CN114076292A

CN114076292A - LED lamp

Info

Publication number: CN114076292A
Application number: CN202110889387.0A
Authority: CN
Inventors: 王名斌; 梅荣; 陈振坤; 蒋靖源; 姚志雄; 张志超; 周林; 熊爱明; 秦建锋; 沈涛
Original assignee: Jiaxing Super Lighting Electric Appliance Co Ltd
Current assignee: Jiaxing Super Lighting Electric Appliance Co Ltd
Priority date: 2020-08-04
Filing date: 2021-08-04
Publication date: 2022-02-22
Also published as: CN220249919U; WO2022028443A1; CN216047513U; CN219606986U; JP3242784U; JP2022029443A

Abstract

The application relates to a lighting device and discloses a light-emitting diode (LED) lamp, which comprises a lampshade, a base connected with the lampshade, wherein a photoelectric module is arranged in a first accommodating space formed by the lampshade and the base, the light source module comprises a light source module and a power supply module, the light source module comprises a first chip area and a second chip area, and one part of the power supply module is positioned between the first chip area and the second chip area. The LED lamp has the characteristics of thin thickness, excellent luminous effect and good heat dissipation performance.

Description

LED lamp

Technical Field

The application relates to a lighting apparatus, in particular to an LED lamp.

Background

The ceiling lamp is a lamp decoration attached to or embedded in a ceiling of a roof, and is often used as a lighting device in various places such as homes, offices, entertainment venues and the like. The traditional ceiling lamp generally comprises a base, a light source module, a circuit module and a lampshade, wherein a light-emitting element in the light source module is generally an energy-saving lamp tube. As the energy-saving lamp tube has mercury pollution in the production process and after being used and abandoned, the power consumption of the energy-saving lamp tube is larger than that of an LED, and the LED has the characteristics of no mercury, no toxicity, no electromagnetic pollution, no harmful rays, energy conservation, environmental protection, long service life and the like, the LED is gradually used for replacing the energy-saving lamp tube for the luminous element of the ceiling lamp. But the current ceiling lamp still has the problem in aspects such as luminous, heat dissipation, installation and packing in the use, specifically as follows:

1. the problems of flash, small irradiation range, uneven light emission, small brightness of the central part of the lamp, uneven brightness of the central part of the lamp and the peripheral part of the lamp, uneven light emission of the light emitting surface, glare, uneven brightness of the circumferential direction of the lamp, uneven illumination on the installation surface of the light emitting element, uneven brightness and color rendering, low light emitting efficiency and light design, bright spots, low rendering effect, uneven color mixing, uneven illumination on the circumferential direction of the ceiling, light blocking of circuit elements with higher height, large color temperature and color deviation, narrow light orientation, low light transmission efficiency, low light emitting efficiency of a light source, dim side areas of a lampshade, uneven brightness of the light emitting surface of the lampshade, bright lines, low light extraction efficiency of the light emitting element, low light comfort, low aesthetic property in extinction and the like occur in the lighting process, in addition, the following problems may occur in the existing lamp: some use scenes can expect that light emitted by the lamp has a three-dimensional effect or a corresponding light space is generated according to a corresponding life scene, a user can not easily read the light space with the color tone under the lamp, or the old people have low light comfort because the color of characters and objects to be observed is reduced.

In order to improve the optical effect of the ceiling lamp, a backlight lens is added on the LED to reduce the dark areas of the middle part and the edge part of the lamp, but the production cost is greatly improved and the product competitiveness is reduced due to the adoption of the backlight lens and lens pasting process; second, an optical member such as a light guide plate, a lens, a reflection unit, etc. is disposed between the light emitting element and the lamp housing, but when the optical member is used, there are problems such as variation in the amount of light incident on the light guide plate, a complicated structure of the optical member, unevenness in brightness on the light guide plate, and generation of a dark portion on the light guide plate;

2. the light-emitting element and the circuit element can generate heat, and the heat can influence the service life of the ceiling lamp;

3. the light source module is mostly installed in the lamp body through screws or is pasted in the lamp body through a binder, and the light source module is not easy to detach and replace after being installed. In addition, after the ceiling lamp is used for a long time, the phenomena of aging and burning loss of the light source module often occur, for example, when the light source module is damaged and needs to be replaced, the damaged light source module needs to be detached through a tool, then a new light source module is installed through the tool, the replacement operation of the LED light source module needs to be carried out by professional personnel, and the use process is inconvenient;

4. ceiling lamp is the platykurtic structure usually, has to occupy characteristics such as highly little, illumination zone wide, however, ceiling lamp's whole thickness size is still very big, causes the volume increase of product, and then has promoted packing and inventory cost.

In addition, the lamp has the problems of low safety, low manufacturing efficiency, high use cost, easiness in entering the lamp by insects and the like to influence the attractiveness, incapability of continuing to illuminate when a power supply fails, small installation area of a circuit board, limited luminous flux of the whole lamp, low remote control sensitivity or narrow remote control range during intelligent control, noise during installation and the like in the use process.

In view of the above-mentioned shortcomings and drawbacks of the prior art, it is necessary to improve the prior LED lamp to compensate for these shortcomings and drawbacks.

Disclosure of Invention

The present application addresses the shortcomings in the prior art described above, providing an LED light fixture.

In order to solve the technical problem, the application is solved by the following technical scheme:

the utility model provides a LED lamp, its includes the lamp shade, is connected with the lamp shade base, be equipped with the photoelectricity module in the first accommodation space that lamp shade and base formed, the light source module includes light source module and power module, and the light source module includes first chip region and second chip region, and some power module are located between first chip region and the second chip region.

Preferably, the circuit board includes a first surface and a second surface opposite to each other, the optoelectronic module includes a connector terminal, the connector terminal is connected to an electronic component on the circuit board through a wire, and a connection point of the wire and the circuit board is located on the first surface of the circuit board.

Preferably, the connection point of the wire and the circuit board is located between the first chip region and the second chip region.

Preferably, at least one of the connecting lines between one of the LED chips in the first chip region and one of the LED chips in the second chip region passes through the electrical connection point of the wire and the circuit board.

Preferably, the first chip region and the second chip region include at least one LED chip, and a distance between adjacent LED chips in the first chip region is smaller than a distance between adjacent LED chips in the second chip region.

Preferably, the second chip area includes a first LED chip set, a second LED chip set and a third LED chip set, a central point O1, O2, … …, On, n is greater than or equal to 1 is provided between two adjacent LED chips in the first chip set, a central point Q1, Q2, … … is provided between two adjacent LED chips in the third chip set, Qm, m is greater than or equal to 1, n, m is an integer, and when m is greater than 1, the distance between O1 and Q1 is smaller than the distance between O1 and Qm

An LED lamp, which comprises a light-emitting element and a first power supply module for supplying power to the light-emitting element, is characterized by further comprising a processing module, a light sensor, a communication module and a second power supply module, wherein:

the processing module comprises a processor to realize the logic processing of the information;

the optical sensor is used for sensing the ambient illumination intensity and sending the ambient illumination intensity information to the processing module;

the communication module is used for communicating with the outside;

the second power supply module is used for supplying power to the processing module, the optical sensor and the communication module.

Preferably, the system also comprises an infrared sensor, which is used for acquiring an infrared sensing image of the environment and then sending the infrared sensing image to the processing module; the second power supply module is also used for supplying power to the processing module. .

Preferably, the system further comprises an image acquisition device for acquiring an environment image; the processing module is also used for identifying whether the environment image contains a human body image; and judging whether the human body posture in the human body image meets a preset condition or not under the condition that the environment image contains the human body image. The communication module is also used for sending information to the outside under the condition that the human body posture in the human body image meets the preset condition.

Preferably, the processing module is further configured to perform gesture recognition on the human body image when the environment image includes the human body image; the communication module is also used for sending information to the outside according to the identification result.

Through the above structural design, the present application achieves one of the following beneficial effects or any combination thereof:

(1) the photoelectric module is fixed by the mounting part in a rotating way, so that the mounting and maintenance are convenient, and the working efficiency is improved; (2) the arrangement of the LED chips on the light source module is adjusted, so that the light emitting effect of the LED lamp is more uniform and the heat dissipation effect is more excellent; (3) the electronic element on the second surface of the circuit board is positioned more radially inside than the electronic element of any one light source module, so that the heat generated by the electronic element of the light source module during working can be prevented from affecting the electronic element on the second surface, and the distribution area of the electronic element on the second surface can be limited, thereby controlling the size of the second insulating part and controlling the cost; (4) the LED chips and the power module are respectively positioned on the first surface and the second surface of the circuit board, and the number of the LED chips in the area, corresponding to the power module, on the first surface is smaller than that of the LED chips in the area, not corresponding to the power module, on the first surface, so that on one hand, dark areas in the middle of the LED lamp are obviously reduced, the light emitting effect of the LED lamp is improved, and on the other hand, the influence of heat generated by the power module on the light source module can be reduced; (5) the second power supply module with higher height is positioned in the groove part of the base, and the height of the ceiling lamp is effectively reduced because a special accommodating space for accommodating the power supply module is not required to be arranged; (6) the first insulating part has a certain radian, so that the stress degree of the first insulating part can be improved, and the photoelectric module is not damaged in the transportation process; (7) the second insulating part is contacted with the side wall of the groove part of the base, so that the contact area is increased, and the heat conducting capacity is improved; (8) the light emitting surface of the LED chip faces the central axis of the lamp, so that the middle dark area can be effectively eliminated, and the light emitting effect of the lamp is improved; (9) the refractive index of the packaging layer of the LED lamp bead with the proper refractive index is selected to be n1, and the luminous flux of the LED lamp can be effectively improved by the lampshade material; (10) by arranging the refractive index matching layer on the surface of the LED chip or the inner surface of the lampshade, excellent optical effect can be obtained through the thickness design.

Drawings

FIG. 1 is a schematic structural diagram of an embodiment of an LED lamp of the present application;

FIG. 2 is a schematic view of one embodiment of the lamp enclosure of FIG. 1 with the lamp housing removed;

FIG. 3 is a first schematic perspective view of an embodiment of an optoelectronic module of an LED lamp with an insulation unit removed;

FIG. 4 is a second schematic perspective view of the optoelectronic module of the LED lamp with the insulation unit removed in one embodiment;

FIG. 5 is a first schematic perspective view of a photovoltaic module of an LED lamp with an insulation unit removed in another embodiment;

FIG. 6 is a second schematic perspective view of a photovoltaic module of an LED lamp with an insulation unit removed in another embodiment;

fig. 7 is a first schematic perspective view of a photovoltaic module of an LED lamp according to an embodiment;

fig. 8 is a second schematic perspective view of a photovoltaic module of an LED lamp according to an embodiment;

FIG. 9 is a schematic perspective view of a first insulating portion of a photovoltaic module of an LED lamp according to an embodiment;

FIG. 10 is a schematic cross-sectional view of an optoelectronic module of an LED lamp in an embodiment;

fig. 11 is an enlarged view at C in fig. 10;

fig. 12 is a schematic perspective view of a second insulating portion of a photovoltaic module of an LED lamp according to an embodiment;

FIG. 13 is a schematic view of an embodiment of an LED lamp with the lamp cover removed;

fig. 14 is a first schematic structural diagram of a photovoltaic module of an LED lamp according to an embodiment;

fig. 15 is a second schematic structural diagram of a photovoltaic module of an LED lamp according to an embodiment;

FIG. 16 is a schematic view of the structure of section A-A in FIG. 14;

FIG. 17 is a schematic view of the structure of section B-B in FIG. 14;

FIG. 18 is a schematic diagram of an embodiment of an LED lamp with an insulation unit removed from a photovoltaic module;

FIG. 19 is a first schematic view of an embodiment of a photovoltaic module of an LED lamp with an insulation unit removed;

FIG. 20 is a second schematic structural view of the optoelectronic module of the LED lamp with the insulation unit removed in one embodiment;

FIG. 21 is a first schematic structural view of a photovoltaic module of an LED lamp with an insulation unit removed in another embodiment;

FIG. 22 is a second schematic structural view of a photovoltaic module of an LED lamp with an insulation unit removed in another embodiment;

FIG. 23 is a schematic diagram of a first insulating portion of an LED lamp according to an embodiment;

FIG. 24 is a schematic structural diagram of a second insulating portion of the LED lamp according to an embodiment;

FIG. 25 is a schematic diagram of a photovoltaic module of an LED lamp according to an embodiment;

FIG. 26 is a schematic view of an embodiment of a method for assembling an optoelectronic module according to the present disclosure;

FIG. 27 is a schematic structural view of the optoelectronic module assembled by the assembly method shown in FIG. 26;

FIG. 28 is a schematic view of the structure of section A-A in FIG. 27;

FIG. 29 is a schematic perspective view of an embodiment of an LED lamp with the cover removed;

FIG. 30 is a perspective view of a lamp enclosure in one embodiment;

FIG. 31 is an enlarged view at A in FIG. 29;

FIG. 32 is an enlarged view at B in FIG. 29;

FIG. 33 is a front view of the mounting portion;

FIG. 34 is a first perspective view of a mounting portion in one embodiment;

FIG. 35 is a second perspective view of the mounting portion of one embodiment;

FIG. 36 is a schematic perspective view of an optoelectronic module of an LED lamp according to an embodiment;

FIG. 37 is a perspective view of an LED lamp with a cover removed in one embodiment;

FIG. 38 is a cross-sectional schematic view of an LED light fixture in an embodiment;

FIG. 39 is an enlarged view at B in FIG. 38;

FIG. 40 is a schematic perspective view of an embodiment of an LED lamp with the cover removed;

FIG. 41 is a schematic perspective view of an LED lamp with the cover removed in one embodiment;

FIG. 42 is a perspective view of the mounting portion in one embodiment;

FIG. 43 is a perspective view of an LED lamp with the cover removed in one embodiment;

FIG. 44 is a schematic perspective view of an embodiment of an LED lamp with the cover removed;

FIG. 45 is a schematic perspective view of a base in one embodiment;

FIG. 46 is a schematic perspective view of an LED light fixture in one embodiment;

fig. 47 is a first schematic perspective view of a photovoltaic module of an LED lamp according to an embodiment;

FIG. 48 is a second schematic perspective view of a photovoltaic module of an LED lamp according to an embodiment;

FIG. 49 is a schematic perspective view of an LED light fixture in an embodiment;

FIG. 50A is a schematic perspective view of the photovoltaic module of FIG. 49;

FIG. 50B is an enlarged schematic view of portion A of FIG. 50A;

FIG. 50C is a schematic view of the first insulating portion of FIG. 50A;

FIG. 51 is a perspective view of the circuit board of FIG. 50;

FIG. 52A is a cross-sectional view of the LED light fixture of FIG. 49 with the cover removed;

FIG. 52B is a schematic view of section A-A of FIG. 52A;

FIG. 52C is an enlarged schematic view of portion B of FIG. 52B;

FIG. 53A is a first schematic diagram illustrating an embodiment of an optoelectronic module;

FIG. 53B is a second schematic diagram illustrating a structure of an optoelectronic module in an embodiment;

FIG. 53C is a schematic view of section A-A in FIG. 53A;

FIG. 53D is an enlarged schematic view of portion B of FIG. 53C;

FIG. 53E is an enlarged schematic view of portion C of FIG. 53C

FIG. 53F is a schematic view of the first insulating portion of FIG. 53A;

FIG. 53G is a schematic view of section B-B of FIG. 53F;

FIG. 53H is an enlarged schematic view of portion D of FIG. 53G;

FIG. 54A is a first schematic diagram illustrating an exemplary embodiment of an optoelectronic module;

FIG. 54B is a second schematic diagram illustrating an exemplary optoelectronic module;

FIG. 54C is a schematic view of section E-E in FIG. 54B;

FIG. 54D is an enlarged view of portion F of FIG. 54C;

FIG. 54E is a third schematic view illustrating a structure of an optoelectronic module in an embodiment;

FIG. 54F is an enlarged view of portion B of FIG. 54E;

FIG. 54G is an enlarged view of section G-G of FIG. 54E;

FIG. 54H is an enlarged view of portion H of FIG. 54G;

FIG. 54I is a fourth exemplary schematic structural diagram of an optoelectronic module of an embodiment;

FIG. 54J is an enlarged view of section I-I of FIG. 54I;

FIG. 54K is an enlarged view of portion J of FIG. 54J;

FIG. 54L is a schematic view of the circuit board of FIG. 54A;

FIG. 54M is a schematic view of the first insulating portion of FIG. 54A;

FIG. 54N is an enlarged view of portion K of FIG. M;

FIG. 55 is a first schematic perspective view of an LED lamp in one embodiment;

FIG. 56 is a second schematic perspective view of an LED lamp in an embodiment;

FIG. 57 is an interface view through which light emitted by the LED chip passes in one embodiment;

fig. 58 is a schematic view of main components of a lamp according to an embodiment of the present invention.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples.

