JPH11233480A - Substrate drying device and its method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To sufficiently bring out effect that cleaning liquid by means of spraying prescribed gas is splashed and to shorten the time required for drying a substrate. SOLUTION: An electric motor rotates to turn a support arm 57. A N2 discharge nozzle 71 is moved to a start position S, and the discharge of N2 is started from a discharge pot 71a. Discharged N2 is sprayed toward the rotary center O of a substrate 11. Thus, cleaning liquid adhered to the vicinity of the rotary center O of the substrate 11 is plashed toward a peripheral part. When the support arm 57 turns by the electric motor, the N2 discharge nozzle 71 gradually moves in the direction of an arrow G along an arc form the start position S. The spray position of N2 gradually moves toward the peripheral part from the rotary center O of the substrate 11, and cleaning liquid adhered to the surface of the substrate 11 is splashed much more toward the peripheral part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for cleaning a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, a substrate for an optical disk (hereinafter simply referred to as a substrate) with a cleaning liquid, and then cleaning the substrate. The present invention relates to a technique for drying a substrate.

[0002]

2. Description of the Related Art Conventionally, as an apparatus for drying a substrate cleaned by a cleaning liquid, for example, a cleaning substrate is rotated at a high speed, and the cleaning liquid attached to the substrate is scattered by centrifugal force. Devices for drying a substrate are known. It should be noted that this type of substrate drying apparatus is generally configured integrally with a substrate cleaning apparatus for cleaning a substrate with a cleaning liquid.

However, in the above-described substrate drying apparatus, since the cleaning liquid attached to the substrate is scattered by centrifugal force, it is possible to scatter the cleaning liquid attached to the rotation center of the substrate that does not work with centrifugal force. could not.

Therefore, conventionally, before or during the rotation of the substrate, nitrogen gas (N ₂ ) is discharged and sprayed toward the center of rotation of the substrate to thereby remove the cleaning liquid attached to the center of rotation of the substrate. A scattering device has been proposed.

FIG. 4 is a plan view showing a substrate drying apparatus capable of drying a substrate by blowing such N ₂ . Although the substrate drying apparatus shown in FIG. 4 is also configured integrally with the substrate cleaning apparatus as described above, FIG. 4 shows only a main part of the substrate drying apparatus 200.

In the apparatus shown in FIG. 4, first, a substrate 211 to be cleaned is supported by support pins 221a on a spin chuck 221 and then rotated together with the spin chuck 221. Then, the cleaning liquid is discharged from the cleaning liquid discharge nozzle (not shown) toward the surface of the substrate 211, and the surface of the substrate 211 is cleaned by brushing with a rotating brush (not shown). At this time, the cleaning liquid is prevented from scattering around the spin chuck 221.
A scattering prevention cup 231 is provided around the spin chuck 221.
Has been deployed.

After the cleaning of the substrate 211 is completed, N ₂ is discharged from the discharge port 271 a of the N ₂ discharge nozzle 271 supported by the nozzle support 273.
It is sprayed toward the rotation center O of the substrate 211. As a result, the cleaning liquid attached to the rotation center O of the substrate 211 scatters around the substrate 211. Then, the substrate 2
The substrate 211 is rotated at a high speed by increasing the rotation speed of the substrate 11. As a result, the cleaning liquid attached to the substrate 211 becomes
Spatters around due to centrifugal force. Accordingly, since the cleaning liquid can be removed from the entire surface of the substrate 211, the substrate 211 can be dried to a certain extent quickly.

[0008]

[SUMMARY OF THE INVENTION However, in the conventional apparatus for drying a substrate 200 as described above, N ₂ discharge nozzle 271 nozzle carrier 273 for discharging the N ₂
And the N ₂ discharge nozzle 271 is connected to the spin chuck 22 of the substrate 211.
It is arranged around the substrate 211 so as not to hinder the attachment / detachment to / from the substrate 1. Therefore, since the distance from the discharge port 271a of the N ₂ discharge nozzle 271 to the rotation center O of the substrate 211 is very long, N ₂ discharged from the discharge port 271a does not reach the rotation center O of the substrate 211 sufficiently. Therefore, the effect of scattering the cleaning liquid by spraying N ₂ was not sufficiently obtained.

