WO2022009700A1

WO2022009700A1 - Liquid supply device and polishing device

Info

Publication number: WO2022009700A1
Application number: PCT/JP2021/024136
Authority: WO
Inventors: 都章山口; 壮一磯部; 健史新海; 大吉成; 元成田村
Original assignee: 株式会社荏原製作所
Priority date: 2020-07-06
Filing date: 2021-06-25
Publication date: 2022-01-13
Also published as: JP2022014055A; TW202206227A

Abstract

This liquid supply device comprises: a rocking arm that can horizontally rock the upper side of a polishing table; a slurry tube that extends in the longitudinal direction of the rocking arm and discharges slurry onto the polishing table from a slurry discharge port at a tip section thereof; and a plurality of spray nozzles which are provided to be aligned in the longitudinal direction of the rocking arm and spray a cleaning fluid onto the polishing table. The spray nozzles positioned at the tip section of the rocking arm are provided obliquely so as to be capable of cleaning a drop position of slurry onto the polishing table, the slurry being discharged from the slurry discharge nozzles.

Description

Liquid supply equipment and polishing equipment

This disclosure relates to a liquid supply device and a polishing device.

In recent years, as the integration of semiconductor devices has progressed, the wiring of circuits has become finer and the distance between wirings has become narrower. In the manufacture of semiconductor devices, many types of materials are repeatedly formed on a silicon wafer in the form of a film to form a laminated structure. In order to form this laminated structure, a technique for flattening the surface of the wafer is important. As a means for flattening the surface of such a wafer, a polishing apparatus (also referred to as a chemical mechanical polishing apparatus) for performing chemical mechanical polishing (CMP) is widely used.

A chemical mechanical polishing (CMP) device generally includes a polishing table to which a polishing pad is attached, a top ring (polishing head) for holding a wafer, and a slurry ejection nozzle for supplying a polishing liquid (slurry) onto the polishing pad. I have. While supplying the polishing liquid onto the polishing pad from the slurry discharge nozzle, the wafer is pressed against the polishing pad by the top ring, and the top ring and the polishing table are moved relative to each other to polish the wafer and flatten its surface. ..

After polishing the wafer, particles such as polishing debris and abrasive grains contained in the polishing liquid remain on the polishing pad. Therefore, after polishing the wafer, a mist-like cleaning fluid (liquid or a mixture of liquid and gas) is polished from an atomizer having at least one injection nozzle that injects liquid or a mixed fluid of liquid and gas toward the polishing pad. It is sprayed onto the pad to remove foreign matter on the polishing pad.

In the conventional CMP device, it is necessary to arrange the slurry discharge nozzle at a height higher than the atomizer so that the slurry discharge nozzle provided at the tip of the swing arm does not interfere with the atomizer arranged on the polishing pad. there were. Therefore, when the slurry is discharged from the slurry discharge nozzle while swinging the swing arm, the position where the slurry is dropped tends to shift, and it is difficult to drop the slurry required for polishing the wafer at the optimum timing and position. Met.

Japanese Patent Application Laid-Open No. 2018-6549 describes that the swing arm is configured to be rotatable around a horizontal axis extending in the horizontal direction, and is a swing arm when the slurry discharge nozzle is moved between the slurry drop position and the retracted position. Discloses a technique for retracting a slurry discharge nozzle above the atomizer by rotating the slurry around a horizontal axis.

It is desired to provide a liquid supply device and a polishing device that can reduce the misalignment of the dropping position of the slurry required for polishing the wafer.

The liquid supply device according to one aspect of the present disclosure is
A swing arm that can swing horizontally above the polishing table,
A slurry tube extending along the longitudinal direction of the swing arm and discharging slurry onto the polishing table from a slurry discharge port at the tip thereof.
A plurality of injection nozzles provided side by side along the longitudinal direction of the swing arm to inject a cleaning fluid onto the polishing table.
Equipped with
The slurry discharge port is positioned at the tip of the swing arm.
The injection nozzle located at the tip of the swing arm is diagonally provided so that the dropping position of the slurry discharged from the slurry discharge port on the polishing table can be washed.
The polishing device according to one aspect of the present disclosure includes a liquid supply device.
The liquid supply device is
A swing arm that can swing horizontally above the polishing table,
A slurry tube extending along the longitudinal direction of the swing arm and discharging slurry onto the polishing table from a slurry discharge port at the tip thereof.
A plurality of injection nozzles provided side by side along the longitudinal direction of the swing arm to inject a cleaning fluid onto the polishing table.
Have,
The slurry discharge port is positioned at the tip of the swing arm.
The injection nozzle located at the tip of the swing arm is diagonally provided so that the dropping position of the slurry discharged from the slurry discharge port on the polishing table can be washed.

FIG. 1 is a plan view showing a schematic configuration of a polishing apparatus according to an embodiment. FIG. 2 is an enlarged perspective view showing a liquid supply device included in the polishing device shown in FIG. 1. FIG. 3 is a vertical sectional view of the liquid supply device shown in FIG. FIG. 4 is a front view of the swing arm of the liquid supply device shown in FIG. 2 as viewed from the tip side. FIG. 5 is a view of the tip of the swing arm of the liquid supply device shown in FIG. 2 viewed from diagonally below. FIG. 6 is a vertical cross-sectional view showing an outline of the polishing apparatus shown in FIG. FIG. 7 is a system configuration diagram of the polishing apparatus shown in FIG. FIG. 8 is a predicted flow diagram of the simulation by the simulator. FIG. 9A is a plan view showing the relationship between the polishing surface, the swing arm, and the slurry discharge port (polishing liquid supply position) in the simulation by the simulator. FIG. 9B is a front view showing the relationship between the polishing surface, the swing arm, and the slurry discharge port (polishing liquid supply position) in the simulation by the simulator.

The liquid supply device according to the first aspect of the embodiment is
A swing arm that can swing horizontally above the polishing table,
A slurry tube extending along the longitudinal direction of the swing arm and discharging slurry onto the polishing table from a slurry discharge port at the tip thereof.
A plurality of injection nozzles provided side by side along the longitudinal direction of the swing arm to inject a cleaning fluid onto the polishing table.
Equipped with
The slurry discharge port is positioned at the tip of the swing arm.
The injection nozzle located at the tip of the swing arm is diagonally provided so that the dropping position of the slurry discharged from the slurry discharge port on the polishing table can be washed.

