CN220249919U

CN220249919U - LED lamp

Info

Publication number: CN220249919U
Application number: CN202321353488.7U
Authority: CN
Inventors: 王名斌; 梅荣; 陈振坤; 蒋靖源; 姚志雄; 张志超; 周林; 熊爱明; 秦建锋; 沈涛
Original assignee: Jiaxing Super Lighting Electric Appliance Co Ltd
Current assignee: Jiaxing Super Lighting Electric Appliance Co Ltd
Priority date: 2020-08-04
Filing date: 2021-08-04
Publication date: 2023-12-26
Anticipated expiration: 2031-08-04
Also published as: JP3242784U; WO2022028443A1; CN219606986U; JP2022029443A; CN216047513U; CN114076292A

Abstract

The application relates to a lighting fixture discloses an LED lamps and lanterns, the LED lamps and lanterns include photoelectric module, photoelectric module includes circuit board, light source module and power module, and power module includes first power module and second power module, and first power module and second power module are located the first face and the second face of circuit board respectively, and light source module's electronic component locates in the first face.

Description

LED lamp

The utility model relates to a Chinese patent office filed on the 08 month 04 of 2021, application number 202121801614.1 (division application number: 202220390225.2, division application filing date: 2022, 02 month 24), and division application with novel name of 'an LED lamp'.

Technical Field

The application relates to a lighting fixture, in particular to an LED lamp.

Background

The ceiling lamp is a lamp decoration which is absorbed or embedded into a roof ceiling, and is often used as lighting equipment in various places such as families, offices, entertainment places and the like. The conventional ceiling lamp generally comprises a base, a light source module, a circuit module and a lampshade, wherein a light-emitting element in the light source module is generally an energy-saving lamp tube. Because the energy-saving lamp tube has mercury pollution in the production process and after being abandoned, and the power consumption is larger than that of the LED, the LED has the characteristics of no mercury, no toxicity, no electromagnetic pollution, no harmful rays, energy conservation, environmental protection, long service life and the like, and the LED is gradually replaced by the light-emitting element of the ceiling lamp. However, the existing ceiling lamp still has the problems of light emission, heat dissipation, installation, packaging and the like in the using process, and the specific steps are as follows:

1. In the lighting process, the problems of flash, small irradiation range, uneven light emission, small brightness of the central part of the lamp, uneven brightness of the central part of the lamp and the peripheral part of the lamp, uneven light emission of the light emitting surface, glare, uneven brightness of the mounting surface of the light emitting element, uneven brightness and low color rendering property, low luminous efficiency and light designability, bright spots, low rendering effect, uneven color mixing, uneven brightness of the peripheral part of the ceiling, light blocking of circuit elements with higher heights, large color temperature and color deviation, narrow light orientation, low light transmission efficiency, low light emitting efficiency of a light source, dim lateral area of the lamp shade, uneven brightness of the light emitting surface of the lamp shade, low light extraction efficiency of the light emitting element, low light comfort, low light extinction degree and the like occur, and in addition, the existing lamp has the following problems: some usage scenes can want the light emitted by the lamp to have a three-dimensional effect or generate a corresponding light space according to the corresponding life scene, the paper surface with color tone is difficult to read under the lamp by a user, the color of characters and objects to be observed is reduced by the old, the light comfort of the old is low, and the like.

In order to improve the optical effect of the ceiling lamp, a backlight lens is added on an LED to reduce dark areas at the middle part and the edge part of the lamp, but the production cost is greatly increased and the product competitiveness is reduced due to the adoption of a backlight lens and lens patch technology; the second one is that an optical member such as a light guide plate, a lens, a reflecting unit, etc. is disposed between the light emitting element and the lamp housing, but after the optical member is adopted, problems such as variation of the amount of light incident to the light guide plate, complicated structure of the optical member, uneven brightness on the light guide plate, dark portion on the light guide plate, etc. occur;

2. the light emitting element and the circuit element generate heat, and the heat can influence the service life of the ceiling lamp;

3. the light source module is mostly installed in the lamp body through the screw, or paste in the lamp body through the binder, and difficult dismantlement is replaced after the installation. In addition, after the ceiling lamp is used for a long time, the phenomena of ageing and burning loss of the light source module often occur, if the light source module is damaged and needs to be replaced, the damaged light source module is detached through a tool, a new light source module is installed through the tool, the replacement operation of the LED light source module is required to be operated by a professional, and the use process is inconvenient;

4. The ceiling lamp is generally of a flat structure, has the characteristics of small occupied height, wide illumination range and the like, however, the whole thickness of the ceiling lamp is still large, so that the volume of a product is increased, and the packaging and inventory cost is further improved.

In addition, the lamp has the problems of low safety, low manufacturing efficiency, high use cost, easiness in entering the lamp by insects and the like to affect the appearance, incapability of continuing to illuminate when a power supply fails, small installation area of a circuit board, limited luminous flux of the whole lamp, low remote control sensitivity or narrow remote control range during intelligent control, noise during installation and the like in the use process.

In view of the above-described shortcomings and drawbacks of the prior art, there is a need for an improvement over existing LED light fixtures that overcomes these shortcomings and drawbacks.

Disclosure of Invention

The application provides an LED lamp aiming at the defects in the prior art.

In order to solve the technical problems, the application is solved by the following technical scheme:

the utility model provides a LED lamps and lanterns, lamps and lanterns include light source module and to the first power module of light source module power supply, this lamps and lanterns still include processing module, light sensor, communication module and second power module, wherein:

The processing module comprises a processor for realizing logic processing of information;

the light sensor is used for sensing the ambient illumination intensity and sending the ambient illumination intensity information to the processing module;

the communication module is used for communicating with the outside;

the second power supply module is used for supplying power to the processing module, the optical sensor and the communication module.

Preferably, the LED lamp further comprises an infrared sensor, which is used for acquiring an infrared sensing image of the environment and then sending the infrared sensing image to the processing module;

the second power supply module is also used for supplying power to the processing module.

Preferably, the LED lamp further comprises an image acquisition device for acquiring an environment image;

the processing module is also used for identifying whether the environment image contains a human body image or not; judging whether the human body posture in the human body image accords with a preset condition or not under the condition that the environment image contains the human body image;

the communication module is also used for sending information to the outside under the condition that the human body posture in the human body image accords with the preset condition.

Preferably, the processing module is further configured to perform gesture recognition on the human body image when the environment image includes the human body image;

the communication module is also used for sending information to the outside according to the identification result.

Through the structural design, one or any combination of the following beneficial effects are achieved:

(1) The light sensor, the infrared sensor and the communication module are arranged in the lamp, and the functions of simulating someone in a house, finding illegal personnel, monitoring family and the like can be realized by adopting an adaptive program, so that the application mode of the lamp is expanded, and the safety of various aspects of the house is improved; (2) The photoelectric module is simple and convenient to assemble, and a user can assemble the photoelectric module by himself; (3) The length of the lead used for the connector terminal and the circuit board is short, so that wires can be saved; after the assembly is completed, the connector terminal forms a certain angle with the circuit board, so that the height of the exposed first surface of the connector terminal is minimized, and light emitted by the light source module is not blocked.

