WO2022028443A1

WO2022028443A1 - Led lamp

Info

Publication number: WO2022028443A1
Application number: PCT/CN2021/110428
Authority: WO
Inventors: 王名斌; 梅荣; 陈振坤; 蒋靖源; 姚志雄; 张志超; 周林; 熊爱明; 秦建锋; 沈涛
Original assignee: 嘉兴山蒲照明电器有限公司
Priority date: 2020-08-04
Filing date: 2021-08-04
Publication date: 2022-02-10
Also published as: CN216047513U; JP2022029443A; CN220249919U; JP3242784U; CN114076292A; CN219606986U

Abstract

An LED lamp, comprising: a lampshade (1), and a base (3) connected to the lampshade (1). A first accommodation space formed by the lampshade (1) and the base (3) is internally provided with a photoelectric module (2). The photoelectric module (2) comprises a first insulating portion (202), a power source module (23) and a circuit board (201). The circuit board (201) comprises a first face (2011) and a second face (2012) which are arranged opposite each other. The first insulating portion (202) covers an electronic component on the first face (2011), and the first insulating portion (202) comprises an optical processing unit (202b). The optical processing unit (202b) comprises a second optical processing region (2b) arranged corresponding to part of the power source module (23), wherein the second optical processing region (2b) is provided with at least one extending portion (2b3), and the extending portion (2b3) passes through a through hole (201a) in the circuit board (201). The LED lamp has the characteristics of having a thin thickness, an excellent light-emitting effect, and a good heat dissipation performance.

Description

an LED lamp

technical field

The present application relates to lighting fixtures, and in particular, to an LED lighting fixture.

Background technique

Ceiling lamps are lighting that is adsorbed or embedded in the roof ceiling. Ceiling lamps are often used as lighting equipment in various places such as homes, offices, and entertainment venues. A traditional ceiling lamp is usually composed of a base, a light source module, a circuit module and a lampshade, and the light-emitting elements in the light source module are generally energy-saving lamps. Due to the mercury pollution in the production process and after the use of energy-saving lamps, and its power consumption is larger than that of LEDs, LEDs have the characteristics of no mercury, no toxicity, no electromagnetic pollution, no harmful rays, energy saving and environmental protection, and long service life. Therefore, the light-emitting element of the ceiling lamp gradually replaces the energy-saving lamp with LED. However, the existing ceiling lamps still have problems in terms of light emission, heat dissipation, installation and packaging during use, as follows:

1. During the lighting process, there is flashing, small irradiation range, uneven lighting, low brightness in the central part of the lamp, uneven brightness in the central part of the lamp and the surrounding parts of the lamp, uneven lighting on the light-emitting surface, glare, uneven brightness in the circumferential direction of the lamp, lighting Circuit components with uneven illumination, uneven brightness and low color rendering on the component mounting surface, low luminous efficiency and light design, bright spots, low rendering effect, uneven color mixing, uneven illumination around the ceiling, and high height It will block light, large color temperature and color deviation, narrow light orientation, low light transmission efficiency, low luminous efficiency of the light source, dark side area of the lampshade, uneven brightness of the light exit surface of the lampshade, bright lines, and light-emitting elements. Problems such as low light extraction efficiency, low light comfort, and low aesthetics during extinction, in addition, the existing lamps will have the following problems: some usage scenarios may hope that the light emitted by the lamps has a three-dimensional effect or corresponds to the corresponding life scene. It is difficult for users to read the paper surface with color tone under the lamp, or because the color of the text and the observation object is reduced by the elderly, the comfort of the elderly is low, etc.

In order to improve the optical effect of the ceiling lamp, firstly, a backlight lens is added to the LED to reduce the dark area in the middle part and the edge part of the lamp. However, due to the use of the backlight lens and the lens patch process, the production cost is greatly increased and the product competition is reduced. Second, there are optical components between the light-emitting element and the lampshade, such as a light guide plate, a lens, a reflection unit, etc., but after using the above optical components, there will be changes in the amount of light incident on the light guide plate, and the structure of the optical components is complex. , uneven brightness on the light guide plate, dark parts on the light guide plate, etc.;

2. Light-emitting components and circuit components will generate heat, which will affect the service life of the ceiling lamp;

3. The light source modules are mostly installed in the lamp body by screws, or pasted in the lamp body by adhesive, and it is not easy to disassemble and replace after installation. In addition, after the ceiling lamp is used for a long time, the light source module is often aged and burned out. If the light source module is damaged and needs to be replaced, the damaged light source module needs to be removed with a tool, and then the new light source module is replaced by a tool. Installation, the replacement of LED light source modules must be operated by professionals, and the use process is inconvenient;

4. Ceiling lamps are usually flat-shaped structures, which have the characteristics of small occupation height and wide lighting range. However, the overall thickness and size of ceiling lamps are still very large, resulting in an increase in the volume of the product, which in turn increases packaging and inventory costs.

In addition, the lamps have low safety, low manufacturing efficiency, high cost of use, easy access to the interior of the lamps by insects and affect the appearance, failure to continue lighting when the power supply fails, and small installation area of the circuit board, which affects the luminous flux of the whole lamp. problems such as low remote control sensitivity or narrow remote control range during intelligent control, and noise during installation.

In view of the above-mentioned shortcomings and deficiencies of the prior art, it is indeed necessary to improve the existing LED lamps to make up for these deficiencies and deficiencies.

SUMMARY OF THE INVENTION

In view of the above-mentioned shortcomings in the prior art, the present application provides an LED lamp.

In order to solve the above-mentioned technical problems, the application is solved by the following technical solutions:

An LED lamp comprises a lampshade and a base connected with the lampshade, a first accommodating space formed by the lampshade and the base is provided with a photoelectric module, and the photoelectric module comprises a first insulating part, a power module and a circuit board, The circuit board includes a first surface and a second surface arranged oppositely, the first insulating part covers the electronic components on the first surface, the first insulating part includes a light processing unit, and the light processing unit includes a second surface corresponding to a part of the power module. The light treatment area and the second light treatment area are provided with at least one extension part, and the extension part passes through the through hole on the circuit board.

Preferably, a first chip area and a second chip area are provided on the first surface of the circuit board, and the distance from the first chip area to the base is smaller than the distance from the second chip area to the base.

Preferably, the light processing unit further includes a first light processing area and a third light processing area corresponding to the first chip area and the second chip area, respectively.

Preferably, the first chip area and the second chip area include at least one LED chip, and the distance between adjacent LED chips in the first chip area is smaller than the distance between adjacent LED chips in the second chip area.

Preferably, the second chip area includes a first LED chip group, a second LED chip group and a third LED chip group, and the first LED chip group, the second LED chip group and the third LED chip group are respectively located on different circumferences, The number of LED chips in the second chipset is smaller than the number of LED chips in the first chipset, and the number of LED chips in the first chipset is smaller than the number of LED chips in the third chipset.

Preferably, the power module includes a first power module and a second power module respectively located on the first side and the second side of the circuit board, and the first power module is located between the first chip area and the second chip area.

Preferably, there is a center point O1, O2, . , ..., Qm, m≥1, n, m are integers, when m>1, the distance between O1 and Q1 is smaller than the distance between O1 and Qm.

Preferably, when n=m, n, m≥1, and n, m are integers, the connection line between the center point O2n-1 and the center point Q3m-2 passes through at least one LED chip of the second chip set.

Preferably, the cross-section of the first photo-treatment zone and/or the third photo-treatment zone is different from the cross-section of the second photo-treatment zone.

Preferably, in the height direction of the LED lamp, the height of the second light treatment area is greater than or equal to the height of the first light treatment area and the third light treatment area.

The present application achieves one of the following beneficial effects or any combination thereof through the above-mentioned structural design:

(1) The photoelectric module is rotated and fixed by the installation part, which is convenient for installation and maintenance, and improves the work efficiency; (2) Adjusting the arrangement of the LED chips on the light source module can make the light output effect of the LED lamp more uniform and the heat dissipation effect more excellent. (3) Compared with the electronic components of any light source module, the electronic components on the second surface of the circuit board are located on the inner side of the circuit board in the radial direction, which can avoid the heat generated when the electronic components of the light source module work. Two-sided electronic components, and secondly, the distribution area of the electronic components on the second surface can be limited, so as to control the size of the second insulating part to control the cost; (4) The LED chip and the power module are respectively located on the first surface of the circuit board And the second side, the number of LED chips in the area corresponding to the power module on the first side is smaller than the number of LED chips in the area not corresponding to the power module on the first side, so on the one hand, the dark area in the middle of the LED lamp is significantly reduced, Improve the luminous effect of LED lamps, on the other hand, it can reduce the influence of the heat generated by the power module on the light source module; (5) the second power module with a higher height is located in the groove part of the base, because no need A storage space for the power module is set up, which effectively reduces the height of the ceiling lamp. In addition, the photoelectric module can be kept away from the lampshade, so that the amount of light from the light source module to the edge of the lampshade is increased; (6) The first insulating part has a certain amount of light. (7) The second insulating part is in contact with the side wall of the groove part of the base, which increases the contact area and improves the thermal conductivity; ( 8) The light-emitting surface of the LED chip faces the central axis of the lamp, which can effectively eliminate the middle dark area and improve the luminous effect of the lamp; (9) By selecting the appropriate refractive index of the LED lamp beads, the refractive index of the packaging layer is n1, and the material of the lampshade is n1. , which can effectively improve the luminous flux of the LED lamp; (10) By arranging a refractive index matching layer on the surface of the LED chip or the inner surface of the lampshade, and through its thickness design, excellent optical effects can be obtained.

Description of drawings

FIG. 1 is a schematic structural diagram of an embodiment of an LED lamp of the present application;

FIG. 2 is a schematic diagram of an embodiment of FIG. 1 with the lampshade removed;

FIG. 3 is a perspective schematic diagram 1 of the optoelectronic module of the LED lamp in one embodiment with the insulating unit removed;

4 is a second perspective view of the optoelectronic module of the LED lamp in an embodiment with the insulating unit removed;

FIG. 5 is a perspective view 1 of the optoelectronic module of the LED lamp in another embodiment with the insulating unit removed;

6 is a second perspective view of the optoelectronic module of the LED lamp in another embodiment with the insulating unit removed;

FIG. 7 is a perspective view 1 of an optoelectronic module of an LED lamp according to an embodiment;

FIG. 8 is a second perspective view of the optoelectronic module of the LED lamp according to an embodiment;

9 is a schematic perspective view of a first insulating portion of an optoelectronic module of an LED lamp according to an embodiment;

10 is a schematic cross-sectional view of an optoelectronic module of an LED lamp in an embodiment;

Figure 11 is an enlarged view at C in Figure 10;

12 is a schematic perspective view of the second insulating portion of the optoelectronic module of the LED lamp according to an embodiment;

13 is a schematic diagram of the LED lamp in one embodiment with the lampshade removed;

14 is a schematic structural diagram 1 of an optoelectronic module of an LED lamp in an embodiment;

15 is a second structural schematic diagram of a photoelectric module of an LED lamp in an embodiment;

Fig. 16 is the structural representation of A-A section in Fig. 14;

Fig. 17 is the structural representation of the B-B section in Fig. 14;

18 is a schematic view of the structure of the optoelectronic module of the LED lamp in one embodiment with the insulating unit removed;

19 is a schematic structural diagram 1 of the photoelectric module of the LED lamp in an embodiment with the insulating unit removed;

FIG. 20 is a second structural schematic diagram of the optoelectronic module of the LED lamp in one embodiment with the insulating unit removed;

21 is a schematic structural diagram 1 of the photoelectric module of the LED lamp in another embodiment with the insulating unit removed;

22 is a second structural schematic diagram of the optoelectronic module of the LED lamp in another embodiment with the insulating unit removed;

23 is a schematic structural diagram of a first insulating portion of an LED lamp in an embodiment;

24 is a schematic structural diagram of a second insulating portion of an LED lamp in an embodiment;

25 is a schematic structural diagram of an optoelectronic module of an LED lamp in an embodiment;

26 is a schematic diagram of an embodiment of an assembling method of a photovoltaic module of the present application;

FIG. 27 is a schematic structural diagram of the optoelectronic module assembled by the assembly method shown in FIG. 26;

Fig. 28 is the structural representation of the A-A section in Fig. 27;

Fig. 29 is a perspective view of the LED lamp in one embodiment with the lampshade removed;

30 is a perspective view of a lampshade in an embodiment;

Figure 31 is an enlarged view at A in Figure 29;

Figure 32 is an enlarged view at B in Figure 29;

Figure 33 is a front view of the mounting part;

FIG. 34 is a perspective view one of the mounting portion in an embodiment;

35 is a second perspective view of the mounting portion in an embodiment;

36 is a schematic perspective view of an optoelectronic module of an LED lamp according to an embodiment;

Fig. 37 is a perspective view of the LED lamp in one embodiment with the lampshade removed;

38 is a schematic cross-sectional view of an LED lamp in an embodiment;

Figure 39 is an enlarged view at B in Figure 38;

FIG. 40 is a schematic perspective view of the LED lamp in one embodiment with the lampshade removed;

41 is a perspective view of the LED lamp in one embodiment with the lampshade removed;

FIG. 42 is a perspective view of a mounting portion in an embodiment;

Fig. 43 is a perspective view of the LED lamp in one embodiment with the lampshade removed;

44 is a perspective view of the LED lamp in one embodiment with the lampshade removed;

Figure 45 is a perspective view of a base in an embodiment;

FIG. 46 is a schematic perspective view of an LED lamp in an embodiment;

FIG. 47 is a perspective view 1 of an optoelectronic module of an LED lamp according to an embodiment;

FIG. 48 is a second perspective view of the optoelectronic module of the LED lamp according to an embodiment;

FIG. 49 is a schematic perspective view of an LED lamp in an embodiment;

Figure 50A is a perspective view of the optoelectronic module in Figure 49;

Figure 50B is an enlarged schematic view of part A in Figure 50A;

50C is a schematic diagram of the first insulating portion in 50A;

Figure 51 is a perspective view of the circuit board in Figure 50;

52A is a schematic cross-sectional view of the LED lamp shown in FIG. 49 with the lampshade removed;

Figure 52B is a schematic diagram of the section A-A in Figure 52A;

Figure 52C is an enlarged schematic view of part B in Figure 52B;

53A is a schematic structural diagram 1 of an optoelectronic module in an embodiment;

53B is a second structural schematic diagram of a photovoltaic module in an embodiment;

Figure 53C is a schematic diagram of section A-A in Figure 53A;

Figure 53D is an enlarged schematic view of part B in Figure 53C;

Figure 53E is an enlarged schematic view of part C in Figure 53C

FIG. 53F is a schematic structural diagram of the first insulating portion in FIG. 53A;

Figure 53G is a schematic diagram of the B-B section in Figure 53F;

Figure 53H is an enlarged schematic view of part D in Figure 53G;

54A is a schematic structural diagram 1 of an optoelectronic module in an embodiment;

54B is a second structural schematic diagram of a photovoltaic module in an embodiment;

Figure 54C is a schematic diagram of the cross section E-E in Figure 54B;

Figure 54D is an enlarged view of part F in Figure 54C;

FIG. 54E is a third structural schematic diagram of an optoelectronic module in an embodiment;

Figure 54F is an enlarged view of part B in Figure 54E;

Figure 54G is an enlarged view of section G-G in Figure 54E;

Figure 54H is an enlarged view of part H in Figure 54G;

FIG. 54I is a schematic diagram four of the structure of the optoelectronic module in one embodiment;

Figure 54J is an enlarged view of section I-I in Figure 54I;

Figure 54K is an enlarged view of portion J in Figure 54J;

Figure 54L is a schematic diagram of the circuit board in Figure 54A;

FIG. 54M is a schematic diagram of the first insulating portion in FIG. 54A;

Figure 54N is an enlarged view of part K in Figure M;

FIG. 55 is a perspective schematic diagram 1 of an LED lamp in an embodiment;

FIG. 56 is a second perspective view of an LED lamp in an embodiment;

FIG. 57 is an interface diagram of light emitted by an LED chip passing through in an embodiment;

58 is a schematic diagram of the main components of a light fixture according to an embodiment of the present invention.

detailed description

The present application will be further described in detail below with reference to the accompanying drawings and embodiments.

