WO2022016687A1 - 一种屏蔽膜及线路板 - Google Patents

一种屏蔽膜及线路板 Download PDF

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Publication number
WO2022016687A1
WO2022016687A1 PCT/CN2020/114440 CN2020114440W WO2022016687A1 WO 2022016687 A1 WO2022016687 A1 WO 2022016687A1 CN 2020114440 W CN2020114440 W CN 2020114440W WO 2022016687 A1 WO2022016687 A1 WO 2022016687A1
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WIPO (PCT)
Prior art keywords
layer
film
shielding
contrast structure
color
Prior art date
Application number
PCT/CN2020/114440
Other languages
English (en)
French (fr)
Inventor
苏陟
Original Assignee
广州方邦电子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 广州方邦电子股份有限公司 filed Critical 广州方邦电子股份有限公司
Priority to KR1020237005949A priority Critical patent/KR20230098775A/ko
Priority to JP2023504656A priority patent/JP2023534753A/ja
Priority to US18/006,472 priority patent/US20230276604A1/en
Publication of WO2022016687A1 publication Critical patent/WO2022016687A1/zh

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F3/00Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
    • G09F3/02Forms or constructions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224Patterned shielding planes, ground planes or power planes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0086Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material

Definitions

  • the present application relates to the field of electronic technology, for example, to a shielding film and a circuit board.
  • an identification code is often set in the electronic product. Scan the code to trace the information of the electronic product or one of its internal components.
  • an identification code (such as a two-dimensional code) is printed on a steel plate, but the size of the steel plate is limited due to the thinning of electronic products, making it difficult to print a two-dimensional code on the steel plate.
  • the identification code can also be printed on the flexible board of the electronic product by means of printing, but due to the small size of the flexible board, the printed identification code is not clear, the accuracy cannot meet the identification requirements, and there are also signs. code cannot be printed on a smaller size flex board.
  • the embodiments of the present application provide a shielding film and a circuit board, so as to realize setting an identification code on the shielding film, thereby improving the clarity and resolution of the identification code.
  • an embodiment of the present application provides a shielding film, including: a first film layer, a contrast structure layer, and an electromagnetic shielding layer;
  • the first film layer is disposed on the first side of the electromagnetic shielding layer
  • the contrast structure layer is disposed on the first side of the electromagnetic shielding layer
  • the grayscale value of the color of the contrast structure layer is greater than the grayscale value of the color of the first film layer.
  • an embodiment of the present application provides a shielding film, including: a first film layer, a contrast structure layer, and an electromagnetic shielding layer;
  • the first film layer is disposed on the first side of the electromagnetic shielding layer
  • the contrast structure layer is disposed on the first side of the electromagnetic shielding layer
  • the gray value of the color of the contrast structure layer is greater than the gray value of the color of the first film layer; among the contrast structure layer and the first film layer, the layer farther away from the electromagnetic shielding layer A layer of cutout graphics that form the identification code.
  • an embodiment of the present application provides a circuit board, the circuit board includes a printed circuit board and the shielding film provided by any embodiment of the present application; the electromagnetic shielding layer of the shielding film is on a side away from the first film layer is provided with an adhesive film layer;
  • One side of the adhesive film layer of the shielding film is attached to the printed circuit board.
  • the shielding film includes an electromagnetic shielding layer for shielding electromagnetic interference
  • the first side of the electromagnetic shielding layer is provided with a first film layer and a contrast structure layer
  • the first film layer can be disposed on the electromagnetic shield layer and the contrast structure layer
  • the contrast structure layer can also be arranged between the electromagnetic shielding layer and the first film layer, the gray value of the color of the contrast structure layer needs to be greater than the gray value of the color of the first film layer, so that the contrast structure layer and the first film layer are A relatively obvious contrast of light and dark brightness can be formed between a film layer.
  • a hollow pattern of the identification code can be formed on the layer of the contrast structure layer and the first film layer that is far away from the electromagnetic shielding layer, so that under the strong contrast of light and shade or color between the contrast structure layer and the first film layer, The user can obtain the identification code with higher clarity, improve the identification precision and accuracy of the identification code, and facilitate the traceability of the components or electronic products identified by the identification code.
  • FIG. 1 is a schematic structural diagram of a shielding film provided by an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of another shielding film provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of another shielding film provided by an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of another shielding film provided by an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of another shielding film provided by an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of another shielding film provided by an embodiment of the present application.
  • FIG. 7 is a schematic diagram of a plane structure of an electromagnetic shielding layer provided by an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of another shielding film provided by an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of another shielding film provided by an embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of another shielding film provided by an embodiment of the present application.
  • FIG. 11 is a schematic structural diagram of a circuit board provided by an embodiment of the present application.
  • FIG. 12 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • electromagnetic shielding Electromagnetic Interference Shielding, EMI Shielding
  • EMI Shielding Electromagnetic Interference Shielding
  • the embodiment of the present application creatively arranges the identification code on the shielding film to improve the clarity and resolution of the identification code.
  • the embodiments of the present application provide a shielding film, including: a first film layer, a contrast structure layer, and an electromagnetic shielding layer;
  • the first film layer is disposed on the first side of the electromagnetic shielding layer
  • the contrast structure layer is arranged on the first side of the electromagnetic shielding layer
  • the gray value of the color of the contrast structure layer is greater than the gray value of the color of the first film layer.
  • the device can identify the two colors and further process them to form a clearly visible color.
  • the identified identification code is sufficient, and there is no limit to how much the grayscale value of the color of the contrast structure layer should be greater than the grayscale value of the color of the first film layer.
  • the shielding film includes an electromagnetic shielding layer for shielding electromagnetic interference, a first film layer and a contrast structure layer are disposed on the first side of the electromagnetic shielding layer, and the first film layer can be disposed on the electromagnetic shielding layer and the contrast structure layer.
  • the contrasting structural layer can also be arranged between the electromagnetic shielding layer and the first film layer.
  • the grayscale value of the color of the contrasting structural layer needs to be greater than the grayscale value of the color of the first film layer, so that the contrasting structural layer A relatively obvious contrast of light and dark brightness can be formed between it and the first film layer.
  • a hollow pattern of the identification code can be formed on the layer of the contrast structure layer and the first film layer that is far away from the electromagnetic shielding layer, so that under the strong contrast of light and shade or color between the contrast structure layer and the first film layer, The user can obtain the identification code with higher clarity, improve the identification precision and accuracy of the identification code, and facilitate the traceability of the components or electronic products identified by the identification code.
  • FIG. 1 is a schematic structural diagram of a shielding film provided by an embodiment of the present application.
  • the shielding film includes a first film layer 11 , a comparative structural layer 12 and an electromagnetic shielding layer 13 .
  • the material of the electromagnetic shielding layer 13 is a conductive material with good shielding performance, which can achieve effective electromagnetic interference shielding.
  • the material of the electromagnetic shielding layer 13 can be copper, which has electrical
  • the material of the electromagnetic shielding layer 13 can also be metal materials such as aluminum, silver, etc., which are not limited in this embodiment.
  • FIG. 1 is a schematic structural diagram of a shielding film provided by an embodiment of the present application.
  • the shielding film includes a first film layer 11 , a comparative structural layer 12 and an electromagnetic shielding layer 13 .
  • the material of the electromagnetic shielding layer 13 is a conductive material with good shielding performance, which can achieve effective electromagnetic interference shielding.
  • the material of the electromagnetic shielding layer 13 can be copper, which has electrical
  • the shielding film may further include an adhesive film layer 14 , and the adhesive film layer 14 is disposed on the electromagnetic shielding layer 13 away from the first shielding film.
  • One side of the film layer 11 is used to realize the connection between the electromagnetic shielding layer 13 and the circuit board.
  • the first film layer 11 is used to insulate and support the electromagnetic shielding layer 13, and to a certain extent block water and oxygen from invading the electromagnetic shielding layer 13.
  • the first film layer 11 is preferably black, or grayscale values such as dark blue and black. For a closer color, this embodiment does not limit the specific color of the first film layer 11 .
  • the first film layer 11 may include epoxy resin, rubber, modified epoxy resin, polyimide, polyurethane resin, acrylic resin, modified acrylic resin, polyester, polyphenylene sulfide, polyphenylene At least one of glycolic acid, liquid crystal polymer, and ink. In this embodiment, at least one of the above materials is mixed by adding other materials to form a dark color with a lower gray value.
  • the color of the first film layer 11 may be black; the first film layer 11 may include at least one of black polyimide and black ink, the black polyimide has a good water vapor barrier effect, and the black ink has Strong flame retardant effect, the first film layer 11 can be set as black polyimide material, or can be set as black ink material, in addition, the first film layer 11 can include black polyimide and black ink at the same time.
  • the protective effect on the electromagnetic shielding layer 13 is enhanced.
  • the thickness of the first film layer 11 ranges from 0.5 ⁇ m to 40 ⁇ m, so as to reduce the thickness of the first film layer 11 as much as possible. 4 ⁇ m is selected to achieve thinning of the first film layer 11 on the premise of having good insulation and protection properties.
  • the contrast structure layer 12 is used to form an obvious difference in color or brightness with the first film layer 11 , and the gray value of the color of the contrast structure layer 12 is greater than the gray value of the color of the first film layer 11 .
  • a grayscale parameter is used to convert the color color into a high-quality grayscale gradient color, so as to detect the contrast between the brightness of the contrast structure layer 12 and the first film layer 11 .
  • Grayscale uses black tones to represent various colors, that is, using black as the base color, and displaying different colors with black with different saturations. Divide black and white into 0 to 255 shades of gray. The gray value of white is 255, and the gray value of black is 0.
  • the gray value of the color of the defined contrast structure layer 12 is greater than the gray value of the color of the first film layer 11 .
  • the contrast can be limited.
  • the grayscale value of the color of the structural layer 12 is quite different from the grayscale value of the color of the first film layer 11 .
  • the color of the contrast structure layer 12 is silver, and the gray value of silver is larger, the silver color of the contrast structure layer 12 is in sharp contrast with the dark color of the first film layer 11.
  • the comparison structure layer 12 and the first film layer 11 are located on the same side of the electromagnetic shielding layer 13, and the arrangement order of the comparison structure layer 12 and the first film layer 11 can be changed.
  • the comparison structure layer 12 can be arranged between the first film layer 11 and the electromagnetic shielding layer 13
  • FIG. 3 which is a schematic structural diagram of another shielding film provided in the embodiment of the present application
  • the first film layer 11 can be arranged in a comparative structure between layer 12 and electromagnetic shielding layer 13 .
  • the contrast structure layer 12 and the first film layer 11 are superimposed on each other to form a sharp contrast.
  • the outermost layer is used to form the hollow pattern of the identification code, and the hollow pattern exposes another
  • the color of the layer can form a large difference in brightness with the outermost layer, which makes the identification code clearer and facilitates accurate identification by the user.
  • a hollow pattern of the identification code needs to be formed on the first film layer 11 , and the hollow pattern of the first film layer 11 exposes a lighter color
  • the (higher brightness) contrast structure layer 12 forms a relatively clear identification code. As shown in FIG.
  • the above-mentioned hollow pattern can be formed by laser ablation, for example, ultraviolet laser and carbon dioxide laser can be used to ablate the hollow pattern.