Drawings

FIG. 1 is a schematic structural view of an embodiment of an LED lamp of the present application;

FIG. 2 is a schematic view of an embodiment of FIG. 1 with the lamp cover removed;

FIG. 3 is a schematic perspective view of an embodiment of an LED lamp with an insulation unit removed from a photovoltaic module;

FIG. 4 is a schematic perspective view of an LED lamp with an insulation unit removed from a photovoltaic module;

FIG. 5 is a schematic perspective view of an LED lamp with an insulation unit removed from a photovoltaic module;

FIG. 6 is a schematic diagram II of an embodiment of an LED lamp with an insulation unit removed from the photovoltaic module;

FIG. 7 is a schematic perspective view of an optoelectronic module of an LED lamp in an embodiment;

FIG. 8 is a schematic diagram II of an embodiment of an optoelectronic module of an LED lamp;

FIG. 9 is a schematic diagram of an embodiment of a method of assembling an optoelectronic module according to the present disclosure;

FIG. 10 is a schematic view of an assembled photovoltaic module using the assembly method of FIG. 9;

FIG. 11 is a schematic view of the structure of section A-A of FIG. 10;

FIG. 12 is a schematic perspective view of a base in one embodiment;

FIG. 13 is a schematic perspective view of an LED lamp in an embodiment;

FIG. 14 is a schematic perspective view of an LED light fixture in an embodiment;

FIG. 15A is a schematic perspective view of the photovoltaic module of FIG. 14;

FIG. 15B is an enlarged schematic view of portion A of FIG. 15A;

FIG. 15C is a schematic view of the first insulating portion of FIG. 15A;

FIG. 16 is a schematic perspective view of the circuit board of FIG. 15;

FIG. 17A is a schematic cross-sectional view of the LED lamp shown in FIG. 14 with the lamp cover removed;

FIG. 17B is a schematic view of section A-A of FIG. 17A;

FIG. 17C is an enlarged schematic view of portion B of FIG. 17B;

FIG. 18A is a schematic diagram of an embodiment of an optoelectronic module;

FIG. 18B is a schematic diagram of a second embodiment of an optoelectronic module;

FIG. 18C is a schematic view of section A-A of FIG. 18A;

FIG. 18D is an enlarged schematic view of portion B of FIG. 18C;

FIG. 18E is an enlarged schematic view of portion C of FIG. 18C

Fig. 18F is a schematic structural view of the first insulating portion in fig. 18A;

FIG. 18G is a schematic view of section B-B of FIG. 18F;

FIG. 18H is an enlarged schematic view of portion D of FIG. 18G;

FIG. 19A is a schematic diagram of an embodiment of an optoelectronic module;

FIG. 19B is a schematic diagram of a second embodiment of an optoelectronic module;

FIG. 19C is a schematic view of section E-E of FIG. 19B;

fig. 19D is an enlarged view of the portion F in fig. 19C;

FIG. 19E is a schematic diagram of a third embodiment of an optoelectronic module;

fig. 19F is an enlarged view of the portion B in fig. 19E;

FIG. 19G is an enlarged view of section G-G of FIG. 19E;

fig. 19H is an enlarged view of the portion H in fig. 19G;

FIG. 19I is a schematic diagram of a fourth embodiment of an optoelectronic module;

FIG. 19J is an enlarged view of section I-I of FIG. 19I;

FIG. 19K is an enlarged view of portion J of FIG. 19J;

FIG. 19L is a schematic diagram of the circuit board of FIG. 19A;

FIG. 19M is a schematic view of the first insulating portion of FIG. 19A;

fig. 19N is an enlarged view of the K portion in fig. 19M;

fig. 20 is a schematic view of the main components of a luminaire according to an embodiment of the present invention.

Detailed Description

The present application is described in further detail below with reference to the accompanying drawings and examples.

In order to facilitate an understanding of the present application, a more complete description of the present application will now be provided with reference to the relevant figures. Preferred embodiments of the present application are shown in the accompanying drawings. This application may, however, be embodied in many different forms and is not limited to the embodiments described below. Rather, these embodiments are provided so that this disclosure will be thorough and complete. The directions such as "axial direction", "above", "below", etc. are hereinafter for the sake of clarity in terms of structural positional relationship, and are not limiting of the present application. In this application, the terms "equal", "vertical", "horizontal", "parallel" are defined as: including + -10% cases based on standard definition. For example, perpendicular generally refers to an included angle of 90 degrees with respect to the reference line, but in this application, perpendicular refers to a case that includes within 80 degrees to 100 degrees. In addition, the use condition and the use state of the LED lamp in the application refer to the use situation of the LED lamp in a hanging mode that the lampshade is vertically downward, and if other exceptional conditions exist, the use situation will be described.

As shown in fig. 1 to 20, the LED lamp of the embodiment in the present application is, for example, a ceiling lamp mounted on a ceiling. The upper side of fig. 1 to 20 (the positive z-axis direction in fig. 1) corresponds to the direction of the floor surface opposite to the ceiling. In other words, the LED luminaire shown in fig. 1 to 20 is adapted to the opposite posture when in normal use.

The LED lamp designed by the application is positioned in a Cartesian coordinate system as shown in FIG. 1, wherein the z-axis is parallel to the central axis of the LED lamp. As shown in fig. 1 to 20, the LED lamp includes a lamp cover 1 and a base 3 connected to the lamp cover 1, and a photovoltaic module 2 is disposed in a first accommodating space formed by the lamp cover 1 and the base 3. In this embodiment, the LED lamp further includes a mounting portion 31 provided on the base 3, a hanger 4, and an adapter hanger (or adapter) 5, and the optoelectronic module 2 is fixed to the base 3 by the mounting portion 31, and the hanger 4 is connected to the adapter 5. Between the LED lamp and the ceiling, a buffer member 7 is provided for suppressing the shake of the LED lamp, and the buffer member 7 may be, for example, a sponge.

As shown in fig. 1 to 19, the photovoltaic module 2 includes a light source module 22 and a power module 23, in order to prevent power failure and the like from breaking down when external power is cut off, the power module 23 may include a storage battery unit for storing electric energy, and an afterglow module is stored in the storage battery unit, and the afterglow module automatically emits afterglow illumination to ensure safety.

As shown in fig. 1 to 19, the photovoltaic module 2 is configured as a unitary structure and is detachably fixed to the base 3, so that when the photovoltaic module 2 is damaged, it can be replaced alone, which is more cost-effective than a whole lamp replacement. When the optoelectronic module 2 is replaced, it is necessary to prevent the occurrence of electric shock, and particularly, when the optoelectronic module 2 is replaced, the electronic component is touched by a hand. The photovoltaic module 2 in this embodiment includes an electronic component, and an insulating unit is disposed outside the electronic component, so that the electronic component is prevented from being contacted when the photovoltaic module 2 is replaced. The optoelectronic module 2 includes a circuit board 201, the circuit board 201 may be a single PCB board or a double PCB board, and at least part of electronic components are disposed on the circuit board 201. Further, all electronic components are disposed on the circuit board 201. The electronic components include electronic components (such as LED beads) in the light source module 22 and electronic components in the power source module 23. That is, the electronic components of the light source module 22 and the electronic components of the power source module 23 are integrated on the same circuit board, thereby saving cost and space.

As shown in fig. 3 to 6, the circuit board 201 includes a first surface 2011 and a second surface 2012 disposed opposite to each other, wherein the first surface 2011 faces the lamp cover 1. In an embodiment, the electronic components of the light source module 22 are disposed on the first surface 2011, and the electronic components of the power source module 23 can be disposed on the first surface 2011, so that the circuit board 201 only needs to arrange a circuit layer on the first surface 2011, and the wiring cost can be saved. In some embodiments, referring to fig. 3 and 4, the electronic components of the light source module 22 are disposed on the first surface 2011, and the electronic components of the power source module 23 are all disposed on the second surface 2012, so that the electronic components of the light source module 22 and the electronic components of the power source module 23 can be separately disposed. When the lamp is turned on, generally, the electronic components of the light source module 22 and the electronic components of the power source module 23 may generate heat, so that the two components are separately configured to avoid heat source concentration or heat generated during operation from affecting each other, and at this time, the circuit layers may be disposed on the first surface 2011 and the second surface 2012 at the same time. In the present embodiment, the electronic components in the light source module 22 are disposed on the first surface 2011, the electronic components in the partial power source module 23 are disposed on the first surface 2011, and the electronic components in the other partial power source module 23 are disposed on the second surface 2012. In the embodiment, the electronic components of the power module 23 are disposed on the first surface 2011 and the second surface 2012, respectively, so that the layout of the electronic components in the power module 23 can be better performed. For example, the electronic components of the power module 23 located on the first surface 2011 include components with relatively low heights, such as an IC (control circuit) and a chip component (such as a chip resistor), so that the light emitted by the light source module 22 is not blocked by an obstacle, thereby reducing light loss and improving light emitting efficiency. While the electronic components of the power module 23 on the second side 2012 include components having a relatively high height, such as a transformer, a capacitor, an inductor, and the like. For example, the electronic components of the power module 23 located on the first surface 2011 include heat generating components (components that generate more heat during operation, such as ICs and resistors, etc.), and the electronic components of the power module 23 located on the second surface 2012 include heat labile components (such as electrolytic capacitors), and the heat labile components and the heat generating components are respectively disposed on the second surface 2012 and the first surface 2011, so that the influence of the heat generated during operation of the heat generating components on the heat labile components can be reduced, and the reliability and the service life of the whole power module 23 can be improved.