In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the related drawings. The preferred embodiments of the present application are shown in the accompanying drawings. However, the present application may be implemented in many different forms and is not limited to the embodiments described below. Rather, these embodiments are provided so that a thorough and complete understanding of the disclosure of this application is provided. In the following, the directions such as "axial direction", "upper", "lower", etc. are all for the purpose of indicating the structural positional relationship more clearly, and are not intended to limit the present application. In this application, the "equal", "perpendicular", "horizontal", and "parallel" are defined as including ±10% on the basis of the standard definition. For example, vertical generally refers to an included angle of 90 degrees relative to the reference line, but in this application, vertical refers to the situation including 80 degrees to 100 degrees. In addition, the usage and usage status of the LED lamps described in this application refer to the usage scenarios of the LED lamps in a way of hanging the lampshade vertically downward, and if there are other exceptions, it will be explained separately.

As shown in FIGS. 1 to 57 , the LED light fixture of the embodiment of the present application is, for example, a ceiling light mounted on a ceiling. The upper direction in FIGS. 1 to 57 (the positive z-axis direction in FIG. 1 ) corresponds to the direction of the floor surface opposite to the ceiling. In other words, the LED lamps shown in Figs. 1 to 57 are suitable for the opposite posture in normal use.

In the LED lamps designed in the present application, the spatial positions of the LED lamps are located in the Cartesian coordinate system as shown in FIG. 1 , wherein the z-axis is parallel to the central axis of the LED lamps. As shown in FIG. 1 to FIG. 57 , the LED lamp includes a lampshade 1 and a base 3 connected to the lampshade 1 . A photoelectric module 2 is arranged in the first accommodating space formed by the lampshade 1 and the base 3 . In this embodiment, the LED lamp further includes a mounting part 31, a hook 4 and a transfer hook (or adapter) 5 arranged on the base 3, and the optoelectronic module 2 is fixed on the base 3 through the mounting part 31, and the lead The hanger 4 is connected with the adapter 5 . Between the LED lamps and the ceiling, in order to suppress the shaking of the LED lamps, a buffer member 7 is provided, and the buffer member 7 can be, for example, a sponge.

As shown in FIG. 1 to FIG. 57 , the photoelectric module 2 includes a light source module 22 and a power supply module 23. In order to prevent a power failure when the external power supply is cut off due to a power failure, the power supply module 23 may include a battery unit that stores electrical energy. , The afterglow module is stored in the battery unit, and the afterglow light is automatically emitted through the afterglow module to ensure safety.

As shown in Figures 1 to 57, the photoelectric module 2 is configured as an integral structure and can be detachably fixed to the base 3. Therefore, when the photoelectric module 2 is damaged, it can be replaced independently. Compared with the whole lamp Replacement, more cost-effective. When replacing the photoelectric module 2, it is necessary to prevent the occurrence of electric shock, especially when the photoelectric module 2 needs to be replaced, the hand touches the electronic components. The photoelectric module 2 in this embodiment includes electronic components, and insulating units are provided outside the electronic components, so as to prevent the photoelectric module 2 from coming into contact with the electronic components when replacing the photoelectric module 2 . The optoelectronic module 2 includes a circuit board 201 . The circuit board 201 can be a single-sided PCB or a double-sided PCB, and at least some electronic components are disposed on the circuit board 201 . Further, all electronic components are arranged on the circuit board 201 . The electronic components include electronic components (such as LED lamp beads) in the light source module 22 and electronic components in the power module 23 . That is to say, the electronic components of the light source module 22 and the electronic components of the power module 23 are integrated on the same circuit board, which saves cost and space.

As shown in FIG. 3 to FIG. 6 , the circuit board 201 includes a first surface 2011 and a second surface 2012 disposed opposite to each other, wherein the first surface 2011 is a surface facing the lampshade 1 . In one embodiment, the electronic components of the light source module 22 are arranged on the first side 2011, and all the electronic components of the power module 23 can be arranged on the first side 2011. Therefore, the circuit board 201 only needs to be on the first side. In 2011, the layout of the circuit layer can save the wiring cost. In some embodiments, referring to FIGS. 3 and 4 , the electronic components of the light source module 22 are arranged on the first surface 2011 , and the electronic components of the power supply module 23 are all arranged on the second surface 2012 . The electronic components in the module 22 and the electronic components in the power module 23 are arranged separately. When the lamp is turned on, generally speaking, both the electronic components of the light source module 22 and the electronic components of the power module 23 may generate heat. Therefore, disposing the two separately can avoid the concentration of heat sources or the mutual influence of heat generated during operation. , at this time, circuit layers can be arranged on the first surface 2011 and the second surface 2012 at the same time. In this embodiment, the electronic components in the light source module 22 are arranged on the first side 2011 , some of the electronic components in the power module 23 are arranged on the first side 2011 , and the other part of the electronic components in the power module 23 are arranged on the first side 2011 . On the second side 2012. In this embodiment, the electronic components of the power module 23 are arranged on the first surface 2011 and the second surface 2012 respectively, so that the electronic components in the power module 23 can be better laid out. For example, the electronic components of the power module 23 located on the first surface 2011 include relatively low-height components, such as IC (control circuit) and chip components (such as chip resistors). Therefore, the light emitted by the light source module 22 has no The blocking of obstacles reduces the light loss and improves the luminous efficiency. The electronic components of the power module 23 located on the second surface 2012 include relatively high-height components, such as transformers, capacitors, inductors, and the like. For another example, the electronic components of the power module 23 located on the first side 2011 include heating elements (components that generate more heat during operation, such as ICs, resistors, etc.), while the electronic components of the power module 23 located on the second side 2012 include For the heat-labile element (such as electrolytic capacitor), the heat-labile element and the above-mentioned heating element are respectively arranged on the second surface 2012 and the first surface 2011, which can reduce the influence of the heat generated by the heating element on the heat-labile element. , to improve the overall reliability and life of the power module 23 .

As shown in FIGS. 7 to 12 , the optoelectronic module 2 further includes an insulating unit, and the insulating unit includes a first insulating portion 202 and/or a second insulating portion 203 , wherein the first insulating portion 202 is configured to be used for the light source module 22 The light generated during operation is transmitted, and the first insulating portion 202 covers all the electronic components on the first surface 2011 to prevent accidental contact with the electronic components on the first surface 2011 and cause electric shock. The second insulating portion 203 covers all the electronic components on the second surface 2012. The material of the second insulating portion 203 can be selected from one of PC or acrylic, which are lightweight and low-cost. In this embodiment, the electronic components on the second surface 2012 are located more radially inward of the circuit board 201 than the electronic components on any one of the light source modules 22 , that is, the electronic components on the second surface 2012 and the light source The projections of the electronic components of the module 22 on the thickness direction of the circuit board 201 do not overlap. On the one hand, it can prevent the heat generated by the electronic components of the light source module 22 from affecting the electronic components on the second surface 2012; on the other hand, it can limit the distribution area of the electronic components on the second surface 2012, thereby controlling the second insulating part 203 size to control costs.

The first insulating portion 202 in this embodiment includes a cavity 2021 , and the circuit board 201 is accommodated in the cavity 2021 . The first insulating portion 202 has a side wall 2022, the side wall 2022 is provided with a first limiting portion 2023, one or more second limiting portions 2024 are arranged in the cavity 2021 of the first insulating portion 202, and the circuit board 201 is installed in the first limiting portion 2024. When the insulating portion 202 is used, the two sides of the circuit board 201 in the thickness direction are respectively limited by the first limiting portion 2023 and the second limiting portion 2024, that is, the circuit board 201 is sandwiched between the first limiting portion 2023 and the second limiting portion. between 2024 to complete the fix. In addition, the circuit board 201 is not easily shaken after the installation is completed. The first limiting portion 2023 may be a buckle, and the second limiting portion 2024 may be a columnar body.

In this embodiment, the second insulating portion 203 is provided with a first fastening unit 2031 , and the circuit board 201 is provided with a corresponding second fastening unit 2013 , and the first fastening unit 2031 is fastened to the second fastening unit 2013 , so that the second insulating portion 203 is fixed on the circuit board 201 . The first fastening unit 2031 may be a fastening part, and the second fastening unit 2013 may be a fastening hole or a fastening part. In addition, the second buckling unit 2013 may also be disposed on the first insulating portion 202 to fix the second insulating portion 203 and the first insulating portion 202 .

In one embodiment, the circuit board 201 and the first insulating portion 202 may be positioned relative to each other through the concave-convex structure, thereby restricting the first insulating portion 202 relative to the circuit board 201 in a horizontal direction (direction parallel to the xy plane) Therefore, there will be no displacement between the light source module 22 and the first insulating part 202, so that the light source module and the first insulating part 202 will not be displaced. The reduction of light extraction efficiency caused by the displacement between parts.

In one embodiment, the basic structure of the LED lamp is the same as that of the previous embodiment. The LED lamp includes a lampshade 1 , a photoelectric module 2 and a base 3 , which are not repeated here. The difference is that an insulating unit and a circuit board are provided in this embodiment. Another fixed form of . As shown in FIGS. 13 to 17 , the power supply module 23 includes a first power supply module 231 (eg, the aforementioned electronic components in some of the power supply modules 23 disposed on the first surface 2011 ) and a second power supply module 232 (eg, The aforementioned electronic components in some of the power modules 23 disposed on the second surface 2012), the first power module 231 can be an SMT (surface mounting technology) component, and the second power module 232 can be a DIP (dual inline) -pin package) components, such as DIP components including inductors, capacitors, etc. The first insulating portion 202 is provided with a first fastener 25 , and the first insulating portion 202 is fastened to the light source module 22 through the first fastener 25 . The second insulating portion 203 is provided with a second clip 26 . The second insulating portion 203 is snap-fitted with the light source module 22 through the second clip 26 to insulate and mechanically protect the power module 23 . There is a certain distance between the second insulating portion 203 and the second insulating portion 203, so as to provide a buffer buffer for the second insulating portion 203 to prevent the power module from being damaged when the second insulating portion 203 is impacted by an external force.

The first insulating portion 202 and/or the second insulating portion 203 may be provided with reinforcing ribs 27. By providing the reinforcing ribs, the impact strength of the first insulating portion and/or the second insulating portion can be increased, preventing the first insulating portion and the /or the second insulating portion is damaged. The first insulating portion and the second insulating portion of different structures can be combined with each other.

As shown in FIG. 18 , several groups of LED chip groups 221 are provided on the circuit board 201 , and each LED chip group includes several LED chips 2201 . Taking any point on the center axis of the circuit board 201 as the center point, the distances from the LED chips 2201 on each LED chip group to the center point are equal or approximately equal. There is at least one center point on the central axis of the circuit board that is on the same plane as the LED chip group, and each LED chip group is located on the circle with the center point as the center or roughly on the circle with the center point as the center. They are located on different circles according to the radius of the circle. The number of LED chip groups is the same as the number of circles. Let the number of circles be n (n is greater than or equal to 1), and the pitch angle of the LED chip 2201 can be set to (90/n )°, so that the LED lamps have good light distribution and luminous efficiency. Any two LED chip sets have different luminous spectra, so as to make the brightness of LED lamps uniform and improve the color rendering of LED lamps. Of course, two or more LED chip sets can also have the same luminous spectrum, so that LED The lamps have good luminous effect.

In one embodiment, the average distance between adjacent LED chips 2201 in any radial direction of the circuit board 201 and/or the average distance between adjacent LED chips 2201 on the same circumference is smaller than that in the thickness direction of the optoelectronic module. The distance between the upper first insulating portion 202 and the LED chip 2201 can reduce the uneven brightness in the circumferential direction of the first insulating portion and achieve more uniform brightness.

In this embodiment, in the same LED chip set 221 , the center-to-center distance of two adjacent LED chips 2201 is L3 , and any LED chip 2201 in any LED chip set 221 is connected to the adjacent LED chip set 221 . The center-to-center distance of the closest LED chip 2201 is L4, which conforms to the following relationship: L3:L4 is 1:0.8-2, preferably L3:L4 is 1:1-1.5. In this way, the distribution of the LED chips 2201 is more uniform, so as to achieve the purpose of uniform light output.

In this embodiment, as shown in FIG. 18 , in the inner circle, two adjacent LED chips 2201 form a central angle A1 with the axis of the LED lamp, and in the middle circle, two adjacent LED chips 2201 and the LED lamps The axis forms a central angle A2, and the angle of the central angle A2 is smaller than the angle of the central angle A1. In the outer ring, two adjacent LED chips 2201 form a central angle A3 with the axis of the LED lamp, and the angle of the central angle A3 in the outer ring is smaller than the angle of the central angle A2 in the inner ring. For example, the outer ring therefore has more LED chips 2201 than the middle ring. Therefore, the spacing between adjacent LED chips 2201 in the outer ring is not much larger than the spacing between adjacent LED chips 2201 in the middle ring. Even, the distance between the two can be close or equal, so the arrangement of the LED chips 2201 will be more uniform, so that the light output can be more uniform. In other words, the LED chip group 221 has several groups, and each group is disposed on the circuit board 201 in the form of a ring, and the two adjacent LED chips 2201 and the LED chips 2201 of the inner LED chip group 221 are relatively inner. The angle of the central angle formed by the axis of the lamp is larger than the angle of the central angle formed by the axis of the LED lamp and the adjacent two LED chips 2201 of the LED chip group 221 on the outer side. That is to say, the LED chip set 221 on the outer side has more LED chips 2201 than the LED chip set 221 on the inner side, so that the distance between the adjacent two LED chips 2201 of the LED chip set 221 on the outer side is the same as that of the LED chip set 221 on the inner side. The distance between two adjacent LED chips 2201 of the LED chip group 221 on the inner side is closer, therefore, the arrangement of the LED chips 2201 will be more uniform, so that the light output can be more uniform.

In this embodiment, at least two groups of LED chip groups 221 are provided, and at least two groups of LED chip groups 221 are arranged in sequence in the radial direction of the circuit board 201 , each group of LED chip groups 221 includes at least one LED chip 2201 , and the circuit Any one LED chip 2201 in one group of LED chip groups 221 in the radial direction of the board 201 and any one LED chip 2201 in the other group of LED chip groups 221 radially adjacent to the circuit board 201 are on the circuit board 201. The radial direction is staggered, that is to say, the LED chips 2201 of different LED chip groups 221 are located in different directions in the radial direction of the LED lamp, that is, any one starts from the axis of the LED lamp and extends in the radial direction of the LED lamp. If the line is cut to two or more LED chips 2201 , it will cut to different positions of the two or more LED chips 2201 , that is, it will not cut to the same position of the two or more LED chips 2201 . In this way, assuming that the surface of the circuit board 201 has convection, when the air is convection in the radial direction of the circuit board 201, due to the relationship of the air circulation path, the contact between the air and the LED chip 2201 is more sufficient on the circulation path, so that the heat dissipation effect is better. . In addition, in terms of light emitting effect, the arrangement of the LED chips 2201 is more favorable for the uniformity of light output.

In the present embodiment, there is an open area 2202 between two adjacent LED chips 2201 in the same LED chip set 221 to allow air to flow between the LED chips 2201, so as to take away the heat generated by the LED chips 2201 during operation . In the two groups of LED chip groups 221 adjacent to the circuit board 201 in the radial direction, the open area 2202 between any two adjacent LED chips 2201 in one group of LED chips 221 and any two in the other group of LED chips 221 The open areas 2202 between adjacent LED chips 2201 are staggered in the radial direction of the circuit board 201 and communicated with each other. In this way, assuming air convection in the radial direction of the circuit board 201 , due to the relationship of the air circulation path, the contact between the air and the LED chip 2201 is more sufficient on the circulation path, so that the heat dissipation effect is better. If the circuit board 201 is radially adjacent to two sets of LED chips 221 , the open area 2202 between any two adjacent LED chips 2201 in one set of LED chips 221 and any two of the other LED chip sets 221 If the open area 2202 between adjacent LED chips 2201 is in the same direction in the radial direction of the circuit board 201, the air will flow directly along the radial direction of the circuit board. On the flow path, the air contacts the LED chips 2201. It is not conducive to the heat dissipation of the LED chip 2201.

