Step C Prepare the first substrate: Please refer to FIG. 13 , take a first mold, the first mold has at least one first mold cavity, place the lead sheet on the first mold, and let the two connection The inner connection part of the foot corresponds to the first mold cavity, and then glue is injected into the first mold cavity. After the glue is cooled and solidified in the first mold cavity, a transparent first substrate is obtained, and at this time, the inner connection part of the two-pin material and the conductive wire are connected to the first bonding surface of the first substrate .
  • Step D Fixing the chip: Please refer to FIG. 13 , move the lead sheet, the conductive wire and the first substrate from the first mold to a worktable, and fix at least one control chip and at least one LED chip on the on the bonding pad of the conductive wire, so that the control chip and the LED chip are located on the first bonding surface of the first substrate, and are electrically connected with the conductive wire and the pins.
  • Step E. Attaching the second substrate Please refer to FIG. 13 , take a second mold, the second mold has at least one second mold cavity, and place the first substrate together with the lead sheet on the second mold , and make the first bonding surface of the first substrate face the second mold cavity, and then inject glue into the second mold cavity. After the glue is cooled and solidified in the second mold cavity, a light-transmitting second substrate is obtained, and the second bonding surface of the second substrate is bonded and connected to the first bonding surface of the first substrate, and the The internal connection portion of the pin, the control chip, the LED chip and the conductive wire are all covered between the first bonding surface of the first substrate and the second bonding surface of the second substrate.
  • Step F Cut out the desired shape: Please refer to FIG. 13 , cut out the desired shape from the first substrate and the second substrate, that is, cut off the parts of the first substrate, the second substrate and the pin material outside the predetermined shape , the finished product of the LED light source device of the present invention is obtained.
  • a manufacturing method of an LED light source device provided by a third preferred embodiment of the present invention includes the following steps.
  • Step A. Preparation of pin material Please refer to FIG. 14, take at least one pin material, which has a material frame and at least two pins protruding from the inner side of the material frame as in the previous embodiment, Each pin has an inner connection part and an outer connection part.
  • Step B Wiring and fixing the chip: Please refer to FIG. 14 , electrically connect at least one conductive wire to each internal connection portion of the two pins, and arrange solder pads at predetermined positions of the conductive wire, and connect at least one control The chip and at least one LED chip are fixed on the bonding pad of the conductive wire, so that the control chip, the LED chip, the conductive wire and the pin are electrically connected.
  • Step C Prepare the first substrate: Please refer to FIG. 14 , take a first mold, the first mold has at least one first mold cavity, place the lead sheet on the first mold, and let the two leads The inner connecting part of the first mold cavity corresponds to the first mold cavity, and then glue is injected into the first mold. After the glue is cooled and solidified in the first mold cavity, a transparent first substrate is obtained, and at this time, the inner connecting portion of the two-pin material and the conductive wire are connected to the first bonding surface of the first substrate.
  • Step D. Attaching the second substrate Please refer to FIG. 14, take a second mold, the second mold has at least one second mold cavity, and place the first substrate together with the lead sheet on the second mold , and make the first bonding surface of the first substrate face the second mold cavity, and then inject glue into the second mold. After the glue is cooled and solidified in the second mold cavity, a light-transmitting second substrate is obtained, and the second bonding surface of the second substrate is bonded and connected to the first bonding surface of the first substrate, and the The internal connection portion of the pin, the control chip, the LED chip and the conductive wire are all covered between the first bonding surface of the first substrate and the second bonding surface of the second substrate.
  • Step E Cut out the desired shape: Please refer to FIG. 14 , cut out the desired shape of the first substrate and the second substrate, that is, cut off the parts of the first substrate, the second substrate and the pin material outside the predetermined shape , the finished product of the LED light source device of the present invention is obtained.
  • the LED chips in each embodiment can be arranged in such a way that the light-emitting directions all face the same direction, or the light-emitting directions face different directions, so that the light-emitting effect can be improved. more comprehensive.