As shown in fig. 7 to 8, the optoelectronic module 2 further includes an insulating unit, where the insulating unit includes a first insulating portion 202 and/or a second insulating portion 203, and the first insulating portion 202 is configured to allow light generated when the light source module 22 works to pass through, and the first insulating portion 202 covers all the electronic components on the first surface 2011, so as to prevent the electronic components on the first surface 2011 from being touched by mistake to cause an electric shock. The second insulating portion 203 covers all the electronic components on the second face 2012, and the material of the second insulating portion 203 may be one of PC or acryl, and the two materials have the characteristics of light weight and low cost. In the present embodiment, the electronic component on the second surface 2012 is located further inside in the radial direction of the circuit board 201 than any one of the electronic components of the light source module 22, that is, the projection of the electronic component on the second surface 2012 and the electronic component of the light source module 22 in the thickness direction of the circuit board 201 do not overlap. On the one hand, the heat generated when the electronic components of the light source module 22 are operated can be prevented from affecting the electronic components of the second surface 2012, and on the other hand, the distribution area of the electronic components on the second surface 2012 can be limited, so that the size of the second insulating portion 203 can be controlled to control the cost.

As shown in fig. 9 to 11, the optoelectronic module 2 of the present application further includes a connector terminal 24, the electrical connection terminal 24 is electrically connected to an external power source (e.g. a mains supply) for receiving an external power signal and transmitting the power signal to the LED lamp, the connector terminal 24 is connected to the electronic component on the second face 2012 by a wire 241, and a connection point between the wire 241 and the circuit board 201 is located on the second face 2012 of the circuit board 201. The embodiment takes the case that all the electronic components of the power module are located on the second surface 2012 as an example, but not limited thereto. The circuit board 201 is provided with an opening 2018, the opening 2018 is communicated with the first face 2011 and the second face 2012, the opening 2018 is close to the wire 241, the distance from the opening 2018 to the wire 241 in the radial direction of the circuit board is smaller than the length of the wire 241, and preferably the shortest distance from the opening 2018 to the wire 241 in the radial direction of the circuit board is smaller than the length of the wire 241, so that the electrical connection is ensured to be stable. The first insulating portion 202 is provided with a fixing buckle 2025, after the assembly of the optoelectronic module 2 is completed, the fixing buckle 2025 is located in a region between 30 degrees and 60 degrees with the first surface 2011, preferably, the fixing buckle 2025 is located in a region between 30 degrees and 45 degrees with the first surface 2011, so that when a user self-assembles, the connector terminal 24 is easy to fix to the fixing buckle 2025 through the opening 2018, and a portion of the connector terminal 24 is exposed out of the first insulating portion 202 to facilitate subsequent electrical connection. Fig. 9 illustrates an assembly method of an embodiment of the photovoltaic module of this application, see fig. 9-11, comprising:

1) The connector terminals 24 are connected to the electronic components on the circuit board 201 through the wires 241, pressing the circuit board 201 into the first insulating portion 202;

2) Pressing the connector terminals 24 through the openings 2018 in the circuit board 201 into the fasteners 2025 of the first insulating portion 202, with a portion of the connector terminals 24 exposed outside the first insulating portion 202;

3) The second insulating portion 203 is fixed on the circuit board 201, and the second insulating portion 203 covers all the electronic components on the wires 241 and the second face 2012.

When the photoelectric module is assembled, the circuit board is fixed on the base, the connector terminal is fixed on the fixing buckle on the first insulation part, and finally the first insulation part is fixed. However, by adopting the connector terminal fixing mode, the position of the first insulating part needs to be adjusted when the first insulating part is fixed, and in the adjustment process, the electric connection point between the connector terminal and the circuit board is easy to loose, and the electric connection is unstable; in order to solve the problem that the electric connection is unstable, longer wires are needed, but the wires are too long, so that the wire cost is increased. The photoelectric module is assembled by adopting the assembling method, so that the method is simple and convenient, a user can assemble the photoelectric module by himself, and the length of the lead wire for the connector terminal and the circuit board is short, so that wires can be saved; after the assembly is completed, the connector terminal forms a certain angle with the circuit board, so that the height of the exposed first surface of the connector terminal is minimized, and light emitted by the light source module is not blocked.

The lamp cover 1 in the present application may have various structures, and referring to fig. 1 to 16, in an embodiment, the lamp cover 1 has a smooth curved surface to prevent the uneven light distribution caused by the refractive index difference of the cross section of the lamp cover. In one embodiment, the lamp housing 1 includes a central portion and a peripheral portion surrounding the central portion, the lamp housing 1 has a light diffusion layer, the light diffusion layer contains light diffusion particles, and the density of the light diffusion particles in the central portion is greater than that in the peripheral portion, so that the brightness of the center and the periphery of the lamp is uniform. In one embodiment, the lamp housing 1 has a plurality of diffusion regions, wherein one diffusion region overlaps the optoelectronic module 2 in the z-axis direction, so as to improve the flash of the lamp. In an embodiment, the inner surface or the outer surface of the lampshade 1 may be provided with a brightness enhancement film, so as to distribute light energy of the light emitted by the light source module 2, thereby realizing uniform light emission of the LED lamp and avoiding glare. The inner surface and the outer surface are opposite, and the inner surface of the lampshade 1 is a surface close to the photoelectric module 2. In an embodiment, the lamp housing 1 is provided with a through hole, and a mounting screw for mounting the lamp housing 1 to the base 3 is inserted into the through hole of the lamp housing 1 with play and screwed to the base 3, whereby even if the lamp housing and the base expand or contract due to a temperature change caused by opening and closing of the lamp, stress generated by the expansion or contraction can be reduced by the play, and breakage of the lamp housing and the appliance or generation of noise can be prevented.

The base in the LED lamp of the present application may adopt different structures, fig. 12 is a schematic structural diagram of an embodiment of the base in the LED lamp of the present application, the base is located in a space rectangular coordinate system (x, y, z), where the z-axis is parallel to the central axis of the LED lamp, the base 3 is disc-shaped, for example, made of an aluminum plate or a steel plate, etc., as shown in fig. 12 and 13, a hole 33 is formed in a central portion of the base 3, a supporting portion 34 and an edge portion 35 are formed around the hole 33, a space is formed between the supporting portion 34 and the edge portion 35, the space extends along the negative z-axis direction to form a groove portion 36, the supporting portion 34 and the edge portion 35 are located at the same position in the positive z-axis direction, and of course, in other embodiments, the supporting portion 34 and the edge portion 35 are located at different positions in the positive z-axis direction, for example, the height of the supporting portion 34 in the positive z-axis direction is greater than the edge portion 35. The photovoltaic module 2 has an upper surface and a lower surface opposite to the upper surface, the lower surface of the photovoltaic module 2 is far away from the lampshade 1, and the lower surface of the lampshade 1 is in a surface contact state with the supporting part 34, so that heat generated by the photovoltaic module is transferred out through the base, and the heat dissipation speed is improved. In other embodiments, the photovoltaic module 2 and the supporting portion 34 are not in a completely-attached surface contact state, a part of gap exists between the photovoltaic module 2 and the supporting portion 34, and some heat conducting adhesive layers can be filled in the gap, so that heat generated by the LED chip 2201 during operation can be rapidly delivered to the base 3 through the circuit board 201 and the heat conducting adhesive layers, and heat dissipation capability is improved.

Fig. 14 is a schematic structural diagram of an embodiment of an LED lamp according to the present application, referring to fig. 14, 15A to 15B, 16, and 17A to 17C, the light source module includes a first chip area 2211 and a second chip area 2212, and at least a portion of the power source module 23 is located between the first chip area 2211 and the second chip area 2212. In some embodiments, the circuit board 201 includes a first side 2011 and a second side 2012 opposite to each other, the first side 2011 is provided with a first chip area 2211 and a second chip area 2212, the first chip area 2211 and the second chip area 2212 include at least one LED chip 2201, the power module 23 includes a first power module 231 and a second power module 232, which are respectively located on the first side 2011 and the second side 2012 of the circuit board 201, the first power module 231 is located between the first chip area 2211 and the second chip area 2212 (the first power module 231 is also located on the first side 2011) in a radial direction of the circuit board 201, the power module 23 includes a power supply unit 3a, a voltage boosting unit 3b, and a voltage dropping unit 3c, the power supply unit 3a includes a first driving element 3a1, the voltage reducing unit 3c includes a second driving element 3c1, the voltage increasing unit 3b includes a third driving element 3b1, the first driving element 3a1, the second driving element 3c1 and the third driving element 3b1 are located on the first surface 2011 of the circuit board 201, after the LED lamp is lighted for t (t is more than or equal to 0.5) hours, the temperature of the first driving element 3a1 and the temperature of the third driving element 3b1 are smaller than the temperature of the second driving element 3c1, preferably the temperature of the first driving element 3a1 is smaller than the temperature of the third driving element 3b1, that is, the temperature of the first driving element 3a1 is smaller than the temperature of the third driving element 3b1 is smaller than the temperature of the second driving element 3c 1. The second driving element 3c1 is closer to the second chip area 2212 than the first driving element 3a1, the third driving element 3b1 is farther from the second chip area 2212 than the second driving element 3c1, and the driving elements in the power module are designed in a dispersed manner, so that the influence of heat on the first chip area and the second chip area is reduced.