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are shown in the drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete. The following directions such as "axial direction", "above", "below", etc. are for more clearly showing the structural positional relationship, and do not limit the present application. In this application, the terms "equal", "vertical", "horizontal", "parallel" are defined as: including 10% on the basis of the standard definition. For example, perpendicular generally refers to an angle of 90 degrees relative to a reference line, but in this application, perpendicular refers to a situation that is within 80 degrees to 100 degrees inclusive. In addition, the use condition and the use state of the LED lamp in the present application refer to a use situation of the LED lamp in a manner that the lampshade hangs vertically downward, and other exceptional cases will be described in addition.

As shown in fig. 1 to 57, the LED lamp according to the embodiment of the present application is, for example, a ceiling lamp installed on a ceiling. The upward direction of fig. 1 to 57 (the positive direction of the z-axis in fig. 1) corresponds to the direction of the floor surface facing the ceiling. In other words, the LED light fixtures shown in fig. 1 to 57 are adapted to be in a posture opposite to that in normal use.

According to the LED lamp designed by the application, the spatial position of the LED lamp is located in a Cartesian coordinate system as shown in FIG. 1, wherein a z axis is parallel to a central axis of the LED lamp. As shown in fig. 1 to 57, the LED lamp includes a lampshade 1 and a base 3 connected to the lampshade 1, and a first accommodating space formed by the lampshade 1 and the base 3 is provided with a photovoltaic module 2. In this embodiment, the LED lamp further includes a mounting portion 31 disposed on the base 3, a hook guiding device 4 and a transfer hook guiding device (or adapter) 5, the optoelectronic module 2 is fixed on the base 3 through the mounting portion 31, and the hook guiding device 4 is connected to the adapter 5. In order to suppress the wobbling of the LED lamp, a buffer member 7 is provided between the LED lamp and the ceiling, and the buffer member 7 may be, for example, a sponge.

As shown in fig. 1 to 57, the photovoltaic module 2 includes a light source module 22 and a power supply module 23, and in order to prevent power failure and the like from causing power failure when an external power supply is cut off, the power supply module 23 may include a storage battery unit storing electric energy, and an afterglow module is stored in the storage battery unit, and the afterglow illumination is automatically sent out through the afterglow module to ensure safety.

As shown in fig. 1-57, the optoelectronic module 2 is configured as a unitary structure and is removably secured to the base 3 so that when the optoelectronic module 2 is damaged, it can be replaced separately, which is more cost effective than a full light replacement. When the optoelectronic module 2 is replaced, it is necessary to prevent the occurrence of electric shock, especially when the optoelectronic module 2 is replaced, the hand touches the electronic component. The optoelectronic module 2 in this embodiment includes an electronic component, and the electronic component is externally provided with an insulating unit, so as to prevent the electronic component from being contacted when the optoelectronic module 2 is replaced. The optoelectronic module 2 includes a circuit board 201, the circuit board 201 may be a single PCB panel or a double PCB panel, and at least a portion of the electronic components are disposed on the circuit board 201. Further, all electronic components are disposed on the circuit board 201. The electronic components include electronic components (such as LED beads) in the light source module 22 and electronic components in the power module 23. That is, the electronic components of the light source module 22 and the electronic components of the power module 23 are integrated on the same circuit board, so that the cost and the space are saved.

As shown in fig. 3 to 6, the circuit board 201 includes a first surface 2011 and a second surface 2012 disposed oppositely, wherein the first surface 2011 faces the lamp cover 1. In an embodiment, the electronic components of the light source module 22 are disposed on the first surface 2011, and the electronic components of the power module 23 can be disposed on the first surface 2011 completely, so that the circuit board 201 only needs to arrange a circuit layer on the first surface 2011, thereby saving the wiring cost. In some embodiments, referring to fig. 3 and 4, the electronic components of the light source module 22 are disposed on the first surface 2011, and the electronic components of the power module 23 are all disposed on the second surface 2012, so that the electronic components in the light source module 22 and the electronic components in the power module 23 can be separately disposed. When the lamp is turned on, generally, the electronic components of the light source module 22 and the electronic components of the power module 23 may generate heat, so that the two are separately disposed, thereby preventing the heat source from being concentrated or preventing the heat generated during operation from affecting each other, and at this time, the circuit layers may be disposed on the first surface 2011 and the second surface 2012 at the same time. In this embodiment, the electronic devices in the light source module 22 are disposed on the first surface 2011, some of the electronic devices in the power module 23 are disposed on the first surface 2011, and another part of the electronic devices in the power module 23 are disposed on the second surface 2012. In this embodiment, the electronic components of the power module 23 are respectively disposed on the first surface 2011 and the second surface 2012, so that the electronic components in the power module 23 can be better disposed. For example, the electronic components of the power module 23 on the first side 2011 include components with relatively low height, such as an IC (control circuit) and a chip component (e.g., a chip resistor), so that the light emitted from the light source module 22 is not blocked by an obstacle, which reduces the light loss and improves the light emitting efficiency. The electronic components of the power module 23 on the second side 2012 include components with relatively high height, such as a transformer, a capacitor, an inductor, etc. For example, the electronic component of the power module 23 on the first side 2011 includes a heat-generating component (a component that generates more heat during operation, such as an IC, a resistor, etc.), the electronic component of the power module 23 on the second side 2012 includes a heat-labile component (such as an electrolytic capacitor), and the heat-labile component and the heat-generating component are respectively disposed on the second side 2012 and the first side 2011, so that the influence of the heat generated during operation of the heat-generating component on the heat-labile component can be reduced, and the reliability and the lifetime of the power module 23 as a whole can be improved.

As shown in fig. 7 to 12, the optoelectronic module 2 further includes an insulating unit, and the insulating unit includes a first insulating portion 202 and/or a second insulating portion 203, wherein the first insulating portion 202 is configured to be transparent to light generated by the light source module 22 during operation, and the first insulating portion 202 covers all electronic components on the first surface 2011 to prevent electrical shock caused by mistakenly touching the electronic components on the first surface 2011. The second insulating part 203 covers all the electronic components on the second surface 2012, and the material of the second insulating part 203 may be selected from one of PC or acryl, which have the characteristics of lightness and low cost. In this embodiment, the electronic components on the second surface 2012 are located more inside the radial direction of the circuit board 201 than the electronic components of any one of the light source modules 22, that is, the projection of the electronic components on the second surface 2012 and the projection of the electronic components of the light source modules 22 in the thickness direction of the circuit board 201 do not overlap. On one hand, the heat generated by the electronic components of the light source module 22 during operation can be prevented from affecting the electronic components on the second side 2012, and on the other hand, the distribution area of the electronic components on the second side 2012 can be limited, so as to control the size of the second insulating portion 203 and the cost.

The first insulating portion 202 in this embodiment includes a cavity 2021, and the circuit board 201 is accommodated in the cavity 2021. The first insulating portion 202 has a side wall 2022, the side wall 2022 is provided with a first position-limiting portion 2023, one or more second position-limiting portions 2024 are disposed in the cavity 2021 of the first insulating portion 202, when the circuit board 201 is installed in the first insulating portion 202, two sides of the circuit board 201 in the thickness direction are respectively limited by the first position-limiting portion 2023 and the second position-limiting portion 2024, that is, the circuit board 201 is sandwiched between the first position-limiting portion 2023 and the second position-limiting portion 2024 to complete the fixing. And the circuit board 201 is not easy to shake after being installed. The first position-limiting portion 2023 may be a buckle, and the second position-limiting portion 2024 may be a column.

In this embodiment, the second insulating portion 203 is provided with a first fastening unit 2031, the circuit board 201 is provided with a corresponding second fastening unit 2013, and the first fastening unit 2031 is fastened to the second fastening unit 2013, so as to fix the second insulating portion 203 to the circuit board 201. The first fastening unit 2031 may be a fastening portion, and the second fastening unit 2013 may be a fastening hole or a fastening portion. In addition, the second fastening unit 2013 may be disposed on the first insulating portion 202 to fix the second insulating portion 203 to the first insulating portion 202.

In an embodiment, the circuit board 201 and the first insulating portion 202 may be positioned relative to each other by the concave-convex structure, thereby restricting movement of the first insulating portion 202 relative to the circuit board 201 in a horizontal direction (a direction parallel to the xy plane), i.e., no displacement occurs between the circuit board 201 and the first insulating portion 202, and therefore, no displacement occurs between the light source module 22 and the first insulating portion 202, so that a decrease in light extraction efficiency due to the displacement between the light source module and the first insulating portion may be suppressed.

In an embodiment, the basic structure of the LED lamp is the same as that of the foregoing embodiment, and the LED lamp includes a lampshade 1, an optoelectronic module 2 and a base 3, which are not repeated herein, but the embodiment provides another fixing form of the insulating unit and the circuit board. As shown in fig. 13 to 17, the power module 23 includes a first power module 231 (e.g., the electronic component in the portion of the power module 23 disposed on the first surface 2011) and a second power module 232 (e.g., the electronic component in the portion of the power module 23 disposed on the second surface 2012), the first power module 231 may be an smt (surface mounting technology) component, and the second power module 232 may be a DIP (dual inline-pin package) component, for example, the DIP component includes an inductor, a capacitor, and the like. The first insulating portion 202 is provided with a first fastener 25, and the first insulating portion 202 is fastened to the light source module 22 through the first fastener 25. The second insulating portion 203 is provided with a second fastener 26, the second insulating portion 203 is combined with the light source module 22 through the second fastener 26 in a fastening manner so as to insulate and mechanically protect the power module 23, and a certain interval is formed between the power module 23 and the second insulating portion 203, so that a stress buffer area can be provided for the second insulating portion 203, and the power module can be prevented from being damaged when the second insulating portion 203 is impacted by external force.

The first insulating part 202 and/or the second insulating part 203 may be provided with a reinforcing rib 27, which may increase the impact strength of the first insulating part and/or the second insulating part and prevent the first insulating part and/or the second insulating part from being damaged. The first insulating portion and the second insulating portion of the different structures described above may be combined with each other.

As shown in fig. 18, the circuit board 201 is provided with a plurality of LED chip sets 221, each of which includes a plurality of LED chips 2201. With any point on the central axis of the circuit board 201 as the center point, the LED chips 2201 on each LED chip group have equal or substantially equal distances from the center point. The central axis of the circuit board is at least provided with a central point which is positioned on the same plane as the LED chip groups, each LED chip group is positioned on a circumference which takes the central point as the center of a circle or is approximately positioned on the circumference which takes the central point as the center of a circle, each LED chip group is respectively positioned on different circumferences according to the radius of the circle, the number of the LED chip groups is the same as the number of the circumferences, the number of the circumferences is n (n is more than or equal to 1), and the pitch angle of the LED chip 2201 can be set to be (90/n) °, so that the LED lamp has good light distribution and luminous efficiency. Any two LED chip groups have different light-emitting spectrums so as to enable the brightness of the LED lamp to be uniform and improve the color rendering of the LED lamp, and certainly, two or more than two LED chip groups can have the same light-emitting spectrums so as to enable the LED lamp to have good light-emitting effect.

In an embodiment, the average distance between the adjacent LED chips 2201 in any radial direction of the circuit board 201 and/or the average distance between the adjacent LED chips 2201 on the same circumference is smaller than the distance between the first insulating portion 202 and the LED chips 2201 in the thickness direction of the optoelectronic module, so that the brightness unevenness in the circumferential direction of the first insulating portion can be reduced, and more uniform brightness can be realized.

In this embodiment, in the same LED chip set 221, the center distance between two adjacent LED chips 2201 is L3, and the center distance between any LED chip 2201 of any group of LED chip sets 221 and the nearest LED chip 2201 of the adjacent LED chip set 221 is L4, which meets the following relationship: l3: l4 is 1: 0.8-2, preferably L3: l4 is 1: 1-1.5. Therefore, the distribution of the LED chips 2201 is more uniform, and the purpose of uniform light emission is achieved.

In this embodiment, as shown in fig. 18, in the inner ring, two adjacent LED chips 2201 form a central angle a1 with the axis of the LED lamp, in the middle ring, two adjacent LED chips 2201 form a central angle a2 with the axis of the LED lamp, and the angle of the central angle a2 is smaller than the angle of the central angle a 1. In the outer ring, two adjacent LED chips 2201 form a central angle A3 with the axis of the LED lamp, and the central angle A3 in the outer ring is smaller than the central angle a2 in the inner ring. For example, the outer ring has more LED chips 2201 than the middle ring, and therefore, the distance between adjacent LED chips 2201 in the outer ring is not much larger than the distance between adjacent LED chips 2201 in the middle ring, and even the distance between the adjacent LED chips 2201 in the middle ring can be close to or equal to each other, so that the arrangement of the LED chips 2201 is more uniform, and the light emission is more uniform. In other words, the LED chip sets 221 are arranged in a plurality of groups, each group is arranged on the circuit board 201 in a ring shape, and an angle of a central angle formed by two adjacent LED chips 2201 of the LED chip set 221 on the inner side relative to the axis of the LED lamp is larger than an angle of a central angle formed by two adjacent LED chips 2201 of the LED chip set 221 on the outer side relative to the axis of the LED lamp. That is to say, the LED chip sets 221 on the outer side have more LED chips 2201 than the LED chip sets 221 on the inner side, so that the distance between two adjacent LED chips 2201 of the LED chip sets 221 on the outer side is closer to the distance between two adjacent LED chips 2201 of the LED chip sets 221 on the inner side, and therefore, the arrangement of the LED chips 2201 is more uniform, so that the light emission is more uniform.

In this embodiment, at least two groups of LED chip sets 221 are disposed, at least two groups of LED chip sets 221 are sequentially arranged in a radial direction of the circuit board 201, each group of LED chip sets 221 includes at least one LED chip 2201, any one LED chip 2201 in one group of LED chip sets 221 in the radial direction of the circuit board 201 and any one LED chip 2201 in another group of LED chip sets 221 adjacent to the radial direction of the circuit board 201 are staggered in the radial direction of the circuit board 201, that is, between the LED chips 2201 of different LED chip sets 221, in different directions in the radial direction of the LED lamp, i.e., any line starting from the axis of the LED lamp and extending in the radial direction of the LED lamp, such as two or more LED chips 2201, the two or more LED chips 2201 are cut at different positions, i.e., the two or more LED chips 2201 are not cut at the same position. In this way, if the surface of the circuit board 201 has convection, when air convects in the radial direction of the circuit board 201, due to the relationship of the air flow path, the air contacts the LED chip 2201 more sufficiently on the flow path, so that the heat dissipation effect is better. In addition, from the light emitting effect, the arrangement mode of the LED chips 2201 is more beneficial to the uniformity of the emitted light.

In this embodiment, an open region 2202 is formed between two adjacent LED chips 2201 in the same LED chip group 221 to allow air to flow between the LED chips 2201, so as to remove heat generated by the LED chips 2201 during operation. And two groups of LED chip sets 221 which are adjacent to each other in the radial direction of the circuit board 201, wherein an open area 2202 between any two adjacent LED chips 2201 in one group of LED chip sets 221 and an open area 2202 between any two adjacent LED chips 2201 in the other group of LED chip sets 221 are staggered in the radial direction of the circuit board 201 and are communicated with each other. In this way, assuming that air convects in the radial direction of the circuit board 201, due to the relationship of the air flow path, the air contacts the LED chip 2201 more sufficiently on the flow path, so that the heat dissipation effect is better. If two groups of radially adjacent LED chip groups 221 of the circuit board 201 are provided, wherein an open region 2202 between any two adjacent LED chips 2201 in one group of LED chip groups 221 and an open region 2202 between any two adjacent LED chips 2201 in the other group of LED chip groups 221 are in the same direction in the radial direction of the circuit board 201, air directly flows in the radial direction of the circuit board, and on a flow path, the contact between the air and the LED chips 2201 is reduced, which is not beneficial to heat dissipation of the LED chips 2201.