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  • Microelectronics & Electronic Packaging (AREA)
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Abstract

一种LED发光源装置，包含有：第一基板（20），呈透光，具有第一贴合面（21）；至少二接脚（12），各接脚（12）具有内接部（121）及外接部（122），各接脚（12）的内接部（121）连接于第一基板（20）的第一贴合面（21）上，各接脚（12）的外接部（122）则露出于第一贴合面（21）外；至少一控制芯片（41），固设于第一基板（20）的第一贴合面（21）上；至少一LED芯片（42），固设于第一基板（20）的第一贴合面（21）上；至少一导电线（43），固设于第一基板（20）的第一贴合面（21）上，并与控制芯片（41）、LED芯片（42）及接脚（12）的内接部（121）连接，以导通控制芯片（41）、LED芯片（42）及接脚（12）的电性；第二基板（60），呈透光，具有第二贴合面（61），第二贴合面（16）与第一基板（20）的第一贴合面（21）贴合连接，以将导电线（43）、控制芯片（41）、LED芯片（42）及接脚（12）的内接部（121）包覆于第一贴合面（21）与第二贴合面（61）间；借以达到全周发光的功效。

Description

LED发光源装置及其制造方法 技术领域
本发明与LED发光产品有关，更详而言之是指一种LED发光源装置及其制造方法。
 背景技术
一般来说目前传统的LED封装，主要采用PCB Layout方式进行封装，其基板的尺寸、形状在模具成形时已为固定，不仅每一种造形的基板皆需开发一套模具而使制造费用大增，且其布线的形态亦无法变更，而有制造成本高昂、尺寸、形状固定的通用性不佳等问题。
另外，目前LED发光源如要达到各种图案、字型发光，都是使用贴片组件进行组装，但此种贴片组件皆为单面发光，因此其发光效果并不甚理想。
 技术问题
有鉴于此，为改善先前技术中，习知的LED封装有着制造成本高昂、尺寸与形状固定的通用性不佳、发光效果不甚理想等问题。
 技术解决方案
缘此，本发明乃提供一种LED发光源装置，包含有：一第一基板，呈透光，具有一第一贴合面；至少二接脚，各接脚具有一内接部及一外接部，所述各接脚的内接部连接于该第一基板的第一贴合面上，所述各接脚的外接部则露出于该第一贴合面外；至少一控制芯片，固设于该第一基板的第一贴合面上；至少一LED芯片，固设于该第一基板的第一贴合面上；至少一导电线，固设于该第一基板的第一贴合面上，并与该控制芯片、LED芯片及接脚的内接部连接，以导通该控制芯片、LED芯片及接脚的电性；一第二基板，呈透光，具有一第二贴合面，该第二贴合面与该第一基板的第一贴合面贴合连接，以将该导电线、控制芯片、LED芯片及接脚的内接部包覆于该第一基板的第一贴合面与该第二基板的第二贴合面间。借以达到全周发光的功效。
进一步的，更包含有至少一导电片，该导电片固设于该第一基板的第一贴合面上，并与该导电线连接。
 有益效果
采用上述技术方案的LED发光源装置，由于该第一基板与该第二基板皆为可透光，因此本发明可达到全周发光的效果，在同样的能源（电力）消耗下，本发明可达原技术的两倍亮度以上，大大地提高能源的利用率及满足人们对于高亮度LED发光源的需求。