In the present embodiment, the first chip area 2211 has a first edge S1 and a second edge S2 opposite to each other, the first edge S1 is close to the central axis of the LED lamp, the surfaces of at least two LED chips 2201 in the first chip area 2211 close to the first power module 231 are in contact with the second edge S2, the second chip area 2212 has a third edge S3 and a fourth edge S4 opposite to each other, the second edge S2 is located between the first edge S1 and the third edge S3, the third edge S3 is located between the second edge S2 and the fourth edge S4, and the circumferences of the patterns (e.g. circles, ovals, etc.) surrounded by the first edge S1, the second edge S2, the third edge S3 and the fourth edge S4 are C1, C2, C3 and C4 in sequence, and C1 < C2 < C3 < C4. The surfaces of at least two LED chips 2201 in the second chip area 2212, which are close to the first power module 231, are in contact with the third edge S3, the distance from the first edge S1 to the second edge S2 is d1, the distance from the first edge S1 to the third edge S3 is d2, the distance from the first edge S1 to the fourth edge S4 is d3, d1+d2 < d3, preferably 2d1+d2 < d3, the first chip area is close to the central part of the circuit board, so that dark areas of the central part of the lamp can be effectively reduced, and in addition, the first chip area is far away from the first power module, so that the influence of the first power module on the first chip area is reduced.

A second accommodating space is formed between the first insulating portion 202 and the base 3, the second accommodating space is located in the first accommodating space, the circuit board 201 is located in the second accommodating space, and the first insulating portion 202 includes a light processing unit 202b and an isolation unit 202c. When the light source module emits light, a part of or all of the light passes through the light processing unit 202b, and the light processing unit 202b is used for controlling the light emitting uniformity of the LED lamp. The isolation unit 202c includes a first region 202c1 and a second region 202c2, the light processing unit 202b connects the first region 202c1 and the second region 202c2, and the first region 202c1 and the second region 202c2 are disposed opposite to each other in a radial direction of the first insulating portion 202. In an embodiment, the extending direction of the second region 202c2 intersects with the direction of the central axis of the LED lamp, and the inclined design can increase the stress area of the second region, so as to increase the deformation resistance, preferably, the included angle between the second region 202c2 and the direction of the central axis of the LED lamp is 0 to 80 degrees, and preferably, the included angle between the second region 202c2 and the direction of the central axis of the LED lamp is 30 to 60 degrees.

The first insulating portion 202 is provided with at least one fixing unit, which is used to fix the circuit board 201, and the fixing unit may be, for example, a fastening manner, a threaded connection, etc., and in one embodiment, the fixing unit 2027 is located between the light processing unit 202b and the isolation unit 202c.

Fig. 18A is a schematic diagram of an embodiment of an optoelectronic module, please refer to fig. 18A to 18H, wherein the fixing units include at least one first fixing unit 2027a and/or at least one second fixing unit 2027b, the first fixing unit 2027a and the second fixing unit 2027b may have the same structure, and of course, in some embodiments, the first fixing unit 2027a and the second fixing unit 2027b may have different structures. In this embodiment, the first fixing unit 2027a is located between the second region 202c2 and the light processing unit 202b, the second fixing unit 2027b is located between the first region 202c1 and the light processing unit 202b, the circuit board 201 includes a first side 201b and a second side 201c opposite to each other, in the above embodiment, the first edge S1 may be corresponding to the first side 201b, and the fourth edge S4 may be corresponding to the second side 201c. The first chip area 2211 and the second chip area 2212 are located between the first side portion 201b and the second side portion 201c, the first fixing unit 2027a extends towards the central axis of the LED lamp, the second fixing unit 2027b extends towards the direction away from the central axis of the LED lamp, the first fixing unit 2027a includes a first fixing surface 2027a1, the circuit board 201 is located between the first fixing surface 2027a1 and the first insulating portion 202, so as to fix the second side portion 201c of the circuit board 201, the second fixing unit 2027b includes a second fixing surface 2027b1, the circuit board 201 is located between the second fixing surface 2027b1 and the first insulating portion 202, so as to fix the first side portion 201b of the circuit board 201, and two sides of the circuit board 201 are fixed in the first insulating portion 202 through the fixing units, so that stability of the circuit board is improved. In the present embodiment, the first fixing surface 2027a1 and the second fixing surface 2027b1 are located on the same horizontal plane, but not limited thereto. The spacing between the first fixing unit 2027a and the second fixing unit 2027b is smaller than the distance between the first side 201b and the second side 201c, so as to provide stable support to the circuit board, and in some embodiments, the first fixing surface 2027a1 and the second fixing surface 2027b1 contact the circuit board 201, and the hardness of the portions of the first fixing unit 2027a and the second fixing unit 2027b contacting the circuit board 201 is greater than that of the other portions not contacting the circuit board 201, so that the fixing effect on the circuit board can be increased.

In other embodiments, the circuit board 201 may be fixed by using only the first fixing unit 2027A or the second fixing unit 2027B, as shown in fig. 15A to 15B, fig. 16, and fig. 17A to 17C, in this embodiment, the circuit board 201 is fixed by using only the first fixing unit 2027A, and the structure of the first fixing unit 2027A mentioned above is not repeated here. The first insulating portion 202 is provided with a third opening 2025c, the third opening 2025c is connected to the first fixing surface 2027a1, the circuit board 201 is located between the first fixing unit 2027a and the first insulating portion 202, and a portion of the circuit board 201 is exposed by the first insulating portion 202, so that a portion of heat generated by the second chip area can be dissipated, and the temperature of the electronic component on the first surface of the circuit board is reduced.

As shown in fig. 15A, the first insulating portion 202 includes at least one first opening 2025A and at least one second opening 2025b, the first opening 2025A and the second opening 2025b are respectively located in the first area 202c1 and the second area 202c2, and the first opening 2025A and the second opening 2025b enable the second accommodating space to be in communication with the outside, so that heat generated when the electronic component on the circuit board is operated is dissipated through the first opening and the second opening.

As shown in fig. 14, 15A to 15C, 16, and 17A to 17C, in one embodiment, the first region 202C1 includes a spacer 2028, the spacer 2028 includes opposite ends and a second end, the first end is adjacent to the light processing unit 202b, and the spacer 2028 is disposed around the circumference of the first region 202C1 and extends toward the central axis of the LED lamp. In the height direction of the LED lamp, a first height difference exists between the isolation board 2028 and the light processing unit 202b, and after the first insulating portion 202 is fixed on the base 3, a second height difference exists between the base 3 and the isolation board 2028 in the height direction of the LED lamp, and due to the first height difference and the second height difference, the adapter 5 can be located at the first end or the second end of the isolation board 2028, so as to meet different installation requirements of users. In an embodiment, the first opening 2025a communicates the first end of the isolation board 2028 with the second end of the isolation board 2028, in the height direction of the LED lamp, the height of the first opening 2025a is greater than the height of the circuit board 201, the first opening 2025a and the third opening 2025c form a first heat dissipation path, the first opening 2025a and the second opening 2025b form a second heat dissipation path, and the first face 2011 of the circuit board 201 and the second face 2012 of the circuit board 201 are cooled through the first heat dissipation path and the second heat dissipation path, so that the service lives of the power module and the light source module are prolonged. In an embodiment, in the height direction of the LED lamp, the spacer 2028 has a height difference with the circuit board 201, so as to improve the heat dissipation effect on the circuit board. In an embodiment, a gap is formed between the first opening 2025a and the circuit board 201, the second opening 2025b is located in the groove portion 36 of the base 3, and the first insulating portion 202 forms a heat dissipation path through the first opening 2025a and the second opening 2025b, so as to dissipate heat of electronic components on the circuit board, and improve service lives of the power module and the light source module. In one embodiment, the second end of the spacer 2028 may be provided with at least one reinforcement 2028a to increase the structural strength of the first region 202c 1.

