CN219606986U - LED lamp - Google Patents

Abstract

The utility model relates to a lighting fixture, and discloses an LED lamp, which comprises a light source module, a first power supply module for supplying power to the light source module, a processing module, a light sensor, a communication module and a second power supply module, wherein: the processing module comprises a processor for realizing logic processing of information; the light sensor is used for sensing the ambient illumination intensity and sending the ambient illumination intensity information to the processing module; the communication module is used for communicating with the outside; the second power supply module is used for supplying power to the processing module, the optical sensor and the communication module. The utility model has the characteristic of high safety.

Description

A kind of LED lamp

The utility model application is a divisional application submitted to the China Patent Office on August 4, 2021, with the application number 202121801614.1, and the new name being "a LED lamp".

technical field

The present application relates to a lighting appliance, in particular to an LED lamp.

Background technique

Ceiling lamps are lighting fixtures that are absorbed or embedded in the roof ceiling. Ceiling lamps are often used as lighting equipment in various places such as homes, offices, and entertainment venues. A traditional ceiling lamp usually consists of a base, a light source module, a circuit module and a lampshade, and the light-emitting elements in the light source module are generally energy-saving lamps. Since energy-saving lamps are polluted by mercury in the production process and after use and discarded, and their power consumption is greater than that of LEDs, and LEDs have the characteristics of no mercury, no toxicity, no electromagnetic pollution, no harmful rays, energy saving, environmental protection, and long service life. Therefore, the light-emitting elements of ceiling lamps gradually replaced energy-saving lamps with LEDs. However, the existing ceiling lamps still have problems in light emission, heat dissipation, installation and packaging during use, as follows:

1. Flickering occurs during lighting, small irradiation range, uneven light emission, small brightness in the central part of the lamp, uneven brightness between the central part of the lamp and the peripheral part of the lamp, uneven light emission on the light emitting surface, glare, uneven brightness around the lamp, and luminescence Uneven illumination on the component mounting surface, uneven brightness and low color rendering, low luminous efficiency and light design, bright spots, low rendering effect, uneven color mixing, uneven illumination around the ceiling, and high height circuit components Will block light, large color temperature and color deviation, narrow light orientation, low light transmission efficiency, low luminous efficiency of light source, dark side area of lampshade, uneven brightness of light exit surface of lampshade, bright lines, light-emitting elements Low light extraction efficiency, low light comfort, low aesthetics when extinction, etc. In addition, the existing lamps will also have the following problems: some use scenarios will hope that the light emitted by the lamps has a three-dimensional effect or corresponding to the corresponding life scene. It is difficult for users to read under the lamps and lanterns of the light space, or the color of the text and the object of observation is reduced by the elderly, and the elderly have a low sense of comfort when using light.

In order to improve the optical effect of the ceiling lamp, one of them is to add a backlight lens to the LED to reduce the dark area in the middle and edge of the lamp. However, due to the use of the backlight lens and lens patch technology, the production cost is greatly increased and the product competition is reduced. Second, optical components, such as light guide plate, lens, reflection unit, etc., are arranged between the light-emitting element and the lampshade. , Uneven brightness on the light guide plate, dark parts on the light guide plate, etc.;

2. Light-emitting components and circuit components will generate heat, which will affect the service life of the ceiling lamp;

3. Most of the light source modules are installed in the lamp body by screws, or pasted in the lamp body by adhesive, and it is not easy to disassemble and replace after installation. In addition, after long-term use of the ceiling lamp, the aging and burning of the light source module often occur. Installation and replacement of LED light source modules must be performed by professionals, which is inconvenient to use;

4. Ceiling lamps usually have a flat structure, which has the characteristics of small occupied height and wide lighting range. However, the overall thickness of the ceiling lamp is still large, which increases the volume of the product, which in turn increases the cost of packaging and inventory.

In addition, the lamps have low safety, low manufacturing efficiency, high cost of use, insects, etc. are easy to enter the interior of the lamp and affect the appearance, and cannot continue to illuminate when the power supply fails. There are problems such as low remote sensitivity or narrow remote control range during intelligent control, and noise during installation.

In view of the shortcomings and deficiencies of the prior art described above, it is indeed necessary to improve the existing LED lamps to make up for these shortcomings and deficiencies.

Contents of the invention

The present application provides an LED lamp aiming at the above-mentioned shortcomings in the prior art.

In order to solve the above technical problems, the application is solved through the following technical solutions:

An LED lamp, the lamp includes a light source module and a first power supply module that supplies power to the light source module, the lamp also includes a processing module, a light sensor, a communication module and a second power supply module, wherein:

The processing module contains a processor to realize the logical processing of information;

The light sensor is used for sensing the ambient light intensity and sending the ambient light intensity information to the processing module;

The communication module is used to communicate with the outside;

The second power supply module is used to supply power to the processing module, the light sensor and the communication module.

Preferably, the LED lamp further includes an infrared sensor, which is used to acquire an infrared sensing image of the environment and then send it to the processing module;

The second power supply module is also used to supply power to the processing module.

Preferably, the LED lamp further includes an image acquisition device for acquiring environmental images;

The processing module is also used to identify whether the environment image contains a human body image; and if the environment image contains a human body image, judge whether the human body posture in the human body image meets the preset condition;

The communication module is also used to send information to the outside when the posture of the human body in the human body image meets a preset condition.

Preferably, the processing module is further configured to perform gesture recognition on the human body image when the environment image contains the human body image;

The communication module is also used to send information to the outside according to the recognition result.

Through the above-mentioned structural design, the present application has achieved one of the following beneficial effects or any combination thereof:

(1) The light sensor, infrared sensor and communication module are installed in the lamp, and the adaptive program can realize functions such as simulating people in the home, finding illegal persons, and monitoring family members, expanding the application mode of the lamp and improving the safety of all aspects of the home; (2) The assembly of the photoelectric module is simple and convenient, and the user can assemble it by himself; (3) The length of the wire used for the connector terminal and the circuit board is short, which can save wire; after the assembly is completed, the connector terminal and the circuit board are at a certain angle , so that the exposed height of the connector terminal on the first surface is minimized, and the light emitted by the light source module is not blocked.

Description of drawings

Fig. 1 is a schematic structural view of an embodiment of the LED lamp of the present application;

Fig. 2 is a schematic diagram of an embodiment in which the lampshade is removed in Fig. 1;

Fig. 3 is a three-dimensional schematic diagram 1 of the photoelectric module of the LED lamp in an embodiment with the insulation unit removed;

Fig. 4 is a three-dimensional schematic diagram 2 of the photoelectric module of the LED lamp in an embodiment without the insulating unit;

Fig. 5 is a three-dimensional schematic diagram 1 of the photoelectric module of the LED lamp in another embodiment without the insulating unit;

Fig. 6 is a second perspective view of the photoelectric module of the LED lamp without the insulation unit in another embodiment;

Fig. 7 is a three-dimensional schematic diagram of a photoelectric module of an LED lamp in an embodiment;

Fig. 8 is a perspective view II of the photoelectric module of the LED lamp in an embodiment;

Fig. 9 is a schematic diagram of an embodiment of an assembly method of the photoelectric module of the present application;

Fig. 10 is a schematic structural view of the photoelectric module assembled by the assembly method shown in Fig. 9;

Fig. 11 is a schematic structural view of the A-A section in Fig. 10;

Fig. 12 is a schematic perspective view of a base in an embodiment;

Fig. 13 is a three-dimensional schematic diagram of an LED lamp in an embodiment;

Fig. 14 is a three-dimensional schematic diagram of an LED lamp in an embodiment;

Fig. 15A is a schematic perspective view of the photoelectric module in Fig. 14;

Figure 15B is an enlarged schematic view of part A in Figure 15A;

15C is a schematic diagram of the first insulating portion in 15A;

Fig. 16 is a schematic perspective view of the circuit board in Fig. 15;

Fig. 17A is a schematic cross-sectional view of the LED lamp shown in Fig. 14 with the lampshade removed;

Figure 17B is a schematic diagram of the A-A section in Figure 17A;

Figure 17C is an enlarged schematic view of part B in Figure 17B;

FIG. 18A is a first structural schematic diagram of the photoelectric module in an embodiment;