本发明更提供一种LED发光源装置的制造方法，包含有以下步骤：步骤A、制备接脚料片：该接脚料片具有至少二接脚；步骤B、制备第一基板：将该接脚料片放置于一第一模具上，该第一模具具有至少一第一模穴，对该第一模内进行注胶，待该胶冷却固化后，即得呈透光的第一基板，且位于各接脚一端的一内接部与该第一基板的一第一贴合面连接，而各接脚未与该第一基板连接的部位则为一外接部；步骤C、固定芯片与打线接合：将至少一控制芯片、至少一LED芯片及至少一导电线固定在该第一基板的第一贴合面上，使该导电线与该控制芯片、LED芯片及接脚的内接部连接，借以相互导通电性；步骤D、贴合第二基板：将该第一基板连同该接脚料片放置于一第二模具上，该第二模具具有至少一第二模穴，该第一基板的第一贴合面朝向该第二模穴，向该第二模内进行注胶，待胶冷却固化后，即得呈透光的第二基板，使该第二基板的一第二贴合面与该第一基板的第一贴合面贴合连接，并将该接脚的内接部、控制芯片、LED芯片及导电线包覆在该第一基板的第一贴合面与该第二基板的第二贴合面间；步骤E、裁切所要形状：对该第一基板及第二基板裁切出所要的形状，使将预定形状外的第一基板、第二基板、接脚料片的部位加以切除，即得一LED发光源装置的成品。借以达降低制造成本、通用性较佳、利于大量生产及发光效果显著等功效。
进一步的，其于步骤A中，该接脚料片由铜镀银或铁镀银材质中的任一种所制成，该接脚料片更具有一料框，该二接脚自该料框内侧伸出。
进一步的，其于步骤B与步骤D中，该胶可为环氧树脂、硅胶、陶瓷、三氧化二铝材质中的任一种。
进一步的，其中，该环氧树脂可为双酚A型环氧树脂、双酚F型环氧树脂、酚醛型环氧树脂、四溴双酚环氧树脂、橡胶改质环氧树脂、环族环氧树脂、脂肪族环氧树脂中的任一种或其任意组合。
进一步的，其在步骤C中，更将至少一导电片固定在第一基板的第一贴合面上，并使该导电线与该导电片连接。
进一步的，其在步骤B与步骤D中，该胶含有荧光粉。
进一步的，其在步骤B与步骤D中，该胶含有光扩散剂。
采用上述LED发光源装置的制造方法，本发明在第一基板与该第二基板形成后，再进行外部形状的裁切，便无须准备多样形状的模具，而能减少开模费用以降低制造成本，并使大量生产更具效率，产线更具灵活性及适应性。
本发明提供另一种LED发光源装置的制造方法，包含有以下步骤：步骤A、制备接脚料片：该接脚料片具有至少二接脚，所述各接脚具有一内接部及一外接部；步骤B、布线：将至少一导电线与该二接脚的各内接部进行电性连接，并于该导电线的预定位置处布设若干焊垫；步骤C、制备第一基板：将该接脚料片放置于一第一模具上，该第一模具具有至少一第一模穴，向该第一模穴内进行注胶，待胶冷却固化后，即得呈透光的第一基板，且此时该二接脚料片的内接部及该导电线与该第一基板的一第一贴合面连接；步骤D、固定芯片：将至少一控制芯片及至少一LED芯片固定在该导电线的焊垫上，而使该控制芯片与LED芯片位在该第一基板的第一贴合面上，并与该导电线及接脚电性导通；步骤E、贴合第二基板：将第一基板连同该接脚料片放置于一第二模具上，该第二模具具有至少一第二模穴，并让该第一基板的第一贴合面朝向该第二模穴，向该第二模穴内进行注胶，待胶冷却固化后，即得呈透光的第二基板，该第二基板的一第二贴合面系与该第一基板的第一贴合面贴合连接，并使该接脚的内接部、控制芯片、LED芯片及导电线皆被包覆在该第一基板的第一贴合面与该第二基板的第二贴合面间；步骤F、裁切所要形状：对该第一基板及第二基板裁切出所要的形状，使将预定形状外的第一基板、第二基板、接脚料片的部位加以切除，即得一LED发光源装置的成品。