  • the difference between the gray value of the color of the contrast structure layer 12 and the gray value of the color of the first film layer 11 is greater than or equal to the first gray threshold; the first gray threshold is greater than or equal to 10, then the comparison The difference between the gray value of the color of the structural layer 12 and the gray value of the color of the first film layer 11 is at least 10, so that a more obvious difference between light and dark is formed between the contrasting structural layer 12 and the first film layer 11, and the identification is improved.
  • the code identification device identifies the accuracy of the identification code formed by the comparison structure layer 12 and the first film layer 11 .
  • the above-mentioned first grayscale threshold can be defined as 50, then the grayscale value of the color of the contrast structure layer 12 and the color of the first film layer 11 are grayed out.
  • the difference value of the degree value is at least 50, the color brightness of the contrast structure layer 12 is strong, and the color brightness of the first film layer 11 is small, which further increases the light-dark contrast between the contrast structure layer 12 and the first film layer 11, and improves the brightness of the contrast structure layer 12.
  • the first grayscale threshold may be further defined as 100, so that the difference between the grayscale value of the color of the contrast structure layer 12 and the grayscale value of the color of the first film layer 11 is at least 100 100, for example, if the gray value of the color of the first film layer 11 is 0, the gray value of the color of the contrast structure layer 12 and the gray value of the color of the first film layer 11 differ by at least 100, or even 255, then the contrast The gray value of the structure layer 12 can be selected to be greater than or equal to 100.
  • one of the contrast structure layer 12 and the first film layer 11 is pure black and the other is pure white, that is, the gray value of the two is 255 and the other is 0.
  • the brightness or color The difference is large, which further enhances the clarity of the identification code.
  • FIG. 4 is a schematic structural diagram of another shielding film provided by an embodiment of the present application.
  • the side of the electromagnetic shielding layer 13 close to the adhesive film layer 14 may be roughened to form a plurality of rough raised structures 131;
  • the structure 131 is used to pierce the adhesive film layer 14 to connect with the ground terminal of the printed circuit board.
  • the raised structure 131 can realize the connection between the electromagnetic shielding layer 13 and the ground terminal, and the raised structure 131 enables the electromagnetic shielding layer 13 to connect with the adhesive film.
  • the layers 14 are closely attached to avoid separation of the electromagnetic shielding layer 13 and the adhesive film layer 14.
  • the amount of adhesive in the adhesive film layer 14 is insufficient, the separation between the shielding film and the printed circuit board will occur.
  • the amount of glue in 14 is too much, it is easy to cause glue overflow on the edge of the printed circuit board.
  • the arrangement of the raised structure 131 in this embodiment enables the shielding film and the printed circuit board to be pressed together, and the glue overflowed by the raised structure 131 can be pushed up. Squeeze to the concave portion of the adhesive film layer 14 to increase the amount of adhesive between the electromagnetic shielding layer 13 and the printed circuit board to avoid peeling between the shielding film and the printed circuit board.
  • the above-mentioned first film layer 11 , the contrast structure layer 12 , the electromagnetic shielding layer 13 and the adhesive film layer 14 are all arranged on the carrier film, and the carrier film is used for the above-mentioned various film layers.
  • the electromagnetic shielding layer 13 is roughened to form a raised structure 131, and the adhesive film layer 14 is pressed together
  • the base film of the shielding film is formed on the raised structures 131 of the electromagnetic shielding layer 13 .
  • the base film material of the shielding film needs to be peeled off from the carrier film, and a hollow pattern of the identification code is formed by ablation on the side of the shielding film away from the adhesive film layer 14 .
  • FIG. 5 is a schematic structural diagram of another shielding film provided by the embodiment of the present application.
  • the electromagnetic shielding layer 13 may not be selected to be subjected to roughening treatment on the side close to the adhesive film layer 14.
  • a plurality of conductive particles 141 are arranged in the layer 14 ; the conductive particles 141 are used to pierce the adhesive film layer 14 to connect the ground terminal of the printed circuit board and the electromagnetic shielding layer 13 .
  • the adhesive film layer 14 shown in FIG. 5 includes a plurality of conductive particles 141.
  • the conductive particles 141 agglomerate to form larger particles.
  • the larger particles can pierce the adhesive film layer 14 so that the ground terminal of the printed circuit board and the electromagnetic If the shielding layer 13 is connected, this embodiment does not need to roughen the electromagnetic shielding layer 13 during the manufacturing process, and the adhesive film layer 14 can be closely attached to the electromagnetic shielding layer 13 to form the basic film material of the shielding film. .
  • FIG. 1 A schematic structural diagram of another shielding film provided by the application embodiment, in this embodiment, while roughening the electromagnetic shielding layer 13 to form the convex structure 131, a plurality of conductive particles 141 are disposed in the adhesive film layer 14, The conductive particles 141 can pierce the adhesive film layer 14 and electrically connect with the raised structures 131, thereby further enhancing the continuity between the electromagnetic shielding layer 14 and the ground layer of the circuit board, and solving the existing problems caused by insufficient adhesive capacity between the shielding film and the circuit board. The problem of circuit board delamination.
  • FIG. 7 is a schematic plan view of an electromagnetic shielding layer provided by an embodiment of the present application.
  • the electromagnetic shielding layer 13 is provided with a plurality of through holes 132 , which is conducive to the protection of the adhesive film at high temperatures.
  • the volatiles are exhausted through the through holes 132 of the electromagnetic shielding layer 13 to prevent the volatiles from the adhesive film layer being difficult to discharge at high temperatures, thereby avoiding the electromagnetic shielding layer 13 caused by foaming and delamination between the electromagnetic shielding film and the ground layer of the circuit board. Peel off, which in turn ensures that the electromagnetic shielding film is grounded and the interfering charges are carried away.
  • the through holes 132 may be regularly or irregularly distributed on the electromagnetic shielding layer 13; wherein, as shown in FIG. 7 , the through holes 132 are regularly distributed on the electromagnetic shielding layer 13, which means that each through hole 132 has the same shape And evenly distributed on the electromagnetic shielding layer 13 ; the irregular distribution of the through holes 132 on the electromagnetic shielding layer 13 means that the shapes of the through holes 132 are different and distributed on the electromagnetic shielding layer 13 disorderly.
  • each through hole 132 has the same shape, and each through hole 132 is evenly distributed on the electromagnetic shielding layer 13 .
  • the through hole 132 can be a circular through hole, and can also be a through hole of any other shape.
  • FIG. 7 only illustrates that the through hole 132 is a circular through hole, but the through hole 132 of any other shape is covered in this application. within the scope of protection.
  • the contrast structure layer 12 may be disposed on the side of the first film layer 11 away from the electromagnetic shielding layer 13; the contrast structure layer 12 forms a hollow pattern of the identification code.
  • the material of the contrast structure layer 12 can be metal, the gray value of the color of the metal is greater than the gray value of the color of the first film layer 11 , and the difference is preferably greater than or equal to 10 .
  • the above-mentioned metal layer may include at least one of a metal element and a metal alloy, which is not limited in this embodiment.
  • the comparison structure layer 12 is a metal layer
  • a side insulating film is arranged on the side of the metal layer away from the electromagnetic shielding layer 13, and the insulating film and the logo are arranged on the side of the metal layer.
  • An opening portion is formed at a position corresponding to the hollow pattern of the code to expose the identification code for user identification, thereby preventing a short circuit in the contact between the metal layer and the external electronic components.
  • the insulating film is a colorless and transparent insulating film, the insulating film may not be provided with the opening, and the identification code can also be exposed for user identification.
  • the contrast structure layer 12 may be an adhesive layer or an ink layer with a grayscale value greater than that of the first film layer 11 . While protecting the electromagnetic shielding layer 13, the contrast structure layer 12 and the first film layer 11 exposed by the hollow pattern form a clear identification code.
  • the above-mentioned adhesive layer may be a thermosetting adhesive.
  • the contrast structure layer 12 may be a white glue layer or a white ink layer.
  • the contrast structure layer 12 is a white adhesive layer or a white ink layer
  • the grayscale value of the color of the contrast structure layer 12 is 255
  • the color of the first film layer 11 is preferably black
  • the color of the first film layer 11 is preferably black.
  • the gray value of the color is 0, and the contrast between black and white is relatively strong, and it is easy to form a clearer identification code.
  • the adhesive layer or the ink layer may also be gray, yellow, and other colors with higher gray values, which are not limited in this embodiment.
  • the first film layer 11 may be disposed on the side of the contrast structure layer 12 away from the electromagnetic shielding layer 13; the first film layer 11 forms a hollow pattern of the identification code.
  • the contrast structure layer 12 can be an adhesive layer or an ink layer, and the gray value of the color of the adhesive layer or the ink layer is greater than the gray value of the color of the first film layer 11, and the color of the adhesive layer or ink layer.
  • the gray value of is preferably greater than or equal to 160.
  • the contrast structure layer 12 may be a white or colorless adhesive layer; or, the contrast structure layer 12 may be a white ink layer.
  • the material of the contrast structure layer 12 can be selected from modified epoxy resin, modified acrylic, modified rubber, modified thermoplastic polyimide, modified polyester, thermoplastic resin, thermosetting resin, sub-sensitive adhesive at least one of them.
  • the contrast structure layer 12 is a white adhesive layer or a white ink layer, the grayscale value of the color of the contrast structure layer 12 is 255, and the grayscale value of the color of the first film layer 11 is preferably 0, and black and The contrast of white is stronger, and it is easy to form a clearer identification code.
  • the adhesive layer or the ink layer may also be gray, yellow, and other colors with higher gray values, which are not limited in this embodiment.
  • a colorless adhesive layer can be selected for the contrast structure layer 12, and the colorless adhesive layer can effectively protect the electromagnetic shielding layer 13 and prevent electromagnetic interference.
  • the shielding layer 13 is exposed in the hollow pattern.
  • the contrast structure layer 12 is colorless, so the electromagnetic shielding layer 13 is exposed through the hollow pattern, and the black color of the first film layer 11 is also contrasted with the color of the electromagnetic shielding layer 13 to form a relatively clear identification code, such as the electromagnetic shielding layer 13 is selected.
  • the color of the electromagnetic shielding layer 13 is red copper, which is easy to distinguish between red copper and black.
  • the copper is effectively protected by the colorless contrast structure layer 12 to prevent it from being exposed to oxidation in the air and causing subsequent The color is not easily distinguished from the first film layer 11 .
  • the contrast structure layer 12 may also be a metal layer.
  • the grayscale value of the color of the metal is greater than the grayscale value of the color of the first film layer 11 , and the grayscale value of the color of the metal is preferably greater than or equal to 10.
  • the material of the contrast structure layer 12 is at least one element of nickel, silver, platinum, titanium, aluminum, cobalt and chromium; or, the material of the contrast structure layer is nickel, silver, platinum, titanium, aluminum, cobalt and chromium; or, the material of the contrast structure layer is a combination of alloys formed by at least two of nickel, silver, platinum, titanium, aluminum, cobalt, and chromium. It is easy to understand that the more distinct the identification code is in black and white, the better. Therefore, the color of the metal material of the contrast structure layer 12 needs to be light enough, and silver or silver-white metal materials are preferably used.
  • the material of the contrast structure layer is a combination of an alloy formed by at least two of nickel, silver, platinum, titanium, aluminum, cobalt and chromium.
  • the above-mentioned materials are all white, silver or close to silver color.
  • nickel may be selected as the material of the contrast structure layer 12
  • a nickel-chromium alloy may be selected as the material of the contrast structure layer 12 .