Fig. 18B is a second structural schematic diagram of the photoelectric module in an embodiment;

Figure 18C is a schematic diagram of the A-A section in Figure 18A;

Figure 18D is an enlarged schematic view of part B in Figure 18C;

Figure 18E is an enlarged schematic view of part C in Figure 18C

Fig. 18F is a schematic structural diagram of the first insulating part in Fig. 18A;

Figure 18G is a schematic diagram of the B-B section in Figure 18F;

Figure 18H is an enlarged schematic view of part D in Figure 18G;

Fig. 19A is a schematic diagram of the first structure of the photoelectric module in an embodiment;

Fig. 19B is a second structural schematic diagram of the photoelectric module in an embodiment;

Figure 19C is a schematic diagram of the E-E section in Figure 19B;

Figure 19D is an enlarged view of part F in Figure 19C;

FIG. 19E is a schematic diagram of the third structure of the photoelectric module in an embodiment;

Figure 19F is an enlarged view of part B in Figure 19E;

Figure 19G is an enlarged view of the section G-G in Figure 19E;

Figure 19H is an enlarged view of part H in Figure 19G;

Fig. 19I is a schematic view 4 of the structure of the photoelectric module in an embodiment;

Figure 19J is an enlarged view of the I-I section in Figure 19I;

Figure 19K is an enlarged view of part J in Figure 19J;

Figure 19L is a schematic diagram of the circuit board in Figure 19A;

Fig. 19M is a schematic diagram of the first insulating part in Fig. 19A;

Figure 19N is an enlarged view of part K in Figure 19M;

Fig. 20 is a schematic diagram of the main components of a lamp according to an embodiment of the present invention.

Detailed ways

The application will be further described in detail below in conjunction with the accompanying drawings and embodiments.

In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Preferred embodiments of the application are shown in the accompanying drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described below. On the contrary, the purpose of providing these embodiments is to make the disclosure of the application more thorough and comprehensive. The directions such as "axial direction", "above", and "below" in the following text are all for clearly indicating the structural positional relationship, and are not intended to limit the present application. In this application, the definitions of "equal", "vertical", "horizontal" and "parallel" are: including the situation of ±10% based on the standard definition. For example, vertical usually means that the included angle with respect to the reference line is 90 degrees, but in this application, vertical refers to the situation including 80 degrees to 100 degrees. In addition, the usage conditions and usage states of LED lamps mentioned in this application refer to the usage situation of LED lamps hanging vertically with the lampshade downward, and other exceptions will be explained separately.

As shown in FIGS. 1 to 20 , the LED lamps in the embodiments of the present application are, for example, ceiling lamps installed on the ceiling. 1 to 20 (such as the positive direction of the z-axis in FIG. 1 ) corresponds to the direction of the floor surface opposite to the ceiling. In other words, the LED lamps shown in FIGS. 1 to 20 are suitable for the opposite postures in normal use.

For the LED lamp designed in this application, the spatial position of the LED lamp is located in the Cartesian coordinate system shown in FIG. 1 , wherein the z-axis is parallel to the central axis of the LED lamp. As shown in FIG. 1 to FIG. 20 , the LED lamp includes a lampshade 1 and a base 3 connected to the lampshade 1 , and a photoelectric module 2 is disposed in the first accommodation space formed by the lampshade 1 and the base 3 . In this embodiment, the LED lamp also includes a mounting part 31 arranged on the base 3, a hanger 4 and a transfer hanger (or adapter) 5, the photoelectric module 2 is fixed on the base 3 through the mounting part 31, and the lead Hanger 4 is connected with adapter 5 . Between the LED lamp and the ceiling, in order to suppress the shaking of the LED lamp, a buffer component 7 is provided, and the buffer component 7 can be a sponge, for example.

As shown in Figures 1 to 19, the photoelectric module 2 includes a light source module 22 and a power module 23. In order to prevent a power failure when the external power supply is cut off due to a power failure, the power module 23 may include a battery unit for storing electric energy. , the afterglow module is stored in the battery unit, and the afterglow lighting is automatically issued through the afterglow module to ensure safety.

As shown in Figures 1 to 19, the photoelectric module 2 is configured as an integral structure and is detachably fixed to the base 3. Therefore, when the photoelectric module 2 is damaged, it can be replaced separately. Replacement, more cost-effective. When replacing the photoelectric module 2 , it is necessary to prevent electric shock, especially when replacing the photoelectric module 2 , it is necessary to prevent hands from touching electronic components. The optoelectronic module 2 in this embodiment includes electronic components, and insulating units are arranged outside the electronic components, so as to prevent contact with the electronic components when replacing the optoelectronic module 2 . The photoelectric module 2 includes a circuit board 201 , which can be a single-sided PCB or double-sided PCB, and at least some electronic components are arranged on the circuit board 201 . Further, all electronic components are arranged on the circuit board 201 . Wherein, the electronic components include electronic components in the light source module 22 (such as LED lamp beads) and electronic components in the power module 23 . That is to say, the electronic components of the light source module 22 and the electronic components of the power module 23 are integrated on the same circuit board, which saves cost and space.

As shown in FIGS. 3 to 6 , the circuit board 201 includes a first surface 2011 and a second surface 2012 oppositely disposed, wherein the first surface 2011 is a surface facing the lampshade 1 . In one embodiment, the electronic components of the light source module 22 are arranged on the first surface 2011, and all the electronic components of the power supply module 23 can be arranged on the first surface 2011, so that the circuit board 201 only needs to be placed on the first surface 2011. 2011 Arrange the wiring layer, which can save wiring costs. In some embodiments, referring to FIG. 3 and FIG. 4 , the electronic components of the light source module 22 are arranged on the first surface 2011, and all the electronic components of the power supply module 23 are arranged on the second surface 2012, so that the light source can be The electronic components in the module 22 and the electronic components in the power supply module 23 are arranged separately. When the lamp is turned on, generally speaking, the electronic components of the light source module 22 and the electronic components of the power supply module 23 may generate heat, so the two are arranged separately to avoid the concentration of heat sources or the mutual influence of the heat generated during work. , at this time, the circuit layer can be arranged on the first surface 2011 and the second surface 2012 at the same time. In this embodiment, the electronic components in the light source module 22 are arranged on the first surface 2011, some of the electronic components in the power module 23 are arranged on the first surface 2011, and the other part of the electronic components in the power module 23 are arranged on the first surface 2011. On the second side 2012. In this embodiment, the electronic components of the power module 23 are arranged on the first surface 2011 and the second surface 2012 respectively, so that the electronic components in the power module 23 can be better arranged. For example, the electronic components of the power supply module 23 located on the first surface 2011 include relatively low components such as IC (control circuit) and chip components (such as chip resistors). Therefore, the light emitted by the light source module 22 has no The blocking of obstacles reduces light loss and improves luminous efficiency. The electronic components of the power module 23 located on the second surface 2012 include relatively tall components, such as transformers, capacitors, inductors, and the like. Another example is that the electronic components of the power module 23 located on the first surface 2011 include heating elements (components that generate more heat during operation, such as ICs, resistors, etc.), while the electronic components of the power module 23 located on the second surface 2012 include Non-heat-resistant components (such as electrolytic capacitors), the non-heat-resistant components and the above-mentioned heating elements are respectively arranged on the second surface 2012 and the first surface 2011, which can reduce the influence of the heat generated by the heating elements on the non-heat-resistant components , improve the overall reliability and service life of the power module 23 .

As shown in FIGS. 7 to 8 , the photoelectric module 2 further includes an insulating unit, and the insulating unit includes a first insulating part 202 and/or a second insulating part 203 , wherein the first insulating part 202 is configured to be used by the light source module 22 Light generated during operation passes through, and the first insulating portion 202 covers all electronic components on the first surface 2011 to prevent accidental contact with electronic components on the first surface 2011 and cause electric shock. The second insulating part 203 covers all the electronic components on the second surface 2012, and the material of the second insulating part 203 can be selected as PC or acrylic, and the two materials are light and low cost. In this embodiment, the electronic components on the second surface 2012 are located on the inner side of the circuit board 201 in the radial direction compared with any electronic components of the light source module 22, that is, the electronic components on the second surface 2012 and the light source The projections of the electronic components of the module 22 in the thickness direction of the circuit board 201 do not overlap. On the one hand, it can prevent the heat generated by the electronic components of the light source module 22 from affecting the electronic components on the second surface 2012; on the other hand, it can limit the distribution area of the electronic components on the second surface 2012, thereby controlling the 203 size to control cost.