本发明还提供一种LED发光源装置的制造方法，包含有以下步骤：步骤A、制备接脚料片：该接脚料片具有至少二接脚，各接脚具有一内接部及一外接部；步骤B、布线与固定芯片：将至少一导电线与所述二接脚的各内接部进行电性连接，并于该导电线的预定位置处布设若干焊垫，将至少一控制芯片及至少一LED芯片固定在该导电线的焊垫上，而使该控制芯片、LED芯片与该导电线及接脚电性导通；步骤C、制备第一基板：将该接脚料片放置于一第一模具上，该第一模具具有至少一第一模穴，向该第一模穴内进行注胶，待胶冷却固化后，即得呈透光的第一基板，且此时该二接脚料片的内接部及该导电线与该第一基板的一第一贴合面连接；步骤D、贴合第二基板：将第一基板连同该接脚料片放置于一第二模具上，该第二模具具有至少一第二模穴，并让该第一基板的第一贴合面朝向该第二模穴，向该第二模穴内进行注胶，待胶冷却固化后，即得呈透光的第二基板，该第二基板的一第二贴合面与该第一基板的第一贴合面贴合连接，并使该接脚的内接部、控制芯片、LED芯片及导电线皆被包覆在该第一基板的第一贴合面与该第二基板的第二贴合面间；步骤E、裁切所要形状：对该第一基板及第二基板裁切出所要的形状，使将预定形状外的第一基板、第二基板、接脚料片的部位加以切除，即得一LED发光源装置的成品。
虽然后两种LED发光源装置的制造方法与前述第一种方法的步骤并不完成相同，但皆可达到相同的功效与得到相同的成品。
 附图说明
图1至图7是本发明所提供LED发光源装置的制造方法的制造流程示意图。
图8是本发明所提供LED发光源装置的一较佳实施例的立体图。
图9是图8所示实施例的剖视图。
图10是本发明所提供LED发光源装置的另一实施例的示意图。
图11是本发明所提供LED发光源装置的制造方法的第一实施例的制造流程方块图。
图12是本发明所提供LED发光源装置的另一实施态样的示意图。
图13是本发明所提供LED发光源装置的制造方法的第二实施例的制造流程方块图。
图14是本发明所提供LED发光源装置的制造方法的第三实施例的制造流程方块图。
图15是本发明所提供LED发光源装置的另一实施态样的局部零件构造图。
图16是本发明所提供LED发光源装置的另一实施态样的局部零件装配示意图。
 本发明的实施方式
为使贵审查委员能对本发明的特征与其特点有更进一步的了解与认同，兹列举以下的实施例并配合附图说明如下。
请参阅图1至图11，是本发明第一较佳实施例所提供的一种LED发光源装置100的制造方法，其步骤包含如下。
步骤A、制备接脚料片10：请参阅图1及图11，取至少一接脚料片10，该接脚料片10可为自行制造亦可向供应采购。该接脚料片10由铜镀银或铁镀银材质所制成，该接脚料片10具有一料框11及至少二自该料框11内侧伸出的接脚12。
步骤B、制备第一基板20：请参阅图2、3、4及图11，取一第一模具30，该第一模具30具有至少一第一模穴31，将该接脚料片10放置于该第一模具30上，并让二接脚12的一端对应在该第一模穴31上（如图2所示），再向该第一模穴内31进行注胶91（如图3所示），注胶温度为100~160℃，时间为3～15分钟，该胶91可为环氧树脂（如双酚A型环氧树脂、双酚F型环氧树脂、酚醛型环氧树脂、四溴双酚环氧树脂、橡胶改质环氧树脂、环族环氧树脂、脂肪族环氧树脂、或其共混合物中的一种及其任意组合）、硅胶、陶瓷、三氧化二铝等材质。待胶91于第一模穴31冷却固化后，即得呈透光的第一基板20，且此时该接脚料片10上的至少二接脚12，皆以其一端与该第一基板20的第一贴合面21连接，即该接脚12与该第一基板20连接的部位为一内接部121，而伸出于该第一基板20外未与第一基板20连接的部位则为一外接部122（如图4所示）。
步骤C、固定芯片与打线接合：请参阅图5、6及图11，将接脚料片10连同第一基板20自该第一模具30上移动至一工作台上，并将至少一控制芯片41及至少一LED芯片42固定在该第一基板20的第一贴合面21上（如图5所示），并通过打线技术，将导电线43布设于该第一基板20的第一贴合面21上，而借由该导电线43连接该控制芯片41、LED芯片42及接脚12的内接部121（如图6所示），使该控制芯片41、LED芯片42及接脚12借由该导电线43而相互导通电性。