For example, there are three groups of LED chip sets 221 , and they are arranged in sequence along the radial direction of the circuit board 201 , correspondingly, any open areas 2202 in the three groups of LED chip sets are not in the same direction in the radial direction of the circuit board 201 . . In this way, the flow path of convection on the surface of the circuit board 201 is optimized, and the heat dissipation efficiency is improved.

In one embodiment, each LED chip set 221 only includes LED chips 2201 of one light color, and the LED chips 2201 on each circumference can be staggered in the circumferential direction, and this arrangement has good color mixing and light uniformity. Secondly, because the LED chip 2201 includes an LED chip and a light conversion layer, and the light conversion layer includes glue and phosphor powder, by adjusting the ratio of glue and phosphor powder, the LED chips on a circumference can emit white light, such as warm white light, Daylight color light, etc., the LED chips on the circumference adjacent to the white light emit primary color light, such as red light, green light, blue light, etc. The diffusing part and the second diffusing part, the thickness of the first diffusing part in the optical axis direction of the LED chip 2201 is smaller than the thickness in other directions except the optical axis direction of the LED chip 2201, and the white light emitted by the LED chip is blocked by the first diffusing part. The diffusing part diffuses uniformly, the second diffusing part has a uniform thickness, the primary color light emitted by the LED chip is emitted through the second diffusing part with the same light distribution without diffusing, thus adjusting the color temperature contrast on different circumferences to reproduce sky blue color, and provide appropriate lighting space according to the living scene.

In one embodiment, a lens can be provided on the LED chip 2201. For example, there are three LED chip groups on the circuit board 201, which are respectively located on the first circle, the second circle and the third circle that are concentric and have different radii. , The LED chips 2201 on the second circumference cover the tubular lens, and each LED chip 2201 on the third circumference covers a single lens, which can make the illumination of the LED lamps uniform.

In one embodiment, a part of the LED chip sets can be irradiated toward the central part of the LED lamp (or the direction of the central axis of the lamp), and a part of the LED chip groups can be irradiated in a direction away from the circuit board 201 to prevent dark parts from appearing in the central part of the LED lamp.

In one embodiment, two sets of LED chip groups 221 are arranged on the circuit board 201, and the two LED chip groups are respectively arranged on two concentric circles with different radii. The LED chip groups are arranged on another circumference. The first insulating portion 202 is provided with a first absorption area and a second absorption area in the areas corresponding to the first LED chip group and the second LED chip group, respectively. When the color temperature of the light-emitting color is lower than the color temperature of the light-emitting color of the second chipset, the wavelength absorption of the first absorption region is greater than the wavelength absorption of the second absorption region, which can improve the color rendering, color temperature of the lamp and reduce color deviation (DUV). ).

In one embodiment, at least one heat dissipation hole can be provided on the circuit board, since the air can flow on the first surface and the second surface of the circuit board, the heat dissipation effect of the LED lamp can be improved.

In one embodiment, as shown in FIG. 18 to FIG. 22 , the circuit board is provided with an opening 222 , and the LED chip set 221 is arranged around the opening 222 . After the LED lamp is installed, the opening 222 corresponds to the base described later. Hole 33 on 3 (see Figures 45 to 46). The area of the openings 222 accounts for 2%-50% of the area of the circuit board 201, preferably the area of the openings accounts for 10-30% of the area of the circuit board, more preferably the area of the openings accounts for 10-20% of the area of the circuit board , on the one hand, because most of the current circuit boards are cut, the opening area is too large, and there is a lot of leftover material in the corners, resulting in waste of resources and increased cost; If it is too large, the distance between adjacent LED chips will be reduced, and the heat generated by the LED chips will easily affect each other and affect the product quality.

In one embodiment, the light source module 22 may further include a lens unit, and the lens unit is covered on the circuit board 201. There are various forms of the lens unit. A night light is arranged between the adjacent LED chip groups, and the lens unit includes a lens body covering the LED chip group and a communication part connecting the adjacent lens bodies and covering the night light. The emitted light diffuses to the center and the outside of the LED lamp, which can achieve uniform illumination; secondly, the lens unit has two ridges, and a night light is arranged between the two ridges. The night light is used as a point light source with relative directionality. Third, the lens unit can be provided with protrusions, so that the light emitted by the LED chips 2201 on the circuit board 201 is mainly diffused and emitted in the radial direction with the center of the circuit board 201 as the origin, thereby suppressing the light source module point When the light is on, there is a grainy feeling; fourth, there are multiple groups of LED chip groups on the circuit board 201, the number of lens units is greater than 2, and there are avoidance parts between the lens units, the circuit board 201 has openings, and the LED chip groups surround the openings Setting, the avoidance part has a concave part facing the opening to prevent the light interference of the first insulating part 202; Fifth, the lens unit has a concave part aligned with the LED chip 2201 to accommodate the LED chip 2201, the lens unit has an incident surface and a relative The diffusivity in the projection surface near the optical axis of the LED chip 2201 and the area of the incident surface is set to be higher than that in other areas, the brightness distribution of the lampshade becomes smooth, and the light transmission efficiency is high; Sixth, the lens The unit has a first surface and a second surface, the second surface is a light incident surface close to the side of the LED chip 2201, and the second surface is a surface where the light incident from the first surface of the LED chip 2201 is transmitted through this surface and emitted to the outside, The first surface includes a light control surface, the light control surface distributes the light emitted from the LED chip 2201 at a large angle, a plurality of convex parts or a plurality of concave parts are arranged around the light control surface, and the light control surface is diffused through the plurality of convex parts or concave parts, The generation of bright lines on the lampshade can be suppressed; seventh, the lens unit includes a plurality of lenses, each lens covers each LED chip 2201 respectively, that is, the number of lenses is equal to the number of LED chips 2201, and the first insulating portion 202 has light transmittance The lens cover enables the light of the LED chip 2201 to be emitted toward the center of the lamp, and the peak light distribution angle of the lens can be set to improve the uniformity; and the LED accommodating part, by accommodating the LED chip, the contact between the LED chip and the concave part is suppressed, and the LED accommodating part and the concave part are smoothly continuous through the convex curved surface protruding relative to the LED chip; The light area and the second light distribution area, the first light distribution area has a first outer surface, the second light distribution area has a second outer surface, the first outer surface reflects light inward in the direction of the optical axis of the LED chip 2201, and the second light distribution area has a second outer surface. The two outer surfaces are relative to the optical axis direction of the LED chip 2201 The light is reflected upward and outward, and by adjusting the position of the LED chip, a part of the illuminance can be suppressed to prevent glare. The arrangement of the LED chips 2201 involved in the implementation forms of the lens units in the second to ninth above may adopt the arrangement in the above-mentioned embodiment, and may also adopt other arrangement forms.

In one embodiment, the circuit board 201 can also take other different forms. For example, the circuit board 201 can include a plurality of sub-circuit boards 201, and the sub-circuit boards 201 can be arranged in various different structures. The sub-circuit board 201 has a certain inclination angle relative to the base 3; in one embodiment, any sub-circuit board 201 has an inner area where the LED chips 2201 are not placed and an outer area where the LED chips 2201 are placed, for example, any sub-circuit board The smallest area that can be surrounded by all the LED chips 2201 forms the outer area, the LED chips 2201 close to the inner area have small spacing, and the spacing between the LED chips 2201 far from the inner area is large, which can realize uniform lighting of the LED lamps; one In the embodiment, the sub-circuit boards 201 are arranged in the circumferential direction, and each sub-circuit board 201 is provided with LED chips 2201 of different colors. The distance between the LED chips is equal to the shortest distance between the LED chips respectively located on the adjacent sub-circuit boards 201. By arranging the LED chips of different colors, the light-emitting surface can emit light uniformly; in one embodiment, the adjacent sub-circuit boards 201 Connected by the connecting portion, the protruding portion of one sub-circuit board 201 is accommodated in the receiving portion of the adjacent sub-circuit board 201, and the light emitted from the LED chip is easily diffused in the direction orthogonal to the extending direction of the LED chip, thereby suppressing the connection The center of the part is darkened, so as to prevent uneven brightness of the light-emitting surface of the LED lamp; in one embodiment, the circuit board 201 is composed of two sub-circuit boards 201, and the first insulating part 202 is provided with a reflective part, and the reflective part has a sub-circuit board 201. The first reflective surface that reflects the light emitted by the LED chips on the circuit board 201 obliquely from the vertical direction of the circuit board and the second reflective surface that reflects the light emitted by the LED chips on the other sub-circuit board 201 toward the center of the lamp to suppress the The brightness is not uniform on the first insulating portion.

In one embodiment, the circuit board 201 can also adopt other different forms. For example, the circuit board 201 includes an inner area with the power module 23 and an outer area with the light source module 22 , and the outer area is farther away from the circuit than the inner area. The center and outer regions of the board 201 are alternately arranged with a plurality of first blocks and a plurality of second blocks adjacent to each other, and the distance from the plurality of LED chips 2201 arranged in the first block to the center of the circuit board 201 The average value is larger than the average value of the distances from the plurality of LED chips 2201 arranged in the second block to the center of the circuit board 201, so that the light emitted from the LED chips in the outer area can be suppressed from being provided in the covering power supply in the inner area. The second insulating part 203 of the module blocks, which can ensure uniform brightness of the light exit surface of the lampshade;

In some embodiments, the circuit board 201 may also adopt other different forms. As shown in FIGS. 19-20 , the second surface 2012 of the circuit board 201 includes a third area 2014b for placing the power module 23 and a third area 2014b not placed thereon. In the fourth area 2015b of the power module 23, in this embodiment, the first area 2014a and the third area 2014b include an opening 222, and the opening 222 connects the first area 2014a and the third area 2014b, for example, the center of the circuit board is The center of the circle, the area of the circle formed by taking the maximum distance from the electronic components of the power module to the center as the radius is the third area, and the first surface 2011 includes the first area 2014a opposite to the third area 2014b and the fourth area 2015b opposite In the second area 2015a, the number of LED chips located in the first area 2014a is smaller than the number of LED chips located in the second area 2015a, so on the one hand, the dark area in the middle of the LED lamp is significantly reduced, and the luminous effect of the LED lamp is improved, and the other is On the other hand, the influence of the heat generated by the power module on the light source module can be reduced. In some embodiments, the third area 2014b is close to the central axis of the LED luminaire (or the central axis of the optoelectronic module), and the fourth area 2015b is far from the central axis of the LED luminaire (compared to the third area 2014b), because the power module 23 is arranged close to the center of the LED lamp. During transportation, the amplitude of the external force on the photoelectric module 2 is small, and the power module 23 will not be damaged by the external force. When the power module 23 includes the aforementioned first power module 231 and the second power module 232, the power module referred to in the description of FIGS. 19-20 is the second power module 232, and in other embodiments , the first area 2014a and the third area 2014b do not include the opening 222, and the maximum distance from the end or edge of the opening 222 to the first area 2014a is smaller than the distance from the end or edge of the opening 222 to the LED chip 2201.

In some embodiments, the circuit board 201 may also take other different forms. As shown in FIG. 21 and FIG. 22 , the second surface 2012 of the circuit board 201 includes a seventh area 2016b and an eighth area 2017b. Electronic components include heating elements (components that generate more heat during operation, such as ICs, resistors, etc.) and heat-resistant components (meaning components that are easily changed by heat, such as electrolytic capacitors), among which heating elements and The heat-labile elements are located in the seventh area 2016b and the eighth area 2017b respectively, which can reduce the influence of the heat generated by the heating element on the heat-labile element, and improve the overall reliability and life of the power module 23. The first side 2011 includes a fifth area 2016a opposite to the seventh area 2016b and a sixth area 2017a opposite to the eighth area 2017b, the number of LED chips located in the fifth area 2016a is smaller than the number of LED chips located in the sixth area 2017b, thus Reduce the influence of the heat generated by the power module on the light source module. When the power module 23 includes the aforementioned first power module 231 and the second power module 232 , the power module referred to in the description of FIGS. 21-22 is the second power module 232 .

In one embodiment, the circuit board 201 can also adopt other different forms. In order to improve the heat dissipation efficiency of the light source module, the circuit board 201 includes an inner area where the power module 23 is configured and an outer area where the light source module 22 is configured. The outer area is farther from the center of the circuit board 201 than the inner area, and a fragile part (a gap or groove) is arranged between the inner area and the outer area. Cooling area.

In one embodiment, the circuit board 201 can also take other different forms. The optoelectronic module includes a night light. The circuit board 201 includes a first area for configuring the night light and a second area for configuring the LED chip 2201. The first area is close to the LED. The central axis of the lamp (or the central axis of the photoelectric module), a slit is formed between the night light and the LED chip 2201 to ensure the insulation distance between the night light and the LED chip, and prevent the The potential difference causes a short circuit.

In one embodiment, the circuit board 201 can also take other different forms. For example, the circuit board 201 is provided with an optical member for controlling the light distribution of the light emitted from the LED chip 2201. The optical member has a dome-shaped incident surface, an exit surface and In the medium part between the two positions, the ratio of the distance r between the LED chip and the incident surface in the optical axis direction and the distance d between the LED chip and the incident surface in the peripheral direction is r/d<1. The scene produces the corresponding light space.

It can be seen from FIG. 10 to FIG. 11 that the first insulating portion 202 has a certain arc from the center of the light source module 22 along the radial direction of the light source module 22 to the edge, or the first insulating portion 202 extends from one end of the light source module 22 along the light source The radial direction of the module 22 to the other end of the light source module 22 has a certain radian, or the first insulating portion 202 has a radial direction from the center of the circuit board 201 to the end of the first insulating portion 202 along the radial direction of the circuit board 201 . a certain arc. The central angle corresponding to the radian is 2° to 50°, preferably 5° to 15°. Designing the first insulating portion 202 to have a radian can increase the force strength of the first insulating portion during transportation, thereby protecting the integrity of the optoelectronic module 2, and can also ease the inclination of the first insulating portion relative to the circuit board, Distributes the light softly. In other embodiments, the first insulating portion 202 includes a transparent base material and a light-transmitting light diffusing layer, the transparent base material is close to the circuit board 201, and a decorative layer forming a predetermined pattern is provided between the transparent base material and the light diffusing layer. The light passing through the decorative layer will not be scattered by the light diffusion layer, so when the LED lamps are observed from the floor side, a pattern with a clear outline can be seen, which can enhance the lighting effect.

As shown in FIGS. 10 to 12 , a plurality of first holes 2032 are provided on the second insulating portion 203 , and a space for accommodating electronic components is formed between the second insulating portion 203 and the circuit board 201 . The arrangement of the first holes 2032 is beneficial to the air convection in the space for accommodating the electronic components, so that at least a part of the heat generated by the electronic components is discharged through the above-mentioned first holes 2032 to enhance the heat dissipation of the electronic components Effect.

In one embodiment, the second insulating portion 203 may adopt other different forms. The second insulating portion 203 may be composed of a plurality of blocks, with overlapping regions between the blocks, and the distance from the overlapping region to the base 3 is smaller than that of the second insulating portion. 203 The distance from other parts (other than the overlapping area) to the base 3 to prevent the second insulating part from contacting the power module, increase the heat dissipation path, and improve the heat dissipation effect.

In one embodiment, the first insulating portion 202 can adopt other different forms. The first insulating portion 202 includes a central area and an end area, and the central area is close to the central axis of the LED lamp (or the central axis of the optoelectronic module), Compared with the central area, the end area is far away from the central axis of the LED lamp (or the central axis of the photoelectric module), and the end area is provided with a light guide reflection that guides the light emitted by the light source module 22 from the central area to the end area. part to improve the illumination range of the lamps.