For this reason, in order to remove the cleaning liquid from the entire surface of the substrate 211, it is necessary to rotate the substrate 211 for a correspondingly long time to disperse the cleaning liquid by centrifugal force.
Therefore, the time required for drying the substrate could not be sufficiently reduced.

[0010] Accordingly, an object of the present invention is to solve the above-mentioned problems of the prior art, and to sufficiently draw out the effect of spraying the cleaning liquid by spraying a predetermined gas, thereby shortening the time required for substrate drying. An object of the present invention is to provide a substrate drying apparatus and a method thereof.

[0011]

In order to achieve at least a part of the above object, a substrate drying apparatus according to the present invention rotates a substrate cleaned with a cleaning liquid and attaches the substrate to the substrate. A substrate drying apparatus capable of drying the substrate by scattering the cleaning liquid by centrifugal force, wherein a predetermined gas is discharged from a gas discharge port before, during or after the rotation of the substrate. A nozzle for spraying the cleaning liquid attached to the substrate by the gas, and a nozzle at a standby position set at least outside the outer edge of the substrate and near a rotation center of the substrate. And a nozzle moving means for moving between nozzles.

As described above, in the substrate drying apparatus of the present invention,
The nozzle discharges a predetermined gas from a gas discharge port before, during, or after the rotation of the substrate and sprays the gas on the substrate to scatter the cleaning liquid attached to the substrate. The nozzle moving means moves the nozzle from a standby position set outside the outer edge of the substrate to near the center of rotation of the substrate.

Therefore, according to the substrate drying apparatus of the present invention,
Since the nozzle can be moved to the vicinity of the center of rotation of the substrate, the effect of scattering the cleaning liquid by blowing gas can be sufficiently obtained. Therefore, the time for rotating the substrate and scattering the cleaning liquid by the centrifugal force can be shortened, and the time required for drying the substrate can be shortened.

[0014] In the substrate drying apparatus of the present invention, it is preferable that the nozzle moving means moves the nozzle so as to change a spraying position of the gas from a rotation center of the substrate toward a periphery of the substrate.

By changing the gas spray position in this manner, the cleaning liquid scattered by the gas spray can be efficiently moved toward the periphery of the substrate, and the effect of scattering the cleaning liquid by the gas spray can be improved.
Since it can affect the entire surface of the substrate, the time required for drying the substrate can be further reduced.

In the substrate drying apparatus of the present invention, it is preferable that a discharge direction of the gas from the nozzle is set to be substantially the same as a change direction of a spray position of the gas.

By setting the gas discharge direction in this manner, the gas can be further sprayed while following the scattered cleaning liquid, so that the cleaning liquid can be scattered more efficiently, and the time required for drying the substrate can be improved. Can be further reduced.

In the substrate drying apparatus according to the present invention, the nozzle discharges the gas during rotation of the substrate, and the nozzle moving means changes the spray position of the gas during rotation of the substrate. It is preferable to move the nozzle.

As described above, by discharging the gas during the rotation of the substrate and changing the blowing position, the cleaning liquid is more efficiently scattered by the synergistic effect of the centrifugal force generated by the rotation of the substrate and the blowing of the gas. Therefore, the time required for drying the substrate can be further reduced.

In the substrate drying apparatus of the present invention, a gas discharge port height position changing means for changing a height position of the gas discharge port in the nozzle may be further provided. Further, a gas discharge direction changing means for changing a discharge direction of the gas in the nozzle may be further provided.

Further, in the substrate drying apparatus of the present invention,
The apparatus may further include a gas discharge pressure varying unit that changes a discharge pressure of the gas discharged from the nozzle. Further, a gas discharge amount changing means for changing a discharge amount of the gas discharged from the nozzle may be further provided.

By providing such means,
For example, appropriate gas discharge conditions can be set for various substrates having different drying properties. Therefore, the amount of gas used can be reduced, and the time required for drying the substrate can be further reduced.

