WO2022010108A1 - Appareil de dépôt - Google Patents

Appareil de dépôt Download PDF

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Publication number
WO2022010108A1
WO2022010108A1 PCT/KR2021/006971 KR2021006971W WO2022010108A1 WO 2022010108 A1 WO2022010108 A1 WO 2022010108A1 KR 2021006971 W KR2021006971 W KR 2021006971W WO 2022010108 A1 WO2022010108 A1 WO 2022010108A1
Authority
WO
WIPO (PCT)
Prior art keywords
heating wire
heater
crucible
cover
bracket
Prior art date
Application number
PCT/KR2021/006971
Other languages
English (en)
Korean (ko)
Inventor
문병준
김선기
조영수
이용환
Original Assignee
엘지전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지전자 주식회사 filed Critical 엘지전자 주식회사
Priority to CN202180054813.7A priority Critical patent/CN116057198A/zh
Publication of WO2022010108A1 publication Critical patent/WO2022010108A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material

Definitions

  • the present invention relates to a deposition apparatus, and to a deposition apparatus for depositing a deposition material as an object to be deposited.
  • Deposition is a method of coating gaseous particles with a thin solid film on the surface of an object such as metal or glass.
  • an OLED display panel manufacturing process includes a process of depositing an organic material on a substrate such as a glass substrate in a vacuum state.
  • the deposition process includes a process of heating a crucible in which the organic material is accommodated to evaporate the organic material in a gaseous state, and a process in which the gaseous organic material passes through a nozzle and is deposited on a substrate.
  • the deposition apparatus may install a heater for heating the crucible outside the outer circumference of the crucible.
  • An example of an evaporation source of a thin film deposition apparatus having a heater is disclosed in Korean Patent Publication No. 10-2002316 B1 (published on July 22, 2019), and an inner container in which an evaporation material is contained and a first flange is formed at the top; an outer container into which the inner container is inserted and a second flange formed on the upper end; a heater installed to surround the outer circumferential surface of the outer container and heating the inner container through heating of the outer container to evaporate the evaporation material contained in the inner container; a heat-blocking unit having an accommodating space to accommodate the external container and the heater, the upper side being opened, and blocking the heat generated by the heater from being transmitted to the outside; It is supported and installed on the upper end of the heat-blocking part to support the bottom surface of the first flange of the inner container, protrudes outward from the edge of the first flange, and crosses the first flange from the inner container at the protruding protrusion It includes a container support ring formed with a
  • the present invention relates to a deposition apparatus that prevents the conductive gas from being deposited on a hot wire with a simple structure when the conductive gas leaks.
  • the deposition apparatus includes a crucible in which a metal material is contained, a reflector surrounding the outer periphery of the crucible, a heater bracket installed in the reflector, a heating wire fixed to the heater bracket, and an insulator disposed between the heating wire and the crucible It may include a heated cover.
  • the heating wire cover may have a groove formed on the outer circumferential surface in which the heating wire is inserted and accommodated.
  • the groove may be elongated in the vertical direction.
  • the heating wire cover may be seated on the heater bracket.
  • a plurality of heater brackets may be spaced apart in the vertical direction.
  • the heating wire cover may include a top cover disposed above the uppermost heater bracket and a unit cover disposed between a pair of adjacent heater brackets.
  • the top cover and the unit cover may be spaced apart from each other in the vertical direction.
  • the deposition apparatus may further include a spacer covering between the upper portion of the reflector and the upper portion of the top cover.
  • the heating wire cover may have a curved inner circumferential surface and may be made of a ceramic material.
  • the heating wire may include a plurality of unit heating wires that are long in the vertical direction and spaced apart in the horizontal direction, and return heating wires connecting adjacent unit heating wires.
  • the unit heating wire may be accommodated by being inserted into the groove.
  • the non-conductive hot wire cover prevents the conductive gas evaporated from the metal material from flowing to the hot wire, and can minimize a short circuit that may occur when the conductive gas is deposited on the hot wire.
  • the heating wire is inserted and accommodated in the heating wire cover, exposure of the heating wire can be minimized.
  • the heating wire cover is seated and supported on the heater bracket, more compactness is possible when the heating wire cover is positioned inside the heater bracket.
  • top cover, the heater bracket, and the unit cover may protect the crucible.
  • the spacer covers between the upper part of the reflector and the upper part of the top cover, so that the structure is simple.
  • FIG. 1 is a cross-sectional view showing a deposition apparatus according to the present embodiment
  • FIG. 2 is a partially cut-away perspective view showing a crucible and a heating wire and a heating wire cover according to the present embodiment
  • FIG 3 is a partially cut-away perspective view showing a crucible, a heating wire, a heater bracket, and a placer according to the present embodiment.
  • FIG. 1 is a cross-sectional view illustrating a deposition apparatus according to this embodiment
