TW202206227A - Liquid supply device and polishing device - Google Patents

Abstract

This liquid supply device comprises: a rocking arm that can horizontally rock the upper side of a polishing table; a slurry tube that extends in the longitudinal direction of the rocking arm and discharges slurry onto the polishing table from a slurry discharge port at a tip section thereof; and a plurality of spray nozzles which are provided to be aligned in the longitudinal direction of the rocking arm and spray a cleaning fluid onto the polishing table. The spray nozzles positioned at the tip section of the rocking arm are provided obliquely so as to be capable of cleaning a drop position of slurry onto the polishing table, the slurry being discharged from the slurry discharge nozzles.

Description

Liquid supply device and grinding device

The present disclosure relates to a liquid supply device and a polishing device.

In recent years, with the progress of high integration of semiconductor elements, circuit wiring has been miniaturized, and the distance between wirings has also been narrowed. In the manufacture of semiconductor devices, many kinds of materials are repeatedly formed on a silicon wafer to form a laminated structure. In order to form this laminated structure, a technique for flattening the wafer surface is important. As one mechanism for planarizing such a wafer surface, a polishing apparatus that performs chemical mechanical polishing (CMP) is widely used.

A chemical mechanical polishing (CMP) apparatus generally includes: a polishing table on which a polishing pad is installed; an annular turntable (polishing head) holding a wafer above; and a slurry discharge nozzle for supplying polishing liquid (slurry) onto the polishing pad. The polishing liquid is supplied from the slurry discharge nozzle to the polishing pad, and the wafer is pressed against the polishing pad by the upper annular turntable, and the wafer is polished by moving the upper annular turntable and the polishing table relatively to make the surface flat.

After the wafer is polished, fine particles such as polishing dust and abrasive grains contained in the polishing liquid remain on the polishing pad. Therefore, after polishing the wafer, a mist-like cleaning fluid (liquid, or a mixture of liquid and gas) is sprayed from an atomizer having at least one spray nozzle that sprays liquid or a mixture of gas and liquid toward the polishing pad. ) spray on the polishing pad to remove foreign matter on the polishing pad.

In order to avoid interference between the slurry discharge nozzle provided at the tip of the rocker arm and the atomizer arranged on the polishing pad in the conventional CMP apparatus, it was necessary to arrange the slurry discharge nozzle at a height higher than the atomizer. Therefore, when the rocker arm is swung and the slurry is discharged from the slurry discharge nozzle, the position where the slurry is dropped tends to be misaligned, and it is difficult to drop the slurry required for polishing the wafer at the optimum timing and position.

Japanese Patent Application Laid-Open No. 2018-6549 discloses that the swing arm is rotatable around a horizontal axis extending in the horizontal direction. A technique in which the shaft rotates around, and the slurry discharge nozzle is retracted from the atomizer to the top.

(The problem that the invention intends to solve)

It is desired to provide a liquid supply device and a polishing device that can reduce the positional deviation of the drop position of the slurry required for polishing a wafer. (means to solve the problem)

The liquid supply device of one aspect of the present disclosure includes: A rocking arm, which can be rocked horizontally above the grinding table; A slurry pipe, which extends along the longitudinal direction of the rocking arm, and discharges the slurry from the slurry outlet at the front end to the grinding table; and a plurality of spray nozzles, which are arranged in parallel along the length direction of the rocking arm, and spray cleaning fluid on the grinding table; The slurry outlet is positioned at the front end of the rocking arm, The spray nozzles located at the front end of the swing arm are inclined so as to clean the drop position of the slurry discharged from the slurry discharge port on the grinding table. In one aspect of the present disclosure, a polishing device is provided with a liquid supply device, The aforementioned liquid supply device includes: A rocking arm, which can be rocked horizontally above the grinding table; A slurry pipe, which extends along the longitudinal direction of the rocking arm, and discharges the slurry from the slurry outlet at the front end to the grinding table; and a plurality of spray nozzles, which are arranged in parallel along the length direction of the rocking arm, and spray cleaning fluid on the grinding table; The slurry outlet is positioned at the front end of the rocking arm, The spray nozzles located at the front end of the swing arm are inclined so as to clean the drop position of the slurry discharged from the slurry discharge port on the grinding table.

The liquid supply device in the first state of the embodiment includes: A rocking arm, which can be rocked horizontally above the grinding table; A slurry pipe, which extends along the longitudinal direction of the rocking arm, and discharges the slurry from the slurry outlet at the front end to the grinding table; and a plurality of spray nozzles, which are arranged in parallel along the length direction of the rocking arm, and spray cleaning fluid on the grinding table; The slurry outlet is positioned at the front end of the rocking arm, The spray nozzles located at the front end of the swing arm are inclined so as to clean the drop position of the slurry discharged from the slurry discharge port on the grinding table.

In this configuration, since the slurry discharge port and the spray nozzle are arranged on the same swing arm, even if the height of the slurry discharge port is lowered, the slurry discharge port will not interfere with the spray nozzle. Therefore, the height position of the slurry discharge port can be lowered, thereby shortening the distance and time for the slurry discharged from the slurry discharge port to reach the grinding table, and when the rocker arm is swayed and the slurry is discharged from the slurry discharge port, the drop position of the slurry is less likely to occur. The position deviation can be dropped, and the slurry required for polishing the wafer can be dropped at the best timing and position. In addition, since the spray nozzle at the tip of the swing arm is inclined so as to clean the drop position of the slurry discharged from the slurry discharge port on the grinding table, even if the slurry is dropped from the slurry discharge port to the center of the grinding table, for example, When it is near the center of the grinding table, the cleaning fluid can still be sprayed near the center of the grinding table, which can reduce the particles remaining on the grinding table. In addition, by arranging the jet nozzle and the slurry discharge port on the same swing arm, space saving in the polishing apparatus can be achieved.

The liquid supply device of the second aspect of the embodiment is the same as the liquid supply device of the first aspect, The periphery of the slurry pipe is covered by a cover for preventing the liquid splashed on the grinding table from invading between the pipes and staying there.

When the slurry discharge port and the jet nozzle are arranged on the same swing arm, not only the slurry discharged from the slurry discharge port and splashed on the grinding table, but also the cleaning fluid sprayed from the jet nozzle and splashed on the grinding table can be easily It penetrates between the slurry tubes and stays there. However, in this state, since the slurry supply tube is covered with a cover, the liquid splashed on the grinding table can be prevented from invading between the tubes and staying between the tubes. .

The liquid supply device of the third aspect of the embodiment is like the liquid supply device of the second aspect, The aforementioned protective cover has a lower surface opposite to the aforementioned grinding table, and the front end of the aforementioned slurry pipe penetrates downwardly through the lower surface and protrudes out of the outer side of the protective cover.