  • the contrast structure layer 12 may also be other light-colored metals with lower grayscale values, which is not limited in this embodiment.
  • the comparative structure layer 12 may include a first metal layer 121 and a second metal layer 122; the first metal layer 121 is formed by a sputtering process On the side of the first film layer 11 close to the electromagnetic shielding layer 13 ; the second metal layer 122 is formed on the side of the first metal layer 121 away from the first film layer 11 by an electroplating process.
  • this embodiment also has certain requirements on the flatness of the contrast structure layer 12 . Because the rougher the surface of the contrast structure layer 12 is, the duller the light on the surface of the contrast structure layer 12 is, and the resolution between the contrast structure layer 12 and the first film layer 11 is reduced, so in this embodiment, the contrast structure layer 12 can be divided into two layers.
  • a first metal layer 121 is formed on the first film layer 11 through a sputtering process, and the sputtering process forms a dense and flat metal surface, which is convenient for comparison with the first film layer 11.
  • a second metal layer 122 is formed on the layer 121 through an electroplating process.
  • the thickness range of 121 of the first metal layer can be The thickness of the second metal layer 122 may range from 0.1 ⁇ m to 10 ⁇ m.
  • the resistance value of the second metal layer 122 per unit area (1 cm x 1 cm) can be set in the range of 15 m ⁇ to 200 m ⁇ , and preferably can be set as 30m ⁇ .
  • the first metal layer 121 can also be processed by other processes, for example, one or more of electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputtering plating, electroplating and hybrid plating
  • the manufacturing process is formed.
  • the manufacturing process of the first metal layer 121 is not limited in this embodiment.
  • the first metal layer 121 preferably adopts a sputtering process.
  • the laser energy forms a hollow pattern on the first film layer, so that the color of the first metal layer 121 is exposed. Therefore, the first metal layer 121
  • the grayscale value corresponding to the color of the second metal layer 122 is preferably lower than the grayscale value corresponding to the color of the second metal layer 122.
  • the first metal layer 121 can be selected to be Ag
  • the second metal layer 122 can be selected to be Ni.
  • the first metal layer may include a first sputtered metal layer 1211 and a second sputtered metal layer 1212; the first sputtered metal layer 1211 is disposed between the first film layer 11 and the second sputtering metal layer 1212 ; the grayscale value of the color of the first sputtering metal layer 1211 is greater than that of the second sputtering metal layer 1212 .
  • two sputtered metal layers can be provided, because the laser energy may break through the first sputtered metal layer 1211 when actually ablating the first film layer 11 to form the hollow pattern of the identification code, then the second The sputtered metal layer 1212 increases the protection, and the sputtered metal layer with high flatness is maintained to be exposed by the hollow pattern.
  • the grayscale value of the color of the first sputtering metal layer 1211 can be set to be greater than the grayscale value of the color of the second sputtering metal layer 1212.
  • the first sputtering metal layer 1211 can be set to be silver, and the second sputtering If the radiation metal layer 1212 is nickel, the metal surface of silver can form a sharp color contrast with the dark first film layer 11, thereby improving the clarity of the identification code.
  • the comparative structural layer 12 may further include a second film layer 15; the second film layer 15 is disposed on the first film layer 11 and the first film layer 15. Between the metal layers 121; the difference between the gray value of the color of the second film layer 15 and the gray value of the color of the first film layer 11 is greater than or equal to the first grayscale threshold; the first grayscale threshold is greater than or equal to 10 .
  • the second film layer 15 is disposed between the first film layer 11 and the first metal layer 121.
  • the second film layer 15 is disposed on the between the first film layer 11 and the first sputtered metal layer, thereby further enhancing the protection of the first metal layer 121, for example, because of the disposition of the second film layer 15, it is completely avoided that the laser energy may cause the first When the sputtered metal layer is broken through, the first sputtered metal layer is protected.
  • the gray value of the color of the second film layer 15 also needs to be greater than the gray value of the first film layer 11, and the difference between the gray value of the second film layer 15 and the gray value of the color of the first film layer 11 Preferably, it is greater than or equal to the first grayscale threshold; the first grayscale threshold is greater than or equal to 10. Then the difference between the gray value of the color of the second film layer 15 and the gray value of the color of the first film layer 11 is at least 10, so that a more obvious light and shade is formed between the second film layer 15 and the first film layer 11 The difference is improved, and the accuracy of the identification code recognition device for the identification code formed by the second film layer 15 and the first film layer 11 is improved.
  • the above-mentioned first grayscale threshold may be 50 or 100, which can further increase the light-dark contrast between the second film layer 15 and the first film layer 11 and improve the identification accuracy and accuracy of the identification code.
  • the second film layer 15 may be white or colorless; the thickness of the second film layer 15 may range from 0.5 ⁇ m to 30 ⁇ m.
  • the contrast between the white second film layer 15 and the dark color first film layer 11 is relatively strong, and it is easy to form a clearer identification code.
  • the second film layer 15 can be colorless, so that the color of the first metal layer 121 can be exposed through the second film layer 15 through the hollow pattern.
  • the embodiment of the present application further provides a shielding film, with continued reference to FIG. 1 , including: a first film layer 11 , a comparative structural layer 12 and an electromagnetic shielding layer 13 ;
  • the first film layer 11 is disposed on the first side of the electromagnetic shielding layer 13;
  • the contrast structure layer 12 is disposed on the first side of the electromagnetic shielding layer 13;
  • the gray value of the color of the contrast structure layer 12 is greater than the gray value of the color of the first film layer 11; among the contrast structure layer 12 and the first film layer 11, the layer farther from the electromagnetic shielding layer 13 forms the identification code openwork graphics.
  • the shielding film includes an electromagnetic shielding layer for shielding electromagnetic interference, a first film layer and a contrast structure layer are disposed on the first side of the electromagnetic shielding layer, and the first film layer can be disposed on the electromagnetic shielding layer and the contrast structure layer.
  • the contrasting structural layer can also be arranged between the electromagnetic shielding layer and the first film layer.
  • the grayscale value of the color of the contrasting structural layer needs to be greater than the grayscale value of the color of the first film layer, so that the contrasting structural layer A relatively obvious contrast of light and dark brightness can be formed between it and the first film layer.
  • a hollow pattern of the identification code is formed between the contrast structure layer and the first film layer, which is farther from the electromagnetic shielding layer, so that under the strong light and shade or color contrast between the contrast structure layer and the first film layer, the user can
  • the identification code with higher clarity can be obtained, the identification precision and accuracy of the identification code can be improved, and the components or electronic products identified by the identification code can be traced easily.
  • the identification code may include at least one of barcodes, two-dimensional codes and characters.
  • the identification code is the unique corresponding identification mark that identifies the component or electronic product.
  • the identification code may include character graphics such as numbers and letters, and may also be a barcode or two-dimensional code.
  • the shielding film of this embodiment may include at least one of the above-mentioned barcodes, two-dimensional Product is identified. Exemplarily, if the shielding film needs to be attached to the printed circuit board of the electronic device, the identification code of the component can be set on the position of the shielding film corresponding to the component.
  • the hollow pattern is formed by laser ablation.
  • ablation of hollow patterns can be performed using UV lasers and CO2 lasers.
  • the first is to burn through only the layer of the contrast structure layer 12 and the first film layer 11 that is far from the electromagnetic shielding layer 13 to form a hollow pattern of the identification code, and not to the layer that is closer to the electromagnetic shielding layer 13
  • the ablation is performed, that is, the ablation depth of the hollow pattern is: the thickness of the layer farther from the electromagnetic shielding layer 13 in the comparison structure layer 12 and the first film layer 11 .
  • the hollow pattern just exposes the unetched layer structure that is closer to the electromagnetic shielding layer 13, and the contrast structure layer 12 and the first film layer 11 form an identification code.
  • the hollow pattern can also expose the contrast structure layer 12 and the first film.
  • the layer is closer to the electromagnetic shielding layer 13 , so that the contrast structure layer 12 and the first film layer 11 form an identification code.
  • the layer closer to the electromagnetic shielding layer 13 forms a groove pattern; the vertical projection of the hollow pattern on the plane where the electromagnetic shielding layer is located completely coincides with the groove pattern.
  • a part of the comparative structure layer 12 and the first film layer 11 that is closer to the electromagnetic shielding layer 13 is ablated to form a groove pattern, and because the above-mentioned groove pattern and the hollow pattern are formed by the same process, the hollow pattern is formed in the same process.
  • the vertical projection on the plane of the electromagnetic shielding layer completely coincides with the groove pattern.
  • the contrast structure layer 12 may be disposed on the side of the first film layer 11 away from the electromagnetic shielding layer 13 ; the contrast structure layer 12 forms a hollow pattern of the identification code.
  • the comparison structure layer 12 when the comparison structure layer 12 is ablated to form the hollow pattern of the identification code, only the comparison structure layer 12 may be ablated without ablation of the first film layer 11;
  • the first film layer 11 When identifying the hollow pattern of the code, the first film layer 11 can be partially ablated to form a groove pattern at the same time, and the vertical projection of the hollow pattern on the plane where the electromagnetic shielding layer is located completely coincides with the groove pattern.
  • the material of the contrast structure layer 12 in this embodiment may be metal, the gray value of the color of the metal is greater than the gray value of the color of the first film layer 11 , and the gray value of the color of the metal The difference from the grayscale value of the color of the first film layer 11 is preferably greater than or equal to 10.
  • the contrast structure layer 12 may be an adhesive layer or an ink layer.
  • the contrast structure layer 12 can be an adhesive layer or an ink layer with a grayscale value greater than that of the first film layer 11 . While protecting the electromagnetic shielding layer 13, the contrast structure layer 12 and the first film layer 11 exposed by the hollow pattern form a clear identification code.
  • the above-mentioned adhesive layer may be a thermosetting adhesive.
  • the contrast structure layer 12 may be a white glue layer or a white ink layer.
  • the contrast structure layer 12 is a white adhesive layer or a white ink layer
  • the grayscale value of the color of the contrast structure layer 12 is 255
  • the color of the first film layer 11 is preferably black
  • the color of the first film layer 11 is preferably black.
  • the gray value of the color is 0, and the contrast between black and white is relatively strong, and it is easy to form a clearer identification code.
  • the adhesive layer or the ink layer may also be gray, yellow, and other colors with higher gray values, which are not limited in this embodiment.
  • the first film layer 11 may also be disposed on the side of the contrast structure layer 12 away from the electromagnetic shielding layer 13 ; the first film layer 11 forms a hollow pattern of the identification code.
  • the first film layer 11 when the first film layer 11 is ablated to form the hollow pattern of the identification code, only the first film layer 11 may be ablated, but the contrast structure layer 12 may not be ablated; alternatively, the first film layer may be ablated 11
  • the contrast structure layer 12 can be partially ablated to form a groove pattern, and the vertical projection of the hollow pattern on the plane where the electromagnetic shielding layer is located completely coincides with the groove pattern.
  • the contrast structure layer 12 may be one or a combination of two or more of the adhesive layer, the ink layer and the metal layer.
  • the contrast structure layer 12 can be an adhesive layer or an ink layer, and the gray value of the color of the adhesive layer or the ink layer is greater than the gray value of the color of the first film layer 11, and the color of the adhesive layer or ink layer.
  • the difference between the gray value of and the gray value of the color of the first film layer 11 is preferably greater than or equal to 10.