The substrate drying method of the present invention is a substrate drying method for drying a substrate washed with a cleaning liquid,
(A) rotating the washed substrate to scatter the cleaning solution attached to the substrate by centrifugal force;
(B) changing the spraying position of the gas from the center of rotation of the substrate toward the periphery of the substrate while spraying a predetermined gas on the substrate, so that the cleaning liquid attached to the substrate is scattered by the gas; And a step.

As described above, according to the substrate drying method of the present invention,
In the step (a), the substrate is rotated to scatter the cleaning liquid by centrifugal force, and in the step (b), the spray position is changed from the rotation center of the substrate toward the periphery while blowing a predetermined gas on the substrate. Thus, the cleaning liquid is scattered by the gas.

Therefore, according to the substrate drying apparatus of the present invention,
The cleaning liquid can be efficiently scattered by the centrifugal force due to the rotation of the substrate and the gas blowing, and the cleaning liquid scattered by the gas blowing can also be scattered around the substrate by changing the gas blowing position as described above. , And the effect of spraying the cleaning liquid by blowing gas can also be exerted on the entire surface of the substrate, so that the time required for drying the substrate can be further reduced.

[0026]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below based on examples. FIG. 1 is a block diagram showing a schematic configuration of a substrate drying apparatus as one embodiment of the present invention, and FIG. 2 is a plan view of the substrate drying apparatus shown in FIG. Although the substrate drying apparatus 100 of the present embodiment is actually configured integrally with the substrate cleaning apparatus as in the above-described conventional example, FIG.
2 shows only the main part of the substrate drying apparatus 100.

As shown in these figures, six support pins 21a for supporting the substrate 11 are erected on the upper surface of the disk-shaped spin chuck 21, and the rotating shaft 23 is provided on the lower surface thereof. The spin chuck 21 is rotated by the electric motor 25 in the direction of arrow A about O as the center of rotation.

A scattering prevention cup 31 is provided around the spin chuck 21 so as to prevent the cleaning liquid from scattering outside the periphery of the spin chuck 21. The scattering prevention cup 31 can be moved up and down in the direction of arrow B. When the substrate 11 is attached to and detached from the spin chuck 21, it falls downward so as not to hinder attachment and detachment of the substrate 11. .

On the other hand, in FIG.
An N ₂ discharge nozzle 71 attached to a nozzle support 73 is provided above the nozzle support 73, and the nozzle support 73 is connected to the electric motor 61 via a rotating shaft 65.
Therefore, when the electric motor 61 is driven to rotate, the rotating shaft 65
Rotates, and the N ₂ discharge nozzle 71 rotates in the direction of arrow F. Thereby, the N ₂ discharge nozzle 7 with respect to the horizontal plane
1 can be changed. The electric motor 61 is provided with an encoder 63, which detects the amount of rotation of the rotary shaft 65 of the electric motor 61 and
The control unit 131 controls the driving of the electric motor 61 based on the feedback.

The electric motor 61 and the encoder 63 are both arranged on a support arm 57. In this embodiment, the electric motor 6 is set so that the center axis of the N ₂ discharge nozzle 71 and the center axis of the support arm 57 are substantially orthogonal to each other.
1 is attached to the support arm 57. The support arm 57 is connected to the electric motor 51 via a rotation shaft 55. Therefore, when the electric motor 51 is driven to rotate, the rotation shaft 55 rotates, whereby the support arm 57 rotates in the direction of arrow D with P as the center of rotation. Thereby, the discharge port 71a of the N ₂ discharge nozzles 71, it is possible to change the position on the horizontal plane. In addition,
An encoder 53 is also provided below the electric motor 51, and detects the amount of rotation of the rotating shaft 55 of the electric motor 51 and feeds it back to the control unit 131. Based on this, the control unit 131 drives the electric motor 51 based on this. To control.

The electric motor 51 and the encoder 53
Are arranged on a lifting base 49. The elevating base 49 is slidably fitted on the guide shaft 47 erected, and is screwed to a pole screw 45 that is provided side by side with the guide shaft 47 and is connected to the rotating shaft of the electric motor 41. ing. Accordingly, when the electric motor 41 is driven to rotate, the pole screw 45 rotates, whereby the lifting base 49 moves up and down in the arrow C direction. Thus, it is possible to change the height of the discharge port 71a of the N ₂ discharge nozzles 71. An encoder 43 is also provided below the electric motor 41, detects the amount of rotation of the rotating shaft of the electric motor 41, and feeds it back to the control unit 131. The control unit 131 controls the electric motor 41 based on this. I try to control.