According to such an aspect, since the slurry discharge port and the injection nozzle are arranged on the same swing arm, the slurry discharge port interferes with the injection nozzle even if the height position of the slurry discharge port is lowered. There is nothing to do. Therefore, it is possible to lower the height position of the slurry discharge port, which shortens the distance and time from the slurry being discharged from the slurry discharge port to reaching the polishing table, and makes the swing arm. When the slurry is discharged from the slurry discharge port while swinging, the position where the slurry is dropped is less likely to shift, and the slurry required for polishing the wafer can be dropped at the optimum timing and position. Further, since the injection nozzle located at the tip of the swing arm is diagonally provided so that the dropping position of the slurry discharged from the slurry discharge port on the polishing table can be cleaned, for example, the polishing table is provided from the slurry discharge port. Even when the slurry is dropped near the center of the polishing table, the cleaning fluid can be sprayed near the center of the polishing table for cleaning, and the particles remaining on the polishing table can be reduced. Further, since the injection nozzle and the slurry discharge port are arranged on the same swing arm, the space in the polishing device can be saved.

The liquid supply device according to the second aspect of the embodiment is the liquid supply device according to the first aspect.
The periphery of the slurry tube is covered with a cover for preventing the liquid bounced off the polishing table from entering and staying between the tubes.

When the slurry discharge port and the injection nozzle are arranged on the same swing arm, not only the slurry discharged from the slurry discharge port and bounced off the polishing table, but also the cleaning sprayed from the injection nozzle and bounced off the polishing table. The fluid also tends to infiltrate and stay between the slurry tube and the tube, but according to such an embodiment, the circumference of the slurry supply tube is covered with a cover, so that the liquid bounced off the polishing table can be transferred to the tube. It is possible to prevent it from infiltrating and staying between the tube and the tube.

The liquid supply device according to the third aspect of the embodiment is the liquid supply device according to the second aspect.
The cover has a lower surface facing the polishing table, and the tip end portion of the slurry tube penetrates the lower surface downward and protrudes to the outside of the cover.

According to such an embodiment, the periphery of the tip of the slurry tube is covered more tightly, and the liquid bounced off the polishing table is more surely infiltrated and stays between the tubes. Can be prevented.

The liquid supply device according to the fourth aspect of the embodiment is the liquid supply device according to the second or third aspect.
A cover cleaning nozzle for supplying a cleaning liquid is provided on the cover at the base end portion of the swing arm.

According to such an aspect, the cover can be cleaned by supplying the cleaning liquid onto the cover from the cover cleaning nozzle. This makes it possible to prevent particles adhering to the cover from falling onto the polishing table and contaminating the wafer during polishing of the wafer.

The liquid supply device according to the fifth aspect of the embodiment is the liquid supply device according to the fourth aspect.
The cover cleaning nozzle includes a first nozzle that supplies a cleaning liquid to the upper surface of the cover, a second nozzle that supplies the cleaning liquid to the right side surface of the cover, and a third nozzle that supplies the cleaning liquid to the left side surface of the cover. Have.

According to such an aspect, since the cleaning liquid can be supplied to the upper surface, the right side surface, and the left side surface of the cover for cleaning, the amount of particles adhering to the upper surface, the right side surface, and the left side surface of the cover and the method of adhering are different. However, the cleaning efficiency of the cover can be improved.

The liquid supply device according to the sixth aspect of the embodiment is the liquid supply device according to any one of the second to fifth aspects.
The inner surface of the cover is provided with a plurality of ribs so as to protrude toward the slurry tube that crawls along the surface of the swing arm.

According to such an aspect, when the cover is mounted on the swing arm, the rib provided on the inner surface of the cover presses the slurry tube toward the swing arm side, so that pressure is applied to the slurry tube. It is possible to suppress / prevent problems such as the tube floating and interfering with the inner wall of the cover that was not in contact with the tube, and causing the tube to flutter or swing back. As a result, it is possible not only to prevent the slurry tube from rubbing against the inner wall of the cover, but also to prevent the slurry discharged from the slurry discharge port from pulsating due to the floating of the slurry tube and to prevent the slurry dropping position from becoming unstable. In addition, when the cover is removed from the swing arm, the ribs provided on the inner surface of the cover eliminate the holding of the slurry tube, so the slurry tube replacement work is compared to the case where the slurry tube is passed through a pipe or the like. Can be easily performed. The structure is such that the slurry tube is laid on the surface of the swing arm and covered by the swing arm to hold it against the swing arm, so that the slurry tube and the injection nozzle are separated and can be replaced separately. Further, even when the number of slurry tubes is multiple, it is easy to replace the tubes and set the proper use (different types of slurry or pure water).

The liquid supply device according to the seventh aspect of the embodiment is the liquid supply device according to any one of the first to sixth aspects.
In the swing arm, the slurry discharge port is arranged closer to the object to be polished than the injection nozzle. That is, the slurry discharge port is not located at the extension of the arrangement of the injection nozzles (the position is shifted toward the object to be polished with respect to the extension of the arrangement of the injection nozzles). In other words, the slurry discharge port is located between the injection nozzle located at the tip of the swing arm and the object to be polished.

According to such an aspect, it is possible to discharge the slurry to a position closer to the object to be polished, and it is possible to drop the slurry required for polishing the wafer at a more optimum timing and position.

The polishing apparatus according to the eighth aspect of the embodiment is the polishing apparatus according to any one of the first to seventh aspects.
The drive mechanism of the swing arm includes a servomotor and a speed reducer.

The polishing device according to the ninth aspect of the embodiment includes the liquid supply device according to any one of the first to eighth aspects.

Hereinafter, specific examples of the embodiments will be described with reference to the drawings. In the following description and the drawings used in the following description, the same reference numerals are used for parts that can be configured in the same manner, and duplicate description is omitted.

FIG. 1 is a plan view showing a schematic configuration of a polishing apparatus 10 according to an embodiment.

As shown in FIG. 1, the polishing apparatus 10 holds a polishing table 11 to which a polishing pad (not shown) is attached, and a wafer W for polishing while pressing the wafer W against the polishing pad on the polishing table 11. The top ring (polishing head) 12 of the above, a dresser 13 for dressing the polishing pad, and a liquid supply device 20 are provided.

Of these, the top ring 12 is supported by the top ring head 14. A polishing pad (not shown) is attached to the upper surface of the polishing table 11, and the upper surface of the polishing pad constitutes a polishing surface for polishing the wafer W. A fixed grindstone can be used instead of the polishing pad. The top ring 12 and the polishing table 11 are configured to be rotatable around their respective axes. The wafer W is held on the lower surface of the top ring 12 by vacuum suction. At the time of polishing, a polishing liquid (slurry) is supplied from the liquid supply device 20 to the polishing surface of the polishing pad, and the wafer W to be polished is pressed against the polishing surface by the top ring 12 to be polished.

FIG. 2 is an enlarged perspective view of the liquid supply device 20, and FIG. 3 is a vertical sectional view of the liquid supply device 20.