In one embodiment, the first insulating portion 202 may adopt other different forms. The first insulating portion 202 has an inner region, an outer region, and an intermediate region between the inner region and the outer region, and the inner region is compared with the outer region and the outer region. The middle area is close to the central axis of the LED luminaire (or the central axis of the photoelectric module), and the inner area has a first thick part thicker than the middle area, the first thick part can provide a lens effect, so that the central part of the luminaire is bright, and the light is lost small.

In one embodiment, the first insulating portion 202 may adopt other different forms. The surface of the first insulating portion 202 may have a plurality of prisms, and each prism has a first prism surface and a different inclined angle relative to the circuit board 201 . On the second prism surface, the light emitted from the LED chip is incident on the first prism surface and the second prism surface and is refracted, which can suppress discomfort caused by glare.

In one embodiment, the first insulating portion 202 may adopt other different forms. The first insulating portion 202 has a light-transmitting portion with high light transmittance and a lens portion with low light transmittance, and the light-transmitting portion surrounds the lens portion and is far away from the LED. The central axis of the lamp can make the illuminance of the lampshade uniform and the light output rate of the lamp is high. In one embodiment, the first insulating portion 202 is provided with a lens, which can control the radial and circumferential light distribution of the first insulating portion, suppress the uneven brightness of the lamp in the circumferential direction, and ensure radial light distribution.

In one embodiment, the first insulating portion 202 can adopt other different forms, the photoelectric module 2 includes a night light, and the night light is arranged on the circumference closest to the central axis of the LED lamp (or the central axis of the photoelectric module), The night light is provided with a mask that can transmit the pattern, which can ensure the luminous efficiency of the lamp and improve the light design. In addition, when the night light is turned on, there may be bright lines on the lampshade 1. In order to prevent this phenomenon, the night light peripheral There is a diffuser cover for diffusing, and the area where the first insulating portion 202 covers the night light and the light source module 22 is a uniform surface without unevenness, so no bright lines are generated.

In one embodiment, the first insulating portion 202 and the second insulating portion may adopt other different forms. As shown in FIG. 23 and FIG. 24 , in this embodiment, the first insulating portion 202 is provided with a lens group 212 . The group 212 is disposed corresponding to the LED chip group 221, that is, the lens group 212 is located above the LED chip group 221 to cover the LED chip group 221, so that the light distribution is more dispersed and uniform; In order to reduce the production cost, the first insulating part 202 is provided with multiple groups of heat dissipation holes, the heat dissipation hole group includes a plurality of heat dissipation holes 211, and at least one group of heat dissipation holes is close to the LED chip group 221, so that the heat of the circuit board 201 can be absorbed. Rapidly dissipates, greatly increasing the heat dissipation effect. In addition, the second insulating portion 203 can also be provided with heat dissipation holes 211 to further reduce the temperature of the power module and improve the service life of the lamp. A plurality of auxiliary portions 2033 are arranged on the second insulating portion, and the plurality of auxiliary portions 2033 are distributed in a circle. Of course, other distribution methods can also be used. When the insulating unit is fixed to the circuit board, the auxiliary part can increase the connection strength between the insulating unit and the circuit board, and can also increase the heat dissipation area of the second insulating part to improve the heat dissipation effect. In other embodiments, the heat dissipation hole 211 can be arranged in the middle of the first insulating portion 202 (close to the central axis of the optoelectronic module), and a plurality of spaced notches are arranged on the outer edge of the first insulating portion 202, Therefore, air can be convected between the circuit board and the first insulating portion, thereby improving the heat dissipation effect.

FIG. 25 is a schematic structural diagram of another embodiment of the photoelectric module 2b. As shown in FIG. 25, the photoelectric module 2b includes a light source module 22 and a power module 23, and a reflective light is provided between the light source module 22 and the power module 23. The light source module 22 surrounds the reflective member 29. The light source module 22 includes a circuit board 201 and at least one group of LED chip groups 221 located on the circuit board 201. Each LED chip group includes a plurality of LED chips 2201. The light-emitting surface of the LED chip 2201 faces the central axis of the lamp, which can effectively eliminate the middle dark area and improve the lighting effect of the lamp. Referring to FIG. 55 to FIG. 56 , part of the light emitted by the LED chip 2201 is reflected by the light-reflecting member 29 and then exits the lampshade 1 . In one embodiment, the outer surface of the LED chip 2201 can be isolated from the external environment through a colloid (eg, silica gel) to avoid the risk of electric shock. Alternatively, an adhesive layer with a uniform thickness is coated on the entire circuit board 201 .

In this embodiment, the LED light source module 22 further includes a heat sink 223. The heat sink 223 can be an aluminum ring, a copper ring, etc. The circuit board 201 is attached to the heat sink 223. In order to improve the heat dissipation effect, the heat sink 223 can be far away from the heat sink 223. The surface of the circuit board 201 is provided with heat dissipation ribs (not marked in the figure) to increase the heat dissipation area.

In this embodiment, the preparation of the LED light source module 22 may adopt the following methods:

1) the circuit board 201 pad end is stuck in the card slot of the turntable, the turntable is started, and the circuit board 201 is surrounded and adsorbed in the card slot of the turntable;

2) The dispensing head is aligned with the circuit board 201, the turntable rotates to start dispensing, and the turntable stops rotating after the dispensing is completed;

3) The heat sink 223 is inserted into the slot of the turntable. After the turntable rotates once, the heat sink 223 is cut off, and the heat sink 223 and the circuit board 201 are taken out;

4) Paste the LED chip 2201 on the circuit board 201 to obtain the LED light source module 22 . The above preparation method has simple operation and low equipment cost, and can effectively improve production efficiency and reduce production cost.

As shown in FIGS. 26 to 28 , the optoelectronic module 2 of the present application further includes a connector terminal 24 , and the electrical connection terminal 24 is electrically connected to an external power source (such as commercial power) for receiving external power signals and sending the power signals to the LEDs. During lamp transmission, the connector terminals 24 are connected to the electronic components on the second surface 2012 through the wires 241 , and the connection point between the wires 241 and the circuit board 201 is located on the second surface 2012 of the circuit board 201 . In this embodiment, the electronic components of the power module are all located on the second surface 2012 as an example, but it is not limited thereto. The circuit board 201 is provided with an opening 2018, the opening 2018 is connected to the first surface 2011 and the second surface 2012, the opening 2018 is close to the wire 241, and the distance from the opening 2018 to the wire 241 in the radial direction of the circuit board is smaller than the length of the wire 241, preferably the opening The shortest distance from 2018 to the wire 241 in the radial direction of the circuit board is less than the length of the wire 241 to ensure stable electrical connection. The first insulating part 202 is provided with a fixing button 2025. After the photoelectric module 2 is assembled, the fixing button 2025 is located in an area that is 30 degrees to 60 degrees from the first surface 2011. Preferably, the fixing button 2025 is located on the first side 2011. In the area of 30 degrees to 45 degrees, it is easy for the user to assemble the connector terminal 24 through the opening 2018 and fix it to the fixing buckle 2025, and a part of the connector terminal 24 is exposed outside the first insulating part 202 for convenience. Subsequent electrical connections. Fig. 26 shows an assembling method of an embodiment of the optoelectronic module of the present application, referring to Fig. 26 to Fig. 28, which includes:

1) The connector terminal 24 is connected to the electronic components on the circuit board 201 through the wires 241, and the circuit board 201 is pressed into the first insulating part 202;

2) Press the connector terminal 24 through the opening 2018 on the circuit board 201 into the fixing button 2025 of the first insulating part 202, and a part of the connector terminal 24 is exposed outside the first insulating part 202;

3) The second insulating portion 203 is fixed on the circuit board 201 , and the second insulating portion 203 covers the wires 241 and all the electronic components on the second surface 2012 .

At present, when the photoelectric module is assembled, the circuit board is first fixed on the base, then the connector terminal is fixed on the fixing buckle on the first insulating portion, and finally the first insulating portion is fixed. However, with this connector terminal fixing method, the position of the first insulating portion needs to be adjusted when fixing the first insulating portion. During the adjustment process, the electrical connection point between the connector terminal and the circuit board is prone to loosening, and the electrical connection is unstable. The above-mentioned electrical connection is not stable, and a long wire needs to be used, but the wire is too long, which increases the cost of the wire. Using the assembly method of the present application to assemble the optoelectronic module is simple and convenient, the user can assemble it by himself, and the length of the wire used for the connector terminal and the circuit board is short, which can save the wire; after the assembly is completed, the connector terminal and the circuit board are At a certain angle, the height of the exposed first surface of the connector terminal is minimized, and the light emitted by the light source module is not blocked.

As shown in FIGS. 29 to 35 , the outer edge of the first insulating portion 202 is provided with a first protruding portion 2101 , and the first protruding portion 2101 protrudes from the outer edge of the first insulating portion 202 . In this embodiment, the first insulating portion 202 can be configured as a revolving body structure, and a plurality of first protruding portions 2101 can be provided on the outer edge of the first insulating portion 202 along the circumferential direction of the first insulating portion 202 . In this embodiment, a mounting portion 31 is provided on the base 3 , and the mounting portion 31 is provided for mounting the first protruding portion 2101 . Specifically, the mounting portion 31 has a first mounting portion 315 , and the first mounting portion 315 has a first slot 3111 . The first insulating portion 202 has a fixed position and a release position. In the fixed position, the first protruding portion 2101 is clamped into the first slot 3111 to be fixed. In the released position, the first protruding portion 2101 and the The first card slot 3111 is separated. In this embodiment, the first insulating portion 202 is switched between the fixed position and the relaxed position in a rotating form (roughly rotating around the axis of the LED lamp). In this embodiment, both sides of the first card slot 3111 in the axial direction of the LED lamp are closed by the first mounting portion 315 and the base 3 . Therefore, when the first protruding portion 2101 is locked into the first card slot 3111 , the position of the first protruding portion 2101 is limited on both sides in the thickness direction of the LED lamp. In other embodiments, the two sides of the first card slot 3111 in the axial direction of the LED lamp are closed by the structure of the first mounting portion 315 to achieve the same function as above. In this embodiment, the first mounting portion 315 has a positioning unit, so as to play a positioning role for the first protruding portion 2101 inserted into the first locking slot 3111 . Specifically, the positioning unit includes a first elastic arm 3112, and a first groove 3113 is formed between the first elastic arm 3112 and the first mounting portion 315. In the fixed position, the first protruding portion 2101 is in the LED lamp. The radial ends are snapped into the first grooves 3113 to achieve positioning and fixing of the first insulating portion 202 . A first blocking portion 31121 is formed on the first elastic arm 3112 . With the arrangement of the first elastic arm 3112, when the first protruding portion 2101 needs to be disengaged from the first slot 3111 to rotate the first insulating portion 202, the first blocking portion 31121 needs to be overcome (that is, a force needs to be applied to the an insulating portion 202, so that the first protruding portion 2101 presses the first elastic arm 3112 to achieve release), thereby preventing the first insulating portion 202 from slipping from the first card slot due to misoperation or collision, etc. 3111 loose. In this embodiment, in the fixed position, the first elastic arm 3112 can exert force on the first protruding portion 2101 to further play a role of tightening the first insulating portion 202 . The first elastic arm 3112 can be integrally formed on the first mounting portion 315 . The first elastic arm 3112 can be a sheet-like structure, and has elasticity due to its own material properties (a material with elasticity in the prior art, such as plastic or metal) can be used. The first blocking portion 31121 can be directly formed by bending the first elastic arm 3112 (or setting a bending on the first elastic arm 3112 ).

In this embodiment, the first mounting portion 315 and the second mounting portion 316 are integral components, and the first engaging slot 3111 and the second engaging slot 3114 are respectively located on opposite sides of the component. In other embodiments, the first mounting portion 315 and the second mounting portion 316 may also be a split structure (not shown).

The optoelectronic module 2 may also adopt other structures to be connected to the base 3 . As shown in FIG. 2 and FIG. 36 , in some embodiments, the optoelectronic module 2 is fixed to the base 3 by means of magnetic connection (in this embodiment, other basic structures are the same as the previous embodiments). Specifically, the first insulating portion 202 of the optoelectronic module 2 has a first protruding portion 2101 on which a magnet 2102 is arranged, and the base 3 includes a part or component made of iron, so the magnet 2102 can Adsorb directly to the base 3 to complete the fixation. In other embodiments, the magnets may also be arranged at different positions, such as arranged on the light source module, the power module or the second insulating portion, which will not be repeated here. As shown in FIG. 37 , the optoelectronic module 2 can also be connected to the base 3 in a screw-fixed manner (in this embodiment, other basic structures are the same as those in the previous embodiment). Specifically, the first insulating portion 202 of the optoelectronic module 2 has a first protruding portion 2101 . The first protruding portion 2101 is provided with bolts 2103 , and the bolts 2103 are connected to the base 3 , thereby completing the fixing of the optoelectronic module 2 . In other embodiments, the bolts may also be arranged at different positions, such as arranged on the light source module, the power module or the second insulating portion, which will not be described herein again. In one embodiment, as shown in FIG. 38 and FIG. 39 , the photoelectric module 2 can also be connected to the base 3 by other screw fixing methods. The base 3 is provided with a plurality of through holes 3201a, and the through holes 3201 can be located on a circumference. On the top, the first insulating portion 202 of the photoelectric module 2 is provided with threaded holes, and the screws pass through the through holes to the threaded holes, so as to fix the photoelectric module on the base. In some embodiments, as shown in FIG. 40 , the base 3 is provided with a plurality of through holes 3201b, the through holes 3201b can be located on a circumference, and the through holes 3201 are placed with studs 3202, so that the studs 3202 are riveted to the base 3. Above, the first insulating portion 202 of the photoelectric module 2 is provided with screw holes 3203 , and the screws pass through the screw holes 3203 to the studs 3202 , thereby fixing the photoelectric module 2 on the base 3 .

The basic structure of the LED lamp shown in FIG. 41 is the same as that of the lamp (ceiling lamp) of the previous embodiment, the difference is the specific fixing method of the photoelectric module 2 and the base 3. Specifically, as shown in FIGS. 41 and 42, the base 3 There is a mounting portion 31 on the top, the mounting portion 31 includes a fixing portion 314 and an inclined portion 317 connected to the fixing portion 314, the fixing portion 314 includes an upper limit portion 3141, a lower limit portion 3142 opposite to the upper limit portion 3141, and the lower limit portion 3142 is connected to the inclined portion 317 , a connecting portion 3143 is provided between the upper limit portion 3141 and the lower limit portion 3142 , the connecting portion 3143 is connected with a positioning portion 313 , and the positioning portion 313 is opposite to the inclined portion 317 . A part of the corner of the photoelectric module 2 slides into the lower limit part 3142 along the inclined part 317 and is held in a fixed state by the positioning part 313 .

The spatial position of the mounting portion 31 is located in the Cartesian coordinate system (x, y, z) shown in FIG. 42, the xy plane is parallel to the upper surface of the lower limit portion 3142, and the angle between the inclined portion 317 and the xy plane is α, The range of the included angle α is 0<α≤20°, preferably 5°<α≤15°; the included angle between the positioning portion 313 and the xz plane is β, and the range of the included angle β is 10°≤β≤50°, preferably 20° °≤β≤40°, by adjusting β, the light source module can be fixed in the installation part. The positioning part 313 is provided with a spring plate 3131. The angle γ between the spring plate 3131 and the xz direction is in the range of 28°<γ<68°, preferably 38°≤γ≤58°. When the photoelectric module is damaged, it needs to be replaced When , the photoelectric module can be slid out of the fixed part, and by designing γ, the user can easily replace the photoelectric module and improve the work efficiency. The maximum length of the setting portion 313 in the z-axis direction is L1, and when the photoelectric module 2 slides into the lower limit portion 3142, the minimum length of the photoelectric module 2 in the z-axis direction is L2, and the sum of L1 and L2 is greater than The distance D from the upper limit part 3141 to the lower limit part 3142 makes the fixing effect of the photoelectric module better.