Referring to fig. 19N, a first sub-area 202c3 is formed between two adjacent first openings 2025a, the number of the first sub-areas 202c3 is one less than the number of the first openings 2025a, and each first sub-area 202c3 has at least one reinforcing portion 2028a.

Referring to fig. 19A to 19N, the structure of the circuit board in fig. 19A to 19N is the same as that of the circuit board shown in fig. 16, and the led lamp includes, in combination with fig. 16 and 19A to 19N, a connector terminal 24 connected to the power supply unit 3a, the connector terminal 24 is electrically connected to the power supply unit 3a through a wire 241, the first insulating portion 202 is provided with a wiring unit 202d for fixing the wire 241 and protecting the wire from pulling, the wiring unit 202d includes a first wire groove 202b1 on the light processing unit 202b, a second wire groove 202c4 in any one of the first sub-areas 202c3, a fourth opening 202c5 communicating with the first wire groove 202b1, and a fifth opening 2028b on the isolation board 2028, the fourth opening 202c5 communicates with the fifth opening 2028b, the first wire groove 202b1 communicates with the second wire groove 202c4, and the wire 241 passes through the fourth opening 202c5 and the fifth opening 2028b after passing through the first wire groove 202b1 and the second wire groove 202c 4.

In an embodiment, referring to fig. 19A to 19N, the fixing unit 2027 further includes at least one positioning column 2027c, where the positioning column 2027c is located between the light processing unit 202b and the second region 202c2 and extends towards a direction approaching the first region 202c1, and at least one positioning opening 201d is provided on the circuit board 201, and when the circuit board is mounted, the positioning opening is aligned with the positioning column 2027c, so as to primarily determine a mounting position of the circuit board.

In an embodiment, referring to fig. 19A to 19N, the fixing unit 2027 further includes at least one first step 2027d, where the first step 2027d is located on the light processing unit 202b and extends towards a direction close to the first area 202c1, so that a certain distance is provided between the light source module and the light processing unit, which plays a role in limiting the installation of the circuit board, preventing the circuit board from being excessively pressed, and further the LED chip interferes with the first insulation portion, thereby affecting the use. In an embodiment, the fixing unit 2027 may further include at least one second step 2027e, where the second step 2027e is located on the light processing unit 202b and extends away from the first region 202c1, and depending on the stress condition of the circuit board, only the first step 2027d or the second step 2027e may be disposed in the LED lamp, or both the first step 2027d and the second step 2027e may be disposed.

Referring to fig. 14 and fig. 15A to 15C, the first insulating portion 202 further includes a transition portion 2026, and the first insulating portion 202 is connected to the base 3 through the transition portion 2026. In an embodiment, the connection unit 202e includes a transition portion 2026, where the transition portion 2026 is located on the second region 202c2, and the transition portion 2026 is connected to the base 3 through a fixing structure, and the fixing structure may be a clamping structure, a bolt structure (threads and screws), a fastening structure, or a magnetic structure. The transition portion 2026 is connected to the mounting portion 31 on the base 3 by a fixing structure. If the base structure shown in fig. 12 is adopted in fig. 14, and in combination with fig. 12, 14 and 15A to 15C, a space is provided between the transition portion 2026 and the groove portion 36 (the transition portion is not filled with the groove portion in the radial direction of the LED lamp), so that the fluidity of heat generated by the LED lamp can be increased, and the temperature of the electronic components in the LED lamp can be reduced. In an embodiment, the transition portion 2026 includes a connection region 2026a and a reinforcement region 2026b, the connection region 2026a extends from the second region 202c2 toward the edge portion 35, the connection region 2026a has a highest point and a lowest point in a height direction of the LED lamp, and the lowest point contacts the groove portion 36, so as to increase a contact area between the first insulating portion and the base, and improve a fixing effect of the optoelectronic module. The reinforcing region 2026b extends from the second region 202c2 toward the edge portion 35, and the reinforcing region 2026b connects the second region 202c2 and the connecting region 2026a, so that the mechanical strength of the transition portion is improved, and a portion of the fixing structure may be located in the connecting region 2026a.

As shown in fig. 15A to 15C, fig. 16, fig. 17A to 17C, the light processing unit 202b includes a first light processing area 2a, a second light processing area 2b and a third light processing area 2f, the first light processing area 2a corresponds to the first chip area 2211, the second light processing area 2b corresponds to a part of the power supply module, in this embodiment, the second light processing area 2b corresponds to the first power supply module 231, the third light processing area 2f corresponds to the second chip area 2212, in one embodiment, the cross section of the first light processing area 2a and/or the cross section of the third light processing area 2f is different from the cross section of the second light processing area 2b, the light processing unit 202b may be a light absorption area or a lens unit as described above, in this embodiment, the second chip area 2212 includes two sets of LED chip sets 221, a sub-light processing area can be designed corresponding to each set of LED chip sets 221, in this embodiment, a first insulating portion 202 is provided with a first light processing area 2211, a first light processing area 2a corresponding to the first power supply module 231, a second light processing area 202b is provided with a first light processing area, a second light processing area 2b is provided with a light reflection area 2C and a light reflection area 2C is provided on the first light processing area 2b, and a light reflection area 2C is provided on the first light processing area 2b is provided, and a light processing area 2C is arranged on the light processing area 2b, and light processing area 2C is arranged. Referring to fig. 19A to 19N, the first line groove 202b1 is located in the first light treatment area 2a. In some embodiments, the light processing unit may be frosted to improve the light emitting effect of the LED lamp, or the first insulating portion may be frosted to improve the light emitting effect of the LED lamp while improving the beauty of the first insulating portion. In some embodiments, in the height direction of the LED lamp (for example, the positive Z-axis direction shown in fig. 14), the height of the second light treatment area 2b is greater than or equal to the heights of the first light treatment area 2a and the third light treatment area 2f, on the one hand, in the height direction of the LED lamp, the height of a part of the electronic components in the first power supply module is greater than the height of the LED chip, and the second light treatment area 2b can better cover the first power supply module; on the other hand, the light emitted from the first chip area 2211 and the second chip area 2212 is partially or completely refracted by the second light processing area 2b, so as to avoid the dark areas of the first chip area 2211 and the second chip area 2212.

The distance from the first chip area 2211 to the base 3 is smaller than the distance from the second chip area 2212 to the base 3, and the distance between adjacent LED chips in the first chip area 2211 is smaller than the distance between adjacent LED chips in the second chip area 2212. Because the first chip area 2211 is closer to the base 3 and the first opening 2025a than the second chip area 2212, the heat generated by the first chip area 2211 is easier to dissipate than the second chip area 2212.

Referring to fig. 18A to 18H, the second chip area 2212 includes at least one group of LED chip sets, and one of the differences between the present embodiment and the optoelectronic module shown in fig. 15 is that the second chip area 2212 includes three groups of LED chip sets, namely, a first LED chip set 221a, a second LED chip set 221b and a third LED chip set 221c, respectively, the first LED chip set 221a, the second LED chip set 221b and the third LED chip set 221c are located on different circumferences, respectively, the first LED chip set 221a, the second LED chip set 221b and the third LED chip set 221c each include at least one LED chip 2201,the second LED chip set 221b is located between the first LED chip set 221a and the third LED chip set 221 c. In an embodiment, the number of LED chips of the second LED chip set 221b is smaller than the number of LED chips of the first LED chip set 221a and the third LED chip set 221b, and preferably, the number of LED chips of the second LED chip set 221b is smaller than the number of LED chips of the first LED chip set 221a and the number of LED chips of the third LED chip set 221c, so that the light distribution in the second chip area can be more uniform, and the dark area can be reduced. In an embodiment, the spacing between adjacent LED chips of the second LED chip set 221b is larger than the spacing between adjacent LED chips of the first LED chip set 221a and the third LED chip set 221b, and the spacing between adjacent LED chips of the second LED chip set is larger, so as to reduce the mutual influence between the heat generated by the adjacent LED chips in the second chip area, and preferably, two LED chips in the first LED chip set 221a and the third LED chip set 221c are adjacent to one LED chip in the second LED chip set 221 b. A center point O is provided between two adjacent LED chips in the first LED chip set 221a ₁ ,O ₂ ,……，O _n (n is greater than or equal to 1), the center point Q is arranged between two adjacent LED chips in the third LED chip set 221c ₁ ，Q ₂ ，……，Q _m (m is more than or equal to 1), n and m are integers, O ₁ And Q is equal to ₁ The distance between them is smaller than O ₁ And Q is equal to _m Distance between (m > 1), center point O _2n-1 And a center point Q _3m-2 (n=m, n, m.gtoreq.1, n, m are integers) through at least one LED chip 2201 of the second LED chip set 221 b. While improving the luminous flux of the LED lamp, it can avoid the dark areas of the first chip area 2211 and the second chip area 2212, and reduce the mutual influence of the heat generated by the adjacent LED chips in the first LED chip set 221a, the second LED chip set 221b, and the third LED chip set 221 c.