As shown in FIGS. 1 to 3, the liquid supply device 20 discharges slurry onto the polishing table 11 from a swing arm 21 capable of horizontally swinging above the polishing table 11 and a slurry discharge port 22 at the tip thereof. One or more (four in the example shown in FIG. 5) slurry tubes 27 and a cleaning fluid (liquid (eg, pure water or deionized water), or liquid and gas (eg, nitrogen gas) on the polishing table 11. It has a plurality of injection nozzles 231 to 238 (eight in the illustrated example) for injecting a mixture of (such an inert gas).

The swing arm 21 is arranged so as to extend horizontally above the polishing table 11, and a swing means 26 is provided at the base end portion of the swing arm 21. The swinging means 26 has a swinging shaft 261 extending in the vertical direction and a drive mechanism 262 (for example, a servomotor and a speed reducer) provided at the lower end of the swinging shaft 261. The base end portion of the swing arm 21 is fixed to the swing shaft 261. The swing shaft 261 is rotated around the vertical central axis by the power received from the drive mechanism 262, so that the swing arm 21 swings horizontally around the swing shaft 261 above the polishing table 11. (Swirl). When the drive mechanism 262 is composed of a servomotor and a speed reducer, the position, speed, and the like can be controlled by the servo mechanism, so that the position accuracy of the swing arm 21 is high and stable. Therefore, feedback control using the measured value of the polishing amount of the wafer becomes possible, and based on the measured polishing amount, the slurry can be dropped accurately at the position where polishing is required by the required amount of slurry. Here, as the feedback control using the measured value of the polishing amount of the wafer, for example, the polishing head based on the measured value of the eddy current type or the optical type film thickness sensor proposed by the applicant in Japanese Patent Application Laid-Open No. 2015-193068. It is possible to utilize the pressure control of the above, and the position of the swing arm 21 is controlled so that the slurry is supplied to the portion where the pressure of the polishing head is increased in addition to the pressure control of the polishing head. Servo motors are used for accurate positioning and reducers are used for torque increase. For example, if a 1/100 speed reducer is used, the movement of one rotation of the motor becomes 1/100, so that even finer operation can be performed. In this case, a precision reducer without backlash may be used. As will be described later, a motor having a large capacity is required to rotate the weight of the structure in which the slurry nozzle and the atomizer are integrated, but since the torque can be increased if there is a reducer, it can be driven by a motor having a small capacity.

When the drive mechanism 262 is composed of a servomotor and a speed reducer, the reaction force at the time of injecting the cleaning liquid from the injection nozzles 231 to 238 is measured as the servomotor load, so that the discharge flow rate of the injection nozzles 231 to 238 is measured. Can be fed back, and flow rate control is possible without using a flow meter. The flow rate control is performed, for example, by adjusting the opening degree of the control valve 23c (for example, an electric flow rate adjusting valve) shown in FIG. Therefore, it is possible to control the discharge flow rate of the injection nozzles 231 to 238, that is, the pad cleaning position and the flow rate control for each movement angle of the swing arm 21 (positions of the injection nozzles 231 to 238). Further, conventionally, the slurry discharge port 22 and the injection nozzles 231 to 238 are separate arms, and the rigidity of the slurry tube 27 itself is low, so that appropriate position control cannot be performed. Since the slurry discharge port 22 and the injection nozzles 231 to 238 are arranged on the same swing arm 21, and the swing arm 21 has higher rigidity than the slurry tube 27, the slurry and cleaning liquid are discharged by using a servomotor. (Injection) The start position and end position can be controlled.

As shown in FIGS. 1 to 3, the slurry discharge port 22 is positioned at the tip of the swing arm 21, and a plurality of injection nozzles 231 to 238 are arranged side by side along the longitudinal direction of the swing arm 21. It is provided. The tip of the swing arm 21 referred to here may be any of the tip of the arm, and may be either the tip of the axis of the arm or both side surfaces thereof. In FIGS. 2 and 3, the slurry discharge port 22 is on the side surface of the tip of the arm facing the object to be polished. The injection nozzles 231 to 238 are arranged in a recess formed on the bottom surface of the swing arm 21. Each injection nozzle 231 to 238 has a slit-shaped fluid outlet, atomizes the cleaning fluid, and sprays the atomized cleaning fluid onto the polishing table 11.

As shown in FIG. 3, a liquid flow path 23a is formed inside the swing arm 21, and each injection nozzle 231 to 238 communicates with the liquid flow path 23a. A liquid supply inlet 23b is formed at the end of the liquid flow path 23a. The liquid (for example, pure water) supplied from the liquid supply inlet 23b is supplied to the injection nozzles 231 to 238 through the liquid flow path 23a. By injecting the cleaning fluid from each of the injection nozzles 231 to 238, the entire polishing table 11 can be washed. In the example shown in FIG. 3, one liquid flow path 23a is branched into a plurality of (here, eight) injection nozzles 231 to 238, but the present invention is not limited to this, and a plurality of (here, eight) injection nozzles 23a are branched. Eight) separate pipes may be directly connected to different injection nozzles 231 to 238, or several injection nozzles may be grouped and connected to each group. Further, valves may be provided in each of the injection nozzles 231 to 238 so that ON / OFF adjustment of the individual nozzle discharge can be performed separately or in a single branch. Further, it was stated that the number of liquid flow paths 23a may be not limited to one but may be multiple, but the liquid supply inlet 23b is not limited to the position shown in FIG. It is also possible to crawl through the inside of the swaying shaft 261 or along the outside thereof. Further, there may be a plurality of injection nozzles corresponding to each injection nozzle or a group of several injection nozzles.

Further, as shown in FIG. 3, a plurality of slurry tubes 27 are laid on the surface of the swing arm 21 along the longitudinal direction of the swing arm 21, and a slurry discharge port at the tip of each slurry tube 27 is provided. 22 is positioned at the tip of the swing arm 21. The liquid (slurry or pure water) flowing through each slurry tube 27 is discharged from different slurry discharge ports 22.
The tip end portion (near the outlet) of the slurry tube 27 is fixed to the main body of the swing arm 21 by the slurry tube fixing bracket. Since the tip end portion (near the outlet) of the slurry tube 27 is fixed to the atomizer main body having high rigidity, it is possible to suppress the blurring of the slurry discharge port 22 at the tip end of the slurry tube 27. Further, since the tip of the slurry tube 27 is fixed by the slurry tube fixing bracket, the height position of the tube tip can be adjusted, and the height of each tube can be changed from the table surface of the tube tip. Is possible. In addition, it is easy to change the type of tube (considering the difference in material and diameter) and the number of tubes (currently described as multiple (4)). Further, the slurry tube 27 is crawled not only on the upper surface and the side surface of the swing arm 21 but also along the arm surface, and the tip end portion of the slurry tube 27 is fixed to the swing arm 21 main body by the slurry tube fixing bracket. Therefore, it is easy to change the positional relationship of the slurry discharge port 22 when viewed in a plane.