As shown in Figures 9 to 11, the photoelectric module 2 of the present application also includes a connector terminal 24, and the electrical connection terminal 24 is electrically connected to an external power source (such as mains) for receiving an external power signal and sending the power signal to LED lighting transmission, the connector terminal 24 is connected to the electronic components on the second surface 2012 through the wire 241 , and the connection point between the wire 241 and the circuit board 201 is located on the second surface 2012 of the circuit board 201 . In this embodiment, all the electronic components of the power module are located on the second surface 2012 as an example, but it is not limited thereto. The circuit board 201 is provided with an opening 2018, the opening 2018 communicates with the first surface 2011 and the second surface 2012, the opening 2018 is close to the wire 241, the distance from the opening 2018 to the wire 241 in the radial direction of the circuit board is less than the length of the wire 241, preferably the opening The shortest distance from 2018 to the wire 241 in the radial direction of the circuit board is less than the length of the wire 241 to ensure a stable electrical connection. The first insulating part 202 is provided with a fixing buckle 2025. After the photoelectric module 2 is assembled, the fixing buckle 2025 is located in an area of 30 degrees to 60 degrees with the first surface 2011. Preferably, the fixing buckle 2025 is located at a distance from the first surface 2011. In the area of 30 degrees to 45 degrees, it is easy for the user to fix the connector terminal 24 through the opening 2018 to the fixing buckle 2025 when assembling by himself, and a part of the connector terminal 24 is exposed outside the first insulating part 202 for convenience Subsequent electrical connections. Fig. 9 shows an assembly method of an embodiment of the photoelectric module of the present application, referring to Fig. 9 to Fig. 11, which includes:

1) The connector terminal 24 is connected to the electronic components on the circuit board 201 through the wire 241, and the circuit board 201 is pressed into the first insulating part 202;

2) Press the connector terminal 24 into the fixing buckle 2025 of the first insulating part 202 through the opening 2018 on the circuit board 201, and a part of the connector terminal 24 is exposed outside the first insulating part 202;

3) Fix the second insulating part 203 on the circuit board 201 , the second insulating part 203 covers the wire 241 and all electronic components on the second surface 2012 .

At present, when the photoelectric module is assembled, the circuit board is fixed on the base first, then the connector terminal is fixed on the fixing buckle on the first insulating part, and finally the first insulating part is fixed. However, with this connector terminal fixing method, the position of the first insulating part needs to be adjusted when fixing the first insulating part. During the adjustment process, the electrical connection point between the connector terminal and the circuit board is prone to loosening, and the electrical connection is not stable; The above-mentioned electrical connection is not stable, and a longer wire is required, but the wire is too long, which increases the cost of the wire. Using the assembly method of this application to assemble the photoelectric module is simple and convenient, and the user can assemble it by himself, and the length of the wire used for the connector terminal and the circuit board is short, which can save wire materials; after the assembly is completed, the connector terminal and the circuit board are in the same shape At a certain angle, the exposed height of the first surface of the connector terminal is minimized, and the light emitted by the light source module is not blocked.

The lampshade 1 in this application can adopt different structures, referring to FIG. 1 to FIG. 16 , in one embodiment, the lampshade 1 has a smooth curved surface to prevent uneven light distribution caused by the difference in refractive index of the lampshade section. In one embodiment, the lampshade 1 includes a central part and a peripheral part surrounding the central part, the lampshade 1 has a light-diffusing layer, the light-diffusing layer contains light-diffusing particles, and the density of the light-diffusing particles in the central part is greater than the density of the light-diffusing particles in the peripheral part In order to make the brightness of the center and the periphery of the lamp uniform. In one embodiment, the lampshade 1 has a plurality of diffusion areas, and one of the diffusion areas overlaps with the photoelectric module 2 in the z-axis direction, which can improve the flash of the lamp. In one embodiment, the inner surface or the outer surface of the lampshade 1 may be provided with a brightness enhancing film to distribute the light energy of the light emitted by the light source module 2, so as to achieve uniform light output of the LED lamp and avoid glare. Here, the inner surface and the outer surface are relative positions, and the inner surface of the lampshade 1 is the surface close to the photoelectric module 2 . In one embodiment, the lampshade 1 is provided with through holes, and the mounting screws used for installing the lampshade 1 on the base 3 are inserted into the through holes of the lampshade 1 with looseness, and are screwed onto the base 3, so that even the lampshade And the base expands or contracts due to the temperature change caused by the opening and closing of the lamp, and the stress generated by the expansion or contraction can also be reduced through the play, which can prevent the lampshade and the appliance from cracking or generating noise.

The base in the LED lamp of the present application can adopt different structures. FIG. 12 is a schematic structural diagram of an embodiment of the base in the LED lamp of the present application. The base is located in a spatial rectangular coordinate system (x, y, z), where the z axis and The central axis of the LED lamp is parallel, and the base 3 is disc-shaped, such as made of aluminum plate or steel plate, as shown in Figure 12 and Figure 13, a hole 33 is formed in the central part of the base 3, and a supporting part is formed around the hole 33 34 and the edge portion 35, there is a gap between the support portion 34 and the edge portion 35, the gap extends along the negative direction of the z-axis to form a groove portion 36, the support portion 34 and the edge portion 35 are at the same position in the positive direction of the z-axis, of course, in other In an embodiment, the support portion 34 and the edge portion 35 are in different positions in the positive direction of the z-axis, for example, the height of the support portion 34 in the positive direction of the z-axis is greater than that of the edge portion 35 . The photoelectric module 2 has an upper surface and a lower surface opposite to the upper surface, the lower surface of the photoelectric module 2 is far away from the lampshade 1, and the lower surface of the lampshade 1 is in surface contact with the support part 34, thereby passing the heat generated by the photoelectric module The base is passed out to improve the heat dissipation speed. In other embodiments, the photoelectric module 2 and the support part 34 are not in a completely bonded surface contact state, there will be a part of the gap between the photoelectric module 2 and the support part 34, and some thermal conductive adhesive layers can be filled in the gap, and the LED The heat generated by the chip 2201 during operation can be quickly delivered to the base 3 through the circuit board 201 and the thermally conductive adhesive layer, thereby improving the heat dissipation capability.

Figure 14 is a schematic structural diagram of an embodiment of the LED lamp of the present application, see Figure 14, Figure 15A to Figure 15B, Figure 16 and Figure 17A to Figure 17C, the light source module includes a first chip area 2211 and a second chip area 2212, at least a part The power module 23 is located between the first chip area 2211 and the second chip area 2212 . In some embodiments, the circuit board 201 includes an opposite first surface 2011 and a second surface 2012, the first surface 2011 is provided with a first chip area 2211 and a second chip area 2212, and the first chip area 2211 and the second chip area The area 2212 includes at least one LED chip 2201. The power supply module 23 includes a first power supply module 231 and a second power supply module 232, which are respectively located on the first surface 2011 and the second surface 2012 of the circuit board 201. The first power supply module 231 is located between the first chip area 2211 and the second chip area 2212 in the radial direction of the circuit board 201 (the first power module 231 is also located on the first surface 2011), and the power module 23 includes a power supply unit 3a, a booster Unit 3b, step-down unit 3c, power supply unit 3a includes a first drive element 3a1, step-down unit 3c includes a second drive element 3c1, boost unit 3b includes a third drive element 3b1, first drive element 3a1, second drive element 3c1 and the third driving element 3b1 are located on the first surface 2011 of the circuit board 201. After the LED lamp is turned on for t (t≥0.5) hours, the temperature of the first driving element 3a1 and the temperature of the third driving element 3b1 are lower than that of the second driving element The temperature of 3c1, preferably the temperature of the first driving element 3a1 is lower than the temperature of the third driving element 3b1, that is, the temperature of the first driving element 3a1<the temperature of the third driving element 3b1<the temperature of the second driving element 3c1. The second driving element 3c1 is closer to the second chip area 2212 than the first driving element 3a1, and the third driving element 3b1 is farther away from the second chip area 2212 than the second driving element 3c1. The driving elements in the power module are designed in a decentralized manner. The influence of its heat on the first chip area and the second chip area is reduced.