步骤D、贴合第二基板60：参阅图7及图11，取一第二模具50，该第二模具50具有至少一第二模穴51，将该第一基板20连同该接脚料片10放置于该第二模具50上，并让该第一基板20的第一贴合面21朝向该第二模穴51，再向该第二模穴内51进行注胶91（如图7所示），注胶温度同样为100~160℃，时间为3～15分钟，该胶91的材质与第一基板20的材质相同。待胶91于第二模穴51冷却固化后，即得呈透光的第二基板60，而该第二基板60的第二贴合面61与该第一基板20的第一贴合面21贴合连接，并使该接脚12的内接部121、控制芯片41、LED芯片42及导电线43皆被包覆在该第一基板20的第一贴合面21与该第二基板60的第二贴合面61间。
步骤E、裁切所要形状：参阅图8及图11，对该第一基板20及第二基板60裁切出所要的形状，即将预定形状外的第一基板20、第二基板60、接脚料片10的部位加以切除，即得本发明LED发光源装置100的成品。
是以，上述即为本发明第一较佳实施例所提供一种LED发光源装置100的制造方法介绍，接着再将本发明的特点介绍如下。
首先，经由上述制造方法的步骤后，即得本发明LED发光源装置100的构造，如图8及图9，其构造包含有一第一基板20、一第二基板60、至少二接脚12、至少一控制芯片41、至少一LED芯片42及至少一导电线43。该第一基板20具有一第一贴合面21，该第二基板60具有一第二贴合面61，该二接脚12分别具有一内接部121及一外接部122，该内接部121连接于该第一基板20的第一贴合面21上，该外接部122则露出于该第一基板20外，该控制芯片41、LED芯片42及导电线43固设于该第一基板20的第一贴合面21上，并由该导电线43与该控制芯片41、LED芯片42及接脚12的内接部121连接而导通电性，该第二基板60的第二贴合面61与该第一基板20的第一贴合面21贴合连接，即该导电线43、该控制芯片41、LED芯片42及接脚12的内接部121被包覆于该第一基板20的第一贴合面21与该第二基板60的第二贴合面61间。
借此，由于该第一基板20与该第二基板60皆为可透光，因此本发明可达到全周发光的效果，在同样的能源（电力）消耗下，本发明可达原技术的两倍亮度以上，大大地提高能源的利用率及满足人们对于高亮度LED发光源的需求。
另外，本发明在第一基板20与该第二基板60形成后，再进行外部形状的裁切，便无须准备多样形状的模具，而能减少开模费用以降低制造成本，并使大量生产更具效率，产线更具灵活性及适应性。
其次，上述实施例中，可在步骤C、固定芯片与打线接合的步骤中，将若干的导电片44固定在第一基板的第一贴合面21上，并使该导电线43连接于该等导电片44上（如图10所示），以避免导电线43产生断裂的情形。
上述实施例中，在步骤C时，虽然先固定控制芯片41、LED芯片42（及导电片44）后打上导电线43。但实际上，在步骤C时，亦可先打上导电线43后，再将控制芯片41、LED芯片42（及导电片44）固定上，亦仍可达到相同的效果。
上述实施例中，亦可在该第一基板20与该第二基板60的原材料（胶91）中，加入荧光粉，该荧光粉可为YAG荧光粉、TAG荧光粉、铝酸盐（Aluminate）、硅酸盐（Silicatr）、氮化物（Nitride）以及氮氧化物（Oxynitride）中的任一种及其任意组合。
上述实施例中，亦可在该第一基板20与该第二基板60的原材料（胶91）中，加入光扩散剂，该光扩散剂可为纳米硫酸钡、碳酸钙、二氧化硅、压克力型光扩散剂、苯乙烯型、丙烯酸树脂型光扩散剂等。以达到光的柔化、雾化效果。