For example, the LED chip sets 221 are provided in three groups, and are sequentially arranged along the radial direction of the circuit board 201, and the open regions 2202 in any of the three groups of LED chip sets are not in the same direction in the radial direction of the circuit board 201. Therefore, the convection circulation path on the surface of the circuit board 201 is optimized, and the heat dissipation efficiency is improved.

In one embodiment, each LED chip set 221 includes only one LED chip 2201, the LED chips 2201 on each circumference can be staggered in the circumferential direction, the arrangement has good color mixing and light uniformity, and secondly, since the LED chips 2201 include LED chips and light conversion layers, the light conversion layers include glue and fluorescent powder, by adjusting the ratio of the glue to the fluorescent powder, the LED chips on one circumference can emit white light, such as warm white light, sunlight light, etc., and the LED chips on the circumference adjacent to the white light, such as red light, green light, blue light, etc., the first insulating portion 202 is provided with a first diffusion portion and a second diffusion portion respectively corresponding to the white light and the primary light, the thickness of the first diffusion portion in the optical axis direction of the LED chips 2201 is smaller than the thickness in the other directions than the optical axis direction of the LED chips 2201, the white light emitted by the LED chips is uniformly diffused by the first diffusion portion, the second diffusion portion has a uniform thickness, and the primary color light emitted from the LED chip is emitted with the same light distribution without diffusion through the second diffusion portion, thereby adjusting color temperature contrasts on different circumferences to reproduce sky blue, and providing a proper illumination space according to a living scene.

In an embodiment, the LED chips 2201 may be provided with lenses, for example, the circuit board 201 is provided with three LED chip sets respectively located on a first circumference, a second circumference and a third circumference which are concentric and have different radii, the LED chips 2201 on the first circumference and the second circumference cover the tubular lens, and each LED chip 2201 on the third circumference covers a single lens, so that the illuminance of the LED lamp is uniform.

In one embodiment, a portion of the LED chip sets may be irradiated toward the central portion of the LED lamp (or the central axis direction of the lamp), and a portion of the LED chip sets may be irradiated in a direction away from the circuit board 201 to prevent the central portion of the LED lamp from generating a dark portion.

In an embodiment, two sets of LED chip sets 221 are disposed on the circuit board 201, the two sets of LED chip sets are respectively disposed on 2 concentric circles with different radii, the first set of LED chip sets is disposed on one circle, the second set of LED chip sets is disposed on the other circle, the first insulating portion 202 is respectively disposed with a first absorption region and a second absorption region corresponding to the first set of LED chip sets and the second set of LED chip sets, when the color temperature of the light emitting color of the first set of LED chip sets is less than the color temperature of the light emitting color of the second set of LED chip sets, the wavelength absorption amount of the first absorption region is greater than the wavelength absorption amount of the second absorption region, so as to improve the color rendering property and the color temperature of the lamp and reduce the color rendering Deviation (DUV).

In one embodiment, at least one heat dissipation hole can be formed in the circuit board, and air can flow on the first surface and the second surface of the circuit board, so that the heat dissipation effect of the LED lamp is improved.

In an embodiment, as shown in fig. 18 to 22, the circuit board is provided with an opening 222, the LED chip set 221 is disposed around the opening 222, and after the LED lamp is installed, the opening 222 corresponds to a hole 33 (see fig. 45 to 46) on the base 3 described later. The area of the opening 222 accounts for 2% -50% of the area of the circuit board 201, preferably the area of the opening accounts for 10-30% of the area of the circuit board, more preferably the area of the opening accounts for 10-20% of the area of the circuit board, on one hand, because most of the existing circuit boards are cut, the area of the opening is too large, and excessive leftover materials are generated, so that the resource waste is caused, and the cost is increased; on the other hand, the circuit board with the same area has too large opening area under the condition of the same luminous flux, the distance between the adjacent LED chips is reduced, and the heat generated during the work of the LED chips is easy to influence each other, thereby influencing the product quality.

In an embodiment, the light source module 22 may further include a lens unit, the lens unit covers the circuit board 201, the lens unit is disposed in multiple forms, one of the multiple forms is disposed on the circuit board 201, a plurality of LED chip sets are disposed on the circuit board 201, a small night lamp is disposed between adjacent LED chip sets, the lens unit includes a lens main body covering the LED chip sets and a communicating portion communicating with the adjacent lens main body and covering the small night lamp, and a light emitting surface of the lens main body can be a curved surface, so that light emitted from the small night lamp is diffused to the center and the outside of the LED lamp, and uniform irradiation can be achieved; the lens unit is provided with two ridges, a small night lamp is arranged between the two ridges, and the small night lamp is used as a point light source with opposite directivity and plays a role in light distribution; thirdly, the lens unit can be provided with a bulge, so that light emitted by the LED chip 2201 on the circuit board 201 is mainly diffused and emitted towards the radius direction taking the center of the circuit board 201 as the origin, and the granular sensation is inhibited when the light source module is lightened; fourthly, a plurality of groups of LED chip groups are arranged on the circuit board 201, the number of the lens units is larger than 2, an avoiding part is arranged between the lens units, the circuit board 201 is provided with an opening, the LED chip groups are arranged around the opening, and the avoiding part is provided with a concave part facing the opening to prevent the first insulating part 202 from light interference; fifth, the lens unit has a concave portion aligned with the LED chip 2201 to accommodate the LED chip 2201, the lens unit has an incident surface and an opposite projection surface, the diffusion rate in the area of the projection surface close to the optical axis of the LED chip 2201 and the incident surface is set higher than that in the other areas, the luminance distribution of the lamp cover becomes smooth, and the light transmission efficiency is high; sixthly, the lens unit has a first surface and a second surface, the second surface is a light incidence surface near one side of the LED chip 2201, the second surface is a surface through which the light incident from the first surface of the LED chip 2201 is transmitted to the outside, the first surface includes a light control surface which distributes the light emitted from the LED chip 2201 at a large angle, a plurality of convex portions or a plurality of concave portions are provided around the light control surface, and the generation of bright lines on the lamp cover can be suppressed by the diffusion of the plurality of convex portions or concave portions; seventhly, the lens unit comprises a plurality of lenses, each lens covers each LED chip 2201, namely the number of the lenses is equal to that of the LED chips 2201, the first insulating part 202 is provided with a light-transmitting lens cover, the lens cover enables light of the LED chips 2201 to be emitted towards the center of the lamp, and the light distribution peak angle of the lenses can be set, so that the uniformity is improved; eighthly, the lens unit comprises a concave part for the incidence of the light emitted by the LED chip 2201 and an LED containing part, the contact between the LED chip and the concave part is inhibited by containing the LED chip, and the LED containing part and the concave part are smoothly continuous through a convex curved surface which is convex relative to the LED chip; ninth, the lens unit includes a first light distribution area having a first outer surface that reflects light inward in the optical axis direction of the LED chip 2201 and a second light distribution area having a second outer surface that reflects light outward in the optical axis direction of the LED chip 2201, and by adjusting the position of the LED chip, a part of illuminance can be suppressed to prevent glare. The arrangement of the LED chips 2201 according to the second to ninth embodiments may be the arrangement in the above-described embodiments, or may be another arrangement.

In one embodiment, the circuit board 201 may also take other different forms, for example, the circuit board 201 may include a plurality of sub-circuit boards 201, and the sub-circuit boards 201 may be configured in a plurality of different structures, in one embodiment, at least one sub-circuit board 201 has a certain inclination angle with respect to the base 3; in one embodiment, any one of the sub-circuit boards 201 has an inner region where no LED chip 2201 is disposed and an outer region where the LED chip 2201 is disposed, for example, the outer region is formed by a minimum region surrounded by all the LED chips 2201 on any one of the sub-circuit boards, the LED chips 2201 close to the inner region have a small interval, and the LED chips 2201 far away from the inner region have a large interval, so that the LED lamp can emit light uniformly; in one embodiment, the sub circuit boards 201 are arranged in the circumferential direction, each sub circuit board 201 is provided with LED chips 2201 with different colors, the color light of the nearest LED chip of the adjacent sub circuit boards 201 is different, the distance between the adjacent LED chips in the sub circuit boards 201 is equal to the shortest distance between the LED chips of the adjacent sub circuit boards 201, and the light emitting surface can be uniformly emitted by the arrangement of the LED chips with different colors; in one embodiment, the adjacent sub circuit boards 201 are connected through the connecting portion, the protruding portion of one sub circuit board 201 is accommodated in the accommodating portion of the adjacent sub circuit board 201, light emitted from the LED chip is easily diffused in a direction orthogonal to the extending direction of the LED chip, and the center of the connecting portion is prevented from being darkened, so that the brightness unevenness of the light emitting surface of the LED lamp is prevented; in one embodiment, the circuit board 201 is composed of two sub-circuit boards 201, the first insulating portion 202 is provided with a reflection portion, and the reflection portion has a first reflection surface for obliquely reflecting light emitted from the LED chip on one sub-circuit board 201 from a vertical direction of the circuit board and a second reflection surface for reflecting light emitted from the LED chip on the other sub-circuit board 201 toward the center of the lamp, so as to suppress brightness unevenness on the first insulating portion.

In an embodiment, the circuit board 201 may also take other different forms, for example, the circuit board 201 includes an inner area provided with the power module 23 and an outer area provided with the light source module 22, the outer area is far away from the center of the circuit board 201 relative to the inner area, the outer area is alternately configured with a plurality of first blocks and a plurality of second blocks in a mutually adjacent manner, the average value of the distances from the plurality of LED chips 2201 configured in the first blocks to the center of the circuit board 201 is larger than the average value of the distances from the plurality of LED chips 2201 configured in the second blocks to the center of the circuit board 201, so that the light emitted from the LED chips in the outer area can be inhibited from being blocked by the second insulating part 203 which is disposed in the inner area and covers the power module, and the light emitting surface luminance of the lamp housing can be ensured to be uniform;

in some embodiments, the circuit board 201 can also take other different forms, as shown in fig. 19 to 20, the second surface 2012 of the circuit board 201 includes a third region 2014b for placing the power module 23 and a fourth region 2015b for not placing the power module 23, in this embodiment, the first region 2014a and the third region 2014b include an opening 222, the opening 222 communicates with the first region 2014a and the third region 2014b, for example, a circle formed by taking the center of the circuit board as a center and taking the maximum distance from the electronic elements of the power module to the center as a radius has a third region area, the first surface 2011 includes a first region 2014a opposite to the third region 2014b and a second region 2015a opposite to the fourth region 2015b, the number of LED chips in the first region 2014a is smaller than the number of LED chips in the second region 2015a, so as to significantly reduce the dark area in the LED lamp, the light-emitting effect of the LED lamp is improved, and on the other hand, the influence of heat generated by the power supply module on the light source module can be reduced. In some embodiments, the third region 2014b is close to the central axis of the LED lamp (or the central axis of the optoelectronic module), the fourth region 2015b is far away from the central axis of the LED lamp (compared with the third region 2014b), and since the power module 23 is disposed near the center of the LED lamp, in the transportation process, the amplitude of the external force applied to the optoelectronic module 2 is small, and the power module 23 is not damaged by the external force. When the power module 23 includes the aforementioned first power module 231 and the second power module 232, the power module referred to in the description of fig. 19-20 is the second power module 232, in other embodiments, the first region 2014a and the third region 2014b do not include the opening 222, and the maximum distance from the end or the edge of the opening 222 to the first region 2014a is smaller than the distance from the end or the edge of the opening 222 to the LED chip 2201.

In some embodiments, the circuit board 201 can also take different forms, as shown in fig. 21 and 22, the second side 2012 of the circuit board 201 includes a seventh region 2016b and an eighth region 2017b, the electronic components of the power module 23 include a heating element (a component generating more heat during operation, such as an IC, a resistor, etc.) and a thermolabile element (meaning a component which is liable to change its operation capability due to heat, such as an electrolytic capacitor), wherein the heating element and the thermolabile element are respectively located in the seventh region 2016b and the eighth region 2017b, which can reduce the influence of the heat generated during operation of the heating element on the thermolabile element and improve the reliability and lifetime of the whole power module 23, the first side 2011 includes a fifth region 2016a opposite to the seventh region 2016b and a sixth region 2017a opposite to the eighth region 2017b, the number of LED chips located in the fifth region 2016a is smaller than the number of LED chips located in the sixth region 2017b, thereby reducing the influence of the heat generated by the power module on the light source module. When the power module 23 includes the aforementioned first power module 231 and the second power module 232, the power module referred to in the description about fig. 21 to 22 is the second power module 232.

In an embodiment, the circuit board 201 may also take other different forms, in order to improve the heat dissipation efficiency of the light source module, the circuit board 201 includes an inner region configured with the power module 23 and an outer region configured with the light source module 22, the outer region is far away from the center of the circuit board 201 relative to the inner region, a weak portion (a gap or a groove) is disposed between the inner region and the outer region, and the position of the weak portion is easy to bend, so that the sealing degree between the circuit board 201 and the base can be improved, and the heat dissipation area is increased.

In an embodiment, the circuit board 201 can also adopt other different forms, the optoelectronic module includes a small night light, the circuit board 201 includes a first area configured with the small night light and a second area configured with the LED chip 2201, the first area is close to a central axis of the LED lamp (or a central axis of the optoelectronic module), a slit is formed between the small night light and the LED chip 2201, so as to ensure an insulation distance between the small night light and the LED chip, and prevent a short circuit caused by a potential difference between the small night light and the LED chip.

In an embodiment, the circuit board 201 may also take other different forms, such as an optical member disposed on the circuit board 201 for controlling the light distribution of the light emitted from the LED chip 2201, the optical member having a dome-shaped incident surface, an exit surface and a medium portion between the positions, the ratio of the distance r from the LED chip to the incident surface in the optical axis direction to the distance d from the LED chip to the incident surface in the peripheral direction is r/d < 1, and the corresponding light space can be generated according to the living scene by adjusting r and d.

As can be seen from fig. 10 to 11, the first insulating portion 202 has a certain curvature from the center of the light source module 22 to the edge along the radial direction of the light source module 22, or the first insulating portion 202 has a certain curvature from one end of the light source module 22 to the other end of the light source module 22 along the radial direction of the light source module 22, or the first insulating portion 202 has a certain curvature from the center of the circuit board 201 to the end of the first insulating portion 202 along the radial direction of the circuit board 201. The arc corresponds to a central angle of 2 ° to 50 °, preferably 5 ° to 15 °. The first insulating portion 202 is designed to have a radian, so that the stress intensity of the first insulating portion in the transportation process can be increased, the integrity of the photovoltaic module 2 is protected, the inclination of the first insulating portion relative to the circuit board can be alleviated, and light rays are distributed softly. In other embodiments, the first insulating portion 202 includes a transparent substrate and a light diffusion layer having light transmittance, the transparent substrate is close to the circuit board 201, a decoration layer forming a predetermined pattern is disposed between the transparent substrate and the light diffusion layer, and light transmitted through the decoration layer is not scattered by the light diffusion layer, so that when the LED lamp is viewed from the floor side, a clear pattern can be seen, and the lighting effect can be enhanced.

As shown in fig. 10 to 12, the second insulating portion 203 is provided with a plurality of first holes 2032, and a space for accommodating electronic components is formed between the second insulating portion 203 and the circuit board 201. The first holes 2032 are disposed to facilitate air convection in the space for accommodating the electronic components, so that at least a portion of heat generated by the electronic components during operation is discharged through the first holes 2032, thereby enhancing the heat dissipation effect of the electronic components.

In an embodiment, the second insulating portion 203 may take other different forms, and the second insulating portion 203 may be composed of a plurality of blocks, and the blocks have overlapping regions therebetween, and a distance from the overlapping region to the base 3 is smaller than a distance from other portions (other regions except the overlapping region) of the second insulating portion 203 to the base 3, so as to prevent the second insulating portion from contacting the power module, increase a heat dissipation path, and improve a heat dissipation effect.