In this embodiment, the first chip area 2211 has opposite first edge S1 and second edge S2, the first edge S1 is close to the central axis of the LED lamp, and at least The surfaces of the two LED chips 2201 are in contact with the second edge S2, the second chip area 2212 has the opposite third edge S3 and the fourth edge S4, the second edge S2 is located between the first edge S1 and the third edge S3, The third edge S3 is located between the second edge S2 and the fourth edge S4, and the figure (such as a circle, an ellipse, etc.) surrounded by the first edge S1, the second edge S2, the third edge S3 and the fourth edge S4 respectively ) perimeters are C1, C2, C3 and C4 in sequence, C1<C2<C3<C4. Surfaces of at least two LED chips 2201 close to the first power module 231 in the second chip area 2212 are in contact with the third edge S3, the distance from the first edge S1 to the second edge S2 is d1, and the first edge S1 is in contact with the second edge S2. The distance between the three edges S3 is d2, the distance between the first edge S1 and the fourth edge S4 is d3, d1+d2<d3, preferably 2d1+d2<d3, and the first chip area is close to the central part of the circuit board, which can effectively reduce lamps In addition, the first chip area is far away from the first power module, which reduces the influence of the first power module on the first chip area.

A second accommodating space is formed between the first insulating part 202 and the base 3, the second accommodating space is located in the first accommodating space, the circuit board 201 is located in the second accommodating space, and the first insulating part 202 includes an optical processing unit 202b and isolation unit 202c. When the light source module emits light, a part or all of the light will pass through the light processing unit 202b, and the light processing unit 202b is used to control the light uniformity of the LED lamps. The isolation unit 202c includes a first region 202c1 and a second region 202c2. The optical processing unit 202b connects the first region 202c1 and the second region 202c2. In the radial direction of the first insulating portion 202, the first region 202c1 and the second region 202c2 relative settings. In one embodiment, the extension direction of the second area 202c2 intersects with the direction of the central axis of the LED lamp. This inclined design can increase the stress-bearing area of the second area and increase the deformation resistance. Preferably, the second area 202c2 The included angle with the central axis of the LED lamp is 0° to 80°, preferably the included angle between the second area 202c2 and the central axis of the LED lamp is 30° to 60°.

At least one fixing unit is provided on the first insulating part 202, and the fixing unit is used to fix the circuit board 201. The fixing unit can be a fixing form such as buckle or screw connection. In one embodiment, the fixing unit 2027 is located between the optical processing unit 202b and Between isolation units 202c.

Figure 18A is a schematic diagram of an embodiment of the photoelectric module, please refer to Figure 18A to Figure 18H, the fixing unit includes at least one first fixing unit 2027a and/or at least one second fixing unit 2027b, the first fixing unit 2027a The same structure as that of the second fixing unit 2027b may be adopted, of course, in some embodiments, the first fixing unit 2027a and the second fixing unit 2027b may adopt different structures. In this embodiment, the first fixing unit 2027a is located between the second area 202c2 and the light processing unit 202b, the second fixing unit 2027b is located between the first area 202c1 and the light processing unit 202b, and the circuit board 201 includes opposite first sides portion 201b and the second side portion 201c, in the above embodiment, the first edge S1 may correspond to the first side portion 201b, and the fourth edge S4 may correspond to the second side portion 201c. The first chip area 2211 and the second chip area 2212 are located between the first side 201b and the second side 201c, the first fixing unit 2027a extends toward the central axis of the LED lamp, and the second fixing unit 2027b extends away from the center of the LED lamp. Extending in the direction of the axis, the first fixing unit 2027a includes a first fixing surface 2027a1, and the circuit board 201 is located between the first fixing surface 2027a1 and the first insulating part 202, thereby fixing the second side part 201c of the circuit board 201, and the second fixing The unit 2027b includes a second fixing surface 2027b1, the circuit board 201 is located between the second fixing surface 2027b1 and the first insulating part 202, thereby fixing the first side part 201b of the circuit board 201, and the two sides of the circuit board 201 are fixed on the In the first insulating portion 202, the stability of the circuit board is improved. In this embodiment, the first fixing surface 2027a1 and the second fixing surface 2027b1 are located on the same horizontal plane, but it is not limited thereto. The distance between the first fixing unit 2027a and the second fixing unit 2027b is smaller than the distance between the first side part 201b and the second side part 201c, thereby providing a stable support for the circuit board. In some embodiments, the first fixing unit The surface 2027a1 and the second fixing surface 2027b1 are in contact with the circuit board 201, and the hardness of the part of the first fixing unit 2027a and the second fixing unit 2027b in contact with the circuit board 201 is greater than that of other parts not in contact with the circuit board 201, which can increase the resistance to the circuit board 201. The fixed effect of the circuit board.

In other embodiments, only the first fixing unit 2027a or the second fixing unit 2027b can be used to fix the circuit board 201, as shown in Figure 15A to Figure 15B, Figure 16 and Figure 17A to Figure 17C, in this embodiment, only the The first fixing unit 2027a fixes the circuit board 201, and the structure of the above-mentioned first fixing unit 2027a will not be repeated here. The first insulating part 202 is provided with a third opening 2025c, the third opening 2025c is connected to the first fixing surface 2027a1, the circuit board 201 is located between the first fixing unit 2027a and the first insulating part 202, and the first insulating part 202 Exposing a part of the circuit board 201 can dissipate part of the heat generated by the second chip region, thereby reducing the temperature of the electronic components on the first surface of the circuit board.

As shown in FIG. 15A, the first insulating portion 202 includes at least one first opening 2025a and at least one second opening 2025b. The first opening 2025a and the second opening 2025b are respectively located in the first area 202c1 and the second area 202c2. The first opening 2025a and the second opening 2025b make the second accommodating space communicate with the outside, so that the heat generated by the electronic components on the circuit board can be dissipated through the first opening and the second opening.

As shown in Figures 14, 15A to 15C, Figure 16, and Figures 17A to 17C, in one embodiment, the first region 202c1 includes an isolation plate 2028, the isolation plate 2028 includes an opposite end and a second end, and the first end is close to the light processing In the unit 202b, the isolation plate 2028 is arranged around the circumference of the first area 202c1 and extends toward the central axis of the LED lamp. In the height direction of the LED lamp, there is a first height difference between the isolation plate 2028 and the light processing unit 202b. When the first insulating part 202 is fixed on the base 3, there is a first height difference between the base 3 and the isolation plate 2028 in the height direction of the LED lamp Two height differences, due to the existence of the first height difference and the second height difference, the adapter 5 can be located at the first end or the second end of the isolation plate 2028 to meet different installation requirements of users. In one embodiment, the first opening 2025a communicates with the first end of the isolation plate 2028 and the second end of the isolation plate 2028. In the height direction of the LED lamp, the height of the first opening 2025a is greater than the height of the circuit board 201, and the first opening 2025a and the third opening 2025c form a first heat dissipation path, and the first opening 2025a and the second opening 2025b form a second heat dissipation path, through which the first surface 2011 of the circuit board 201 and the circuit board 201 The second surface 2012 can dissipate heat, which improves the service life of the power supply module and the light source module. In one embodiment, in the height direction of the LED lamp, there is a height difference between the isolation plate 2028 and the circuit board 201, which can improve the cooling effect on the circuit board. In one embodiment, there is a gap between the first opening 2025a and the circuit board 201, the second opening 2025b is located in the groove portion 36 of the base 3, and the first insulating portion 202 forms a heat dissipation path through the first opening 2025a and the second opening 2025b. , to dissipate heat from the electronic components on the circuit board, and improve the service life of the power supply module and the light source module. In one embodiment, the second end of the isolation plate 2028 may be provided with at least one reinforcing portion 2028a to increase the structural strength of the first region 202c1.

Please refer to FIG. 19N, a first sub-region 202c3 is formed between two adjacent first openings 2025a, the number of the first sub-region 202c3 is one less than the number of the first opening 2025a, and each first sub-region 202c3 has at least one reinforcement Section 2028a.