上述实施例中，当大量生产时，该第一模具30与该第二模具50为不同模具，以增进产线的效率。在少量生产时，该第一模具30与该第二模具50则可为同一模具，以减少模具费用支出。
请参阅图12，事实上，本发明可依不同客户的实际需求，而裁切出不同的造型，以使适用范围更为广泛。
另外，虽然前述实施中，该接脚料片10的多数接脚12在料框11的二内侧伸出。但，实际上，如第图15所示，各接脚12亦可仅在该料框11的同一内侧伸出，不仅可降低制造成本，亦能让控制芯片41、LED芯片42及导电线43有更大的空间可供布设（如图16所示）。
请参阅图13，是本发明第二较佳实施例所提供的一种LED发光源装置的制造方法，其步骤包含如下。
步骤A、制备接脚料片：请参阅图13，取至少一接脚料片，该接脚料片与前述实施例相同具有一料框及至少二自该料框内侧伸出的接脚，各接脚具有一内接部及一外接部。
步骤B、布线：请参阅图13，将至少一导电线与该二接脚的各内接部进行电性连接，并于该导电线的预定位置处布设焊垫。
步骤C、制备第一基板：请参阅图13，取一第一模具，该第一模具具有至少一第一模穴，将该接脚料片放置于该第一模具上，并让该二接脚的内接部对应在该第一模穴上，再向该第一模穴内进行注胶。待胶于第一模穴冷却固化后，即得呈透光的第一基板，且此时该二接脚料片的内接部及该导电线与该第一基板的第一贴合面连接。
步骤D、固定芯片：请参阅图13，将接脚料片、导电线连同第一基板自该第一模具上移动至一工作台上，并将至少一控制芯片及至少一LED芯片固定在该导电线的焊垫上，而使该控制芯片与LED芯片位于该第一基板的第一贴合面上，并与该导电线及接脚电性导通。
步骤E、贴合第二基板：请参阅图13，取一第二模具，该第二模具具有至少一第二模穴，将该第一基板连同该接脚料片放置于该第二模具上，并让该第一基板的第一贴合面朝向该第二模穴，再向该第二模穴内进行注胶。待胶于第二模穴冷却固化后，即得呈透光的第二基板，而该第二基板的第二贴合面与该第一基板的第一贴合面贴合连接，并使该接脚的内接部、控制芯片、LED芯片及导电线皆被包覆在该第一基板的第一贴合面与该第二基板的第二贴合面间。
步骤F、裁切所要形状：请参阅图13，对该第一基板及第二基板裁切出所要的形状，即将预定形状外的第一基板、第二基板、接脚料片的部位加以切除，即得本发明LED发光源装置的成品。
虽然本实施例的步骤与前述实施例的步骤并不完成相同，但皆可达到相同的功效与得到相同的成品。
请参阅图14，本发明第三较佳实施例所提供的一种LED发光源装置的制造方法，其步骤包含如下。
步骤A、制备接脚料片：请参阅图14，取至少一接脚料片，该接脚料片与前述实施例相同具有一料框及至少二自该料框内侧伸出的接脚，各接脚具有一内接部及一外接部。
步骤B、布线与固定芯片：请参阅图14，将至少一导电线与二接脚的各内接部进行电性连接，并于该导电线的预定位置处布设焊垫，并将至少一控制芯片及至少一LED芯片固定在该导电线的焊垫上，而使该控制芯片、LED芯片与该导电线及接脚电性导通。
步骤C、制备第一基板：请参阅图14，取一第一模具，该第一模具具有至少一第一模穴，将该接脚料片放置于该第一模具上，并让二接脚的内接部对应在该第一模穴上，再向该第一模内进行注胶。待胶于第一模穴冷却固化后，即得呈透光的第一基板，且此时该二接脚料片的内接部与导电线与该第一基板的第一贴合面连接。
步骤D、贴合第二基板：请参阅图14，取一第二模具，该第二模具具有至少一第二模穴，将该第一基板连同该接脚料片放置于该第二模具上，并让该第一基板的第一贴合面朝向该第二模穴，再向该第二模内进行注胶。待胶于第二模穴冷却固化后，即得呈透光的第二基板，而该第二基板的第二贴合面与该第一基板的第一贴合面贴合连接，并使该接脚的内接部、控制芯片、LED芯片及导电线皆被包覆在该第一基板的第一贴合面与该第二基板的第二贴合面间。