On the other hand, the nozzle support body 73 and N ₂ supply tube 75 is connected, N ₂ supply tube 75
Is an on / off valve 81, a mass flow controller 91,
It is connected to an N ₂ supply source such as a factory line via an electropneumatic regulator 113 and a filter 121 in order.

The ON / OFF valve 81 is controlled on / off by the control unit 131 to supply N ₂ to the N ₂ discharge nozzle 71 or to stop the supply. In addition, the mass flow controller 91 includes a flow meter and a flow control valve (not shown) therein. The flow meter measures the flow rate of N ₂ flowing through the N ₂ supply tube 75, and feeds back the detection result to the control unit 131. The control unit 131 controls the flow regulating valve based on the detection result, adjusting the flow rate of N ₂ through the N ₂ supply tube 75.

Further, the electropneumatic regulator 113 is connected motor 115, by the electropneumatic regulator 113 to the motor 115 is driven to rotate, changing the pressure of N ₂ in the N ₂ supply tube 75 Can be. A pressure gauge 111 is connected between the electropneumatic regulator 113 and the mass flow controller 91. The pressure gauge 111 measures the pressure of N ₂ in the N ₂ supply tube 75 and feeds back the detection result to the control unit 131. Control unit 131 controls the rotation driving of the motor 115 based on the detection result, to adjust the pressure of N ₂ in the N ₂ supply tube 75 within the electropneumatic regulator 113. The filter 121 is deployed to remove impurities contained in the N ₂ supplied from the N ₂ supply source.

As described above, the control unit 131 is connected to various components, and as shown in FIG. 1, is connected to an instruction unit 141 and a memory 151.
Of these, the memory 151 stores a program for a cleaning process and a drying process called a recipe, and the controller 131 controls the various components according to the recipe to perform the cleaning process and the drying process. The instruction unit 141 is used to input an instruction for creating the recipe or to select a desired recipe from a plurality of created recipes.

The recipe is created, for example, for each type of the substrate 11 and includes data such as operating conditions during the cleaning process and operating conditions during the drying process. The operating conditions during the drying process include the discharge port 7 of the N ₂ discharge nozzle 71.
1a height, discharged inclination angle of the N ₂ discharge nozzles 71, the moving speed of N ₂ discharge nozzles 71, the moving range of the N ₂ discharge nozzles 71, and from the discharge port 71a of the N ₂ discharge nozzles 71 The discharge pressure and discharge amount of N ₂ are exemplified.

In the above-described configuration, when the control unit 131 starts the substrate cleaning process in accordance with the recipe selected by the instruction unit 141, first, the transport unit (not shown) applies the spin chuck to the substrate 11 to be cleaned. And six support pins 21 on the upper surface of the spin chuck 21.
“a” abuts and supports the peripheral portion of the substrate 11. Then, the electric motor 25 drives the spin chuck 21 to rotate, so that the substrate 11 rotates around O in the horizontal direction in the direction of arrow A in the horizontal plane. At this time, as a component of the substrate cleaning apparatus, a cleaning liquid discharge nozzle (not shown) and a rotary brush are separately provided, and when the substrate 11 rotates,
The cleaning liquid discharge nozzle discharges the cleaning liquid toward the surface of the substrate 211, and the rotating brush rotates to brush and clean the surface of the substrate 11. During the cleaning process, the N ₂ discharge nozzle 71 is moved to a predetermined standby position W set outside the outer edge of the substrate 11 and the scattering prevention cup 31 shown by a dashed line in FIG. And stands by at that position so as not to hinder the cleaning process.

When the series of substrate cleaning processes is completed in this way, the control unit 131 next proceeds according to the above-described recipe.
The substrate drying process according to the present invention is started. First, the control of the control unit 131, together with the electric motor 41 to elevate the elevating base 49 rotates, the nozzle support body 73 rotates the electric motor 61 is rotated, thereby, N ₂
Height and inclination angle of the N ₂ discharge nozzles 71 of the discharge port 71a of the discharging nozzle 71 is set to a predetermined height and tilt angle according to the operating conditions written in the recipe.