Please refer to Figure 19A to Figure 19N, the structure of the circuit board in Figure 19A to Figure 19N is the same as the structure of the circuit board shown in Figure 16, combined with Figure 16 and Figure 19A to Figure 19N, the LED lamp includes a connector connected to the power supply unit 3a The terminal 24, the connector terminal 24 is electrically connected to the power supply unit 3a through the wire 241, the first insulating part 202 is provided with a wiring unit 202d, which is used to fix the wire 241, and protects the wire from pulling. The wiring unit 202d includes a light The first wire slot 202b1 on the processing unit 202b, the second wire slot 202c4 in any first sub-area 202c3, the fourth opening 202c5 communicating with the first wire slot 202b1 and the fifth opening 2028b on the isolation plate 2028, the fourth The opening 202c5 communicates with the fifth opening 2028b, the first wire slot 202b1 communicates with the second wire slot 202c4, and the wire 241 passes through the first wire slot 202b1 and the second wire slot 202c4, and then passes through the fourth opening 202c5 and the fifth opening 2028b.

In one embodiment, please refer to FIG. 19A to FIG. 19N , the fixing unit 2027 further includes at least one positioning column 2027c, the positioning column 2027c is located between the light processing unit 202b and the second area 202c2, and extends towards the direction close to the first area 202c1 The circuit board 201 is provided with at least one positioning opening 201d. During installation, align the positioning opening with the positioning post 2027c, so as to preliminarily determine the installation position of the circuit board.

In one embodiment, please refer to FIG. 19A to FIG. 19N , the fixing unit 2027 further includes at least one first step 2027d, the first step 2027d is located on the light processing unit 202b and extends toward the direction close to the first area 202c1, so that the light source There is a certain distance between the module and the light processing unit, which acts as a limit for the installation of the circuit board, and prevents the circuit board from being over-pressed, and then the LED chip interferes with the first insulating part, affecting use. In one embodiment, the fixing unit 2027 may further include at least one second step 2027e. The second step 2027e is located on the light processing unit 202b and extends away from the first area 202c1. According to the stress on the circuit board, the LED lamp Only the first step 2027d or the second step 2027e may be provided, or both the first step 2027d and the second step 2027e may be provided.

Please refer to FIG. 14 , and FIGS. 15A to 15C , the first insulating part 202 further includes a transition part 2026 , and the first insulating part 202 is connected to the base 3 through the transition part 2026 . In one embodiment, the connection unit 202e includes a transition part 2026, the transition part 2026 is located on the second area 202c2, the transition part 2026 is connected to the base 3 through a fixing structure, and the fixing structure can be a clamping structure, a bolt structure (thread and screw) , buckle structure or magnetic structure, etc. Specifically, the transition part 2026 is connected with the mounting part 31 on the base 3 through a fixing structure. If the base structure shown in FIG. 12 is used in FIG. 14, with reference to FIGS. 12, 14 and 15A to 15C, there is a gap between the transition part 2026 and the groove part 36 (in the radial direction of the LED lamp, the transition part Not filling the groove), so that the fluidity of the heat generated by the LED lamp can be increased, and the temperature of the electronic components in the LED lamp can be reduced. In one embodiment, the transition portion 2026 includes a connection area 2026a and a reinforcement area 2026b, the connection area 2026a extends from the second area 202c2 to a direction close to the edge portion 35, the connection area 2026a has the highest point and the lowest point in the height direction of the LED lamp , the lowest point is in contact with the groove portion 36, thereby increasing the contact area between the first insulating portion and the base, and improving the fixing effect of the photoelectric module. The reinforcement area 2026b extends from the second area 202c2 toward the edge 35, and the reinforcement area 2026b connects the second area 202c2 and the connection area 2026a, thereby improving the mechanical strength of the transition portion. A part of the above-mentioned fixing structure can be located in the connection area 2026a.

As shown in Figures 15A to 15C, Figure 16, and Figures 17A to 17C, the optical processing unit 202b includes a first optical processing area 2a, a second optical processing area 2b, and a third optical processing area 2f, and the first optical processing area 2a corresponds to The first chip area 2211, the second optical processing area 2b corresponds to a part of the power module, in this embodiment, the second optical processing area 2b corresponds to the first power module 231, and the third optical processing area 2f corresponds to the second chip area 2212. In one embodiment, the cross section of the first light processing area 2a and/or the third light processing area 2f is different from the cross section of the second light processing area 2b, and the light processing unit 202b can be the aforementioned light absorption area or lens unit. In the embodiment, the second chip area 2212 includes two groups of LED chip groups 221, and a sub-light processing area can be designed corresponding to each group of LED chip groups 221, and the first insulating part 202 corresponds to the first chip area 2211, the first power supply The module 231 is respectively provided with a first optical processing area 2a and a second optical processing area 2b, and a third optical processing area 2f is provided on the first insulating part 202 corresponding to the second chip area 2212, and the third optical processing area 2f includes The sub-light processing areas 2c and 2d, in one embodiment, can be frosted in the photo-processing area 2b, and the refractive index of the light-processing area 2b is smaller than that of the photo-processing area 2a, the sub-light processing areas 2c and 2d, the first chip area and the second chip area. Part of the light emitted by the second chip area will be reflected to the light processing area 2b, and the light processing area 2b is frosted to make the lamp have a more uniform light distribution. Referring to FIG. 19A to FIG. 19N , the above-mentioned first line groove 202b1 is located in the first photoprocessing area 2a. In some embodiments, the light processing unit can be frosted to improve the light output effect of the LED lamp, or the first insulating part can be frosted to improve the appearance of the first insulating part and the light output effect of the LED lamp. In some embodiments, in the height direction of the LED lamp (such as the positive direction of the Z axis shown in FIG. 14), the height of the second light treatment area 2b is greater than or equal to the height of the first light treatment area 2a and the third light treatment area 2f. On the one hand, in the height direction of the LED lamp, the height of some electronic components in the first power module is greater than the height of the LED chip, and the second light processing area 2b can better cover the first power module; on the other hand Part of the light emitted by the first chip area 2211 and the second chip area 2212 will be emitted to the second light processing area 2b, and part or all of this part of light will be refracted by the second light processing area 2b, thereby avoiding the first chip area 2211, the second light processing area A dark area appears in the second chip area 2212 .

The distance from the first chip area 2211 to the base 3 is smaller than the distance from the second chip area 2212 to the base 3 , and the distance between adjacent LED chips in the first chip area 2211 is smaller than the distance between adjacent LED chips in the second chip area 2212 . Since the first chip area 2211 is closer to the base 3 and the first opening 2025 a than the second chip area 2212 , the heat generated by the first chip area 2211 is easier to dissipate than the second chip area 2212 .

Please refer to Figures 18A to 18H, the second chip area 2212 includes at least one set of LED chip groups, one difference between this embodiment and the photoelectric module shown in Figure 15 is that the second chip area 2212 includes three sets of LED chip groups, respectively The first LED chip group 221a, the second LED chip group 221b and the third LED chip group 221c, the first LED chip group 221a, the second LED chip group 221b and the third LED chip group 221c are respectively located on different circles, the second A LED chip group 221a, a second LED chip group 221b and a third LED chip group 221c each include at least one LED chip 2201, and the second LED chip group 221b is located between the first LED chip group 221a and the third LED chip group 221c. In one embodiment, the number of LED chips in the second LED chip group 221b is less than the number of LED chips in the first LED chip group 221a and the third LED chip group 221b, preferably the number of LED chips in the second LED chip group 221b<the first LED chip The number of LED chips in the group 221a<the number of LED chips in the third LED chip group 221c can make the light distribution in the second chip area more uniform and reduce the area of the dark area. In one embodiment, the distance between adjacent LED chips of the second LED chip group 221b is greater than the distance between adjacent LED chips of the first LED chip group 221a and the third LED chip group 221b, and the adjacent LED chips of the second LED chip group The distance between the chips is large, which can reduce the mutual influence between the heat generated by adjacent LED chips in the second chip area. Preferably, the first LED chip group 221a and the third LED chip group 221c respectively have two LED chips and the second One LED chip in the two LED chip groups 221b is adjacent to each other. There is a center point O ₁ , O ₂ ,..., O _n (n≥1) between two adjacent LED chips in the first LED chip group 221a, and there is a center point between two adjacent LED chips in the third LED chip group 221c. Center points Q ₁ , Q ₂ ,..., Q _m (m≥1), n, m are integers, the distance between O ₁ and Q ₁ is smaller than the distance between O ₁ and Q _m (m>1) , the connection line between the center point O _2n-1 and the center point Q _3m-2 (n=m, n, m≧1, n, m is an integer) passes through at least one LED chip 2201 of the second LED chip group 221b. While improving the luminous flux of the LED lamp, it can avoid dark areas appearing in the first chip area 2211 and the second chip area 2212, and reduce the number of the first LED chip group 221a, the second LED chip group 221b, and the third LED chip group 221c. The heat generated by adjacent LED chips affects each other.