Further, since the tip portion (near the outlet) of the slurry tube 27 is fixed to the main body of the swing arm 21 by the slurry tube fixing bracket, the slurry discharge port 22 at the tip portion of the slurry tube 27 is positioned further downward and stopped. be able to. Further, since the height of the slurry discharge port 22 from the polishing table 11 can be adjusted to the height of the injection nozzles 231 to 238, the height from the polishing table 11 to the slurry discharge port 22 can be increased from about 100 mm so far. It can be approached up to about 30 mm. Further, by providing the swing shaft 261 with an air cylinder or an electric actuator, the position can be moved in the vertical direction, and the distance between the polishing table 11 and the slurry discharge port 22 can be adjusted according to the application.

The slurry tube 27 may be arranged (crawled) along the outer peripheral surface of the swing shaft 261 that supports the swing arm 21. As a result, the slurry tube 27 can be replaced. When the swing shaft 261 is covered with the cover 24, the slurry tube 27 arranged along the swing shaft 261 may be arranged inside the cover 24. Further, in order to prevent air from entering the slurry tube 27 when the slurry discharge from the slurry discharge port 22 is stopped, the slurry tube 27 is once extended upward along the swing shaft 261 and then extended upward. It may be set by being bent downward and lowered, and then extended sideways along the swing arm 21 (crawled).

Since the slurry discharge port 22 and the injection nozzles 231 to 238 are arranged on the same swing arm 21, the slurry discharge port 22 has the injection nozzles 231 to 23 even if the height position of the slurry discharge port 22 is lowered. Does not interfere with 238. Therefore, it is possible to lower the height position of the slurry discharge port 22, thereby shortening the distance and time from the slurry being discharged from the slurry discharge port 22 to reaching the polishing table 11, and shaking. When the slurry is discharged from the slurry discharge port 22 while swinging the moving arm 21, the position where the slurry is dropped is less likely to shift, and the slurry required for polishing the wafer can be dropped at the optimum timing and position. It has become.

As shown in FIG. 1, in the swing arm 21, the slurry discharge port 22 is arranged closer to the object to be polished (wafer) W than the injection nozzles 231 to 238. That is, the slurry discharge port 22 is not located at the extension of the arrangement of the injection nozzles 231 to 238 (the slurry discharge port 22 is located offset to the polishing target (wafer) W side from the extension of the arrangement of the injection nozzles 231 to 238. ). In other words, the slurry discharge port 22 is located between the injection nozzle 231 located at the tip of the swing arm 21 and the object to be polished (wafer) W. As a result, the slurry can be discharged to a position closer to the object to be polished (wafer) W, and the slurry required for polishing the wafer W can be dropped to a more optimum timing and position.

FIG. 4 is a front view of the swing arm 21 as viewed from the tip side. FIG. 5 is a view of the tip of the swing arm 21 as viewed from diagonally below.

As shown in FIGS. 4 and 5, the injection nozzle 231 located at the tip of the swing arm 21 is diagonally provided so that the dropping position of the slurry discharged from the slurry discharge port 22 on the polishing table 11 can be washed. Has been done. That is, when viewed from the tip side of the swing arm 21, the injection nozzle 231 located at the tip of the swing arm 21 has an extension line in the discharge direction with respect to an extension line in the discharge direction of the slurry discharge port 22. It is installed diagonally so as to form an acute angle.

With reference to FIG. 1, for example, when a slurry is dropped from the slurry discharge port 22 near the center of the polishing table 11, it is assumed that the injection nozzle 231 located at the tip of the swing arm 21 is provided vertically downward. There is a possibility that the cleaning fluid cannot be sufficiently sprayed onto the slurry remaining near the center of the polishing table 11 to perform cleaning. The reason why it tends to remain near the center is that the centrifugal force toward the outer periphery of the polishing table with respect to the slurry becomes less likely to work toward the center in the radial direction of the polishing table. On the other hand, in the present embodiment, the injection nozzle 231 located at the tip of the swing arm 21 is diagonally provided so that the dropping position of the slurry discharged from the slurry discharge port 22 can be washed. Even when the slurry is dropped from the slurry discharge port 22 near the center of the polishing table 11, it is possible to sufficiently inject the cleaning fluid near the center of the polishing table 11 for cleaning, and the cleaning is performed on the polishing table 11. Particles remaining in the table can be reduced. The injection nozzle 231 is not a nozzle having a circular fluid outlet, but a spray nozzle having a slit-shaped fluid outlet, and the cleaning liquid is applied onto the polishing table 11 as if a horizontally long brush was applied so as to cover the center of the polishing table 11. It is desirable that it is designed to drip. This is because when the slurry is dropped from the circular slurry supply port 22, the figure drawn by the slurry on the polishing table 11 tries to spread concentrically from the dropping position, and the concentric circles are rotated in the rotation direction due to the rotation of the polishing table 11. Oval to the outside. The same applies to the dripping of the cleaning liquid from the circular fluid outlet. Therefore, in the case of a circular slurry discharge port 22 and a circular fluid outlet, no matter how close the slurry discharge port 22 and the circular fluid outlet are, the spread of the slurry and the spread of the cleaning liquid are such that the spread centers are mutually exclusive. As long as they are different, there are overlapping parts, but different parts occur. On the other hand, when the injection nozzle 231 is a spray nozzle having a slit-shaped fluid outlet, as long as the shape of the sprayed cleaning liquid is brush-like, the slurry of the portion on which the sprayed cleaning liquid is applied is removed. When the injection nozzle 231 is a spray nozzle having a slit-shaped fluid outlet, the shape of the cleaning liquid sprayed when viewed from above is not on the radius line from the center of the polishing table 11 to the outer periphery, and is slightly. It is desirable that it is tilted. In this case, the flow of the cleaning liquid to the outer periphery can be promoted according to the rotation of the polishing table 11, and the desired removal of slurry can be promoted.

As shown in FIGS. 2 to 5, the periphery of the slurry tube 27 is covered with a cover 24 for preventing the liquid bounced off by the polishing table 11 from entering and staying between the tubes 27 and the tubes 27. There is.

When the slurry discharge port 22 and the injection nozzles 231 to 238 are arranged on the same swing arm 21 as in the present embodiment, only the slurry discharged from the slurry discharge port 22 and rebounded by the polishing table 11 Instead, the cleaning fluid sprayed from the injection nozzles 231 to 238 and bounced off at the polishing table 11 also easily infiltrates between the slurry supply tube 27 and the tube 27 and stays there, but the periphery of the slurry supply tube 27 is covered 24. By being covered with the above, it is possible to prevent the liquid bounced off by the polishing table 11 from entering and staying between the tubes 27 and the tubes 27.

As shown in FIG. 5, the cover 24 has a lower surface 24b facing the polishing table 11, and the tip end portion of the slurry tube 27 penetrates the lower surface 24b downward and protrudes to the outside of the cover 24. .. As a result, the periphery of the tip of the slurry tube 27 is covered even more tightly, and the liquid bounced off by the polishing table 11 is more reliably prevented from entering and staying between the tubes 27. can.