Referring to fig. 19A to 19N, in an embodiment, the number of LED chips of the first LED chip set 221a and the second LED chip set 221b is smaller than the number of LED chips of the third LED chip set 221c, preferably, the number of LED chips of the first LED chip set 221a is equal to the number of LED chips of the second LED chip set 221b, and the number of LED chips of the second LED chip set 221b is smaller than the number of LED chips of the third LED chip set 221c, so that the light distribution of the second chip area can be more uniformAnd (3) uniformly reducing the area of a dark area. In an embodiment, the distance between the adjacent LED chips of the second LED chip set 221b is larger than the distance between the adjacent LED chips of the first LED chip set 221a, and the distance between the adjacent LED chips of the second LED chip set is larger, so as to reduce the mutual influence between the heat generated by the adjacent LED chips in the second chip area, and preferably, two LED chips in the first LED chip set 221a and the third LED chip set 221c are adjacent to one LED chip in the second LED chip set 221 b. A center point O is provided between two adjacent LED chips in the first LED chip set 221a ₁ ,O ₂ … …, on (n.gtoreq.1), the third LED chip set 221c has a center point Q between two adjacent LED chips ₁ ，Q ₂ … … Qm (m.gtoreq.1), n, m are integers, O ₁ And Q is equal to ₁ The distance between them is smaller than O ₁ Distance from Qm (m > 1), center point O _n And a center point Q _2m-1 (n=m, n, m.gtoreq.1, n, m are integers) through at least one LED chip 2201 of the second LED chip set 221 b. While improving the luminous flux of the LED lamp, it can avoid the dark areas of the first chip area 2211 and the second chip area 2212, and reduce the mutual influence of the heat generated by the adjacent LED chips in the first LED chip set 221a, the second LED chip set 221b, and the third LED chip set 221 c. In an embodiment, the optoelectronic module 2 further includes a connector terminal 24, the connector terminal 24 is electrically connected to an external power source (e.g. a mains supply) for receiving an external power signal and transmitting the power signal to the LED lamp, the connector terminal 24 is connected to an electronic component on the circuit board 201 through a wire 241, a connection point between the wire 241 and the circuit board 201 is located on the first surface 2011 of the circuit board 201, and a connection point between the wire 241 and the circuit board 201 is located between the first chip area 2211 and the second chip area 2212, so that a transmission distance of the power signal is short, power loss is small, and power is stable. In one embodiment, at least one line among the lines between an LED chip of the first chip area 2211 and an LED chip 2201 of the second chip area 2212 passes through the electrical connection point (if there is an electrical connection point greater than 1, at least one of the electrical connection points) between the conductive wire 241 and the circuit board 201, and the electrical connection point is located on the line between an LED chip of the first chip area and an LED chip of the second chip area, and the first chip area and the second chip area emit The light of the lamp shade can prevent dark spots or dark areas in the area corresponding to the electric connection points.

The LED light fixture may further include a secondary light source 2203 and a primary light source, the number of primary light sources being greater than the number of secondary light sources. When the main light source does not emit light, the secondary light source can emit light to provide illumination. For example, at night while sleeping, the primary light source is turned off and the secondary light source may be lit for a period of time or the user may select the secondary light source to provide a sense of security for the illumination. The secondary light source may comprise a night light bead and/or an afterglow bead. In one embodiment, the secondary light source 2203 is located outside the second edge S2 of the first chip area 2211 or inside the fourth edge S4 of the second chip area 2212, or the secondary light source 2230 is located between the first chip area 2211 and the second chip area 2212, and in some embodiments, the electrical connection point of the wire 241 and the circuit board 201 and the connection line of the secondary light source 2203 pass through at least one LED chip 2201 of the first chip area 2211. In an embodiment, the shortest distance between the secondary light source 2203 and the first chip area 2211 is smaller than the distance between the secondary light source 2203 and the second chip area 2212, so as to improve the light-emitting effect of the secondary light source 2203 emitted from the lampshade. In one embodiment, first chip area 2211 and/or second chip area 2212 includes at least two different LED chips (LED chip a ₁ LED chip a ₂ LED chip a ₃ … … LED chip a _n N represents the number of kinds of LED chips), different LED chips (LED chip a ₁ LED chip a ₂ LED chip a ₃ … … LED chip a _n N represents the number of kinds of the LED chips, and n is an integer), for example, different specifications, different color temperatures, different luminous fluxes, and the like, and may also be different parameter indexes of the LED chips. In one embodiment, first chip region 2211 includes LED chip a ₁ LED chip a ₂ And LED chip a ₃ The second chip region 2212 includes an LED chip a ₁ LED chip a ₂ Wherein the LED chip a on the circuit board ₁ The total number of (a) is greater than that of the LED chips a ₂ Is, for example, LED chip a ₁ LED chip a is a high color temperature LED chip ₂ For the low-color-temperature LED chip, the high-color-temperature chip and the low-color-temperature chip are distributed to fully mix the two color temperatures, and the total can be realized by adjusting the driving current ratio of the two color-temperature chipsAnd (5) color temperature adjustment. In one embodiment, the LED chip a in the first chip region 2211 ₁ Is smaller than the number of LED chips a in the second chip region 2212 ₁ And/or LED chip a ₂ Is the number of (3); in one embodiment, the LED chip a in the first chip region 2211 and/or the second chip region 2212 ₁ The number of LED chips a on the circuit board 201 is smaller than that of LED chips a on the circuit board 201 ₂ Is a number of (3). In one embodiment, LED chip a ₁ And/or LED chip a ₂ Is greater than the number of LED chips a ₃ The number of LED chips a in the embodiment ₁ And LED chip a ₂ Can be the main light source mentioned above, the LED chip a ₃ May be the secondary light source mentioned above.

In some embodiments, the LED luminaire comprises at least one set of LED chipsets (LED chipset b ₁ LED chip set b ₂ LED chip set b ₃ … … LED chip set b _m M is an integer), each LED chip group includes at least one LED chip, each LED chip group is located on the circuit board 201, in this embodiment, each LED chip group is located on the first surface of the circuit board 201, the LED chips of the same LED chip group are located on or substantially on the same circumference (disposed around the opening of the circuit board 201), and the LED chips of each LED chip group are located on different circumferences and disposed around the same or substantially the same central axis, which may be the central axis of the circuit board 201, or the central axis of the hanger or adapter. A portion of the power supply modules (e.g., the first power supply module) are located between adjacent LED chip sets in the radial direction of the circuit board 201. At least one of the LED chip sets comprises a main light source and a secondary light source, and the luminous flux of the secondary light source when the secondary light source is lighted can be configured to be 0.1% -10% of the luminous flux of the main light source when the secondary light source is lighted. When the main light source does not emit light, the secondary light source can emit light to provide illumination. For example, at night while sleeping, the primary light source is turned off and the secondary light source may be lit for a period of time or the user may select the secondary light source to provide a sense of security for the illumination. The secondary light source may comprise a night light bead and/or an afterglow bead. The number of the main light sources is greater than the number of the secondary light sources, and the distance between the adjacent main light sources is greater than or equal to the distance between the adjacent main light sources and the secondary light sources. In one embodiment, the central angle of the adjacent primary light source is greater than or equal to the central angle of the adjacent primary light source and the secondary light source. At the position of In some embodiments, the same chip set includes n LED chips, the central angle between adjacent LED chips or the average central angle a between adjacent LED chips is (360/n) degrees, the electrical connection point of the wire 241 and the circuit board 201 forms a line La with the line of the center o, the secondary light source forms a line Lb with the line of the center o, the included angle between the line La and the line Lb is 0.3×a-5*a, and in some embodiments, the included angle between the line La and the line Lb is [ 360/(n+3)]Degree to [ 360/(n-5)]The secondary light source has a short wiring distance from the secondary light source to the connector terminal, and the heat generated by the LED chip adjacent to the secondary light source has less influence on the secondary light source. In one embodiment, the LED lamp comprises an LED chip group b from small to large according to the radius ₁ LED chip set b ₂ LED chip set b ₃ LED chip set b ₄ I.e. LED chip set b ₁ Compared with the LED chip group b ₂ LED chip set b ₃ LED chip set b ₄ Near the opening 222 of the circuit board 201, in this embodiment, the LED chip set b ₁ The secondary light source is included, the wiring distance from the secondary light source to the connector terminal 24 is short, and the resistance of the lead is small, so that the power loss is low in operation, and the signal transmission is stable. In its embodiment, LED chipset b ₄ The secondary light source is far away from the hanger or the adapter, and light generated when the secondary light source is lighted is not easy to be absorbed by the hanger or the adapter, so that the light loss is low.