In one embodiment, as shown in FIG. 43 and FIG. 44 , an LED lamp is provided, and the basic structure of the LED lamp is the same as that of the lamp (ceiling lamp) of the foregoing embodiment. The difference is the specific fixing method of the photoelectric module 2 and the base 3 . Specifically, referring to FIG. 43 and FIG. 44 , the photoelectric module 2 in this embodiment is provided with mounting holes 28 . The mounting holes 28 may be located at both ends of the photoelectric module 2 , and the base 3 is provided with mounting portions 31 . The mounting holes The number of 28 is the same as that of the mounting portion 31. The mounting portion 31 includes a support portion 311 and a fastener portion 312 fixed on the support portion 311. The fastener portion 312 includes a telescopic portion 3121 and a limit portion 3122. , align the mounting hole 28 on the photoelectric module 2 with the fastener part 312, and then apply force to the photoelectric module 2, so that the telescopic part 3121 is compressed into the installation hole 28 of the photoelectric module 2, and then the photoelectric module 2 It is clipped into the gap between the telescopic portion 3121 and the limiting portion 3122 . The height of the mounting hole 28 is not less than the minimum distance between the telescopic part 3121 and the limiting part 3122, preferably the height of the mounting hole 28 is equal to the minimum distance between the telescopic part 3121 and the limiting part 3122, and the photoelectric module will not be damaged during transportation. If shaking occurs, the fixing effect of the photoelectric module is good. After the installation is completed, as shown in Figure 44, using this installation method, the operation method is simple, the installation is convenient for users, the work efficiency is improved, and the fixing effect is good, the production cost is low, and it is suitable for industrialization.

Referring to FIGS. 29 to 35 , the mounting portion 31 further includes a second mounting portion 316 , which has been provided for fixing the lampshade 1 . Specifically, the lampshade 1 has a wall portion 11, and the lampshade 1 can be configured as a revolving body structure. The wall portion 11 has an edge, and the edge of the wall portion 11 is provided with a second protruding portion 1101 . A plurality of second protruding portions 1101 may be provided along the circumferential direction of the lampshade 1 . The second mounting portion 316 has a second slot 3114 . When the lampshade 1 is fixed to the base 3 , the second protruding portion 1101 is snapped into the second snap groove 3114 to be fixed. In this embodiment, the lampshade 1 locks the second protrusion 1101 into the second slot 3114 or loosens it from the second slot 3114 in the form of rotation (roughly around the axis of the LED lamp). In this embodiment, the two sides of the second slot 3114 in the axial direction of the LED lamp are closed by the second mounting portion 316 and the base 3 . Therefore, when the second protruding portion 1101 is locked into the second slot 3114 , the position of the second protruding portion 1101 is limited on both sides in the thickness direction of the LED lamp. In other embodiments, the two sides of the second card slot 3114 in the axial direction of the LED lamp are closed by the structure of the second mounting portion 316 to achieve the same function as above. In this embodiment, the second mounting portion 316 has a positioning unit, so as to play a positioning role for the second protruding portion 1101 that is snapped into the second locking slot 3114 . Specifically, the positioning unit includes a second elastic arm 3115, and a second groove 3116 is formed between the second elastic arm 3115 and the second mounting portion 316. In the fixed position, the second protruding portion 1101 is in the LED lamp. The radial end is snapped into the second groove 3116 to achieve the positioning and fixation of the lampshade 1 . A second blocking portion 31151 is formed on the second elastic arm 3115 . With the arrangement of the second elastic arm 3115, when the second protruding portion 1101 needs to be disengaged from the second slot 3114 to rotate the lampshade 1, it is necessary to overcome the obstruction of the second blocking portion 31151 (that is, the lampshade 1 needs to be forced to be applied to thereby The second protruding portion 1101 is pressed against the second elastic arm 3115 to be released), thereby preventing the lampshade 1 from being released from the second slot 3114 due to misoperation or collision. In this embodiment, when the lampshade 1 is fixed, the second elastic arm 3115 can exert force on the second protruding portion 1101 , so as to further tighten the lampshade 1 . The second elastic arm 3115 can be integrally formed on the second mounting portion 316 . The second elastic arm 3115 can be a sheet-like structure, and has elasticity due to its own material properties (a material with elasticity in the prior art, such as plastic or metal) can be used. The second blocking portion 31151 can be directly formed by bending the second elastic arm 3115 (or setting the bending at the second elastic arm 3115 ).

The lampshade 1 in the present application can adopt different structures. Referring to FIG. 1 to FIG. 51 , in one embodiment, the lampshade 1 has a smooth curved surface to prevent uneven light distribution caused by the difference in refractive index of the lampshade section. In one embodiment, the lampshade 1 includes a central portion and a peripheral portion surrounding the central portion, the lampshade 1 has a light diffusing layer, the light diffusing layer contains light diffusing particles, and the density of the light diffusing particles in the central portion is greater than that in the peripheral portion. , so that the brightness of the center and periphery of the lamp is uniform. In one embodiment, the lampshade 1 has a plurality of diffusion regions, wherein a diffusion region overlaps with the photoelectric module 2 in the z-axis direction, which can improve the flashing of the lamp. In one embodiment, the inner surface or the outer surface of the lampshade 1 may be provided with a brightness enhancement film to distribute the light energy of the light emitted by the light source module 2, so as to achieve uniform light output from the LED lamp and avoid glare. Here, the inner surface and the outer surface are relative positions, and the inner surface of the lampshade 1 is the surface close to the photoelectric module 2 . In one embodiment, the lampshade 1 is provided with through holes, and the mounting screws used to mount the lampshade 1 to the base 3 are inserted into the through holes of the lampshade 1 and screwed to the base 3, so that even if the lampshade 1 The expansion or contraction of the base and the base due to the temperature change caused by the opening and closing of the lamp can also reduce the stress caused by the expansion or contraction through the clearance, which can prevent the lampshade and the appliance from cracking or generating noise.

In other embodiments, a light guide plate may be provided between the lampshade 1 and the first insulating portion 202. The light guide plate is, for example, a transparent acrylic resin molded body. The light guide plate may adopt different structures. The luminous intensity (the end near the edge of the base 3) is the luminous intensity of the angle corresponding to 30% of the luminous intensity (maximum luminous intensity) in the main luminous direction of the LED chip 2201; in one embodiment, the light guide plate covers the circuit board 201, and the light guide plate It has an asymmetrical first curved portion and a second curved portion. A part of the light emitted by the LED chip 2201 is directed to the first curved portion, and a portion of the light is directed to the second curved portion, so that the lamp can emit light evenly; in one embodiment, the surface of the light guide plate can be formed Dot-shaped diffusers to achieve uniform light emission on the light-emitting surface; in one embodiment, the light guide plate includes a main light portion that guides the light emitted from the LED chip 2201 to the periphery of the light guide plate, and guides and scatters the light from the LED chip 2201 toward the central portion of the lamp. Auxiliary light guide part for light; in one embodiment, the light guide plate includes an introduction unit that introduces light into the interior of the lamp and a lead-out unit that guides light to the outside of the lamp, which can suppress uneven brightness and glare of the light guide plate; in one embodiment , the light guide plate has an inner side and a corresponding outer side, and the radius of curvature of the inner side is larger than that of the outer side, which can prevent bright spots from appearing on the lampshade; in one embodiment, there are multiple groups of LED chips on the circuit board. 221. The LED chip set 221 includes a plurality of LED chips 2201. The light-emitting surface of the LED chips 2201 faces the incident end face of the light guide plate. The first LED chip group, the second LED chip group, and the third LED chip group are installed in a straight line in order from the edge of the direction toward the center line. The first phase is set between the edge of the circuit board 201 and the first LED chip group. The distance between the first LED chip group and the second LED chip group is the second distance L2, the distance between the second LED chip group and the third LED chip group is the third distance L3, L1<L2< L3, the light guide plate is not easy to produce dark parts; in one embodiment, the light guide plate has a light-transmitting base material, a plurality of concave prism parts are arranged on the main surface of the light-transmitting base material, and the concave prism parts are covered with a coating to prevent dust accumulation In the main surface and within the prism portion, the coating thickness is sufficiently small to suppress the degradation of the optical performance of the light guide plate. The arrangement of the above-mentioned light guide plate can be combined with the arrangement of the aforementioned LED chips on the circuit board that are not mutually exclusive.

In one embodiment, the circuit board 201 is annular, such as the circuit board 201 of the optoelectronic module 2b in the foregoing embodiment, a light guide plate may be provided between the lampshade 1 and the first insulating portion 202, and the light-emitting surface of the LED chip 2201 faces In the center of the lamp, the light guide plate can adopt different structures. In one embodiment, the thickness of the light guide plate is inclined, and its thickness gradually decreases from the peripheral part to the center part, so that the brightness of the light guide plate is uniform; in one embodiment, the circuit board 201 There are a first LED chip group and a second LED chip group on it, the first LED chip group is incident from the incident end face of the first light guide plate, the second LED chip group is incident from the incident end face of the second light guide plate, and the incident light is directed toward the first light guide plate. The upper and lower surfaces of a light guide plate and a second light guide plate emit light, and the first light guide plate and the second light guide plate have light transmittance along their thickness directions, so that the lamp has a three-dimensional lighting effect; in one embodiment, the ring circuit The plate 201 is sequentially covered with a reflector, a light guide plate and a light collecting cover. The convex part of the light guide plate is inserted into the concave part of the reflecting cover. The light collecting cover has a lens area covering the exit surface inside the light guide plate. The lens area and the light guide plate The concave reflectors are located in optically opposite positions, so that the light emitted by the luminaire has a narrow orientation.

The bases in the LED lamps of the present application can adopt different structures. FIG. 45 is a schematic structural diagram of an embodiment of the bases in the LED lamps of the present application. The bases are located in a space rectangular coordinate system (x, y, z), where the z-axis and the The central axis of the LED lamp is parallel, and the base 3 is disc-shaped, for example, made of aluminum plate or steel plate. 34 and the edge part 35, there is a gap between the support part 34 and the edge part 35, the gap extends along the negative direction of the z-axis to form a groove part 36, the support part 34 and the edge part 35 are in the same position in the positive direction of the z-axis, of course, in other In the embodiment, the support portion 34 and the edge portion 35 are located at different positions in the positive z-axis direction. For example, the height of the support portion 34 in the positive z-axis direction is greater than that of the edge portion 35 . The photoelectric module 2 has an upper surface and a lower surface opposite to the upper surface, the lower surface of the photoelectric module 2 is away from the lampshade 1, and the lower surface of the lampshade 1 is in surface contact with the support portion 34, so that the heat generated by the photoelectric module passes through The base is passed out to improve the heat dissipation speed. In other embodiments, the optoelectronic module 2 and the support portion 34 are not in a fully attached surface contact state, and there will be a part of the gap between the optoelectronic module 2 and the support portion 34, and some thermally conductive adhesive layers can be filled in the gap. The heat generated by the chip 2201 during operation can be quickly delivered to the base 3 through the circuit board 201 and the thermally conductive adhesive layer, thereby improving the heat dissipation capability.

In one embodiment, a brightness sensor may be provided on the base 3, and the installation position of the brightness sensor is set at a position where there is no direct light from the lamp, and the lighting conditions of the lamp are continuously adjusted according to the increase in brightness caused by the external light, so as to achieve Save energy and reduce environmental load while appropriately suppressing excessive power consumption. In one embodiment, the base 3 is provided with reinforcing ribs, thereby increasing the strength of the base and reducing the thickness of the base.

The user usually sets the time to wake up the user through the remote control. In order to confirm that the lamp has received the signal from the remote control, the electronic sound of the buzzer is generally used to remind the user, but the buzzer is generally configured on both sides. For the circuit board with wiring on one side, the sound generating element needs to be installed on the side of the circuit board close to the ceiling. Due to the blockage of the circuit board, the sound emitted by the sound generating element is transmitted to the user at a low volume. In one embodiment, the base 3 is provided with an opposite portion facing the circuit board 201, the circuit board 201 is provided with an opening corresponding to the opposite portion, and the sound generating element is installed on the surface of the different side from the LED chip 2201 On the other hand, when the sound generating element generates sound, the sound is reflected by the opposite part and then propagates through the opening, so as to ensure that the user can obtain the desired volume.

47 is a schematic structural diagram of an embodiment of the optoelectronic module of the present application. Referring to FIGS. 45 to 48 , the optoelectronic module 2 is provided with a power module 23 at a position relative to the groove 36 , and the power module 23 includes a first The power module 231 and the second power module 232. The height of the second power module 232 in the positive direction of the Z axis is greater than the height of the LED chip 2201. After the ceiling lamp is installed, the second power module 232 is located in the groove of the base. In 36, it is preferable that the second insulating portion 203 is in contact with the side wall of the groove portion 36 to increase the contact area and improve the thermal conductivity. Since there is no need for a storage space such as a second power module on the base, the LED lamp can be thinned (that is, the height in the Z-axis direction is shortened), and the cost of packaging and inventory is reduced. In addition, the photoelectric module can be kept away from The lampshade increases the amount of light from the light source module reaching the edge of the lampshade. In other words, when the lampshade is viewed in plan, the edge of the lampshade can be brightly illuminated. As a result, light emitted from, for example, LED lamps can be irradiated over a wider range.

49 is a schematic structural diagram of an embodiment of an LED lamp of the present application. Referring to FIGS. 49 , 50A to 50B, 51 and 52A to 52C, the light source module includes a first chip area 2211 and a second chip area 2212, at least a part of which is The power module 23 is located between the first chip area 2211 and the second chip area 2212 . In some embodiments, the circuit board 201 includes a first side 2011 and a second side 2012 opposite to each other, and the first side 2011 is provided with a first chip area 2211 and a second chip area 2212 , and the first chip area 2211 and the second chip The area 2212 includes at least one LED chip 2201, and the power module 23 includes a first power module 231 and a second power module 232, which are respectively located on the first side 2011 and the second side 2012 of the circuit board 201. The first power module 231 is located between the first chip area 2211 and the second chip area 2212 in the radial direction of the circuit board 201 (the first power module 231 is also located on the first side 2011 ), and the power module 23 includes a power supply unit 3a, a booster unit 3b, step-down unit 3c, power supply unit 3a includes a first drive element 3a1, step-down unit 3c includes a second drive element 3c1, boost unit 3b includes a third drive element 3b1, first drive element 3a1, second drive element 3c1 and the third driving element 3b1 are located on the first surface 2011 of the circuit board 201. After the LED lamp is turned on for t (t≥0.5) hours, the temperature of the first driving element 3a1 and the temperature of the third driving element 3b1 are lower than that of the second driving element The temperature of 3c1, preferably the temperature of the first driving element 3a1 is lower than the temperature of the third driving element 3b1, that is, the temperature of the first driving element 3a1<the temperature of the third driving element 3b1<the temperature of the second driving element 3c1. The second driving element 3c1 is closer to the second chip area 2212 than the first driving element 3a1, and the third driving element 3b1 is farther away from the second chip area 2212 than the second driving element 3c1. The driving elements in the power module are designed to be dispersed. Reduce the influence of its heat on the first chip area and the second chip area.

In this embodiment, the first chip area 2211 has a first edge S1 and a second edge S2 opposite to each other, the first edge S1 is close to the central axis of the LED lamp, and at least one of the first chip area 2211 close to the first power module 231 The surfaces of the two LED chips 2201 are in contact with the second edge S2, the second chip area 2212 has a third edge S3 and a fourth edge S4 opposite to each other, and the second edge S2 is located between the first edge S1 and the third edge S3, The third edge S3 is located between the second edge S2 and the fourth edge S4, and the first edge S1, the second edge S2, the third edge S3 and the fourth edge S4 respectively form a figure (such as a circle, an ellipse, etc.) ) in the order of C1, C2, C3 and C4, C1<C2<C3<C4. The surfaces of at least two LED chips 2201 in the second chip area 2212 close to the first power module 231 are in contact with the third edge S3, the distance from the first edge S1 to the second edge S2 is d1, and the first edge S1 and the third edge S3 are in contact with each other. The distance between the three edges S3 is d2, the distance between the first edge S1 and the fourth edge S4 is d3, d1+d2<d3, preferably 2d1+d2<d3, the first chip area is close to the central part of the circuit board, which can effectively reduce the number of lamps In addition, the first chip area is far away from the first power module, which reduces the influence of the first power module on the first chip set.