As shown in FIG. 3, a plurality of (three in the illustrated example) ribs 24a are provided on the inner surface of the cover 24 so as to protrude toward the slurry supply tube 27. When the cover 24 is mounted on the swing arm 21, the rib 24a provided on the inner surface of the cover 24 presses the slurry tube 27 toward the swing arm 21, so that the tube is subjected to pressure due to the pressure applied to the slurry tube 27. It is possible to suppress / prevent problems such as the 27 rising and interfering with the inner wall of the cover 24 which was not in contact with the tube 27, and the tube 27 fluttering or swinging back. As a result, not only the slurry tube 27 is prevented from rubbing against the inner wall of the cover 24, but also the slurry discharged from the slurry discharge port 22 is pulsated due to the lifting of the slurry tube 27, and the drop position of the slurry is suppressed from becoming unstable. can.
The number of ribs 24a is three in the example shown in FIG. 3, but the number of ribs 24a is not limited to three, and may be one or two, or four or more. The cover 24 and the rib 24a may be integrated or separate. Further, as a modification, the rib 24a is provided on the main body of the swing arm 21, and when the cover 24 is mounted on the swing arm 21, the rib 24a provided on the main body of the swing arm 21 provides the slurry tube 27. It may be pressed against the inner wall side of the cover 24 and along the inner wall of the cover 24. Even in such an embodiment, the same function and effect as in the embodiment in which the rib 24a is provided on the inner surface of the cover 24 can be obtained.

Further, when the cover 24 is removed from the swing arm 21, the holding of the slurry tube 27 by the rib 24a provided on the inner surface of the cover 24 is eliminated, so that the slurry tube 27 is not passed through a pipe or the like. , The slurry tube can be easily replaced. Further, by laying the slurry tube 27 on the surface of the swing arm 21 and pressing the slurry tube 27 on the swing arm 21 by the cover 24, the slurry tube 27 and the injection nozzles 231 to 238 are separately united. , Can be exchanged separately. Further, even when the number of slurry tubes 27 is plurality, it is easy to replace the tubes and set the proper use (different types of slurry or pure water).

As shown in FIGS. 2 to 4, a cover cleaning nozzle 25 for supplying a cleaning liquid (for example, pure water) is provided on the cover 24 at the base end portion of the swing arm 21. As shown in FIG. 2, the cover cleaning nozzle 25 communicates with the liquid flow path 23a formed inside the swing arm 21. Therefore, the liquid (for example, pure water) supplied from the liquid supply inlet 23b is supplied to the atomizer nozzles 231 to 238 through the liquid flow path 23a, and is also supplied to the cover cleaning nozzle 25. As a result, after polishing the wafer W, when the atomizer nozzles 231 to 238 spray a mist-like cleaning fluid (liquid or a mixture of liquid and gas) onto the polishing table 11 to clean the polishing table 11. A cleaning liquid is supplied from the cover cleaning nozzle 25 onto the cover 23, and the cover 24 can be cleaned at the same time. It should be noted that the supply pipe to the cover cleaning nozzle 25 and the supply pipe to the injection nozzles 231 to 237 may be configured so that their respective discharges are controlled and discharged at the same time if necessary. The upper surface of the cover 24 may have a curved surface shape having a semi-cylindrical shape (arc-shaped cross section). The cover cleaning nozzle 25 may be a spray nozzle.

In the present embodiment, as shown in FIGS. 2 and 4, the cover cleaning nozzle 25 has a first nozzle 251 that supplies a cleaning liquid to the upper surface of the cover 24 and a second nozzle that supplies the cleaning liquid to the right side surface of the cover 24. It has a 252 and a third nozzle 253 that supplies a cleaning liquid to the left side surface of the cover 24. As a result, it is possible to supply cleaning liquid to the upper surface, the right side surface, and the left side surface of the cover 24 to clean the cover 24, and the amount of particles adhered to the upper surface, the right side surface, and the left side surface of the cover and the method of adhesion are different. However, the cleaning efficiency of the cover 24 can be improved. The first to third nozzles 251 to 253 are spray nozzles, respectively, and the spread of the cleaning liquid (spray) sprayed from the first to third nozzles 251 to 253 can cover from the base to the tip of the cover 24. You may have. The first to third nozzles 251 to 253 are not limited to the spray nozzles as long as the nozzles can cover the cover 24 from the base to the tip with the cleaning liquid. The orientation of the first to third nozzles 251 to 253 with respect to the cover 24 may be variable. When the first to third nozzles 251 to 253 are spray nozzles, the first to third nozzles 251 to 253 may be able to rotate the direction of the spray around the center of each axis. The flow rates of the first to third nozzles 251 to 253 may be different and / or variable from each other. In this case, the desired flow rate of the cleaning liquid can be concentrated and applied to the portion of the surface of the cover 24 where the degree of adhesion is high.

Next, an example of the operation of the polishing apparatus 10 configured as described above will be described.

First, when polishing the wafer W, as shown in FIG. 1, the swing arm 21 is positioned so that the slurry can be dropped from the slurry discharge port 22 to the vicinity of the center of the polishing table 11, and the wafer W is polished from the slurry discharge port 22. The slurry is discharged onto the table 11, and the wafer W to be polished is pressed onto the polishing table 11 by the top ring 12 to be polished.

In the present embodiment, since the slurry discharge port 22 and the injection nozzles 231 to 238 are arranged on the same swing arm 21, it is possible to lower the height position of the slurry discharge port 22. As a result, the distance and time from when the slurry is discharged from the slurry discharge port 22 to when it reaches the polishing table 11 is shortened, and when the slurry is discharged from the slurry discharge nozzle 22 while swinging the swing arm 21. The dropping position of the slurry is less likely to shift, and the slurry required for polishing the wafer can be dropped at the optimum timing and position.

After polishing the wafer W, the discharge of the slurry from the slurry discharge port 22 is stopped, and as shown in FIG. 1, the swing arm 21 is capable of injecting the cleaning fluid from the injection nozzles 231 to 238 onto the entire surface of the polishing table 11. Is positioned, the liquid (for example, pure water) supplied from the liquid supply inlet 23b is supplied to the injection nozzles 231 to 238 and the cover cleaning nozzle 25 through the liquid flow path 23a, and is supplied to each injection nozzle 231. A mist-like cleaning fluid is sprayed onto the polishing table 11 from 238 to clean the polishing table 11, and a cleaning liquid is supplied from the cover cleaning nozzle 25 onto the cover 23 to clean the cover 24. The swing arm 21 may be swung to control the injection position of the cleaning fluid injected from each of the injection nozzles 231 to 238. The injection of the cleaning fluid from the atomizer injection nozzles 231 to 238 and the cover cleaning nozzle 25 is performed until the start of polishing of the next wafer W (until the end of the dressing work).