  • FIG. 2 is a partially cut-away perspective view showing a crucible, a hot wire, and a hot wire cover according to this embodiment
  • FIG. 3 is a crucible and a hot wire according to this embodiment A partially cut-away perspective view showing the heater bracket and the placer.
  • the deposition apparatus includes a crucible 2 having a space S1 formed therein, and a nozzle plater 10 covering the space S1.
  • the crucible 2 may accommodate the deposition raw material 8 in the space S1 .
  • the deposition raw material 8 accommodated in the crucible 2 may be evaporated as a deposition material.
  • the deposition raw material 8 may be a metal material, and the crucible 2 may contain a metal material.
  • the deposition raw material 8 may be used as the deposition raw material 8 , and the deposition raw material 8 may be determined according to the structure of the OLED.
  • the deposition raw material 8 is a metal material such as Ag or Mg
  • the deposition material may be a conductive gas.
  • the crucible 2 may have a cross-sectional shape formed in a cup shape with an open upper surface.
  • the crucible 2 may include a cover 6 .
  • the cover part 6 may protrude upward from the spacer 90 to be described later in the crucible 2 , and may be seated on the upper surface of the spacer 90 .
  • the cover part 6 may protrude outward in the horizontal direction from the upper end of the crucible (2).
  • the nozzle plater 10 may have a plate shape.
  • the nozzle plate 10 may be provided with a nozzle 12 .
  • the nozzle 12 may be integrally formed with the nozzle plate 10 , and may be detachably coupled to the nozzle plate 10 .
  • the nozzle 12 When the nozzle 12 is integrally formed with the nozzle plate 10 , it may protrude from the upper surface of the nozzle plate 10 .
  • the nozzle 12 When the nozzle 12 is detachably coupled to the nozzle plate 10 , it may be coupled to the nozzle fastener 13 formed in the nozzle plate 10 .
  • the nozzle 12 may be detachably coupled by being screwed to the nozzle fastener 13 .
  • the assembly of the crucible 2 and the nozzle plater 10 configured as described above can spray the conductive gas (ie, the deposition material) evaporated from the deposition raw material 8 to the nozzle 12 , and to the nozzle 12 .
  • the sprayed conductive gas may be deposited in the form of a thin film on a substrate (not shown).
  • the assembly of the crucible 2 and the nozzle plater 10 may constitute a point evaporation source 20 capable of depositing a metal thin film on a substrate.
  • the deposition apparatus may include a heater 40 capable of heating the point evaporation source 20 and a reflector 50 surrounding the heater 40 .
  • the deposition apparatus further includes a cooler 58 in which the point evaporation source 20 , the heater 40 , and the reflector 50 are accommodated.
  • the heater 40 may heat the crucible 2 from the outside of the crucible 2 .
  • the heater 40 may be disposed on the outer periphery of the crucible (2).
  • the heater 40 includes an upper heater 42 and a lower heater 44 .
  • the upper heater 42 may be disposed on the outer periphery of the upper portion of the crucible (2) to heat the upper portion of the crucible (2).
  • the lower heater 44 may be disposed on the outer periphery of the lower portion of the crucible 2 to heat the lower portion of the crucible 2 .
  • the upper heater 42 and the lower heater 44 may be vertically spaced apart. One of the upper heater 42 and the lower heater 44 may be formed to be longer than the other one.
  • the upper heater 42 and the lower heater 44 may have a different distance from the crucible 2 . Any one of the upper heater 42 and the lower heater 44 may be closer to the crucible 2 than the other.
  • the upper heater 42 and the lower heater 44 may be supported by the heater bracket 60 .
  • a plurality of heater brackets 60 may be provided.
  • the heater bracket supporting the upper heater 42 and the heater bracket supporting the lower heater 44 may have different positions.
  • the reflector 50 may surround the outer periphery of the crucible (2).
  • the reflector 50 may be spaced apart from the crucible 2 .
  • a heater accommodating space S2 may be formed between the reflector 50 and the crucible 2 .
  • the heater accommodating space S2 may be formed between the outer circumferential surface of the crucible 2 and the inner circumferential surface of the reflector 50 .
  • the reflector 50 may surround the outer periphery of the crucible 2 and the heater 40 .
  • the cooler 58 may block heat (ie, radiant heat) emitted by the heater 40 from being emitted to the outside of the deposition apparatus. Heat radiated from the heater 40 may be collected in the center of the heater accommodating space S2.
  • An accommodating space is formed in the cooler 58 , and a reflector 50 and a heater 40 may be disposed together with the crucible 2 in the accommodating space of the cooler 58 .
  • the cooler 58 may include a refrigerant tube or refrigerant channel through which a refrigerant such as cooling water passes.
  • the cooler 58 includes a coolant block comprising coolant tubes or coolant channels.
  • the heater 40 may include a heater bracket 60 installed on the reflector 50 and a heating wire 70 supported by the heater bracket 60 .
  • the heater bracket 60 may be disposed in a ring shape as a whole.
  • the heater bracket 60 may be disposed outside the outer circumference of the crucible (2).
  • a plurality of heater brackets 60 may be spaced apart from each other in the vertical direction.
  • the heater bracket 60 may include a guide bracket 62 and a ceramic bracket 64 .
  • the guide bracket 62 may be spaced apart from the crucible 2 .