步骤E、裁切所要形状：请参阅图14，对该第一基板及第二基板裁切出所要的形状，即将预定形状外的第一基板、第二基板、接脚料片的部位加以切除，即得本发明LED发光源装置的成品。
虽然本实施例的步骤与前述实施例的步骤并不完成相同，但皆可达到相同的功效与得到相同的成品。
另外，虽然所揭实施例中的步骤不完全相同，但每一实施例中的各LED芯片，可以将发光方向全朝向同一方向，或将发光方向朝向不同方向的方式设置，而能让发光效果更加全面。
以上所揭，仅为本发明所提供的较佳实施例而已，并非用以限制本发明的实施范围，凡本技术领域内的相关技艺者根据本发明所为的均等变化，皆应属本发明所涵盖的范围。

Claims (11)

  1. 一种LED发光源装置的制造方法，其特征在于，包含有以下步骤：
    步骤A、制备接脚料片：
    该接脚料片具有至少二接脚；
    步骤B、制备第一基板：
    将该接脚料片放置于一第一模具上，该第一模具具有至少一第一模穴，对该第一模内进行注胶，待该胶冷却固化后，即得呈透光的第一基板，且位于各接脚一端的一内接部与该第一基板的一第一贴合面连接，而各接脚未与该第一基板连接的部位则为一外接部；
    步骤C、固定芯片与打线接合：
    将至少一控制芯片、至少一LED芯片及至少一导电线固定在该第一基板的第一贴合面上，使该导电线与该控制芯片、LED芯片及接脚的内接部连接，借以相互导通电性；
    步骤D、贴合第二基板：
    将该第一基板连同该接脚料片放置于一第二模具上，该第二模具具有至少一第二模穴，该第一基板的第一贴合面朝向该第二模穴，向该第二模内进行注胶，待胶冷却固化后，即得呈透光的第二基板，使该第二基板的一第二贴合面与该第一基板的第一贴合面贴合连接，并将该接脚的内接部、控制芯片、LED芯片及导电线包覆在该第一基板的第一贴合面与该第二基板的第二贴合面间；
    步骤E、裁切所要形状：
    对该第一基板及第二基板裁切出所要的形状，使将预定形状外的第一基板、第二基板、接脚料片的部位加以切除，即得一LED发光源装置的成品。
  2. 如权利要求1所述LED发光源装置的制造方法，其特征在于：其于步骤A中，该接脚料片由铜镀银或铁镀银材质中的任一种所制成，该接脚料片更具有一料框，该二接脚自该料框内侧伸出。
  3. 如权利要求1所述LED发光源装置的制造方法，其特征在于：其于步骤B与步骤D中，该胶可为环氧树脂、硅胶、陶瓷、三氧化二铝材质中的任一种。
  4. 如权利要求3所述LED发光源装置的制造方法，其特征在于：其中，该环氧树脂可为双酚A型环氧树脂、双酚F型环氧树脂、酚醛型环氧树脂、四溴双酚环氧树脂、橡胶改质环氧树脂、环族环氧树脂、脂肪族环氧树脂中的任一种或其任意组合。
  5. 如权利要求1所述LED发光源装置的制造方法，其特征在于：其在步骤C中，更将至少一导电片固定在第一基板的第一贴合面上，并使该导电线与该导电片连接。
  6. 如权利要求1所述LED发光源装置的制造方法，其特征在于：其在步骤B与步骤D中，该胶含有荧光粉。
  7. 如权利要求1所述LED发光源装置的制造方法，其特征在于：其在步骤B与步骤D中，该胶含有光扩散剂。
  8. 一种LED发光源装置，其特征在于，包含有：
    一第一基板，呈透光，具有一第一贴合面；
    至少二接脚，各接脚具有一内接部及一外接部，所述各接脚的内接部连接于该第一基板的第一贴合面上，所述各接脚的外接部则露出于该第一贴合面外；
    至少一控制芯片，固设于该第一基板的第一贴合面上；