Next, the electric motor 51 rotates to rotate the support arm 57, and the N ₂ discharge nozzle 71 is moved from the standby position W described above to a gas blowing position near the rotation center of the substrate indicated by a solid line in FIG. To the start position S.

When the N ₂ discharge nozzle 71 is located at the start position S, the on / off valve 81 is turned on.
The supply of N ₂ to the N ₂ discharge nozzle 71 is started. In parallel with this, the electric motor 25 increases the rotation speed and rotates the substrate 11 at high speed.

[0041] Figure 3 cleaning liquid 1 scattered by blowing of the moving direction and N ₂ of N ₂ discharge nozzles 71 shown in FIG. 1
It is explanatory drawing which shows the situation of No.3.

When N ₂ is discharged from the discharge port 71a of the N ₂ discharge nozzle 71 at the start position S, the discharged N _2
2 is the substrate 1 of the surface of the substrate 11 as shown in FIG.
It is sprayed toward one rotation center O. As a result, the cleaning liquid 1 attached near the rotation center O of the substrate 11
3 scatters toward the periphery. Further, as the substrate 11 rotates at a high speed, the cleaning liquid attached to the peripheral portion of the substrate 11 is scattered to the periphery by centrifugal force.

At this time, the control section 131 controls the flow rate adjusting valve in the mass flow controller 91 and controls the electropneumatic regulator 113 via the motor 115 in accordance with the above-described recipe, thereby controlling the N ₂ supply. The flow rate and pressure of N ₂ flowing through the tube 75 are adjusted. Thereby, the discharge pressure and the discharge amount of N ₂ discharged from the discharge port 71a of the N ₂ discharge nozzle 71 become the predetermined discharge pressure and the discharge amount according to the operating conditions written in the recipe. Adjusted.

Subsequently, when the support arm 57 is further rotated by the electric motor 51, the N ₂ discharge nozzle 71 is
As shown in FIG. 2, it gradually moves from the start position S along the arc in the direction of arrow G. Accordingly, N ₂
The spray position of N ₂ discharged from the discharge nozzle 71 also gradually moves from the rotation center O of the substrate 11 toward the periphery as shown in FIG. 3, and the cleaning liquid 13 attached to the surface of the substrate 11 further increases. Fly toward the periphery. At this time, the control unit 131 controls the electric motor 51 in accordance with the above-described recipe so that the moving speed of the N ₂ discharge nozzle 71 becomes a predetermined speed according to the operating condition written in the recipe. .

Then, by the rotation of the support arm 57,
Finally, when the N ₂ discharge nozzle 71 reaches the end position E, the N ₂ discharge nozzle 71
N ₂ discharged from the discharge port 71a of the substrate 11 is sprayed toward the outermost peripheral portion Q of the substrate 11 as shown in FIG.
Thus, the cleaning liquid 13 that has moved from the rotation center O of the substrate 11 is blown off from the substrate 11 and removed.

[0046] When the N ₂ discharge nozzle 71 comes to the end position E, then, on / off valve 81 is turned off, N ₂
The supply of N ₂ into the discharge nozzle 71 is stopped, N ₂ from the N ₂ discharge nozzle 71 is no longer discharged. At the same time, the electric motor 25 also stops rotating and the substrate 11
Is also stopped.

As described above, the blowing of N _{2 on} the substrate 11 and the centrifugal force of the high-speed rotation of the substrate 11
The substrate 11 is quickly dried by blowing off all the cleaning liquid 13 attached to the surface of the substrate 11.

When the above series of substrate drying processes is completed,
Thereafter, the electric motor 51 continues to rotate, and the support arm 57 further rotates. And the N ₂ discharge nozzle 7
1 is returned to the standby position W again beyond the end position E.
Then, when the support pins 21a of the spin chuck 21 release the contact support of the substrate 11, the substrate 11 is removed from the spin chuck 21 by a transport unit (not shown).