In the present embodiment, as shown in FIG. 4, the injection nozzle 231 located at the tip of the swing arm 21 can clean the dropping position of the slurry discharged from the slurry discharge port 22 on the polishing table 11. Since it is provided at an angle, even if the slurry is dropped from the slurry discharge port 22 near the center of the polishing table 11, it is possible to sufficiently inject the cleaning fluid near the center of the polishing table 11 for cleaning. It is possible and the particles remaining on the polishing table 11 can be reduced. When particles adhere to the surface of the wafer, they cause defects. By improving the dischargeability of the slurry in this way, the defect reducing effect of the wafer is improved.

By the way, as mentioned in the background technology section, in the conventional CMP device, the slurry discharge nozzle provided at the tip of the swing arm does not interfere with the atomizer arranged on the polishing pad. Needed to be placed at a higher height than the atomizer. Therefore, when the slurry is discharged from the slurry discharge nozzle while swinging the swing arm, the position where the slurry is dropped tends to shift, and it is difficult to drop the slurry required for polishing the wafer at the optimum timing and position. Met.

On the other hand, according to the present embodiment, since the slurry discharge port 22 and the injection nozzles 231 to 238 are arranged on the same swing arm 21, the height position of the slurry discharge port 22 is lowered. However, the slurry discharge port 22 does not interfere with the injection nozzle. Therefore, it is possible to lower the height position of the slurry discharge port 22, thereby shortening the distance and time from the slurry being discharged from the slurry discharge port 22 to reaching the polishing table 11, and shaking. When the slurry is discharged from the slurry discharge nozzle 22 while swinging the moving arm 21, the position where the slurry is dropped is less likely to shift, and the slurry required for polishing the wafer W can be dropped at the optimum timing and position. It will be possible.

Further, according to the present embodiment, the injection nozzle 231 located at the tip of the swing arm 21 is diagonally provided so that the dropping position of the slurry discharged from the slurry discharge port 22 on the polishing table 11 can be washed. Therefore, for example, even when the slurry is dropped from the slurry discharge port 22 near the center of the polishing table 11, it is possible to inject a cleaning fluid near the center of the polishing table 11 for cleaning. Particles remaining on the polishing table 11 can be reduced.

Further, according to the present embodiment, the injection nozzles 231 to 238 and the slurry discharge port 22 are arranged on the same swing arm 21, so that the space in the polishing device can be saved. Further, since the injection nozzles 231 to 238 and the slurry discharge port 22 are arranged on the same swing arm 21, when the slurry discharge port 22 is retracted from the table surface of the polishing table 11, the injection nozzles 22 are also injected. Nozzles 231 to 238 can also be cleaned.

Further, when the slurry discharge port 22 and the injection nozzles 231 to 238 are arranged on the same swing arm 21, not only the slurry discharged from the slurry discharge port 22 and rebounded by the polishing table 11 but also the injection nozzle 231 The cleaning fluid sprayed from and rebounded on the polishing table 11 also easily infiltrates and stays between the slurry supply tube 27 and the tube 27, but according to the present embodiment, the periphery of the slurry supply tube 27 is covered with the cover 24. Therefore, it is possible to prevent the liquid bounced off by the polishing table 11 from entering and staying between the tubes 27 and the tubes 27.

Further, according to the present embodiment, the cover 24 has a lower surface 24b facing the polishing table 11, and the tip end portion of the slurry tube 27 penetrates the lower surface 24b downward and protrudes to the outside of the cover 24. Therefore, the periphery of the tip of the slurry tube 27 is covered even more tightly, and the liquid bounced off by the polishing table 11 can be more reliably prevented from entering and staying between the tubes 27. ..

Further, according to the present embodiment, the cover cleaning nozzle 25 is provided at the base end portion of the swing arm 21, and the cover 24 can be cleaned by supplying the cleaning liquid from the cover cleaning nozzle 25 onto the cover 24. .. This makes it possible to prevent particles adhering to the cover 24 from falling onto the polishing table 11 and contaminating the wafer W during polishing of the wafer W.

Further, according to the present embodiment, a plurality of ribs 24a are provided on the inner surface of the cover 24 so as to protrude toward the slurry tube 27 extending along the longitudinal direction of the swing arm 21. Therefore, when the cover 24 is mounted on the swing arm 21, the rib 24a provided on the inner surface of the cover 24 presses the slurry tube 27 toward the swing arm 21, and pressure is applied to the slurry tube 27. Problems such as the tube 27 floating up and interfering with the inner wall of the cover 24 that was not in contact with the tube 27, and the tube 27 fluttering or swinging back are suppressed / prevented. As a result, it is possible to prevent the slurry discharged from the slurry discharge port 22 from pulsating due to the floating of the slurry tube 27 and causing the slurry dropping position to become unstable. Further, when the cover 24 is removed from the swing arm 21, the holding of the slurry tube 27 by the rib 24a provided on the inner surface of the cover 24 is eliminated, so that the slurry supply tube 27 is not passed through a pipe or the like. Therefore, the replacement work of the slurry tube 27 can be easily performed.

Further, according to the present embodiment, in the swing arm 21, the slurry discharge port 22 is arranged closer to the wafer W than the injection nozzles 231 to 238, so that the slurry is discharged to a position closer to the wafer W. This is possible, and the slurry required for polishing the wafer W can be dropped at a more optimum timing and position.

Further, according to the present embodiment, since the slurry tube 27 is fixed to the atomizer main body (that is, the swing arm 21), the rigidity is increased and the runout of the tip portion of the slurry tube 27 is reduced. Further, as a comparative example, when considering a configuration in which the slurry tube 27 is arranged diagonally or far away from the polishing table and discharges the slurry to the center of the polishing table, in the configuration of the comparative example, the change in the flow velocity of the slurry is considered. However, in the present embodiment, the slurry discharge port 22 is arranged closer to the wafer W than the injection nozzles 231 to 238 in the swing arm 21, and the slurry discharge port 22 is located closer to the wafer W. Since the outlet 22 faces vertically downward, it is easy to control the position of the slurry dropping position. In addition, the injection position calculation of the injection nozzles 232 to 238 also maintains the relative positional relationship with the slurry discharge port 22 in that it drops vertically downward, so that it passes through the same trajectory as the slurry discharge port 22. You just have to control it.

FIG. 6 is a vertical cross-sectional view showing a part of the polishing device 10, and FIG. 7 is a system configuration diagram of the polishing device 10. As shown in FIG. 6, the polishing table 11 of the polishing apparatus 10 is connected to a motor 50 arranged below the polishing table 11, and is rotatable around its axis as shown by an arrow. Further, a polishing pad (polishing cloth) 52 having a polishing surface 52a is attached to the upper surface of the polishing table 11. Further, the top ring 12 is connected to the top ring shaft 54, and a retainer ring 56 for holding the outer peripheral edge of the semiconductor wafer W is provided on the lower outer peripheral portion of the top ring 12.