A second accommodating space is formed between the first insulating portion 202 and the base 3 , the second accommodating space is located in the first accommodating space, the circuit board 201 is located in the second accommodating space, and the first insulating portion 202 includes a light processing unit 202b and isolation unit 202c. When the light source module emits light, some or all of the light will pass through the light processing unit 202b, and the light processing unit 202b is used to control the uniformity of the light output of the LED lamps. The isolation unit 202c includes a first area 202c1 and a second area 202c2, the light processing unit 202b connects the first area 202c1 and the second area 202c2, and in the radial direction of the first insulating portion 202, the first area 202c1 and the second area 202c2 Relative settings. In one embodiment, the extending direction of the second area 202c2 intersects with the direction of the central axis of the LED lamp. This inclined design can increase the force-bearing area of the second area and increase the resistance to deformation. Preferably, the second area 202c2 The included angle with the central axis direction of the LED lamp is 0 degrees to 80 degrees, and preferably, the included angle between the second region 202c2 and the central axis direction of the LED lamp is 30 degrees to 60 degrees.

The first insulating portion 202 is provided with at least one fixing unit. The fixing unit is used to fix the circuit board 201. The fixing unit may be a fixing form such as a buckle or a screw connection. between the isolation units 202c.

53A is a schematic diagram of an optoelectronic module according to an embodiment. Please refer to FIGS. 53A to 53H . The fixing unit includes at least one first fixing unit 2027a and/or at least one second fixing unit 2027b. The first fixing unit 2027a The same structure as the second fixing unit 2027b may be adopted. Of course, in some embodiments, the first fixing unit 2027a and the second fixing unit 2027b may adopt different structures. In this embodiment, the first fixing unit 2027a is located between the second area 202c2 and the optical processing unit 202b, the second fixing unit 2027b is located between the first area 202c1 and the optical processing unit 202b, and the circuit board 201 includes the opposite first side The portion 201b and the second side portion 201c, in the above embodiment, the first edge S1 may correspond to the first side portion 201b, and the fourth edge S4 may correspond to the second side portion 201c. The first chip area 2211 and the second chip area 2212 are located between the first side portion 201b and the second side portion 201c, the first fixing unit 2027a extends toward the central axis of the LED lamp, and the second fixing unit 2027b extends away from the center of the LED lamp The first fixing unit 2027a includes a first fixing surface 2027a1, and the circuit board 201 is located between the first fixing surface 2027a1 and the first insulating portion 202, thereby fixing the second side portion 201c of the circuit board 201, and the second fixing The unit 2027b includes a second fixing surface 2027b1, and the circuit board 201 is located between the second fixing surface 2027b1 and the first insulating portion 202, so as to fix the first side portion 201b of the circuit board 201, and both sides of the circuit board 201 are fixed on the fixing unit by the fixing unit. In the first insulating portion 202, the stability of the circuit board is improved. In this embodiment, the first fixing surface 2027a1 and the second fixing surface 2027b1 are located on the same horizontal plane, but not limited thereto. The distance between the first fixing unit 2027a and the second fixing unit 2027b is smaller than the distance between the first side portion 201b and the second side portion 201c, so as to provide a stable support for the circuit board. In some embodiments, the first fixing unit The surface 2027a1 and the second fixing surface 2027b1 are in contact with the circuit board 201. The hardness of the parts of the first fixing unit 2027a and the second fixing unit 2027b that are in contact with the circuit board 201 is greater than that of other parts that are not in contact with the circuit board 201. The effect of fixing the circuit board.

In other embodiments, only the first fixing unit 2027a or the second fixing unit 2027b may be used to fix the circuit board 201, as shown in FIGS. 50A to 50B, 51 and 52A to 52C. In this embodiment, only the The first fixing unit 2027a fixes the circuit board 201, and the structure of the first fixing unit 2027a mentioned above will not be repeated here. The first insulating portion 202 is provided with a third opening 2025c, the third opening 2025c is connected to the first fixing surface 2027a1, the circuit board 201 is located between the first fixing unit 2027a and the first insulating portion 202, and the first insulating portion 202 Exposing a part of the circuit board 201 can dissipate a part of the heat generated by the second chip area, thereby reducing the temperature of the electronic components on the first surface of the circuit board.

As shown in FIG. 50A , the first insulating portion 202 includes at least one first opening 2025a and at least one second opening 2025b. The first opening 2025a and the second opening 2025b are located in the first region 202c1 and the second region 202c2, respectively. The first opening 2025a and the second opening 2025b make the second accommodating space communicate with the outside, so that the heat generated when the electronic components on the circuit board work are dissipated through the first opening and the second opening.

As shown in FIGS. 49 , 50A to 50C, FIGS. 51 , and 52 to 52C, in one embodiment, the first area 202c1 includes an isolation plate 2028, and the isolation plate 2028 includes an opposite end and a second end, and the first end is close to the light treatment The unit 202b, the isolation plate 2028 is arranged around the circumference of the first area 202c1 and extends towards the central axis of the LED light fixture. In the height direction of the LED lamp, there is a first height difference between the isolation plate 2028 and the light processing unit 202b. After the first insulating part 202 is fixed on the base 3, there is a first height difference between the base 3 and the isolation plate 2028 in the height direction of the LED lamp. Two height differences, due to the existence of the first height difference and the second height difference, the adapter 5 can be located at the first end or the second end of the isolation plate 2028 to meet different installation requirements of users. In one embodiment, the first opening 2025a communicates with the first end of the isolation plate 2028 and the second end of the isolation plate 2028. In the height direction of the LED lamp, the height of the first opening 2025a is greater than the height of the circuit board 201, and the first opening 2025a and the third opening 2025c form a first heat dissipation path, the first opening 2025a and the second opening 2025b form a second heat dissipation path, and the first surface 2011 of the circuit board 201 and the circuit board 201 are exposed to the first heat dissipation path and the second heat dissipation path through the first heat dissipation path and the second heat dissipation path. The second surface 2012 of the radiator is used for heat dissipation, which improves the service life of the power module and the light source module. In one embodiment, in the height direction of the LED lamp, the isolation plate 2028 and the circuit board 201 have a height difference, which can improve the heat dissipation effect on the circuit board. In one embodiment, there is a gap between the first opening 2025a and the circuit board 201 , the second opening 2025b is located in the groove portion 36 of the base 3 , and the first insulating portion 202 forms a heat dissipation path through the first opening 2025a and the second opening 2025b , the electronic components on the circuit board are dissipated, and the service life of the power module and the light source module is improved. In one embodiment, the second end of the isolation plate 2028 may be provided with at least one reinforcement portion 2028a to increase the structural strength of the first region 202c1.

54N, a first sub-region 202c3 is formed between two adjacent first openings 2025a, the number of the first sub-regions 202c3 is one less than the number of the first openings 2025a, and each first sub-region 202c3 has at least one reinforcement Section 2028a.

Please refer to FIG. 54A to FIG. 54N. The structure of the circuit board in FIG. 54A to FIG. 54N is the same as that of the circuit board shown in FIG. 51. In combination with FIG. 51 and FIG. 54A to FIG. 54N, the LED lamp includes a connector connected to the power supply unit 3a. The terminal 24, the connector terminal 24 is electrically connected to the power supply unit 3a through the wire 241, the first insulating part 202 is provided with a wiring unit 202d, which is used to fix the wire 241 and protect the wire from pulling, and the wiring unit 202d includes a light The first wire slot 202b1 on the processing unit 202b, the second wire slot 202c4 in any of the first sub-regions 202c3, the fourth opening 202c5 communicating with the first wire slot 202b1, and the fifth opening 2028b on the isolation plate 2028, the fourth The opening 202c5 communicates with the fifth opening 2028b, the first wire slot 202b1 communicates with the second wire slot 202c4, and the wire 241 passes through the first wire slot 202b1 and the second wire slot 202c4 and then passes through the fourth opening 202c5 and the fifth opening 2028b.

In one embodiment, please refer to FIGS. 54A to 54N , the fixing unit 2027 further includes at least one positioning post 2027c, and the positioning post 2027c is located between the light processing unit 202b and the second area 202c2 and extends toward the direction close to the first area 202c1 , the circuit board 201 is provided with at least one positioning opening 201d. During installation, the positioning opening is aligned with the positioning post 2027c, so as to preliminarily determine the installation position of the circuit board.

In one embodiment, please refer to FIGS. 54A to 54N, the fixing unit 2027 further includes at least one first step 2027d. The first step 2027d is located on the light processing unit 202b and extends toward the direction close to the first area 202c1, so that the light source can be There is a certain distance between the module and the light processing unit, which can limit the installation of the circuit board and prevent the circuit board from being over-pressed, so that the LED chip interferes with the first insulating part, which affects the use. In one embodiment, the fixing unit 2027 may further include at least one second step 2027e. The second step 2027e is located on the light processing unit 202b and extends away from the first area 202c1. Only the first step 2027d or the second step 2027e may be provided, or both the first step 2027d and the second step 2027e may be provided.

Referring to FIG. 49 and FIGS. 50A to 50C , the first insulating portion 202 further includes a transition portion 2026 , and the first insulating portion 202 is connected to the base 3 through the transition portion 2026 . In one embodiment, the connecting unit 202e includes a transition portion 2026, the transition portion 2026 is located on the second area 202c2, and the transition portion 2026 is connected to the base 3 through a fixing structure, and the fixing structure may be a snap-on structure or a bolt structure (thread and screw) , buckle structure or magnetic structure, etc. The specific transition portion 2026 is connected to the mounting portion 31 on the base 3 through a fixing structure. If the base structure shown in FIG. 45 is adopted in FIG. 49, in combination with FIGS. 45, 49 and 50A to 50C, there is a gap between the transition portion 2026 and the groove portion 36 (in the radial direction of the LED lamp, the transition portion The groove portion is not fully filled), so that the heat flow generated by the LED lamp can be increased, and the temperature of the electronic components in the LED lamp can be reduced. In one embodiment, the transition portion 2026 includes a connection area 2026a and a reinforcement area 2026b. The connection area 2026a extends from the second area 202c2 toward the edge portion 35, and the connection area 2026a has the highest point and the lowest point in the height direction of the LED lamp. , the lowest point is in contact with the groove part 36 , thereby increasing the contact area between the first insulating part and the base, and improving the fixing effect of the photoelectric module. The reinforcement area 2026b extends from the second area 202c2 to the direction close to the edge portion 35. The reinforcement area 2026b connects the second area 202c2 and the connection area 2026a, thereby improving the mechanical strength of the transition portion. A part of the above-mentioned fixing structure may be located in the connection area 2026a.

As shown in FIGS. 50A to 50C , FIGS. 51 , and 52 to 52C, the light processing unit 202b includes a first light processing area 2a, a second light processing area 2b and a third light processing area 2f, and the first light processing area 2a corresponds to The first chip area 2211 and the second light processing area 2b correspond to a part of the power module. In this embodiment, the second light processing area 2b corresponds to the first power module 231 and the third light processing area 2f corresponds to the second chip In the region 2212, in one embodiment, the cross section of the first light treatment region 2a and/or the third light treatment region 2f is different from that of the second light treatment region 2b, and the light treatment unit 202b may be the aforementioned light absorption region or lens unit, In this embodiment, the second chip area 2212 includes two groups of LED chip groups 221 , a sub-light processing area can be designed corresponding to each group of LED chip groups 221 , and the first insulating portion 202 corresponds to the first chip area 2211 , the first The power module 231 is respectively provided with a first light treatment area 2a and a second light treatment area 2b, and the first insulating portion 202 is provided with a third light treatment area 2f and a third light treatment area 2f corresponding to the second chip area 2212 The

sub-light processing areas

2c and 2d are included. In one embodiment, the optical processing area 2b can be subjected to frosting treatment. The refractive index of the optical processing area 2b is smaller than that of the optical processing area 2a, the

sub-light processing areas

2c and 2d. The first chip area and Part of the light emitted by the second chip area will be reflected to the light treatment area 2b, and the light treatment area 2b is subjected to frosting treatment, so that the lamp has a relatively uniform light distribution. Referring to FIGS. 54A to 54N , the above-mentioned first wire groove 202b1 is located in the first photo-processing area 2a. In some embodiments, the light processing unit can be frosted to improve the light extraction effect of the LED lamp, or the first insulating part can be frosted to improve the appearance of the first insulating part and the light extraction effect of the LED lamp. In some embodiments, in the height direction of the LED lamp (for example, the positive direction of the Z axis shown in FIG. 49 ), the height of the second light treatment area 2b is greater than or equal to the height of the first light treatment area 2a and the third light treatment area 2f On the one hand, in the height direction of the LED lamp, the height of some electronic components in the first power module is greater than the height of the LED chip, and the second light processing area 2b can better cover the first power module; on the other hand , part of the light emitted by the first chip area 2211 and the second chip area 2212 will be emitted to the second light processing area 2b, and part or all of this part of the light will be refracted by the second light processing area 2b, thereby avoiding the first chip area 2211, the second light processing area 22b. A dark area appears in the second chip area 2212 .

The distance from the first chip area 2211 to the base 3 is smaller than the distance from the second chip area 2212 to the base 3 , and the distance between adjacent LED chips in the first chip area 2211 is smaller than the distance between adjacent LED chips in the second chip area 2212 . Since the first chip area 2211 is closer to the base 3 and the first opening 2025 a than the second chip area 2212 , the heat generated by the first chip area 2211 is easier to dissipate than the second chip area 2212 .

Referring to FIGS. 53A to 53H, the second chip area 2212 includes at least one group of LED chip groups. One of the differences between this embodiment and the optoelectronic module shown in FIG. 50 is that the second chip area 2212 includes three groups of LED chip groups, respectively The first LED chip group 221a, the second LED chip group 221b and the third LED chip group 221c are respectively located on different circumferences. An LED chip set 221a, a second LED chip set 221b and a third LED chip set 221c each include at least one LED chip 2201, and the second LED chip set 221b is located between the first LED chip set 221a and the third LED chip set 221c. In one embodiment, the number of LED chips in the second chipset 221b is smaller than the number of LED chips in the first chipset 221a and the number of LED chips in the third chipset 221b, preferably, the number of LED chips in the second chipset 221b < the number of LED chips in the first chipset 221a The number<the number of LED chips in the third chip group 221c can make the light distribution in the second chip area more uniform and reduce the area of the dark area. In one embodiment, the spacing between adjacent LED chips of the second chip group 221b is greater than the spacing between adjacent LED chips of the first chip group 221a and the third chip group 221b, and the spacing between adjacent LED chips of the second chip group 221b The larger spacing can reduce the mutual influence between the heat generated by adjacent LED chips in the second chip area. An LED chip is adjacent. There _is a center point O ₁ , O ₂ , . Q ₁ , Q ₂ , ..., Q _m (m≥1), n, m are all integers, the distance between O ₁ and Q ₁ is smaller than the distance between O ₁ and Q _m (m>1), the center The connection line between the point O _2n-1 and the center point Q _3m-2 (n=m, n, m≧1, n, m is an integer) passes through at least one LED chip 2201 of the second chip set 221b. While increasing the luminous flux of the LED lamp, it can not only avoid dark areas in the first chip area 2211 and the second chip area 2212, but also reduce the phase difference between the first LED chip set 221a, the second chip set 221b, and the third chip set 221c. The heat generated by adjacent LED chips affects each other.