Please refer to FIGS. 19A to 19N. In one embodiment, the number of LED chips in the first LED chip group 221a and the second LED chip group 221b is less than the number of LED chips in the third LED chip group 221c, preferably the number of LED chips in the first LED chip group 221a. The number of chips is equal to the number of LED chips in the second LED chip group 221b, and the number of LED chips in the second LED chip group 221b is smaller than the number of LED chips in the third LED chip group 221c, which can make the light distribution in the second chip area more uniform and reduce dark spots. District area. In one embodiment, the distance between adjacent LED chips in the second LED chip group 221b is greater than the distance between adjacent LED chips in the first LED chip group 221a, and the distance between adjacent LED chips in the second LED chip group is larger , can reduce the mutual influence between the heat generated by adjacent LED chips in the second chip area, preferably the first LED chip group 221a and the third LED chip group 221c respectively have two LED chips and the second LED chip group 221b One LED chip is adjacent to each other. There is a center point O ₁ , O ₂ ,..., On(n≥1) between two adjacent LED chips in the first LED chip group 221a, and there is a center point between two adjacent LED chips in the third LED chip group 221c. Points Q ₁ , Q ₂ ,..., Qm (m≥1), n, m are integers, the distance between O ₁ and Q ₁ is smaller than the distance between O ₁ and Qm (m>1), the center point The connection line between O _n and the central point Q _2m-1 (n=m, n, m≧1, n, m both integers) passes through at least one LED chip 2201 of the second LED chip group 221b. While improving the luminous flux of the LED lamp, it can avoid dark areas in the first chip area 2211 and the second chip area 2212, and reduce the number of the first LED chip group 221a, the second LED chip group 221b, and the third LED chip group 221c. The heat generated by adjacent LED chips affects each other. In one embodiment, the photoelectric module 2 further includes connector terminals 24, the connector terminals 24 are electrically connected to an external power source (such as mains) for receiving external power signals and transmitting the power signals to LED lamps, and the connector terminals 24 Connect the electronic components on the circuit board 201 through the wire 241, the connection point between the wire 241 and the circuit board 201 is located on the first surface 2011 of the circuit board 201, and the connection point between the wire 241 and the circuit board 201 is located between the first chip area 2211 and the second Between the chip areas 2212, the power signal transmission distance is short, the power loss is small, and the power is stable. In one embodiment, in the connection between an LED chip in the first chip area 2211 and an LED chip 2201 in the second chip area 2212, at least one line passes through the electrical connection point between the wire 241 and the circuit board 201 (if there are more than 1 at least one of the electrical connection points), since the electrical connection point is located on the connection line between an LED chip in the first chip region and an LED chip in the second chip region, the first chip region and the second chip The light emitted by the area prevents dark spots or dark areas in the area of the lampshade corresponding to the electrical connection points.

The LED lamp may also include secondary light sources 2203 and main light sources, and the number of the main light sources is greater than that of the secondary light sources. When the main light source is not emitting light, the secondary light source can emit light to provide illumination. For example, when sleeping at night, turn off the main light source, and the secondary light source will be on for a period of time or the user selects the secondary light source to provide a sense of security for the lighting. The secondary light source may include night light beads and/or afterglow light beads. In one embodiment, the secondary light source 2203 is located outside the second edge S2 of the first chip area 2211 or inside the fourth edge S4 of the second chip area 2212, or the secondary light source 2230 is located between the first chip area 2211 and the second chip area Between 2212 , in some embodiments, the connection between the electrical connection point of the wire 241 and the circuit board 201 and the secondary light source 2203 passes through at least one LED chip 2201 in the first chip region 2211 . In one embodiment, the shortest distance from the secondary light source 2203 to the first chip area 2211 is shorter than the distance from the secondary light source 2203 to the second chip area 2212 , which can improve the light output effect of the secondary light source 2203 from the lampshade. In one embodiment, the first chip area 2211 and/or the second chip area 2212 include at least two different LED chips (LED chip a ₁ , LED chip a ₂ , LED chip a ₃ , ..., LED chip a _n , n represents the number of types of LED chips), different LED chips (LED chip a ₁ , LED chip a ₂ , LED chip a ₃ , ..., LED chip a _n , n represents the number of types of LED chips, n is an integer) for example Different specifications and sizes, different color temperatures, or different luminous fluxes may also be different parameter indexes of LED chips. In one embodiment, the first chip area 2211 includes LED chips a ₁ , LED chips a ₂ and LED chips a ₃ , and the second chip area 2212 includes LED chips a ₁ and LED chips a ₂ , wherein the LED chips on the circuit board The total number of _a1 is greater than the total number of LED chips _a2 . For example, LED chip _a1 is a high color temperature LED chip, and LED chip _a2 is a low color temperature LED chip. By arranging high color temperature chips and low color temperature chips, the two The color temperature is fully mixed with light, and the overall color temperature can be adjusted by adjusting the driving current ratio of the two color temperature chips. In one embodiment, the number of LED chips _a1 in the first chip area 2211 is less than the number of LED chips _a1 and/or LED chips _a2 in the second chip area 2212; in one embodiment, the first chip area 2211 and the number of LED chips a2 /or the number of LED chips a ₁ in the second chip region 2212 is smaller than the number of LED chips a ₂ on the circuit board 201 . In one embodiment, the number of LED chips a ₁ and/or LED chips a ₂ is greater than the number of LED chips a ₃ , and the LED chips a ₁ and LED chips a ₂ in the embodiment can be the main light sources mentioned above, and the LED chips a 2 _a3 may be the secondary light source mentioned above.

In some embodiments, the LED lamp includes at least one group of LED chip groups (LED chip group b ₁ , LED chip group b ₂ , LED chip group b ₃ , ..., LED chip group b _m , m is an integer), each The LED chip group includes at least one LED chip, and each LED chip group is located on the circuit board 201. In this embodiment, each LED chip group is located on the first side of the circuit board 201, and the LED chips of the same LED chip group are located at or approximately on the same circumference. (Arranged around the opening of the circuit board 201,) the LED chips of each LED chip group are located on different circumferences, and are arranged around the same or approximately the same central axis, which can be the central axis of the circuit board 201, or lead and hang center axis of the adapter or adapter. A part of the power supply modules (for example, the first power supply module) is located between adjacent LED chip groups in the radial direction of the circuit board 201 . At least one of the LED chipsets includes a main light source and a secondary light source, and the luminous flux when the secondary light source is turned on can be configured to be 0.1%-10% of the luminous flux when the main light source is turned on. When the main light source is not emitting light, the secondary light source can emit light to provide illumination. For example, when sleeping at night, turn off the main light source, and the secondary light source will be on for a period of time or the user selects the secondary light source to provide a sense of security for the lighting. The secondary light source may include night light beads and/or afterglow light beads. The number of main light sources is greater than the number of secondary light sources, and the distance between adjacent main light sources is greater than or equal to the distance between adjacent main light sources and secondary light sources. In one embodiment, the central angles of adjacent main light sources are greater than or equal to the central angles of adjacent main light sources and secondary light sources. In some embodiments, n LED chips are included in the same chipset, the central angle between adjacent LED chips or the average central angle a between adjacent LED chips is (360/n) degrees, the wire 241 and the circuit board The connection between the electrical connection point of 201 and the center o forms a line La, the connection between the secondary light source and the center o forms a line Lb, and the angle between the line La and the line Lb ranges from 0.3*a to 5*a. In some embodiments Among them, the angle between the line La and the line Lb ranges from [360/(n+3)] degrees to [360/(n-5)] degrees, and the wiring distance from the secondary light source to the connector terminal is short and close to the secondary light source The heat generated by adjacent LED chips has less influence on the secondary light source. In one embodiment, LED lamps include LED chip group b ₁ , LED chip group b ₂ , LED chip group b ₃ , and LED chip group b ₄ according to the radius from small to large, that is, LED chip group b ₁ is compared to LED chip group b ₂ , LED chip group b ₃ , LED chip group b ₄ is close to the opening 222 of the circuit board 201 , in this embodiment, the LED chip group b ₁ includes a secondary light source, and the wiring distance from the secondary light source to the connector terminal 24 is relatively short , the resistance of the wire is small, so the power loss during operation is low and the signal transmission is stable. In another embodiment, the LED chipset b ₄ includes a secondary light source. Because it is far away from the hanger or adapter, the light generated when the secondary light source is turned on is not easily absorbed by the hanger or adapter, so the light loss is low.