Referring to fig. 18A to 18H, the light processing unit 202b includes a first light processing area 2a, a second light processing area 2b and a third light processing area 2f, the first light processing area 2a corresponds to the first chip area 2211, the second light processing area 2b corresponds to a part of the power supply module, in this embodiment, the second light processing area 2b corresponds to the first power supply module 231, the third light processing area 2f corresponds to the second chip area 2212, the light processing unit 202b may be the aforementioned light absorbing area or lens unit, in this embodiment, the second chip area 2212 includes three groups of LED chips 221a, 221b and 221c, a sub-light processing area is designed corresponding to each group of LED chips 221a, 221b and 221c, the first insulating portion 202 is respectively provided with the light processing areas 2a and 2b corresponding to the first chip area 2211, the first power supply module 231, the third light processing area 2f includes sub-light processing areas 2c, 2d and 2e, the sub-light processing areas 2c and 2d and 2e respectively correspond to the second groups of LED chips 221a and 221b and 221c, the sub-light treatment regions 2a, 2c, 2d and 2e include lenses 202a disposed opposite to the LED chip 2201, the light treatment region 2b includes at least one left inclined portion 2b1 and at least one right inclined portion 2b2, the left inclined portion 2b1 is connected to the right inclined portion 2b2, the left inclined portion 2b1 and the right inclined portion 2b2 may form a V shape or an inverted V shape after being connected, and when external light passes through the light treatment region 2b, part of the light is reflected by the left inclined portion 2b1 and the right inclined portion 2b2, thereby reducing the visibility of the first power module 231 and improving the aesthetic appearance of the LED lamp, and on the other hand, part of the light emitted from the LED chip adjacent to the first power module 231 group is refracted by the lenses 202a and then passes out of the first insulating portion 202 through the left inclined portion 2b1 and the right inclined portion 2b2, thereby further reducing a dark region between the first chip region 2211 and the second chip region 2212. The light treatment area 2b is provided with at least one extension part 2b3, the extension part 2b3 is contacted with at least one left inclined part 2b1 and at least one right inclined part 2b2, the circuit board 201 is provided with a through hole 201a opposite to the extension part 2b3, and the extension part 2b3 passes through the through hole 201a on the circuit board 201, so that the relative position of the circuit board 201 and the first insulating part 202 is fixed, and the circuit board 201 is prevented from rotating circumferentially.

The lamp in the embodiment of the invention realizes a housekeeping function besides a common lighting function, and particularly mainly comprises three aspects. The function of the first aspect is mainly for the case where a resident goes out for a period of time, usually more than 1 day, to thereby experience a lighting period with a lamp, during which the lamp simulates a resident's usual lighting state to cause an impression of the resident's home to the outside. This feature helps to deter the thief from being conscious of someone in the home. The function of the second aspect is to provide information to the outside, such as a resident or a specified other person, when entering a suspicious person in the home during a period when the resident is not at home. The function of the third aspect is to realize a view to the resident, judge whether or not there is an emergency in the physical aspect by the resident's human body state and provide information to the specified other person in this regard. The setting of the functions can be realized by using a remote controller of the lamp, man-machine interaction can be realized by arranging keys, a display screen, a touch screen and the like on the lamp body, and the intelligent equipment such as an intelligent mobile phone, a tablet personal computer and the like can be used for operation. The following describes the technical scheme of the embodiment of the present invention in detail.

Fig. 20 is a schematic view of the main components of a luminaire according to an embodiment of the present invention. As shown in fig. 20, the LED luminaire includes, in addition to a conventional light emitting element 1111 and a first power supply module 1112 for supplying power thereto, a processing module 1113, a light sensor 1114, an infrared sensor 1115, a communication module 1116, and a second power supply module 1117 for supplying power to the four parts.

The light emitting element 1111 may be, for example, an LED array, a light source module 22 of the present application, or an incandescent bulb, a fluorescent tube, or the like. Accordingly, the first power supply module 1112 may include a corresponding circuit for converting 220V mains supply into a form suitable for a light emitting element, for example, for an LED array, the first power supply module 1112 includes a corresponding rectifying circuit, and if it is an incandescent lamp, the first power supply module 1112 mainly includes a wire, a wiring device, and the like for electrical communication.

The processing module 1113 generally comprises a processor, as well as other ancillary circuitry and elements, that enable the logical processing of information, primarily from the light sensor 1114 and infrared sensor 1115, as well as the communication module 1116. The light sensor 1114 is mainly used for sensing the ambient illumination intensity, so that the processor can determine whether to turn on the light. The infrared sensor 1115 senses the human body state of the resident by acquiring an infrared sensing image of the environment. The communication module 1116 may be used for two-way communication with the outside world through a wireless or wired lan and/or a wireless communication network such as a 3G/4G/5G network, and may also be used for communication with the remote control described above.

The second power supply module 1117 may include a conversion circuit such as rectification and filtering, and a battery, and the conversion circuit uses the mains supply to supply power to the processing module 1113, the light sensor 1114, the infrared sensor 1115, and the communication module 1116 when the mains supply is normal, and uses the battery to supply power when the mains supply is abnormal or cannot supply power, and if the light emitting element 1111 is an LED array, the battery may also be used to supply power.

In the following, the technical means for realizing the functions of the first aspect in the embodiments of the present invention will be described. The light fixture may be set to a "housekeeping mode" when the resident is out, in which the operation of the light fixture simulates the resident's home state under the control of the processing module 1113. If the ambient light intensity is sufficiently dark, e.g. the first light intensity is preset to 100lx, and the current time does not reach the preset rest time, the illumination is turned on. When the rest time is reached, the illumination is turned off, or the illumination is turned off again when the illumination is operated for a period of time with a lower illumination brightness level.

The illumination is then not turned on for a relatively long preset period of time, e.g. 6 to 8 hours, which is a rest period; or the lighting is turned on briefly once to several times in a preset manner in the middle of the rest period so as to simulate the night-up state of the user. The time can be random time or preset time, and the time is preset time or random time less than a preset value.

For different seasons, illumination may or may not be needed after getting up in the morning, for which purpose the processing module 1113 may determine whether or not to turn on based on ambient light intensity after the rest period has ended, or to turn on based on the current date. If the lamp is turned on, the lamp is turned off when the ambient light is sufficiently strong, e.g. greater than the second preset value of light intensity. The second light intensity preset value here should be greater than the first light intensity preset value described above.

The housekeeping mode described above is exited when any operation is performed on the light fixture after the resident returns.

In the following, the function of the second aspect is described in the embodiment of the present invention. This function is designed for the case of illegal entry into the room, and the movement of a person is detected during the rest period described above, but the lamp is not operated, and it is considered that the person is illegally intruded. The user can turn on the function before going out to realize the monitoring function, i.e. enter the monitoring mode.