54A to 54N, in one embodiment, the number of LED chips in the first chipset 221a and the second chipset 221b is smaller than the number of LED chips in the third chipset 221c, preferably the number of LED chips in the first chipset 221a is equal to the number of LED chips in the first chipset 221a. The number of LED chips in the second chip group 221b is smaller than that of the third chip group 221c, which can make the light distribution in the second chip area more uniform and reduce the dark area area. In one embodiment, the spacing between adjacent LED chips of the second chip group 221b is greater than the spacing between adjacent LED chips of the first chip group 221a, and the spacing between adjacent LED chips of the second chip group is larger, which can be reduced The heat generated by adjacent LED chips in the second chip area affects each other. Preferably, two LED chips in the first chip group 221a and the third chip group 221c are adjacent to one LED chip in the second chip group 221b. There is a center point O ₁ , O ₂ , . ₁ , Q ₂ , ..., Qm (m≥1), n, m are integers, the distance between O ₁ and Q ₁ is less than the distance between O ₁ and Qm (m>1), the center point O _n The connection with the center point Q _2m-1 (n=m, n, m≧1, n, m is an integer) passes through at least one LED chip 2201 of the second chip set 221b. While increasing the luminous flux of the LED lamp, it can not only avoid dark areas in the first chip area 2211 and the second chip area 2212, but also reduce the amount of light in the first LED chip set 221a, the second chip set 221b, and the third chip set 221c. The heat generated by adjacent LED chips affects each other. In one embodiment, the optoelectronic module 2 further includes a connector terminal 24, which is electrically connected to an external power source (eg, commercial power) for receiving an external power signal and transmitting the power signal to the LED lamps. 24 Connect the electronic components on the circuit board 201 through the wires 241, the connection points between the wires 241 and the circuit board 201 are located on the first side 2011 of the circuit board 201, and the connection points between the wires 241 and the circuit board 201 are located in the first chip area 2211 and the second Between the chip areas 2212, the power signal transmission distance is short, the power loss is small, and the power is stable. In one embodiment, at least one of the wires connecting an LED chip in the first chip area 2211 and an LED chip 2201 in the second chip area 2212 passes through the electrical connection point between the wire 241 and the circuit board 201 (if there is more than 1 the electrical connection point, then at least one of the electrical connection points), since the electrical connection point is located on the connection line between an LED chip in the first chip area and an LED chip in the second chip area, the first chip area and the second chip area The light emitted from the area prevents dark spots or dark areas in the area of the lampshade that corresponds to the electrical connection point.

The LED lamp may further include secondary light sources 2203 and main light sources, the number of which is greater than the number of secondary light sources. When the primary light source is not emitting light, the secondary light source can emit light to provide illumination. For example, when going to bed at night, turn off the main light source, the secondary light source will be on for a period of time, or the user selects the secondary light source to provide a sense of security in lighting. The secondary light source may include night light bulbs and/or afterglow bulbs. In one embodiment, the secondary light source 2203 is located outside the second edge S2 of the first chip area 2211 or inside the fourth edge S4 of the second chip area 2212 , or the secondary light source 2230 is located between the first chip area 2211 and the second chip area Between 2212 , in some embodiments, the connection between the wire 241 and the electrical connection point of the circuit board 201 and the secondary light source 2203 passes through at least one LED chip 2201 in the first chip area 2211 . In one embodiment, the shortest distance from the secondary light source 2203 to the first chip area 2211 is smaller than the distance from the secondary light source 2203 to the second chip area 2212 , which can improve the light emitting effect of the secondary light source 2203 from the lampshade. In one embodiment, the first chip area 2211 and/or the second chip area 2212 includes at least two different LED chips (LED chip a ₁ , LED chip a ₂ , LED chip a ₃ , . . . , LED _chip an , n represents the number of types of LED chips), different LED chips (LED chip a ₁ , LED chip a ₂ , LED chip a ₃ , ..., LED chip a _n , n represents the number of types of LED chips, n is an integer) for example Different specifications, different color temperatures or different luminous flux, etc., can also be different parameters of LED chips. In one embodiment, the first chip area 2211 includes LED chip a ₁ , LED chip a ₂ and LED chip a ₃ , the second chip area 2212 includes LED chip a ₁ , LED chip a ₂ , wherein the LED chips on the circuit board are The total number of a ₁ is greater than the total number of LED chips a ₂ , for example, LED chip a ₁ is a high color temperature LED chip, and LED chip a ₂ is a low color temperature LED chip. The color temperature is fully mixed, and the overall color temperature can be adjusted by adjusting the driving current ratio of the two color temperature chips. In one embodiment, the number of LED chips a1 in the first chip area 2211 is smaller _than the number of LED chips a1 and/or LED chips a2 in the _second chip area 2212; in _one embodiment, the first chip area 2211 and /or the number of LED chips a ₁ in the second chip area 2212 is smaller than the number of LED chips a ₂ on the circuit board 201 . _In _one embodiment, the number _of LED chips a1 and/or LED chips _a2 is greater _than the number of LED chips a3. a ₃ may be the above-mentioned secondary light source.

In some embodiments, the LED luminaire includes at least one set of LED chip sets (LED chip set b ₁ , LED chip set b ₂ , LED chip set b ₃ , . . . , LED chip set b _m , where m is an integer), each The LED chip set includes at least one LED chip, and each LED chip set is located on the circuit board 201 . In this embodiment, each LED chip set is located on the first surface of the circuit board 201 , and the LED chips of the same LED chip set are located on or approximately on the same circumference. (arranged around the opening of the circuit board 201,) the LED chips of each LED chip group are located on different circumferences, and are arranged around the same or approximately the same central axis, which can be the central axis of the circuit board 201, or the hanging the central axis of the adapter or adapter. A part of the power module (eg, the first power module) is located between adjacent LED chip groups in the radial direction of the circuit board 201 . At least one of the LED chip sets includes a primary light source and a secondary light source, and the luminous flux when the secondary light source is lit can be configured to be 0.1%-10% of the luminous flux when the primary light source is lit. When the primary light source is not emitting light, the secondary light source can emit light to provide illumination. For example, when going to bed at night, turn off the main light source, the secondary light source will be on for a period of time, or the user selects the secondary light source to provide a sense of security in lighting. The secondary light source may include night light bulbs and/or afterglow bulbs. The number of primary light sources is greater than the number of secondary light sources, and the distance between adjacent primary light sources is greater than or equal to the distance between adjacent primary light sources and secondary light sources. In one embodiment, the central angle opposite the adjacent main light sources is greater than or equal to the central angle opposite the adjacent main light sources and the secondary light sources. In some embodiments, the same chip set includes n LED chips, the central angle between adjacent LED chips or the average central angle a between adjacent LED chips is (360/n) degrees, and the wires 241 are connected to the circuit board. The connection line between the electrical connection point 201 and the circle center o forms a line La, the connection line between the secondary light source and the circle center o forms a line Lb, and the included angle between the line La and the line Lb ranges from 0.3*a to 5*a. In some embodiments , the angle between the line La and the line Lb ranges from [360/(n+3)] degrees to [360/(n-5)] degrees, and the wiring distance from the secondary light source to the connector terminal is short and the distance between the secondary light source and the secondary light source is short. The heat generated by the adjacent LED chips has less influence on the secondary light source. In one embodiment, the LED lamps include LED chip set b ₁ , LED chip set b ₂ , LED chip set b ₃ , LED chip set b ₄ , according to the radius from small to large, that is, the LED chip set b ₁ is compared with the LED chip set b ₂ , the LED chip set b ₃ , the LED chip set b ₄ is close to the opening 222 of the circuit board 201 , in this embodiment, the LED chip set b ₁ includes a secondary light source, and the wiring distance from the secondary light source to the connector terminal 24 is short , the resistance of the wire is small, so the power loss during operation is low, and the signal transmission is stable. In its embodiment, the LED chip set _b4 includes a secondary light source. Since the LED chip set b4 is far away from the hanger or adapter, the light generated when the secondary light source is turned on is not easily absorbed by the hanger or the adapter, so the light loss is low.

53A to 53H, the light processing unit 202b includes a first light processing area 2a, a second light processing area 2b and a third light processing area 2f. The first light processing area 2a corresponds to the first chip area 2211, and the second light processing area 2a corresponds to the first chip area 2211. The processing area 2b corresponds to a part of the power module. In this embodiment, the second light processing area 2b corresponds to the first power module 231, the third light processing area 2f corresponds to the second chip area 2212, and the light processing unit 202b may be the aforementioned In this embodiment, the second chip area 2212 includes three groups of LED chip groups, corresponding to each group of LED chip groups 221a, 221b, 221c can be designed a sub-light processing area, the first insulating part 202 On the top, corresponding to the first chip area 2211 and the first power module 231 are respectively provided with light processing areas 2a, 2b, the third light processing area 2f includes sub-light processing areas 2c, 2d and 2e, and the sub-light processing areas 2c, 2d and 2e respectively correspond to the LED chip groups 221a, 221b, 221c in the second chip area, the sub-light processing areas 2a, 2c, 2d and 2e include a lens 202a disposed opposite to the LED chip 2201, and the light processing area 2b includes at least one left inclined portion 2b1 and at least one right inclined part 2b2, the left inclined part 2b1 is connected with the right inclined part 2b2, the left inclined part 2b1 and the right inclined part 2b2 can be connected to form a V shape or an inverted V shape, and the external light passes through the light processing area 2b At the time, part of the light is reflected by the left inclined portion 2b1 and the right inclined portion 2b2, thereby reducing the visibility of the first power module 231 and improving the appearance of the LED lamp. After the light emitted by the adjacent LED chips is refracted by the lens 202a, part of the light passes through the first insulating portion 202 through the left inclined portion 2b1 and the right inclined portion 2b2, thereby further reducing the distance between the first chip area 2211 and the second chip area 2212. dark area in between. The light processing area 2b is provided with at least one extension portion 2b3, and the extension portion 2b3 is in contact with at least one left inclined portion 2b1 and at least one right inclined portion 2b2. The circuit board 201 is provided with a through hole 201a opposite to the extension portion 2b3. 2b3 passes through the through hole 201a on the circuit board 201, thereby fixing the relative position of the circuit board 201 and the first insulating portion 202, and preventing the circuit board 201 from rotating in the circumferential direction.

The base can also adopt other different structures. In one embodiment, the diameter of the base 3 is larger than the diameter of the lampshade 1, and the sub-light-emitting part is provided in the area outside the lampshade 1 on the base 3, which can effectively improve the illumination range of the lamp. In one embodiment, the base 3 is provided with a pad, and a plurality of convex portions protrude from the surface of the pad, and the lampshade 1 is provided with a concave portion corresponding to the convex portion, and the depth of the concave portion is greater than the height of the convex portion protruding from the surface of the pad, When the convex portion is fitted into the concave portion, the peripheral edge of the lampshade 1 is pressed against the gasket, and the gap between them is eliminated, so that insects can be effectively prevented from entering the lampshade.

55 and FIG. 56 are schematic structural diagrams of an embodiment of the LED lamp of the application. The LED lamp includes a lampshade 1, a photoelectric module 2, and a base 3. Its basic structure is the same as that of the previous embodiment, and the description is not repeated here. The difference is: This LED lamp adopts the above-mentioned photoelectric module 2b. The structure of the photoelectric module 2b refers to the above-mentioned embodiment. As shown in Figure 55 and Figure 56, the LED lamp is located in a space rectangular coordinate system (X, Y, Z), and the Y axis Parallel to the central axis of the LED luminaire, the LED luminaire further comprises a chassis 6, the chassis 6 is connected to the base 3, the reflector 29 has an end point A and a vertex B, and the end point A is located between the LED light source module 22 and the power module 23, Vertex B is the highest point in the reverse direction of the Z axis, then the height of the reflector 29 (or the distance from the vertex B to the endpoint A in the Z axis direction) z=(a ² +b ² -2abcosα) ^1/2 *sinβ, a is the straight-line distance from the LED chip 2201 to the vertex A; b is the straight-line distance from the LED chip 2201 to the vertex B; The light-emitting angle of the chip 2201 is 0<α<120°; β is the included angle between the straight line AB (the line connecting the endpoint A and the vertex B) and the X-axis direction. By designing a and β, the height of the reflective member can be adjusted to obtain excellent reflective effect and thus better light distribution. In one embodiment, the reflector 29 is arched in the direction away from the power module 23 (ie, the negative direction of the y-axis), which can increase the cooling space of the power module on the one hand; to the role of insulation to prevent electric shock. In one embodiment, the power module 23 may be fixed on the base 3 by gluing or snapping. In one embodiment, as shown in FIG. 56 , the base 3 may be provided with a groove 32 . The electrical components (such as inductors, capacitors, etc.) can be located in the grooves 32, and the grooves can increase the heat dissipation space for the electrical components, and can also shorten the heat dissipation path, thereby reducing the temperature of the power module.

The LED chip 2201 includes LED lamp beads. As shown in Figure 57, the light emitted by the LED lamp beads will pass through four interfaces C, D, E and F. The C interface is the interface between the packaging layer of the LED lamp beads and the air, and the D interface is The interface between the air and the light-emitting element, the E interface is the interface between the air and the lampshade, and the F interface is the interface between the lampshade and the air. Set the refractive index of the encapsulation layer of the LED lamp bead as n1, the refractive index of the lampshade as n2, and the refractive index of the air as n3. In order to improve the utilization rate of light, the main purpose is to reduce the reflection of the C, E and F interfaces, and to improve the D reflection of the interface. The reflection at the C, E and F interfaces will reduce the luminous flux of the LED lamp, so it is necessary to select the material of the LED lamp bead packaging layer and lampshade. At normal incidence, 1-(n1-1) ² /(n1+1) ² -(n2-1) ² /(n2+1) ² >0.9 can be set. By selecting materials with appropriate refractive index, it can be effectively improved Luminous flux of LED lamps.

In addition, since both n1 and n2 are greater than n3, when the incident angle is greater than the critical angle, total reflection will occur. In order to reduce the reflection of the C interface and the E interface, a first refractive index can be set on the surface of the LED chip 2201 and the inner surface of the lampshade respectively. matching layer and second refractive index matching layer, the refractive index of the first refractive index matching layer n4=(n1*n3) ^1/2 , the refractive index of the second refractive index matching layer n5=(n2*n3) ^1/2 , In one embodiment, the range of n1 is 1.4-1.53, then the range of n4 is 1.18-1.24; in one embodiment, the range of n2 is 1.5-1.7, the range of n5 is 1.22-1.3, and 0.16≤n1- n4≤0.35, 0.18≤n4-n3≤0.24; 0.2≤n2-n5≤0.48, 0.22≤n5-n1≤0.3, it can be seen that after setting the first index matching layer and the second index matching layer, it can effectively Reduce light reflection and improve light utilization.

Regarding the thickness d1 of the first refractive index matching layer and the thickness d2 of the second refractive index matching layer, the interference of the reflected light can be canceled, so as to further reduce the reflection of light. Since n1>n4>n3, there is no half-wave loss. Since the wavelength range of visible light is 400-760nm, in order to reduce the harm of blue light to the human eye and improve the comfort of the human body to light, it is necessary to increase the reflection of blue light and reduce the red light. The reflection of the first index matching layer can mainly increase the blue light reflection, then the thickness of the first index matching layer d1=(2k+1)λ/[4*((n4 ² -n1 ² *sinα ² ) ^{1 /2} )], (k=0,1,2,3....), α is the incident angle of light entering the first refractive index matching layer from the encapsulation layer of the LED lamp bead, and λ is the wavelength of blue light.

The second index matching layer mainly reduces the reflection of red light, then the thickness of the second index matching layer is d2=kλ/[2*(n5 ² -n2 ² *sinβ ² ) ^1/2 ](k=1, 2,3…..). β is the incident angle of light entering the second refractive index matching layer from the lampshade, and λ is the wavelength of red light; by setting the thickness of the above two layers, the LED lamps can achieve a better color temperature and make the room have a warm and comfortable atmosphere.

In other embodiments, the first index matching layer can also be set to mainly reduce the reflection of red light, d1=kλ/[2*(n4 ² -n1 ² *sinα ² ) ^1/2 ](k=1, 2,3…..), α is the incident angle of light entering the first refractive index matching layer from the packaging layer of the LED lamp bead, λ is the wavelength of red light, and the second refractive index matching layer mainly increases the reflection of blue light, d2 =(2k+1)λ/[4*((n5 ² -n2 ² *sinβ ² ) ^1/2 )], (k=0,1,2,3…..), β is the light entering from the lampshade The incident angle of the second index matching layer, λ is the wavelength of blue light.