    至少一LED芯片，固设于该第一基板的第一贴合面上；
    至少一导电线，固设于该第一基板的第一贴合面上，并与该控制芯片、LED芯片及接脚的内接部连接，以导通该控制芯片、LED芯片及接脚的电性；
    一第二基板，呈透光，具有一第二贴合面，该第二贴合面与该第一基板的第一贴合面贴合连接，以将该导电线、控制芯片、LED芯片及接脚的内接部包覆于该第一基板的第一贴合面与该第二基板的第二贴合面间。
  9. 如权利要求8所述LED发光源装置，其特征在于：更包含有至少一导电片，该导电片固设于该第一基板的第一贴合面上，并与该导电线连接。
  10. 一种LED发光源装置的制造方法，其特征在于，包含有以下步骤：
    步骤A、制备接脚料片：
    该接脚料片具有至少二接脚，所述各接脚具有一内接部及一外接部；
    步骤B、布线：
    将至少一导电线与该二接脚的各内接部进行电性连接，并于该导电线的预定位置处布设若干焊垫；
    步骤C、制备第一基板：
    将该接脚料片放置于一第一模具上，该第一模具具有至少一第一模穴，向该第一模穴内进行注胶，待胶冷却固化后，即得呈透光的第一基板，且此时该二接脚料片的内接部及该导电线与该第一基板的一第一贴合面连接；
    步骤D、固定芯片：
    将至少一控制芯片及至少一LED芯片固定在该导电线的焊垫上，而使该控制芯片与LED芯片位在该第一基板的第一贴合面上，并与该导电线及接脚电性导通；
    步骤E、贴合第二基板：
    将第一基板连同该接脚料片放置于一第二模具上，该第二模具具有至少一第二模穴，并让该第一基板的第一贴合面朝向该第二模穴，向该第二模穴内进行注胶，待胶冷却固化后，即得呈透光的第二基板，该第二基板的一第二贴合面系与该第一基板的第一贴合面贴合连接，并使该接脚的内接部、控制芯片、LED芯片及导电线皆被包覆在该第一基板的第一贴合面与该第二基板的第二贴合面间；
    步骤F、裁切所要形状：
    对该第一基板及第二基板裁切出所要的形状，使将预定形状外的第一基板、第二基板、接脚料片的部位加以切除，即得一LED发光源装置的成品。
  11. 一种LED发光源装置的制造方法，其特征在于，包含有以下步骤：
    步骤A、制备接脚料片：
    该接脚料片具有至少二接脚，各接脚具有一内接部及一外接部；
    步骤B、布线与固定芯片：
    将至少一导电线与所述二接脚的各内接部进行电性连接，并于该导电线的预定位置处布设若干焊垫，将至少一控制芯片及至少一LED芯片固定在该导电线的焊垫上，而使该控制芯片、LED芯片与该导电线及接脚电性导通；
    步骤C、制备第一基板：
    将该接脚料片放置于一第一模具上，该第一模具具有至少一第一模穴，向该第一模穴内进行注胶，待胶冷却固化后，即得呈透光的第一基板，且此时该二接脚料片的内接部及该导电线与该第一基板的一第一贴合面连接；
    步骤D、贴合第二基板：
    将第一基板连同该接脚料片放置于一第二模具上，该第二模具具有至少一第二模穴，并让该第一基板的第一贴合面朝向该第二模穴，向该第二模穴内进行注胶，待胶冷却固化后，即得呈透光的第二基板，该第二基板的一第二贴合面与该第一基板的第一贴合面贴合连接，并使该接脚的内接部、控制芯片、LED芯片及导电线皆被包覆在该第一基板的第一贴合面与该第二基板的第二贴合面间；
    步骤E、裁切所要形状：
    对该第一基板及第二基板裁切出所要的形状，使将预定形状外的第一基板、第二基板、接脚料片的部位加以切除，即得一LED发光源装置的成品。
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