In an embodiment, the first insulating portion 202 can take other different forms, and the first insulating portion 202 includes a central region and an end region, wherein the central region is close to the central axis of the LED lamp (or the central axis of the optoelectronic module), the end region is far away from the central axis of the LED lamp (or the central axis of the optoelectronic module) compared to the central region, and the end region is provided with a light guiding reflection portion for guiding the light emitted from the light source module 22 from the central region to the end region, so as to increase the illumination range of the lamp.

In one embodiment, the first insulating portion 202 can take other different forms, and the first insulating portion 202 has an inner region, an outer region and a middle region located between the inner region and the outer region, the inner region is closer to the central axis of the LED lamp (or the central axis of the optoelectronic module) than the outer region and the middle region, and the inner region has a first thick portion thicker than the middle region, and the first thick portion can provide a lens effect, so that the central portion of the lamp is bright and the optical loss is small.

In an embodiment, the first insulating portion 202 may take other different forms, and the surface of the first insulating portion 202 may have a plurality of prisms, each prism having a first prism surface and a second prism surface with different inclination angles with respect to the circuit board 201, and light emitted from the LED chip is incident on the first prism surface and the second prism surface and refracted, so that discomfort caused by glare can be suppressed.

In an embodiment, the first insulating portion 202 may take other different forms, and the first insulating portion 202 has a light-transmitting portion with high light transmittance and a lens portion with low light transmittance, and the light-transmitting portion surrounds the lens portion and is far away from a central axis of the LED lamp, so that the illuminance of the lamp cover is uniform, and the light output rate of the lamp is high. In one embodiment, the first insulating portion 202 is provided with a lens, which can control the radial and circumferential light distribution of the first insulating portion, suppress the circumferential brightness unevenness of the lamp, and ensure the radial light distribution.

In an embodiment, first insulating portion 202 can adopt other different forms, photovoltaic module 2 includes little night-light, little night-light sets up on the circumference of the center pin (or the center pin of photovoltaic module) that is closest to the LED lamps and lanterns, be equipped with the mask that can penetrate the pattern on the little night-light, can guarantee the luminous efficacy of lamps and lanterns and improve light designability, little night-light is when opening in addition, can produce the bright line on the lamp shade 1, for preventing this phenomenon from appearing, little night-light is equipped with the diffusion hood outward and carries out the diffusion, first insulating portion 202 covers little night-light and light source module 22's the region is for not having concave-convex even surface, therefore can not produce the bright line.

In an embodiment, the first insulating portion 202 and the second insulating portion can take other different forms, as shown in fig. 23 and fig. 24, in this embodiment, the lens assembly 212 is disposed on the first insulating portion 202, and the lens assembly 212 is disposed corresponding to the LED chip set 221, that is, the lens assembly 212 is disposed above the LED chip set 221 to cover the LED chip set 221, so that the light distribution is more dispersed and uniform; the lens group is formed in one step through an injection molding process, the production cost is reduced compared with the case of independently installing the lens, the first insulation portion 202 is provided with a plurality of groups of radiating holes, each group of radiating holes comprises a plurality of radiating holes 211, at least one group of radiating holes is close to the LED chip group 221, heat of the circuit board 201 can be quickly radiated, and the radiating effect is greatly improved. In addition, the second insulating portion 203 may also be provided with heat dissipation holes 211, so as to further reduce the temperature of the power module and prolong the service life of the lamp, the second insulating portion is provided with a plurality of auxiliary portions 2033, the plurality of auxiliary portions 2033 are distributed circumferentially, of course, other distribution manners may be adopted, when the insulating unit is fixed to the circuit board, the auxiliary portions may increase the connection strength between the insulating unit and the circuit board, and in addition, the heat dissipation area of the second insulating portion may be increased, so as to improve the heat dissipation effect. In other embodiments, the heat dissipation hole 211 may be disposed in the middle of the first insulating portion 202 (close to the central axis of the optoelectronic module), and a plurality of notches are disposed at intervals on the outer edge of the first insulating portion 202, so that air can convect between the circuit board and the first insulating portion, thereby improving the heat dissipation effect.

Fig. 25 is a schematic structural diagram of another embodiment of the optoelectronic module 2b, as shown in fig. 25, the optoelectronic module 2b includes a light source module 22 and a power supply module 23, a reflective member 29 is disposed between the light source module 22 and the power supply module 23, the light source module 22 surrounds the reflective member 29, the light source module 22 includes a circuit board 201 and at least one LED chip set 221 located on the circuit board 201, each LED chip set includes a plurality of LED chips 2201, a light emitting surface of each LED chip 2201 faces a central axis of the lamp, a middle dark area can be effectively eliminated, and a light emitting effect of the lamp is improved. Referring to fig. 55 to 56, a part of light emitted from the LED chip 2201 is reflected by the reflector 29 and then exits the lamp housing 1. In one embodiment, the outer surface of the LED chip 2201 can be isolated from the external environment through a colloid (e.g., silicon gel) to avoid the risk of electric shock. Or a glue layer of uniform thickness may be applied over the entire circuit board 201.

In this embodiment, the LED light source module 22 further includes a heat dissipation member 223, the heat dissipation member 223 may be an aluminum ring, a copper ring, etc., the circuit board 201 is attached on the heat dissipation member 223, in order to improve the heat dissipation effect, a heat dissipation rib (not shown) may be disposed on a surface of the heat dissipation member 223 far away from the circuit board 201 to increase the heat dissipation area, and the heat dissipation rib and the circuit board 201 are disposed on two surfaces opposite to the heat dissipation member 223.

In this embodiment, the LED light source module 22 can be prepared by the following steps:

1) clamping the bonding pad end of the circuit board 201 into a clamping groove of the turntable, starting the turntable, and adsorbing the circuit board 201 in the clamping groove of the turntable in a surrounding manner;

2) the dispensing head is aligned with the circuit board 201, dispensing is started when the turntable rotates, and the turntable stops rotating after dispensing is finished;

3) the heat dissipation member 223 is clamped in the clamping groove of the turntable, the heat dissipation member 223 is cut off after the turntable rotates for one circle, and the heat dissipation member 223 and the circuit board 201 are taken out;

4) the LED chip 2201 is attached to the circuit board 201 to obtain the LED light source module 22. The preparation method is simple to operate, low in equipment cost and capable of effectively improving production efficiency and reducing production cost.

As shown in fig. 26 to 28, the optoelectronic module 2 of the present application further includes a connector terminal 24, the electrical connection terminal 24 is electrically connected to an external power source (e.g., commercial power) for receiving an external power signal and transmitting the power signal to the LED lamp, the connector terminal 24 is connected to the electronic component on the second surface 2012 through a wire 241, and a connection point of the wire 241 and the circuit board 201 is located on the second surface 2012 of the circuit board 201. In this embodiment, all the electronic components of the power module are located on the second surface 2012, but not limited thereto. An opening 2018 is formed in the circuit board 201, the opening 2018 is communicated with the first face 2011 and the second face 2012, the opening 2018 is close to the lead 241, the distance from the opening 2018 to the lead 241 in the radial direction of the circuit board is smaller than the length of the lead 241, and preferably, the shortest distance from the opening 2018 to the lead 241 in the radial direction of the circuit board is smaller than the length of the lead 241, so that stable electrical connection is guaranteed. The first insulating portion 202 is provided with a fixing buckle 2025, after the optical electrical module 2 is assembled, the fixing buckle 2025 is located in an area at an angle of 30 degrees to 60 degrees with the first surface 2011, preferably, the fixing buckle 2025 is located in an area at an angle of 30 degrees to 45 degrees with the first surface 2011, so that when a user assembles the optical electrical module by himself, the connector terminal 24 is easily fixed to the fixing buckle 2025 through the opening 2018, and a portion of the connector terminal 24 is exposed out of the first insulating portion 202, so as to facilitate subsequent electrical connection. Fig. 26 illustrates an assembly method according to an embodiment of the optoelectronic module of the present application, referring to fig. 26 to 28, which includes:

1) the connector terminal 24 is connected to the electronic component on the circuit board 201 through a wire 241, and presses the circuit board 201 into the first insulating portion 202;

2) a fixing buckle 2025 for pressing the connector terminal 24 into the first insulating portion 202 through the opening 2018 of the circuit board 201, wherein a part of the connector terminal 24 is exposed out of the first insulating portion 202;

3) the second insulating portion 203 is fixed on the circuit board 201, and the second insulating portion 203 covers the wires 241 and all the electronic components on the second surface 2012.

When the photoelectric module is assembled at present, the circuit board is firstly fixed on the base, then the connector terminal is fixed on the fixing buckle on the first insulating part, and finally the first insulating part is fixed. However, when the connector terminal is fixed, the position of the first insulating portion needs to be adjusted when the first insulating portion is fixed, and an electrical connection point between the connector terminal and the circuit board is easy to loosen and unstable in electrical connection in the adjusting process; in order to solve the problem that the electric connection is not stable, a longer wire needs to be adopted, but the wire is too long, so that the wire cost is increased. The assembly method for the photoelectric module is simple and convenient, the photoelectric module can be assembled by a user, and the length of the lead used for the connector terminal and the circuit board is short, so that wires can be saved; after the assembly is finished, the connector terminal and the circuit board form a certain angle, so that the height of the exposed first surface of the connector terminal is minimized, and light emitted by the light source module is not shielded.

As shown in fig. 29 to 35, a first projecting portion 2101 is provided on an outer edge of the first insulating portion 202, and the first projecting portion 2101 projects with respect to the outer edge of the first insulating portion 202. In this embodiment, the first insulating portion 202 may be provided as a solid of revolution structure, and the first projecting portion 2101 may be provided in plurality at the outer edge of the first insulating portion 202 in the circumferential direction of the first insulating portion 202. In this embodiment, a mounting portion 31 is provided on the base 3, and the mounting portion 31 provides mounting for the first projecting portion 2101. Specifically, the mounting portion 31 has a first mounting portion 315, and the first mounting portion 315 has a first slot 3111. The first insulating portion 202 has a fixed position where the first projecting portion 2101 is caught and fixed in the first catching groove 3111 and a released position where the first projecting portion 2101 is separated from the first catching groove 3111. In this embodiment, the first insulating portion 202 is configured to be rotated (substantially about the axis of the LED lamp) between the fixed position and the release position. In this embodiment, two sides of the first slot 3111 in the axial direction of the LED lamp are sealed by the first mounting portion 315 and the base 3, so that after the first protrusion 2101 is clamped into the first slot 3111, two sides of the first protrusion 2101 in the thickness direction of the LED lamp are limited. In other embodiments, the first card slot 3111 is closed at two sides of the LED lamp in the axial direction by the structure of the first mounting portion 315, so as to achieve the same function as described above. In this embodiment, the first mounting portion 315 has a positioning unit to position the first protrusion 2101 snapped into the first card slot 3111. Specifically, the positioning unit includes a first elastic arm 3112, a first groove 3113 is formed between the first elastic arm 3112 and the first mounting portion 315, and when the positioning unit is at the fixed position, the first protrusion 2101 is clamped into the first groove 3113 at the end of the LED lamp in the radial direction, so as to fix the first insulating portion 202. A first stopper 31121 is formed on the first elastic arm 3112. Through the arrangement of the first elastic arm 3112, when the first protrusion 2101 needs to be disengaged from the first slot 3111 and the first insulating portion 202 is rotated, the first blocking portion 31121 needs to be overcome (i.e. a force needs to be applied to the first insulating portion 202, so that the first protrusion 2101 presses the first elastic arm 3112 to disengage it), thereby preventing the first insulating portion 202 from being disengaged from the first slot 3111 due to misoperation or collision, etc. In this embodiment, when in the fixed position, the first elastic arm 3112 can apply a force to the first protrusion 2101 to further secure the first insulating portion 202. The first elastic arm 3112 can be integrally formed with the first mounting portion 315. The first elastic arm 3112 can be a sheet-like structure with elasticity due to its material property (e.g., plastic or metal can be used as the elastic material in the prior art). The first stopper 31121 may be directly formed by bending the first elastic arm 3112 (or providing a bend in the first elastic arm 3112).

In this embodiment, the first mounting portion 315 and the second mounting portion 316 are an integral component, and the first card slot 3111 and the second card slot 3114 are respectively located at two opposite sides of the component. In other embodiments, the first mounting portion 315 and the second mounting portion 316 can also be formed in a split structure (not shown).

The photoelectric module 2 can also be connected with the base 3 by adopting other structures. As shown in fig. 2 and fig. 36, in some embodiments, the optoelectronic module 2 is fixed to the base 3 by magnetic connection (in this embodiment, other basic structures are the same as those in the previous embodiments). Specifically, the first insulating portion 202 of the photovoltaic module 2 has a first protrusion 2101, a magnet 2102 is disposed on the first protrusion 2101, and the base 3 includes a portion or member made of iron, so that fixation can be performed by directly attaching the magnet 2102 to the base 3. In other embodiments, the magnet may also be disposed at different positions, such as on the light source module, the power module or the second insulating portion, which is not described herein again. As shown in fig. 37, the optoelectronic module 2 can also be connected to the base 3 by screwing (in this embodiment, other basic structures are the same as those in the previous embodiment). Specifically, the first insulating portion 202 of the optoelectronic module 2 has a first protrusion 2101, a bolt 2103 is disposed on the first protrusion 2101, and the bolt 2103 is connected to the base 3, so as to fix the optoelectronic module 2. In other embodiments, the bolt may also be disposed at different positions, such as on the light source module, the power source module or the second insulating portion, which is not described herein again. In an embodiment, as shown in fig. 38 and 39, the optoelectronic module 2 may be connected to the base 3 by other screw fastening methods, the base 3 is provided with a plurality of through holes 3201a, the through holes 3201 may be located on a circumference, the first insulating portion 202 of the optoelectronic module 2 is provided with screw holes, and screws are inserted through the through holes to the screw holes, thereby fastening the optoelectronic module to the base. In some embodiments, as shown in fig. 40, the base 3 is provided with a plurality of through holes 3201b, the through holes 3201b may be located on a circumference, the studs 3202 are disposed in the through holes 3201, the studs 3202 are press-riveted on the base 3, the first insulating portion 202 of the optoelectronic module 2 is provided with screw holes 3203, and screws pass through the screw holes 3203 to the studs 3202, thereby fixing the optoelectronic module 2 on the base 3.

The basic structure of the LED lamp shown in fig. 41 is the same as that of the lamp (ceiling lamp) of the foregoing embodiment, except that the optoelectronic module 2 is fixed to the base 3, specifically, as shown in fig. 41 and 42, the base 3 is provided with the mounting portion 31, the mounting portion 31 includes a fixing portion 314 and an inclined portion 317 connected to the fixing portion 314, the fixing portion 314 includes an upper limit portion 3141 and a lower limit portion 3142 opposite to the upper limit portion 3141, the lower limit portion 3142 is connected to the inclined portion 317, a connecting portion 3143 is provided between the upper limit portion 3141 and the lower limit portion 3142, the connecting portion 3143 is connected to the positioning portion 313, and the positioning portion 313 is opposite to the inclined portion 317. After a part of the corner of the photovoltaic module 2 slides along the inclined portion 317 to the lower positioning portion 3142, the positioning portion 313 maintains a fixed state, and the surface of the upper positioning portion 3141 contacts a part of the surface of the photovoltaic module 2.

The spatial position of the mounting portion 31 is located in a cartesian coordinate system (x, y, z) shown in fig. 42, an x-y plane is parallel to the upper surface of the lower limit portion 3142, an included angle α between the inclined portion 317 and the x-y plane is set to be 0 < α ≦ 20 °, preferably 5 ° < α ≦ 15 °; the included angle between the positioning part 313 and the x-z plane is beta, the included angle beta is more than or equal to 10 degrees and less than or equal to 50 degrees, preferably more than or equal to 20 degrees and less than or equal to 40 degrees, and the light source module can be fixed in the mounting part by adjusting beta. The positioning portion 313 is provided with the elastic plate 3131, the included angle gamma between the elastic plate 3131 and the x-z direction is in a range of 28 degrees & lt gamma & lt 68 degrees, preferably 38 degrees & lt gamma & lt 58 degrees, when the photoelectric module is damaged and needs to be replaced, the photoelectric module can slide out of the fixing portion, and through designing gamma, the photoelectric module can be replaced conveniently by a user, and the working efficiency is improved. The maximum length of the positioning portion 313 in the z-axis direction is set to be L1, and when the optical electrical module 2 slides into the lower positioning portion 3142, the minimum length of the optical electrical module 2 in the z-axis direction is set to be L2, and the sum of L1 and L2 is greater than the distance D from the upper positioning portion 3141 to the lower positioning portion 3142, so that the fixing effect of the optical electrical module is better.