The top ring 12 is connected to a motor (not shown) and to an elevating cylinder (not shown). As a result, the top ring 12 can be raised and lowered as shown by an arrow and can rotate around its axis, and the semiconductor wafer W can be pressed against the polishing surface 52a of the polishing pad 52 with an arbitrary pressure. You can do it.

Inside the polishing table 11, an eddy current sensor 58 as a film thickness monitor for measuring the film thickness of a metal thin film such as a copper film formed on the surface of the semiconductor wafer W is embedded. The wiring 60 from the eddy current sensor (film thickness monitor) 58 passes through the polishing table 22 and the support shaft 62, and passes through the rotary connector (or slip ring) 64 provided at the shaft end of the support shaft 62, and the controller 66. It is connected to the. While the eddy current sensor 58 passes under the semiconductor wafer W, it has become possible to continuously measure the film thickness of a conductive film such as a copper film formed on the surface of the semiconductor wafer W on the passing locus. There is. The control target and installation location of the controller 66 may be the controller in the polishing module related to the work in the polishing module in the polishing module, or the polishing related to the work of the entire polishing device including the cleaning / drying device. It may be the controller of the device. Furthermore, the controller 66 may be located in the cleaning / drying module of the polishing device. Further, it may be located outside the housing in the factory where the substrate processing system is installed. Further, the controller 66 is composed of a plurality of computers, and the plurality of computers may be distributed and arranged in the factory. In other words, even if at least one computer constituting the controller 66 is located in the cleaning / drying module, in the vicinity of the cleaning / drying module, or in the substrate processing system away from the cleaning / drying module. good. Further, at least one computer constituting the controller 66 may be arranged in one line of a plurality of substrate processing systems in a semiconductor substrate manufacturing factory. Further, the plurality of computers constituting the controller 66 may be arranged on a plurality of lines of the plurality of board processing systems. Further, at least one computer constituting the controller 66 may be arranged in a line control / monitoring place in a factory or a line control / monitoring system. Further, it may be arranged in a plurality of factory monitoring locations of a semiconductor substrate manufacturing company, in a factory monitoring system, or in a company that manufactures and installs a CMP device.

In this example, the eddy current sensor is used to measure the thickness of a metal thin film such as a copper film formed on the surface of a semiconductor wafer, but an optical sensor is used instead of the vortex current sensor. It may be used to measure the thickness of an optically transparent thin film such as an oxide thin film provided on the surface of a semiconductor wafer during polishing.

Although not shown, a polishing profile monitor for measuring the post-polishing profile of the surface of the semiconductor wafer may be provided, and the measurement result of this polishing profile monitor may be input to the simulator 72 as an actual polishing profile.

As shown in FIG. 7, the swing arm 24 swings above the polishing surface 52a along a horizontal plane with the rotation of the servomotor 262 as a drive mechanism, and the swing arm 24 swings with the swing. Therefore, the slurry discharge port 22 facing downward at the tip, that is, the polishing liquid supply position moves along the substantially radial direction of the polishing surface 52a. The servomotor (drive mechanism) 262 is connected to the controller 66.

The controller 66 has a relationship between the slurry discharge port (polishing liquid supply position) 22 of the swing arm 24 and the polishing profile when polishing is performed while supplying the polishing liquid to the polishing surface 52a at this polishing liquid supply position. A simulator 72 that predicts and performs a simulation based on, for example, a desired polishing profile is connected.

The database stored in the simulator 72 contains a plurality of polishing liquid supply positions: α (°), which are positions along the extension line of the arc shown in FIG. 7 of the slurry discharge port 22 of the swing arm 24, and this polishing liquid. When the semiconductor wafer W is polished while the polishing liquid is supplied at the supply position, the wafer position along the radius r shown in FIG. 7 of the semiconductor wafer W: the polishing rate at each intersection with r (mm): RR ( It consists of α, r) (nm / min). Each polishing liquid supply position in this database: Polishing rate at α: RR (α, r), for example, from the polishing rate (60, r) corresponding to the polishing liquid supply position α = 60 (°), each polishing liquid supply position: The polishing profile when polishing is performed for a certain period of time while supplying the polishing liquid from α can be known. That is, in this database, the polishing rate also represents the polishing profile when polishing is continuously performed for a certain period of time.

In the polishing apparatus 10 having such a configuration, the semiconductor wafer W is held on the lower surface of the top ring 12, and the semiconductor wafer W is pressed against the polishing pad 52 on the upper surface of the rotating polishing table 11 by the elevating cylinder. Then, by swinging the swing arm 24 to supply the polishing liquid Q from the slurry discharge port 22 onto the polishing pad 52, the polishing liquid Q is between the surface to be polished (lower surface) of the semiconductor wafer W and the polishing pad 52. The surface of the semiconductor wafer W is polished in the presence of. At the time of this polishing, the controller 66 swings the swing arm 24 while controlling the servomotor 262 to move the supply position (polishing liquid supply position) of the polishing liquid Q supplied from the slurry discharge port 22 to a predetermined position. Move along the pattern. The movement pattern of the polishing liquid supply position is predicted by the simulator 72, input to the controller 66, and determined.

Next, the prediction of the polishing liquid supply position by the simulator 72, that is, the movement pattern of the slurry discharge port 22 of the swing arm 24 will be described with reference to FIGS. 8, 9A and 9B.

First, the simulator 72 has a swingable range of the swing arm 24, that is, a movable range A of the slurry discharge port (polishing liquid supply position) 22 shown in FIG. 9B, the minimum and maximum speed change points, and the acceleration / deceleration at the time of speed change. Read the calculation parameters such as (step 1).

Next, the simulator 72 reads the correlation between the polishing liquid supply position of the swing arm 24 and the actual polishing profile as experimental data from past data, immediately preceding data, and the like (step 2). Refer to the database showing the relationship between the polishing liquid supply positions of the plurality of points of the swing arm 24 and the polishing rate (polishing profile) obtained from this experimental data, and if necessary, Nth order regression, Fourier transform, spline regression and spline regression. The relationship between an arbitrary polishing liquid supply position and a polishing rate (polishing profile) is predicted and stored by at least one method of wavelet transform (step 3).

On the other hand, the desired polishing profile after polishing is input to the simulator 70 directly or from the polishing device (CMP) (step 4).

Next, for example, between the polishing liquid supply start position S, the polishing liquid supply turning position R, the speed change positions P1 to P4, and each speed change position shown in FIG. 9B, S to P1, P1 to P2, P2 to P3, P3 to Set the calculation initial value of the movement pattern of the polishing liquid supply position such as the movement speed V1 to V5 of the slurry discharge port in P4, P4 to R (step 5). Further, limits in calculation such as the maximum number of repetitions and the allowable profile error (error between the desired profile and the expected profile) are set (step 6).