In one embodiment, the outer surface of the lampshade 1 may be provided with a multilayer optical film, and the refractive indices of the multilayer optical films are n _H , n _L , n _H , and n _L in the direction of light propagation from the lamp shade 1 to the air. ..., n _H , H represents a high refractive index film, and L represents a low refractive index film. In other embodiments, the optical thicknesses of the multilayer optical films are respectively 0.5λ1, 0.25λ2, 0.5λ1, 0.25λ2..., 0.5λ1, λ1 is the wavelength of blue light, and λ2 is the wavelength of blue light from the lampshade 1 to the air propagation direction. The wavelength of red light, due to the wide wavelength range of visible light, single-layer optical film can not achieve anti-reflection or anti-reflection effect well, using multi-layer optical film, according to the color rendering index or color temperature requirements of lamps, different wavelengths of light can be processed. Anti-reflection or anti-reflection to obtain excellent light-emitting effect.

The LED lamps of the present application may also be provided with some other structures. In one embodiment, an auxiliary light source is provided in the LED lamp, and the auxiliary light source emits light obliquely upward and radiates the light to the ceiling, thereby improving the brightness of the space. In one embodiment, the height (h) and width (w) of the lamp satisfy the relational formula 4≤d/h≤9. Thereby, it is possible to realize a lighting fixture capable of obtaining illumination light of desired brightness and desired light distribution as a ceiling light, while reducing heavy indentation due to the presence of the fixture body. In one embodiment, the lampshade 1 and the base 3 are connected by snaps, and a repellent holding layer containing an insect repellant is provided at the gap between the two connections, so as to effectively prevent insects from entering the interior of the lamp. In one embodiment, a backlight source is provided at a position perpendicular to the circuit board 201, and the number of LED chips of the back light source on the side far from the base 3 is greater than the number of LED chips of the backlight source on the side close to the base 3, so that the light-emitting surface can be reduced. Illumination is uniform.

In addition to the ordinary lighting function, the lamp in the embodiment of the present invention also realizes the housekeeping function, which mainly includes three aspects. The first aspect of the function is mainly for residents to go out for a period of time, usually more than 1 day, so as to experience the lighting period with lights. During this period, the lamps simulate the normal lighting state of residents to create the impression of residents at home to the outside world. This feature helps to deter thieves from thinking that someone is in the home. The second aspect of the function is to provide information to outsiders such as residents or designated other persons when a suspicious person enters the home during the period when the resident is not at home. The function of the third aspect is to realize the observation of residents, to judge whether there is an emergency in the body through the state of the resident's body, and to provide information to other designated persons. The setting of the above-mentioned functions can be realized by the remote control of the lamp, or by setting buttons, display screens, touch screens, etc. on the lamp body to realize human-computer interaction, or by using the application programs of smart devices such as smart phones and tablet computers. operate. The technical solutions of the embodiments of the present invention will be specifically described below.

58 is a schematic diagram of the main components of a light fixture according to an embodiment of the present invention. As shown in FIG. 58 , in addition to the conventional light-emitting element 1111 and the first power supply module 1112 for powering it, the LED lamp also includes a processing module 1113 , a light sensor 1114 , an infrared sensor 1115 , a communication module 1116 and power supply for these four parts The second power supply module 1117.

The light-emitting element 1111 is, for example, a light-emitting diode LED array, the light source module 22 of the present application, or the like, and may also be an incandescent light bulb or a fluorescent tube or other element. Correspondingly, the first power supply module 1112 may include a corresponding circuit to convert the 220V commercial power into a form suitable for light-emitting elements. For example, for an LED array, the first power supply module 1112 includes a corresponding rectifier circuit. If it is an incandescent lamp, then The first power supply module 1112 is mainly composed of components used for electrical communication, such as wires and wiring devices.

The processing module 1113 mainly includes a processor, and other auxiliary circuits and components to implement logical processing of information, which mainly comes from the light sensor 1114 and the infrared sensor 1115 and the communication module 1116 . The light sensor 1114 is mainly used to sense the ambient light intensity, so that the processor can determine whether the light needs to be turned on or not. The infrared sensor 1115 senses the human body state of the resident by acquiring the infrared sensing image of the environment. The communication module 1116 can perform two-way communication with the outside world through a wireless or wired local area network and/or a wireless communication network such as 3G/4G/5G, and is also used to communicate with the above-mentioned remote controller.

The second power supply module 1117 may include conversion circuits such as rectification and filtering, and a battery. When the commercial power is normal, the conversion circuit uses the commercial power to supply power to the processing module 1113, the optical sensor 1114, the infrared sensor 1115, and the communication module 1116. When the power supply cannot be used, the battery is used for power supply. In addition, if the light-emitting element 1111 is an LED array, the battery can also be used for power supply at this time.

The technical solution for realizing the function of the above-mentioned first aspect in the embodiment of the present invention is first described below. When the resident goes out, the lamp can be set to "housekeeping mode". In the housekeeping mode, under the control of the processing module 1113, the operation of the lamp simulates the state of the resident at home. If the ambient light intensity is dark enough, for example, the first light intensity preset value is 100lx, and the current time has not reached the preset rest time, the lighting is turned on. When the rest time is reached, turn off the lighting, or operate at a lower lighting brightness level for a period of time and then turn off the lighting.

Next, the lighting is not turned on for a relatively long preset period of time, such as 6 to 8 hours, which is the rest period; state of the night. It can be turned on at a random time, or it can be turned on at a preset time, and the duration is a preset duration or a random duration less than a preset value.

For different seasons, lighting may or may not be required after getting up in the morning. For this reason, the processing module 1113 may determine whether to turn on the lights according to the ambient light intensity after the rest period ends, or determine what time to turn on the lights in the morning according to the current date. If the light is on, the light is turned off when the ambient light is strong enough, eg, greater than the second light intensity preset value. The second preset value of light intensity here should be greater than the aforementioned first preset value of light intensity.

When the resident performs any operations on the lamps after returning, the above-mentioned housekeeping mode is exited.

The following describes the technical solutions for realizing the functions of the second aspect in the embodiments of the present invention. This function is designed for the case of illegal entry. During the above-mentioned rest period, it is detected that someone moves but the light is not operated, and it is considered that someone has illegally entered. The user can turn on this function before going out to realize the monitoring function, that is, enter the monitoring mode.

In the monitoring mode, the processing module 1113 monitors the infrared signal provided by the infrared sensor 1115, the infrared signal is generally an infrared sensing image, and the infrared sensor 1115 can provide the processing module with these images at a certain sampling frequency. If there is a heat source area in the image, it is determined to be an illegal person, and at this time, the processing module 1113 controls the communication module 1116 to send information to the outside. Specifically, it may be a resident or other designated person, such as a contact person provided by a resident, or a residential property, a police station, and the like. Therefore, in the case of turning on the housekeeping mode, it is best to turn on the monitoring mode at the same time.

When residents return home, they can exit the monitoring mode. At this time, they can exit the monitoring mode by performing any operation on the lights. At this time, when there are multiple lamps and lanterns in the monitoring mode, the residents can withdraw some or all of the lamps from the monitoring mode. . Because when the resident has just returned to the room and has not had time to exit the monitoring mode, the resident itself will cause the lamp to send information as a heat source, so before deciding to send information to the outside, it can be delayed for a period of time, such as 30S, so that the resident can exit the monitoring mode. Monitor mode for the lights in the room. That is, residents can set rooms where they are not in surveillance mode.

For pets (mainly referring to warm-blooded animals such as cats, dogs, rabbits and birds), the above infrared sensor images will still contain heat source areas when residents are not at home. In this case, the processing module 1113 should perform some filtering operations on the image. For this reason, the height and/or width, that is, the size condition of the heat source shape in the image can be set according to the physical characteristics of the pet at home. If the size condition is satisfied, the heat source area in the image is ignored, and then the image is judged. For example, if the height and width are set to small values at the same time, the interference caused by cats, small dogs, rabbits, and birds can be eliminated. For another example, for the size of a big dog, the width can be set to be significantly larger than the height.

The following describes the technical solution for realizing the function of the third aspect in the embodiment of the present invention. This function can be implemented by using an infrared sensor, and the state of the occupants in the house is mainly judged according to the infrared sensor image provided by the infrared sensor 1115 . If the person does not move for a long time, there may be an abnormality. At this time, information should be sent to the outside, such as the relatives of the person in the house. So this function can be called monitoring mode.

The monitoring area is the area in the house that can be covered by the infrared sensor 1115. Considering the difference in the stay time of personnel in sub-areas such as the ground area, sofa area, desk area, bed area, etc., the range of the above area can be set, and Set the preset time duration for each sub-area, and these settings are saved as monitoring setting information. When judging the image, examine the time that the heat source area in the image and the above-mentioned sub-areas keep still when they overlap, and send information when they exceed their respective preset values. A threshold can be set for the overlap here. For example, if the overlap area accounts for a set percentage of the heat source area, it is considered as overlap.

Some check setting information can be saved to check whether people in the house go to bed, get up on time, etc. Specifically, the time of going to bed and/or the time of getting up can be set as the inspection time and the preset delay time. If the heat source area in the image does not overlap with the bed area within the preset time delay after the time of going to bed, it means that the people in the house did not go to bed on time. , you can send information to the outside. If the heat source area in the image still overlaps with the bed area within the preset time delay after the time of getting up, it means that the people in the room did not get up on time, and information can also be sent to the outside at this time.

If a person falls and cannot get up due to various reasons in the house, this function can also be reminded. Specifically, some settings can be made, which are referred to as fall settings here, which mainly include the settings of the fall area, the fall duration, and the fall target. The fall area is generally set as the ground area, that is, avoiding the position where the sofa, bed, etc. can lie down. The setting of the fall target, that is, the setting according to the posture difference between the person standing and the fall, is generally reflected in the change of the height and width of the heat source area in the heat source area. Therefore, the height and width of the shape of the heat source area can be set, or the size relationship between the two can be set, for example, the height is half of the width. This setting takes into account that a person is considered to have fallen if the height of the heat source area is less than half the width. The viewing angles of lamps in different positions are different, so the relationship between the height and width here should also consider the position of the lamps. In addition, the influence of pets can be eliminated by setting the size of the heat source area in the manner described above.

According to the above settings, for the heat source area in the image, if it is located in the ground area, the shape conforms to the fall target, that is, the shape and size are within the range of the fall target size, for example, its height is less than half of its width, and the time when the image was received When the above preset time duration is reached, it is considered that the people in the house cannot afford to fall to the ground, and information should be sent to the outside at this time.

The function of the third aspect can also be realized based on the visual sensing function, that is, a camera is used to replace the infrared sensor 1115 (or both), and the environmental image collected by the camera is sent to the processing module 1113 for analysis, and pattern recognition can be applied to this analysis. and other techniques to determine the state of a particular object within the environment. This method can not only more accurately recognize the posture and other states of the person in the house, but also realize the gesture recognition of the person. In a specific application, the camera collects an environment image and then sends it to the processing module 1113 for identification. If it is recognized that the environment image contains a human body image, the human body posture is judged. The judgment here is based on some preset conditions, such as judging whether the human body falls, etc., which can be analyzed by means of pattern recognition. If the posture of the human body meets the preset conditions, it will send information to the outside.

In the way of using the camera for image acquisition, gesture recognition can also be performed on the human body image, and at this time, specific information corresponding to the gesture can be sent to the outside according to the specific gesture of the person.

The lamps in the embodiments of the present invention may be ceiling lamps, table lamps, floor lamps, wall lamps, and the like. For multi-room houses, if multiple lamps are connected to the same local area network, unified settings or separate settings can be adopted. If there are multiple lamps in the same room, you can designate one of them as the main lamp to send information to the outside. For multiple lamps, they can be linked together or separately when setting the mode. For example, if a fixture enters or exits the housekeeping mode, all other fixtures can enter or exit the housekeeping mode. When a fixture enters or exits monitoring mode or monitoring mode, other fixtures can enter or exit at the same time without being affected or by linkage. You can also group lamps, lamps in the same group are linked, and lamps in different groups are not linked.

According to the technical solution of the embodiment of the present invention, the light sensor, the infrared sensor and the communication module are arranged in the light fixture, and the functions of simulating someone at home, finding outlaws, and monitoring family members can be realized by adopting an adaptive program, which expands the application mode of the light fixture and improves the All aspects of home safety.

The features of the various embodiments of the present application described above can be arbitrarily combined and transformed without being mutually exclusive, and are not limited to a specific embodiment. For example, as described in the embodiment shown in FIG. 18, although these features are not described in the embodiment shown in FIG. 46, the features described in the embodiment shown in FIG. 18 may also be included. The description of 18 applies these features to FIG. 46 without creativity; for another example, although the present application describes various creation schemes by taking LED ceiling lamps as an example, it is obvious that these designs can be applied without creativity. The lamps of other shapes or types are not listed here.

The implementation of the lampshade, optoelectronic module, base and various embodiments of the LED lamps to which they are applied in the present application have been described as described above. ”, “insulation unit”, “arrangement of LED chips”, “base” and other features may include one, two, more or all technical features if they do not conflict with each other. The relevant corresponding content can be selected from one or a combination of the technical features included in the corresponding embodiment.

The present application has been disclosed above with preferred embodiments, but those skilled in the art should understand that the embodiments are only used to describe the present application and should not be construed as limiting the scope of the present application. It should be noted that all changes and substitutions equivalent to this embodiment should be set to be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the scope defined by the appended claims.

Claims

An LED lamp is characterized in that, the LED lamp comprises a lampshade and a base connected with the lampshade, a first accommodating space formed by the lampshade and the base is provided with a photoelectric module, and the photoelectric module comprises a first insulating part, a power module A set and a circuit board, the circuit board includes a first surface and a second surface arranged oppositely, a first insulating part covers the electronic components on the first surface, the first insulating part includes a light processing unit, and the light processing unit includes a part corresponding to a power supply module. The group is provided with a second light treatment area, and the second light treatment area is provided with at least one extension part, and the extension part passes through the through hole on the circuit board.
The LED lamp of claim 1, wherein a first chip area and a second chip area are arranged on the first surface of the circuit board, and the distance from the first chip area to the base is smaller than the distance from the second chip area to the base.
The LED lamp according to claim 2, wherein the light processing unit further comprises a first light processing area and a third light processing area corresponding to the first chip area and the second chip area, respectively.
The LED lamp according to claim 2, wherein the first chip area and the second chip area comprise at least one LED chip, and the distance between adjacent LED chips in the first chip area is smaller than that between adjacent LED chips in the second chip area distance between chips.
The LED lamp according to claim 2, wherein the second chip area comprises a first LED chip group, a second LED chip group and a third LED chip group, the first LED chip group, the second LED chip group and the third LED chip group The three LED chip groups are respectively located on different circumferences. The number of LED chips in the second chip group is smaller than that in the first chip group, and the number of LED chips in the first chip group is smaller than the number of LED chips in the third chip group. .
The LED lamp according to claim 2, wherein the power module comprises a first power module and a second power module respectively located on the first side and the second side of the circuit board, and the first power module is located on the first side of the circuit board. between the chip area and the second chip area.
The LED lamp according to claim 3, wherein there is a center point O 1 , O 2 , . . . , On , n≥1 between two adjacent LED chips in the first chip group, and the third chip group There are central points Q 1 , Q 2 , ..., Q m , m ≥ 1, n, m are integers between two adjacent LED chips, when m > 1, the distance between O 1 and Q 1 is less than O The distance between 1 and Q m .
The LED lamp according to claim 7, characterized in that, when n=m, n, m≥1, and n, m are both integers, the line connecting the center point O 2n-1 and the center point Q 3m-2 passes through At least one LED chip of the second chipset.
The LED luminaire of claim 3, wherein the cross section of the first light treatment area and/or the third light treatment area is different from the cross section of the second light treatment area.
The LED lamp according to claim 3, wherein in the height direction of the LED lamp, the height of the second light treatment area is greater than or equal to the height of the first light treatment area and the third light treatment area.