In an embodiment, as shown in fig. 43 and 44, an LED lamp is provided, and the basic structure of the LED lamp is the same as that of the lamp (ceiling lamp) in the foregoing embodiment. The difference is the concrete fixing mode of the optoelectronic module 2 and the base 3. Specifically, refer to fig. 43 and 44, be equipped with mounting hole 28 on the photovoltaic module 2 in this embodiment, mounting hole 28 can be located the both ends of photovoltaic module 2, be equipped with installation portion 31 on the base 3, the quantity of mounting hole 28 is the same with the quantity of installation portion 31, installation portion 31 includes supporting part 311 and the fastener portion 312 that is fixed in on supporting part 311, fastener portion 312 includes pars contractilis 3121 and spacing portion 3122, during the photovoltaic module installation, aim at fastener portion 312 with mounting hole 28 on the photovoltaic module 2, then exert force for photovoltaic module 2, make pars contractilis 3121 atress compression get into in the mounting hole 28 of photovoltaic module 2, and then photovoltaic module 2 blocks in the space between pars contractilis 3121 and spacing portion 3122. The height of mounting hole 28 is not less than the minimum distance between pars contractilis 3121 and spacing portion 3122, and the height of preferred mounting hole 28 equals pars contractilis 3121 and the minimum distance between spacing portion 3122, and the photovoltaic module can not appear rocking in the transportation, and photovoltaic module's fixed effect is good. After the installation is finished, as shown in fig. 44, by adopting the installation mode, the operation method is simple, the installation is convenient for a user, the working efficiency is improved, the fixing effect is good, the production cost is low, and the method is suitable for industrialization.

Referring to fig. 29 to 35, the mounting portion 31 further includes a second mounting portion 316 to provide fixation of the lamp housing 1. Specifically, the globe 1 has a wall portion 11, and the globe 1 may be provided as a revolving structure. The wall portion 11 has an edge, and a second projection 1101 is provided on the edge of the wall portion 11, and the second projection 1101 is convex inward in the radial direction of the globe 1 with respect to the edge of the wall portion 11. The second projection 1101 may be provided in plurality along the circumferential direction of the globe 1. The second mounting portion 316 has a second slot 3114. When the lamp cover 1 is fixed to the base 3, the second protrusion 1101 is snapped into the second notch 3114 for fixation. In this embodiment, the lampshade 1 rotates (approximately rotates around the axis of the LED lamp) to insert or release the second protrusion 1101 into or from the second slot 3114. In this embodiment, the second slot 3114 is sealed by the second mounting portion 316 and the base 3 at two sides of the LED lamp in the axial direction, so that after the second protrusion 1101 is clamped into the second slot 3114, two sides of the second protrusion 1101 in the thickness direction of the LED lamp are limited. In other embodiments, the second card slot 3114 is closed at two sides of the LED lamp in the axial direction by the structure of the second mounting portion 316, so as to achieve the same function as described above. In this embodiment, the second mounting portion 316 has a positioning unit to position the second protrusion 1101 snapped into the second card slot 3114. Specifically, the positioning unit includes a second elastic arm 3115, and a second groove 3116 is formed between second elastic arm 3115 and second installation portion 316, when fixing the position, second bulge 1101 is blocked in second groove 3116 at the radial tip of LED lamp to the realization is fixed to the location of lamp shade 1. A second stopper 31151 is formed on the second elastic arm 3115. Through the setting of second elastic arm 3115, when second bulge 1101 need deviate from second draw-in groove 3114 and rotate lamp shade 1, need overcome the hindrance of second stopper 31151 earlier (need apply force in lamp shade 1 promptly to make second bulge 1101 extrude second elastic arm 3115, so that it realizes the pine and takes off), thereby can prevent because of maloperation or collision etc. and lead to lamp shade 1 to loosen from second draw-in groove 3114 and take off. In this embodiment, when the lampshade 1 is fixed, the second elastic arm 3115 can apply a force to the second protrusion 1101, so as to further secure the lampshade 1. The second resilient arm 3115 may be integrally formed with the second mounting portion 316. The second elastic arm 3115 can be a sheet-like structure with elasticity due to its material property (e.g., plastic or metal can be used as the elastic material in the prior art). The second stopper 31151 may be directly formed by bending the second elastic arm 3115 (or providing a bend in the second elastic arm 3115).

The lamp housing 1 of the present application may adopt different structures, and referring to fig. 1 to 51, in an embodiment, the lamp housing 1 has a smooth curved surface to prevent the light distribution from being uneven due to the refractive index difference of the lamp housing section. In one embodiment, the lamp cover 1 includes a central portion and a peripheral portion surrounding the central portion, the lamp cover 1 has a light diffusion layer containing light diffusion particles, and the density of the light diffusion particles in the central portion is greater than that in the peripheral portion, so that the brightness in the central portion and the peripheral portion of the lamp is uniform. In one embodiment, the lamp housing 1 has a plurality of diffusion regions, wherein one of the diffusion regions overlaps the optoelectronic module 2 in the z-axis direction, thereby improving the flash of the lamp. In an embodiment, the inner surface or the outer surface of the lamp shade 1 may be provided with a brightness enhancement film for distributing light energy of the light emitted from the light source module 2, so as to realize uniform light emission of the LED lamp and avoid glare. The inner surface and the outer surface are opposite, and the inner surface of the lampshade 1 is a surface close to the photoelectric module 2. In one embodiment, the lamp cover 1 is provided with a through hole, and a mounting screw for mounting the lamp cover 1 to the base 3 is inserted into the through hole of the lamp cover 1 with play and screwed to the base 3, whereby even if the lamp cover and the base expand or contract due to a temperature change caused by opening and closing of the lamp, stress generated by the expansion or contraction can be reduced by the play, and the lamp cover and the appliance can be prevented from being broken or generating noise.

In other embodiments, a light guide plate may be disposed between the lamp housing 1 and the first insulating portion 202, for example, the light guide plate is a transparent molded acrylic resin, and the light guide plate may have a different structure, in one embodiment, the light emitting intensity of the end portion (end near the edge of the base 3) of the light guide plate is 30% of the light emitting intensity (maximum light emitting intensity) of the LED chip 2201 in the main light emitting direction; in one embodiment, the light guide plate covers the circuit board 201, the light guide plate has an asymmetric first bending portion and a second bending portion, a part of light emitted by the LED chip 2201 is directed to the first bending portion, and a part of light is directed to the second bending portion, so that the light emitted by the lamp is uniform; in one embodiment, a point-shaped scatterer can be formed on the surface of the light guide plate to realize uniform light emission of the light emitting surface; in one embodiment, the light guide plate includes a main light guide portion guiding light emitted from the LED chip 2201 to the outer circumference of the light guide plate and an auxiliary light guide portion guiding and diffusing light from the LED chip 2201 toward the central portion of the lamp; in one embodiment, the light guide plate comprises an introducing unit for introducing light into the lamp and a guiding unit for guiding the light to the outside of the lamp, so that the brightness unevenness and the glare of the light guide plate can be inhibited; in one embodiment, the light guide plate has an inner side and an outer side corresponding to the inner side, and the curvature radius of the inner side is larger than that of the outer side, so that bright spots on the lampshade can be inhibited; in an embodiment, a plurality of LED chip sets 221 are disposed on the circuit board, each LED chip set 221 includes a plurality of LED chips 2201, a light emitting surface of each LED chip 2201 faces an incident end surface of the light guide plate, the plurality of LED chip sets 221 are linearly arranged in a length direction of the circuit board 201, a first LED chip set, a second LED chip set, and a third LED chip set are sequentially linearly mounted from an end edge of the length direction of the circuit board 201 toward a center line, a first separation dimension L1 is set between the end edge of the circuit board 201 and the first LED chip set, a second separation dimension L2 is set between the first LED chip set and the second LED chip set, a third separation dimension L3 is set between the second LED chip set and the third LED chip set, L1< L2< L3, and the light guide plate is not prone to generate a dark portion; in one embodiment, the light guide plate has a light transmissive substrate, a plurality of concave prism portions are provided on a main surface of the light transmissive substrate, the concave prism portions are covered with a coating layer to prevent dust from accumulating in the main surface and the prism portions, and the thickness of the coating layer is sufficiently small to suppress a decrease in optical performance of the light guide plate. The light guide plate can be matched and combined with the LED chips on the circuit board in a non-mutually exclusive arrangement mode.

In an embodiment, the circuit board 201 is ring-shaped, for example, the circuit board 201 of the optoelectronic module 2b in the foregoing embodiment, a light guide plate may be disposed between the lamp cover 1 and the first insulating portion 202, the light emitting surface of the LED chip 2201 faces the center of the lamp, and the light guide plate may have different structures; in one embodiment, the circuit board 201 is provided with a first LED chip set and a second LED chip set, the first LED chip set is incident from an incident end surface of the first light guide plate, the second LED chip set is incident from an incident end surface of the second light guide plate, the incident light is emitted towards upper and lower surfaces of the first light guide plate and the second light guide plate, and the first light guide plate and the second light guide plate have light transmittance along the thickness direction thereof, so that the lamp has a three-dimensional light emitting effect; in one embodiment, the annular circuit board 201 is sequentially covered with a reflector, a light guide plate and a light collecting cover, wherein the convex part of the light guide plate is inserted into the concave part of the reflector, the light collecting cover has a lens region covering the emergent surface inside the light guide plate, and the lens region and the concave reflecting part on the light guide plate are located at the position opposite to each other optically, so that the light emitted by the lamp has a narrow orientation.

The base in the LED lamp of the present application can have different structures, and FIG. 45 is a schematic structural diagram of an embodiment of the base in the LED lamp of the present application, the base is located in a rectangular spatial coordinate system (x, y, z), wherein the z axis is parallel to the central axis of the LED lamp, the base 3 is disc-shaped, for example made of aluminum plate or steel plate, as shown in fig. 45 and 46, a hole 33 is formed in the central portion of the base 3, a support portion 34 and an edge portion 35 are formed around the hole 33, the support portion 34 and the edge portion 35 have a gap therebetween, a groove portion 36 is formed by extending the gap in the negative direction of the z-axis, the support portion 34 and the edge portion 35 are at the same position in the positive direction of the z-axis, of course, in other embodiments, the support portion 34 is at a different position from the edge portion 35 in the positive z-axis direction, for example, the support portion 34 is higher than the edge portion 35 in the positive z-axis direction. The photovoltaic module 2 has an upper surface and a lower surface opposite to the upper surface, the lower surface of the photovoltaic module 2 is far away from the lampshade 1, and the lower surface of the lampshade 1 is in surface contact with the supporting part 34, so that heat generated by the photovoltaic module is transmitted out through the base, and the heat dissipation speed is improved. In other embodiments, the optoelectronic module 2 and the supporting portion 34 are not in a completely attached surface contact state, a part of gap exists between the optoelectronic module 2 and the supporting portion 34, some thermal conductive adhesive layers can be filled in the gap, heat generated by the LED chip 2201 during operation can be quickly expressed to the base 3 through the circuit board 201 and the thermal conductive adhesive layers, and the heat dissipation capability is improved.

In one embodiment, a brightness sensor may be disposed on the base 3, and the installation position of the brightness sensor is set at a position where no direct light of the lamp is irradiated, so as to continuously adjust the lighting condition of the lamp according to the brightness increase caused by the external light, thereby achieving energy saving and reducing the environmental load, and at the same time, properly suppressing the excessive power consumption. In one embodiment, the base 3 is provided with a reinforcing rib, so that the strength of the base is increased, and the thickness of the base is reduced.

The user generally sets the time for waking up the user through the remote controller, and in order to determine that the lamp has received the signal of the remote controller, the user is usually reminded through the electronic sound of the buzzer, but the buzzer is generally configured on the circuit board with double-side wiring, for a circuit board with a single-sided wiring, the sound generating element is mounted on the side of the circuit board close to the ceiling, because of the obstruction of the circuit board, the sound generated by the sound generating component is transmitted to the user with a smaller volume, in one embodiment, the base 3 is provided with an opposing portion disposed to face the circuit board 201, the circuit board 201 is provided with an opening corresponding to the opposing portion, the sound generating element is mounted on a surface of a different side from the LED chip 2201, and when the sound generating element generates sound, the sound is reflected by the opposing portion and then transmitted through the opening, thereby ensuring that the user can obtain a desired sound volume.

Fig. 47 is a schematic structural diagram of an embodiment of the photovoltaic module of the present application, referring to fig. 45 to 48, the power module 23 is disposed at a position corresponding to the groove 36 of the photovoltaic module 2, the power module 23 includes a first power module 231 and a second power module 232, a height of the second power module 232 in the positive direction of the Z axis is greater than a height of the LED chip 2201, after the ceiling lamp is installed, the second power module 232 is located in the groove 36 of the base, preferably, the second insulating portion 203 contacts with a side wall of the groove 36, so as to increase a contact area and improve a heat conduction capability. Because the base does not need a storage space for storing the second power supply module, the LED lamp is thinned (namely, the height in the Z-axis direction is shortened), the packaging and storage cost is reduced, and in addition, the photoelectric module can be far away from the lampshade, so that the light quantity of the light source module reaching the edge of the lampshade is increased. In other words, in the case of the flat lamp cover, the edge of the lamp cover can be brightly illuminated. As a result, for example, light emitted from the LED lamp can be irradiated over a wider range.

Fig. 49 is a schematic structural view of an embodiment of an LED lamp of the present application, referring to fig. 49, fig. 50A to fig. 50B, fig. 51, and fig. 52A to fig. 52C, a light source module includes a first chip area 2211 and a second chip area 2212, and at least a portion of a power module 23 is located between the first chip area 2211 and the second chip area 2212. In some embodiments, the circuit board 201 includes a first face 2011 and a second face 2012 which are opposite to each other, the first face 2011 is provided with a first chip area 2211 and a second chip area 2212, the first chip area 2211 and the second chip area 2212 include at least one LED chip 2201, the power module 23 includes a first power module 231 and a second power module 232 which are respectively located on the first face 2011 and the second face 2012 of the circuit board 201, the first power module 231 is located between the first chip area 2211 and the second chip area 2212 in a radial direction of the circuit board 201 (the first power module 231 is also located on the first face 2011), the power module 23 includes a power supply unit 3a, a voltage boost unit 3b, and a voltage buck unit 3c, the power supply unit 3a includes a first driving element 3a1, the buck unit 3c includes a second driving element 3c1, the boost unit 3b includes a third driving element 3b1, the first driving element 3a1, After the LED lamp is turned on for t (t ≧ 0.5) hours, the temperature of the first driving element 3a1 and the temperature of the third driving element 3b1 are lower than the temperature of the second driving element 3c1, and preferably the temperature of the first driving element 3a1 is lower than the temperature of the third driving element 3b1, that is, the temperature of the first driving element 3a 1< the temperature of the third driving element 3b 1< the temperature of the second driving element 3c 1. The second driving element 3c1 is closer to the second chip area 2212 than the first driving element 3a1, and the third driving element 3b1 is farther from the second chip area 2212 than the second driving element 3c1, so that the driving elements in the power module are distributed and the influence of heat on the first chip area and the second chip area is reduced.

In this embodiment, the first chip area 2211 has a first edge S1 and a second edge S2 opposite to each other, the first edge S1 is close to a central axis of the LED lamp, a surface of at least two LED chips 2201 in the first chip area 2211 close to the first power module 231 is in contact with the second edge S2, the second chip area 2212 has a third edge S3 and a fourth edge S4 opposite to each other, the second edge S2 is located between the first edge S1 and the third edge S3, the third edge S3 is located between the second edge S2 and the fourth edge S4, perimeters of patterns (e.g., circular, elliptical, etc.) respectively enclosed by the first edge S1, the second edge S2, the third edge S3 and the fourth edge S4 are C1, C2, C3 and C4, C1 < C2 < C3 < C4 in this order. The surfaces of at least two LED chips 2201 in the second chip area 2212 close to the first power module 231 are in contact with the third edge S3, the distance from the first edge S1 to the second edge S2 is d1, the distance from the first edge S1 to the third edge S3 is d2, the distance from the first edge S1 to the fourth edge S4 is d3, d1+ d 2< d3, preferably 2d1+ d 2< d3, the first chip area is close to the central portion of the circuit board, thereby effectively reducing the dark area of the central portion of the lamp, and the first chip area is far away from the first power module, thereby reducing the influence of the first power module on the first chip group.