18A to 18H, the optical processing unit 202b includes a first optical processing area 2a, a second optical processing area 2b and a third optical processing area 2f, the first optical processing area 2a corresponds to the first chip area 2211, and the second optical processing area 221 The processing area 2b corresponds to a part of the power module. In this embodiment, the second optical processing area 2b corresponds to the first power module 231, and the third optical processing area 2f corresponds to the second chip area 2212. The optical processing unit 202b can be The aforementioned light absorption area or lens unit, in this embodiment, the second chip area 2212 includes three groups of LED chip groups, corresponding to each group of LED chip groups 221a, 221b, 221c, a sub-light processing area can be designed, and the first insulating part 202 corresponding to the first chip area 2211 and the first power module 231 are respectively provided with optical processing areas 2a, 2b, the third optical processing area 2f includes sub-optical processing areas 2c, 2d and 2e, sub-optical processing areas 2c, 2d and 2e respectively correspond to the LED chip groups 221a, 221b, 221c of the second chip area, the sub-light processing areas 2a, 2c, 2d, and 2e include the lens 202a arranged opposite to the LED chip 2201, and the light processing 2b includes at least one left tilt part 2b1 and at least one right inclined part 2b2, the left inclined part 2b1 is connected with the right inclined part 2b2, and the left inclined part 2b1 and the right inclined part 2b2 can be connected to form a V shape or an inverted V shape, and the external light passes through the light treatment area 2b, part of the light is reflected by the left inclined part 2b1 and the right inclined part 2b2, thereby reducing the visibility of the first power module 231 and improving the appearance of the LED lamp. On the other hand, it is compatible with the first power module 231 After the light emitted by the adjacent LED chips is refracted by the lens 202a, part of the light passes through the first insulating part 202 through the left inclined part 2b1 and the right inclined part 2b2, thereby further reducing the size of the first chip area 2211 and the second chip area 2212. the dark area in between. At least one extension part 2b3 is provided on the light processing area 2b, and the extension part 2b3 is in contact with at least one left inclined part 2b1 and at least one right inclined part 2b2. The circuit board 201 is provided with a perforation 201a opposite to the extension part 2b3. 2b3 passes through the through hole 201a on the circuit board 201, so as to fix the relative position of the circuit board 201 and the first insulating part 202, and prevent the circuit board 201 from rotating in the circumferential direction.

In addition to the common lighting function, the lamp in the embodiment of the present invention also realizes the housekeeping function, which mainly includes three aspects. The function of the first aspect is mainly aimed at residents going out for a period of time, usually more than 1 day, so as to experience the period of lighting with lights. During this period, the lamps simulate the state of residents’ usual use of lights to create the impression that residents are at home to the outside world. This feature helps confuse burglars into thinking someone is in the home and be afraid to do so. The function of the second aspect is to provide information to outsiders such as residents or other designated people when suspicious persons enter the home while the residents are not at home. The function of the third aspect is to realize the observation of the residents, judge whether there is an emergency in the body through the state of the residents, and provide information to other designated people. The setting of the above functions can be realized with the remote control of the lamp, or buttons, display screens, touch screens, etc. can be set on the lamp body to realize human-computer interaction, and smart devices such as smart phones, tablet computers, etc. can also be used for applications. operate. The technical solutions of the embodiments of the present invention will be described in detail below.

Fig. 20 is a schematic diagram of the main components of a lamp according to an embodiment of the present invention. As shown in Figure 20, in addition to the conventional light-emitting element 1111 and the first power supply module 1112 for powering it, the LED lamp also includes a processing module 1113, a light sensor 1114, an infrared sensor 1115, a communication module 1116 and power supply for these four parts The second power supply module 1117.

The light emitting element 1111 is, for example, a light emitting diode LED array, such as the light source module 22 of the present application, etc., and may also be an element such as an incandescent bulb or a fluorescent tube. Correspondingly, the first power supply module 1112 may contain a corresponding circuit to convert the 220V commercial power into a form suitable for light-emitting elements. For example, for an LED array, the first power supply module 1112 may contain a corresponding rectification circuit. If it is an incandescent lamp, then The first power supply module 1112 is mainly composed of wires, wiring devices and other components for electrical communication.

The processing module 1113 mainly includes a processor, and other auxiliary circuits and components to implement logical processing of information, which mainly comes from the light sensor 1114 , the infrared sensor 1115 and the communication module 1116 . The light sensor 1114 is mainly used to sense the intensity of ambient light for the processor to judge whether to turn on the light or not. The infrared sensor 1115 acquires the infrared sensing images of the environment to perceive the human body state of the residents. The communication module 1116 can perform two-way communication with the outside world through a wireless or wired local area network and/or a wireless communication network such as 3G/4G/5G, and is also used to communicate with the above-mentioned remote control.

The second power supply module 1117 may include conversion circuits such as rectification and filtering and batteries. When the mains power is normal, the conversion circuit uses the mains power to supply power to the processing module 1113, the light sensor 1114, the infrared sensor 1115, and the communication module 1116. When the mains power is abnormal or When the power supply is not available, the battery is used for power supply. In addition, if the light emitting element 1111 is an LED array, the battery can also be used for power supply at this time.

The technical solution for realizing the function of the first aspect in the embodiments of the present invention will be described below first. When the residents go out, the lamps can be set to "housekeeping mode". In the housekeeping mode, under the control of the processing module 1113, the operation of the lamps simulates the state of the residents at home. If the ambient light intensity is dark enough, for example, the first light intensity preset value is 100 lx, and the current time is not up to the preset rest time, then the lighting is turned on. When the rest time is reached, the lighting is turned off, or the lighting is turned off after running at a lower lighting level for a period of time.

Next, the lighting will not be turned on for a long period of time, such as 6 to 8 hours, which is the rest period; state of night. It can be turned on at a random time or a preset time, and the duration is a preset duration or a random duration that is less than a preset value.

For different seasons, lighting may or may not be required after getting up in the morning. For this reason, the processing module 1113 can determine whether to turn on the light according to the ambient light intensity after the rest period ends, or determine what time to turn on the light in the morning according to the current date. If the light is turned on, the light is turned off when the ambient light is strong enough, for example, greater than the second light intensity preset value. Here, the second preset light intensity value should be greater than the above-mentioned first preset light intensity value.

When the resident returns and performs any operation on the light fixture, exit the above-mentioned housekeeping mode.

The following describes the technical solution for realizing the function of the second aspect in the embodiments of the present invention. This function is designed for the situation of illegal entry. During the above-mentioned rest period, if someone moves but does not operate the lights, it is considered that there is an illegal entry. Users can turn on this function before going out to realize the monitoring function, that is, enter the monitoring mode.

In the monitor mode, the processing module 1113 monitors the infrared signal provided by the infrared sensor 1115. The infrared signal is generally an infrared sensor image, and the infrared sensor 1115 can provide these images to the processing module at a certain sampling frequency. If there is a heat source area in the image, it is determined that the person is an illegal person. At this time, the processing module 1113 controls the communication module 1116 to send information to the outside. Specifically, it can be a contact person provided to residents or other designated persons, such as residents, or residential properties, police stations, etc. Therefore, when the housekeeping mode is turned on, it is best to turn on the monitoring mode at the same time.