In this state, the periphery of the front end of the slurry tube is further covered without a gap, so that the liquid splashed on the grinding table can be more reliably prevented from intruding between the tubes and staying there.

The liquid supply device of the fourth aspect of the embodiment, such as the liquid supply device of the second or third aspect, The base end of the rocking arm is provided with a cover cleaning nozzle, which is connected to the cover to supply cleaning liquid.

In this state, the cover can be cleaned by supplying the cleaning liquid to the cover from the cover cleaning nozzle. In this way, during wafer polishing, the particles adhering to the protective cover can be prevented from falling on the polishing table and contaminating the wafer.

The liquid supply device of the fifth aspect of the embodiment is like the liquid supply device of the fourth aspect, The protective cover cleaning nozzle has: a first nozzle, which is connected to the upper surface of the protective cover to supply cleaning liquid; a second nozzle, which is connected to the right side of the protective cover to supply cleaning liquid; and a third nozzle, which is connected to the above-mentioned protective cover. The left side of the cover is supplied with cleaning fluid.

In this state, since the cleaning solution can be supplied to the upper surface, right side and left side of the protective cover respectively for cleaning, even if the amount of particles adhering to the upper surface, the right side and the left side of the protective cover and the method of adhering are different, the It can improve the cleaning efficiency of the protective cover.

The liquid supply device of the sixth aspect of the embodiment is the liquid supply device of any one of the second to fifth aspects, A plurality of ribs are provided on the inner surface of the protective cover so as to protrude toward the slurry tube crawling along the surface of the rocking arm.

In this state, when the cover is attached to the rocker arm, the rib provided on the inner surface of the cover presses the slurry pipe to the side of the rocker arm, so that the pressure is applied to the slurry pipe and the pipe can be suppressed and prevented from floating. And the interference with the inner wall of the protective cover that is not in contact, or the problem of jitter and oscillation on the tube. Thereby, not only the friction between the slurry tube and the inner wall of the protective cover is prevented, but also the pulsation of the slurry discharged from the slurry discharge port due to the floating of the slurry tube can be suppressed, and the drop position of the slurry can be prevented from being unstable. In addition, when removing the cover from the rocker arm, since the pressure of the slurry pipe by the ribs provided on the inner surface of the cover is released, the slurry pipe can be easily removed compared to when the slurry pipe is passed through a pipe or the like. Replace the job. By forming a structure in which the slurry pipe crawls on the surface of the rocker arm and covers it to press the rocker arm, the slurry pipe and the spray nozzle can be combined and replaced separately. Furthermore, even when there are multiple slurry pipes, the pipe replacement and setting work for separate use (different types of slurries and pure water) are still easy.

The liquid supply device of the seventh aspect of the embodiment is the liquid supply device of any one of the first to sixth aspects, In the above-mentioned swing arm, the above-mentioned slurry discharge port is arranged on the side closer to the grinding object than the above-mentioned jet nozzle. That is, the slurry discharge port is not located in an extension of the juxtaposition of the jet nozzles (is longer than the juxtaposition of the jet nozzles, and is located on the side of the polishing object). In other words, the slurry discharge port is located between the jet nozzle located at the tip of the swing arm and the object to be polished.

In this state, the slurry can be ejected at a position closer to the object to be polished, and the slurry required for polishing the wafer can be dropped at a more optimal timing and position.

The liquid supply device of the eighth aspect of the embodiment is the liquid supply device of any one of the first to seventh aspects, The drive mechanism of the rocking arm is composed of a servo motor and a reducer.

The polishing apparatus of the ninth aspect of the embodiment includes the liquid supply device of any one of the first to eighth aspects.

Hereinafter, a specific example of the embodiment will be described with reference to the drawings. In addition, in the following description and the drawings used for the following description, the same reference numerals may be used for the parts having the same configuration, and overlapping descriptions will be omitted.

FIG. 1 is a plan view showing a schematic configuration of a polishing apparatus 10 according to an embodiment.

As shown in FIG. 1 , the polishing apparatus 10 includes: a polishing table 11 on which a polishing pad (not shown) is mounted; An annular turntable (grinding head) 12 ; a dresser 13 for dressing the polishing pad; and a liquid supply device 20 .

The upper annular turntable 12 is supported on the upper annular turntable head 14 . A polishing pad (not shown) is attached to the upper surface of the polishing table 11 , and the upper surface of the polishing pad constitutes a polishing surface for polishing the wafer W. In addition, a fixed grindstone can also be used in place of the polishing pad. The upper annular turntable 12 and the grinding table 11 are configured to be rotatable around each axis. The wafer W is held under the upper annular turntable 12 by vacuum suction. During polishing, a polishing liquid (slurry) is supplied from the liquid supply device 20 to the polishing surface of the polishing pad, and the wafer W to be polished is pressed against the polishing surface by the upper ring turntable 12 to be polished.

FIG. 2 is an enlarged perspective view showing the liquid supply device 20 , and FIG. 3 is a longitudinal cross-sectional view of the liquid supply device 20 .

As shown in FIGS. 1 to 3 , the liquid supply device 20 includes: a swing arm 21 that can be horizontally swung above the grinding table 11 ; one or more than one or more of the slurry discharge port 22 at the front end part discharges the slurry on the grinding table 11 (The example shown in FIG. 5 is four) slurry pipes 27; and spray cleaning fluid (liquid (such as pure water and deionized water), or a mixture of liquid and gas (such as inert gas such as nitrogen) on the grinding table 11 ) (the example in the figure is eight) spray nozzles 231 to 238 .

The swing arm 21 is arranged so as to extend horizontally above the polishing table 11 , and a swing means 26 is provided at the proximal end of the swing arm 21 . The swing means 26 includes a swing shaft 261 extending in the vertical direction, and a drive mechanism 262 (eg, a servo motor and a reduction gear) provided at the lower end of the swing shaft 261 . The base end of the rocking arm 21 is fixed to the rocking shaft 261 . The rocking shaft 261 is rotatable around the vertical center axis by the power received from the drive mechanism 262 , whereby the rocking arm 21 is horizontally rocked (rotated) above the grinding table 11 about the rocking shaft 261 . When the drive mechanism 262 is composed of a servo motor and a reduction gear, since the position, speed, etc. can be controlled in the servo mechanism, the positional accuracy of the swing arm 21 is high and stable. Therefore, feedback control can be implemented by using the measured value of the polishing amount of the wafer, and according to the measured polishing amount, the slurry can be accurately dropped with the required amount of slurry at the position to be polished. At this time, the feedback control using the measurement value of the polishing amount of the wafer can be implemented, for example, using the measurement value of the eddy current type or optical type film thickness sensor proposed by the applicant of the present application in Japanese Patent Laid-Open No. 2015-193068. The pressure control of the grinding head is performed, and the position control of the swing arm 21 is carried out so that the slurry is supplied to the part where the pressure of the grinding head is increased in addition to the pressure control of the grinding head. Servo motors are used for precise positioning and reducers are used to increase torque. For example, when using a 1/100 speed reducer, since the movement of the motor per revolution becomes 1/100, it can be used for finer movements. At this time, a precision reducer without backlash can also be used. As will be described later, a motor with a large capacitance is required to rotate the weight of the structure that integrates the slurry nozzle and the atomizer. However, since the torque can be increased with a reducer, it can be driven by a motor with a small capacitance.