A second accommodating space is formed between the first insulating portion 202 and the base 3, the second accommodating space is located in the first accommodating space, the circuit board 201 is located in the second accommodating space, and the first insulating portion 202 includes a light processing unit 202b and an isolation unit 202 c. When the light source module emits light, a part of light or all of the light passes through the light processing unit 202b, and the light processing unit 202b is used for controlling the light emitting uniformity of the LED lamp. The isolation unit 202c includes a first region 202c1 and a second region 202c2, the light processing unit 202b connects the first region 202c1 and the second region 202c2, and the first region 202c1 and the second region 202c2 are disposed opposite to each other in the radial direction of the first insulating portion 202. In an embodiment, the extending direction of the second region 202c2 intersects with the direction of the central axis of the LED lamp, and the inclined design can increase the force-bearing area of the second region and increase the deformation resistance, preferably, the angle between the second region 202c2 and the direction of the central axis of the LED lamp is 0 to 80 degrees, and preferably, the angle between the second region 202c2 and the direction of the central axis of the LED lamp is 30 to 60 degrees.

The first insulating portion 202 is provided with at least one fixing unit for fixing the circuit board 201, the fixing unit may be in a fixing form such as a snap, a screw connection, and the like, and in one embodiment, the fixing unit 2027 is located between the light processing unit 202b and the isolating unit 202 c.

Fig. 53A is a schematic diagram of an embodiment of an optoelectronic module, please refer to fig. 53A to 53H, in which the fixing units include at least one first fixing unit 2027a and/or at least one second fixing unit 2027b, and the first fixing unit 2027a and the second fixing unit 2027b may have the same structure, but in some embodiments, the first fixing unit 2027a and the second fixing unit 2027b may have different structures. In the present embodiment, the first fixing unit 2027a is located between the second region 202c2 and the light processing unit 202b, the second fixing unit 2027b is located between the first region 202c1 and the light processing unit 202b, the circuit board 201 includes a first side portion 201b and a second side portion 201c opposite to each other, in the above embodiment, the first edge S1 may correspond to the first side portion 201b, and the fourth edge S4 may correspond to the second side portion 201 c. The first chip area 2211 and the second chip area 2212 are located between the first side portion 201b and the second side portion 201c, the first fixing unit 2027a extends towards the central axis of the LED lamp, the second fixing unit 2027b extends towards the direction far away from the central axis of the LED lamp, the first fixing unit 2027a comprises a first fixing surface 2027a1, the circuit board 201 is located between the first fixing surface 2027a1 and the first insulating portion 202 so as to fix the second side portion 201c of the circuit board 201, the second fixing unit 2027b comprises a second fixing surface 2027b1, the circuit board 201 is located between the second fixing surface 2027b1 and the first insulating portion 202 so as to fix the first side portion 201b of the circuit board 201, and two sides of the circuit board 201 are fixed in the first insulating portion 202 through the fixing units, so that the stability of the circuit board is improved. In this embodiment, the first fixing surface 2027a1 and the second fixing surface 2027b1 are located on the same horizontal plane, but not limited thereto. The distance between the first fixing unit 2027a and the second fixing unit 2027b is smaller than the distance between the first side portion 201b and the second side portion 201c, so as to provide a stable support for the circuit board, in some embodiments, the first fixing surface 2027a1 and the second fixing surface 2027b1 contact the circuit board 201, and the hardness of the portions of the first fixing unit 2027a and the second fixing unit 2027b contacting the circuit board 201 is greater than that of other portions not contacting the circuit board 201, so as to increase the fixing effect for the circuit board.

In other embodiments, the circuit board 201 may be fixed by only the first fixing unit 2027a or the second fixing unit 2027B, as shown in fig. 50A to 50B, fig. 51, and fig. 52A to 52C, in this embodiment, the circuit board 201 is fixed by only the first fixing unit 2027a, and the above-mentioned structure of the first fixing unit 2027a is not repeated here. The first insulating portion 202 is provided with a third opening 2025c, the third opening 2025c is connected to the first fixing surface 2027a1, the circuit board 201 is located between the first fixing unit 2027a and the first insulating portion 202, and a portion of the circuit board 201 is exposed by the first insulating portion 202, so that a portion of heat generated by the second chip region can be dissipated, thereby reducing the temperature of the electronic component on the first surface of the circuit board.

As shown in fig. 50A, the first insulating portion 202 includes at least one first opening 2025a and at least one second opening 2025b, the first opening 2025a and the second opening 2025b are respectively located in the first region 202c1 and the second region 202c2, and the first opening 2025a and the second opening 2025b enable the second accommodating space to communicate with the outside, so that heat generated by electronic components on the circuit board during operation can be dissipated through the first opening and the second opening.

As shown in fig. 49, 50A to 50C, 51, and 52 to 52C, in one embodiment, the first section 202C1 includes a partition 2028, the partition 2028 includes opposite ends, the first end is close to the light processing unit 202b, and the partition 2028 is disposed around the circumference of the first section 202C1 and extends toward the central axis of the LED lamp. In the height direction of the LED lamp, there is a first height difference between the isolation board 2028 and the light processing unit 202b, and after the first insulation portion 202 is fixed on the base 3, there is a second height difference between the base 3 and the isolation board 2028 in the height direction of the LED lamp, and due to the first height difference and the second height difference, the adapter 5 can be located at the first end or the second end of the isolation board 2028, so as to meet different installation requirements of users. In an embodiment, the first opening 2025a communicates the first end of the isolating plate 2028 with the second end of the isolating plate 2028, in the height direction of the LED lamp, the height of the first opening 2025a is greater than the height of the circuit board 201, the first opening 2025a and the third opening 2025c form a first heat dissipation path, the first opening 2025a and the second opening 2025b form a second heat dissipation path, and the first surface 2011 of the circuit board 201 and the second surface 2012 of the circuit board 201 are cooled by the first heat dissipation path and the second heat dissipation path, so that the service lives of the power module and the light source module are prolonged. In an embodiment, in the height direction of the LED lamp, the height difference between the isolation board 2028 and the circuit board 201 can improve the heat dissipation effect on the circuit board. In an embodiment, a gap is formed between the first opening 2025a and the circuit board 201, the second opening 2025b is located in the groove portion 36 of the base 3, and the first insulating portion 202 forms a heat dissipation path through the first opening 2025a and the second opening 2025b to dissipate heat of the electronic element on the circuit board, so that the service lives of the power module and the light source module are prolonged. In one embodiment, the second end of the isolation sheet 2028 may be provided with at least one reinforcement portion 2028a to increase the structural strength of the first region 202c 1.

Referring to fig. 54N, first sub-regions 202c3 are formed between two adjacent first openings 2025a, the number of the first sub-regions 202c3 is one less than the number of the first openings 2025a, and each of the first sub-regions 202c3 has at least one reinforced portion 2028 a.

Referring to fig. 54A to 54N, the structure of the circuit board in fig. 54A to 54N is the same as the structure of the circuit board shown in fig. 51, and referring to fig. 51 and fig. 54A to 54N, the LED lamp includes a connector terminal 24 connected to the power supply unit 3a, the connector terminal 24 is electrically connected to the power supply unit 3a through a wire 241, the first insulating portion 202 is provided with a routing unit 202d for fixing the wire 241, the wire is protected from being pulled, the wire routing unit 202d includes a first wire slot 202b1 on the light processing unit 202b, a second wire slot 202c4 in any first sub-area 202c3, a fourth opening 202c5 communicated with the first wire slot 202b1, and a fifth opening 2028b on the isolation board 2028, the fourth opening 202c5 is communicated with the fifth opening 2028b, the first wire slot 202b1 is communicated with the second wire slot 202c4, and the wire 241 passes through the first wire slot 202b1 and the second wire slot 202c4 and then passes through the fourth opening 202c5 and the fifth opening 2028 b.

In an embodiment, referring to fig. 54A to 54N, the fixing unit 2027 further includes at least one positioning post 2027c, the positioning post 2027c is located between the light processing unit 202b and the second region 202c2 and extends toward the direction close to the first region 202c1, at least one positioning opening 201d is formed on the circuit board 201, and the positioning opening is aligned with the positioning post 2027c during mounting, so as to preliminarily determine the mounting position of the circuit board.

In an embodiment, referring to fig. 54A to 54N, the fixing unit 2027 further includes at least one first step 2027d, and the first step 2027d is located on the light processing unit 202b and extends toward the direction close to the first region 202c1, so that the light source module and the light processing unit have a certain distance therebetween, which acts as a limit for the installation of the circuit board, and prevents the circuit board from being pressed excessively, and the LED chip interferes with the first insulating portion, thereby affecting the use. In an embodiment, the fixing unit 2027 may further include at least one second step 2027e, the second step 2027e is located on the light processing unit 202b and extends toward a direction away from the first region 202c1, and according to a stress condition of the circuit board, only the first step 2027d or the second step 2027e may be disposed in the LED lamp, or both the first step 2027d and the second step 2027e may be disposed.

Referring to fig. 49 and fig. 50A to 50C, the first insulating portion 202 further includes a transition portion 2026, and the first insulating portion 202 is connected to the base 3 through the transition portion 2026. In one embodiment, the connection unit 202e includes a transition portion 2026, the transition portion 2026 is located on the second region 202c2, and the transition portion 2026 is connected to the base 3 through a fixing structure, which may be a clamping structure, a bolt structure (thread and screw), a fastening structure, or a magnetic attraction structure. The transition portion 2026 is connected to the mounting portion 31 of the base 3 by a fixing structure. If the base structure shown in fig. 45 is adopted in fig. 49, and with reference to fig. 45, fig. 49, and fig. 50A to 50C, a gap is provided between the transition portion 2026 and the groove portion 36 (in the radial direction of the LED lamp, the transition portion does not fill the groove portion), so that the heat generated by the LED lamp can be increased in fluidity, and the temperature of the electronic components in the LED lamp can be reduced. In an embodiment, the transition portion 2026 includes a connection region 2026a and a reinforced region 2026b, the connection region 2026a extends from the second region 202c2 to a direction close to the edge portion 35, and the connection region 2026a has a highest point and a lowest point in a height direction of the LED lamp, and the lowest point contacts the groove portion 36, so as to increase a contact area between the first insulating portion and the base and improve a fixing effect of the optoelectronic module. The reinforced region 2026b extends from the second region 202c2 in a direction closer to the edge portion 35, and the reinforced region 2026b connects the second region 202c2 with the attachment region 2026a to improve the mechanical strength of the transition, and a portion of the fastening structure may be located at the attachment region 2026 a.

As shown in fig. 50A to 50C, 51, 52 to 52C, the light processing unit 202b includes a first light processing area 2a, a second light processing area 2b and a third light processing area 2f, the first light processing area 2a corresponds to the first chip area 2211, the second light processing area 2b corresponds to a portion of the power module, in this embodiment, the second light processing area 2b corresponds to the first power module 231, and the third light processing area 2f corresponds to the second chip area 2212, in one embodiment, the first light processing area 2a and/or the third light processing area 2f have a cross section different from that of the second light processing area 2b, the light processing unit 202b may be the light absorbing area or the lens unit, in this embodiment, the second light processing area 2212 includes two sets of LED chip sets 221, a sub-light processing area may be designed corresponding to each set of LED chip sets 221, the first insulating portion 202 corresponds to the first chip area 2211, The first power module 231 is respectively provided with a first light processing area 2a and a second light processing area 2b, the first insulating portion 202 is provided with a third light processing area 2f corresponding to the second chip area 2212, the third light processing area 2f includes sub-light processing areas 2c and 2d, in one embodiment, the light processing area 2b can be frosted, the refractive index of the light processing area 2b is smaller than that of the light processing area 2a and the sub-light processing areas 2c and 2d, light parts emitted from the first chip area and the second chip area can be reflected to the light processing area 2b, the light processing area 2b is frosted, and the lamp can have uniform light distribution. Referring to fig. 54A to 54N, the first wire groove 202b1 is located in the first light processing region 2 a. In some embodiments, the light processing unit may be frosted to improve the light emitting effect of the LED lamp, or the first insulating portion may be frosted to improve the light emitting effect of the LED lamp while improving the appearance of the first insulating portion. In some embodiments, in a height direction of the LED lamp (for example, a positive direction of a Z axis shown in fig. 49), the height of the second light processing region 2b is greater than or equal to the height of the first light processing region 2a and the height of the third light processing region 2f, on one hand, in the height direction of the LED lamp, the height of a part of electronic components in the first power module is greater than the height of the LED chip, and the second light processing region 2b can better cover the first power module; on the other hand, part of the light emitted from the first and

second chip areas

2211 and 2212 is emitted to the second light processing area 2b, and the part or all of the light is refracted by the second light processing area 2b, so that dark areas in the first and

second chip areas

2211 and 2212 are avoided.

The distance from the first chip area 2211 to the base 3 is smaller than the distance from the second chip area 2212 to the base 3, and the distance between the adjacent LED chips in the first chip area 2211 is smaller than the distance between the adjacent LED chips in the second chip area 2212. Since the first chip area 2211 is closer to the base 3 and the first opening 2025a than the second chip area 2212, heat generated from the first chip area 2211 is more easily dissipated than the second chip area 2212.

Referring to fig. 53A to 53H, the second chip area 2212 includes at least one group of LED chip sets, and the present embodiment is different from the optoelectronic module shown in fig. 50 in that the second chip area 2212 includes three groups of LED chip sets, which are a first LED chip set 221a, a second LED chip set 221b, and a third LED chip set 221c, the first LED chip set 221a, the second LED chip set 221b, and the third LED chip set 221c are located on different circumferences, respectively, each of the first LED chip set 221a, the second LED chip set 221b, and the third LED chip set 221c includes at least one LED chip 2201, and the second LED chip set 221b is located between the first LED chip set 221a and the third LED chip set 221 c. In an embodiment, the number of the LED chips in the second chip set 221b is smaller than the number of the LED chips in the first chip set 221a and the third chip set 221b, and preferably, the number of the LED chips in the second chip set 221b is smaller than the number of the LED chips in the first chip set 221a, so that the light distribution in the second chip area is more uniform, and the dark area is reduced. In an embodiment, the distance between the adjacent LED chips of the second chip set 221b is greater than the distance between the adjacent LED chips of the first chip set 221a and the third chip set 221b, and the distance between the adjacent LED chips of the second chip set is greater, so that the mutual influence between the heat generated by the adjacent LED chips in the second chip region can be reduced, and preferably, two LED chips in the first chip set 221a and the third chip set 221c are adjacent to one LED chip in the second chip set 221 b. A center point O is located between two adjacent LED chips in the first chip set 221a₁,O₂,……，O_n(n is greater than or equal to 1), a central point Q is arranged between two adjacent LED chips in the third chip group 221c₁， Q₂，……，Q_m(m is more than or equal to 1), n and m are integers, O₁And Q₁Is less than O₁And Q_m(m > 1) distance between the center points O_2n-1And a central point Q_3m-2A connection line (n ═ m, n, m ≧ 1, n, m are integers) passes through the at least one LED chip 2201 of the second chipset 221 b. While the luminous flux of the LED lamp is increased, dark areas in the first chip area 2211 and the second chip area 2212 can be avoided, and adjacent LEDs in the first LED chip set 221a, the second chip set 221b and the third chip set 221c can be reducedThe heat generated by the chips affects each other.

Referring to fig. 54A to 54N, in an embodiment, the number of LED chips in the first chip set 221a and the second chip set 221b is less than the number of LED chips in the third chip set 221c, preferably, the number of LED chips in the first chip set 221a is equal to the number of LED chips in the second chip set 221b, and the number of LED chips in the second chip set 221b is less than the number of LED chips in the third chip set 221c, so that the light distribution in the second chip area is more uniform, and the dark area is reduced. In an embodiment, the distance between the adjacent LED chips of the second chip set 221b is greater than the distance between the adjacent LED chips of the first chip set 221a, and the distance between the adjacent LED chips of the second chip set is greater, so that the mutual influence between the heat generated by the adjacent LED chips in the second chip region can be reduced, and preferably, two LED chips in the first chip set 221a and the third chip set 221c are adjacent to one LED chip in the second chip set 221 b. A center point O is located between two adjacent LED chips in the first chip set 221a₁,O₂… …, On (n is more than or equal to 1), a center point Q is arranged between two adjacent LED chips in the third chip set 221c₁，Q₂… …, Qm (m is more than or equal to 1), n and m are integers, O₁And Q₁Is less than O₁Distance from Qm (m > 1), center point O_nAnd a center point Q_2m-1A connection line (n ═ m, n, m ≧ 1, n, m are integers) passes through the at least one LED chip 2201 of the second chipset 221 b. When the luminous flux of the LED lamp is increased, dark areas in the first chip area 2211 and the second chip area 2212 can be avoided, and mutual influence of heat generated by adjacent LED chips in the first LED chip set 221a, the second chip set 221b, and the third chip set 221c can be reduced. In an embodiment, the optoelectronic module 2 further includes a connector terminal 24, the connector terminal 24 is electrically connected to an external power source (e.g., a commercial power) for receiving an external power signal and transmitting the power signal to the LED lamp, the connector terminal 24 is connected to the electronic component on the circuit board 201 through a wire 241, a connection point of the wire 241 and the circuit board 201 is located on the first surface 2011 of the circuit board 201, and a connection point of the wire 241 and the circuit board 201 is located between the first chip area 2211 and the second chip area 2212, so that the power signal is transmitted for a distanceShort, low power loss and stable power. In one embodiment, at least one of the connecting lines between one LED chip in the first chip area 2211 and one LED chip 2201 in the second chip area 2212 passes through the electrical connection point between the wire 241 and the circuit board 201 (if there is an electrical connection point greater than 1, at least one of the electrical connection points), and since the electrical connection point is located on the connecting line between one LED chip in the first chip area and one LED chip in the second chip area, the light emitted from the first chip area and the second chip area can prevent dark spots or dark regions in the area of the lamp cover corresponding to the electrical connection point.

The LED luminaire may also include a secondary light source 2203 and a primary light source, the number of primary light sources being greater than the number of secondary light sources. When the main light source does not emit light, the secondary light source can emit light to provide illumination. For example, during sleep at night, the primary light source is turned off, the secondary light source is lit for a period of time or the user selects the secondary light source to provide a sense of security of illumination. The secondary light source can include a night lamp bead and/or an afterglow bead. In one embodiment, the secondary light source 2203 is located outside the second edge S2 of the first chip area 2211 or inside the fourth edge S4 of the second chip area 2212, or the secondary light source 2230 is located between the first chip area 2211 and the second chip area 2212, and in some embodiments, the electrical connection point of the wire 241 and the circuit board 201 and the connection line of the secondary light source 2203 pass through at least one LED chip 2201 of the first chip area 2211. In an embodiment, the shortest distance from the secondary light source 2203 to the first chip area 2211 is smaller than the distance from the secondary light source 2203 to the second chip area 2212, so as to improve the light emitting effect of the secondary light source 2203 emitted from the lamp cover. In one embodiment, the first chip area 2211 and/or the second chip area 2212 comprise at least two different LED chips (LED chip a)₁LED chip a₂LED chip a₃… … LED chip a_nN represents the number of kinds of LED chips), different LED chips (LED chip a)₁LED chip a₂LED chip a₃… … LED chip a_nN represents the number of the LED chips, and n is an integer) such as different specifications, different color temperatures or different luminous fluxes, and the like, and also can be different parameter indexes of the LED chips. In an embodiment, the first chip area 2211 includes LED chips a₁LED chip a₂And an LED coreSheet a₃The second chip area 2212 comprises an LED chip a₁LED chip a₂Wherein the LED chip a on the circuit board₁Is greater than the total number of the LED chips a₂Of total number of LED chips, e.g. LED chip a₁Is a high color temperature LED chip, an LED chip a₂The LED chip with the low color temperature is characterized in that the LED chip with the low color temperature is a high color temperature LED chip, the high color temperature LED chip and the low color temperature LED chip are arranged to enable the two color temperatures to be fully mixed, and the total color temperature can be adjusted by adjusting the driving current ratio of the two color temperature LED chips. In one embodiment, the LED chip a in the first chip area 2211₁Is less than the number of LED chips a in the second chip area 2212₁And/or LED chip a₂The number of (2); in one embodiment, the LED chip a in the first chip area 2211 and/or the second chip area 2212₁Is less than the number of the LED chips a on the circuit board 201₂The number of the cells. In one embodiment, the LED chip a₁And/or LED chip a₂Is greater than the number of the LED chips a₃Number of LED chips a in the embodiment₁And an LED chip a₂Which may be the primary light source mentioned above, LED chip a₃May be the secondary light sources mentioned above.

In some embodiments, the LED luminaire comprises at least one group of LED chips (LED chip group b)₁LED chip group b₂LED chip group b₃… … LED chip set b_mM is an integer), each LED chip group at least includes one LED chip, each LED chip group is located on the circuit board 201, in this embodiment, each LED chip group is located on the first surface of the circuit board 201, the LED chips of the same LED chip group are located or approximately located on the same circumference (arranged around the opening of the circuit board 201), the LED chips of each LED chip group are located on different circumferences and arranged around the same or approximately the same central axis, which may be the central axis of the circuit board 201 or the central axis of the guiding and hanging device or adapter. A part of the power modules (e.g., the first power module) is located between the adjacent LED chip sets in the radial direction of the circuit board 201. At least one of the LED chip sets comprises a main light source and a secondary light source, and luminous flux when the secondary light source is lightened can be configured to be 0.1% -10% of luminous flux when the main light source is lightened. When the main light source does not emit light, the secondary light source can emit light,to provide illumination. For example, during sleep at night, the primary light source is turned off, the secondary light source is lit for a period of time or the user selects the secondary light source to provide a sense of security of illumination. The secondary light source can include a night lamp bead and/or an afterglow bead. The number of the main light sources is larger than that of the secondary light sources, and the distance between the adjacent main light sources is larger than or equal to the distance between the adjacent main light sources and the secondary light sources. In one embodiment, the central angle subtended by the adjacent primary light source is greater than or equal to the central angle subtended by the adjacent primary light source and the adjacent secondary light source. In some embodiments, the same chip set includes n LED chips, the central angle between adjacent LED chips or the average central angle a between adjacent LED chips is (360/n), the connection line between the electrical connection point of the conductive wire 241 and the circuit board 201 and the center o forms a line La, the connection line between the secondary light source and the center o forms a line Lb, the included angle between the line La and the line Lb ranges from 0.3 a to 5a, and in some embodiments, the included angle between the line La and the line Lb ranges from [360/(n +3) ]]Degree [360/(n-5)]Meanwhile, the wiring distance from the secondary light source to the connector terminal is short, and the heat generated by the LED chip adjacent to the secondary light source has small influence on the secondary light source. In one embodiment, the LED lamp comprises an LED chip group b according to the radius from small to large₁LED chip group b₂LED chip group b₃LED chip group b₄I.e. LED chip sets b₁Compared with the LED chip group b₂LED chip group b₃LED chip group b₄Near the opening 222 of the circuit board 201, in this embodiment, the LED chip set b₁Including the secondary light source, the line distance of secondary light source to connector terminal 24 is shorter, and the resistance of wire is less, therefore the power loss of during operation is low, and signal transmission is stable. In its embodiment, the LED chip group b₄The secondary light source is far away from the hanger or the adapter, so that light generated when the secondary light source is lightened is not easily absorbed by the hanger or the adapter, and the light loss is low.

Referring to fig. 53A to 53H, the optical processing unit 202b includes a first optical processing area 2a, a second optical processing area 2b and a third optical processing area 2f, the first optical processing area 2a corresponds to the first chip area 2211, the second optical processing area 2b corresponds to a portion of the power module, in this embodiment, the second optical processing area 2b corresponds to the first power module 231, the third optical processing area 2f corresponds to the second chip area 2212, the optical processing unit 202b may be the aforementioned optical absorption area or the lens unit, in this embodiment, the second chip area 2212 includes three groups of LED chip sets, a sub-optical processing area may be designed corresponding to each group of LED chip sets 221a, 221b and 221c, the optical processing areas 2a and 2b are respectively disposed on the first insulating portion 202 corresponding to the first chip area 2211 and the first power module 231, and the third optical processing area 2f includes a sub-optical processing area 2c and a sub-optical processing area 2c, 2d and 2e, the sub-light processing regions 2c, 2d and 2e respectively correspond to the LED chip sets 221a, 221b and 221c of the second chip region, the sub-light processing regions 2a, 2c, 2d and 2e respectively include a lens 202a disposed opposite to the LED chip 2201, the light processing region 2b includes at least one left inclined portion 2b1 and at least one right inclined portion 2b2, the left inclined portion 2b1 is connected to the right inclined portion 2b2, the left inclined portion 2b1 is connected to the right inclined portion 2b2 to form a V shape or an inverted V shape, when external light passes through the light processing region 2b, part of the light is reflected by the left inclined portion 2b1 and the right inclined portion 2b2, so that visibility of the first power module 231 is reduced, appearance of the LED lamp is improved, on the other hand, light emitted from the LED chip set adjacent to the first power module 231 passes through the lens 202a and then passes through the left inclined portion 1b 3526 b, thereby further reducing dark areas between the first chip area 2211 and the second chip area 2212. The light processing region 2b is provided with at least one extending portion 2b3, the extending portion 2b3 is in contact with at least one left inclined portion 2b1 and at least one right inclined portion 2b2, the circuit board 201 is provided with a through hole 201a opposite to the extending portion 2b3, and the extending portion 2b3 penetrates through the through hole 201a on the circuit board 201, so that the relative position of the circuit board 201 and the first insulating portion 202 is fixed, and the circuit board 201 is prevented from rotating in the circumferential direction.

The base can also adopt other different structures, in one embodiment, the diameter of the base 3 is larger than that of the lampshade 1, and the area of the base 3, which is positioned outside the lampshade 1, is provided with the sub-luminous part, so that the irradiation range of the lamp can be effectively improved. In one embodiment, the base 3 is provided with a spacer, a plurality of protrusions protrude from the surface of the spacer, the lamp cover 1 is provided with recesses corresponding to the protrusions, the depth of the recesses is greater than the height of the protrusions protruding from the surface of the spacer, when the protrusions are fitted into the recesses, the peripheral edge of the lamp cover 1 is pressed against the spacer, and the gap therebetween is eliminated, so that insects can be effectively prevented from entering the lamp cover.

Fig. 55 and 56 are schematic structural diagrams of an embodiment of an LED lamp according to the present application, the LED lamp includes a lampshade 1, a photovoltaic module 2, and a base 3, and the basic structure of the LED lamp is the same as that of the previous embodiment, which will not be described repeatedly, except that the LED lamp employs the above-mentioned photovoltaic module 2B, the structure of the photovoltaic module 2B refers to the above-mentioned embodiment, as shown in fig. 55 and 56, the LED lamp is located in a spatial rectangular coordinate system (X, Y, Z), the Y axis is parallel to the central axis of the LED lamp, the LED lamp further includes a chassis 6, the chassis 6 is connected to the base 3, the reflector 29 has an end point a and an apex point B, the end point a is located between the LED light source module 22 and the power source module 23, the apex point B is an apex point in the opposite direction of the Z axis, and the height of the reflector 29 (or the distance from the apex point B to the end point a in the direction of the Z axis) Z ═ a (a)²+b²-2abcosα)^1/2Sin β, a is the linear distance from the LED chip 2201 to the end point a; b is the linear distance from the LED chip 2201 to the vertex B; alpha is an included angle between a straight line from the LED chip 2201 to the endpoint A and a straight line from the LED chip 2201 to the vertex B, and alpha is smaller than the light-emitting angle of the LED chip 2201, namely alpha is more than 0 and less than 120 degrees; beta is the angle between the straight line AB (the line connecting the end point A and the vertex B) and the X-axis direction. By designing a and beta, the height of the reflecting member can be adjusted to obtain an excellent reflecting effect, thereby obtaining a better light distribution. In one embodiment, the reflector 29 is arched away from the power module 23 (i.e. negative direction of y axis), so as to increase the heat dissipation space of the power module; on the other hand, the power module can be completely covered to play an insulating role so as to prevent electric shock. In an embodiment, the power module 23 may be fixed on the base 3 by gluing or fastening, in an embodiment, as shown in fig. 56, a groove 32 may be disposed on the base 3, and electrical components (such as inductors, capacitors, etc.) in the power module 23 may be located in the groove 32, which may increase a heat dissipation space for the electrical components, and in addition, may also shorten a heat dissipation path, thereby reducing a temperature of the power module.

The LED chip 2201 includes LED beads, as shown in fig. 58, light emitted from the LED beads passes through C, D, E and four interfaces F, and interface C is a packaging layer and an interface of the LED beadsThe interface of air, the interface D is the interface of air and luminous piece, the interface E is the interface of air and lamp shade, and the interface F is the interface of lamp shade and air. The refractive index of the packaging layer of the LED lamp bead is n1, the refractive index of the lampshade is n2, and the refractive index of air is n3, so that the reflection of the C, E interface and the F interface is mainly reduced and the reflection of the D interface is improved in order to improve the light utilization rate. C. The reflection at the interfaces E and F can reduce the luminous flux of the LED lamp, so that the materials of the packaging layer of the LED lamp bead and the lampshade need to be selected, and according to the relation between the reflectivity and the refractive index, when light vertically enters at the interface C and the interface F, 1- (n1-1) can be arranged²/(n1+1)²-(n2-1)²/(n2+1)²The refractive index is more than 0.9, and the luminous flux of the LED lamp can be effectively improved by selecting materials with proper refractive index.

In addition, since both n1 and n2 are larger than n3, when the incident angle is larger than the critical angle, total reflection occurs, and in order to reduce the reflection at the C interface and the E interface, a first index matching layer and a second index matching layer may be respectively disposed on the surface of the LED chip 2201 and the inner surface of the lamp cover, where the index of refraction n4 of the first index matching layer is equal to (n1 × n3)^1/2The refractive index of the second index matching layer n5 ═ (n2 × n3)^1/2In one embodiment, n1 ranges from 1.4 to 1.53, and n4 ranges from 1.18 to 1.24; in one embodiment, n2 is in the range of 1.5-1.7, n5 is in the range of 1.22-1.3, where n1-n4 are 0.16-0.35, and n4-n3 are 0.18-0.24; n2-n5 of 0.2-0.48, and n5-n1 of 0.22-0.3, so that the light reflection can be effectively reduced and the light utilization rate can be improved after the first and second refractive index matching layers are arranged.

With respect to the thickness d1 of the first index matching layer and the thickness d2 of the second index matching layer, the reflected light interference may be canceled to further reduce the reflection of light. Since n1 > n4 > n3 has no half-wave loss, since the wavelength range of visible light is 400-760 nm, in order to reduce the harm of blue light to human eyes and improve the comfort of human body to light, the reflection of blue light and the reflection of red light need to be increased, and the reflection of blue light can be mainly increased when the first refractive index matching layer is used, the thickness d1 of the first refractive index matching layer is (2k +1) lambda/[ 4 ((n 4)²-n1²*sinα²)^1/2)]And k is 0,1,2,3 …, where α is an incident angle of light entering the first index matching layer from the encapsulation layer of the LED lamp bead, and λ is a wavelength of blue light.

The second index matching layer mainly reduces the reflection of red light, and the thickness of the second index matching layer is d2 ═ k λ/[2 × (n 5)²-n2²*sinβ²)^1/2](k-1, 2,3 …). β is an incident angle at which light is incident from the lamp cover into the second index matching layer, and λ is a wavelength of red light; through the arrangement of the two layers of thicknesses, the LED lamp can reach a better color temperature, and the indoor environment is warm and comfortable.

In other embodiments, the first index matching layer may be configured to reduce reflection of primarily red light, with d1 ═ k λ/[2 × (n 4)²-n1²*sinα²)^1/2](k is 1,2,3 …), α is an incident angle of light entering the first index matching layer from the encapsulation layer of the LED lamp bead, λ is a wavelength of red light, the second index matching layer is mainly used for increasing reflection of blue light, and d2 is (2k +1) λ/[4 ((n 5)²-n2²*sinβ²)^1/2)]And (k is 0,1,2,3 …), β is an incident angle at which light enters the second index matching layer from the lamp cover, and λ is a wavelength of blue light.