When the residents return home, they can exit the monitoring mode. At this time, any operation on the lights can exit the monitoring mode. At this time, if there are multiple lamps in the monitoring mode, the residents can exit some or all of the lamps from the monitoring mode. . Because when the resident has just returned to the room and has not had time to exit the monitoring mode, the resident himself as a heat source will cause the lamp to send information to the outside, so before deciding to send information to the outside, you can delay for a period of time, such as 30S, so that the resident can exit the monitoring mode. Monitor mode for room lights. That is to say, residents can set the room in which they are not in surveillance mode.

For the case of pets (mainly referring to warm-blooded animals such as cats, dogs, rabbits and birds), the above-mentioned infrared sensing image will still contain the heat source area when the residents are not at home. In this case, the processing module 1113 should perform some filtering operations on the image. For this reason, the height and/or width of the shape of the heat source in the image, that is, the size condition, can be set according to the body shape characteristics of the pet at home. size condition, ignore the heat source area in the image, and then judge the image. For example, if the height and width are set to smaller values at the same time, the interference caused by cats, small dogs, rabbits, and birds can be eliminated. As another example, for the size of a big dog, the width can be set to be significantly greater than the height.

The following describes the technical solution for realizing the function of the third aspect in the embodiments of the present invention. This function can be realized by using an infrared sensor, mainly according to the infrared sensing image provided by the infrared sensor 1115 to judge the state of the people in the house. If the person does not move for a long time, it means that there may be an abnormality. At this time, a message should be sent to the outside, for example, to the relatives of the person in the house. Therefore, this function can be called guardianship mode.

The monitoring area is the area in the house that can be covered by the infrared sensor 1115. Considering the difference in the residence time of people in sub-areas such as the ground area, sofa area, table area, and bed area, the range of the above-mentioned areas can be set, and The duration preset value is set for each sub-area respectively, and these settings are saved as monitoring setting information. When judging the image, examine the time when the heat source area in the image overlaps with the above-mentioned sub-area and keep still, and send a message if it exceeds the respective preset value. Here, a threshold can be set for the overlap, for example, if the overlap area accounts for the set percentage of the heat source area, it is considered to be overlap.

Some check setting information can be saved to check whether people in the house go to bed and wake up on time. Specifically, the bedtime and/or wake-up time can be set as the inspection time and the preset delay time. If the heat source area in the image does not overlap with the bed area within the preset delay time after the bedtime time, it means that the people in the house did not go to bed on time. , and the information can be sent to the outside at this time. If within the preset delay after the wake-up time, the heat source area in the image still coincides with the bed area, it means that the people in the house did not get up on time, and a message can also be sent to the outside at this time.

If the person falls down and cannot get up due to various reasons in the house, this function can also realize the reminder. Specifically, some settings can be made, which are called fall settings here, which mainly include the settings of the fall area, the duration of the fall, and the fall target. The fall area is generally set as a ground area, that is, to avoid places where sofas, beds, etc. can lie. The setting of the fall target, that is, the setting according to the difference in the posture of the person when standing and when falling, is generally reflected in the change of the height and width of the heat source area on the heat source area. Therefore, the height and width of the shape of the heat source area can be set, or the size relationship between the two can be set, for example, the height is half of the width. This setting takes into account that a person is considered to have fallen if the height of the heat source area is less than half the width. The viewing angles of lamps in different positions are different, so the relationship between the height and width here should also consider the position of the lamps. In addition, the impact of pets can also be eliminated by setting the size of the heat source area in the manner described above.

According to the above settings, judge the heat source area in the image, if it is located in the ground area, the shape conforms to the fall target, that is, the shape and size are within the size range of the fall target, for example, its height is less than half of the width, and the time when this image is received When the preset value of the above-mentioned duration is reached, it is considered that the people in the house have fallen to the ground, and a message should be sent to the outside at this time.

The function of the third aspect can also be realized based on the visual sensing function, that is, the infrared sensor 1115 is replaced by a camera (or both can be used), and the environmental image collected by the camera is analyzed by the processing module 1113, and this analysis can be applied to pattern recognition and other techniques to determine the state of a particular object within the environment. This method can not only more accurately identify the posture and other states of the person in the house, but also realize the gesture recognition of the person. In a specific application, the camera collects the environment image and then submits it to the processing module 1113 for recognition. If it is recognized that the environment image contains a human body image, the posture of the human body is judged. The judgment here is based on some preset conditions, such as judging whether the human body has fallen, etc., which can be analyzed by means of pattern recognition. If the human body posture meets the preset conditions, the information is sent to the outside.

In the method of image acquisition by using the camera, gesture recognition can also be performed on the human body image, and at this time, specific information corresponding to the gesture can be sent out according to the specific gesture of the person.

The lamps in the embodiments of the present invention may be ceiling lamps, table lamps, floor lamps, wall lamps and the like. For multi-bedroom houses, multiple lamps are connected to the same LAN, and can be set uniformly or separately. If there are multiple lamps in the same room, one of them can be designated as the main lamp to send information to the outside. For multiple lamps, they can be linked together or separately when setting the mode. For example, if a lamp enters or exits housekeeping mode, all other lamps can enter or exit housekeeping mode. When a lamp enters or exits the monitoring mode or monitoring mode, other lamps can enter or exit at the same time without being affected or linked. You can also group lamps, and the lamps in the same group are linked, and the lamps in different groups are not linked.

According to the technical solution of the embodiment of the present invention, the light sensor, the infrared sensor and the communication module are installed in the lamp, and the functions such as simulating someone at home, finding illegal persons, and monitoring family members can be realized by adopting an adapted program, which expands the application mode of the lamp and improves the Safety in all aspects of your home.

The features of various embodiments of the present application described above can be combined and transformed in any combination without mutual exclusion, and are not limited to a specific embodiment. For example, as described in the embodiment shown in FIG. 3, although these features are not described in the embodiment shown in FIG. 13, they may also include the features described in the embodiment of FIG. The description of 3 applies these features to Figure 13 without creativity; as another example, although this application uses LED ceiling lamps as an example to illustrate various creative solutions, it is obvious that these designs can be applied to Among lamps of other shapes or types, no one will be listed here.

The implementation of the lampshade, photoelectric module, base and LED lamps used in this application has been described above. ", "insulation unit", "arrangement of LED chips", "base" and other features may include one, two, multiple or all technical features if they do not conflict with each other. The relevant corresponding content may be selected from one or a combination of the technical features included in the corresponding embodiments.

The present application has been disclosed above with a preferred embodiment, but those skilled in the art should understand that the embodiment is only used to describe the present application, and should not be construed as limiting the scope of the present application. It should be noted that all changes and substitutions equivalent to this embodiment should be included within the scope of the present application. Therefore, the scope of protection of this application should be defined by the appended claims.

Claims (4)

1. An LED lamp, characterized in that the lamp includes a light source module and a first power supply module that supplies power to the light source module, the lamp also includes a processing module, an optical sensor, a communication module and a second power supply module, wherein: The processing module contains a processor to realize the logical processing of information; The light sensor is used for sensing the ambient light intensity and sending the ambient light intensity information to the processing module; The communication module is used to communicate with the outside; The second power supply module is used to supply power to the processing module, the light sensor and the communication module. 2. The LED lamp according to claim 1, characterized in that, the LED lamp further comprises an infrared sensor for acquiring an infrared sensing image of the environment and then sending it to the processing module; The second power supply module is also used to supply power to the processing module. 3. The LED lamp according to claim 1 or 2, wherein the LED lamp further comprises an image acquisition device for collecting environmental images; The processing module is also used to identify whether the environment image contains a human body image; and if the environment image contains a human body image, judge whether the human body posture in the human body image meets the preset condition; The communication module is also used to send information to the outside when the posture of the human body in the human body image meets a preset condition. 4. The LED lamp according to claim 3, wherein the processing module is further configured to perform gesture recognition on the human body image when the environment image includes a human body image; The communication module is also used to send information to the outside according to the recognition result.