In addition, when the drive mechanism 262 is composed of a servo motor and a speed reducer, by measuring the reaction force of the cleaning liquid from the spray nozzles 231 to 238 as the load of the servo motor, the discharge flow rate of the spray nozzles 231 to 238 can be fed back, which is not used. flow meter to control the flow. The flow rate control is performed by, for example, adjusting the opening degree of the control valve 23c shown in FIG. 3 (for example, an electric flow control valve or the like). Therefore, each moving angle of the rocking arm 21 (position of the spray nozzles 231 to 238 ) can control the discharge flow rate of the spray nozzles 231 to 238 , in other words, the pad cleaning position and flow rate can be controlled. In addition, in the past, since the slurry discharge port 22 and the jet nozzles 231 to 238 were attached to different arms, and the rigidity of the slurry pipe 27 itself was low, proper position control could not be performed, but in this embodiment, the slurry discharge port 22 and the jet nozzles 231 to 238 are arranged on the same swing arm 21, and the rigidity of the swing arm 21 is higher than that of the slurry pipe 27, so the start position and end position of the discharge (spray) of the slurry and cleaning liquid can be controlled by using a servo motor.

As shown in FIGS. 1 to 3 , the slurry discharge port 22 is positioned at the front end of the swing arm 21 , and a plurality of spray nozzles 231 to 238 are arranged in parallel along the longitudinal direction of the swing arm 21 . The front end portion of the swing arm 21 here may be the front end portion of the arm, and it may be the front end of the axis of the arm and one of the two side surfaces thereof. The slurry discharge port 22 of FIGS. 2 and 3 is on the side facing the object to be polished in the front end of the arm. Each of the injection nozzles 231 to 238 is arranged in a concave portion formed on the bottom surface of the swing arm 21 . Each of the spray nozzles 231 to 238 has a slit-shaped fluid outlet, forms a mist of the cleaning fluid, and sprays the mist-like cleaning fluid on the polishing table 11 .

As shown in FIG. 3, the liquid flow path 23a is formed in the rocker arm 21, and each injection nozzle 231-238 communicates with the liquid flow path 23a. A liquid supply inlet 23b is formed at the end of the liquid flow path 23a. The liquid (for example, pure water) supplied from the liquid supply inlet 23b is supplied to each of the spray nozzles 231 to 238 through the liquid flow path 23a. By spraying the cleaning fluid from each of the spray nozzles 231 to 238, the entire polishing table 11 can be cleaned. In addition, the example shown in FIG. 3 is that one liquid flow path 23a is branched into a plurality of (here, eight) spray nozzles 231 to 238, but it is not limited to this, and a plurality of (here, eight) spray nozzles may be used. ) are directly connected to different spray nozzles 231 to 238, or several spray nozzles are grouped and connected to each group. In addition, each or one of the nozzles can be branched, and each nozzle 231-238 is provided with a valve in such a way that the opening (ON) or the closing (OFF) of the discharge of the individual nozzles can be adjusted. In addition, it has been explained that there is not only one liquid flow path 23a, but also a plurality of liquid flow paths 23a. However, the liquid supply inlet 23b is not limited to the position shown in FIG. Inside the shaft 261, or crawl along its outside. Furthermore, it may correspond to each spray nozzle or a plurality of combinations of several spray nozzles grouped together.

3, a plurality of slurry pipes 27 crawl on the surface of the swing arm 21 along the longitudinal direction of the swing arm 21. The liquid (slurry or pure water) flowing in each of the slurry pipes 27 is discharged from each of the different slurry discharge ports 22 . The front end portion (near the outlet) of the slurry pipe 27 is fixed to the body of the swing arm 21 by a slurry pipe fixing fitting. By fixing the front end (near the outlet) of the slurry tube 27 to the nebulizer body with high rigidity, deviation of the slurry discharge port 22 at the front end of the slurry tube 27 can be suppressed. In addition, the front end of the slurry tube 27 is fixed by a slurry tube fixing fitting, whereby the height position of the front end of the tube can be adjusted, and the height of the front end of each tube can be changed and held. In addition, it is easy to replace the type of tube (considering the difference in material and diameter) and the number (currently recorded as plural (4)). In addition, the slurry tube 27 is not limited to the top and side surfaces of the rocking arm 21. By crawling along the surface of the arm, and the front end of the slurry tube 27 is fixed to the body of the rocking arm 21 by a slurry tube fixing fitting, it is easy to change the horizontal view. The positional relationship of the slurry discharge port 22.

In addition, by fixing the front end (near the outlet) of the slurry tube 27 to the main body of the swing arm 21 by the slurry tube fixing fitting, the slurry discharge port 22 of the front end of the slurry tube 27 can be positioned further below. In addition, since the height of the slurry discharge port 22 from the grinding table 11 can be matched with the heights of the jet nozzles 231 to 238, the height from the grinding table 11 to the slurry discharge port 22 can be changed from about 100 mm in the past to approximately 30 mm. Furthermore, by arranging an air cylinder or an electric actuator in the rocking shaft 261, the position can be moved in the vertical direction, and the distance between the grinding table 11 and the slurry discharge port 22 can be adjusted according to the application.

The slurry pipe 27 may be arranged along the outer peripheral surface (crawl) of the swing shaft 261 that supports the swing arm 21 . Thereby, the slurry tube 27 can be replaced. When covering the swing shaft 261 with the protective cover 24 , the slurry pipe 27 arranged along the swing shaft 261 may be disposed inside the protective cover 24 . In addition, when the slurry discharge from the slurry discharge port 22 is stopped, in order to prevent the air from entering the slurry pipe 27, the slurry pipe 27 can also extend upward along the rocking shaft 261, then bend downward and descend, and then follow the rocking arm 21 (crawling). ) while extending horizontally.

By arranging the slurry outlet 22 and the jet nozzles 231 to 238 on the same swing arm 21, even if the height of the slurry outlet 22 is lowered, the slurry outlet 22 does not interfere with the jet nozzles 231 to 238. Therefore, the height position of the slurry discharge port 22 can be lowered, thereby shortening the distance and time for the slurry to reach the polishing table 11 after being discharged from the slurry discharge port 22. The drop position of the slurry is not prone to position deviation, and the slurry required for polishing wafers can be dropped at the best timing and position.