In one embodiment, the outer surface of the lampshade 1 may be provided with a plurality of optical films, and the refractive indexes of the plurality of optical films are n in sequence from the lampshade 1 to the air propagation direction_H，n_L，n_H，n_L……，n_HH denotes a high refractive index film, and L denotes a low refractive index film. In other embodiments, in the light traveling direction from the lamp shade 1 to the air, the optical thicknesses of the multilayer optical films are 0.5 λ 1, 0.25 λ 2, 0.5 λ 1, 0.25 λ 2 … …, 0.5 λ 1, λ 1 is the wavelength of blue light, λ 2 is the wavelength of red light, and since the visible light wavelength range is wide, a single layer of optical film cannot achieve an anti-reflection or reflection enhancement effect well, and by using the multilayer optical films, light with different wavelengths can be anti-reflection or reflection enhancement according to the color rendering index or color temperature requirement of the lamp, so as to obtain an excellent light emitting effect.

The LED lamp can be further provided with other structures. In one embodiment, the LED lamp is provided with an auxiliary light source, and the auxiliary light source emits light obliquely upward and radiates the light to the ceiling, thereby improving the brightness of the space. In one embodiment, the height (h) and width (w) of the lamp satisfy the relation 4 ≦ d/h ≦ 9. Thereby, it is possible to realize a lighting fixture as a dome lamp capable of obtaining illumination light of desired brightness and desired light distribution while reducing heavy dents due to the presence of the fixture body. In one embodiment, the lampshade 1 and the base 3 are connected through a buckle, and a repellent holding layer containing an insect repellent is arranged in a gap between the connection of the lampshade and the base, so that insects are effectively prevented from entering the lamp. In an embodiment, a backlight source is disposed at a position perpendicular to the circuit board 201, and the number of LED chips of the back light source at a side far from the base 3 is greater than the number of LED chips of the backlight source at a side close to the base 3, so that the illuminance of the light emitting surface is uniform.

The lamp in the embodiment of the invention also realizes a house-keeping function besides a common lighting function, and specifically comprises three aspects. The function of the first aspect is mainly to address the situation where the resident is out for a period of time, typically 1 day or more, to experience a period of time of lamp illumination during which the lamp simulates the ordinary lamp state of the resident to give the outside the impression that the resident is at home. This function helps to discourage a thief from misunderstanding that someone is at home. The function of the second aspect is to provide information to the outside such as the resident or other person specified when the resident enters a suspicious character at home while the resident is not at home. The third aspect has a function of realizing a view to the resident, judging whether there is a physical emergency by the human body state of the resident and providing information to the specified other person as it is. The functions can be set by using a remote controller of the lamp, keys, a display screen, a touch screen and the like can be arranged on the lamp body to realize man-machine interaction, and intelligent equipment such as an application program of a smart phone, a tablet computer and the like can be used for operation. The following describes embodiments of the present invention.

Fig. 58 is a schematic view of main components of a lamp according to an embodiment of the present invention. As shown in fig. 58, the LED lamp includes, in addition to a conventional light emitting element 1111 and a first power supply module 1112 for supplying power thereto, a processing module 1113, a light sensor 1114, an infrared sensor 1115, a communication module 1116, and a second power supply module 1117 for supplying power to these four parts.

The light emitting element 1111 may be, for example, an LED array, such as the light source module 22 of the present application, or may be an incandescent bulb or a fluorescent tube. Accordingly, the first power supply module 1112 may include corresponding circuitry therein for converting the 220V mains power to a form suitable for use as a light emitting element, for example, for an LED array, the first power supply module 1112 includes a corresponding rectifying circuit, and in the case of an incandescent lamp, the first power supply module 1112 is primarily composed of wires, wiring devices, and the like for electrical communication.

The processing module 1113 mainly comprises a processor and other auxiliary circuits and elements, and implements logic processing of information, which mainly comes from the optical sensor 1114, the infrared sensor 1115 and the communication module 1116. The light sensor 1114 is mainly used to sense the ambient light intensity for the processor to determine whether the light needs to be turned on. The infrared sensor 1115 senses the human body state of the residents by acquiring an infrared sensing image of the environment. The communication module 1116 can perform two-way communication with the outside through a wireless or wired lan and/or a wireless communication network, such as a 3G/4G/5G network, and is also used for communication with the remote controller.

The second power supply module 1117 may include a conversion circuit such as a rectifier filter and a battery, and when the commercial power is normal, the conversion circuit supplies power to the processing module 1113, the optical sensor 1114, the infrared sensor 1115, and the communication module 1116 by using the commercial power, and when the commercial power is abnormal or unable to supply power, the battery may be used to supply power.

The technical means for realizing the above-described function of the first aspect in the embodiment of the present invention will be described below. The lamp may be set to a "housekeeping mode" when the resident is out, in which the operation of the lamp simulates a state where the resident is at home under the control of the processing module 1113. If the ambient light intensity is sufficiently dark, e.g., the first light intensity preset value of 100lx, and the current time does not reach the preset rest time, the illumination is turned on. When the rest time is reached, the illumination is turned off, or the illumination is turned off after the rest time is operated for a period of time at a lower illumination brightness gear.

Then the illumination is not switched on for a preset period of time, for example 6 to 8 hours, which is the rest period; or briefly turn on the lighting once to several times in a preset manner in the middle of the rest period to simulate the user's overnight state. The starting time can be random or preset, and the duration is preset duration or random duration smaller than a preset value.

For different seasons, lighting may or may not be needed after waking up in the morning, and for this purpose, the processing module 1113 may determine whether lighting needs to be turned on according to the ambient lighting intensity after the rest period is over, or determine the lighting needs to be turned on in the morning according to the current date. If the light is turned on, the light is turned off when the ambient light is sufficiently strong, for example, greater than a second light intensity preset value. The second preset light intensity value should here be greater than the first preset light intensity value mentioned above.

When the resident performs any operation on the lamp after returning, the above-described housekeeping mode is exited.

The technical means for realizing the function of the second aspect in the embodiment of the present invention will be described below. This function is designed for the case of illegal entry, and it is considered that a person intrudes illegally, by detecting that a person moves but not operating the lamp during the rest period. The user can start the function before going out to realize the monitoring function, namely, enter the monitoring mode.

In the monitor mode, the processing module 1113 listens for infrared signals, typically infrared sensed images, provided by the infrared sensors 1115, and the infrared sensors 1115 may provide these images to the processing module at a sampling frequency. If the heat source region exists in the image, it is determined to be an illegal person, and the processing module 1113 controls the communication module 1116 to send out information. Specifically, the contact person provided to the resident or a specified other person, for example, the resident, or the cell property, the dispatch office, or the like may be mentioned. Therefore, when the watchdog mode is turned on, it is preferable to turn on the monitoring mode at the same time.

When the resident returns home, the monitoring mode can be exited, and when any operation is performed on the lamp, the monitoring mode can be exited. Since the resident himself as a heat source causes the luminaire to send out also when he has just returned to the room and has not yet reached the exit from the monitoring mode, a time delay of e.g. 30S may be provided for the resident to exit the monitoring mode of the lamp of the room before deciding to send out the information. That is, the resident can set a room where the resident is not present as the monitoring mode.

In the case of pets (mainly including bloody animals such as cats, dogs, rabbits and birds), the infrared sensing image still contains a heat source area when the resident is not at home. In this case, the processing module 1113 should perform some filtering operations on the image, and for this reason, the height and/or width of the shape of the heat source in the image, i.e. the size condition, may be set according to the body shape characteristics of the pet at home, and if the heat source in the image simultaneously conforms to the size condition, the heat source area in the image is ignored, and then the image is determined. For example, if the height and width are set to small values at the same time, interference caused by cats, small dogs, rabbits, and birds can be eliminated. As another example, for a large dog's body shape, the width can be set to be significantly greater than the height.

The following describes a technical solution for realizing the function of the third aspect in the embodiment of the present invention. This function can be implemented using infrared sensors, and the status of the persons in the room is determined primarily from the infrared sensing images provided by infrared sensors 1115. If the person is immobile for a long time, it indicates that there may be an abnormality, and at this time, information should be sent to the outside, for example, to the relatives of the person in the room. This function may therefore be referred to as the guardian mode.

The monitoring area is an area in the house which can be covered by the infrared sensor 1115, and the range of the area can be set in consideration of the difference of the stay time of personnel in sub-areas such as a ground area, a sofa area, a table front area, a bed area and the like, and time preset values are respectively set for the sub-areas and are stored as monitoring setting information. And when the image is judged, the time for keeping static when the heat source area in the image is superposed with the sub-area is considered, and information is sent when the time exceeds the respective preset value. The overlap may be set as a threshold, for example, the overlap area may be a set percentage of the heat source area to be considered as overlap.

Some inspection setting information can be saved to realize the purpose of inspecting whether the indoor personnel go to bed, get up, etc. on time. Specifically, the sleeping time and/or the waking time can be set as the inspection time and the preset delay, and if the heat source region in the image does not coincide with the bed region within the preset delay after the sleeping time, it indicates that the indoor person is not going to bed on time, and at this time, the information can be sent to the outside. If the heat source area in the image still coincides with the bed area within a preset delay after the time of getting up, it indicates that the indoor person is not getting up on time, and at this time, the information can also be sent to the outside.

This function can also enable reminders if a person falls and cannot get up for various reasons inside the house. In particular, settings may be made, referred to herein as fall settings, which include mainly settings for fall area, length of fall, and fall objective. The fall area is generally set as a ground area, i.e. avoiding a position in which a sofa, a bed, etc. can lie. The setting of the fall target, that is, the setting according to the difference in posture between the person standing and the person falling, is reflected in the change in height and width of the heat source area in general. The height, width, or the relationship between the height and width of the heat source region shape may be set, for example, the height is half of the width. This arrangement is to take into account that if the height of the heat source area is less than half the width, then the person is considered to have fallen. The viewing angles of the lamps at different positions are different, so the height and width relationship should also take into consideration the positions of the lamps. It is also possible to eliminate the pet's influence by dimensioning the heat source area in the manner described above.

According to the above arrangement, the heat source area in the image is determined, and if the heat source area is located in the ground area, the shape of the heat source area conforms to the falling target, that is, the shape and the size of the heat source area are within the size range of the falling target, for example, the height of the heat source area is less than half of the width of the heat source area, and the time for receiving the image reaches the preset time length value, the indoor person is considered to be unable to fall over, and information should be sent to the outside.

The function of the third aspect can also be implemented based on a visual sensing function, that is, the infrared sensor 1115 is replaced by a camera (or both of them are available), and the environment image collected by the camera is analyzed by the processing module 1113, and this analysis can apply a technique such as pattern recognition to determine the state of a specific object in the environment. The mode not only can more accurately identify the states of the personnel in the house, such as the gesture, but also can realize the gesture identification of the personnel. When the method is applied specifically, the camera collects an environment image and then sends the environment image to the processing module 1113 for recognition, and if the environment image is recognized to contain a human body image, the human body posture is judged. The determination here is to analyze in a mode of pattern recognition for some preset conditions, for example, whether the human body falls down or not. And if the human body posture meets the preset condition, sending information to the outside.

In the mode of adopting the camera to collect images, the gesture recognition can be carried out on human body images, and at the moment, the specific information corresponding to the gesture can be sent outwards according to the specific gesture of the person.

The lamp in the embodiment of the invention can be a ceiling lamp, a desk lamp, a floor lamp, a wall lamp and the like. For houses with multiple rooms, a plurality of lamps are connected into the same local area network and can be arranged in a consistent mode or in a separate mode. If a plurality of lamps are arranged in the same room, one of the lamps can be designated as a main lamp and sends information to the outside. The plurality of lamps may be linked or may be operated individually when the mode is set. For example, if a luminaire enters or exits the housekeeping mode, then all other luminaires may enter or exit the housekeeping mode. When one lamp enters or exits the monitoring mode or the monitoring mode, other lamps can enter or exit simultaneously without being influenced or in linkage. The lamps can be grouped, the lamps in the same group are linked, and the lamps in different groups are not linked.

According to the technical scheme of the embodiment of the invention, the light sensor, the infrared sensor and the communication module are arranged in the lamp, and the functions of simulating the family, discovering illegal persons, monitoring the family and the like can be realized by adopting an adaptive program, so that the application mode of the lamp is expanded, and the safety of the family is improved.

The features of the various embodiments of the present application described above can be combined and changed arbitrarily without mutually exclusive, and are not limited to a specific embodiment. Such as described in the embodiment of fig. 18, although features not described in the embodiment of fig. 46 may also be included in the embodiment of fig. 18, it should be apparent to those of ordinary skill in the art that such features may be applied to fig. 46 without inventive step based on the description of fig. 18; for another example, although various creation schemes are described in the application by taking the LED ceiling lamp as an example, it is obvious that these designs can be applied to lamps of other shapes or types without creativity, and are not listed here.

The implementation of the embodiments of the lamp cover, the optoelectronic module, the base and the LED lamp applied thereto in the present application has been described as above, it should be reminded that the features such as "the lamp cover", "the circuit board", "the insulating unit", "the arrangement of the LED chips", "the base" and the like related to the above embodiments may include one, two, multiple or all technical features without mutual conflict. The corresponding content may be selected from one or a combination of the technical features included in the corresponding embodiments.

While the present application has been described in terms of preferred embodiments, it will be appreciated by those skilled in the art that such embodiments are merely illustrative of the present application and are not to be construed as limiting the scope of the present application. It should be noted that equivalent variations and substitutions to those of the embodiments are intended to be included within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the scope defined by the appended claims.

Claims

1. The utility model provides a LED lamp which characterized in that, LED lamp includes the lamp shade, the base that is connected with the lamp shade, be equipped with the photoelectricity module in the first accommodation space that lamp shade and base formed, the light source module includes light source module and power module, and the light source module includes first chip district and second chip district, and some power module are located between first chip district and the second chip district.

2. The LED light fixture of claim 1 wherein the circuit board includes first and second opposing faces, and wherein the optoelectronic module includes connector terminals that are connected to the electronic components on the circuit board by wires, the connection points of the wires to the circuit board being located on the first face of the circuit board.

3. The LED lamp of claim 1, wherein the connection point of the wire to the circuit board is located between the first chip region and the second chip region.

4. The LED lamp of claim 1, wherein at least one of the wires connecting an LED chip of the first chip region and an LED chip of the second chip region is electrically connected to the circuit board through a wire.

5. The LED lamp of claim 1, wherein the first chip region and the second chip region comprise at least one LED chip, and a distance between adjacent LED chips in the first chip region is smaller than a distance between adjacent LED chips in the second chip region.

6. The LED lamp of claim 1, wherein the second chip region comprises a first LED chip set, a second LED chip set and a third LED chip set, and a center point O is located between two adjacent LED chips in the first chip set₁,O₂,……，O_nN is more than or equal to 1, and a central point Q is arranged between two adjacent LED chips in the third chip group₁，Q₂，……，Q_mM is not less than 1, n and m are integers, and when m is more than 1, O is₁And Q₁Is less than O₁And Q_mDistance between themAnd (5) separating.

7. A luminaire comprising a light emitting element and a first power supply module for supplying power to the light emitting element, characterized in that the luminaire further comprises a processing module, a light sensor, a communication module, a second power supply module, wherein:

the communication module is used for communicating with the outside;

8. The luminaire of claim 7,

the system also comprises an infrared sensor, a processing module and a display module, wherein the infrared sensor is used for acquiring an infrared sensing image of an environment and then sending the infrared sensing image to the processing module;

the second power supply module is also used for supplying power to the processing module.

9. Luminaire according to claim 7 or 8,

the system also comprises an image acquisition device for acquiring an environment image;

the processing module is also used for identifying whether the environment image contains a human body image; and judging whether the human body posture in the human body image meets a preset condition or not under the condition that the environment image contains the human body image.

The communication module is also used for sending information to the outside under the condition that the human body posture in the human body image meets the preset condition.

10. The luminaire of claim 9,

the processing module is also used for performing gesture recognition on the human body image under the condition that the environment image comprises the human body image;

the communication module is also used for sending information to the outside according to the identification result.