Through each of the above steps, the simulator 70 refers to the database and obtains a polishing profile (polishing rate) when polishing is performed while moving the polishing liquid supply position in a temporary polishing liquid supply position moving pattern (step). 7).

Then, the difference between the desired polishing profile and the polishing profile obtained in the calculation in step 7 is calculated (step 8), and this difference is within the allowable profile error set in step 6, or the maximum number of repetitions. Is not reached (step 9).

Then, if the difference between the desired polishing profile and the calculated polishing profile is not within the allowable profile error, the process returns to step 7 in order to recalculate the temporary polishing liquid supply position movement pattern (step 10). .. Then, by repeating this, when the difference between the desired polishing profile and the calculated polishing profile is within the allowable profile error, or the difference between the desired polishing profile and the calculated polishing profile is acceptable. Even if it is not within the range of the profile error, when the maximum number of repetitions set in step 6 is reached, the movement pattern of the polishing supply position, which is the polishing profile calculated in step 7, is displayed and saved, and is input to the controller 66. (Step 11).

The controller 66 receives an input from the simulator 70 and controls the servomotor 70 as a moving mechanism so that the slurry discharge port 22 of the swing arm 24 moves along the moving pattern of the polishing liquid supply position during polishing. Then, the swing arm 24 is swung.

In this example, during polishing of a semiconductor wafer, the film thickness distribution (polishing profile) of a metal thin film such as a copper film formed on the surface of the semiconductor wafer is acquired by the eddy current sensor 58 and input to the simulator 72. The simulator 72 instantly compares the desired polishing profile input in step 4 of FIG. 8 with the film thickness distribution (polishing profile) acquired by the eddy current sensor 58 during polishing to obtain the difference, and obtains the desired polishing. Simulate the polishing conditions required to create a profile. Based on the polishing conditions obtained by the simulation, the swing pattern of the swing arm 24, that is, the movement pattern of the slurry discharge port (polishing liquid supply position) 22 is updated so as to have a desired profile.

By controlling the swing pattern of the swing arm 24 in this way, it is desired that the film thickness distribution (polishing profile) of the metal thin film such as a copper film formed on the surface of the semiconductor wafer after polishing becomes a desired profile. Polishing is performed to complete the polishing.

In the above-described embodiment, the injection nozzles 231 to 238 are used for the purpose of spraying a cleaning fluid (liquid or a mixed fluid of gas and liquid) toward the polishing table 11 to remove foreign substances on the polishing table 11. However, the present invention is not limited to this, and the injection nozzles 231 to 238 may be used for the purpose of spraying a temperature-adjusted liquid toward the polishing table 11 to adjust the temperature of the surface of the polishing table 11.

Although the preferred embodiments of the present technology have been described so far, it is needless to say that the present technology is not limited to the above-described embodiments and may be implemented in various different forms within the scope of the technical idea.

Claims

A swing arm that can swing horizontally above the polishing table,
A slurry tube extending along the longitudinal direction of the swing arm and discharging slurry onto the polishing table from a slurry discharge port at the tip thereof.
A plurality of injection nozzles provided side by side along the longitudinal direction of the swing arm to inject a cleaning fluid onto the polishing table.
Equipped with
The slurry discharge port is positioned at the tip of the swing arm.
The injection nozzle located at the tip of the swing arm is obliquely provided so as to be able to clean the dropping position of the slurry discharged from the slurry discharge port on the polishing table. ..
The liquid according to claim 1, wherein the periphery of the slurry tube is covered with a cover for preventing the liquid bounced off the polishing table from entering and staying between the tubes. Feeding device.
The second aspect of claim 2, wherein the cover has a lower surface facing the polishing table, and the tip end portion of the slurry tube penetrates the lower surface downward and protrudes to the outside of the cover. Liquid supply device.
A cover cleaning nozzle for supplying a cleaning liquid is provided on the cover at the base end portion of the swing arm.
The liquid supply device according to claim 2 or 3.
The cover cleaning nozzle includes a first nozzle that supplies a cleaning liquid to the upper surface of the cover, a second nozzle that supplies the cleaning liquid to the right side surface of the cover, and a third nozzle that supplies the cleaning liquid to the left side surface of the cover. Have,
The liquid supply device according to claim 4.
One of claims 2 to 5, wherein the inner surface of the cover is provided with a plurality of ribs so as to protrude toward the slurry tube crawls along the surface of the swing arm. Liquid supply device according to.
The liquid supply device according to any one of claims 1 to 6, wherein in the swing arm, the slurry discharge port is arranged closer to the object to be polished than the injection nozzle.
The drive mechanism of the swing arm includes a servomotor and a speed reducer.
The liquid supply device according to any one of claims 1 to 7.
A polishing device equipped with a liquid supply device,
The liquid supply device is
A swing arm that can swing horizontally above the polishing table,
A slurry tube extending along the longitudinal direction of the swing arm and discharging slurry onto the polishing table from a slurry discharge port at the tip thereof.
A plurality of injection nozzles provided side by side along the longitudinal direction of the swing arm to inject a cleaning fluid onto the polishing table.
Have,
The slurry discharge port is positioned at the tip of the swing arm.
The injection nozzle located at the tip of the swing arm is diagonally provided so that the dropping position of the slurry discharged from the slurry discharge port on the polishing table can be washed.
A polishing device characterized by that.
The polishing according to claim 9, wherein the periphery of the slurry tube is covered with a cover for preventing the liquid bounced off the polishing table from entering and staying between the tubes. Device.
10. The tenth aspect of the present invention, wherein the cover has a lower surface facing the polishing table, and the tip end portion of the slurry tube penetrates the lower surface downward and protrudes to the outside of the cover. Polishing equipment.
A cover cleaning nozzle for supplying a cleaning liquid is provided on the cover at the base end portion of the swing arm.
The polishing apparatus according to claim 10 or 11.
The cover cleaning nozzle includes a first nozzle that supplies a cleaning liquid to the upper surface of the cover, a second nozzle that supplies the cleaning liquid to the right side surface of the cover, and a third nozzle that supplies the cleaning liquid to the left side surface of the cover. Have,
The polishing apparatus according to claim 12.
One of claims 10 to 13, wherein the inner surface of the cover is provided with a plurality of ribs so as to project toward the slurry tube crawls along the surface of the swing arm. The polishing device described in.
The polishing apparatus according to any one of claims 9 to 14, wherein in the swing arm, the slurry discharge port is arranged closer to the object to be polished than the injection nozzle.
The drive mechanism of the swing arm includes a servomotor and a speed reducer.
The polishing apparatus according to any one of claims 9 to 15.