As described above, according to this embodiment,
It is possible to change the spraying position of N _2, N ₂
The effect of scattering the cleaning liquid by spraying can be sufficiently obtained. Therefore, the time for rotating the substrate 11 and scattering the cleaning liquid by centrifugal force can be shortened,
The time required for drying the substrate can be reduced.

[0050] Further, according to this embodiment, the blowing position of the N ₂ from the rotation center O of the substrate 11 so that is moved towards the outermost periphery Q, of the cleaning liquid even substrate 11 scattered by blowing N ₂ The cleaning liquid can be efficiently moved toward the periphery, and the effect of scattering the cleaning liquid by blowing N ₂ can also be exerted on the entire surface of the substrate 11.

[0051] In the present embodiment, as shown in FIG. 2, N ₂ discharge nozzle 71 with its central axis is mounted so as to be substantially perpendicular to the central axis of the support arm 57, N ₂ discharge Nozzle 71 moves on an arc by the pivotal movement of the support arm 57. Therefore, the discharge direction of N ₂ discharged from the discharge port 71a of the N ₂ discharge nozzle 71 is
The direction is substantially the same as the moving direction of the N ₂ discharge nozzle 71 (that is, the direction in which the N ₂ blowing position changes). Accordingly, as shown in FIG. 3, while following the following splashed cleaning liquid 13, it is possible to further blowing N _2, it is possible to scatter the washing liquid more efficiently.

[0052] In the present embodiment, except that it is possible to move the position of the N ₂ discharge nozzles 71, the discharge port 71a of the height of the N ₂ discharge nozzles 71, the inclination angle of the N ₂ discharge nozzles 71 , N ₂ discharge nozzle 71 moving speed, N ₂
The moving range of the discharge nozzle 71 and the N ₂ discharge nozzle 7
Since the discharge pressure and discharge amount of N ₂ discharged from one discharge port 71a can be changed, for example, it is necessary to set appropriate N ₂ discharge conditions for various substrates having different drying properties. Can be. Therefore, the amount of N ₂ used can be reduced, and the time required for drying the substrate can be further reduced.

The present invention is not limited to the above-described examples and embodiments, but can be implemented in various modes without departing from the scope of the invention.

In the above embodiment, the electric motor 6
The rotation angle of the N ₂ discharge nozzle 71 with respect to the horizontal plane can be changed by the one rotation drive, but the direction of the center axis of the N ₂ discharge nozzle 71 with respect to the center axis of the support arm 57 (ie, the center of the support arm 57) The discharge direction of N ₂ with respect to the axis) is fixed at approximately 90 degrees. However, the present invention is not limited to this, and the direction of the center axis of the N ₂ discharge nozzle 71 with respect to the center axis of the support arm 57 may be changed by newly providing an electric motor or the like. You may be able to.

In the above-described embodiment, the start position S at which the discharge of N ₂ from the N ₂ discharge nozzle 71 is started and the end position E at which the discharge is completed are fixed. The end position E may be changed according to the type of the substrate 11 or the like.

In the above embodiment, the N ₂ discharge nozzle 71 is moved from the start position S, which is the gas blowing position near the rotation center of the substrate 11, to the end position E around the substrate 11. Alternatively, after moving from the predetermined standby position W, N ₂ may be sprayed on the substrate 11 without moving at the start position S. Also in this case, since the distance between the discharge port 71a of the N ₂ discharge nozzle 71 and the substrate 11 is short, the drying effect is higher than in the related art.

In the above-described embodiment, the N ₂ discharge nozzle 71 is moved on the circular arc by the rotation of the support arm 57. However, the present invention is not limited to this. assuming X-Y coordinate in a horizontal plane, the N ₂ discharge nozzle 71 by a linear motor or a belt drive, provided X-Y nozzle conveying means for conveying in the X and Y directions, in the horizontal plane N ₂ for discharge The nozzle 71 may be freely movable.

In the above embodiment, the substrate 1
The position of No. 1 is fixed, and by changing the position and angle of the N ₂ discharge nozzle 71, the blowing position of N ₂ is changed. Conversely, the position and angle of the N ₂ discharge nozzle 71 are changed. fixed to, by changing the position and angle of the substrate 11, it may be to vary the blowing position of N _2.