As shown in FIG. 1 , the slurry discharge port 22 is disposed closer to the object to be polished (wafer) W than the jet nozzles 231 to 238 in the swing arm 21 . That is, the slurry discharge port 22 is not located in the parallel extension of the jetting nozzles 231 to 238 (but is located on the side of the polishing object (wafer) W relative to the parallel extension of the jetting nozzles 231 to 238 ). In other words, the slurry discharge port 22 is located between the jet nozzle 231 located at the tip portion of the swing arm 21 and the object to be polished (wafer) W. As shown in FIG. Thereby, the slurry can be discharged at a position closer to the polishing object (wafer) W, and the slurry required for polishing the wafer W can be dropped at a more optimal timing and position.

FIG. 4 is a front view of the swing arm 21 viewed from the front end side. FIG. 5 is a view of the front end portion of the swing arm 21 viewed obliquely from below.

As shown in FIGS. 4 and 5 , the spray nozzles 231 at the front end of the swing arm 21 are inclined so as to clean the drop position of the slurry discharged from the slurry discharge port 22 on the polishing table 11 . That is, when viewed from the front end side of the rocker arm 21, the spray nozzles 231 located at the front end of the rocker arm 21 are inclined so that the extension line of the discharge direction forms an acute angle with the extension line of the discharge direction of the slurry discharge port 22.

1 , for example, when the slurry is dropped from the slurry discharge port 22 near the center of the grinding table 11, if the spray nozzle 231 located at the front end of the swing arm 21 is installed vertically downward, there is a possibility that the residual liquid in the center of the grinding table 11 cannot be removed. The nearby slurry is fully sprayed with cleaning fluid for cleaning. Moreover, the reason why it is easy to remain in the vicinity of the center is that the centrifugal force toward the outer periphery of the grinding table is less likely to be generated on the slurry toward the center in the radial direction of the grinding table. In contrast, in this embodiment, since the spray nozzle 231 located at the front end of the swing arm 21 is slanted so as to clean the drop position of the slurry discharged from the slurry discharge port 22, even if the slurry is dropped from the slurry discharge port 22 to When the center of the grinding table 11 is near the center of the grinding table 11 , the cleaning fluid can be sufficiently sprayed near the center of the grinding table 11 for cleaning, which can reduce the particles remaining on the grinding table 11 . The spray nozzle 231 is not a nozzle with a circular fluid outlet, but a spray nozzle with a slit-shaped fluid outlet, and the cleaning liquid should be dropped on the grinding table 11 in a manner of contacting the horizontally long brush with respect to the center of the grinding table 11 . Therefore, when the slurry is dropped from the circular slurry discharge port 22, the pattern drawn by the slurry on the grinding table 11 expands concentrically from the dropping position, and the concentric circles are elongated toward the outside in the rotation direction by the rotation of the grinding table 11. rounded. The same applies to dripping the cleaning solution from the circular fluid outlet. Therefore, in the case of the circular slurry outlet 22 and the circular fluid outlet, no matter how close the slurry outlet 22 and the circular fluid outlet are, the expansion of the slurry and the expansion of the cleaning solution, since the expansion centers are different from each other, the overlapping portion will be The part that makes some kind of difference. In addition, when the spray nozzle 231 is a spray nozzle having a slit-shaped fluid outlet, since the shape of the sprayed cleaning liquid is brush-like, the slurry of the part where the sprayed cleaning liquid showers is removed. When the spray nozzle 231 is a spray nozzle with a slit-shaped fluid outlet, when viewed from above, the shape of the sprayed cleaning liquid should not be placed on the radial line from the center of the grinding table 11 to the outer periphery, and should be slightly inclined. At this time, with the rotation of the polishing table 11, the flow of the cleaning liquid to the outer periphery can be assisted, and the removal of the desired slurry can be facilitated.

As shown in FIGS. 2 to 5 , the periphery of the slurry pipe 27 is covered by a cover 24 for preventing the liquid splashed on the grinding table 11 from intruding into the space between the pipes 27 and staying there.

When the slurry discharge port 22 and the jetting nozzles 231 to 238 are arranged on the same swing arm 21 as in the present embodiment, the slurry that is not only discharged from the slurry jetting port 22 but splashed on the polishing table 11 is also discharged from the jetting nozzles 231 to 238 . The cleaning fluid splashed on the grinding table 11 by the spray of 238 is also likely to intrude between the slurry supply pipe 27 and the pipe 27 and stay there. The splashed liquid penetrates between the pipes 27 and stays there.

As shown in FIG. 5 , the protective cover 24 has a lower surface 24 b opposite to the grinding table 11 , and the front end of the slurry pipe 27 penetrates downwardly through the lower surface 24 b and protrudes from the outer side of the protective cover 24 . Thereby, the periphery of the front end of the slurry pipe 27 is covered with no gaps, and the liquid splashed on the polishing table 11 can be more reliably prevented from entering between the pipes 27 and staying there.

As shown in FIG. 3 , a plurality of (three in the illustrated example) ribs 24a are provided on the inner surface of the protective cover 24 so as to protrude toward the slurry supply pipe 27 . When the cover 24 is attached to the rocker arm 21, the slurry pipe 27 is pressed against the rocker arm 21 by the ribs 24a provided on the inner surface of the cover 24, so that the pressure applied to the slurry pipe 27 can be suppressed and prevented from causing the pipe 27 It floats up and interferes with the inner wall of the protective cover 24 that is not in contact, or the tube 27 produces jitter and oscillation. This not only prevents the slurry tube 27 from rubbing against the inner wall of the protective cover 24, but also suppresses the pulsation of the slurry discharged from the slurry discharge port 22 due to the floating of the slurry tube 27, resulting in an unstable drop position of the slurry.

In the example shown in FIG. 3, the number of ribs 24a is three, but it is not limited to three, and one to two or four or more may be used. The cover 24 and the rib 24a can also be integrated, or they can be separated. In addition, in a modified example, the rib 24 a can also be provided on the body of the rocking arm 21 . When the protective cover 24 is installed on the rocking arm 21 , the rib 24 a provided on the body of the rocking arm 21 presses the slurry pipe 27 against the inner wall of the protective cover 24 . side and along the inner wall of the cover 24 . Even in this aspect, the same effect as the aspect in which the rib 24a is provided on the inner surface of the protective cover 24 can be obtained.

In addition, when removing the cover 24 from the swing arm 21, since the pressing of the slurry pipe 27 by the ribs 24a provided on the inner surface of the cover 24 is released, it can be easily performed compared to when the slurry pipe 27 is passed through a conduit or the like. Replacing the slurry tube. In addition, by forming a structure in which the slurry pipe 27 crawls on the surface of the rocker arm 21 and the rocker arm 21 is pressed by the cover 24, the slurry pipe 27 and the spray nozzles 231 to 238 are combined and replaced respectively. . Furthermore, even when there are a plurality of slurry tubes 27, the replacement of the tubes and the setting work for separate use (different types of slurries and pure water) are still easy.