  • the guide bracket 62 and the crucible 2 may be spaced apart from each other in a horizontal direction.
  • the guide bracket 62 may determine the position of the heating wire 70 from the outside of the heating wire 70 .
  • the outer surface of the heating wire 70 may be in contact with the guide bracket 62 .
  • the guide bracket 62 may be an outer bracket disposed outside the ceramic bracket 64 .
  • the guide bracket 62 may support the heating wire 70 from the outside of the heating wire 70 so that the heating wire 70 is not deformed in a radially outward direction.
  • the ceramic bracket 64 may be located inside the guide bracket 62 .
  • the ceramic bracket 64 may be an inner bracket.
  • the ceramic bracket 64 may be made of a ceramic material capable of increasing the amount of radiant heat emitted by the heating wire 70 .
  • the ceramic bracket 64 may be disposed between the guide bracket 62 and the crucible 2 .
  • the ceramic bracket 64 may prevent deformation of the heating wire 70 .
  • the ceramic bracket 64 may support the heating wire 70 inside the heating wire 70 so that the heating wire 70 is not deformed in a radially inward direction.
  • a unit heater receiving groove 66 for accommodating the unit heating wire 72 of the heating wire 70 in a 1:1 ratio may be formed between the guide bracket 62 and the ceramic bracket 64 .
  • One unit heating wire 72 may be accommodated by being inserted into one unit heater accommodating groove 66 .
  • the unit heater accommodating groove 66 may be opened in the vertical direction.
  • a unit heater receiving groove 66 may be formed in the ceramic bracket 64 .
  • the unit heater accommodating groove 66 and protrusions may be alternately formed in the circumferential direction.
  • the unit heater receiving groove 66 and the protrusion may be formed on the outer peripheral surface of the ceramic bracket 64 .
  • the protrusion may have a contact end in contact with the inner circumference of the guide bracket 62 .
  • the heating wire 70 may be supported by the heater bracket 60 , and may be fixed by the heater bracket 60 .
  • the heating wire 70 may be erected in a vertical direction.
  • the heating wire 70 may be formed of a conductive metal material having resistance.
  • the heating wire 70 may be thermally deformed and thermally expanded.
  • the heating wire 70 may have a zigzag shape.
  • the heating wire 70 may include a plurality of unit heating wires 72 that are long in the vertical direction and spaced apart in the horizontal direction, and return heating wires connecting the adjacent unit heating wires 72 .
  • the plurality of unit heating wires 72 may be parallel, and a gap may be formed therebetween.
  • the gap may be formed in a size that does not contact each other even if the plurality of unit heating wires 72 are thermally deformed and thermally expanded.
  • the return heating wire may include an upper return heating wire 73 connecting one of the plurality of unit heating wires 72 to the other, and a lower liter heating wire 74 connecting another one of the plurality of unit heating wires 72 to another. have.
  • Each of the plurality of unit heating wires 72 and the plurality of return heating wires 73 and 74 may have a sheet shape or a band shape.
  • the plurality of unit heating wires 72 may have a vertical long straight shape.
  • the plurality of return heating wires 73 and 74 may have a 'U' shape.
  • a cross-sectional shape of each of the plurality of unit heating wires 72 and the plurality of return heating wires 73 and 74 may be a circular rod shape.
  • the hot wire 70 may be in the order of one unit hot wire 72 , an upper return hot wire 73 , another unit hot wire 72 , and a lower return hot wire 74 .
  • the deposition apparatus may further include a hot wire cover 80 which is disposed between the hot wire 70 and the crucible 2 and is an insulator.
  • the heating wire cover 80 may be a non-conductive bracket formed of a non-conductive material.
  • the heating wire cover 80 is positioned between the inner circumference of the reflector 50 and the outer circumference of the crucible 2 , and may be formed to wrap the heating wire 70 .
  • the heating wire cover 80 may be a ceramic that can increase the amount of radiant heat emitted by the heating wire 70 .
  • the inner circumferential surface 82 of the heated wire cover 80 may have a curved shape, and the inner circumferential surface 82 of the heated wire cover 80 may be spaced apart from the outer circumference of the crucible 2 .
  • the heating wire cover 80 may have a hollow cylindrical shape as a whole.
  • the heating wire cover 80 may function as a heating wire housing protecting the heating wire 70 .
  • the heating wire cover 80 may be formed with a groove 84 in which the heating wire 70 is inserted and accommodated on the outer circumferential surface.
  • the groove 84 may be long in the vertical direction.
  • the heating wire cover 80 may be seated on the heater bracket 60 .
  • the lower end of the heating wire cover 80 may be seated on the heater bracket 60 .
  • the lower end of the heating wire cover 80 may be seated on the upper surface of the ceramic bracket 64 .
  • the heating wire cover 80 may include a top cover 86 disposed above the uppermost heater bracket 60 and a unit cover 88 disposed between a pair of adjacent heater brackets 60 .
  • the top cover 86 and the unit cover 88 may be spaced apart from each other in the vertical direction.
  • the unit cover 88 may be located below the top cover 86 .
  • the deposition apparatus may further include a spacer 90 covering an upper portion of the reflector 50 and an upper portion of the top cover 86 .
  • the spacer 90 may contact the upper end of the reflector 50 and the upper end of the top cover 86 , respectively.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