  • the contrast structure layer 12 may be a white or colorless adhesive layer; or, the contrast structure layer 12 may be a white ink layer.
  • the material of the contrast structure layer 12 can be selected from modified epoxy resin, modified acrylic, modified rubber, modified thermoplastic polyimide, modified polyester, thermoplastic resin, thermosetting resin, sub-sensitive adhesive at least one of them.
  • the contrast structure layer 12 is a white adhesive layer or a white ink layer
  • the grayscale value of the color of the contrast structure layer 12 is 255
  • the grayscale value of the color of the first film layer 11 is preferably 0, and black and The contrast of white is stronger, and it is easy to form a clearer identification code.
  • the adhesive layer or the ink layer may also be gray, yellow, and other colors with lower grayscale values, which are not limited in this embodiment. It should be noted that when the contrast structure layer 12 is disposed between the first film layer 11 and the electromagnetic shielding layer 13, a colorless adhesive layer can be selected for the contrast structure layer 12, and the colorless adhesive layer can effectively protect the electromagnetic shielding layer 13 and prevent electromagnetic interference. The shielding layer 13 is exposed in the hollow pattern.
  • the contrast structure layer 12 is colorless, so the electromagnetic shielding layer 13 is exposed through the hollow pattern, and the black color of the first film layer 11 is also contrasted with the color of the electromagnetic shielding layer 13 to form a relatively clear identification code, such as the electromagnetic shielding layer 13 is selected.
  • the material is copper
  • the color of the electromagnetic shielding layer 13 is red copper, which is easy to distinguish between red copper and black.
  • the copper is effectively protected by the colorless contrast structure layer 12 to prevent it from being oxidized when exposed to the air. It is not easy to distinguish the color between the subsequent and the first film layer 11 .
  • the contrast structure layer 12 may also be a metal layer.
  • the grayscale value of the color of the metal is greater than the grayscale value of the color of the first film layer 11 , and the difference is preferably greater than or equal to 10.
  • the material of the contrast structure layer 12 is at least one element of nickel, silver, platinum, titanium, aluminum, cobalt and chromium; or, the material of the contrast structure layer is nickel, silver, platinum, titanium, aluminum, cobalt and chromium; or, the material of the contrast structure layer is a combination of alloys formed by at least two of nickel, silver, platinum, titanium, aluminum, cobalt, and chromium. It is easy to understand that the more distinct the identification code is in black and white, the better.
  • the color of the metal material of the contrast structure layer 12 needs to be light enough, and silver or silver-white metal materials are preferably used.
  • at least one element of nickel, silver, platinum, titanium, aluminum, cobalt, and chromium, or an alloy formed by at least two of nickel, silver, platinum, titanium, aluminum, cobalt, and chromium is selected to form a contrast structure layer 12.
  • the material of the contrast structure layer is a combination of an alloy formed by at least two of nickel, silver, platinum, titanium, aluminum, cobalt and chromium. The above-mentioned materials are all white, silver or close to silver color.
  • nickel may be selected as the material of the contrast structure layer 12, or a nickel-chromium alloy may be selected as the material of the contrast structure layer 12.
  • the contrast structure layer 12 may also be other light-colored metals with lower grayscale values, which is not limited in this embodiment.
  • the contrast structure layer 12 may include a first metal layer 121 and a second metal layer 122; the first metal layer 121 is formed on the side of the first film layer 11 close to the electromagnetic shielding layer 13 by a sputtering process; the second metal layer 121 The layer 122 is formed on the side of the first metal layer 121 away from the first film layer 11 by an electroplating process.
  • this embodiment also has certain requirements on the flatness of the contrast structure layer 12 . Because the rougher the surface of the contrast structure layer 12 is, the duller the light on the surface of the contrast structure layer 12 is, and the resolution between the contrast structure layer 12 and the first film layer 11 is reduced, so in this embodiment, the contrast structure layer 12 can be divided into two layers.
  • a first metal layer 121 is formed on the first film layer 11 through a sputtering process, and the sputtering process forms a dense and flat metal surface, which is convenient for comparison with the first film layer 11.
  • a second metal layer 122 is formed on the layer 121 through an electroplating process.
  • the thickness range of 121 of the first metal layer can be The thickness of the second metal layer 122 may range from 0.1 ⁇ m to 10 ⁇ m.
  • the resistance value of the second metal layer 122 per unit area (1 cm x 1 cm) can be set in the range of 15 m ⁇ to 200 m ⁇ , and preferably can be set as 30m ⁇ .
  • the laser energy forms a hollow pattern on the first film layer, so that the color of the first metal layer is exposed, so the color of the first metal layer is exposed.
  • the corresponding gray value is preferably lower than the gray value corresponding to the color of the second metal layer.
  • the first metal layer can be selected to be Ag, and the second metal layer can be selected to be Ni.
  • the first metal layer may include a first sputtered metal layer 1211 and a second sputtered metal layer 1212; the first sputtered metal layer 1211 is disposed on the first film layer 11 and the second sputtered metal layer 1211. between the sputtering metal layers 1212 ; the grayscale value of the color of the first sputtering metal layer 1211 is greater than the grayscale value of the color of the second sputtering metal layer 1212 .
  • two sputtered metal layers can be provided, because the laser energy may break through the first sputtered metal layer 1211 when actually ablating the first film layer 11 to form the hollow pattern of the identification code, then the second The sputtered metal layer 1212 increases the protection, and the sputtered metal layer with high flatness is maintained to be exposed by the hollow pattern.
  • the grayscale value of the color of the first sputtering metal layer 1211 can be set to be greater than the grayscale value of the color of the second sputtering metal layer 1212.
  • the first sputtering metal layer 1211 can be set to be silver, and the second sputtering If the radiation metal layer 1212 is nickel, the metal surface of silver can form a sharp color contrast with the dark first film layer 11, thereby improving the clarity of the identification code.
  • an embodiment of the present application also provides a circuit board, as shown in FIG. 11 , which is a schematic structural diagram of a circuit board provided by an embodiment of the present application.
  • the circuit board includes a printed circuit board 2 and any The shielding film 1 provided by the embodiment; the electromagnetic shielding layer of the shielding film 1 is provided with an adhesive film layer on the side away from the first film layer; the side of the adhesive film layer of the shielding film 1 is attached to the printed circuit board 2 and disposed.
  • the circuit board of this embodiment includes the technical features of the shielding film provided by any embodiment of the present application, and has the beneficial effects of the shielding film provided by any embodiment of the present application.
  • the printed circuit board 2 is integrated with a large number of components with different functions.
  • the positions corresponding to the components on the shielding film 1 may be provided with identification codes of the components.
  • the shielding film 1 can cover the above-mentioned printed circuit board in a whole layer, so as to realize the electromagnetic shielding of the whole layer.
  • the shielding film 1 can also include a plurality of sub-shielding films with smaller size, and each sub-shielding film is used to cover the corresponding area of the printed circuit board, This embodiment does not limit this.
  • the identification code of the electronic device where the circuit board is located can also be set on the shielding film 1 .
  • FIG. 12 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • the electronic device provided by an embodiment of the present application includes a circuit board 3 according to any embodiment of the present application.
  • the electronic device may be a mobile phone as shown in FIG. 12 , or may be a computer, a television, a smart wearable device, or the like, which is not particularly limited in this embodiment.

Abstract

一种屏蔽膜及线路板,屏蔽膜包括第一膜层(11)、对比结构层(12)和电磁屏蔽层(13);第一膜层(11)设置于电磁屏蔽层(13)的第一侧;对比结构层(12)设置于电磁屏蔽层(13)的第一侧;其中对比结构层(12)的颜色的灰度值大于第一膜层(11)的颜色的灰度值,对比结构层(12)和第一膜层(11)中,距离电磁屏蔽层(13)较远的一层形成标识码的镂空图形。该屏蔽膜的对比结构层(12)和第一膜层(11)的强烈的明暗或色彩的对比下,用户可获取清晰度较高的标识码,提高对标识码的识别精度和准确度,便于对标识码所标识的元器件或电子产品进行追溯。

Description

一种屏蔽膜及线路板 技术领域
本申请涉及电子技术领域,例如涉及一种屏蔽膜及线路板。
背景技术
随着电子工业的迅速发展,电子产品进一步向小型化,轻量化,组装高密度化发展,极大地推动了挠性电路板的发展,逐步实现元件装置和导线连接一体化。挠性电路板可广泛应用于手机、液晶显示、通信和航天等行业。
随着手机等电子产品的各种功能的整合,其内部组件逐步高频高速化。例如,在手机的各项功能中,除了原有的音频传播功能,照相功能已成为必要功能,且无线局域网(Wireless Local Area Networks,WLAN)、全球定位系统(Global Positioning System,GPS)以及上网功能也已普及,此外,未来的感测组件将会逐渐整合,手机内部组件急剧高频高速化的趋势不可避免。
目前的电子产品中,电子产品的内部集成了各种元器件,为了更好的追溯该电子产品或者更好的追溯电子产品内部的某一个元器件,在电子产品内往往设置有标识码,通过扫码该标识码,可以进行电子产品或其内部某一元器件的信息追溯。以往的技术是将标识码(例如二维码)印制在一钢板上,但是由于电子产品的轻薄化限定了钢板的尺寸,导致不易在钢板上印制二维码。现有技术中还可采用印刷的方式,将标识码印刷在电子产品的软板上,但是由于软板尺寸较小,导致印刷的标识码不清晰,精度达不到识别要求,并且也存在标志码无法印制在较小尺寸的软板上的情况。
发明内容
本申请实施例提供了一种屏蔽膜及线路板,以实现在屏蔽膜上设置标识码,从而提高标识码的清晰度和分辨率。
第一方面,本申请实施例提供了一种屏蔽膜,包括:第一膜层、对比结构层和电磁屏蔽层;
所述第一膜层设置于所述电磁屏蔽层的第一侧;
所述对比结构层设置于所述电磁屏蔽层的第一侧;
其中,所述对比结构层的颜色的灰度值大于所述第一膜层的颜色的灰度值。
第二方面,本申请实施例提供了一种屏蔽膜,包括:第一膜层、对比结构层和电磁屏蔽层;
所述第一膜层设置于所述电磁屏蔽层的第一侧;
所述对比结构层设置于所述电磁屏蔽层的第一侧;
其中,所述对比结构层的颜色的灰度值大于所述第一膜层的颜色的灰度值;所述对比结构层和所述第一膜层中,距离所述电磁屏蔽层较远的一层形成标识码的镂空图形。
第三方面,本申请实施例提供了一种线路板,所述线路板包括印刷电路板以及本申请任意实施例提供的屏蔽膜;所述屏蔽膜的电磁屏蔽层远离第一膜层的一侧设置有胶膜层;
所述屏蔽膜的胶膜层的一侧贴附所述印刷电路板设置。
本申请中,屏蔽膜包括用于屏蔽电磁干扰的电磁屏蔽层,电磁屏蔽层的第一侧设置有第一膜层和对比结构层,可以将第一膜层设置于电磁屏蔽层和对比结构层之间,也可将对比结构层设置于电磁屏蔽层和第一膜层之间,对比结构 层的颜色的灰度值需要大于第一膜层的颜色的灰度值,使得对比结构层和第一膜层之间能够形成较为明显的明暗亮度对比。本实施例可将对比结构层和第一膜层中距离电磁屏蔽层较远的一层形成标识码的镂空图形,使得在对比结构层和第一膜层的强烈的明暗或色彩的对比下,用户可获取清晰度较高的标识码,提高对标识码的识别精度和准确度,便于对标识码所标识的元器件或电子产品进行追溯。
附图说明
图1是本申请实施例提供的一种屏蔽膜的结构示意图;
图2是本申请实施例提供的另一种屏蔽膜的结构示意图;
图3是本申请实施例提供的另一种屏蔽膜的结构示意图;
图4是本申请实施例提供的另一种屏蔽膜的结构示意图;
图5是本申请实施例提供的另一种屏蔽膜的结构示意图;
图6是本申请实施例提供的另一种屏蔽膜的结构示意图;
图7是本申请实施例提供的一种电磁屏蔽层的平面结构示意图;
图8是本申请实施例提供的另一种屏蔽膜的结构示意图;
图9是本申请实施例提供的另一种屏蔽膜的结构示意图;
图10是本申请实施例提供的另一种屏蔽膜的结构示意图;
图11是本申请实施例提供的一种线路板的结构示意图;
图12是本申请实施例提供的一种电子设备的结构示意图。
具体实施方式
下面结合附图和实施例对本申请作进一步的详细说明。可以理解的是,此处所描述的具体实施例仅仅用于解释本申请,而非对本申请的限定。另外还需要说明的是,为了便于描述,附图中仅示出了与本申请相关的部分而非全部结构。
随着挠性电路板的发展,评定挠性电路板性能的一项重要指标是电磁屏蔽(Electromagnetic Interference Shielding,EMI Shielding)。在高频及高速化的驱动下所引发的组件内部及外部的电磁干扰,以及信号在传输过程中的衰减、插入损耗和抖动逐渐严重,一般的电子产品均需要在印刷线路板上贴附屏蔽膜以实现电磁干扰的屏蔽。结合目前标识码因电子产品尺寸规格不易设置的情况,本申请实施例创造性的将标识码设置于屏蔽膜上,以提高标识码的清晰度和分辨率。
具体的,本申请实施例提供了一种屏蔽膜,包括:第一膜层、对比结构层和电磁屏蔽层;
第一膜层设置于电磁屏蔽层的第一侧;
对比结构层设置于电磁屏蔽层的第一侧;
其中,对比结构层的颜色的灰度值大于第一膜层的颜色的灰度值。
在本申请实施例中,对于对比结构层的颜色的灰度值大于第一膜层的颜色的灰度值,只要形成标识码后,设备能够将两者的颜色识别并进一步处理形成清晰的可辨别的标识码即可,对于对比结构层的颜色的灰度值具体应该大于第一膜层的颜色的灰度值多少没有限定。
本申请实施例中,屏蔽膜包括用于屏蔽电磁干扰的电磁屏蔽层,电磁屏蔽 层的第一侧设置有第一膜层和对比结构层,可以将第一膜层设置于电磁屏蔽层和对比结构层之间,也可将对比结构层设置于电磁屏蔽层和第一膜层之间,对比结构层的颜色的灰度值需要大于第一膜层的颜色的灰度值,使得对比结构层和第一膜层之间能够形成较为明显的明暗亮度对比。本实施例可将对比结构层和第一膜层中距离电磁屏蔽层较远的一层形成标识码的镂空图形,使得在对比结构层和第一膜层的强烈的明暗或色彩的对比下,用户可获取清晰度较高的标识码,提高对标识码的识别精度和准确度,便于对标识码所标识的元器件或电子产品进行追溯。
以上是本申请的核心思想,下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述。基于本申请中的实施例,本领域普通技术人员在没有做出创造性劳动前提下,所获得的所有其他实施例,都属于本申请保护的范围。
图1是本申请实施例提供的一种屏蔽膜的结构示意图,如图1所示,屏蔽膜包括第一膜层11、对比结构层12和电磁屏蔽层13。其中,电磁屏蔽层13的材料为具有良好屏蔽性能的导电性材料,能够实现有效的电磁干扰屏蔽,可选的,电磁屏蔽层13的材料可以为铜,在保证较低成本的同时,具有电气特性好、屏蔽性能高、传输质量高、信赖度佳等特性,当然电磁屏蔽层13的材料还可以为铝、银等金属材料,本实施例对此不进行限定。可选的,如图2所示,图2是本申请实施例提供的另一种屏蔽膜的结构示意图,屏蔽膜还可以包括胶膜层14,胶膜层14设置于电磁屏蔽层13远离第一膜层11的一侧,用于实现电磁屏蔽层13与线路板的连接。
第一膜层11用于对电磁屏蔽层13进行绝缘和支撑作用,在一定程度上阻 隔水氧入侵至电磁屏蔽层13,第一膜层11优选为黑色,或者深蓝色等灰度值与黑色更为接近的颜色,本实施例对第一膜层11的具体颜色不进行限定。可选的,第一膜层11可以包括环氧树脂、橡胶、改性环氧树脂、聚酰亚胺、聚氨酯类树脂、丙烯酸树脂、改性丙烯酸树脂、聚酯、聚苯硫醚、聚苯二甲酸乙二醇酸、液晶聚合物和油墨中的至少一种,本实施将上述材料中至少一种通过添加其他材料混合形成灰度值较低的深色。
可选的,第一膜层11的颜色可以为黑色;第一膜层11可以包括黑色聚酰亚胺和黑色油墨中的至少一种,黑色聚酰亚胺水气阻隔效果好,黑色油墨具有较强的阻燃效果,第一膜层11可以设置为黑色聚酰亚胺材料,也可以设置为黑色油墨材料,此外,第一膜层11可同时包括黑色聚酰亚胺和黑色油墨,以增强对电磁屏蔽层13的保护作用。可选的,为了适应电子产品的薄型化趋势,第一膜层11的厚度范围为0.5μm~40μm,从而尽量降低第一膜层11的厚度,可选的,第一膜层11的厚度可选取4μm,在具有良好的绝缘和保护性能的前提下,实现第一膜层11的纤薄化。
对比结构层12用于与第一膜层11形成明显的颜色或亮度差异,对比结构层12的颜色的灰度值大于第一膜层11的颜色的灰度值。本实施例采用灰度参数将彩色颜色转为高质量的灰度渐变色,以探测对比结构层12和第一膜层11亮度的对比度。灰度使用黑色调来表示各种颜色,也即采用黑色为基准色,将不同颜色用不同饱和度的黑色来显示。将黑色和白色之间划分成0~255种灰度。白色的灰度值为255,黑色的灰度值为0,本实施例中限定对比结构层12的颜色的灰度值大于第一膜层11的颜色的灰度值,优选的,可限定对比结构层12的颜色的灰度值与第一膜层11的颜色的灰度值差异较大。例如,对比结构层 12的颜色为银色,银色的灰度值较大,则对比结构层12的银色与第一膜层11的深色形成鲜明对比。
对比结构层12和第一膜层11位于电磁屏蔽层13的同一侧,并且对比结构层12和第一膜层11的设置顺序可变,例如,如图2所示,对比结构层12可设置于第一膜层11和电磁屏蔽层13之间,或者,如图3所示,图3是本申请实施例提供的另一种屏蔽膜的结构示意图,第一膜层11可设置于对比结构层12和电磁屏蔽层13之间。只要对比结构层12和第一膜层11相互叠加形成鲜明对比即可。无论对比结构层12和第一膜层11为图1中的设置顺序,还是图3中的设置顺序,位于最外侧的一层用于形成标识码的镂空图形,并且该镂空图形露出的另一层的颜色能够与该最外侧的一层形成较大亮度差异,使得标识码更加清晰,便于用户进行准确识别。具体的,如图2所示,当第一膜层11设置于最外侧时,则需要在第一膜层11上形成标识码的镂空图形,则第一膜层11的镂空图形露出较浅颜色(较高亮度)的对比结构层12,形成较为清晰的标识码。如图3所示,当对比结构层12设置于最外侧时,需要在对比结构层12上形成标识码的镂空图形,则对比结构层12上的镂空图形露出深色的第一膜层11,形成清晰的标识码。可选的,上述镂空图形可以通过激光烧蚀形成,例如,可采用紫外线激光和二氧化碳激光进行镂空图形的烧蚀。
可选的,对比结构层12的颜色的灰度值与第一膜层11的颜色的灰度值的差值大于或等于第一灰度阈值;第一灰度阈值大于或等于10,则对比结构层12的颜色的灰度值与第一膜层11的颜色的灰度值的差值至少为10,使得对比结构层12和第一膜层11之间形成较为明显的明暗差异,提高标识码识别装置对对比结构层12和第一膜层11形成的标识码识别的准确率。
为了进一步增大对比结构层12与第一膜层11的亮度差异,可限定上述第一灰度阈值为50,则对比结构层12的颜色的灰度值与第一膜层11的颜色的灰度值的差值至少为50,对比结构层12的颜色亮度较强,第一膜层11的颜色亮度较小,进一步增大对比结构层12和第一膜层11之间的明暗对比,提高对标识码的识别精度和准确度。
在上述实施例的基础上,本实施例可进一步限定第一灰度阈值为100,则对比结构层12的颜色的灰度值与第一膜层11的颜色的灰度值的差值至少为100,例如,若第一膜层11的颜色的灰度值0,对比结构层12的颜色的灰度值与第一膜层11的颜色的灰度值至少相差100,甚至相差255,则对比结构层12的灰度值可选取大于或等于100。灰度值相差255的情况是,对比结构层12和第一膜层11其中一个为纯黑,另一个为纯白,即两者的灰度值一个为255,另一个为0,亮度或颜色差异较大,进一步增强标识码的清晰度。
需要注意的是,本实施例中屏蔽膜通过设置有胶膜层14的一侧与印刷线路板贴合,用于将电子设备产生的干扰信号由电磁屏蔽层13迅速导出至印刷电路板的接地板或接地线上。图4是本申请实施例提供的另一种屏蔽膜的结构示意图,可选的,电磁屏蔽层13靠近胶膜层14的一侧可以经过粗化处理形成粗多个凸起结构131;凸起结构131用于刺穿胶膜层14与印刷线路板的接地端连接,凸起结构131能够实现电磁屏蔽层13与接地端之间的连接,并且凸起结构131使得电磁屏蔽层13与胶膜层14之间紧密贴合,避免电磁屏蔽层13与胶膜层14分离,此外,当胶膜层14的胶量不足时,会产生屏蔽膜与印刷电路板之间的分离,当胶膜层14的胶量太多时,容易使得印刷电路板的边缘产生溢胶情况,本实施例凸起结构131的设置使得屏蔽膜和印刷电路板压合时,能够将凸起结 构131顶起的溢胶挤压至胶膜层14的凹陷部位,增大电磁屏蔽层13和印刷电路板之间的容胶量,避免屏蔽膜与印刷电路板之间的剥离。
需要注意的是,在上述屏蔽膜的生产过程中,上述第一膜层11、对比结构层12、电磁屏蔽层13和胶膜层14均设置于载体膜上,载体膜对上述各个膜层进行支撑,当在载体膜上形成第一膜层11、对比结构层12和电磁屏蔽层13后,对电磁屏蔽层13上进行粗化处理,形成凸起结构131,并将胶膜层14压合至电磁屏蔽层13的凸起结构131上形成屏蔽膜的基础膜材。此后,需要将屏蔽膜的基础膜材从载体膜上剥离,并在屏蔽膜远离胶膜层14的一侧烧蚀形成标识码的镂空图形。
图5是本申请实施例提供的另一种屏蔽膜的结构示意图,本实施例可不选择将电磁屏蔽层13靠近胶膜层14的一侧可以经过粗化处理,可选的,可在胶膜层14内设置有多个导电粒子141;导电粒子141用于刺穿胶膜层14,以连接印刷电路板的接地端和电磁屏蔽层13。对比图4,图5中示出的胶膜层14内包括多个导电粒子141,导电粒子141团聚形成较大颗粒,较大颗粒能够刺穿胶膜层14使得印刷电路板的接地端和电磁屏蔽层13建立连接,则本实施例在制作过程不需要对电磁屏蔽层13上进行粗化处理,即可将胶膜层14与电磁屏蔽层13紧密贴合,从而形成屏蔽膜的基础膜材。
此外,也可先对电磁屏蔽层13靠近胶膜层14的一侧经过粗化处理形成凸起结构后再涂布具有导电粒子141的胶膜层14,如图6所示,图6是本申请实施例提供的另一种屏蔽膜的结构示意图,本实施例可将电磁屏蔽层13上进行粗化处理形成凸起结构131的同时,在胶膜层14内设置有多个导电粒子141,导电粒子141能够刺穿胶膜层14与凸起结构131电连接,从而进一步加强电磁屏 蔽层14与线路板地层的导通性,以及解决现有的因容胶量不足而造成的屏蔽膜与线路板分层的问题。
可选的,如图7所示,图7是本申请实施例提供的一种电磁屏蔽层的平面结构示意图,电磁屏蔽层13设有多个通孔132,有利于胶膜层在高温时的挥发物通过电磁屏蔽层13的通孔132进行排气,以避免在高温时胶膜层挥发物难以排出,从而避免了电磁屏蔽层13起泡分层造成电磁屏蔽膜与线路板的地层之间剥离,进而确保了电磁屏蔽膜接地并将干扰电荷导出。
可选的,通孔132可以规则或不规则地分布在电磁屏蔽层13上;其中,如图7所示,通孔132规则地分布在电磁屏蔽层13上,是指各个通孔132形状相同且均匀地分布在电磁屏蔽层13上;通孔132不规则地分布在电磁屏蔽层13上是指各个通孔132的形状各异且无序地分布在电磁屏蔽层13上。优选地,如图7所示,各个通孔132的形状相同,各个通孔132均匀分布在电磁屏蔽层13上。此外,通孔132可以是圆形通孔,还可以是其它任意形状的通孔,图7仅以通孔132是圆形通孔进行举例说明,但其他任何形状的通孔132都在本申请实施例的保护范围之内。
以下将依据第一膜层11和对比结构层12的排布顺序将屏蔽膜分两种类型进行详述:
第一种,继续参考图3,可选的,本实施中,对比结构层12可以设置于第一膜层11远离电磁屏蔽层13的一侧;对比结构层12形成标识码的镂空图形。如图3所示,本实施例中对比结构层12的材料可以为金属,该金属的颜色的灰度值大于第一膜层11的颜色的灰度值,并且其差值优选大于或等于10。需要注意的是,上述金属层可以包括金属单质和金属合金中的至少一种,本实施例 对此不进行限定。当对比结构层12为金属层时,当用户在金属层上形成了镂空图案后,可选的,在金属层远离电磁屏蔽层13的一侧设置一侧绝缘膜,且在该绝缘膜与标识码的镂空图形对应的位置形成有开口部,以露出标识码以供用户识别,从而防止金属层与外部电子元器件接触出现短路的情况。此外,若上述绝缘膜为无色透明的绝缘膜,则该绝缘膜可未设置上述开口部,同样能够露出标识码以供用户识别。
此外,可选的,对比结构层12可以为灰度值大于第一膜层11的胶层或油墨层。在对电磁屏蔽层13起到保护作用的同时,对比结构层12与镂空图形露出的第一膜层11形成清晰的标识码。本实施例中,上述胶层可以为热固胶。
可选的,对比结构层12可以为白色胶层或白色油墨层。本实施例中,对比结构层12为白色胶层或白色油墨层,则对比结构层12的颜色的灰度值为255,而第一膜层11的颜色优选为黑色,第一膜层11的颜色的灰度值为0,黑色与白色的对比较为强烈,容易形成更加清晰的标识码。此外,胶层或油墨层还可以为灰色、黄色等其他灰度值较高的颜色,本实施例对此不进行限定。
第二种,继续参考图2,可选的,第一膜层11可以设置于对比结构层12远离电磁屏蔽层13的一侧;第一膜层11形成标识码的镂空图形。可选的,对比结构层12可以为胶层或油墨层,且胶层或油墨层的颜色的灰度值大于第一膜层11的颜色的灰度值,并且该胶层或油墨层的颜色的灰度值优选大于或等于160。
可选的,对比结构层12可以为白色或无色的胶层;或者,对比结构层12为白色油墨层。对比结构层12的材料可选择为改性环氧树脂类、改性丙烯酸类、改性橡胶类、改性热塑性聚酰亚胺类、改性聚酯类、热塑性树脂、热固性树脂、 亚敏胶中的至少一种。本实施例中,对比结构层12为白色胶层或白色油墨层,则对比结构层12的颜色的灰度值为255,而第一膜层11的颜色的灰度值优选为0,黑色与白色的对比较为强烈,容易形成更加清晰的标识码。此外,胶层或油墨层还可以为灰色、黄色等其他灰度值较高的颜色,本实施例对此不进行限定。需要注意的是,当对比结构层12设置于第一膜层11和电磁屏蔽层13之间,对比结构层12可选用无色的胶层,无色胶层有效保护电磁屏蔽层13,防止电磁屏蔽层13暴露在镂空图形中。并且对比结构层12为无色,所以电磁屏蔽层13通过镂空图形露出,第一膜层11的黑色同样与电磁屏蔽层13的颜色形成对比,形成较为清晰的标识码,如电磁屏蔽层13选用材料为铜,则电磁屏蔽层13的颜色为红铜色,红铜色与黑色之间容易区分,通过无色的对比结构层12对铜进行有效保护,防止裸露在空气中被氧化而使得后续与第一膜层11之间颜色不容易区别。
可选的,对比结构层12还可以为金属层。该金属的颜色的灰度值大于第一膜层11的颜色的灰度值,并且该金属的颜色的灰度值优选大于或等于10。
可选的,对比结构层12的材料为镍、银、铂、钛、铝、钴和铬中的至少一种单质;或者,对比结构层的材料为镍、银、铂、钛、铝、钴和铬中的至少两种形成的合金;或者,对比结构层的材料为镍、银、铂、钛、铝、钴和铬中的至少两种所形成的合金之间的组合。容易理解的是,标识码越是黑白分明越好,因此对比结构层12的金属材料的颜色需要够浅,优选用银色、银白色的金属材料。本实施例选取镍、银、铂、钛、铝、钴和铬中的至少一种单质,或者镍、银、铂、钛、铝、钴和铬中的至少两种形成的合金形成对比结构层12,或者,对比结构层的材料为镍、银、铂、钛、铝、钴和铬中的至少两种所形成的合金 之间的组合。上述材料均为白色、银色或者接近银色的颜色,示例性的,本实施例可选取镍作为对比结构层12的材料,或镍铬合金作为对比结构层12的材料。此外,对比结构层12还可以为其他灰度值较低的浅色金属,本实施例对此不进行限定。
图8是本申请实施例提供的另一种屏蔽膜的结构示意图,可选的,对比结构层12可以包括第一金属层121和第二金属层122;第一金属层121通过溅射工艺形成在第一膜层11靠近电磁屏蔽层13的一侧;第二金属层122通过电镀工艺形成在第一金属层121远离第一膜层11的一侧。
除了灰度值的限制,本实施例对对比结构层12的平坦度也具有一定要求。因为对比结构层12表面越粗糙,对比结构层12表面的光线越暗哑,与第一膜层11之间分辨率降低,所以本实施可将对比结构层12分为两层,即,首先在第一膜层11上通过溅射工艺形成一层第一金属层121,溅射工艺形成一层致密且平整的金属表面,便于与第一膜层11形成对比,之后,在平整的第一金属层121上通过电镀工艺形成第二金属层122。可选的,第一金属层的121厚度范围可以为
Figure PCTCN2020114440-appb-000001
第二金属层122的厚度范围可以为0.1μm~10μm。可选的,若第二金属层122的厚度范围为0.2μm~0.4μm,则第二金属层122在单位面积内(1cm x 1cm)的阻值可以设置范围为15mΩ~200mΩ,优选可设置为30mΩ。
此外,除了溅射工艺,第一金属层121还可以通过其他的工艺,例如,化学镀、物理气相沉积、化学气相沉积、蒸发镀、溅射镀、电镀和混合镀中的一种或多种工艺制作形成,本实施例对第一金属层121的制作工艺不进行限定,可选的,第一金属层121优选采用溅射的工艺。
在图8所示出的实施例中,当要烧蚀形成标识码时,激光能量在第一膜层上形成缕空图案,从而使得第一金属层121的颜色裸露,因此第一金属层121的颜色对应的灰度值优选低于第二金属层122的颜色对应的灰度值,例如,可选择第一金属层121为Ag,而第二金属层122选择为Ni。
图9是本申请实施例提供的另一种屏蔽膜的结构示意图,可选的,第一金属层可以包括第一溅射金属层1211和第二溅射金属层1212;第一溅射金属层1211设置于第一膜层11和第二溅射金属层1212之间;第一溅射金属层1211的颜色的灰度值大于第二溅射金属层1212的颜色的灰度值。
本实施例可设置两层溅射金属层,因为实际在烧蚀第一膜层11形成标识码的镂空图形时,激光能量有可能将第一溅射金属层1211打穿,则可以通过第二溅射金属层1212增加保障,保持镂空图形露出的为平坦度较高的溅射金属层。此外,可设置第一溅射金属层1211的颜色的灰度值大于第二溅射金属层1212的颜色的灰度值,例如,可设置第一溅射金属层1211为银,则第二溅射金属层1212为镍,则银的金属表面能够与深色的第一膜层11形成鲜明的颜色对比,提高标识码的清晰度。
图10是本申请实施例提供的另一种屏蔽膜的结构示意图,可选的,对比结构层12还可以包括第二膜层15;第二膜层15设置于第一膜层11和第一金属层121之间;第二膜层15的颜色的灰度值与第一膜层11的颜色的灰度值的差值大于或等于第一灰度阈值;第一灰度阈值大于或等于10。第二膜层15设置于第一膜层11和第一金属层121之间,当第一金属层121包括第一溅射金属层和第二溅射金属层时,第二膜层15设置于第一膜层11和第一溅射金属层之间,从而进一步增强对第一金属层121的保护,示例性的,因为第二膜层15的设置, 完全避免了激光能量有可能将第一溅射金属层打穿的情况,对第一溅射金属层进行保护。则第二膜层15的颜色的灰度值同样需要大于第一膜层11的灰度值,并且第二膜层15的灰度值与第一膜层11的颜色的灰度值的差值优选为大于或等于第一灰度阈值;第一灰度阈值大于或等于10。则第二膜层15的颜色的灰度值与第一膜层11的颜色的灰度值的差值至少为10,使得第二膜层15和第一膜层11之间形成较为明显的明暗差异,提高标识码识别装置对第二膜层15和第一膜层11形成的标识码识别的准确率。优选的,上述第一灰度阈值可以为50或100,可进一步增大第二膜层15和第一膜层11之间的明暗对比,提高对标识码的识别精度和准确度。可选的,第二膜层15可以为白色或无色;第二膜层15的厚度范围可以为0.5μm~30μm。白色的第二膜层15与深色的第一膜层11对比较为强烈,容易形成更加清晰的标识码。并且第二膜层15可以为无色,使得第一金属层121的颜色能够透过第二膜层15由镂空图形露出。
在上述实施例的基础上,本申请实施例还提供了一种屏蔽膜,继续参考图1,包括:第一膜层11、对比结构层12和电磁屏蔽层13;
第一膜层11设置于电磁屏蔽层13的第一侧;
对比结构层12设置于电磁屏蔽层13的第一侧;
其中,对比结构层12的颜色的灰度值大于第一膜层11的颜色的灰度值;对比结构层12和第一膜层11中,距离电磁屏蔽层13较远的一层形成标识码的镂空图形。
本申请实施例中,屏蔽膜包括用于屏蔽电磁干扰的电磁屏蔽层,电磁屏蔽层的第一侧设置有第一膜层和对比结构层,可以将第一膜层设置于电磁屏蔽层 和对比结构层之间,也可将对比结构层设置于电磁屏蔽层和第一膜层之间,对比结构层的颜色的灰度值需要大于第一膜层的颜色的灰度值,使得对比结构层和第一膜层之间能够形成较为明显的明暗亮度对比。本实施例将对比结构层和第一膜层中距离电磁屏蔽层较远的一层形成标识码的镂空图形,使得在对比结构层和第一膜层的强烈的明暗或色彩的对比下,用户可获取清晰度较高的标识码,提高对标识码的识别精度和准确度,便于对标识码所标识的元器件或电子产品进行追溯。
可选的,标识码可以包括条形码、二维码和字符中的至少一种。标识码为标识元器件或电子产品的唯一对应的识别标志。标识码可包括数字、字母等字符图形,也可以为条形码或者二维码,本实施例的屏蔽膜可以包括上述条形码、二维码和字符中的至少一种,以对对应的元器件或电子产品进行标识。示例性的,屏蔽膜需要贴附在电子设备的印刷电路板上,则可在屏蔽膜与元器件对应的位置上设置元器件的标识码。屏蔽膜上可设置有多个标识码与多个元器件一一对应设置,从而解决电子产品因没有足够尺寸的钢板设置标识码,导致印刷的标识码不清晰的问题,有效提高了标识码的分辨率和识别精度。可选的,镂空图形通过激光烧蚀形成。例如,可采用紫外线激光和二氧化碳激光进行镂空图形的烧蚀。
需要注意的是,在烧蚀上述镂空图形时,可能存在两种情况:
第一种,仅将对比结构层12和第一膜层11中距离电磁屏蔽层13较远的一层烧穿形成标识码的镂空图形,而并未对距离电磁屏蔽层13较近的一层进行烧蚀,也即,镂空图形的烧蚀深度为:对比结构层12和第一膜层11中距离电磁屏蔽层13较远的一层的厚度。则镂空图形恰好露出未被刻蚀的距离电磁屏蔽层 13较近的一层结构,对比结构层12和第一膜层11形成标识码。
第二种,在对对比结构层12和第一膜层11中距离电磁屏蔽层13较远的一层烧穿形成标识码的镂空图形的同时,可能会对距离电磁屏蔽层13较近的一层进行部分烧蚀。本实施例中,会对距离电磁屏蔽层13较近的一层进行部分烧蚀,而并未完全烧蚀,在标识码烧蚀完成后,镂空图形同样能够露出对比结构层12和第一膜层11中距离电磁屏蔽层13较近的一层,使得对比结构层12和第一膜层11形成标识码。具体的,对比结构层12和第一膜层11中,距离电磁屏蔽层13较近的一层形成凹槽图形;镂空图形在电磁屏蔽层所在平面上的垂直投影与凹槽图形完全重合。将对比结构层12和第一膜层11中距离电磁屏蔽层13较近的一层部分烧蚀形成凹槽图形,并且因为上述凹槽图形与镂空图形是通过同一道工艺形成,则镂空图形在电磁屏蔽层所在平面上的垂直投影与凹槽图形完全重合。
可选的,继续参考图3,对比结构层12可以设置于第一膜层11远离电磁屏蔽层13的一侧;对比结构层12形成标识码的镂空图形。本实施例在烧蚀对比结构层12形成标识码的镂空图形时,可仅对对比结构层12进行烧蚀,而不对第一膜层11进行烧蚀;或者,在烧蚀对比结构层12形成标识码的镂空图形时,可同时对第一膜层11进行部分烧蚀形成凹槽图形,并且镂空图形在电磁屏蔽层所在平面上的垂直投影与凹槽图形完全重合。
如图3所示,本实施例中对比结构层12的材料可以为金属,该金属的颜色的灰度值大于第一膜层11的颜色的灰度值,并且该金属的颜色的灰度值与第一膜层11的颜色的灰度值的差值优选为大于或等于10。
可选的,对比结构层12可以为胶层或油墨层。对比结构层12可以为灰度 值大于第一膜层11的胶层或油墨层。在对电磁屏蔽层13起到保护作用的同时,对比结构层12与镂空图形露出的第一膜层11形成清晰的标识码。本实施例中,上述胶层可以为热固胶。
可选的,对比结构层12可以为白色胶层或白色油墨层。本实施例中,对比结构层12为白色胶层或白色油墨层,则对比结构层12的颜色的灰度值为255,而第一膜层11的颜色优选为黑色,第一膜层11的颜色的灰度值为0,黑色与白色的对比较为强烈,容易形成更加清晰的标识码。此外,胶层或油墨层还可以为灰色、黄色等其他灰度值较高的颜色,本实施例对此不进行限定。
可选的,继续参考图1,第一膜层11还可以设置于对比结构层12远离电磁屏蔽层13的一侧;第一膜层11形成标识码的镂空图形。本实施例在烧蚀第一膜层11形成标识码的镂空图形时,可仅对第一膜层11进行烧蚀,而不对对比结构层12进行烧蚀;或者,在烧蚀第一膜层11形成标识码的镂空图形时,可同时对对比结构层12进行部分烧蚀形成凹槽图形,并且镂空图形在电磁屏蔽层所在平面上的垂直投影与凹槽图形完全重合。可选的,对比结构层12可以为胶层、油墨层和金属层中一种或两种及以上的组合。
可选的,对比结构层12可以为胶层或油墨层,且胶层或油墨层的颜色的灰度值大于第一膜层11的颜色的灰度值,并且该胶层或油墨层的颜色的灰度值与第一膜层11的颜色的灰度值的差值优选为大于或等于10。可选的,对比结构层12可以为白色或无色的胶层;或者,对比结构层12为白色油墨层。对比结构层12的材料可选择为改性环氧树脂类、改性丙烯酸类、改性橡胶类、改性热塑性聚酰亚胺类、改性聚酯类、热塑性树脂、热固性树脂、亚敏胶中的至少一种。本实施例中,对比结构层12为白色胶层或白色油墨层,则对比结构层12 的颜色的灰度值为255,而第一膜层11的颜色的灰度值优选为0,黑色与白色的对比较为强烈,容易形成更加清晰的标识码。此外,胶层或油墨层还可以为灰色、黄色等其他灰度值较低的颜色,本实施例对此不进行限定。需要注意的是,当对比结构层12设置于第一膜层11和电磁屏蔽层13之间,对比结构层12可选用无色的胶层,无色胶层有效保护电磁屏蔽层13,防止电磁屏蔽层13暴露在镂空图形中。并且对比结构层12为无色,所以电磁屏蔽层13通过镂空图形露出,第一膜层11的黑色同样与电磁屏蔽层13的颜色形成对比,形成较为清晰的标识码,如电磁屏蔽层13选用材料为铜,则电磁屏蔽层13的颜色为红铜色,红铜色与黑色之间容易区分,通过无色的对比结构层12对铜进行有效保护,防止在裸露在空气中被氧化而使得后续与第一膜层11之间颜色不容易区别。
可选的,对比结构层12还可以为金属层。该金属的颜色的灰度值大于第一膜层11的颜色的灰度值,并且其差值优选为大于或等于10。可选的,对比结构层12的材料为镍、银、铂、钛、铝、钴和铬中的至少一种单质;或者,对比结构层的材料为镍、银、铂、钛、铝、钴和铬中的至少两种形成的合金;或者,对比结构层的材料为镍、银、铂、钛、铝、钴和铬中的至少两种所形成的合金之间的组合。容易理解的是,标识码越是黑白分明越好,因此对比结构层12的金属材料的颜色需要够浅,优选用银色、银白色的金属材料。本实施例选取镍、银、铂、钛、铝、钴和铬中的至少一种单质,或者镍、银、铂、钛、铝、钴和铬中的至少两种形成的合金形成对比结构层12,或者,对比结构层的材料为镍、银、铂、钛、铝、钴和铬中的至少两种所形成的合金之间的组合。上述材料均为白色、银色或者接近银色的颜色,示例性的,本实施例可选取镍作为对比结 构层12的材料,或镍铬合金作为对比结构层12的材料。此外,对比结构层12还可以为其他灰度值较低的浅色金属,本实施例对此不进行限定。
可选的,对比结构层12可以包括第一金属层121和第二金属层122;第一金属层121通过溅射工艺形成在第一膜层11靠近电磁屏蔽层13的一侧;第二金属层122通过电镀工艺形成在第一金属层121远离第一膜层11的一侧。
除了灰度值的限制,本实施例对对比结构层12的平坦度也具有一定要求。因为对比结构层12表面越粗糙,对比结构层12表面的光线越暗哑,与第一膜层11之间分辨率降低,所以本实施可将对比结构层12分为两层,即,首先在第一膜层11上通过溅射工艺形成一层第一金属层121,溅射工艺形成一层致密且平整的金属表面,便于与第一膜层11形成对比,之后,在平整的第一金属层121上通过电镀工艺形成第二金属层122。可选的,第一金属层的121厚度范围可以为
Figure PCTCN2020114440-appb-000002
第二金属层122的厚度范围可以为0.1μm~10μm。可选的,若第二金属层122的厚度范围为0.2μm~0.4μm,则第二金属层122在单位面积内(1cm x 1cm)的阻值可以设置范围为15mΩ~200mΩ,优选可设置为30mΩ。
在图7所示出的实施例中,当要烧蚀形成标识码时,激光能量在第一膜层上形成缕空图案,从而使得第一金属层的颜色裸露,因此第一金属层的颜色对应的灰度值优选低于第二金属层的颜色对应的灰度值,例如,可选择第一金属层为Ag,而第二金属层选择为Ni。
如图9所示,可选的,第一金属层可以包括第一溅射金属层1211和第二溅射金属层1212;第一溅射金属层1211设置于第一膜层11和第二溅射金属层1212之间;第一溅射金属层1211的颜色的灰度值大于第二溅射金属层1212的 颜色的灰度值。
本实施例可设置两层溅射金属层,因为实际在烧蚀第一膜层11形成标识码的镂空图形时,激光能量有可能将第一溅射金属层1211打穿,则可以通过第二溅射金属层1212增加保障,保持镂空图形露出的为平坦度较高的溅射金属层。此外,可设置第一溅射金属层1211的颜色的灰度值大于第二溅射金属层1212的颜色的灰度值,例如,可设置第一溅射金属层1211为银,则第二溅射金属层1212为镍,则银的金属表面能够与深色的第一膜层11形成鲜明的颜色对比,提高标识码的清晰度。
基于同一构思,本申请实施例还提供了一种线路板,如图11所示,图11是本申请实施例提供的一种线路板的结构示意图,线路板包括印刷电路板2以及本申请任意实施例提供的屏蔽膜1;屏蔽膜1的电磁屏蔽层远离第一膜层的一侧设置有胶膜层;屏蔽膜1的胶膜层的一侧贴附印刷电路板2设置。本实施例线路板包括本申请任意实施例提供的屏蔽膜的技术特征,具备本申请任意实施例提供的屏蔽膜的有益效果。
印刷电路板2集成有大量不同功能的元器件,本实施例中屏蔽膜1上与元器件相对应的位置可设置有该元器件的标识码。屏蔽膜1可整层覆盖上述印刷电路板,用于实现整层电磁屏蔽,屏蔽膜1也可以包括多块尺寸较小的子屏蔽膜,每个子屏蔽膜用于覆盖印刷电路板的对应区域,本实施例对此不进行限定。此外该线路板所处的电子设备的标识码也可以设置于屏蔽膜1上,示例性的,电子设备的标识码可设置于屏蔽膜1的边缘区域。
本申请实施例还提供一种电子设备。图12是本申请实施例提供的一种电子设备的结构示意图,如图12所示,本申请实施例提供的电子设备包括本申请任意实施例的线路板3。电子设备可以为如图12中所示的手机,也可以为电脑、电视机、智能穿戴设备等,本实施例对此不作特殊限定。
注意,上述仅为本申请的较佳实施例及所运用技术原理。本领域技术人员会理解,本申请不限于这里所述的特定实施例,对本领域技术人员来说能够进行各种明显的变化、重新调整和替代而不会脱离本申请的保护范围。因此,虽然通过以上实施例对本申请进行了较为详细的说明,但是本申请不仅仅限于以上实施例,在不脱离本申请构思的情况下,还可以包括更多其他等效实施例,而本申请的范围由所附的权利要求范围决定。

Claims (27)

  1. 一种屏蔽膜,其包括:第一膜层、对比结构层和电磁屏蔽层;
    所述第一膜层设置于所述电磁屏蔽层的第一侧;
    所述对比结构层设置于所述电磁屏蔽层的第一侧;
    其中,所述对比结构层的颜色的灰度值大于所述第一膜层的颜色的灰度值。
  2. 根据权利要求1所述的屏蔽膜,其还包括:胶膜层;
    所述胶膜层设置于所述电磁屏蔽层远离所述第一膜层的一侧。
  3. 根据权利要求1所述的屏蔽膜,其中,所述第一膜层包括环氧树脂、橡胶、改性环氧树脂、聚酰亚胺、聚氨酯类树脂、丙烯酸树脂、改性丙烯酸树脂、聚酯、聚苯硫醚、聚苯二甲酸乙二醇酸、液晶聚合物和油墨中的至少一种;
    所述第一膜层的厚度范围为0.5μm~40μm。
  4. 根据权利要求1所述的屏蔽膜,其中,所述对比结构层的颜色的灰度值与所述第一膜层的颜色的灰度值的差值大于或等于第一灰度阈值,所述第一灰度阈值大于或等于10。
  5. 根据权利要求4所述的屏蔽膜,其中,所述第一灰度阈值为50。
  6. 根据权利要求4所述的屏蔽膜,其中,所述第一灰度阈值为100。
  7. 根据权利要求1所述的屏蔽膜,其中,所述对比结构层设置于所述第一膜层远离所述电磁屏蔽层的一侧。
  8. 根据权利要求7所述的屏蔽膜,其中,所述对比结构层为胶层或油墨层。
  9. 根据权利要求8所述的屏蔽膜,其中,所述对比结构层为白色胶层或白色油墨层。
  10. 根据权利要求1所述的屏蔽膜,其中,所述第一膜层设置于所述对比结构层远离所述电磁屏蔽层的一侧。
  11. 根据权利要求10所述的屏蔽膜,其中,所述对比结构层为胶层或油墨层。
  12. 根据权利要求11所述的屏蔽膜,其中,所述对比结构层为白色或无色的胶层;或者,所述对比结构层为白色油墨层。
  13. 根据权利要求7或10所述的屏蔽膜,其中,所述对比结构层为金属层。
  14. 根据权利要求13所述的屏蔽膜,其中,所述对比结构层的材料为镍、银、铂、钛、铝、钴和铬中的至少一种单质;或者,所述对比结构层的材料为镍、银、铂、钛、铝、钴和铬中的至少两种形成的合金;或者,对比结构层的材料为镍、银、铂、钛、铝、钴和铬中的至少两种所形成的合金之间的组合。
  15. 根据权利要求13所述的屏蔽膜,其中,所述对比结构层包括至少两层金属层。
  16. 根据权利要求13所述的屏蔽膜,其中,所述对比结构层还包括:第二膜层;所述第二膜层设置于所述第一膜层和所述金属层之间;
    所述第二膜层的颜色的灰度值与所述第一膜层的颜色的灰度值的差值大于或等于第一灰度阈值;所述第一灰度阈值大于或等于10。
  17. 根据权利要求16所述的屏蔽膜,其中,所述第二膜层为白色或无色;所述第二膜层的厚度范围为0.5μm~30μm。
  18. 根据权利要求2所述的屏蔽膜,其中,所述电磁屏蔽层靠近所述胶膜层的一侧经过粗化处理形成有多个凸起结构;
    所述凸起结构用于刺穿所述胶膜层与印刷线路板的接地端连接。
  19. 根据权利要求2或18所述的屏蔽膜,其中,所述胶膜层内设置有多个导电粒子;
    所述导电粒子用于刺穿所述胶膜层,以连接印刷电路板的接地端和所述电磁屏蔽层。
  20. 根据权利要求1所述的屏蔽膜,其中,所述电磁屏蔽层设有多个通孔。
  21. 一种屏蔽膜,其包括:第一膜层、对比结构层和电磁屏蔽层;
    所述第一膜层设置于所述电磁屏蔽层的第一侧;
    所述对比结构层设置于所述电磁屏蔽层的第一侧;
    其中,所述对比结构层的颜色的灰度值大于所述第一膜层的颜色的灰度值;所述对比结构层和所述第一膜层中,距离所述电磁屏蔽层较远的一层形成标识码的镂空图形。
  22. 根据权利要求21所述的屏蔽膜,其中,所述对比结构层和所述第一膜层中,距离所述电磁屏蔽层较近的一层形成凹槽图形;所述镂空图形在所述电磁屏蔽层所在平面上的垂直投影与所述凹槽图形完全重合。
  23. 根据权利要求21或22所述的屏蔽膜,其中,所述对比结构层设置于所述第一膜层远离所述电磁屏蔽层的一侧;所述对比结构层形成所述标识码的镂空图形。
  24. 根据权利要求23所述的屏蔽膜,其中,所述对比结构层为胶层或油墨层。
  25. 根据权利要求21或22所述的屏蔽膜,其中,所述第一膜层设置于所述对比结构层远离所述电磁屏蔽层的一侧;所述第一膜层形成所述标识码的镂空图形。
  26. 根据权利要求25所述的屏蔽膜,其中,所述对比结构层为胶层、油墨层和金属层中一种或两种及以上的组合。
  27. 一种线路板,其包括:印刷电路板以及如权利要求1-26任一项所述的屏蔽膜;所述屏蔽膜的电磁屏蔽层远离第一膜层的一侧设置有胶膜层;
    所述屏蔽膜的胶膜层的一侧贴附所述印刷电路板设置。
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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005277228A (ja) * 2004-03-25 2005-10-06 Mitsui Chemicals Inc 透明電磁波遮蔽体およびその用途
CN101290533A (zh) * 2008-06-03 2008-10-22 福建省石狮市通达电器有限公司 用于笔记本电脑外盖的覆盖膜
CN101513782A (zh) * 2009-01-13 2009-08-26 东莞市万丰纳米材料有限公司 电磁波屏蔽材料
CN102711426A (zh) * 2012-06-12 2012-10-03 昆山市飞荣达电子材料有限公司 电磁屏蔽型面膜标签
CN205454368U (zh) * 2015-12-24 2016-08-10 昆山市飞荣达电子材料有限公司 电磁屏蔽型印刷标签
CN206506768U (zh) * 2017-01-16 2017-09-19 东莞市道诚绝缘材料有限公司 四级连续高效屏蔽膜
CN108323143A (zh) * 2018-03-14 2018-07-24 广州方邦电子股份有限公司 电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法
CN207885103U (zh) * 2018-01-24 2018-09-18 中山国安火炬科技发展有限公司 一种电磁波屏蔽膜

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4288235B2 (ja) * 2002-08-08 2009-07-01 大日本印刷株式会社 電磁波遮蔽用シート
WO2005022971A1 (ja) * 2003-09-01 2005-03-10 Dai Nippon Printing Co., Ltd. プラズマディスプレイ用電磁波シールドフィルム
JP4386273B2 (ja) * 2004-08-31 2009-12-16 大日本印刷株式会社 画像表示装置
TWI403761B (zh) * 2005-02-15 2013-08-01 Fujifilm Corp 透光性導電性膜之製法
KR100812345B1 (ko) * 2006-03-08 2008-03-11 삼성코닝정밀유리 주식회사 디스플레이 필터 및 이를 포함하는 디스플레이 장치
JP2008276220A (ja) * 2007-04-27 2008-11-13 Samsung Sdi Co Ltd フィルタ、およびプラズマディスプレイ装置
DE102009026834A1 (de) * 2008-06-11 2009-12-24 Samsung Corning Precision Glass Co., Ltd., Gumi Filter und Anzeigevorrichtung mit demselben
CN103763893B (zh) * 2014-01-14 2016-04-13 广州方邦电子股份有限公司 电磁波屏蔽膜以及包含屏蔽膜的线路板的制作方法
CN108323144B (zh) * 2018-03-14 2020-07-28 广州方邦电子股份有限公司 电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005277228A (ja) * 2004-03-25 2005-10-06 Mitsui Chemicals Inc 透明電磁波遮蔽体およびその用途
CN101290533A (zh) * 2008-06-03 2008-10-22 福建省石狮市通达电器有限公司 用于笔记本电脑外盖的覆盖膜
CN101513782A (zh) * 2009-01-13 2009-08-26 东莞市万丰纳米材料有限公司 电磁波屏蔽材料
CN102711426A (zh) * 2012-06-12 2012-10-03 昆山市飞荣达电子材料有限公司 电磁屏蔽型面膜标签
CN205454368U (zh) * 2015-12-24 2016-08-10 昆山市飞荣达电子材料有限公司 电磁屏蔽型印刷标签
CN206506768U (zh) * 2017-01-16 2017-09-19 东莞市道诚绝缘材料有限公司 四级连续高效屏蔽膜
CN207885103U (zh) * 2018-01-24 2018-09-18 中山国安火炬科技发展有限公司 一种电磁波屏蔽膜
CN108323143A (zh) * 2018-03-14 2018-07-24 广州方邦电子股份有限公司 电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法

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