As shown in FIGS. 2 to 4 , a cover cleaning nozzle 25 for supplying cleaning liquid (eg, pure water) to the cover 24 is provided at the base end portion of the swing arm 21 . As shown in FIG. 2 , the cover cleaning nozzle 25 communicates with a liquid flow path 23 a formed inside the swing arm 21 . Therefore, the liquid (for example, pure water) supplied from the liquid supply inlet 23 b is supplied to each of the atomizer nozzles 231 to 238 through the liquid flow path 23 a, and is also supplied to the cap cleaning nozzle 25 . Thereby, after polishing the wafer W, when the polishing table 11 is cleaned by spraying the mist-like cleaning fluid (liquid or a mixture of liquid and gas) from the atomizer nozzles 231 to 238 on the polishing table 11, it is possible to clean the polishing table 11 from the protection The cover cleaning nozzle 25 supplies cleaning liquid to the protective cover 24 and simultaneously cleans the protective cover 24 . In addition, the supply piping to the cap cleaning nozzle 25 and the supply piping to the jet nozzles 231 to 238 may be configured as separate supply piping, and the discharge of each may be controlled, and simultaneous discharge may be possible if necessary. The upper surface of the protective cover 24 may also have a semi-conical (cross-sectional arc shape) curved surface shape. The cover cleaning nozzle 25 can also be a spray nozzle.

In this embodiment, as shown in FIGS. 2 and 4 , the cover cleaning nozzle 25 includes: a first nozzle 251 for supplying cleaning liquid on the upper surface of the protective cover 24 ; a second nozzle 252 for supplying cleaning liquid on the right side of the protective cover 24 ; and a third nozzle 253 for supplying cleaning liquid on the left side surface of the protective cover 24 . In this way, cleaning liquid can be supplied to the upper surface, right side and left side of the protective cover 24 respectively for cleaning. Even if the amount and the adhesion method of the particles adhering to the upper surface, the right side and the left side of the protective cover are different, the protective cover 24 can still be improved. cleaning efficiency. The first to third nozzles 251 to 253 are spray nozzles, respectively, and the expansion of the cleaning liquid (spray) sprayed from the first to third nozzles 251 to 253 can cover from the base to the front end of the protective cover 24 . In addition, the first to third nozzles 251 to 253 are not limited to those of spray nozzles as long as they are nozzles capable of covering from the base to the front end of the protective cover 24 with the cleaning liquid. The directions of the first to third nozzles 251 to 253 to the protective cover 24 can also be changed, respectively. When the first to third nozzles 251 to 253 are spray nozzles, the first to third nozzles 251 to 253 may rotate in the direction of spraying at the center of each axis. The flow rates of the first to third nozzles 251 to 253 may also be different and/or variable from each other. At this time, the cleaning liquid with a desired flow rate can be concentratedly sprayed to the portion of the surface of the protective cover 24 where the attachment degree is high.

Next, an example of the operation of the polishing apparatus 10 configured as described above will be described.

First, when polishing the wafer W, as shown in FIG. 1 , the swing arm 21 is positioned so that the slurry can be dropped from the slurry ejection port 22 to the vicinity of the center of the polishing table 11 , and the slurry is ejected from the slurry ejection port 22 until polishing. The wafer W to be ground is pressed on the grinding table 11 by the upper annular turntable 12 for grinding.

In this embodiment, since the slurry ejection port 22 and the jet nozzles 231 to 238 are arranged on the same swing arm 21, the height of the slurry ejection port 22 can be lowered, thereby shortening the size of the slurry ejected from the slurry ejection port 22 to reach the polishing table. When the swing arm 21 is shaken and the slurry is ejected from the slurry ejection port 22, the distance and time on the 11 and 11, the drop position of the slurry is not easily displaced, and the slurry required for polishing the wafer can be dropped at the optimum timing and position.

After polishing the wafer W, the slurry ejection from the slurry ejection port 22 is stopped, and as shown in FIG. The liquid (for example, pure water) supplied from the liquid supply inlet 23b is supplied to each of the spray nozzles 231 to 238 and the cover cleaning nozzle 25 through the liquid flow path 23a, and the spray nozzles 231 to 238 spray mist-like cleaning fluid to the polishing table 11 , cleaning of the grinding table 11 is performed, and cleaning liquid is supplied from the cover cleaning nozzle 25 to the cover 24 to clean the cover 24 . The swing arm 21 may be swung to control the ejection position of the cleaning fluid ejected from each of the ejection nozzles 231 to 238 . The cleaning fluid is sprayed from each of the atomizer spray nozzles 231 to 238 and the cap cleaning nozzle 25 until the polishing of the next wafer W is started (before the trimming operation is completed).

In this embodiment, as shown in FIG. 4 , since the spray nozzle 231 located at the front end of the swing arm 21 is inclined so as to clean the drop position of the slurry discharged from the slurry discharge port 22 on the polishing table 11, even if the spray nozzle 231 is discharged from the slurry discharge port 22, the When the slurry discharge port 22 drops the slurry to the vicinity of the center of the grinding table 11 , the cleaning fluid can be sufficiently sprayed near the center of the grinding table 11 for cleaning, which can reduce the particles remaining on the grinding table 11 . The fine particles are the cause of defects attached to the wafer surface. Therefore, the effect of reducing the defects of the wafer is improved by improving the dischargeability of the slurry.

Furthermore, as described in the prior art, in order to avoid interference between the slurry ejection nozzle provided at the tip of the rocker arm and the atomizer arranged on the polishing pad, the conventional CMP apparatus had to arrange the slurry ejection nozzle at a height higher than the atomizer. altitude position. Therefore, when the rocker arm is swung and the slurry is discharged from the slurry discharge nozzle, the position where the slurry is dropped tends to be misaligned, and it is difficult to drop the slurry required for polishing the wafer at the optimum timing and position.

In contrast, in the present embodiment, since the slurry ejection port 22 and the jet nozzles 231 to 238 are arranged on the same swing arm 21, even if the height of the slurry ejection port 22 is lowered, the slurry ejection port 22 will not be in contact with the ejection port 22. Nozzle interference. Therefore, the height position of the slurry discharge port 22 can be lowered, thereby shortening the distance and time for the slurry discharged from the slurry discharge port 22 to reach the polishing table 11. The drop position of the slurry is not prone to positional deviation, and the slurry required for polishing the wafer W can be dropped at the optimum timing and position.

In addition, in the present embodiment, since the spray nozzle 231 located at the front end of the swing arm 21 is inclined so as to clean the drop position of the slurry discharged from the slurry discharge port 22 on the polishing table 11, for example, even if When the slurry is dropped from the slurry discharge port 22 to the vicinity of the center of the grinding table 11 , the cleaning fluid can still be sprayed near the center of the grinding table 11 for cleaning, and the particles remaining on the grinding table 11 can be reduced.

In addition, according to this embodiment, by arranging the jet nozzles 231 to 238 and the slurry discharge port 22 on the same swing arm 21, space saving in the polishing apparatus can be achieved. In addition, by arranging the jet nozzles 231 to 238 and the slurry discharge port 22 on the same swing arm 21, when the slurry discharge port 22 is withdrawn from the table surface of the polishing table 11, the jet nozzles 231 to 238 can be cleaned together.

In addition, when the slurry discharge port 22 and the jet nozzles 231 to 238 are arranged on the same swing arm 21, not only the slurry discharged from the slurry jet port 22 but also the slurry splashed on the polishing table 11 is sprayed from the jet nozzle 231 and sprayed onto the polishing table 11. The cleaning fluid splashed on the polishing table 11 also tends to penetrate between the slurry supply pipe 27 and the pipe 27 and stay there. However, in the present embodiment, the surrounding of the slurry supply pipe 27 is covered by the protective cover 24 to prevent the slurry supply pipe 27 from entering the polishing table. The liquid splashed on the 11 penetrates between the tubes 27 and 27 and stays there.

In addition, in the present embodiment, since the protective cover 24 has a lower surface 24b facing the grinding table 11, and the front end of the slurry pipe 27 penetrates downwardly through the lower surface 24b and protrudes from the outer side of the protective cover 24, the front end of the slurry pipe 27 The periphery of the part is covered with no gap, so that the liquid splashed on the grinding table 11 can be more reliably prevented from intruding between the tubes 27 and the tubes 27 and staying there.

In addition, in the present embodiment, the cover cleaning nozzle 25 is provided at the base end of the swing arm 21 , and the cover 24 can be cleaned by supplying cleaning liquid from the cover cleaning nozzle 25 to the cover 24 . In this way, in polishing the wafer W, the particles adhering to the protective cover 24 can be prevented from falling on the polishing table 11 and contaminating the wafer W.

In addition, according to the present embodiment, since a plurality of ribs 24a are provided on the inner surface of the protective cover 24 so as to protrude toward the slurry pipe 27 extending along the longitudinal direction of the swing arm 21, the When the protective cover 24 is installed on the rocking arm 21, the rib 24a provided on the inner surface of the protective cover 24 presses the slurry tube 27 against the rocking arm 21 side. The inner wall of the cover 24 interferes, or the slurry tube 27 produces vibration and vibration problems. Thereby, the pulsation of the slurry discharged from the slurry discharge port 22 due to the floating of the slurry pipe 27 can be suppressed, and the instability of the drop position of the slurry can be suppressed. In addition, when removing the cover 24 from the swing arm 21, since the pressing of the slurry pipe 27 by the ribs 24a provided on the inner surface of the cover 24 is released, it can be easily performed compared to when the slurry pipe 27 is passed through a conduit or the like. Replacement work of the slurry tube 27 .

In addition, according to the present embodiment, since the swing arm 21 disposes the slurry discharge port 22 on the side closer to the wafer W than the ejection nozzles 231 to 238, the slurry can be discharged at a position closer to the wafer W, and the slurry can be discharged at a position closer to the wafer W. Drop the slurry required for polishing the wafer W at the right time and place.

In addition, according to this embodiment, since the slurry tube 27 is fixed to the atomizer body (ie, the swing arm 21 ), the rigidity is improved, and the vibration of the front end of the slurry tube 27 is reduced. In addition, if the slurry pipe 27 is inclined as a comparative example or is disposed away from the grinding table, and the slurry is discharged at the center of the grinding table, the structure of the comparative example may cause the drop position to vibrate easily due to the change in the flow rate of the slurry. However, in this embodiment, in the rocker arm 21, the slurry discharge port 22 is arranged on the wafer W side than the jet nozzles 231 to 238. Since the slurry discharge port 22 is vertically downward, the position of the slurry drop position is Control is easy. In addition, in the calculation of the ejection positions of the ejection nozzles 231 to 238, since the relative positional relationship with the slurry ejection port 22 is maintained regarding the vertical downward drop, it is only necessary to control it so as to pass the same trajectory as that of the slurry ejection port 22. .

FIG. 6 is a longitudinal sectional view showing a part of the polishing apparatus 10 , and FIG. 7 is a system configuration diagram of the polishing apparatus 10 . As shown in FIG. 6, the grinding table 11 of the grinding|polishing apparatus 10 is connected to the motor 50 arrange|positioned below it, and it can rotate about the axis|shaft center as shown by the arrow. In addition, a polishing pad (polishing cloth) 52 having a polishing surface 52 a is attached to the upper surface of the polishing table 11 . In addition, the upper annular turntable 12 is connected to the upper annular turntable shaft 54 , and a retaining ring 56 for holding the outer periphery of the semiconductor wafer W is provided on the lower outer peripheral portion of the upper annular turntable 12 .

The upper annular turntable 12 is connected to a motor (not shown), and is also connected to a lift cylinder (not shown). Thereby, the upper annular turntable 12 can be raised and lowered as shown by the arrow and can be rotated around its axis, and the semiconductor wafer W can be pressed against the polishing surface 52a of the polishing pad 52 with any pressure.

An eddy current sensor 58 serving as a film thickness monitor for measuring the film thickness of a metal thin film such as a copper film formed on the surface of the semiconductor wafer W is embedded in the polishing table 11 . The wiring 60 from the eddy current sensor (film thickness monitor) 58 passes through the polishing table 11 and the support shaft 62 , and is connected to the rotary connector (or slip ring) 64 provided at the shaft end of the support shaft 62 . controller 66. When the eddy current sensor 58 passes under the semiconductor wafer W, the film thickness of a conductive film such as a copper film formed on the surface of the semiconductor wafer W can be continuously measured on the passing track. The controller 66 can also be a controller whose control object and setting place are located in the grinding module, and the controller in the grinding module related to the operation in the grinding module, or the entire grinding device including the cleaning and drying device. The controller of the grinding unit for operation. In addition, the controller 66 can also be disposed in the cleaning and drying modules of the polishing apparatus. Furthermore, it can also be arrange|positioned on the outer side of the rack in the factory in which the substrate processing system is installed. Furthermore, the controller 66 is constituted by a plurality of computers, and the plurality of computers may be distributed in the factory. In other words, at least one computer constituting the controller 66 may also be disposed in the cleaning and drying module, near the cleaning and drying module, or in the substrate processing system separated from the cleaning and drying module. Furthermore, at least one computer constituting the controller 66 may be disposed on one production line of a plurality of substrate processing systems in a semiconductor substrate manufacturing plant. Furthermore, a plurality of computers constituting the controller 66 can also be arranged on a plurality of production lines of a plurality of substrate processing systems. Furthermore, at least one computer constituting the controller 66 may be arranged in a production line control and monitoring place in a factory, and in a production line control and monitoring system. Furthermore, it may be arranged in a plurality of factory monitoring sites and factory monitoring systems of a semiconductor substrate manufacturing company, or in a CMP apparatus manufacturing and installation company.

In addition, in this example, an eddy current sensor is used to measure the film thickness of a metal thin film such as a copper film formed on the surface of a semiconductor wafer, but an optical sensor may be used instead of the eddy current sensor to measure during polishing The thickness of optically transparent thin films such as oxide films formed on the surface of semiconductor wafers.

A polishing profile monitor for measuring the polished profile of the surface of the semiconductor wafer may also be provided, and the measurement result of the polishing profile monitor is input to the simulator 72 as the actual polishing profile, but not shown.

As shown in FIG. 7 , the swing arm 21 swings along the horizontal plane above the grinding surface 52 a with the rotation of the servo motor 262 serving as the driving mechanism, and as the swing arm 21 swings, it moves toward the slurry discharge port below the front end. 22. In other words, the polishing liquid supply position moves along the approximate radial direction of the polishing surface 52a. The servo motor (drive mechanism) 262 is connected to the controller 66 .

The controller 66 is connected to: the slurry discharge port (polishing liquid supply position) 22 of the swing arm 21; and the relationship between the prediction and the polishing profile when the polishing liquid is supplied to the polishing surface 52a at the polishing liquid supply position and the polishing is performed, for example A simulator 72 that simulates according to the desired grinding profile.

The database stored in the simulator 72 is supplied by a plurality of polishing liquid supply positions along the position of the arc extension line shown in FIG. 7 of the slurry discharge port 22 of the swing arm 21: α (°); Liquid supply position When polishing liquid is supplied and semiconductor wafer W is polished (nm/min). From the polishing liquid supply position of the database: polishing rate in α: RR (α, γ), for example, the polishing rate corresponding to the polishing liquid supply position α=60 (°): RR (60, γ), it is judged from Each polishing liquid supply position: α is the polishing profile when polishing liquid is supplied and polishing is performed for a certain period of time. In other words, in the database, the grinding rate also represents the grinding profile when grinding is continued for a certain period of time.

In the polishing apparatus 10 thus constructed, the semiconductor wafer W is held under the upper annular turntable 12, and the semiconductor wafer W is pressed against the polishing pad 52 on the rotating polishing table 11 by the lift cylinder. Then, by swinging the swing arm 21 and supplying the polishing liquid Q from the slurry discharge port 22 onto the polishing pad 52 , the polishing liquid Q exists between the polished surface (lower surface) of the semiconductor wafer W and the polishing pad 52 . Next, grinding of the surface of the semiconductor wafer W is performed. During this polishing, the controller 66 controls the servo motor 262 and swings the swing arm 21 to move the supply position (polishing liquid supply position) of the polishing liquid Q supplied from the slurry discharge port 22 along a predetermined movement pattern. The movement pattern of the slurry supply position is predicted by the simulator 72 and input to the controller 66 for determination.

8 , 9A and 9B , the prediction of the polishing liquid supply position by the simulator 72 , that is, the movement pattern of the slurry discharge port 22 of the swing arm 21 will be described.

First, the simulator 72 reads the swingable range of the swing arm 21 , in other words, the movable range A of the slurry discharge port (polishing liquid supply position) 22 shown in FIG. 9B , the minimum and maximum speed change points, and the speed change Calculation parameters such as acceleration and deceleration (step 1).

Next, the simulator 72 reads the relationship between the polishing liquid supply position of the swing arm 21 and the actual polishing profile from past data and previous data, etc., as time-test data (step 2). Refer to the database showing the relationship between the polishing liquid supply position and polishing rate (polishing profile) of the multiple points of the rocker arm 21 required by the time-tested data, and if necessary, use N-fold regression, Fourier transform, spline regression and wavelet At least one method of conversion is to predict and memorize the relationship between the supply position of any polishing liquid and the polishing rate (polishing profile) (step 3).

In addition, the desired polishing profile after polishing is input into the simulator 70 directly or from the polishing apparatus (CMP) (step 4).

Next, for example, as shown in FIG. 9B, the polishing liquid supply start position S, the polishing liquid supply return position R, the speed changing positions P1 to P4, and the positions S to P1, P1 to P2, P2 to P3, and P3 between the speed changing positions are set. Calculate the initial value of the movement pattern of the polishing liquid supply position, such as the moving speeds V1 to V5 of the slurry discharge ports of to P4 and P4 to R (step 5). Furthermore, the maximum number of repetitions, the allowable contour error (error between the desired contour and the expected contour), etc., are set as the limits at the time of calculation (step 6).

After each of the above steps, the simulator 70 obtains a polishing profile (polishing rate) when polishing is performed by moving the polishing liquid supply position with the assumed polishing liquid supply position movement pattern with reference to the database (step 7 ).

Then, calculate the difference between the desired grinding profile and the grinding profile obtained by the calculation in step 7 (step 8), and judge whether the difference is within the allowable profile error range set in step 6, or reaches the maximum number of repetitions (step 9). ).

Then, when the difference between the desired polishing profile and the calculated polishing profile is not within the allowable profile error range, the process returns to step 7 (step 10 ) in order to recalculate the assumed polishing liquid supply position movement pattern. Then, repeat this step until the difference between the desired grinding profile and the calculated grinding profile is within the allowable profile error range, or even if the difference between the desired grinding profile and the calculated grinding profile is not within the allowable profile error range However, when the maximum number of repetitions set in step 6 has been reached, the moving pattern of the polishing liquid supply position that becomes the polishing profile calculated in step 7 is displayed, stored, and input to the controller 66 (step 11).

The controller 66 receives the input from the simulator 70, and controls the servo motor 262 as the moving mechanism to make the swing arm 21 move so that the slurry discharge port 22 of the swing arm 21 moves along the movement pattern of the polishing liquid supply position during polishing. shake.

In this example, during polishing of a semiconductor wafer, the eddy current sensor 58 acquires the film thickness distribution (polishing profile) of a metal thin film such as a copper film formed on the surface of the semiconductor wafer, and inputs it to the simulator 72 . The simulator 72 instantaneously compares the desired polishing profile input in step 4 of FIG. 8 with the film thickness distribution (polishing profile) acquired by the eddy current sensor 58 during polishing to obtain the difference, in order to obtain the desired polishing Simulate the necessary grinding conditions according to the contour. And according to the polishing conditions obtained by the simulation, the swing pattern of the swing arm 21 , in other words, the movement pattern of the slurry discharge port (polishing liquid supply position) 22 is updated so as to have a desired profile.

The swing pattern of the swing arm 21 is controlled in this way so that the desired polishing is performed so that the film thickness distribution (polishing profile) of a metal thin film such as a copper film formed on the surface of the polished semiconductor wafer becomes a desired profile, and the polishing is completed.

In the above-described embodiment, the jet nozzles 231 to 238 are used for the purpose of removing foreign matter on the polishing table 11 by blowing the cleaning fluid (liquid or a mixed fluid of gas and liquid) toward the polishing table 11, but it is not limited to this. The spray nozzles 231 to 238 may also be used for the purpose of adjusting the surface temperature of the polishing table 11 by blowing the temperature-adjusted liquid toward the polishing table 11 .

The preferred embodiments of the present technology have been described above. However, the present technology is not limited to the above-described embodiments, and can of course be implemented in various forms within the scope of the technical idea.

10: Grinding device 11: Grinding table 12: The upper ring turntable 13: Dresser 14: Upper ring turntable head 20: Liquid supply device 21: rocker arm 22: Slurry spit outlet 23a: Liquid flow path 23b: Liquid supply inlet 23c: Control valve 231～238: jet nozzle 24: Cover 24a: Ribs 24b: Below 25: Cover cleaning nozzle 251: First Nozzle 252: Second Nozzle 253: Third Nozzle 26: Shake Means 261: Shake Shaft 262: Servo motor 27: Slurry tube 50: Motor 52: Polishing pad 52a: Grinding surface 54: Upper ring turntable shaft 56: Buckle 58: Eddy current sensor 60: Wiring 62: Support shaft 64: Rotary connector 66: Controller 70,72: Simulator P1～P4: Speed change position Q: Grinding fluid R: Grinding liquid supply return position S: The position where the slurry starts to be supplied V1～V5: Movement speed W: Wafer

FIG. 1 is a plan view showing a schematic configuration of a polishing apparatus according to an embodiment. FIG. 2 is an enlarged perspective view showing a liquid supply device included in the polishing apparatus shown in FIG. 1 . FIG. 3 is a longitudinal sectional view of the liquid supply device shown in FIG. 2 . Fig. 4 is a front view of the swing arm of the liquid supply device shown in Fig. 2 viewed from the front end side. Fig. 5 is a view of the front end portion of the rocker arm of the liquid supply device shown in Fig. 2 viewed obliquely from below. FIG. 6 is a longitudinal sectional view showing the outline of the polishing apparatus shown in FIG. 1 . FIG. 7 is a system configuration diagram of the polishing apparatus shown in FIG. 6 . Figure 8 is an envisioned flow chart simulated by a simulator. 9A is a plan view showing the relationship between the polishing surface, the swing arm, and the slurry discharge port (polishing liquid supply position) simulated by the simulator. 9B is a front view showing the relationship between the polishing surface, the rocking arm, and the slurry discharge port (polishing liquid supply position) simulated by the simulator.

10: Grinding device

11: Grinding table

13: Dresser

14: Upper ring turntable head

20: Liquid supply device

21: rocker arm

22: Slurry spit outlet

231~238: jet nozzle

58: Eddy current sensor

W: Wafer

Claims (16)

A liquid supply device is characterized by having: A rocking arm, which can be rocked horizontally above the grinding table; A slurry pipe, which extends along the longitudinal direction of the rocking arm, and discharges the slurry from the slurry outlet at the front end to the grinding table; and a plurality of spray nozzles, which are arranged in parallel along the length direction of the rocking arm, and spray cleaning fluid on the grinding table; The slurry outlet is positioned at the front end of the rocking arm, The spray nozzles located at the front end of the swing arm are inclined so as to clean the drop position of the slurry discharged from the slurry discharge port on the grinding table. The liquid supply device according to claim 1, wherein the periphery of the slurry pipe is covered by a cover for preventing the liquid splashed on the grinding table from intruding between the pipes and remaining therebetween. The liquid supply device of claim 2, wherein the protective cover has a lower surface opposite to the grinding table, and the front end of the slurry pipe penetrates downward through the lower surface and protrudes from the outer side of the protective cover. The liquid supply device according to claim 2 or 3, wherein a cover cleaning nozzle is provided at the base end of the swing arm, and the cleaning liquid is supplied to the cover. The liquid supply device according to claim 4, wherein the protective cover cleaning nozzle has: a first nozzle, which is connected to the upper surface of the protective cover to supply the cleaning liquid; and a second nozzle, which is connected to the right side of the protective cover to supply the cleaning liquid; and a third nozzle, which supplies cleaning fluid on the left side of the aforementioned protective cover. The liquid supply device according to any one of claims 2 to 5, wherein a plurality of ribs are provided on the inner surface of the protective cover so as to protrude toward the slurry pipe that crawls along the surface of the swing arm. The liquid supply device according to any one of claims 1 to 6, wherein in the swing arm, the slurry discharge port is disposed on a side closer to the object to be polished than the jet nozzle. The liquid supply device according to any one of claims 1 to 7, wherein the drive mechanism of the rocking arm is constituted by a servo motor and a speed reducer. A grinding device is characterized by having a liquid supply device, and the liquid supply device includes: A rocking arm, which can be rocked horizontally above the grinding table; A slurry pipe, which extends along the longitudinal direction of the rocking arm, and discharges the slurry from the slurry outlet at the front end to the grinding table; and a plurality of spray nozzles, which are arranged in parallel along the length direction of the rocking arm, and spray cleaning fluid on the grinding table; The slurry outlet is positioned at the front end of the rocking arm, The spray nozzles located at the front end of the swing arm are inclined so as to clean the drop position of the slurry discharged from the slurry discharge port on the grinding table. The grinding apparatus of claim 9, wherein the periphery of the slurry tube is covered by a cover for preventing the liquid splashed on the grinding table from invading between the tubes and staying there. The grinding device of claim 10, wherein the protective cover has a lower surface opposite to the grinding table, and the front end of the slurry pipe penetrates downwardly through the lower surface and protrudes from the outer side of the protective cover. The grinding apparatus according to claim 10 or 11, wherein a cover cleaning nozzle is provided at the base end of the rocking arm, and the cleaning liquid is supplied on the cover. The grinding device of claim 12, wherein the protective cover cleaning nozzle has: a first nozzle, which supplies cleaning liquid on the upper surface of the protective cover; a second nozzle, which supplies cleaning liquid on the right side of the protective cover; and The third nozzle is used to supply cleaning liquid on the left side of the aforementioned protective cover. The grinding device according to any one of claims 10 to 13, wherein a plurality of ribs are provided on the inner surface of the protective cover so as to protrude toward the slurry pipe that crawls along the surface of the rocking arm. The polishing apparatus according to any one of claims 9 to 14, wherein in the swing arm, the slurry discharge port is disposed on a side closer to the object to be polished than the jet nozzle. The grinding device according to any one of claims 9 to 15, wherein the drive mechanism of the rocking arm is constituted by a servo motor and a reducer.

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