La présente invention concerne un appareil de dépôt qui peut comprendre : un creuset dans lequel un matériau métallique est placé ; un réflecteur pour couvrir la circonférence externe du creuset ; un support de chauffage disposé sur le réflecteur ; un fil chauffant fixé au support de dispositif de chauffage ; et une couverture de fil chauffant qui est placée entre le fil et le creuset et qui est un non-conducteur, et, pendant la fuite de gaz conducteur, la structure simple de couverture de fil chauffant peut empêcher le gaz conducteur d'être déposé sur le fil chauffant. De plus, une rainure dans laquelle le fil chauffant est inséré et reçu peut être formée sur la surface circonférentielle externe de la couverture de fil chauffant.
PCT/KR2021/006971 2020-07-10 2021-06-03 Appareil de dépôt WO2022010108A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202180054813.7A CN116057198A (zh) 2020-07-10 2021-06-03 沉积装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2020-0085658 2020-07-10
KR1020200085658A KR102616353B1 (ko) 2020-07-10 2020-07-10 증착 장치

Publications (1)

Publication Number Publication Date
WO2022010108A1 true WO2022010108A1 (fr) 2022-01-13

Family

ID=79553293

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2021/006971 WO2022010108A1 (fr) 2020-07-10 2021-06-03 Appareil de dépôt

Country Status (3)

Country Link
KR (1) KR102616353B1 (fr)
CN (1) CN116057198A (fr)
WO (1) WO2022010108A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060028181A (ko) * 2004-09-24 2006-03-29 삼성에스디아이 주식회사 증착 장치
KR20130039078A (ko) * 2011-10-11 2013-04-19 주식회사 원익아이피에스 기판처리장치 및 그에 사용되는 히터 조립체
KR101615913B1 (ko) * 2014-11-12 2016-05-13 에스엔유 프리시젼 주식회사 박막증착장치
KR101752277B1 (ko) * 2016-11-23 2017-07-11 삼성에스디에스 주식회사 Ｏｌｅｄ 증착용 히터의 소스 누출 방지 구조
KR20200079830A (ko) * 2018-12-26 2020-07-06 공주대학교 산학협력단 박막 증착용 진공 증발원

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100402334B1 (ko) 2000-06-23 2003-10-22 환인제약 주식회사 알프로스타딜 외용제

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060028181A (ko) * 2004-09-24 2006-03-29 삼성에스디아이 주식회사 증착 장치
KR20130039078A (ko) * 2011-10-11 2013-04-19 주식회사 원익아이피에스 기판처리장치 및 그에 사용되는 히터 조립체
KR101615913B1 (ko) * 2014-11-12 2016-05-13 에스엔유 프리시젼 주식회사 박막증착장치
KR101752277B1 (ko) * 2016-11-23 2017-07-11 삼성에스디에스 주식회사 Ｏｌｅｄ 증착용 히터의 소스 누출 방지 구조
KR20200079830A (ko) * 2018-12-26 2020-07-06 공주대학교 산학협력단 박막 증착용 진공 증발원

Also Published As

Publication number Publication date
KR20220007434A (ko) 2022-01-18
CN116057198A (zh) 2023-05-02
KR102616353B1 (ko) 2023-12-26

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