In the monitor mode, the processing module 1113 listens for infrared signals provided by the infrared sensor 1115, which are typically infrared sensor images, and the infrared sensor 1115 can provide these images to the processing module at a sampling frequency. If a heat source region is present in the image, it is deemed an illegal person, and the processing module 1113 controls the communication module 1116 to send information outwards. In particular, it may be a contact provided to a resident or a designated other person, such as a resident, or a community property, a dispatch office, etc. Therefore, in the case of turning on the housekeeping mode, it is preferable to also turn on the monitor mode.

When the resident returns home, the resident can exit the monitoring mode, and the resident can exit the monitoring mode by performing any operation on the lamp at the moment, and can exit the monitoring mode by using part or all of the lamps under the condition that a plurality of lamps are in the monitoring mode. Because the resident itself as a heat source causes the light fixture to also send information outwardly when the resident just returned to the room and has not yet arrived at the monitor mode, a time delay of, for example, 30S may be provided before deciding to send information outwardly so that the resident exits the monitor mode of the lamp of the room. That is, the resident can set a room where himself or herself is not present as the monitoring mode.

In the case of pets (mainly, warm-blooded animals such as cats, dogs, rabbits, birds, etc.), the infrared sensor image may still contain a heat source region when the resident is not at home. In this case, the processing module 1113 should perform some filtering operation on the image, for this purpose, the height and/or width of the shape of the heat source in the image, that is, the size condition, may be set according to the body shape of the pet in the home, and if the heat source in the image meets the size condition at the same time, the heat source area in the image is ignored, and then the image is determined. For example, if the height and width are set to smaller values at the same time, the interference caused by cats, small dogs, rabbits and birds can be eliminated. For another example, for a large dog size, the width may be set to be significantly greater than the height.

In the following, the function of the third aspect is implemented in the embodiment of the present invention. The function can be realized by using an infrared sensor, and the state of people in the house is judged mainly according to the infrared sensing image provided by the infrared sensor 1115. If the person is stationary for a long time, it is stated that there may be an abnormality, at which time information should be sent to the outside, for example, to relatives of the person in the house, etc. This function may be referred to as a guardian mode.

The monitoring area is an area in the house covered by the infrared sensor 1115, and the range of the area can be set in consideration of the difference of residence time of personnel in the subareas such as the ground area, the sofa area, the area before a desk, the bed area and the like, and the time length preset values are respectively set for each subarea and are stored as monitoring setting information. When judging the image, examining the time for keeping static when the heat source area in the image is overlapped with the subarea, and sending information when the time exceeds the preset value. The overlap may be set to a threshold value, for example, if the overlap area is a set percentage of the heat source area, then the overlap is considered.

Some inspection setting information may be saved to enable inspection of whether an indoor person is sleeping, getting up, etc. on time. Specifically, the sleeping time and/or the getting-up time can be set as the checking time and the preset time delay, if the heat source area in the image is not overlapped with the bed area within the preset time delay after the sleeping time, the condition that the personnel in the room go to bed for sleeping on time is indicated, and information can be sent to the outside. If the heat source area in the image still coincides with the bed area within the preset time delay after the time of getting up, it is indicated that the indoor personnel do not get up on time, and information can be sent to the outside at this time.

The present function also enables a reminder if the person falls down and cannot get up in the house for various reasons. Some settings, here called fall settings, may be made in particular, mainly including settings of fall area, fall duration, fall target. The fall area is typically set to a floor area, i.e. to avoid a position where a sofa, a bed, etc. can lie. The falling object is set according to the posture difference between the standing time and the falling time of the person, and the falling object is generally set on the heat source area by changing the height and the width of the heat source area. The height, width, or both of the shape of the heat source region may be set, for example, to half the width. This arrangement is to take into account that if the height of the heat source area is less than half the width, the person is considered to have fallen. The viewing angles of the lamps at different positions are different, so the relation of the height and the width is considered as well. The effect of the pet may also be eliminated by sizing the heat source area in the manner previously described.

According to the above arrangement, the heat source area in the image is judged, and if it is located in the ground area, the shape conforms to the falling target, i.e., the shape size is within the falling target size range, for example, the height is smaller than half the width, and the time for receiving such an image reaches the above-mentioned duration preset value, it is considered that the indoor person cannot fall, and information should be sent to the outside at this time.

The functionality of the third aspect may also be implemented based on a visual sensing function, i.e. using a camera instead of the infrared sensor 1115 (or both), the environmental image acquired by the camera is submitted to a processing module 1113 for analysis, which may apply techniques such as pattern recognition to determine the status of a specific object within the environment. The mode can not only accurately identify the states of the personnel in the house, such as the gesture, but also realize the gesture identification of the personnel. In specific application, the camera collects the environmental image and then sends the environmental image to the processing module 1113 for recognition, and if the environmental image is recognized to contain the human body image, the human body gesture is judged. The judgment here is for some preset conditions, for example, judging whether the human body falls down or not, and the like, and can be analyzed by adopting a mode recognition mode. And if the human body posture meets the preset conditions, sending information to the outside.

In the mode of adopting the camera to collect images, the gesture recognition can be carried out on the human body images, and at the moment, specific information corresponding to the gesture can be sent outwards according to the specific gesture of the person.

The lamp in the embodiment of the invention can be a ceiling lamp, a desk lamp, a floor lamp, a wall lamp and the like. For houses with multiple rooms, multiple lamps are connected to the same local area network, and consistent setting or independent setting can be adopted. If there are a plurality of lamps in the same room, one of the lamps may be designated as a main lamp, and information may be transmitted to the outside from the main lamp. The plurality of lamps may be connected or separately operated in the setting mode. For example, if a certain luminaire enters or exits from the housekeeping mode, all other luminaires may enter or exit from the housekeeping mode. One lamp enters or exits the monitoring mode or the monitoring mode, and other lamps can enter or exit simultaneously without being influenced or linked. The lamps can be grouped, the lamps in the same group are linked, and the lamps in different groups are not linked.

According to the technical scheme of the embodiment of the invention, the light sensor, the infrared sensor and the communication module are arranged in the lamp, and the functions of simulating someone in a house, finding illegal personnel, monitoring the house and the like can be realized by adopting the adaptive program, so that the application mode of the lamp is expanded, and the safety of various aspects of the house is improved.

The various embodiment features of the present application described above may be combined in any number of ways without mutual exclusion and are not limited to a particular one of the embodiments. Such as that described in the embodiment of fig. 3, although not illustrated in the embodiment of fig. 13 may include the features described in the embodiment of fig. 3, it should be apparent that one of ordinary skill in the art may not inventively apply these features to fig. 13 in light of the description of fig. 3; for another example, while various creation schemes are described in the present application using LED ceiling lights as an example, it should be apparent that these designs may be applied without inventive aspects to other shapes or types of lights, and are not specifically recited herein.

The implementation of the embodiments of the lampshade, the optoelectronic module, the base and the LED lamp applied to the embodiments of the lampshade, the optoelectronic module and the base in the application has been described above, and it is to be noted that the features such as the "lampshade", "circuit board", "insulation unit", "arrangement mode of LED chip", "base" and the like in the embodiments described above may include one, two, multiple or all technical features without mutual conflict. The corresponding content may be selected from one or a combination of features included in the corresponding embodiments.

The present application has been disclosed in terms of preferred embodiments, however, it will be understood by those skilled in the art that the embodiments are merely illustrative of the present application and should not be construed as limiting the scope of the present application. It should be noted that all changes and substitutions equivalent to the embodiment are intended to be included in the scope of the present application. The scope of the application is therefore intended to be defined only by the following claims.

Claims

1. The LED lamp is characterized by comprising a photoelectric module, wherein the photoelectric module comprises a circuit board, a light source module and a power supply module, the power supply module comprises a first power supply module and a second power supply module, the first power supply module and the second power supply module are respectively located on a first face and a second face of the circuit board, and an electronic element of the light source module is arranged on the first face.

2. The LED light fixture of claim 1 wherein the circuit board is provided with an opening, the opening communicating the first and second faces.

3. The LED light fixture of claim 2 further comprising connector terminals connected to the electronic components on the second side by wires.

4. A LED light fixture as recited in claim 3, wherein the opening-to-wire distance is less than the length of the wire in a radial direction of the circuit board.

5. The LED light fixture of claim 3 further comprising a first insulating portion, a portion of the connector terminals being exposed outside the first insulating portion.

6. The LED lamp of claim 5, wherein the first insulating portion is provided with a securing catch, and the connector terminal is secured to the securing catch through the opening.