In the above embodiment, the gas blown to the substrate is N ₂ , but the present invention is not limited to this, and any gas that does not affect the substrate can be used. For example, air may be used.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a schematic configuration of a substrate drying apparatus as one embodiment of the present invention.

FIG. 2 is a plan view of the substrate drying apparatus shown in FIG.

FIG. 3 is an explanatory diagram showing a moving direction of an N ₂ discharge nozzle 71 shown in FIG. 1 and a state of a cleaning liquid 13 scattered by blowing N ₂ .

FIG. 4 is a plan view showing a substrate drying apparatus capable of drying a substrate by blowing N ₂ .

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 11 ... Substrate 13 ... Cleaning liquid 21 ... Spin chuck 21a ... Support pin 23 ... Rotating shaft 25 ... Electric motor 31 ... Scatter prevention cup 41 ... Electric motor 43 ... Encoder 45 ... Pole screw 47 ... Guide shaft 49 ... Elevating base 51 ... Electric motor 53 ... encoder 55 ... rotating shaft 57 ... supporting arm 61 ... electric motor 63 ... encoder 65 ... rotating shaft 71 ... N ₂ discharge nozzles 71a ... discharge port 73 ... nozzle support 81 ... on / off valve 91 ... mass flow controller 100 ... substrate Drying device 111 ... Pressure gauge 113 ... Electro-pneumatic regulator 115 ... Motor 121 ... Filter 131 ... Control unit 141 ... Instruction unit 151 ... Memory 200 ... Substrate drying device 201 ... Base 211 ... Substrate 221 ... Spin chuck 221a ... Support pin 231 ... scattering prevention cup 271 ... N ₂ discharge Nozzles 271a ... discharge port 273 ... nozzle carrier E ... end position O ... center of rotation Q ... outermost peripheral portion S ... starting position W ... standby position

Claims (9)

[Claims] 1. A substrate drying apparatus capable of drying a substrate by rotating a substrate cleaned by a cleaning liquid and scattering the cleaning liquid attached to the substrate by centrifugal force, wherein the substrate is dried. Before, during or after the rotation of the nozzle, a nozzle that discharges a predetermined gas from a gas discharge port and sprays the gas on the substrate, and the cleaning liquid attached to the substrate is scattered by the gas. And a nozzle moving means for moving between a standby position set outside an outer edge of the substrate and near a rotation center of the substrate. 2. The substrate drying apparatus according to claim 1, wherein the nozzle moving unit moves the nozzle such that a position at which the gas is blown changes from a rotation center of the substrate toward a periphery of the substrate. A substrate drying apparatus, characterized in that: 3. The substrate drying apparatus according to claim 2, wherein the discharge direction of the gas from the nozzle is set to be substantially the same as the direction in which the gas is sprayed. Drying equipment. 4. The substrate drying apparatus according to claim 2, wherein the nozzle discharges the gas during rotation of the substrate, and the nozzle moving unit rotates the gas during rotation of the substrate. Wherein the nozzle is moved so as to change the spray position of the substrate. 5. The substrate drying apparatus according to claim 1, wherein a gas discharge port height position changing unit that changes a height position of the gas discharge port in the nozzle is provided. A substrate drying device, further comprising: 6. The substrate drying apparatus according to claim 1, further comprising a gas discharge direction changing unit that changes a discharge direction of the gas from the nozzle. Substrate drying equipment. 7. The substrate drying apparatus according to claim 1, further comprising a gas discharge pressure changing unit that changes a discharge pressure of the gas discharged from the nozzle. A substrate drying apparatus characterized by the above-mentioned. 8. The substrate drying apparatus according to claim 1, further comprising a gas discharge amount changing unit that changes a discharge amount of the gas discharged from the nozzle. A substrate drying apparatus characterized by the above-mentioned. 9. A substrate drying method for drying a substrate washed with a cleaning liquid, comprising: (a) rotating the washed substrate to scatter the cleaning liquid attached to the substrate by centrifugal force; (B) changing the spraying position of the gas from the center of rotation of the substrate toward the periphery of the substrate while spraying a predetermined gas onto the substrate, so that the cleaning liquid attached to the substrate is scattered by the gas; A substrate drying method, comprising: